TWM244691U - Supper thin type camera module - Google Patents

Description

M244691 V. Creation Instructions (l) [Technical Field to which the New Type belongs] This creation relates to a photographic module, and particularly to an ultra-thin photographic module containing a thermosetting film combined with a lens holder. [Previous technology] The application fields of photography modules are quite extensive, such as digital cameras, video phones, mobile phones, monitor systems, video conferences, etc., which are based on an image sensing semiconductor chip (one of the common chip systems It is a complementary type: it is an oxide semiconductor, CMOS is packaged in an optical device to sense and capture the optical image signal, convert the optical image signal into an electronic signal and transfer it to the circuit substrate, so that the optical image signal can be identified, processed or stored. . In the Republic of China Patent Gazette Bulletin No. 49 2593 "CCD & CM0s image capture module addition one", its previous technology revealed a conventional ccd $ image capture module, which contains an image sensing element system It is electrically connected to a circuit board and combined on the circuit substrate—the module circuit required by the lens holder for the CD shadow extraction module must be electrically connected, so the image extraction module The manufacturing process must be equal to the image sensor: it is electrically connected to the circuit substrate (such as the surface port 4), and then fixedly combines the lens holder and the circuit beautiful cup, and the misalignment between the broadcasting and broadcasting causes image capture of the image sensing element. This is how the sound of the angle is taken, in order to make the lens barrel of the lens holder accurately aligned with the image sensing element coupling crystal (ie, the chip). In addition, the patent is also improved-the image extraction module of the mouth. Its, 4r]:;:; ccD and a further method and the above-mentioned knowledge

Page 6 M244691 V. Creation instructions (2) The CCD image capture module is roughly the same. The difference is that the lens mount is combined with the upper edge of the package of the image sensing element (CM0s, CCd), and the lens The base is attached and closed around the top edge of the image sensing element package, so that the viewfinder tube of the lens mount can correspond to the coupling crystal of the image sensing element. However, the lens mount is combined with the image sensing element. On the sensing element, the image sensing element must bear the weight of the entire lens holder, which can easily affect the stability of the electrical combination between the image sensing element and the circuit substrate. In addition, the modular system of the middle head includes one side without—the lens holder body sensing module system is provided with a continuous light unit at an optical sensing position, and the lines are in contact with each other (pi η) to start the image board. And the thickness of the bottom group of an optical module, in addition to the overall ROC Patent Gazette Bulletin No. 372079 _… structure, a modular electronic photography lens, lens holder and a light-sensing mold are disclosed. Group, in which one of the lens bases is an empty convex post, the convex post is pivotally provided with a telescopic lens barrel, and the other side is provided with a receiving groove penetrating the convex post, and the light is placed in the receiving groove. It is formed by packaging a filter, a substrate, and a wafer, wherein the substrate is perforated correspondingly with the convex pillar to set the filter, and the sense of the optical sensing wafer corresponds to the through-hole and the convex pillar. And the signal of the substrate leads to the contact point of the optical sensing chip. When one end of the signal leads is electrically connected to a related telecommunication circuit element, it can be opened. However, the optical sensor module is packaged with a filter, A hard-based sensing chip, which The optical sensor chip is exposed to the light sensor, which has poor protection to the optical sensor chip, and the light sensor mode includes the thickness of the filter, the hard substrate and the optical sensor chip. The length 'makes the electrical thickness larger. &

Page 7 M244691 V. Creation instructions (3) [New content] The main creator of this creation is a thermosetting adhesive film that is heat-sealed to seal the base of the optical chip. The second creation is a filled gel. The purpose of the bump is to create a thin film substrate. The main purpose is to provide a base that is coated with the adhesive film on an optical crystal plate. The purpose is to combine the optical wafer to achieve the photography mode. An objective is to cover the light with an optical crystal-based sealing solid adhesive film. The purpose is to provide a member provided on a thermosetting film. The thin-film substrate has a finger extension for surface bonding to at least one plate. The ultra-thin type of an optical chip and a thermosetting extension part created according to this book are joined to the back of a super sheet—the super type of ultra-thin film of the lens group, the ultra-thin film of an academic chip type, and an extension part. The photographic surface, and the side, the base, and the design of the thin photographic film film substrate and the back of the photographic mold lens can be formed to simplify the rigid substrate system having a first surface and the periphery of the window formed on the window. The film is provided with an active surface, a corresponding side surface, the active watch and a plurality of sealing bumps formed on the optical substrate connected to the film substrate to prevent the photographic film and the first film. The back surface of the plurality of substrates is an active area of the connection thermosetting group, which is a lens with two surface connection ends, a first surface and a peripheral end, which includes a base body over a rubber film pair, and at least the smooth surface, The active is located in the middle bump, preferably, the optical film, wherein the optical crystal surface of a windowing wafer and the central light are convex. Module wafer, a thermosetting group as substituent Xi square, side surface therebetween. Group, in which there is a conductive base substrate and the thin film, wherein the corresponding sheet is provided with the back-side active region and the block-based electrically-charged colloid is activated by light

