JPH11112854A - Image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an image pickup device provided with optically excellent positioning accuracy by matching the optical axis of a lens and the light receiving surface of a solid-state image pickup element in the case that an adhesive material is applied in a non-uniform thickness by an application defect for the attachment of a container for housing the solid-state image pickup element or the like and a holder for loading an optical system at the time of integrating the solid-state image pickup element, a peripheral circuit element and the optical system of the lens and a diaphragm, etc. SOLUTION: A level difference by a projection part 16a on the inner side part of the peripheral frame part of a lens holder 16 and a bottom surface part 16b on an outer side part is provided and the level difference by the bottom surface part 11a on the inner side part of the peripheral frame part of a housing container 11 and the projection part 11b on the outer side part is provided. In this case, at the time of combining the lens holder 16 and the housing container 11, an optical positioning reference surface by the projection part 16a and the bottom surface part 11a is constituted and an adhesion surface for generating a clearance between the bottom surface part 16b of the peripheral frame part of the lens holder 16 and the projection part 11b of the peripheral frame part of the housing container 11 is constituted.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-weight, small-sized, and thinned image pickup apparatus which can be mounted on a desktop or notebook personal computer, a portable telephone, etc. The present invention relates to an imaging apparatus in which peripheral circuit elements such as circuits and an optical system such as a lens and a diaphragm are integrated.

[0002]

2. Description of the Related Art In recent years, in consumer video cameras,
Demands for high image quality, such as faithful color reproducibility and expression of fine details, and demands for miniaturization, thinning, weight reduction, etc., which are convenient to carry, are increasing. In order to meet such demands, techniques for reducing the size and thickness of an imaging device including a solid-state imaging device and its peripheral circuit devices have been actively developed.

FIG. 6 is a sectional view of a main part of a conventional miniaturized imaging device. In FIG. 6, reference numeral 1 denotes a solid-state imaging device in which a solid-state imaging device (hereinafter referred to as a CCD chip) is mounted inside a ceramic package. (Hereinafter referred to as CCD) mounted on the first printed circuit board 2. Circuit components 3 such as resistors and capacitors are provided on the first printed circuit board 2.
Are also mounted, and are electrically connected to the CCD 1. Reference numeral 4 denotes a second printed circuit board which is electrically connected to the first printed circuit board 2 by a flexible cable 5, and has on its upper surface each peripheral circuit element constituting a driving circuit section and a signal processing circuit section of the CCD 1. 6 and circuit components 7 such as resistors and capacitors are mounted. The second printed circuit board 4 can be freely bent by the flexible cable 5, which is effective in reducing the area occupied by the imaging device.

As shown in FIG. 1, the conventional imaging apparatus uses two printed boards 2 and 4, and a first printed board 2 has a solid-state imaging device 1 mounted on a ceramic package or the like and a circuit component 3 mounted thereon. The peripheral circuit element 6 and the circuit component 7 are mounted on the second printed circuit board 4. The dimensions of these printed circuit boards are about 4 cm square, and the height of two printed circuit boards superposed is about 1 cm.

[0005] Reference numeral 8 denotes a lens holder provided so as to cover the CCD 1, and a lens 9 is fixed to a position located at the center of the CCD 1. Reference numeral 10 denotes a case of an imaging device in which a stop having a small diameter and an optical filter are provided at the center thereof.

[0006] Such an image pickup apparatus has been increasingly used for an image pickup section of a video camera or an electronic still camera or for an information terminal such as a notebook computer or a mobile phone. While the miniaturization and miniaturization are progressing without limit, the functions to be provided are required to be multifunctional, so that the further miniaturization, weight reduction and thinning of the components of these electronic devices are no longer essential conditions. I have.

In order to meet these demands, the present inventors have previously proposed a new one-package module type imaging device which is reduced in size and thickness as shown in FIG.

As shown in FIG. 7, a CCD chip 12 and a peripheral circuit element 13 made of a semiconductor chip adjacent to the CCD chip 12 are provided in a housing 11 as shown in FIG.
Are mounted, all of which are wire leads 14 such as gold wires.
Thus, it is bonded to a wiring group (not shown) formed on the bottom surface of the storage container 11. The terminals of the wiring group are also connected to pin leads 15 which are led out of the housing 11 by wire leads 14. The inside of the storage container 11 thus configured is hermetically sealed by bonding the lens holder 16 to the upper surface thereof.

