200525660 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一種影像感測器後段封裝製程之上物件 封裝方法，尤指一種應用於影像感測器後段封裝過程中， 針對待封裝於影像感測器物件上之透明蓋板、鏡頭座或具 透明蓋板之鏡頭座等上物件的封裝方法所提出之設計，用 以確保影像感測器封裝後之潔淨度、定位精準度及結合強 度。 ° 【先前技術】 目前常見之影像感泪j器係—包括彳具影像感測功能的 :學半導體晶片之產品’由於該影測器内部晶片之感測區 需保持高標準之潔淨度，避免感測區之部份晝素被微塵或 水氣遮蔽’而無法感測，故必需對該感測器元件施以適當 的封裝手a，以保護感測器元件内部感測區免受水氣及微 塵之侵人造成遮蔽’另使該晶片可透過基板之線路重佈作 外部連接，藉以受控作為影像感測之用途。 或光電耦合元件等（C C D影 具線路之基板上預定黏晶區模 -人將晶片感光面朝上黏著於 ’再以打線接合手段將晶片與 ’最後於基板之堤牆頂緣進行 等之透明蓋板蓋置於堤牆頂緣 裔之封裝作業，或可再於該透 習知影像感測器之封裝 體（C Μ〇S影像感測器） 像感測器）等，主要係先於 塑成型出方形環圈狀的堤牆 基板相對於堤牆内側之位置 基板上之線路構成電性連接 點膠，再將如I R濾光破片 再烘烤，以完成該影像感測 万法’如互補式金屬氧化半導 200525660 明盍板上黏著一鏡頭座，而播士 構成一具有影像感測功能之影 像感測器。 另有一種軟式基版的方式，係為-具有開口設計之軟 式基板’於基板下方以覆晶（fllPGhip)方式將晶片與基 板連結，再於基板上方點膠並設置叫㈣光玻片之透明 黏貼上物件並供烤以完成軟式基板之影像感測器 封裝作業。 =上述習知影像感測器之封裝方法，於實際使用時， 仍具有以下所述之諸多缺點存在： J於於大氣狀態下做後製程之上物件（即前述之透明 =反、鏡頭座等）_裝，易因大氣存中在的微塵、水氣附 者、上物件及基板上而影㈣I後之影像品質。 物件像感測器於封裝過程中，並未對封裝前之上 :牛，基板本身施以任何的清潔處理，因&，如上物件或 裝前’若其表面沾附有微塵或其它雜質時，則-“者於…壓封裝完成後’影像感測區 田 旦遮蔽影像感測區的部份晝*，部份 清潔處理’對於己經封裝於影像感測器内==以 已無法再重工處理。 之楗塵或雜質 3、當影像感測器進行封裝過程中，其 置上物件後，传必需爯剎 ^…， > 且盍 ’以完成封裝作業，其中，因基板與上物件門二，置 yk , .. 吻件間的接合區报 …送過程中，由於透明蓋板與基板間的膠體尚 200525660 未凡全固化，故無法提供兩者間適當的定位效果，導致上 物件谷易因輸送過程中晃動而產生位移，使基板與上物件 間的接合度不良。 【發明内容】 曰因此，為改善前述影像感測器封裝方法的缺點，本發 明者乃研發設計出一種「影像感測器後 t封裝方法」，希藉此設計，㈣像感測器封裝過程t =供=有潔淨層流控制之㈣環境，並將待封裝感測器物 έ及:人：扁其上之上物件施以表面清潔處理，並以視覺系 且即時預烤預熱強化上物件與待封裝感測器 。度’以確保影像感測器封裝後之潔淨度、待封 裝感測器物件及上物件定位精準及結合強度 2 之發明目的。 人々王要 :達二前述發明目的’本發明所運用的技術手段係在 其段封裝製程之上物件封裝方法， 与傻威、、、。。化石及二悲變化反應手段，分別對該待封裝 衫象感測為物件表面，以及待黏著之 卜 ^ 清潔處理，續將上物件對位、面施以表面 之預定結合處，並施以預烤影像感測器物件 熱“手段增加上物件固著於待 再以 合強度’藉以使封裝後之妒、“1益物件的結 附著微塵及雜質，且使上物件 =件不會 件上。 疋位於待封裝感測器物 藉由上述方法之實施流種，該影像感測器之封裝過種 200525660 中’將待封裝感測器物件 及上物件’於封裝作紫箭 進行表面清潔處理，以接曰^ 、 忒作業刚，分別 潔淨度，避免感測區之部心金… ㈣仵及上物件的 ,χ ^ , 77旦素被微塵或水氣遮蔽，而么 法感測，另亦可先行對 而無 體施以預烤處理，搵 忭间的膠 防止該上物件於輸送 <效果而有效 私壯4 ^ ^因晃動產生不當位移，以躂仅 封4後之影像感⑽。 保 【實施方式】 ' :使貴審查委員可確實了解本發設 其它創作目的與功效，以τ #I， 以下絲舉出一具體實施例，並配合 圖式詳細說明如下·· G 口 依據前揭技術方荦之訊斗 ^# ,,,, ^ Μ °又5十，本發明係應用於影像感測 為後I又封裝之上物件封梦 板或鏡頭座等，其中，上物件可為透明蓋 兄貝以6月參閱第一圖及第二圖所示： :先如第四圖所示，係以上物件為透明蓋板（3㈡ '、已π成基板上模塑膠體堤牆、晶片黏著及打線接合 後之待封裝影像感測器物件 观1干、2◦)上的製程步驟設計提 。兄明，其封裝製程步驟主要包括有： 提供具有潔淨層流控制之内部環境。 哭、氧化奴二恶變化反應手段清潔該待封裝影像感測 口口件（2 0 )之表面；配合參閱第三圖Α所示，主要係 =用封裝設備（i 〇 )預設之第一清洗裝置（工丄），該 、、j置預叹有一進氣孔及排氣孔，使二氧化碳從進氣孔 、/月洗哀置，再於排氣孔排出，配合二氧化碳因溫度及 200525660 壓力的 感測器 2 0) 表面所 以 塗設膠 (10 封裝感 ，使其 的定位 又產生一悲變化後之微細分子，清潔待封裝影像 物件（9 + 、主乙u)的表面，完成該待封裝感測器物件（ 之’月洗處理’用以去除待封裝感測物件（2 0 )夂 附著之微塵及雜質。 σ 2膠手段於待封裝影像感測器物件之膝體堤牆頂緣 & ’配口參閱第三圖Β所示，主要係利用封裝設備 、）=設之點膠裝置（12)，對完成清洗處理之待 、Γ、物件（2 〇 )上的預定結合部位施以點膠作業 堤牆頂緣塗附熱固性膠體，並將其傳送至下一製程 工作區（A )。 王 以二氧化碳三態變化反應手段清潔該透明蓋板之表面 ;配合參閱第三圖C所#，主要係利用封裝設備㈠㈧ 預設之第二清洗裝置（丄3 )’並藉由取置器（Η )取 置透明盍板（30) ’使其容置於該第二清洗裝置（13 )内1，该第二清洗裝置設有—進氣孔及_排氣孔，使二 氧化碳從進氣孔進人第二清洗裝置（1 3 )，再由排氣孔 :出，配合二氧化碳因溫度及壓力而產生三態變化對透明 蓋板（3 0 ) @表面產生之清洗效果，用以去除透明蓋板 (3 0 )表面所附著之微塵及雜質。 )之影像位置 利用視覺系統進行定位，將透明蓋板（3 〇 )精確定 位於膠體堤牆頂緣上，同時施以預烤加熱處理，使透明蓋 板定位於膠體堤牆上；配合參閱第三圖c、D所示，於第 二清洗裝置一侧設有一組視覺系統，擷取透明蓋板（3 〇 並於定位工作區 (A )的上方設另一組視 200525660 覺系統，擷取待封裝影像感測器物件之影像位 … ，取置态（1 4 )係藉由該二組視覺系統進行丁疋位 明蓋板（30)設置於待封裝感測器物件（2〇) ’將透 定結合部，同時利用具烘烤照射功能的預烤裝置（=預 ，如紫外線光源照射燈等’對兩者結合部位施 ，且在待封裝感測器物件（2 〇 )的下方嗖处 :使該待封裝感測器物件（20)的堤牆頂緣與二= 用3:二間的膠體加熱至預定之溫度’達到預定的定形作 、’效減少膠體流動性，以形成極佳的定位效果。 以熱壓合手段將透明蓋板強化固著於膠。 要係將待封裝感測器物件（2 〇) : ’主 ?二輸送至加星裝置對對透明蓋板（3 〇 )施以加舞 & ’增加透明蓋板（3〇)與堤牆間之的接合強声，； 控制封裝後之影像感測器之整體高度及共平面性，：送： 烘烤裝置使膠體完全固化， / 業。 70成5亥衫像感測器之封裝作 物件Γ上所述之封裝方法，亦可適用於如第六圖所示，上 牛為=明蓋板（3Q)之鏡頭座（4Q)封裝於 it上模塑膠體堤牆（亦可為無堤牆之設計，係直接將 置於基板上）、晶片黏著及打線接合後之待封裝 衫像感測器物件（2 ΓΜ μ AA扁丨 1Ju)上的製程，其步驟如上所述。 =本發明亦適用於如第五圖所示，將不具鏡片之鏡 頁座（50)封裝於p+士甘 著、打線接合，以及固反;L模塑膠體堤牆、晶“占 者透明盍板（3 0 )後的待封裝影 200525660 像感：器物件（20)上之封裝製程步驟，主 提供具有潔淨層流控制之内部環境。 ^ . 以二氧化碳三態變化反應 器物件之表面；主要#利用私/月心亥待封裝影像感測 王要係利用封裝設備f Ί 清洗穿詈Γ 1 、 又侑（1 0)預設之第一 使二氧化π ，5亥清洗裝置設有-進氣孔及排氣孔， 人：：1 氣孔進入清洗裝置，再於排氣孔排出，配 口一乳化奴因溫度及壓力的改變而 封裝影像感測器物件（20)的_面化，清潔待 器物件o m 完成該待封裝感測 2。） 之清洗處理’用以去除待封裝感測物件（ u)各表面所附著之微塵及雜質。 以點勝手段於待封裝影像感測器物件外側之透明蓋板 =邊塗設膠體；主要係利用封裝設備（10)預設之點勝 ^ (12)對70成清洗處理之待封裝感測器物件（2 〇 )上的預定結合部位施以點膠作業，使其透明蓋板（3 〇)周邊塗附膠體，並將其傳送至下一個製程的定位工作 區（A )。 