KR100673643B1 - Camera module package and manufacturing method thereof - Google Patents

Abstract

A camera module package and a method of manufacturing the camera module package are provided to prevent an optical axis from swerving, reduce the size of a camera module, and easily combine an image sensor module with a housing. A camera module package includes a lens barrel(10) in which a plurality of lenses is set, an image sensor module(30) having an image sensor(33) and a flexible printed circuit board(31), an upper housing(20) combined with the lens barrel, and a lower housing(60). The image sensor converts light which has passed through the lens barrel into an image. The flexible printed circuit board is flip-chip-bonded to the image sensor by an adhesive member(35) and formed in the same size as the image sensor. The upper housing has a groove(21). The lower housing is combined with the groove of the upper housing with the image sensor module mounted therein. A portion of the lower housing, which corresponds to the position of the adhesive member, is cut.

Description

Camera module package and manufacturing method {CAMERA MODULE PACKAGE AND MANUFACTURING METHOD THEREOF}

1 is a diagram of a camera module package according to a conventional COF packaging method,

FIG. 1A is a view for explaining a process by a COF packaging method and a tolerance generated when performing the process, FIG. 1B is a front view of a camera module package according to the above method, and FIG. 1C is generated by the tolerance according to the above method. A diagram showing an optical axis skew phenomenon.

2A and 2B are front views of a camera module package according to an embodiment of the present invention, respectively.

3A and 3B are a plan view and a cross-sectional view of a lower housing applied to an embodiment of the present invention.

4A and 4B are a plan view and a cross-sectional view of a lower housing applied to another embodiment of the present invention.

5 is a schematic diagram showing optical axis matching in a camera module package according to the present invention.

6a to 6e is a process chart showing a manufacturing method of the camera module package according to the present invention.

<Description of Major Symbols in Drawing>

10: lens portion (lens barrel) 20: upper housing (Housing)

21: coupling groove 30: image sensor module

31: FPCB (Flexible Printed Circuit Board)

32: Window 33: Image sensor

34: Multi Layer Ceramic Capacitor (MLCC) or Electronic Component

35: bonding means 40: infrared cut filter (IR cut filter)

60, 70: lower housing 61: base

62, 72: extension 63, 73: protrusion

80, 90: bonding means

The present invention relates to a camera module package including an image sensor module used in a digital camera, a mobile device, or various monitoring devices, and a method of manufacturing the same. More specifically, the present invention minimizes process tolerances generated by a conventional packaging method. The present invention relates to an image sensor size camera module package and a method of manufacturing the same, which prevents optical axis distortion, tilting and rotation, and facilitates the coupling between the image sensor module and the housing to improve quality.

Recently, due to the rapid development of information and communication technology, the improvement of data communication speed and the increase of data communication amount are realized, and the imaging devices such as CCD image sensor and CMOS image sensor are mounted on mobile electronic devices such as mobile phones and laptops. It is spread | distributing and these can transmit the image data image | photographed by the camera module besides the text data by real-time process.

In general, the packaging method of an image sensor for a camera includes a flip-chip (Chip On Flim) method, a wire bonding method of a chip on board (COB) method, and a chip scale package (CSP) method. Among them, a COF packaging method and a COB packaging method are widely used.

In particular, the bump-based COF method, which has an external projecting joint, does not require a space for attaching the wire, as compared to the COB method, which reduces the package area and reduces the height of the barrel. have. In addition, since a thin film or flexible printed circuit board (FPCB) is used, a reliable package that can withstand external shocks is possible, and the process is relatively simple. In addition, the COF method also meets the trend of high-speed processing, high density, and multipinning due to miniaturization and reduction of resistance.