The lens holder 16 includes a CCD chip 1
An optical stop 17 and a lens 18 which constitute a pinhole lens are provided in a portion located just above the upper surface 2.

Next, the substrate 1 on which the storage container 11 is placed is
The other peripheral components 20 and the like 20 are mounted on the surface opposite to 9 to complete the imaging device.

[0011]

However, as shown in FIG. 7, the lens holder 16 and the storage container 11 are made of an adhesive 21 applied on the upper surface of the periphery of the frame of the storage container 11.
a, 21b, and if the adhesive is applied in a non-uniform thickness, such as the thick portion 21a and the thin portion 21b, as shown in the figure, there is a risk that the lens holder 16 will be mounted unevenly. This causes a problem that the optical axis of the lens 18 does not coincide with the light receiving surface of the CCD chip 12.

The present invention has been made to solve the above problems, and
An object of the present invention is to provide an imaging device capable of simultaneously and reliably performing hermetic sealing and optical alignment when assembling a one-package camera module.

[0013]

According to the present invention, there is provided an image pickup apparatus comprising a lens holder having an optical diaphragm and a lens, and a storage container having a solid-state image pickup element and a peripheral circuit element. Steps are provided in the lens holder and the periphery of the frame of the storage container, and an optical positioning reference surface and an adhesive surface are respectively formed in the steps, and a lens holder having an optical system in the optical positioning reference surface is provided. Since a storage container on which a CCD chip or the like is mounted can be positioned, it is possible to obtain a high-quality imaging apparatus that does not cause a deviation in the optical axis due to a failure in applying the adhesive as in the related art.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is an image pickup apparatus provided with a lens holder having an optical diaphragm and a lens, and a storage container on which a solid-state image pickup device and a peripheral circuit element are mounted, Steps are respectively provided around the frame of the lens holder and the housing, and an optical positioning reference surface and an adhesive surface are formed on the steps, and the lens holder and the housing of the imaging device are formed. By providing a bonding surface for hermetic sealing, and a reference surface for performing optical alignment between a lens holder forming an optical system, a light receiving unit and a storage container forming a signal processing system are separately provided, Hermetic sealing and optical positioning can be performed very easily and reliably at the same time, and a high-precision imaging device can be obtained.

According to a second aspect of the present invention, there is provided the imaging apparatus according to the first aspect, wherein an optical positioning reference surface is provided on each of inner surfaces of the steps of the lens holder and the storage container, and an adhesive surface is formed of the steps. These are provided on the outer surfaces, respectively, so that even if the adhesive is excessively applied, the adhesive does not flow into the inside of the imaging device and contaminate the CCD chip or the like.

According to a third aspect of the present invention, there is provided the image pickup apparatus according to the first aspect, wherein an optical positioning reference surface is provided on each of outer surfaces of steps of the lens holder and the storage container, and an adhesive surface is provided on the step. Are provided on the inner side surfaces, respectively, and can prevent the adhesive from being exposed to the outside air, so that a large adhesive force can be maintained.

According to a fourth aspect of the present invention, there is provided an image pickup apparatus including a lens holder having an optical diaphragm and a lens, and a storage container having a solid-state image pickup element and a peripheral circuit element. An optical alignment reference surface and an adhesive surface are respectively formed in a convex portion or a concave portion provided in the peripheral portion of the body, and a concave portion or a convex portion provided in the peripheral portion of the frame of the storage container. Since the convex and concave portions are fitted to each other, optical alignment can be performed with strong bonding force and high reliability.

According to a fifth aspect of the present invention, there is provided the image pickup apparatus according to the fourth aspect, wherein the contact surface between the tip of the convex portion and the bottom surface of the concave portion forms an optical positioning reference surface, and the low level of the convex portion. The gap between the surface and the high surface of the concave portion forms the bonding surface, and the bonding surface can be provided on both sides of the outer surface and the inner surface of the frame body, so that the bonding force can be improved. The present invention can be used for an imaging device mounted on a device requiring vibration resistance.

According to a sixth aspect of the present invention, there is provided the image pickup apparatus according to the fourth aspect, wherein the contact surface between the low surface of the convex portion and the high surface of the concave portion forms an optical alignment reference surface, and The gap between the tip of the portion and the bottom surface of the recess forms an adhesive surface, and the same operation and effect as the invention according to claim 5 can be obtained.

