KR100741823B1 - Camera module package equipped with camera shake correction function - Google Patents

Abstract

The present invention relates to a camera module package having an anti-shake or correction function in a mobile terminal, which can reduce the size of the main board while increasing the degree of freedom of arrangement of various IC chips on the main board. At the same time, despite such miniaturization, image stabilization and prevention are possible without noise interference, and there is an advantage in design flexibility that can satisfy various user's requirements.

Camera module package according to the present invention for this purpose, a plurality of lenses is mounted, the lower opening is formed in the housing; It is coupled to the lower opening of the housing, a window window is formed in the center, and a protrusion protruding the edge portion so as to form a cavity in a direction opposite to the surface engaging with the housing, and a contact pad formed on the outer surface of the protrusion A ceramic substrate; An image sensor flip-chip bonded at a position corresponding to the window window of the ceramic substrate in the cavity; It includes a gyro sensor IC or an angular velocity sensor mounted on the substrate surface formed in the opposite direction to the surface on which the image sensor of the ceramic substrate is mounted.

Camera Module Package, Image Sensor Module, Ceramic Board, COB, COF, Cavity, Contact Pad, Gyro Sensor, Angular Velocity Sensor

Description

Camera Module Package with Image Stabilizer {CAMERA MODULE PACKAGE EQUIPPED WITH CAMERA SHAKE CORRECTION FUNCTION}

1A is a schematic diagram of a main board for mounting inside a portable terminal main body in which a gyro sensor IC or an angular velocity sensor is mounted according to the prior art, and FIG. 1B is a diagram of a gyro sensor IC.

2A and 2B are front views of an image sensor module formed by a COF packaging method and a camera module package including the same according to an embodiment of the present invention.

3 is a perspective view of an image sensor module formed by the COF packaging method according to an embodiment of the present invention.

4 is a view of a ceramic substrate applied to the present invention.

5 is a front view of an image sensor module formed by a COB packaging method and a camera module package including the same according to another embodiment of the present invention.

<Description of Major Symbols in Drawing>

10: Lens Barrel 20: Housing

30: image sensor module 31: ceramic substrate

311: cavity 312: protrusion

313: lower contact pad 314: side contact pad

32: Window 33: Image sensor

34: Gyro sensor IC or angular velocity sensor

35: Multi Layer Ceramic Capacitor (MLCC) or Passive Device Including Electronic Component

40: IR cut filter

The present invention relates to a camera module package including an image sensor module used in a mobile terminal, and more particularly, to a camera module package having an anti-shake function or a correction function in a mobile terminal.

Modern mobile terminals are provided with a variety of additional functions in addition to the simple voice call function to provide convenience to the user. Recently, due to the rapid development of information and communication technology, the improvement of data communication speed and the increase of data communication amount are realized, and the imaging devices such as CCD image sensor and CMOS image sensor are mounted on mobile electronic devices such as mobile phones and laptops. It is spread | distributing and these can transmit the image data image | photographed by the camera module besides the text data by real-time process.

Due to the multi-functionality of mobile terminals, especially mobile phones, high-resolution cameras are built into the mobile phones that will be released in the future, and from digital CIF class to VGA class, it is now expanded to MEGA class. There is a real competition with the camera.

As the high-pixel image sensor is applied as described above, the resolution is increased, so that a high-quality photograph can be taken. However, due to the miniaturization of a mobile phone, a hand shake problem is caused by a shutter pressing operation during imaging. In order to compensate for this camera shake, mobile phone companies are trying to solve the problem by mounting a gyro sensor IC or an angular velocity sensor inside the mobile phone. The angular velocity sensor, which is usually provided with a gyro sensor IC or a vibrating gyroscope for detecting the rotational angular velocity, is used to compensate for the shaking of the video camera. In this case, the vibrating gyroscope has a plane parallel to the image sensor. The rotational angular velocity around each of the two axes perpendicular to each other in the phase is detected.

Meanwhile, recently released portable terminals have a gyro sensor IC or an angular velocity sensor mounted on a main board mounted inside the terminal main body, as shown in FIG. 1A, so that various functions can be performed in addition to the sensors. Hundreds of circuit components including LCD panels and various driving components are mounted, as well as various IC chips.

