CN205792880U - The integral base assembly of camera module based on integral packaging technique - Google Patents

The integral base assembly of camera module based on integral packaging technique Download PDF

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Publication number
CN205792880U
CN205792880U CN201620422525.9U CN201620422525U CN205792880U CN 205792880 U CN205792880 U CN 205792880U CN 201620422525 U CN201620422525 U CN 201620422525U CN 205792880 U CN205792880 U CN 205792880U
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CN
China
Prior art keywords
wiring board
main body
base portion
integral
board main
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Active
Application number
CN201620422525.9U
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Chinese (zh)
Inventor
王明珠
赵波杰
田中武彦
郭楠
黄桢
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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Publication date
Priority to CN201620422525.9U priority Critical patent/CN205792880U/en
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to KR1020217023290A priority patent/KR102465474B1/en
Priority to JP2018543321A priority patent/JP6829259B2/en
Priority to KR1020187026982A priority patent/KR102282687B1/en
Priority to EP16890320.1A priority patent/EP3419275A4/en
Priority to US15/999,858 priority patent/US11877044B2/en
Priority to PCT/CN2016/092020 priority patent/WO2017140092A1/en
Priority to JP2018555482A priority patent/JP6952052B2/en
Priority to US15/512,065 priority patent/US10477088B2/en
Priority to PCT/CN2016/106402 priority patent/WO2017181668A1/en
Priority to KR1020187033639A priority patent/KR102152517B1/en
Application granted granted Critical
Publication of CN205792880U publication Critical patent/CN205792880U/en
Priority to TW108100066A priority patent/TWI743429B/en
Priority to TW108100078A priority patent/TWI708987B/en
Priority to TW106110049A priority patent/TWI648587B/en
Priority to TW106204229U priority patent/TWM561225U/en
Priority to US15/627,429 priority patent/US9848109B2/en
Priority to US15/627,408 priority patent/US10129452B2/en
Priority to US15/627,437 priority patent/US10194064B2/en
Priority to US15/627,425 priority patent/US9900487B2/en
Priority to US15/627,418 priority patent/US10110791B2/en
Priority to US16/575,357 priority patent/US11533416B2/en
Priority to JP2021007710A priority patent/JP2021073520A/en
Priority to US17/833,025 priority patent/US20220303441A1/en
Active legal-status Critical Current
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Abstract

The integral base assembly of one camera module based on integral packaging technique, comprising: a base portion and a wiring board portion；Wherein said base portion is attached directly to described wiring board portion, and is suitable to neighbour outside a sensitive chip of described camera module, thus extends the thickness of described base portion so that described base portion and described line part have higher connectivity robustness.

Description

The integral base assembly of camera module based on integral packaging technique
Technical field
This utility model relates to camera module field, further, relating to camera module based on integral packaging technique and an integral base assembly thereof.
Background technology
COB (Chip on Board chip package) technique is a technical process particularly important in tradition camera module assembling manufacture process.The camera module that traditional COB technique is made generally is assembled by parts such as wiring board, sensitive chip, camera lens, microscope base and motors.
As it is shown in figure 1, be a camera module schematic diagram of tradition COB technique manufacture.Described camera module includes a wiring board 1P, a sensitive chip 2P, a microscope base 3P, an optical filter 4P, a motor 5P and a camera lens 6P.Described sensitive chip 2P is mounted on described wiring board 1P, described optical filter 4P is installed in described microscope base 3P, described camera lens 6P is installed in described motor 5P, described motor 5P is installed in described microscope base 3P, described microscope base 3P is by by being installed on described wiring board 1P, in order to described camera lens 6P and described optical filter 4P is positioned at the photosensitive path of described sensitive chip 2P.
Further, in COB technique, described microscope base 3P is fixed on described wiring board 1P with described wiring board 1P typically by the mode that glue is bonding, and based on bonding technique and the characteristic of glue, easily there is the phenomenon such as (Tilt), bias in described microscope base 3P, it usually needs calibrated by AA (Active Arrangement calibrates automatically) technique.
On the other hand, traditional described microscope base 3P is typically by completing that single Shooting Technique manufactures, and therefore the flatness of its own face is poor, and the negligible amounts of the described microscope base that once can manufacture.Assembling process is typically to bond on wiring board by single support, and each camera module is individually to assemble, and therefore process is relative complex, production efficiency is relatively low in the manufacturing.
It is worth mentioning that, described wiring board 1P is usually installed some circuit devcies 11P as drives element, such as resistance, electric capacity etc., these circuit devcies 11P protrudes from described wiring board 1P, and the assembling matching relationship between wiring board 1P described in traditional COB technique, described circuit devcie 11P and described microscope base 3P has some unfavorable factors, and limit the camera module direction to lightening development to a certain extent.
Specifically, first, described circuit devcie 11P is directly exposed to the surface of described wiring board 1P, therefore in follow-up assembling process, the most bonding described microscope base 3P, weld the processes such as described motor 5P, inevitably it is affected, solder resist during welding, dust is easily attached to described circuit devcie 11P, and described circuit devcie 11P and described sensitive chip 2P is positioned at the space being interconnected, therefore dust pollutant are easy to transfer, pollute described sensitive chip 2P, there is the bad phenomenon such as pitch-black point in the camera module after such impact is likely to result in assembling, reduce product yield.
Secondly, described microscope base 3P is positioned at the outside of described circuit devcie 11P, in order to prevent described circuit devcie 11P damaged, generally when installing described microscope base, typically require reserved certain safe distance between described microscope base and described circuit devcie 11P, and direction in the horizontal direction and straight up is required for reserved safe distance, and such requirement increases the demand to camera module thickness the most to a certain extent so that it is thickness is difficult to reduce.
null3rd，During COB assembles，Described microscope base 3P is glued to described wiring board 1P by paste such as glue，AA to be carried out (Active Arrangement the calibrates automatically) technique when pasting，It is exactly to adjust described microscope base 3P、Described wiring board 1P and the central axis of described motor 5P，Reach horizontal direction consistent with vertical direction，Therefore to meet AA technique，Need to be required for presetting more glue between described microscope base 3P and described wiring board 1P and described microscope base and described motor 5P，Make to leave adjustment space each other，And on the one hand this demand adds the thickness requirements to camera module to a certain extent，Its thickness is made to be difficult to reduce，On the other hand，Repeatedly pasting assembling process, to easily cause the inclination of assembling inconsistent，And to described microscope base 3P、The planarization of described wiring board 1P and described motor 5P requires higher.
In addition, in traditional COB technique, described wiring board 1P provides most basic fixing, support carrier, therefore, described wiring board 1P itself is required possess certain structural strength, this requires to make described wiring board 1P have bigger thickness, thus the pre-add thickness requirements of camera module the most again.
Along with various electronic products, the development of smart machine, camera module is the most increasingly to high-performance, lightening direction is developed, and in the face of high pixel, the various high performance demand for development such as high imaging quality, electronic devices and components in circuit get more and more, the area of chip is increasing, drive resistance, the Passive components such as electric capacity increase accordingly, this makes the specification of electronic device increasing, assemble difficulty constantly to increase, the overall dimensions of camera module is increasing, and from the point of view of above-mentioned, microscope base, traditional assembling mode of wiring board and component etc. is the most also the very big restriction of the lightening development of camera module.
Utility model content
A purpose of the present utility model is to provide camera module based on integral packaging technique and an integral base assembly thereof, wherein said integral base assembly includes a base portion and a wiring board portion, described base portion is shaped in described wiring board portion rather than bonding mode.
A purpose of the present utility model is to provide camera module based on integral packaging technique and an integral base assembly thereof, wherein said wiring board portion includes a wiring board main body and at least one component, described component protrudes from described wiring board main body, described component is coated with by described base portion, from without being directly exposed to outside.
A purpose of the present utility model is to provide camera module based on integral packaging technique and an integral base assembly thereof, it is connected to described wiring board main body wherein said base portion integral packaging, with described wiring board main body, there is stronger connection reliability, and strengthen the structural strength of described wiring board main body.
A purpose of the present utility model is to provide camera module based on integral packaging technique and an integral base assembly thereof, it is connected to described wiring board portion wherein said base portion integral packaging, and described base portion can spend less thickness and reach Structural strength calls, such that it is able to reduce the lateral dimension of described camera module.
A purpose of the present utility model is to provide camera module based on integral packaging technique and an integral base assembly thereof, it is connected to described wiring board main body wherein said base portion integral packaging, when assembling described camera module, it is made without AA to adjust, adjust space also without reserved AA, thus reduce the height of described camera module.
A purpose of the present utility model is to provide camera module based on integral packaging technique and an integral base assembly thereof, wherein when manufacturing described camera module, multiple described base portion integral packaging simultaneously is in a whole jigsaw, thus realizes the jigsaw operation of described camera module, improves production efficiency.
A purpose of the present utility model is to provide a camera module based on integral packaging technique and integral base assembly thereof and manufacture method thereof, wherein said wiring board main body has an inner groovy, be suitable to described camera module one sensitive chip is installed, thus reduce described sensitive chip and the relative altitude of described wiring board main body, reduce the requirement for height to described base portion further.
A purpose of the present utility model is to provide camera module based on integral packaging technique and an integral base assembly thereof, wherein said wiring board main body has a path and an external groove, described external groove is communicated in described path, and described groove installs described sensitive chip with being suitable to upside-down mounting.
A purpose of the present utility model is to provide a camera module based on integral packaging technique and one base assembly and manufacture method thereof, wherein said wiring board portion includes a back-up coat, it is arranged at described wiring board bottom part body with being stacked, to strengthen structural strength and the heat dispersion of described wiring board main body.
