TWI462191B - Pierced substrate on chip module structure - Google Patents

Description

Module structure for hollowing out the substrate on the wafer

The present invention relates to a semiconductor device structure, and more particularly to a module structure in which a lens holder and an image sensor are integrated to reduce the size of the device.

The rapid development of semiconductor technology, in the traditional flip-chip structure, the solder ball array is formed on the surface of the die, through the traditional solder paste by the solder ball mask to form the desired pattern. The package functions include heat dissipation, signal transmission, power distribution, protection, etc. When the chip is more complicated, the traditional package such as lead frame package, flexible package, rigid package, can not meet the needs of high-density small-size chips. Wafer-level packaging technology is an advanced packaging technology that is fabricated and tested by wafers on a wafer and then separated by cutting for assembly in a surface mount line. Because wafer-level packaging technology uses the entire wafer as a target rather than a single wafer or die, packaging and testing are done before the separation process. In addition, wafer level packaging is such an advanced technology that the procedures for wire bonding, die attach and underfill can be omitted. By using wafer-level packaging technology, cost and manufacturing time can be reduced and the final structure size of the wafer-level package can be equivalent to the die size, so the technology can meet the miniaturization requirements of electronic devices.

The flip chip technology currently used in the camera module uses a wire bonding device to perform a stud bump process on the entire wafer, and the solder ball is replaced by a wire bump.

Complementary MOS Half Field Effect Transistor (CMOS) by electronic packaging technology The image sensor chip is fabricated in a CMOS image sensor module. This module is used in a variety of electronic products, and the package specification requirements for CMOS image sensor modules depend on the characteristics of the product. In particular, the recent trend of CMOS image sensor modules, high-power capability, miniaturization, high density, low power consumption, multi-function, high-speed signal processing, and reliability are typical features of miniaturization of electronic products.

In contrast to general CMOS wafers, CMOS image sensors are feasible in the past physical environment and may be contaminated with impurities; when their size is not considered important, leadless wafer carrier LCC type packages can be used. However, in recent market trends, thinning and simplification characteristics are required, such as camera phones, smart phones, chip-on-board (COB), and chip-on-film (COF). Or wafer size packaging (CSP), etc., are also commonly used.

In the current flip chip package structure, although the height of the module structure can be reduced, the flip chip packaged machine equipment is too expensive and its mass production speed (Unit Per Hour) is too slow. Therefore, its investment requires huge funds, and the yield is low and difficult to control.

According to the above disadvantages of the prior art, the present invention proposes a novel module structure for hollowing out the substrate on the wafer, which does not require additional investment cost, and can obtain a better process yield.

In view of the above disadvantages, it is an object of the present invention to provide a module structure for a hollow substrate on a wafer having a small (thin) module structure height.

Another object of the present invention is to provide an integrated lens holder and image sensing The substrate module structure is hollowed out on the wafer to improve yield, reliability and reduce module size.

Still another object of the present invention is to provide a hollow substrate module structure on a wafer having good thermal performance, low cost, and simple process.

The present invention provides a module structure for a hollow substrate on a wafer, comprising: a first substrate; a wafer disposed on the first substrate, having a first contact pad and a sensing region; and a second substrate disposed on the substrate The first substrate and the wafer have a groove structure, a first perforation structure, a second perforation structure and a second contact pad, wherein the wafer is placed in the groove structure, and the first contact pad is electrically connected to the second through a bonding wire. a contact pad, the first contact pad is exposed to the first perforated structure, the sensing area is exposed to the second perforated structure; a transparent substrate is disposed on the second substrate and the wafer, approximately aligned with the sensing area; and a lens holder, The lens is disposed on the second substrate, and a lens is disposed above the lens holder approximately aligned with the transparent substrate and the sensing region.

The module structure further includes at least one passive component or active component disposed on the first substrate and/or the second substrate. The first substrate is attached to the second substrate through a conductive layer to electrically connect to each other. The material of the second substrate includes epoxy resin type FR5 or FR4, BT, printed circuit board, glass, tantalum or ceramic. In addition, the first substrate has a wire on a printed circuit board or a flexible printed circuit board. The wafer is attached to the first substrate through an adhesive layer. The lens holder is attached to the second substrate through an adhesive layer.

