TWI743429B - Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof - Google Patents

Abstract

A camera module based on an integrated packaging process and an integrated base assembly and manufacturing method thereof, wherein the camera module includes: at least one lens, at least one photosensitive chip, at least one filter, and at least one integrated base assembly; wherein The integrated base assembly includes a base portion and a circuit board portion, the base portion is integrally packaged on the circuit board portion, the photosensitive chip is mounted on the circuit board portion, and the base portion forms At least one through hole provides a light path for the photosensitive chip, and the lens is located in the light path of the photosensitive chip.

Description

Camera module based on integrated packaging process and integrated base assembly and manufacturing thereof method

The invention provides a camera module based on an integrated packaging process, an integrated base assembly and a manufacturing method thereof, and particularly relates to a camera module based on an integrated packaging process, an integrated base assembly and a manufacturing method thereof.

The COB (Chip on Board) process is an extremely important process in the assembly and manufacturing process of the camera module. The structure of the camera module of the traditional COB process is the assembly of circuit boards, photosensitive chips, lens holders, motor drives, lenses and other components.

As shown in Figure 1, it is a schematic diagram of a camera module manufactured by a traditional COB process. The camera module includes a circuit board 1P, a photosensitive chip 2P, a bracket 3P, a filter 4P, a motor 5P, and a lens 6P. The photosensitive chip 2P is mounted on the circuit board 1P, the filter 4P is mounted on the bracket 3P, the lens 6P is mounted on the motor 5P, and the motor 5P is mounted on the bracket 3P so that the lens 6P is located Above the photosensitive wafer 2P.

It is worth mentioning that some circuit components 11P, such as resistors and capacitors, are usually installed on the circuit board 1P. These circuit components 11P protrude from the surface of the circuit board 1P, and the bracket 3P needs to be installed on the circuit board 1P. On the circuit board 1P with the circuit device 11P, while in the traditional COB process The assembling relationship between the circuit board 1P, the circuit device 11P, and the bracket 3P has some unfavorable factors, and to a certain extent limits the development of the camera module to be lighter and thinner.

Specifically, first, the circuit device 11P is directly exposed on the surface of the circuit board 1P. Therefore, in the subsequent assembly process, such as pasting the bracket 3P, welding the motor 5P, etc., it will inevitably be affected. The solder resist, dust, etc. easily adhere to the circuit device 11P, and the circuit device 11P and the photosensitive chip 2P are located in a space that communicates with each other. Therefore, dust and contaminants can easily affect the photosensitive chip 2P. Such influence may cause post-assembly. The camera module has black spots and other undesirable phenomena, which reduces the product yield.

Secondly, the bracket 3P is located on the outside of the circuit device 11P, so when installing the lens holder and the circuit board 1P, a certain safety distance needs to be reserved between the bracket 3P and the circuit device 11P, and in the horizontal direction and A safe distance needs to be reserved in the upward direction, which increases the demand for the thickness of the camera module to a certain extent, making it difficult to reduce the thickness.

Third, during the COB assembly process, the bracket 3P is pasted to the circuit board 1P through glue and other pastes. The AA (Active Arrangement) process is usually performed when pasting, which is to adjust the bracket 3P and the circuit board. 1P and the central axis of the motor 5P to make it consistent with the horizontal and vertical directions. Therefore, in order to meet the AA process, it is necessary to pre-determine between the bracket 3P and the circuit board 1P, as well as the lens holder and the motor 5P. Set up more glue to leave room for adjustment. On the one hand, this requirement increases the thickness of the camera module to a certain extent, making it difficult to reduce the thickness. On the other hand, multiple pasting and assembly processes are required. It is easy to cause inconsistent assembly tilt, and the flatness of the lens holder 3P, the circuit board 1P, and the motor 5P is required to be high.

In addition, in the traditional COB process, the circuit board 1P provides the most basic fixing and supporting carrier. Therefore, the circuit board 1P itself is required to have a certain structural strength. This requirement makes the circuit board 1P have a larger thickness, thereby On the other hand, the thickness requirement of the camera module is pre-added.

With the development of various electronic products and smart devices, camera modules are becoming more and more high-performance, lighter and thinner. In the face of various high-performance development requirements such as high pixels and high imaging quality, electronic components in circuits More and more, the area of the chip is getting bigger and bigger, and the passive components such as driving resistors and capacitors are increasing accordingly. This makes the specifications of electronic devices bigger and bigger, the difficulty of assembly is increasing, and the overall size of the camera module is getting bigger and bigger. From the above point of view, the traditional assembly methods of lens holders, circuit boards, and circuit components are also a great limitation to the development of light and thin camera modules to a certain extent.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the circuit board assembly includes a molded part and a circuit board part, and the molded part is molded In the circuit board section.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the molded circuit board assembly includes at least one circuit element, and the circuit element is wrapped in the circuit board assembly Inside, it will not be directly exposed to the external environment.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the circuit element is integrally wrapped in the molded circuit board assembly by molding.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the molded circuit board assembly includes a molded part and a circuit board The molded part is molded on the circuit board part, and the circuit element provided on the circuit part is molded and wrapped.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the circuit board portion includes a circuit board main body and a photosensitive chip, and the chip is arranged on the circuit board On the inner surface, the molded part surrounds the outside of the photosensitive wafer.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the circuit board main body has an inner ring groove, and the photosensitive chip is arranged in the inner ring groove, Therefore, the height requirement of the molded part can be reduced.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the circuit board main body has a chip channel suitable for the photosensitive chip to be transferred from the back of the circuit board main body Installation, and the photosensitive area of the photosensitive wafer faces the front, providing a more convenient flip-chip mounting method for the photosensitive wafer.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, in which a filter is installed in the inner opening of the chip channel of the circuit board body, so that there is no need Provide an additional place to install the filter.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the circuit main body has at least one reinforcement hole, and the molded part extends through the reinforcement hole, thereby increasing the The adhesive force between the molded part and the circuit board part, and the structural strength of the main body of the circuit board is increased by the molded part.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the molding part includes a support table suitable for supporting the filter, thereby providing the filter The location of the film.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein one of the molded parts is suitable for mounting a motor assembly or a lens, which can be used as a traditional bracket , Provide a fixed position for the motor assembly or the lens.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the molded part replaces the traditional bracket, so that the bracket and the circuit board do not need to be pasted and assembled during assembly Process, increase process accuracy.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the camera module is assembled from the molded circuit board assembly, which can obtain a smaller thickness and Camera module with better performance.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the camera module is assembled and manufactured by molding, thereby changing the COB process of the traditional camera module .

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and a manufacturing method thereof, wherein the camera module includes a seat, and the seat is mounted on the molding part , The filter is installed on the support.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof. The lens includes a lens barrel, and the filter is installed in the lens barrel, thereby There is no need to provide additional parts to install the filter.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the filter is installed on the upper end of the chip path, thereby reducing the size of the camera module The back focus.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the base portion is integrally packaged and connected to the circuit board portion, In addition, the molded part can meet the structural strength requirement with a small thickness, so that the longitudinal dimension of the camera module can be reduced.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein when the camera module is manufactured, a plurality of the molds are simultaneously packaged in a whole assembly Board, so as to realize the splicing operation of the camera module and improve the production efficiency.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the circuit board portion includes a reinforcement layer, which is laminated on the bottom of the circuit board body , In order to enhance the structural strength and heat dissipation performance of the circuit board main body.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the molding part includes a lens mounting section suitable for mounting a lens of the camera module , So as to provide a stable installation position for the lens.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly and manufacturing method thereof, wherein the molding part molds the side and bottom surfaces of the circuit board main body to enhance the camera module The structural strength of the group.

An object of the present invention is to provide a camera module based on a molding process and a molded circuit board assembly thereof.

The present invention provides a camera module, which includes:

At least one lens; at least one photosensitive chip; at least one filter; at least one integrated base assembly; and at least one base; wherein the integrated base assembly includes a base portion and a circuit board portion, the base Part is integrally packaged on the circuit board part, the photosensitive chip is mounted on the circuit board part, the base part is formed with at least one through hole to provide a light path for the photosensitive chip, and the lens is located on the photosensitive chip The support is mounted on the base part, and the filter is mounted on the support and is located in the light path of the photosensitive chip.

In an embodiment of the present invention, the support has a first support groove on the top side, the first support groove is connected to the through hole, and the filter is installed in the first Support slot.

In an embodiment of the present invention, the support has a second support groove on the bottom side to engage with the top of the base portion.

In an embodiment of the present invention, the base portion has an installation groove, the installation groove communicates with the through hole, and the support is installed in the installation groove.

In an embodiment of the present invention, the base portion has an installation groove, and the installation groove communicates with the through hole.

In an embodiment of the present invention, the base portion forms a platform, and the support is installed on the platform.

In an embodiment of the present invention, the mounting groove has at least one notch communicating with the through hole and the outside, and the support includes at least one extending edge, and the extending edge is adapted to overlap with the notch.

In an embodiment of the present invention, the mounting groove has at least one notch to form a U-shaped structure, and the support portion includes at least one extended edge, and the extended edge fills the opening of the U-shaped structure.

In an embodiment of the present invention, the integrated base assembly includes at least one circuit element, and the base portion covers the circuit element.

In an embodiment of the present invention, the lens is at least partially mounted on the support.

In an embodiment of the present invention, the camera module includes at least one motor, the lens is mounted on the motor, and the motor is at least partially mounted on the support.

In an embodiment of the present invention, the lens is mounted on the base part.

In an embodiment of the present invention, the camera module includes at least one motor, the lens is mounted on the motor, and the motor is mounted on the base part or on the support.

In an embodiment of the present invention, the integrated packaging method is a molded integrated packaging method.

In an embodiment of the present invention, the integrated base assembly includes a ring-shaped blocking element, which is disposed on the circuit board portion, and the blocking element is at least partially integrally encapsulated by the base portion.

In an embodiment of the present invention, the base portion has at least one first inner side surface, which extends integrally on the circuit board portion to form at least part of the through hole, and the first inner side surface is inclined Extends upwards likewise.

In an embodiment of the present invention, there is an inclination angle α between the first inner side surface and the optical axis of the camera module, and the size of α ranges from 3° to 85°.

In an embodiment of the present invention, the first inner side surface surrounds the lower end of the through hole, and the inner diameter of the lower end of the through hole gradually increases from bottom to top.

In an embodiment of the present invention, the base portion has a second inner side surface, and the second side surface is bent and extended from the first inner side surface, and the second inner side surface surrounds to form the passage At the upper end of the hole, the second inner side surface extends upward in an oblique shape.

In an embodiment of the present invention, there is an inclination angle β between the second inner side surface and the optical axis of the camera module, wherein the magnitude of β ranges from 3° to 45°.

In an embodiment of the present invention, the base portion has an outer side surface which is integrally extended upwardly by the circuit board portion and has an inclination angle γ with the optical axis of the camera module, wherein The range of γ is 3°~45°.

Another aspect of the present invention provides a camera module, which includes:

At least one lens; at least one photosensitive chip; and at least one integrated base assembly; wherein the integrated base assembly includes a base portion and a circuit board portion, and the base portion is integrally connected to the circuit board portion, The photosensitive chip is mounted on the circuit board portion, and the base portion forms at least one through The hole provides a light path for the photosensitive chip, and the lens is located in the light path of the photosensitive chip. The sides extend upward in an oblique shape.

Another aspect of the present invention provides a camera module, which includes:

At least one lens; at least one photosensitive chip; and at least one integrated base assembly; wherein the one integrated base assembly includes a base part and a circuit board part, the base part is molded on the circuit board part, The base portion is formed with at least one through hole to provide a light path for the photosensitive chip and the lens.

In an embodiment of the present invention, the base portion has a top surface that extends flatly.

In an embodiment of the present invention, the base portion has a mounting groove connected to the through hole, and the base portion includes at least one raised step, and the raised step forms the mounting groove.

In an embodiment of the present invention, the circuit board portion includes at least one side surface, and the base covers at least one side surface of the circuit board portion.

In an embodiment of the present invention, the base portion further covers the bottom of the circuit board portion.

In an embodiment of the present invention, the base portion has two mounting grooves in sequence along the optical axis direction of the camera module, and each of the mounting grooves is connected to the through hole, so that the base portion is formed inside Step structure.

In an embodiment of the present invention, the camera module includes at least one filter, and the filter is installed on the top surface, so that the filter is installed evenly.

In an embodiment of the present invention, the lens is mounted on the top surface.

In an embodiment of the present invention, the camera module includes at least one motor, the lens is mounted on the motor, and the motor is mounted on the top surface of the base portion.

In an embodiment of the present invention, the camera module includes at least one filter, and the filter is installed in the mounting groove.

In an embodiment of the present invention, the lens is mounted on the raised step.

In an embodiment of the present invention, the camera module includes at least one motor, the lens is mounted on the motor, and the motor is mounted on the raised step.

In an embodiment of the present invention, the camera module includes a filter, and the filter is installed in the mounting groove at a lower position.

In an embodiment of the present invention, the lens is installed in the installation groove at the higher position.

In an embodiment of the present invention, the base portion integrally extends upward from the mounting groove at a higher position to form an inner lens wall.

In an embodiment of the present invention, the inner wall surface of the lens is flat and suitable for mounting a threadless lens.

In an embodiment of the present invention, it further includes at least one lens holder installed on the base part, and the lens holder is suitable for installing the lens.

In an embodiment of the present invention, the camera module includes at least a base and at least one filter, the support is installed in the mounting groove, and the filter is installed in the support .

In an embodiment of the present invention, the circuit board portion has an inner groove connected to the through hole, and the photosensitive chip is accommodated in the inner groove.

In an embodiment of the present invention, the lens includes a lens barrel and at least one lens, each of the lenses is installed in the lens barrel, and the filter is installed in the lens barrel and located in the lens barrel. Below.

In an embodiment of the present invention, the camera module includes at least one motor and at least one filter, the filter is mounted on the motor, and the lens is mounted on the motor and located at the Above the filter.

In an embodiment of the present invention, the integrated base assembly includes at least one circuit element, and the base portion covers the circuit element.

In an embodiment of the present invention, the circuit element is selected from a combination: one or more of resistors, capacitors, diodes, transistors, potentiometers, relays, drivers, processors, and memories.

In an embodiment of the present invention, the circuit board portion has at least one passage connected to both sides of the circuit board portion, and the photosensitive chip is installed in the passage.

In an embodiment of the present invention, the circuit board portion has a reinforcement hole, and the base portion extends into the reinforcement hole.

In an embodiment of the present invention, the circuit board portion includes a reinforcement layer, which is stacked on the bottom of the circuit board portion.

In an embodiment of the present invention, the circuit board portion includes a shielding layer wrapped around the camera module.

In an embodiment of the present invention, the circuit board portion includes a shielding layer surrounding the inner side of the base portion.

In an embodiment of the present invention, the circuit board portion includes a circuit board main body, and the material of the circuit board main body is selected from a combination: a flexible and hard bonded board, a ceramic substrate, and a PCB rigid board.

In an embodiment of the present invention, the base material is selected from a combination: one or more of nylon, LCP, PP and resin.

In an embodiment of the present invention, the molding process of the molding part is insert molding or compression molding.

In an embodiment of the present invention, the photosensitive chip is electrically connected to the circuit board portion through at least one connecting wire.

Another aspect of the present invention provides a camera module, which includes:

At least one lens; at least one photosensitive chip; at least an integrated base assembly; and at least one motor; wherein the integrated base assembly includes a base portion and a circuit board portion, and the base portion is integrally packaged on the circuit board Part, the photosensitive chip is mounted on the circuit board part, the lens is located in the photosensitive path of the photosensitive chip, and the base part forms a through hole to provide a light path for the photosensitive chip; the integrated base The assembly includes at least one motor connection structure, the motor connection structure is preset on the base portion, the motor is electrically connected to the circuit board portion through the motor connection structure, and the lens is mounted on the motor , In order to adjust the lens through the motor.

In an embodiment of the present invention, the circuit board portion includes a circuit board main body, and the base portion is integrally formed on the circuit board main body by molding.

In an embodiment of the present invention, the motor connection structure includes at least one lead wire and at least one pin groove, the lead wire is disposed on the base part and is electrically connected to the circuit board main body, and the lead wire The foot groove is provided at the upper end of the base part, the lead wire includes a motor connection end exposed on the bottom wall of the groove, so that at least one motor pin of the motor is inserted into the bottom wall of the groove. The pin slot is electrically connected to the motor connection end.

In an embodiment of the present invention, the motor connection structure includes at least one pin slot and at least one circuit contact, the circuit contact is electrically connected to the circuit board main body, and the pin slot is disposed in the main body of the circuit board. The base portion extends from the circuit board main body to the top end of the base portion, and the circuit contacts are exposed in the pin grooves, so that at least one motor pin of the motor is inserted into the pin slot. The pin slot is electrically connected to the circuit contact.

In an embodiment of the present invention, the motor connection structure includes at least one engraved circuit, and the engraved circuit is disposed on the base portion and electrically connected to the circuit board main body so as to be electrically connected to a motor pin.

In an embodiment of the present invention, the thickness of the base portion ranges from 0.3 mm to 1.2 mm.

In an embodiment of the present invention, the transverse cross-sectional size of the camera module ranges from 5 to 20 mm.

In an embodiment of the present invention, the height range of the camera module is 3-6 mm.

In an embodiment of the present invention, the thickness of the circuit board portion ranges from 0.15 mm to 0.5 mm.

In an embodiment of the present invention, the base portion is adjacently surrounding the outside of the photosensitive chip, thereby expanding the thickness of the base portion, so that the base portion and the circuit board portion have a stronger connection. sex.

Another aspect of the present invention provides an integrated base assembly, applying a camera module, which includes:

A base portion; and a circuit board portion; the base portion is integrally packaged on the circuit board portion, a photosensitive chip of the camera module is adapted to be mounted on the circuit board portion, the base portion At least one through hole is formed to provide a light path for the photosensitive chip, and the lens is located in the light path of the photosensitive chip.

In an embodiment of the present invention, the integrated base assembly includes at least one circuit element, and the base portion covers the circuit element.

In an embodiment of the present invention, the integrated base assembly includes at least one circuit element, and the circuit element is located inside the base portion, and the base portion does not cover the circuit element Pieces.

10A: Circuit board assembly

100: camera module

1010, 1010A, 1010B, 1010C, 1010D, 1010E, 1010F: molded circuit board components

1011, 1011A, 1011B, 1011C, 1011D, 1011E, 1011F: Molding department

10111A, 10111B, 10111C, 10111D: support table

10113, 10113A, 10113B, 10113C, 10113D: inner ring groove

10117F: The first inner side

10118F: The second inner side

10119F: Outer side

101100, 101100A, 101100B, 101100C, 101100D, 101100E, 101100F: through hole

1012, 1012A, 1012B, 1012C, 1012D, 1012E, 1012F: circuit board section

10121, 10121A, 10121B, 10121C, 10121D, 10121E: circuit board main body

101211A: Inner groove

101212B, 101212E: access

101213B, 101213E: Outer ring groove

101214C: Via

10122, 10122A, 10122B, 10122C, 10122D, 10122E, 10122F, 10122G: circuit components

1030, 1030B, 1030D, 1030E: photosensitive wafer

1031D: Lead

1040, 1040D: filter

1050, 1050D, 1050E: lens

1060, 1060E: Motor

1061, 1061A: Motor pin

1070: bracket

1014G: barrier element

200: Manufacturing equipment

210: Forming mold

211: The first mold

2111: light window forming block

21111: pressing surface

212: The second mold

213: forming cavity

2131: Filling Department

2132: Receptacle

214: Feed Channel

220: feeding mechanism

2010: Circuit board components

2011: Packaging Department

20112, 20112G: Top surface

20113A, 20113C, 20113G: installation slot

201131G: gap

20115, 20115G: raised steps

201100: Through hole

2012: Circuit Board Department

20121, 20121F: circuit board main body

201212E: Access

201213F: Outer groove

20122: Circuit components

2030: photosensitive chip

2031: connection line

2040: filter

2050, 2050E: lens

2051E: lens barrel

20511E: bottom

2052E: Lens

2060, 2060D: Motor

2061: Motor pin

2070, 2070B, 2070C, 2070G: support

2071C, 2071G: first support slot

2071C, 2072G: second support slot

2073G: extended edge

2080: bracket

3010: One-piece base assembly

3011, 3011F: Base part

30112: top surface

30113, 30113F: installation slot

30114, 30114F: Covering section

30115, 30115F: filter installation section

30116F: Lens installation section

301161F: The inner wall of the lens

301162F: Installation section

301100, 301100F: Through hole

3012: Circuit Board Department

30121, 30121A, 30121B, 30121D, 30121E: circuit board main body

301211A: Inner groove

301212B: Access

301213B: Outer groove

30122: circuit components

30123C: reinforcement layer

30124, 30124A: shielding layer

301214D, 301214E: reinforcement holes

3013: Motor connection structure

30131: Lead

301311: Motor connection end

30132: Circuit contact

30133: pin slot

30134: Lead

301341: Motor connection end

30135: pin slot

30136: Engraving line

3030: photosensitive wafer

3040: filter

3050: lens

3060: Motor

3061: Motor pin

3070G, 3070H: support

3071G, 3071H: first support slot

3072G, 3072H: second support slot

400: molding material

4010, 4010A: Package photosensitive components

4011, 4011P, 4011A: Package part

4012, 40121P, 4012A: photosensitive components

40121, 40121P, 40121A: circuit board

401215: top surface

401216, 401216A: side

401217A: bottom

40122, 40122A: electronic components

4040: filter

4030, 4030A: photosensitive wafer

4031: Lead

4040, 4040A: filter

4050, 4050A: lens

4060, 4060A: Motor

30: photosensitive wafer

40: filter

50: lens

60: Motor

1P: circuit board

11P: Circuit device

2P: photosensitive wafer

3P: Bracket

4P: filter

5P: Motor

6P: lens

Figure 1 is a cross-sectional view of a camera module in a traditional COB packaging process.

2 is a schematic cross-sectional view of the camera module according to the first preferred embodiment of the present invention.

Fig. 3 is an exploded schematic view of the camera module according to the first preferred embodiment of the present invention.

4 is a partially enlarged view of the camera module according to the first preferred embodiment of the present invention.

5 is a schematic diagram of the forming process of the molded circuit assembly of the camera module according to the first preferred embodiment of the present invention.

6A is a schematic cross-sectional view of a first modified embodiment of the molded circuit board assembly of the camera module according to the first preferred embodiment not invented.

6B is a partially enlarged schematic diagram of a first modified embodiment of the molded circuit board assembly of the camera module according to the first preferred embodiment of the present invention.

7A is a schematic cross-sectional view of a second modified embodiment of the molded circuit board assembly of the camera module according to the first preferred embodiment of the present invention.

7B is a partially enlarged schematic diagram of a second modified embodiment of the circuit board assembly of the camera module according to the first preferred embodiment of the present invention.

8A is a cross-sectional view of a third modified embodiment of the circuit board assembly of the camera module according to the first preferred embodiment of the present invention.

8B is a partially enlarged view of a third modified embodiment of the circuit board assembly of the camera module according to the first preferred embodiment of the present invention.

FIG. 9 is a schematic cross-sectional view of a camera module according to a second preferred embodiment of the present invention.

Fig. 10 is an exploded schematic diagram of a camera module according to a second preferred embodiment of the present invention.

Fig. 11 is a partial enlarged view of a camera module according to a second preferred embodiment of the present invention.

Fig. 12 is a cross-sectional view of a camera module according to a third preferred embodiment of the present invention.

13 is a schematic diagram of the forming process of the molded circuit assembly of the camera module according to the third preferred embodiment of the present invention.

14 is a schematic cross-sectional view of a camera module according to a fourth preferred embodiment of the present invention.

Fig. 15 is an exploded view of a camera module according to a fourth preferred embodiment of the present invention.

16 is a schematic cross-sectional view of a camera module based on a molding process according to a fifth preferred embodiment of the present invention.

FIG. 17 is a three-dimensional exploded schematic diagram of a camera module based on a molding process according to a fifth preferred embodiment of the present invention.

18A is another embodiment of a camera module based on a molding process according to the fifth preferred embodiment of the present invention.

18B is another embodiment of a camera module based on a molding process according to the fifth preferred embodiment of the present invention.

FIG. 18C is another embodiment of a camera module based on a molding process according to the fifth preferred embodiment of the present invention.

19 is a schematic cross-sectional view of a camera module based on a molding process according to a sixth preferred embodiment of the present invention.

20 is a schematic cross-sectional view of a camera module based on a molding process according to a seventh preferred embodiment of the present invention.

