TWI462280B - Wafer level camera module structure - Google Patents

Description

Wafer level image module structure

The invention relates to a semiconductor component module structure, in particular to a wafer level image module structure which integrates active and passive components, a lens holder and an image sensor to reduce component size.

The rapid development of semiconductor technology, in the traditional flip-chip structure, the solder ball array is formed on the surface of the die, through the traditional solder paste by the solder ball mask to form the desired pattern. The package functions include heat dissipation, signal transmission, power distribution, protection, etc. When the chip is more complicated, the traditional package such as lead frame package, flexible package, rigid package, can not meet the needs of high-density small-size chips. Wafer-level packaging technology is an advanced packaging technology that is fabricated and tested by wafers on a wafer and then separated by cutting for assembly in a surface mount line. Because wafer-level packaging technology uses the entire wafer as a target rather than a single wafer or die, packaging and testing are done before the separation process. In addition, wafer level packaging is such an advanced technology that the procedures for wire bonding, die attach and underfill can be omitted. By using wafer-level packaging technology, cost and manufacturing time can be reduced and the final structure size of the wafer-level package can be equivalent to the die size, so the technology can meet the miniaturization requirements of electronic devices.

In addition, a complementary MOS field-effect transistor (CMOS) image sensor chip is fabricated in a CMOS image sensor module by electronic packaging technology. This module is used in a variety of electronic products, and the package specification requirements for CMOS image sensor modules depend on the characteristics of the product. especially It is the trend of recent CMOS image sensor modules, high-power capability, miniaturization, high density, low power consumption, multi-function, high-speed signal processing, and reliability, etc., which are typical features of miniaturization of electronic products.

In the current wafer-level package structure, although the height of the module structure can be reduced, but the main and passive components cannot be included in the module structure, the active and passive components need to be placed outside the module. Therefore, it is not possible to reduce the size of the module structure in the X/Y direction.

According to the above disadvantages of the prior art, the present invention proposes a novel wafer level image module structure.

In view of the above disadvantages, it is an object of the present invention to provide a wafer level image module structure having a smaller module structure.

It is still another object of the present invention to provide a novel wafer level image module structure that integrates both active and passive components in the same module structure.

The present invention provides a wafer level image module structure comprising: a wafer having a sensing region, a twinned perforated structure formed to penetrate the upper surface to the lower surface of the wafer; and a transparent substrate disposed on the wafer Having at least one conductive via structure formed therein and a wire and at least one electronic component formed thereon, the wire electrically connecting the conductive via structure and the at least one electronic component, the conductive via structure being approximately aligned with the twinned via structure; A lens holder is disposed on the transparent substrate, and a lens is positioned above the lens holder, wherein the lens is approximately aligned with the transparent substrate and the sensing region.

The lens frame is attached to the transparent substrate through an adhesive layer.

In another example, the module structure further includes a conductive layer coupled a conductive perforated structure and a twinned perforated structure; a solder ball formed over the lower surface of the twinned perforated structure.

At least one of the electronic components includes at least one active component or at least one passive component.

The invention will be described in conjunction with the embodiments and the accompanying drawings. It is to be understood that all of the embodiments of the invention are illustrative and not intended to be limiting. Therefore, the invention may be applied to other embodiments in addition to the embodiments described herein. The invention is not limited to any embodiment, but should be determined by the scope of the appended claims and their equivalents.

The first figure shows a cross-sectional view of the image module structure of the integrated lens holder and the image sensor. As shown in the first figure, the image module structure 100 integrates the lens holder and the image sensor to form a photosensitive module structure, which can be applied to a camera module of a mobile phone or other portable electronic components. The image module structure 100 includes a wafer 106, a lens holder 103, a lens 101, and a transparent substrate 102. The transparent substrate 102 is located in the inner or intermediate layer of the module structure, and the wafer 106 is located at the bottom of the module structure.

The manufacturing process of the above module structure 100 is as follows. First, the transparent substrate 102 is directly attached to the wafer 106. In this step, an adhesive layer 105 may be formed on the wafer 106, and then the transparent substrate 102 is attached to the wafer 106 by the adhesive layer 105. In one example, the size of the transparent substrate 102 is approximately equal to or greater than the size of the wafer 106. In one embodiment of the invention, the adhesive layer 105 is passed through a printing or coating process to form an adhesive layer pattern over the wafer 106. Wafer 106 is a sense The test wafer has a sense (active) region 106a and the contact pads 105 can be exposed. A solder ball 107 is formed under the wafer 106 to facilitate electrically connecting the wafer 106 of the module structure 100 to external components.

