CN110351460A - A kind of camera encapsulation module and its packaging method - Google Patents
A kind of camera encapsulation module and its packaging method Download PDFInfo
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- CN110351460A CN110351460A CN201910546279.6A CN201910546279A CN110351460A CN 110351460 A CN110351460 A CN 110351460A CN 201910546279 A CN201910546279 A CN 201910546279A CN 110351460 A CN110351460 A CN 110351460A
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- wiring board
- region
- sensing chip
- image sensing
- encapsulation module
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 230000003287 optical effect Effects 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims description 26
- 239000005304 optical glass Substances 0.000 claims description 7
- 238000013461 design Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims description 2
- 230000002787 reinforcement Effects 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 230000008878 coupling Effects 0.000 description 9
- 238000010168 coupling process Methods 0.000 description 9
- 238000005859 coupling reaction Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 241000218202 Coptis Species 0.000 description 6
- 235000002991 Coptis groenlandica Nutrition 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000003331 infrared imaging Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000010956 nickel silver Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000003319 supportive effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14634—Assemblies, i.e. Hybrid structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Studio Devices (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
Abstract
The present invention discloses a kind of camera encapsulation module and its packaging method, comprising: wiring board has each other relative first surface and the second surface, and the second surface is provided with multiple connection gaskets；Lens bracket, the lens bracket have support portion, and the support portion is connect with the first surface of the wiring board；Lens assembly is mounted on the lens bracket；Image sensing chip has front and the back side relative to each other, and front is provided with photosensitive region and the non-photo-sensing region around the photosensitive region, and the non-photo-sensing region is provided with multiple weld pads, and the weld pad and the connection gasket are electrically connected；The wiring board includes hardboard region and flexible board region, and the lens bracket and the image sensing chip are mounted on the hardboard region；The hardboard region of the wiring board is provided with window, and the window exposure photosensitive region forms optical path between the lens assembly and the image sensing chip.
Description
Technical field
The present invention relates to the encapsulation of semiconductor chip packaging technology more particularly to image sensing chip and camera lens assembled package
Mould group and its packaging method.
Background technique
In recent years, with the development of digital image processing techniques, people seal optical lens and image sensing chip portfolio
Dress, forms the camera encapsulation module of miniaturization.Camera encapsulation module is widely used in consumer digital product, such as mobile phone,
Laptop, toy, industrial detection, the fields such as automobile mounted camera and medical treatment make these products realize digital photographing/take the photograph
As function.
Prior art discloses a kind of camera module COB encapsulation schemes, referring to FIG. 1, specifically, COB encapsulation scheme
It is image sensing chip to be bonded together with circuit board by adhesive means, then pass through routing Wire bonding technology for shadow
It realizes and is electrically connected as sensing chip and circuit board, lens assembly is assembled into lens bracket, then uses adhesive means by camera lens
Bracket bonds on circuit boards, and optical path is formed between lens assembly and image sensor dice.Due to image sensing chip
Weld pad it is more and more intensive, spacing is also gradually approaching the limit, very intensive in this gold thread under Wire bonding technique
In the case where, it is easy to happen between gold thread and interferes, so as to cause fault.On the other hand, in entire manufacturing process, Wire
A series of such as lens bracket installation, the reliability that will all connect to gold thread will be also carried out after bonding technique
It impacts.Furthermore gold thread has certain camber, thus to increase to avoid gold thread usually in mould group one section it is additional
Highly, therefore, the presence of gold thread may hinder the miniaturization of mould group.
A kind of camera module CSP encapsulation scheme is also disclosed in the prior art, referring to FIG. 2, specifically, CSP encapsulation scheme
It is first to be packaged image sensing chip with glass, the patent CN201320010199.7 of our company can be referred to, then will
The packaging body of image sensing chip is welded to by surface mounting technology (Surface Mount Technology, abbreviation SMT)
On circuit board, lens assembly is assembled into lens bracket, is then bonded lens bracket on circuit boards using adhesive means, camera lens
Optical path is formed between component and image sensor dice.
To sum up, camera module COB encapsulation scheme and camera module CSP encapsulation scheme, camera encapsulation module
Size is big, is unfavorable for mould group Miniaturization Design.
Summary of the invention
The present invention provides a kind of camera encapsulation module and its packaging method, to solve existing camera encapsulation module size
Greatly, the problem of can not minimizing.