A purpose of the present utility model is to provide camera module based on integral packaging technique and an integral base assembly thereof, wherein wiring board main body has at least one reinforced hole, described base portion extends into described reinforced hole, further enhances the structural strength of described wiring board main body.
A purpose of the present utility model is to provide camera module based on integral packaging technique and an integral base assembly thereof, wherein said base portion includes a camera lens construction section, be suitable to install a camera lens of described camera module, thus provide stable installation site for described camera lens.
In order to realize above utility model purpose and other purposes of the present utility model and advantage, one side of the present utility model provides an integral base assembly being used for camera module, comprising: a base portion and a wiring board portion；Wherein said base portion is attached directly to described wiring board portion, and is suitable to neighbour outside a sensitive chip of described camera module, thus extends the thickness of described base portion so that described base portion and described line part have higher connectivity robustness.
According to an embodiment of the present utility model, described in described integral base assembly, base portion forms a through hole, relative with described sensitive chip, in order to provide photosensitive path for described sensitive chip.
According to an embodiment of the present utility model, described in described integral base assembly, base portion has a mounting groove, is communicated in described through hole.
According to an embodiment of the present utility model, described in described integral base assembly, wiring board portion includes a wiring board main body, and described base portion is shaped in described wiring board main body, and described sensitive chip is suitable to be mounted on described wiring board main body.
According to an embodiment of the present utility model, wiring board portion described in described integral base assembly includes that wiring board portion described in includes that a back-up coat, described back-up coat lamination are arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body.
According to an embodiment of the present utility model, described in described integral base assembly, back-up coat is metallic plate, to strengthen the heat dispersion in described wiring board portion.
According to an embodiment of the present utility model, wiring board portion described in described integral base assembly includes a screen layer, and described screen layer wraps up described wiring board main body and described base portion, to strengthen the electromagnetism interference performance of described circuit board module.
According to an embodiment of the present utility model, described in described integral base assembly, screen layer is metallic plate or wire netting.
According to an embodiment of the present utility model, described in described integral base assembly, wiring board main body has at least one reinforced hole, and described base portion extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body.
According to an embodiment of the present utility model, described in described integral base assembly, reinforced hole is groove-like.
According to an embodiment of the present utility model, described in described integral base assembly, reinforced hole is through hole, so that the moulding material of described base portion is fully contacted with described wiring board main body and easily fabricated.
According to an embodiment of the present utility model, described in described integral base assembly, wiring board portion includes one at least one component, described component protrudes from described wiring board main body, and described base portion is coated with each described component, so that described component will not be directly exposed to outside.
According to an embodiment of the present utility model, described in described integral base assembly, integral base assembly includes a motor attachment structure, described motor attachment structure includes at least one lead-in wire and at least one pin groove, described lead-in wire is arranged at described base portion, and it is electrically connected to described wiring board main body, described pin groove is arranged at described base portion upper end, described lead-in wire includes that a motor connects end, described motor connects end and is revealed in the groove bottom wall of described pin groove, in order to a motor pin is electrically connected to described motor and connects end when being plugged in described pin groove.
According to an embodiment of the present utility model, described in described integral base assembly, integral base assembly includes a motor attachment structure, described motor attachment structure includes at least one pin groove and at least one circuit junction, described circuit junction is electrically connected to described wiring board main body, described pin groove is arranged at described base portion, the top of described base portion is extended to by described wiring board main body, and described circuit junction is revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when being plugged in described pin groove.
According to an embodiment of the present utility model, described in described integral base assembly, integral base assembly includes a motor attachment structure, described motor attachment structure includes at least one engraving circuit, described engraving circuit is arranged at described base portion, it is electrically connected to described wiring board main body, in order to electrically connect a motor pin.
According to an embodiment of the present utility model, carve circuit described in described integral base assembly in the way of laser formation, be arranged at described base portion.
According to an embodiment of the present utility model, described in described integral base assembly, wiring board main body has a path, is suitable to described sensitive chip and is installed on described wiring board main body from direction, the described wiring board main body back side.
According to an embodiment of the present utility model, described in described integral base assembly, path is step-like, in order to stably sensitive chip described in upside-down mounting.
According to an embodiment of the present utility model, the material of wiring board main body described in described integral base assembly can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
According to an embodiment of the present utility model, the material of base portion described in described integral base assembly is selected from combination: the one in epoxy resin, nylon, LCP or PP.
Accompanying drawing explanation
Fig. 1 is the camera module of tradition COB technique.
Fig. 2 is the camera module cross-sectional schematic based on integral packaging technique according to first preferred embodiment of the present utility model.
Fig. 3 is the integral base component manufacturing process schematic diagram according to first preferred embodiment of the present utility model.
Fig. 4 is the integral base assembly manufacture method schematic diagram according to first preferred embodiment of the present utility model.
Fig. 5 is another embodiment of camera module based on integral packaging technique according to first preferred embodiment of the present utility model.
Fig. 6 A, 6B, 6C and 6D are the camera module based on integral packaging technique according to second preferred embodiment of the present utility model and the different embodiments of motor attachment structure thereof.
Fig. 7 is the camera module based on integral packaging technique according to the 3rd preferred embodiment of the present utility model and the cross-sectional schematic of integral base assembly thereof.
Fig. 8 is the camera module based on integral packaging technique according to the 4th preferred embodiment of the present utility model and the cross-sectional schematic of integral base assembly thereof.
Fig. 9 is the camera module based on integral packaging technique according to the 5th preferred embodiment of the present utility model and the cross-sectional schematic of integral base assembly thereof.
Figure 10 is the camera module based on integral packaging technique according to the 6th preferred embodiment of the present utility model and the cross-sectional schematic of integral base assembly thereof.
Figure 11 is the camera module based on integral packaging technique according to the 7th preferred embodiment of the present utility model and the cut-away view of integral base assembly thereof.
Figure 12 is the camera module based on integral packaging technique according to the 8th preferred embodiment of the present utility model and the cross-sectional schematic of integral base assembly thereof.
Figure 13 is the camera module based on integral packaging technique according to the 9th preferred embodiment of the present utility model and the cross-sectional schematic of integral base assembly thereof.
Figure 14 is the camera module based on integral packaging technique according to the of the present utility model ten preferred embodiment and the cross-sectional schematic of integral base assembly thereof.
Figure 15 is another embodiment of the camera module based on integral packaging technique of the tenth preferred embodiment according to this utility model.
Figure 16 is that the shooting based on integral packaging technique according to above preferred embodiment of the present utility model compares schematic diagram with tradition camera module structural strength.
Figure 17 is that the camera module based on integral packaging technique according to above preferred embodiment of the present utility model compares schematic diagram with the lateral dimension of tradition camera module.
Figure 18 is the aspect ratio relatively schematic diagram of the camera module based on integral packaging technique according to this utility model above preferred embodiment and tradition camera module.
Figure 19 is the flatness schematic diagram of the camera module based on integral packaging technique according to above preferred embodiment of the present utility model.
Figure 20 is that the camera module based on integral packaging technique according to above preferred embodiment of the present utility model compares schematic diagram with the image quality of tradition camera module.
Figure 21 A and 21B is that the camera module based on integral packaging technique according to above preferred embodiment of the present utility model compares schematic diagram with tradition camera module manufacture process.
Detailed description of the invention
Hereinafter describe and be used for disclosing this utility model so that those skilled in the art are capable of this utility model.Preferred embodiment in below describing is only used as citing, it may occur to persons skilled in the art that other obvious modification.The ultimate principle of the present utility model defined in the following description can apply to other embodiments, deformation program, improvement project, equivalent and the other technologies scheme without departing from spirit and scope of the present utility model.
As shown in Figures 2 to 4, it is according to first preferred embodiment camera module based on integral packaging technique of the present utility model.Described camera module can be applied to various electronic equipment, and to assist use can carry out shooting activity by described camera module, the most described camera module can be used for shooting object or the image of personage or video image etc..Preferably, described camera module can be employed a mobile electronic device, and the most described mobile electronic device can be but not limited to mobile phone or panel computer equipment.
As shown in Figures 2 to 4, described camera module includes integral base assembly 10, sensitive chip 30 and a camera lens 50.
Further, described sensitive chip 30 is installed in described integral base assembly 10, and described camera lens 50 is positioned on described integral base assembly 10, and described camera lens 50 is positioned at the photosensitive path of described sensitive chip 30.Described integral base assembly 10 can be coupled to described electronic equipment, thus with described electronic equipment with the use of.Those skilled in the art is filmed image it should be appreciated that described camera lens 50 and described sensitive chip 30 can cooperate.Specifically, subject, the reflection of object or person thing light by as described in after camera lens 50, received to carry out photoelectric conversion by described sensitive chip 30.In other words, described sensitive chip 30 can convert optical signal into the signal of telecommunication, and the described signal of telecommunication can be transferred into described electronic equipment by described integral base assembly 10, thus generates the image relevant to described reference object on described electronic equipment.
Described integral base assembly 10 includes base portion 11 and a wiring board portion 12, is connected to described wiring board portion 12 described base portion 11 integral packaging, molding be connected to as described in wiring board portion 12.More specifically, described base portion 11 (Molding On Board, MOB) molding by the way of being molded into wiring board is connected to described wiring board portion.It is to say, described base portion 11 is attached directly to described wiring board portion 12 rather than is connected by intermedium, such as glue, the most described base portion 11 has preferable connectivity robustness with described wiring board portion 12.
