四、創作說明（1) 【新型所屬之技術領域】 本創作係有關於一種攝影模組，特別係有關於一種玻 璃覆晶攝影模組。 【先前技術】 目前攝影模組之運用領域相當廣泛，如數位相機、數 位攝影機、影像電話及視訊會議等等，習知攝影模組係先 將一封裝完成之影像感測器〔Image Sens〇r〕裝設於一電 路基板上’再於該電路基板裝設一鏡頭座，以擷取光學影 像訊號’如中華民國專利公報公告第492593號「CCD及 CMOS影像擷取模組追加一」所揭示者，該影像攝影模組係 包含有一電路基板，於該電路基板上結合一影像感測元件 〔CMOS、CCD〕’於該影像感測元件之封裝體緣設有一鏡 頭座，該鏡頭座具有一取景筒以對應於該影像感測元件之 耦合晶體上方，該取景筒係用以旋鎖一鏡頭，該鏡頭座依 據該取景筒之接合部而罩設於該影像感測元件，且該鏡頭 座係貼附及封閉於影像感測元件之封裝體頂緣周圍，使該 鏡頭座之取；f、涛月b對應於該影像感測元件之搞合晶體上 方，該衫像擷取模組之影像感測元件需先經一封裝製程， 再結合於該電路基板，其製程係較為繁瑣。 此外，另一種習知之攝影模組， 7 ^ =。彻"u「影像裝置模組封裝」： 該影像裝置棋組，包含有—電路基㈣、- 衫像感測晶片20、一外蓋〔h〇using〕3〇及一鏡頭座 〔holder〕40，該影像感測晶片2〇係貼設於該電路基板 M250470 四、創作說明（2) 10，並以複數個銲線50電性連接該電路基板1〇，該外蓋3〇 係設於該電路基板1 〇並密封該影像感測晶片2〇，以防止水 氣侵入而影響該影像感測晶片2 〇，即該影像感測晶片2 〇需 被封裝於該外蓋30與該電路基板10所形成之密閉空間，之 後’再將該鏡頭座40裝設於該外蓋3〇上，以擷取光學影像 訊號。 【新型内容】 本創作之主要目的係在於提供一種玻璃覆晶攝影模 組’利用一影像感測晶片直接覆晶接合於一鏡頭座之濾光 片’不需先封裝該影像感測晶片，以整合影像感測晶片之 封裝製程與鏡頭座之組裝製程。 依本創作之玻璃覆晶攝影模組包含有一鏡頭座，該鏡 頭座係用以結合一鏡頭，該鏡頭座包含有一座體及一濾光 片’該座體係具有一基座部及一鏡頭結合部，該基座部係 形成有複數個電性導接元件，該濾光片係設於該基座部與 該鏡頭結合部之間，該濾光片係具有複數個線路，該些線 路係與該些電性導接元件電性連接，該濾光片係覆晶接合 有一影像感測晶片，該影像感測晶片係具有一感測面及一 背面’該感測面之周邊形成有複數個凸塊，該影像感測晶 片之該些凸塊係接合於該濾光片之該些線路，該影像感測 晶片與該鏡頭座之該濾光片之間係設有一第一密封膠，以 密封該影像感測晶片之感測面，防止水氣侵入而影響該影 像感測晶片，較佳地，該鏡頭座之基座部形成有一第二密 、十膠 以包覆該影像感測晶片之背面。4. Creation Instructions (1) [Technical Field to which the New Type belongs] This creation relates to a photographic module, and in particular to a glass flip-chip photographic module. [Previous technology] At present, the application field of photography modules is quite wide, such as digital cameras, digital cameras, video phones, video conferences, etc., the conventional photography module is a packaged image sensor [Image Sens〇r] ] Installed on a circuit substrate 'and then install a lens holder on the circuit substrate to capture optical image signals' as disclosed in the "Republic of China Patent Gazette No. 492593" Addition of a CCD and CMOS image capture module " The image photography module includes a circuit substrate. An image sensing element (CMOS, CCD) is combined with the circuit substrate. A lens holder is provided on the edge of the package of the image sensing component. The lens holder has a lens holder. The viewfinder tube is above the coupling crystal corresponding to the image sensing element. The viewfinder tube is used to spin-lock a lens. The lens holder is arranged on the image sensing element according to the joint portion of the viewfinder tube. It is attached and closed around the top edge of the package of the image sensing element, so that the lens holder is taken out; f, Tao Yue b corresponds to the top of the engaging crystal of the image sensing element, the shirt image The image sensing device module to take a required prior to the packaging process, and then bonded to the circuit board, which system is more complicated manufacturing process. In addition, another conventional photography module, 7 ^ =. To "quotation package of image device module": The image device chess set includes-circuit base,-shirt image sensor chip 20, a cover [housing] 30 and a lens holder [holder] 40. The image sensing chip 20 is attached to the circuit board M250470. 