In order to solve the above-mentioned technical problem, a kind of camera encapsulation module of the present invention, comprising: wiring board has phase each other
Pair first surface and second surface, the second surface is provided with multiple connection gaskets；Lens bracket, the lens bracket tool
There is support portion, the support portion is connect with the first surface of the wiring board；Lens assembly is mounted on the lens bracket；
Image sensing chip, has front and the back side relative to each other, and front is provided with photosensitive region and around described photosensitive
The non-photo-sensing region in region, the non-photo-sensing region are provided with multiple weld pads, and the weld pad and the connection gasket are electrically connected；Institute
Stating wiring board includes hardboard region and flexible board region, and the lens bracket and the image sensing chip are mounted on described
Hardboard region；The hardboard region of the wiring board is provided with window, the window exposure photosensitive region, the lens assembly
Optical path is formed between the image sensing chip.
Preferably, stiffening plate is arranged in the second surface of the wiring board, and the stiffening plate is located at the hardboard region and not
The hardboard region is completely covered, the stiffening plate exposure image sensing chip, the support portion is on the wiring board
Projection be fully located at the stiffening plate in the projection on the wiring board.
Preferably, transparent substrates are provided on the first surface of the wiring board, the transparent substrates cover the window,
The transparent substrates are optical glass or infrared fileter.
Preferably, the top surface of the stiffening plate is higher by the back side of the image sensing chip.
Preferably, the wiring board includes the flexible circuit board being electrically connected with each other and rigid wiring board, the hard rays
The overlapping region that road plate and the flexible circuit board stack forms the hardboard region of the wiring board, the flexible circuit board its
His region is flexible board region.
Preferably, the wiring board is designed using differential lines route.
The present invention also provides a kind of packaging methods of camera encapsulation module, comprising the following steps: provides wiring board, has
Each other relative first surface and the second surface, the second surface are provided with multiple connection gaskets, and the wiring board includes hard
The hardboard region in plate region and flexible board region, the wiring board is provided with window；Image sensing chip, the image are provided
Sensing chip has front and the back side relative to each other, and front is provided with photosensitive region and around the photosensitive region
Non-photo-sensing region, the non-photo-sensing region are provided with multiple weld pads；Lens bracket and lens assembly, the lens bracket are provided
With support portion, the lens assembly is mounted on the lens bracket；The upside-down mounting image on the second surface of the wiring board
Sensing chip, so that the window exposure photosensitive region, and the weld pad and the connection gasket are electrically connected；In the line
Lens bracket is installed on the first surface of road plate, connect the support portion with the first surface of the wiring board and the camera lens
Optical path is formed between component and the image sensing chip.
Preferably, stiffening plate is arranged in the second surface of the wiring board, and the stiffening plate is located at the hardboard region and not
The hardboard region is completely covered, the stiffening plate exposure image sensing chip, the support portion is on the wiring board
Projection be fully located at the stiffening plate in the projection on the wiring board.
Preferably, before upside-down mounting image sensing chip, transparent substrates, institute are bonded on the first surface of the wiring board
It states transparent substrates and covers the window, the transparent substrates are optical glass or infrared fileter.
Preferably, the top surface of the stiffening plate is higher by the back side of the image sensing chip.
Preferably, the wiring board includes the flexible circuit board being electrically connected with each other and rigid wiring board, the hard rays
The overlapping region that road plate and the flexible circuit board stack forms the hardboard region of the wiring board, the flexible circuit board its
His region is flexible board region.
Preferably, the wiring board is designed using differential lines route.
Image sensing chip and lens bracket by being respectively set the two sides of assist side by the present invention, by wiring board
Thickness is contained between camera lens and the optical path of image sensing chip, reduces the integral thickness and width of camera encapsulation module
Degree realizes the miniaturization of camera encapsulation module.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of prior art camera module COB encapsulation scheme；
Fig. 2 is the structural schematic diagram of prior art camera module CSP encapsulation scheme；
Fig. 3 is the structural schematic diagram of the preferred embodiment of the present invention camera encapsulation module；
Fig. 4 is the structural representation that transparent substrates are installed in the preferred embodiment of the present invention camera encapsulation module packaging method
Figure；
Fig. 5 is the structure that image sensing chip is installed in the preferred embodiment of the present invention camera encapsulation module packaging method
Schematic diagram；
Fig. 6 is the structural representation that lens bracket is installed in the preferred embodiment of the present invention camera encapsulation module packaging method
Figure；
Fig. 7 is the structural representation of installs connector in the preferred embodiment of the present invention camera encapsulation module packaging method
Figure；
Specific embodiment
Technical solution of the present invention is described in further detail with reference to the accompanying drawing, it is clear that described embodiment is this hair
Bright a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not having
Every other embodiment obtained under the premise of creative work is made, the range of invention protection is belonged to.