However, the COF method is concentrated in the smallest and lightest chip size wafer level package, but the process cost is high and the delivery time is unstable, and thus there is a limitation for the image sensor. In addition, the module miniaturization, which is an advantage of the COF method, cannot be used in a module that uses a mega-level or higher sensor, in which a variety of functions are added due to the single-layer structure. There was no. Currently, a double-sided flexible printed circuit board (FPCB) can be used to have a size similar to that of the COB method, but since it is less than the miniaturization of the above-described COF method, the COB method is gradually used. Design and process technology development is required to take advantage of the miniaturization of the advantage.

On the other hand, in the camera module, the light receiving surface of the image sensor mounted on the lens and the wiring board needs to be assembled so that the optical axis of the lens is accurately positioned at the center of the image sensor. However, the packaging method of the existing camera module including the COF method described above, the optical axis distortion, tilting and rotating phenomena affecting the most important image quality in the camera module through various packaging processes It is included. This adds the tolerances generated in each process and the tolerances of the components constituting the module itself, and as a result, the optical axis is greatly distorted.

Various methods have been proposed to prevent such optical axis distortion, and related arts have been disclosed, for example, in Japanese Patent Application Laid-Open No. 2004-55574, but these also have a high design difficulty and difficult to manage in a process of 20 μm or less. It can not be managed.

Then, a conventional camera module using a COF method will be described with reference to the accompanying drawings and the problems thereof will be described.

1 is a view of a camera module according to a conventional COF packaging method, Figure 1a is a view for explaining a process generated by the COF packaging method and the tolerance generated during the process, Figure 1b is a camera module according to the method FIG. 1C is a front view of the package, and FIG. 1C is a view showing optical axis distortion, tilting, and rotation phenomenon caused by the tolerance according to the above scheme.

As shown in FIG. 1A, in the COF packaging method, the image sensor 320 is attached to one surface (lower surface) of the FPCB 300 having a window window through which light passing through the lens portion can pass. Next, the IR filter 330 processed to a predetermined size is attached to an opposite surface (upper surface) of one surface of the FPCB 300 to which the image sensor 320 is attached. After that, the outer circumferential surface of the IR filter 330 attached to the FPCB 300 is used as a guide surface so that the inner circumferential surfaces of the lower opening of the housing 200 including the lens unit 100 adhere to the outer circumferential surface to be in close contact with each other. .

In the COF packaging method, as shown in FIG. 1B, a side filling bonding process is required to protect the image sensor and the passive element, and in addition to the problem of increasing the overall module size, two tolerances are largely generated. There is a problem that the optical axis passing through the portion is not accurately positioned on the light receiving portion of the image sensor. That is, the IR filter 330 size tolerance generated when the outer circumferential surface of the IR filter 330 guiding the housing 200 and the processed IR filter 330 are attached to the FPCB 300 when the IR filter 330 is attached. IR filter position tolerance is generated because 330 is twisted and attached.

Similarly, due to the accumulation of tolerances caused by the aforementioned factors, as shown in FIG. 1C, an optical axis shifting and tilting and rotation phenomena occur in which the optical axis passing through the lens unit is spaced a predetermined distance from the pixel center of the image sensor.

Further, in the above-described conventional COF packaging method, that is, the outer peripheral surface of the IR filter attached to the FPCB as a guide surface, the inner peripheral surface of the lower opening of the housing including the lens unit is coupled to and adhered to each other in close contact with each other. Due to the IR filter attached to the FPCB, devices such as multilayer ceramic capacitors (MLCCs) cannot be mounted to be located inside the housing of the camera module, and must be mounted on the same side as the image sensor attached or outside the housing. As a result, the required size of the FPCB increases, resulting in an increase in the size of the entire image sensor module.

In addition, in the above-described conventional COF packaging method image sensor module, if the size of the camera module is limited to a certain size at the request of the user (User), it is inevitable to design the product within the size of the limited camera module In some cases, it is necessary to remove an active or passive element including a multilayer ceramic capacitor (MLCC) from the image sensor module. In this case, when the multilayer ceramic capacitor (MLCC) is removed from the image sensor module, a screen noise problem occurs. However, in order to reduce the overall size of the camera module including the housing, this problem has to be taken.