IIH

M244691

Qiao Ding, the thermosetting film is set on the back of the optical chip, and the thermosetting film covers the side and back of the optical chip. The lens holder system is used for a 2-in-1 lens, and the lens holder system is combined with The thermosetting film forms a closed space to seal the active surface of the optical chip. The lens holder system has a light-transmitting channel, which corresponds to the light actuating area of the optical chip for capturing optical image signals. Preferably, the thin film substrate has an extension portion beyond the thermosetting adhesive film, and can be formed with a conductive finger or a surface bonding element for surface bonding, instead of the conventional rigid electrical substrate. [Embodiment] Please refer to the attached drawings. This creation will list the following embodiments: According to a specific embodiment of this creation, as shown in Figure 1, an ultra-thin camera module mainly includes a A thin film substrate 10, an optical wafer 20, a thermosetting film 40, and a lens mount 50, wherein the thin film substrate 10 has a first surface 11, a second surface 12, and at least one window 13, among which A plurality of connection terminals 14 are formed around the window 13, such as copper pads or metal fingers. In this embodiment, the thin film substrate 10 is a thin-film-on-chip package (Chip-On-Film, COF). Substrate 10, the connection terminals 14 are disposed on the first surface 11 of the thin film substrate 10, the connection terminals 14 may also be disposed on the second surface 12, or suspended from the window 13, and the connection terminals 14 are electrically A metal layer such as gold, tin, or nickel is preferably forged. The thickness of the thin-film substrate 10 is about 0.1 mm or less, and it is a thin-film flip-chip package that can be rolled and packaged with a tape transmission. The circuit substrate, the soft film of the thin film substrate 10, the system is electrically insulating, such as Amides [alkylene polyimide, PI], polyester

M244691

[Polyester, PET], BT resin or other materials. The optical chip 20 has an active surface 21, a corresponding back surface 22, and a side surface 23 between the active surface 21 and the back surface 22, such as a charge coupled device (CCD), a complementary metal oxide semiconductor ( complementary metal oxide semiconductor (CMOS) or photodiode, etc., the active surface 21 includes a central light activation region 24 for receiving image light sources, and the active surface 21 has a plurality of formations Bumps 25, such as gold bumps and tin-lead bumps, around the light-acting region 24 are used as external electrical connection ends of the optical chip 20. In this embodiment, the optical chip 20 is an image The image sensor chip is a flip-chip bonding method corresponding to the window 13 and the bump 25 of the optical wafer 20 is electrically connected to the connection end 14 of the thin film substrate 10 so that the light The operating region 24 is provided on the first surface 11 of the thin film substrate 10 corresponding to the window 13 of the thin film substrate 10. Preferably, the bumps 25 are sealed with a filling gel 30, and the filling gel 30 is Selected from One of an anisotropic conductive film (ACF), a non-conductive thermosetting film (NCF), a liquid-coated thermosetting gel, and a UV adhesive, and the filling colloid The 30 series has the effect of preventing the thermosetting film 40 from contaminating the light operating region 24 of the optical wafer 20 when the thermosetting film 40 is thermocompression bonded. The thermosetting adhesive film 40 is provided on the back surface 22 of the optical chip 20, and the thermosetting adhesive film 40 covers the side surface 23 and the back surface 22 of the optical chip 20 by thermocompression bonding. Optical wafer 20 and the film

M244691 V. Creation instructions (6) Base plate 1 0 'The thermosetting film 40 that covers the side 2 3 and the back 22 of the optical wafer 2 and covers the optical wafer 20 is a thin combined base of the lens holder 50. To replace the conventional rigid electrical substrate and the sealing compound of the optical chip 20, preferably, the thermosetting film 40 covers the first surface 11 of the film base plate 〇 the lens mount 50 series It is used to combine a lens 60 with a lens 61. The lens base 50 is combined with the thermosetting adhesive film 40 to form a closed space, such as a vacuum state or filled with a passive gas to seal the optical chip 2 Active surface 21, in which the lens base 50 has a coupling portion 52, such as an internal thread, for combining a lens 60, the lens 60 is generally cylindrical and has a transparent lens 61 'The lens 61 It can be fixed or adjusted to be combined with the lens base 50. Among them, the adjustable combined lens 60 is telescopically adjusted to facilitate capturing clear images, and the lens base 50 has a light transmitting channel 51. Is corresponding to the light operating region 24 of the optical chip 20, And the lens 61 of the lens 60 is located on the same photographic path for capturing optical image signals. A lens 53 is installed in the lens base 50, and it is also aligned to the transparent lens. The light channel 51 is a light operating region 24 corresponding to the optical chip 20, and the filter 53 is used to filter out infrared (inf rared, ir) to prevent noise or false colors. In addition, preferably, the thin-film substrate has an extension portion 15 beyond the thermosetting film 40, and the extension portion 15 may be formed with a circuit layer and side conductive fingers 16 (also can be connected to a soft Board connector FPC], as the signal input / output end of the entire camera module, the extension part 丄 5 is surface-bonded to a surface-bonding element 70, and the surface-bonding element 70 may be selected from the group consisting of inductor, resistor, One of capacitors and semiconductor wafers.

