JPH1117997A - Image pickup unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a one-package module image pickup unit with light weight, formed in a small size, thin in shape to be mouthed on a notebook-personal computer and a cellular phone, etc., and with short wiring. SOLUTION: The image pickup unit is attached by mounting a CCD chip 12 and a peripheral circuit element 13 on a silicon substrate 14, mutually and electrically connecting the CCD chip 12 and the peripheral circuit element 13 with wiring formed on the silicon substrate 14, storing the connected CCD chip 12 and the peripheral circuit element 13 in a container 11 with a recessed shape, hermetically sealing the top of the container 11 by covering it by a face plate 18, simultaneously providing an optical filter 20 in an opening part 19 of the face plate 18 located in front of the CCD chip 12, covering a lens holder 24 in which can optical diaphragm 22 and a lens 23 are provided from a side of the face plate 18 of a package 21 and adjusting light axes of the CCD chips 12, the optical filter 20 and the lens 23.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light-weight, small-sized, and thinned image pickup apparatus which can be mounted on a desktop or notebook personal computer, a portable telephone, etc. The present invention relates to an imaging device in which a peripheral circuit including a circuit and an optical system such as a lens and an aperture are integrated.

[0002]

2. Description of the Related Art In recent years, in consumer video cameras,
Demands for high image quality, such as faithful color reproducibility and expression of fine details, and demands for miniaturization, thinning, weight reduction, etc., which are convenient to carry, are increasing. In order to meet such a demand, technology development for reducing the size and thickness of an imaging device including a solid-state imaging device and its peripheral circuits has been actively conducted.

FIG. 4 is a cross-sectional view of a main part of a conventional small and thin imaging device. In FIG. 4, reference numeral 1 denotes a solid-state image pickup device (hereinafter referred to as a CCD chip) mounted inside a ceramic package. An image pickup device (hereinafter referred to as a CCD) is mounted on the first printed wiring board 2.
Circuit components 3 such as a resistor and a capacitor are also mounted on the first printed wiring board 2 and are electrically connected to the CCD 1. Reference numeral 4 denotes a second printed wiring board which is electrically connected to the first printed wiring board 2 by a flexible cable 5, and has a CCD on its upper surface.
Each peripheral circuit element 6 and circuit components 7 such as a resistor and a capacitor, which constitute one drive circuit unit and a signal processing circuit unit, are mounted. The second printed wiring board 4 can be freely bent by the flexible cable 5, which is effective in reducing the area occupied by the imaging device.

As shown in FIG. 1, the conventional image pickup apparatus uses two printed wiring boards 2 and 4, and a first printed wiring board 2 has a CCD 1 mounted on a ceramic package or the like.
And a circuit component 3, and a peripheral circuit element 6 and a circuit component 7 are also mounted on the second printed wiring board 4. The dimensions of these printed wiring boards are about 4 cm square, and the height of two printed wiring boards superimposed is about 1 cm.

[0005] Reference numeral 8 denotes a lens holder provided so as to cover the CCD 1, and a lens 9 is fixed to a position located at the center of the CCD 1. Reference numeral 10 denotes a case of the image pickup apparatus. A stop 11 having a small diameter and an optical filter 12 are provided at a position located at the center of the lens 9, and the center of the CCD 1 and the lens 9, the optical filter 12, and the center of the stop 11 are provided. Are set on the same optical axis.

[0006] Such an image pickup apparatus has been increasingly used for an image pickup section of a video camera or an electronic still camera or for an information terminal such as a notebook computer or a mobile phone. While the miniaturization and miniaturization are progressing without limit, the functions to be provided are required to be multifunctional, so that the further miniaturization, weight reduction and thinning of the components of these electronic devices are no longer essential conditions. I have.

[0007]

However, in the structure of the above-mentioned conventional image pickup apparatus, although the CCD chip and some peripheral circuit elements are modularized for the time being, the package is still made of ceramic or plastic. Since the solid-state imaging device and the peripheral circuit element used are used and are connected to the printed wiring board by soldering, there is a limit to a reduction in size and thickness. In addition, the length of the wiring on the printed wiring board is long, so that the wiring capacity is large, and unnecessary radiation due to charging and discharging of the wiring capacity is a problem.
In addition, if the length of the wiring is long, signal delay occurs, which limits the speed of signal processing.