Accordingly, the present invention was devised to solve the above-described problems, and can prevent optical axis distortion, thereby reducing a high resolution and resolution-related defect rate, and reducing the size of the module itself to achieve miniaturization, as well as an image sensor. It is an object of the present invention to provide a camera module package and a method of manufacturing the same, which can facilitate the coupling of the module and the housing to improve the quality.

In order to achieve the above object, the camera module package according to the present invention comprises: a lens barrel equipped with a plurality of lenses; An image sensor module comprising an image sensor for converting light passing through the lens barrel into an image, and an FPCB that is flip chip bonded by the image sensor and an adhesive means and is substantially the same size as the image sensor; An upper housing coupled to the lens barrel and having a groove formed on an outer circumferential surface of a lower end thereof; And a lower housing coupled to a groove formed in the upper housing in a state in which the image sensor module is seated, and in which a portion corresponding to the position of the adhesive means of the image sensor module is partially chamfered.

Here, the FPCB is preferably a flexible printed circuit board (RFPCB) or a double-sided flexible printed circuit board (TWO LAYERED FPCB), and at least one mounted on an opposite surface of the FPCB surface to which the image sensor is attached. It is characterized by including an electronic component.

In addition, the adhesive means, characterized in that any one of the group consisting of anisotropic conductive film (ACF), non-conductive film (NCF) and non-conductive paste (NCP).

The upper housing may be equipped with an infrared cut filter (IR CUT FILTER) therein, or an infrared cut filter may be attached on an opposite surface of the FPCB surface to which the image sensor is attached. .

Here, the lower housing, the hollow base portion (BASE PLATE) in contact with a portion of the bottom surface of the image sensor; An extension part extending upward from the base part to be in contact with a part of the side surface of the image sensor, and having an inner side surface of the upper end part corresponding to the position of the bonding means; And a protrusion formed extending upward from the extension part and engaging with the groove of the upper housing.

In addition, the lower housing has a lower end that is the same as the position of the end of the image sensor, the bottom of the hollow contact with the side of the image sensor, the inner surface of the upper end of the upper part corresponding to the position of the bonding means is partially chamfered ; And a protrusion extending upwardly from the base to engage with the groove of the upper housing.

In addition, the lower housing and the part in contact with the image sensor, and the lower housing and the upper housing in contact with each other by a separate adhesive means characterized in that the sealing at the same time.

On the other hand, in order to achieve the above object, a camera module package manufacturing method according to the present invention comprises the steps of: providing an image sensor module by pressing an image sensor and FPCB having substantially the same size as the image sensor through an adhesive means; Mounting and attaching the image sensor module to each other in the lower housing in which the inner circumferential surface portion corresponding to the adhesive means protruding to the outside of the outer circumferential surface of the image sensor is partially chamfered; And attaching the lower housing on which the image sensor module is mounted and the upper housing to which the lens barrel equipped with the plurality of lenses are coupled to each other.

The pressing and attaching of the image sensor and the FPCB to each other may include anisotropic conductive film (ACF), non-conductive film (NCF), and non-conductive paste (NCP) as the adhesive means between the FPCB and the image sensor. After inserting any one of the groups consisting of a method of pressing and attaching.

In addition, it is preferable to use a flexible printed circuit board (RFPCB) or a double-sided flexible printed circuit board (TWO LAYERED FPCB) as the FPCB.

The providing of the image sensor module may include mounting at least one electronic component on an opposite surface of the FPCB surface to which the image sensor is attached, wherein the electronic component is disposed between the window window formed in the FPCB and an outer circumferential surface of the image sensor. Characterized in that to be located.

In addition, before combining the upper housing and the lower housing, characterized in that for attaching an infrared cut filter on the opposite side of the FPCB surface to which the image sensor is attached.

In the providing of the image sensor module, an infrared cut filter is mounted inside the upper housing.