However, when mounting a circuit component including a gyro sensor IC or an angular velocity sensor as shown in Figure 1b on the main board, there is a problem that the size of the main board inevitably increases, which is a portable terminal In order to reflect the latest trends of the consumer using the portable terminal according to the trend of miniaturization and slimming, it is inevitable to meet the needs of consumers that the size of the main board mounted in the terminal should be gradually reduced.

Accordingly, the present invention was devised to solve the above-described problems, and the size of the main board can be reduced while increasing the degree of freedom of arrangement of various IC chips on the main board, thereby miniaturizing the portable terminal, and at the same time, minimizing such miniaturization. Nevertheless, the present invention provides a camera module capable of stabilizing and preventing camera shake.

In order to achieve the above object, a camera module package having a camera shake correction function according to an embodiment of the present invention, a plurality of lenses is mounted, the lower opening is formed housing; A ceramic substrate coupled to the lower opening of the housing and having a protrusion protruding the edge portion thereof so as to form a cavity in a direction opposite to the surface engaging with the housing, and a contact pad formed on an outer surface of the protrusion. ; An image sensor wire-bonded on a surface engaging with the housing of the ceramic substrate; It includes a gyro sensor IC or an angular velocity sensor mounted in the cavity formed in the opposite direction to the surface on which the image sensor of the ceramic substrate is mounted.

In accordance with another aspect of the present invention, a camera module package having a camera shake correction function includes: a housing in which a plurality of lenses are mounted and a lower opening is formed; It is coupled to the lower opening of the housing, a window window is formed in the center, and a protrusion protruding the edge portion so as to form a cavity in a direction opposite to the surface engaging with the housing, and a contact pad formed on the outer surface of the protrusion A ceramic substrate; An image sensor flip-chip bonded at a position corresponding to the window window of the ceramic substrate in the cavity; It includes a gyro sensor IC or an angular velocity sensor mounted on the substrate surface formed in the opposite direction to the surface on which the image sensor of the ceramic substrate is mounted.

The contact pad may be formed on at least one of a bottom surface and an outer surface of the protrusion.

The wire bonding type camera module package may further include a plurality of passive elements mounted in a cavity formed in a direction opposite to a surface on which the image sensor of the ceramic substrate is mounted.

The flip chip type camera module package may further include a plurality of passive elements mounted on a substrate surface formed in a direction opposite to a surface on which the image sensor of the ceramic substrate is mounted.

In the flip chip type camera module package, the inner surface of the protrusion and the outer surface of the image sensor may be in contact with each other.

In general, the packaging method of an image sensor for a camera includes a flip-chip (Chip On Flim) method, a wire bonding method of a chip on board (COB) method, and a chip scale package (CSP) method. Among them, a COF packaging method and a COB packaging method are widely used.

In particular, the bump-based COF method, which has an external projecting joint, does not require a space for attaching the wire, as compared to the COB method, which reduces the package area and reduces the height of the barrel. have. In addition, since a thin film or flexible printed circuit board (FPCB) is used, a reliable package that can withstand external shocks is possible, and the process is relatively simple. In addition, the COF system meets the trend of high-speed processing, high density, and multipinning of signals due to miniaturization and resistance reduction.

However, the COF method is concentrated in the smallest and lightest chip size wafer level package, but the process cost is high and the delivery time is unstable, and thus there is a limitation for the image sensor. In addition, the module miniaturization, which is an advantage of the COF method, cannot be used in a module that uses a mega-level or higher sensor, in which a variety of functions are added due to the single-layer structure. There was no. Currently, a double-sided flexible printed circuit board (FPCB) can be used to have a size similar to that of the COB method, but since it is less than the miniaturization of the above-described COF method, the COB method is gradually used. Design and process technology development is required to take advantage of the miniaturization of the advantage.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in describing the present invention, when a detailed description of a related well-known configuration or function is apparent to those skilled in the art, or it is determined that the subject matter of the present invention may be obscured, the detailed description thereof will be omitted.

First, in a camera module package having a camera shake correction function according to the present invention, it is noted that a plurality of lenses may be mounted directly inside the housing, or a lens barrel equipped with a plurality of lenses may be combined with the housing. . Hereinafter, as an example, a case in which a lens barrel equipped with a plurality of lenses is coupled to a housing as shown in FIGS. 2 and 4 will be described.

The lens barrel 10 functions as a lens holder and is typically formed of a resin such as polycarbonate, and has apertures and condensing on the bottom side inserted into the housing 20. A lens or the like is installed. The aperture defines a passage of light passing through the condenser lens, and the condenser lens receives light passing through the aperture to the light receiving portion of the image sensor 33 element described later. IR coated glass is adhered to the upper surface of the lens barrel 10 to prevent foreign matter from penetrating into the aperture or the condenser lens.

