CN108933151A - A kind of encapsulating structure and packaging method of image sensing chip - Google Patents
A kind of encapsulating structure and packaging method of image sensing chip Download PDFInfo
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- CN108933151A CN108933151A CN201810832360.6A CN201810832360A CN108933151A CN 108933151 A CN108933151 A CN 108933151A CN 201810832360 A CN201810832360 A CN 201810832360A CN 108933151 A CN108933151 A CN 108933151A
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- image sensing
- sensing chip
- cylindrical sidewall
- contact jaw
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- 238000000034 method Methods 0.000 title claims abstract description 57
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 43
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 238000003466 welding Methods 0.000 claims abstract description 11
- 230000003287 optical effect Effects 0.000 claims description 24
- 238000005520 cutting process Methods 0.000 claims description 9
- 230000005611 electricity Effects 0.000 claims description 6
- 238000000926 separation method Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 3
- 230000013011 mating Effects 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 2
- 238000009434 installation Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 238000005538 encapsulation Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- 230000001447 compensatory effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000000750 progressive effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005494 tarnishing Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
Abstract
The invention discloses the encapsulating structures and packaging method of a kind of image sensing chip, image sensing chip is separately fixed at the two sides of the light passing window by technical solution of the present invention with the supporting structure for being used to install lens module, in this way, on the one hand, the front of image sensing chip is directly fixed with the surface of package substrate, the front of image sensing chip is preferable relative to back side flatness, directly it can realize that fixed and circuit interconnects by welding procedure and package substrate, the thickness of fixing layer between the front and package substrate of image sensing chip can be more accurately controlled, in order to accurately control image-forming range of the lens module relative to image sensing chip；It on the other hand, can be using the light passing window as reference position, so that lens module can be arranged with image sensing chip with face.Therefore technical solution of the present invention can improve the image quality of encapsulating structure with accurate contraposition lens module and image sensing chip.
Description
Technical field
The present invention relates to chip encapsulation technology fields, more specifically, being related to a kind of encapsulating structure of image sensing chip
And packaging method.
Background technique
With being constantly progressive for science and technology, more and more electronic equipments with image collecting function are widely applied
In daily life and work, huge convenience is brought for daily life and work, becomes and works as
The indispensable important tool of moderns.Electronic equipment realizes that the main component of image collecting function is image sensing chip, is
Guarantee the reliability of image sensing chip, service life and external factor is avoided to damage, image sensing chip needs to carry out
Packaging protection.
Image sensing chip needs and lens module is packaged protection together, in the prior art, to image sensing chip
It is usually existing to bind image sensing chip on circuit boards and when lens module progress integral packaging, then in circuit board
The same side be fixedly installed with the bracket of lens module.The prior art, can not be accurate when being packaged to image sensing chip
Align image sensing chip and lens module.
Summary of the invention
To solve the above-mentioned problems, technical solution of the present invention provides the encapsulating structure and envelope of a kind of image sensing chip
The aligning accuracy of lens module Yu image sensing chip can be improved in dress method, improves the encapsulating structure of image sensing chip
Image quality.
To achieve the goals above, the invention provides the following technical scheme:
A kind of encapsulating structure of image sensing chip, the encapsulating structure include:
Package substrate, the package substrate has opposite first surface and second surface, and runs through first table
The light passing window in face and the second surface；The package substrate also has interconnection circuit, and the interconnection circuit is outer for connecting
Portion's circuit；
Image sensing chip, the image sensing chip bonding cover the light passing window in the first surface；Institute
Image sensing chip is stated to be arranged with photosensitive region, the photosensitive region and the light passing window face；
Supporting structure, the supporting structure are fixed on the second surface；
Lens module, the lens module is mounted on the supporting structure, and light passing window described in face.
Preferably, in above-mentioned encapsulating structure, the interconnection circuit includes:
First contact jaw of the first surface is set, and first contact jaw is for connecting the external circuit；
Second contact jaw of the first surface is set, and second contact jaw is for connecting the image sensing core
Piece, second contact jaw are connect by the first wired circuit with first contact jaw.
Preferably, in above-mentioned encapsulating structure, the first wired circuit setting on the first surface, or is located at
Between the first surface and the second surface.
Preferably, in above-mentioned encapsulating structure, the supporting structure includes:
First cylindrical sidewall, first cylindrical sidewall is fixed on the second surface, and surrounds the light passing window；
The lens module is fixed on the inside of first cylindrical sidewall；
Wherein, first cylindrical sidewall and binding that are equipped with the lens module have the institute of the image sensing chip
It states package substrate and forms first annular seal space body.
