CN105744130B - Camera module and its photosensory assembly and manufacturing method - Google Patents

Camera module and its photosensory assembly and manufacturing method Download PDF

Info

Publication number
CN105744130B
CN105744130B CN201610143457.7A CN201610143457A CN105744130B CN 105744130 B CN105744130 B CN 105744130B CN 201610143457 A CN201610143457 A CN 201610143457A CN 105744130 B CN105744130 B CN 105744130B
Authority
CN
China
Prior art keywords
camera module
photosensory assembly
encapsulation part
wiring board
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610143457.7A
Other languages
Chinese (zh)
Other versions
CN105744130A (en
Inventor
田中武彦
赵波杰
王明珠
梅其敏
丁亮
蒋恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201610143457.7A priority Critical patent/CN105744130B/en
Priority to CN201910061810.0A priority patent/CN110022424B/en
Priority to CN201910061809.8A priority patent/CN110022423B/en
Priority to US15/075,192 priority patent/US10750071B2/en
Publication of CN105744130A publication Critical patent/CN105744130A/en
Priority to EP16894174.8A priority patent/EP3429181A4/en
Priority to KR1020207036129A priority patent/KR102335306B1/en
Priority to JP2018547880A priority patent/JP2019519087A/en
Priority to PCT/CN2016/103736 priority patent/WO2017157015A1/en
Priority to US15/317,117 priority patent/US10908324B2/en
Priority to KR1020187029337A priority patent/KR102193819B1/en
Priority to KR1020187029304A priority patent/KR20180132684A/en
Priority to JP2018548099A priority patent/JP7071926B2/en
Priority to PCT/CN2017/076041 priority patent/WO2017157211A1/en
Priority to EP17765753.3A priority patent/EP3429183A4/en
Priority to KR1020217005344A priority patent/KR102294537B1/en
Priority to KR1020217005352A priority patent/KR102360319B1/en
Priority to US16/082,533 priority patent/US20190148429A1/en
Priority to TW106203511U priority patent/TWM552720U/en
Priority to TW106108124A priority patent/TWI703715B/en
Priority to TW108135672A priority patent/TWI742441B/en
Priority to TW106203507U priority patent/TWM559558U/en
Priority to TW108135670A priority patent/TW202017356A/en
Priority to TW106108217A priority patent/TWI754632B/en
Priority to TW108135671A priority patent/TWI769403B/en
Priority to TW108135674A priority patent/TW202019155A/en
Priority to TW106203473U priority patent/TWM565451U/en
Priority to TW106108225A priority patent/TWI685255B/en
Priority to TW108135670D priority patent/TWI758644B/en
Priority to TW108135674D priority patent/TWI758645B/en
Priority to US15/460,231 priority patent/US9876948B2/en
Priority to US15/460,235 priority patent/US10277792B2/en
Priority to US15/461,413 priority patent/US9876949B2/en
Priority to US15/460,236 priority patent/US10084949B2/en
Priority to US15/473,573 priority patent/US9781325B1/en
Priority to US15/473,605 priority patent/US10033913B2/en
Priority to US15/473,607 priority patent/US9826132B2/en
Priority to US15/473,609 priority patent/US9906700B2/en
Priority to US15/679,146 priority patent/US10274694B2/en
Priority to US15/705,225 priority patent/US10175447B2/en
Priority to US15/705,232 priority patent/US10126519B2/en
Priority to US15/784,171 priority patent/US10237460B2/en
Priority to US15/784,167 priority patent/US10578837B2/en
Priority to US16/101,509 priority patent/US10367983B2/en
Priority to US16/436,934 priority patent/US10735637B2/en
Application granted granted Critical
Publication of CN105744130B publication Critical patent/CN105744130B/en
Priority to US16/737,863 priority patent/US20200218034A1/en
Priority to US16/908,723 priority patent/US11303789B2/en
Priority to US16/919,065 priority patent/US11706516B2/en
Priority to US17/114,466 priority patent/US11822099B2/en
Priority to US17/685,587 priority patent/US11743569B2/en
Priority to US17/740,887 priority patent/US20220268968A1/en
Priority to US17/847,569 priority patent/US12021097B2/en
Priority to US18/203,252 priority patent/US20230300442A1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/004—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having four lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/006—Filter holders
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Human Computer Interaction (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Abstract

One camera module and its photosensory assembly and manufacturing method, wherein the mould group photosensory assembly includes an encapsulation part and a photographic department；Institute's photographic department includes a wiring board main body and a sensitive chip, and the encapsulation part unitary packed is in the wiring board main body and the sensitive chip.