以一氧化奴二態變化反應手段清潔該鏡頭座之表面； ’主要係利用封裝設備（1 〇)預設之第二清洗裝置（i 3)，並藉由取置器（14)取置鏡頭座，使其容置於該 第二清洗裝置（丄3 )内部，第二清洗裝置（丄3 )設有 一進氣孔及一排氣孔，使二氧化碳從進氣孔進入第二清洗 裝置（1 3 )，再由排氣孔排出，配合二氧化碳因溫度及 壓力而產生三態變化對鏡頭座（5 〇 )的表面產生之清洗 效果’用以去除鏡頭座（5 〇 )表面所附著之微塵及雜質 200525660 利用視覺系統進行定位，將鏡頭座（5 〇 )精確定位 於透明盍板（3 0 )周邊頂緣上，同時施以加熱處理，使 透明蓋板（3 0 )定位於膠體堤牆上；於第二清洗裝置（ 1 3 ) —側設有一組視覺系統，擷取鏡頭座（5 〇 )之影 像位置，並於定位工㈣（A)的上方設另一組視覺系： ’擷取待封裝影像感測H物件（2 Q ).之影像位置進行定 位，取置态（1 4 )藉由二組視覺系統進行定位，將鏡頭 座（5 0 )設置於待封裝感測器物件（2 〇 )上的預定結 合部，同時在待封裝感測器物件（2 〇 )的下方設有一加 熱治具，使該待封裝感測器物件（2 〇 )透明蓋板（3 〇 )周邊頂緣上與鏡頭座（5 〇 ) ^的膠體加熱至預定之溫 度’達到預定的定形作用，並有效減少膠體流動性，以形 成極佳的定位效果。 以熱壓合手段將將鏡頭座（5 〇 )完全固著於透明蓋 板（3 0 )上；主要係將待封裝感測器物件（2 〇 )與封 裝其上的鏡頭a (5 0)輸送至加壓裝置對鏡頭座（5 〇 )施以加壓壓合，增加鏡 ( 5 Q)與透明蓋板（3 〇 L間之的接合強度’並可控制封裝後之影像感測器之整體 高度及共平面性’再送人烘烤裝置使膠完全固％，以完成 該影像感測器之封裝作業。 藉此，於該影像感測器的封裝過程中，㈣裝感測器 物件（2〇)1 组裝其上的上物件，如前述之透明蓋板（ 30)或鏡頭座（40) 、Γςη、^ ....... 200525660 置進行封裝作業前，先分別— 封裝作辈n甘主 潔處理，使兩者於 成不附者任何微塵及雜質， 另亦了先行對待封裝感測器物件（2 〇 位間的熱固性膠體施以預烤處：物件結合部 產生不當位移。 物件於輸-至供烤裝置的過程中 另’如弟七圖及第八同- 板（6 0)之影像减❹^不明亦適用於軟式基 物件可為玻璃：= 裝之上物件封裝’其上 巧破璃孤板（3 0)或具有玻 頭座（4 0)，封裝於已m 之鏡 連接之裤抖板下方以覆晶方式與晶片 運接之待封裝影像感測器物 ，主要包括有·· 勿件（2〇)上之封裝製程步驟 k i、具有溧淨層流控制之内部環境。 器二ΓΓΓ變化反應手段清潔該待封裝影像感測 清==Γ:用封裝設備（10)預設之第- 传—:山 忒〆月洗裝置設有一進巍孔及排氣孔， 使一氧化碳從進氣孔進人、、主 合H… 置’再於排氣孔排出，配 妷因溫度及壓力的改變而產 封裝影像感測器物件（20)的h 4化，清潔待 20)各二 用以去除待封裝感測物件（ U )各表面所附著之微塵及雜質。 膠二：手段於待封裝影像感測器物件之基板上方塗設 ; 要係利用封裝設備（1〇)預設之點膠裝置（1 ’對完成清洗處理之待封裝感測器物件（20)上的 12 200525660 預定結合部位施以點膠㈣，使其基板i 將其傳送至下-個製程的定位工作區（A)。，體’並 或二氧=三態變化反應手段清潔該透明蓋板之表面 A鏡頭座，主要係利用封妒 “， 備（1 0)預設之第二清洗 ΐ置（13)，並藉由取置器（“）取置透明蓋板= 透明蓋板之鏡頭座，使其容置於該第二清洗裝置（二、 二 内部，第二清洗裝置設有一進氣孔及一排氣孔，使二氧化 ，㈣氣孔進入第二清洗裝置，#由排氣孔排出，配合： 氧化厌因咖度及壓力而產生三態變化對透明蓋& ( 3 或具透明蓋板（3 0 )的鏡頭座（4 0 )#表面產生之、、主 洗效果1以去除透明蓋板（3 0)或具透明蓋板（3 〇月 的鏡頭座（4 0 )表面所附著之微塵及雜質。 曰从利用視覺系統進行定位，將透明蓋板（3 〇 )或具透 月風板（3 0)的鏡頭座（4〇)精確定位於基板上，同 時施以預烤加熱處王里，使透明蓋板（3 0)或具透明蓋板 Y f 〇 )的鏡頭座（4 〇 )定位於軟式基板（6 〇 )上， 於第一清洗裝置一側設有一組視覺系統，擷取透明蓋板（ 〇 )或具透明蓋板（3 0 )的鏡頭座（4 0 )之影像位 置/並，疋位工作區（A )的上方設另一組視覺系統，擷 取待封裳影像感測器物件（2 0 )之影像位置進行定位， 杰c 1 4 )藉由二組視覺系統進行定位，將透明蓋板 / 3 〇 )或具透明蓋板（3 0 )的鏡頭座（4 0 )設置於 =封政感測為物件（2 〇 )上的預定結合部，同時利用具 、烤…、射功志的預烤裝置（1 5 )，如紫外線光源照射燈 13 200525660 等’對兩者結合部位施以預烤處理（若為具透明蓋板之鏡 頭座，則不施以預烤處理，因鏡頭座為不透光之材質， 外線無法照射）且在待封裝感測器物件（ τ ^ 下方設 有-加熱治具，使該待封裝感測器物件（2 〇)的堤 緣與透明蓋板（3 0 )間的膠體加熱至預定之溫度，^到 ，定的定形作用，並有效減少膠體流動性，以形二極佳的 定位效果。 、 以熱壓合手段將透明蓋板（3〇)或具透明蓋 〇 )的鏡頭座（4 0 )強化固著於軟式基板（6 〇 )上. 主要係將待封裝感測器物件（2〇.)與封裝其上的透明罢 板（30)或具透明蓋板（3〇)的鏡頭座（4〇 : 至加壓裝置對透明蓋板（3〇)或具透明蓋板（3〇)的 鏡頭座（40)施以加壓壓合，以增加透明蓋 =透明蓋板㈡0)的鏡頭座"〇)與軟式基板（： 〇)間之接合強度，可控制封妒德旦 产及it伞^ W ^ 、麦之衫像感測器之整體高 度及:、千面性’再送入烘烤裝置使膠完全固化， 影像感測器之封裳作業。 兀 Μ 首由上述實施流程說明中撂 π 44狀剩 f侍知，本發明影像感測器後 又封衣衣程之上物件封裝方法的特點在於： 1、該影像感測器於封裝過鞋 測哭物杜；^έ &甘 迟釭中，可先行對待封裝感 ::物件及組裝其上之上物件’如前述之透明蓋板（30 )或鏡頭座（4 0 ) 、（ 5 〇 )望\ 1 j 0 & U j等，分別施以二氧化栌- 態變化反應手段的表面清潔處 虱化呶二 成封裝製程後，幾乎不會附著任 ^ U的彳放麈及雜質，提昇待 14 200525660 封I感測益物件及上物件〜 、 。/糸/尹度，避免感測區之部份晝 素被微塵或水氣遮蔽無法感測。 一 7 2 ,亥〜像感測态於進行封裝過程中，藉由二組視覺 系統進行定位，使上物杜 ,Q n , 物件Ύ精確定位於待封裝感測器物件 — 上上物件組裝於待封裝感測器物件（2 〇 )的 預疋組裝部位後，同時對 上物供社人〜 情兩者施以預烤、預熱處理，強化 :物件結合疋位於待封裝感測器物件（2〇)上之結合強 二=τ定位效果，而有效防止該上物件於輸送過 產王品品質 不當位移，以確保封裝後之影像感測器的 程之上1:上封:說:月可知，本發明影像感測裝製 上物件封4方法，可於影像感測器封裝過程中，先分 別對待封裝感測器物件及έ F並 ,m目，广 千及、、且#其上之上物件施以清潔處理 C免感測區之部份畫素被微塵 ，曰认；土垃★ >机&敬，而無法感測 且於兩者精確定位後，同時 佳0…"s …“預烤加熱處理，形成極 疋：效果，以防止上物件於輸送過程中因晃動而產生 位移，其確為一相當優異之設計。 【圖式簡單說明】 (一）圖式部分 第一圖係本發明之實施流程圖。 ^圖係本發明所配合使用之料設備的立體外觀圖。 第二圖A〜D係本發明之實施示意圖。 第四圖係本發明待封裝感測器物件與上物件之示音圖（ 一 )〇 15 200525660 之示意圖 第五圖係本發明待封裝感測器物件與上物件 第六圖係本發明待封裝感測器物件與上物立 二）。 丁 <不思圖 第七圖=發明待封裝感測器物件與上物件之示意圖 第八圖發明待封裝感測器物件與上物件之示意圖 (二）元件代表符號200525660 发明 Description of the invention: [Technical field to which the invention belongs] The present invention relates to an object packaging method on the back-end packaging process of an image sensor, and more particularly, it is applied to the back-end packaging process of an image sensor, and is aimed at being packaged on an image. The design proposed by the packaging method of the transparent cover on the sensor object, the lens holder or the lens holder with a transparent cover to ensure the cleanliness, positioning accuracy and bonding strength of the image sensor after packaging . ° [Previous technology] Commonly used image sensor devices — including those with image sensing functions: Learn about semiconductor wafer products'. Because the sensing