Described wiring board portion 12 includes that a wiring board main body 121, described base portion 11 are integrally connected to described wiring board main body 121.Described base portion 11 forms a through hole 1100, so that described base portion 11 is around outside described sensitive chip 30, and provides described camera lens 50 and the passage of light of described sensitive chip 30.Described sensitive chip 30 is arranged at the described wiring board main body 121 of described through hole 1100 correspondence position.
Described wiring board portion 12 includes a connection circuit and at least one component 122, and described connection line defaults in described wiring board main body 121, and described component 122 is electrically connected to described connection circuit, for the photosensitive work process of described sensitive chip 30.Described component 122 it may be that citing ground but be not limited to, resistance, electric capacity, diode, audion, potentiometer, relay, driver etc..
It is worth mentioning that, described component 122 element can be coated on inside by described base portion 11, hence in so that described component 122 will not be directly exposed in space, more specifically, it is not exposed in the enclosed environment being connected with described sensitive chip 30.In different traditional camera modules, the existing way of circuit devcie, as capacitance resistance ware protrudes from the mode of wiring board, thus prevents dust, foreign material from staying in described component 122 and polluting described sensitive chip 30.In this embodiment of the present utility model, protrude from by described component 122 and illustrate as a example by described wiring board main body 121, and in other embodiments of the present utility model, it is internal that described component 122 is embedded in described wiring board main body 121, and non-bulging described wiring board main body 121, those skilled in the art is it should be appreciated that the structure of described component 122, type and provided position are not restriction of the present utility model.It is understandable that, in the camera module of transmission, circuit devcie protrudes from described wiring board, and base can only be installed in the outside of described component 122, the most described circuit devcie and described base are required for certain locus, therefore higher in horizontal dimensional requirement to wiring board.And for camera module based on integral packaging technique of the present utility model, described base portion 11 integral packaging is in described wiring board main body 121, and it is coated with described component 122, the most described base portion 11 and described component 122 are overlapped in space, thus add the space that described base portion 11 can inwardly be arranged, reduce extension demand outside to described wiring board main body 121, thus reduce the lateral dimension of described camera module so that it is the equipment of miniature requirement can be met.
It is worth mentioning that; described base portion 11 is coated with described component 122 and has the described component 122 of protection; make it from advantage that is contaminated and that by mistake touched; corresponding camera module is brought advantage simultaneously; but those skilled in the art is it should be appreciated that described base portion 11 is not limited to be coated with described component 122.It is to say, in other embodiments of the present utility model, described base portion 11 can directly be molded into the described wiring board main body 121 of the described component 122 not protruded, it is also possible to be to be molded into the diverse locations such as the outside of described component 122, surrounding.
In this embodiment of this utility model, described base portion 11 is protrudingly around outside described sensitive chip 30, especially, described base portion 11 closes connection integratedly, make it have good sealing, thus when described camera lens 50 is installed in the photosensitive path of described sensitive chip 30, described sensitive chip 30 is sealed in inside, thus forms space in the closing of correspondence.
Specifically, when manufacturing described integral base assembly 10, a traditional wiring board can be selected as described wiring board main body 121, mold on described wiring board main body 121 surface.Such as, in one embodiment, injection machine can be used, wiring board after carrying out SMT technique (Surface Mount Technology surface mount process) by insert molding (Insert Molding) technique carries out integral packaging, such as molded packages, form described base portion 11, or form described base portion 11 by mould pressing process conventional in semiconductor packages.Further, each described sensitive chip 30 is mounted on described wiring board main body 121, then each described sensitive chip 30 is electrically connected with described wiring board main body 121, such as play gold thread electrical connection.Described wiring board main body 121 can be chosen as, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard (without soft board) etc..Described base portion 11 formed mode can be chosen as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..The material that described base portion 11 can select is, citing ground but be not limited to, Shooting Technique can select nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use epoxy resin.It will be apparent to a skilled person that the aforementioned manufacture that can select and the material that can select, being illustrative only of the present utility model can be not restriction of the present utility model in the way of enforcement.
In other embodiments of the present utility model, the process manufacturing described integral base assembly 10 can also is that, first described wiring board main body 121 is carried out SMT technique, and then described sensitive chip 30 is mounted on described wiring board main body 121, and described sensitive chip 30 is electrically connected with described wiring board main body 121, such as play gold thread electrical connection, then described wiring board main body 121 will be carried out integral packaging, such as molded packages, described base portion 11 is formed by the way of insert molding, or form described base portion 11 by mould pressing process conventional in semiconductor packages.Those skilled in the art is it should be appreciated that the manufacturing sequence of described integral base assembly 10 is not restriction of the present utility model.
Described camera module includes that an optical filter 40, described optical filter 40 are installed in described base portion 11, in order to provide stable, smooth mounting condition for described optical filter 40.
More specifically, in an embodiment of the present utility model, described optical filter 40 is implemented as a cutoff filter 40 (Infra-Red Cut Filter, IRCF), described cutoff filter 40 is the blooming utilizing precision optics coating technique alternately to plate high index of refraction on optical base-substrate, realize visible region (400-630nm) high thoroughly, the optical filter 40 that near-infrared (700-1100nm) ends, it can eliminate the Infrared Imaging to described sensitive chip 30, such as CCD or CMOS.By adding described cutoff filter 40 in the imaging system of described camera module, stop the infrared light of imaging system portion interference image quality so that the become image of described camera module more conforms to the best perception of human eye.
It is worth mentioning that, due to described sensitive chip 30, such as CCD or CMOS, sensing to light is different with human eye, human eye can only see the visible ray of 380-780nm wave band, described sensitive chip 30 then can sense more multiband, such as infrared light and ultraviolet light, especially the most sensitive to infrared light, therefore infrared light have to be suppressed in described camera module, and keep the high transmission of visible ray, make the sensing of described sensitive chip 30 close to human eye, so that the image of described camera module shooting also complies with the sensing of eyes, the most described cutoff filter 40 is indispensable for described camera module.
Especially, in embodiment of the present utility model, described optical filter 40 can be selected from combination: wafer scale cutoff filter, narrow band pass filter, smalt IRCF.Those skilled in the art is it should be appreciated that the type of described optical filter 40 is not restriction of the present utility model.
In the camera module that traditional COB assembles, optical filter is usually installed in plastic feet, and base is installed on wiring board typically by bonding mode, the most this plastic feet and corresponding mounting means are not easy skew or inclination occur, and the surface smoothness of plastic stent is poor, therefore good mounting condition can not be provided for optical filter 40.According to this preferred embodiment of this utility model, described optical filter 40 is installed in described base portion 11, and based on integral packaging technique, good surface smoothness can be obtained, therefore, it is possible to provide smooth mounting condition for described optical filter 40, and integrated mode so that described base portion 11 is difficult to eccentric, tilt phenomenon occur, thus reduces cumulative limit when described optical filter 40 is installed.
It will also be appreciated that, the shape of described base portion 11 can determine as required, such as extend internally in described component 122 position, form a protuberance, thus increase the width of described base portion 11 correspondence, and there is no the position of described component 122, described disjunctor molded section 11 as one man extends, form the shape of comparison rule, and width is less.Those skilled in the art is it should be appreciated that the concrete shape of described base portion 11 is not restriction of the present utility model.
Further, described base portion 11 includes cladding section 111 and an optical filter construction section 112, being integrally connected to described cladding section 111, described cladding section 111 molding is connected to described wiring board main body 121, is used for being coated with described component 122 described optical filter construction section 112 molding.Described optical filter construction section 112 is used for installing described optical filter 40.
That is, when described integral base assembly 10 is used for assembling described camera module, the described optical filter 40 of described camera module is installed in described optical filter construction section 112, described optical filter 40 is positioned on the photosensitive path of corresponding described sensitive chip 30, and need not provide extra optical filter 40 mounting bracket.That is, described base portion 11 has the function of traditional microscope base herein, but advantage based on integral packaging technique, described optical filter construction section 112 top can be by the technology mode of mold, make it have good planarization, so that described optical filter 40 is installed with being flattened, this point is also an advantage over traditional camera module.
Further, described optical filter construction section 112 forms a mounting groove 1121, described mounting groove 1121 is communicated in described through hole 1100, provides sufficient installing space for described optical filter 40 so that described optical filter 40 will not protrude from the top surface of optical filter construction section 112.It is to say, described base portion 11 upper end arranges described mounting groove 1121, thus each by the described base portion 11 that is installed on stable for described optical filter 40, and the top of described base portion 11 will not be protruded from.
It is worth mentioning that, in this embodiment of the present utility model, described mounting groove 1121 may be used for installing described optical filter 40, and in of the present utility model other are implemented, described mounting groove 1121 can be used to the parts such as motor or the camera lens of installing described camera module, those skilled in the art is it should be appreciated that the purposes of described mounting groove 1211 is not restriction of the present utility model.
In other words, described base portion 11 has described mounting groove 1121, and described mounting groove 1121 is communicated in described through hole 1100, in order to provide sufficient installing space for described optical filter 40.It is to say, the described top surface 1122 of described base portion 11 is in step-like structure, and it is not that one extends, each step of described top surface 1122 can be used for described optical filter 40, described camera lens 50 or described motor 60 are installed.
Further, the height of described mounting groove 1121 is more than the thickness of described optical filter 40, and during so that described optical filter 40 is installed in described mounting groove 1121, described optical filter 40 will not protrude from the top of described base portion 11.