Description

Camera module and its photosensory assembly and manufacturing method
Technical field
The present invention relates to camera module fields, further, are related to a camera module and its photosensory assembly and manufacturing method.
Background technique
COB (Chip On Board, chip package) technique is one particularly important in camera module assembling manufacture process Technical process.Camera module made of traditional COB technique be wiring board, sensitive chip, microscope base, motor driving and through mirror First-class component assembles.
As shown in Figure 1, being a camera module schematic diagram of traditional COB technique manufacture.The camera module includes a line Road plate 1P, a sensitive chip 2P, a bracket 3P, an optical filter 4P, a motor 5P and a camera lens 6P.The sensitive chip 2P is pacified Loaded on the wiring board 1P, the optical filter 4P is installed in the bracket 3P, and the camera lens 6P is installed in the motor 5P, The motor 5P is installed in the bracket 3P, is located on the photosensitive path of the sensitive chip 2P in order to the camera lens 6P.
It is noted that being usually installed some circuit devcie 11P, such as resistance, electricity on the wiring board 1P Hold etc., these circuit devcies 11P protrudes from the surface the wiring board 1P, and the bracket 3P then needs to be installed in described On the wiring board 1P of circuit devcie 11P, and wiring board 1P described in traditional COB technique, the circuit devcie 11P and Assembling matching relationship between the bracket 3P has some unfavorable factors, and limits camera module to a certain extent to light The development of thinning.
It's also worth mentioning that the sensitive chip is usually to pass through some gold thread 21P to be electrically connected to the wiring board, with Convenient for the information transmission between the sensitive chip 2P and the line plate plate 1P.And characteristic and structure based on the gold thread 21P, The gold thread 21P is usually curvedly bent, and protrudes from the surface of the wiring board, therefore, the assembling of the sensitive chip Journey is also as the circuit devcie 11P, and to camera module, there are similar influence factors.
Specifically, firstly, the circuit devcie 11P and the gold thread 21P are directly exposed to the wiring board 1P's Surface, thus during subsequent assembling, for example the processes such as the bracket 3P, the welding motor 5P are pasted, unavoidably Will receive influence, solder resist, dust when welding etc. be easy to be attached to the circuit devcie 11P, and the circuit devcie 11P It is located in an interconnected space with the sensitive chip 2P, therefore dust pollutant is easy to influence sensitive chip 2P, Such influence may cause the camera module after assembling and there are the bad phenomenons such as dirty stain, reduce product yield.
Secondly, the bracket 3P is located at the outside of the circuit devcie 11P, therefore the bracket 3P and the line are being installed When the plate 1P of road, need to reserve certain safe distance between the bracket 3P and the circuit devcie 11P, and in the horizontal direction And upwardly direction requires reserved safe distance, this increases the demand of camera module thickness to a certain extent, makes Its thickness is difficult to decrease.
Third, during COB assembling, the bracket 3P or the motor 5P are glued to by pastes such as glue The wiring board 1P will usually carry out AA (Active Arrangement is calibrated automatically) technique when pasting, exactly adjust institute The central axis for stating the sensitive chip 2P and the camera lens 6P, it is consistent with vertical direction to reach horizontal direction, therefore In order to meet AA technique, need all to need between the bracket 3P and the wiring board 1P and the microscope base and the motor 5P More glue is preset, so that there are adjustment spaces between each other, and on the one hand this demand increases to a certain extent It to the thickness requirements of camera module, is difficult to decrease its thickness, on the other hand, repeatedly pastes assembling process and easily cause group The inclination of dress is inconsistent, and more demanding to the planarization of the microscope base 3P, the wiring board 1P and the motor 5P.
In addition, the wiring board 1P provides most basic fixation, support carrier in traditional COB technique, therefore, for The wiring board 1P itself requires have certain structural strength, this is required so that the wiring board 1P has biggish thickness Degree, thus the pre-add thickness requirements of camera module again from another point of view.
With various electronic products, the development of smart machine, camera module is also increasingly sent out to high-performance, lightening direction Exhibition, and electronic component in the various high performance demands for development such as high pixel, high imaging quality, circuit it is more and more, The area of chip is increasing, the Passive components such as resistance, capacitor is driven accordingly to increase, this makes the specification of electronic device more next Bigger, assembling difficulty constantly increases, the overall dimensions of camera module are increasing, and from the point of view of above-mentioned, microscope base, wiring board and Traditional assembling mode of circuit element etc. is also the very big limitation of the lightening development of camera module to a certain extent.
Summary of the invention
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein described photosensitive Component includes an encapsulation part and a photographic department, and the encapsulation part encapsulated moulding is in the photographic department.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein described photosensitive Portion includes a sensitive chip and a wiring board main body, and the sensitive chip is electrically connected to the wiring board by an at least connecting line Main body, the encapsulation part coat the connecting line, and so that it will not be directly exposed to outside.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the connection Line is integrally coated on inside the encapsulation part by the manufacture by molding.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein described photosensitive Component includes an at least circuit element, and the circuit element is coated in the encapsulation part, so as not to being directly exposed to It is external.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the circuit Element is integrally coated on inside the encapsulation part by the manufacture by molding.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein described photosensitive Chip has a photosensitive area and a non-photo-sensing area, and the encapsulation part is molded into the non-photo-sensing area of the sensitive chip, described in reduction The length and width dimensions of photosensory assembly and the camera module by its assembling.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the route Plate main body has an inner groovy, and the sensitive chip is arranged in the inner groovy, to reduce the height to the encapsulation part Degree requires.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the encapsulation Portion includes a cladding section and an optical filter construction section, and integrally molding is connected to the cladding section to the optical filter construction section, described Optical filter construction section is suitable for being mounted an optical filter, without providing additional optical filter mounting bracket.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein described photosensitive Component includes an optical filter, the optical filter molding the top of the sensitive chip is set to, to pass through the optical filter The sensitive chip is protected, and the back focal length of the camera module by its assembling can be reduced, so that the height of camera module is smaller.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein described photosensitive Component includes a reinforcing layer, the reinforcing layer laminate the bottom side of the wiring board main body is connected to, to increase the route The structural strength of plate main body in order to use the smaller wiring board main body of thickness, and can be improved the wiring board main body Heat-sinking capability.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the route There is an at least reinforced hole in main body, the encapsulation part extends into the reinforced hole, thus enhance the encapsulation part with it is described Bonding force between photosensory assembly, and increase the structural strength of the wiring board main body.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the encapsulation It is suitable for being mounted a motor or a camera lens in portion, can be used as traditional bracket, the support of the motor or the camera lens is provided Fixed position, and by the molded advantage of the encapsulation part, there is preferable flatness, to obtain reducing camera shooting film group Part assembles heeling error.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, wherein the camera shooting Mould group carries out assembly by the way of molding, to change traditional camera module COB technique.
It is an object of the present invention to provide a camera module and its photosensory assembly and manufacturing methods, use molding Mode manufactures the photosensitive circuit pack, to be molded, the integrated photosensory assembly.
In order to realize that object above and other objects of the present invention and advantage of the invention, an aspect of of the present present invention provide The photosensory assembly of one camera module comprising: an encapsulation part and a photographic department；The photographic department includes a wiring board main body and one Sensitive chip, the encapsulation part encapsulated moulding is in the wiring board main body and the sensitive chip.
An embodiment according to the present invention, encapsulation part described in the photosensory assembly formed a through-hole, the through-hole with The sensitive chip is opposite, to provide the sensitive chip passage of light.
An embodiment according to the present invention, the bottom of the through-hole of encapsulation part described in the photosensory assembly are under It is supreme be gradually increased it is skewed.
An embodiment according to the present invention, encapsulation part top described in the photosensory assembly are suitable for installing the camera shooting mould Camera lens, motor or the optical filter of group.
An embodiment according to the present invention, encapsulation part top described in the photosensory assembly is in planar, for pacifying Fill the camera lens, motor or optical filter of the camera module.
An embodiment according to the present invention, encapsulation part top described in the photosensory assembly has a mounting groove, described Mounting groove is connected to the through-hole, with the optical filter, camera lens or motor for installing the camera module.
An embodiment according to the present invention, encapsulation part described in the photosensory assembly include cladding a section, an optical filter Construction section and a camera lens construction section, the optical filter construction section and the camera lens construction section are successively molded by the cladding section upwards Extend, and internal in step-like, in order to install the optical filter and camera lens of the camera module.According to the present invention one implements Example, camera lens construction section described in the photosensory assembly have a camera lens inner wall, and the camera lens inner wall surface is smooth, is suitable for pacifying Fill a non-threaded camera lens.
An embodiment according to the present invention, camera lens construction section described in the photosensory assembly have a camera lens inner wall, institute Camera lens inner wall surface is stated with screw thread, is suitable for that a threaded camera lens is installed.
An embodiment according to the present invention, photographic department described in the photosensory assembly include an at least connecting line, each institute It states connecting line and is electrically connected the sensitive chip and the wiring board main body, the encapsulation part coats the connecting line, so that institute Outside will not be directly exposed to by stating connecting line.
An embodiment according to the present invention, connecting line described in the photosensory assembly are selected from combination: gold thread, silver wire, copper One of line or aluminum steel.
An embodiment according to the present invention, connecting line described in the photosensory assembly curvedly connect the wiring board Main body and the sensitive chip.
An embodiment according to the present invention, sensitive chip described in the photosensory assembly include a photosensitive area and a non-sense Light area, the non-photo-sensing area extend to the described of the sensitive chip around the photosensitive area periphery, the encapsulation part molding Non-photo-sensing area reduces the Outside Dimensions of the encapsulation part to extend the inside mouldable range of the encapsulation part.
An embodiment according to the present invention, photographic department described in the photosensory assembly include an at least circuit element, institute It states circuit element and protrudes from the wiring board main body, the encapsulation part coats the circuit element, so that the circuit element It will not be directly exposed to outside.
An embodiment according to the present invention, circuit element described in the photosensory assembly selection combination: resistance, capacitor, One or more of them in diode, triode, potentiometer, relay and relay.
An embodiment according to the present invention, photographic department described in the photosensory assembly include an optical filter, the optical filtering Piece is covered in the sensitive chip, and the encapsulation part takes shape in the wiring board main body, the sensitive chip and the optical filter, In order to protect the sensitive chip by the optical filter, and reduce the back focal length of the camera module, reduces its height.
An embodiment according to the present invention, photographic department described in the photosensory assembly include a reinforcing layer, the reinforcing Layer laminate is set to the wiring board bottom part body, to enhance the structural strength of the wiring board main body.
An embodiment according to the present invention, reinforcing layer described in the photosensory assembly is metal plate, to enhance the sense The heat dissipation performance in light portion.
An embodiment according to the present invention, photographic department described in the photosensory assembly include a shielded layer, the shielding Layer wraps up the wiring board main body and the encapsulation part, to enhance the electromagnetism interference performance of the photosensory assembly.
An embodiment according to the present invention, shielded layer described in the photosensory assembly are metal plate or metal mesh.
An embodiment according to the present invention, wiring board main body has an at least reinforced hole in the photosensory assembly, described Encapsulation part extends into the reinforced hole, in order to enhance the structural strength of the wiring board main body.
An embodiment according to the present invention, reinforced hole described in the photosensory assembly are groove-like.
An embodiment according to the present invention, reinforced hole described in the photosensory assembly is through-hole, so that the encapsulation The moulding material in portion comes into full contact with the wiring board main body, and easily fabricated.
An embodiment according to the present invention, the material of wiring board main body described in the photosensory assembly can be selected from group It closes: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
An embodiment according to the present invention, the material of encapsulation part described in the photosensory assembly, which is selected from, to be combined: nylon, One of LCP, PP or resin or a variety of.
Another aspect of the present invention provides the manufacturing method of the photosensory assembly of a camera module comprising step: in a line One encapsulation part of encapsulated moulding in road plate main body and a sensitive chip.
An embodiment according to the present invention, comprising steps of in a wiring board master in the manufacturing method of the photosensory assembly The attached sensitive chip is shown consideration for, and is electrically connected by an at least connecting line.
An embodiment according to the present invention, comprising steps of passing through the encapsulation in the manufacturing method of the photosensory assembly Portion coats the connecting line.
An embodiment according to the present invention, comprising steps of extending the encapsulation in the manufacturing method of the photosensory assembly Portion to a non-photo-sensing area of the sensitive chip.
An embodiment according to the present invention, comprising steps of in the encapsulation part in the manufacturing method of the photosensory assembly Top forms a mounting groove, in order to install an optical filter, motor or camera lens.
An embodiment according to the present invention, comprising steps of upwardly extending described in the manufacturing method of the photosensory assembly Encapsulation part, and two stage stepped structures of internal formation, in order to install optical filter or camera lens.
An embodiment according to the present invention, comprising steps of in the encapsulation part in the manufacturing method of the photosensory assembly Helicitic texture is arranged in inner wall, in order to install threaded camera lens.
An embodiment according to the present invention, comprising steps of in the wiring board in the manufacturing method of the photosensory assembly An at least groove-like reinforced hole is set in main body, and the encapsulation part is made to extend into the reinforced hole.
An embodiment according to the present invention, comprising steps of in the wiring board in the manufacturing method of the photosensory assembly An at least through hole shape reinforced hole is set in main body, and the encapsulation part is made to extend into the reinforced hole.
An embodiment according to the present invention, comprising steps of in the wiring board in the manufacturing method of the photosensory assembly Main body bottom attaches a reinforcing layer, to enhance the structural strength of the wiring board main body.
An embodiment according to the present invention, comprising steps of in the wiring board in the manufacturing method of the photosensory assembly Main body and the encapsulation part coat a shielded layer, to enhance the electromagnetism interference performance of the photosensory assembly.
Another aspect of the present invention provides the photosensory assembly of a camera module comprising an encapsulation part and a photographic department；Institute Photographic department includes a wiring board main body, a sensitive chip and an optical filter, and the encapsulation part encapsulated moulding is in the wiring board master Body, the sensitive chip and the optical filter.
Another aspect of the present invention, which provides encapsulation part described in the photosensory assembly of a camera module, has a camera lens mounting groove, The camera lens mounting groove is connected to the through-hole, in order to for the camera module camera lens or motor installation site is provided
Another aspect of the present invention provides the manufacturing method of the photosensory assembly of a camera module comprising step: in a line An encapsulation part is encapsulated on road plate main body, a sensitive chip and an optical filter.
According to another embodiment of the present invention, comprising steps of in a wiring board in the manufacturing method of the photosensory assembly Main body attaches the sensitive chip, and is electrically connected by an at least connecting line.
According to another embodiment of the present invention, comprising steps of described photosensitive in the manufacturing method of the photosensory assembly The optical filter is covered on chip, to protect the sensitive chip.
According to another embodiment of the present invention, comprising steps of passing through the envelope in the manufacturing method of the photosensory assembly Dress portion coats the connecting line and the optical filter.
According to another embodiment of the present invention, comprising steps of extending the envelope in the manufacturing method of the photosensory assembly Dress portion to the optical filter edge.
A camera module is provided according to another aspect of the present invention comprising photosensory assembly described in one；With a camera lens；Institute State the photosensitive path that camera lens is located at the sensitive chip of the photosensory assembly.
An embodiment according to the present invention, the camera module include a bracket, and the bracket is installed in the sense Optical assembly, the camera lens are installed in the bracket.
An embodiment according to the present invention, the camera module include a motor, and the camera lens is installed in the horse It reaches, the motor is installed in the photosensory assembly.
An embodiment according to the present invention, the camera module include an optical filter, and the optical filter is installed in institute State photosensory assembly.
An embodiment according to the present invention, the camera module include an optical filter, and the optical filter is installed in institute State bracket.
Detailed description of the invention
Fig. 1 is the camera module cut-away view of traditional COB technique.
Fig. 2 is the perspective view of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 3 is the cut-away view of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 4 is the manufacturing process schematic diagram of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 5 is the manufacturing method schematic diagram of the photosensory assembly of first preferred embodiment according to the present invention.
Fig. 6 is the camera module cut-away view of first preferred embodiment according to the present invention.
Fig. 7 is the camera module exploded view of first preferred embodiment according to the present invention.
Fig. 8 is another camera module cut-away view of first preferred embodiment according to the present invention.
Fig. 9 is the exploded view of another camera module of first preferred embodiment according to the present invention.
Figure 10 is the cut-away view of the photosensory assembly of second preferred embodiment according to the present invention.
Figure 11 is the camera module cut-away view of second preferred embodiment according to the present invention.
Figure 12 is the cross-sectional view of the photosensory assembly of third preferred embodiment according to the present invention.
Figure 13 is the camera module cut-away view of third preferred embodiment according to the present invention.
Figure 14 is another camera module cut-away view of third preferred embodiment according to the present invention.
Figure 15 is the cut-away view of the photosensory assembly of the 4th preferred embodiment according to the present invention.
Figure 16 is the photosensory assembly manufacturing method schematic diagram of the 4th preferred embodiment according to the present invention.
Figure 17 is the camera module cut-away view of the 4th preferred embodiment according to the present invention.
Figure 18 is another camera module cut-away view of the 4th preferred embodiment according to the present invention.
Figure 19 is the photosensory assembly cut-away view of the 5th preferred embodiment according to the present invention.
Figure 20 is the camera module cut-away view of the 5th preferred embodiment according to the present invention.
Figure 21 is the photosensory assembly cut-away view of the 6th preferred embodiment according to the present invention.
Figure 22 is the camera module cut-away view of the 6th preferred embodiment according to the present invention.
Figure 23 is the photosensory assembly cut-away view of the 7th preferred embodiment according to the present invention.
Figure 24 is the photosensory assembly exploded view of the 7th preferred embodiment according to the present invention.
Figure 25 is the mould group photosensory assembly cut-away view of the 8th preferred embodiment according to the present invention.
Figure 26 is the camera module cut-away view of the 9th preferred embodiment according to the present invention.
Figure 27 is the camera module cross-sectional view of the according to the present invention ten preferred embodiment.
Figure 28 A and 28B are that the beneficial effect of the camera module of above preferred embodiment according to the present invention compares figure.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description Basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back Other technologies scheme from the spirit and scope of the present invention.
It will be understood by those skilled in the art that in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper", The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without referring to Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore above-mentioned art Language is not considered as limiting the invention.
Referring to Fig. 2 to Fig. 7, the photosensory assembly and camera module of first preferred embodiment according to the present invention are illustrated. The photosensory assembly 10 is for camera module described in assembly.The photosensory assembly 10 includes an encapsulation part 11 and a photographic department 12, be connected to the photographic department 12 to 11 integral packaging of encapsulation part, molding be connected to as described in photographic department 12.
The photographic department 12 includes a wiring board main body 122 and a sensitive chip 121, and the sensitive chip 121 is set In in the wiring board main body 122.This embodiment according to the invention is connected to the molding of sensitive chip 121 described Wiring board main body 122.Particularly, the encapsulation part 11 (Molding on Chip, MOC) in a manner of being molded into chip molds In the photographic department 12.
This embodiment according to the present invention, the photographic department 12 include a connection line (not shown) and at least one electricity Circuit component 123.The connection line defaults in the wiring board main body 122, and the circuit element 123 is electrically connected to the connection Route and the sensitive chip 121, for the photosensitive course of work of the sensitive chip 121.The circuit element 123 protrudes Ground is set to the wiring board main body 122.The circuit element 123 can be, citing ground but be not limited to, resistance, capacitor, two poles Pipe, triode, potentiometer, relay or driver etc..
It is noted that the circuit element 123 is coated on inside it by the encapsulation part 11, so that the electricity Circuit component 123 will not be directly exposed in space, more specifically, be not exposed to the ring communicated with the sensitive chip 121 In border, so that the pollutants such as dust will not be infected on the circuit element 123 when being assembled into the camera module, it will not Influence the sensitive chip 121, different from traditional camera module circuit devcie exposure existing way, such as capacitance resistance ware, from And prevent dust, sundries from staying in 123 surface of circuit element by way of molding cladding, avoid pollution the photosensitive core Piece 121 and make camera module the bad phenomenons such as dirty stain occur.
