TWI685255B - Split array camera module and manufacturing method thereof - Google Patents

Abstract

Split array camera module and manufacturing method thereof, wherein the split array camera module The group includes that at least two camera module units are arranged separately, so that each camera module unit can be calibrated relatively independently, so that the optical axes of the camera module units are consistent.

Description

Split array camera module and manufacturing method thereof

The invention relates to the field of camera modules, and furthermore, to a split array camera module and a manufacturing method thereof.

With the continuous development of smart devices, the requirements for camera modules are getting higher and higher. For example, in the past two years, the cameras of smart phones have changed from single to dual cameras, and the development of dual camera modules has also become an important trend in the development of mobile phone camera modules.

To put it simply, dual cameras can capture images through the cooperation of two cameras to achieve a richer image collection function. The existing dual cameras can be divided into two categories according to their functions: one is to use the dual cameras to generate stereo vision, obtain the depth of field of the image, use the depth of field information for background blurring, 3D scanning, assisted focus, motion recognition and other applications, or use two The information of the picture is fused; the other is to use the left and right two different pictures for fusion, in order to expect higher resolution, better color, dynamic range and other better image quality or realize the function of optical zoom.

On the other hand, the requirements for the picture element of the camera module are getting higher and higher, and the number of lenses of the lens is continuously increasing, from the original two or three pieces to the current five, six or more pieces. On the one hand, it requires a small size, on the other hand, it requires the problem of good optical imaging quality. For multi-camera modules, it is also facing such a problem. How to make the module as a whole suitable for high graphics, and Stably and safely combining two or more camera modules to form an integrated module to meet the requirements of multiple camera modules in the development of existing camera modules is a problem that needs to be solved.

When the camera is installed in an electronic device, such as a smart phone, the outside needs to be flat, and the appearance of the two cameras is guaranteed to be beautiful. Therefore, how to assemble the external rules of the two camera modules is one of the issues that the multi-camera module needs to consider.

Further, the consistency of the optical axis between multiple cameras is an important aspect of the optical design of the multi-camera camera module, how to ensure that multiple camera modules can be assembled into one, and can ensure the consistency of the optical axis, this is a multi-camera An issue that needs to be considered in the manufacture of camera modules.

Further, the two cameras cooperate with each other to collect image information, and the accuracy and image quality of image acquisition are closely related to the light incident from the two cameras. The consistency of the optical axis between the two cameras is to ensure the camera module The basis of imaging quality. In other words, how to improve the consistency of the optical axis of the two camera modules or make the error within a predetermined range on the basis of stably and compactly fixing the two cameras, improve the accuracy of the installation and make it more Good imaging quality is another important issue to consider when developing dual cameras.

Further, the conventional camera module is usually a camera module assembled by COB, and its basic structure includes a circuit board, a photosensitive element, a lens holder, a lens and a filter element, wherein the photosensitive element is attached On the circuit board, a gold wire is electrically connected to the circuit board, the lens holder is attached to the circuit board through glue, the lens is installed on the lens holder, the filter element is installed on the lens holder, and the circuit The board is usually provided with protruding electronic components. In this structure, on the one hand, the lens holder is usually manufactured by injection molding and then adhered to the circuit board, which cannot provide the lens with good flatness installation conditions, and the adhesive fixing method increases the cumulative tolerance. On the other hand, the electronic components protrude from the circuit board, so it is necessary to reserve the installation space when installing the lens holder, thus making the overall demand of the circuit board The area is large, and the electronic components are exposed to the space inside the camera module. Dust impurities contaminated on the surface can easily affect the imaging effect of the camera module. In short, the traditional COB mounting camera module has many disadvantages, especially it is not suitable for the existing high-primary camera module.

An object of the present invention is to provide a split-array camera module and a manufacturing method thereof, wherein the split-array camera module includes at least two camera module units that are arranged separately, so that each camera module can be relatively independently The unit performs active calibration so that the optical axis of each camera module unit is consistent.

An object of the present invention is to provide a split-array camera module and a manufacturing method thereof, wherein the split-array camera module includes an assembly body that stably assembles and fixes the camera module units As a whole.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the assembly has a receiving chamber, and each of the camera module units is received therein, so that the split array camera module The external shape is relatively regular, easy to install and use.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the assembly includes at least one partition wall that partitions the receiving chamber so that each of the camera module units Set up in isolation to reduce mutual electromagnetic interference.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the assembly includes at least one supporting edge extending relative to the receiving chamber, so as to stably support and install each camera module unit .

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein one of the camera module units includes a photosensitive element, and the photosensitive element includes a base and a For the circuit board, the base is integrally formed on the circuit board, and has good flatness, which can provide flat installation conditions for the mounted components, thereby improving the optical axis consistency of the camera module unit.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the base has a light window to provide a light path for a photosensitive element, and the inner side wall of the base is inclined to reduce The stray light is reflected to the photosensitive element.

An object of the present invention is to provide a split array camera module, wherein the photosensitive element has at least one photosensitive area and a non-photosensitive area, and the base integrally encapsulates at least part of the non-photosensitive area of the photosensitive element, to Expand the integrated packaging area of the base.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the circuit board includes a circuit board body and at least one electronic component, the electronic component protrudes from the circuit board body, the The base is integrally formed on the main body of the circuit board, covers the electronic components, and reduces space occupation.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the photosensitive element is electrically connected to the circuit board body through at least one electrical connection element, and the base covers the electrical connection element .

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the base includes a support element, the support element is spaced apart from the circuit board and the base body to facilitate The circuit board and the photosensitive element are protected during the manufacturing process.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the camera module unit includes a filter element, and the filter element is mounted on the base body.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the camera module unit includes a support, the support is installed on the base body, and a filter element is installed on The support.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the circuit board body has a sinking area, and the photosensitive element is disposed in the sinking area to reduce the photosensitive element and The relative height of the circuit board body.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the circuit board body includes a first board body and a second board body, and the first board body is conductively grounded by a conductive adhesive Connected to the second plate body.

An object of the present invention is to provide a split array camera module and a manufacturing method thereof, wherein the height and size of each of the camera module units can be freely combined and assembled to facilitate the cooperation of different types of camera module units.

In order to achieve at least one of the above objects of the invention, one aspect of the present invention provides an array camera module, which includes: at least two camera module units and an assembly, wherein each of the camera module units is respectively fixed to the assembly In order to form a whole.

According to some embodiments, the assembly includes an upper cover for fixedly connecting the camera module units.

According to some embodiments, wherein the assembly includes a main body, the main body forms a receiving room, and each of the camera module units is received in the receiving room.

According to some embodiments, wherein the assembly includes an upper cover, the upper cover is adapted to cover the receiving chamber, the upper cover has at least two lens openings, so that each camera module unit is accommodated in the assembly When the body is in the storage room, lighting is performed through the lens opening.

According to some embodiments, wherein the upper cover is integrally connected to the main body. It can be understood that the assembly may be implemented only with the above-mentioned upper cover, or with the above-mentioned formation of the housing The main body of the chamber and the upper cover integrally formed with the main body, or without the above-mentioned upper cover, but having only a side wall of the main body and other suitable structures.

According to some embodiments, wherein the assembly body includes a partition wall, the partition wall is located in the storage chamber, and divides the storage chamber into at least two parts, each for accommodating each of the camera module units.

According to some embodiments, the material of the partition wall is selected from one or more of plastic, resin, rubber, and metal.

According to some embodiments, wherein the partition wall is connected to the main body. According to some embodiments, the assembly body includes at least one partition wall that partitions the receiving chamber into at least two parts, each for accommodating each camera module unit, and the partition wall is connected to the Describe the cover.

According to some embodiments, wherein the assembly includes at least one supporting edge, the supporting edge extends inward from the main body to facilitate supporting each of the camera module units.

According to some embodiments, wherein the supporting edge is a boss structure.

According to some embodiments, each of the camera module units includes a photosensitive element and a lens, wherein the lens is located in the photosensitive path of the photosensitive element, and the photosensitive element includes a circuit board, a photosensitive element and a base , The base is integrally formed on the circuit board, the photosensitive element is electrically connected to the circuit board, the lens is located in the photosensitive path of the photosensitive element, the base has at least one light window, which is The photosensitive element provides a light path.

According to some embodiments, wherein the photosensitive element is located inside the base.

