200846739 • 九、發明說明： • 【發明所屬之技術領域】 本發明涉及一種相機模組，尤其涉及一種體積小且便 於基板佈線之相機模組及其組裝方法。 【先前技術】 隨著數位相機，手提電話及其它可照相或攝像之電子 産品越來越受到消費者之喜愛，這些産品正在漸漸之改變 Φ 著人們之生活。與此同時，人們對電子産品之要求亦越來 越高，於滿足功能強大之同時，還要求外型美觀，便於攜 帶。廠家爲了滿足消費者之需要，製作出之電子産品曰趨 小型化。但由於狹小之内部空間，限制了相機模組内部元 件選擇之靈活性並給其製作精度帶來了更高之要求。 請參閱圖1，爲現有之一種相機模組1之半剖視圖， 圖2爲所述相機模組1之立體分解圖。該相機模組1其包 括一鏡筒2、一鏡座3、一影像感測晶片5及一基板6。所 B 述鏡筒2之表面設有外螺紋7，於所述鏡座3之内壁設有 内螺紋8，所述鏡筒2藉由外螺紋7與内螺紋8套設於所 述鏡座3，即所述鏡筒2之外螺紋7舆所述鏡座3之内螺 紋8相嚙合。所述鏡座3有一貫穿之容室，所述鏡座3容 室内固疋玻璃片4。所述影像感測晶片5粘接於所述基 板6頂面，其感測區背對所述基板6。所述鏡座3與所述 基板6相枯接，並使所述影像感測晶片5收容於所述鏡座 3之所述容室中。所述鏡座3、所述玻璃片4及所述基板6 6 200846739 構成對所述影像感測晶片5之無塵密閉封裝。 所述相機模組l，於έ 士 .# ^ 、、、且衣到基板6上時，直接將鏡座 3枯接到基板6上，如此 .^ ± 此，不僅影像感測晶片5會佔用基 扳6表面之空間，而且并 ^ 向且鏡座3亦會額外佔用基板6之表面 工間。如此將增大相機桓 丄7 X U 〜且丄中基板6之表面積，從而加 大了相機模組1之體積。 ^ 、门4，基板6之表面佈滿了導線 刀二間以粘接鏡座3，導線及被 動兀件之空間密度進一并^ i ^ * 4- JL V 17大，將使基板6表面之佈線複 ‘度增大，於生産加工時 了而要非卷问之精度，這會導致生 產良率較低，而生產費用升高。 【發明内容】 有鑒·於此，有必要担Μ _ _ ^ a ^ ^ ^ 蚨供一種體積小且便於基板佈線之 相機杈組及其組裝方法。 一 ^目機n其包括··—鏡頭模組、—影像感測晶 正三2板及—賴層。所述鏡賴組與影像感測晶片對 H。、、所述基板有—承載面用於承載所述影像感測晶 斤述膠體層β又置於所述基板與鏡頭模組之間。所述基 板承載面對應於所述鏡頭模組底部設有至少二凸塊，所述 ’兄頭模組藉由所述基板承載面上之至少二凸塊支撐並藉由 所述膠體層粘著於基板上。 種相機模組之組裝方法，其包括以下步驟： 提供一基板，其具有一承載面，所述承載面對應於鏡 頭模組底部設有至少二凸塊； 將一影像感測晶片固設於所述基板之承載面上； 7 200846739 於所述基板承載面塗布膠體，形成一膠體層； 將一待組裝之鏡頭模組與影像感測晶片對i設置，炎 由所述至少二凸塊支撐及藉由所述膠體層粘著於美板上。 、、相對於先前技術，所述相機模組中之鏡頭模^藉由所 述基板Κ載面上之至凸塊支撐並藉由膠體層枯著於基 板上’因此將鏡頭模組組裝到基板上時，只需㈣較少基 =承載面©積因此可減小基板表面積，從而，降低相機 权=之體積。於不減小基板表面積之情況下可增加了基板 承載面之可則面積，擴大了基板表面之佈線空間，降低 了基板表面之導線及被動元件之空間密度 線同時降低_成本。 ⑽打、.泉执打 【實施方式】 ^將結合_對本發明作進―步之詳細說明。 勹Ll閱圖3與圖4 ’本發明第一實施例之相機模200846739 • IX. Description of the Invention: • Technical Field of the Invention The present invention relates to a camera module, and more particularly to a camera module that is small in size and convenient for substrate wiring and a method of assembling the same. [Prior Art] With digital cameras, mobile phones and other electronic products that can be photographed or photographed are increasingly popular with consumers, these products are gradually changing Φ people's lives. At the same time, people's requirements for electronic products are getting higher and higher. While satisfying the powerful functions, they also require beautiful appearance and easy carrying. In order to meet the needs of consumers, manufacturers have become more and more compact. However, due to the small internal space, the flexibility of the internal selection of the camera module is limited and the precision of the production is brought to a higher level. Please refer to FIG. 1 , which is a half cross-sectional view of a conventional camera module 1 , and FIG. 2 is an exploded perspective view of the camera module 1 . The camera module 1 includes a lens barrel 2, a lens holder 3, an image sensing wafer 5, and a substrate 6. The surface of the lens barrel 2 is provided with an external thread 7 . The inner wall of the lens holder 3 is provided with an internal thread 8 . The lens barrel 2 is sleeved on the lens holder 3 by an external thread 7 and an internal thread 8 . That is, the external thread 7 of the lens barrel 2 is engaged with the internal thread 8 of the lens holder 3. The lens holder 3 has a chamber through which the glass sheet 4 is fixed. The image sensing wafer 5 is bonded to the top surface of the substrate 6 with its sensing area facing away from the substrate 6. The lens holder 3 is in contact with the substrate 6, and the image sensing wafer 5 is received in the chamber of the lens holder 3. The lens