Next, an image pickup apparatus according to an embodiment of the present invention will be described with reference to the drawings. Note that the basic configuration of the imaging apparatus according to the present invention is similar to the imaging apparatus shown in FIG. 7 previously proposed by the inventors, and therefore, the same parts as those in FIG. Will be described.

(Embodiment 1) FIG. 1 shows a structure of an imaging apparatus according to a first embodiment of the present invention. In FIG. 1, reference numeral 11 denotes a storage container on which a CCD chip 12 and a peripheral circuit element 13 are mounted. Reference numerals 16 denote lens holders each having an optical stop 17 and a lens 18 at a portion located on the upper surface of the CCD chip 12 when the imaging device is assembled. The feature of the present invention lies in the structure of the lens holder 16 and the peripheral frame of the storage container 11, and as shown in FIG. 1, the peripheral frame of the lens holder 16 has a protruding portion 16a on the inner side and an outer portion. Is provided with a bottom surface portion 16b, and a peripheral frame portion of the storage container 11 has an inner bottom surface portion 11b.
a and a step in which a protruding portion 11b is formed on the outer side.

FIG. 2 is an enlarged view showing the structure of the peripheral frame portion in FIG. 1. When the lens holder 16 and the storage container 11 are combined, the protrusion 16a of the peripheral frame portion of the lens holder 16 The bottom portion 11a of the peripheral frame portion of the storage container 11 is in close mechanical contact with the lens holder 16 and the storage container 11 because the protrusion 16a and the surface of the bottom portion 11a are mechanically formed precisely. Can be used as a reference plane for optical positioning. A gap D is formed between the bottom surface 16b of the peripheral frame of the lens holder 16 and the protrusion 11b of the peripheral frame of the storage container 11, and the adhesive 22 is filled in the gap D and 16 and the storage container 11 can be hermetically sealed.

(Embodiment 2) Next, an image pickup apparatus according to a second embodiment of the present invention will be described. FIG. 3 shows a structure of an image pickup apparatus according to a second embodiment of the present invention. This embodiment is different from the first embodiment in that peripheral frames of a lens holder 36 and a storage container 31 are respectively provided. In the structure of the steps. That is, when the lens holder 36 and the storage container 31 are combined, the lens holder 36
The bottom surface portion 36b provided on the outer portion of the peripheral frame portion and the protruding portion 31b provided on the outer portion of the peripheral frame portion of the storage container 31 mechanically come into close contact with each other, and serve as a reference surface for optical positioning. The adhesive 32 is applied to the gap D generated between the protrusion 36a provided inside the peripheral frame of the lens holder 36 and the bottom 31a provided inside the peripheral frame of the storage container 31.
Is filled.

In the combination of the steps of the lens holder and the peripheral frame of the storage container of the image pickup apparatus according to the first and second embodiments of the present invention, although not shown in FIGS. It is also possible to provide clearances in the sliding portions 17 and 37 in the combination of the above and use the clearances for optical alignment of the lens holder and the storage container in the horizontal direction.

(Embodiment 3) Next, an image pickup apparatus according to a third embodiment of the present invention will be described. FIG. 4 shows the structure of an imaging apparatus according to a third embodiment of the present invention. This embodiment is different from the first and second embodiments in that a lens holder 46 and a storage container 41 are different from each other. Each is in the structure of the peripheral frame. That is, the lens holder 4
6 is provided with a convex portion 47 on the upper surface thereof, and the peripheral frame portion of the storage container 41 is provided with a concave portion 48 on the upper surface thereof. Further, the height H of the convex portion 47 and the depth L of the concave portion 48 are determined. The relationship of H
> L. Therefore, when the lens holder 46 and the storage container 41 are combined, the tip of the convex 47 and the concave 48
Is mechanically in close contact with the bottom surface and serves as a reference surface for optical positioning of the lens holder 46 and the storage container 41. Because of the relationship of H> L, a gap D is inevitably formed between the low surface 46a on both sides of the convex portion 47 and the high surface 41a on both sides of the concave portion 48, and the adhesive is filled in the gap D. The lens holder 46 and the storage container 41 can be hermetically sealed.

(Embodiment 4) Next, an imaging apparatus according to a fourth embodiment of the present invention will be described. FIG. 5 shows the structure of an image pickup apparatus according to a fourth embodiment of the present invention. This embodiment is different from the third embodiment in that the peripheral frame of the lens holder according to the third embodiment is different from the third embodiment. There is a relationship between the height H of the convex portion provided in the portion and the depth L of the concave portion provided in the peripheral frame portion of the storage container, and the convex portion provided in the peripheral frame portion of the lens holder 56 in the present embodiment. Part 57
Height H and the recess 5 provided in the peripheral frame of the storage container 51
8 in that the relationship with the depth L is H <L.