According to some embodiments, wherein the photosensitive element includes at least a portion of the non-photosensitive area where the base integrally encapsulates the circuit board and the photosensitive element.

According to some embodiments, wherein the photosensitive element is electrically connected to the circuit board through at least one electrical connection element, and the base covers the electrical connection element.

According to some embodiments, wherein the circuit board includes at least one electronic component, and the integrated base covers the electronic component.

According to some embodiments, wherein the base includes a supporting element, the supporting element is disposed on the circuit board body, so as to protect the circuit board body and the photosensitive element during the manufacturing process.

According to some embodiments, wherein the base includes a supporting element, the supporting element is disposed in a non-photosensitive area of the photosensitive element, so as to protect the photosensitive element during the manufacturing process.

According to some embodiments, wherein each of the camera units includes a support, the support is mounted on the base to facilitate the installation of a filter element.

According to some embodiments, the support is at least partially connected to the circuit board.

According to some embodiments, the supports of the camera module units are integrally connected.

According to some embodiments, wherein the circuit board is provided with at least a sinking area, and the photosensitive element is provided in the sinking area, so as to reduce the relative height of the photosensitive element and the circuit board.

According to some embodiments, the circuit board includes a first board body and a second board body, and the second board body is fixedly connected to the first board body through a connecting medium.

According to some embodiments, wherein the first board body is a hard board, the second board body is a soft board, and the connection medium is an anisotropic conductive adhesive.

According to some embodiments, wherein the base includes an extended mounting portion that extends at least partially upward from the base body to form a limiting groove to limit the installed component.

According to some embodiments, wherein the circuit board is provided with a flip-chip slot, the photosensitive element is disposed in the flip-chip slot, so that the photosensitive element is mounted on the circuit board in a flip-chip manner.

According to some embodiments, the circuit boards of each camera module unit are integrally connected.

According to some embodiments, each camera module unit is provided separately.

According to some embodiments, the bottom of each camera module unit has a height difference.

According to some embodiments, each of the camera module units includes a lens supporting element, the lens is mounted on the lens supporting element, and the lens supporting element is mounted on the base.

According to some embodiments, the lens support element is a driving element, so that the camera module unit constitutes a dynamic focus camera module.

According to some embodiments, wherein the lens supporting element is a lens barrel element, so that the camera module unit constitutes a fixed-focus camera module.

According to some embodiments, at least two of the camera module units are fixed focus camera modules.

According to some embodiments, at least two of the camera module units are dynamic focus camera modules.

According to some embodiments, at least one of the camera module units is a dynamic focus camera module, and at least one is a fixed focus camera module.

According to some embodiments, each of the array camera modules includes a filter element, and the filter element is mounted on the base.

According to some embodiments, wherein the circuit board type is selected from a rigid board, a flexible board, a rigid-flexible board, and a flexible board.

10‧‧‧ First camera module unit

11‧‧‧Photosensitive element

12‧‧‧ First lens

13‧‧‧The first lens support element

14‧‧‧First filter element

15‧‧‧First support

20‧‧‧Second camera module unit

21‧‧‧Second photosensitive element

22‧‧‧Second lens

23‧‧‧Second lens support element

24‧‧‧Second filter element

30‧‧‧Assembly

31‧‧‧Main

32‧‧‧ containment room

33‧‧‧Cover

34‧‧‧Supporting edge

35‧‧‧Partition wall

100‧‧‧ Split dual camera array camera module

111‧‧‧ First circuit board

113‧‧‧The first photosensitive element

112‧‧‧First pedestal

211‧‧‧ Second circuit board

212‧‧‧Second base

213‧‧‧Second photosensitive element

200‧‧‧Electronic equipment body

300‧‧‧Electronic equipment

331‧‧‧lens port

1000‧‧‧Manufacturing method

1001, 1002‧‧‧ steps

1111‧‧‧The main body of the first circuit board

1112‧‧‧The first electronic component

1121‧‧‧The first base body

1122‧‧‧First light window

1123‧‧‧First installation slot

1124‧‧‧First support element

1131‧‧‧ First photosensitive area

1132‧‧‧The first non-photosensitive area

1133‧‧‧Electrical connection element

2111‧‧‧ Main body of the second circuit board

2112‧‧‧Second electronic component

2121‧‧‧Second base body

2122‧‧‧Second light window

2124‧‧‧Second support element

2131‧‧‧Second photosensitive area

2132‧‧‧Second non-photosensitive area

2133‧‧‧Second electrical connection element

10011~10014‧‧‧Step

10021~10023‧‧‧Step

11112‧‧‧First board

11113‧‧‧Second plate

21111‧‧‧Second sinking area

21251‧‧‧Second limit slot

α‧‧‧Tilt angle

FIG. 1 is a schematic perspective view of a split array camera module according to the first preferred embodiment of the present invention.

FIG. 2 is an exploded schematic view of a split array camera module according to the first preferred embodiment of the present invention.

3 is a schematic diagram of the assembly process of the split array camera module according to the first preferred embodiment of the present invention.

4 is a schematic cross-sectional view of a split array camera module according to the first preferred embodiment of the present invention.

5 is a schematic cross-sectional view of a split array camera module according to a second preferred embodiment of the present invention.

6 is a schematic cross-sectional view of a split array camera module according to a third preferred embodiment of the present invention.

7 is a schematic cross-sectional view of a split array camera module according to a fourth preferred embodiment of the present invention.

8A and 8B are schematic cross-sectional views of a split array camera module according to a fifth preferred embodiment of the present invention.

9 is a schematic cross-sectional view of a split array camera module according to a sixth preferred embodiment of the present invention.

10 is a schematic cross-sectional view of a split array camera module according to a seventh preferred embodiment of the present invention.

11 is a schematic cross-sectional view of a split array camera module according to an eighth preferred embodiment of the present invention.

12 is a schematic cross-sectional view of a split array camera module according to a ninth preferred embodiment of the present invention.

13 is a schematic cross-sectional view of a split array camera module according to a tenth preferred embodiment of the present invention.

14 is a schematic diagram of a split array camera module according to a twelfth preferred embodiment of the present invention.

15A, 15B, and 15C are schematic cross-sectional views of different implementations of a split array camera module according to a tenth preferred embodiment of the present invention.

16 is a plan view of a split array camera module according to an eleventh preferred embodiment of the present invention.

17 is a flowchart of a method for manufacturing a split array camera module according to the above preferred embodiment of the present invention.

18 is a schematic diagram of the application of the split array camera module according to the above preferred embodiment of the present invention.

The following description is used to disclose the present invention to enable those skilled in the art to implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious modifications. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions without departing from the spirit and scope of the present invention.

Those skilled in the art should understand that in the disclosure of the present invention, the terms "portrait", "horizontal", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the The description is simplified, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore the above terms should not be construed as limiting the present invention.

The multi-camera camera module is an important trend in the recent development of camera modules, especially when the various performance of the camera module tends to be extreme, the picture element of the camera module is getting higher and higher, and the number of lens lenses is increasing. Next, the development of multi-camera camera modules has become an important trend and direction. The cooperation of multiple camera modules can realize more functions, such as the use of dual cameras to generate stereo vision, obtain the depth of field of the image, use the depth of field information for background blur, 3D scanning, assisted focus, motion recognition and other applications, or use two Fusion of the information in the picture; or use two different pictures on the left and right to fuse In order to achieve higher resolution, better color, dynamic range and other better image quality or realize the function of optical zoom. However, the combination of these camera modules with different functions and the stable application can be implemented by hardware. However, most of the existing multi-camera modules stay at the theoretical stage, or just separate the two camera modules. Independent assembly, the mutual position relationship is determined by the installation position, which is not suitable for large-scale production applications. According to an embodiment of the present invention, a split array camera module is provided, which includes at least two camera module units and an assembly, each of the camera module units is assembled separately by the assembly, so that each camera The mutual influence between the modules is small, and the structure forms a whole, with a regular appearance, which is convenient for installation and application. And further, according to an embodiment of the present invention, each of the camera module units includes at least one photosensitive element, and the photosensitive element includes a base and a circuit board, and the base is attached or formed by integral molding in The circuit board is preferably formed in an integrated manner so that the base can provide a flat installation plane, which is superior to the traditional COB assembly method, improves the optical performance of the camera module, and is optimized in terms of volume and process. The camera module units can be manufactured as different types of camera modules. Therefore, the specific optimization structure of the camera module unit of the present invention and the assembly structure of the camera module unit of the present invention are combined to provide a structured structure And, the array camera module with good optical performance and optimized volume enables the same or different camera modules to be assembled stably and safely in one body to form a whole and realize more functions.