holder 3, the glass sheet 4 and the substrate 6 6 200846739 constitute a dust-tight sealed package of the image sensing wafer 5. The camera module 1 directly detaches the lens holder 3 to the substrate 6 when the clothing is applied to the substrate 6, so that not only the image sensing chip 5 is occupied. The space of the surface of the base plate 6 and the mirror base 3 also occupy the surface of the substrate 6 additionally. This will increase the surface area of the camera 桓 7 X U 〜 丄 and the substrate 6, thereby increasing the size of the camera module 1. ^, door 4, the surface of the substrate 6 is covered with two wire cutters to bond the lens holder 3, and the spatial density of the wire and the passive element is further increased by ^ i ^ * 4- JL V 17 to make the surface of the substrate 6 The wiring re-degree is increased, and the accuracy of non-volume is required during production and processing, which results in lower production yield and higher production cost. SUMMARY OF THE INVENTION In view of this, it is necessary to carry out _ _ ^ a ^ ^ ^ 蚨 for a small size and easy to substrate wiring camera set and its assembly method. A camera machine includes a lens module, an image sensing crystal, a positive two-two board, and a laminating layer. The mirror group and the image sensing wafer pair H. The substrate has a bearing surface for carrying the image sensing crystal colloid layer β and placed between the substrate and the lens module. The substrate carrying surface is provided with at least two bumps corresponding to the bottom of the lens module, and the 'mild head module is supported by at least two bumps on the substrate carrying surface and adhered by the colloid layer On the substrate. The method for assembling a camera module includes the following steps: providing a substrate having a bearing surface, wherein the bearing surface is provided with at least two bumps corresponding to the bottom of the lens module; and fixing an image sensing chip to the substrate The substrate is coated on the substrate; 7 200846739 is coated with a colloid on the substrate carrying surface to form a colloid layer; a lens module to be assembled and an image sensing wafer pair i are disposed, and the inflammation is supported by the at least two bumps and The gel layer is adhered to the beauty plate. Compared with the prior art, the lens module in the camera module is supported by the bump on the substrate carrying surface and is adhered to the substrate by the colloid layer. Therefore, the lens module is assembled to the substrate. In the upper case, only (4) less base = bearing surface is accumulated, so that the surface area of the substrate can be reduced, thereby reducing the volume of the camera weight. By reducing the surface area of the substrate, the area of the substrate carrying surface can be increased, the wiring space on the surface of the substrate is enlarged, and the space density of the wires on the surface of the substrate and the passive components are reduced. (10) Playing, .quanting [Embodiment] ^ The details of the invention will be described in conjunction with _.勹Ll read FIG. 3 and FIG. 4' camera model of the first embodiment of the present invention