21 is a schematic cross-sectional view of camera molding based on a molding process according to an eighth preferred embodiment of the present invention.

22 is a schematic cross-sectional view of a camera module based on a molding process according to a ninth preferred embodiment of the present invention.

FIG. 23 is a schematic cross-sectional view of a camera module based on a molding process according to a tenth preferred embodiment of the present invention.

24 is a schematic cross-sectional view of a camera module based on a molding process according to an eleventh preferred embodiment of the present invention.

25A and 25B are schematic cross-sectional views from different angles of a camera module based on a molding process according to a twelfth preferred embodiment of the present invention.

FIG. 26 is a partial perspective view of a camera module based on a molding process according to a twelfth preferred embodiment of the present invention.

27 is a schematic cross-sectional view of a camera module based on an integrated packaging process according to a thirteenth preferred embodiment of the present invention.

Fig. 28 is a schematic diagram of the manufacturing process of the integrated base assembly according to the thirteenth preferred embodiment of the present invention.

Fig. 29 is a schematic diagram of the manufacturing method of the integrated base assembly according to the thirteenth preferred embodiment of the present invention.

FIG. 30 is another embodiment of a camera module based on an integrated packaging process according to the thirteenth preferred embodiment of the present invention.

31A, 31B, 31C, and 31D are different embodiments of a camera module and its motor connection structure based on an integrated packaging process according to the fourteenth preferred embodiment of the present invention.

32 is a schematic cross-sectional view of a camera module based on an integrated packaging process and its integrated base assembly according to a fifteenth preferred embodiment of the present invention.

33 is a schematic cross-sectional view of a camera module based on an integrated packaging process and its integrated base assembly according to a sixteenth preferred embodiment of the present invention.

34 is a schematic cross-sectional view of a camera module based on an integrated packaging process and its integrated base assembly according to a seventeenth preferred embodiment of the present invention.

35 is a schematic cross-sectional view of a camera module based on an integrated packaging process and its integrated base assembly according to an eighteenth preferred embodiment of the present invention.

36 is a cross-sectional view of a camera module based on an integrated packaging process and its integrated base assembly according to a nineteenth preferred embodiment of the present invention.

37 is a schematic cross-sectional view of a camera module based on an integrated packaging process and its integrated base assembly according to a twentieth preferred embodiment of the present invention.

38 is a schematic cross-sectional view of a camera module based on an integrated packaging process and its integrated base assembly according to the twenty-first preferred embodiment of the present invention.

39 is a schematic cross-sectional view of a camera module based on an integrated packaging process and its integrated base assembly according to the 22nd preferred embodiment of the present invention.

FIG. 40 is another embodiment of a camera module based on an integrated packaging process according to the twenty-second preferred embodiment of the present invention.

FIG. 41 is a schematic diagram of the structural strength comparison between the camera based on the integrated packaging process and the traditional camera module according to the above-mentioned preferred embodiment of the present invention.

FIG. 42 is a schematic diagram of the lateral size comparison between a camera module based on an integrated packaging process and a traditional camera module according to the above-mentioned preferred embodiment of the present invention.

FIG. 43 is a schematic diagram of height comparison between a camera module based on an integrated packaging process and a conventional camera module according to the above-mentioned preferred embodiment of the present invention.

FIG. 44 is a schematic diagram of the flatness of the camera module based on the integrated packaging process according to the above-mentioned preferred embodiment of the present invention.

FIG. 45 is a schematic diagram of image quality comparison between a camera module based on an integrated packaging process and a traditional camera module according to the above-mentioned preferred embodiment of the present invention.

46A and 46B are schematic diagrams illustrating the comparison between the manufacturing process of the camera module based on the integrated packaging process and the traditional camera module according to the above-mentioned preferred embodiment of the present invention.

FIG. 47 is a side cross-sectional view of a camera module based on an integrated packaging process according to the twenty-third preferred embodiment of the present invention.

48 is a side cross-sectional view of the camera module based on the integrated packaging process according to the twenty-fourth preferred embodiment of the present invention.

FIG. 49A is a schematic diagram of a molded camera module formed by a comparative technology.

FIG. 49B is a schematic diagram of a conventional molded camera module in the comparative technology.

FIG. 49C is a schematic diagram of a conventional molded camera module in the comparative technology.

FIG. 49D is a schematic diagram of a conventional molded camera module in the comparative technology.

Fig. 49E is a schematic diagram of a conventional molded camera module in the comparative technology.

50 is a cross-sectional view of the camera module according to the twenty-fifth preferred embodiment of the present invention.

FIG. 51 is a perspective view of a molded circuit board assembly of the camera module according to the twenty-fifth preferred embodiment of the present invention.

FIG. 52 is a schematic diagram of the inclination angle of a molded circuit board assembly of the camera module according to the twenty-fifth preferred embodiment of the present invention.

FIG. 53 is a schematic diagram of light rays of a camera module according to a twenty-fifth preferred embodiment of the present invention.

54A and 54B are schematic diagrams of the manufacturing process of a molded circuit board assembly according to the twenty-fifth preferred embodiment of the present invention.

Fig. 55 is a schematic diagram of the demolding process of a molded circuit board assembly according to the twenty-fifth preferred embodiment of the present invention.

Fig. 56 is a modified embodiment of the molded circuit board assembly according to the twenty-fifth preferred embodiment of the present invention.

Fig. 57 is another modified embodiment of the molded circuit board assembly according to the twenty-fifth preferred embodiment of the present invention.

FIG. 58 is a schematic diagram of an application of the camera module according to the twenty-fifth preferred embodiment of the present invention.

FIG. 59 is a modified implementation of the camera module according to the twenty-first preferred embodiment of the present invention.

In order to fully understand the purpose, features, and effects of the present invention, the following specific embodiments are used in conjunction with the accompanying drawings to give a detailed description of the present invention. The description is as follows:

The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions that do not deviate from the spirit and scope of the present invention.

Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", " The orientation or positional relationship indicated by "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and The description is simplified, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore the above-mentioned terms should not be construed as limiting the present invention.

It can be understood that the term "a" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element The number can be multiple, and the term "one" cannot be understood as a restriction on the number.

As shown in FIGS. 2 to 5, the camera module based on the molding process according to the first preferred embodiment of the present invention. The camera module can be applied to various electronic devices to assist in the use of the camera module to perform shooting activities. For example, the camera module can be used to capture images or video images of objects or people. Preferably, the camera module can be applied to a mobile electronic device, For example, the mobile electronic device may be, but is not limited to, a mobile phone, a tablet computer device, a TV, an intelligent transportation tool, an intelligent monitoring device, and the like.

As shown in FIGS. 2 to 5, the camera module according to the first preferred embodiment of the present invention. The camera module may be a dynamic focus camera module, which includes a molded circuit board assembly 1010, a lens 1050, a motor 1060, and a photosensitive chip 1030. Of course, it is understandable that in this embodiment and the following variants of the embodiment with a driver (motor), the camera module can be deformed and implemented as a fixed-focus camera module without the motor. The lens can be mounted on a lens holder and then mounted on the molded circuit board assembly.

The motor 1060 is mounted on the molded circuit board assembly 1010, and the lens 1050 is mounted on the motor 1060 so that the lens 1050 is supported above the molded circuit board assembly 1010.

Furthermore, the molded circuit board assembly 1010 includes a molded portion 1011 and a circuit board portion 1012, and the molded portion 1011 is connected to the circuit board portion 1012 by molding.

The circuit board portion 1012 includes a circuit board main body 10121, and the photosensitive chip 1030 is disposed on the circuit board main body 10121 and located inside the molding portion 1011.

Specifically, the motor 1060 is mounted on the molded portion 1011 of the molded circuit board assembly 1010, and is electrically connected to the circuit board portion 1012, the lens 1050 is mounted on the motor 1060, And the lens 1050 can be adapted to auto focus by the motor 1060. The lens 1050 is located in the photosensitive path of the photosensitive chip 1030, so that when the camera module is used to capture an image of an object, the light reflected by the object can be processed by the lens 1050 and then further by the photosensitive chip 1030 received to be suitable for photoelectric conversion.

Furthermore, the circuit board portion 1012 includes a photosensitive circuit and at least one circuit element 10122. The photosensitive circuit is preset in the circuit board main body 10121, and the circuit element 10122 is electrically connected to the photosensitive circuit and the photosensitive chip 1030 for the photosensitive chip 1030 work process. The circuit element 10122 may be, for example, but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

Particularly, in an embodiment of the present invention, when assembling the camera mold, the motor 1060 is electrically connected to the photosensitive circuit through at least one motor pin 1061, and the motor pin 1061 is welded to The circuit board main body 10121.

It is worth mentioning that the molding part 1011 can wrap the circuit element 10122 inside, so that the circuit element 10122 will not be directly exposed to the space, more specifically, will not be exposed to the The closed environment where the photosensitive chip 1030 communicates is different from the existence of circuit components in the traditional camera module, such as a blocking container, so as to prevent dust and debris from staying in the circuit components and contaminate the photosensitive chip. The molding part 1011 forms a through hole 101100 so that the molding part 1011 surrounds the outside of the photosensitive wafer 1030 and provides a light path between the lens 1050 and the photosensitive wafer 1030. In other words, the molding part forms a light window for the photosensitive chip, and in the camera module, the light passing through the lens 1050 further passes through the light window to reach the photosensitive chip.

It is worth mentioning that the molding part 1011 wrapping the circuit element 10122 has the advantage of protecting the circuit element 10122 and the corresponding improvement in the performance of the camera module. However, those skilled in the art should understand that the The molding part 1011 is not limited to wrapping the circuit element 10122. That is to say, in other embodiments of the present invention, the molding part 1011 may be directly molded on the circuit board without the protruding circuit element 10122, or may be molded on the outer side of the circuit element 10122. , Surroundings, etc., or embedded in the circuit board main body 10121.

It is worth mentioning that, in an embodiment of the present invention, the molding part 1011 protrudingly surrounds the outside of the photosensitive wafer 1030. In particular, the molding part 1011 is integrally closed and connected so that it has Good airtightness, so that when the motor 1060 is installed in the molded part 1011, the photosensitive wafer 1030 is sealed inside to form a closed inner space.

Specifically, when manufacturing the molded circuit board assembly, a conventional circuit board can be used as the circuit board main body 10121, and the surface of the circuit board main body 10121 can be molded, such as by using an injection molding machine, by insert molding ( In the insert molding process, the circuit board after the SMT process (Surface Mount Technology) is molded to form the molded part 1011, or the molded part 1011 is formed by a molding process commonly used in semiconductor packaging. The circuit board main body 10121 can be selected as, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The forming method of the molding part 1011 can be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the molding part 1011 are, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene), etc., and the molding process can be used. Resin. Those skilled in the art should understand that the foregoing selectable manufacturing methods and selectable materials are only used as examples to illustrate the possible implementation of the present invention, and are not a limitation of the present invention.

It is also worth mentioning that the motor 1060 is mounted on the molded part 1011 of the molded circuit board assembly 1010, so that the molded part 1011 is equivalent to the function of the bracket in the traditional camera module, which is The motor 1060 provides support and a fixed position, but the assembly is different from the traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by pasting, and the molding part 1011 is fixed to the main body 10121 of the circuit board through a molding process. The fixing has better connection stability and controllability of the process, and there is no need to reserve AA adjustment glue space between the molding part 1011 and the circuit board main body 10121, thus reducing the traditional camera module AA The adjusted reserved space reduces the thickness of the camera module; on the other hand, the molded part 1011 is wrapped around the circuit element 10122, so that the traditional bracket function and the circuit element can be overlapped in space. It is necessary to reserve a safety distance around the circuit device like a traditional camera module, so that the height of the molded part 1011 with the support function can be set in a small range, thereby further providing a reduction in the thickness of the camera module space. In addition, the molding part 1011 replaces the traditional bracket, avoids the tilt error caused by the bracket during the pasting and assembly, and reduces the cumulative tolerance of the camera module assembly.

Furthermore, the molding part 1011 includes a supporting table 10111, and the supporting table 10111 is adapted to install a filter 1040 such that the filter 1040 is located above the photosensitive wafer 1030. In other words, the light entering the lens 1050 reaches the photosensitive chip 1030 after passing through the action of the filter 1040. The filter 1040 may be implemented as, but not limited to, an infrared cut filter (IRCF).

The supporting table 10111 of the molding part 1011 forms an inner ring groove 10113 to provide sufficient installation space for the filter 1040. It is worth mentioning that the molded part 1011 replaces the traditional bracket, connects the motor 1060 and the filter 1040, and provides an installation position of the filter 1040, so that the molded part 1011. The filter 1040 and the circuit element 10122 are reasonably arranged to make full use of the remaining space outside the photosensitive area of the photosensitive wafer 1030, so that the camera module is minimized. At the same time, with the help of a molding process, the molding part 1011 provides a flat support table 10111, so that the filter 1040 can be installed flatly, and the consistency of the light path is ensured.

More specifically, the vertical section of the inner ring groove 10113 is in the shape of an L ring, communicating with the through hole 101100 of the molding part 1011, so that the filter 1040 is supported and mounted on the photosensitive wafer 1030. path.

According to this embodiment of the present invention, the photosensitive wafer 1030 is connected to the circuit board main body 10121 through a series of leads 1031, and is electrically connected to the photosensitive circuit. The lead wire 1031 may be implemented as, for example, but not limited to, gold wire, copper wire, aluminum wire, or silver wire. In particular, the series of leads 1031 of the photosensitive chip 1030 can be connected to the circuit board main body 10121 by a conventional COB method, for example, but not limited to, a welding method. That is to say, the connection between the photosensitive chip 1030 and the circuit board main body 10121 can make full use of the existing mature connection technology to reduce improvement. The cost of technology makes full use of traditional crafts and equipment to avoid waste of resources. Of course, those skilled in the art should understand that the connection between the photosensitive chip 1030 and the circuit board main body 10121 can also be achieved by any other connection that can achieve the purpose of the invention. The invention is in this respect. Unrestricted.

It is worth mentioning that, in this embodiment of the present invention, the photosensitive chip 1030 is disposed on the upper surface of the circuit board main body 10121, such as attached to the upper surface, and the molding part 1011 surrounds the upper surface of the circuit board main body 10121. On the outside of the photosensitive wafer 1030, when manufacturing the molded circuit board assembly 1010, different manufacturing sequences can be selected. For example, but not limited to, in one embodiment, the circuit board main body 10121 can be installed first. The photosensitive chip 1030, and then on the outside of the photosensitive chip 1030, the edge position of the circuit board main body 10121, is molded to form the molding part 1011, and will protrude from the circuit element 10122 of the circuit board main body 10121 Wrapped inside. In another embodiment of the present invention, the edge position of the circuit board main body 10121 may be molded to form the molded part 1011, and the circuit element protruding from the circuit board main body 10121 10122 is wrapped inside it, and then the photosensitive chip 1030 is mounted on the circuit board main body 10121 so that it is located inside the molding part 1011.

As shown in FIG. 6A and FIG. 6B, it is a first modified embodiment of the molded circuit board assembly of the camera module according to the first preferred embodiment of the present invention. The molded circuit board assembly 1010A includes a molded portion 1011A and a circuit board portion 1012A, and the molded portion 1011A is connected to the circuit board portion 1012A by molding.

The circuit board portion 1012A includes a circuit board main body 10121A, and the photosensitive chip 1030 is disposed on the circuit board main body 10121A and located inside the molding portion 1011A.

Specifically, the motor 1060 is mounted on the molded part 1011A of the circuit board assembly 10A, and is electrically connected to the circuit board part 1012A, the lens 1050 is mounted on the motor 1060, and The lens 1050 can be adjusted by the motor 1060 to be suitable for auto focus. The mirror The head 1050 is located on the photosensitive path of the photosensitive chip 1030, so that when the camera module is used to capture an image of an object, the light reflected by the object can be processed by the lens 1050 and then further received by the photosensitive chip 1030 To be suitable for photoelectric conversion.

Furthermore, the circuit board portion 1012A includes a photosensitive circuit and at least one circuit element 10122A. The photosensitive circuit is preset in the circuit board main body 10121A, and the circuit element 10122A is electrically connected to the photosensitive circuit and the photosensitive wafer 1030 for the photosensitive work process of the photosensitive wafer 1030. The circuit element 10122A may be, specifically but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

Particularly, in an embodiment of the present invention, when assembling the camera mold, the motor 1060 is electrically connected to the photosensitive circuit through at least one motor pin 1061A, and the motor pin 1061A is welded to The circuit board main body 10121.

It is worth mentioning that the molding part 1011A wraps the circuit element 10122A inside, so that the circuit element 10122A will not be directly exposed to the space, more specifically, will not be exposed to the photosensitive material. The closed environment where the chip 1030 communicates is different from the existence of circuit components in the traditional camera module, such as a blocking container, so as to prevent dust and debris from staying in the circuit components and contaminating the photosensitive chip. The molding part 1011A forms a through hole 101100A so that the molding part surrounds the outside of the photosensitive chip 1030 and provides a light path between the lens 1050 and the photosensitive chip 1030.

Furthermore, the circuit board main body 10121A includes an inner groove 101211A, and the photosensitive wafer 1030 is disposed in the inner groove 101211A. Different from the molded circuit board assembly in the above embodiment, the inner groove 101211A is provided in the circuit board main body 10121A, and the photosensitive wafer 1030 is contained therein, so that the photosensitive wafer 1030 will not protrude significantly. On the upper surface of the circuit board main body 10121A, so that the height of the photosensitive chip 1030 relative to the molding part 1011A is reduced Low, thereby reducing the height restriction of the photosensitive wafer 1030 on the molded part 1011A, and providing the possibility of further reducing the height.

Specifically, when manufacturing the molded circuit board assembly 1010, a conventional circuit board can be used as the circuit board main body 10121A, and the circuit board main body 10121A is molded on the surface, such as by using an injection molding machine, by insert molding. In an insert molding process, a circuit board that has undergone an SMT process (Surface Mount Technology) is molded to form the molded part 1011A, or the molded part 1011A is formed by a molding process commonly used in semiconductor packaging. In particular, in one embodiment, the inner groove 101211 needs to be opened to the circuit board main body 10121A first. In other words, the inner groove 101211A is provided on the conventional circuit board to make it suitable for accommodating and mounting the photosensitive wafer 1030. The circuit board main body 10121A can be selected as, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner of forming the molding part 1011A can be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the molding part 1011A are, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene), etc., for example, but not limited to, and the molding process can be Resin. Those skilled in the art should understand that the foregoing selectable manufacturing methods and selectable materials are only used as examples to illustrate the possible implementation of the present invention, and are not a limitation of the present invention.

It is also worth mentioning that the motor 1060 is mounted on the molded part 1011A of the molded circuit board assembly 1010A, so that the molded part 1011A is equivalent to the function of a bracket in a traditional camera module. The motor 1060 provides support and a fixed position, but the assembly is different from the traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by pasting, and the molding part 1011A is fixed to the main body 10121A of the circuit board through a molding process. The fixing has better connection stability and controllability of the process, and there is no need to reserve AA-adjusted glue space between the molded part 1011A and the main body of the circuit board, so The reserved space for adjustment of the traditional camera module AA is reduced, so that the thickness of the camera module can be reduced; on the other hand, the molded part 1011A is wrapped around the circuit element 10122A, so that the traditional bracket function and circuit element It can be arranged overlappingly in space, and there is no need to reserve a safe distance around the circuit device like a traditional camera module, so that the height of the molding part 1011A with the support function can be set in a small range, thereby further providing The space where the thickness of the camera module can be reduced. In addition, the molded part 1011A replaces the traditional bracket, which avoids the tilt error caused by the bracket during the pasting and assembly, and reduces the cumulative tolerance of the camera module assembly.

Furthermore, the molding part 1011A includes a support stand 10111A, and the support stand 10111A is suitable for mounting the filter 1040 so that the filter 1040 is located above the photosensitive wafer 1030. In other words, the light entering the lens 1050 reaches the photosensitive chip 1030 after passing through the action of the filter 1040. The filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).

The supporting table 10111A of the molding part 1011A forms an inner ring groove 10113A, which provides sufficient installation space for the filter 1040. It is worth mentioning that the molded part 1011 replaces the traditional bracket, connects the motor 1060 and the filter 1040, and provides an installation position of the filter 1040, so that the molded part 1011A, the filter 1040, and the circuit element 10122A are reasonably arranged to make full use of the remaining space outside the photosensitive area of the photosensitive wafer 1030, so that the camera module is minimized. At the same time, with the help of a molding process, the molding part 1011A provides a flat support platform 10111A, so that the filter 1040 can be installed flatly, and the consistency of the light path is ensured.

More specifically, the inner ring groove 10113A may have an L-shaped cross section and communicate with the through hole 101100A of the molding part 1011A, so that the filter 1040 is supported and installed on the photosensitive wafer 1030. path.

According to this embodiment of the present invention, the photosensitive wafer 1030 is connected to the circuit board main body 10121A through a series of leads 1031A, and is electrically connected to the photosensitive circuit. The lead 51A can be implemented as, for example, but not limited to, gold wire, copper wire, aluminum wire, or silver wire. In particular, the series of leads 1031A of the photosensitive chip 1030 can be connected to the circuit board main body 10121A by a conventional COB method, for example, but not limited to, a welding method. In other words, the connection between the photosensitive wafer 1030 and the circuit board main body 10121A can make full use of the existing mature connection technology to reduce the cost of the improved technology, make full use of traditional processes and equipment, and avoid waste of resources. Of course, those skilled in the art should understand that the connection between the photosensitive chip 1030 and the circuit board main body 10121A can also be achieved by any other connection that can achieve the purpose of the present invention. The present invention is in this respect. Unrestricted.

It is worth mentioning that, in this embodiment of the present invention, the photosensitive wafer 1030 is disposed in the inner groove 101211A of the circuit board main body 10121A, and the molding part 1011A surrounds the photosensitive wafer The outside of 1030. When manufacturing the molded circuit board assembly, a different manufacturing sequence can be selected. For example, but not limited to, in one embodiment, the inner groove 101211A can be opened on the circuit board main body 10121A first, and then in the The photosensitive wafer 1030 is installed in the inner groove 12110A of the circuit board main body 10121, and then the molding part 1011A is molded on the outside of the photosensitive chip 1030 and at the edge of the circuit board main body 10121A, and The circuit element 10122A protruding from the circuit board main body 10121A is wrapped inside. In another embodiment of the present invention, the inner groove 101211A may be formed on the circuit board main body 10121A first, and then at the edge position of the circuit board main body 10121A, the molded part 1011A may be molded. , And wrap the circuit element 10122A protruding from the circuit board main body 10121A inside, and then mount the photosensitive chip 1030 in the inner groove 101211A of the circuit board main body 10121A so that it is located The inner side of the molded part 1011A.

As shown in FIGS. 7A and 7B, it is a second modified embodiment of the molded circuit board assembly of the camera module according to the first preferred embodiment of the present invention. The molded circuit board assembly 1010B includes a molded portion 1011B and a circuit board portion 1012B, and the molded portion 1011B is molded to connect to the circuit board portion 1012B.

The circuit board portion 1012B includes a circuit board main body 10121B, and the photosensitive chip 1030 is disposed on the circuit board main body 10121B and located inside the molding portion 1011B.

Specifically, the motor 1060 is mounted on the molded part 1011B of the circuit board assembly 10B and is electrically connected to the circuit board part 1012B, the lens 1050 is mounted on the motor 1060, and The lens 1050 can be adapted to auto focus by the motor 1060. The lens 1050 is located in the photosensitive path of the photosensitive chip 1030, so that when the camera module is used to capture an image of an object, the light reflected by the object can be processed by the lens 1050 and then further by the photosensitive chip 1030 received to be suitable for photoelectric conversion.

Furthermore, the circuit board portion 1012B includes a photosensitive circuit (not shown in the figure) and at least one circuit element 10122B. The photosensitive circuit is preset in the circuit board main body 10121B, and the circuit element 10122B is electrically connected to the photosensitive circuit and the photosensitive wafer 1030 for the photosensitive work process of the photosensitive wafer 1030. The circuit element 10122B may be, for example, but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

Particularly, in an embodiment of the present invention, when assembling the camera mold, the motor 1060 is electrically connected to the photosensitive circuit through at least one motor pin 1061, and the wire is welded to the circuit Board body 10121B.