Especially, according to this embodiment of the present utility model, described optical filter 40 is square, and the shape of described mounting groove 1121 adapts with the shape of described optical filter 40.It is to say, described mounting groove 1121 is in square annular, it is communicated in described through hole 1100.
It is worth mentioning that, in this embodiment of the present utility model, described mounting groove 1121 may be used for installing described optical filter 40, and in of the present utility model other are implemented, described mounting groove 1121 can be used to install the parts such as the motor 60 of described camera module or described camera lens 50, those skilled in the art is it should be appreciated that the purposes of described mounting groove 1121 is not restriction of the present utility model.
In this embodiment of the present utility model, described camera module includes a motor 60, such as voice coil motor, described camera lens 50 is installed in described motor 60, so that driving described camera lens 50 to move by described motor 60, regulate the focal length of described camera module, say, that, described camera module is a dynamic burnt module (Automatic Focus Model, AFM).
It will also be appreciated that, in this embodiment of the present utility model, accompanying drawing illustrates as a example by dynamic burnt module, and in other embodiments of the present utility model, described shooting can be one to focus module, those skilled in the art is it should be appreciated that the type of described camera module is not restriction of the present utility model.
Described motor 60 is installed in the described base portion 11 of described integral base assembly 10, further, described motor 60 is installed in the described top surface 1122 of described base portion 11, say, that described optical filter 40 and the mutually coordinated described top surface 1122 taking described base portion 11 of described motor 60.
Described camera lens 50 is installed in described motor 60, described motor 60 and described optical filter 40 are installed in described base portion 11, thus described base portion 11 is equivalent to the function of base of tradition camera module, there is provided, for described motor 60 and described optical filter 40, the position supporting, fixing, but manufacture, assembling and form are but different from tradition COB technique.The base of the camera module of traditional COB technique is fixed on wiring board in the way of bonding, and described base portion 11 is fixed on described wiring board main body 121 by the way of being molded into wiring board, need not the process of being adhesively fixed, molding mode has the controllability of more preferable connective stability and technical process relative to adhering fixed mode, planarization is higher, good mounting condition is provided for described motor 60 and described optical filter 40, and there is not the glue space that AA adjusts in described base portion 11 and described wiring board main body 121, therefore the headspace that tradition camera module AA adjusts is eliminated, the thickness making described camera module is reduced；On the other hand, described base portion 11 is coated with described component 122, make conventional base space and component 122 installing space can be spatially overlapping, need not as traditional camera module, reserved safe distance around circuit devcie, so that the described base portion 11 with base functions can be arranged on less size, thus further provide the space that camera module thickness can reduce.Additionally, described base portion 11 replaces traditional base, it is to avoid the heeling error that base brings when pasting and assembling, reduce the cumulative limit that described camera module assembles.
It will also be appreciated that, the shape of described base portion 11 can more it needs to be determined that, such as extend internally in described component 122 position, form a protuberance, thus increase the width of described base portion 11 correspondence, and there is no the position of described component 122, described disjunctor molded section as one man extends, form the shape of comparison rule, and width is less.Those skilled in the art is it should be appreciated that the concrete shape of described base portion 11 is not restriction of the present utility model.
According to this embodiment of the present utility model, described sensitive chip 30 can be energized by least one connecting line 31 and be connected to described wiring board main body 121, and can be energized and be connected to described connecting line 31 tunnel.Described connecting line 31 may be implemented as, citing ground but be not limited to, gold thread, copper cash, aluminum steel, silver wire.Especially, the described connecting line 31 of described sensitive chip 30 can be connected to described wiring board main body 121 by traditional COB mode, citing ground but be not limited to, the mode of welding.It is to say, described sensitive chip 30 and the connection of described wiring board main body 121 can make full use of existing ripe interconnection technique, to reduce the cost of improvement technology, traditional technique and equipment are made full use of, it is to avoid the wasting of resources.Certainly, those skilled in the art it should be appreciated that, described sensitive chip 30 can also be realized by the connected mode of other any utility model purpose of the present utility model being capable of with the connection of described wiring board main body 121, and this utility model is unrestricted in this regard.
It is noted that in this embodiment of this utility model, each described sensitive chip 30 is arranged at the upper surface of described wiring board main body 121, and described base portion 11 is around the outside of described sensitive chip 30.When manufacturing described integral base assembly 10, different manufacturing sequence can be selected, citing ground but be not limited to, in one embodiment, described sensitive chip 30 can be first installed in described wiring board main body 121, then outside described sensitive chip 30, the described wiring board main body 121 upper mold described base portion of moulding one-tenth 11, and the described component 122 that will protrude above described wiring board main body 121 is coated on inside it.And in another embodiment of the present utility model, can be first in the described wiring board main body 121 upper mold described base portion of moulding one-tenth 11, and the described component 122 that will protrude above described wiring board main body 121 is coated on inside it, then described sensitive chip 30 is installed on described wiring board main body 121 so that it is be positioned at the inner side of described base portion 11.
With reference to Fig. 5, being another embodiment of camera module according to first preferred embodiment of the present utility model, described camera module can be one to focus module (Fix Focus Model, FFM).In described camera module, described camera lens 50 is installed in the top surface 1122 of described base portion 11, and the focal length of the most described camera module cannot freely be adjusted.Described camera lens 50 and described optical filter 40 coordinate to configure the described top surface 1122 of described base portion 11, and described optical filter 40 is mounted described mounting groove 1121.Those skilled in the art is it should be appreciated that the type of described shooting molding is not restriction of the present utility model.
It is worth mentioning that, according to this preferred embodiment of the present utility model, described base portion 11 can be used to support installs described optical filter 40 and described camera lens 50, there is the function of conventional base, and based on the advantage molded, described base portion 11 can control planarization and the concordance of described base portion 11 by mould, thus provide smooth and consistent installation environment with described camera lens 50 for the described optical filter 40 of described camera module, thus it is easier to ensure that the concordance of the optical axis of camera lens 50 and optical filter 40 and sensitive chip 30, the camera module that this point is traditional is not readily reachable by.
With reference to Fig. 6 A, according to the camera module of second preferred embodiment of the present utility model, the described integral base assembly 10 of described camera module includes a motor attachment structure 13, for connecting the motor 60 of described camera module.Described motor 60 has at least one motor pin 61.Described motor attachment structure 13 includes at least one lead-in wire 131, and each described lead-in wire 131 is used for electrically connecting described motor 60 and described wiring board main body 121.Each described lead-in wire 131 is electrically connected to wiring board main body 121.Further, each described lead-in wire 131 is electrically connected to the connection circuit of described wiring board main body 121.Described lead-in wire 131 is arranged at described base portion 11, and extends to the top of described base portion 11.Described lead-in wire 131 includes that a motor connects end 1311, is revealed in the top of described base portion 11, for electrically connecting the described pin 61 of described motor 60.It is noted that described lead-in wire 131 can be arranged by embedding manner when forming described base portion 11.In traditional connected mode, such as driving the parts such as motor is all to be connected to wiring board by arranging single wire, manufacturing process is relative complex, and the mode burying described lead-in wire 131 when this molding of the present utility model underground can replace the technical processs such as traditional motor welding, and it is more stable that circuit is connected.Especially, in implementing of the present utility model one, described lead-in wire 131 is a wire, is embedded in described base portion 11 internal.Citing ground, described motor pin 61 can be connected to described motor by anisotropic conductive film and connect end 1311, it is also possible to is connected to described motor by the way of welding and connects end 1311.
It is worth mentioning that, the position that the burial place of described lead-in wire 131 and the described motor connection end 1311 of described lead-in wire 131 show in described base portion 11 can be arranged as required to, such as, in an embodiment of the present utility model, the described motor of described lead-in wire 131 connects end 1311 can be arranged at the periphery of described base portion 11, the top surface of the most described base portion 11, the top surface of described optical filter construction section 112, and in another embodiment of the present utility model, described motor connection end 1311 encloses in can being arranged at described base portion 11, described mounting groove 1121 bottom surface of the most described base portion 11, such that it is able to provide described motor 60 different installation site.In other words, when described motor 60 needs to install to described base portion top, described motor connects end 1311 and is arranged at described base portion periphery top surface, when described motor 60 needs to install to described mounting groove 1121, described motor connection end 1311 encloses in being arranged at described base portion 11, the most described mounting groove 1121 bottom surface.
That is, when manufacturing described integral base assembly 10, can first mount each described sensitive chip 30 to described wiring board main body 121, in described wiring board main body 121, in the way of MOB, then mold described base portion 11, and described lead-in wire 131 can be set inside described base portion 11 with embedding manner when molding, and make described lead-in wire 131 be electrically connected to described wiring board main body 121, and make the described motor connection end 1311 of described lead-in wire 131 be shown in the top of described base portion, in order to it is connected to the described motor pin 61 of described motor 60.Citing ground, when described integral base assembly 10 is used for assembling described shooting molding, the each described pin 61 of described motor 60 is connected to the described motor of described lead-in wire 131 by the way of welding and connects end 1311, so that described motor 60 is electrically connected to described wiring board main body 121, and needing, single wire is set described motor 60 and described wiring board main body 121 are connected, and the length of the described motor pin 61 of described motor 60 can be reduced.