4. Creation instructions (2) 10, and the circuit board 10 is electrically connected with a plurality of bonding wires 50. The outer cover 30 is provided on The circuit substrate 10 and the image sensing chip 20 are sealed to prevent water vapor from invading and affecting the image sensing chip 20. That is, the image sensing chip 20 must be packaged in the outer cover 30 and the circuit substrate. The sealed space formed by 10, and then the lens holder 40 is mounted on the outer cover 30 to capture optical image signals. [New content] The main purpose of this creation is to provide a glass flip-chip photography module 'using an image sensing chip to directly flip the chip bonded to a lens holder' filter without first packaging the image sensing chip. Integrate the packaging process of the image sensor chip and the assembly process of the lens holder. The glass-on-chip photographic module created according to this book includes a lens holder for combining a lens. The lens holder includes a body and a filter. The base system has a base portion and a lens combination. The base portion is formed with a plurality of electrical conductive elements. The filter is provided between the base portion and the lens coupling portion. The filter has a plurality of lines. The lines are It is electrically connected with the electrical conductive elements. The filter is flip-chip bonded with an image sensing chip. The image sensing chip has a sensing surface and a back surface. The periphery of the sensing surface is plural. Bumps, the bumps of the image sensing chip are connected to the lines of the filter, and a first sealant is arranged between the image sensing chip and the filter of the lens holder, The sensing surface of the image sensing chip is sealed to prevent water and gas from invading and affecting the image sensing chip. Preferably, a second dense, ten glue is formed on the base portion of the lens holder to cover the image sensing The back of the chip.
M250470 四、創作說明（3) 【實施方式】 參閱所附圖式，本創作將列舉以下之實施例說明。 依本創作之一具體實施例，請參閱第2圖，一種玻璃 覆晶攝影模組100包含有一鏡頭座11〇，該鏡頭座11〇包含 有一座體111及一濾光片112，該座體lli係以射出成型方 式形成，該濾光片11 2可於射出成型形成該座體丨丨1時即結 合於該座體111中，該座體111係具有一基座部113及一鏡° 頭結合部114 ’該基座部113係具有一内側壁115及一接合 端，該基座部1 1 3係形成有複數個電性導接元件11 6，該些 電性導接元件1 1 6係為金屬片，該些電性導接元件丨丨6係可 形成於該基座部11 3之内侧壁11 5或嵌設於該基座部丨！ 3 中’而不論該些電性導接元件116係形成於該基座部jig之 内侧壁11 5或嵌設於該基座部11 3中，該些電性導接元件 11 6之一端係顯露於該基座部丨丨3之接合面，用以傳遞電性 至外部電路板〔圖未繪出〕，該鏡頭結合部11 4係形成有 内螺紋，用以結合一鏡頭20 0，該濾光片11 2係為一紅外線 滤光片（IR Fi 1 ter )，用以濾除紅外線，以防產生雜訊 或偽色，該濾光片11 2係設於該基座部11 3與該鏡頭結合部 11 4之間，在本實施例中，該座體丨丨1之基座部丨丨3與鏡頭 結合部11 4之間係形成有一限位槽11 7，該濾光片丨丨2係設 於該限位槽117，該濾光片112係具有複數個線路ι18，該 些線路11 8為一金屬層，例如氧化銦錫〔Indium Ti η Oxide，I TO〕，該些線路118係與該些電性導接元件丨丨6電 性連接’該濾光片11 2係覆晶接合有一影像感測晶片i 2 〇，M250470 IV. Creative Instructions (3) [Embodiment] Referring to the attached drawings, this creative will enumerate the following examples. According to a specific embodiment of this creation, please refer to FIG. 2, a glass flip-chip photography module 100 includes a lens holder 110, which