It is worth mentioning that the molding part 1011B wraps the circuit element 10122B inside, so that the circuit element 10122B will not be directly exposed to the space, more specifically, will not be exposed to the photosensitive material. In a closed environment where the chip 1030 is connected, it is different from the traditional camera module The way of existence of circuit components, such as a blocking container, prevents dust and debris from staying in the circuit components and contaminating the photosensitive wafer. The molding part 1011B forms a through hole 101100B so that the molding part surrounds the outside of the photosensitive chip 1030 and provides a light path between the lens 1050 and the photosensitive chip 1030.

Furthermore, the circuit board main body 10121B has a passage 101212B, and the lower part of the passage 101212B is suitable for mounting the photosensitive wafer 1030. The passage 101212B connects the upper and lower sides of the circuit board main body 10121B, so that when the photosensitive chip 1030 is mounted on the circuit board main body 10121B from the back of the circuit board main body 10121B with the photosensitive area facing upward, The photosensitive chip 1030B of the photosensitive chip 1030 can receive the light entered by the lens 1050.

Furthermore, the passage 101212B has an outer ring groove 101213B on the bottom side to provide a mounting position for the photosensitive wafer 1030. In particular, when the photosensitive wafer 1030 is mounted on the outer ring groove 101213 on the bottom side, the bottom surface of the photosensitive wafer 1030 and the surface of the circuit board main body 10121B are the same and are located on the same plane. The bottom surface of the photosensitive wafer 1030 is recessed inward with respect to the surface of the circuit board main body 10121B, that is, the bottom surface of the photosensitive wafer 1030 may not protrude from the bottom surface of the circuit board main body 10121B, thereby ensuring the mold The surface smoothness of the plastic circuit board assembly 1010B.

In this embodiment of the present invention, the passage 101212B is stepped, so as to facilitate the installation of the photosensitive wafer 1030, provide a stable installation position for the photosensitive wafer 1030, and expose the photosensitive area to the inner space.

It is worth mentioning that, in this embodiment of the present invention, a different chip mounting method is provided, that is, a flip chip method (FC (Flip Chip)). Mount the photosensitive wafer 1030 on the circuit board main body 10121B from the back side of the circuit board main body 10121B, instead of from the front side of the circuit board main body 10121 as in the above-mentioned embodiment, that is, from the circuit board Above the main body 10121, and the photosensitive area of the photosensitive wafer 1030 is mounted on the circuit board main body 10121 with the photosensitive area facing upward. Such a structure and mounting method make the photosensitive wafer 1030 and the molding part 1011B relatively independent, and the mounting of the photosensitive wafer 1030 will not be affected by the molding part 1011B. Plastic molding has a relatively small effect on the photosensitive wafer 1030. In addition, the photosensitive chip 1030 is embedded on the outer side surface of the circuit board main body 10121B, and does not protrude from the inner side surface of the circuit board main body 10121B, thereby leaving a larger space inside the circuit board main body 10121B , So that the height of the molded part 1011B is not limited by the height of the photosensitive wafer 1030, so that the molded part 1011B can reach a smaller height.

Specifically, when manufacturing the molded circuit board assembly, a conventional circuit board can be used as the circuit board main body 10121B, and the surface of the circuit board main body 10121B can be molded, such as by using an injection molding machine, by insert molding ( The insert molding process molds the circuit board after the SMT process (Surface Mount Technology) to form the molded part 1011B, or forms the molded part 1011B by a molding process commonly used in semiconductor packaging, and The passage 101212B is opened on the circuit board main body 10121B. The circuit board main body 10121B can be selected as, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The forming method of the molding part 1011B can be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the molding part 1011B are, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene), etc., and the molding process can be used. Resin. Those skilled in the art should understand that the foregoing selectable manufacturing methods and selectable materials are only used as examples to illustrate the possible implementation of the present invention, and are not a limitation of the present invention.

It is also worth mentioning that the motor 1060 is mounted on the molded part 1011B of the molded circuit board assembly 1010B, so that the molded part 1011B is equivalent to the function of the bracket in the traditional camera module, which is The motor 1060 provides support and a fixed position, but the assembly is different from the traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by pasting, and the The molding part 1011 is fixed to the circuit board main body 10121B through a molding process, and there is no need for a sticking and fixing process. Compared with sticking and fixing, the molding method has better connection stability and process controllability. The part 1011 does not need to reserve the glue space for AA adjustment between the main body of the circuit board, so the reserved space for AA adjustment of the traditional camera module is reduced, so that the thickness of the camera module can be reduced; on the other hand, the mold The plastic part 1011B is wrapped in the circuit element 10122B, so that the traditional support function and the circuit element can be overlapped in space, and there is no need to reserve a safe distance around the circuit device like the traditional camera module, so that the support function is provided. The height of the molding part 1011B can be set in a small range, thereby further providing a space where the thickness of the camera module can be reduced. In addition, the molding part 1011B replaces the traditional bracket, which avoids the tilt error caused by the bracket during the pasting and assembly, and reduces the accumulated tolerance of the camera module assembly.

Furthermore, the molding part 1011B includes a supporting table 10111B, and the supporting table 10111B is suitable for mounting the filter 1040 such that the filter 1040 is located above the photosensitive wafer 1030. In other words, the light entering the lens 1050 reaches the photosensitive chip 40 after passing through the action of the filter 1040. The filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).

The supporting table 10111B of the molding part 1011B forms an inner ring groove 10113B, which provides sufficient installation space for the filter 1040. It is worth mentioning that the molded part 1011B replaces the traditional bracket, connects the motor 1060 and the filter 1040, and provides an installation position of the filter 1040, so that the molded part 1011B, the filter 1040, and the circuit element 10122B are reasonably arranged to make full use of the remaining space outside the photosensitive area of the photosensitive wafer 1030, so that the camera module is minimized. At the same time, with the help of a molding process, the molding part 1011B provides a flat support platform 10111B, so that the filter 1040 can be installed flatly, and the consistency of the light path is ensured.

More specifically, the vertical section of the inner ring groove 10113B is in the shape of an L ring, communicating with the through hole 101100B of the molding part 1011B, so that the filter 1040 is supported and installed on the photosensitive wafer 1030. Sensitivity path.

It is worth mentioning that in this embodiment of the present invention, the photosensitive chip 1030 is disposed on the lower surface of the circuit board main body 10121B, and the molding part 1011B surrounds the outer surface of the circuit board main body 10121B. edge. When manufacturing the molded circuit board assembly 1010B, different manufacturing sequences can be selected. For example, but not limited to, in one embodiment, the via 101212B can be opened on the circuit board main body 10121B first, and then the The photosensitive chip 1030 is flip-chip mounted on the passage 101212B of the circuit board main body 10121, and then outside the photosensitive chip 1030, the edge position of the circuit board main body 10121B is molded to form the molding part 1011B, and The circuit element 10122B protruding from the circuit board main body 10121B is wrapped inside. In another embodiment of the present invention, the passage 101212B may be opened on the circuit board main body 10121B first, and then the molding part 1011B may be molded at the edge position of the circuit board main body 10121B, and The circuit element 10122B protruding from the circuit board main body 10121B is wrapped inside, and then the photosensitive chip 1030 is mounted on the circuit board main body 10121B so that it is located in the outer ring of the circuit board main body 10121B Slot 101213B. In another embodiment of the present invention, the molding part 1011B may be molded at the edge position of the circuit board main body 10121B first, and the circuit element 10122B protruding from the circuit board main body 10121B Wrap the inside of the circuit board main body 10121B and open the passage 101212B, then open the passage 101212B on the circuit board main body 10121B, and then install the photosensitive chip 1030 on the circuit board main body 10121B by flip-chip mounting The passage 101212B.

As shown in FIGS. 8A and 8B, it is a third modified embodiment of the molded circuit assembly of the camera module according to the first preferred embodiment of the present invention. The molded circuit board assembly 1010C includes a mold A plastic part 1011C and a circuit board part 1012C, and the mould part 1011C is connected to the circuit board part 1012C by moulding.

The circuit board portion 1012C includes a circuit board main body 10121C, and the photosensitive chip 1030 is disposed on the circuit board main body 10121C and located inside the molding portion 1011C.

Specifically, the motor 1060 is mounted on the molded part 1011C of the circuit board assembly 10C, and is electrically connected to the circuit board part 1012C, the lens 1050 is mounted on the motor 1060, and The lens 1050 can be adapted to auto focus by the motor 50. The lens 1050 is located in the photosensitive path of the photosensitive chip 1030, so that when the camera module is used to capture an image of an object, the light reflected by the object can be processed by the lens 1050 and then further by the photosensitive chip 1030 received to be suitable for photoelectric conversion.

Furthermore, the circuit board portion 1012C includes a photosensitive circuit (not shown in the figure) and at least one circuit element 10122C. The photosensitive circuit is preset in the circuit board main body 10121C, and the circuit element 10122C is electrically connected to the photosensitive circuit and the photosensitive wafer 1030 for the photosensitive work process of the photosensitive wafer 1030. The circuit element 10122C may be, for example, but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

In particular, in an embodiment of the present invention, when assembling the camera mold, the motor 1060 is electrically connected to the photosensitive circuit through a motor pin 1061, and the 1 motor pin 106 is welded to The circuit board main body 10121C.

It is worth mentioning that the molding part 1011C wraps the circuit element 10122C inside, so that the circuit element 10122C will not be directly exposed to the space, more specifically, will not be exposed to the photosensitive material. The closed environment where the chip 1030 communicates is different from the existence of circuit components in the traditional camera module, such as a blocking container, so as to prevent dust and debris from staying in the circuit components and contaminating the photosensitive chip. The molding part 1011C forms a through hole 101100C so that the molding part surrounds the The photosensitive chip 1030 is outside and provides a light path between the lens 1050 and the photosensitive chip 1030.

Further, the circuit board main body 10121C has at least one through hole 101214C, and the molding part 1011 is immersed in the through hole 101214C. Each via 101214C is provided in the molding area of the circuit board body, and is arranged in coordination with the circuit element 10122C. It is worth mentioning that the arrangement of the through hole 101214C allows the molding part 1011C to be immersed in the circuit board main body 10121C during molding, and strengthens the difference between the molding part 1011C and the circuit board main body 10121C. The adhesive force between the molded part 1011C and the circuit board main body 10121C is not easy to separate, and at the same time, the structural strength of the circuit board main body 10121C is enhanced, so that the circuit board main body 10121C can have a smaller thickness . The position and number of the vias 101214C can be set according to needs. Those skilled in the art should understand that the position and the number of the vias 101214C are not the limitation of the present invention.

It is worth mentioning that in other embodiments of the present invention, the circuit board main body 10121C can also be provided with the inner groove 101211A or the passage 101212B, so that the molded circuit board assembly 1010C can have different Advantages, such as smaller thickness and higher structural strength.

It is worth mentioning that the arrangement of the vias 101214C on the circuit board main body 10121C in the embodiment can bring some advantages, such as increasing the molding of the circuit board main body 10121C and the molding part 1011C. Of course, those skilled in the art should understand that the arrangement of the vias 101214C of the circuit board main body 10121C is not a limitation of the present invention, and the structure strength of the circuit board main body 10121C is enhanced. That is, in other embodiments of the present invention, the vias 101214C may not be provided, or different layouts and different numbers of the vias 101214C may be provided as required.

Specifically, when manufacturing the molded circuit board assembly, a conventional circuit board can be used as the circuit board main body 10121C, and the surface of the circuit board main body 10121C can be molded, such as by using an injection molding machine, by insert molding ( insert molding) process will be SMT process (Surface Mount The circuit board after the technology surface mount process) is molded to form the molded part 1011C, or the molded part 1011C is formed by a molding process commonly used in semiconductor packaging. The circuit board main body 10121C can be selected as, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The forming method of the molding part 1011C can be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the molding part 1011C are, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene), etc., and the molding process can be used. Resin. Those skilled in the art should understand that the foregoing selectable manufacturing methods and selectable materials are only used as examples to illustrate the possible implementation of the present invention, and are not a limitation of the present invention.

It is also worth mentioning that the motor 1060 is installed on the molded part 1011C of the molded circuit board assembly 1010C, so that the molded part 1011C is equivalent to the function of the bracket in the traditional camera module. The motor 1060 provides support and a fixed position, but the assembly is different from the traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board in a pasting manner, and the molding part 1011C is fixed to the circuit board main body 10121C through a molding process. The fixation has better connection stability and controllability of the process, and there is no need to reserve the glue space for AA adjustment between the molding part 1011C and the main body of the circuit board, thus reducing the need for AA adjustment of the traditional camera module. Leave space to reduce the thickness of the camera module; on the other hand, the molded part 1011C is wrapped around the circuit element 10122C, so that the traditional bracket function and the circuit element can be overlapped in space, without the need for traditional For the camera module, a safe distance is reserved around the circuit device, so that the height of the molded part 1011C with the support function can be set in a small range, thereby further providing a space where the thickness of the camera module can be reduced. In addition, the molded part 1011C replaces the traditional bracket, which avoids the tilt error caused by the bracket during the pasting and assembly, and reduces the accumulated tolerance of the camera module assembly.

Furthermore, the molding part 1011C includes a support platform 10111C, and the support platform 10111C is suitable for mounting the filter 1040 so that the filter 1040 is located above the photosensitive wafer 1030. In other words, the light entering the lens 1050 reaches the photosensitive chip 40 after passing through the action of the filter 1040. The filter 1040 can be implemented as, but not limited to, an infrared cut filter (IRCF).

The supporting table 10111C of the molding part 1011C forms an inner ring groove 10113C, which provides sufficient installation space for the filter 1040. It is worth mentioning that the molded part 1011C replaces the traditional bracket, connects the motor 1060 and the filter 1040, and provides an installation position of the filter 1040, so that the molded part 1011C, the filter 1040, and the circuit element 10122C are reasonably arranged to make full use of the remaining space outside the photosensitive area of the photosensitive wafer 1030, so that the camera module is minimized. At the same time, with the aid of a molding process, the molding part 1011C provides a flat support platform 10111C, so that the filter 1040 can be installed flatly, and the consistency of the light path is ensured.

More specifically, the inner ring groove 10113C has an L-shaped cross section and is connected to the through hole 101100C of the molding part 1011C, so that the filter 1040 is supported and installed on the photosensitive path of the photosensitive wafer 1030 .

According to this embodiment of the present invention, the photosensitive wafer 1030 is connected to the circuit board main body 10121C through a series of leads 1031, and is electrically connected to the photosensitive circuit. The lead wire 1031 may be implemented as, for example, but not limited to, gold wire, copper wire, aluminum wire, or silver wire. In particular, the series of leads 1031 of the photosensitive chip 1030 can be connected to the circuit board main body 10121C by a conventional COB method, for example, but not limited to, a welding method. That is to say, the connection between the photosensitive wafer 1030 and the circuit board main body 10121C can make full use of the existing mature connection technology to reduce the cost of the improved technology, make full use of traditional processes and equipment, and avoid waste of resources. Of course, those skilled in the art should understand that the photosensitive chip 1030 and the circuit board main body 10121C The connection of can also be achieved by any other connection mode that can achieve the purpose of the present invention, and the present invention is not limited in this respect.

It is worth mentioning that, in this embodiment of the present invention, the photosensitive wafer 1030 is disposed on the upper surface of the circuit board main body 10121C, and the molding part 1011C surrounds the outside of the photosensitive wafer. When manufacturing the molded circuit board assembly, different manufacturing sequences can be selected. For example, but not limited to, in one embodiment, the photosensitive chip 1030 can be mounted on the circuit board main body 10121C first, and then the photosensitive chip 1030 Outside the chip 1030, the edge position of the circuit board main body 10121C is molded to form the molding part 1011C, and the circuit element 10122C protruding from the circuit board main body 10121C is wrapped inside. In another embodiment of the present invention, the edge position of the circuit board main body 10121C may be first molded to form the molded part 1011C, and the circuit element protruding from the circuit board main body 10121C 10122C is wrapped inside, and then the photosensitive chip 1030 is mounted on the circuit board main body 10121C so that it is located inside the molding part 1011C.

As shown in FIG. 9 to FIG. 11, it is a camera module according to a second preferred embodiment of the present invention. The camera module is a fixed focus camera module. The camera module includes a molded circuit board assembly 1010D, a lens 1050D, and a photosensitive chip 1030D.

The lens 1050D is installed above the molded circuit board assembly 1010D. Furthermore, the molded circuit board assembly 1010D includes a molded portion 1011D and a circuit board portion 1012D, and the molded portion 1011D is connected to the circuit board portion 1012D by molding.

The circuit board portion 1012D includes a circuit board main body 10121D, and the photosensitive chip 1030D is disposed on the circuit board main body 10121D and located inside the molding portion 1011D.

Specifically, the lens 1050D is located on the photosensitive path of the photosensitive chip 1030D, so that when the camera module is used to capture an image of an object, the light reflected by the object can pass through all After the lens 1050D is processed, it is further received by the photosensitive chip 1030D to be suitable for photoelectric conversion.

Furthermore, the circuit board portion 1012D includes a photosensitive circuit and at least one circuit element 10122. The photosensitive circuit is preset in the circuit board main body 10121D, and the circuit element 10122D is electrically connected to the photosensitive circuit and the photosensitive wafer 1030D for the photosensitive work process of the photosensitive wafer 1030D. The circuit element 10122D may be, for example, but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

It is worth mentioning that the molding part 1011D wraps the circuit element 10122D inside, so that the circuit element 10122D will not be directly exposed to the space, more specifically, will not be exposed to the light The closed environment where the chip 1030D communicates is different from the existence of the circuit elements in the traditional camera module, such as a blocking container, so as to prevent dust and debris from staying in the circuit element 10122D and contaminating the photosensitive chip 1030D. The molding part 1011D forms a through hole 101100D so that the molding part 1011D surrounds the outside of the photosensitive chip 1030D and provides a light path between the lens 1050D and the photosensitive chip 1030D.

Specifically, when manufacturing the molded circuit board assembly, a traditional circuit board can be used as the circuit board main body 10121D, and the circuit board main body 10121D can be molded on the surface, such as by using an injection molding machine, by insert molding. The insert molding process molds the circuit board after the SMT process (Surface Mount Technology) to form the molded part 1011D, or forms the molded part by a molding process commonly used in semiconductor packaging 1011D. The circuit board main body 10121D can be selected as, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The forming method of the molding part 1011D can be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The material that can be selected for the molding part 1011D is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene), etc., and the molding process can be selected. To use resin. Those skilled in the art should understand that the foregoing selectable manufacturing methods and selectable materials are only used as examples to illustrate the possible implementation of the present invention, and are not a limitation of the present invention.

It is also worth mentioning that the lens 1050D is mounted on the molding part 1011D of the molded circuit board assembly 1010D, so that the molding part 1011D is equivalent to the function of a bracket in a traditional camera module. The lens 1050D provides support and a fixed position, but the assembly is different from the traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board in a pasting manner, and the molding part 1011D is fixed to the circuit board main body 10121D through a molding process. The fixation has better connection stability and controllability of the process, and there is no need to reserve a glue space for AA adjustment between the molded part 1011D and the main body of the circuit board, thus reducing the need for AA adjustment of the traditional camera module. Leave space to reduce the thickness of the camera module; on the other hand, the molded part 1011D is wrapped around the circuit element 10122D, so that the traditional bracket function and the circuit element can be overlapped in space, without the need for traditional For the camera module, a safety distance is reserved around the circuit device, so that the height of the molded part 1011D with the support function can be set in a small range, thereby further providing a space where the thickness of the camera module can be reduced. Fixed focus camera module with smaller thickness. In addition, the molded part 1011D replaces the traditional bracket, which avoids the tilt error caused by the bracket during the pasting and assembly, and reduces the accumulated tolerance of the camera module assembly.

Furthermore, the molding part 1011D includes a support platform 10111D, and the support platform 10111D is suitable for mounting a filter 1040D such that the filter 1040D is located above the photosensitive wafer 1030D. In other words, the light entering the lens 1050D reaches the photosensitive chip 40D after being acted by the filter 1040D. The filter 1040D can be implemented as, but not limited to, an infrared cut filter (IRCF).

The supporting table 10111D of the molding part 1011D forms an inner ring groove 10113D, which provides sufficient installation space for the filter 1040D. It’s worth mentioning that the molding part 1011D Instead of a traditional bracket, the lens 1050D is connected to the circuit board portion 1012D, and the installation position of the filter 1040D is provided at the same time, so that the molded portion 1011D, the filter 1040D, and the circuit The components 10122D are reasonably arranged to make full use of the remaining space outside the photosensitive area of the photosensitive wafer 1030D, so that the camera module is minimized. At the same time, with the help of a molding process, the molding part 1011D provides a flat support platform 10111D, so that the filter 1040D can be installed flatly, and the consistency of the light path is ensured.

More specifically, the inner ring groove 10113D has an L ring shape and communicates with the through hole 101100D of the molding part 1011D, so that the filter 1040D is supported and installed on the photosensitive path of the photosensitive wafer 1030D.

According to this embodiment of the present invention, the photosensitive chip 1030D is connected to the circuit board main body 10121D through a series of leads 1031D, and is electrically connected to the photosensitive circuit. The lead 51D can be implemented as, for example, but not limited to, gold wire, copper wire, aluminum wire, or silver wire. In particular, the series of leads 1031D of the photosensitive chip 1030D can be connected to the circuit board main body 10121D by a conventional COB method, for example, but not limited to, a welding method. In other words, the connection between the photosensitive wafer 1030D and the circuit board main body 10121D can make full use of the existing mature connection technology to reduce the cost of improved technology, make full use of traditional processes and equipment, and avoid waste of resources. Of course, those skilled in the art should understand that the connection between the photosensitive chip 1030D and the circuit board main body 10121D can also be achieved by any other connection mode that can achieve the purpose of the present invention. The present invention is in this respect. Unrestricted.

It is worth mentioning that in the traditional manufacturing process, after the incoming SMT of the circuit board is pasted on the blocking container, the traditional COB packaging is carried out, then the chip is attached, the gold wire is attached, and the plastic bracket or motor is attached through glue. In a manufacturing method of the present invention, after SMT, the molded part 1011D is formed on the surface of the circuit board by a molding process, and then the chip is attached and gold wire is applied.

It is worth mentioning that, in this embodiment of the present invention, the photosensitive wafer 121D is disposed on the upper surface of the circuit board main body 10121D, and the molding part 1011D surrounds the outside of the photosensitive wafer. When manufacturing the molded circuit board assembly, different manufacturing sequences may be selected. For example, but not limited to, in one embodiment, the photosensitive chip 1030D may be mounted on the circuit board main body 10121D first, and then the photosensitive chip 1030D may be mounted on the photosensitive circuit board body 10121D. Outside of the chip 1030D, the edge position of the circuit board main body 10121D is molded to form the molding part 1011D, and the circuit element 10122D protruding from the circuit board main body 10121D is wrapped inside. In another embodiment of the present invention, the edge position of the circuit board main body 10121D may be molded to form the molded part 1011D, and the circuit element protruding from the circuit board main body 10121D 10122D is wrapped inside, and then the photosensitive chip 1030D is mounted on the circuit board main body 10121D so that it is located inside the molding part 1011D.

It is worth mentioning that the lens 1050D can also be combined with different embodiments of the molded circuit assembly in the above preferred embodiment to be assembled into fixed focus camera modules with different structures, that is, the lens 1050D and the mold respectively The plastic circuit board assembly 1010A, the molded circuit board assembly 1010B, and the molded circuit board assembly 1010C are assembled to form different fixed-focus camera modules. The structure of the molded circuit board assembly can refer to the above-mentioned preferred embodiment , I won’t repeat it here.

As shown in FIG. 12 and FIG. 13, it is a camera module according to a third preferred embodiment of the present invention. The camera is molded as a dynamic focus camera module, which includes a molded circuit board assembly 1010E, a lens 1050E, and a motor 1060E.

The motor 1060E is mounted on the molded circuit board assembly 1010E, and the lens 1050E is mounted on the motor 1060E so that the lens 1050E is supported above the molded circuit board assembly 1010E.

The molded circuit board assembly 1010E includes a molded portion 1011E and a circuit board portion 1012E, and the molded portion 1011E is molded to connect to the circuit board portion 1012E.

The circuit board portion 1012E includes a circuit board main body 10121E and a photosensitive chip 1030E. The photosensitive chip 1030E is disposed on the circuit board main body 10121E and is located inside the molding portion 1011E.

Specifically, the motor 1060E is mounted on the molded portion 1011E of the circuit board assembly 10E and is electrically connected to the circuit board portion 1012E, the lens 1050E is mounted on the motor 1060E, and The lens 1050 can be adapted to auto focus by the motor 1060E. The lens 1050 is located on the photosensitive path of the photosensitive chip 1030E, so that when the camera module is used to capture an image of an object, the light reflected by the object can be processed by the lens 1050E and then further by the photosensitive chip 1030E received to be suitable for photoelectric conversion.