In the accompanying drawings, for ease of description, thickness, the size and shape of object are slightly exaggerated.Attached drawing is merely illustrative
And it is and non-critical drawn to scale.
It will also be appreciated that term " comprising ", " including ", " having ", "comprising" and/or " including ", when in this theory
In bright book use when indicate exist stated feature, entirety, step, operations, elements, and/or components, but do not exclude the presence of or
It is attached with one or more of the other feature, entirety, step, operation, component, assembly unit and/or their combination.
Referring to FIG. 3, being the preferred embodiment of the present invention, a kind of camera encapsulation module 1 can be applied to various
Electronic equipment illustrates but is not limited to smart phone, wearable device, computer equipment, television set, the vehicles, camera, monitoring
Device etc., the camera encapsulation module cooperate the electronic equipment to realize the Image Acquisition to target object and reproduce function
Energy.
Camera encapsulation module 1 in the present embodiment includes: wiring board 10, has each other relative first surface and the
Two surfaces, second surface are provided with multiple connection gaskets 101；Lens bracket 20, lens bracket 20 have support portion 21, support portion 21
It is connect with the first surface of wiring board 10；Lens assembly 30 is mounted on lens bracket 20；Image sensing chip 40 has that
This opposite front 41 and the back side 42, front 41 are provided with photosensitive region and the non-photo-sensing area around the photosensitive region
Domain, non-photo-sensing region are provided with multiple weld pads 401, and weld pad 401 and connection gasket 101 are electrically connected；Wiring board 10 includes hardboard area
Domain and flexible board region, lens bracket 20 and image sensing chip 40 are mounted on hardboard region；The hardboard area of wiring board 10
Domain is provided with window 102, the photosensitive region of the exposure image sensing chip 40 of window 102, lens assembly 30 and image sensing chip
Optical path is formed between 40.
Image sensing chip 40 is a kind of device for converting optical signals to electric signal, and image sensing chip 40 can be
CCD (Charge-coupled Device, charge coupled cell) image sensing chip or CMOS (Complementary
Metal-Oxide Semiconductor, complementary metal oxide semiconductor) image sensing chip.
In this present embodiment, wiring board 10 is a kind of flexible circuit board 13 (alternatively referred to as soft board, i.e. FPC plate) and hard rays
Road plate 14 (the rigid wiring board of alternatively referred to as hardboard, i.e. pcb board or ceramics), by processes such as pressings, by related process requirement group
It is combined.Flexible circuit board 13 and rigid wiring board 14 are electrically connected, and the region of the two overlapping is hardboard region, currently, should
Comparative maturity, the wiring board relative to other techniques such as ceramic substrate have biggish cost to the manufacture craft of kind wiring board
Advantage.Hardboard region can be understood as the area for being rendered as rigidity (inflexibility at normal temperature) on the whole in Rigid Flex
Domain, i.e. flexible circuit board 13 region Chong Die with rigid wiring board 14, flexible board region can be understood as in Rigid Flex
Not with rigid wiring board 14 Chong Die other areas are rendered as in the region i.e. flexible circuit board 13 of flexible (i.e. flexible) on the whole
Domain.
Window 102 is the through-hole for penetrating flexible circuit board 13 and rigid wiring board 14.
Preferably, in the present embodiment, wiring board is designed using differential lines route, camera module compared with the prior art
COB encapsulation scheme, wiring board strong antijamming capability of the invention work as the external world because the coupling between two difference cablings is fine
There are when noise jamming, almost it is coupled in two lines simultaneously, and the difference for only two signals that receiving end is concerned about, so
Extraneous common-mode noise can be cancelled completely.And due to the coupling of differential lines, it can effectively inhibit EMI, due to two signals
Polarity on the contrary, they can cancel out each other to the electromagnetic field of external radiation, coupling it is closer, be released to extraneous electromagnetic energy and get over
It is few.
In this present embodiment, connector can be set in flexible board region and hardboard region is electrically connected to company to realize
Device is connect, to be electrically connected with the mainboard of terminal device (such as mobile phone).