It is an Equivalent embodiments of the described motor attachment structure according to above preferred embodiment of the present utility model with reference to Fig. 6 B.Described motor attachment structure 13 includes a pin groove 133, and described pin groove 133 is for accommodating the described motor pin 61 of the described motor 60 of described camera module.Described pin groove 133 is arranged at described base portion 11 upper end.Described motor attachment structure 13 includes that at least one lead-in wire 134 each described lead-in wires 134 are for electrically connecting described motor 60 and described wiring board main body 121.Described lead-in wire 134 is arranged at described base portion 11, and extends upwardly to the groove bottom wall of the described pin groove 133 of described base portion 11.Described lead-in wire 134 includes that a motor connects end 1341, is revealed in the groove bottom wall of the described pin groove 133 of described base portion 11, for electrically connecting the described motor pin 61 of described motor 60.Especially, in one embodiment, described motor connection end 1341 may be implemented as a pad.Described lead-in wire 134 may be implemented as a wire, is embedded in described base portion 11 internal.
That is, when manufacturing described integral base assembly 10, first mount described sensitive chip 30, then in described wiring board main body 122, described base portion 11 is molded in the way of MOB, and the described pin groove 133 of default predetermined length, and described lead-in wire 134 can be set with embedding manner when molding, and make described lead-in wire 134 be electrically connected to described wiring board main body 122, and make the described motor of described lead-in wire 134 connect the groove bottom wall that end 1341 is shown in the described pin groove 133 of described base portion 11, in order to it is connected to the described pin 61 of described motor 60.Citing ground, when described integral base assembly 10 is used for assembling described shooting molding, the each described motor pin 61 of described motor 60 inserts described pin groove 133, and the described motor being connected to described lead-in wire 134 by the way of welding connects end 1341, so that described motor 60 is electrically connected to described wiring board main body 122, and needing, single wire is set described motor 60 and described wiring board main body 122 are connected, and make can stably the connecting of described motor pin 61 of described motor 60, prevent from outside unwanted touching described motor pin 61.Especially, described lead-in wire 134 may be implemented as a wire, is embedded in described base portion 11 internal.
With reference to Fig. 6 C, it it is another Equivalent embodiments of motor attachment structure according to above preferred embodiment of the present utility model.Described motor attachment structure 13 includes a pin groove 135, and described pin groove 135 is for accommodating the described motor pin 61 of the described motor 60 of described camera module.Described pin groove 135 is arranged at described base portion 11.Described motor attachment structure 13 includes that at least one circuit junction 132, described circuit junction 132 default in described wiring board main body 122, and is electrically connected to the described connection line of 122 in described wiring board main body.Further, each described pin groove 135 is extended to described wiring board main body 122 by the top of described base portion 11, and described circuit junction 132 is shown.In a kind of way of example, described motor pin 61 is adapted for insertion into described pin groove 135, and can be welded to connect with described circuit junction 132.
That is, when manufacturing described integral base assembly 10, described wiring board main body 122 is preset each described circuit junction 132, and then mount 121, described photosensitive core, then in described wiring board main body 122, in the way of MOB, mold described base portion 11, and the described pin groove 135 of default predetermined length, and described circuit junction 132 is shown by described pin groove 135, in order to it is connected to the described motor pin 61 of described motor 60.Citing ground, when described integral base assembly 10 is used for assembling described shooting molding, the each described motor pin 61 of described motor 60 inserts described pin groove 135, and by the way of welding the described circuit junction 132 that is connected in wiring board main body 122, so that described motor 60 is electrically connected to described wiring board main body 122, and the described motor pin 61 of described motor 60 can stably be connected, prevent from outside unwanted touching described motor pin 61.
With reference to Fig. 6 D, it is according to above-mentioned another Equivalent embodiments being preferable to carry out inner motor attachment structure of the present utility model.Described motor attachment structure 13 includes an engraving circuit 136, and described engraving circuit 136 is for electrically connecting the parts such as described connection line, described sensitive chip 30 and motor in described wiring board main body 122.Citing ground but be not limited to, described engraving circuit 136 can by laser formation (LDS) by the way of formed described base portion 11 time setting.In traditional connected mode, such as driving the parts such as motor is all to be connected to wiring board by arranging single wire, manufacturing process is relative complex, and the mode arranging described engraving circuit 136 when this molding of the present utility model can replace the technical processs such as traditional motor welding, and it is more stable that circuit is connected.More specifically, the forming process of described engraving circuit 136 is it may be that presently described base portion 11 arranges engraving groove, then arranging circuit in the way of plating in described engraving groove.
In different embodiments of the present utility model, the described motor 60 of described camera module is connected to the mode of described integral base assembly 10 connected mode corresponding with Fig. 6 A, 6B, 6C and 6D can carry out free combination, select the mode that is suitable for connect described motor 60, use described pin groove 133 with go between 134, as described in pin groove 135 and as described in circuit junction 132.And in an embodiment of the present utility model, with reference to Fig. 2, described motor 60 can be connected to described integral base assembly 10 by the way of traditional, such as by the way of welding.Those skilled in the art is it should be appreciated that the connected mode of described motor 60 and described integral base assembly 10 is not this utility model restriction.
As it is shown in fig. 7, be the camera module according to the 3rd preferred embodiment of the present utility model and integral base assembly thereof.Unlike above preferred embodiment, described integral base assembly 10 includes wiring board main body 121A.In described wiring board main body 121A includes the described inner groovy 1211A that two inner groovy 1211A, each described sensitive chip 30 are arranged at correspondence.It is different from integral base assembly 10 in above-described embodiment, described sensitive chip 30 is set in described inner groovy 1211A, and described sensitive chip 30 is accommodated therein, described sensitive chip 30 is made will not substantially to protrude from the upper surface of described wiring board main body 121A, make the height reduction of the described the most described base portion of sensitive chip 30 11, thus reduce the described sensitive chip 30 limitation in height to described base portion 11, the probability reducing height further is provided, and described sensitive chip 30 is mounted in described inner groovy 1211A, described sensitive chip 30 can be protected, the most described connecting line 31, prevent external component from touching described sensitive chip 30 by mistake.
Further, described sensitive chip 30 is connected to described wiring board main body 121 by described connecting line 31, and is electrically connected to described connection line.Described lead-in wire may be implemented as, citing ground but be not limited to, gold thread, copper cash, aluminum steel, silver wire.It is to say, described sensitive chip 30 and described connecting line 31 are all located in the described inner groovy 1211A of described wiring board main body 121A.In one embodiment, when manufacturing described integral base assembly 10, need first in described wiring board main body 121A, to arrange described inner groovy 1211A.It is to say, open described inner groovy 1211A on traditional wiring board so that it is be suitable to accommodate and install described sensitive chip 30.
Fig. 8 is the camera module according to the 4th preferred embodiment of the present utility model and the cut-away view of integral base assembly thereof.
Being different from above preferred embodiment, described integral base assembly 10 includes that wiring board main body 121B, described wiring board main body 121B have a path 1212B, and the bottom of described path 1212B is suitable to install described sensitive chip 30.Described path 1212B makes the described upper and lower both sides of wiring board main body 121B be connected, thus when described sensitive chip 30 is installed on described wiring board main body 121B upward by the back side of described wiring board main body 121B and photosensitive area, the photosensitive area of described sensitive chip 30 is able to receive that the light entered by described camera lens 50.
Further, described wiring board master has external groove 1213B, and described external groove 1213B is communicated in the described path 1212B of correspondence, it is provided that the installation site of described sensitive chip 30.Especially, when described sensitive chip 30 is installed in described external groove 1213B, the outer surface of described sensitive chip 30 is consistent with the surface of described wiring board main body 121B, is generally aligned in the same plane, thus ensures the profile pattern of described integral base assembly 10.
It is to say, in this embodiment of the present utility model, described path 1212B is step-like, consequently facilitating install described sensitive chip 30, provide stable installation site for described sensitive chip 30, and make its photosensitive area represent in interior space.
It is noted that in this embodiment of the present utility model, it is provided that a kind of be different from traditional chip mounting means, i.e. flip-chip mode (Flip Chip, FC).Described sensitive chip 30 is installed on described wiring board main body 121B from the direction, the back side of described wiring board main body 121B, rather than as above-described embodiment needs the front from described wiring board main body 121B, i.e., from the top of described wiring board main body 121B, and the photosensitive area of described sensitive chip 30 is installed on described wiring board main body 121B upward.Such structure and mounting means, make described sensitive chip 30 and described base portion 11 relatively independent, the installation of described sensitive chip 30 will not be affected by described base portion 11, and the molded impact on described sensitive chip 30 of described base portion 11 is the least.In addition, described sensitive chip 30 is embedded in the lateral surface of described wiring board main body 121B, and the medial surface of described wiring board main body 121B will not be protruded from, so that reserve bigger space inside described wiring board main body 121B, the height making described base portion 11 will not be by the limitation in height of described sensitive chip 30 so that described base portion 11 can reach less height.
It is noted that in other embodiments of the present utility model, described optical filter 40 is installed in the upper end of described path 1212B, that is, need not described optical filter 40 is installed on described base portion 11, thus reduce the back focal length of described camera module, reduce the height of described shooting.Especially, described optical filter 40 can be carried out example is cutoff filter IRCF.
Fig. 9 is the camera module according to the 5th preferred embodiment of the present utility model and the cut-away view of integral base assembly thereof.
Described integral base assembly 10 includes a back-up coat 123C, is connected to described wiring board main body 121 bottom, in order to strengthen the structural strength of described wiring board main body 121 described back-up coat 123C lamination.That is, in described wiring board main body 121, the region bottom at described base portion 11 and described sensitive chip 30 place mounts described back-up coat 123C, so that described wiring board main body 121 reliablely and stablely supports described base portion 11 and described sensitive chip 30.
Further, described back-up coat 123C is a metallic plate, and described metallic plate is attached at the bottom of described wiring board main body 121, increase the structural strength of described wiring board main body 121, on the other hand, increase the heat dispersion of described integral base assembly, the heat that the described sensitive chip 30 that can effectively scatter and disappear sends.