Furthermore, the circuit board portion 1012E includes a photosensitive circuit and at least one circuit element 10122E. The photosensitive circuit is preset in the circuit board main body 10121E, and the circuit element 10122E is electrically connected to the photosensitive circuit and the photosensitive wafer 1030E for the photosensitive work process of the photosensitive wafer 1030E. The circuit element 10122E may be, for example, but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

Particularly, in an embodiment of the present invention, when assembling the camera mold, the motor 1060E is electrically connected to the photosensitive circuit through a motor pin 1061E, and the wire is soldered to the circuit board The main body 10121E.

It is worth mentioning that the molding part 1011E wraps the circuit element 10122E inside, so that the circuit element 10122E will not be directly exposed to the space, more specifically, will not be exposed to the photosensitive material. In the closed environment where the chip 1030E is connected, it is different from the existence of the circuit components in the traditional camera module, such as a blocking container, so as to prevent dust and debris from staying in the circuit components and contaminating the photosensitive chip. The molding part 1011E forms a through hole 101100E so that the molding part surrounds the outside of the photosensitive chip 1030E and provides a light path between the lens 1050E and the photosensitive chip 1030E.

Furthermore, the circuit board main body 10121E has a passage 101212E, and the lower part of the passage 101212E is suitable for mounting the photosensitive wafer 1030E. The passage 101212E connects the upper and lower sides of the circuit board main body 10121E, so that when the photosensitive chip 1030E is mounted on the circuit board main body 10121E from the back of the circuit board main body 10121E with the photosensitive area facing upward, The photosensitive area of the photosensitive chip 1030E can receive the light entered by the lens 1050E.

Furthermore, the passage 101212E has an outer ring groove 101213E, which provides a mounting position for the photosensitive wafer 1030E. Particularly, when the photosensitive wafer 1030E is installed in the outer ring groove 101213, the outer surface of the photosensitive wafer 1030E and the surface of the circuit board main body 10121E are consistent and located on the same plane, so as to ensure that the molded circuit The surface flatness of the board assembly 1010E.

In this embodiment of the present invention, the passage 101212E is stepped, so as to facilitate the installation of the photosensitive wafer 1030E, provide a stable installation position for the photosensitive wafer 1030E, and expose the photosensitive area to the inner space.

It is worth mentioning that in this embodiment of the present invention, a chip mounting method different from the traditional chip mounting method, that is, a chip flip-chip method, is provided. Mount the photosensitive wafer 1030E on the circuit board main body 10121E from the back side of the circuit board main body 10121E, instead of from the front side of the circuit board main body 10121 as in the above embodiment, that is, from the circuit board Above the main body 10121, and the photosensitive area of the photosensitive wafer 1030 is mounted on the circuit board main body 10121 with the photosensitive area facing upward. Such a structure and mounting method make the photosensitive wafer 1030E and the molding part 1011E relatively independent, and the mounting of the photosensitive wafer 1030E will not be affected by the molding part 1011E. The molding of the molding part 1011E Plastic molding has less influence on the photosensitive wafer 1030E. In addition, the photosensitive chip 1030E is embedded on the outer side of the circuit board main body 10121E, and will not protrude from the inner side of the circuit board main body 10121E, thereby leaving a larger space inside the circuit board main body 10121E , So that the height of the molded part 1011E will not be restricted by the height of the photosensitive wafer 1030E, so that the molded part 1011E can reach a smaller height.

Specifically, when manufacturing the molded circuit board assembly, a traditional circuit board can be used as the circuit board main body 10121E, and the circuit board main body 10121E is molded on the surface, such as by using an injection molding machine, by insert molding ( The insert molding process molds the circuit board after the SMT process (Surface Mount Technology) to form the molded part 1011E, or forms the molded part 1011E by a molding process commonly used in semiconductor packaging, and The passage 101212E is opened on the circuit board main body 10121E. The circuit board main body 10121E can be selected as, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCE rigid board (without a flexible board), and the like. The forming method of the molding part 1011E can be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the molding part 1011E are, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene), etc., and the molding process can be used. Resin. Those skilled in the art should understand that the foregoing selectable manufacturing methods and selectable materials are only used as examples to illustrate the possible implementation of the present invention, and are not a limitation of the present invention.

It is also worth mentioning that the motor 1060E is mounted on the molded part 1011E of the circuit board assembly 10E, so that the molded part 1011E is equivalent to the function of the bracket in the traditional camera module. The motor 1060E provides support and a fixed position, but the assembly is different from the traditional COE process. The bracket of the camera module of the traditional COE process is fixed to the circuit board in a pasting manner, and the molding part 1011E is fixed to the circuit board main body 10121E through a molding process. The fixation has better connection stability and controllability of the process, and there is no need to reserve the glue space for AA adjustment between the molding part 1011E and the main body of the circuit board, thus reducing the need for AA adjustment of the traditional camera module. Leave space to reduce the thickness of the camera module; on the other hand, the molded part 1011E is wrapped around the circuit element 10122E, so that the traditional bracket function and the circuit element can be overlapped in space, without the need for traditional Camera module, reserve a safe distance around the circuit device, so that the height of the molding part 1011E with the support function can be set at a small The range of the camera module can be further reduced in thickness. In addition, the molded part 1011E replaces the traditional bracket, which avoids the tilt error caused by the bracket during the pasting and assembly, and reduces the accumulated tolerance of the camera module assembly.

It is worth mentioning that, different from the above-mentioned preferred embodiment, the camera module includes a filter 1040E, and the filter 1040E is mounted on the circuit board main body 10121E and is located on the photosensitive chip 1030E. Above, that is, the upper opening of the passage 101212E of the circuit board main body 10121E, so that the light entering by the lens 1050E, when passing through the passage 101212E, passes through the filter 1040E first. Different from the above-mentioned embodiment, the molding part 1011E does not need to provide the installation position of the filter 1040E, and there is no need to provide the support stand 10111. Instead, the circuit board main body 11E serves as the filter. The sheet 1040E provides a mounting position, reduces the distance between the filter 1040E and the photosensitive wafer 1030E, so that the height of the molded part 1011E can be further reduced.

The filter 1040E can be implemented as, but not limited to, an infrared cut filter (IRCF).

It is worth mentioning that, in this embodiment of the present invention, by means of the arrangement of the passage 101212E in the FC chip flip-chip mode, the filter 1040E can be installed on the circuit board main body 10121E, thereby making The circuit board assembly 10E and the camera module assembled by the circuit board assembly 10E have the advantages brought by the FC installation method and the installation method of the filter 1040E, such as convenient assembly, reduced thickness, etc., However, those skilled in the art should understand that the installation position of the optical filter 1040E is not a limitation of the present invention. In other embodiments of the present invention, the optical filter 1040E may also be installed in different positions. For example,地, but not limited to, the molded part 1011, bracket, motor, etc.

It is worth mentioning that the molded part 1011E replaces the traditional bracket and connects the motor 1060E with the circuit board part 1012E, and the circuit board part 1012E provides the installation position of the filter 1040E, so that The molding part 1011E, the filter 1040E, and the circuit element The components 10122E are reasonably arranged to make full use of the remaining space outside the photosensitive area of the photosensitive wafer 1030E, so that the camera module is minimized. At the same time, with the help of a molding process, the molding part 1011E provides a flat fixed position, so that the motor 1060E can be installed flatly, and the consistency of the light path is ensured.

It is worth mentioning that in this embodiment of the present invention, the photosensitive chip 1030E is disposed on the lower surface of the circuit board main body 10121E, and the molding part 1011E surrounds the outer surface of the circuit board main body 10121E. edge. When manufacturing the molded circuit board assembly 1010E, different manufacturing sequences can be selected. For example, but not limited to, in one embodiment, the via 101212E can be opened on the circuit board main body 10121E first, and then the The photosensitive chip 1030E is flip-chip mounted on the passage 101212E of the circuit board main body 10121, and then on the outside of the photosensitive chip 1030E, the edge position of the circuit board main body 10121E is molded to form the molded part 1011E, and The circuit element 10122E protruding from the circuit board main body 10121E is wrapped inside. In another embodiment of the present invention, the passage 101212E may be opened on the circuit board main body 10121E first, and then the molding part 1011E may be molded at the edge position of the circuit board main body 10121E, and The circuit element 10122E protruding from the circuit board main body 10121E is wrapped inside, and then the photosensitive chip 1030E is mounted on the circuit board main body 10121E so that it is located in the outer ring of the circuit board main body 10121E Slot 101213E. In another embodiment of the present invention, the molding part 1011E may be molded at the edge position of the circuit board main body 10121E first, and the circuit element 10122E of the circuit board main body 10121E may be protruded. Wrap inside the circuit board main body 10121E, open the passage 101212E, then open the passage 101212E on the circuit board main body 10121E, and then flip-chip mount the photosensitive chip 1030E on the circuit board main body 10121E The passage 101212E.

It is worth mentioning that the installation method of the molded circuit board assembly 1010E and the optical filter 1040E can also be applied to a fixed-focus camera module.

Figures 14 and 15 show the camera module according to the fourth preferred embodiment of the present invention. Different from the above-mentioned first preferred embodiment, the camera module further includes a bracket 1070. 1070 is mounted on the molded circuit board assembly 1010, the motor 1060 is mounted on the molded circuit board assembly 1010, and the lens 1050 is mounted on the motor 1060 so as to support the lens 1050 It is fixed above the molded circuit board assembly 1010. In other words, the molded circuit board components 1010, 1010A, 1010B, and 1010C can be combined with traditional brackets to be assembled into different types of camera modules, such as dynamic focus camera modules and fixed focus camera modules. The filter 1040 may be selectively installed on the bracket 1070, the molded part 1011, or the motor 1060.

It can be seen from the above-mentioned preferred embodiments that the camera module adopting the molding process can increase the competitiveness of the product in the market. Especially in high-end products, the camera module mainly has the following advantages:

1. The length and width dimensions of the module can be reduced, and the molded part and the blocking container part can overlap in space; the traditional solution bracket needs to be outside the capacitor, and a certain safety distance needs to be reserved. The molded manufacturing method of the present invention can be directly Using the capacitor space, fill plastic directly around the capacitor to form a bracket.

2. Reduce the inclination of the module, and the molded part can replace the existing plastic bracket design to reduce the cumulative tolerance.

3. Molding improves the structural strength of the circuit board. Under the same structural strength, because the molded part can play a supporting role, it can increase the strength, and the circuit board can be made thinner and reduce the height of the module.

4. In terms of height space, the traditional solution capacitors and brackets need to reserve a safe space for assembly, and the molding process can be omitted to reduce the height of the module. In the traditional solution, a safety gap between the top of the capacitor and the bracket needs to be reserved to prevent interference. In the present invention, plastic can be directly filled around circuit components, such as capacitors, without the need to reserve a space gap.

5. The resistance and capacitor parts can be wrapped by molding, which can avoid the bad spots of the module caused by the solder resist, dust, etc. in the area of the container part, and improve the product yield.

6. Suitable for high-efficiency mass production. As shown in FIGS. 14 to 18C, it is a camera module according to a fifth preferred embodiment of the present invention. The camera module includes a circuit board assembly 2010, a photosensitive chip 2030, and a lens 2050.

Further, the photosensitive chip 2030 is mounted on the circuit board assembly 2010, the lens 2050 is located on the circuit board assembly 2010, and the lens 2050 is located in the photosensitive path of the photosensitive chip 2030. The circuit board assembly 2010 may be coupled to the electronic device, so as to cooperate with the electronic device. Those skilled in the art should understand that the lens 2050 and the chip can cooperate with each other to capture images. Specifically, the light reflected by the photographed object, such as an object or a person, is received by the photosensitive chip 2030 for photoelectric conversion after passing through the lens 2050. In other words, the photosensitive chip 2030 can convert light signals into electrical signals, and the electrical signals can be transmitted to the electronic device through the circuit board assembly 2010, thereby generating and photographing the object on the electronic device. Related images.

The circuit board assembly 2010 includes an encapsulation portion 2011 and a circuit board portion 2012, and the encapsulation portion 2011 is integrally packaged and connected to the circuit board portion 2012, such as being moldedly connected to the circuit board portion 2012. More specifically, the packaging portion 2011 is connected to the circuit board portion by molding on a circuit board (Molding On Board, MOB), and the molding process may be injection molding or molding.

The circuit board portion 2012 includes a circuit board main body 20121, and the packaging portion 2011 is integrally connected to the circuit board main body 20121. The packaging portion 2011 forms a through hole 201100 so that the packaging portion 2011 surrounds the outside of the photosensitive chip 2030 and provides a light path for the lens 2050 and the photosensitive chip 2030. The photosensitive chip 2030 is disposed on the circuit board main body 20121 at a position corresponding to the through hole 201100.

The circuit board portion 2012 includes a connection line 2031 and at least one circuit element 20122, the connection line 2031 is preset in the circuit board main body 20121, and the circuit element 20122 It is electrically connected to the connecting circuit for the photosensitive work process of the photosensitive chip 2030. The circuit element 20122 may be, for example, but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, a processor, a memory, and the like.

It is worth mentioning that the packaging portion 2011 can wrap the circuit element 20122 inside, so that the circuit element 20122 will not be directly exposed to the space, more specifically, will not be exposed to the space. The photosensitive wafer 2030 is connected in a closed environment. Different from the existing way of the circuit components in the traditional camera module, such as the way that the blocking container protrudes from the circuit board, so as to prevent dust and debris from staying on the circuit element 20122 and polluting the photosensitive chip 2030. In this embodiment of the present invention, the circuit element 20122 protruding from the circuit board main body 20121 is taken as an example for description. In other embodiments of the present invention, the circuit element 20122 is embedded in the circuit. The inside of the board body 20121 does not protrude from the circuit board body 20121. Those skilled in the art should understand that the structure, type, and location of the circuit element 20122 are not limitations of the present invention. It is understandable that, in the transmission camera module, the circuit device protrudes from the circuit board, and the base can only be installed on the outside of the circuit element 20122, so both the circuit device and the base need to be Therefore, the requirements for the horizontal size of the circuit board are relatively high. For the camera module based on the molding process of the present invention, the packaging portion 2011 is integrally packaged on the circuit board main body 20121 and covers the circuit element 20122, so the packaging portion 2011 and the circuit element 20122 The space overlaps each other, thereby increasing the space in which the packaging portion 2011 can be set inward, reducing the need for external extension of the circuit board main body 20121, thereby reducing the lateral size of the camera module, so that it can meet Equipment required for miniaturization.

It is worth mentioning that the packaging portion 2011 covering the circuit element 20122 has the advantage of protecting the circuit element 20122 from being contaminated and accidentally touched, and at the same time it brings advantages to the corresponding camera module However, those skilled in the art should understand that the packaging portion 2011 is not limited to covering the circuit element 20122. That is, in other embodiments of the present invention, the seal The mounting portion 2011 can be directly molded on the circuit board main body 20121 of the circuit element 20122 without protruding, or can be molded on the outer side of the circuit element 20122 or around the circuit element 20122 in different positions.

In this embodiment of the present invention, the packaging portion 2011 protrudingly surrounds the outside of the photosensitive chip 2030. In particular, the packaging portion 2011 is integrally closed and connected, so that it has a good airtightness, so that when the When the lens 2050 is installed in the photosensitive path of the photosensitive wafer 2030, the photosensitive wafer 2030 is sealed inside, thereby forming a corresponding enclosed inner space.

Specifically, when manufacturing the circuit board assembly 2010, a traditional circuit board can be selected as the circuit board main body 20121, and molding is performed on the surface of the circuit board main body 20121. For example, in one embodiment, an injection molding machine can be used to integrate the circuit board after the SMT process (Surface Mount Technology) through an insert molding process, such as a molded package, to form the The packaging portion 2011 may be formed by a molding process commonly used in semiconductor packaging. Furthermore, each of the photosensitive chips 2030 is mounted on the circuit board main body 20121, and then each of the photosensitive chips 2030 is electrically connected to the circuit board main body 20121, such as a gold wire. The circuit board main body 20121 can be selected as, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner in which the packaging portion 2011 is formed can be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the encapsulation part 2011 are, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc., for injection molding process, and ring molding process. Oxy resin. Those skilled in the art should understand that the foregoing selectable manufacturing methods and selectable materials are only used as examples to illustrate the possible implementation of the present invention, and are not a limitation of the present invention.

In other embodiments of the present invention, the process of manufacturing the circuit board assembly 2010 may also be to first perform an SMT process on the circuit board main body 20121, and then mount the photosensitive wafer 2030 on the circuit board main body 20121 , And the photosensitive chip 2030 and the circuit board main body 20121 is electrically connected, such as a gold wire, and then the circuit board main body 20121 will be integrally packaged, such as a molded package, and the package portion 2011 is formed by insert molding, or by molding commonly used in semiconductor packaging The process forms the packaging portion 2011. Those skilled in the art should understand that the manufacturing sequence of the circuit board assembly 2010 is not a limitation of the present invention.

The camera module includes a filter 2040, and the filter 2040 is installed on the packaging part 2011 so as to provide a stable and flat installation condition for the filter 2040.

More specifically, in an embodiment of the present invention, the filter 2040 is implemented as an infrared cut filter (Infra-Red Cut Filter, IRCF), and the infrared cut filter is made of precision optical coating. Technology Alternately coat high-refractive-index optical films on the optical substrate to achieve high transmittance in the visible light region (400-630nm) and near-infrared (700-1100nm) cut-off optical filters, which can eliminate the effect of infrared light on the photosensitive wafer The imaging impact of 2030, such as CCD or CMOS. By adding the infrared cut-off filter to the imaging system of the camera module, the infrared light that interferes with the imaging quality of the imaging system is blocked, so that the image formed by the camera module is more in line with the best perception of the human eye.

It is worth mentioning that, because the photosensitive chip 2030, such as CCD or CMOS, has a different light sensitivity from the human eye, the human eye can only see visible light in the 380-780nm band, while the photosensitive chip 2030 can sense more Multi-bands, such as infrared light and ultraviolet light, are particularly sensitive to infrared light. Therefore, the infrared light must be suppressed in the camera module and the visible light must be maintained at a high transmittance, so that the sensing of the photosensitive chip 2030 is close to Human eyes, so that the image captured by the camera module is also in line with the sense of the eyes. Therefore, the infrared cut filter is indispensable for the camera module.

In particular, in the embodiment of the present invention, the filter 2040 may be selected from a combination: a wafer-level infrared cut filter, a narrowband filter, and a blue glass IRCF. Those skilled in the art should understand that the type of the filter 2040 is not a limitation of the present invention.

In the traditional COB assembled camera module, the filter is usually installed on the plastic base, and the base is usually installed on the circuit board by bonding, so this plastic base and the corresponding The installation method is not prone to deviation or tilt, and the surface flatness of the plastic bracket is poor, so it cannot provide good installation conditions for the filter 2040. According to this preferred embodiment of the present invention, the filter 2040 is mounted on the encapsulation part 2011, and based on a molding process, good surface flatness can be obtained, so that the filter 2040 can be provided with a flat surface. The installation conditions and the integral molding method make the package portion 2011 less likely to be offset or tilted, thereby reducing the cumulative tolerance during the installation of the filter 2040.

In this embodiment of the present invention, the top surface 20112 of the packaging portion 2011 extends integrally and planarly, and the filter 2040 is mounted on the top surface 20112 of the packaging portion 2011. In particular, the filter 2040 may be connected to the top surface 20112 of the packaging portion 2011 by bonding.

In this embodiment of the present invention, the camera module includes a motor 2060, such as a voice coil motor or a piezoelectric motor. The lens 2050 is installed on the motor 2060 so that the lens 2050 is driven to move by the motor 2060 to adjust the focal length of the camera module, that is, the camera module is a dynamic focus module ( Automatic Focus Module, AFM). Of course, the camera module may not have a driver, that is, it does not have the above-mentioned motor 2060, and a fixed-focus camera module is formed.

The motor 2060 is mounted on the packaging portion 2011 of the circuit board assembly 2010, and further, the motor 2060 is mounted on the top surface 20112 of the packaging portion 2011, that is, the filter 2040 and the motor 2060 coordinate with each other to occupy the top surface 20112 of the packaging portion 2011. The motor 2060 is electrically connected to the circuit board main body 20121 through at least one motor pin 2061.

The lens 2050 is mounted on the motor 2060, and the motor 2060 and the filter 2040 are mounted on the encapsulation part 2011, so that the encapsulation part 2011 is equivalent to the function of the base of a traditional camera module, which is The motor 2060 and the filter 2040 provide supporting and fixed positions, but the manufacturing, assembly and shape are different from the traditional COB process. The traditional COB process camera module The base is fixed to the circuit board by bonding, and the package portion 2011 is fixed to the circuit board main body 20121 by molding on the circuit board. No bonding and fixing process is required. The molding method is relative to the bonding and fixing method. It has better connection stability and process controllability, high flatness, and provides good installation conditions for the motor 2060 and the filter 2040, and the packaging portion 2011 and the circuit board main body There is no glue space for AA adjustment in 20121, so the reserved space for AA adjustment of the traditional camera module is omitted, so that the thickness of the camera module can be reduced; on the other hand, the packaging part 2011 covers the circuit The component 20122 allows the traditional base space and the installation space of the circuit component 20122 to overlap spatially. It does not need to reserve a safe distance around the circuit device like the traditional camera module, so that the package part 2011 with the base function can be installed In a smaller size, it further provides a space where the thickness of the camera module can be reduced. In addition, the encapsulation part 2011 replaces the traditional base, avoids the tilt error caused by the base during the pasting and assembling, and reduces the cumulative tolerance of the camera module assembly.

It is also worth mentioning that the shape of the packaging portion 2011 can be determined according to needs, for example, extending inward at the location of the circuit element 20122 to form a protrusion, thereby increasing the corresponding width of the packaging portion 2011, and In the position where there is no circuit element 20122, the packaging portion 2011 extends uniformly to form a relatively regular shape and a smaller width. Those skilled in the art should understand that the specific shape of the packaging portion 2011 is not a limitation of the present invention.

According to this embodiment of the present invention, the photosensitive chip 2030 can be electrically connected to the circuit board main body 20121 through at least one connection wire 2031, and can be electrically connected to the connection line. The connecting wire 2031 can be implemented as, for example, but not limited to, a gold wire, a copper wire, an aluminum wire, or a silver wire. In particular, the connecting wire 2031 of the photosensitive chip 2030 can be connected to the circuit board main body 20121 by a conventional COB method, for example, but not limited to, a welding method. That is to say, the connection between the photosensitive wafer 2030 and the circuit board main body 20121 can make full use of the existing mature connection technology to reduce the cost of the improved technology, make full use of traditional processes and equipment, and avoid waste of resources. Of course, those skilled in the art should understand that the photosensitive wafer 2030 and the wire The connection of the main body 20121 of the road board can also be realized by any other connection mode that can realize the purpose of the invention, and the invention is not limited in this respect.

It is worth mentioning that, in this embodiment of the present invention, each of the photosensitive chips 2030 is disposed on the upper surface of the circuit board main body 20121, and the packaging portion 2011 surrounds the outside of the photosensitive chip 2030. When manufacturing the circuit board assembly 2010, different manufacturing sequences may be selected. For example, but not limited to, in one embodiment, the photosensitive chip 2030 may be installed on the circuit board main body 20121 first, and then the photosensitive chip 2030 may be installed on the photosensitive chip 2030. Outside the chip 2030, the circuit board main body 20121 is molded to form the encapsulation portion 2011, and the circuit element 20122 protruding from the circuit board main body 20121 is covered inside. In another embodiment of the present invention, the package portion 2011 may be molded on the circuit board main body 20121 first, and the circuit element 20122 protruding from the circuit board main body 20121 may be covered on Inside, the photosensitive chip 2030 is then mounted on the circuit board main body 20121 so that it is located inside the package portion 2011.

18A, it is another implementation of the camera module according to the fifth preferred embodiment of the present invention. The camera module may be a fixed focus module (Fix Focus Module, FFM). In the camera module, the lens 2050 is mounted on the top surface 20112 of the packaging portion 2011, that is, the focal length of the camera module cannot be adjusted freely. The lens 2050 and the filter 2040 coordinately configure the top surface 20112 of the packaging portion 2011. Those skilled in the art should understand that the type of camera molding is not a limitation of the present invention.