The housing 20 has upper and lower openings formed therein, the ceramic substrate 31 of the image sensor module 30 which is coupled to the lens barrel 10 at the upper opening and described later in the lower opening. substrate). An infrared cut filter (IR CUT FILTER) is mounted inside the housing 20. On the other hand, a coupling protrusion for coupling with the ceramic substrate 31 is formed on the bottom surface of the housing 20 to be coupled to the hole formed in the ceramic substrate 31.

As described above, the image sensor module 30 may be implemented by a COB packaging method and a COF packaging including a gyro sensor IC or an angular velocity sensor for image stabilization and correction, and thus, a detailed arrangement and configuration of the elements will be described. do.

COF  Package way

2 is a front view of an image sensor module formed by a COF packaging method according to the present invention and a camera module package including the same, and FIG. 3 is a perspective view of the image sensor module formed by a COF packaging method according to the present invention.

2 and 3, the image sensor module 30, which is generally coupled to the lower opening of the housing, has a ceramic substrate 31 having a window window 32 through which light passing through the lens portion can pass. And an image sensor 33 attached to the ceramic substrate 31 to receive and process the light passing through the window window 32.

The image sensor 33 is attached to one surface of the ceramic substrate 31, and includes, for example, a pixel area for receiving light received from the condensing lens of the lens unit 10 and performing photoelectric conversion; And a signal processing unit (ISP) such as transmitting the signal generated by the light receiving unit as image data. A plurality of electrode pads (not shown) are formed on one surface (lower surface) of the ceramic substrate 31, and bumps are formed on the electrode pads. In this case, when the image sensor 33 is attached in a flip-chip manner, bumps and anisotropic conductive films (ACFs) or non-conductive pastes (NCPs) protruding from the exterior of the electrode pads may be used. A conductive paste or a non-conductive film (NCF) may be used to attach or ultrasonic bonding may be used. The bump may be configured of any one of a stud type bump, an electroless bump, and an electrolytic bump. Since the stud type bump may reduce the height of the bump during flip chip pressurization, the step between ceramic leads may be improved. It is also advantageous in terms of improving the reliability of the product.

On the other hand, conventionally, a resin substrate such as a polyimide having flexibility is used, but in this case, it is difficult to form a contact pad on the side of the substrate in the manufacturing process, and there is also a problem in that the cavity described later is difficult to process. Therefore, in the present invention, as shown in FIG. 4, a ceramic substrate 31 formed of a multilayer is used, and one surface of the ceramic substrate 31 to which the image sensor 33 is attached by the ceramic substrate 31 is used. One or more electronic components 35 including at least a gyro sensor IC or an angular velocity sensor 34 may be mounted on the opposite side (upper surface) of the lower surface, thereby reducing the size of the entire image sensor module. Since the same method as that known to those skilled in the art may be generally applied to the method of manufacturing the ceramic substrate 31 patterned with a predetermined conductive line in a multilayer, a detailed description thereof will be omitted. 4 is a diagram of a ceramic substrate 31 applied to the present invention.

On the other hand, as shown in Figures 2 to 4, the ceramic substrate 31 has a predetermined length of the substrate edge portion so that the cavity 311 (cavity) is formed in the opposite direction (down direction) of the surface engaging with the housing Protruding portion 312 protrudes as much as is formed. The protrusion 312 is formed in consideration of the corresponding height when the image sensor 33 is flip-chip bonded to a position corresponding to the window window of the ceramic substrate 31. ) To be included inside.

In this case, the size of the cavity 311 is preferably the outer circumferential surface of the image sensor 33, that is, the inner surface of the protrusion 312 and the outer surface of the image sensor 33, as shown in FIG. 2B. . Since the size of the image sensor 33 is generally determined according to the number of pixels, the size of the inner circumferential surface of the cavity 311 of the ceramic substrate 31 is the same according to the size of the image sensor 33 having a predetermined size. Attach. That is, in this case, the size of the image sensor module and the size of the ceramic substrate are almost the same as the size of the chip scale package (CSP). In this way, when the size of the ceramic substrate 31 is formed to be substantially the same as the size of the image sensor 33, and the cut surface of the image sensor 33 is used as a guide when joining the substrate, the conventional COF packaging method When the processed IR filter is attached on the FPCB, due to the IR filter position tolerance caused by the attached IR filter being twisted and attached, the optical axis that is passed through the lens portion is tilted and tilted at a predetermined distance from the pixel center of the image sensor. There is an advantage that can prevent the rotation phenomenon.