Preferably, in above-mentioned encapsulating structure, the supporting structure further include:
Second cylindrical sidewall, second cylindrical sidewall have top opening and bottom opening；
Binding has the package substrate of the image sensing chip to be located in second cylindrical sidewall；
The top opening of second cylindrical sidewall has roof, and the roof has outer with first cylindrical sidewall
The fixed opening in side, the split ring is around the outside of first cylindrical sidewall；
The bottom opening is used for and circuit board is fixed, and the circuit board has the external circuit；
When the bottom opening and the fixed circuit board, second cylindrical sidewall and the circuit board form second
Seal cavity.
Preferably, in above-mentioned encapsulating structure, the circuit board is PCB or FPC.
Preferably, in above-mentioned encapsulating structure, second cylindrical sidewall is an integral molding structure with the roof；
Or, second cylindrical sidewall and the roof are separation unit, the roof is fixed on second tubular side
The top opening of wall.
Preferably, in above-mentioned encapsulating structure, further includes:
Optical filter between the lens module and the image sensing chip.
Preferably, in above-mentioned encapsulating structure, the optical filter is fixed on the second surface, and covers the light passing window
Mouthful.
It preferably, further include the anti-reflecting layer that the optical filter surface is set in above-mentioned encapsulating structure.
Preferably, in above-mentioned encapsulating structure, the interconnection circuit further include:
The third contact jaw of the second surface is set, and the third contact jaw is for binding plug-in element；
The third contact jaw passes through the second wired circuit being arranged in the package substrate and contacts with corresponding first
End connection.
The present invention also provides a kind of packaging method, the packaging method includes:
A package substrate is provided, the package substrate has opposite first surface and second surface, the encapsulation base
Plate has multiple chip bonding regions, has cutting channel, the chip bonding between the two neighboring chip bonding region
Region has the light passing window through the first surface and the second surface, and the chip bonding region also has interconnection electricity
Road, the interconnection circuit is for connecting external circuit；
Image sensing chip is bound in the chip bonding region, the image sensing chip bonding is in first table
Face, and cover the light passing window；The image sensing chip has photosensitive region, the photosensitive region and the light passing window
Face setting；
Divide the package substrate based on the cutting channel, forms multiple isolated chip bonding regions, the chip
Binding region binding has the image sensing chip；
Lens module, the lens module are set away from the side of the image sensing chip in the chip bonding region
It is mounted on the supporting structure, and light passing window described in face, the supporting structure is fixed on the second surface.
Preferably, in above-mentioned packaging method, the interconnection circuit includes: the first contact that the first surface is arranged in
End, first contact jaw is for connecting the external circuit；Second contact jaw of the first surface is set, described second
Contact jaw passes through the first wired circuit and first contact jaw for connecting the image sensing chip, second contact jaw
Connection.
Described in chip bonding region binding image sensing chip includes: by the image sensing chip and described the
The welding of two contact jaws.
Preferably, in above-mentioned packaging method, the first wired circuit setting on the first surface, or is located at
Between the first surface and the second surface.
Preferably, in above-mentioned packaging method, the supporting structure includes:
First cylindrical sidewall, first cylindrical sidewall is fixed on the second surface, and surrounds the light passing window；
The lens module is fixed on the inside of first cylindrical sidewall；
Wherein, first cylindrical sidewall and binding that are equipped with the lens module have the institute of the image sensing chip
It states package substrate and forms first annular seal space body.
Preferably, in above-mentioned packaging method, the supporting structure further include:
Second cylindrical sidewall, second cylindrical sidewall have top opening and bottom opening；
Binding has the package substrate of the image sensing chip to be located in second cylindrical sidewall；
The top opening of second cylindrical sidewall has roof, and the roof has outer with first cylindrical sidewall
The fixed opening in side, the split ring is around the outside of first cylindrical sidewall；
The bottom opening is used for and circuit board is fixed, and the circuit board has the external circuit；
When the bottom opening and the fixed circuit board, second cylindrical sidewall and the circuit board form second
Seal cavity.
Preferably, in above-mentioned packaging method, the packaging method further include:
It is solid away from the side of the image sensing chip in the chip bonding region before the supporting structure is installed
Determine optical filter, the optical filter covers the light passing window.
Preferably, in above-mentioned packaging method, the fixed optical filter before dividing the package substrate.
Preferably, in above-mentioned packaging method, the optical filter surface is provided with anti-reflecting layer.
Preferably, in above-mentioned packaging method, the interconnection circuit further include: the third that the second surface is arranged in connects
Contravention, the third contact jaw is for binding plug-in element；The third contact jaw is by being arranged in the package substrate
Second wired circuit is connected with corresponding first contact jaw.
The packaging method further include: before installing the supporting structure, described in the binding of the chip bonding region
Plug-in element, the plug-in element are arranged in the second surface.