It is worth mentioning that, described wiring board main body 121 can use FPC (Flex Print Circuit, flexible printed-circuit board), and by the rigidity of FPC described in described back-up coat 123C so that the FPC with excellent bending performance disclosure satisfy that the bearing requirements of described integral base assembly.It is to say, the selectable range of described wiring board main body 121 is more extensive, such as PCB (Printed Circuit Board, rigid printed circuit boards), FPC, RG (Rigid Flex, Rigid Flex).Increase the structural strength of described wiring board main body 121 by described back-up coat 123B and improve heat dispersion, such that it is able to reduce the thickness of described wiring board main body 121, the height making described integral base assembly reduces further, and the height being assembled the camera module obtained by it reduces.
Figure 10 is the camera module according to the 6th preferred embodiment of the present utility model and the cut-away view of integral base assembly thereof.
Being different from above preferred embodiment, described wiring board main body 121D has at least one reinforced hole 1214D, and described base portion 11 extends in described reinforced hole 1214D, thus strengthens the structural strength of described wiring board main body 121D.
The position of described reinforced hole 1214D can select as required, and arranges according to the structural strength demand of described wiring board, structure the most symmetrically.Setting by described reinforced hole 1214D makes the structural strength of described wiring board main body 121D strengthen, such that it is able to reduce the thickness of described wiring board main body 121D, reduce the thickness of the camera module assembled by it, and improve the heat dispersion of described integral base assembly.
It is noted that described reinforced hole 1214D is groove-like, thus when manufacturing described integral base assembly, the moulding material of described base portion 11 will not be spilt by described reinforced hole 1214D.
Figure 11 is the camera module according to the 7th preferred embodiment of the present utility model and the cut-away view of integral base assembly thereof.
Being different from above preferred embodiment, described wiring board main body 121E has at least one reinforced hole 1214E, and described base portion 11 extends in described reinforced hole 1214E, thus strengthens the structural strength of described wiring board main body 121E.
The position of described reinforced hole 1214E can select as required, and arranges according to the structural strength demand of described wiring board, structure the most symmetrically.Setting by described reinforced hole 1214E makes the structural strength of described wiring board main body 121E strengthen, such that it is able to reduce the thickness of described wiring board main body 121E, reduce the thickness of the camera module assembled by it, and improve the heat dispersion of described integral base assembly.
It is worth mentioning that, described reinforced hole 1214E is perforation, that is, through described wiring board main body 121E so that the both sides connection of described wiring board main body 121E, thus when manufacturing described integral base assembly, the moulding material of described base portion 11 is combined with described wiring board main body 121E fully, forming more firm composite structure, and the structure of the most described groove-like, described perforation is easier to processing and manufacturing.
Figure 12 is the camera module according to the 8th preferred embodiment of the present utility model and the cut-away view of integral base assembly thereof.
Be different from above preferred embodiment is, described base portion 11F includes cladding section 111F, an optical filter construction section 112F and a camera lens construction section 113F, described optical filter construction section 112F and described camera lens construction section 113F molds the most integratedly and is connected to described cladding section 111F, described cladding section 111F molding is connected to described wiring board main body 121, is used for being coated with described component 122 and described connecting line 31.Described optical filter construction section 112F is used for installing described optical filter 40, that is, when described integral base assembly is used for assembling described camera module, the optical filter 40 of described camera module is installed in described optical filter construction section 112F, described optical filter 40 is positioned on the photosensitive path of described sensitive chip 30, and need not provide extra optical filter 40 mounting bracket.That is, described base portion 11F has the function of conventional stent herein, but advantage based on integral packaging technique, described optical filter construction section 112F top can be by the technology mode of mold, make it have good planarization, so that described optical filter 40 is entirely mounted, this point is also an advantage over traditional camera module.Described camera lens construction section 113F is used for installing described camera lens 50, that is, when described integral base assembly is used for assembling described camera module, described camera lens 50 is installed in inside the described camera lens construction section 11F3 of described base portion 11F, in order to provide stable installation site for described camera lens 50.
Further, described optical filter construction section 112F has two mounting groove 1121F, described mounting groove 1121F and is communicated in the described through hole 1100F of correspondence, provides sufficient installing space for each described optical filter 40 so that each described optical filter 40 is stable to be installed.Described camera lens construction section 113F has two camera lens mounting groove 11211F, each described camera lens mounting groove 11211F and is communicated in the described through hole 1100F of correspondence, and the most each described camera lens 50 provides sufficient installing space.
In other words, described optical filter construction section 112F and described camera lens construction section 113F upwardly extends integratedly, and it is internally formed step-like structure, it is respectively described optical filter 40 and described camera lens 50 provides and supports fixed position, from without providing extra parts to install described optical filter 40 and described camera lens 50.
Described camera lens construction section 113F has two camera lens inwall 1132F, and each described camera lens inwall 1132F is respectively in closed annular, and being suitable to camera lens 50 provides installing space.It is noted that each described camera lens inwall 1132F surfacing of described camera lens construction section 1132F, thus be suitable to install threadless described camera lens 50, formed and focus module.Especially, described camera lens 50 can be fixed on described camera lens construction section 113F by the way of bonding.
With reference to Figure 13, it is the integral base assembly according to the 9th preferred embodiment of the present utility model and camera module.Be different from above preferred embodiment is, described integral base assembly 10 includes a screen layer 126, described screen layer 126 wraps up described wiring board main body 122 and described base portion 11, thus while strengthening the structural strength of described wiring board main body 122, strengthen the anti-electromagnetic interference capability of described integral base assembly 10.
With reference to Figure 14, according to camera module and the integral base assembly thereof of the of the present utility model ten preferred embodiment.Being different from above preferred embodiment, described camera module includes at least one bearing 70G, is used for installing each described optical filter 40, each described camera lens 50 or each described motor 60.According to this embodiment of the present utility model, described bearing 70G is installed in described base portion 11, and each described optical filter 40 is installed in described bearing 70G, and each described motor 60 is installed in described bearing 70G.The concrete shape of described bearing 70G can be arranged as required to, and such as arranges boss, in order to installs each described optical filter.
According to this embodiment of the present utility model, described bearing 70G has one first seat slot 71G and one second seat slot 72G, described first seat slot 71G is used for installing described optical filter 40 so that the surface of described optical filter 40 will not protrude from the top of described bearing 70.Described second seat slot 72G, is used for being installed on described base portion 11, so that described base portion 11 upwardly extends along described bearing 70G, and the positional of described optical filter 40 is to downwards, thus reduces the back focal length of described camera module.
In other words, described bearing 70G extends in described through hole 1100, and downwardly extends, thus described optical filter 40 is supported in above described sensitive chip 30, and utilizing the space in described through hole 1100 so that while optical filter 40 is stably installed, described optical filter 40 will not take space outerpace.
It is worth mentioning that, the distance that described bearing 70G extends internally is positioned at outside the photosensitive area of described sensitive chip 30, that is, described bearing 70G will not block the described photosensitive area of described sensitive chip 30, to avoid affecting the photo-process of described sensitive chip 30, the size of described bearing 70G can design with real needs.
In this embodiment of the present utility model and respective drawings, illustrating as a example by dynamic burnt module, described camera lens 50 is by by being installed on described motor 60, and described motor 60 is installed in described bearing 70G.It is to say, described bearing 70G provides installation site for described optical filter 40 and described motor 60.And in these other embodiments of the present utility model, described camera module can also is that one focuses module.Described camera lens 50 is installed in described bearing 70G, that is, described bearing 70G provides installation site for described optical filter 40 and described camera lens 50, those skilled in the art is it should be appreciated that the type of the concrete structure of described bearing 70 and described camera module is not restriction of the present utility model.
With reference to Figure 15, according to another embodiment of the camera module of the of the present utility model ten preferred embodiment.Being different from above preferred embodiment, described camera module includes that a bearing 70H, described bearing 70H are used for installing described optical filter 40.Described bearing 70H is installed in described encapsulation part 11, and described optical filter 40 is installed in described encapsulation part 11, and described motor 60 or described camera lens 50 are installed in described encapsulation part 11.
Further, described bearing 70H is installed in the described mounting groove 1121 of described encapsulation part 11, and the setting height(from bottom) that the height of described mounting groove 1121 is more than described bearing 70H, so that described bearing 70H will not protrude from the top of described encapsulation part 11.
According to this embodiment of the present utility model, described bearing 70H has one first seat slot 71H and one second seat slot H, described first seat slot 71H is used for installing described optical filter 40 so that the surface of described optical filter 40 will not protrude from the top of described bearing 70H.Described second seat slot 72H, is used for being installed on described encapsulation part 11, so that described encapsulation part 11 upwardly extends along described bearing 70H, and the positional of described optical filter 40 is to downwards, thus reduces the back focal length of described camera module.
In other words, described bearing 70H extends in described through hole 1100, and downwardly extends, thus described optical filter 40 is supported in above described sensitive chip 30, and utilizing the space in described through hole 1100 so that while optical filter 40 is stably installed, described optical filter 40 will not take space outerpace.
It is worth mentioning that, the distance that described bearing 70H extends internally is positioned at outside the photosensitive area of described sensitive chip 30, that is, described bearing 70H will not block described sensitive chip 30, to avoid affecting the photo-process of described sensitive chip 30, the size of described bearing 70C can design with real needs.