Accordingly, the reference surfaces for optical positioning are formed on the lower surface 56a on both sides of the convex portion 57 provided on the peripheral frame of the lens holder 56 and on both sides of the concave portion 58 provided on the peripheral frame of the storage container 51. It is a contact surface with a certain high surface 51a. In addition, the hermetic sealing between the lens holder 56 and the storage container 51 by the adhesive is performed by the tip of the convex portion 57 of the peripheral frame portion of the lens holder 56 and the storage container 5 caused by the relationship of H <L.
This is performed by filling a gap D between the first peripheral frame portion and the bottom surface of the concave portion 58 with an adhesive.

In the third and fourth embodiments of the present invention as well, a sliding portion at the time of assembling the lens holder and the storage container is used for horizontal optical alignment between the lens holder and the storage container. It is possible to provide a slight clearance at 49, 59.

[0029]

As is apparent from the above embodiment, the present invention provides a lens holder for an image pickup apparatus comprising a lens holder having an optical diaphragm and a lens, and a storage container on which a solid-state image pickup device and peripheral circuit elements are mounted. A lens holder and a CCD chip having an optical system on the optical positioning reference surface by providing a step on the periphery of the frame of the storage container and forming an optical positioning reference surface and an adhesive surface separately on the step. Can be positioned optically with high precision, so that the optical axis does not become out of order due to poor application of the adhesive as in the past, and an extremely high quality imaging device is produced. Can get better.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of an imaging device according to a first embodiment of the present invention.

FIG. 2 is a partially enlarged cross-sectional view showing a combination structure of a lens holder and a storage container of the imaging device.

FIG. 3 is a partially enlarged cross-sectional view illustrating a combination structure of an imaging device according to a second embodiment of the present invention.

FIG. 4 is a partially enlarged cross-sectional view showing a combination structure of the imaging device according to the third embodiment.

FIG. 5 is a partially enlarged cross-sectional view showing a combination structure of the imaging device according to the fourth embodiment.

FIG. 6 is a cross-sectional view of a conventional imaging device.

FIG. 7 is a cross-sectional view of another conventional imaging device.

[Description of Signs] 11 Storage container 11a Bottom part (optical positioning reference surface) 11b Projection (adhesion surface) 12 CCD chip (solid-state imaging device) 13 Peripheral circuit element 16 Lens holder 16a Projection (optical positioning reference surface) 16b Bottom part (adhesive surface) 17 Optical aperture 18 Lens

Continuation of the front page (72) Inventor Shogai Omae 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Corporation

Claims (6)

[Claims] 1. An imaging apparatus comprising: a lens holder having an optical diaphragm and a lens; and a storage container on which a solid-state imaging device and a peripheral circuit element are mounted. An imaging apparatus, wherein a step is provided, and an optical positioning reference surface and an adhesive surface are formed in the step. 2. The imaging device according to claim 1, wherein an optical positioning reference surface is provided on each of inner surfaces of the steps of the lens holder and the storage container, and an adhesive surface is provided on each of outer surfaces of the steps. 3. The imaging device according to claim 1, wherein an optical positioning reference surface is provided on each of outer surfaces of the steps of the lens holder and the storage container, and an adhesive surface is provided on each of inner surfaces of the steps. 4. An image pickup apparatus comprising: a lens holder having an optical diaphragm and a lens; and a storage container on which a solid-state image pickup device and a peripheral circuit element are mounted, wherein a convex portion provided around a frame of the lens holder. Alternatively, an imaging device in which an optical positioning reference surface and an adhesive surface are formed in a concave portion and a concave portion or a convex portion provided around a frame of the storage container, respectively. 5. The contact surface between the tip of the convex portion and the bottom surface of the concave portion forms an optical positioning reference surface, and the gap between the low surface of the convex portion and the high surface of the concave portion forms an adhesive surface. Claim 4
An imaging device according to any one of the preceding claims. 6. A contact surface between a low surface of a convex portion and a high surface of a concave portion forms an optical positioning reference surface, and a gap between a tip portion of the convex portion and a bottom surface of the concave portion forms an adhesive surface. The imaging device according to claim 4.