CN112887542A

CN112887542A - Electronic device

Info

Publication number: CN112887542A
Application number: CN202110083437.6A
Authority: CN
Inventors: 李茂兴; 周威
Original assignee: Vivo Mobile Communication Co Ltd
Current assignee: Vivo Mobile Communication Co Ltd
Priority date: 2021-01-21
Filing date: 2021-01-21
Publication date: 2021-06-01
Anticipated expiration: 2041-01-21
Also published as: CN112887542B

Abstract

The application discloses an electronic device, which belongs to the technical field of communication devices. The electronic device includes a first bracket and an optical module; the first bracket is provided with a first accommodating space; the optical module includes a lens assembly, a support part and a photosensitive chip, and the support The part includes a support and a bearing protrusion, the support is connected with the bearing protrusion, the support has a light-transmitting area, the lens assembly and the bearing protrusion are respectively located on both sides of the support, the lens assembly is arranged on the support, and the lens assembly is connected to the support. The light-transmitting areas are arranged oppositely, the photosensitive chip is connected to the bearing protrusion, and the photosensitive chip and the light-transmitting area are arranged opposite to each other; the support member is overlapped on the surface of the first bracket, and at least part of the bearing protrusion and the photosensitive chip are located in the first container within the space. The above solution can solve the problem of the large thickness of the electronic device.

Description

Electronic device

Technical Field

The application belongs to the technical field of communication equipment, and particularly relates to electronic equipment.

Background

With the rapid development of electronic devices, the electronic devices are more and more widely used, and electronic devices such as mobile phones and tablet computers play more and more roles in the aspects of work, life, entertainment and the like of people. Electronic devices generally have functions such as shooting and fingerprint recognition, and further can meet the use requirements. The above-mentioned function of electronic equipment is realized by corresponding camera module and fingerprint module isotructure usually.

In the correlation technique, in order to realize the stable installation of optical module such as camera module or fingerprint, electronic equipment is provided with the installing support, and optical module supports on the installing support to realize electronic equipment's stable installation.

In the process of implementing the invention, the inventor finds that in the related art, the optical module is stacked on the mounting bracket, so that the stacking thickness of the optical module and the mounting bracket is larger, and further the thickness of the electronic device is larger.

Disclosure of Invention

An object of the embodiments of the present application is to provide an electronic device, which can solve the problem of a large thickness of the electronic device.

In order to solve the technical problem, the present application is implemented as follows:

an embodiment of the present application provides an electronic device, including:

the first bracket is provided with a first accommodating space;

the optical module comprises a lens component, a supporting part and a photosensitive chip, wherein the supporting part comprises a supporting part and a bearing bulge, the supporting part is connected with the bearing bulge, the supporting part is provided with a light transmission area, the lens component and the bearing bulge are respectively positioned at two sides of the supporting part, the lens component is arranged on the supporting part, the lens component and the light transmission area are oppositely arranged, the photosensitive chip is connected with the bearing bulge, and the photosensitive chip and the light transmission area are oppositely arranged;

the supporting piece is lapped on the surface of the first support, and at least part of the bearing bulge and the photosensitive chip are both positioned in the first accommodating space.

In the embodiment of the application, the first bracket is provided with the accommodating space, the supporting part comprises the supporting part and the bearing bulge, the bearing bulge is used for supporting the photosensitive chip, and the supporting part is lapped on the surface of the first bracket, so that the optical module and the first bracket are installed. In this scheme, bear bellied at least part and photosensitive chip all be located first accommodation space to make optical module's part hide in first support, and then reduced first support and optical module's pile up the height, make electronic equipment's thickness less, and then help promoting electronic equipment's lightness and thinness nature.

Drawings

Fig. 1 is a schematic structural diagram of a first electronic device disclosed in an embodiment of the present application;

fig. 2 is a schematic partial structural diagram of a first electronic device disclosed in an embodiment of the present application;

fig. 3 is a schematic structural diagram of a second electronic device disclosed in an embodiment of the present application;

fig. 4 is a front view of a first support part in the electronic device disclosed in the embodiment of the present application;

fig. 5 is a bottom view of a first support portion in an electronic device disclosed in an embodiment of the present application;

fig. 6 is a cross-sectional view of a first support portion in an electronic device disclosed in an embodiment of the present application;

fig. 7 is a front view of a second support part in the electronic device disclosed in the embodiment of the present application;

fig. 8 is a bottom view of a second support portion in an electronic device disclosed in an embodiment of the present application.