The transparent substrate 102 is, for example, a substrate formed of a glass substrate or other transparent material, and is disposed on the wafer.

Then, a lens holder attaching process is performed, and the lens holder 103 is attached to the transparent substrate 102 to form the module structure 100. In this step, an adhesive layer 104 may be formed on the transparent substrate 102, and then the lower half of the lens holder 103 is attached to the transparent substrate 102 by the adhesive layer 104.

The lens 101 is fixed in the lens holder 103. In addition, the lens holder 103 can also be fixed to the transparent substrate 102. The lens 101 can be selectively disposed at the uppermost portion of the lens holder. In the module structure 100 of the present embodiment, the lens holder 103 has a groove structure or an accommodating space therein so that the transparent substrate 102 can be selectively disposed therein and between the lens 101 and the wafer 106. In other words, the lens 101 is approximately aligned with the transparent substrate 102 and the wafer 106 such that light can be incident directly onto the sensing region 106a of the wafer 106.

After forming the module structure 100, alignment measurements between the lens 101, the transparent substrate 102 and the sensing region of the wafer 106, and the electrical sensing of the image sensing wafer 106 can be performed.

As shown in the second figure, an embodiment of the wafer level image module structure of the present invention is shown. In this embodiment, the wafer level image module structure 200 can be applied to a camera module of a mobile phone or other portable electronic component. Wafer The stage image module structure 200 includes a wafer 206, a transparent substrate 202, a lens holder 203, a lens 201, and an electronic component 205. The transparent substrate 202 is located in the inner or intermediate layer of the module structure, and the wafer 206 is located at the bottom of the module structure. Additionally, electronic component 205 is positioned over transparent substrate 202 in a position that avoids the light path of lens 201 to avoid blocking light from traveling to sensing region 206a of wafer 206.

The wafer 206 includes, for example, image sensor dies formed on a ruthenium wafer having a first punctured structure on both sides that penetrates the upper surface to the lower surface of the wafer 206. The perforated structure is filled with a conductive material to form a through silicon via (TSV) structure 210. The germanium via structure 210 may be preformed within the germanium wafer (wafer 206).

The wafer 206 has a contact pad that is electrically connected to the perforated structure 210 through a trace. A conductive layer (metal) 209 may be coated over the tantalum perforated structure 210 as an electrical connection layer. A solder ball 211 is formed under the crucible perforation structure 210 to facilitate the electrical connection of the wafer 206 and the electronic component 205 of the module structure 200 to the external component.

The transparent substrate 202 has a second perforated structure on both sides thereof. The perforated structure is filled with a conductive material to form a conductive via structure 208. The conductive via structure 208 is electrically connected to the conductive layer 209. The conductive layer 209 is electrically connected to the conductive via structure 208 in the transparent substrate 202, and the germanium via structure 210 in the wafer 206. In other words, the conductive via structure 208 is electrically connected to the via structure 210 through the conductive layer 209. The electrically conductive perforated structure 208 is approximately aligned with the perforated perforated structure 210. In addition, a trace 207 is formed on the transparent substrate 202 and the conductive via structure 208, and is electrically The conductive via structure 208 is connected. The electronic component 205 is disposed on the wire 207 and electrically connected to the wire 207. For example, electronic component 205 is an active component (eg, an integrated circuit (IC)) or a passive component (eg, a capacitor or inductor). Based on the perforated structure in the transparent substrate 202, the electronic component 205 can be integrated over the transparent substrate 202 to form part of the module structure. That is, the present invention can integrate a plurality of electronic components into the module structure without requiring additional component placement space. Through the conductive via structure 208 and the via structure 210, the sensing chip 206 in the module structure 200 and the electrical signals on the electronic component 205 can be transmitted to the outside via the solder ball 211.

The manufacturing process of the above module structure 200 is as follows. First, a wafer 206 is prepared which may be pre-formed with a perforated structure 210 (both sides). The formation of the perforated structure 210 can be referred to the above or other methods. For example, the wafer 206 is an image sensor (eg, a CMOS image sensing wafer) having an upper surface having a sensing region 206a and a contact pad (not shown) formed thereon. Then, a conductive layer 209 is formed over the meandering structure 210.