Compared to the electric connection mode for using wire bond in COB encapsulation scheme, in the present embodiment on wiring board 10
Connection gasket 101 can be closer to photosensitive region.Help to reduce total face that image sensing chip 40 and wiring board 10 are electrically connected
Product, and then be conducive to the Miniaturization Design of camera encapsulation module.
Metal coupling is set in the connection gasket 101 of assist side 10 and 401 one of both of weld pad of image sensing chip 40,
For realizing the electric connection between connection gasket 101 and weld pad 401.
In this present embodiment, by one layer photoresist layer of spin coating on the second surface of assist side 10, then by exposure,
Copper is planted in development, and copper bump 1011 is formed on connection gasket 101.Metal coupling and weldering are realized using the suitable technique such as ultrasonic bond
Pad 401 is electrically connected.
Metal coupling be also possible to be by composition metal image sensing chip the electroplated technique of positive weld pad 401
It is made.It can be copper and tin material, or copper silver, copper and tin silver, cuprum-nickel-stannum, cupro-nickel silver, the materials such as cuprum-nickel-stannum silver.
Coat of metal is deposited between the positive weld pad 401 of image sensing chip 40 and the metal coupling.Specifically,
The coat of metal provides seed layer for plating metal convex block.The coat of metal can be titanium and copper material.
Further, nickel, palladium, gold, tin cream or conductive silver can be adhered on metal coupling, such as the top surface of copper bump
The conductive attachments material such as glue passes through the conductive attachment material of the attachment between the weld pad 401 and metal coupling of image sensing chip 40
The connection (such as welding or pressing) realizing conducting, while being also convenient between weldering electricity 401 and connection gasket 101.Connection gasket 101 and weldering
The electric connection mode present invention of pad 401 is with no restrictions.
In another embodiment, golden convex block is formed on the weld pad 401 of image sensing chip 40.
In this present embodiment, assist side 10 second surface be arranged stiffening plate 50, stiffening plate 50 be located at hardboard region and
Hardboard region described in endless all standing, the exposure image sensing chip 40 of stiffening plate 50.Stiffening plate mainly to lens bracket 20 with
And lens assembly 30 plays a supportive role.Therefore, at least, the complete position of projection in 21 assist side 10 of support portion of lens bracket 20
In in the projection in 50 assist side 10 of stiffening plate.
Other electronic components can be set on wiring board 10, above-mentioned electronic component can be capacitor, resistance or electricity
Sense.Above-mentioned electronic component can be set on the first surface of assist side 10, and be arranged in around window 102.Capacitor etc.
Electronic component can be used for eliminating the interference signal of some routes.
Stiffening plate can be the good sheet materials of heat dissipation performances such as steel disc.
In this present embodiment, stiffening plate 50 with a thickness of 0.1mm, in order to assemble the convenience of lens bracket 20, the present embodiment
In, the top surface that the thickness of stiffening plate 50 needs to meet stiffening plate 50 is higher by the back side of the image sensing chip 40.In this way, pacifying
When filling lens bracket 20, can directly it be supported with stiffening plate 50 without damaging image sensing chip.
In the present embodiment, lens bracket 20 is equipped with internal thread through hole, and lens assembly 30 is equipped with external screw thread, lens assembly 30
It is detachably connected by the internal thread through hole of external screw thread and lens bracket 20.
Transparent substrates 60 are provided on the first surface of wiring board 10, transparent substrates 60 cover window 102.
Preferably, transparent substrates 60 are optical glass, and transmissivity is 90% or bigger, preferably 95% or bigger.It can
With the plated film on optical glass, make transparent substrates that there are more functions.Such as by pasting or being coated in shape on optical glass
At IR optical filter, for shielding the light with the wavelength corresponding to infrared ray.
In other embodiments, it is directly infrared fileter that transparent substrates, which can be,.
Transparent substrates 60 are used to prevent the photosensitive region of the image sensing chip contaminated and improve camera encapsulation
The optical property of mould group.
Camera encapsulation module 1 can be by visual light imaging visual light imaging mould group (including color image imaging
Mould group and black white image imaging modules), it is also possible to the infrared imaging mould group by infrared imaging.The present invention is with no restrictions.
The present invention also provides a kind of packaging methods of camera module, comprising the following steps:
Wiring board 10 as described above is provided.
Image sensing chip 40 as described above is provided, in the present embodiment, first passes through grinding and cutting and divides full wafer wafer
At single crystal grain, the single crystal grain, that is, image sensing chip 40.