Description of reference numerals:

100-first bracket, 110-first accommodating space, 120-accommodating concave part,

200-optical module, 210-lens assembly, 220-supporting part, 221-supporting part, 2211-light-transmitting area, 222-bearing projection, 230-photosensitive chip, 240-reinforcing plate, 250-circuit board, 260-second accommodating space,

300-a second bracket, 310-a mounting hole,

410-a battery cover, 420-a middle frame,

500-display module.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.

The electronic device provided by the embodiment of the present application is described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.

Referring to fig. 1 to 8, an embodiment of the present application discloses an electronic apparatus, which includes a first bracket 100 and an optical module 200.

The first bracket 100 is used for mounting the optical module 200, and the first bracket 100 is provided with a first accommodating space 110.

The optical module 200 includes a lens assembly 210, a supporting portion 220, and a photo sensor chip 230. The supporting portion 220 provides a mounting position for other components of the optical module 200, and the supporting portion 220 is also used for assembling the optical module 200 with the first bracket 100.

The supporting portion 220 includes a supporting member 221 and a bearing protrusion 222, and the supporting member 221 is connected to the bearing protrusion 222. The support 221 has a light-transmitting area 2211. Lens assembly 210 and bearing projection 222 are located on either side of support member 221. The lens assembly 210 is disposed on the supporting member 221, and the lens assembly 210 is disposed opposite to the light-transmitting area 2211. The photosensitive chip 230 is connected to the bearing protrusion 222, and the photosensitive chip 230 is disposed opposite to the light-transmitting area 2211, that is, the lens assembly 210 and the photosensitive chip 230 are respectively located at two opposite sides of the supporting member 221, and the bearing protrusion 222 and the photosensitive chip 230 are located at the same side of the supporting member 221.

The supporting member 221 is attached to a surface of the first bracket 100. The supporting member 221 is used for carrying the lens assembly 210 and assembling the optical module 200 with the first bracket 100. At least a portion of the bearing protrusion 222 and the photosensitive chip 230 are located in the first receiving space 110. At this time, the supporting member 221 is located outside the first accommodating space 110, the supporting member 221 covers the opening position of the first accommodating space 110, and the portion of the supporting member 221 protruding with respect to the first accommodating space 110 overlaps the surface of the first bracket 100, that is, the portion of the supporting member 221 protruding with respect to the bearing projection 222 overlaps the surface of the first bracket 100.

Alternatively, the supporting member 221 and the first bracket 100 may be connected by bonding, screwing, clipping, etc., although other connecting methods may be adopted, which is not limited herein.

In the operation process of the optical module 200, light in the external environment enters the optical module 200 through the lens assembly 210, and the light passes through the light-transmitting area 2211 and then enters the photo sensor chip 230, so as to be converted into image information. Optionally, the photosensitive chip 230 may be a high-resolution photosensitive chip, so that the optical module 200 has better performance, and thus the electronic device has better user experience. The photo-sensing chip 230 may be a Complementary Metal Oxide Semiconductor (CMOS) imaging chip.

Optionally, the optical module 200 may be at least one of a camera module and a fingerprint identification module, so as to implement the shooting and fingerprint identification functions of the electronic device.

In the embodiment disclosed in the present application, at least a portion of the bearing protrusion 222 and the photo chip 230 are both located in the first accommodating space 110, so that a portion of the optical module 200 is hidden in the first bracket 100, and further the stacking height of the first bracket 100 and the optical module 200 is reduced, so that the thickness of the electronic device is small, and the improvement of the thinness of the electronic device is facilitated.

Meanwhile, the supporting portion 220 may be directly attached to the first bracket 100, so that the electronic device may be assembled in a simple and reliable manner.

In the above embodiment, the edge of the photo sensor chip 230 may be connected to the supporting bump 222, and at this time, the photo sensor chip 230 is in a floating state, so that the photo sensor chip 230 is easily damaged. In another alternative embodiment, the optical module 200 may further include a stiffener 240, and the stiffener 240 may be disposed at an end of the bearing protrusion 222 facing away from the supporting member 221. The photo chip 230 may be disposed on the stiffener 240, and the photo chip 230 may be located between the stiffener 240 and the support 221. In this scheme, reinforcing plate 240 is used for supporting sensitization chip 230 to the intensity of sensitization chip 230 has been strengthened, sensitization chip 230 sets up on reinforcing plate 240 in addition, thereby makes sensitization chip 230 be difficult to contact with other parts of electronic equipment, thereby can prevent sensitization chip 230 to damage, and then can improve optical module 200's reliability.