It is worth mentioning that, according to this preferred embodiment of the present invention, the encapsulation part 2011 can be used to support the installation of the filter 2040 and the lens 2050, and has the function of a traditional base, but is based on the advantages of molding. The packaging part 2011 can control the flatness and consistency of the packaging part 2011 by means of a mold, so as to provide a flat and consistent installation environment for the color filter of the camera module and the lens 2050, thereby It is easier to ensure the consistency of the optical axis of the lens 2050, the filter 2040, and the photosensitive chip 2030, which is not easily achieved by the traditional camera module.

18B, it is another implementation of the camera module according to the fifth preferred embodiment of the present invention. The camera module may be a fixed focus module (Fix Focus Module, FFM). In the camera module, the lens 2050 is mounted on a lens holder 2080, and the lens holder 2080 is mounted on the top surface 20112 of the package portion 2011, that is, the focal length of the camera module cannot be freely Adjustment. It is understandable that the lens holder 2080 may be a holder with threads on the inner wall, or a holder without threads.

18C, it is another implementation of the camera module according to the fifth preferred embodiment of the present invention. The camera module may be a fixed focus module (Fix Focus Module, FFM). In the camera module, the lens 2050 is installed on a lens holder 2080, the lens holder 2080 is installed on a holder 2070, and the holder 2070 is installed on the top side of the packaging portion 2011.

As shown in FIG. 19, it is a camera module according to a sixth preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the packaging portion 2011 has a mounting groove 20113A, and the mounting groove 20113A is connected to the through hole 201100 so as to provide sufficient mounting space for the filter 2040. In other words, the top surface 20112 of the encapsulation portion 2011 has a stepped structure instead of extending integrally, and each step of the top surface 20112 can be used to mount the filter 2040, the lens 2050, or The motor 2060.

Further, the height of the installation groove 20113A is greater than the thickness of the filter 2040, so that when the filter 2040 is installed in the installation groove 20113A, the filter 2040 will not protrude from the The top of the package part 2011.

In particular, according to this embodiment of the present invention, the filter 2040 has a square shape, and the shape of the mounting groove 20113A is adapted to the shape of the filter 2040. In other words, the mounting groove 20113A has a square ring shape and is connected to the through hole 201100.

It is worth mentioning that in this embodiment of the present invention, the installation groove 20113A can be used to install the filter 2040, and in other implementations of the present invention, the installation groove 20113A Those skilled in the art should understand that the use of the mounting groove 20113 is not a limitation of the present invention.

It is also worth mentioning that, in this embodiment of the present invention, the moving focus module is taken as an example for description in the accompanying drawings. In other embodiments of the present invention, the camera may be a fixed focus module. Those skilled in the art should understand that the type of the camera module is not a limitation of the present invention.

As shown in FIG. 20, it is a schematic cross-sectional view of a camera module based on a molding process according to a seventh preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the camera module includes a seat 2070B, and the seat 2070B is used for mounting the filter 2040. The support 2070B is mounted on the packaging portion 2011, the filter 2040 is mounted on the packaging portion 2011, and the motor 2060 or the lens 2050 is mounted on the support 2070B.

According to this embodiment of the present invention, the holder 2070B has a first holder groove 2071B and a second holder groove 2072B, and the first holder groove 2071B is used to install the filter 2040 so that the The surface of the filter 2040 does not protrude from the top of the support 2070B. The second support groove 2072B is used to be installed in the packaging portion 2011 so that the packaging portion 2011 extends upward along the support 2070, and the position of the filter 2040 is relatively downward, thereby reducing Small the back focal length of the camera module.

In other words, the support 2070B extends into the through hole 201100 and extends downward, so as to support the filter 2040 above the photosensitive wafer 2030 and utilize the space in the through hole 201100 Therefore, while the filter 2040 is stably installed, the filter 2040 does not occupy external space.

It is worth mentioning that the distance that the support 2070B extends inward is outside the photosensitive area of the photosensitive wafer 2030, that is, the support 2070B does not block the photosensitive area of the photosensitive wafer 2030. In order to avoid affecting the photosensitive process of the photosensitive wafer 2030, the size of the support 2070B can be designed according to specific requirements.

In this embodiment of the present invention and the corresponding drawings, the dynamic focus module is taken as an example for description. The lens 2050 is installed on the motor 2060, and the motor 2060 is installed on the support 2070B. In other words, the support 2070 provides installation positions for the filter 2040 and the motor 2060. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 2050 is mounted on the support 2070B, that is, the support 2070B provides installation positions for the filter 2040 and the lens 2050. Those skilled in the art should understand that the The specific structure of the support 2070B and the type of the camera module are not limitations of the present invention.

As shown in FIG. 21, it is a schematic cross-sectional view of camera molding based on a molding process according to an eighth preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the packaging portion 2011 has a mounting groove 20113C, and the mounting groove 20113C is connected to the through hole 201100. In other words, the top surface 20112 of the encapsulation portion 2011 has a stepped structure, and does not extend integrally.

The camera module includes a seat 2070C, and the seat 2070C is used to install the filter 2040. The holder 2070C is mounted on the packaging portion 2011, the filter 2040 is mounted on the packaging portion 2011, and the motor 2060 or the lens 2050 is mounted on the packaging portion 2011.

Further, the support 2070C is installed in the mounting groove 20113C of the packaging portion 2011, and the height of the mounting groove 20113C is greater than the mounting height of the support 2070C, so that the support 2070C does not protrude. From the end of the encapsulation portion 2011. That is, the support 2070C may be arranged inside the packaging portion 2011.

According to this embodiment of the present invention, the holder 2070C has a first holder groove 2071C and a second holder groove 2072C, and the first holder groove 2071C is used to install the filter 2040 so that all The surface of the filter 2040 does not protrude from the top end of the support 2070C. The second support groove 2072C is used to be installed in the packaging portion 2011 so that the packaging portion 2011 extends upward along the support 2070C, and the position of the filter 2040 is downward, so that Reduce the camera The back focus of the module. It can be understood that, in other modified embodiments, the support 2070C may not have the above-mentioned second support groove 2072C, and the flat bottom surface of the support 72C is directly attached to the packaging portion 2011.

In other words, the support 2070C extends into the through hole 201100 and extends downward to support the filter 2040 above the photosensitive wafer 2030 and utilize the space in the through hole 201100 Therefore, while the filter 2040 is stably installed, the filter 2040 does not occupy external space. Further, the support 2070 is located outside the photosensitive area of the photosensitive wafer 2030, so as not to block the photosensitive path of the photosensitive wafer.

It is worth mentioning that the distance that the support 2070C extends inward is outside the photosensitive area of the photosensitive wafer 2030, that is, the support 2070C will not block the photosensitive wafer 2030, so as to avoid affecting the photosensitive wafer 2030. In describing the photosensitive process of the photosensitive wafer 2030, the size of the support 2070C can be designed according to specific requirements.

Different from the third preferred embodiment, the second support groove 2072C and the mounting groove 20113C of the package cooperate with each other to form a matching clamping structure, so that the support 2070C can be stabilized Installed in the installation slot 20113C. Compared with the third preferred embodiment, the filter 2040 in this embodiment is smaller from the photosensitive chip 2030, and the camera module with a smaller back focal length can be obtained.

In this embodiment of the present invention and the corresponding drawings, the dynamic focus module is taken as an example for description. The lens 2050 is installed on the motor 2060, and the motor 2060 is installed on the support 2070C. In other words, the support 2070C provides installation positions for the filter 2040 and the motor 2060. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 2050 is mounted on the support 2070C, that is, the support 2070C provides installation positions for the filter 2040 and the lens 2050. Those skilled in the art should understand that the The specific structure of the support 2070 and the type of the camera module are not limitations of the present invention.

As shown in FIG. 22, it is a schematic cross-sectional view of a camera module based on a molding process according to a ninth preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the filter 2040 is mounted on a motor 2060D, and the motor 2060D is mounted on the encapsulation part 2011, so that no additional components are required to install the filter. 2040.

The motor 2060D includes a lower end 2062D, and the lower end 2062D is suitable for mounting on the filter 2040. In other words, the lens 2050 is mounted on the upper end of the motor 2060D, and the filter 2040 is mounted on the lower end 2062D of the motor 2060D, which is located below the lens 2050.

In this embodiment of the present invention, the filter 2040 is mounted on the motor 2060D, so there is no need to provide additional components to mount the filter 2040, and the motor 2060D is directly mounted on the package Section 2011 provides smooth installation conditions for the motor 2060D.

As shown in FIG. 23, it is a schematic cross-sectional view of a camera module based on a molding process according to a tenth preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the lens 2050E includes a lens barrel 2051E and at least one lens 2052E, and each lens 2052E is installed in the lens barrel 2051E.

According to this embodiment of the present invention, the filter 2040 is installed in the lens barrel 2051E under each lens 2052E, so that no additional components are required to install the filter 2040.

More specifically, the lens barrel 2051E includes a bottom portion 20511E, and the bottom portion 20511E is used to install the filter 2040. The base of the lens barrel 2051E is adapted to the shape of the filter 2040, that is, the base has a hollow square structure to facilitate the installation of the filter 2040 therein. The upper part of the lens barrel 2051E is used to install the lens 2052E, and the shape of the lens 2052E is adapted, and the lower part is used to install the filter 2040 and is adapted to the shape of the filter 2040 Therefore, the upper part of the lens barrel 2051E as a whole is a round tubular cylinder, and the inside of the lower part is a square, and the round tube and the square are integrally connected.

The motor 2060 is installed in the encapsulation part 2011, and the filter 2040 is installed in the lens barrel 2051E, so that no additional components are required to install the filter 2040.

As shown in FIG. 24, it is a schematic cross-sectional view of a camera module based on a molding process according to an eleventh preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the circuit board assembly 2010 includes a circuit board main body 20121F, the circuit board main body 20121F has a passage 201212F, and the lower part of the passage 201212F is suitable for mounting the photosensitive chip 2030. Each of the passages connects the upper and lower sides of the circuit board main body 20121F, so that when the photosensitive wafer 2030 is mounted on the circuit board main body 20121F from the back of the circuit board main body 20121F with the photosensitive area facing upward, The photosensitive area of the photosensitive chip 2030 can receive the light entered by the lens 2050.

Furthermore, the circuit board main body 20121F has an outer groove 201213F, and the outer groove 201213F communicates with the corresponding passage to provide an installation position of the photosensitive wafer 2030. In particular, when the photosensitive wafer 2030 is installed in the outer groove 201213F, the outer surface of the photosensitive wafer 2030 and the outer surface of the circuit board main body 20121F are consistent and located on the same plane, thereby ensuring that the circuit board The surface flatness of the component 2010 In this embodiment of the present invention, the passage is stepped, so as to facilitate the installation of the photosensitive wafer 2030, provide a stable installation position for the photosensitive wafer 2030, and expose the photosensitive area内空间.

It is worth mentioning that, in this embodiment of the present invention, a chip mounting method that is different from the traditional chip mounting method, namely, a flip chip (FC) method is provided. Mount the photosensitive wafer 2030 on the circuit board main body 20121F from the back side of the circuit board main body 20121F, instead of from the front side of the circuit board main body 20121F as in the above embodiment, that is, from the circuit board The main body 20121F is mounted on the circuit board main body 20121F with the photosensitive area of the photosensitive wafer 2030 facing upward. Such a structure and installation method make the photosensitive chip 2030 and the package part 2011 Relatively independent, the installation of the photosensitive chip 2030 will not be affected by the packaging portion 2011, and the molding of the packaging portion 2011 has a relatively small impact on the photosensitive chip 2030. In addition, the photosensitive chip 2030 is embedded on the outer side of the circuit board main body 20121F, and will not protrude from the inner side of the circuit board main body 20121F, thereby leaving a larger space inside the circuit board main body 20121F , So that the height of the packaging portion 2011 will not be restricted by the height of the photosensitive chip 2030, so that the packaging portion 2011 can reach a smaller height.

It is worth mentioning that, in this embodiment of the present invention, the filter 2040 is installed at the upper end of the passage, that is, the filter 2040 covers the passage of the circuit board main body 20121F. There is no need to install the filter 2040 on the packaging part 2011, thereby greatly reducing the back focal length of the array camera module and reducing the height of the camera. In particular, the filter 2040 may be implemented as an infrared cut filter IRCF. In other words, the optical filter 2040 is installed on the circuit board main body 20121F without providing additional components, such as a support.

As shown in FIGS. 25A to 26, it is a camera module based on a molding process according to a twelfth preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the packaging portion 2011 has a mounting groove 20113G, and the mounting groove 20113G is connected to the through hole 201100. In other words, the top surface 20112G of the encapsulation portion 2011 has a stepped structure, and does not extend integrally.

Further, the camera module includes a seat 2070G, and the seat 2070G is used to install the filter 2040. The holder 2070G is mounted on the packaging portion 2011, the filter 2040 is mounted on the holder 2070G, and the motor 2060 or the lens 2050 is mounted on the packaging portion 2011. For example, the support 2070G may be fixedly installed on the packaging portion 2011 by means of bonding.

Further, the packaging portion 2011 has raised steps 20115G on at least two side surfaces of the top side, and at least one side surface does not have the above-mentioned raised steps 20115G, and a mounting groove 20113G is formed. That is to say, in this embodiment, the cross section of the mounting groove 20113G is not a closed structure. Instead, there is a gap 201131G at least on one side. For stability, at least two symmetrical raised steps 20115G can be provided, that is, two symmetrical mounting grooves 20113 are formed. For example, the number of the raised steps 20115G can be one, two, three or four. When the number of protruding steps 20115G is two, they can be selectively provided on two symmetrical sides, and the other two-sided symmetrical gaps 201131G are formed; when the number of protruding steps 20115G is three , Optionally set any three sides, and form one gap 201131G; when the number of raised steps 20115G is four, there is no gap 201131G, that is, the raised steps 20115G form a closed, The closed installation slot 20113G. In different embodiments, the support 2070G matches the raised steps 20115 with different structures and the mounting groove 201131G formed thereon. When the support 2070G is installed in the mounting groove 20113G, The gap 201131G is filled to form a closed internal environment for the photosensitive wafer 2030. In other words, the support 2070G can extend to the gap 201131G.

It is worth mentioning that the shape of the raised step 20115G may be a regular linear structure or an irregular bent structure. Correspondingly, the cross-sectional structure of the support 2070G may be a regular structure or an irregular bending structure.

Further, the support 2070G includes at least one extending side 2073G, and the extending side 2073G corresponds to the notch 201131G of the mounting groove 20113G. In particular, the number of good positions of the extending edges 2073G corresponds to the number and positions of the gaps 201131G. Of course, when the number of the raised steps 20115G is four to form a closed structure, the extension side 2073G does not need to be provided, and each side of the support 2070 corresponds to the mounting groove 20113G. Of course, in another embodiment of the present invention, the package portion 2011 may not be provided with the raised step 20115G, that is, the package portion 2011 forms a platform structure, and the support 2070 is mounted on the The platform structure, and correspondingly, the support 2070G includes four extending sides 2073G, which are respectively adapted to overlap each side of the packaging portion 2011. The width of each extension side can be determined according to the width of the encapsulation portion 2011, and is not limited to uniform Width, that is, the support may have a wider extending side 2073G, or a narrower extending side 2073G.

The support 2070G is installed in the mounting groove 20113G of the encapsulation portion 2011, and the height of the mounting groove 20113G is greater than the mounting height of the support 2070G, so that the support 2070G will not protrude The top end of the package portion 2011. For example, the height of the mounting groove 20113G is greater than the height of the support 2070G by 0.05 mm, so that when the motor 2060 is mounted on the encapsulation part 2011, the bottom of the motor 2060 will not directly contact the The support 2070G, and the lens installed in the motor 2060 will not contact the support 2070G. It is worth mentioning that, in this embodiment of the present invention, a dynamic focus camera module is taken as an example for description. The motor is installed in the package portion 2011, while in other embodiments of the present invention, the The camera module may also be a fixed focus module, and the lens 2050 is installed in the packaging part 2011. In particular, the holder 2070G is not in direct contact with the barrel and lens of the lens 2050.

It is understandable that when the photosensitive chip 2030 has a larger size and the packaging portion 2011 has a smaller wall thickness, the above design can still enable the packaging portion 2011 to provide space for installing the support 2070G, so as to provide Install the filter. As shown in FIGS. 11A to 12, the top of the package portion 2011 may form the raised steps 20115 on three sides, and the other side does not have the raised steps 20115 and is directly used to support the support 2070G . As shown in the cross-sectional view in FIG. 25A, it can be seen that there are the raised steps 20115 on the left and right sides, and the inner side of the raised steps is used to install the support 2070G. In another cross-sectional view shown in FIG. 25B, the top surface of the encapsulation portion 2011 on the left directly supports the support 2070G, and the inner side of the raised step 20115 on the right is used to limit the support 2070G .

Moreover, in this embodiment, the top surface of the raised step 20115 may be higher than the top surface of the support 2070G, so that the motor 2060 is mounted on the raised step 20115, so that the package portion 2011 It is integrally formed, and the motor 2060 only contacts the raised step 20115 of the encapsulation portion 2011, so that the inclination of the motor 2060 can be reduced.

It is worth mentioning that the circuit elements 20122 may not be evenly arranged on the circuit board main body 20121, so the positions reserved on the circuit board main body 20121 where the packaging portion 2011 is arranged are not in a regular symmetrical relationship. For example, the side with the circuit element 20122 is reserved wider, while the side without the circuit element 20122 is relatively narrow. In this case, the problem is that the package part is narrower. It is difficult to set the mounting groove at the position of, and in this embodiment of the present invention, the mounting groove 20113G is U-shaped. The connecting 113G is connected to the outside, and the encapsulation portion 2011 is wider. The mounting groove 20113G is only connected to the through hole 201100 and not to the external environment, thereby forming a U-shaped mounting groove 20113G. The support 2070G is installed in the mounting groove 20113G, and can be stably supported in a wide or narrow area of the encapsulation portion 2011, so that the filter 2040 is stably installed. In other words, the extension side 2073G of the support 2070G is filled in the opening of the U-shaped structure, so that the mounting groove 20113G is closed, and the top surface of the encapsulation portion 2011 is relatively uniform in height to facilitate installation The motor 60 or the lens 50.

It is worth mentioning that, according to an embodiment of the present invention, the height of the mounting groove 20113G is greater than the height of the support 2070G, so in the U-shaped opening area of the mounting groove 20113G, when the support 2070G is When installed in the mounting groove 20113G, there is a gap between the support 2070G and the side surface of the motor 2060. Therefore, in the camera module, the gap is sealed by a seal, so that the photosensitive The chip 2030 is isolated from the outside. In particular, in one embodiment, the sealant is a colloid. That is to say, after the camera module is assembled, the support 2070G is mounted on the packaging portion 2011 by the glue for sealing.

According to this embodiment of the present invention, the holder 2070G has a first holder groove 2071G and a second holder groove 2072G, and the first holder groove 2071G is used to install the filter 2040 so that all The surface of the filter 2040 does not protrude from the top end of the support 2070G. The second support groove 2072G is used to be installed in the packaging portion 2011 so that the packaging portion 2011 is along the The support 2070G extends upward, and the positional alignment of the filter 2040 is downward, thereby reducing the back focus of the camera module.

The shape of the first supporting groove 2071G matches the shape of the filter 2040, and the shape of the second supporting groove 2072 matches the shape of the mounting groove 20113 of the packaging portion 2011.

In other words, the support 2070G extends into the through hole 201100 and extends downward, so as to support the filter 2040 above the photosensitive wafer 2030 and utilize the space in the through hole 201100 Therefore, while the filter 2040 is stably installed, the filter 2040 does not occupy external space.

It is worth mentioning that the distance that the support 2070G extends inward is outside the photosensitive area of the photosensitive wafer 2030, that is, the support 2070G will not block the photosensitive wafer 2030, so as to avoid affecting the In describing the photosensitive process of the photosensitive wafer 2030, the size of the support 2070G can be designed according to specific requirements.

Different from the seventh preferred embodiment, the second support groove 2072G and the mounting groove 20113G of the packaging portion 2011 cooperate with each other to form a matching clamping structure, so that the support 2070G can be It is stably installed in the installation slot 20113G. Compared with the third preferred embodiment, the filter 2040 in this embodiment is smaller from the photosensitive chip 2030, and the camera module with a smaller back focal length can be obtained.

In this embodiment of the present invention and the corresponding drawings, the dynamic focus module is taken as an example for description. The lens 2050 is installed on the motor 2060, and the motor 2060 is installed on the support 2070G. In other words, the support 2070C provides installation positions for the filter 2040 and the motor 2060. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 2050 is mounted on the holder 2070G, that is, the holder 2070G is the filter The sheet 2040 and the lens 2050 provide installation positions. Those skilled in the art should understand that the specific structure of the support 2070G and the type of the camera module are not limitations of the present invention.

It is worth mentioning that, according to different requirements, the support 2070G can be designed with different structures, such as the support 1070, the support 2070 and the subsequent support 3070G and the support of the aforementioned embodiment. The seat 3070H is convenient to install different components, such as the filter 2040, the motor 2060, and the lens 2050. In this embodiment of the present invention, the filter 2040 is mounted on the support 2070G, the support 2070G is mounted on the packaging part 2011, the lens 2050 is mounted on the motor 2060, The bottom part of the motor 2060 is supported by the encapsulation part 2011, and the other part is located above the support 2070G, for example, one side overlaps the support 2070G to form a dynamic focus module. In another embodiment of the present invention, the bottom part of the lens 2050 is supported by the encapsulation part 2011, and the other part is located above the support 2070G to form a fixed focus module. In another embodiment of the present invention, the filter 2040 is mounted on the support 2070, the support 2070 is mounted on the packaging part 2011, the lens is mounted on the motor 2060, The motor 2060 is completely supported and installed on the packaging portion 2011 without the support of the support 2070, that is, the support is completely located inside the packaging portion 2011. In another embodiment of the present invention, the lens 2050 is completely supported and installed on the packaging portion 2011 to form a fixed focus module. In another embodiment of the present invention, the motor 2060 or the lens 2050 is fully supported and mounted on the support 2070, that is, the support 2070 is provided on the encapsulation part 2011 and the mount 2070. Between the motor 2060 or the lens 2050. In another embodiment of the present invention, the filter 2040 is not installed on the support, but is installed on the photosensitive chip 2030 or the circuit board main body 20121.

Those skilled in the art should understand that the structural features of the packaging portion 2011 and the support 2070G in this embodiment of the present invention can be combined and applied to other embodiments of the present invention, and are not limited to those of the present invention. This embodiment.

In the above-mentioned embodiments and drawings, a dynamic focus module is taken as an example to illustrate the principle of the present invention. In other embodiments of the present invention, the camera module may also be fixed-focus molding. Those skilled in the art It should be understood that the type of the camera module is not a limitation of the present invention. As shown in FIGS. 27-29, the camera module is based on the integrated packaging process according to the thirteenth preferred embodiment of the present invention. The camera module can be applied to various electronic devices to assist the electronic device to perform shooting activities through the camera module. For example, the camera module can be used to capture images or video images of objects or people. Wait. Preferably, the camera module can be applied to a mobile electronic device, for example, the mobile electronic device can be, but not limited to, a mobile phone or a tablet computer device.

As shown in FIGS. 27-29, the camera module includes an integrated base assembly 3010, a photosensitive chip 3030, and a lens 3050.

Furthermore, the photosensitive wafer 3030 is mounted on the integrated base assembly 3010, the lens 3050 is located on the integrated base assembly 3010, and the lens 3050 is located in the photosensitive path of the photosensitive wafer 3030. The integrated base assembly 3010 can be coupled to the electronic device so as to cooperate with the electronic device. Those skilled in the art should understand that the lens 3050 and the photosensitive chip 3030 can cooperate with each other to capture images. Specifically, the light reflected by the photographed object, such as an object or a person, is received by the photosensitive chip 3030 for photoelectric conversion after passing through the lens 3050. In other words, the photosensitive wafer 3030 can convert an optical signal into an electrical signal, and the electrical signal can be transmitted to the electronic device through the integrated base assembly 3010, thereby generating and photographing on the electronic device. Object-related images.

The integrated base assembly 3010 includes a base portion 3011 and a circuit board portion 3012, and the base portion 3011 is integrally packaged and connected to the circuit board portion 3012, such as molded to be connected to the circuit board portion 3012 . More specifically, the base portion 3011 is connected to the circuit board portion 3012 by molding on the circuit board (Molding On Board, MOB). In other words, the base portion 3011 It is directly connected to the circuit board portion 3012 instead of being connected by an intermediate, such as glue, so the base portion 3011 and the circuit board portion 3012 have better connection firmness.