As can be seen from the above description, the encapsulating structure for the image sensing chip that technical solution of the present invention provides and encapsulation side
In method, image sensing chip is separately fixed to the two sides of the light passing window with the supporting structure for being used to install lens module,
Thus it is possible, on the one hand, the front of image sensing chip is directly fixed with the surface of package substrate, the front of image sensing chip is opposite
In the back side, flatness is preferable, directly can realize that fixed and circuit interconnects by welding procedure and package substrate, can be more
It is accurately controlled the thickness of fixing layer between the front and package substrate of image sensing chip, in order to accurately control lens module
Image-forming range relative to image sensing chip；It on the other hand, can be using the light passing window as reference position, so that camera lens
Mould group can be arranged with image sensing chip with face.Therefore technical solution of the present invention can be with accurate contraposition lens module and image sensing
Chip improves the image quality of encapsulating structure.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is a kind of encapsulation schematic illustration of image sensing chip in the prior art；
Fig. 2 is a kind of schematic diagram of the encapsulating structure of image sensing chip provided in an embodiment of the present invention；
Fig. 3 is the schematic diagram of the encapsulating structure of another image sensing chip provided in an embodiment of the present invention；
Fig. 4 is the schematic diagram of the encapsulating structure of another image sensing chip provided in an embodiment of the present invention；
Fig. 5-Fig. 9 is a kind of flow diagram of the packaging method of image sensing chip provided in an embodiment of the present invention；
Figure 10-Figure 14 is the process signal of the packaging method of another image sensing chip provided in an embodiment of the present invention
Figure；
Figure 15 is a kind of structural schematic diagram of image sensing chip provided in an embodiment of the present invention；
Figure 16-Figure 18 is a kind of production method flow chart of image sensing chip provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
As shown in FIG. 1, FIG. 1 is a kind of encapsulation schematic illustration of image sensing chip in the prior art, image sensing cores
Piece 13 needs and lens module 11 is packaged protection together, in the prior art, to image sensing chip 13 and lens module
When 11 progress integral packaging, image sensing chip 13 is bound on usually present circuit board 15, then in the same of circuit board 15
Bracket 12 is fixed in side, and lens module 11 is installed on the bracket 12.Wherein, in mode shown in Fig. 1 left figure, image sensing chip
13 are fixed on 15 surface of circuit board by glue-line, and front weld pad is connect by conducting wire 14 with the interconnection circuit on circuit board, mutually
Connection circuit with external circuit for connecting；In mode shown in right figure, image sensing chip is overleaf formed with back by TSV technique
Face electricity interconnection architecture, the back side electricity interconnection architecture are connect with 13 front weld pad of image sensing chip, are mutually coupled by back side electricity
Structure is connect with the interconnection circuit on circuit board.
As shown in Figure 1, when the prior art carries out integral packaging to image sensing chip 13 and camera lens 11, on the one hand, nothing
Method accurately controls the thickness of fixing layer between the back side of image sensing chip 13 and circuit board 15, in this way, perpendicular to circuit board
The spacing of image sensing chip 13 Yu lens module 11 can not be accurately controlled on 15 direction, therefore can not accurately adjust lens module
11 image-forming range relative to image sensing chip 13；Another side, lens module 11 be usually between being directly anchored on 12, and
It is fixed with circuit board 15 again afterwards, in this way, lens module can not be accurately controlled after binding image sensing chip 13 on circuit board 15
The 11 face settings on the direction perpendicular to circuit board 15 with image sensing chip 12.
Therefore, the prior art, can not 13 He of accurate contraposition image sensing chip when being packaged to image sensing chip
Lens module mould group 11, the encapsulating structure image quality that will lead to image sensing chip 13 are poor.
To solve the above-mentioned problems, the embodiment of the invention provides a kind of encapsulating structure of image sensing chip and encapsulation
Image sensing chip is separately fixed at the two sides of the light passing window by method with the supporting structure for being used to install lens module,
Thus it is possible, on the one hand, the front of image sensing chip is directly fixed with the surface of package substrate, the front of image sensing chip is opposite
In the back side, flatness is preferable, directly can realize that fixed and circuit interconnects by welding procedure and package substrate, can be more
It is accurately controlled the thickness of fixing layer between the front and package substrate of image sensing chip, in order to accurately control lens module
Image-forming range relative to image sensing chip；It on the other hand, can be using the light passing window as reference position, so that camera lens
Mould group can be arranged with image sensing chip with face.Therefore technical solution of the present invention can be with accurate contraposition lens module and image sensing
Chip improves the image quality of encapsulating structure.
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
With reference to Fig. 1, Fig. 1 is a kind of schematic diagram of the encapsulating structure of image sensing chip provided in an embodiment of the present invention, should
Encapsulating structure includes: package substrate 24, image sensing chip 23, supporting structure 22 and lens module 21.