Further, in the conventional imaging apparatus, the arrangement of the CCD chip and peripheral circuit elements is not particularly specified, and the arrangement is such that when the imaging apparatus is used in an upright position, the CCD chip is positioned upward. It was customary. Therefore, if a CCD chip and peripheral circuit elements are integrated at a high density in order to reduce the size of the imaging device, the CC due to heat generation of the peripheral circuit elements
The influence on the D chip cannot be ignored, and the dark current of the CCD chip that is sensitive to a temperature change increases. If the dark current increases, the image quality deteriorates, for example, when a dark scene on the screen is photographed, the screen becomes rough.

In particular, a printed wiring board and a ceramic substrate in a conventional image pickup device cannot effectively dissipate heat because of their low thermal conductivity. This has been the biggest barrier to the demand for smaller and thinner image pickup devices mounted in the camera.

[0010] The present invention solves such a problem and provides a CCD.
By mounting the semiconductor elements that make up the chip, the drive unit, the signal processing unit, and the control unit in a compact, lightweight, and thin package, it is modularized, and by making the optical systems such as lenses, optical diaphragms, and optical filters compact, , C
Electrical signal processing system components including CD chips and optical system components have a one-package module structure with excellent heat dissipation,
It is another object of the present invention to provide an imaging device capable of performing signal processing at high speed.

[0011]

According to the present invention, in order to achieve the above-mentioned object, a solid-state image sensor and a peripheral circuit element comprising an integrated circuit are mounted on the same silicon substrate, and the solid-state image sensor and the peripheral circuit element are combined. It is electrically connected by wiring formed on a silicon substrate and housed in a container having a concave shape, and the top of the container is covered with a face plate to seal the container and a face plate located on the front surface of the CCD chip An optical filter is provided in the opening of the solid package, and a lens holder provided with an optical diaphragm and a lens on the optical axis passing through the imaging center of the solid-state imaging device from the face plate side of the sealed package is covered with a solid. It is fixed so that the optical axes of the image sensor, optical filter, and lens are adjusted, and heat generated from peripheral circuit elements is transferred to the silicon substrate. Because heat can be efficiently dissipated using heat conductivity and the wiring length can be shortened, excellent images can be obtained even when mounted on small and thin electronic devices such as notebook PC displays and mobile phones. Becomes

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is different from a solid-state image pickup device comprising a semiconductor substrate having a photoelectric conversion portion on the main surface and the semiconductor substrate having an integrated circuit formed on the main surface. A concave container having a built-in peripheral circuit element made of a semiconductor substrate, and a face plate made of a light-shielding material except for an optical filter provided at a position in front of the solid-state image sensor while hermetically sealing the container. And an imaging device including a lens holder provided with an optical stop and a lens on an optical axis passing through an imaging center of the solid-state imaging device and an optical filter, wherein the solid-state imaging device and the peripheral circuit device are mounted on the same silicon substrate. It is mounted, and the solid-state imaging device and the peripheral circuit element are electrically connected to each other by wiring formed on the silicon substrate and housed in a container. Can be dissipated by utilizing the heat conductivity of the con substrate, also it is possible to shorten the length of the interconnecting wiring and wiring to the external circuit of the solid-state image pickup element and the peripheral circuit elements.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIGS. 1, 2 and 3 show the structure of an imaging apparatus according to an embodiment of the present invention. As shown in FIG. 1, a CCD chip 12 and a CC
A silicon substrate 14 on which a peripheral circuit element 13 composed of a semiconductor chip such as VDr, CDS, DSP or the like is mounted close to the D chip 12 is housed.

The CCD chip 12 and the peripheral circuit element 13 are electrically connected to each other by wire leads 15 such as gold wires via wirings formed on the silicon substrate 14. The provided electrode pad 16 is bonded to the terminal 17a of the pin lead 17 on the outer peripheral portion of the container 11 shown in FIG.

The upper surface of the container 11 thus configured is adhered by a face plate 18 so that
The inside is hermetically sealed in a state filled with an inert gas.

At this time, since the size of the face plate 18 is made smaller than the upper area of the container 11, the CCD
Even if the adhesive fixing position is finely adjusted so that the center axis of the chip 12 and the center axis of the opening of the face plate 18 coincide with each other, the end of the face plate 18 does not protrude from the outer periphery of the container 11 and the package size There will be no out of order.