It is noted that in this embodiment in accordance with the invention, protruding a wiring board with the circuit element 123 It is illustrated for main body 122, and in other embodiments of the invention, the circuit element 123 can be embedded in the line Road plate main body 123 is without protruding from the wiring board main body, and those skilled in the art is it should be understood that the circuit element 123 shape, type and setting position is not limitation of the invention.
The encapsulation part 11 forms a through-hole 1100, in order to provide photosensitive path for the sensitive chip 121.
This preferred embodiment according to the present invention, the photographic department 12 includes an at least connecting line 124, for being electrically connected The sensitive chip 121 and the wiring board main body 122.Further, each connecting line 124 may be implemented as, specifically But it is not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..Especially low, the connecting line 124 curvedly connects the sensitive chip 121 and the wiring board main body 122.
It is noted that each connecting line 124 is molded into inside the encapsulation part 11, so as to by described Encapsulation part 11 coats each connecting line 124, without being directly exposed to outside, thus assembling the camera module When so that the connecting line 124 not will receive it is any touch damage, while reducing environmental factor to a connecting line 124 Influence, such as temperature so that communication connection between the sensitive chip 121 and the wiring board main body 122 is stablized, this point It is totally different from the prior art.
Preferably, the bottom of the through-hole 1100 of the encapsulation part 11 is skewed in being gradually increased from the bottom to top, but This shape is simultaneously not understood to the limitation present invention.
It is noted that the encapsulation part 11 coats the circuit element 123 and the connecting line 124, there is protection The advantage of the circuit element 123 and the connecting line 124 and its camera module for more being had performance etc., but ability The technical staff in domain is it should be understood that the encapsulation part 11 is not limited to coat the circuit element 123 or the connecting line 124.That is, in other embodiments of the invention, the encapsulation part 11 can directly be molded into do not protrude it is described The wiring board main body 122 of circuit element 123 is also possible to be molded into the different positions such as 123 outside of circuit element, surrounding It sets.
Further, the sensitive chip 121 has a photosensitive area 1211 and a non-photo-sensing area 1212, the non-photo-sensing area 1212 are surrounded on 1211 periphery of photosensitive area.The photosensitive area 1211 is connected for carrying out photosensitization, the connecting line 124 In the non-photo-sensing area 1212.
This preferred embodiment according to the present invention, the encapsulation part 11 extend the described non-of the sensitive chip 121 Photosensitive area 1212, so that the lamination by way of molding of sensitive chip 121 is fixed on the wiring board main body 122.It is logical Such mode is crossed, the mode (Molding on Chip, MOC) for being such as molded into chip expands the inside of the encapsulation part 11 Mouldable range, so as to reduce the wiring board main body 122 and the encapsulation part 11 outside structural moiety, The length and width dimensions of the photosensory assembly 10 are further decreased, the length and width dimensions of the camera module by its assembling are reduced.
In this embodiment in accordance with the invention, the 11 protrusion ground of encapsulation part is around described in the sensitive chip 121 1211 outside of photosensitive area, particularly, the encapsulation part 11 is integrally closed connection, so that having good leakproofness, to work as When the photosensory assembly 10 be used to assemble the camera module, the sensitive chip 121 is sealed in inside, forms a closing Interior space.
Specifically, when manufacturing the photosensory assembly 10, a traditional wiring board can be chosen as the wiring board master A sensitive chip 121 is arranged in body 122 in the wiring board main body 122, and the sensitive chip 121 is passed through the company Wiring 124 is electrically connected, so after preliminary assembling the molding wiring board main body 122 and 121 component of sensitive chip on carry out Molding, for example the encapsulation part 11 or the wiring board master are formed with mould pressing process (Molding) common in semiconductor packages Body 122 can choose that with injection molding machine, SMT technique (Surface will be carried out by insert molding (Insert Molding) technique Mount Technology surface mount process) after wiring board carry out molding form the encapsulation part 11, the wiring board master Body 122 can choose for, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard are (without soft Plate) etc..The mode that the encapsulation part 11 is formed can choose as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..Institute The material that stating encapsulation part 11 can choose is, citing ground but is not limited to, and Shooting Technique can choose nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use Resin.It will be apparent to a skilled person that the aforementioned manufacture that can choose and the material that can choose, only make It is not limitation of the invention for the mode that can be implemented illustrated the present invention.
It is noted that the molded mode based on the photosensory assembly 10 of the invention, the photosensory assembly 10 are more suitable for layout operation, the manufacture of the primary photosensory assembly 10 for completing more amount, for example can achieve 90, and traditional Wiring board once can only at most produce 8.
Further, the encapsulation part 11 includes a cladding section 111 and an optical filter construction section 112, the optical filter installation It is integrally connected to 112 molding of section the cladding section 111, the molding of cladding section 111 is connected to the wiring board main body 122, For coating the circuit element 123 and the connecting line 124.The optical filter construction section 112 is used to install an optical filter 20, That is, when the photosensory assembly 10 be used to assemble the camera module, the optical filter 20 of the camera module It is installed in the optical filter construction section 112, so that the optical filter 20 is located on the photosensitive path of the sensitive chip 121, And it does not need to provide additional optical filter mounting bracket.That is, the encapsulation part 11 is here with the function of conventional stent Can, but the advantage based on moulding technology can make by the technology mode of mold at the top of the optical filter construction section 112 It is with good planarization, so that the optical filter 20 is entirely mounted, this point is also an advantage over traditional camera shooting Mould group.Particularly, the optical filter 20 is a cutoff filter IRCF.
Further, the optical filter construction section 112 has a mounting groove 1121, and the mounting groove 1211 is connected to described Through-hole 1100 provides sufficient installation space for the optical filter 20, so that the optical filter 20 will not protrude from the camera lens The top surface of construction section 112.That is, the mounting groove is arranged in 11 upper end of encapsulation part, so as to by the optical filtering Piece 20 is installed on wherein.
It is noted that in this embodiment in accordance with the invention, the mounting groove 1121 can be used for installing optical filter, And in other implementations of the invention, the mounting groove 1121 can be used to install the portions such as motor or the camera lens of the camera module Part, those skilled in the art is it should be understood that the purposes of the mounting groove is not limitation of the invention.
It is noted that the inner wall of the encapsulation part 11 can according to the shape of the connection and be arranged, for example set Be set to it is skewed, to make the sensitive chip 121 can receive more light while coating connecting line 124 Line.Those skilled in the art is it should be understood that the shape of the encapsulation part 11 is not limitation of the invention.
Referring to Fig. 2 to Fig. 7, the camera module of first preferred embodiment according to the present invention.The camera module can be with It is a fixed-focus mould group (Fix Focus Model, FFM).The camera module includes a photosensory assembly 10, an optical filtering Piece 20 and a camera lens 30.
The optical filter 20 is installed in the photosensory assembly 10, and the camera lens 30 is installed in the photosensory assembly 10 On.
More specifically, the optical filter 20 is installed in the optical filter of the encapsulation part 11 of the photosensory assembly 10 The mounting groove 1121 of construction section 112.The camera lens 30 is by by the encapsulation part 11 for being installed on the photosensory assembly 10 The top of the optical filter construction section 112.That is, the optical filter is installed in the mounting groove, 30 quilt of camera lens It is installed on 11 top of encapsulation part.
It's also worth mentioning that the camera lens 30 is installed in the filter of the encapsulation part 11 of the photosensory assembly 10 112 top of mating plate construction section, so that the encapsulation part 11 is equivalent to the function of the bracket in traditional camera module, it is the camera lens 30 provide support, fixed position, but assemble and be but different from tradition COB technical process.The branch of the camera module of traditional COB technique Frame is fixed on wiring board in a manner of pasting, and the encapsulation part 11 is fixed on the wiring board main body 122 by moulding technology, Do not need to paste fixation procedure, molding mode relative to paste it is fixed there is better connective stability and technical process can Control property, and do not need to reserve the glue space that AA is adjusted between the encapsulation part 11 and the wiring board main body 122, therefore subtract The reserved space of small traditional camera module AA adjustment, and under conditions of the structural strengths such as reaching, molding scheme of the invention In the thickness of the wiring board main body 122 can be smaller, when optical filter is directly affixed on molded side, rear lens focus can be more It is short, so that the thickness of camera module is reduced,；On the other hand, the encapsulation part 11 coats the circuit element 123 and described Connecting line 124 allows traditional cradling function and circuit element 123 and the connecting line 124 to be spatially overlapped and set It sets, does not need to reserve safe distance around circuit devcie as traditional camera module, so that described with cradling function The height of encapsulation part 11 can be set in lesser range, to further provide the sky that camera module thickness can reduce Between.In addition, the encapsulation part 11 replaces traditional bracket, bracket bring heeling error when pasting assembling is avoided, is reduced The cumulative limit of camera module assembling.And the encapsulation part 11 coats the connecting line 124, and the encapsulation part 11 extends to The non-photo-sensing area 1212 of the sensitive chip 121 allows the encapsulation part 11 to contract, to further decrease described The lateral length and width dimensions of camera module.
It is another camera shooting mould of first preferred embodiment according to the present invention referring to Fig. 2 to Fig. 5 and Fig. 8 and Fig. 9 Group, the camera module can be a dynamic burnt camera module (Automatic Focus Model, AFM).The camera module packet Include a photosensory assembly 10, an optical filter 20, a motor 40 and a camera lens 30.
The optical filter 20 is installed in the photosensory assembly 10, and the camera lens 30 is installed in the motor 40, described Motor 40 is installed on the molding circuit pack 10.
Further, the optical filter 20 is installed in the optical filter peace of the encapsulation part 11 of the photosensory assembly 10 Fill the mounting groove 1121 of section 112.The motor 40 is installed in the described of the encapsulation part 11 of the photosensory assembly 10 112 top of optical filter construction section.That is, the optical filter 20 is installed in the mounting groove of the encapsulation part 11, institute It states camera lens 30 and is installed in the motor 40, the motor 40 is installed in the top of the encapsulation part 11.
Particularly, when the pin is adhered to the circuit junction by way of conducting resinl attaching, it may not be necessary to weld Conducting wire is connect to connect the wiring board main body 122 of the horse 40 and the photographic department 12, to reduce the technique of motor welding Process.
It will be apparent to a skilled person that the structure and type of above-mentioned camera module are only as an example, to illustrate The mode that the camera module can be carried out not is limitation of the invention.
0 and Figure 11 referring to Fig.1, the camera module photosensory assembly and camera shooting mould of second preferred embodiment according to the present invention Group.The photosensory assembly 10A is for camera module described in assembly, to obtain the camera module of moulding type.It is described photosensitive Component 10A includes an encapsulation part 11A and a photographic department 12A, is connected to the photographic department 12A to the encapsulation part 11A molding.
The photographic department 12A includes an a wiring board main body 122A and sensitive chip 121A, the sensitive chip 121A quilt It is set on the wiring board main body 122A.This embodiment according to the invention, sensitive chip 121A molding ground connection In the route version main body.
This embodiment according to the present invention, the photographic department 12A include a connection line (not shown) and at least one Circuit element 123A.The connection line defaults in the wiring board main body 122A, and the circuit element 123A is electrically connected to institute Connection line and the sensitive chip 121A are stated, for the photosensitive course of work of the sensitive chip 121A.The circuit elements Part 123A is projectedly set to the wiring board main body 122A.The circuit element 123A can be, citing ground but be not limited to, electricity Resistance, capacitor, diode, triode, potentiometer, relay or driver etc..
It is noted that the circuit element 123A is coated on inside it by the encapsulation part 11A, so that described Circuit element 123A will not be directly exposed in space, more specifically, be not exposed to communicate with the sensitive chip 121A Environment in, so that the pollutants such as dust will not be infected on the circuit element 123A when being assembled into the camera module, It will not influence the sensitive chip 121A, different from the existing way of circuit element 123A exposure in traditional camera module, such as hinder Container piece avoids pollution to prevent dust, sundries from staying in the surface the circuit element 123A by way of molding cladding The sensitive chip 121A and make camera module the bad phenomenons such as dirty stain occur.
The encapsulation part 11A forms a through-hole 1100A, in order to provide photosensitive path for the sensitive chip 121A.
This preferred embodiment according to the present invention, the photographic department 12A includes an at least connecting line 124A, for being electrically connected Meet the sensitive chip 121A and the wiring board main body 122A.Further, each connecting line 124A may be implemented as, tool Body but be not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..Especially low, the connecting line 124A curvedly connects the sense The optical chip 121A and wiring board main body 122A.It is noted that each connecting line 124A is molded into the encapsulation Inside portion 11A, so as to coat each connecting line 124A by the encapsulation part 11A, without directly exposing In outside, thus when assembling the camera module so that the connecting line 124A not will receive it is any touch damage, subtract simultaneously Few influence of the environmental factor to a connecting line 124A, such as temperature, so that the sensitive chip 121A and the wiring board master Communication connection between body 122A is stablized, and this point is totally different from the prior art.
It is noted that the encapsulation part 11A coats the circuit element 123A and connecting line 124A, has and protect The advantage of the circuit element 123A and the connecting line 124A and its camera module for more being had performance etc. is protected, still Those skilled in the art is it should be understood that the encapsulation part 11A is not limited to coat the circuit element 123A or the company Wiring 124A.That is, in other embodiments of the invention, the encapsulation part 11A, which can be directly molded into, not to be protruded The circuit element 123A the wiring board main body 122A, be also possible to be molded on the outside of the circuit element 123A, week Enclose equal different locations.
Different from above preferred embodiment, the wiring board main body 122A has an inner groovy 1222A, described photosensitive Chip 121A is arranged in the inner groovy 1222A, so that the sensitive chip 121A and the wiring board main body The relative altitude of 122A reduces, to reduce when the encapsulation part 11A coats the sensitive chip 121A to the encapsulation part The requirement for height of 11A, to reduce the height of the camera module of the photosensory assembly 10A assembling.
Further, the sensitive chip 121A has an a photosensitive area 1211A and non-photo-sensing area 1212A, the non-photo-sensing Area 1212A is surrounded on the periphery photosensitive area 1211A.The photosensitive area 1211A is for carrying out photosensitization, the connecting line 124A is connected to the non-photo-sensing area 1212A.
This preferred embodiment according to the present invention, the encapsulation part 11A extend the described of the sensitive chip 121A Non-photo-sensing area 1212A, so that sensitive chip 121A lamination by way of molding is fixed on the wiring board main body 122A.In this way, the mode (Molding on chip, MOC) for being such as molded into chip expands the encapsulation part The inside mouldable range of 11A, so as to reduce the outside of the wiring board main body 122A and the encapsulation part 11A Structural moiety further decreases the length and width dimensions of the photosensory assembly 12A, reduces the length of the camera module by its assembling Wide size.
In this embodiment in accordance with the invention, institute of the encapsulation part 11A protrusion ground around the sensitive chip 121A It states on the outside of photosensitive area 1211A, particularly, the encapsulation part 11A is integrally closed connection, so that there is good leakproofness, from And when the photosensory assembly 10A be used to assemble the camera module, the sensitive chip 121A is sealed in inside, is formed One closes interior space.
Further, the encapsulation part 11A includes a cladding section 111A and an optical filter construction section 112A, the optical filter peace It is integrally connected to dress section 112A molding the cladding section 111A, the cladding section 111A molding is connected to the wiring board main body 122A, for coating the circuit element 123A and the connecting line 124A.The optical filter construction section 112A is for installing one Optical filter 20A, that is to say, that when the photosensory assembly 10A be used to assemble the camera module, the filter of the camera module Mating plate 20A is installed in the optical filter construction section 112A, so that the optical filter 20A is located at the sense of the sensitive chip 121A On light path, and do not need to provide additional optical filter 20A mounting bracket.That is, the encapsulation part 11A has here The function of conventional stent, but the advantage based on moulding technology, the top optical filter construction section 112A can be by mold Technology mode, make it have good planarization, so that the optical filter 20A is entirely mounted, this point is also Better than traditional camera module.
Further, the optical filter construction section 112A has a mounting groove 1121A, and the support slot is connected to described logical Hole 1100A provides sufficient installation space for the optical filter 20A, so that the optical filter 20A will not protrude from optical filter peace Fill the top surface of section 112A.That is, the mounting groove is arranged in the upper end the encapsulation part 11A, thus by the optical filter 20A Stable is installed on the encapsulation part 11A, and will not protrude from the top of the encapsulation part 11A.
It is noted that the inner wall of the molding can according to the shape of the connection and be arranged, for example be set as It is skewed, to make the sensitive chip 121A can receive more light while coating the connecting line 124A. Those skilled in the art is it should be understood that the shape of the encapsulation part 11A is not limitation of the invention.
1 and Figure 12 referring to Fig.1, the camera module of second preferred embodiment according to the present invention.The camera module can To be a fixed-focus mould group.The camera module includes a photosensory assembly 10A, an optical filter 20A and a camera lens 30A.
The optical filter 20A is installed in the photosensory assembly 10A, and the camera lens 30A is installed in the photosensory assembly On 10A.
More specifically, the optical filter 20A is installed in the filter of the encapsulation part 11A of the photosensory assembly 10A The mounting groove 1111A of mating plate construction section 111A.The camera lens 30A is by by the envelope for being installed on the photosensory assembly 10A The top of the optical filter construction section 111A of dress portion 11A.In other words, the optical filter 20A is installed in the encapsulation part The IR of 11A supports grain 1111A, the camera lens 30A to be installed in the top of the encapsulation part 11A.
In other embodiments of the invention, the photosensory assembly 10A can also be assembled as a dynamic burnt camera module.This The technical staff in field is not this hair it should be understood that the fixed-focus camera module only illustrates the present invention as an example Bright limitation.
2 and Figure 13 referring to Fig.1, the photosensory assembly and camera module of third preferred embodiment according to the present invention.It is described Photosensory assembly 10B is for camera module described in assembly, to obtain the camera module of moulding type.The photosensory assembly 10B Including an encapsulation part 11B and a photographic department 12B, the encapsulation part 11B molding it is connected to the photographic department 12B.
The photographic department 12B includes an a wiring board main body 122B and sensitive chip 121B, the sensitive chip 121B quilt It is set on the wiring board main body 122B.This embodiment according to the invention, sensitive chip 121B molding ground connection In the route version main body.
This embodiment according to the present invention, the photographic department 12B include a connection line (not shown) and at least one Circuit element 123B.The connection line defaults in the wiring board main body 122B, and the circuit element 123B is electrically connected to institute Connection line and the sensitive chip 121B are stated, for the photosensitive course of work of the sensitive chip 121B.The circuit elements Part 123B is projectedly set to the wiring board main body 122B.The circuit element 123B can be, citing ground but be not limited to, electricity Resistance, capacitor, diode, triode, potentiometer, relay or driver etc..
It is noted that the circuit element 123B is coated on inside it by the encapsulation part 11B, so that described Circuit element 123B will not be directly exposed in space, more specifically, be not exposed to communicate with the sensitive chip 121B Environment in, so that the pollutants such as dust will not be infected on the circuit element 123B when being assembled into the camera module, It will not influence the sensitive chip 121B, different from the existing way of circuit element 123B exposure in traditional camera module, such as hinder Container piece avoids pollution to prevent dust, sundries from staying in the surface the circuit element 123B by way of molding cladding The sensitive chip 121B and make camera module the bad phenomenons such as dirty stain occur.
The encapsulation part 11B forms a through-hole 1100B, in order to provide photosensitive path for the sensitive chip 121B.
This preferred embodiment according to the present invention, the photographic department 12B includes an at least connecting line 124B, for being electrically connected Meet the sensitive chip 121B and the wiring board main body 122B.Further, each connecting line 124B may be implemented as, tool Body but be not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..Especially low, the connecting line 124B curvedly connects the sense The optical chip 121B and wiring board main body 122B.
It is noted that each connecting line 124B is molded into inside the encapsulation part 11B, so as to by institute It states encapsulation part 11B to coat each connecting line 124B, without being directly exposed to outside, to assemble the camera shooting mould When group so that the connecting line 124B not will receive it is any touch damage, while reducing environmental factor to a connecting line The influence of 124B, such as temperature, so that the communication connection between the sensitive chip 121B and the wiring board main body 122B is stablized, This point is not to be provided in the prior art completely.
It is noted that the encapsulation part 11B coats the circuit element 123B and connecting line 124B, has and protect The advantage of the circuit element 123B and the connecting line 124B and its camera module for more being had performance etc. is protected, still Those skilled in the art is it should be understood that the encapsulation part 11B is not limited to coat the circuit element 123B or the company Wiring 124B.That is, in other embodiments of the invention, the encapsulation part 11B, which can be directly molded into, not to be protruded The circuit element 123B the wiring board main body 122B, be also possible to be molded on the outside of the circuit element 123B, week Enclose equal different locations.
Further, the sensitive chip 121B has an a photosensitive area 1211B and non-photo-sensing area 1212B, the non-photo-sensing Area 1212B is surrounded on the periphery photosensitive area 1211B.The photosensitive area 1211B is for carrying out photosensitization, the connecting line 124B is connected to the non-photo-sensing area 1212B.