Here, the coupling between the lower housing in which the image sensor module is mounted and the upper housing in which the lens barrel equipped with the plurality of lenses is coupled is engaged by the uneven coupling.

In addition, the attachment of the lower housing in which the image sensor module is mounted and the upper housing in which the lens barrel in which the plurality of lenses are mounted is coupled, the lower housing and the image sensor after applying a separate adhesive means on the lower housing. It is characterized in that the sealing means so as to sufficiently penetrate between the modules.

Image sensor module

First, before describing the camera module package and its manufacturing method which can facilitate the coupling of the image sensor module and the housing to improve the quality, it will be described with respect to the image sensor module that can be applied to the present invention.

2 is a front view of an image sensor module and a camera module package including the same according to the present invention.

In general, the image sensor module 30 coupled to the lower opening of the housing includes an FPCB 31 having a window window 32 through which light passing through the lens part passes, and a window window 32 passing through the window window 32. And an image sensor 33 attached to the FPCB 31 for receiving and processing light. In addition, one end of the FPCB 31 is connected to a connector (not shown).

As an example of the FPCB 31, a resin substrate such as polyimide having flexibility can be used. As will be described later, when a two-layered FPCB or a flexible printed circuit board (RFPCB) is used as the FPCB 31, one surface (lower surface) of the FPCB 31 to which the image sensor 33 is attached is used. At least one electronic component 34 may be mounted on the opposite side (upper surface) of H, thereby reducing the size of the entire image sensor module.

The image sensor 33 is formed to be substantially the same size as the width of the FPCB 31 (the width of the FPCB 31 is in the range of 0 to 50㎛ larger than the width of the image sensor 33) A pixel area attached to one surface of the FPCB 31 for receiving light received from the condensing lens of the lens unit 10 and performing photoelectric conversion; and transmitting signals generated by the light receiving unit as image data, and the like. Signal processing unit (ISP). A plurality of electrode pads (not shown) are formed on one surface of the FPCB 31, and bumps are formed on the electrode pads. In this case, when the image sensor 33 is attached to the COF flip chip method, bumps and anisotropic conductive films (ACFs) or non-conductive pastes (NCPs) or protrusions protruding from the outer surface of the electrode pads may be used. It adheres using a non-conductive film (NCF). The bump may be configured of any one of a stud type bump, an electroless bump, and an electrolytic bump. Since the stud type bump may reduce the height of the bump during flip chip pressurization, the step between ceramic leads may be improved. It is also advantageous in terms of improving the reliability of the product.

On the other hand, in the image sensor module according to the present invention as described above, since the size of the image sensor 33 is generally determined according to the number of pixels, the image sensor 33 is adapted to the size of the image sensor 33 of the predetermined size. The same size of the FPCB 31 is made and attached to each other. That is, in the image sensor module applied to the present invention, the size of the FPCB is substantially the same as that of the image sensor. In this way, if the size of the FPCB 31 is formed to be the same as the size of the image sensor 33, and the cut surface of the image sensor 33 is used as a direct or indirect guide when the housing is combined, the conventional COF packaging method Two tolerances, namely the IR filter size tolerance generated when machining the outer circumferential surface of the IR filter guiding the housing, and the IR filter position generated when the processed IR filter is attached to the FPCB by twisting the attached IR filter. Due to the tolerance, it is possible to prevent the optical axis distortion, tilting and rotation phenomenon in which the optical axis passing through the lens portion is spaced a predetermined distance from the pixel center of the image sensor.

In addition, since the size of the FPCB is substantially the same as that of the image sensor, the image sensor module applicable to the present invention can reduce the size of the image sensor module and eventually reduce the size of the entire camera module package. Can be.