The split array camera module of the present invention can be applied to electronic devices, such as, but not limited to, smart phones, notebook computers, tablet computers, cameras, monitoring devices, and wearable devices.

For ease of description, the following uses a split dual camera array camera module 100 composed of two camera module units as an example for description. In other embodiments of the present invention, the split array camera module 100 may include more of the camera module units, and the present invention is not limited in this regard. 1 to 4, a split array camera module 100 according to the first preferred embodiment of the present invention. The split array camera module 100 includes at least two camera module units and an assembly 30, and each of the camera module units is assembled in the assembly 30 separately to form a whole.

Specifically, the two camera module units are a first camera module unit 10 and a second camera module unit 20, respectively. The assembly 30 includes a main body 31 and has a storage room 32. The first camera module unit 10 and the second camera module unit 20 are accommodated in the storage room 32. In other words, the main body 31 forms the receiving chamber 32, and fixes the limiting units of the first camera module unit 10 and the second camera module unit 20 therein, so that the first camera module The group unit 10 and the second camera module unit 20 form a whole, which is convenient for installation and application. It is worth mentioning that the receiving chamber 32 is not a closed structure, but a semi-open structure, so that each of the camera module units can perform lighting and provide a position for electrical connection.

In other embodiments of the present invention, the assembly may not form the obvious storage room, for example, the first camera module unit 10 and the second camera module unit 20 are fixed by spaced plate members .

Further, the first camera module unit 10 and the second camera module unit 20 are respectively fixed to the side wall of the main body 31 of the assembly 30, for example, fixed by glue, so as to pass the The main body 31 provides fixed positions for the first camera module unit 10 and the second camera module unit 20, respectively, so that the relative positions of the first camera module unit 10 and the second camera module unit 20 Confirm to form an array structure. It is worth mentioning that the array described in the present invention is used to express that each camera module unit forms a positional layout relationship, and is not limited to the arrangement in rows. The layout can be based on the needs and the array camera module. The quantity and type are determined, such as linear arrangement, triangular arrangement, symmetrical arrangement, etc.

More specifically, in some embodiments, the assembly body 30 may be a square frame structure, so that each of the camera module units is assembled into a square structure by a stopper, which is convenient Install applications, such as electronic devices. Of course, in other embodiments of the present invention, the structure of the assembly 30 may be deformed according to the size and structure of each camera module unit to form a regular or irregular structure, so that each camera module The unit can be assembled stably.

Further, the assembly 30 includes an upper cover 33, which is suitable for shielding the main body 31 so as to close the receiving chamber 32. Further, the upper cover 33 has at least two lens openings 331 corresponding to each camera module unit, so that each camera module unit performs lighting through the lens opening 331.

In this embodiment of the present invention, the upper cover 33 is integrally connected to the main body 31, thereby constructing an integral receiving structure. For example, in the process of assembling the split array camera module, each camera module may be placed upside down in the assembly 30, and then the assembly 30 is filled with glue so that each of the The camera module is fixedly connected to the assembly 30 to form the split array camera module, and glue may be applied in the upper cover 33 of the assembly 30 when the assembly 30 is inverted , And then the camera module is placed upside down, so that the assembly 30 and each camera module are stably connected to form the split array camera module.

Of course, in other implementations of the present invention, the upper cover 33 may not be provided, or the upper cover 33 may be connected separately from the main body 31, or only the upper cover 33 may be connected without connecting the main 31, in the art Those skilled in the art should understand that the arrangement of the upper cover 33 and the connection method are not limitations of the present invention.

Further, referring to FIG. 3, for example, the assembly process of the split array camera module 100 may be that the assembly 30 is turned upside down, glue is applied on top of the camera module units 10, 20, and then The inverted pre-assembled in the assembly 30, further, the first camera module unit 10 and the second camera module unit 20 are actively calibrated respectively, so that the first camera module unit 10 Coincide with the optical axis of the second camera module unit 20, and then separate the first camera module The element 10 and the second camera module unit 20 are cured so that the first camera module unit 10 and the second camera module unit 20 are fixedly connected to the assembly 30.

It is worth mentioning that the fixed positions of the camera module units 10, 20 and the assembly 30 may be the top or the side walls. For example, at the time of bonding, the side wall of the main body 31 of the assembly 30 and the camera module unit may be fixed, and/or at the time of bonding, the upper cover 33 of the assembly 30 and the The camera module unit is fixed. The assembly 30 may not have the upper cover 33, and the camera module units 10, 20 are connected to the side wall or the bottom wall of the assembly 30. Those skilled in the art should understand that the bonding position of the glue is not a limitation of the present invention.

In another embodiment of the present invention, referring to FIG. 15, the assembly 30 may include a supporting edge 34 disposed on the bottom of the main body 31 to support the first camera module unit 10 and the camera Described second camera module unit 20. Specifically, the supporting edge 34 extends from the main body 31 into the receiving chamber 32 to form a boss to provide support for the first camera module unit 10 and the second camera module unit 20 position. The upper cover 33 is detachably connected to the main body 31.

The supporting edge 34 limits the first camera module unit 10 and the second camera module unit 20, so that the first camera module unit 10 and the second camera module unit 20 are in a predetermined position position. It is worth mentioning that, in this embodiment of the present invention, the height of the supporting edge 34 corresponding to the first camera module unit 10 and the second camera module unit 20 is the same, when two camera modules When the heights of the units are the same, the heights of the ends of the camera module units may be the same. In other embodiments of the present invention, the positions of the first camera module unit 10 and the second camera module unit 20 corresponding to the height of the supporting edge 34 may be different, so that different limit heights may be provided, Even if the heights of the two camera module units are different, the height difference between the first camera module unit 10 and the second camera module unit 20 can still be compensated by the supporting edge 34, so that the split type The ends of the array camera module 100 match. Of course, in other embodiments of the present invention, the top heights of the first camera module unit 10 and the second camera module unit 20 may be different, and the present invention is not in this regard limit. In other words, the supporting edge 34 may be a boss on the same plane or a boss on a different plane. The height of the camera module may be the same or different. The first camera module unit 10 and The top of the second camera module unit 20 may be the same or different, and the present invention is not limited in these respects.

It is worth mentioning that in the present invention, the first camera module unit 10 and the second camera module unit 20 are provided separately, so that the first camera module unit 10 and the second camera The mutual influence of the module units 20 is small, and the assembly 30 is packaged to ensure the consistency of the optical axes of the first camera module unit 10 and the second camera module unit 20. During the assembly process, the first camera module unit 10 and the second camera module unit 20 can be pre-assembled in the assembly 30, and the first camera module unit 10 and /Or the second camera module unit 20 performs automatic calibration, so that the optical axes of the first camera module unit 10 and the second camera module unit 20 are the same, or the included angle of the optical axis is within a predetermined error range Relative position within a certain distance. If the first camera module unit 10 and the second camera module unit 20 are connected and fixed together, and the mutual influence is greater, that is to say, when adjusting one of the camera module units , Will inevitably affect another camera module unit, and cannot achieve the purpose of independent active calibration in the present invention.

In this embodiment of the present invention, the basic structures of the first camera module unit 10 and the second camera module unit 20 are the same, that is, the first camera module unit 10 and the first The second camera module unit 20 may be the same type of camera module. Of course, in other embodiments of the present invention, the first camera module may be of a different type, and the present invention is not limited in this regard.

Specifically, the first camera module unit 10 includes a first photosensitive element 11, a first lens 12, a first lens supporting element 13, and a first filter element 14.

The first lens 12 is located in the photosensitive path of the first photosensitive element 11, the first lens 12 is mounted on the first lens support element 13, and the first lens support element 13 is mounted on the first A photosensitive element 11 so that the first lens 12 is located on the first photosensitive element 11 Light path, the first filter element 14 is mounted on the first photosensitive element 11 so that the light passing through the first lens 12 passes through the action of the first filter element 14 to reach the first Photosensitive element 11.