This preferred embodiment according to the present invention, the encapsulation part 11B extend the described of the sensitive chip 121B Non-photo-sensing area 1212B, so that sensitive chip 121B lamination by way of molding is fixed on the wiring board main body 122B.In this way, the mode (Molding on Chip, MOC) for being such as molded into chip expands the encapsulation part The inside mouldable range of 11B, so as to reduce the outside of the wiring board main body 122B and the encapsulation part 11B Structural moiety further decreases the length and width dimensions of the molding photographic department 12B part, reduces the camera module assembled by it Length and width dimensions.
In this embodiment in accordance with the invention, institute of the encapsulation part 11B protrusion ground around the sensitive chip 121B It states on the outside of photosensitive area 1211B, particularly, the encapsulation part 11B is integrally closed connection, so that there is good leakproofness, from And when the photosensory assembly 10B be used to assemble the camera module, the sensitive chip 121B is sealed in inside, is formed One closes interior space.
Specifically, when manufacturing the photosensory assembly 10B, a traditional wiring board can be chosen as the wiring board master A sensitive chip 121B is arranged on the wiring board main body 122B, the sensitive chip 121B is passed through institute by body 122B State connecting line 124B electrical connection, and then the molding wiring board main body 122B and sensitive chip 121B component after preliminary assembling On molded, such as use injection molding machine, by insert molding (molding) technique will carry out SMT technique (Surface Mount Technology surface mount process) after wiring board carry out molding and form the encapsulation part 11B, or with normal in semiconductor packages Mould pressing process forms the encapsulation part 11B.The wiring board main body 122B can choose for, citing ground but be not limited to, it is soft Harden plywood, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..The mode that the encapsulation part 11B is formed can be selected Be selected as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that the encapsulation part 11B can choose is citing ground But it is not limited to, Shooting Technique can choose nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that aforementioned The manufacture that can choose and the material that can choose are illustrative only the mode that can be implemented of the invention, and It is not limitation of the invention.
Further, the encapsulation part 11B top end surface is smooth, is suitable for one optical filter 20B of installation, that is to say, that when described When photosensory assembly 10B be used to assemble the camera module, the optical filter 20B of the camera module is installed in the encapsulation part The top end surface of 11B so that the optical filter 20B is located on the photosensitive path of the sensitive chip 121B, and does not need to provide Additional optical filter 20B mounting bracket.That is, the encapsulation part 11B has the function of conventional stent here, but base 11B can make it have good planarization by the technology mode of mold at the top of the advantage of moulding technology, the mould, So that the optical filter 20B is entirely mounted, this point is also an advantage over traditional camera module.
Different from above preferred embodiment, in this embodiment in accordance with the invention, the photosensory assembly 10B's is described Photographic department 12B includes a reinforcing layer 125B, is connected to the reinforcing layer 125B lamination wiring board main body 122B bottom, with Convenient for reinforcing the structural strength of the wiring board main body 122B.That is, the encapsulation on the wiring board main body 122B Region bottom where the portion 11B and sensitive chip 121B mounts the reinforcing layer 125B, so that the wiring board Main body 122B reliablely and stablely supports the encapsulation part 11B and the sensitive chip 121B.
Further, the reinforcing layer 125B is a metal plate, and the metal plate is attached at the wiring board main body 122B's Bottom increases the structural strength of the wiring board main body 122B, on the other hand, increases the heat dissipation performance of the photosensory assembly 10B, The heat that the sensitive chip 121B that can effectively scatter and disappear is issued.
It is noted that the wiring board main body 122B can be using FPC (Flex Print Circuit, flexibility print Circuit board processed), and enhance the rigidity of the FPC by the reinforcing layer 125B, enables the FPC with excellent bending performance Meet the bearing requirements of the photosensory assembly 10B.That is, the selectable range of the wiring board main body 122B is wider It is general, such as PCB (Printed Circuit Board, rigid printed circuit boards), FPC, RF (Rigid Flex, soft or hard combination Plate).Increase the structural strength of the wiring board main body 122B by the reinforcing layer 125B and improves heat dissipation performance, so as to To reduce the thickness of the wiring board main body 122B, so that the height of the photosensory assembly 10B further decreases, and by its group The height for filling obtained camera module reduces.
It is noted that in this embodiment in accordance with the invention, the reinforcing layer 125 is plate-like to be overlapped in the route Plate main body 122B, and in other embodiments of the invention, the reinforcing layer 125B can extend to the package encapsulation part 11B Side wall, to enhance its anti-electromagnetic interference capability while enhancing the structural strength of the photosensory assembly 10B.
It is noted that the inner wall of the encapsulation part can according to the shape of the connection and be arranged, for example be arranged To be skewed, to make the sensitive chip 121B can receive more light while coating the connecting line 124B Line.Those skilled in the art is it should be understood that the shape of the encapsulation part 11B is not limitation of the invention.
2 and Figure 13 referring to Fig.1, the camera module of third preferred embodiment according to the present invention.The camera module can To be a fixed-focus mould group (Fix Focus Model, FFM).The camera module is including described in a photosensory assembly 10B, one An optical filter 20B and camera lens 30B.
The optical filter 20B is installed in the photosensory assembly 10B, and the camera lens 30B is installed in the photosensory assembly On 10B.
More specifically, the optical filter 20B is installed in the top the encapsulation part 11B of the photosensory assembly 10B.It is described Camera lens 30B is by the top by the encapsulation part 11B for being installed on the photosensory assembly 10B.Particularly, the optical filter 20B and The camera lens 30B can coordinate to configure according to specific needs in the specific installation site of the encapsulation part 11B.
It's also worth mentioning that the camera lens 30B is installed in the top of the encapsulation part 11B of the photosensory assembly 10B End provides support for the camera lens 30B, consolidates so that the encapsulation part 11B is equivalent to the function of the bracket in traditional camera module Positioning is set, but is assembled and be but different from tradition COB technical process.Side of the bracket of the camera module of traditional COB technique to paste Formula is fixed on wiring board, and the encapsulation part 11B is fixed on the wiring board main body 122B by moulding technology, does not need to paste Fixation procedure, controllability of the molding mode relative to stickup fixation with better connective stability and technical process, and The glue space of reserved AA adjustment is not needed between the encapsulation part 11B and the wiring board main body 122B, therefore reduces biography The reserved space adjusted as module A A is had under one's command, so that the thickness of camera module is reduced；On the other hand, the encapsulation part 11B The circuit element 123B and the connecting line 124B are coated, so that traditional cradling function and circuit element 123B and described Connecting line 124B can be overlapped spatially, not needed as traditional camera module, reserved around circuit devcie safety away from From so that the height of the encapsulation part 11B with cradling function can be set in lesser range, to further mention The space for having supplied camera module thickness can reduce.In addition, the encapsulation part 11B replaces traditional bracket, avoids bracket and exist Bring heeling error when pasting assembling reduces the cumulative limit of camera module assembling.And described in the encapsulation part 11B cladding Connecting line 124B, and the encapsulation part 11B extends to the non-photo-sensing area 1212B of the sensitive chip 121B, so that the encapsulation Portion 11B can be to contract, to further decrease the lateral length and width dimensions of the camera module.
Another camera module of 2 and Figure 14 referring to Fig.1, third preferred embodiment according to the present invention will be illustrated.Institute Stating camera module can be a dynamic burnt camera module.The camera module includes a photosensory assembly 10B, an optical filter 20B, a motor 40B and a camera lens 30B.
The optical filter 20B is installed in the photosensory assembly 10B, and the camera lens 30B is installed in the motor 40B, The motor 40B is installed on the molding circuit pack.
Further, the optical filter 20B is installed in the top of the encapsulation part 11B of the photosensory assembly 10B.Institute State the top that motor 40B is installed on the encapsulation part 11B of the photosensory assembly 10B.Particularly, the optical filter 20B and institute Stating motor 40B can coordinate to configure according to specific needs in the specific installation site of the encapsulation part 11B.
Particularly, the engraving route 114B is electrically connected the wiring board master of the motor 40B and the photographic department 12B Body 122B connects the wiring board main body of the horse 40B and the photographic department 12B so as to not need welding lead 122B reduces the technical process of motor welding.
It will be apparent to a skilled person that the structure and type of above-mentioned camera module are only as an example, to illustrate The mode that the camera module can be carried out not is limitation of the invention.
5 and Figure 17 referring to Fig.1, the photosensory assembly and camera module of the 4th preferred embodiment according to the present invention will be explained It releases.The photosensory assembly 10C is for camera module described in assembly, to obtain the camera module of moulding type.It is described photosensitive Component 10C includes an encapsulation part 11C and photographic department 12C, is connected to the photographic department 12C to the encapsulation part 11C molding.
The photographic department 12C includes an a wiring board main body 122C and sensitive chip 121C, the sensitive chip 121C quilt It is set on the wiring board main body 122C.This embodiment according to the invention, sensitive chip 121C molding ground connection In the route version main body.
This embodiment according to the present invention, the photographic department 12C include a connection line (not shown) and at least one Circuit element 123C.The connection line defaults in the wiring board main body 122C, and the circuit element 123C is electrically connected to institute Connection line and the sensitive chip 121C are stated, for the photosensitive course of work of the sensitive chip 121C.The circuit elements Part 123C is projectedly set to the wiring board main body 122C.The circuit element 123C can be, citing ground but be not limited to, electricity Resistance, capacitor, diode, triode, potentiometer, relay or driver etc..
It is noted that the circuit element 123C is coated on inside it by the encapsulation part 11C, so that described Circuit element 123C will not be directly exposed in space, more specifically, be not exposed to communicate with the sensitive chip 121C Environment in, so that the pollutants such as dust will not be infected on the circuit element 123C when being assembled into the camera module, It will not influence the sensitive chip 121C, different from the existing way of circuit element 123C exposure in traditional camera module, such as hinder Container piece avoids pollution to prevent dust, sundries from staying in the surface the circuit element 123C by way of molding cladding The sensitive chip 121C and make camera module the bad phenomenons such as dirty stain occur.
The encapsulation part 11C forms a through-hole 1100C, in order to provide photosensitive path for the sensitive chip 121C.
This preferred embodiment according to the present invention, the photographic department 12C includes an at least connecting line 124C, for being electrically connected Meet the sensitive chip 121C and the wiring board main body 122C.Further, each connecting line 124C may be implemented as, tool Body but be not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..Especially low, the connecting line 124C curvedly connects the sense The optical chip 121C and wiring board main body 122C.
It is noted that each connecting line 124C is molded into inside the encapsulation part 11C, so as to by institute It states encapsulation part 11C to coat each connecting line 124C, without being directly exposed to outside, to assemble the camera shooting mould When group so that the connecting line 124C not will receive it is any touch damage, while reducing environmental factor to a connecting line The influence of 124C, such as temperature, so that the communication connection between the sensitive chip 121C and the wiring board main body 122C is stablized, This point is not to be provided in the prior art completely.
It is noted that the encapsulation part 11C coats the circuit element 123C and connecting line 124C, has and protect The advantage of the circuit element 123C and the connecting line 124C and its camera module for more being had performance etc. is protected, still Those skilled in the art is it should be understood that the encapsulation part 11C is not limited to coat the circuit element 123C or the company Wiring 124C.That is, in other embodiments of the invention, the encapsulation part 11C, which can be directly molded into, not to be protruded The circuit element 123C the wiring board main body 122C, be also possible to be molded on the outside of the circuit element 123C, week Enclose equal different locations.
Further, the sensitive chip 121C has an a photosensitive area 1211C and non-photo-sensing area 1212C, the non-photo-sensing Area 1212C is surrounded on the periphery photosensitive area 1211C.The photosensitive area 1211C is for carrying out photosensitization, the connecting line 124C is connected to the non-photo-sensing area 1212C.
This preferred embodiment according to the present invention, the encapsulation part 11C extend the described of the sensitive chip 121C Non-photo-sensing area 1212C, so that sensitive chip 121C lamination by way of molding is fixed on the wiring board main body 122C.In this way, the mode (Molding on the chip) for being such as molded into chip expands the encapsulation part The inside mouldable range of 11C, so as to reduce the outside of the wiring board main body 122C and the encapsulation part 11C Structural moiety further decreases the length and width dimensions of the photosensory assembly, reduces the length and width of the camera module by its assembling Size.
In this embodiment in accordance with the invention, institute of the encapsulation part 11C protrusion ground around the sensitive chip 121C It states on the outside of photosensitive area 1211C, particularly, the encapsulation part 11C is integrally closed connection, so that there is good leakproofness, from And when the photosensory assembly 10C be used to assemble the camera module, the sensitive chip 121C is sealed in inside, is formed One closes interior space.
Specifically, when manufacturing the photosensory assembly 10C, a traditional wiring board can be chosen as the wiring board master A sensitive chip 121C is arranged on the wiring board main body 122C, the sensitive chip 121C is passed through institute by body 122C State connecting line 124C electrical connection, and then the molding wiring board main body 122C and sensitive chip 121C component after preliminary assembling On molded, such as use injection molding machine, by insert molding (molding) technique will carry out SMT technique (Surface Mount Technology surface mount process) after wiring board carry out molding and form the encapsulation part 11C, or with normal in semiconductor packages Mould pressing process forms the encapsulation part 11C.The wiring board main body 122C can choose for, citing ground but be not limited to, it is soft Harden plywood, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..The mode that the encapsulation part 11C is formed can be selected Be selected as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that the encapsulation part 11C can choose is citing ground But it is not limited to, Shooting Technique can choose nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that aforementioned The manufacture that can choose and the material that can choose are illustrative only the mode that can be implemented of the invention, and It is not limitation of the invention.
The photosensory assembly 10C further comprises an optical filter 20C, and optical filter 20C molding ground lamination is set to institute It states on sensitive chip 121C.The edge of the optical filter 20C is molded into the encapsulation part 11C, thus the fixed optical filter 20C.It is noted that the optical filter 20C is covered in above the sensitive chip 121C, by the sensitive chip 121C with External environment isolation, protects the sensitive chip 121C to be damaged and prevent the entrance of dust.
When manufacturing the photosensory assembly 10C, the sensitive chip 121C is first attached at the wiring board main body 122C, And it is connected to the sensitive chip 121C and the wiring board main body 122C by described, and then the optical filter 20C is attached at On the sensitive chip 121C, further, by the wiring board main body 122C and sensitive chip 121C and the optical filter 20C is molded, and the encapsulation part 11C is formed.In molding, since the optical filter 20C is covered in the sensitive chip On 121C, therefore injury of the mold for the sensitive chip 121C of molding can be prevented, and due to the optical filter 20C with The distance of the sensitive chip 121C reduces, therefore can be reduced by the back focal length of the camera module of its assembling, to subtract The height of the small camera module, on the other hand, due to not needing to provide additional support member for the optical filter 20C, because This is also further reduced the thickness of the camera module.
It is noted that the inner wall of the encapsulation part 10C can according to the shape of the connection and be arranged, for example set Be set to it is skewed, thus the mostly light such as can receive the sensitive chip 121C while coating the connecting line 124C Line.Those skilled in the art is it should be understood that the shape of the encapsulation part 11C is not limitation of the invention.
Referring to Fig.1 5 to Figure 17, the camera module of the 4th preferred embodiment according to the present invention.The camera module can To be a fixed-focus mould group.The camera module includes an a photosensory assembly 10C and camera lens 30C.The camera lens 30C is mounted In on the photosensory assembly 10C, assembling forms the camera module.
Particularly, the camera lens 30C can be fixed on the encapsulation part of the photosensory assembly 10C by way of bonding The top of 11C, and the characteristics of manufactured by mold in moulding technology so that the top of the encapsulation part 11C have it is preferable flat Whole property provides good mounting condition for the camera lens 30C, to obtain good camera module.
It is noted that the camera lens 30C is installed in the top of the encapsulation part 11C of the photosensory assembly 10C, To which the encapsulation part 11C is equivalent to the function of the bracket in traditional camera module, support, fixation are provided for the camera lens 30C Position, but assemble and be but different from tradition COB technical process.The bracket of the camera module of traditional COB technique is in a manner of pasting It is fixed on wiring board, and the encapsulation part 11C is fixed on the wiring board main body 122C by moulding technology, does not need to paste solid Determine process, molding mode fixes the controllability with better connective stability and technical process relative to stickup, and in institute The glue space for not needing reserved AA adjustment between encapsulation part 11C and the wiring board main body 122C is stated, therefore reduces tradition The reserved space of camera module AA adjustment, so that the thickness of camera module is reduced；On the other hand, the encapsulation part 11C packet The circuit element 123C and the connecting line 124C are covered, so that traditional cradling function and circuit element 123C and the company Wiring 124C can be overlapped spatially, not need to reserve safe distance around circuit devcie as traditional camera module, So that the height of the encapsulation part 11C with cradling function can be set in lesser range, to further provide for The space that camera module thickness can reduce.In addition, the encapsulation part 11C replaces traditional bracket, bracket is avoided viscous Bring heeling error when patch assembling, reduces the cumulative limit of camera module assembling.And the encapsulation part 11C coats the company Wiring 124C, and the encapsulation part 11C extends to the non-photo-sensing area 1212C of the sensitive chip 121C, so that the encapsulation part 11C can be to contract, to further decrease the lateral length and width dimensions of the camera module.Moreover, the photosensory assembly 10C molds the optical filter 20C inside it, therefore when assembling the camera module, does not need to carry out optical filter again Installation process is pasted, to reduce camera module packaging technology process, improves working efficiency, these are all an advantage over the prior art 's.
5, Figure 16 and Figure 18 referring to Fig.1 are that another camera module of the 4th preferred embodiment according to the present invention will be by It illustrates.The camera module can be a dynamic burnt camera module (Automatic Focus Model, AFM).The camera module Including a photosensory assembly 10C, a motor 40C and a camera lens 30C.
The camera lens 30C is installed in the motor 40C, and the motor 40C is installed on the photosensory assembly 10C, In order to adjust the camera module focal length by the motor 40C.The motor 40C is installed on the photosensory assembly 10C's The top of the encapsulation part 11C.
Particularly, the engraving route 114C is electrically connected the wiring board master of the motor 40C and the photographic department 12C Body 122C connects the wiring board main body of the motor 40C and the photographic department 12C so as to not need welding lead 122C reduces the technical process of motor welding.
It will be apparent to a skilled person that the structure and type of above-mentioned camera module are only as an example, to illustrate The mode that the camera module can be carried out not is limitation of the invention.
Referring to Fig.1 9 and 20, the photosensory assembly and camera module of the 5th preferred embodiment according to the present invention will be explained It releases.The photosensory assembly 10D is for camera module described in assembly, to obtain the camera module of moulding type.It is described Photosensory assembly 10D includes an encapsulation part 11D and a photographic department 12D, is connected to the photographic department to the encapsulation part 11D molding 12D。
Particularly, the encapsulation part is molded into the photographic department 12D in a manner of MOC.
The photographic department 12D includes an a wiring board main body 122D and sensitive chip 121D, the sensitive chip 121D quilt It is set on the wiring board main body 122D.This embodiment according to the invention, sensitive chip 121D molding ground connection In the wiring board main body 122D.
This embodiment according to the present invention, the photographic department 12D include a connection line (not shown) and at least one Circuit element 123D.The connection line defaults in the wiring board main body 122D, and the circuit element 123D is electrically connected to institute Connection line and the sensitive chip 121D are stated, for the photosensitive course of work of the sensitive chip 121D.The circuit elements Part 123D is projectedly set to the wiring board main body 122D.The circuit element 123D can be, citing ground but be not limited to, electricity Resistance, capacitor, diode, triode, potentiometer, relay or driver etc..It is noted that the encapsulation part 11D is by institute It states circuit element 123D to be coated on inside it, so that the circuit element 123D will not be directly exposed in space, more It says to body, is not exposed in the environment communicated with the sensitive chip 121D, thus when being assembled into the camera module, institute The pollutants such as dust will not be infected with by stating on circuit element 123D, will not be influenced the sensitive chip 121D, be taken the photograph different from tradition As in mould group circuit element 123D exposure existing way, such as capacitance resistance ware, thus molding cladding by way of prevent dust, Sundries stays in the surface the circuit element 123D, avoids pollution the sensitive chip 121D and makes camera module appearance dirty black The bad phenomenons such as point.
The encapsulation part 11D forms a through-hole 1100D, in order to provide photosensitive path for the sensitive chip 121D.
This preferred embodiment according to the present invention, the photographic department 12D includes an at least connecting line 124D, for being electrically connected Meet the sensitive chip 121D and the wiring board main body 122D.Further, each connecting line 124D may be implemented as, tool Body but be not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..Especially low, the connecting line 124D curvedly connects the sense The optical chip 121D and wiring board main body 122D.
It is noted that each connecting line 124D is molded into inside the encapsulation part 11D, so as to by institute It states encapsulation part 11D to coat each connecting line 124D, without being directly exposed to outside, to assemble the camera shooting mould When group so that the connecting line 124D not will receive it is any touch damage, while reducing environmental factor to a connecting line The influence of 124D, such as temperature, so that the communication connection between the sensitive chip 121D and the wiring board main body 122D is stablized, This point is not to be provided in the prior art completely.
It is noted that the encapsulation part 11D coats the circuit element 123D and connecting line 124D, has and protect The advantage of the circuit element 123D and the connecting line 124D and its camera module for more being had performance etc. is protected, still Those skilled in the art is it should be understood that the encapsulation part 11D is not limited to coat the circuit element 123D or the company Wiring 124D.That is, in other embodiments of the invention, the encapsulation part 11D, which can be directly molded into, not to be protruded The circuit element 123D the wiring board main body 122D, be also possible to be molded on the outside of the circuit element 123D, week Enclose equal different locations.