Lens bracket 20 and lens assembly 30 as described above are provided, lens assembly 30 is installed on and lens bracket 20
On；The periphery of the lens assembly 30 is also provided with motor sub-assembly, and the automatic focusing function of lens assembly 30 may be implemented.It answers
When understanding, camera encapsulation module of the invention can be used for cameras with fixed focus encapsulation module and autozoom camera envelope
Die-filling group, with no restriction.
Transparent substrates 60 are bonded on the first surface of assist side 10, transparent substrates 60 cover the window.In this step
In, using dispenser dispensing, reuses bonding chip machine and attach to transparent substrates 60 on the window 102 of wiring board 10, so
Afterwards by baking-curing, and clean up.
Using transparent substrates 60 as loading plate, upside-down mounting image sensing chip 40, image on the second surface of assist side 10
The photosensitive region of sensing chip 40 is corresponding with 102 position of window of wiring board 10, and weld pad 401 and connection gasket 101 are electrically connected.
Image sensing chip 40 and the connection gasket 101 of wiring board 10 are weldingly connected by the way of flip chip bonding, the thickness of wiring board 10
It is arranged between lens assembly 30 and the optical distance of image sensing chip 40, so as to greatly reduce camera encapsulation module
Overall thickness；The gap filling of wiring board 10 and 40 weld of image sensing chip is reinforced into company between the two with filling glue again
Intensity is connect, and protection is sealed to the photosensitive region of image sensing chip 40, avoids the pollution of dust particles.
In other embodiments, anisotropic conductive adhesive, ultrasonic bonding, heat can be passed through between weld pad 401 and connection gasket 101
Pressure welding connects or the modes such as Reflow Soldering realize conducting.
Due to being that image sensing chip 40 is attached directly on the second surface of wiring board 10, pass through metal between the two
Salient point, which is realized, to be electrically connected, compared to wire bonding connection type, wiring board 10 and image sensing under this reverse installation process
The circuit conducting length of chip 40 greatly shortens, and reduces delay, effectively improves electrical property.On the other hand, with light transmission base
Plate 60 is used as loading plate, and the flatness of transparent substrates 60 is good, intensity is not high flexible.
Compared to such as wire bonding encapsulation scheme, the present invention no longer needs to consider electronic component layout and routing space,
Reduce size of the camera module on the direction X/Y.In this way, having reached the mesh for further decreasing the size of camera encapsulation module
, realize the miniaturization of camera module.
Then, using stiffening plate 50 as support, lens bracket 20 is installed on the first surface of assist side 10, makes support portion
21 and wiring board 10 first surface connection and form optical path between lens assembly 30 and image sensing chip 40.
Lens assembly 30 and transparent substrates 60 are sequentially located on the photosensitive path of image sensing chip 40, it can be understood as mirror
The optical axis of head assembly 30 and the optical axis coincidence of image sensing chip 40, the optical axis of transparent substrates 60 and the light of image sensing chip 40
Overlapping of axles.The coincidence that the present invention mentions can be understood as being overlapped or there are certain gaps, such as 40 optical axis of image sensing chip
With the optical axis of the optical axis and lens assembly 30 of the optical axis coincidence of lens assembly 30 or image sensing chip 40 there are certain gap,
The gap in a certain range, meets the optical performance requirements of entire camera encapsulation module.
When installing lens bracket 20, the product after upside-down mounting image sensing chip 40 is cleaned, to lens assembly
30 and lens bracket 20 cleaned, then, lens bracket 20 is aligned to and is covered image sensing chip 40, lens bracket 20
Support portion 21 by glue paste assist side 10 first surface on, and by baking processing procedure make glue curing.
Further comprising the steps of in the packaging method of the present embodiment, the flexible board region of assist side 10 disposes connection
Device 70.
Image sensing chip and lens bracket by being respectively set the two sides of assist side by the present invention, by wiring board
Thickness is contained between camera lens and the optical path of image sensing chip, reduces the integral thickness and width of camera encapsulation module
Degree realizes the miniaturization of camera encapsulation module.
The present invention is exemplarily described above in conjunction with attached drawing, it is clear that the present invention implements not by aforesaid way
Limitation, as long as use technical solution of the present invention carry out various unsubstantialities improvement, or it is not improved will be of the invention
Conception and technical scheme directly apply to other occasions, within the scope of the present invention.
