CN106993123B - Miniaturized camera device and manufacturing method thereof - Google Patents
Miniaturized camera device and manufacturing method thereof Download PDFInfo
- Publication number
- CN106993123B CN106993123B CN201710232183.3A CN201710232183A CN106993123B CN 106993123 B CN106993123 B CN 106993123B CN 201710232183 A CN201710232183 A CN 201710232183A CN 106993123 B CN106993123 B CN 106993123B
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- circuit board
- bracket
- annular boss
- photosensitive chip
- chip
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- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims abstract description 8
- 230000000149 penetrating effect Effects 0.000 claims abstract description 5
- 206010070834 Sensitisation Diseases 0.000 claims description 28
- 230000008313 sensitization Effects 0.000 claims description 28
- 238000000465 moulding Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 239000011265 semifinished product Substances 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 6
- 238000005516 engineering process Methods 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000002245 particle Substances 0.000 abstract description 4
- 230000002093 peripheral effect Effects 0.000 abstract description 4
- 239000000047 product Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013037 co-molding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The invention discloses a miniaturized camera device, which comprises a circuit board, a photosensitive chip, an optical filter, a bracket and a lens component, wherein the photosensitive chip is attached to the circuit board, the bracket comprises a bracket body and an annular boss formed at the bottom of the bracket body, the middle part of the bracket body is provided with a light passing hole penetrating through the annular boss, the annular boss is bonded with a non-photosensitive area at the periphery of the photosensitive chip, the bracket, the annular boss, the photosensitive chip and the circuit board are combined into a whole through a plastic package body formed by plastic package materials, the plastic package body is combined on the outer side of the bracket, the outer side of the annular boss, the peripheral side of the photosensitive chip and the upper side of the circuit board, the lens component is arranged on the upper side of the bracket and/or the upper side of the plastic package body, and the optical filter is arranged between the lens component and the photosensitive chip and is arranged at the light passing hole at the middle part of the bracket. The invention reduces the size of the camera module, reduces the risk of dirt of particles in the camera, and enhances the reliability of the product.
Description
Technical Field
The invention relates to the technical field of camera shooting, in particular to a miniaturized camera device and a manufacturing method thereof, which can be well applied to mobile phones or tablet computers and the like.
Background
Currently, a camera module generally includes an image sensor (photosensitive chip), a circuit board (soft and hard combined board RFPC), a bracket, an optical filter and a lens assembly with a lens. The image sensor is mounted on a circuit board (hard board part of the RFPC) through a Die bonding (Die Bond) process and a gold Wire bonding (Wire Bond) process, the bracket is mounted above the image sensor on the circuit board, the lens assembly is mounted on the bracket, and the optical filter is positioned between the lens assembly and the image sensor and is mounted in the middle of the bracket. However, the size of the camera module with the structure is larger, the camera module is not in line with the development trend of light, thin and small electronic products (mobile phones, tablet computers and the like) at present, the risk of dirt of particles in the camera exists, and the reliability of the product is still to be further enhanced.
Disclosure of Invention
In order to solve the technical problems, the invention provides a miniaturized camera device and a manufacturing method thereof, which reduce the size of a camera module, reduce the risk of dirt of particles in the camera and enhance the reliability of products.
The technical scheme of the invention is realized as follows:
the utility model provides a miniaturized camera device, includes circuit board, sensitization chip, light filter, support and camera lens subassembly, sensitization chip paste dress to on the circuit board, the support include support body with form in the annular boss of support body bottom, support body middle part has the link up the light through hole of annular boss, annular boss with sensitization chip outlying non-sensitization district bonds together, the support annular boss the sensitization chip with the circuit board combines into a whole through the plastic envelope body that forms by plastic envelope material, the plastic envelope body combine in the support outside the annular boss outside the periphery of sensitization chip and the circuit board upside, the camera lens subassembly install in support upside and/or the upside of plastic envelope body, the light filter is located between the camera lens subassembly with install in the light through hole department at support middle part.
Further, the optical filter is integrally formed in the bracket body of the bracket through insert molding.
Further, the annular boss with support body integrated into one piece, annular boss inside wall with the logical unthreaded hole lateral wall parallel and level in support body middle part.
Further, the periphery of the photosensitive chip on the circuit board is provided with a passive element and a metal circuit, the photosensitive chip is electrically connected with the metal circuit on the circuit board through a gold wire, and the passive element and the gold wire are embedded into the plastic package body in a plastic package mode.