Furthermore, in the prior art, the outer circumferential surface of the IR filter attached to the FPCB is used as a guide surface so that the inner circumferential surfaces of the lower opening of the housing including the lens portion adhere to each other so as to be in close contact with each other. The image sensor module uses the outer circumferential surface of the image sensor itself as a guide surface for housing coupling, so that the IR filter can be mounted inside the housing or manufactured and attached to a size substantially the same as that of the window formed on the FPCB, thereby securing design space. It is advantageous from the side. In the case of using a two-layered FPCB or a flexible printed circuit board (RFPCB) as the FPCB, a multilayer ceramic capacitor is formed on the opposite side (upper surface) of one side (lower surface) of the FPCB to which the image sensor is attached. At least one electronic component 34 such as (MLCC) may be mounted to be included in the housing, thereby reducing the size of the entire image sensor module as compared with the related art.

The electronic component 34 that may be mounted on the image sensor module 30 may include at least one multilayer ceramic capacitor (MLCC), and may further include other electronic components such as resistors, diodes, and transistors. have. Here, the multilayer ceramic capacitor (MLCC) serves to eliminate a screen noise problem occurring in the camera module, and other electronic components used elsewhere may be used for quality improvement other than the screen noise problem. In addition, as the multilayer ceramic capacitor (MLCC) has recently developed in the direction of high performance, high integration, and high speed, a thin and small package may be realized by combining a multi-chip package and a multi-layered three-dimensional stack structure rather than a single chip package.

On the other hand, in the image sensor module 30, the specific relationship between the electronic component 34 and the image sensor 33 disposed and mounted on the FPCB 31 is shown in Figure 2, the FPCB 31 An electronic component 34 including a stacked ceramic capacitor is mounted on an upper surface of the window window 32 formed on the upper surface thereof, and an image sensor 33 is attached to the lower surface thereof. At this time, the electronic component 34 is mounted inside the surface on which the image sensor 33 is attached, that is, between the window window 32 and the outer circumferential surface of the image sensor 33 to be coupled to the housing. Preferably, the electronic component 34 is included in the housing.

Camera Module Package

Hereinafter, a description will be given of a camera module package that can facilitate the coupling of the above-described image sensor module and the housing to improve the quality.

2A and 2B respectively show a front view of a camera module package according to an embodiment of the present invention, and FIGS. 3A and 3B are plan views and cross-sectional views of a lower housing applied to an embodiment of the present invention, and FIGS. 4A and 4B A plan view and a sectional view of a lower housing applied to another embodiment of the present invention are shown.

As shown in FIGS. 2A and 2B, the camera module package includes a lens unit (lens barrel) 10, an upper housing 20 into which the lens unit 10 is inserted and mounted from an upper opening thereof, and It is coupled to the lower opening of the upper housing 20 and consists of a lower housing (60, 70) on which the image sensor module 30 described above is seated.

The lens unit 10 functions as a lens holder and is typically formed of a resin such as polycarbonate, and includes an aperture and a lower portion at a bottom side inserted into the upper housing 20. A condenser lens or the like is provided. The aperture defines a passage of light passing through the condenser lens, and the condenser lens allows the light passing through the aperture to receive the light receiving portion of the image sensor element described later. IR coated glass is adhered to the upper surface of the lens unit 10 to prevent foreign matter from penetrating into the aperture and the condenser lens.

The upper housing 20 is coupled to the lens unit 10 and may be equipped with an infrared cut filter (IR CUT FILTER) therein. Alternatively, as described above, an infrared cut filter may be attached on the opposite side of the FPCB surface to which the image sensor is attached. On the other hand, the groove 21 is formed on the outer circumferential surface of the lower end of the upper housing 20, and forms an engagement coupling relationship with the protrusions 61 and 71 of the lower housings 60 and 70 described later.

The lower housings 60 and 70 are coupled to the grooves 21 formed in the upper housing 20 in a state of being seated and coupled in a shape surrounding the image sensor module 30 described above. 3A and 3B are plan and cross-sectional views of a lower housing applied to an embodiment of the present invention, and FIGS. 4A and 4B respectively show a plan and a cross-sectional view of a lower housing applied to another embodiment of the present invention.