In addition, a contact pad 314 is formed on an outer surface of the protrusion 312 of the ceramic substrate 31, preferably on an outer surface of the protrusion 312. As mentioned above, in the case of the resin-type PCB, in the case of the ceramic substrate 31 according to the present invention, the side of the pad is formed only at the bottom of the PCB so that the surface mount technology (SMT) or the bottom contact is possible. Since there is no restriction in the implementation of the side contact method, the bottom / side contacts 313 and 314 can be made available at the same time, thereby easily satisfying the needs of the user. In other words, in the bar type mobile phone model, it can be applied to the mobile phone by using the socket.In the case of the folder type mobile phone, a separate FPCB can be designed and delivered after assembly with the FPCB. The advantage is that it is possible to respond.

The gyro sensor IC or the angular velocity sensor 34 is mounted on a substrate surface (upper surface) formed in a direction opposite to the surface (lower surface) on which the image sensor 33 of the ceramic substrate 31 is mounted. It is preferable to mount a plurality of passive elements 35 necessary on the substrate surface on which the sensor IC or the angular velocity sensor 34 is mounted. This not only reduces the size of the image sensor module, but also pays more attention to EMI shielding since several ICs are mounted, and the device mounting area is smaller than that of the conventional method, and the image sensor 33 and gyro sensor ICs are smaller. Alternatively, the angular velocity sensor 34 and other passive elements 35 may be disposed on different surfaces to reduce noise interference. Here, the electronic component 35, which is another passive element that can be mounted on the image sensor module 30, includes at least one multilayer ceramic capacitor (MLCC), and other electronic components such as resistors, diodes, and transistors. It may further include. A method of applying a solder cream to the attachment portion of the multilayer ceramic capacitor 35 and then attaching it through a curing process may be used, and it is preferable to attach using a solder cream having a lower manufacturing cost than other methods. Do. Here, the multilayer ceramic capacitor (MLCC) serves to eliminate a screen noise problem occurring in the camera module, and other electronic components used elsewhere may be used for quality improvement other than the screen noise problem. In addition, as the multilayer ceramic capacitor (MLCC) has recently developed in the direction of high performance, high integration, and high speed, a thin and small package may be realized by combining a multi-chip package and a multi-layered three-dimensional stack structure rather than a single chip package. On the other hand, an IC having an image stabilization and prevention function may be mounted on a substrate as a CSP type at the wafer level, as an image sensor.

COB packaging method

5 is a front view of an image sensor module formed by a COB packaging method according to the present invention and a camera module package including the same.

In general, the image sensor module 30 coupled to the lower opening of the housing includes an image sensor 33 attached to the ceramic substrate 31 to receive and process light passing through the lens unit.

The image sensor 33 includes a pixel area for receiving light received from the condensing lens of the lens unit 10 and performing photoelectric conversion, and a signal processing unit for transmitting signals generated by the light receiving unit as image data. (ISP). On the other hand, the image sensor 33 is mounted on a substrate by a known die bonding and wire bonding method. That is, the image sensor is fixed by die bonding to the upper surface of the substrate on which the metallized conductor is formed by using a conductive adhesive or the like, and the electrode pad of the image sensor is wire bonded to the metallized conductor by metal wires for mounting. Can be.

On the other hand, as described above, conventionally, a resin substrate such as polyimide having flexibility is used, but in this case, it is difficult to form contact pads on the side surfaces of the substrate in the manufacturing process, and the cavity 311 to be described later is processed. There is also a difficult problem. Therefore, as in the COF packaging method, in the present invention, a ceramic substrate 31 is formed by forming a multilayer and patterning a predetermined wiring line for each layer, and the image sensor 33 is formed by the ceramic substrate 31. One or more electronic components 35 including at least a gyro sensor IC or an angular velocity sensor 34 can be mounted on the opposite side (lower surface) of the one side (upper surface) of the ceramic substrate 31 to which the upper surface of the ceramic substrate 31 is attached. The size of the entire image sensor module can be reduced compared to the case in which the image sensor 33 and other IC elements are mounted on the same.