Further, a stop ring is formed on the upper side of the plastic package body, the top of the stop ring is flush with or close to the top of the support body, and the bottom of the lens assembly is adhered to the plastic package body on the outer side of the stop ring.
Further, the circuit board is a rigid-flex board, the rigid-flex board comprises a lens rigid board portion, a connector rigid board portion and an intermediate flexible board portion connected therebetween, and the photosensitive chip is attached to the lens rigid board portion.
A manufacturing method of a miniaturized camera device comprises the following steps:
1) The optical filter is fixed in a bracket through an insert molding process, the bracket comprises a bracket body and an annular boss formed at the bottom of the bracket body, the middle part of the bracket body is provided with a light passing hole penetrating through the annular boss, and the optical filter is integrally molded in the light passing hole in the middle part of the bracket body through insert molding to form a component;
2) Performing SMT (surface mount technology) patch and COB (chip on board) processes, and attaching a photosensitive chip to a circuit board so that the photosensitive chip is electrically connected with a metal circuit on the circuit board through a gold bonding wire;
3) Dispensing at one circle of the non-photosensitive area of the photosensitive chip, covering the components on the surface of the photosensitive chip, bonding the bottom of the annular boss of the bracket with the non-photosensitive area of the photosensitive chip by using glue, and baking the glue to form a semi-finished product;
4) Placing the semi-finished product obtained in the step 3 into a mould for moulding, wherein a lower mould and an upper mould of the mould are provided with bump rings extending towards a circuit board, after mould closing, the bump rings are pressed on the circuit board, gold wires between the photosensitive chip and the component and the circuit board and passive elements on the periphery of the photosensitive chip on the circuit board are enclosed in the gold wires to form a mould cavity, and then, injecting a plastic packaging material into the mould cavity to form a plastic packaging body, wherein the plastic packaging body casts the passive elements, the gold wires, the bracket, the photosensitive chip and the circuit board together to form a whole;
5) And (3) drawing glue on the upper surface of the plastic package body and/or the upper surface of the bracket, and adhering the lens assembly on the upper surface of the plastic package body and/or the upper surface of the bracket to complete the assembly of the whole camera device.
Further, the circuit board is a rigid-flex board, the rigid-flex board comprises a lens rigid-flex board portion, a connector rigid-flex board portion and an intermediate flexible-flex board portion connected therebetween, and the photosensitive chip and the component are mounted on the lens rigid-flex board portion.
Further, the mold can be used for plastic packaging at least one group of semi-finished products, two lens hard plate parts of each group of semi-finished products are arranged back to back, the bump ring of the mold encloses the photosensitive chips and components on the two lens hard plate parts in the mold together to form a common mold cavity, the mold is integrally plastic packaged, and then the mold is cut to form a miniaturized camera device.
The beneficial effects of the invention are as follows: the invention provides a miniaturized camera device and a manufacturing method thereof; through designing the support into the structural style of support body and annular boss, bond annular boss and the peripheral non-sensitization district of sensitization chip together to the plastic envelope body that forms through plastic envelope material is in the same place support, annular boss, sensitization chip and circuit board casting, formed overall structure, compared with traditional support and circuit board combination, reduced the space between support and the sensitization chip, reduced the space that the support occupies promptly, thereby reached the purpose that reduces the module size of making a video recording, and the sensitization district of sensitization chip is airtight by support and light filter, can reduce the dirty risk of the inside granule of camera module, and overall plastic envelope structure has strengthened the reliability of product greatly.
Drawings
FIG. 1 is a top view of a miniaturized camera device of the present invention;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is a cross-sectional view taken along the direction B-B in FIG. 1;
FIG. 4 is a schematic diagram of a structure of the present invention for integrally co-molding with a mold;
the LED display device comprises a circuit board 1, a lens hard board 11, a connector hard board 12, a middle soft board 13, a 2-photosensitive chip, a 3-optical filter, a 4-support, a 41-support body 42-annular boss 43-light passing holes, a 5-lens assembly 51-lens, a 52-voice coil motor, a 6-plastic package body 61-stop ring, a 7-passive element, an 8-gold wire, a 9-mold and a 91-bump ring.
Detailed Description
In order that the technical content of the present invention may be more clearly understood, the following detailed description of the embodiments is given only for better understanding of the content of the present invention and is not intended to limit the scope of the present invention.