area of the chip inside the camera needs to maintain a high standard of cleanliness, avoid Part of the daytime in the sensing area is shielded by dust or water vapor and cannot be sensed. Therefore, it is necessary to apply a suitable packaging hand a to the sensor element to protect the internal sensing area of the sensor element from moisture. And the invasion of the dust caused by the intrusion of the person ', so that the chip can be redistributed through the circuit of the substrate for external connection, thereby being controlled for the purpose of image sensing. Or photo-coupling elements (predetermined die-attachment die on the substrate of the CCD video circuit-the person will stick the wafer with the photosensitive side facing up and then use the wire bonding method to attach the wafer to the top edge of the substrate's bank wall) The cover cover is placed on the top edge of the embankment for packaging operations, or the package of the image sensor (C MOS image sensor) can be used in the conventional image sensor, etc., mainly before The shape of the square ring-shaped embankment wall substrate is shaped to electrically connect the glue on the substrate inside the embankment wall. The IR filter chip is then baked to complete the image sensing method. A complementary metal oxide semiconductor 2005200560 is attached to a lens holder on the fascia board, and Boshi constitutes an image sensor with an image sensing function. There is another soft base plate method, which is-a soft base plate with an opening design. 'FlipPGhip' is used to connect the wafer to the base plate under the base plate. Paste the objects and bake them to complete the image sensor packaging of the flexible substrate. = The above-mentioned conventional image sensor packaging method still has the following disadvantages when it is actually used: J is used to make objects on the post-process in the atmospheric state (that is, the aforementioned transparency = reverse, lens mount, etc.) ) _ Installation, easy to affect the image quality after I due to the dust, water vapor, attached objects and substrates in the atmosphere. Objects are like sensors in the packaging process, and no packaging is applied to the front of the package: cattle, the substrate itself is not subjected to any cleaning treatment, because &, such as the above objects or before installation, if the surface is stained with dust or other impurities , Then-"After the compression packaging is completed, the 'image sensing area Tian Dan covers part of the day of the image sensing area *, part of the cleaning process' has been packaged in the image sensor == can no longer be Rework processing. Dust or impurities 3. When the image sensor is packaged, it must pass the brake after placing the object ^ ..., > and 盍 'to complete the packaging operation, where the substrate and the object Door two, set yk, .. .. Report the joint area between the kisses ... During the delivery process, because the colloid between the transparent cover and the substrate is still not fully cured, it can not provide the proper positioning effect between the two, leading to the object Gu Yi was displaced due to shaking during the transportation process, which caused a poor joint between the substrate and the upper object. [Summary of the Invention] Therefore, in order to improve the disadvantages of the aforementioned image sensor packaging method, the inventor has developed a " Image sensing "T packaging method behind the device", I hope this design, the sensor sensor packaging process t = supply = clean environment with laminar flow control, and the sensor to be packaged by the hand and: person: flatten the object on it Apply a surface cleaning treatment, and visually and immediately pre-bake and pre-heat to strengthen the upper object and the sensor to be packaged. Degree 'to ensure the cleanliness of the image sensor after packaging, the precise positioning of the