The photosensory assembly 10D further comprises an optical filter 20D, and optical filter 20D molding ground lamination is set to institute It states on sensitive chip 121D.The edge of the optical filter 20D is molded into the encapsulation part 11D, thus the fixed optical filter 20D.It is noted that the optical filter 20D is covered in above the sensitive chip 121D, by the sensitive chip 121D with External environment isolation, protects the sensitive chip 121D to be damaged and prevent the entrance of dust.
Further, the sensitive chip 121D has an a photosensitive area 1211D and non-photo-sensing area 1212D, the non-photo-sensing Area 1212D is surrounded on the periphery photosensitive area 1211D.The photosensitive area 1211D is for carrying out photosensitization, the connecting line 124D is connected to the non-photo-sensing area 1212D.
This preferred embodiment according to the present invention, the encapsulation part 11D extend the described of the sensitive chip 121D Non-photo-sensing area 1212D, so that sensitive chip 121D lamination by way of molding is fixed on the wiring board main body 122D.In this way, the mode (Molding on the Chip, MOC) for being such as molded into chip expands the encapsulation The inside mouldable range of portion 11D, so as to reduce the outside of the wiring board main body 122D and the encapsulation part 11D Structural moiety, further decrease it is described molding photographic department 12D part length and width dimensions, reduce by its assemble the camera shooting The length and width dimensions of mould group.
In this embodiment in accordance with the invention, institute of the encapsulation part 11D protrusion ground around the sensitive chip 121D It states on the outside of photosensitive area 1211D, particularly, the encapsulation part 11D is integrally closed connection, so that there is good leakproofness, from And when the photosensory assembly 10D be used to assemble the camera module, the sensitive chip 121D is sealed in inside, is formed One closes interior space.
Specifically, when manufacturing the photosensory assembly 10D, a traditional wiring board can be chosen as the wiring board master A sensitive chip 121D is arranged on the wiring board main body 122D, the sensitive chip 121D is passed through institute by body 122D State connecting line 124D electrical connection, and then the molding wiring board main body 122D and sensitive chip 121D component after preliminary assembling On molded, such as use injection molding machine, by insert molding (molding) technique will carry out SMT technique (Surface Mount Technology surface mount process) after wiring board carry out molding and form the encapsulation part 11D, or with normal in semiconductor packages Mould pressing process forms the encapsulation part 11D.The wiring board main body 122D can choose for, citing ground but be not limited to, it is soft Harden plywood, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..The mode that the encapsulation part 11D is formed can be selected Be selected as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that the encapsulation part 11D can choose is citing ground But it is not limited to, Shooting Technique can choose nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that aforementioned The manufacture that can choose and the material that can choose are illustrative only the mode that can be implemented of the invention, and It is not limitation of the invention.
Further, the encapsulation part 11D includes a cladding section 111D, an optical filter construction section 112D and a camera lens construction section Successively integrally molding is connected to the cladding section by 113D, the optical filter construction section 112D and the camera lens construction section 113D 111D, the cladding section 111D molding is connected to the wiring board main body 122D, for coating the circuit element 123D and institute State connecting line 124D.The camera lens construction section 113D is for installing a camera lens 30D, that is to say, that when the photosensory assembly 10D quilt When for assembling the camera module, the camera lens 30D is installed in the camera lens construction section 113D of the encapsulation part 11D Side, in order to provide stable installation site for the camera lens 30D.The camera lens construction section 113D has a camera lens mounting groove 1131D, the camera lens mounting groove 1131D are connected to the through-hole 1100D, and sufficient installation space is provided for the camera lens 30D. That is, the encapsulation part 11D has a camera lens mounting groove 1131D of mounting groove 1121D and one, the optical filter 20D is installed in the mounting groove 1121D, and the camera lens 30D is installed in the camera lens mounting groove 1131D.
The camera lens construction section 113D is integrally upwardly extended, and internal formation step-like structure, is mentioned for the camera lens 30D For supporting fixed position, the camera lens 30D is installed without providing additional component.In other words, the encapsulation part 11D is integrally upwardly extended, and internal formation is step-like, to be respectively coated by the circuit element and the connecting line and support The camera lens.
It is in closed annular that the camera lens construction section 113D, which has camera lens inner wall a 1132D, the camera lens inner wall 1132D, is fitted In providing installation space for the camera lens 30D.It is noted that the camera lens inner wall of the camera lens construction section 113D 1132D surfacing forms fixed-focus mould group to be suitable for installing the non-threaded camera lens 30D.Particularly, the camera lens 30D The camera lens construction section 113D can be fixed on by way of bonding.
It is noted that the inner wall of the cladding section 111D of the encapsulation part 11D can be according to the shape of the connection Shape and be arranged, for example be set as skewed, to make the sensitive chip while coating the connecting line 124D 121D can receive more light.Those skilled in the art is not it should be understood that the shape of the encapsulation part 11D is Limitation of the invention.
Referring to Figure 20, the camera module of the 5th preferred embodiment according to the present invention.The camera module can be one Fixed-focus mould group.The camera module includes a camera lens 30D of photosensory assembly 10D and one.
More specifically, the camera lens 30D is installed in the camera lens of the encapsulation part 11D of the photosensory assembly 10D The camera lens mounting groove 1131D of construction section 113D.The optical filter 20D is molded into the photosensory assembly 11D, therefore is not required to Additional optical filter is provided, is not also needed when assembling camera shooting molding, therefore separately installed optical filter reduces assembling Process, and mold optical filter mode the back focal length of the camera module can reduce.
It's also worth mentioning that the camera lens 30D is installed in the institute of the encapsulation part 11D of the photosensory assembly 10D Camera lens construction section 113D is stated, so that the encapsulation part 11D is equivalent to the function of bracket or lens barrel in traditional camera module, for institute It states camera lens 30D and support, fixed position is provided, but assemble and be but different from tradition COB technical process.The camera shooting of traditional COB technique The bracket of mould group is fixed on wiring board in a manner of pasting, and the encapsulation part 11D is fixed on the route by moulding technology Plate main body 122D, does not need to paste fixation procedure, molding mode relative to paste it is fixed have better connective stability and The controllability of technical process, and reserved AA adjustment is not needed between the encapsulation part 11D and the wiring board main body 122D Glue space, therefore the reserved space of traditional camera module AA adjustment is reduced, so that the thickness of camera module is reduced, and And the encapsulation part 11D of molding mode according to the present invention has preferable flatness, therefore is assembling the camera module When, it can be adjusted without AA；On the other hand, the encapsulation part 11D coats the circuit element 123D and the connecting line 124D overlaps traditional cradling function and circuit element 123D and the connecting line 124D spatially, It does not need to reserve safe distance around circuit devcie as traditional camera module, so that the envelope with cradling function The height of dress portion 11D can be set in lesser range, to further provide the space that camera module thickness can reduce. In addition, the encapsulation part 11D replaces traditional bracket, and installation site is provided for the camera lens 30D, avoids bracket and pasting Bring heeling error when assembling reduces the cumulative limit of camera module assembling.And the encapsulation part 11D coats the connection Line 124D, and the encapsulation part 11D extends to the non-photo-sensing area 1212D of the sensitive chip 121D, so that the encapsulation part 11D It can be to contract, to further decrease the lateral length and width dimensions of the camera module.
Referring to Figure 21 and Figure 22, the photosensory assembly and camera module of the 6th preferred embodiment will be explained according to the present invention It releases.The photosensory assembly 10E is for camera module described in assembly, to obtain the camera module of moulding type.It is described Photosensory assembly 10E includes an encapsulation part 11E and photographic department 12E, is connected to the photographic department 12E to the encapsulation part 11E molding.
The photographic department 12E includes an a wiring board main body 122E and sensitive chip 121E, the sensitive chip 121E quilt It is set on the wiring board main body 122E.This embodiment according to the invention, sensitive chip 121E molding ground connection In the route version main body.
This embodiment according to the present invention, the photographic department 12E include a connection line (not shown) and at least one Circuit element 123E.The connection line defaults in the wiring board main body 122E, and the circuit element 123E is electrically connected to institute Connection line and the sensitive chip 121E are stated, for the photosensitive course of work of the sensitive chip 121E.The circuit elements Part 123E is projectedly set to the wiring board main body 122E.The circuit element 123E can be, citing ground but be not limited to, electricity Resistance, capacitor, diode, triode, potentiometer, relay or driver etc..
It is noted that the circuit element 123E is coated on inside it by the encapsulation part 11E, so that described Circuit element 123E will not be directly exposed in space, more specifically, be not exposed to communicate with the sensitive chip 121E Environment in, so that the pollutants such as dust will not be infected on the circuit element 123E when being assembled into the camera module, It will not influence the sensitive chip 121E, different from the existing way of circuit element 123E exposure in traditional camera module, such as hinder Container piece avoids pollution to prevent dust, sundries from staying in the surface the circuit element 123E by way of molding cladding The sensitive chip 121E and make camera module the bad phenomenons such as dirty stain occur.
The encapsulation part 11E forms a through-hole 1100E, in order to provide photosensitive path for the sensitive chip 121E.
This preferred embodiment according to the present invention, the photographic department 12E includes an at least connecting line 124E, for being electrically connected Meet the sensitive chip 121E and the wiring board main body 122E.Further, each connecting line 124E may be implemented as, tool Body but be not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..Especially low, the connecting line 124E curvedly connects the sense The optical chip 121E and wiring board main body 122E.
It is noted that each connecting line 124E is molded into inside the encapsulation part 11E, so as to by institute It states encapsulation part 11E to coat each connecting line 124E, without being directly exposed to outside, to assemble the camera shooting mould When group so that the connecting line 124E not will receive it is any touch damage, while reducing environmental factor to a connecting line The influence of 124E, such as temperature, so that the communication connection between the sensitive chip 121E and the wiring board main body 122E is stablized, This point is not to be provided in the prior art completely.
It is noted that the encapsulation part 11E coats the circuit element 123E and connecting line 124E, has and protect The advantage of the circuit element 123E and the connecting line 124E and its camera module for more being had performance etc. is protected, still Those skilled in the art is it should be understood that the encapsulation part 11E is not limited to coat the circuit element 123E or the company Wiring 124E.That is, in other embodiments of the invention, the encapsulation part 11E, which can be directly molded into, not to be protruded The circuit element 123E the wiring board main body 122E, be also possible to be molded on the outside of the circuit element 123E, week Enclose equal different locations.
The photosensory assembly 10E further comprises an optical filter 20E, and optical filter 20E molding ground lamination is set to institute It states on sensitive chip 121E.The edge of the optical filter 20E is molded into the encapsulation part 11E, thus the fixed optical filter 20E.It is noted that the optical filter 20E is covered in above the sensitive chip 121E, by the sensitive chip 121E with External environment isolation, protects the sensitive chip 121E to be damaged and prevent the entrance of dust.
Further, the sensitive chip 121E has an a photosensitive area 1211E and non-photo-sensing area 1212E, the non-photo-sensing Area 1212E is surrounded on the periphery photosensitive area 1211E.The photosensitive area 1211E is for carrying out photosensitization, the connecting line 124E is connected to the non-photo-sensing area 1212E.
This preferred embodiment according to the present invention, the encapsulation part 11E extend the described of the sensitive chip 121E Non-photo-sensing area 1212E, so that sensitive chip 121E lamination by way of molding is fixed on the wiring board main body 122E.In this way, as being molded into the mode (Molding on chip) of chip expands the encapsulation part 11E Inside mouldable range, so as to reduce the wiring board main body 122E and the encapsulation part 11E outside structure Property part, further decrease it is described molding photographic department 12E length and width dimensions, reduce by its assembling the camera module length and width Size.
In this embodiment in accordance with the invention, institute of the encapsulation part 11E protrusion ground around the sensitive chip 121E It states on the outside of photosensitive area 1211E, particularly, the encapsulation part 11E is integrally closed connection, so that there is good leakproofness, from And when the photosensory assembly 10E be used to assemble the camera module, the sensitive chip 121E is sealed in inside, is formed One closes interior space.
Specifically, when manufacturing the photosensory assembly 10E, a traditional wiring board can be chosen as the wiring board master A sensitive chip 121E is arranged on the wiring board main body 122E, the sensitive chip 121E is passed through institute by body 122E State connecting line 124E electrical connection, and then the molding wiring board main body 122E and sensitive chip 121E component after preliminary assembling On molded, such as use injection molding machine, by insert molding (molding) technique will carry out SMT technique (Surface Mount Technology surface mount process) after wiring board carry out molding and form the encapsulation part 11E, or with normal in semiconductor packages Mould pressing process forms the encapsulation part 11E.The wiring board main body 122E can choose for, citing ground but be not limited to, it is soft Harden plywood, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..The mode that the encapsulation part 11E is formed can be selected Be selected as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that the encapsulation part 11E can choose is citing ground But it is not limited to, Shooting Technique can choose nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that aforementioned The manufacture that can choose and the material that can choose are illustrative only the mode that can be implemented of the invention, and It is not limitation of the invention.
Further, the encapsulation part 11E includes an a cladding section 111E and camera lens construction section 113E, the camera lens construction section 113E, which is integrally molded, is connected to the cladding section 111E, and the cladding section 111E molding is connected to the wiring board main body 122E, for coating the circuit element 123E and the connecting line 124E.The camera lens construction section 113E is for installing a mirror Head 30E, that is to say, that when the photosensory assembly 10E be used to assemble the camera module, the camera lens 30E is installed in On the inside of the camera lens construction section 113E of the encapsulation part 11E, in order to provide stable installation site for the camera lens 30E.
Further, the camera lens construction section 113E has camera lens mounting groove a 1131E, the camera lens mounting groove 1131E It is connected to the through-hole 1100E, sufficient installation space is provided for the camera lens 30E.That is, the encapsulation part 11E tool There are a camera lens mounting groove 1131E, the camera lens 30E to be installed in the camera lens mounting groove 1131E.
The camera lens construction section 113E is integrally upwardly extended along the covering portion 111E, and the internal step-like knot of formation Structure provides support fixed position, installs the camera lens 30E without providing additional component for the camera lens 30E.It changes Sentence is talked about, and the encapsulation part 11E is integrally upwardly extended, and it is internal formed it is step-like, be respectively coated by the circuit element and The connecting line 124E, and support the camera lens 30E.
It is in closed annular that the camera lens construction section 113E, which has camera lens inner wall a 1132E, the camera lens inner wall 1132E, is fitted Installation space is provided in camera lens 30E.It is noted that the surface camera lens inner wall 1132E of the camera lens construction section 113E With helicitic texture, to be suitable for installing the threaded camera lens 30E, fixed-focus mould group is formed.Particularly, the camera lens 30E The camera lens construction section 113E can be fixed on by way of being spirally connected.
It is noted that the inner wall of the cladding section 111E of the molding can according to the shape of the connection and Setting, for example is set as skewed, to make the sensitive chip 121E can be with while coating the connecting line 124E More light such as receive.Those skilled in the art is it should be understood that the shape of the encapsulation part 11E is not of the invention Limitation.
Referring to Figure 22, the camera module of the 6th preferred embodiment according to the present invention.The camera module can be one Fixed-focus mould group.The camera module includes a camera lens 30E of photosensory assembly 10E and one.
More specifically, the camera lens 30E is installed in the camera lens of the encapsulation part 11E of the photosensory assembly 10E The camera lens mounting groove 1131E of construction section 113E.The optical filter 20E is molded into the photosensory assembly 11E, therefore is not required to Additional optical filter is provided, is not also needed when assembling camera shooting molding, separately installed optical filter, therefore, described in reduction The assembling process of camera module, and the mode for molding optical filter can reduce the back focal length of the camera module.
It's also worth mentioning that the camera lens 30E is installed in the institute of the encapsulation part 11E of the photosensory assembly 10E Camera lens construction section 113E is stated, so that the encapsulation part 11E is equivalent to the function of bracket or lens barrel in traditional camera module, for institute It states camera lens 30E and support, fixed position is provided, but assemble and be but different from tradition COB technical process.The camera shooting of traditional COB technique The bracket of mould group is fixed on wiring board in a manner of pasting, and the encapsulation part 11E is fixed on the route by moulding technology Plate main body 122E, does not need to paste fixation procedure, molding mode relative to paste it is fixed have better connective stability and The controllability of technical process, and reserved AA adjustment is not needed between the encapsulation part 11E and the wiring board main body 122E Glue space, therefore the reserved space of traditional camera module AA adjustment is reduced, so that the thickness of camera module is reduced；Separately On the one hand, the encapsulation part 11E coats the circuit element 123E and connecting line 124E so that traditional cradling function and Circuit element 123E and the connecting line 124E can be overlapped spatially, not needed as traditional camera module, in electricity Around the device of road reserve safe distance so that with cradling function the encapsulation part 11E height can be set compared with Small range, to further provide the space that camera module thickness can reduce.In addition, the encapsulation part 11E replaces passing The bracket of system, and installation site is provided for the camera lens 30E, bracket bring heeling error when pasting assembling is avoided, is subtracted The cumulative limit of small camera module assembling.And the encapsulation part 11E coats the connecting line 124E, and the encapsulation part 11E The non-photo-sensing area 1212E for extending to the sensitive chip 121E, allows the encapsulation part 11E to contract, thus into one Step reduces the lateral length and width dimensions of the camera module.
Referring to Figure 23 and Figure 24, the photosensory assembly and camera module of the 7th preferred embodiment according to the present invention will be explained It releases.The photosensory assembly 10F is for camera module described in assembly, to obtain the camera module of moulding type.It is described Photosensory assembly 10F includes an encapsulation part 11F and a photographic department 12F, is connected to the photographic department to the encapsulation part 11F molding 12F。
The photographic department 12F includes an a wiring board main body 122F and sensitive chip 121F, the sensitive chip 121F quilt It is set on the wiring board main body 122F.This embodiment according to the invention, sensitive chip 121F molding ground connection In the route main body 122F.
This embodiment according to the present invention, the photographic department 12F include a connection line (not shown) and at least one Circuit element 123F.The connection line defaults in the wiring board main body 122F, and the circuit element 123F is electrically connected to institute Connection line and the sensitive chip 121F are stated, for the photosensitive course of work of the sensitive chip 121F.The circuit elements Part 123F is projectedly set to the wiring board main body 122F.The circuit element 123F can be, citing ground but be not limited to, electricity Resistance, capacitor, diode, triode, potentiometer, relay or driver etc..
It is noted that the circuit element 123F is coated on inside it by the encapsulation part 11F, so that described Circuit element 123F will not be directly exposed in space, more specifically, be not exposed to communicate with the sensitive chip 121F Environment in, so that the pollutants such as dust will not be infected on the circuit element 123F when being assembled into the camera module, It will not influence the sensitive chip 121F, different from the existing way of circuit element 123F exposure in traditional camera module, such as hinder Container piece avoids pollution to prevent dust, sundries from staying in the surface the circuit element 123F by way of molding cladding The sensitive chip 121F and make camera module the bad phenomenons such as dirty stain occur.
The encapsulation part 11F forms a through-hole 1100F, in order to provide photosensitive path for the sensitive chip 121F.
This preferred embodiment according to the present invention, the photographic department 12F includes an at least connecting line 124F, for being electrically connected Meet the sensitive chip 121F and the wiring board main body 122F.Further, each connecting line 124F may be implemented as, tool Body but be not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..Especially low, the connecting line 124F curvedly connects the sense The optical chip 121F and wiring board main body 122F.
It is noted that each connecting line 124F is molded into inside the encapsulation part 11F, so as to by institute It states encapsulation part 11F to coat each connecting line 124F, without being directly exposed to outside, to assemble the camera shooting mould When group so that the connecting line 124F not will receive it is any touch damage, while reducing environmental factor to a connecting line The influence of 124F, such as temperature, so that the communication connection between the sensitive chip 121F and the wiring board main body 122F is stablized, This point is not to be provided in the prior art completely.
It is noted that the encapsulation part 11F coats the circuit element 123F and connecting line 124F, has and protect The advantage of the circuit element 123F and the connecting line 124F and its camera module for more being had performance etc. is protected, still Those skilled in the art is it should be understood that the encapsulation part 11F is not limited to coat the circuit element 123F or the company Wiring 124F.That is, in other embodiments of the invention, the encapsulation part 11F, which can be directly molded into, not to be protruded The circuit element 123F the wiring board main body 122F, be also possible to be molded on the outside of the circuit element 123F, week Enclose equal different locations.
Further, the sensitive chip 121F has an a photosensitive area 1211F and non-photo-sensing area 1212F, the non-photo-sensing Area 1212F is surrounded on the periphery photosensitive area 1211F.The photosensitive area 1211F is for carrying out photosensitization, the connecting line 124F is connected to the non-photo-sensing area 1212F.
This preferred embodiment according to the present invention, the encapsulation part 11F extend the described of the sensitive chip 121F Non-photo-sensing area 1212F, so that sensitive chip 121F lamination by way of molding is fixed on the wiring board main body 122F.In this way, as being molded into the mode (Molding on chip) of chip expands the encapsulation part 11F Inside mouldable range, so as to reduce the wiring board main body 122F and the encapsulation part 11F outside structure Property part, further decrease it is described molding photographic department 12F part length and width dimensions, reduce by its assembling the camera module length Wide size.
In this embodiment in accordance with the invention, institute of the encapsulation part 11F protrusion ground around the sensitive chip 121F It states on the outside of photosensitive area 1211F, particularly, the encapsulation part 11F is integrally closed connection, so that there is good leakproofness, from And when the photosensory assembly 10F be used to assemble the camera module, the sensitive chip 121F is sealed in inside, is formed One closes interior space.