Being different from above preferred embodiment, the described mounting groove 1121 of described second seat slot 71H and described base portion 11 cooperates, and forms the interface arrangment of coupling, so that being installed in described mounting groove 1121 of being stabilized of described bearing 70H.Relative 3rd preferred embodiment, the described optical filter 40 in this embodiment is less apart from described sensitive chip 30, it is possible to obtain have the described camera module of less back focal length.
In this embodiment of the present utility model and respective drawings, illustrating as a example by dynamic burnt module, described camera lens 50 is by by being installed on described motor 60, and described motor 60 is installed in described bearing 70H.It is to say, described bearing 70H provides installation site for described optical filter 40 and described motor 60.And in these other embodiments of the present utility model, described camera module can also is that one focuses module.Described camera lens 50 is installed in described bearing 70H, that is, described bearing 70H provides installation site for described optical filter 40 and described camera lens 50, those skilled in the art is it should be appreciated that the type of the concrete structure of described bearing 70H and described camera module is not restriction of the present utility model.
Figure 16 is that the shooting based on integral packaging technique according to above preferred embodiment of the present utility model compares schematic diagram with tradition camera module structural strength.Being tradition camera module on the left of Figure 16, right side is according to camera module based on integral packaging technique of the present utility model.Represent the thickness of the described microscope base 3P of tradition camera module with a1, a2 represents the thickness of the described base portion 11 of camera module of the present utility model.
Described in tradition camera module, microscope base 3P is used for installing the plastic components that described optical filter 4P, described motor 5P or described camera lens 6P, and described microscope base 3P are formed typically by the mode being molded.In tradition camera module, described microscope base 3P is usually installed in the outside of described circuit devcie 11P, therefore in the case of the lateral dimension not increasing described wiring board main body, the installing space reserved for described microscope base 3P is limited, the thickness a1 of described microscope base 3P also can only be limited in less scope, such as 0.3mm, at this moment, described microscope base 3P and described wiring board 1P to be mutually bonded area less, therefore connective stability is poor, it is to say, at life-time service or when having stronger External Force Acting, the easy and described wiring board 1P of described microscope base 3P is separated from each other or crackle occurs.
And according to the camera module based on integral packaging technique of preferred embodiment of the present utility model, described base portion 11 integral packaging is in described wiring board main body 121, wiring board main body as described in be packaged in by the way of molding (Molding), and cover described component 122, the most described base portion 11 relative to described microscope base 3P have bigger can installation space, and to the internal extension of described wiring board main body 121, thus without the Outside Dimensions extending described wiring board main body.According to this embodiment of the present utility model, described base portion 11 can reach bigger thickness a2, such as 0.6mm.Described base portion 11 has more preferable stability of strutting system, and by the way of integral packaging, described base portion 11 is more firmly connected to described wiring board main body 121 so that described camera module is more reliable and more stable during using.On the other hand, described base portion 11 integral packaging, in the mode of described wiring board main body 121, adds the structural strength of wiring board main body 121 described in connecting portion, and described base portion 11 plays the effect protecting described wiring board main body 121.
Figure 17 is that the camera module based on integral packaging technique according to above preferred embodiment of the present utility model compares schematic diagram with the lateral dimension of tradition camera module.Being tradition camera module on the left of Figure 17, right side is according to camera module based on integral packaging technique of the present utility model.Represent the lateral cross-sectional dimension of tradition camera module with b1, represent the lateral cross-sectional dimension of camera module based on integral packaging technique of the present utility model with b2.
Described in camera module in tradition COB technique, microscope base 3P is installed in the outside of described circuit devcie 11P, described microscope base 3P and described circuit devcie 11P is separate on installing space, it is required for occupying certain space, and in order to protect described circuit devcie 11P, reserved certain safe distance is needed around described circuit devcie 11P, safe distance such as reserved 0.35mm, these factors all make the lateral dimension b1 of described camera module bigger, the probability that lateral dimension reduces is less, it is impossible to meet demand undersized for camera module.
And according to camera module based on integral packaging technique of the present utility model, described base portion 11 1 is packaged in described wiring board main body 121, and described base portion 11 is coated with described component 122, the most described base portion 11 is on the basis of the requirement meeting fundamental strength, have only to less size be coated with by described component 122, such as 0.15mm, described base portion 11 and described component 122 are overlapped, making full use of installing space, the transverse dimension B 2 of the most described camera module is reduced.Especially, according to an embodiment of the present utility model, the lateral dimension b2 of described camera module based on integral packaging technique can reach little 0.2mm more monolateral than the lateral dimension b1 of traditional camera module.
Figure 18 is the aspect ratio relatively schematic diagram of the camera module based on integral packaging technique according to this utility model above preferred embodiment and tradition camera module.Being tradition camera module on the left of Figure 18, right side is according to camera module based on integral packaging technique of the present utility model.The height of tradition camera module is represented with c1, the height of camera module based on integral packaging technique of the present utility model is represented with c2, represent the thickness of the described wiring board 1P of tradition camera module with d1, represent the thickness of the described wiring board main body 121 of camera module based on integral packaging technique of the present utility model with d2.The described microscope base 3P of tradition camera module is by being adhered to described wiring board 1P, and adjusting requirement to meet AA, resin added is relatively big, and glue layer is thicker, and above described circuit devcie 11P, it is also required to reserved mounting distance, hence in so that the height c1 of described camera module is bigger.On the other hand, described microscope base 3P is positioned at outside described circuit devcie 11P, horizontal span is bigger, the most described wiring board 1P requires have higher intensity to ensure the shape of described camera module, thus it requires the thickness d 1 of described wiring board 1P is relatively big, this also makes the whole height d1 of described camera module bigger.
And according to camera module based on integral packaging technique of the present utility model, wherein said pedestal 11 integral packaging is in described wiring board main body 121, need not glue bonding space, and need not reserved AA adjustment space, and be not necessary for described component 122 and reserve safe distance, therefore described height c2 based on integral packaging technique camera module is reduced.On the other hand, described base portion 11 is coated with described component 122, described base portion 11 can be extended internally, reduce the horizontal span in the middle of described base portion 11, the deformation quantity of equal wiring board is less, therefore the requirement of strength to described wiring board main body 121 is reduced, and described base portion 11 can strengthen the structural strength of described wiring board main body 121, so that the thickness d 2 of described wiring board main body 121 can reduce, so that the whole height c1 of described camera module based on integral packaging technique reduces further.
Figure 19 is the flatness schematic diagram of the camera module based on integral packaging technique according to above preferred embodiment of the present utility model.
The described microscope base 3P of tradition camera module manufactures by the way of injection, and is assembled in described camera module by the way of bonding, the most described camera module easily occur, the phenomenon such as eccentric.And the surface smoothness of described microscope base 3P is poor, it is impossible to provide smooth mounting condition for parts such as optical filter, motor or camera lenses.
And according to camera module based on integral packaging technique of the present utility model, described base portion 11 is connected to described wiring board main body 121 by integral packaging mode, molding be connected to as described in wiring board main body 121.Further, manufacturing described integral base assembly it is, bronze drum on a rare occasion molding die 1 forms described base portion, the profile pattern of described base portion 11 is ensured by described molding die 1, and make the top surface 1122 of described base portion 11 consistent with the surface, adhesion zone 1215 of described sensitive chip, for described optical filter 40, described camera lens 50 or described motor 60 by smooth mounting condition, and make the optical axis of described sensitive chip 30, described optical filter 40, described camera lens 50 and described motor 60 consistent.
Figure 20 is that the camera module based on integral packaging technique according to above preferred embodiment of the present utility model compares schematic diagram with the image quality of tradition camera module.Being tradition camera module on the left of Figure 20, right side is according to camera module based on integral packaging technique of the present utility model.The described circuit devcie 11P of tradition camera module is exposed in the enclosed environment being interconnected with described sensitive chip 2P, and when assembling described camera module, some dusts would generally be adhered on described circuit devcie 11P, the such as solder resist when welding described motor, and these dusts are more difficult to remove, remain in described circuit devcie 11P surface, after described camera module is packed, dust can move freely, and when dust falls described sensitive chip, during the photosensitive area of the most described sensitive chip, described camera module arises that pitch-black point, hence in so that the image quality of described camera module is poor.
And according to camera module based on integral packaging technique of the present utility model, described component 122 is coated with by described base portion, it is not exposed in the environment identical with described sensitive chip 30, even if therefore there is the dust of residual at described component 11P, such as solder resist, also will not fall described sensitive chip after the encapsulation of described camera module, therefore can ensure that the stability of the image quality of described camera module, pitch-black point will not occur after packaging.
Figure 21 A and 21B is that the camera module based on integral packaging technique according to above preferred embodiment of the present utility model compares schematic diagram with tradition camera module manufacture process.
The assembling manufacture process of tradition camera module is typically: manufacture described microscope base 3P by the way of injection；Cutting monoblock wiring board, is adhered to single described wiring board 1P by described microscope base 3P；Then described chip is attached at described wiring board 1P；And then the parts such as optical filter 4P, described camera lens 6P or described motor 5P are installed on described microscope base 3P, thus it are assembled into and focus module or dynamic burnt module.In this manufactures assembling process, described microscope base 3P completes by the way of injection, once can only manufacture small amount, such as 4 to 8, then single described microscope base 3P is adhered to independent described wiring board 1P respectively, these make the manufacture of described camera module inefficient, and the more difficult control of concordance between each module.