The invention will be described in conjunction with the embodiments and the accompanying drawings. Should be All of the embodiments of the present invention are for illustrative purposes only and are not intended to be limiting. Therefore, the invention may be applied to other embodiments in addition to the embodiments described herein. The invention is not limited to any embodiment, but should be determined by the scope of the appended claims and their equivalents.

The present invention provides a pierced substrate on chip module structure, which can be completed by a chip-on-board (COB) process. Direct wafer package is a way of integrating circuit package, which directly adheres the wafer to the circuit board or substrate, and can effectively transfer the package and test steps of the wafer to the circuit board after assembly.

The first figure shows a cross-sectional view of a flip chip package structure. As shown in the first figure, the flip chip package structure 100 includes a substrate 106, a wafer 105, a passive component 107, a lens holder 104, a lens 101, and a transparent substrate 102. The substrate 106 has a recess structure formed therein to receive the wafer 105 and the conductive layer 108. The wafer 105 and the conductive layer 108 are formed under the substrate 106, wherein the conductive layer 108 is electrically connected to the substrate 106 and the electrical contact pads on the wafer 105. The lens holder 104 includes a clamp portion 103 for fixing the lens 101. At least one passive component 107 can be formed (attached) to the substrate 106 within the lens holder 104. The lens 101 is formed at the uppermost portion of the lens holder 104. In addition, the transparent substrate 102 can be selectively disposed within the lens holder 104 and between the lens 101 and the wafer 105. Lens holder 104 can be attached to substrate 106 using an adhesive layer.

The second figure shows a cross-sectional view of a flip chip package structure of another example. As shown in the second figure, in this example, the flip chip package structure further includes a printed circuit. A board 109 having wires thereon for electrically connecting other electronic components, a conductive layer 110, and a heat dissipation layer 111. A heat dissipation layer 111 is disposed between the wafer 105 and the printed circuit board 109 to facilitate heat dissipation. The first substrate 106 is attached to the second substrate 109 through a conductive layer 110 to electrically connect to each other.

The third figure shows a cross-sectional view of the module structure of the integrated lens holder and the image sensor on the wafer in accordance with the present invention. As shown in the third figure, the module structure 200 on which the transparent substrate is mounted on the wafer integrates the lens holder and the image sensor to form a photosensitive module structure, which can be applied to a camera module of a mobile phone. The module structure 200 on which the transparent substrate is on the wafer includes a hollow substrate 209 and a substrate 211, a wafer 206, active or passive components 207 and 208, a lens holder 203, a lens 201, and a transparent substrate 202.

The wafer 206 can be attached to the substrate 211 through a conductive layer or a non-conductive adhesive layer. In an example, the active or passive component 208 is electrically coupled to the wires on the substrate 211. For example, the wafer 206 is an image sensor having an upper surface having a sensing region 206a and a contact pad 204d formed thereon; the active device 208 is a semiconductor integrated circuit (IC), and the passive component 208 includes a capacitor or Inductance; the substrate 211 is a printed circuit board or a flexible printed circuit board.

In one embodiment, the substrate 209 has a recessed structure formed therein to receive or house the wafer 206 and the active or passive component 208 is disposed within the recessed structure, having an open area with the perforated structure (open Areas 220a, 220b, 220c to facilitate sensing (active) regions 206a of wafer 206 and contact pads 204d may be exposed, as shown in the fifth figure. The location and number of apertures are merely illustrative and are not intended to limit the invention. The size of the substrate 209 is larger than the size of the wafer. For example, the above-mentioned perforated structure (opening regions 220a, 220b, 220c) may be formed in the substrate 209 by a process such as punching or drilling. The opening regions 220a, 220b, and 220c are approximately aligned with the sensing region 206a and the contact pad (I/O pad) 204d, respectively. Further, a contact pad 204c is formed on the substrate 209. Since the substrate 209 has a groove structure therein, there is more space for accommodating the electronic components to be disposed in the module structure.