sensor object to be packaged and the upper object and the strength of the combination 2 of the invention. Ren Wangwang Yao: To achieve the aforementioned two purposes of the invention ′ The technical means used in the present invention is an object packaging method based on its packaging process, and silly power. . The fossils and the two tragic change response methods respectively sense the surface of the shirt to be packaged as the surface of the object and the cloth to be adhered. ^ Clean the processing, continue to place the upper object on the surface, and apply the predetermined joint on the surface. Baked image sensor object heat "means to increase the upper object's fixation to the strength to be used again", so as to make the package jealous, "the dust and impurities attached to the knot of the object, and the upper object = the piece will not be on the piece.疋 The sensor object that is located in the package to be packaged is implemented by the above method. The package of the image sensor 200525660 is used to clean the surface of the packaged sensor object and the upper object as purple arrows in the package. Then, ^ and 忒 are just clean, and cleanliness is avoided to avoid the heart of the sensing area ... ㈣ 仵 and the upper objects, χ ^, 77 denier is covered by dust or water vapor, and the method of sensing can also be used. The pre-baking treatment is applied to the body without body, and the glue between the pans prevents the upper object from being conveyed effectively and privately. 4 ^ ^ Improper displacement due to shaking, so that only the image after the 4 is sealed. [Embodiment] ': Allow your review committee to understand the other creative purposes and effects of this design. Take τ #I, the following is a specific example, and the detailed description with the diagram is as follows. Debunking technology Fang Zhizhi's news ^ # ,,,, ^ Μ ° and 50, the present invention is applied to the image sensing and packaging of objects on top of the dream board or lens holder, etc., where the above objects can be The transparent cover is shown in the first and second pictures in June: As shown in the fourth picture, the above objects are transparent cover plates (3㈡ ', molded plastic walls on the substrate, wafers The design of the process steps on the image sensor object to be packaged after the adhesion and wire bonding are performed (1, 2). Brother Ming, the packaging process steps mainly include: Provide an internal environment with clean laminar flow control. The method of crying and oxin dioxin change means cleans the surface of the image sensing mouthpiece (20) to be packaged; as shown in Figure 3A, it is mainly the first preset by the packaging equipment (i). Cleaning device (worker), the air compressor and the air heater have an air inlet hole and an air outlet hole, so that carbon dioxide is washed from the air inlet hole / month, and then exhausted through the air outlet hole, in accordance with the temperature and the 200525660 pressure of carbon dioxide The surface of the sensor 2 0) is coated with glue (10 packaging sense), and its positioning produces a tragic molecule after the tragic change. Clean the surface of the image object to be packaged (9 +, main u), and complete the process. The packaged sensor object ('monthly washing process') is used to remove the dust and impurities attached to the sensor object to be packaged (20). The σ 2 glue is used on the top edge of the knee bank of the image sensor object to be packaged. & 'The distribution port is shown in Figure 3B, which mainly uses packaging equipment ()) to set the dispensing device (12) to complete the cleaning process, Γ, and the predetermined bonding site on the object (20). Apply the thermosetting colloid to the top edge of the embankment by dispensing operation and transfer it Go to the next process working area (A). Wang cleans the surface of the transparent cover by means of the three-state change