The package substrate 24 has opposite first surface and second surface, and through the first surface and described
The light passing window K of second surface.The package substrate 24 also has interconnection circuit, and the interconnection circuit is for connecting external electrical
Road.In order to avoid the image quality for the reflection image sensing chip 23 that the sidewall surfaces of light passing window K are formed, institute can be set
The sidewall surfaces for stating light passing window K have antireflective film.
The image sensing chip 23 is bundled in the first surface, and covers the light passing window K.The image sensing
Chip 23 has photosensitive region 231, and the photosensitive region 231 is arranged with the light passing window K face.The image sensing chip
23 have opposite front and back, and the photosensitive region 231 is located at the front.The image sensing chip 23 front with
The first surface is fixed.Optionally, the image sensing chip 23 can be fixed by welding procedure and the first surface
Connection, thus it is possible, on the one hand, image sensing chip 23 and the package substrate 24 can be made relatively fixed, another side can make
Image sensing chip 23 is obtained to be electrically connected with interconnection circuit realization.
The supporting structure 22 is fixed on the second surface.The lens module 21 is mounted on the supporting structure 22
On, and light passing window K described in face.
In encapsulating structure described in the embodiment of the present invention, by image sensing chip 23 and the bracket for being used to install lens module 21
Structure 22 is separately fixed at the two sides of the light passing window K, thus it is possible, on the one hand, image sensing chip 23 front directly with envelope
The surface of dress substrate 24 is fixed, and the front of image sensing chip 23 is preferable relative to back side flatness, can directly pass through welding
Technique and package substrate 24 realize that fixed and circuit interconnects, can more be accurately controlled the front of image sensing chip 23 with
The thickness of fixing layer between package substrate 24, in order to accurately control imaging of the lens module 21 relative to image sensing chip 23
Distance；It on the other hand, can be using the light passing window K as reference position, so that lens module 21 and image sensing chip 23
It can be arranged with face.Therefore encapsulating structure described in the embodiment of the present invention can be with accurate contraposition lens module 21 and image sensing chip
23, improve the image quality of encapsulating structure.
As shown in Fig. 2, the interconnection circuit includes: the first contact jaw 241 that the first surface is arranged in, described first
Contact jaw 241 is for connecting the external circuit；Second contact jaw 242 of the first surface, second contact are set
For connecting the image sensing chip 23, second contact jaw 242 passes through the first wired circuit 243 and described the at end 242
The connection of one contact jaw 241.Optionally, first wired circuit 243 setting on the first surface, or is located at described the
Between one surface and the second surface.In the exemplary embodiment illustrated in fig. 2, first wired circuit 243 is arranged described
Between second surface and the second surface, that is to say, that be disposed at the inside of the package substrate 24, avoid its by
Damage.
In encapsulating structure described in the embodiment of the present invention, the structure of the image sensing chip 23 is as shown in figure 15, Tu15Wei
The front of a kind of structural schematic diagram of image sensing chip provided in an embodiment of the present invention, the image sensing chip 23 has sense
Light region 231, front are additionally provided with the multiple weld pads 232 connecting with the photosensitive region 231.The weld pad 232 with it is described
Second contact jaw 242 welding, so that the image sensing chip 23 is connect with the interconnection circuit.The image sensing chip
23 front is also covered with protective layer 200, for protecting to the photosensitive region 231.It can be right in the protective layer 200
Answer the position of the weld pad 232 that opening is set, to expose the weld pad 232, in order to which the weld pad 232 is contacted with described second
242 welding of end or the protective layer 200 cover the weld pad 232, and having the protective layer 200 is relatively thin film, Ke Yitong
The temperature crossed in welding procedure directly melts the protective layer 200, so that weld pad 232 and second contact jaw 242 connect
It connects.
As shown in Fig. 2, the supporting structure 22 includes: the first cylindrical sidewall in encapsulating structure described in the embodiment of the present invention
221, first cylindrical sidewall 221 is fixed on the second surface, and surrounds the light passing window K；The lens module 21
It is fixed on the inside of first cylindrical sidewall 221；Wherein, first cylindrical sidewall of the lens module 21 is installed
221 have the package substrate 24 of the image sensing chip 23 to form first annular seal space body with binding.The lens module 21
With at least one lens element and fixing seat, the lens element is located in the fixing seat.The fixing seat with it is described
It is threadably secured between first cylindrical sidewall 221, is passed in order to accurately adjust the lens module 21 relative to the image
The image-forming range of sense chip 23.In other modes, the setting fixing seat also may not need, it directly will at least one described lens
Element is fixed on the inner wall of first cylindrical sidewall 221, described in the groove fixation by 221 inside of the first cylindrical sidewall
Lens element.