Alternatively, the reinforcing plate 240 and the bearing protrusion 222 may be connected by bonding, for example, a double-sided adhesive tape is used to bond the reinforcing plate 240 and the bearing protrusion 222, and meanwhile, the reinforcing plate 240 may be a steel plate with a thickness of 0.1 mm, or a reinforcing plate 240 with other thickness and other materials may be used.

In the above embodiment, the optical module 200 may further include a circuit board 250, the circuit board 250 is electrically connected to the photosensitive chip 230, the photosensitive chip 230 is electrically connected to a motherboard of the electronic device through the circuit board 250, and the photosensitive chip 230 converts the received optical signal into an electrical signal and transmits the electrical signal to the motherboard of the electronic device through the circuit board 250.

In the above embodiment, the edge of the circuit board 250 may be fixed on the inner sidewall of the first accommodating space 110, and at this time, the circuit board 250 is in a suspended state, so that the circuit board 250 is easily damaged by bending, and meanwhile, the circuit board 250 also bears a part of the weight of the optical module 200, so that the circuit board 250 is subjected to a larger pressure, and the circuit board 250 is further damaged.

Based on this, in another alternative embodiment, the circuit board 250 may be located in the first receiving space 110, and the photosensitive chip 230, the circuit board 250, and the reinforcing plate 240 are sequentially stacked. In this scheme, the reinforcing plate 240 is used to support the circuit board 250, thereby enhancing the strength of the circuit board 250, and the circuit board 250 is disposed on the reinforcing plate 240, thereby preventing the circuit board 250 from being damaged and further improving the reliability of the optical module 200, because the circuit board 250 is not easily contacted with other components of the electronic device.

In addition, the circuit board 250 is supported by the reinforcing plate 240, so that the pressure applied to the circuit board 250 is only the gravity of the photosensitive chip 230, and the photosensitive chip 230 has a small mass and a small gravity, so that the circuit board 250 is not damaged by pressure, and the safety of the optical module 200 is further improved.

Alternatively, the circuit board 250 may be a rigid circuit board or a flexible circuit board, and the thickness of the circuit board 250 may be 0.35 mm. Of course, other configurations may be used, and are not limited herein.

As shown in fig. 4 to 6, in the present application, a specific structure of the supporting portion 220 is disclosed, the bearing protrusion 222 may be an annular structure, and the bearing protrusion 222 may be disposed around the light-transmitting area 2211. The bearing protrusion 222, the supporting member 221 and the reinforcing plate 240 may enclose a second receiving space 260, and at this time, the photosensitive chip 230 may be located in the second receiving space 260. In this scheme, the photosensitive chip 230 is hidden in the second accommodating space 260, so that the photosensitive chip 230 is not easily collided with other components in the assembling process of the optical module 200, thereby further improving the safety of the photosensitive chip 230.

In addition, the bearing protrusion 222 is of an annular structure, so that the light leakage phenomenon is not easily generated at the connection side of the bearing protrusion 222 and the reinforcing plate 240, and further the imaging of the photosensitive chip 230 is not easily affected, and the optical performance of the optical module 200 is improved.

In addition, the second accommodating space 260 is enclosed by the bearing protrusion 222, the supporting member 221 and the reinforcing plate 240, so that the photosensitive chip 230 is not easily contacted with dust and water vapor, the photosensitive chip 230 is further prevented from being damaged, and the safety and reliability of the optical module 200 are further improved.

The supporting portion 220 may have other structures, as shown in fig. 7 and 8, the number of the bearing protrusions 222 is two, two bearing protrusions 222 are oppositely disposed on two opposite sides of the light-transmitting area 2211, and at this time, the reinforcing plate 240 is connected to the two bearing protrusions 222. Of course, the supporting portion 220 is not limited to the two structures described herein, and may also be other structures, which are not limited herein.

In order to enable the optical module 200 to be more reliably assembled in the electronic device, in another optional embodiment, the electronic device disclosed in this application may further include a second bracket 300, a side of the lens assembly 210 facing away from the support 221 may be provided with a limiting surface, and the second bracket 300 and the limiting surface may be in limiting fit along the optical axis direction of the lens assembly 210. In this scheme, the lens assembly 210 is clamped between the first bracket 100 and the second bracket 300, and the first bracket 100 and the second bracket 300 mechanically limit the lens assembly 210, so that the lens assembly 210 can be prevented from moving, and the optical module 200 can be more reliably assembled in the electronic device.