of carbon dioxide; with reference to the third figure C #, it mainly uses packaging equipment ㈠㈧ preset second cleaning device (丄3) 'and the transparent fascia plate (30) is taken by the taker (Η)' so that it is accommodated in the second cleaning device (13) 1, the second cleaning device is provided with-air inlet holes and _ The exhaust hole allows carbon dioxide to enter the second cleaning device (1 3) from the air inlet hole, and then exits through the exhaust hole: cooperate with the carbon dioxide to cause a three-state change due to temperature and pressure on the transparent cover plate (3 0) @surface The cleaning effect generated is used to remove the dust and impurities attached to the surface of the transparent cover plate (30). The image position of the transparent cover plate (30) is positioned by the visual system, and the transparent cover plate (30) is accurately positioned on the top edge of the colloidal bank wall. At the same time, pre-baking heat treatment is applied to position the transparent cover on the colloidal bank wall; as shown in Figures 3 and 3c, a set of vision system is provided on the side of the second cleaning device to capture the transparent cover ( 3 〇 and set another set of views 2 above the positioning work area (A) 2 00525660 sensor system to capture the image position of the image sensor object to be packaged ... The setting state (1 4) is set by the two sets of vision system. The cover plate (30) is set on the sensor to be packaged Object (2〇) 'Will pass through the combination part, and use a pre-baking device (= pre, such as ultraviolet light irradiation lamp, etc.) with a baking irradiation function to apply the combination to the two, and place the sensor object to be packaged ( 2 〇) below: make the top edge of the bank of the sensor object (20) to be packaged and the second = heating with a 3: 2 gel to a predetermined temperature 'to achieve a predetermined shape,' effectively reduce the gel Flowability to form an excellent positioning effect. The transparent cover is reinforced and fixed to the glue by hot pressing. To send the sensor object to be packaged (20): 'The main device is transported to the star device to apply a dance to the transparent cover (30)' 'Add the transparent cover (30) and the bank Strong bonding between them; Control the overall height and coplanarity of the packaged image sensor: Send: The baking device completely solidifies the gel. The packaging method described above for 70% 55% shirt-like sensor package of crops Γ can also be applied to the lens holder (4Q) of the top cover = 3Q as shown in the sixth figure. It is molded with a plastic embankment wall (it can also be a non-bank wall design, which is placed directly on the substrate), the chip is attached to the shirt and the object to be packaged is a sensor object (2 ΓΜ μAA 丨 丨 Ju) The steps above are as described above. = The present invention is also suitable for packaging the lens holder (50) without lens in p + Shigan, wire bonding, and solidification as shown in the fifth figure; L-molded plastic body embankment wall, crystal "occupant transparent 盍" The image to be packaged after the plate (30) is 200525660. Image: The packaging process steps on the container object (20), which mainly provides the internal environment with clean laminar flow control. ^. The surface of the reactor object is changed by the three states of carbon dioxide; #Using the private / monthly heart to be encapsulated image sensing Wang wants to use the packaging equipment f Ί to clean and wear 詈 Γ 1 and 侑 (1 0) preset first to make π dioxide, 5 Hai cleaning device is provided- Stomatal and exhaust hole, person: 1 Stomatal enters the cleaning device, and then is discharged out of the exhaust hole. An emulsifier is attached to the mouth to seal the image sensor object (20) due to changes in temperature and pressure, and clean it. The object to be packaged om completes the sensor