The first photosensitive element 11 includes a first circuit board 111, a first photosensitive element 113 and a first base 112.

The first photosensitive element 113 is electrically connected to the first circuit board 111 to facilitate the transmission of photosensitive information to the first circuit board 111, the first lens 12 is located in the photosensitive path of the first photosensitive element 113, Therefore, the first photosensitive element 113 receives light and receives light. In particular, in some embodiments, the first photosensitive element 113 may be disposed on the first circuit board 111 through a surface mount technology (SMT) (Surface Mount Technology), and electrically connected through at least one first electrical connection element 1133 Connected to the first circuit board 111. The first electrical connection element 1133 is exemplified but not limited to gold wires, silver wires, copper wires, aluminum wires, pads, pins, and the like.

The first photosensitive element 113 has a first photosensitive area 1131 and a first non-photosensitive area 1132, the first photosensitive area 1131 is used for photosensitive action, and the first non-photosensitive area 1132 is used to electrically connect to the First circuit board 111. In this embodiment of the present invention, the first non-photosensitive area 1132 is electrically connected to the first circuit board 111 through the electrical connection element.

In this embodiment of the invention, the first photosensitive element 113 is located inside the first base 112, that is, it is not encapsulated by the base. In this embodiment of the present invention, the first photosensitive element 113 needs to be mounted on the first circuit board 111, such as glue bonding, so that the first photosensitive element 113 is stably fixed, and then the The first photosensitive element 113 is electrically connected to the first circuit board 111 through the first electrical connection element 1133, for example, electrically connected to the first circuit board 111 by a gold wire.

Further, the first base 112 is integrally connected to the first circuit board 111. The first base 112 includes a first base body 1121 and a first light window 1122. The first The light window 1122 provides a light path for the first photosensitive element 113. In other words, the first photosensitive element 113 is located in the first light window 1122, and the photosensitive path of the first photosensitive element 113 is consistent with the direction of the first light window 1122.

More specifically, the first base body 1121 forms the first light window 1122 to provide a light path for the first photosensitive element 113. In some embodiments, the first base body 1121 is a closed ring structure, adapted to the shape of the first photosensitive element 113.

In this embodiment of the present invention, the first base body 1121 has a first inner side wall, and the first inner side wall has an inclined angle, thereby facilitating mold manufacturing and reducing stray light reflection to the photosensitive element. For example, when the side wall is at a vertical angle, the incident angle of the light reaching the first base body 1121 is large, so the reflection angle of the light is large, and it is easier to reflect toward the inside, that is, to the position of the photosensitive element reflection. When the first inner side wall is inclined, the incident angle of the light is small, and the light incident in the same direction, the reflected light is shifted away from the position of the photosensitive element, so the inclined arrangement helps reduce the interference of stray light . The size of the tilt angle can be set according to requirements. Of course, in some embodiments, the first inner side wall of the first base body 1121 may be vertically arranged, that is, the inclination angle does not exist.

Further, according to an embodiment of the present invention, the first base 112 is disposed on the first circuit board 111 in an integrated manner, such as by molding, so that the first base 112 and the base The first circuit board 111 is stably fixed, and additional installation and fixing processes are reduced. For example, the process of glue bonding is reduced, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is reduced.

For example, the first base 112 may be provided on the first circuit board 111 by integral molding of a mold, such as the method of molding on the circuit board, which is different from the traditional COB (Chip On Board) method. Through the integral molding of the mold, the molding shape and the surface flatness can be better controlled, for example, the first base body 1121 has a better flatness, so that it is installed Components, such as the lens support element and the first filter element 14, provide smooth installation conditions, thereby helping to improve the optical axis consistency of the first camera module unit 10.

Further, according to this embodiment of the present invention, the first circuit board 111 includes a first circuit board body 1111 and at least one first electronic component 1112, and the first electronic component 1112 protrudes from the first circuit board The main body 1111 is used to cooperate with the work of the first circuit board main body 1111. The first base 112 is integrally formed on the first circuit board body 1111 and covers the first electronic component 1112, thereby reducing the occupied space of the first electronic component 1112. The first electronic component 1112 is exemplified but not limited to, a resistor, a capacitor, a driver, and the like. Of course, in other embodiments of the present invention, the first electronic component 1112 may not be provided or the first electronic component 1112 may protrude from the first circuit board body 1111, for example, be embedded in the first The circuit board body 1111, the present invention is not limited in this regard.

Each of the first electronic components 1112 may be mounted on the edge area of the first circuit board 111 at intervals, such as outside the first photosensitive element 113, by an SMT process, for example. It is worth mentioning that each of the first electronic components 1112 may be located on the same side or the opposite side of the first circuit board 111, for example, in a specific example, the first photosensitive element 113 and each The first electronic components 1112 may be located on the same side of the first circuit board 111 respectively, and the first photosensitive element 113 is mounted on the wafer mounting area of the first circuit board 111, each of the first An electronic component 1112 is mounted on the edge area of the first circuit board 111 at intervals. The first base 112 wraps each of the first electronic components 1112 after molding to isolate the adjacent first electronic components 1112 and the first electronic components by the first base 112 1112与此第一 photosensitiveElement 113.

In the camera module of the present invention, the first base 112 wraps each of the first electronic components 1112 after molding has many advantages. First, the first base 112 includes Covering each of the first electronic components 1112 so that there is no gap between adjacent first electronic components 1112 Undesirable phenomena of mutual interference may occur, and even when the distance between the adjacent first electronic components 1112 is short, the imaging quality of the camera module unit can be ensured, so that the first circuit board with a small area can be made A larger number of the first electronic components 1112 can be mounted on 111, so that the structure of the camera module unit is more compact, which is beneficial to improve the size of the camera module unit on the basis of control The imaging quality of the camera module unit; secondly, the first base 112 covers each of the first electronic components 1112, so that whether in the horizontal direction or in the height direction, the first base 112 and There is no need to reserve a safety distance between each of the first electronic components 1112 to reduce the size of the camera module unit. Thirdly, the first base 112 covers each of the first electronic components 1112, so that there is no need to use glue to connect and level between the first base 112 and the first circuit board 111, In order to reduce the height dimension of the camera module unit. Fourth, the first base 112 covers each of the first electronic components 1112. During the subsequent transportation and assembly of the camera module unit to form the split-array camera module 100, the The first base 112 can prevent the first electronic component 1112 from shaking and falling off, thereby helping to ensure the structural stability of the split array camera module 100. Fifth, the first base 112 wraps each of the first electronic components 1112. During the subsequent transportation and assembly of the camera module unit to form the split-array camera module 100, it can prevent Contaminants contaminate each of the first electronic components 1112, or contaminants on the surface of the electronic components fall off to contaminate the photosensitive elements to ensure the imaging quality of the first camera module unit 10. Sixth, after the first base 112 covers the electronic component, the first electronic component 1112 can be isolated from the air. In this way, the oxidation rate of the metal portion of the first electronic component 1112 can be slowed down It is beneficial to improve the environmental stability of the first electronic component 1112 and the split array camera module 100.

It is worth mentioning that the first base 112 is integrally formed on the first circuit board body 1111 and covers the first electronic component 1112 of the first circuit board 111, so that the first The base 112 and the first circuit board body 1111 have a larger connection area, and the connection is more stable The first base 112 can firmly and reliably support and fix the components of the first camera module unit 10, thereby ensuring the yield of the product .

It is also worth mentioning that for high-primary camera module units, the number of lenses of the lens is increasing, such as reaching 5p, 6p, and above 6p. When the number of lens of the camera module lens increases, it also needs Meet the requirements of optical performance, such as providing a smaller back focal length to prevent the filter element from affecting the imaging quality of the camera module unit, such as providing cleaner and smoother installation conditions, so that no black spots appear in the imaging, The edges are like paste, etc., and according to the embodiment of the present invention, the filter element is mounted on the integrally formed base, so that the filter element can be provided with a flat installation condition, and can pass through the base The height of the seat effectively controls the height position where the filter element is installed, so the structure of the present invention is more suitable for a high-picture element camera module.

The first base 112 has a first mounting slot 1123 communicating with the first light window 1122. The first filter element 14 is located between the first lens 12 and the first photosensitive element 113, so as to filter light passing through the first lens 12 and reaching the first photosensitive element 113. The first filter element 14 is installed in the first mounting groove 1123. For example, the first filter element 14 can be implemented as an infrared cut filter, a total transmission spectrum filter, a blue glass filter, or the like.