As shown in FIGS. 3A and 3B, the lower housing 60 extends upward from the base portion 61 and a hollow base portion 61 in contact with a portion of the bottom surface of the image sensor. Formed in contact with a part of the side surface of the image sensor 33, the inner surface of the upper end of the upper portion corresponding to the position of the bonding means 35 used for bonding the image sensor 33 and the FPCB 31 is chamfered It is characterized in that it comprises an extension portion 62, and a protrusion portion 63 extending upwardly from the extension portion 62 to engage with the groove 21 of the upper housing 20.

Here, the base 61 serves to protect the image sensor inside the package when the package is impacted by an external drop.

In addition, as shown in Figure 4a and 4b, the lower housing 70 may be made of a configuration in which the portion that serves as the buffer portion is omitted. That is, the lower housing 70 has a lower end portion that is the same as the end position of the image sensor 33, contacts the side surface of the image sensor 33, and an upper end portion thereof corresponding to the position of the bonding means 35. The inner side of the hollow portion of the chamfered hollow portion 72, and extending upwardly from the extension portion 72 includes a projection 73 is engaged with the groove 21 of the upper housing 20 Characterized in that.

That is, since the portion supporting the image sensor module is the image sensor itself rather than the outer portion of the FPCB as in the prior art, there is an advantage of minimizing optical axis shift as shown in FIG. 5. 5 is a schematic diagram which shows optical-axis matching in the camera module package by this invention.

In addition, during the manufacture of the image sensor module, the rear surface of the image sensor 33 and the FPCB 31 is attached by pressing in a state of interposing the adhesive means 35, the adhesive means 35 inserted in this process The image sensor 33 and the outer peripheral surface of the FPCB 31 is protruded by a predetermined length. When forcibly coupling the image sensor module 30 and the lower housings 60 and 70 including such protrusions, the camera module package may be defective and a reliability problem may occur. Accordingly, by forming a chamfer on the inner circumferential surface of the mounting portion, which is a corresponding position, to allow the resin component, which is a protrusion of the bonding means, to restrain the occurrence of foreign matters during assembly of the housing, and to prevent the failure of the camera module package. It is possible to manufacture a package of high reliability.

The lower housings 60 and 70 and the image sensor module 30 are in contact with each other, and the lower housings 60 and 70 and the upper housing 20 are in contact with each other by separate bonding means. At the same time, it is sealed, so that package reliability can be increased.

Manufacturing Method of Camera Module Package

Hereinafter, a method of manufacturing the camera module package according to the present invention will be described with reference to FIG. 6.

Figure 6 shows a process diagram for showing a manufacturing method of the camera module package according to the present invention, the image sensor module manufacturing step, the coupling and attachment step of the image sensor module and the lower housing, the lower housing and It can be divided into the step of coupling and attaching the upper housing including a lens unit.

First, as shown in Figure 6a, as an image sensor module manufacturing step, by cutting the image sensor wafer to prepare a unit image sensor 33 of a predetermined size. At this time, the cutting tolerance of the unit image sensor 33 is cut to be 20㎛ or less in both width directions. Thereafter, an FPCB 31 having a width substantially the same as that of the image sensor 33 is prepared. The FPCB 31 is provided with a window window 32 having a predetermined size so that light received from the condenser lens of the lens unit 10 can pass therethrough. Then, the back surface of the image sensor 33 and the FPCB 31 is attached by pressing the adhesive means 35 through a state between the back surface of the FPCB 31 and the image sensor 33. As the adhesive means 35, any one of a group consisting of an anisotropic conductive film (ACF), a non-conductive film (NCF), and a non-conductive paste (NCP) may be inserted and then pressed and attached.

On the other hand, if the IR blocking filter for blocking the infrared rays from the incident light passing through the lens unit 10 inside the upper housing 20, the FPCB 31 of the completed image sensor module 30 An IR blocking filter may be attached to the opposite side (upper surface) of the rear surface to have a size enough to cover the window window 32. The IR blocking filter is for injecting only visible light from incident light passing through the lens part, and unlike the prior art, it does not serve as a guide for coupling with the housing, and thus may have the same size as the coupling part of the housing. There is no need to provide a high degree of freedom in device placement.