The bonding wires 205 are electrically connected to the contact pads 204c on the substrate 209 and the contact pads 204d on the wafer 206. The contact pads 204c are formed on the wire bonding area 230 on the substrate 209. The transparent substrate 202 is formed over the substrate 209. An adhesive layer 204b is formed on the substrate 209, and the transparent substrate 202 is adhered to the substrate 209 by the adhesive layer 204b. The transparent substrate 202 is, for example, a substrate formed of a glass substrate or other transparent material, and is formed on the substrate 209 to cover the sensing region 206a. As a result, a gap (a recess) between the transparent substrate 202 and the sensing region 206a is generated. The transparent substrate 202 covers the sensing area 206a of the image sensing wafer 206, which can reduce particle contamination to improve the yield of the module structure. The transparent substrate 202 may be the same as or slightly larger than the area occupied by the sensing area 206a. Additionally, at least one passive component 207 can be selectively formed (attached) over the substrate 209 within the lens holder.

The transparent substrate (glass substrate) 202 may be in a circular or square shape. The transparent substrate (glass substrate) 202 can be selectively coated with an infrared coating for filtering, for example, an infrared filter for filtering through the lens 201 Light waves of a certain band.

The lens holder 203, which may be a simple plastic member or an actuator, is attached to the substrate 209 to complete the module structure 200 of the present invention. An adhesive layer 204 is formed on the substrate 209, and the bottom of the lens holder 203 is attached to the substrate 209 by the adhesive layer 204. The lens 201 is fixed to the lens holder 203 and passes through the lens holder 203 to support the lens 201. In addition, the lens holder 203 may also be fixed to the substrate 209 to support the lens 201. The lens 201 can be selectively disposed at the uppermost portion of the lens holder 203. In the module structure 200 of the present embodiment, the transparent substrate 202 can be selectively disposed within the lens holder 203 and between the lens 201 and the wafer 206. In other words, the lens 201 is approximately aligned with the transparent substrate 202 and the wafer 206. The wires on the substrate 209 are electrically connected to the wires on the substrate 211 through the conductive layer 210a. The conductive layer 210a may be formed as an adhesive layer on both sides of the substrate 209. In one embodiment of the invention, the material of the conductive layer 210a comprises a conductive paste or a conductive film through a printing, coating or other process to form a pattern of glue on the substrate. The conductive material layer 210a may be selectively coated on the substrate 211. The size of the substrate 211 is larger than the size of the substrate 209 such that the substrate 211 is extended beyond the substrate 209 after the two are adhered. The lens holder integrates the transparent substrate 202, the substrate 209, a portion of the substrate 211, and the image sensor 106 to form a cube module structure. Based on the substrate 211 extending beyond the cube module structure, the wires on the substrate structure 211 are transmitted through the wires on the substrate 211 to other components outside the structure.

As shown in the fourth figure, the module for hollowing out the substrate on the wafer of the present invention is shown Another embodiment of the structure. In the present embodiment, the substrate 209 is attached to the surface of the wafer 206. In the present embodiment, the substrate 209 and the surface of the wafer 206 are adhered to each other through the adhesive layer (glue) pattern 204e. At the same time, the wafer 206 is also formed (attached) on the substrate 211; that is, the substrate 209 and the wafer 206 are attached to the substrate 211 through the conductive layer 210. Other structures are similar to the third figure, and thus the detailed description is omitted.

In one embodiment of the present invention, the substrate 209 is a printed circuit board, and the material thereof may be an organic substrate, such as epoxy type FR5 or FR4 or BT (Bismaleimide Triazine) having a predetermined opening. Further, glass, ceramics, and tantalum may also be used as the material of the substrate 209.

The advantages of the invention include: having a small (thin) module structure height, having more space for accommodating components, utilizing the current easy and cheaper welding line process, good thermal efficiency, low cost and simple process, easy Make multi-chip packages.

The present invention has been described above by way of example, and is not intended to limit the scope of the invention. Modifications and similar configurations made within the spirit and scope of the invention are intended to be included within the scope of the appended claims.