The circuit board portion 3012 includes a circuit board main body 30121, and the base portion 3011 is integrally connected to the circuit board main body 30121. The base portion 3011 forms a through hole 301100 so that the base portion 3011 surrounds the outside of the photosensitive wafer 3030 and provides a light path for the lens 3050 and the photosensitive wafer 3030. The photosensitive wafer 3030 is disposed on the circuit board main body 30121 at the corresponding position of the through hole 301100.

The circuit board portion 3012 includes a connecting circuit and at least one circuit element 30122. The connecting circuit is preset in the circuit board main body 30121. The circuit element 30122 is electrically connected to the connecting circuit for the photosensitive chip 3030's photosensitive work process. The circuit element 30122 may be, for example, but not limited to, a resistor, a capacitor, a diode, a triode, a potentiometer, a relay, a driver, a processor, a memory, and the like.

It is worth mentioning that the base portion 3011 can wrap the circuit element 30122 inside, so that the circuit element 30122 will not be directly exposed to the space, more specifically, will not be exposed to the space. The photosensitive wafer 3030 is connected in a closed environment. Different from the conventional camera module, the circuit components exist in the way, such as the way that the blocking container protrudes from the circuit board, so as to prevent dust and debris from staying on the circuit element 30122 and polluting the photosensitive wafer 3030. In this embodiment of the present invention, the circuit element 30122 protruding from the circuit board main body 30121 is taken as an example for description. In other embodiments of the present invention, the circuit element 30122 is embedded in the circuit. The inside of the board main body 30121 does not protrude from the circuit board main body 30121. Those skilled in the art should understand that the structure, type and location of the circuit element 30122 are not limited by the present invention. It is understandable that, in the transmission camera module, the circuit device protrudes from the circuit board, and the base can only be installed on the outside of the circuit element 30122, so both the circuit device and the base need to be fixed. Therefore, the requirements for the horizontal size of the circuit board are relatively high. For the integrated package of the present invention For the camera module of the technology, the base portion 3011 is integrally packaged on the circuit board main body 30121 and covers the circuit element 30122, so the base portion 3011 and the circuit element 30122 overlap each other in space, thereby The space in which the base portion 3011 can be set inward is increased, and the need for external extension of the circuit board main body 30121 is reduced, thereby reducing the lateral size of the camera module, so that it can meet the requirements of miniaturization. .

It is worth mentioning that the base portion 3011 covering the circuit element 30122 has the advantage of protecting the circuit element 30122 from being contaminated and accidentally touched, and at the same time, it brings benefits to the corresponding camera module. However, those skilled in the art should understand that the base portion 3011 is not limited to covering the circuit element 30122. That is to say, in other embodiments of the present invention, the base portion 3011 may be directly molded on the circuit board main body 30121 without the protruding circuit element 30122, or it may be molded on the circuit board. The outside and surroundings of the element 30122 are located at different locations.

In this embodiment of the present invention, the base portion 3011 protrudingly surrounds the outside of the photosensitive wafer 3030. In particular, the base portion 3011 is integrally closed and connected, so that it has a good sealing performance, thereby When the lens 3050 is installed in the photosensitive path of the photosensitive wafer 3030, the photosensitive wafer 3030 is sealed inside, thereby forming a corresponding closed inner space.

Specifically, when manufacturing the integrated base assembly 3010, a conventional circuit board can be selected as the circuit board main body 30121, and the circuit board main body 30121 is molded on the surface. For example, in one embodiment, an injection molding machine can be used to integrate the circuit board after the SMT process (Surface Mount Technology) through an insert molding process, such as a molded package, to form the The base portion 3011, or the base portion 3011 may be formed by a molding process commonly used in semiconductor packaging. Furthermore, each of the photosensitive wafers 3030 is mounted on the circuit board main body 30121, and then each of the photosensitive chips 3030 and the circuit board main body 30121 are electrically connected, such as a gold wire. The circuit board main body 30121 can be selected as, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The base portion 3011 The forming method can be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The material that can be selected for the base portion 3011 is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene), etc., and the molding process can be used. Epoxy resin. Those skilled in the art should understand that the foregoing selectable manufacturing methods and selectable materials are only used as examples to illustrate the possible implementation of the present invention, and are not a limitation of the present invention.

In other embodiments of the present invention, the process of manufacturing the integrated base assembly 3010 may also be to first perform an SMT process on the circuit board main body 30121, and then mount the photosensitive wafer 3030 on the circuit board main body. 30121, and electrically connect the photosensitive chip 3030 and the circuit board main body 30121, such as a gold wire, and then integrate the circuit board main body 30121, such as a molded package, by insert molding The base portion 3011 is formed, or the base portion 3011 is formed by a molding process commonly used in semiconductor packaging. Those skilled in the art should understand that the manufacturing sequence of the integrated base assembly 3010 is not a limitation of the present invention.

The camera module includes a filter 3040, and the filter 3040 is installed on the base portion 3011 so as to provide a stable and flat installation condition for the filter 3040.

More specifically, in an embodiment of the present invention, the filter 3040 is implemented as an infrared cut filter (Infra-Red Cut Filter, IRCF), and the infrared cut filter is made of precision optical coating. Technology Alternately coat high-refractive-index optical films on the optical substrate to achieve high transmittance in the visible light region (400-630nm) and near-infrared (700-1100nm) cut-off optical filters, which can eliminate the effect of infrared light on the photosensitive wafer 3030's imaging effects, such as CCD or CMOS. By adding the infrared cut filter 3040 to the imaging system of the camera module, the infrared light that partially interferes with the imaging quality of the imaging system is blocked, so that the image formed by the camera module is more in line with the best perception of the human eye.

It is worth mentioning that, because the photosensitive chip 3030, such as CCD or CMOS, has a different light sensitivity from the human eye, the human eye can only see visible light in the 380-780nm band, and the photosensitive chip The 3030 can sense more wavelengths, such as infrared light and ultraviolet light, and is particularly sensitive to infrared light. Therefore, infrared light must be suppressed in the camera module and the visible light must be maintained at a high transmittance, so that the photosensitive chip The sensing of 3030 is close to the human eye, so that the image captured by the camera module also matches the sensing of the eyes. Therefore, the infrared cut filter 3040 is indispensable for the camera module.

In particular, in the embodiment of the present invention, the filter 3040 may be selected from a combination: a wafer-level infrared cut filter, a narrowband filter, and a blue glass IRCF. Those skilled in the art should understand that the type of the filter 3040 is not a limitation of the present invention.

In the traditional COB assembled camera module, the filter is usually installed on the plastic base, and the base is usually installed on the circuit board by bonding, so this plastic base and the corresponding installation method are not prone to deviation Or inclined, and the surface of the plastic bracket is poorly flat, so it cannot provide good installation conditions for the filter 3040. According to this preferred embodiment of the present invention, the filter 3040 is mounted on the base portion 3011, and based on a molding process, a good surface flatness can be obtained, so that the filter 3040 can be flattened The installation conditions of the optical filter and the integral molding method make the base portion 3011 less likely to be eccentric or inclined, thereby reducing the cumulative tolerance during installation of the filter 3040.

It is also worth mentioning that the shape of the base portion 3011 can be determined according to needs. For example, the circuit element 30122 extends inward to form a protrusion, thereby increasing the corresponding width of the base portion 3011. , And at the position where the circuit element 30122 is not present, the base portion 3011 extends uniformly to form a relatively regular shape and a smaller width. Those skilled in the art should understand that the specific shape of the base portion 3011 is not a limitation of the present invention.

Further, the base portion 3011 includes a covering section 30114 and a filter mounting section 30115. The filter mounting section 30115 is integrally connected to the covering section 30114 by molding, and the covering section 30114 is integrally connected to the covering section 30114. It is molded and connected to the circuit board main body 30121 for covering the circuit element 30122. The filter mounting section 30115 is used for mounting the filter 3040.

That is, when the integrated base assembly 3010 is used to assemble the camera module, the filter 3040 of the camera module is installed on the filter mounting section 30115, so that the The filter 3040 is located on the corresponding photosensitive path of the photosensitive wafer 3030, and no additional filter 3040 mounting bracket is required. That is to say, the base portion 3011 has the function of a traditional lens holder here, but based on the advantages of an integrated packaging process, the top of the filter mounting section 30115 can be molded with the help of a molding process to make it have a good The flatness, so that the filter 3040 is installed flatly, is also superior to the traditional camera module.

Furthermore, the filter mounting section 30115 forms a mounting groove 30113, and the mounting groove 30113 is communicated with the through hole 301100 to provide sufficient mounting space for the filter 3040, so that the filter 3040 It does not protrude from the top surface of the filter mounting section 30115. In other words, the mounting groove 30113 is provided at the upper end of the base portion 3011, so that each of the filters 3040 is stably mounted on the base portion 3011 without protruding from the base portion 3011. The top.

It is worth mentioning that, in this embodiment of the present invention, the installation groove 30113 can be used to install the filter 3040, and in other implementations of the present invention, the installation groove 30113 can be used to install the filter 3040. As for the components such as the motor or lens of the camera module, those skilled in the art should understand that the purpose of the mounting groove 30113 is not a limitation of the present invention.

In other words, the base portion 3011 has the mounting groove 30113, and the mounting groove 30113 is connected to the through hole 301100, so as to provide sufficient mounting space for the filter 3040. That is to say, the top surface 30112 of the base portion 3011 has a stepped structure instead of extending integrally, and each step of the top surface 30112 can be used to install the filter 3040 and the lens 3050. Or the motor 3060.

Further, the height of the installation groove 30113 is greater than the thickness of the filter 3040, so that when the filter 3040 is installed in the installation groove 30113, the filter 3040 will not protrude from the The top end of the base portion 3011.

In particular, according to this embodiment of the present invention, the filter 3040 has a square shape, and the shape of the mounting groove 30113 is adapted to the shape of the filter 3040. In other words, the cross section of the mounting groove 30113 is in a square ring shape, and is connected to the through hole 301100.

It is worth mentioning that, in this embodiment of the present invention, the installation groove 30113 can be used to install the filter 3040, and in other implementations of the present invention, the installation groove 30113 can be used to install the filter 3040. For components such as the motor 3060 or the lens 3050 of the camera module, those skilled in the art should understand that the purpose of the mounting groove 30113 is not a limitation of the present invention.

In this embodiment of the present invention, the camera module includes a motor 3060, such as a voice coil motor, and the lens 3050 is mounted on the motor 3060 so as to drive the lens 3050 to move through the motor 3060, The focal length of the camera module is adjusted, that is, the camera module is an Automatic Focus Module (AFM). The motor 3060 is electrically connected to the circuit board main body 30121 through at least one motor pin 3061.

It is also worth mentioning that, in this embodiment of the present invention, the moving focus module is taken as an example for description in the accompanying drawings. In other embodiments of the present invention, the camera may be a fixed focus module. Those skilled in the art should understand that the type of the camera module is not a limitation of the present invention.

The motor 3060 is mounted on the base portion 3011 of the integrated base assembly 3010, and further, the motor 3060 is mounted on the top surface 30112 of the base portion 3011, that is, the The filter 3040 and the motor 3060 coordinate with each other to occupy the top surface 30112 of the base portion 3011. The motor 3060 is electrically connected to the circuit board main body 30121 through at least one motor pin 3061.

The lens 3050 is mounted on the motor 3060, and the motor 3060 and the filter 3040 are mounted on the base portion 3011, so that the base portion 3011 functions as a base of a conventional camera module , Provides support and fixed positions for the motor 3060 and the filter 3040, but the manufacturing, assembly and form are different from the traditional COB process. The traditional COB process camera module The base is fixed to the circuit board by bonding, and the base part 3011 is fixed to the circuit board main body 30121 by molding on the circuit board. No bonding and fixing process is needed. The molding method is relative to the bonding and fixing. The method has better connection stability and process controllability, higher flatness, and provides good installation conditions for the motor 3060 and the filter 3040, and the base portion 3011 and the circuit There is no glue space for AA adjustment in the board main body 30121, so the reserved space for AA adjustment of the traditional camera module is omitted, so that the thickness of the camera module can be reduced; on the other hand, the base part 3011 covers The circuit element 30122 allows the traditional base space and the circuit element 30122 installation space to overlap spatially, and does not need to reserve a safe distance around the circuit device like a traditional camera module, so that the base with the base function The part 3011 can be arranged in a smaller size, thereby further providing a space where the thickness of the camera module can be reduced. In addition, the base portion 3011 replaces the traditional base, which avoids the tilt error caused by the attachment and assembly of the base, and reduces the accumulated tolerance of the camera module assembly.

It is also worth mentioning that the shape of the base portion 3011 may need to be determined more, for example, extending inwardly at the location of the circuit element 30122 to form a protrusion, thereby increasing the corresponding width of the base portion 3011 , And where there is no circuit element 30122, the one-piece molded part extends uniformly to form a relatively regular shape with a smaller width. Those skilled in the art should understand that the shape of the base portion 3011 is not a limitation of the present invention.

According to this embodiment of the present invention, the photosensitive chip 3030 can be electrically connected to the circuit board main body 30121 through at least one connecting wire 3031, and can be electrically connected to the connecting line. The connecting wire 3031 may be implemented as, for example, but not limited to, gold wire, copper wire, aluminum wire, or silver wire. In particular, the connecting wire 3031 of the photosensitive chip 3030 can be connected to the circuit board main body 30121 by a conventional COB method, for example, but not limited to, a welding method. That is to say, the connection of the photosensitive wafer 3030 and the circuit board main body 30121 can make full use of the existing mature connection technology to reduce the cost of the improved technology, make full use of traditional processes and equipment, and avoid waste of resources. Of course, those skilled in the art should understand that the photosensitive wafer 3030 and the wire The connection of the main body 30121 of the road board can also be realized by any other connection mode that can realize the purpose of the invention, and the invention is not limited in this respect.

It is worth mentioning that, in this embodiment of the present invention, each of the photosensitive wafers 3030 is disposed on the upper surface of the circuit board main body 30121, and the base portion 3011 surrounds the outside of the photosensitive wafer 3030. . When manufacturing the integrated base assembly 3010, different manufacturing sequences can be selected. For example, but not limited to, in one embodiment, the photosensitive wafer 3030 can be mounted on the circuit board body 30121 first, and then the photosensitive wafer 3030 can be mounted on the circuit board body 30121. Outside the photosensitive wafer 3030, the circuit board main body 30121 is molded to form the base portion 3011, and the circuit element 30122 protruding from the circuit board main body 30121 is covered inside. In another embodiment of the present invention, the base portion 3011 may be molded on the circuit board main body 30121 first, and the circuit element 30122 protruding from the circuit board main body 30121 may be covered Inside it, the photosensitive chip 3030 is then mounted on the circuit board main body 30121 so that it is located inside the base portion 3011.

Referring to FIG. 30, it is another implementation of the camera module according to the thirteenth preferred embodiment of the present invention. The camera module may be a fixed focus module (Fix Focus Module, FFM). In the camera module, the lens 3050 is mounted on the top surface 30112 of the base portion 3011, that is, the focal length of the camera module cannot be adjusted freely. The lens 3050 and the filter 3040 are coordinated to configure the top surface 30112 of the base portion 3011, and the filter 3040 is installed in the mounting groove 30113. Those skilled in the art should understand that the type of camera molding is not a limitation of the present invention.

It is worth mentioning that, according to this preferred embodiment of the present invention, the base portion 3011 can be used to support and install the filter 3040 and the lens 3050, and has the function of a traditional base, but based on a molded Advantageously, the base part 3011 can control the flatness and consistency of the base part 3011 with the help of a mold, so as to improve the filter 3040 and the lens 3050 of the camera module. Provides a flat and consistent installation environment, so that it is easier to ensure the consistency of the optical axis of the lens 3050, the filter 3040, and the photosensitive chip 3030, which is not easily achieved by the traditional camera module.

31A, according to the fourteenth preferred embodiment of the camera module of the present invention, the integrated base assembly 3010 of the camera module includes a motor connection structure 3013 for connecting the camera module Motor 3060. The motor 3060 has at least one motor pin 3061. The motor connection structure 3013 includes at least one lead 30131, and each lead 30131 is used to electrically connect the motor 3060 and the circuit board main body 30121. Each lead 30131 is electrically connected to the circuit board main body 30121. Furthermore, each of the lead wires 30131 is electrically connected to the connection circuit of the circuit board main body 30121. The lead wire 30131 is disposed on the base portion 3011 and extends to the top end of the base portion 3011. The lead 30131 includes a motor connecting end 3013111311 exposed at the top of the base portion 3011 for electrically connecting the motor pin 3061 of the motor 3060. It is worth mentioning that the lead wire 30131 may be buried when the base portion 3011 is formed. In the traditional connection method, components such as the drive motor are connected to the circuit board by setting a separate wire, the manufacturing process is relatively complicated, and the method of embedding the lead 30131 during the molding of the present invention can replace the traditional method. The process of motor welding and other processes, and makes the circuit connection more stable. In particular, in an implementation of the present invention, the lead 30131 is a wire, which is embedded in the base portion 3011. For example, the motor pin 3061 may be connected to the motor connection terminal 301311 through an anisotropic conductive adhesive film, or may be connected to the motor connection terminal 301311 through welding.

It is worth mentioning that the buried position of the lead wire 30131 and the position of the motor connection end 301311 of the lead wire 30131 displayed on the base portion 3011 can be set as required, for example, in an embodiment of the present invention The motor connection end 301311 of the lead 30131 may be arranged on the periphery of the base portion 3011, that is, the top surface of the base portion 3011, the top surface of the filter mounting section 30115, and In another embodiment of the present invention, the motor connecting end 301311 may be disposed on the inner circumference of the base portion 3011, that is, at the bottom of the mounting groove 30113 of the base portion 3011. In this way, different installation positions of the motor 3060 can be provided. In other words, when the motor 3060 needs to be installed on the top of the base portion, the motor connecting end 301311 is provided on the outer top surface of the base portion, and when the motor 3060 needs to be installed on the mounting groove 30113 At this time, the motor connecting end 301311 is disposed on the inner circumference of the base portion 3011, that is, on the bottom surface of the mounting groove 30113.

That is to say, when manufacturing the integrated base assembly 3010, each of the photosensitive wafers 3030 can be attached to the circuit board main body 30121 first, and then the circuit board main body 30121 can be molded by MOB. The base portion 3011 can be embedded in the base portion 3011 during molding. The lead wire 30131 can be electrically connected to the circuit board main body 30121, and the lead wire 30131 can be electrically connected to the circuit board main body 30121. The motor connecting end 301311 is displayed on the top of the base part so as to be easily connected to the motor pin 3061 of the motor 3060. For example, when the integrated base assembly 3010 is used to assemble the camera molding, each motor pin 3061 of the motor 3060 is connected to the motor connection end of the lead 30131 by welding 301311, so that the motor 3060 is electrically connected to the circuit board main body 30121, and a separate wire needs to be provided to connect the motor 3060 and the circuit board main body 30121, and make the motor pins of the motor 3060 The length of 3061 can be reduced.

Refer to FIG. 31B for an equivalent embodiment of the motor connection structure according to the above-mentioned preferred embodiment of the present invention. The motor connection structure 3013 includes a pin slot 30133 for accommodating the motor pin 3061 of the motor 3060 of the camera module. The pin groove 30133 is provided at the upper end of the base portion 3011. The motor connection structure 3013 includes at least one lead 30134, and each lead 30134 is used to electrically connect the motor 3060 and the circuit board main body 30121. The lead wire 30134 is disposed on the base portion 3011 and extends upward to the bottom wall of the pin groove 30133 of the base portion 3011. The lead 30134 includes a motor connecting end 301341 exposed on the bottom wall of the pin slot 30133 of the base portion 3011, and is used to electrically connect the motor pin 3061 of the motor 3060. The motor pin 3061 . In particular, in one embodiment, The motor connection terminal 301341 may be implemented as a pad. The lead 30134 can be implemented as a wire, which is embedded in the base portion 3011.

That is to say, when manufacturing the integrated base assembly 3010, the photosensitive chip 3030 is first mounted, and then the base portion 3011 is molded on the circuit board main body 30121 in the manner of MOB, and preset The lead groove 30133 of a predetermined length, and the lead 30134 can be embedded in the molding, and the lead 30134 is electrically connected to the circuit board main body 30121, and the motor of the lead 30134 The connecting ends 301311 and 301341 are displayed on the bottom wall of the pin slot 30133 of the base portion 3011 so as to be easily connected to the motor pin 3061 of the motor 3060. For example, when the integrated base assembly 3010 is used to assemble the camera molding, each of the motor pins 3061 of the motor 3060 is inserted into the pin slot 30133 and connected to all the pins by welding. The motor connection ends 301311 and 301341 of the lead wire 30134, so that the motor 3060 is electrically connected to the circuit board main body 30121, and a separate wire is required to connect the motor 3060 and the circuit board main body 30121, and This enables the motor pins 3061 of the motor 3060 to be connected stably, and prevents unnecessary external contact with the motor pins 3061. In particular, the lead 30134 can be implemented as a wire, which is embedded in the base portion 3011.

Referring to FIG. 31C, it is another equivalent embodiment of the motor connection structure according to the above-mentioned preferred embodiment of the present invention. The motor connection structure 3013 includes a pin slot 30135 for accommodating the motor pin 3061 of the motor 3060 of the camera module. The pin groove 30135 is provided on the base portion 3011. The motor connection structure 3013 includes at least one circuit contact 30132. The circuit contact 30132 is preset in the circuit board main body 30121 and electrically connected to the connection line 122 in the circuit board main body. Furthermore, each of the pin slots 30135 extends from the top end of the base portion 3011 to the circuit board main body 30121, and makes the circuit contact 30132 display. In an embodiment, the motor pin 3061 is adapted to be inserted into the pin slot 30135, and can be welded to the circuit contact 30132.

That is to say, when manufacturing the integrated base assembly 3010, each circuit contact 30132 is preset on the circuit board main body 30121, and then the photosensitive core 121 is mounted, and then the circuit board main body On 30121, the base portion 3011 is molded in a MOB manner, and the pin slot 30135 of a predetermined length is preset, and the circuit contact 30132 is displayed through the pin slot 30135 to facilitate connection to The motor pin 3061 of the motor 3060. For example, when the integrated base assembly 3010 is used to assemble the camera molding, each motor pin 3061 of the motor 3060 is inserted into the pin slot 30135 and connected to the circuit by welding The circuit contact 30132 on the board main body 30121, so that the motor 3060 is electrically connected to the circuit board main body 30121, and the motor pins 3061 of the motor 3060 can be connected stably, preventing external unnecessary Touches the motor pin 3061.

Referring to FIG. 31D, it is another equivalent embodiment of the motor connection structure in the above-mentioned preferred embodiment of the present invention. The motor connection structure 3013 includes an engraved circuit 30136, and the engraved circuit 30136 is used to electrically connect the connection circuit on the circuit board main body 30121, the photosensitive wafer 3030, the motor and other components. For example, but not limited to, the engraving circuit 30136 may be provided when the base portion 3011 is formed by means of laser forming (LDS). In the traditional connection method, components such as the drive motor are connected to the circuit board by setting separate wires, and the manufacturing process is relatively complicated. However, the method of setting the engraving circuit 30136 in the molding of the present invention can replace Traditional motor welding and other processes, and make the circuit connection more stable. More specifically, the process of forming the engraved circuit 30136 may be that the base portion 3011 is now provided with an engraving groove, and then a circuit is arranged in the engraving groove by electroplating.

In different embodiments of the present invention, the manner in which the motor 3060 of the camera module is connected to the integrated base assembly 3010 can be freely combined with the connection manners corresponding to FIGS. 6A, 6B, 6C, and 6D, and select suitable The motor 3060 is connected in a manner such as the pin slot 30133 and the lead 30134, the pin slot 30135 and the circuit contact 30132. And in an embodiment of the present invention 2, the motor 3060 can be connected to the integrated base assembly 3010 in a conventional manner, such as by welding. Those skilled in the art should understand that the connection manner of the motor 3060 and the integrated base assembly 3010 is not a limitation of the present invention.

As shown in FIG. 32, it is a camera module and its integrated base assembly according to the fifteenth preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the integrated base assembly 3010 includes a circuit board main body 30121A. The circuit board main body 30121A includes two inner grooves 301211A, and each photosensitive wafer 3030 is disposed in the corresponding inner groove 301211A. Different from the one-piece base assembly 3010 in the above embodiment, the photosensitive wafer 3030 is set in the inner groove 301211A, and the photosensitive wafer 3030 is contained therein, so that the photosensitive wafer 3030 will not protrude significantly from The upper surface of the circuit board main body 30121A reduces the height of the photosensitive wafer 3030 relative to the base portion 3011, thereby reducing the height restriction of the photosensitive wafer 3030 on the base portion 3011 and providing a further reduction in height The photosensitive chip 3030 is mounted in the inner groove 301211A, which can protect the photosensitive chip 3030, especially the connecting wire 3031, and prevent external components from accidentally touching the photosensitive chip 3030.