In addition, the first bracket 100 and the second bracket 300 mechanically limit the lens assembly 210, so that the first bracket 100, the second bracket 300 and the optical module 200 bracket do not need to be provided with other connecting structures, and the electronic equipment is simple and convenient to assemble and disassemble.

Optionally, the lens assembly 210 may include a lens housing and a lens, the lens is disposed in the lens housing, the limiting surface is disposed on the lens housing, and the limiting surface is disposed around the lens. Of course, the lens assembly 210 may have other configurations, and is not limited herein.

Further, the second bracket 300 may be opened with a mounting hole 310, and at least a portion of the lens assembly 210 may be located in the mounting hole 310. In this embodiment, at least a portion of the lens assembly 210 is hidden in the mounting hole 310, so that the stacking height of the second bracket 300 and the lens assembly 210 is reduced, and the thickness of the electronic device is further reduced.

Optionally, the mounting hole 310 may be a stepped hole, and the limiting surface may be in limiting fit with the stepped surface of the stepped hole, although the mounting hole 310 may also have other shapes, which is not limited herein.

In another alternative embodiment, the first receiving space 110 may be a receiving groove, i.e., a non-penetrating way opened on the first bracket 100, so as to ensure the strength of the first bracket 100. At this time, a gap is formed between the bottom wall of the accommodating recess and the above-mentioned reinforcing plate 240, that is, the bottom wall of the accommodating recess is not in contact with the reinforcing portion, so as to prevent the first bracket 100 from pressing the reinforcing plate 240, thereby protecting the optical module 200 from being damaged. Alternatively, the distance between the reinforcing plate 240 and the bottom wall may be 0.2mm, but may be other values, which is not limited herein.

Or, in another alternative embodiment, the first receiving space 110 may be a receiving hole, that is, a receiving hole is formed in the second bracket 300 in a penetrating manner, so that the thickness of the electronic device can be further reduced while ensuring that the strength of the first bracket 100 is sufficient for use.

The first bracket 100 includes a first surface and a second surface that are opposite to each other, the first surface is connected to the supporting member 221, and the reinforcing plate 240 and the second surface have a gap, that is, the bottom of the first bracket 100 may protrude out of the bottom of the camera module, so as to prevent the battery cover 410 or the middle frame 420 from pressing on the reinforcing plate 240, so as to protect the optical module 200 from being damaged easily. Alternatively, the distance between the reinforcing plate 240 and the second surface may be 0.2mm, but may be other values, which is not limited herein.

In order to further reduce the thickness of the electronic device, in another alternative embodiment, the first bracket 100 may be provided with an accommodating recess 120, and the accommodating recess 120 may be disposed around the first accommodating space 110. The receiving recess 120 may communicate with the first receiving space 110, and at least a portion of the support member 221 is located in the first receiving space 110. At this time, the receiving recess 120 and the first receiving space 110 constitute a stepped structure, which may be a stepped groove or a stepped hole. At least a portion of the supporting member 221 can be hidden in the accommodating recess 120, so as to further reduce the stacking height of the first bracket 100 and the supporting member 221, thereby further reducing the thickness of the electronic device, and further improving the user experience.

In another alternative embodiment, the projected contour of the bearing protrusion 222 in the projection direction along the optical axis of the lens assembly 210 may be outside the projected contour of the light-transmissive region 2211. In this scheme, the bearing protrusion 222 does not shield the light-transmitting area 2211, so that the bearing protrusion 222 is not easy to shield light, thereby improving the optical performance of the optical module 200.

In another alternative, the supporting member 221 and the bearing protrusion 222 may be an integral structural member. This way can not only facilitate the whole disassembly and assembly of the supporting portion 220, improve the assembly performance of the optical module 200, but also improve the strength of the supporting portion 220, thereby improving the safety of the optical module 200.

In another alternative embodiment, the supporting member 221 can be made of a transparent material, such as transparent glass or transparent plastic, and the light-transmitting region 2211 is a region of the supporting member 221 opposite to the photosensitive chip 230, where the supporting plate is a non-opening structure.

In another aspect, the light-transmissive area 2211 can be a light-transmissive hole. That is, the supporting member 221 has an open structure. In this scheme, the light-transmitting area 2211 is a light-transmitting hole, and the light transmittance at the light-transmitting area 2211 is higher, so that the imaging performance of the photosensitive chip 230 is further improved. Meanwhile, the supporting member 221 has an opening structure, so that the requirement on the material of the supporting member 221 is low, and the manufacturing cost of the optical module 200 and the electronic device is reduced.