In addition, if a flexible printed circuit board or a double-sided flexible printed circuit board is used as the FPCB 31, the opposite side of the rear surface of the FPCB 31 of the image sensor module, preferably the window window 32 and the image Mounting at least one or more electronic components 34 such as a multilayer ceramic capacitor may be added at a position between the outer circumferential surface of the sensor 33 and the like. As an example, a method of attaching the multilayer ceramic capacitor 34 to an opposite surface of the rear surface of the FPCB 31 may be performed by applying a solder cream to an attachment portion of the multilayer ceramic capacitor 34 and then curing it. It can be used to attach through, it is preferable to attach using a solder cream, which is less expensive to manufacture than other methods.

Next, as shown in Figure 6b, the inner circumferential surface portion corresponding to the adhesive means portion 35 that protrudes to the outside of the outer circumferential surface of the image sensor 33 by the pressing step inside the lower housing (60, 70) On, the image sensor module 30 is seated and attached to each other. In this case, the coupling between the lower housings 60 and 70 on which the image sensor module 30 is mounted, and the upper housing 20 to which the lens barrel 10 with a plurality of lenses is mounted, is engaged by uneven coupling. It is characterized by. In addition, by applying and attaching a separate adhesive means 80 on the base 61 of the lower housing 60 or on the inner side of the extension portion 72 of the lower housing 70 can be improved reliability.

Then, as shown in Figure 6c, by applying a sufficient adhesive means 90 on the lower housing (60, 70) between the lower housing (60, 70) and the image sensor module 30 A lens barrel equipped with a plurality of lenses and protrusions 61 and 71 of the lower housing 60 and 70 to which the bonding means 90 is sufficiently infiltrated and sealed, as shown in FIG. 6D. 10) is coupled to the groove 21 of the upper housing 20 coupled to each other to complete the camera module package (see Figure 6e).

As such, as a result of performing the coupling between the image sensor module 30 and the upper and lower housings 20, 60, and 70 by using the outer circumferential surface of the image sensor 33 as an indirect guide, the optical axis passing through the lens unit It is possible to prevent optical axis distortion, tilting and rotation which are spaced a predetermined distance from the pixel center of the image sensor. In addition, since the housing is coupled with the outer circumferential surface of the image sensor 33 as a guide, a camera module width larger than about 300 μm may be realized. Furthermore, the IR filter attaching step is not an essential constitution, and the number of manufacturing steps can be shortened by that, and the productivity can be improved.

On the other hand, when assembling the image sensor module 30 and the upper and lower housings (20, 60, 70), the lens unit 10 is assembled with an aperture, a condenser lens, etc. from the upper opening of the upper housing 20 in advance. The lens unit 10 may be mounted after the image sensor module 30 and the upper and lower housings 20, 60, and 70 are assembled.

The present invention is not limited to the above-described embodiments, but can be variously modified and changed by those skilled in the art, which should be regarded as included in the spirit and scope of the present invention as defined in the appended claims. something to do.

As described above, according to the camera module package and the manufacturing method thereof according to the present invention, it is possible to prevent the optical axis distortion phenomenon to reduce the high resolution and resolution-related defect rate and to reduce the size of the module itself to achieve miniaturization In addition, by facilitating the combination of the image sensor module and the housing to create an effect that can improve the quality.