Further, the photosensitive wafer 3030 is connected to the circuit board main body 30121 through the connecting wire 3031, and is electrically connected to the connecting wire. The lead may be implemented as, for example, but not limited to, gold wire, copper wire, aluminum wire, or silver wire. In other words, the photosensitive wafer 3030 and the connecting wire 3031 are both located in the inner groove 301211A of the circuit board main body 30121A. In one embodiment, when manufacturing the integrated base assembly 3010, it is necessary to first provide the inner groove 301211A on the circuit board main body 30121A. That is to say, the inner groove 301211A is opened on the conventional circuit board to make it suitable for accommodating and mounting the photosensitive wafer 3030.

33 is a cross-sectional view of a camera module and its integrated base assembly according to a sixteenth preferred embodiment of the present invention.

Different from the above-mentioned preferred embodiment, the integrated base assembly 3010 includes a circuit board main body 30121B, the circuit board main body 30121B has a passage 301212B, and the lower part of the passage 301212B is suitable for mounting the photosensitive wafer 3030. The passage 301212B connects the upper and lower sides of the circuit board main body 30121B, so that when the photosensitive wafer 3030 is mounted on the circuit board main body 30121B from the back of the circuit board main body 30121B with the photosensitive area facing upward, The photosensitive area of the photosensitive wafer 3030 can receive the light entered by the lens 3050.

Furthermore, the circuit board has an outer groove 301213B, and the outer groove 301213B communicates with the corresponding passage 301212B to provide an installation position of the photosensitive wafer 3030. In particular, when the photosensitive wafer 3030 is installed in the outer groove 301213B, the outer surface of the photosensitive wafer 3030 and the surface of the circuit board main body 30121B are the same and are located on the same plane, thereby ensuring the integrated base The surface flatness of the component 3010.

That is to say, in this embodiment of the present invention, the passage 301212B is stepped, so as to facilitate the installation of the photosensitive wafer 3030, provide a stable installation position for the photosensitive wafer 3030, and expose the photosensitive area to the inside. space.

It is worth mentioning that, in this embodiment of the present invention, a chip mounting method that is different from the traditional chip mounting method, namely, a flip chip (FC) method is provided. The photosensitive wafer 3030 is mounted on the circuit board main body 30121B from the back side of the circuit board main body 30121B, not from the front side of the circuit board main body 30121B as in the above-mentioned embodiment, that is, from the circuit board The main body 30121B is mounted on the circuit board main body 30121B with the photosensitive area of the photosensitive wafer 3030 facing upward. This structure and installation method make the photosensitive wafer 3030 and the base portion 3011 relatively independent, and the installation of the photosensitive wafer 3030 will not be affected by the base portion 3011. The mold of the base portion 3011 Plastic molding has a relatively small effect on the photosensitive wafer 3030. In addition, the photosensitive chip 3030 is embedded on the outer side of the circuit board main body 30121B, and will not protrude from the inner side of the circuit board main body 30121B, thereby leaving a larger space inside the circuit board main body 30121B , Making The height of the base portion 3011 is not limited by the height of the photosensitive wafer 3030, so that the base portion 3011 can reach a smaller height.

It is worth mentioning that in other embodiments of the present invention, the filter 3040 is installed at the upper end of the passage 301212B, that is, it is not necessary to install the filter 3040 on the base portion 3011. , Thereby reducing the back focal length of the camera module and reducing the height of the camera. In particular, the filter 3040 may be implemented as an infrared cut filter IRCF.

Fig. 34 is a cross-sectional view of a camera module and its integrated base assembly according to a seventeenth preferred embodiment of the present invention.

The integrated base assembly 3010 includes a reinforcement layer 30123C, which is laminated and connected to the bottom layer of the circuit board main body 30121, so as to strengthen the structural strength of the circuit board main body 30121. In other words, the reinforcing layer 30123C is attached to the bottom layer of the area where the base portion 3011 and the photosensitive wafer 3030 are located on the circuit board main body 30121, so that the circuit board main body 30121 stably and reliably supports the The base portion 3011 and the photosensitive wafer 3030.

Further, the reinforcement layer 30123C is a metal plate attached to the bottom layer of the circuit board main body 30121 to increase the structural strength of the circuit board main body 30121. On the other hand, the integrated base assembly is added The heat dissipation performance can effectively dissipate the heat emitted by the photosensitive wafer 3030.

It is worth mentioning that the circuit board main body 30121 can adopt FPC (Flex Print Circuit, flexible printed circuit board), and the rigidity of the FPC through the reinforcement layer 30123C enables the FPC with good bending performance to meet The load-bearing requirements of the integrated base assembly. In other words, the circuit board body 30121 has a wider range of options, such as PCB (Printed Circuit Board, rigid printed circuit board), FPC, and RG (Rigid Flex, rigid-flex board). The reinforcement layer 30123B increases the structural strength of the circuit board main body 30121 and improves the heat dissipation performance, thereby The thickness of the circuit board main body 30121 can be reduced, so that the height of the integrated base assembly is further reduced, and the height of the camera module assembled therefrom is reduced.

35 is a cross-sectional view of a camera module and its integrated base assembly according to an eighteenth preferred embodiment of the present invention.

Different from the above-mentioned preferred embodiment, the circuit board main body 30121D has at least one reinforcing hole 301214D, and the base portion 3011 extends into the reinforcing hole 301214D, thereby enhancing the structural strength of the circuit board main body 30121D.

The position of the reinforcement hole 301214D can be selected according to needs and set according to the structural strength requirements of the circuit board, such as a symmetrical structure. The structure strength of the circuit board main body 30121D is enhanced by the arrangement of the reinforcing holes 301214D, so that the thickness of the circuit board main body 30121D can be reduced, the thickness of the camera module assembled by it can be reduced, and the The heat dissipation performance of the integrated base assembly.

It is worth mentioning that the reinforcing hole 301214D is in the shape of a groove, so that the molding material of the base portion 3011 will not leak out of the reinforcing hole 301214D when the integrated base assembly is manufactured.

36 is a cross-sectional view of a camera module and its integrated base assembly according to a nineteenth preferred embodiment of the present invention.

Different from the above preferred embodiment, the circuit board body 30121E has at least one reinforcement hole 301214E, and the base portion 3011 extends into the reinforcement hole 301214E, thereby enhancing the structural strength of the circuit board body 30121E.

The position of the reinforcing hole 301214E can be selected according to needs, and set according to the structural strength requirements of the circuit board, for example, a symmetrical structure. The structure of the circuit board main body 30121E is enhanced by the arrangement of the reinforcing holes 301214E, so that the thickness of the circuit board main body 30121E can be reduced, the thickness of the camera module assembled by it can be reduced, and the The heat dissipation performance of the integrated base assembly.

It is worth mentioning that the reinforcement hole 301214E is a perforation, that is, it passes through the circuit board main body 30121E, so that the two sides of the circuit board main body 30121E are connected, so that when the integrated base assembly is manufactured, The molding material of the base portion 3011 is fully combined with the circuit board main body 30121E to form a stronger composite material structure, and compared with the groove-shaped structure, the perforation is easier to process and manufacture.

Fig. 37 is a cross-sectional view of a camera module and its integrated base assembly according to a twentieth preferred embodiment of the present invention.

Different from the above-mentioned preferred embodiment, the base portion 3011F includes a covering section 30114F, a filter mounting section 30115F, and a lens mounting section 30116F, the filter mounting section 30115F and the lens mounting section 30115F The section 30116F is integrally molded and connected to the cladding section 30114F in turn, and the cladding section 30114F is molded and connected to the circuit board main body 30121 for encapsulating the circuit element 30122 and the connecting wire 3031. The filter mounting section 30115F is used to install the filter 3040, that is, when the integrated base assembly is used to assemble the camera module, the filter 3040 of the camera module It is installed in the filter mounting section 30115F, so that the filter 3040 is located on the photosensitive path of the photosensitive wafer 3030, and there is no need to provide an additional filter 3040 mounting bracket. In other words, the base portion 3011F has the function of a traditional bracket here, but based on the advantages of the integrated packaging process, the top of the filter mounting section 30115F can be made with a good flatness by means of a mold-based process. Therefore, the filter 3040 is installed smoothly, which is better than the traditional camera module. The lens mounting section 30116F is used to mount the lens 3050, that is, when the integrated base assembly is used to assemble the camera module, the lens 3050 is mounted on the base portion 3011F The inner side of the lens mounting section 113F, so as to provide a stable mounting position for the lens 3050.

Furthermore, the filter mounting section 30115F has a mounting groove 30113F, and the mounting groove 30113F is connected to the corresponding through hole 30110F to provide a filling for each filter 3040. The sufficient installation space enables stable installation of each of the optical filters 3040. The lens mounting section 30116F has a lens mounting groove 301131F, and each of the lens mounting grooves 301131F is connected to the corresponding through hole 301100F to provide sufficient mounting space for each lens 3050.

In other words, the filter mounting section 30115F and the lens mounting section 30116F extend upwards integrally, and form a stepped structure inside to provide supporting and fixing positions for the filter 3040 and the lens 3050 respectively, thereby There is no need to provide additional components to install the filter 3040 and the lens 3050. In other words, the base portion 3011 has two installation grooves, one of the installation grooves 30113F is located at a lower position, and the other installation groove 30113F is located at a higher position, forming a two-step step structure. The lower mounting groove 30113F is used for mounting the filter 3040, and the higher mounting groove 30113F is used for mounting the lens 3050.

The lens mounting section 30116F has two lens inner walls 301161F, and each of the lens inner walls 301161F has a closed ring shape, which is suitable for the lens 3050 to provide an installation space. It is worth mentioning that the surface of each lens inner wall 301161F of the lens mounting section 301162F is flat, so that it is suitable for mounting the threadless lens 3050 to form a fixed focus module. In particular, the lens 3050 can be fixed to the lens mounting section 30116F by bonding.

Referring to FIG. 38, it is an integrated base assembly and camera module according to the twenty-first preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the integrated base assembly 3010 includes a shielding layer 30124 that wraps the circuit board main body 30121 and the base portion 3011, thereby strengthening the circuit board The structural strength of the main body 30121 also enhances the anti-electromagnetic interference capability of the integrated base assembly 3010.

Referring to FIG. 39, a camera module and its integrated base assembly according to a twenty-second preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the camera module includes at least one seat 3070G for mounting each of the filters 3040, each of the lenses 3050, or each of the motors 3060. According to this embodiment of the present invention, the support 3070 is mounted on the base portion 3011, and each of the filters The piece 3040 is mounted on the support 3070, and each of the motors 3060 is mounted on the support 3070. The specific shape of the support 3070 can be set as required, for example, a boss is provided to facilitate the installation of each of the optical filters.

According to this embodiment of the present invention, the holder 3070G has a first holder groove 3071G and a second holder groove 3072G, and the first holder groove 3071G is used to install the filter 3040 so that all The surface of the filter 3040 does not protrude from the top end of the support 3070. The second support groove 3072G is used for mounting on the base portion 3011, so that the base portion 3011 extends upward along the support 3070G, and the position of the filter 3040 is downward , Thereby reducing the back focus of the camera module.

In other words, the support 3070G extends into the through hole 301100 and extends downward to support the filter 3040 above the photosensitive wafer 3030 and utilize the space in the through hole 301100 Therefore, while the filter 3040 is stably installed, the filter 3040 does not occupy external space.

It is worth mentioning that the distance that the support 3070G extends inward is outside the photosensitive area of the photosensitive wafer 3030, that is, the support 3070G does not block the photosensitive area of the photosensitive wafer 3030 In order to avoid affecting the photosensitive process of the photosensitive wafer 3030, the size of the support 3070G can be designed according to specific requirements.

In this embodiment of the present invention and the corresponding drawings, the dynamic focus module is taken as an example for description. The lens 3050 is installed on the motor 3060, and the motor 3060 is installed on the support 3070G. In other words, the support 3070G provides installation positions for the filter 3040 and the motor 3060. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 3050 is mounted on the support 3070G, that is, the support 3070G provides installation positions for the filter 3040 and the lens 3050. Those skilled in the art should understand that the The specific structure of the support 3070 and the type of the camera module are not limitations of the present invention.

Referring to FIG. 40, another implementation manner of the camera module according to the twenty-second preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the camera module includes a seat 3070H, and the seat 3070H is used for mounting the filter 3040. The holder 3070H is mounted on the base portion 3011, the filter 3040 is mounted on the base portion 3011, and the motor 3060 or the lens 3050 is mounted on the base portion 3011.

Further, the support 3070H is installed in the installation groove 30113 of the base portion 3011, and the height of the installation groove 30113 is greater than the installation height of the support 3070H, so that the support 3070H does not It protrudes from the top end of the base portion 3011.

According to this embodiment of the present invention, the holder 3070H has a first holder groove 3071H and a second holder groove 3072H, and the first holder groove 3071H is used to install the filter 3040 so that all The surface of the filter 3040 does not protrude from the top of the support 3070H. The second support groove 3072H is used for mounting on the base portion 3011, so that the base portion 3011 extends upward along the support 3070H, and the position of the filter 3040 is downward. , Thereby reducing the back focus of the camera module.

In other words, the support 3070H extends into the through hole 301100 and extends downward to support the filter 3040 above the photosensitive wafer 3030 and utilize the space in the through hole 301100 Therefore, while the filter 3040 is stably installed, the filter 3040 does not occupy external space.

It is worth mentioning that the distance that the support 3070H extends inward is outside the photosensitive area of the photosensitive wafer 3030, that is, the support 3070H will not block the photosensitive wafer 3030 to avoid affecting the In the light-sensing process of the photosensitive wafer 3030, the size of the support 3070C can be designed according to specific requirements.

Different from the above-mentioned preferred embodiment, the second support groove 3072H and the mounting groove 30113 of the package cooperate with each other to form a matching clamping structure, so that the support 3070H It can be stably installed in the installation groove 30113. Compared with the third preferred embodiment, the filter 3040 in this embodiment is smaller from the photosensitive chip 3030, and the camera module with a smaller back focal length can be obtained.

In this embodiment of the present invention and the corresponding drawings, the dynamic focus module is taken as an example for description. The lens 3050 is installed on the motor 3060, and the motor 3060 is installed on the support 3070H. In other words, the support 3070H provides installation positions for the filter 3040 and the motor 3060. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 3050 is mounted on the support 3070H, that is, the support 3070H provides installation positions for the filter 3040 and the lens 3050. Those skilled in the art should understand that the The specific structure of the support 3070H and the type of the camera module are not limitations of the present invention.

FIG. 41 is a schematic diagram of the structural strength comparison between the camera based on the integrated packaging process and the traditional camera module according to the above-mentioned preferred embodiment of the present invention. The left side of FIG. 42 is a traditional camera module, and the right side is a camera module based on an integrated packaging process according to the present invention. Let a1 represent the thickness of the bracket 3P of the conventional camera module, and a2 represent the thickness of the base portion 3011 of the camera module of the present invention.

In a conventional camera module, the bracket 3P is used to mount the filter 4P, the motor 5P, or the lens 6P, and the bracket 3P is usually a plastic part formed by injection molding. In the traditional camera module, the bracket 3P is usually installed on the outside of the circuit device 11P. Therefore, the installation space reserved for the bracket 3P is limited without increasing the lateral size of the circuit board main body. The thickness a1 of the bracket 3P can only be limited to a small range, such as 0.3 mm. At this time, the mutual bonding area of the bracket 3P and the circuit board 1P is small, so the connection stability is poor, that is, When used for a long time or with strong external force, the bracket 3P and the circuit board 1P are easily separated from each other or cracks appear.

According to a camera module based on an integrated packaging process according to a preferred embodiment of the present invention, the base portion 3011 is integrated on the circuit board main body 30121, such as by molding It is packaged in the circuit board main body and covers the circuit element 30122, so the base portion 3011 has a larger space for installation relative to the bracket 3P and extends into the circuit board main body 30121. The peripheral dimensions of the circuit board main body will not be expanded. According to this embodiment of the present invention, the base portion 3011 can reach a larger thickness a2, such as 0.6 mm. The base portion 3011 has better support stability, and through the integrated packaging, the base portion 3011 is more firmly connected to the circuit board main body 30121, so that the camera module is in use. More stable and reliable. On the other hand, the manner in which the base portion 3011 is integrally packaged on the circuit board main body 30121 increases the structural strength of the circuit board main body 30121 at the connection portion, and the base portion 3011 protects the circuit board main body The role of 30121.

FIG. 42 is a schematic diagram of the lateral size comparison between a camera module based on an integrated packaging process and a traditional camera module according to the above-mentioned preferred embodiment of the present invention. The left side of FIG. 43 is a traditional camera module, and the right side is a camera module based on an integrated packaging process according to the present invention. Let b1 represent the transverse cross-sectional size of the traditional camera module, and b2 represent the transverse cross-sectional size of the camera module based on the integrated packaging process of the present invention.

In the camera module in the traditional COB process, the bracket 3P is installed on the outside of the circuit device 11P. The bracket 3P and the circuit device 11P are independent of each other in installation space, and both need to occupy a certain space, and for protection The circuit device 11P needs to reserve a certain safety distance around the circuit device 11P, such as a safety distance of 0.35 mm. These factors make the horizontal dimension b1 of the camera module larger and reduce the horizontal dimension. The possibility of being small is small, and it cannot meet the demand for small size of the camera module.

According to the camera module based on the integrated packaging process of the present invention, the base portion 3011 is packaged on the circuit board main body 30121, and the base portion 3011 covers the circuit element 30122, so the base On the basis of meeting the requirements of basic strength, the portion 3011 only needs a smaller size to cover the circuit element 30122, such as 0.15 mm, the base portion 3011 and the circuit element The 30122 overlap each other to make full use of the installation space, so the lateral dimension B2 of the camera module can be reduced. In particular, according to an embodiment of the present invention, the lateral dimension b2 of the camera module based on the integrated packaging process can be 0.2 mm smaller than the lateral dimension b1 of the traditional camera module.

FIG. 43 is a schematic diagram of height comparison between a camera module based on an integrated packaging process and a conventional camera module according to the above-mentioned preferred embodiment of the present invention. The left side of FIG. 44 is a traditional camera module, and the right side is a camera module based on an integrated packaging process according to the present invention. Let c1 represent the height of the conventional camera module, c2 represent the height of the camera module based on the integrated packaging process of the present invention, d1 represent the thickness of the circuit board 1P of the traditional camera module, and d2 represent the height of the present invention based on The thickness of the circuit board main body 30121 of the camera module of the integrated packaging process. The bracket 3P of the traditional camera module is adhered to the circuit board 1P, and in order to meet the AA adjustment requirements, the amount of glue is large, the glue layer is thick, and it needs to be reserved for installation above the circuit device 11P Therefore, the height c1 of the camera module is relatively large. On the other hand, the bracket 3P is located outside the circuit device 11P and has a large lateral span. Therefore, the circuit board 1P is required to have a higher strength to ensure the shape of the camera module, thereby requiring the circuit board 1P The thickness d1 is larger, which also makes the overall height d1 of the camera module larger.

According to the camera module based on the integrated packaging process of the present invention, the base 11 is integrated with the circuit board main body 30121, no glue bonding space is required, and AA adjustment space is not required to be reserved, and there is no need for The circuit element 30122 reserves a safe distance, so the height c2 of the camera module based on the molding process can be reduced. On the other hand, the base portion 3011 covers the circuit element 30122 so that the base portion 3011 can extend inward, reducing the lateral span in the middle of the base portion 3011, and the deformation of the same circuit board is more Therefore, the strength requirement for the circuit board main body 30121 is reduced, and the base portion 3011 can enhance the structural strength of the circuit board main body 30121, so that the thickness d2 of the circuit board main body 30121 can be reduced, As a result, the overall height c1 of the camera module based on the integrated packaging process is further reduced.

FIG. 44 is a schematic diagram of the flatness of the camera module based on the integrated packaging process according to the above-mentioned preferred embodiment of the present invention.

The bracket 3P of the traditional camera module is manufactured by injection molding, and is assembled to the camera module by bonding. Therefore, the camera module is prone to tilt, eccentricity, and the like. In addition, the surface of the bracket 3P is poorly flat, and cannot provide flat installation conditions for components such as filters, motors, or lenses.

According to the camera module based on the integrated packaging process of the present invention, the base portion 3011 is connected to the circuit board main body 30121 through an integrated packaging method, such as being connected to the circuit board main body 30121 by molding. Furthermore, in manufacturing the integrated base assembly, the base portion is formed by a molding mold 1, and the surface flatness of the base portion 3011 is ensured by the molding mold 1, and the base portion 3011 is made smooth. The top surface 30112 of the seat 3011 is consistent with the surface of the attaching area 301216 of the photosensitive chip, so that the filter 3040, the lens 3050, or the motor 3060 pass the flat installation conditions, and the photosensitive chip 3030 The optical axis of the filter 3040, the lens 3050, and the motor 3060 are the same.

FIG. 45 is a schematic diagram of image quality comparison between a camera module based on an integrated packaging process and a traditional camera module according to the above-mentioned preferred embodiment of the present invention. The left side of FIG. 46 is a traditional camera module, and the right side is a camera module based on the integrated packaging process according to the present invention. The circuit device 11P of the conventional camera module is exposed to a closed environment that communicates with the photosensitive chip 2P, and when the camera module is assembled, some dust is usually attached to the circuit device 11P, such as during welding. The solder resist used in the motor, and these dusts are difficult to remove and remain on the surface of the circuit device 11P. After the camera module is packaged, the dust will move freely, and when the dust falls on the photosensitive chip, especially When it is the photosensitive area of the photosensitive chip, the camera module will have black spots, which makes the imaging quality of the camera module poor.

According to the camera module based on the integrated packaging process of the present invention, the circuit element 30122 is covered by the base part and will not be exposed to the same environment as the photosensitive chip 3030. Therefore, even in the circuit element 11P has residual dust, such as solder resist, and will not fall on the photosensitive chip after the camera module is packaged, so the stability of the imaging quality of the camera module can be ensured, and no black spots will appear after packaging. .

46A and 46B are schematic diagrams illustrating the comparison between the manufacturing process of the camera module based on the integrated packaging process and the traditional camera module according to the above-mentioned preferred embodiment of the present invention.

The assembly and manufacturing process of the traditional camera module is usually: manufacturing the bracket 3P by injection molding; cutting the entire circuit board, bonding the bracket 3P to the separate circuit board 1P; and then attaching the chip On the circuit board 1P; and then components such as the filter 4P, the lens 6P, or the motor 5P are mounted on the bracket 3P to be assembled into a fixed focus module or a dynamic focus module. In this manufacturing and assembly process, the bracket 3P is completed by injection molding, and only a small amount, such as 4 to 8, can be manufactured at a time, and then the individual brackets 3P are respectively bonded to the independent circuit boards 1P. , These make the manufacturing efficiency of the camera module low, and the consistency between the modules is more difficult to control.

The assembling and manufacturing process of the camera module based on the integrated packaging process according to the present invention is usually: integrally forming a plurality of the base portions 3011 on the imposition circuit board 2 by molding; and then dividing the imposition. , Divide the imposition into a plurality of separate integrated base components; then mount the photosensitive wafer 3030 on the integrated base component, and then attach the filter 3040, the lens 3050 or the The motor 3060 is installed on the base part to be assembled into a dynamic focus module or a fixed focus module. This process is different from the traditional assembly method. The imposition method greatly improves the production efficiency of the camera module, and it is easier to ensure the consistency between multiple modules. For example, during the imposition operation, 90 of the integrated base components can be formed at one time. Since the module of the present invention is integrally packaged based on the packaging process, in each embodiment of the present invention, the molding process in the packaging process is taken as an example for description. Therefore, in order to more clearly reveal the content of the present invention, a brief description of the molding process is firstly given. In addition, the molding process generally includes injection molding and molding in terms of equipment. Injection molding can also be divided into injection molding compression method and die-casting method. Injection molding machine (abbreviated as injection machine or injection molding machine) is the main molding equipment that uses plastic molding molds to make various shapes of plastic products from thermoplastics or thermosets. Injection molding is achieved through injection molding machines and molds. Molding is short for compression molding, also known as compression molding. Molded materials, such as plastic or rubber compounds, are molded into products by heating and pressing in a closed mold cavity. In the present invention, the molding process in the molding process is used to illustrate, but those skilled in the art can understand that the present invention is not limited to the molding process, there are other packaging processes, and the present invention is not limited by this.