As shown in fig. 1, 2 and 3, a miniaturized camera device comprises a circuit board 1, a photosensitive chip 2, an optical filter 3, a support 4 and a lens assembly 5, wherein the photosensitive chip is attached to the circuit board, the support comprises a support body 41 and an annular boss 42 formed at the bottom of the support body, a light passing hole 43 penetrating through the annular boss is formed in the middle of the support body, the annular boss is bonded with a non-photosensitive area at the periphery of the photosensitive chip, the support, the annular boss, the photosensitive chip and the circuit board are combined into a whole through a plastic package body 6 formed by plastic package materials, the plastic package body is combined to the outer side of the support, the outer side of the annular boss, the peripheral side of the photosensitive chip and the upper side of the circuit board, and the lens assembly is mounted on the upper side of the support and/or the upper side of the plastic package body, and the optical filter is arranged between the lens assembly and the photosensitive chip and is mounted at the light passing hole at the middle of the support. Like this, through the structural style with support design into support body and annular boss, bond annular boss and the peripheral non-sensitization district of sensitization chip together to the plastic envelope body that forms through plastic envelope material is in the same place support, annular boss, sensitization chip and circuit board casting, form overall structure, compare with traditional support and circuit board combination, reduced the space between support and the sensitization chip, reduced the space that the support occupies promptly, thereby reach the purpose that reduces the module size of making a video recording, and the sensitization district of sensitization chip is airtight by support and light filter, can reduce the dirty risk of the inside granule of camera module, and overall plastic envelope structure has strengthened the reliability of product greatly.
Preferably, the optical filter is integrally formed in the bracket body of the bracket through insert molding. In this way, the optical filter is combined in the bracket body of the bracket through an insert molding (insert molding) process, namely, the optical filter is integrally injection molded and embedded in the side wall of the light transmission hole in the center of the bracket body, and is molded and injection molded together with the bracket, so that the periphery of the optical filter is embedded in the light transmission hole in the middle of the bracket.
Preferably, the annular boss and the support body integrated into one piece, annular boss inside wall with the logical unthreaded hole lateral wall parallel and level in support body middle part. Therefore, the support is in a shape with a large upper part and a small lower part, and the annular boss at the lower part is smaller to reduce the area of the surface contacted with the non-photosensitive area of the photosensitive chip, so that the connection between the support and the photosensitive chip is realized.
Preferably, the periphery of the photosensitive chip on the circuit board is provided with a passive element 7 and a metal circuit, the photosensitive chip is electrically connected with the metal circuit on the circuit board through a gold wire 8, and the passive element and the gold wire are embedded into the plastic package body in a plastic package mode. Like this, sensitization chip, support, gold thread and passive component utilize plastic envelope material to cast together, have formed a whole, compare with traditional support and circuit board combination, reduced the space between support and the sensitization chip, the sensitization district of sensitization chip is airtight by support and light filter, can reduce the inside granule dirt risk of camera module, and the reliability of product obtains the reinforcing greatly.
Preferably, a stop ring 61 is formed on the upper side of the plastic package body, the top of the stop ring is flush with or close to the top of the bracket body, and the bottom of the lens assembly is adhered to the plastic package body outside the stop ring. The concrete structure is as follows: the lens assembly generally comprises a lens 51 and a voice coil motor 52 for driving the lens, the voice coil motor is provided with a through placing hole, the lens is arranged in the placing hole and corresponds to the setting of the optical filter, the bottom of the shell of the voice coil motor is downwards convex and corresponds to the contact surface of the outer side of the stop ring on the plastic package body, and the bottom of the shell of the voice coil motor is convexly adhered to the contact surface of the outer side of the stop ring on the plastic package body through adhesive, so that adhesive flows towards the inside of the lens when the adhesive is dispensed on the plastic package body and the lens assembly is combined, and the stop ring plays a role in effectively preventing glue overflow. In other embodiments, the upper side of the plastic package body is lower than the upper side of the support, so that the side wall of the support is equivalent to the stop ring, and the plastic package body can also play an effective role in preventing glue overflow.
Preferably, the circuit board is a rigid-flex board, the rigid-flex board comprises a lens rigid-flex board portion 11, a connector rigid-flex board portion 12 and an intermediate flexible-flex board portion 13 connected therebetween, and the photosensitive chip is attached to the lens rigid-flex board portion.