includes a body 111 and a filter 112, and the body The lli is formed by injection molding. The filter 112 can be combined with the base 111 when the injection molding is performed to form the base body. The base body 111 has a base portion 113 and a mirror. The head coupling portion 114 ′ The base portion 113 has an inner side wall 115 and a joint end, and the base portion 1 1 3 is formed with a plurality of electrical conductive elements 11 16, and the electrical conductive elements 1 1 The 6 series is a metal sheet, and these electrical conductive elements 丨 丨 6 series can be formed on the inner side wall 115 of the base portion 11 3 or embedded in the base portion 丨! 3 'regardless of whether the electrical conductive elements 116 are formed on the inner side wall 115 of the base portion jig or embedded in the base portion 113, one end of the electrical conductive elements 116 is The joint surface exposed on the base section 3 is used to transfer electrical properties to an external circuit board (not shown in the figure). The lens coupling section 11 4 is formed with an internal thread for coupling a lens 200. The filter 11 2 is an infrared filter (IR Fi 1 ter) for filtering out infrared rays to prevent noise or false colors. The filter 11 2 is provided on the base portion 11 3 and Between the lens coupling portion 11 4, in this embodiment, a limiting groove 11 7 is formed between the base portion 丨 丨 1 of the base body 丨 丨 3 and the lens coupling portion 11 4, and the filter 丨丨 2 is provided in the limiting slot 117, and the filter 112 has a plurality of lines 18, the lines 118 are a metal layer, such as indium tin oxide (Indium Ti η Oxide, I TO), the lines 118 series is electrically connected with the electrical conducting elements 丨 丨 6 'The filter 11 2 series chip is bonded with an image sensing chip i 2 〇,
M250470 四、創作說明（4) 該影像感測晶片120係選自於電荷耦合器件〔charged Couple Device，CCD〕與互補金屬氧化半導體 〔Complementary Metal Oxide Semiconductor ， CMOS 〕 之其中之一，該影像感測晶片1 2 0係具有一感測面1 21及一 背面122，該感測面121之周邊形成有複數個凸塊123，該 些凸塊123係可為金凸塊〔Gold Bump〕或錫錯凸塊 〔Solder Bump〕，該影像感測晶片120之該些凸塊123係 接合於該濾光片11 2之該些線路1 1 8，該影像感測晶片1 20 與該鏡頭座1 1 0之該濾光片1 1 2之間係設有一第一密封膠 1 3 0，以密封該影像感測晶片1 2 〇之感測面1 2 1，防止水氣 侵入而影響該影像感測晶片1 2 0之感測面1 2 1，該第一密封 膝130之材質係選自於由異方性導電膠〔Anisotropic Conductive Paste，ACP〕、光感固化膠〔Photocurable Paste〕及覆晶底部填充材（underfilling Material )所 組成之族群中之一種材質，在本實施例中，該第一密封膠 1 30係完全覆蓋該濾光片112之該些線路118，以避免該些 線路11 8氧化，較佳地，該鏡頭座丨丨〇之基座部丨13係形成 有一第二密封膠140，該第二密封膠140係為一透明膠 〔Clear C〇mpoUnd〕，其係包覆該影像感測晶片120之背 面1 22 ’以達到保護該影像感測晶片丨2〇之功效，且該第二 密封膝140係不覆蓋至顯露於該基座部113之接合面之該些 電性導接元件11 6之一端，以避免影響該玻璃覆晶攝影模 組1 0 0之電性傳導。 