An opening 19 is provided in the face plate 18 at a position just above the CCD chip 12, and an IR cut filter 20 for blocking infrared rays is fixed to the opening 19 as an optical filter. The package 21 is constituted by the container 11 and the face plate 18.

The area of the opening 19 provided in the face plate 18 is formed to be larger than the area of the CCD chip 12. When the face plate 18 is fixed to the container 11 while adjusting the optical axis, the mounting is performed. Work can be facilitated, which is effective in improving the yield.

The face plate 1 in which a quartz low-pass filter or a phase grating is attached to the opening 19 in addition to the IR cut filter 20 depending on the purpose of use of the imaging apparatus.
8 can also be used.

Next, on the upper surface of the package 21, an IR
A lens holder 24 made of plastic or the like provided with an optical diaphragm 22 and a lens 23 that constitute a pinhole lens for forming an image or the like on the CCD chip 12 through the cut filter 20 is mounted. The lens holder 24 is fixed to the package 21 after performing fine adjustment in the X and Y directions for optical axis adjustment.
A clearance 25 is formed between the peripheral edge of the face plate 18 having a smaller area and the inner surface of the lens holder 24. The clearance portion 25 facilitates defining a reference plane for adjusting the optical axis when the optical axis is adjusted by fitting the lens holder 24 to the package 21 in an image pickup apparatus having a one-package module structure.

Next, the package 21 is mounted on a printed wiring board on the other side of which a peripheral component 26 such as a resistor and a capacitor, a peripheral integrated circuit element 27, a connector 28 for connection to an external circuit shown in FIG. The package 21 is mounted on the upper surface, and the pin leads 16 of the package 21 are connected to wiring terminals (not shown) of the printed wiring board 29 to complete a one-package module type imaging device.

In the present invention, the CCD chip 12
In addition to mounting the peripheral circuit element 13 on the silicon substrate 14 as described above, it is also possible to further form the peripheral circuit element 13 directly on the silicon substrate 14 by using a normal semiconductor integrated circuit forming technique to further increase the integration. .

[0023]

As described above, according to the present invention, a CCD chip, which is a main component of an image pickup apparatus, and an electric signal processing circuit system component including its peripheral circuit elements are mounted close to each other on a silicon substrate. , Heat generated by high-density integrated circuit devices such as DSPs can be dissipated by utilizing the high thermal conductivity of the silicon substrate to prevent the temperature of the CCD chip from rising, and to form high-density wiring on the silicon substrate. The speed of signal transmission and processing can be increased, and noise can also be greatly reduced.Thus, it is thinner like a display unit of a notebook computer and extremely miniaturized like an extremely limited narrow place or a mobile phone. It is possible to provide a highly reliable image pickup device with little noise mounted on an electronic device or the like.

[Brief description of the drawings]

FIG. 1 is a sectional view of an imaging device according to an embodiment of the present invention.

FIG. 2 is a plan view of the imaging device.

FIG. 3 is a rear view of the imaging device.

FIG. 4 is a cross-sectional view of a conventional imaging device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Container 12 CCD chip (solid-state image sensor) 13 Peripheral circuit element 14 Silicon substrate 18 Face plate 19 Opening 20 IR cut filter (optical filter) 21 Package 22 Optical diaphragm 23 Lens 24 Lens holder

Continuing from the front page (72) Inventor Shigeru Ishii 1-1, Sachimachi, Takatsuki-shi, Osaka, Japan Inside Matsushita Electronics Corporation (72) Inventor Shigetaka Kasuga 1-1, Sachimachi, Takatsuki-shi, Osaka Matsushita Electronics Corporation

Claims (1)

[Claims] 1. A concave shape having a built-in solid-state imaging device comprising a semiconductor substrate having a photoelectric conversion portion on a main surface and a peripheral circuit device comprising a semiconductor substrate different from the semiconductor substrate having an integrated circuit formed on a main surface. A container, a face plate made of a light-shielding material except for an optical filter provided at a position in front of the solid-state imaging device while hermetically sealing the container; an imaging center of the solid-state imaging device; and the optical filter. An optical diaphragm and a lens holder provided with a lens on an optical axis passing therethrough, wherein the solid-state image sensor and the peripheral circuit element are mounted on the same silicon substrate, and the solid-state image sensor and the peripheral An imaging device in which a circuit element is electrically connected to a wiring formed on the silicon substrate and housed in the container.