The second camera module unit 20 includes a second photosensitive element 21, a second lens 22, a second lens support element 23 and a second filter element 24.

The second lens 22 is located in the photosensitive path of the second photosensitive element 21, the second lens 22 is mounted on the second lens support element 23, and the second lens support element 23 is mounted on the first Two photosensitive elements 21, so that the second lens 22 is located on the photosensitive path of the second photosensitive element 21, and the second filter element 24 is mounted on the second photosensitive element 21, so that The light from the second lens 22 passes through the second filter element 24 to reach the second photosensitive element 21.

The second photosensitive element 21 includes a second circuit board 211, a second photosensitive element 213 and a second base 212.

The second photosensitive element 213 is electrically connected to the second circuit board 211 to facilitate the transmission of photosensitive information to the second circuit board 211, the second lens 22 is located in the photosensitive path of the second photosensitive element 213, In order for the second light receiving element 213 to receive light and receive light. In particular, in some embodiments, the second photosensitive element 213 may be disposed on the second circuit board 211 through a surface mount technology (SMT) (Surface Mount Technology), and electrically connected through at least one second electrical connection element 2133 Connected to the second circuit board 211. The second electrical connection element 2133 is exemplified but not limited to gold wires, silver wires, copper wires, aluminum wires, pads, pins, and the like.

The second photosensitive element 213 has a second photosensitive area 2131 and a second non-photosensitive area 2132, the second photosensitive area 2131 is used for photosensitive action, and the second non-photosensitive area 2132 is used to electrically connect to the Second circuit board 211. In this embodiment of the present invention, the second non-photosensitive area 2132 is electrically connected to the second circuit board 211 through the electrical connection element.

In this embodiment of the invention, the second photosensitive element 213 is located inside the second base 212, that is, it is not encapsulated by the base. In this embodiment of the present invention, the second photosensitive element 213 needs to be mounted on the second circuit board 211, such as glue bonding, so that the second photosensitive element 213 is stably fixed, and then the The second photosensitive element 213 is electrically connected to the second circuit board 211 through the second electrical connection element 2133, for example, electrically connected to the second circuit board 211 by a gold wire.

Further, the second base 212 is integrally connected to the second circuit board 211. The second base 212 includes a second base body 2121 and a second light window 2122. The second light window 2122 provides a light path for the second photosensitive element 213. In other words, the second photosensitive element 213 is located in the second light window 2122, and the photosensitive path of the second photosensitive element 213 is in the same direction as the second light window 2122.

More specifically, the second base body 2121 forms the second light window 2122 to provide a light path for the second photosensitive element 21313. In some embodiments, the second base body 2121 is a closed ring structure, adapted to the shape of the second photosensitive element 213.

In this embodiment of the present invention, the second base body 2121 has a second inner side wall, and the second inner side wall has an inclination angle α, thereby facilitating mold manufacturing and reducing stray light reflection to the photosensitive element. For example, when the side wall is at a vertical angle, the incident angle of the light reaching the second base body 2121 is large, so the reflection angle of the light is large, and it is easier to reflect toward the inside, that is, to the position of the photosensitive element reflection. When the second inner side wall is inclined, the incident angle of the light is small, and the direction of the light incident in the same direction and the reflected light are shifted away from the position of the photosensitive element, so the inclined arrangement helps reduce the interference of stray light . The size of the tilt angle α can be set according to requirements. Of course, in some embodiments, the second inner side wall of the second base body 2121 may be vertically arranged, that is, the inclination angle α does not exist.

Further, according to this embodiment of the present invention, the second base 212 is provided on the second circuit board 211 in an integrated manner, such as by molding, so that the second base 212 and The second circuit board 211 is stably fixed, and additional installation and fixing processes are reduced. For example, the process of glue bonding is reduced, the connection is more stable, the height of the glue connection is omitted, and the height of the camera module unit is reduced.

For example, the second base 212 may be provided on the second circuit board 211 by integral molding of a mold, such as the method of molding on the circuit board, which is different from the traditional COB (Chip On Board) method. Through the integral molding of the mold, the molding shape and surface flatness can be better controlled, for example, so that the second base body 2121 has a good flatness, so that it is a mounted component, such as the second lens support element 23. The second filter element 24 provides a flat installation condition, thereby helping to improve the consistency of the optical axis of the second camera module unit 20.

Further, according to this embodiment of the present invention, the second circuit board 211 includes a second circuit board body 2111 and at least one second electronic component 2112, and the second electronic component 2112 protrudes from the second circuit board The main body 2111 is used to cooperate with the work of the second circuit board main body 2111. The second base 212 is integrally formed on the second circuit board body 2111 and covers at least part of the second electronic component 2112, thereby reducing the occupied space of the second electronic component 2112. The second electronic component 2112 is exemplified but not limited to, resistors, capacitors, drivers, and the like. Of course, in other embodiments of the present invention, the second electronic component 2112 may not be provided or the second electronic component 2112 may not protrude from the second circuit board body 2111, such as embedded in the first Two circuit board main body 2111, the invention is not limited in this respect. For example, the types of the first circuit board body 1111 and the second circuit board body 2111 are soft board, hard board, and soft-hard board.

Each of the second electronic components 2112 may be attached to an edge area of the second circuit board 211 at intervals, such as outside the second photosensitive element 213, by a process such as SMT. It is worth mentioning that each of the second electronic components 2112 may be located on the same side or the opposite side of the second circuit board 211, for example, in a specific example, the second photosensitive element 213 and each The second electronic components 2112 may be respectively located on the same side of the second circuit board 211, and the second photosensitive element 213 is mounted on the wafer mounting area of the second circuit board 211, each of the first The two electronic components 2112 are respectively mounted on the edge area of the second circuit board 211 at intervals. The second base 212 wraps each of the second electronic components 2112 after molding to isolate the adjacent second electronic components 2112 and the second electronic components by the second base 212 2112 and the second photosensitive element 213.

The advantages that the second base 212 is integrally formed on the second circuit board 211 bring are the same as those of the first camera module unit 10, and will not be repeated here. It can be understood that the first and second bases may also be respectively disposed on the first and second circuit boards by glue mounting. Preferably, at least one of the first and second bases is provided on the counter by integral molding Should be the circuit board. For example, two bases are integrally formed on the corresponding circuit board, or one base is integrally formed on the corresponding circuit board, and the other base is traditional The bracket is installed on the corresponding circuit board by means of mounting.

Further, the first lens support element 13 and the second lens support element 23 may be implemented as a driving element or a lens barrel element, thereby forming a dynamic focus camera module or a fixed focus camera module. The driving element is exemplified but not limited to, a voice coil motor, a piezoelectric motor, and the like. For example, when both the first lens supporting element 13 and the second lens supporting element 23 are implemented as a driving element, the first camera module unit 10 and the second camera module unit 20 are both A dynamic focus camera module, that is to say, the split array camera module 100 is composed of two dynamic focus camera modules. When the first lens support unit 12 is implemented as a driving element, and the second lens support element 23 is implemented as a lens barrel element, the first camera module unit 10 is a dynamic focus camera module, the first The two camera module unit 20 is a fixed focus camera module, that is to say, the split array camera module 100 is composed of a dynamic focus camera module and a fixed focus camera module. When the first lens supporting element 13 is implemented as a lens barrel element, and the second lens 22 element is implemented as a driving element, the first camera module unit 1010 is a fixed focus camera module, the first The second camera module unit 20 is a dynamic focus camera module. When both the first lens support element 13 and the second lens support element 23 are implemented as the lens barrel element, the first camera module unit 10 and the second camera module unit 20 are both Fixed focus camera module.

It is worth mentioning that in some embodiments, when the first lens support element 13 or the second lens support element 23 is implemented as a driving element, the first lens support element 13 and the second The lens supporting element 23 is electrically connected to the first circuit board 111 or the second circuit board 211, so as to drive the first lens 12 or the second lens 22 to work. For example, the first lens support element 13 and the second lens support element 23 may be electrically connected to the first circuit board 111 or the second circuit board 211 by providing pins, pads or leads, etc. .

The types of the first camera module unit 10 and the second camera module unit 20 can be configured according to requirements, so as to cooperate with each other to achieve a better image collection effect, and the present invention is not limited in this regard.