On the other hand, the ceramic substrate 31 is formed with a protrusion 312 in which the substrate edge portion protrudes by a predetermined length so that the cavity 311 is formed in the opposite direction (downward direction) of the surface engaging with the housing. The protrusion 312 is formed in consideration of a corresponding height when the gyro sensor IC or the angular velocity sensor 34 is mounted on the lower surface of the substrate. The protrusion 312 may include the gyro sensor IC or the angular velocity sensor 34 and other passive elements 35. This is to be included in the cavity 311.

In addition, as in the COF packaging method, a contact pad 314 is formed on an outer surface of the protrusion 312 of the ceramic substrate 31, preferably, an outer surface of the protrusion 312, which is a conventional resin PCB. In the case of the surface mount technology or the bottom contact to form a pad only on the bottom of the PCB, as in the case of the ceramic substrate 31 as the present invention, there is no restriction in the implementation of the side contact method, the bottom / side contacts (313,314) at the same time Because it can be made possible, it can easily meet the needs of users. In other words, the bar-type cell phone model can be applied to a cell phone using a socket, and a folder-type cell phone has a merit that a separate FPCB can be designed and delivered after assembly with the FPCB according to a customer's specification. .

The gyro sensor IC or the angular velocity sensor 34 is mounted on a substrate surface (lower surface) formed in a direction opposite to the surface (upper surface) on which the image sensor 33 of the ceramic substrate 31 is mounted. It is preferable to further mount a plurality of passive elements 35 required on the substrate surface (lower surface) on which the sensor IC or the angular velocity sensor 34 is mounted. This not only reduces the size of the image sensor module, but also pays more attention to EMI shielding since several ICs are mounted, and the device mounting area is smaller than that of the conventional method, and the image sensor 33 and gyro sensor ICs are smaller. Alternatively, the angular velocity sensor 34 and other passive elements 35 may be disposed on different surfaces to reduce noise interference. Here, the electronic component 35, which is another passive element that may be mounted on the image sensor module 30, is the same as described in the COF packaging method, and thus redundant description thereof will be omitted.

The present invention is not limited to the above-described embodiments, but can be variously modified and changed by those skilled in the art, which should be regarded as included in the spirit and scope of the present invention as defined in the appended claims. something to do.

As described above, according to the camera module package having the image stabilization function according to the present invention, the size of the main board can be reduced while increasing the degree of freedom of various IC chip arrangements on the main board. At the same time, despite this miniaturization, image stabilization and prevention can be performed without noise interference, and an effect having design flexibility that can satisfy various user's demands is created.

Claims (6)

A housing in which a plurality of lenses are mounted and a lower opening is formed; A ceramic substrate coupled to the lower opening of the housing and having a protrusion protruding the edge portion thereof so as to form a cavity in a direction opposite to the surface engaging with the housing, and a contact pad formed on an outer surface of the protrusion. ; An image sensor wire-bonded on a surface engaging with the housing of the ceramic substrate; A gyro sensor IC or an angular velocity sensor mounted in a cavity formed in a direction opposite to a surface on which the image sensor of the ceramic substrate is mounted; Camera module package with a camera shake correction function comprising a. A housing in which a plurality of lenses are mounted and a lower opening is formed; It is coupled to the lower opening of the housing, a window window is formed in the center, and a protrusion protruding the edge portion so as to form a cavity in a direction opposite to the surface engaging with the housing, and a contact pad formed on the outer surface of the protrusion A ceramic substrate; An image sensor flip-chip bonded at a position corresponding to the window window of the ceramic substrate in the cavity; A gyro sensor IC or an angular velocity sensor mounted on a substrate surface formed in a direction opposite to the surface on which the image sensor of the ceramic substrate is mounted; Camera module package with a camera shake correction function comprising a. The method according to claim 1 or 2, The contact pad is a camera module package having a camera shake correction function, characterized in that formed on at least one of the bottom surface and the outer surface of the protrusion. The method of claim 1, And a plurality of passive elements mounted in a cavity formed in a direction opposite to a surface on which the image sensor of the ceramic substrate is mounted. The method of claim 2, And a plurality of passive elements mounted on a substrate surface formed in a direction opposite to a surface on which the image sensor of the ceramic substrate is mounted. The method of claim 2, The camera module package having a shake correction function, wherein the inner surface of the protrusion and the outer surface of the image sensor are in contact with each other.

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