組 匕 基板60、一影像感測晶片5〇、一鏡頭模组 10、一膠體層40。 所述基板60用於承載影像感測晶片50。本實施例中， 所遠鏡頭模組1Q底部爲四邊框形結構，所述基板60之承 載面602對應於鏡頭模組底部設有等高之棱柱形之四凸塊 601。名四凸塊6〇1至少有一凸塊601與其他凸塊601設置 於不同線上。優選地，所述四凸塊601分別設於基板60 之四拐角處。該四凸塊601之高度與所述影像感測晶片5Ό 之厚度相§，其與基板60採用相同材料做成，並爲一體結 構。所述四凸塊6〇1亦可藉由粘接方式粘著於所述基板60 8 200846739 之承載面602上。實際應用中，鏡頭模組1〇底部，即鏡座 14底部爲圓形結構時，所述凸塊6〇1相應地做成圓弧形凸 塊’所述凸塊601之形狀隨鏡頭模組1〇底部被支撐部分之 結構形狀變化而相應變化，並不限於本實施例。 所述影像感測晶片50可爲CCD ( Charge Coupled Device，龟何耦合元件感測态）或cmos ( Complementary Metal Oxide Semiconductor，互補性金屬氧化物感測器）。所 述影像感測晶片50既可以粘接至所述基板6〇承載面6〇2 並藉由導線與基板60電性連接，亦可以使用覆晶形式、内 引腳貼合、自動載帶貼合、倒貼封裝或熱壓合連接方式使 影像感測晶片結構性及電性連接於基板6〇。所述影像感測 晶片50用以將鏡頭模組10攝取到之光信號變成電信號。 所述鏡頭模組1〇包括透鏡組16、一鏡筒12及—鏡座 14。所述透鏡組16固設於所述鏡筒14内。所述鏡筒12 外侧成有外螺紋U，所述鏡座14内侧設有内螺紋2^，所 述鏡筒12藉由外螺紋η與内螺紋22旋入至鏡座 定或調焦。 所述膠體層40設於所述鏡座14與所述基板6〇之間。 本實施例中，該膠體層40沿著影像感測晶片5〇之週邊曰設 置並環繞所述影像感測晶片50。實際應用中，所述膠 40亦可只環繞所述影像感測晶片5〇而與所述影像咸測晶 片50周側相間隔。所述膠體層40之高度與影像感測晶= 5〇之高度相當。所述膠體層40可起到保護所述基板、:承 載面602上之被動元件6〇4之作用。本實施例中，所述膠 9 200846739 •體層40爲熱固膠。所述鏡頭模組ίο藉由所述基板60之承 •載面6〇2之四凸塊601支撐並藉由膠體層4〇直接粘著於基 板60上。 、土 本實施例中，所述相機模組100還包括一透光元件 30，所述透光元件30爲一紅外濾光片，所述透光元件3〇 固設於所述鏡座14之内壁，其位元於所述影像感測晶片 50與所述鏡筒12之間，用於保護所述影像感測晶片邓之 感測區，並對光線進行過濾。實際應用中，該透光元件如 _亦可爲玻埚或其他透光材料，其直接粘接於所述鏡座14 底部。並不限於本實施例。 請參閱圖5,爲本發明第一實施例提供之相機模組 組裝之流程圖，其包括以下步驟： 步驟300 :提供一基板6〇，其具有一承载面6〇2，所 述承載面602對應於鏡頭模組1〇底部設有四凸塊6〇1。 所述基板60用於承載影像感測晶片5〇。本實施例中， _ 所述鏡頭模組10底部爲四邊框形結構，所述基板6〇之承 載面對應於所述鏡頭模組10底部分別設有等高之棱柱形 之四凸塊601。該四凸塊601至少有一凸塊6〇1與其他凸 塊601設置於不同線上。優選地，所述四凸塊6〇1分別設 於所述基板60之四拐角處。該四凸塊6〇1之高度與所述影 像感測晶片50之厚度相當，其與基板6〇採用相同材料做 成，並爲一體結構。所述四凸塊601亦可藉由粘接方式粘 著於所述基板60之承載面602上。實際應用中，鏡頭模組 1〇底部，即鏡座14之底部爲圓形結構時，所述凸塊 200846739 .相應地做成圓弧形凸塊，所述凸塊601之形狀隨鏡頭模組 ，10底部被支撐部分之結構形狀變化而相應變化，並不限於 本實施例。 步驟400 :將一影像感測晶片5〇固設於所述基板6〇 之承載面602上。 於所述基板60承載面602上環繞所述影像感測晶片 50之表面區域，利用表面貼裝技術貼裝被動元件6〇4。運 鲁用打線機將所述影像感測晶片50與所述基板60藉由導線 %性連接’亦可以使用覆晶形式、内引腳貼合、自動載帶 貼合、倒貼封裝或熱壓合連接方式使影像感測晶片結構性 及電性連接於基板60。 步驟500 :於所述基板60承載面602塗布膠體，形成 一膠體層40。 本實施例中，所述膠體層40沿著影像感測晶片5〇之 週邊設置並環繞所述影像感測晶片50。實際應用中，所述 φ 膠體層40亦可只環繞所述影像感測晶片50而與所述影像 感捌晶片50周侧相間隔。同時所述膠體層40包覆所述基 板60之被動元件604以及導線。起到保護所述影像感測晶 片5〇與所述被動元件604以及所述導線之作用，還可固定 所述被動元件604以及所述導線之相對位置。本實施例中 所述膠體層40爲熱固膠。 步驟600:將一待組裝之鏡頭模組10與影像感測晶片 對正設置，並由所述四凸塊601支樓並藉由所述膠體層 粘著於基板60上。 11 200846739 所述鏡頭模組10包括一透鏡組16、一鏡筒12及一鏡 座 所述透鏡組16固設於所述鏡筒12内。所述鏡筒12 卜側"又有外螺紋11，所述鏡座14内侧設有内螺紋22，所 ，鏡同12藉由外螺紋u與内螺紋22旋入至鏡座14内固 疋或调焦。所述相機模組100還包括一透光元件30，所述 I光元件3〇爲一紅外濾光片，所述遂光元件3〇固設於所 w兄座14之内壁，其位元於所述影像感測晶片50與述鏡 同12之p q 心間，用於保護所述影像感測晶片50之感測區，並 對光線進行過濾。所述鏡座14、膠體層40與透光元件30 ^成對所述影像感測晶片50之無塵密封封裝。 5月參閱圖6，本發明之第二實施例之相機模組200包 括〜基板160、一影像感測晶片15〇、一鏡頭模組1〇、一 膠體層140。 所述相機模組200與本發明第一實施例之相機模組 結構基本相同，其差異主要在於：所述基板160承載 面M2對應於鏡頭模組1〇底部對稱地設有二凸塊161，所 述二凸塊161與所述基板160採用相同之材料做成，所述 二凸塊161爲兩等高之長方體，其長度不大於所述基板16〇 之邊長，其長度需保證所述鏡頭模組10可以藉由所述二凸 塊161平穩之枯接至所述基板160之承載面162爲准。 所述膠體層140設置於所述鏡頭模組1〇與所述基板 16〇之間，本實施例中，該膠體層140沿著影像感測晶片 150之週邊設置並環繞所述影像感測晶片15〇。實際應用 中，所述膠體層140亦可只環繞所述影像感測晶片15〇而 12 200846739 . 與所述影像感測晶片150周侧相間隔。同時所述膠體層140 包覆所述基板160之被動元件164以及導線。所述鏡頭模 組10藉由所述基板160之承載面162之二凸塊161支撐並 藉由膠體層140直接粘著於基板160上。 本實施例中，所述相機模組100還包括一透光元件 130，所述透光元件130爲一紅外濾光片，所述透光元件 130固設於所述鏡座14之内壁上，其設置於所述影像感測 晶片15 0與述鏡简12之間’用於保護所述影像感測晶片 ⑩ 150之感測區，並對光線進行過濾。實際應用中，該透光 元件130亦可爲玻璃或其他透光材料，其直接粘接於所述 鏡座14底部。並不限於本實施例。 本實施例中’所述鏡頭模組底部爲四邊框形結構， 所述基板160承載面162對應於所述鏡頭模組10底部對稱 地設有二凸塊161 ’所述二凸塊161與所述基板160採用 一體成型結構做成’所述二凸塊161爲兩等兩之長方體。 實際應用中，戶斤述基板丄的承載面162對應於所述鏡頭模 組10底部設有三或四凸塊161，此時，至少有一凸塊161 及其他凸塊161不在同一線上。鏡頭模組10底部，即鏡座 14之底部爲圓形結構時’所述凸塊161相應地做成圓弧形 凸塊，所述凸塊161之形狀隨鏡頭模組10底部被支撐部分 之結構形狀變化而相應變化。所述凸塊161與基板托0可 採用一體成型結構做成，亦可以爲分開之不同元件，所述 凸塊161藉由粘接或其他方式固定於所述基板之承載 面162上。並不限於本實施例。 13 200846739 ι 相對於先前技術，所述相機模組中之鏡頭模組藉由所 述基板承載面上之至少二凸塊支撐並藉由膠體層粘著於基 板上，因此將鏡頭模組組裝到基板上時，只需佔用較少基 板承載面面積。因此可減小基板表面積，從而，降低相機 模組之體積。於不減小基板表面積之情況下可增加了基板 承載面之可利用面積，擴大了基板表面之佈線空間，降低 了基板表面之導線及被動元件之空間密度，便於打線機打 線同時降低組裝成本。 • 綜上所述，本發明符合發明專利要件，爰依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施 方式，本發明之範圍並不以上述實施方式為限，舉凡 熟習本案技藝之人士援依本發明之精神所作之等效 修飾或變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係先前之一種相機模組半剖視圖； 0 圖2係圖1之相機模組之立體分解圖； 圖3係本發明第一實施例提供之相機模組之半剖視 圖； 圖4係本發明第一實施例提供之相機模組之立體分解 圖， 圖5係本發明第一實施例之相機模組之組裝流程圖； 圖6係本發明第二實施例提供之相機模組之立體分解 圖。 14 200846739 . 【主要元件符號說明】 相機模組 1、100、200鏡頭模組 10 鏡筒 2、12 鏡座 3、14 透鏡組 16 透光元件 4、30、130 影像感测晶片 5、50、150膠體層 40 、 140 基板 6、60、160夕卜螺紋 7、11 内螺紋 8、22 凸塊 161 、 601 基板承載面 162、602 被動元件 164 、 604The substrate 60, an image sensing wafer 5, a lens module 10, and a colloid layer 40 are disposed. The substrate 60 is used to carry the image sensing wafer 50. In this embodiment, the bottom of the distal lens module 1Q has a four-frame structure, and the bearing surface 602 of the substrate 60 corresponds to a four-bump 601 having a prismatic shape of the same height at the bottom of the lens module. The four bumps 6〇1 have at least one bump 601 and other bumps 601 disposed on different lines. Preferably, the four bumps 601 are respectively disposed at four corners of the substrate 60. The height of the four bumps 601 is the same as the thickness of the image sensing wafer 5, and is made of the same material as the substrate 60, and has an integrated structure. The four bumps 6〇1 may also be adhered to the bearing surface 602 of the substrate 60 8 200846739 by bonding. In practical applications, when the bottom of the lens module 1 is a bottom, that is, when the bottom of the lens holder 14 has a circular structure, the protrusions 6〇1 are correspondingly formed into circular arc-shaped bumps. The structural shape of the bottom supported portion is changed correspondingly, and is not limited to the embodiment. The image sensing wafer 50 can be a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor). The image sensing wafer 50 can be bonded to the substrate 6 〇 bearing surface 6 〇 2 and electrically connected to the substrate 60 by wires, or can be laminated, internal pin bonding, and automatic tape loading. The image sensing wafer is structurally and electrically connected to the substrate 6 by a flip-chip, a flip-chip package or a thermocompression bonding. The image sensing chip 50 is configured to convert an optical signal captured by the lens module 10 into an electrical signal. The lens module 1 includes a lens group 16, a lens barrel 12, and a lens holder 14. The lens group 16 is fixed in the lens barrel 14. The outer side of the lens barrel 12 is formed with an external thread U. The inside of the lens holder 14 is provided with an internal thread 2^, and the lens barrel 12 is screwed into the mirror by the external thread η and the internal thread 22 to be fixed or adjusted. The colloid layer 40 is disposed between the mirror mount 14 and the substrate 6A. In this embodiment, the colloid layer 40 is disposed along the periphery of the image sensing wafer 5 and surrounds the image sensing wafer 50. In practical applications, the glue 40 may also be spaced around the image sensing wafer 5 from the peripheral side of the image sensing wafer 50. The height of the colloid layer 40 is equivalent to the height of the image sensing crystal = 5 。. The colloid layer 40 functions to protect the substrate, the passive component 6〇4 on the carrier surface 602. In this embodiment, the glue 9 200846739 • the body layer 40 is a thermosetting