And be typically according to the assembling manufacture process of camera module based on integral packaging technique of the present utility model: by the way of molding on layout wiring board 2 the most one-body molded multiple described base portion 11；Then described layout is split, described layout is divided into multiple single described integral base assembly；And then on described integral base assembly, mount described sensitive chip 30, then described optical filter 40, described camera lens 50 or described motor 60 are installed described base portion, thus is assembled into dynamic burnt module or focuses module.This process is different from traditional assembling mode, the production efficiency of the described camera module that the mode of layout operation is greatly improved, and is easier to ensure that the concordance between multiple module.Such as, during layout operation, can be with the described integral base assembly of one-shot forming 90.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as citing and is not limiting as this utility model.The purpose of this utility model is completely and be effectively realized.Function of the present utility model and structural principle are shown the most in an embodiment and illustrate, without departing under described principle, embodiment of the present utility model can have any deformation or amendment.

Claims (20)

1. the integral base assembly of a camera module based on integral packaging technique, it is characterised in that including a: base portion and a wiring board portion；Wherein said base portion is attached directly to described wiring board portion, and is suitable to neighbour outside a sensitive chip of described camera module, thus extends the thickness of described base portion so that described base portion and described line part have higher connectivity robustness.
Integral base assembly the most according to claim 1, wherein said base portion forms a through hole, relative with described sensitive chip, in order to provide photosensitive path for described sensitive chip.
Integral base assembly the most according to claim 2, wherein said base portion has a mounting groove, is communicated in described through hole.
Integral base assembly the most according to claim 2, wherein said wiring board portion includes a wiring board main body, and described base portion is shaped in described wiring board main body, and described sensitive chip is suitable to be mounted on described wiring board main body.
Integral base assembly the most according to claim 4, wherein said wiring board portion includes that wiring board portion described in includes that a back-up coat, described back-up coat lamination are arranged at described wiring board bottom part body, to strengthen the structural strength of described wiring board main body.
Integral base assembly the most according to claim 5, wherein said back-up coat is metallic plate, to strengthen the heat dispersion in described wiring board portion.
Integral base assembly the most according to claim 4, wherein said wiring board portion includes a screen layer, and described screen layer wraps up described wiring board main body and described base portion, to strengthen the electromagnetism interference performance of described circuit board module.
Integral base assembly the most according to claim 7, wherein said screen layer is metallic plate or wire netting.
Integral base assembly the most according to claim 4, wherein said wiring board main body has at least one reinforced hole, and described base portion extends into described reinforced hole, in order to strengthen the structural strength of described wiring board main body.
Integral base assembly the most according to claim 9, wherein said reinforced hole is groove-like.
11. integral base assemblies according to claim 9, wherein said reinforced hole is through hole, so that the moulding material of described base portion is fully contacted with described wiring board main body and easily fabricated.
12. according to described integral base assembly arbitrary in claim 2 to 11, wherein said wiring board portion includes one at least one component, described component protrudes from described wiring board main body, described base portion is coated with each described component, so that described component will not be directly exposed to outside.
13. integral base assemblies according to claim 12, wherein said integral base assembly includes a motor attachment structure, described motor attachment structure includes at least one lead-in wire and at least one pin groove, described lead-in wire is arranged at described base portion, and it is electrically connected to described wiring board main body, described pin groove is arranged at described base portion upper end, described lead-in wire includes that a motor connects end, described motor connects end and is revealed in the groove bottom wall of described pin groove, in order to a motor pin is electrically connected to described motor and connects end when being plugged in described pin groove.
14. integral base assemblies according to claim 12, wherein said integral base assembly includes a motor attachment structure, described motor attachment structure includes at least one pin groove and at least one circuit junction, described circuit junction is electrically connected to described wiring board main body, described pin groove is arranged at described base portion, the top of described base portion is extended to by described wiring board main body, and described circuit junction is revealed in described pin groove, in order to a motor pin is electrically connected to described circuit junction when being plugged in described pin groove.
15. integral base assemblies according to claim 12, wherein said integral base assembly includes a motor attachment structure, described motor attachment structure includes at least one engraving circuit, described engraving circuit is arranged at described base portion, it is electrically connected to described wiring board main body, in order to electrically connect a motor pin.
16. integral base assemblies according to claim 15, wherein said engraving circuit is arranged at described base portion in the way of laser formation.
17. integral base assemblies according to claim 12, wherein said wiring board main body has a path, is suitable to described sensitive chip and is installed on described wiring board main body from direction, the described wiring board main body back side.
18. integral base assemblies according to claim 17, wherein said path is step-like, in order to stably sensitive chip described in upside-down mounting.
19. integral base assemblies according to claim 12, the material of wherein said wiring board main body can be selected from combination: Rigid Flex, ceramic substrate, PCB hardboard or FPC.
20. integral base assemblies according to claim 12, the material of wherein said base portion is selected from combination: the one in epoxy resin, nylon, LCP or PP.
CN201620422525.9U 2016-02-18 2016-05-11 The integral base assembly of camera module based on integral packaging technique Active CN205792880U (en)

Priority Applications (23)

Application Number Priority Date Filing Date Title
CN201620422525.9U CN205792880U (en) 2016-05-11 2016-05-11 The integral base assembly of camera module based on integral packaging technique
JP2018543321A JP6829259B2 (en) 2016-02-18 2016-07-28 Integrated packaging process-based camera module, its integrated base parts, and how to manufacture them
KR1020187026982A KR102282687B1 (en) 2016-02-18 2016-07-28 Camera module based on integrated packaging process, integrated base part thereof, and manufacturing method thereof
EP16890320.1A EP3419275A4 (en) 2016-02-18 2016-07-28 Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor
KR1020217023290A KR102465474B1 (en) 2016-02-18 2016-07-28 Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor
US15/999,858 US11877044B2 (en) 2016-02-18 2016-07-28 Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof
PCT/CN2016/092020 WO2017140092A1 (en) 2016-02-18 2016-07-28 Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor
JP2018555482A JP6952052B2 (en) 2016-04-21 2016-11-18 Camera modules and array camera modules based on integrated packaging technology
US15/512,065 US10477088B2 (en) 2016-04-21 2016-11-18 Camera module and array camera module based on integral packaging technology
PCT/CN2016/106402 WO2017181668A1 (en) 2016-04-21 2016-11-18 Camera module and array camera module based on integration packaging process
KR1020187033639A KR102152517B1 (en) 2016-04-21 2016-11-18 Camera module and array camera module based on integrated packaging process
TW106204229U TWM561225U (en) 2016-04-01 2017-03-26 Integral packaging process-based camera module and integral base component of same
TW108100066A TWI743429B (en) 2016-04-01 2017-03-26 Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof
TW108100078A TWI708987B (en) 2016-04-01 2017-03-26 Camera module based on integrated packaging process and integrated base assembly and manufacturing method thereof
TW106110049A TWI648587B (en) 2016-04-01 2017-03-26 Camera module based on integrated packaging process and integrated base assembly and manufacturing
US15/627,418 US10110791B2 (en) 2016-04-21 2017-06-19 Camera module and array camera module based on integral packaging technology
US15/627,425 US9900487B2 (en) 2016-04-21 2017-06-19 Camera module and array camera module based on integral packaging technology
US15/627,408 US10129452B2 (en) 2016-04-21 2017-06-19 Camera module and array camera module based on integral packaging technology
US15/627,437 US10194064B2 (en) 2016-04-21 2017-06-19 Array camera module based on integral packaging technology
US15/627,429 US9848109B2 (en) 2016-04-21 2017-06-19 Camera module and array camera module based on integral packaging technology
US16/575,357 US11533416B2 (en) 2016-04-21 2019-09-18 Camera module and array camera module based on integral packaging technology
JP2021007710A JP2021073520A (en) 2016-02-18 2021-01-21 Integral package process base camera module, integral base component thereof, and manufacturing method thereof
US17/833,025 US20220303441A1 (en) 2016-04-21 2022-06-06 Camera module and array camera module based on integral packaging technology

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CN107404606A (en) * 2017-05-06 2017-11-28 南昌欧菲光电技术有限公司 Camera module
CN108810340A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810339A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810342A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810338A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
GB2563193A (en) * 2017-03-23 2018-12-12 Cambridge Mechatronics Ltd IR filter flange
CN109040621A (en) * 2018-09-20 2018-12-18 武汉高德智感科技有限公司 A kind of infrared mould group with reinforcement heat sinking function
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TWI672552B (en) * 2017-12-13 2019-09-21 鴻海精密工業股份有限公司 Lens module
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GB2563193A (en) * 2017-03-23 2018-12-12 Cambridge Mechatronics Ltd IR filter flange
GB2563193B (en) * 2017-03-23 2020-01-01 Cambridge Mechatronics Ltd IR filter flange
CN108810342A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN107404606A (en) * 2017-05-06 2017-11-28 南昌欧菲光电技术有限公司 Camera module
CN108810338A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810341A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810339A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810340A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810340B (en) * 2017-05-06 2021-10-08 南昌欧菲光电技术有限公司 Camera module and photosensitive assembly thereof
CN109862213A (en) * 2017-11-30 2019-06-07 宁波舜宇光电信息有限公司 A kind of circuit board module and camera module
CN109862213B (en) * 2017-11-30 2020-11-27 宁波舜宇光电信息有限公司 Circuit board assembly and camera module
TWI672552B (en) * 2017-12-13 2019-09-21 鴻海精密工業股份有限公司 Lens module
CN109040621A (en) * 2018-09-20 2018-12-18 武汉高德智感科技有限公司 A kind of infrared mould group with reinforcement heat sinking function
WO2023082743A1 (en) * 2021-11-12 2023-05-19 华为技术有限公司 Circuit board reinforcing structure, photosensitive device, and terminal

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