It is worth mentioning that, in this embodiment of the invention, the first photosensitive element 113 and the second photosensitive element 213 of the first camera module unit 10 and the second camera module unit 20 The types can be the same or different to form camera module units with different functions.

As shown in FIG. 5, a schematic cross-sectional view of the split array camera module 100 according to the second preferred embodiment of the present invention. Different from the above embodiment, the second base 212 of the second photosensitive element 21 of the second camera module unit 20 integrally encapsulates at least part of the second non-photographic element of the second photosensitive element 213 Photosensitive area 2132. In other words, the second base 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213, so that the second photosensitive element 213 is stably fixed, and the The moldable area of the second base 212 is described. The second base 212 covers the second electrical connection element 2133.

It is worth mentioning that, compared to the first embodiment in which the first base 112 is formed only on the first circuit board 111, the second base 212 is molded on the photosensitive element The range of integral molding can be extended to the second non-photosensitive area 2132 of the second photosensitive element 213, thereby increasing the number of the second photosensitive element 213 without affecting the normal photosensitive operation of the second photosensitive element 213 The connection area of the bottom of the two bases 212 can make the second base 212 and the second circuit board 211 and the second photosensitive element 213 more stable connection, and the top can be other components, as described The second lens 22, the second lens support element 23, etc., provide a larger mountable area. And the second electrical connection element 2133 is covered by the second base 212, so as to avoid external interference with the second electrical connection element 2133, and prevent the second electrical connection element 2133 from being oxidized or contaminated with dust to affect the Describe the imaging quality of the camera module unit.

As shown in FIG. 6, it is a schematic cross-sectional view of a split array camera module 100 according to a third preferred embodiment of the present invention. In this embodiment of the present invention, the assembly 30 includes a partition wall 35 that is disposed in the storage chamber 32 to partition the storage chamber 32 and accommodate the camera module units respectively. The partition wall 35 may be made of plastic, resin, rubber, metal, or other materials, so as to reduce electromagnetic interference of the first camera module unit 10 and the second camera module unit 20.

Further, in an embodiment of the present invention, the partition wall 35 is fixedly connected to the upper cover 33, so that when the upper cover 33 closes the receiving chamber 32, the partition wall 35 will The group unit 10 and the second camera module unit 20 are isolated.

In another embodiment of the present invention, the partition wall 35 is fixedly connected to the side wall of the main body 31, partitions the storage chamber 32 into two parts, and respectively receives the first camera module unit 10 and the Second camera module unit 20. That is, when the first camera module unit 10 and the second camera module unit 20 are mounted on the assembly 30, the first camera module unit 10 and the second camera module The group unit 20 is separated by the partition wall 35. Of course, in other embodiments of the present invention, the partition wall 35 may also be other structures and materials, and the present invention is not limited in this regard.

As shown in FIG. 7, it is a schematic cross-sectional view of the split array camera module 100 according to the fourth preferred embodiment of the present invention. In this embodiment, the first base 112 includes a first support element 1124 for supporting the mold during the manufacturing process to prevent the first circuit board 111 or the first photosensitive element 113 from damage. That is to say, during the manufacturing process, the manufacturing mold can be pressed against the first supporting element 1124, so that the mold does not directly contact the first circuit board 111 or the first photosensitive element 113, And prevent the molding material from overflowing to the inside.

Further, the first supporting element 1124 may be a ring structure, which is consistent with the edge shape of the first base body 1121. The first supporting element 1124 has elasticity, such as, but not limited to, a glue coating or a rubber pad.

The second base 212 includes a second support element 2124 for supporting the mold during the manufacturing process to prevent damage to the second circuit board 211 or the second photosensitive element 213. That is to say, during the manufacturing process, the manufacturing mold can be pressed against the second supporting element 2124, so that the mold does not directly contact the first circuit board 111 or the second photosensitive element 213, And prevent the molding material from overflowing to the inside.

Further, the second supporting element 2124 may be an annular structure, which is consistent with the edge shape of the second base body 2121. The second supporting element 2124 has elasticity, such as, but not limited to, a glue coating or a rubber pad.

As shown in FIGS. 8A and 8B, it is a schematic cross-sectional view of a split array camera module 100 according to a fifth preferred embodiment of the present invention. Referring to FIG. 8A, in this implementation of the present invention, the first camera module unit 10 includes a first support 15 for mounting other components, such as the first filter element 14, the first lens 12or the first lens support element 13.

In the drawings of this embodiment of the present invention, the first holder 15 is installed on the first base body 1121, and the first filter element 14 is installed on the first holder 15. In particular, the first support 15 sinks into the first light window 1122 of the first base 112, so that the position of the first filter element 14 sinks, close to the first The photosensitive element 113 reduces the back focal length occupation of the first camera module unit 10 and reduces the required area of the first filter element 14.

The second holder 25 is installed on the second base body 2121, and the second filter element 24 is installed on the second holder 25. In particular, the second support 25 sinks into the second light window 2122 of the second base 212, so that the position of the second filter element 24 sinks, close to the second The photosensitive element 213 reduces the back focus of the second camera module unit 20 and reduces the required area of the second filter element 24. Of course, in other embodiments of the present invention, the array camera module may include only one of the supports, such as the first support 15 or the second support 25, as those skilled in the art should understand Yes, the number of the supports is not a limitation of the present invention.

In this embodiment, the first support 15 is installed in the first mounting groove 1123 of the first base 112, and the second support 25 is installed in the second base 212 The second mounting slot 2123. In other embodiments of the present invention, the first base body 1121 and the second base body 2121 may be a platform structure, and the first support 15 and the second support 25 may also be combined The platform structure that does not sink and is directly installed on the first support 15 and the second support 25, those skilled in the art should understand that the installation position and specific structure of the support It is not a limitation of the present invention.

It is worth mentioning that in other embodiments of the present invention, the support may cooperate with the base to form the light window, that is to say, the base may have an opening communicating with the outside, and the The support can supplement the opening to form a closed light window. For example, the support may extend to the circuit board body to form a closed light window.

Referring to FIG. 8B, in this embodiment, the first support 15 and the second support 25 are integrally connected. In other words, the adjacent portions of the first support 15 and the second support 25 are connected to each other, so that they can be installed on the first base 112 and the second base 212 at a time, and provide relative Consistent installation conditions.

9 is a schematic cross-sectional view of a split array camera module 100 according to a sixth preferred embodiment of the present invention. In this embodiment, the difference from the first embodiment is that the second circuit board body 2111 has a second sinking area 21111, and the second photosensitive element 213 is sinked on the second The sinking area 21111 facilitates reducing the relative height of the second photosensitive element 213 and the second circuit board body 2111.

The second sinking area 21111 may be implemented as a groove or a through hole. In other words, both sides of the second circuit board main body 2111 may not be connected or connected. When the second sinking area 21111 is a groove, the second photosensitive element 213 is disposed at the bottom of the groove, and is electrically connected to the second circuit board main body 2111 through the second electrical connection element 2133. The outer of the second electrical connection element 2133 The end may be electrically connected to the bottom of the groove of the groove, or may be electrically connected to the outside of the second sinking area 21111. The present invention is not limited in this regard. Furthermore, the top surface of the second photosensitive element 213 may be the same as the top surface of the second circuit board body 2111, or higher than the top surface of the second circuit board body 2111, or lower than the second circuit The top surface of the plate body 2111, that is, the present invention does not limit the sinking depth.

Further, in the drawings of this embodiment of the present invention, the second sinking area 21111 is a through hole, that is, both sides of the second circuit board 211 communicate through the through hole. The second circuit board 211 of the second camera module unit 20 includes a second bottom plate 1113 stacked on the bottom of the second circuit board body 2111 to support the photosensitive element and enhance the first The structural strength of the main body 2111 of the circuit board. In other words, the second photosensitive element 213 is sunk in the second sunken area 21111 and supported by the bottom plate 1113. The second photosensitive element 213 is electrically connected to the second circuit board body 2111 through the second electrical connection element 2133.

In some embodiments, the bottom plate 1113 may be a metal plate, which is disposed on the bottom of the second circuit board body 2111 by attaching.