By the first annular seal space body can to the image sensing chip 23 front with the lens module 21 it
Between space be sealed protection, avoid the space from tarnishing.It is formed in order to avoid the inner surface of the first cylindrical sidewall 221
The image quality of reflection image sensing chip 23, the inner surface that first cylindrical sidewall 221 can be set have antireflective film.
With reference to Fig. 3, Fig. 3 is the schematic diagram of the encapsulating structure of another image sensing chip provided in an embodiment of the present invention,
Fig. 3 illustrated embodiment is that Fig. 3 illustrated embodiment further includes optical filter 25 with Fig. 2 illustrated embodiment difference.The filter
Mating plate 25 is arranged between the lens module 21 and the image sensing chip 23.The optical filter 25 can be arranged in institute
Second surface is stated, and covers the light passing window K.There is the space spacing of setting between lens module 21 and first surface, with
So that it has the image-forming range of setting with respect to image sensing chip 23, it is multiplexed the space spacing and the optical filter 25, nothing is set
The thickness of encapsulating structure need to be increased.The optical filter 25 is used to filter out other except the image sensing chip induction optical band
Light wave avoids influence of other light waves to image quality.
Optionally, the encapsulating structure further include: the anti-reflecting layer on 25 surface of optical filter is set.Do not show in Fig. 3
The anti-reflecting layer out.The anti-reflecting layer avoids influence of the reflected light to image quality for reducing reflection.
In the encapsulating structure described in the embodiment of the present invention, the supporting structure 22 further include: the second cylindrical sidewall 222, institute
The second cylindrical sidewall 222 is stated with top opening and bottom opening.Binding has the encapsulation of the image sensing chip 23
Substrate 24 is located in second cylindrical sidewall 222.The top opening of second cylindrical sidewall 222 has roof 223, described
The opening that roof 223 has and the outside of first cylindrical sidewall 221 is fixed, the split ring is around first cylindrical sidewall
221 outside.
As shown in figure 4, Fig. 4 is the signal of the encapsulating structure of another image sensing chip provided in an embodiment of the present invention
Scheme, in encapsulating structure described in the embodiment of the present invention, the bottom opening of second cylindrical sidewall 222 is used for and circuit board 26 is solid
Fixed, the circuit board 26 has the external circuit.When the bottom opening and the fixed circuit board 26, described second
Shape side wall 222 and the circuit board form the second seal cavity.The circuit board 26 is PCB or FPC.It is close by described second
Envelope cavity can be sealed protection to the space of second cylindrical sidewall 222, and the space is avoided to tarnish.Described first
Contact jaw 241 can be welded directly with the circuit board 26, so that interconnection circuit on the package substrate 24 and described outer
Portion's circuit connection.The height of first contact jaw 241 is greater than the thickness of the image sensing chip 23, in order to described first
Contact jaw 241 is welded and fixed with the circuit board 26.
Optionally, second cylindrical sidewall 222 is an integral molding structure with the roof 223；Or, second tubular
Side wall 222 and the roof 223 are separation unit, and the top that the roof 223 is fixed on second cylindrical sidewall 222 is opened
Mouthful.
Optionally, the interconnection circuit further include: the third contact jaw of the second surface, the third contact are set
End is for binding plug-in element.The third contact jaw pass through the second wired circuit for being arranged in the package substrate 24 with it is right
The first contact jaw 241 connection answered.The embodiment of the present invention is attached to be not shown in the figure the third contact jaw, second wired circuit
And the plug-in element.The plug-in element may include one of resistance, capacitor, memory and compensatory light or more
Kind.The plug-in element can be set in the outside of first cylindrical sidewall 221, and be located in second seal cavity.
When the plug-in element includes the compensatory light, the position of the corresponding compensatory light of the roof 223 has light hole,
So that compensation light outgoing.
As can be seen from the above description, in encapsulating structure described in the embodiment of the present invention, by image sensing chip 23 be used to pacify
The supporting structure 22 of dress lens module 21 is separately fixed at the two sides of the light passing window K, thus it is possible, on the one hand, image sensing core
Surface of the front directly with package substrate 24 of piece 23 is fixed, the front of image sensing chip 23 relative to back side flatness compared with
It is good, it directly can realize that fixed and circuit interconnects by welding procedure and package substrate 24, can more be accurately controlled shadow
As sensing chip 23 front and package substrate 24 between fixing layer thickness, in order to accurately control lens module 21 relative to
The image-forming range of image sensing chip 23；It on the other hand, can be using the light passing window K as reference position, so that camera lens mould
Group 21 can be arranged with image sensing chip 23 with face.Therefore encapsulating structure described in the embodiment of the present invention can be with accurate contraposition camera lens mould
Group 21 and image sensing chip 23, improve the image quality of encapsulating structure.