M244691 V. Creation Instructions (7) ^ Please refer to Figure 2. The manufacturing method 2 of the ultra-thin photography module of this creation mainly includes the steps of “providing a thin film substrate” 丨 and the step of “joining an optical film” 2 Step 3 of "Providing a thermosetting film", Step 4 of "Hot-pressing the thermosetting film" and Step 5 of "Installing a lens holder on the thermosetting film", which will be described in detail later. First, in step 1 of “Providing a thin film substrate”, please refer to FIG. 3A, to provide a thin film substrate 10 of a thin film flip chip package [chip — ON — Film, COF]. The thin film substrate 10 has a The first surface n, a second surface 12 and at least one solid opening 13 ′, wherein a plurality of connection ends 1 4 are formed around the window 13 in the periphery. In this embodiment, the connection ends 4 are provided on the film. The first surface 11 of the substrate 10 is a thin-film flip-chip packaged circuit substrate that can be rolled and packaged with a tape transmission package. After that, perform step 2 of “bonding an optical wafer”, referring to the figure ，, the first surface of the thin-film substrate 10 facing upward, corresponding to each window 13 by flip-chip bonding, [Inner Lead Bonding], anisotropic conductive adhesive (film) and non-conductive adhesive (film) connection method to join at least one optical wafer 20 to the first surface 11 of the film substrate 10 'The optical wafer 20 series It has an active surface 21, a corresponding back surface 22, and a side surface 23 between the active surface 21 and the back surface 22. The active surface 21 includes a central light activation region 24. In this embodiment, 'The optical chip 20 is an image sensing chip [soil magesens 〇r ch ip') It is a plurality of bumps 2 5 of the optical chip 2 0 electrically connected to the film substrate 1 by flip-chip bonding. The connecting ends 14 of 〇, and the light actuating area 24 corresponds to the window 丨 3 of the thin film substrate; preferably, please

M244691 on page 12 V. Creation instructions (8) Referring to Figure 3C, after step 2 of the above "bonding an optical wafer", a filling colloid can be formed around the window 13 of the film substrate 10, and the filling colloid 30 can be used to seal these. Convex block 25. 'Then' perform step 3 of “Provide a thermosetting film”, see FIG. 3D. 'Provide a thermosetting film 40 on the back surface 22 of the optical wafer 20. When providing the thermosetting film 40, keep the The thermosetting film 40 is at a lower temperature in the solid state, and the thermosetting film 40 is placed on the back surface 22 of the optical wafer 200. In this embodiment, a thermosetting film is provided above the thermosetting film 40 at the same time. The heat conductive mold 110 has a flat pressing surface 1Π, and the flat pressing surface 11 1 is at least larger than the back surface 22 of the optical wafer 20 to facilitate the formation of the thermosetting film 40. Next, perform step 4 of "thermocompression of the thermosetting adhesive film", refer to FIG. 3E, heat and move the mold 110, and thermally compress the thermosetting adhesive film 40 with the flat pressing surface 111 of the mold 110. The thermosetting adhesive film 40 is made to have fluidity, and the fluidity of the thermosetting adhesive film 40 is flowed from the back surface 22 of the optical wafer 20 and covered to the side surface 23 of the optical wafer 20. Preferably, the thermosetting adhesive 40 The film 40 further covers the first surface 11 of the thin film substrate 10 to seal the back surface 22 and the side surface 23 of the optical wafer 20. Since the flow of the thermosetting film 40 is mainly softened by heating temperature, The pressing pressure is much smaller than the conventional injection molding pressure, so the optical chip 20 is not damaged. Preferably, as shown in FIG. 3F, in the above step 4, a post cure process is further performed, and after the thermosetting adhesive film 40 flows, the heating is maintained until the thermosetting adhesive film 40 is fixed. At this time, The thermosetting adhesive film 40 has undergone a partially cured cross-linking reaction to facilitate the release of the mold 110.