A manufacturing method of a miniaturized camera device comprises the following steps:
1) The optical filter 3 (glass, JSR and the like with visible filtering function) is fixed in a bracket 4 through an Insert molding (Insert molding) process, the bracket comprises a bracket body 41 and an annular boss 42 formed at the bottom of the bracket body, the middle part of the bracket body is provided with a light through hole 43 penetrating through the annular boss, and the optical filter 3 is integrally formed in the light through hole 43 in the middle part of the bracket body 41 through Insert molding to form a component; that is to say, the bracket (in particular to a plastic bracket) is designed to be large at the top and small at the bottom, is injection molded with the optical filter at one time, and is manufactured into a component, the upper part of the component is the optical filter of the Inset modeling, the lower part of the component is a surface which is contacted with a non-photosensitive area of a photosensitive chip (in particular to a CMOS Sensor), and the surface is contacted with the non-photosensitive area around the CMOS Sensor;
2) Performing SMT (surface mount technology) patch and COB (chip on board) process, attaching the photosensitive chip 2 to the circuit board 1 (specifically RFPC), and electrically connecting the photosensitive chip 2 with the metal circuit on the circuit board 1 by gold wire bonding 8; firstly, SMT is carried out on RFPC of the camera module, then COB process is carried out to make a photosensitive chip (CMOS Sensor) pass through Die Bond and Wire Bond processes to Mount on RFPC.
3) Dispensing at one circle of the non-photosensitive area of the photosensitive chip, covering the components on the surface of the photosensitive chip, bonding the bottom of the annular boss of the bracket with the non-photosensitive area of the photosensitive chip by using glue, and baking the glue to form a semi-finished product;
4) Placing the semi-finished product obtained in the step 3 into a mould 9 for moulding, wherein the lower mould and the upper mould of the mould are provided with a bump ring 91 extending towards the circuit board, after the mould is closed, the bump ring is pressed on the circuit board 1, the gold wire 8 between the photosensitive chip 2 and the component, the photosensitive chip and the circuit board and the passive element 7 on the periphery of the photosensitive chip on the circuit board are enclosed in the mould to form a mould cavity, then injecting a plastic package material into the mould cavity to form a plastic package body 6, and the plastic package body casts the passive element, the gold wire, the bracket, the photosensitive chip and the circuit board together to form a whole;
5) And (3) drawing glue on the upper surface of the plastic package body and/or the upper surface of the bracket, and adhering the lens assembly 5 on the upper surface of the plastic package body and/or the upper surface of the bracket to complete the assembly of the whole camera device.
Preferably, the circuit board is a rigid-flex board (RFPC) including a lens rigid board portion 11, a connector rigid board portion 12, and an intermediate flexible board portion 13 connected therebetween, the photosensitive chip and the component being mounted on the lens rigid board portion.
Preferably, the mold may be used to mold at least one set of semi-finished products, the two lens hard plate portions of each set of semi-finished products are disposed back-to-back, referring to fig. 4, two RFPCs are shown, the bump ring of the mold encloses the photosensitive chips and components on the two lens hard plate portions together therein to form a common mold cavity, and the mold cavity is integrally molded, and then cut to form a miniaturized camera device.
The design scheme of the invention can be well applied to a mobile phone or a tablet personal computer, and is a miniaturized camera module scheme formed by adopting an RFPC (rigid-flex board) +plastic package+insert molding process; the miniaturized camera module scheme can reduce the size of the camera module through a plastic package and Insert molding process, reduces the risk of dirt of particles in the camera, and enhances the reliability of the product due to Insert molding of the filter in the camera in the plastic bracket.
The above embodiments are described in detail with reference to the accompanying drawings. Modifications and variations in the above-described embodiments may be made by those skilled in the art without departing from the spirit of the invention, which fall within the scope of the invention.
Claims (7)
1. A miniaturized camera device, characterized in that: including circuit board (1), sensitization chip (2), light filter (3), support (4) and camera lens subassembly (5), sensitization chip paste dress to on the circuit board, the support include support body (41) with form in annular boss (42) of support body bottom, support body middle part have link up annular boss's light passing hole (43), annular boss with sensitization chip outlying non-sensitization district bonds together, support body annular boss the sensitization chip reaches the circuit board combines into a whole through plastic envelope body (6) by plastic envelope material formation, the plastic envelope body combine in the support body outside annular boss outside the periphery of sensitization chip reaches the circuit board upside, the camera lens subassembly install in support upside and/or the upside of plastic envelope body, the light filter locate between the camera lens subassembly with the light passing hole department at support middle part, through inserts integrated into one piece in support body and annular boss, this annular boss is the shape of the support body parallel and level with the side wall down of support, this integrated into one piece is the annular boss.