In encapsulating structure described in the embodiment of the present invention, lens module 21 and image sensing chip 23 are separately positioned on described
The package substrate 24 is arranged and corresponds in space in the image-forming range, reduces encapsulating structure by the two sides of package substrate 24
Thickness.When light passing window K be arranged optical filter 25 when, can to avoid when subsequent fixed supporting structure 22 to image sensing chip
23 are stained.
Based on above-mentioned encapsulating structure embodiment, another embodiment of the present invention additionally provides a kind of encapsulation of image sensing chip
Method, for the packaging method as shown in Fig. 5-Fig. 9, Fig. 5-Fig. 9 is a kind of envelope of image sensing chip provided in an embodiment of the present invention
The flow diagram of dress method, the packaging method include:
Step S11: as shown in figure 5, providing a package substrate 24.
The package substrate 24 has opposite first surface and second surface, and the package substrate 24 has multiple cores
Piece binding region has cutting channel 100 between the two neighboring chip bonding region, and the chip bonding region, which has, to be passed through
The light passing window K of the first surface and the second surface is worn, the chip bonding region also has interconnection circuit, described mutual
Connection circuit is for connecting external circuit.
The interconnection circuit includes: the first contact jaw 241 that the first surface is arranged in, first contact jaw 241
For connecting the external circuit；Second contact jaw 242 of the first surface is set, and second contact jaw 242 is used for
The image sensing chip 23 is connected, second contact jaw 242 passes through the first wired circuit 243 and first contact jaw
241 connections.
As above-mentioned, the setting of the first wired circuit 243 on the first surface, or be located at the first surface and
Between the second surface.
Step S12: as shown in fig. 6, binding image sensing chip 23 in the chip bonding region.
The image sensing chip 23 is bundled in the first surface, and covers the light passing window K；The image sensing
Chip 23 has photosensitive region 231, and the photosensitive region 231 is arranged with the light passing window K face.
In the step, it is described the chip bonding region binding image sensing chip 23 include: by the image sensing
Chip 23 and second contact jaw 242 weld.
Step S13: as shown in fig. 7, dividing the package substrate 24 based on the cutting channel 100, multiple separation are formed
Chip bonding region, chip bonding region binding has the image sensing chip 23.
Step S13: as shown in Figure 8 and Figure 9, deviate from the side of the image sensing chip 23 in the chip bonding region
Lens module 21 is set.
The lens module 21 is mounted on the supporting structure 22, and light passing window K described in face, the supporting structure
22 are fixed on the second surface.The image sensing chip 23 can be as shown in figure 15, and details are not described herein.
As above-mentioned, the supporting structure 22 includes: the first cylindrical sidewall 221, and first cylindrical sidewall 221 is fixed on institute
Second surface is stated, and surrounds the light passing window K；The lens module 21 is fixed on the inside of first cylindrical sidewall 221；
Wherein, first cylindrical sidewall 221 and binding that are equipped with the lens module 21 have the institute of the image sensing chip 23
It states package substrate 24 and forms first annular seal space body.Optionally, the supporting structure 22 further include: opening and bottom opening；It ties up
There is the package substrate 24 of the image sensing chip 23 to be located in second cylindrical sidewall 222 surely；Second tubular
The top opening of side wall 222 has roof 223, and the roof 223 is fixed with the outside with first cylindrical sidewall 221
Opening, the split ring is around the outside of first cylindrical sidewall 221；The bottom opening is used for and circuit board is fixed, the electricity
Road plate has the external circuit；When the bottom opening and the circuit board are fixed, second cylindrical sidewall and described
Circuit board forms the second seal cavity.
By production method shown in Fig. 5-Fig. 9, encapsulating structure as shown in Figure 2 can be formed.In the packaging method, the mirror
Head mould group 21 includes fixing seat, and the fixing seat is threadably secured with the supporting structure 22, therefore in the packaging method, can be with
First in the fixed supporting structure 22 in the surface of the package substrate 24, then passes through screw thread and fix institute on the supporting structure 22
State lens module 21.In other modes, the lens module 21 can also be directly fixedly installed on the package substrate 24
Supporting structure 22.
With reference to Figure 10-Figure 14, Figure 10-Figure 14 provides the encapsulation of fixed another image sensing chip for the embodiment of the present invention
The flow diagram of method, the packaging method be with above-mentioned packaging method difference, the packaging method further include:
Firstly, as shown in Figure 10, before installing the supporting structure 22, deviating from the shadow in the chip bonding region
As the fixed optical filter 25 in the side of sensing chip 23, the optical filter 25 covers the light passing window K.Optionally, can divide
The fixed optical filter 25 before cutting the package substrate 24.