IMB Page 13 M244691 V. Creative Instructions (9) Finally, referring to Figure 3G, perform step 5 of "Installing a lens mount on the thermosetting film", which is a lens mount 50 mounted on the film The second surface 12 of the base plate 10 is connected to the thermosetting adhesive film 40 to form a closed space to seal the active surface 21 of the optical chip 20, wherein the light transmitting channel 51 of the lens holder 50 and the The filter and light sheet 53 are corresponding to the light actuating area 24 of the optical chip 20 for capturing optical image signals. Therefore, the ultra-thin photographic module created according to this book uses "a thermosetting film 40 to cover the back surface 22 and the side surface 23 of the optical chip 20, and ^ should be combined on the other surface of the film substrate 10. There is a lens base 50 ″, so that the thermosetting film 40 can be used as an ultra-thin base that seals the optical chip 20 and is combined with the base 50, instead of the conventional fixing plate and the lens fixing base. The chip seals the gel to achieve the ultra-thin design of the camera module. Therefore, the scope of protection of this creation shall be determined by the scope of the attached patent application. Any changes and modifications made by those skilled in the art without departing from the spirit and scope of this creation shall belong to this creation. Protection range

Page 14 M244691

Brief Description of the Drawings [Simplified Illustration of the Drawings] Figure 1: A specific embodiment of an ultra-thin photographic module according to one embodiment of the present invention; Figure 2: An embodiment of the ultra-thin photography module according to the present invention. Flow chart of manufacturing a thin photographic module; and FIGS. 3A to 3G: a schematic cross-sectional view of a thin film substrate during the manufacturing process of the ultra-thin photographic module according to a specific embodiment of the present invention. [Representative Symbols of Components] 1 Provide a thin film substrate 2 Bond an optical wafer 3 Provide a thermosetting film 4 Thermocompression bonding the thermosetting film 5 Install a lens holder on the thermosetting film 10 Thin film substrate 11 First-Surface 12 13 Window D 14 Connection end 15 16 Leading finger 20 Optical chip 21 Active surface 22 23 Side 24 Light actuating area 25 30 Filled gel 40 Thermosetting film 50 Lens base nSL 51 Light transmission channel C 〇53 Filter 60 Lens 70 Surface bonding element 61 110 Mold 111 Flat pressing surface Second surface extension portion Back surface bump bonding portion lens

Claims (1)

M244691 VI. Scope of patent application [Scope of patent application] 1. A photographic module includes: a thin film substrate with a first surface, a second surface, and at least a window, wherein the periphery of the window is A plurality of connecting ends are formed; an optical chip is provided on the third surface of the thin film substrate corresponding to the window; the optical chip has an active surface, a corresponding back surface, and an active surface and a back surface; On the side, the active surface includes a light-acting region in the center and a plurality of bumps formed on the periphery of the light-acting region. The bumps are electrically connected to the connection end of the film substrate; a thermosetting adhesive. A film provided on the back of the optical chip, and the thermosetting film covering the side and the back of the optical chip; and a lens holder for combining a lens, the lens holder system being combined with the thermosetting film A closed space is formed to seal the active surface of the optical chip. The lens holder system has a light-transmitting channel, which acts on the light of the optical chip. , For capturing an optical image signal. 2. The photographic module according to item 1 of the scope of patent application, further comprising a filling gel to seal the bumps. 3. The photographic module according to item 2 of the scope of the patent application, wherein the filler system is selected from anisotropic conductive adhesive layer (anistropic conduct ive f 1 lm, ACF), non-conductive thermosetting Adhesive layer: Ckn-Conductive Film (NCF), liquid-coated thermosetting colloid and UV adhesive. 4, such as the scope of patent application!摄影 The camera module mentioned, & the film Page 16 JVL244byi Scope of patent application 5 base SiC extension part of this thermosetting film. The photographic module described in the fourth odor ... The extension part of the film substrate is formed with a guide finger. Seeking film i declares the photographic module described in item 4 of the scope of interest, which further includes a bonding element 'which is surface-bonded to the extension of the film substrate 0 7 = photographed in item 6 of the scope of the patent application In a module, the surface-attachment element is selected from one of an inductor, a resistor, a capacitor, and a semiconductor chip. ' 8. The photographic module according to item 1 of the scope of patent application, wherein the thermosetting film covers the first surface of the thin film substrate. 9. The photographic module according to item 1 of the scope of patent application, wherein the connection ends are provided on the first surface of the thin film substrate. 10. The photographic module according to item 1 of the scope of patent application, wherein the connection ends are provided on the second surface of the film substrate. 11. The photographic module according to item 1 of the scope of patent application, wherein the closed space is in a vacuum state. 1 2. The photographic module according to item 1 of the scope of patent application, wherein the closed space is filled with a passive gas. ---- page 17