10 is a schematic cross-sectional view of a split array camera module 100 according to a seventh preferred embodiment of the present invention. Different from the first embodiment, in this embodiment, the first base 112 of the first photosensitive component 11 of the first camera module unit 10 integrally encapsulates the first photosensitive element 113 At least part of the first non-photosensitive area 1132. In other words, the first base 112 integrally encapsulates the first circuit board 111 and the first photosensitive element 113, so that the first photosensitive element 113 is stably fixed, and the The moldable area of the first base 112 is described. The first base 112 covers the first electrical connection element 1133.

It is worth mentioning that, compared to the first embodiment in which the first base 112 is formed only on the first circuit board 111, the first base 112 is molded on the photosensitive element The range of integral molding can be extended to the first non-photosensitive area of the first photosensitive element 113 1132, thereby increasing the connection area of the bottom of the first base 112 without affecting the normal photosensitive operation of the first photosensitive element 113, so that the first base 112 and the first A circuit board 111 and the first photosensitive element 113 are more stably connected, and the top may be other components, such as the first lens 12, the first lens support element 13, etc., to provide a larger mountable area. And the electrical connection element is covered by the first base 112, so as to avoid external interference with the electrical connection element, and prevent the electrical connection element from being oxidized or contaminated with dust to affect the imaging quality of the camera module unit.

The second base 212 of the second photosensitive element 21 of the second camera module unit 20 integrally encapsulates at least part of the second non-photosensitive area 2132 of the second photosensitive element 213. In other words, the second base 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213, so that the second photosensitive element 213 is stably fixed, and the The moldable area of the second base 212 is described. The second base 212 covers the second electrical connection element 2133. Further, in this embodiment, the second circuit board main body 2111 has a second sinking area 21111, and the second photosensitive element 213 is sinkingly disposed in the second sinking area 21111 to facilitate lowering The relative height of the second photosensitive element 213 and the second circuit board body 2111.

The second sinking area 21111 may be implemented as a groove or a through hole. In other words, both sides of the second circuit board main body 2111 may not be connected or connected. When the second sinking area 21111 is a groove, the second photosensitive element 213 is disposed at the bottom of the groove, and is electrically connected to the second circuit board main body 2111 through the second electrical connection element 2133. The outer end of the second electrical connecting element 2133 may be electrically connected to the bottom of the groove of the groove, or may be electrically connected to the outside of the second sinking area 21111. The present invention is not limited in this regard. Furthermore, the top surface of the second photosensitive element 213 may be the same as the top surface of the second circuit board body 2111, or higher than the top surface of the second circuit board body 2111, or lower than the second circuit The top surface of the plate body 2111, that is, the present invention does not limit the sinking depth.

Further, in the drawings of this embodiment of the present invention, the second sinking area 21111 is a through hole, that is, both sides of the second circuit board 211 communicate through the through hole.

In this embodiment, the second photosensitive element 213 and the second electrical connection element 2133 are integrally encapsulated by the second base 212, so the second photosensitive element can be fixed by the second base 212 213. A second bottom plate may be provided at the bottom of the second circuit board 211, or the second bottom plate may not be provided.

11 is a schematic cross-sectional view of a split array camera module 100 according to an eighth preferred embodiment of the present invention. Different from the first embodiment, in this embodiment, the first base 212 of the first photosensitive component 21 of the first camera module unit 20 integrally encapsulates the first photosensitive element 213 At least part of the first non-photosensitive area 2132. In other words, the first base 212 integrally encapsulates the first circuit board 211 and the first photosensitive element 213, so that the first photosensitive element 213 is stably fixed, and the The moldable area of the first base 212 is described. The first base 212 covers the first electrical connection element 2133.

Further, the first circuit board body 1111 includes a first board body 11112 and a second board body 11113, and the first board body 11112 and the second board body 11113 are fixedly connected by a connecting medium 11114. The first board 11112 may be a hard board, the second board 11113 may be a soft board, and the connection medium 11114 may be an anisotropic conductive adhesive. The first board 11113 may further include an interface end, for example, a connector is provided to facilitate electrical connection to an electronic device.

In some embodiments, the first base body 1121 is integrally formed on the first plate 11112, and the second plate 11113 overlaps one end of the first plate 11112. In the manufacturing process, the first circuit board body 1111 may be formed by the first board body 11112 and the second board body 11113, and then integrally formed, or the first board body 11112 may be formed first. Then, the second plate 11113 is electrically connected to the first plate 11112, for example, fixed to the first plate 11112 by the anisotropic conductive adhesive.

In some embodiments, the second circuit board body 2111 may also be constructed in the above manner, and the present invention is not limited in this regard.

12 is a schematic cross-sectional view of a split array camera module 100 according to a ninth preferred embodiment of the present invention. Different from the first preferred embodiment, in this embodiment, the second circuit board main body 2111 is provided with a second reverse attaching groove 21115, and the photosensitive element is installed in the second reverse attaching groove 21115 in an inverted manner . That is, the second photosensitive element 213 is mounted on the second circuit board body 2111 by FC (FliP Chip) method. The second inverted attaching groove 21115 is opposite to the second lens 22 in a direction.

That is, during the installation process, the second photosensitive element 213 is installed from below the second circuit board body 2111 toward the second circuit board body 2111, and the second The photosensitive area 2131 performs the photosensitive function through the second light window 2122 and the upper opening of the second flipping groove 21115.

Of course, in other embodiments of the present invention, the first camera module unit 10 may also be configured in the above manner.

13 is a schematic cross-sectional view of a split array camera module 100 according to a tenth preferred embodiment of the present invention. Different from the above preferred embodiment, in this embodiment, the second base 212 of the second photosensitive element 21 of the second camera module unit 20 integrally encapsulates the second photosensitive element 213 At least part of the second non-photosensitive area 2132. In other words, the second base 212 integrally encapsulates the second circuit board 211 and the second photosensitive element 213, so that the second photosensitive element 213 is stably fixed, and the The moldable area of the second base 212 is described. The second base 212 covers the second electrical connection element 2133.

The second base 212 includes a second extended mounting portion 2125 extending at least partially upward from the second base body 2121 and forming a second limiting groove 21251 for limiting mounting of the second The lens 2224 or the second lens support element 2325. In this embodiment of the invention, The second lens 22 is mounted on the second extension mounting portion 2125, and the second extension mounting portion 2125 replaces the second lens support element 23, thereby forming a fixed-focus camera module. In other embodiments of the present invention, the first camera module unit 10 may also be constructed in the above manner.

14 is a schematic diagram of a split array camera module 100 according to an eleventh preferred embodiment of the present invention. Different from the first preferred embodiment, in this embodiment of the present invention, the first circuit board body 1111 and the second circuit board body 2111 are integrally connected to form an overall structure, the first A base 112 and the second base 212 are respectively formed in different areas of the overall structure, that is, areas corresponding to the first circuit board body 1111 and the second circuit board 211.

15A, 15B, and 15C are schematic cross-sectional views of different implementations of the split array camera module 100 according to the twelfth preferred embodiment of the present invention. In this embodiment of the present invention, the split array camera module 100 is composed of two camera module units of different heights, the first camera module unit 10 and the second camera module unit 20 The relative position can be arranged as required. For example, referring to FIG. 15A, the top ends of the first camera module unit 10 and the second camera module unit 20 are the same, and there is a height difference at the bottom. For example, referring to FIG. 15B, the first camera module The unit 10 is consistent with the bottom of the second camera module unit 20, and there is a height difference at the top. For example, referring to FIG. 15C, the two of the first camera module unit 10 and the second camera module unit 20 Both ends are inconsistent, and there are height differences at both ends. Those skilled in the art should understand that the type and height of the camera module unit are not limitations of the present invention.

FIG. 16 is a top view of the split array camera module 100 according to the eleventh preferred embodiment of the present invention. In this embodiment of the invention, the split array camera module 100 is composed of two camera module units of different sizes, the first camera module unit 10 and the second camera module unit 20 The relative position can be arranged as required. The structure of the assembly 30 may vary with the size of the camera module, for example, at a position where the camera module has a larger cross-section, such that the assembly 30 is opened The opening area is larger, and the position of the camera module unit with a smaller cross section makes the opening area of the assembly 30 smaller, thereby adapting to the size of each camera module unit.