Then, as shown in figure 11, the package substrate 24 is split.25 surface of optical filter is provided with antireflection
Layer.
Again as shown in figure 12, the second surface fixing rack structure 22 of the package substrate 24 after singulation.
Again as shown in figure 13, fixed lens mould group 21 is installed in the bracket result 22.At this point it is possible to be formed such as Fig. 3
Shown in encapsulating structure.
Finally, as shown in figure 14, binding circuit board 26.At this point it is possible to form encapsulating structure as shown in Figure 4.
Such as above-mentioned, the interconnection circuit further include: the third contact jaw of the second surface, the third contact is arranged in
End is for binding plug-in element；The third contact jaw pass through the second wired circuit for being arranged in the package substrate 24 with it is right
The first contact jaw 241 connection answered.At this point, the packaging method further include: before installing the supporting structure 22, described
The plug-in element is bound in chip bonding region, and the plug-in element is arranged in the second surface.
In the embodiment of the present invention, the production method of the image sensing chip 23 can as exemplified in figs, Figure 16-
Figure 18 is a kind of production method flow chart of image sensing chip provided in an embodiment of the present invention, which includes:
Firstly, as shown in Figure 16 and Figure 17, Figure 17 is figure 1 in the sectional drawing in the direction PP ', a wafer 43 is provided.Wafer
43 have multiple chip areas 42, and each chip area 42 is used to form an image sensing chip 23.Between chip area 42
With cutting channel 41.Matcoveredn 200 is arranged in 43 surface of wafer.
Then, the image sensing chip 23 can be formed to this hair by dividing the wafer 43 based on cutting channel 41.
Packaging method described in bright embodiment is used to form encapsulating structure described in above-described embodiment, and processing step is simple, production
It is at low cost, and can have preferable with lens module 21 described in accurate contraposition and the image sensing chip, the encapsulating structure of formation
Image quality.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For being encapsulated disclosed in embodiment
For method, since it is corresponding with encapsulating structure disclosed in embodiment, so being described relatively simple, related place is referring to envelope
Assembling structure corresponding part explanation.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (20)
1. a kind of encapsulating structure of image sensing chip, which is characterized in that the encapsulating structure includes:
Package substrate, the package substrate have opposite first surface and second surface, and through the first surface and
The light passing window of the second surface；The package substrate also has interconnection circuit, and the interconnection circuit is for connecting external electrical
Road；
Image sensing chip, the image sensing chip bonding cover the light passing window in the first surface；The shadow
As sensing chip has photosensitive region, the photosensitive region and light passing window face setting；
Supporting structure, the supporting structure are fixed on the second surface；
Lens module, the lens module is mounted on the supporting structure, and light passing window described in face.
2. encapsulating structure according to claim 1, which is characterized in that the interconnection circuit includes:
First contact jaw of the first surface is set, and first contact jaw is for connecting the external circuit；
Second contact jaw of the first surface is set, and second contact jaw is for connecting the image sensing chip, institute
The second contact jaw is stated to connect by the first wired circuit with first contact jaw.
3. encapsulating structure according to claim 2, which is characterized in that first wired circuit is arranged in first table
On face, or between the first surface and the second surface.
4. encapsulating structure according to claim 1, which is characterized in that the supporting structure includes:
First cylindrical sidewall, first cylindrical sidewall is fixed on the second surface, and surrounds the light passing window；
The lens module is fixed on the inside of first cylindrical sidewall；
Wherein, first cylindrical sidewall and binding that are equipped with the lens module have the envelope of the image sensing chip
It fills substrate and forms first annular seal space body.
5. encapsulating structure according to claim 4, which is characterized in that the supporting structure further include:
Second cylindrical sidewall, second cylindrical sidewall have top opening and bottom opening；
Binding has the package substrate of the image sensing chip to be located in second cylindrical sidewall；
The top opening of second cylindrical sidewall has roof, and the roof has and the outside of first cylindrical sidewall is solid
Fixed opening, the split ring is around the outside of first cylindrical sidewall；
The bottom opening is used for and circuit board is fixed, and the circuit board has the external circuit；
When the bottom opening and the fixed circuit board, second cylindrical sidewall and the circuit board form the second sealing
Cavity.
6. encapsulating structure according to claim 5, which is characterized in that the circuit board is PCB or FPC.
7. encapsulating structure according to claim 5, which is characterized in that second cylindrical sidewall is integrated with the roof
Molding structure；
Or, second cylindrical sidewall and the roof are separation unit, the roof is fixed on second cylindrical sidewall
Top opening.
8. encapsulating structure according to claim 1, which is characterized in that further include:
Optical filter between the lens module and the image sensing chip.