to be packaged 2.) The cleaning process is used to remove the dust and impurities attached to the surfaces of the object to be packaged (u). Use dots to win the outside of the object to be packaged image sensor Transparent cover = coated side; mainly use packaging equipment 10) Preset point wins ^ (12) Apply 70% of the cleaning process to the predetermined joint on the sensor object (20) to be packaged, and apply the glue to the periphery of the transparent cover (30). Colloid, and transfer it to the positioning work area (A) of the next process. Clean the surface of the lens holder by means of the two-state change reaction of nitric oxide; 'Mainly use the second cleaning preset by the packaging equipment (10). Device (i 3), and the lens holder is taken by the taker (14), so that it is accommodated in the second cleaning device (丄 3), the second cleaning device (丄 3) is provided with an air inlet hole and An exhaust hole, so that carbon dioxide enters the second cleaning device (1 3) from the air inlet, and is then discharged through the exhaust hole. In accordance with the temperature and pressure of the carbon dioxide, a three-state change occurs on the surface of the lens holder (50). Cleaning effect 'is used to remove the dust and impurities attached to the surface of the lens holder (50). 200525660 Use the vision system to position the lens holder (50) on the top edge of the transparent fascia (30). Heat treatment to position the transparent cover (30) on the colloidal bank On the wall; a set of vision system is set on the side of the second cleaning device (1 3), which captures the image position of the lens holder (50), and sets another set of vision system above the positioning tool (A): ' Capture the image position of the H object (2 Q). To be packaged for image positioning. The positioning state (1 4) is positioned by two sets of vision systems, and the lens holder (50) is set on the sensor to be packaged. A predetermined joint on the object (20), and a heating jig is provided below the sensor object (20) to be packaged, so that the sensor object (20) is to be covered with a transparent cover (30). The colloid on the top edge of the periphery and the lens holder (50) is heated to a predetermined temperature to achieve a predetermined setting effect, and effectively reduces the colloid fluidity to form an excellent positioning effect. The lens holder (50) is completely fixed on the transparent cover (30) by means of hot pressing; it is mainly the sensor object (20) to be packaged and the lens a (50) packaged thereon. It is sent to the pressure device to apply pressure to the lens holder (50) to increase the bonding strength between the lens (5Q) and the transparent cover plate (30L), and to control the packaged image sensor. The overall height and coplanarity 'are then sent to the baking device to make the glue completely solid to complete the packaging operation of the image sensor. Thus, during the packaging process of the image sensor, a sensor object is mounted ( 2〇) 1 Assemble the upper objects, such as the aforementioned transparent cover plate (30) or lens holder (40), Γς, ^... 200525660 Before packaging operations, respectively — package as This process is cleaned, so that the two are not attached to any dust and impurities. In addition, the sensor object (the thermosetting colloid between 20 positions is pre-baked): the joint of the object is improperly displaced. In the process of transferring-to the roasting device, the image of the object such as the seventh figure and the eighth same-plate (60) is reduced ^ Ming also applies to soft base objects can be glass: = mounted on the object package 'on top of the broken glass solitary plate (30) or with a glass head (40), packaged in a mirror connected trouser shaker The image sensor device to be packaged which is connected to the chip by a flip-chip method below mainly includes the packaging process step ki on the