Specifically, when manufacturing the photosensory assembly 10F, a traditional wiring board can be chosen as the wiring board master A sensitive chip 121F is arranged on the wiring board main body 122F, the sensitive chip 121F is passed through institute by body 122F State connecting line 124F electrical connection, and then the molding wiring board main body 122F and sensitive chip 121F component after preliminary assembling On molded, such as use injection molding machine, by insert molding (molding) technique will carry out SMT technique (Surface Mount Technology surface mount process) after wiring board carry out molding and form the encapsulation part 11F, or with normal in semiconductor packages Mould pressing process forms the encapsulation part 11F.The wiring board main body 122F can choose for, citing ground but be not limited to, it is soft Harden plywood, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..The mode that the encapsulation part 11F is formed can be selected Be selected as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that the encapsulation part 11F can choose is citing ground But it is not limited to, Shooting Technique can choose nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that aforementioned The manufacture that can choose and the material that can choose are illustrative only the mode that can be implemented of the invention, and It is not limitation of the invention.
Further, the encapsulation part 11F includes a cladding section 111F and an optical filter construction section 112F, the optical filter peace It is integrally connected to dress section 112F molding the cladding section 111F, the cladding section 111F molding is connected to the wiring board main body 122F, for coating the circuit element 123F and the connecting line 124F.The optical filter construction section 112F is for installing one Optical filter 20F, that is to say, that when the photosensory assembly 10F be used to assemble the camera module, the filter of the camera module Mating plate 20F is installed in the optical filter construction section 112F, so that the optical filter 20F is located at the sense of the sensitive chip 121F On light path, and do not need to provide additional optical filter 20F mounting bracket.That is, the encapsulation part 11F has here The function of conventional stent, but the advantage based on moulding technology, the top optical filter construction section 112F can be by mold Technology mode, make it have good planarization, so that the optical filter 20F is entirely mounted, this point is also Better than traditional camera module.
Further, the optical filter construction section 112F has a mounting groove 1121F, and the support slot is connected to described logical Hole 1100F provides sufficient installation space for the optical filter 20F, so that the optical filter 20F will not protrude from optical filter peace Fill the top surface of section 112F.That is, the mounting groove 1121F is arranged in the upper end the encapsulation part 11F, in order to by the filter Mating plate 20F is installed on the encapsulation part 11F and will not protrude from the top of the encapsulation part 11F.
It is noted that the inner wall of the encapsulation part 11F can according to the shape of the connecting line 124F and be arranged, For example it is set as skewed, to make the sensitive chip 121F can receive while coating the connecting line 124F Etc. more light.Those skilled in the art is it should be understood that the shape of the encapsulation part 11F is not limitation of the invention.
Different from above preferred embodiment, the wiring board main body 122F has an at least reinforced hole 1221F, described Encapsulation part 11F is extended into the reinforced hole 1221F, to enhance the structural strength of the wiring board main body 122F.Change sentence It talks about, two kinds of different materials be combined with each other, so that composite structure is formed, so that the wiring board main body as matrix The structural strength of 122F enhances.
The position of the reinforced hole 1221F can according to need selection, and the structural strength need according to the wiring board It asks to be arranged, for example is in symmetrical structure.By the reinforced hole 1221F, the knot so that the wiring board main body 122F is set Structure enhanced strength reduces the thickness of the camera module by its assembling so as to reduce the thickness of the wiring board main body 122F, And improve the heat dissipation performance of the photosensory assembly 10F.
It is noted that in this embodiment in accordance with the invention, the reinforced hole 1221F is groove-like, to manufacture When the photosensory assembly 10F, the moulding material of the encapsulation part 11F will not be leaked out by the reinforced hole 1221F.
Similar with above preferred embodiment, the photosensory assembly 10F can be assembled as fixed-focus mould group or dynamic burnt mould group, this The technical staff in field is not it should be understood that the assembling application mode of the photosensory assembly 10F is limitation of the invention.
Referring to Figure 25, the photosensory assembly of the 8th preferred embodiment according to the present invention will be illustrated.The photosensory assembly 10G is for camera module described in assembly, to obtain the camera module of moulding type.The photosensory assembly 10G includes One encapsulation part 11G and photographic department 12G, is connected to the photographic department 12G to the encapsulation part 11G molding.
The photographic department 12G includes an a wiring board main body 122G and sensitive chip 121G, the sensitive chip 121G quilt It is set on the wiring board main body 122G.This embodiment according to the invention, sensitive chip 121G molding ground connection In the route version main body.
This embodiment according to the present invention, the photographic department 12G include a connection line (not shown) and at least one Circuit element 123G.The connection line defaults in the wiring board main body 122G, and the circuit element 123G is electrically connected to institute Connection line and the sensitive chip 121G are stated, for the photosensitive course of work of the sensitive chip 121G.The circuit elements Part 123G is projectedly set to the wiring board main body 122G.The circuit element 123G can be, citing ground but be not limited to, electricity Resistance, capacitor, diode, triode, potentiometer, relay or driver etc..
It is noted that the circuit element 123G is coated on inside it by the encapsulation part 11G, so that described Circuit element 123G will not be directly exposed in space, more specifically, be not exposed to communicate with the sensitive chip 121G Environment in, so that the pollutants such as dust will not be infected on the circuit element 123G when being assembled into the camera module, It will not influence the sensitive chip 121G, different from the existing way of circuit element 123G exposure in traditional camera module, such as hinder Container piece avoids pollution to prevent dust, sundries from staying in the surface the circuit element 123G by way of molding cladding The sensitive chip 121G and make camera module the bad phenomenons such as dirty stain occur.
The encapsulation part 11G forms a through-hole 1100G, in order to provide photosensitive path for the sensitive chip 121G.
This preferred embodiment according to the present invention, the photographic department 12G includes an at least connecting line 124G, for being electrically connected Meet the sensitive chip 121G and the wiring board main body 122G.Further, each connecting line 124G may be implemented as, tool Body but be not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..Especially low, the connecting line 124G curvedly connects the sense The optical chip 121G and wiring board main body 122G.
It is noted that each connecting line 124G is molded into inside the encapsulation part 11G, so as to by institute It states encapsulation part 11G to coat each connecting line 124G, without being directly exposed to outside, to assemble the camera shooting mould When group so that the connecting line 124G not will receive it is any touch damage, while reducing environmental factor to a connecting line The influence of 124G, such as temperature, so that the communication connection between the sensitive chip 121G and the wiring board main body 122G is stablized, This point is not to be provided in the prior art completely.
It is noted that the encapsulation part 11G coats the circuit element 123G and connecting line 124G, has and protect The advantage of the circuit element 123G and the connecting line 124G and its camera module for more being had performance etc. is protected, still Those skilled in the art is it should be understood that the encapsulation part 11G is not limited to coat the circuit element 123G or the company Wiring 124G.That is, in other embodiments of the invention, the encapsulation part 11G, which can be directly molded into, not to be protruded The circuit element 123G the wiring board main body 122G, be also possible to be molded on the outside of the circuit element 123G, week Enclose equal different locations.
Further, the sensitive chip 121G has an a photosensitive area 1211G and non-photo-sensing area 1212G, the non-photo-sensing Area 1212G is surrounded on the periphery photosensitive area 1211G.The photosensitive area 1211G is for carrying out photosensitization, the connecting line 124G is connected to the non-photo-sensing area 1212G.
This preferred embodiment according to the present invention, the encapsulation part 11G extend the described of the sensitive chip 121G Non-photo-sensing area 1212G, so that sensitive chip 121G lamination by way of molding is fixed on the wiring board main body 122G.In this way, as being molded into the mode (Molding on chip) of chip expands the encapsulation part 11G Inside mouldable range, so as to reduce the wiring board main body 122G and the encapsulation part 11G outside structure Property part, further decrease it is described molding photographic department 12G length and width dimensions, reduce by its assembling the camera module length and width Size.
In this embodiment in accordance with the invention, institute of the encapsulation part 11G protrusion ground around the sensitive chip 121G It states on the outside of photosensitive area 1211G, particularly, the encapsulation part 11G is integrally closed connection, so that there is good leakproofness, from And when the photosensory assembly 10G be used to assemble the camera module, the sensitive chip 121G is sealed in inside, is formed One closes interior space.
Specifically, when manufacturing the photosensory assembly 10G, a traditional wiring board can be chosen as the wiring board master A sensitive chip 121G is arranged on the wiring board main body 122G, the sensitive chip 121G is passed through institute by body 122G State connecting line 124G electrical connection, and then the molding wiring board main body 122G and sensitive chip 121G component after preliminary assembling On molded, such as use injection molding machine, by insert molding (molding) technique will carry out SMT technique (Surface Mount Technology surface mount process) after wiring board carry out molding and form the encapsulation part 11G, or with normal in semiconductor packages Mould pressing process forms the encapsulation part 11G.The wiring board main body 122G can choose for, citing ground but be not limited to, it is soft Harden plywood, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..The mode that the encapsulation part 11G is formed can be selected Be selected as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that the encapsulation part 11G can choose is citing ground But it is not limited to, Shooting Technique can choose nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that aforementioned The manufacture that can choose and the material that can choose are illustrative only the mode that can be implemented of the invention, and It is not limitation of the invention.
Further, the encapsulation part 11G includes a cladding section 111G and an optical filter construction section 112G, the optical filter peace It is integrally connected to dress section 112G molding the cladding section 111G, the cladding section 111G molding is connected to the wiring board main body 122G, for coating the circuit element 123G and the connecting line 124G.The optical filter construction section 112G is for installing one Optical filter 20G, that is to say, that when the photosensory assembly 10G be used to assemble the camera module, the filter of the camera module Mating plate 20G is installed in the optical filter construction section 112G, so that the optical filter 20G is located at the sense of the sensitive chip 121G On light path, and do not need to provide additional optical filter 20G mounting bracket.That is, the encapsulation part 11G has here The function of conventional stent, but the advantage based on moulding technology, the top optical filter construction section 112G can be by mold Technology mode, make it have good planarization, so that the optical filter 20G is entirely mounted, this point is also Better than traditional camera module.
Further, the optical filter construction section 112G has a mounting groove 1121G, and the support slot is connected to described logical Hole 1100G provides sufficient installation space for the optical filter 20G, so that the optical filter 20G will not protrude from optical filter peace Fill the top surface of section 112G.That is, the mounting groove 1121F is arranged in the upper end the encapsulation part 11F, in order to by the filter Mating plate 20F is installed on the encapsulation part 11F and will not protrude from the top of the encapsulation part 11F.
It is noted that the inner wall of the encapsulation part 11G can according to the shape of the connection and be arranged, for example set Be set to it is skewed, to make the sensitive chip 121G can receive more light while coating the connecting line 124G Line.Those skilled in the art is it should be understood that the shape of the encapsulation part 11G is not limitation of the invention.
Different from above preferred embodiment, the wiring board main body 122G has an at least reinforced hole 1221G, described Encapsulation part 11G is extended into the reinforced hole 1221G, to enhance the structural strength of the wiring board main body 122G.Change sentence It talks about, two kinds of different materials be combined with each other, so that composite structure is formed, so that the wiring board main body as matrix The structural strength of 122G enhances.
The position of the reinforced hole 1221G can according to need selection, and the structural strength need according to the wiring board It asks to be arranged, for example is in symmetrical structure.By the reinforced hole 1221G, the knot so that the wiring board main body 122G is set Structure enhanced strength reduces the thickness of the camera module by its assembling so as to reduce the thickness of the wiring board main body 122G, And improve the heat dissipation performance of the photosensory assembly 10G.
It is noted that this preferred embodiment according to the present invention, the reinforced hole 1221G is perforation, that is, It says, the wiring board main body 122G is passed through, so that the two sides of the wiring board main body 122G are connected to, to manufacture described photosensitive group When part 10G, the moulding material of the encapsulation part 11G adequately in conjunction with the wiring board main body 122G, is formed stronger Composite structure, and the structure of the relatively described groove, the perforation are easier to fabricate.
Similar with above preferred embodiment, the photosensory assembly 10G can be assembled as fixed-focus mould group or dynamic burnt mould group, this The technical staff in field is not it should be understood that the assembling application mode of the photosensory assembly 10G is limitation of the invention.
Referring to Figure 26, the camera module of the 9th preferred embodiment according to the present invention will be illustrated.The camera module It can be a fixed-focus mould group (Fix Focus Model, FFM).The camera module includes a photosensory assembly 10H, a bracket 50H, an optical filter 20H and a camera lens 30H.
The bracket 50H is installed on the photosensory assembly 10H, and the optical filter 20H is installed in the bracket 50H, the camera lens 30H are installed on the bracket 50H.
The photosensory assembly 10H includes an encapsulation part 11H and a photographic department 12H, is connected to the encapsulation part 11H molding The photographic department 12H.
The photographic department 12H includes an a wiring board main body 122H and sensitive chip 121H, the sensitive chip 121H quilt It is set on the wiring board main body 122H.This embodiment according to the invention, sensitive chip 121H molding ground connection In the route version main body.
This embodiment according to the present invention, the photographic department 12H include a connection line (not shown) and at least one Circuit element 123H.The connection line defaults in the wiring board main body 122H, and the circuit element 123H is electrically connected to institute Connection line and the sensitive chip 121H are stated, for the photosensitive course of work of the sensitive chip 121H.The circuit elements Part 123H is projectedly set to the wiring board main body 122H.The circuit element 123H can be, citing ground but be not limited to, electricity Resistance, capacitor, diode, triode, potentiometer, relay or driver etc..
It is noted that the circuit element 123H is coated on inside it by the encapsulation part 11H, so that described Circuit element 123H will not be directly exposed in space, more specifically, be not exposed to communicate with the sensitive chip 121H Environment in, so that the pollutants such as dust will not be infected on the circuit element 123H when being assembled into the camera module, It will not influence the sensitive chip 121H, different from the existing way of circuit element 123H exposure in traditional camera module, such as hinder Container piece avoids pollution to prevent dust, sundries from staying in the surface the circuit element 123H by way of molding cladding The sensitive chip 121H and make camera module the bad phenomenons such as dirty stain occur.
The encapsulation part 11H forms a through-hole 1100H, in order to provide photosensitive path for the sensitive chip 121H.
This preferred embodiment according to the present invention, the photographic department 12H includes an at least connecting line 124H, for being electrically connected Meet the sensitive chip 121H and the wiring board main body 122H.Further, each connecting line 124H may be implemented as, tool Body but be not necessarily limited to, gold thread, copper wire, aluminum steel, silver wire etc..Especially low, the connecting line 124H curvedly connects the sense The optical chip 121H and wiring board main body 122H.
It is noted that each connecting line 124H is molded into inside the encapsulation part 11H, so as to by institute It states encapsulation part 11H to coat each connecting line 124H, without being directly exposed to outside, to assemble the camera shooting mould When group so that the connecting line 124H not will receive it is any touch damage, while reducing environmental factor to a connecting line The influence of 124H, such as temperature, so that the communication connection between the sensitive chip 121H and the wiring board main body 122H is stablized, This point is not to be provided in the prior art completely.
It is noted that the encapsulation part 11H coats the circuit element 123H and connecting line 124H, has and protect The advantage of the circuit element 123H and the connecting line 124H and its camera module for more being had performance etc. is protected, still Those skilled in the art is it should be understood that the encapsulation part 11H is not limited to coat the circuit element 123H or the company Wiring 124H.That is, in other embodiments of the invention, the encapsulation part 11H, which can be directly molded into, not to be protruded The circuit element 123H the wiring board main body 122H, be also possible to be molded on the outside of the circuit element 123H, week Enclose equal different locations.
Further, the sensitive chip 121H has an a photosensitive area 1211H and non-photo-sensing area 1212H, the non-photo-sensing Area 1212H is surrounded on the periphery photosensitive area 1211H.The photosensitive area 1211H is for carrying out photosensitization, the connecting line 124H is connected to the non-photo-sensing area 1212H.
This preferred embodiment according to the present invention, the encapsulation part 11H extend the described of the sensitive chip 121H Non-photo-sensing area 1212H, so that sensitive chip 121H lamination by way of molding is fixed on the wiring board main body 122H.In this way, the mode (Molding on the chip, MOC) for being such as molded into chip expands the encapsulation The inside mouldable range of portion 11H, so as to reduce the outside of the wiring board main body 122H and the encapsulation part 11H Structural moiety, further decrease it is described molding photographic department 12H part length and width dimensions, reduce by its assemble the camera shooting mould The length and width dimensions of group.
In this embodiment in accordance with the invention, institute of the encapsulation part 11H protrusion ground around the sensitive chip 121H It states on the outside of photosensitive area 1211H, particularly, the encapsulation part 11H is integrally closed connection, so that there is good leakproofness, from And when the photosensory assembly 10H be used to assemble the camera module, the sensitive chip 121H is sealed in inside, is formed One closes interior space.
Specifically, when manufacturing the photosensory assembly 10H, a traditional wiring board can be chosen as the wiring board master A sensitive chip 121H is arranged on the wiring board main body 122H, the sensitive chip 121H is passed through institute by body 122H State connecting line 124H electrical connection, and then the molding wiring board main body 122H and sensitive chip 121H component after preliminary assembling On molded, such as use injection molding machine, by insert molding (molding) technique will carry out SMT technique (Surface Mount Technology surface mount process) after wiring board carry out molding and form the encapsulation part 11H, or with normal in semiconductor packages Mould pressing process forms the encapsulation part 11H.The wiring board main body 122H can choose for, citing ground but be not limited to, it is soft Harden plywood, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..The mode that the encapsulation part 11H is formed can be selected Be selected as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that the encapsulation part 11H can choose is citing ground But it is not limited to, Shooting Technique can choose nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use resin.It will be apparent to a skilled person that aforementioned The manufacture that can choose and the material that can choose are illustrative only the mode that can be implemented of the invention, and It is not limitation of the invention.
Here it is the bracket 50H to provide installation site by the encapsulation part 11H, and the advantage based on moulding technology is described Encapsulation part 11H can make it have good planarization by the technology mode of mold, so that the bracket 50H is flat Site preparation is mounted.
It is noted that the inner wall of the encapsulation part 11H can according to the shape of the connection and be arranged, for example set Be set to it is skewed, to make the sensitive chip 121H can receive more light while coating the connecting line 124H Line.Those skilled in the art is it should be understood that the shape of the encapsulation part 11H is not limitation of the invention.
The molding circuit pack in other embodiments of the invention, can also be assembled into dynamic burnt camera module, thus Can change the focal length of the camera module, those skilled in the art it should be understood that the type of the camera module simultaneously It is not limitation of the invention.
It is the photosensory assembly and camera module of the according to the present invention ten preferred embodiment referring to Figure 27.Different from above-mentioned Preferred embodiment, the photosensory assembly 10 include that shielded layer a 126I, the shielded layer 126I wraps up the wiring board master Body 122 and the encapsulation part 11, to enhance described photosensitive while enhancing the structural strength of the wiring board main body 122 The anti-electromagnetic interference capability of component 10.
Further, the shielded layer 126I is a metal layer, can be plate structure or reticular structure.
Referring to Figure 28 A and 28B, the according to the present invention comparison of the camera module of above preferred embodiment and traditional camera module Schematic diagram.In Figure 28 A, left side represents traditional camera module, and right side represents the camera module in of the invention.It is left in Figure 28 B Side represents traditional route board manufacturing process, and right side represents photosensory assembly manufacturing process of the invention.
In summary content, it was obvious that, photosensory assembly of the invention and camera module have the advantage that
1, the length and width dimensions of camera module, packed part and circuit element be can reduce, on capacitance resistance ware segment space It can be overlapped；Traditional scheme bracket need to be on the outside of capacitor, and needs to reserve certain safe distance, and the solution of the present invention can be direct Using capacitor space, plastic cement is directly filled around capacitor.
2, the inclination of mould group is reduced, the alternative existing plastic stent design of packed part reduces accumulated tolerance；
3, it molds and promotes circuit board structure intensity, under equivalent constructions intensity, because packed part can play a supporting role, Intensity can be increased, wiring board can be done thinner, reduce mould group height；
4, in height space, traditional scheme capacitor and pedestal need reserved assembling safe space, and moulding technology can not It is reserved, reduce mould group height；Traditional scheme capacitor top distance bracket needs reserved safety clearance, prevents from interfering, new departure can Directly to fill plastic cement around capacitor.
5, resistance capacitor device can be wrapped up by molding, can be to avoid capacitance resistance ware region solder resist, dust etc. It is bad to put the mould group dirt stain come, promotes product yield；
6, it is suitble to high efficiency scale of mass production, photosensory assembly of the invention is more suitable for a large amount of layout operations.Based on the present invention The photosensory assembly molded mode, the photosensory assembly is more suitable for layout operation, the primary sense for completing more amount The manufacture of optical assembly, for example can achieve 80 to 90, and traditional wiring board once can only at most produce 8.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating And it is not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention exists It shows and illustrates in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.