It is worth mentioning that the above embodiments and the drawings are only used as examples to illustrate some ways in which the present invention can be implemented, and the various features in the above embodiments can be freely combined to form different camera module units. Other embodiments constituting the present invention also belong to the scope of the inventive concept. In addition, in the above embodiments and other embodiments of the present invention, the types and structures of the camera module units can be freely combined, and the assembly 30 is assembled to form the split array cameras of different structures The module 100, the present invention is not limited in this regard.

FIG. 17 is a block diagram of a method for manufacturing the split array camera module 100 according to the above-described preferred embodiment of the present invention. The present invention provides a method 1000 for manufacturing a split array camera module. The method includes the following steps: 1001: forming at least two camera module units; and 1002: assembling each camera module unit through an assembly 30 separately.

The step 1001 includes the steps of: 10011: mounting a photosensitive element on a circuit board; 10012: integrally forming a base on a circuit board. 10013: Set a lens on the photosensitive path of the photosensitive element; 10014: Actively calibrate the camera module unit.

The step 10012 may be before the step 10011 or after the step 10011.

The step 10012 may include the step of integrally forming the base on the circuit board and the photosensitive element, for example, integrally forming a base on a circuit board and at least part of the non-photosensitive area of a photosensitive element , Integrally encapsulating the circuit board and the photosensitive element.

The step 1002 includes the following steps: 10021: Pre-fix each camera module unit to the assembly 30; 10022: Actively calibrate the camera module units respectively so that the optical axes of the camera module units are consistent; and 10023: Fix each station Describe the camera module unit.

18 is a schematic diagram of application of the split array camera module 100 according to the above preferred embodiment of the present invention. The present invention further provides an electronic device 300, wherein the electronic device includes an electronic device body 200 and at least one split array camera module 100, wherein the split array camera module 100 is respectively disposed on the electronic device body 200 for acquiring images. It is worth mentioning that the type of the electronic device body 200 is not limited. For example, the electronic device body 200 may be a smart phone, a wearable device, a tablet computer, a notebook computer, an e-book, a personal digital assistant, a camera, Any electronic equipment that can be configured with the camera module, such as a monitoring device. A person skilled in the art may understand that although the electronic device body 200 is implemented as a smart phone in FIG. 35 as an example, it does not limit the content and scope of the present invention.

Those skilled in the art should understand that the embodiments of the present invention shown in the above description and drawings are only examples and do not limit the present invention. The object of the present invention has been completely and effectively achieved. The functions and structural principles of the present invention have been shown and described in the examples. Without departing from the principles, the embodiments of the present invention may have any variations or modifications.

10‧‧‧ First camera module unit

12‧‧‧ First lens

13‧‧‧The first lens support element

14‧‧‧First filter element

20‧‧‧Second camera module unit

21‧‧‧Second photosensitive element

22‧‧‧Second lens

23‧‧‧Second lens support element

24‧‧‧Second filter element

30‧‧‧Assembly

31‧‧‧Main

32‧‧‧ containment room

33‧‧‧Cover

34‧‧‧Supporting edge

111‧‧‧ First circuit board

113‧‧‧The first photosensitive element

211‧‧‧ Second circuit board

213‧‧‧Second photosensitive element

1111‧‧‧The main body of the first circuit board

1112‧‧‧The first electronic component

1121‧‧‧The first base body

1122‧‧‧First light window

1131‧‧‧ First photosensitive area

1132‧‧‧The first non-photosensitive area

2111‧‧‧ Main body of the second circuit board

2112‧‧‧Second electronic component

2121‧‧‧Second base body

2122‧‧‧Second light window

2131‧‧‧Second photosensitive area

2132‧‧‧Second non-photosensitive area

2133‧‧‧Second electrical connection element

Claims (29)

An array camera module is characterized by comprising: at least two camera module units, wherein each camera module unit includes at least one photosensitive element and at least one lens, wherein the lens is located in the photosensitive path of the photosensitive element, The photosensitive element includes at least one circuit board, at least one photosensitive element and at least one base, the base is integrally formed on the circuit board by molding, the photosensitive element is electrically connected to the circuit board; and at least one An assembly, wherein each of the camera module units is separately fixed to the assembly, so as to form a whole. The array camera module according to item 1 of the patent application scope, wherein the assembly includes at least one upper cover, and the upper cover has at least one lens opening, so that each of the camera module units is fixed to the assembly At this time, lighting is performed through the lens opening. The array camera module according to item 2 of the patent application scope, wherein the assembly forms at least one storage chamber, and each of the camera module units is accommodated in the storage chamber. The array camera module according to item 1 of the patent application scope, wherein the assembly includes a main body and at least one upper cover, wherein the upper cover is integrally connected to the main body; or the assembly includes a main body, which It has at least one side wall, each of the camera module units is pasted to the side wall, and an opening is formed on the top side of the assembly without a cover. The array camera module according to item 3 of the patent application scope, wherein the assembly includes at least one partition wall, the partition wall is located in the storage chamber, and divides the storage chamber into at least two parts, each for Accommodating each of the camera module units. The array camera module according to item 5 of the patent application scope, wherein the material of the partition wall is selected from one or more of plastic, resin, rubber, and metal. The array camera module according to item 5 of the patent application scope, wherein the partition wall is connected to the main body. The array camera module according to item 2 of the scope of the patent application, wherein the assembly includes at least one partition wall that divides the storage chamber into at least two parts, which are used to accommodate each of the camera modules Group unit, the partition wall is connected to the upper cover. The array camera module according to item 2 of the patent application scope, wherein the assembly includes at least one supporting edge, the supporting edge extends inward from the main body to facilitate supporting each of the camera module units. The array camera module according to item 9 of the patent application scope, wherein the supporting edge is a boss structure. The array camera module according to any one of claims 1 to 10, wherein the base has at least one light window to provide a light path for the photosensitive element. The array camera module according to item 11 of the patent application scope, wherein the photosensitive element is located inside the base. The array camera module according to item 11 of the patent application range, wherein the base integrally encapsulates the circuit board and at least part of the non-photosensitive area of the photosensitive element. The array camera module according to item 13 of the patent application range, wherein the photosensitive element is electrically connected to the circuit board through at least one electrical connection element, and the base covers the electrical connection element. The array camera module according to item 11 of the patent application scope, wherein the circuit board includes at least one electronic component, and the integrated base covers the electronic component. The array camera module according to item 11 of the patent application scope, wherein the base includes a support element, the support element is disposed on the circuit board body, so as to protect the circuit board during the manufacturing process The main body and the photosensitive element. The array camera module according to item 11 of the patent application scope, wherein the base includes a supporting element, the supporting element is disposed in a non-photosensitive area of the photosensitive element, so as to protect the camera during the manufacturing process Said photosensitive element. The array camera module according to item 11 of the patent application scope, wherein each of the camera module units includes a support, and the support is at least partially mounted on the base to facilitate the installation of a filter element. The array camera module according to item 18 of the patent application scope, wherein the support is at least partially connected to the circuit board. The array camera module according to item 18 of the patent application range, wherein each support of each camera module unit is integrally connected. The array camera module according to item 11 of the patent application scope, wherein the circuit board is provided with at least a sinking area, and the photosensitive element is provided in the sinking area to facilitate lowering of the photosensitive element and Describe the relative height of the circuit board. The array camera module according to item 11 of the patent application scope, wherein the circuit board includes a first board body and a second board body, and the second board body is fixedly connected to the first board through a connecting medium Plate body. The array camera module according to item 22 of the patent application range, wherein the first board body is a hard board, the second board body is a soft board, and the connection medium is an anisotropic conductive adhesive. The array camera module according to item 11 of the patent application scope, wherein the base includes an extension mounting portion extending at least partially upward from the base body to form a limit slot, which limits part. The array camera module according to item 11 of the patent application scope, wherein the circuit board is provided with a flip-chip slot, and the photosensitive element is arranged in the flip-chip slot, so that the photosensitive element is mounted in a flip-chip manner To the circuit board. The array camera module according to item 11 of the patent application scope, wherein the circuit boards of each camera module unit are integrally connected. The array camera module according to item 11 of the patent application scope, wherein each camera module unit is provided separately. The array camera module according to item 11 of the patent application scope, wherein the bottom of each camera module unit has a height difference. The array camera module according to item 11 of the patent application scope, wherein all the camera module units are all fixed focus camera modules, or all are dynamic focus camera modules, or part are fixed focus camera modules, part It is a dynamic focus camera module.

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