glue. The lens module ί is supported by the four bumps 601 of the carrier surface 6〇2 of the substrate 60 and directly adhered to the substrate 60 by the colloid layer 4〇. In the present embodiment, the camera module 100 further includes a light transmissive component 30, the light transmissive component 30 is an infrared filter, and the light transmissive component 3 is fixed to the mirror mount 14. An inner wall is disposed between the image sensing chip 50 and the lens barrel 12 for protecting the sensing area of the image sensing chip Deng and filtering the light. In practical applications, the light transmissive element, such as a glass or other light transmissive material, is directly bonded to the bottom of the lens holder 14. It is not limited to this embodiment. Please refer to FIG. 5 , which is a flowchart of a camera module assembly according to a first embodiment of the present invention. The method includes the following steps: Step 300 : providing a substrate 6 〇 having a bearing surface 6 〇 2, the bearing surface 602 Corresponding to the bottom of the lens module 1 is provided with four bumps 6〇1. The substrate 60 is used to carry an image sensing wafer 5 . In this embodiment, the bottom of the lens module 10 has a quadrangular structure, and the bearing surface of the substrate 6 is corresponding to the four prisms 601 of the prismatic shape at the bottom of the lens module 10. The four bumps 601 have at least one bump 6〇1 disposed on a different line from the other bumps 601. Preferably, the four bumps 6〇1 are respectively disposed at four corners of the substrate 60. The height of the four bumps 6〇1 is equivalent to the thickness of the image sensing wafer 50, and is made of the same material as the substrate 6〇, and is of a unitary structure. The four bumps 601 can also be adhered to the bearing surface 602 of the substrate 60 by bonding. In practical applications, when the bottom of the lens module 1 is a bottom, that is, when the bottom of the lens holder 14 has a circular structure, the bumps 200846739 are correspondingly formed into circular arc-shaped bumps, and the shape of the bumps 601 is matched with the lens module. The structure of the bottom portion of the 10 is changed by the structural shape of the support portion, and is not limited to the embodiment. Step 400: Fixing an image sensing wafer 5〇 on the bearing surface 602 of the substrate 6〇. The surface area of the image sensing wafer 50 is wrapped around the substrate 60 bearing surface 602, and the passive component 6〇4 is mounted by surface mount technology. The image sensing wafer 50 and the substrate 60 are connected by a wire by a wire bonding machine. The chipping form, the inner pin bonding, the automatic tape bonding, the reverse packaging or the thermal pressing may also be used. The connection mode makes the image sensing wafer structurally and electrically connected to the substrate 60. Step 500: Apply a colloid to the bearing surface 602 of the substrate 60 to form a colloid layer 40. In this embodiment, the colloid layer 40 is disposed along the periphery of the image sensing wafer 5 and surrounds the image sensing wafer 50. In practical applications, the φ colloid layer 40 may also surround the image sensing wafer 50 and be spaced apart from the peripheral side of the image sensing wafer 50. At the same time, the colloid layer 40 covers the passive component 604 of the substrate 60 and the wires. To protect the image sensing wafer 5 and the passive component 604 and the wire, the passive component 604 and the relative position of the wire can also be fixed. In the embodiment, the colloid layer 40 is a thermosetting glue. Step 600: A lens module 10 to be assembled is aligned with the image sensing wafer, and is supported by the four bumps 601 and adhered to the substrate 60 by the colloid layer. 