100‧‧‧Flip chip package structure

101, 201‧ ‧ lens

102, 202‧‧‧ Transparent substrate

103‧‧‧Clamp section

104, 204‧‧‧ lens holder

105, 206‧‧‧ wafer

106, 211‧‧‧ substrate

107‧‧‧ Passive components

108‧‧‧ Conductive layer

109‧‧‧Printed circuit board

110, 210a‧‧‧ conductive layer

111‧‧‧heat layer

200‧‧‧Modular structure of hollow substrate on wafer

204, 204b‧‧‧ adhesive layer

204c, 204d‧‧‧ contact pads

204e‧‧‧Adhesive layer (glue) pattern

205‧‧‧welding line

206a‧‧‧Sensing area

207, 208‧‧‧ active or passive components

209‧‧‧ hollow substrate

210‧‧‧Adhesive layer (glue) pattern

220a, 220b, 220c‧‧‧open area

230‧‧‧ welding area

The first figure shows a schematic cross-sectional view of a flip chip package structure.

The second figure shows a schematic cross-sectional view of a flip chip package structure of another example.

The third figure shows a cross-sectional view of the module structure of the integrated lens holder and the image sensor on the wafer in accordance with the present invention.

The fourth figure shows a cross-sectional view of a module structure of a hollow substrate on a wafer integrated with a lens holder and an image sensor according to another embodiment of the present invention.

Fifth Figure is a top view of a substrate in accordance with an embodiment of the present invention.

200‧‧‧Modular structure of hollow substrate on wafer

201‧‧‧ lens

202‧‧‧Transparent substrate

203‧‧‧ lens holder

204, 204b‧‧‧ adhesive layer

204c, 204d‧‧‧ contact pads

205‧‧‧welding line

206‧‧‧ wafer

206a‧‧‧Sensing area

207, 208‧‧‧ active or passive components

209‧‧‧ hollow substrate

210‧‧‧Adhesive layer (glue) pattern

210a‧‧‧ Conductive layer

211‧‧‧Substrate

Claims (12)

A module structure for a hollow substrate on a wafer, comprising: a first substrate; a wafer disposed on the first substrate, having a first contact pad and a sensing region; and a second substrate disposed on the first substrate a substrate and the wafer have a groove structure, a first perforation structure, a second perforation structure and a second contact pad, wherein the wafer is placed in the groove structure, and the first contact pad is electrically connected through a bonding wire Connecting the second contact pad, the first contact pad is exposed to the first perforated structure, the sensing area is exposed to the second perforated structure; a passive component or an active component is disposed on the substrate; and a lens holder And disposed on the second substrate, a lens is located above the lens holder approximately aligned with the sensing region. The module structure of the substrate on the wafer of claim 1, wherein the first substrate is adhered to the second substrate through a conductive layer. The module structure of the substrate on the wafer of claim 1, wherein the first substrate is a printed circuit board or a flexible printed circuit board, and the second substrate is a printed circuit board, and the material of the second substrate comprises Epoxy type FR5 or FR4, BT (Bismaleimide Triazine), glass, tantalum or ceramic, wherein the printed circuit board or the flexible printed circuit board has its own wires thereon. The module structure of the substrate on the wafer of claim 1, wherein the wafer is attached to the first substrate through a conductive layer or a non-conductive adhesive layer. The module structure of the substrate on the wafer of claim 1, wherein the second substrate is adhered to the wafer through an adhesive layer. The module structure of the substrate on the wafer of claim 1, wherein the lens holder is attached to the second substrate through an adhesive layer. The module structure of the hollow substrate on the wafer of claim 1 further includes a transparent substrate disposed on the second substrate and the wafer, approximately aligned with the sensing region. The module structure of the substrate on the wafer of claim 7, wherein the first substrate is adhered to the second substrate through a conductive layer. The module structure of the substrate on the wafer of claim 7, wherein the first substrate is a printed circuit board or a flexible printed circuit board, the second substrate is a printed circuit board, and the material of the second substrate comprises Epoxy type FR5 or FR4, BT (Bismaleimide Triazine), glass, tantalum or ceramic, wherein the printed circuit board or the flexible printed circuit board has its own wires thereon. The module structure of the substrate on the wafer of claim 7, wherein the wafer is attached to the first substrate through a conductive layer or a non-conductive adhesive layer. The module structure of the substrate on the wafer of claim 7, wherein the second substrate is adhered to the wafer through an adhesive layer. The module structure of the substrate is hollowed out on the wafer of claim 7, wherein the lens holder is attached to the second substrate through an adhesive layer.