Optionally, the electronic device disclosed in the present application may further include a housing and a display module 500, where the housing is a mounting base for the optical module 200, the first bracket 100, and other components of the electronic device. The case may include a battery cover 410 and a middle frame 420, and the display module 500 and the middle frame 420 are located at both sides of the display module 500. The battery cover 410, the middle frame 420 and the display module 500 may enclose an installation space, and the first bracket 100 and the optical module 200 may be located in the installation space.

When the first bracket 100 is connected to the battery cover 410, the lens assembly 210 faces the display module 500, and the optical module 200 may be a front-facing under-screen camera module or a front-facing under-screen fingerprint module.

When the first bracket 100 is connected to the middle frame 420, the lens assembly 210 faces the battery cover 410, and the optical module 200 may be a rear camera module or a rear fingerprint module.

Alternatively, the first bracket 100 and the battery cover 410 or the first bracket 100 and the middle frame 420 may be adhered by glue, but may also be connected by other methods, which is not limited herein. The middle frame 420 and the display module 500 may be adhered by glue, or may be connected by other methods, which is not limited herein.

The electronic device disclosed in the embodiment of the present application may be a smart phone, a tablet computer, an electronic book reader, a wearable device (e.g., a smart watch), an electronic game machine, and the like, and the specific kind of the electronic device is not limited in the embodiment of the present application.

While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. an electronic device, is characterized in that, comprises:

a first bracket (100), the first bracket (100) is provided with a first accommodating space (110);

An optical module (200), the optical module (200) includes a lens assembly (210), a support portion (220) and a photosensitive chip (230), the support portion (220) includes a support member (221) and a bearing protrusion (222), the support (221) is connected with the bearing protrusion (222), the support (221) has a light-transmitting area (2211), the lens assembly (210) and the bearing Protrusions (222) are respectively located on both sides of the support member (221), the lens assembly (210) is arranged on the support member (221), and the lens assembly (210) is connected to the light-transmitting area ( 2211) are arranged oppositely, the photosensitive chip (230) is connected to the bearing protrusion (222), and the photosensitive chip (230) is arranged opposite to the light-transmitting area (2211);

The supporting member (221) is overlapped on the surface of the first bracket (100), and at least part of the bearing protrusion (222) and the photosensitive chip (230) are both located in the first accommodating space (110) )Inside.

2. The electronic device according to claim 1, wherein the optical module (200) further comprises a reinforcing plate (240), and the reinforcing plate (240) is disposed on the bearing protrusion (222) ) at one end away from the support member (221), the photosensitive chip (230) is arranged on the reinforcing plate (240), and is located between the reinforcing plate (240) and the support member (221) .

3. The electronic device according to claim 2, wherein the optical module (200) further comprises a circuit board (250), and the circuit board (250) is electrically connected to the photosensitive chip (230), The circuit board (250) is located in the first accommodating space (110), and the photosensitive chip (230), the circuit board (250) and the reinforcing plate (240) are stacked in sequence.

4. The electronic device according to claim 2, wherein the bearing protrusion (222) is an annular structure, the bearing protrusion (222) is arranged around the light-transmitting area (2211), and the bearing The protrusion (222), the support member (221) and the reinforcing plate (240) enclose a second accommodating space (260), and the photosensitive chip (230) is located in the second accommodating space (260) .

5. The electronic device according to claim 1, characterized in that, the electronic device further comprises a second bracket (300), and a limit is provided on the side of the lens assembly (210) facing away from the support (221) The second bracket (300) is limited and matched with the limiting surface along the optical axis direction of the lens assembly (210).

6 . The electronic device according to claim 5 , wherein the second bracket ( 300 ) is provided with a mounting hole ( 310 ), and at least part of the lens assembly ( 210 ) is located in the mounting hole ( 310 ). 7 . Inside.

7. The electronic device according to claim 1, wherein the first accommodating space (110) is an accommodating groove or an accommodating hole.

8. The electronic device according to claim 1, wherein the first bracket (100) is provided with a accommodating recess (120), and the accommodating recess (120) is disposed around the first accommodating space (110) , the accommodating recess (120) is communicated with the first accommodating space (110), and at least part of the support member (221) is located in the accommodating recess (120).

9. The electronic device according to claim 1, characterized in that, in a projection direction along the optical axis of the lens assembly (210), the projection profile of the bearing protrusion (222) is located in the light-transmitting area (210). 2211) outside the projected contour.

10. The electronic device according to claim 1, wherein the optical module (200) comprises at least one of a camera module and a fingerprint identification module.