11 200846739 The lens module 10 includes a lens group 16, a lens barrel 12 and a lens holder. The lens group 16 is fixed in the lens barrel 12. The lens barrel 12 has an external thread 11 and an inner thread 22 is disposed on the inner side of the lens holder 14 . The mirror 12 is screwed into the lens holder 14 by an external thread u and an internal thread 22 . Or focus. The camera module 100 further includes a light transmissive element 30, the I light element 3 is an infrared filter, and the light emitting element 3 is fixed on the inner wall of the siren 14 and its bit is The image sensing wafer 50 is interposed between the pq and the mirror, and is used to protect the sensing area of the image sensing wafer 50 and filter the light. The lens holder 14 , the colloid layer 40 and the light transmissive element 30 ^ are paired with the dust-free sealed package of the image sensing wafer 50 . Referring to FIG. 6, a camera module 200 according to a second embodiment of the present invention includes a substrate 160, an image sensing wafer 15A, a lens module 1A, and a colloid layer 140. The camera module 200 is basically the same as the camera module structure of the first embodiment of the present invention, and the difference is mainly that the substrate 160 bearing surface M2 is symmetrically disposed with two bumps 161 corresponding to the bottom of the lens module 1 . The two bumps 161 and the substrate 160 are made of the same material, and the two bumps 161 are two rectangular parallelepiped, and the length thereof is not longer than the side length of the substrate 16 , and the length thereof is required to ensure the length. The lens module 10 can be smoothly connected to the bearing surface 162 of the substrate 160 by the two bumps 161. The colloid layer 140 is disposed between the lens module 1 and the substrate 16 , and in the embodiment, the colloid layer 140 is disposed along the periphery of the image sensing chip 150 and surrounds the image sensing chip. 15〇. In practical applications, the colloid layer 140 may also surround the image sensing wafer 15 and may be spaced apart from the peripheral side of the image sensing wafer 150. At the same time, the colloid layer 140 covers the passive component 164 of the substrate 160 and the wires. The lens module 10 is supported by two bumps 161 of the bearing surface 162 of the substrate 160 and directly adhered to the substrate 160 by the colloid layer 140. In this embodiment, the camera module 100 further includes a light transmitting component 130, the light transmitting component 130 is an infrared filter, and the light transmitting component 130 is fixed on the inner wall of the lens holder 14. It is disposed between the image sensing wafer 150 and the mirror 12 to protect the sensing area of the image sensing wafer 10 150 and filter the light. In practical applications, the light transmissive element 130 may also be glass or other light