Claims (17)

A lens barrel equipped with a plurality of lenses; An image sensor module comprising an image sensor for converting light passing through the lens barrel into an image, and an FPCB that is flip chip bonded by the image sensor and an adhesive means and is substantially the same size as the image sensor; An upper housing coupled to the lens barrel and having a groove formed on an outer circumferential surface of a lower end thereof; And A lower housing coupled to a groove formed in the upper housing in a state in which the image sensor module is seated, and in which a portion corresponding to the position of the adhesive means of the image sensor module is partially chamfered; Camera module package comprising a. The method of claim 1, The FPCB is a flexible printed circuit board (RFPCB) or a double-sided flexible printed circuit board (TWO LAYERED FPCB) characterized in that the camera module package. The method of claim 2, And at least one electronic component mounted on an opposite surface of the FPCB surface to which the image sensor is attached. The method of claim 1, The bonding means is an anisotropic conductive film (ACF), non-conductive film (NCF) and non-conductive paste (NCP) camera module package, characterized in that any one of the group consisting of. The method of claim 1, The upper housing is a camera module package, characterized in that equipped with an infrared cut filter (IR CUT FILTER) therein. The method of claim 1, Camera module package, characterized in that the infrared filter is attached on the opposite side of the FPCB surface attached to the image sensor. The method of claim 1, The lower housing, A hollow base portion in contact with a portion of the bottom surface of the image sensor; An extension part extending upward from the base part to be in contact with a part of the side surface of the image sensor, and having an inner side surface of the upper end part corresponding to the position of the bonding means; And A protruding portion extending upwardly from the extension portion and engaging with the groove of the upper housing; Camera module package comprising a. The method of claim 1, The lower housing, A hollow base having the same lower end as that of the end of the image sensor, contacting a side surface of the image sensor, and having an inner surface of the upper end corresponding to the position of the bonding means; And A protrusion extending upwardly from the base to engage with the groove of the upper housing; Camera module package comprising a. The method according to claim 7 or 8, A portion of the lower housing and the image sensor in contact, and a portion of the lower housing and the upper housing in contact with each other by a separate bonding means and the camera module package, characterized in that sealed at the same time. Providing an image sensor module by compressing an image sensor and an FPCB having substantially the same size as the image sensor through an adhesive means; Mounting and attaching the image sensor module to each other in the lower housing in which the inner circumferential surface portion corresponding to the adhesive means protruding to the outside of the outer circumferential surface of the image sensor is chamfered by the pressing step; And Coupling the lower housing on which the image sensor module is seated and the upper housing to which the lens barrel equipped with a plurality of lenses are coupled to each other; Camera module package manufacturing method comprising a. The method of claim 10, Pressing and attaching the image sensor and the FPCB to each other, the group consisting of anisotropic conductive film (ACF), non-conductive film (NCF) and non-conductive paste (NCP) as the adhesion means between the FPCB and the image sensor. Method of manufacturing a camera module package, characterized in that the method of pressing and then attaching any one of the insert. The method of claim 10, The flexible printed circuit board (RFPCB) or the double-sided flexible printed circuit board (TWO LAYERED FPCB) is used as the FPCB. The method of claim 10, In the providing of the image sensor module, at least one electronic component is mounted on an opposite surface of the FPCB surface to which the image sensor is attached, wherein the electronic component is positioned between a window window formed in the FPCB and an outer circumferential surface of the image sensor. Method for manufacturing a camera module package, characterized in that. The method of claim 10, Before combining the upper housing and the lower housing, the camera module package manufacturing method characterized in that for attaching an infrared cut filter on the opposite side of the FPCB surface to which the image sensor is attached. The method of claim 10, The image sensor module providing step, the camera module package manufacturing method, characterized in that for mounting an infrared cut filter inside the upper housing. The method of claim 10, And a coupling between the lower housing on which the image sensor module is mounted and the upper housing on which the lens barrel equipped with a plurality of lenses is coupled is engaged by the uneven coupling. The method of claim 10, The attachment of the lower housing in which the image sensor module is mounted and the upper housing in which the lens barrel in which the plurality of lenses are mounted is coupled is performed by applying a separate adhesive means to the lower housing and then between the lower housing and the image sensor module. Camera module package manufacturing method, characterized in that the sealing means so as to sufficiently infiltrate.

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