由於該影像感測晶片1 2 〇係直接覆晶接合於該鏡頭座M250470 4. Creation instructions (4) The image sensing chip 120 is selected from one of a charged coupled device (CCD) and a complementary metal oxide semiconductor (CMOS). The image sensing chip The chip 1 2 0 has a sensing surface 121 and a back surface 122. A plurality of bumps 123 are formed around the sensing surface 121. The bumps 123 may be gold bumps or tin bumps. The bumps [Solder Bump], the bumps 123 of the image sensing chip 120 are connected to the lines 1 1 8 of the filter 112, the image sensing chip 1 20 and the lens holder 1 1 0 A first sealant 130 is arranged between the filters 1 12 to seal the sensing surface 1 2 1 of the image sensing chip 1 2 0 to prevent water vapor from invading and affecting the image sensing chip. 1 2 0 sensing surface 1 2 1. The material of the first sealing knee 130 is selected from the group consisting of Anisotropic Conductive Paste (ACP), Photocurable Paste and flip-chip underfill. A material in a group of underfilling materials In this embodiment, the first sealant 1 30 completely covers the lines 118 of the filter 112 to avoid oxidation of the lines 118. Preferably, the base portion of the lens mount 丨 丨 〇丨 13 is formed with a second sealant 140. The second sealant 140 is a transparent adhesive [Clear CompoUnd], which covers the back surface 1 22 'of the image sensing chip 120 to protect the image sense The efficacy of the chip 丨 20 is measured, and the second sealing knee 140 is not covered to one end of the electrical conductive elements 116 exposed on the joint surface of the base portion 113 to avoid affecting the glass-on-chip photography Electrical conduction of module 100. Since the image sensing chip 1 2 0 is directly flip-chip bonded to the lens holder
M250470 ["、創作說明（5) 11 0之濾光片11 2，不需先封裝該影像感測晶片1 20，以整 合該影像感測晶片1 2 0之封裝製程與該鏡頭座11 〇之組裝製 輕’減少製造成本。 本創作之保護範圍當視後附之申請專利範圍所界定者 二準，任何熟知此項技藝者，在不脫離本創作之精神和範 圍内所作之任何變化與修改，均屬於本創作之保護範園。M250470 [", creative description (5) 11 0 of the filter 11 2 without first packaging the image sensing chip 120, in order to integrate the packaging process of the image sensing chip 120 and the lens holder 11 〇 The light weight of the assembly system reduces manufacturing costs. The scope of protection of this creation shall be deemed as defined in the scope of the attached patent application. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of this creation shall be protected by this creation. garden.
第11頁 M250470 圖式簡單說明 【圖式簡單說明】 第1圖：美國專利公開公告2003/00 48378 A1號「影像裝 置模組封裝」之截面示意圖；及 第2圖··依本創作之玻璃覆晶攝影模組之截面示意圖。 元件符號簡單說明： 10 電路基板 20 影像感測晶片30 外蓋 40 鏡頭座 50 銲線 100攝影模組 110鏡頭座 111 座體 112濾光片M250470 on page 11 [Brief description of the drawings] Figure 1: Sectional diagram of US Patent Publication 2003/00 48378 A1 "Image Device Module Package"; and Figure 2 · Glass created according to this A schematic cross-sectional view of a flip-chip camera module. Brief description of component symbols: 10 circuit board 20 image sensor chip 30 outer cover 40 lens holder 50 welding wire 100 camera module 110 lens holder 111 base 112 filter
113 基座部 114 鏡頭結合部 115 内侧壁 11 6 電性導接元件11 7 限位槽 11 8 線路 120影像感測晶片121 感測面 122背面 1 2 3凸塊 130第一密封膠 1 4 0 第二密封膠 200鏡頭113 Base portion 114 Lens coupling portion 115 Inner side wall 11 6 Electrical conductive element 11 7 Limiting slot 11 8 Circuit 120 Image sensing chip 121 Sensing surface 122 Back 1 1 3 Bump 130 First sealant 1 4 0 Second sealant 200 lens
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