2. The miniaturized camera apparatus of claim 1, wherein: the periphery of the photosensitive chip on the circuit board is provided with a passive element (7) and a metal circuit, the photosensitive chip is electrically connected with the metal circuit on the circuit board through a gold wire (8), and the passive element and the gold wire are embedded into the plastic package body in a plastic package mode.
3. The miniaturized camera apparatus of claim 1, wherein: the plastic package body upper side is formed with backstop ring (61), backstop ring top with support body top parallel and level, the lens subassembly bottom bond on the plastic package body in backstop ring outside.
4. The miniaturized camera apparatus of claim 1, wherein: the circuit board is a rigid-flex board, the rigid-flex board comprises a lens rigid board part (11), a connector rigid board part (12) and an intermediate flexible board part (13) connected between the lens rigid board part and the connector rigid board part, and the photosensitive chip is attached to the lens rigid board part.
5. A manufacturing method of a miniaturized camera device is characterized in that: the method comprises the following steps:
1) The optical filter is fixed in a bracket through an insert molding process, the bracket comprises a bracket body and an annular boss integrally formed at the bottom of the bracket body, the middle part of the bracket body is provided with a light passing hole penetrating through the annular boss, the shape of the bracket is big-end-up, and the optical filter is integrally formed in the light passing hole at the middle part of the bracket body through insert molding to form a component;
2) Performing SMT (surface mount technology) patch and COB (chip on board) processes, and attaching a photosensitive chip to a circuit board so that the photosensitive chip is electrically connected with a metal circuit on the circuit board through a gold bonding wire;
3) Dispensing at one circle of the non-photosensitive area of the photosensitive chip, covering the components on the surface of the photosensitive chip, bonding the bottom of the annular boss of the bracket with the non-photosensitive area of the photosensitive chip by using glue, and baking the glue to form a semi-finished product;
4) Placing the semi-finished product obtained in the step 3 into a mould for moulding, wherein a lower mould and an upper mould of the mould are provided with bump rings extending towards a circuit board, after mould closing, the bump rings are pressed on the circuit board, gold wires between the photosensitive chip and the component and the circuit board and passive elements on the periphery of the photosensitive chip on the circuit board are enclosed in the gold wires to form a mould cavity, and then, injecting a plastic packaging material into the mould cavity to form a plastic packaging body, wherein the plastic packaging body casts the passive elements, the gold wires, the bracket, the photosensitive chip and the circuit board together to form a whole;
5) And (3) drawing glue on the upper surface of the plastic package body and/or the upper surface of the bracket, and adhering the lens assembly on the upper surface of the plastic package body and/or the upper surface of the bracket to complete the assembly of the whole camera device.
6. The method for manufacturing a miniaturized camera device according to claim 5, wherein: the circuit board is a rigid-flex board, the rigid-flex board comprises a lens rigid board part, a connector rigid board part and a middle flexible board part connected with the connector rigid board part, and the photosensitive chip and the component are mounted on the lens rigid board part.
7. The method for manufacturing a miniaturized camera device according to claim 5, wherein: the die can be used for plastic packaging at least one group of semi-finished products, two lens hard plate parts of each group of semi-finished products are arranged back to back, a bump ring of the die encloses photosensitive chips and components on the two lens hard plate parts in the die together to form a shared die cavity, the die is integrally plastic packaged, and then a miniaturized camera device is formed by cutting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710232183.3A CN106993123B (en) | 2017-04-11 | 2017-04-11 | Miniaturized camera device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710232183.3A CN106993123B (en) | 2017-04-11 | 2017-04-11 | Miniaturized camera device and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN106993123A CN106993123A (en) | 2017-07-28 |
| CN106993123B true CN106993123B (en) | 2024-03-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710232183.3A Active CN106993123B (en) | 2017-04-11 | 2017-04-11 | Miniaturized camera device and manufacturing method thereof |
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| CN (1) | CN106993123B (en) |
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