Claims (92)

1. the photosensory assembly of a camera module characterized by comprising
One encapsulation part；With
One photographic department；The photographic department includes a wiring board main body and a sensitive chip, and the encapsulation part encapsulated moulding is in described Wiring board main body and the sensitive chip；Wherein the encapsulation part forms a through-hole, and the through-hole is opposite with the sensitive chip, To provide the sensitive chip passage of light；Wherein at least part of the inner wall for being used to form the through-hole of the encapsulation part For tilt internal wall.
2. photosensory assembly according to claim 1, wherein the bottom of the through-hole of the encapsulation part in from the bottom to top by It is cumulative big skewed.
3. photosensory assembly according to claim 1, wherein the encapsulation part top is suitable for installing the mirror of the camera module Head, motor or optical filter.
4. photosensory assembly according to claim 1, wherein the encapsulation part top is in planar, for installing described take the photograph As the camera lens, motor or optical filter of mould group.
5. photosensory assembly according to claim 1, wherein the encapsulation part top has a mounting groove, the mounting groove connects The through-hole is passed through, with the optical filter, camera lens or motor for installing the camera module.
6. photosensory assembly according to claim 1, wherein the encapsulation part includes a cladding section, extends the cladding section An optical filter construction section and extend a camera lens construction section of the optical filter construction section, and the inside of the encapsulation part A step-like structure is formed, wherein the cladding section encapsulated moulding is in the wiring board main body and the sensitive chip, and described Cladding section forms the through-hole, and the optical filter construction section has a mounting groove, and the mounting groove is connected to the through-hole, and institute The first rank that optical filter construction section forms the step-like structure is stated, in order to install an optical filter, the camera lens construction section tool Have a camera lens mounting groove, the camera lens mounting groove is connected to the mounting groove, and the camera lens construction section formed it is described step-like The second-order of structure, in order to install the camera lens of the camera module.
7. photosensory assembly according to claim 1, wherein the encapsulation part includes a cladding section and extends the cladding One optical filter construction section of section, and the inside of the encapsulation part forms a step-like structure, wherein the cladding section takes shape in The wiring board main body and the sensitive chip, and the cladding section forms the through-hole, the optical filter construction section has one Mounting groove, the mounting groove is connected to the through-hole, in order to install an optical filter.
8. photosensory assembly according to any one of claims 1 to 7, wherein the photographic department includes an at least connecting line, each institute It states connecting line and is electrically connected the sensitive chip and the wiring board main body, the encapsulation part coats the connecting line, so that institute Outside will not be directly exposed to by stating connecting line.
9. photosensory assembly according to claim 8, wherein the connecting line is selected from combination: gold thread, silver wire, copper wire or aluminum steel One of.
10. photosensory assembly according to claim 8, wherein the connecting line curvedly connect the wiring board main body and The sensitive chip.
11. photosensory assembly according to claim 8, wherein the sensitive chip includes a photosensitive area and a non-photo-sensing area, The non-photo-sensing area extends to the non-photo-sensing of the sensitive chip around the photosensitive area periphery, the encapsulation part molding Area reduces the Outside Dimensions of the encapsulation part to extend the inside mouldable range of the encapsulation part.
12. photosensory assembly according to claim 8, wherein the photographic department includes an at least circuit element, the circuit Element protrudes from the wiring board main body, and the encapsulation part coats the circuit element, so that the circuit element will not be straight It connects and is externally exposed.
13. photosensory assembly according to claim 12, wherein circuit element selection combination: resistance, capacitor, two poles One or more of them in pipe, triode, potentiometer, relay and relay.
14. photosensory assembly according to claim 1 or 2, wherein the photographic department includes an optical filter, the optical filter covers It is placed on the sensitive chip, the encapsulation part takes shape in the wiring board main body, the sensitive chip and the optical filter, so as to In protecting the sensitive chip, and the back focal length of the reduction camera module by the optical filter, reduce its height.
15. photosensory assembly according to claim 8, wherein the photographic department includes a reinforcing layer, the reinforcing layer laminate It is set to the wiring board bottom part body, to enhance the structural strength of the wiring board main body.
16. photosensory assembly according to claim 15, wherein the reinforcing layer is metal plate, to enhance the photographic department Heat dissipation performance.
17. photosensory assembly according to claim 8, wherein the photographic department includes a shielded layer, the shielded layer package The wiring board main body and the encapsulation part, to enhance the electromagnetism interference performance of the photosensory assembly.
18. photosensory assembly according to claim 17, wherein the shielded layer is metal plate or metal mesh.
19. photosensory assembly according to claim 8, wherein wiring board main body has an at least reinforced hole, the encapsulation part The reinforced hole is extended into, in order to enhance the structural strength of the wiring board main body.
20. photosensory assembly according to claim 19, wherein the reinforced hole is groove-like.
21. photosensory assembly according to claim 19, wherein the reinforced hole is through-hole, so that the mould of the encapsulation part Moulding material comes into full contact with the wiring board main body, and easily fabricated.
22. photosensory assembly according to claim 8, wherein the material of the wiring board main body is selected from combination: soft or hard combination Plate, ceramic substrate, PCB hardboard or FPC.
23. photosensory assembly according to claim 8, wherein the material of the encapsulation part is selected from combination: epoxy resin, Buddhist nun One of dragon, LCP or PP or a variety of.
24. the manufacturing method of the photosensory assembly of a camera module, which is characterized in that comprising steps of in a wiring board main body and one One encapsulation part of encapsulated moulding on sensitive chip, wherein the encapsulation part forms a through-hole, the through-hole and the sensitive chip phase It is right, to provide the sensitive chip passage of light；Wherein at least the one of the inner wall for being used to form the through-hole of the encapsulation part Part is tilt internal wall.
25. the manufacturing method of photosensory assembly according to claim 24, including step: being attached in a wiring board main body The sensitive chip, and be electrically connected by an at least connecting line.
26. the manufacturing method of photosensory assembly according to claim 25, including step: being coated by the encapsulation part The connecting line.
27. the manufacturing method of photosensory assembly according to claim 25, including step: extending the encapsulation part to institute State a non-photo-sensing area of sensitive chip.
28. the manufacturing method of photosensory assembly according to claim 24, including step: in encapsulation part top shape At a mounting groove, in order to install an optical filter, motor or camera lens.
29. according to the manufacturing method of any photosensory assembly of claim 24 to 28, including step: in the route An at least groove-like reinforced hole is set in plate main body, and the encapsulation part is made to extend into the reinforced hole.
30. according to the manufacturing method of any photosensory assembly of claim 24 to 28, including step: in the route An at least through hole shape reinforced hole is set in plate main body, and the encapsulation part is made to extend into the reinforced hole.
31. according to the manufacturing method of any photosensory assembly of claim 24 to 28, including step: in the route Plate main body bottom attaches a reinforcing layer, to enhance the structural strength of the wiring board main body.
32. according to the manufacturing method of any photosensory assembly of claim 24 to 28, including step: in the route Plate main body and the encapsulation part coat a shielded layer, to enhance the electromagnetism interference performance of the photosensory assembly.
33. being further comprised the steps of: according to the manufacturing method of any photosensory assembly of claim 24 to 27 in the wiring board An encapsulation part is encapsulated on main body, the sensitive chip and an optical filter.
34. a camera module characterized by comprising
One photosensory assembly, wherein the photosensory assembly includes an encapsulation part and a photographic department；The photographic department includes a wiring board Main body and a sensitive chip, the encapsulation part encapsulated moulding is in the wiring board main body and the sensitive chip；The wherein envelope Dress portion forms a through-hole, and the through-hole is opposite with the sensitive chip, to provide the sensitive chip passage of light；It is wherein described At least part of the inner wall for being used to form the through-hole of encapsulation part is tilt internal wall；With
One camera lens；The camera lens is located at the photosensitive path of the sensitive chip of the photosensory assembly.
35. camera module according to claim 34, wherein the bottom of the through-hole of the encapsulation part is in from the bottom to top What is be gradually increased is skewed.
36. camera module according to claim 34, wherein the encapsulation part top is suitable for installing the camera module Camera lens, motor or optical filter.
37. camera module according to claim 34, wherein the encapsulation part top is in planar, with described for installing Camera lens, motor or the optical filter of camera module.
38. camera module according to claim 34, wherein the encapsulation part top has a mounting groove, the mounting groove It is connected to the through-hole, with the optical filter, camera lens or motor for installing the camera module.
39. camera module according to claim 34, wherein the encapsulation part includes a cladding section, extends the cladding One optical filter construction section of section and the camera lens construction section for extending the optical filter construction section, and the encapsulation part is interior Portion forms a step-like structure, wherein the cladding section encapsulated moulding is in the wiring board main body and the sensitive chip, and institute It states cladding section and forms the through-hole, the optical filter construction section has a mounting groove, and the mounting groove is connected to the through-hole, and The optical filter construction section forms the first rank of the step-like structure, in order to install an optical filter, the camera lens construction section With a camera lens mounting groove, the camera lens mounting groove is connected to the mounting groove, and the camera lens construction section forms the step The second-order of shape structure, in order to install the camera lens of the camera module.
40. camera module according to claim 34, wherein the encapsulation part includes a cladding section and extends the packet An optical filter construction section of section is covered, and the inside of the encapsulation part forms a step-like structure, wherein the cladding section forms In the wiring board main body and the sensitive chip, and the cladding section forms the through-hole, and the optical filter construction section has One mounting groove, the mounting groove is connected to the through-hole, in order to install an optical filter.
41. according to any camera module of claim 34 to 40, wherein the photographic department includes an at least connecting line, respectively The connecting line is electrically connected the sensitive chip and the wiring board main body, and the encapsulation part coats the connecting line, so that The connecting line will not be directly exposed to outside.
42. camera module according to claim 41, wherein the connecting line is selected from combination: gold thread, silver wire, copper wire or aluminium One of line.
43. camera module according to claim 41, wherein the connecting line curvedly connects the wiring board main body With the sensitive chip.
44. camera module according to claim 41, wherein the sensitive chip includes a photosensitive area and a non-photo-sensing area, The non-photo-sensing area extends to the non-photo-sensing of the sensitive chip around the photosensitive area periphery, the encapsulation part molding Area reduces the Outside Dimensions of the encapsulation part to extend the inside mouldable range of the encapsulation part.
45. camera module according to claim 41, wherein the photographic department includes an at least circuit element, the circuit Element protrudes from the wiring board main body, and the encapsulation part coats the circuit element, so that the circuit element will not be straight It connects and is externally exposed.
46. camera module according to claim 45, wherein circuit element selection combination: resistance, capacitor, two poles One or more of them in pipe, triode, potentiometer, relay and relay.
47. the camera module according to claim 34 or 35, wherein the photographic department includes an optical filter, the optical filter It is covered in the sensitive chip, the encapsulation part takes shape in the wiring board main body, the sensitive chip and the optical filter, with Convenient for protecting the sensitive chip by the optical filter, and reduce the back focal length of the camera module, reduces its height.
48. camera module according to claim 41, wherein the photographic department includes a reinforcing layer, the reinforcing layer laminate It is set to the wiring board bottom part body, to enhance the structural strength of the wiring board main body.
49. camera module according to claim 48, wherein the reinforcing layer is metal plate, to enhance the photographic department Heat dissipation performance.
50. camera module according to claim 34, wherein the photographic department includes a shielded layer, the shielded layer package The wiring board main body and the encapsulation part, to enhance the electromagnetism interference performance of the photosensory assembly.
51. camera module according to claim 50, wherein the shielded layer is metal plate or metal mesh.
52. camera module according to claim 41, wherein wiring board main body has an at least reinforced hole, the encapsulation part The reinforced hole is extended into, in order to enhance the structural strength of the wiring board main body.
53. camera module according to claim 52, wherein the reinforced hole is groove-like.
54. camera module according to claim 52, wherein the reinforced hole is through-hole, so that the mould of the encapsulation part Moulding material comes into full contact with the wiring board main body, and easily fabricated.
55. camera module according to claim 34, wherein the material of the wiring board main body is selected from combination: soft or hard combination Plate, ceramic substrate, PCB hardboard or FPC.
56. camera module according to claim 34, wherein the material of the encapsulation part is selected from combination: epoxy resin, Buddhist nun One of dragon, LCP or PP or a variety of.
57. according to any camera module of claim 34 to 40, wherein the camera module includes a bracket, the branch Frame is installed in the photosensory assembly, and the camera lens is installed in the bracket.
58. camera module according to claim 41, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
59. camera module according to claim 42, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
60. camera module according to claim 43, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
61. camera module according to claim 44, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
62. camera module according to claim 45, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
63. camera module according to claim 46, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
64. camera module according to claim 47, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
65. camera module according to claim 48, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
66. camera module according to claim 49, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
67. camera module according to claim 50, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
68. camera module according to claim 51, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
69. camera module according to claim 52, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
70. camera module according to claim 53, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
71. camera module according to claim 54, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
72. camera module according to claim 55, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
73. camera module according to claim 56, wherein the camera module includes a bracket, the bracket is mounted In the photosensory assembly, the camera lens is installed in the bracket.
74. according to any camera module of claim 34 to 40, wherein the camera module includes a motor, the mirror Head is installed in the motor, and the motor is installed in the photosensory assembly.
75. camera module according to claim 41, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
76. camera module according to claim 42, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
77. camera module according to claim 43, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
78. camera module according to claim 44, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
79. camera module according to claim 45, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
80. camera module according to claim 46, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
81. camera module according to claim 47, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
82. camera module according to claim 48, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
83. camera module according to claim 49, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
84. camera module according to claim 50, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
85. camera module according to claim 51, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
86. camera module according to claim 52, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
87. camera module according to claim 53, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
88. camera module according to claim 54, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
89. camera module according to claim 55, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
90. camera module according to claim 56, wherein the camera module includes a motor, the camera lens is mounted In the motor, the motor is installed in the photosensory assembly.
91. the camera module according to claim 34 or 35, wherein the camera module includes an optical filter, the optical filtering Piece is installed in the photosensory assembly.
92. camera module according to claim 57, wherein the camera module includes an optical filter, the optical filter quilt It is installed on the bracket.
CN201610143457.7A 2016-03-12 2016-03-12 Camera module and its photosensory assembly and manufacturing method Active CN105744130B (en)