Thereafter, a transparent substrate 202 stacking process is performed, for example, directly on the wafer 206. The transparent substrate 202 may be formed in advance with a conductive via structure 208 (on both sides) or after the transparent substrate 202 is disposed on the wafer 206. In this step, the perforated structure or conductive via structure 208 is aligned with the conductive layer 209. Then, a wire 207 is formed on the transparent substrate 202 and the conductive via structure 208 to electrically connect the conductive via structure 208. Next, the electronic component 205 is disposed on the conductive via structure 208 on the transparent substrate 202 and electrically connected to the conductive via structure 208. The vertical position of the electronic component 205 configuration does not overlap the lens 201 and the sensing area 206a to avoid blocking light incident on the lens 201.

Finally, the lens holder 203, which may be a simple plastic member or an actuator, is attached to the transparent substrate 202 to complete the module structure 200 of the present invention. In this step, an adhesive layer 204 may be formed on the transparent substrate 202, and then the bottom of the lens holder 203 is attached to the transparent substrate 202 by the adhesive layer 204. The lens 201 is fixed to the lens holder 203 and passes through the lens holder 203 to support the lens 201. In addition, the lens holder 203 may also be fixed on the transparent substrate 202 to support the lens 201. The lens 201 can be selectively disposed at the uppermost portion of the lens holder 203. In the module structure 200 of the present embodiment, the transparent substrate 202 can be selectively disposed within the lens holder 203 and between the lens 201 and the wafer 206. In other words, the lens 201 is approximately aligned with the transparent substrate 202 and the wafer 206 such that light can directly reach the sensing region 206a.

In the present invention, the structure of the image module can be achieved without an additional substrate.

The advantages of the present invention include: the integration of active and passive components in the module structure, without the need for additional space for placing the active and passive components.

The present invention has been described above by way of example, and is not intended to limit the scope of the invention. Modifications and similar configurations made within the spirit and scope of the invention are intended to be included within the scope of the appended claims.

100‧‧‧Image module structure

101, 201‧ ‧ lens

102, 202‧‧‧ Transparent substrate

103, 203‧‧‧ lens holder

104, 105‧‧‧ adhesive layer

106, 206‧‧‧ wafer

107, 211‧‧‧ solder balls

200‧‧‧ Wafer-level image module structure

204‧‧‧Adhesive layer

205‧‧‧Electronic components

206a‧‧‧Sensing area

207‧‧‧ wire

208‧‧‧conductive perforated structure

209‧‧‧ Conductive layer

210‧‧‧矽perforated structure

The first figure shows a schematic cross-sectional view of the image module structure of the integrated lens holder and the image sensor.

The second figure shows a cross-sectional view of a wafer level image module structure in accordance with an embodiment of the present invention.

200‧‧‧ Wafer-level image module structure

201‧‧‧ lens

202‧‧‧Transparent substrate

203‧‧‧ lens holder

204‧‧‧Adhesive layer

205‧‧‧Electronic components

206‧‧‧ wafer

206a‧‧‧Sensing area

207‧‧‧ wire

208‧‧‧conductive perforated structure

209‧‧‧ Conductive layer

210‧‧‧矽perforated structure

211‧‧‧ solder ball

Claims (10)

A wafer level image module structure includes: a wafer having a sensing region and a first perforated structure formed to penetrate from an upper surface to a lower surface of the wafer, the first perforated structure being filled with the first conductive material a transparent substrate disposed on the wafer, the transparent substrate having a second perforated structure formed therein and a wire and at least one electronic component formed thereon, the second perforated structure being filled with a second conductive material, the wire Electrically connecting the second conductive material and the at least one electronic component, the second through-hole structure is approximately aligned with the first through-hole structure; and a lens holder disposed on the transparent substrate, a lens being above the lens holder Wherein the lens is approximately aligned with the transparent substrate and the sensing region. The wafer level image module structure of claim 1, wherein the lens frame is attached to the transparent substrate through an adhesive layer. The wafer level image module structure of claim 1 further includes a conductive layer coupled to the second through structure and the first through structure. The wafer level image module structure of claim 1 further comprising a solder ball formed on a lower surface of the first via structure. The wafer level image module structure of claim 1 wherein the at least one The electronic component includes at least one active component or at least one passive component. The wafer level image module structure of claim 5, wherein the at least one active component comprises at least one integrated circuit. The wafer level image module structure of claim 5, wherein the at least one passive component comprises at least one capacitor or at least one inductor. The wafer level image module structure of claim 1, wherein the wafer is an image sensing wafer. The wafer level image module structure of claim 1, wherein the contact pads of the chip are electrically connected to a second wire, and the second wire is electrically connected to the first through structure. The wafer level image module structure of claim 1, wherein the lens holder is a plastic member or a driving mechanism.