Claims (12)
1. a kind of camera encapsulation module characterized by comprising
Wiring board, has each other relative first surface and the second surface, and the second surface is provided with multiple connection gaskets；
Lens bracket, the lens bracket have support portion, and the support portion is connect with the first surface of the wiring board；
Lens assembly is mounted on the lens bracket；
Image sensing chip, has front and the back side relative to each other, and front is provided with photosensitive region and around described
The non-photo-sensing region of photosensitive region, the non-photo-sensing region are provided with multiple weld pads, and the weld pad electrically connects with the connection gasket
It connects；
The wiring board includes hardboard region and flexible board region, and the lens bracket and the image sensing chip are installed
In the hardboard region；
The hardboard region of the wiring board is provided with window, the window exposure photosensitive region, the lens assembly and institute
It states and forms optical path between image sensing chip.
2. camera encapsulation module as described in claim 1, which is characterized in that reinforcement is arranged in the second surface of the wiring board
Plate, the stiffening plate are located at hardboard region described in the hardboard region and endless all standing, the stiffening plate exposure image
Sensing chip, projection of the support portion on the wiring board are fully located at projection of the stiffening plate on the wiring board
It is interior.
3. camera encapsulation module as described in claim 1, which is characterized in that be provided on the first surface of the wiring board
Transparent substrates, the transparent substrates cover the window, and the transparent substrates are optical glass or infrared fileter.
4. camera encapsulation module as described in claim 1, which is characterized in that the top surface of the stiffening plate is higher by the image
The back side of sensing chip.
5. camera encapsulation module as described in claim 1, which is characterized in that the wiring board includes being electrically connected with each other
The overlapping region that flexible circuit board and rigid wiring board, the hardness wiring board and the flexible circuit board stack forms the line
The hardboard region of road plate, other regions of the flexible circuit board are flexible board region.
6. camera encapsulation module as described in claim 1, which is characterized in that the wiring board is set using differential lines route
Meter.
7. a kind of packaging method of camera encapsulation module, which is characterized in that
Wiring board is provided, there are each other relative first surface and the second surface, the second surface is provided with multiple connections
Pad, the wiring board include hardboard region and flexible board region, and the hardboard region of the wiring board is provided with window；
Image sensing chip is provided, the image sensing chip has front and the back side relative to each other, and front is provided with
Photosensitive region and non-photo-sensing region around the photosensitive region, the non-photo-sensing region is provided with multiple weld pads；
Lens bracket and lens assembly are provided, the lens bracket has support portion, and the lens assembly is mounted on the mirror
On head bracket；
The upside-down mounting image sensing chip on the second surface of the wiring board, so that the window exposure photosensitive region, and
The weld pad and the connection gasket are electrically connected；
Lens bracket is installed on the first surface of the wiring board, connects the first surface of the support portion and the wiring board
It connects and forms optical path between the lens assembly and the image sensing chip.
8. the packaging method of camera encapsulation module as claimed in claim 7, which is characterized in that the second table of the wiring board
Stiffening plate is arranged in face, and the stiffening plate is located at hardboard region described in the hardboard region and endless all standing, and the stiffening plate is sudden and violent
Reveal the image sensing chip, projection of the support portion on the wiring board is fully located at the stiffening plate in the route
In projection on plate.
9. the packaging method of camera encapsulation module as claimed in claim 7, which is characterized in that in upside-down mounting image sensing chip
Before, transparent substrates are bonded on the first surface of the wiring board, the transparent substrates cover the window, the light transmission base
Plate is optical glass or infrared fileter.
10. the packaging method of camera encapsulation module as claimed in claim 7, which is characterized in that the top surface of the stiffening plate
It is higher by the back side of the image sensing chip.
11. the packaging method of camera encapsulation module as claimed in claim 7, which is characterized in that the wiring board includes phase
The flexible circuit board being mutually electrically connected and rigid wiring board, the hardness wiring board are overlapped area with what the flexible circuit board stacked
Domain forms the hardboard region of the wiring board, other regions of the flexible circuit board are flexible board region.
12. the packaging method of camera encapsulation module as claimed in claim 7, which is characterized in that the wiring board is using poor
The design of separated time route.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910546279.6A CN110351460A (en) | 2019-06-22 | 2019-06-22 | A kind of camera encapsulation module and its packaging method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910546279.6A CN110351460A (en) | 2019-06-22 | 2019-06-22 | A kind of camera encapsulation module and its packaging method |
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| CN110351460A true CN110351460A (en) | 2019-10-18 |
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|---|---|---|---|
| CN201910546279.6A Pending CN110351460A (en) | 2019-06-22 | 2019-06-22 | A kind of camera encapsulation module and its packaging method |
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