package (20) and an internal environment with net laminar flow control. Device II ΓΓΓ Change reaction Means to clean the to-be-packaged image sensing clear == Γ: Pre-set with the packaging equipment (10)-Pass-through: The mountain cleaning month washing device is provided with an inlet hole and an exhaust hole, so that carbon monoxide enters from the air inlet hole The person, the main assembly H ... is placed in the exhaust hole, and the packaged image sensor object (20) is produced due to changes in temperature and pressure, and is cleaned. Dust and impurities attached to each surface of the packaged sensing object (U). Glue 2: Means to apply on top of the substrate of the image sensor object to be packaged; it should be a dispensing device preset using packaging equipment (10) ( 1 '12 on the sensor object to be packaged (20) after the cleaning process is completed. Place the adhesive on the part, so that the substrate i will be transferred to the positioning work area (A) of the next process. The body's or the two oxygen = three-state change reaction means clean the surface of the transparent cover A lens holder The main purpose is to use the seal jealousy ", prepare (10) the preset second cleaning unit (13), and take the lens holder of the transparent cover = the transparent cover by the taker (") to make it capacity Placed inside the second cleaning device (two, two, the second cleaning device is provided with an air inlet hole and an exhaust hole to make the dioxide, the radon gas hole enters the second cleaning device, # is discharged from the exhaust hole, cooperate with: oxidation Tired of the tri-state changes due to the degree of coffee and the pressure on the surface of the transparent cover & (3 or the lens holder (40) with a transparent cover (30), the main washing effect 1 to remove the transparent cover ( 30) or a dust cover and impurities attached to the surface of the lens holder (40) with a transparent cover plate (30 months). That is, from the positioning using the vision system, the transparent cover (30) or the lens holder (40) with a translucent wind plate (30) is accurately positioned on the substrate, and at the same time, the pre-baking heating is performed to make the The transparent cover (30) or the lens holder (4 〇) with a transparent cover Y f 〇) is positioned on the soft substrate (60), and a set of vision system is provided on the side of the first cleaning device to capture the transparent cover Image position of the plate (〇) or the lens holder (40) with a transparent cover (30), and another set of vision system is set above the nib work area (A) to capture the image of the image to be sealed Positioning of the image position of the camera object (20), Jay c 1 4) positioning by two sets of vision system, the transparent cover / 3 〇) or the lens holder (40) with a transparent cover (30) It is set at a predetermined joint on the object (20) which is to be sealed and sensed. At the same time, a pre-baking device (1 5), such as a UV light source, 13 200525660, etc. is used. Pre-bake treatment is applied to the joint part (if it is a lens holder with a transparent cover, it will not be pre-baked, because the lens holder is an opaque material , The outer line cannot be illuminated) and a heating fixture is provided below the sensor object to be packaged (τ ^), so that the gel between the bank edge of the sensor object to be packaged (20) and the transparent cover plate (30) Heating to a predetermined temperature, to achieve a fixed setting effect, and effectively reduce the fluidity of the colloid, to shape the excellent positioning effect. 