9. encapsulating structure according to claim 8, which is characterized in that the optical filter is fixed on the second surface, and
Cover the light passing window.
10. encapsulating structure according to claim 8, which is characterized in that further include that resisting for the optical filter surface is arranged in
Reflecting layer.
11. encapsulating structure according to claim 2, which is characterized in that the interconnection circuit further include:
The third contact jaw of the second surface is set, and the third contact jaw is for binding plug-in element；
The third contact jaw passes through the second wired circuit being arranged in the package substrate and connects with corresponding first contact jaw
It connects.
12. a kind of packaging method, which is characterized in that the packaging method includes:
A package substrate is provided, the package substrate has opposite first surface and second surface, the package substrate tool
There are multiple chip bonding regions, there is cutting channel, the chip bonding region between the two neighboring chip bonding region
With the light passing window for running through the first surface and the second surface, the chip bonding region also has interconnection circuit,
The interconnection circuit is for connecting external circuit；
The chip bonding region bind image sensing chip, the image sensing chip bonding in the first surface, and
Cover the light passing window；The image sensing chip has photosensitive region, the photosensitive region and the light passing window face
Setting；
Divide the package substrate based on the cutting channel, forms multiple isolated chip bonding regions, the chip bonding
Region binding has the image sensing chip；
Lens module, the lens module installation are set away from the side of the image sensing chip in the chip bonding region
On the supporting structure, and light passing window described in face, the supporting structure are fixed on the second surface.
13. packaging method according to claim 12, which is characterized in that the interconnection circuit includes: setting described the
First contact jaw on one surface, first contact jaw is for connecting the external circuit；It is arranged in the of the first surface
Two contact jaws, second contact jaw pass through the first wiring electricity for connecting the image sensing chip, second contact jaw
Road is connect with first contact jaw；
It is described the chip bonding region binding image sensing chip include: to connect the image sensing chip with described second
Contravention welding.
14. packaging method according to claim 13, which is characterized in that first wired circuit is arranged described first
On surface, or between the first surface and the second surface.
15. packaging method according to claim 12, which is characterized in that the supporting structure includes:
First cylindrical sidewall, first cylindrical sidewall is fixed on the second surface, and surrounds the light passing window；
The lens module is fixed on the inside of first cylindrical sidewall；
Wherein, first cylindrical sidewall and binding that are equipped with the lens module have the envelope of the image sensing chip
It fills substrate and forms first annular seal space body.
16. packaging method according to claim 15, which is characterized in that the supporting structure further include:
Second cylindrical sidewall, second cylindrical sidewall have top opening and bottom opening；
Binding has the package substrate of the image sensing chip to be located in second cylindrical sidewall；
The top opening of second cylindrical sidewall has roof, and the roof has and the outside of first cylindrical sidewall is solid
Fixed opening, the split ring is around the outside of first cylindrical sidewall；
The bottom opening is used for and circuit board is fixed, and the circuit board has the external circuit；
When the bottom opening and the fixed circuit board, second cylindrical sidewall and the circuit board form the second sealing
Cavity.
17. packaging method according to claim 15, which is characterized in that the packaging method further include:
Before installing the supporting structure, in the chip bonding region away from the fixed filter in the side of the image sensing chip
Mating plate, the optical filter cover the light passing window.
18. packaging method according to claim 17, which is characterized in that described in fixed before dividing the package substrate
Optical filter.
19. packaging method according to claim 17, which is characterized in that the optical filter surface is provided with anti-reflecting layer.
20. packaging method according to claim 13, which is characterized in that the interconnection circuit further include: be arranged described
The third contact jaw of second surface, the third contact jaw is for binding plug-in element；The third contact jaw is existed by setting
The second wired circuit in the package substrate is connected with corresponding first contact jaw；
The packaging method further include: before installing the supporting structure, bound in the chip bonding region described plug-in
Element, the plug-in element are arranged in the second surface.
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| CN201810832360.6A CN108933151B (en) | 2018-07-26 | 2018-07-26 | Packaging structure and packaging method of image sensing chip |
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|---|---|---|---|
| CN201810832360.6A CN108933151B (en) | 2018-07-26 | 2018-07-26 | Packaging structure and packaging method of image sensing chip |
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| CN108933151B CN108933151B (en) | 2024-02-13 |
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| CN110416241A (en) * | 2019-08-29 | 2019-11-05 | 苏州多感科技有限公司 | Encapsulating structure, Image Acquisition mould group and intelligent mobile phone terminal |
| WO2021196221A1 (en) * | 2020-04-03 | 2021-10-07 | 南昌欧菲光电技术有限公司 | Photosensitive assembly, camera module and electronic device |
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| CN108933151B (en) | 2024-02-13 |
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