FIG. 47 shows the twenty-third preferred embodiment of a camera module based on an integrated packaging process of the present invention, which adopts the MOB process. The camera module based on the integrated packaging process includes a packaged photosensitive component 4010, a filter 4040, a lens 4050 and a motor 4060. Those skilled in the art can understand that the motor 4060 may be absent in other embodiments, such as fixed focus (FF) modules, and the present invention is not limited thereto. In other words, in this preferred embodiment of the present invention, an auto focus (AF) module is taken as an example. The packaged photosensitive component 4010 includes a packaging portion 4011 and a photosensitive component 4012. The photosensitive component 4012 further includes a photosensitive chip 4030, and a circuit board 40121, which is configured with a set of electronic components 40122 (such as resistors, capacitors, drivers, etc., referred to as IC hereinafter) and a set of leads 4031. The lead 4031 connects and conducts the photosensitive chip 4030 and the circuit board 40121. Of course, the photosensitive chip 4030 and the circuit board 40121 can also have other conduction methods. In this preferred embodiment of the present invention, the lead 4031 can be implemented as a gold wire. The packaging portion 4011 serves as a support for carrying the filter 4040. The packaging portion 4011 may have electrical properties, such as engraving lines and energizing the motor 4060 and the photosensitive component 4012, which can replace traditional motor bonding wires. , To reduce the traditional process. Of course, the motor 4060 and the circuit board 40121 can also be connected through traditional horse soldering. During the packaging process, the packaging part 4011 encapsulates the circuit board 40121. In this preferred embodiment of the present invention, the packaging part 4011 encapsulates the circuit board 40121 in addition to the photosensitive chip 4030 and The lead 4031 is in contact with Outside the area. The packaging portion 4011 not only encapsulates the top surface 401215 of the circuit board 40121, but also encapsulates and covers at least one side surface 401216 of the circuit board 40121. It can be understood that, during the packaging process, the packaging portion 4011 may also package the electronic components 40122 as a whole. The motor 4060 is electrically connected to the circuit board 40121 through at least one motor pin.

Figures 49A to 49E show the mold forming module in the comparative technology. The part on the left side of the package portion 4011P in FIG. 50A is flush with the circuit board 40121P. Such a design in which the side surface of the circuit board 40121P is flush with the side surface of the package portion 4011P is usually adopted for comparison technology. Therefore, in order to meet the above design requirements, as shown in Figure 49B, the structure in the figure needs to be achieved before the module is assembled. The circuit board 40121P is processed as shown in Figure 49B during molding, that is, two or more pieces are combined. The circuit boards 40121P are connected together, molded, and finally cut by a machine in the middle part of FIG. 49B, but new cutting equipment is needed. If the method in Figure 49B is not used, considering that the circuit board 40121P has a certain deviation from the mold alignment, the edge of the circuit board 40121P cannot be designed flush with the package part 4011P, so usually it can only be designed as As shown in FIG. 49C, the circuit board 40121P in the figure needs to protrude a section for die pressing, and the protruding length of the circuit board 40121P is usually 0.1 mm to 1 mm in value.

Therefore, compared with the comparison technology, the camera module based on the integrated packaging process of the present invention is designed to shrink the circuit board 40121 so that the side surface of the packaging portion 4011 covers all the circuit board 40121. The side surface 401216, so that the side surface of the package portion 4011 and the circuit board 40121 still reserve a certain misalignment space. After the molding is completed, the side surface does not have the circuit board 40121 protruding, which reduces the cutting process and improves the product quality.

It is worth mentioning that the packaging portion 4011 may encapsulate both sides of the circuit board 40121. In this preferred implementation of the present invention, since there are other components connected to the right side, such as a flexible circuit board, only the left side of the circuit board 40121, that is, the side surface 401216, is encapsulated. However, those skilled in the art can understand that the encapsulation portion 4011 can not only encapsulate the side surface 401216 of the circuit board 40121, but in other embodiments, it can also encapsulate the side surface at the same time. Part or all areas of the two sides of the circuit board 40121 are covered, and the present invention is not limited by this.

Figure 48 shows the twenty-fourth preferred embodiment of the camera module based on the integrated packaging process of the present invention. In order to ensure that the module after the molding process can be easily installed and positioned, and improve flatness, Also in the form of MOB, the camera module based on the integrated packaging process includes a packaged photosensitive component 4010A, a filter 4040A, a lens 4050A, and a motor 4060A. Similarly, since the AF module is taken as an example, the motor 4060A is disclosed, but in other FF modules, the motor 4060A may not be required, and the present invention is not limited by this.

Specifically, the packaged photosensitive component 4010A includes a package portion 4011A and a photosensitive component 4012A. The photosensitive component 4012A further includes a photosensitive wafer 4030A, and a circuit board 40121A, which is configured with a set of electronic components 40122A and a set of leads 4031A. The packaging portion 4011A serves as a support for carrying the filter 4040A, and the engraving circuit of the module portion 11A is electrically connected to the motor 4060A and the photosensitive component 4012A. Compared with the above-mentioned preferred embodiment of the present invention, during the molding process, except for the packaging portion 4011A, the circuit board 40121A and the electronic components 40122A are packaged, and the package covers the circuit board 40121A. In addition to the top surface 1221A and at least one side surface 401216A, the packaging portion 4011A also molds and encapsulates a bottom portion 401217A of the circuit board 40121A. Therefore, after the molding is completed, the overall flatness of the side and bottom of the camera module based on the integrated packaging process is ensured, and it is also easy to install and position on other tooling.

It is worth mentioning that the packaging portion 4011A can encapsulate the entire bottom portion 401217A of the circuit board 40121A, or in other embodiments, according to different needs, package all of the circuit board 40121A. As for the part of the bottom 401217A, the present invention is not limited by this.

It is worth mentioning that, in this preferred embodiment of the present invention, since the right side of the camera module shown in the figure can also be connected to other components or other processing techniques, the line The right side of the circuit board 40121A is not packaged, but in other embodiments, the package portion 4011A can simultaneously package and wrap two or more sides of the circuit board 40121A, and simultaneously package and wrap the circuit board The present invention is not limited to all or part of the bottom 401217A of 40121A.

As shown in FIGS. 50 to 55 and 58, it is a camera module according to the twenty-fifth preferred embodiment of the present invention. The camera module 100 can be applied to various electronic devices 300, for example, but not limited to, smart phones, wearable devices, computer equipment, televisions, vehicles, cameras, monitoring devices, etc. The camera module cooperates with the The electronic equipment realizes the image acquisition and reproduction of the target object.

The molded circuit board assembly 1010F of the camera module 100 is manufactured and formed by a manufacturing equipment 200.

Different from the first preferred embodiment, the molded part 1011F has a first inner side surface 10117F, a second inner side surface 10118F, and an outer side surface 10119F. The first inner side surface 10117F and the second inner side surface 10119F The inner side surfaces 10118F are each closed to form the through hole 101100F, which provides a light path for the photosensitive wafer. That is to say, the molding part 1011F forms a light window through the first inner side surface 10117F and the second inner side surface 10118F to provide a window for the photosensitive chip to enter light, and the lower connection of the light window The shape of the port is determined by the surrounding shape of the first inner surface 10117F. The first inner side surface 10117F surrounds the through hole 101100F or the lower end of the light window, and the second inner side surface 10118F surrounds the through hole 101100F or the upper end of the light window.

The first inner side surface 10117F extends upward in an inclined shape, and the cross section is a trapezoid with an opening gradually increasing from bottom to top. That is, the cross-section of the through hole 101100F or the lower end of the light window is a trapezoid with an opening gradually increasing from bottom to top. The inclination angle of the first inner surface 10117F is defined as the first inclination angle α, that is, the angle between the first inner surface 10117F and the central optical axis Y of the molded camera module is the first inclination angle α.

In one embodiment, the first inner side surface 10117F surrounds and the inner diameter gradually increases from bottom to top, that is, the inner diameter of the lower end of the light window gradually increases from bottom to top. Of course, in other embodiments of the present invention, the first inner side surface 10117F can also be surrounded by other trapezoidal cross-sectional structures. Those skilled in the art should understand that the surrounding shape of the first inner side surface 10117F is not a limitation of the present invention. The surrounding shape of the first inner side surface 10117F may be determined according to the shape of the lens 50, the photosensitive chip 30, or the filter 40. It is worth mentioning that the cross-section pyramid is an approximate structure. In the actual manufacturing process, the corners of the pyramid are not straight-line sharp corners, but arc-shaped rounded corners.

According to an embodiment of the present invention, the first inclination angle α is greater than 0°, that is, the first inner side surface 10117F and the central optical axis Y direction are not parallel. Since the central optical axis Y is perpendicular to the circuit board main body 10121, in the embodiment of the present invention, the positional relationship between the first inner side surface 10117F and the circuit board main body 10121 is not a vertical relationship. The setting of the first inclination angle α is helpful for the molding and manufacturing of the molded part 1011F. For ease of understanding, this point will be described in conjunction with the subsequent manufacturing process.

It is worth mentioning that the setting of the first inclination angle α, that is, the oblique setting of the first inner side surface 10117F, reduces the incident angle of the light reaching the first inner side surface 10117F, and the corresponding reflection angle decreases. As a result, the reflected light is far away from the photosensitive chip 30, thereby reducing the influence of the reflected stray light of the molding part 1011F on the imaging quality of the camera module. On the other hand, the through hole 101100F or the light window is formed by a structure with a trapezoidal cross-section whose opening gradually increases, thereby increasing the light flux, thereby further improving the imaging quality of the camera module.

Further, the second inner side surface 10118F surrounds the through hole 101100F or the upper end of the light window, that is, the shape of the upper end of the light window is determined by the surrounding shape of the second inner side surface 10118F. The second inner side surface 10118F extends upward obliquely, and the cross section forms a trapezoid with an opening gradually increasing from bottom to top. In other words, the cross section of the upper end of the through hole 101100F or the light window is a trapezoid that gradually increases from bottom to top. Define the inclination angle of the second inner side surface 10118F as the second inclination angle β, that is, the included angle between the second inner surface 10118F and the central optical axis Y of the molded camera module is the second inclination angle β.

In one embodiment, the second inner surface 10118F surrounds and forms a headless vertebral body structure gradually increasing from bottom to top. That is, the upper end of the light window has a headless vertebral body structure gradually increasing from bottom to top. Of course, in other embodiments of the present invention, the second inner side surface 10118F can also be surrounded by other structures with a trapezoidal cross-section, such as a headless cone and a quadrangular pyramid. Those skilled in the art should understand that the surrounding shape of the second inner side surface 10118F is not a limitation of the present invention. The surrounding shape of the second inner surface 10118F may be determined according to the shape of the lens, the photosensitive element, or the filter.

According to an embodiment of the present invention, the second inclination angle β is greater than 0°, that is, the second inner surface 10118F is not parallel to the direction of the central optical axis. Since the optical axis is perpendicular to the circuit board main body 10121, in the embodiment of the present invention, the positional relationship between the second inner side surface 10118F and the circuit board main body 10121 is not a vertical relationship. The setting of the second inclination angle β facilitates the molding and manufacturing of the molded body. For ease of understanding, this point will be described in conjunction with the subsequent manufacturing process.

Further, the molded body includes an outer side surface 10119F, and the outer side surface 10119F surrounds the outside of the light window. The outer side surface 10119F extends upward from the circuit board main body 10121 in an inclined shape, and the cross section forms a trapezoid with a gradually narrowing opening from bottom to top. It is defined that the inclination angle of the outer surface 10119F and the inclination angle is the third inclination angle γ, that is, the included angle between the outer surface 10119F and the central optical axis Y of the molded camera module is the third inclination angle γ .

According to an embodiment of the present invention, the third inclination angle γ is greater than 0°, that is, the outer surface 10119F is not parallel to the direction of the central optical axis. Since the optical axis is perpendicular to the circuit board main body 10121, in the embodiment of the present invention, the positional relationship between the outer side surface 10119F and the circuit board main body 10121 is not a vertical relationship. The setting of the third inclination angle γ helps For the molding and manufacturing of the molded body, in order to facilitate understanding, this point will be described in conjunction with the subsequent manufacturing process.

For example, but not limited to, the preferred range of the first inclination angle α is 3°~85°. The preferred range of the second inclination angle β is 3°~45°. The preferred range of the third inclination angle γ is 3°~45°.

In this embodiment of the present invention, the first inclination angle α ranges from 3° to 45°, and in some specific embodiments, it may be 3° to 15°, or 15° to 20°, or 20° ~30° or 45°~60°. The second inclination angle β ranges from 3° to 45°, and in some specific embodiments, it may be 3° to 15°, or 15° to 30°, or 30° to 45°. The third inclination angle γ ranges from 3° to 45°, and in some specific embodiments, it may be 3° to 15°, or 15° to 20°, or 20° to 30°.

It is worth mentioning that in this embodiment of the present invention, the first inner side surface 10117F, the first top surface, the second inner side surface 10118F, the second top surface, and the outer side surface 10119F forms one or two stepped stepped structures, which are used to install different components. In other embodiments of the present invention, there may be fewer steps or more steps. For example, only the first inner side 10117F and the second The inner side surface 10118F and the outer side surface 10119F form a first step, or a top surface and the inner side surface are superimposed to form a third step step. Those skilled in the art should understand that the inner side surface, the top surface, and the outer side surface 10119F The number and the number of steps formed are not a limitation of the present invention.

It is also worth mentioning that the first inner side surface 10117F, the first top surface, the second inner side surface 10118F, the second top surface, and the outer side surface 10119F are each in a closed structure to facilitate Provide a closed internal environment for the molded camera module. When the lens 1050 or the motor 1060 and the lens 50 are mounted on the molded circuit board assembly 1010F, a closed internal environment is formed for the photosensitive chip 1030 to isolate the interference of external light.

As shown in FIGS. 54A and 54B, the manufacturing equipment and manufacturing process of the molded circuit board assembly of the molded camera module according to the first preferred embodiment of the present invention. The manufacturing equipment 200 is used for manufacturing The molded circuit board assembly 1010F is further used to manufacture the molded circuit board assembly 1010F by molding.

The manufacturing equipment 200 of the molded circuit board assembly 1010F includes a molding die 210 and a feeding mechanism 220. The feeding mechanism 220 is used to supply the molding material 400 to the molding die 210 to facilitate molding by the molding die 210. The molding material 400 can be nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy resin, etc.

The forming mold 210 includes a first mold 211 and a second mold 212, and the first mold 211 and the second mold 212 can open and close the mold. In other words, the forming mold 210 includes two states of mold opening and mold closing.

In an embodiment, the forming mold 210 can control the opening and closing of the first mold 211 and the second mold 212 through a fixing device. 54A, 54B, when the molding mold 210 is in a closed state, the first mold 211 and the second mold 212 form a molding cavity 213 and a supply channel 214, the supply channel 214 is connected于The molding cavity 213. The molding cavity 213 is used for accommodating the circuit board portion 1012F, and the supply channel 214 is used for conveying the molding material 400 into the molding cavity 213 to be molded at a predetermined position on the circuit board portion 1012F. That is to say, the circuit board portion 1012F is placed in the second mold 212 when the molding mold 210 is opened, and then the molding mold 210 is placed in a closed state, through the function of the feeding structure For the molding material 400, such as high pressure, the molding material 400 is transported into the molding cavity 213 through the supply channel 214, and the remaining part of the molding cavity 213 is filled with the molding material 400, thereby forming The molding part 1011F.

The first mold 211 includes a light window forming block 2111, and the light window forming block 2111 is used to block the molding material 400, so that the molding material 400 forms a hollow through hole along the light window forming block 2111 101100F or the light window.

The first mold 211 includes a plurality of molding surfaces, and the first inclination angle α, the second inclination angle β, and the third inclination angle γ corresponding to the molding part 1011F are respectively set to facilitate the formation of The first inner side surface 10117F, the second inner side surface 10118F, and the outer side surface 10119F.

Further, the light window forming block 2111 includes a pressing surface 21111. During the molding process, the pressing surface 21111 is pressed against the circuit board portion 1012F, so that the position corresponding to the pressing surface 21111 on the circuit board portion 1012F is not filled with the molding material 400, The light window connected to the circuit board portion 1012F is formed.

Further, the molding cavity 213 includes a filling part 2131 and a receiving part 2132, the filling part 2131 is used for filling the molding material 400, and the receiving part 2132 is used for receiving the circuit board main body 10121. In an embodiment of the present invention, the filling portion 2131 is provided on the first mold 211, and the containing portion 2132 is provided on the second mold 212. That is, during the molding process, the circuit board main body 10121 is placed in the receiving portion 2132 of the second mold 212, and the circuit board main body 10121 and the first mold 211 are surrounded by The filling portion 2131 is filled with the molding material 400 in the space, so that the molding portion 1011F is molded on the top surface of the circuit board portion 1012F.

It is worth mentioning that the circuit board portion 1012F carries the circuit element 10122F, that is, when the circuit board main body 10121 is placed in the receiving portion 2132 of the molding cavity 213, the circuit The element 10122F is accommodated in the filling part 2131. When the molding material 400 is filled in the filling portion 2131 of the molding cavity 213, the circuit element 10122F is covered by the molding material 400.

It can be understood that due to the setting of the first inclination angle α, the second inclination angle β, and the third inclination angle γ, the demolding process, that is, the first mold 211 and the second During the separation of the mold 212, the friction between the mold part 1011F and the first mold 211 Decrease, the first mold 211 is easier to pull out and separate from the molded part 1011F, so that the molded part 1011F can obtain a better forming state. 55, more specifically, in the demolding process, the light window molding block 2111 and the molded part 1011F produce relative movement at the moment of demolding, and then the light window molding block 2111 and the molded part 1011F A gap is formed between the molded parts 1011F, so in the subsequent movement process, the light window molding block 2111 and the molded part 1011F will not contact and generate frictional force, so that they can be pulled out smoothly.

As shown in FIG. 56, according to a modified implementation of the twenty-fifth embodiment of the present invention, before the molding process, the photosensitive wafer 1030 can be connected to the circuit board main body 10121F through the leads 1031, and the The circuit board main body 10121F can be provided with a ring-shaped blocking element 1014G, which is attached or coated on the circuit board main body 10121 and has elasticity and is higher than the highest point of the lead 1031, so that it can be used in the molding process. , The light window forming block 2111 is pressed against the blocking element 1014G to prevent the light window forming block 214 from contacting the circuit board main body 10121F and the leads 1031 when pressed against the circuit board main body 10121F. The photosensitive wafer 1030 is damaged. In a specific example, the blocking element 1014G has a square ring shape and is implemented as a step glue. In other words, the blocking element is at least partially encapsulated by the molding part, and is spaced between at least part of the molding part 1011F and the circuit board main body 10121F.

As shown in FIG. 57, it is another modified embodiment according to the twenty-fifth embodiment of the present invention. Different from the above preferred embodiment, the circuit board portion 1012F includes at least one circuit element 10122G, and the circuit element 10122G is disposed on the circuit board main body 10121. The circuit element 10122G protrudes from the circuit board main body 10121 and is located inside the molded part 1011F. In other words, the circuit element 10122G is located in the through hole 101100F. In other words, the circuit element 10122G is not molded by the molding part 1011F. During molding, the light window molding block in the molding mold has a groove inside, so that it is covered on the circuit element 10122G during the molding process, so that the molded part 1011F can be formed without covering The circuit element 10122G. Of course, in the present invention In other embodiments, the molded circuit element 10122F may also be provided, that is, a part of the circuit element 10122F is molded, and another part of the circuit element 10122G is not molded.

As shown in FIG. 59, it is a modified implementation of the integrated base assembly and camera module according to the twenty-first preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the integrated base assembly 3010 includes a shielding layer 30124A that surrounds the inner side of the base portion 3011, thereby enhancing the structural strength of the circuit board main body 30121 At the same time, the anti-electromagnetic interference capability of the integrated base assembly 3010 is enhanced. The shielding layer 30124A can be a metal mesh or a metal plate.

Those skilled in the art should understand that the structures of the molding part, the base part, and the packaging part in different embodiments of the present invention may be the same as the various structural features of the camera module described in other embodiments. Perform permutation and combination. The above-mentioned preferred embodiments are only used as examples to illustrate the different ways in which the present invention can be implemented. Various structural features in different embodiments can be permuted and combined to form new implementations. The present invention is not limited to the implementations shown in the figures. , Not limited to a single embodiment.

It is worth mentioning that the above-mentioned multiple camera modules may be arranged in an array to form an array camera module. Each camera module may have the structure of the camera module in each of the above embodiments. Each camera module of the array camera module may have the same structure or different. The plurality of camera modules may be an integrated structure or a split structure. The one-piece structure may have a connected base part or a connected circuit board part; or a connected base part and a connected circuit board part.

Those skilled in the art should understand that the above description and the embodiments of the present invention shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been completely and effectively achieved. The functions and structural principles of the present invention have been shown and explained in the embodiments. Without departing from the principles, the implementation of the present invention may have any deformation or modification.

2010: Circuit board components

2011: Packaging Department

20112: top surface

20113C: Installation slot

201100: Through hole

2012: Circuit Board Department

20121: Circuit board main body

20122: Circuit components

2030: photosensitive chip

2031: connection line

2040: filter

2050: lens

2060: Motor

2070C: Support

2071C: The first support slot

2072: second support slot

Claims (17)

A camera module includes: at least one lens; at least one photosensitive chip; at least one integrated base assembly; and at least one seat; wherein the integrated base assembly includes a base part and a circuit board part, the The base portion is integrally packaged on the circuit board portion by molding, the photosensitive chip is mounted on the circuit board portion, and the base portion forms at least one through hole to provide a light path for the photosensitive chip. The lens is located in the light path of the photosensitive chip, and the support is mounted on the base portion, wherein the base portion has at least one first inner side surface, which integrally extends to the circuit board portion and forms a circle For at least part of the through hole, the first inner side surface extends upward in an oblique shape. The camera module according to the first item of the scope of patent application, wherein the camera module includes at least one filter, which is installed on the support and located in the light path of the photosensitive chip. The camera module according to claim 1, wherein the camera module includes at least one motor, the lens is mounted on the motor, and the motor is at least partially mounted on the support or mounted于The base part. The camera module according to the third item of the scope of patent application, wherein the camera module includes at least one filter, which is installed on the motor and located in the light path of the photosensitive chip. The camera module according to the first item of the scope of patent application, wherein the integrated base assembly includes a reinforcement layer, which is laminatedly connected to the bottom layer of a circuit board main body of the circuit board portion, so as to strengthen the The structural strength and heat dissipation performance of the main body of the circuit board. According to the camera module described in item 5 of the scope of patent application, the circuit board main body has at least one reinforcing hole, and the base portion extends into the reinforcing hole, thereby enhancing the structural strength of the circuit board main body. According to the camera module described in claim 1, wherein the circuit board portion has an inner groove connected to the through hole, and the photosensitive chip is accommodated in the inner groove. According to the camera module described in item 2 or item 4 of the scope of patent application, the support has a first support groove on the top side, the first support groove is connected to the through hole, and the filter The light sheet is installed in the first support groove. According to the camera module described in item 8 of the scope of patent application, the support has a second support groove on the bottom side to engage with the top of the base portion. According to the camera module described in claim 1, wherein the base portion forms a platform, and the support is installed on the platform. According to the camera module described in claim 1, wherein the base portion has an installation groove, the installation groove is connected to the through hole, and the support is installed in the installation groove. The camera module according to item 11 of the scope of patent application, wherein the mounting groove has at least one notch that communicates the through hole with the outside, and the support includes at least one extending side, and the extending side is suitable for overlapping In the gap. The camera module according to item 11 of the scope of patent application, wherein the mounting groove has at least one notch to form a U-shaped structure, the support portion includes at least one extended side, and the extended side fills the U-shaped The opening of the structure. The camera module according to the first item of the scope of patent application, wherein the lens is at least partially mounted on the support. The camera module according to the first item of the scope of patent application, wherein the lens is mounted on the base part. The camera module according to the first item of the patent application, wherein the integrated base assembly includes a ring-shaped blocking element, which is disposed on the circuit board portion, and the blocking element is at least partially covered by the base The seat is packaged in one piece. The camera module according to the first item of the scope of patent application, wherein the base portion has a second inner side surface, the second side surface is bent and extended from the first inner side surface, and the second inner side surface is bent and extended. The side surface surrounds the upper end of the through hole, and the second inner side surface extends upward in an oblique shape.

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