transmissive material that is directly bonded to the bottom of the mirror mount 14. It is not limited to this embodiment. In the embodiment, the bottom of the lens module is a four-frame structure, and the substrate 160 bearing surface 162 is symmetrically disposed corresponding to the bottom of the lens module 10 with two bumps 161 'the two bumps 161 and the The substrate 160 is formed by an integrally formed structure. The two bumps 161 are two rectangular parallelepipeds. In practical applications, the bearing surface 162 of the substrate 丄 corresponds to the bottom of the lens module 10 and has three or four bumps 161. At this time, at least one of the bumps 161 and the other bumps 161 are not on the same line. The bottom of the lens module 10, that is, when the bottom of the lens holder 14 has a circular structure, the bumps 161 are correspondingly formed into circular arc-shaped bumps, and the shape of the bumps 161 is supported by the bottom portion of the lens module 10 The shape of the structure changes and changes accordingly. The bumps 161 and the substrate holder 0 may be formed in an integrally formed structure, or may be separate components. The bumps 161 are fixed to the bearing surface 162 of the substrate by bonding or other means. It is not limited to this embodiment. 13 200846739 ι In contrast to the prior art, the lens module in the camera module is supported by at least two bumps on the substrate carrying surface and adhered to the substrate by a colloid layer, thereby assembling the lens module to When it is on the substrate, it takes only a small amount of substrate bearing surface area. Therefore, the surface area of the substrate can be reduced, thereby reducing the volume of the camera module. The available area of the substrate carrying surface can be increased without reducing the surface area of the substrate, the wiring space of the substrate surface is enlarged, the space density of the wires and the passive components on the surface of the substrate is reduced, and the wire bonding machine can be driven to reduce the assembly cost. • In summary, the present invention complies with the requirements of the invention patent and proposes a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be able to make equivalent modifications or changes in accordance with the spirit of the present invention. It should be covered by the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a half cross-sectional view of a camera module of the prior art; FIG. 2 is an exploded perspective view of the camera module of FIG. 1; FIG. 3 is a half cross-sectional view of the camera module according to the first embodiment of the present invention. 4 is an exploded perspective view of a camera module according to a first embodiment of the present invention, FIG. 5 is a flowchart of assembling a camera module according to a first embodiment of the present invention; FIG. 6 is a camera according to a second embodiment of the present invention; An exploded view of the module. 14 200846739 . [Description of main component symbols] Camera module 1, 100, 200 lens module 10 lens barrel 2, 12 lens holder 3, 14 lens group 16 light transmitting element 4, 30, 130 image sensing wafer 5, 50, 150 colloid layer 40, 140 substrate 6, 60, 160 thread 7, 7 internal thread 8, 22 bump 161, 601 substrate bearing surface 162, 602 passive components 164, 604
1515