2, the transparent cover (30) or a transparent cover by means of thermocompression bonding) The lens holder (40) is reinforced and fixed on the flexible substrate (60). It mainly consists of the sensor object (20) to be packaged and the transparent stop plate (30) or a transparent cover ( 3〇) Lens mount (40: To the pressurizing device, press the transparent cover (30) or the lens mount (40) with the transparent cover (30) to press and press to increase the transparent cover = transparent The joint strength between the lens holder "0" of the cover plate "0" and the flexible substrate (: 〇) can control the overall height of the seal made by Dedan and it umbrella ^ W ^, wheat shirt image sensor, and :, Thousands of facets' are then sent to the baking device to completely cure the glue, and the sealing operation of the image sensor is performed. Wu M is firstly known from the above description of the implementation process of the π 44 shape leftover f. The method for packaging objects on the clothing process after the image sensor of the present invention is characterized by: 1. The image sensor is packed in shoes Measure the crying object; ^ έ & Gan Chi, you can first treat the packaging feeling: the object and the objects assembled thereon, such as the transparent cover (30) or the lens holder (40), (50) ) Wang \ 1 j 0 & U j, etc., after applying the plutonium dioxide-state change reaction method to the surface cleansing lice 呶 into the packaging process, almost no ^ 彳 release and impurities, Lift up 14 200525660 I-sensing objects and objects ~,. / 糸 / 尹 度, to prevent part of the daylight in the sensing area from being blocked by dust or water vapor. 1-2, the image sensing state is positioned during the packaging process by two sets of vision systems, so that the upper object, Q n, object Ύ is accurately positioned on the sensor object to be packaged-the upper object is assembled on the After the pre-assembly of the sensor object (20) is to be packaged, pre-baking and pre-heating are applied to the above-mentioned supplier to both of them at the same time, strengthening: the object combination is located at the sensor object to be packaged ( 2〇) The combination of strong second = τ positioning effect, which effectively prevents the upper object from being displaced improperly during the conveyance of the king product, to ensure that the packaged image sensor is on the upper 1: seal: said: month It can be known that the method for manufacturing an object seal 4 of the image sensing device according to the present invention can first treat the packaged sensor object and the camera separately, and the camera is in the process of packaging the image sensor. Some of the pixels in the C-free sensing area were cleaned by the dust on the objects, and they were recognized as dirt; > Machine &; s… "Pre-baking heat treatment, forming a 疋: effect, to prevent the upper objects from being transported during transportation Displacement caused by movement is indeed a very good design. [Simplified description of the drawings] (a) The first drawing of the drawing part is the implementation flow chart of the present invention. ^ The drawing is a three-dimensional view of the material equipment used in the present invention. Appearance diagram. The second diagram A to D are schematic diagrams of the implementation of the present invention. The fourth diagram is the sound diagram of the sensor object and the upper object to be packaged according to the present invention (1) 015200525660 The fifth diagram is the diagram of the present invention. The sixth image of the packaged sensor object and the upper object is the second object of the sensor to be packaged and the upper object of the present invention. Figure 8 Schematic diagram of the sensor object and the upper object to be packaged in the invention (2) Symbols of components
(1 〇)封裝設備 ^ (1 2 )點膠裝置 1 )第-清洗裝置 (1 4 )取置器 （1 3 )第二清洗裝置 (20)待封裝感測器(15)預烤裝置 (40)鏡㈣ （3〇)透明蓋板 (…軟式基板 （5〇)鏡頭座(1 〇) Packaging equipment ^ (1 2) Dispensing device 1) First-cleaning device (1 4) Taker (1 3) Second cleaning device (20) Sensor to be packaged (15) Pre-bake device ( 40) Mirror (30) transparent cover (... soft substrate (50)) lens holder
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