Priority Applications (52)

Application Number Priority Date Filing Date Title
CN201610143457.7A CN105744130B (en) 2016-03-12 2016-03-12 Camera module and its photosensory assembly and manufacturing method
CN201910061810.0A CN110022424B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof
CN201910061809.8A CN110022423B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof
US15/075,192 US10750071B2 (en) 2016-03-12 2016-03-20 Camera module with lens array arrangement, circuit board assembly, and image sensor and manufacturing method thereof
EP16894174.8A EP3429181A4 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
KR1020207036129A KR102335306B1 (en) 2016-03-12 2016-10-28 Array Imaging Module and Molded Photensitive Assembly and Manufacturing Method Thereof for Electronic Device
JP2018547880A JP2019519087A (en) 2016-03-12 2016-10-28 Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices
PCT/CN2016/103736 WO2017157015A1 (en) 2016-03-12 2016-10-28 Array camera module, moulded photosensitive assembly and manufacturing method therefor, and electronic device
US15/317,117 US10908324B2 (en) 2016-03-12 2016-10-28 Molded photosensitive assembly of array imaging module
KR1020187029337A KR102193819B1 (en) 2016-03-12 2016-10-28 Array imaging module, molded photosensitive assembly and manufacturing method thereof, and electronic device
KR1020187029304A KR20180132684A (en) 2016-03-12 2017-03-09 Camera module, its photosensitive part and method of manufacturing the same
JP2018548099A JP7071926B2 (en) 2016-03-12 2017-03-09 Camera module and its photosensitive parts and their manufacturing method
PCT/CN2017/076041 WO2017157211A1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
EP17765753.3A EP3429183A4 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
KR1020217005344A KR102294537B1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
KR1020217005352A KR102360319B1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
US16/082,533 US20190148429A1 (en) 2016-03-12 2017-03-09 Camera module, and photosensitive component thereof and manufacturing method therefor
TW106203511U TWM552720U (en) 2016-03-12 2017-03-13 Split array camera module
TW106108124A TWI703715B (en) 2016-03-12 2017-03-13 Array camera module, molded photosensitive element and manufacturing method thereof, and electronic equipment
TW108135672A TWI742441B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW106203507U TWM559558U (en) 2016-03-12 2017-03-13 Camera module and light-sensing component
TW108135670A TW202017356A (en) 2016-03-12 2017-03-13 Camera module, and photosensitive component thereof and manufacturing method therefor
TW106108217A TWI754632B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW108135671A TWI769403B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW108135674A TW202019155A (en) 2016-03-12 2017-03-13 Camera module, and photosensitive component thereof and manufacturing method therefor
TW106203473U TWM565451U (en) 2016-03-12 2017-03-13 Array camera module and its molded photosensitive element and electronic device
TW106108225A TWI685255B (en) 2016-03-12 2017-03-13 Split array camera module and manufacturing method thereof
TW108135670D TWI758644B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
TW108135674D TWI758645B (en) 2016-03-12 2017-03-13 Camera module, photosensitive element and manufacturing method thereof
US15/460,231 US9876948B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/460,235 US10277792B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/461,413 US9876949B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/460,236 US10084949B2 (en) 2016-03-12 2017-03-16 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/473,573 US9781325B1 (en) 2016-03-12 2017-03-29 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,605 US10033913B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,607 US9826132B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/473,609 US9906700B2 (en) 2016-03-12 2017-03-30 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/679,146 US10274694B2 (en) 2016-03-12 2017-08-16 Manufacturing method of a molded photosensitive assembly of an array imaging module
US15/705,225 US10175447B2 (en) 2016-03-12 2017-09-14 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/705,232 US10126519B2 (en) 2016-03-12 2017-09-14 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US15/784,171 US10237460B2 (en) 2016-03-12 2017-10-15 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US15/784,167 US10578837B2 (en) 2016-03-12 2017-10-15 Molded photosensitive assembly for array imaging module for electronic device
US16/101,509 US10367983B2 (en) 2016-03-12 2018-08-12 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/436,934 US10735637B2 (en) 2016-03-12 2019-06-11 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/737,863 US20200218034A1 (en) 2016-03-12 2020-01-08 Molded Photosensitive Assembly for Array Imaging Module for Electronic Device and Manufacturing Method Thereof
US16/908,723 US11303789B2 (en) 2016-03-12 2020-06-22 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US16/919,065 US11706516B2 (en) 2016-03-12 2020-07-01 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US17/114,466 US11822099B2 (en) 2016-03-12 2020-12-07 Array imaging module and molded photosensitive assembly and manufacturing method thereof for electronic device
US17/685,587 US11743569B2 (en) 2016-03-12 2022-03-03 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof
US17/740,887 US20220268968A1 (en) 2016-03-12 2022-05-10 Molded photosensitive assembly for array imaging module for electronic device and manufacturing method thereof
US17/847,569 US12021097B2 (en) 2016-03-12 2022-06-23 Camera module, and photosensitive component thereof and manufacturing method therefor
US18/203,252 US20230300442A1 (en) 2016-03-12 2023-05-30 Camera module and array camera module with circuit board unit and photosensitive unit and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610143457.7A CN105744130B (en) 2016-03-12 2016-03-12 Camera module and its photosensory assembly and manufacturing method

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CN201910061810.0A Division CN110022424B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof
CN201910061809.8A Division CN110022423B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof

Publications (2)

Publication Number Publication Date
CN105744130A CN105744130A (en) 2016-07-06
CN105744130B true CN105744130B (en) 2019-10-18

Family

ID=56250427

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201910061810.0A Active CN110022424B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof
CN201910061809.8A Active CN110022423B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof
CN201610143457.7A Active CN105744130B (en) 2016-03-12 2016-03-12 Camera module and its photosensory assembly and manufacturing method

Family Applications Before (2)

Application Number Title Priority Date Filing Date
CN201910061810.0A Active CN110022424B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof
CN201910061809.8A Active CN110022423B (en) 2016-03-12 2016-03-12 Camera module and photosensitive assembly and manufacturing method thereof

Country Status (1)

Country Link
CN (3) CN110022424B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12021097B2 (en) 2016-03-12 2024-06-25 Ningbo Sunny Opotech Co., Ltd. Camera module, and photosensitive component thereof and manufacturing method therefor

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017140092A1 (en) * 2016-02-18 2017-08-24 宁波舜宇光电信息有限公司 Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor
CN110650273B (en) * 2016-08-01 2024-06-18 宁波舜宇光电信息有限公司 Image pickup module and molded photosensitive assembly and manufacturing method thereof
KR102352901B1 (en) * 2016-08-01 2022-01-19 닝보 써니 오포테크 코., 엘티디. Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods
US10659664B2 (en) * 2016-08-01 2020-05-19 Ningbo Sunny Opotech Co., Ltd. Camera module and molded circuit board assembly and manufacturing method thereof
CN106454058A (en) * 2016-12-27 2017-02-22 维沃移动通信有限公司 Camera module and mobile terminal using same
CN112600999A (en) * 2016-12-30 2021-04-02 宁波舜宇光电信息有限公司 Camera module, molded circuit board assembly thereof, preparation method and electronic equipment
CN108401092B (en) * 2017-02-04 2024-03-15 宁波舜宇光电信息有限公司 Camera module, molded circuit board assembly thereof, circuit board and application
CN106993123B (en) * 2017-04-11 2024-03-05 昆山丘钛微电子科技有限公司 Miniaturized camera device and manufacturing method thereof
CN108807430A (en) * 2017-04-28 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its combined type photosensory assembly
CN108810344A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810340B (en) * 2017-05-06 2021-10-08 南昌欧菲光电技术有限公司 Camera module and photosensitive assembly thereof
CN107071252A (en) * 2017-05-16 2017-08-18 昆山丘钛微电子科技有限公司 Direct attaching type miniaturization cam device of optical filter and preparation method thereof
CN106973210A (en) * 2017-05-16 2017-07-21 昆山丘钛微电子科技有限公司 Plastic packaging adds stent-type to minimize cam device and preparation method thereof
CN109218567A (en) * 2017-06-30 2019-01-15 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN109218568A (en) * 2017-06-30 2019-01-15 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN107734227A (en) * 2017-10-27 2018-02-23 昆山丘钛微电子科技有限公司 Image sensor package structure, camera module and preparation method thereof
CN109218582A (en) * 2018-09-29 2019-01-15 Oppo广东移动通信有限公司 Mould group and preparation method thereof, camera and electronic device
CN110881276A (en) * 2018-10-31 2020-03-13 深圳市大疆创新科技有限公司 Camera bayonet structure and shooting device
EP3955561A4 (en) * 2019-04-12 2022-06-22 Ningbo Sunny Opotech Co., Ltd. Camera module, molded photosensitive assembly and manufacturing method therefor, and electronic device
TWI730639B (en) 2020-02-25 2021-06-11 大立光電股份有限公司 Imaging lens module and electronic device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2658949Y (en) * 2003-11-07 2004-11-24 飞信半导体股份有限公司 Film covering chip packaging structure of image sensor
CN101089670A (en) * 2006-06-16 2007-12-19 鸿富锦精密工业（深圳）有限公司 Lens module and camera module
CN102707547A (en) * 2012-06-25 2012-10-03 东莞光阵显示器制品有限公司 Method for manufacturing dustproof photography module and dustproof photography module device
CN203674192U (en) * 2013-11-06 2014-06-25 南昌欧菲光电技术有限公司 Camera module group and packaging structure therefor
CN105704354A (en) * 2016-03-12 2016-06-22 宁波舜宇光电信息有限公司 Camera module, photosensitive assembly thereof and manufacturing method
CN205792875U (en) * 2016-03-12 2016-12-07 宁波舜宇光电信息有限公司 Camera module and photosensory assembly thereof
CN205792874U (en) * 2016-03-12 2016-12-07 宁波舜宇光电信息有限公司 Camera module and photosensory assembly thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2773722Y (en) * 2005-02-04 2006-04-19 沈阳敏像科技有限公司 Microcamera mould set
US20090045476A1 (en) * 2007-08-16 2009-02-19 Kingpak Technology Inc. Image sensor package and method for forming the same
TW201104747A (en) * 2009-07-29 2011-02-01 Kingpak Tech Inc Image sensor package structure
TWI398949B (en) * 2009-07-29 2013-06-11 Kingpak Tech Inc Manufacturing method for molding image sensor package structure and image sensor package structure thereof
CN203241600U (en) * 2013-04-15 2013-10-16 世大光电(深圳)有限公司 Optical lens and imaging module group having optical lens
CN203337981U (en) * 2013-07-02 2013-12-11 南昌欧菲光电技术有限公司 Support structure and camera module provided with support structure
CN203387593U (en) * 2013-08-08 2014-01-08 南昌欧菲光电技术有限公司 Shooting module and mobile device including the shooting module
CN203482298U (en) * 2013-09-18 2014-03-12 南昌欧菲光电技术有限公司 Camera module
CN204809224U (en) * 2015-08-01 2015-11-25 陆玉明 Cell -phone camera module sensitization chip package structure
CN105206640B (en) * 2015-10-08 2020-04-21 格科微电子（上海）有限公司 Camera module and assembling method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2658949Y (en) * 2003-11-07 2004-11-24 飞信半导体股份有限公司 Film covering chip packaging structure of image sensor
CN101089670A (en) * 2006-06-16 2007-12-19 鸿富锦精密工业（深圳）有限公司 Lens module and camera module
CN102707547A (en) * 2012-06-25 2012-10-03 东莞光阵显示器制品有限公司 Method for manufacturing dustproof photography module and dustproof photography module device
CN203674192U (en) * 2013-11-06 2014-06-25 南昌欧菲光电技术有限公司 Camera module group and packaging structure therefor
CN105704354A (en) * 2016-03-12 2016-06-22 宁波舜宇光电信息有限公司 Camera module, photosensitive assembly thereof and manufacturing method
CN205792875U (en) * 2016-03-12 2016-12-07 宁波舜宇光电信息有限公司 Camera module and photosensory assembly thereof
CN205792874U (en) * 2016-03-12 2016-12-07 宁波舜宇光电信息有限公司 Camera module and photosensory assembly thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12021097B2 (en) 2016-03-12 2024-06-25 Ningbo Sunny Opotech Co., Ltd. Camera module, and photosensitive component thereof and manufacturing method therefor

Also Published As

Publication number Publication date
CN110022424B (en) 2021-08-10
CN105744130A (en) 2016-07-06
CN110022424A (en) 2019-07-16
CN110022423B (en) 2021-08-10
CN110022423A (en) 2019-07-16

Similar Documents

Publication Publication Date Title
CN105744130B (en) Camera module and its photosensory assembly and manufacturing method
CN105704354B (en) Camera module and its photosensory assembly and manufacturing method
CN205792874U (en) Camera module and photosensory assembly thereof
CN105611134B (en) Camera module and its molding circuit board module and manufacturing method based on moulding technology
US11627239B2 (en) Photosensitive assembly and camera module and manufacturing method thereof
CN105744131B (en) Array camera module and its circuit board module and manufacturing method
CN207530910U (en) Double camera modules and its photosensory assembly and electronic equipment
US11223751B2 (en) Photosensitive assembly and camera module and manufacturing method thereof
US7419854B2 (en) Methods for packaging image sensitive electronic devices
CN206272707U (en) Array camera module and double camera modules and its circuit board module and electronic equipment
US10708481B2 (en) Camera module and photosensitive assembly thereof
CN205792880U (en) The integral base assembly of camera module based on integral packaging technique
CN105847645A (en) Shooting module based on integrated packaging technology, and integrated pedestal assembly and manufacturing method thereof
US10750072B2 (en) Camera module and photosensitive assembly thereof
CN107566691A (en) Photosensory assembly and camera module and its manufacture method
CN206977550U (en) Camera module and its photosensory assembly
CN207184653U (en) Camera module
CN206977545U (en) Camera module and its photosensory assembly
CN111009475B (en) Packaging structure and packaging method of optical module
CN108702431A (en) Array camera module and its molding photosensory assembly, circuit board module and manufacturing method and electronic equipment

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant