1345305 ------— 一 —____ Ί- 100年〇4月〇7日修正替換翠 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明是關於影像感測器封裝及其應用之影像攝取裝置 尤其係關於一種小尺寸影像感測器封装及—種小尺寸影 像攝取裝置。 【先前技術】 [0002] 影像感測器係數位攝像産品中之核心元件之_，爲改善 其成像品質，將一些被動元件與影像感測器整合為一體 ，從而減少影像感測器於訊號切換及傳輪過程中産生之 雜訊串音。 _3]料_1，習知之-整合有被動元件之影像感測器封裝 10，其包括一基體1 、一支撐件2、一影像感測晶片3、 二被動元件4、一透明蓋板5，所述支撐件2設置於所述基 體1上與其形成一谷腔6，所述影像感測晶片容置於該容 腔6内且與所述基體1電性及結構性連接，二被動元件4也 容置於所述容腔6内與所述基體丨電性及結構性連接，所 述透明蓋板5固設於所述支撐件2上將所述容腔6密封。該 影像感測器將被動元件4及影像感測晶片3整合於同一封 裝體内，從而達到改善訊號傳輪質量之目的，然，此種 封裝結構需於基體1上爲被動元件4安裝預留一定之空間 ，因此使得整個影像感測器封裝之體積增大，不利於影 像感測器封裝之小型化及應用該影像感測器封裝之産品 小塑化。 【發明内容】 [0004]有鑒於此，有必要提供一有效利用空間之小型化影像感 096114998 表草編號Α0101 苐4頁/共23頁 1003118434-0 I34r53051345305 -------一_____ Ί - 100 years 〇 April 〇 7th revised replacement Cui Liu, invention description: [Technical field of invention] [0001] The present invention relates to image sensor package and The image capturing device of the application relates in particular to a small-sized image sensor package and a small-sized image capturing device. [Prior Art] [0002] Image Sensors are the core components of the camera products. In order to improve the image quality, some passive components are integrated with the image sensor to reduce the image sensor switching. And the noise crosstalk generated during the pass. _3] material_1, a well-integrated image sensor package 10 incorporating a passive component, comprising a substrate 1, a support member 2, an image sensing wafer 3, two passive components 4, a transparent cover 5, The support member 2 is disposed on the base body 1 and forms a valley chamber 6 . The image sensing chip is received in the cavity 6 and electrically and structurally connected to the base body 1 . The transparent cover plate 5 is fixed to the support member 2 to seal the cavity 6 in the cavity 6 . The image sensor integrates the passive component 4 and the image sensing die 3 into the same package, thereby improving the quality of the signal transmission wheel. However, the package structure needs to be reserved for the passive component 4 on the substrate 1. A certain space, thus increasing the volume of the entire image sensor package, is not conducive to the miniaturization of the image sensor package and the small plasticization of the product using the image sensor package. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide an effective use space for miniaturized imagery. 096114998 Table Number Α0101 苐4 pages/Total 23 pages 1003118434-0 I34r5305
• loo年〇4月胃I 、 測器封裝》 [0005] 還有必要提供一可有效利用空間之應用該影像感測器封 1 裝之影像攝取裝置 • [0006] —種影像感測器封裝，包括一影像感測晶片、一基體、 一蓋板及至少一被動元件。所述基體包括一基板及沿該 基板邊緣設置之側壁，所述基板與侧壁形成一容腔。所 述影像感測晶片收容於所述容腔内且電性連接於所述基 板上。所述被動元件收容於所述容腔内且電性連接於所 述基體之側壁上。所述蓋板支撐於所述基體之側壁上將 所述影像感測晶片及被動元件密封於所述容腔内。所述 蓋板設置於該容腔上，將影像感測晶片及被動元件密封 於該容腔内》 [0007] —種影像攝取裝置包括一鏡頭模組及與該鏡頭模組對正 設置之影像感測器封裝。該影像感測器封裝包括一影像 感測晶片、一基體、一蓋板及至少一被動元件。所述基 體包括一基板及沿該基板邊緣設置之側壁，所述基板與 側壁形成一容腔。所述影像感測晶片收容於所述容腔内 且電性連接於所述基板上β所述被動元件收容於所述容 腔内且電性連接於所述基體之側壁上.所述蓋板支撐於 所述基體之側壁上將所述影像感測晶片及被動元件密封 於所述容腔内。 [0008] 一種影像攝取裝置，包括一鏡頭模組及一與其對應設置 之影像感測器封裝。該影像感測器封裝包括一影像感測 晶片、一基體及至少一被動元件❶所述基體包括一基板 096114998 表單編號Α0101 第5頁/共23頁 1003118434-0 1345305 100年04月07日後正靜？ 及沿該基板邊緣設置之侧壁，該側壁與所述基板垂直。 所述影像感測晶片電性連接於所述基板上，所述被動元 件電性連接於述基體之側壁上。 [0009] 相較先前技術，本發明採用將被動元件懸置於所述基體 之側壁上’而無需於所述基體之基板上再爲被動元件之 安裝預留空間，能夠有效利用空間，從而達成減小封裝 體積之目的。 【實施方式】 [0010] 以下結合附圖對本技術方案實施例提供之影像攝取裝置 進一步說明。 [0011] 請參閱圖2，本發明影像攝取裝置之第一較佳實施例，該 影像攝取裝置100包括一影像感測器封裝11〇及一鏡頭模 組130。所述影像感測器封裝11〇與鏡頭模組13〇對正設 置。 [0012] 影像感測器封裝U〇包括有一基體112、一影像感測晶片 114、至少一被動元件116、多條導線118及一蓋板117。 [0013] 基體11 2爲-用於承載影像感測晶片！ i 4及被動元件i i 6 之載體。該基艘112包括-基板1122，沿該基板1122邊 緣設置之側壁11 24。該基板丨1 22包括 一第一表面1123及 一第一表面1125，所述基板1122的第一表面1123與侧壁 1224形成一個容腔1126。該基體112之基板1122及側壁 1124上設置有可供電氣訊號輸入及輸出之電路（圖未示） 。可以理解，該基體H2之基板1122及側壁1124爲一體 結構°此外該基艘112還可係由框架形之側壁1124罩設於 096114998 表單編號A0101 第6頁/共23頁 1003118434-0 1345305 100年04月07日接主 基板1122上形成。 闺*像感>則晶片114爲—光敏元件，可將光訊號轉化爲電訊 號，該影像感測晶片1丨4有一上表面114 2及一下表面 1144 ’其上表面1142包括一感測區1145及環繞該感測區 1145之非感測區1146，於所述非感測區1146上設置有多 個晶片焊塾1147 °該影像感測晶片114藉由其下表面 1144固設於基體112基板1122之正面1123，且該影像感 測晶片114可藉由打線技術用多條導線118與基板1122相 電性連接。可以理解，該影像感測晶片114也可採用其它 連接方式如覆晶連接（flip chip)、内引腳連接（inner lead bonding)、栽帶自動連接（tape aut〇mated bonding)等與基板1122之電性連接。 [0015] 被動元件116係用以改善影像感測訊號傳輸品質之元件， 其可以係電感元件、電容元件或者電阻元件等可改善訊 號傳輸品質之分立元件，其設置於基體112之侧壁1124上 ，並與設置於所述側壁1124上之電路相電性連接。 [0016] 導線118用於將影像感測晶片114電性連接至基體112上 ，其中一部分導線118之一端連接於影像感測晶片114之 晶片焊墊1147上，另一端與基體112之基板1122上之電 路相電性連接。 [0017] 蓋板11 7爲一個透光體如玻璃片、高透光性樹脂或者其他 材料製成之透鏡等’該蓋板117藉由基體Π2之侧壁1124 支撐於影像感測晶片114之上方，與基體112—同將影像 感測晶片114密封，從而將影像感測晶片114與外部環境 096114998 表單編號A0101 第7頁/共23頁 1003118434-0 1345305 隔離，提高影像威測晶片114之可靠性。• loo years of April stomach I, tester package [0005] It is also necessary to provide a space-efficient application of the image sensor package 1 image capture device • [0006] - image sensor package The invention comprises an image sensing chip, a substrate, a cover plate and at least one passive component. The substrate includes a substrate and sidewalls disposed along an edge of the substrate, the substrate and the sidewall forming a cavity. The image sensing chip is received in the cavity and electrically connected to the substrate. The passive component is received in the cavity and electrically connected to a sidewall of the substrate. The cover plate is supported on the sidewall of the substrate to seal the image sensing chip and the passive component in the cavity. The cover plate is disposed on the cavity to seal the image sensing chip and the passive component in the cavity. [0007] The image capturing device includes a lens module and an image disposed opposite the lens module Sensor package. The image sensor package includes an image sensing chip, a substrate, a cover, and at least one passive component. The substrate includes a substrate and sidewalls disposed along an edge of the substrate, the substrate and the sidewall forming a cavity. The image sensing chip is received in the cavity and electrically connected to the substrate. The passive component is received in the cavity and electrically connected to the sidewall of the substrate. The image sensing wafer and the passive component are sealed in the cavity on the sidewall of the substrate. [0008] An image capture device includes a lens module and an image sensor package corresponding thereto. The image sensor package includes an image sensing chip, a substrate and at least one passive component. The substrate comprises a substrate 096114998. Form number Α 0101 Page 5 / Total 23 pages 1003118434-0 1345305 After April 07, 100 ? And a sidewall disposed along an edge of the substrate, the sidewall being perpendicular to the substrate. The image sensing chip is electrically connected to the substrate, and the passive component is electrically connected to the sidewall of the substrate. [0009] Compared with the prior art, the present invention employs a suspension of a passive component on a side wall of the substrate without leaving a space for the installation of the passive component on the substrate of the substrate, thereby effectively utilizing space, thereby achieving Reduce the size of the package. [Embodiment] The image pickup apparatus provided in the embodiment of the present technical solution will be further described below with reference to the accompanying drawings. Referring to FIG. 2, in a first preferred embodiment of the image capture device of the present invention, the image capture device 100 includes an image sensor package 11A and a lens module 130. The image sensor package 11A is aligned with the lens module 13A. [0012] The image sensor package U includes a substrate 112, an image sensing wafer 114, at least one passive component 116, a plurality of wires 118, and a cover plate 117. [0013] The substrate 11 2 is - used to carry an image sensing wafer! i 4 and the carrier of the passive component i i 6 . The base vessel 112 includes a base plate 1122 with side walls 11 24 disposed along the edge of the base plate 1122. The substrate 丨1 22 includes a first surface 1123 and a first surface 1125, and the first surface 1123 of the substrate 1122 and the sidewall 1224 form a cavity 1126. A circuit (not shown) for inputting and outputting electrical signals is disposed on the substrate 1122 and the side wall 1124 of the base 112. It can be understood that the substrate 1122 and the side wall 1124 of the base body H2 are integrated. Further, the base boat 112 can also be covered by the frame-shaped side wall 1124 at 096114998. Form No. A0101 Page 6 / Total 23 Page 1003118434-0 1345305 100 years Formed on the main substrate 1122 on April 07. The image sensor 114 is a photosensitive element that converts the optical signal into an electrical signal. The image sensing wafer 1 4 has an upper surface 1142 and a lower surface 1144. The upper surface 1142 includes a sensing region. 1145 and a non-sensing area 1146 surrounding the sensing area 1145. A plurality of wafer pads 1147 are disposed on the non-sensing area 1146. The image sensing wafer 114 is fixed to the substrate 112 by a lower surface 1144 thereof. The front surface 1123 of the substrate 1122, and the image sensing wafer 114 can be electrically connected to the substrate 1122 by a plurality of wires 118 by a wire bonding technique. It can be understood that the image sensing chip 114 can also adopt other connection methods such as flip chip, inner lead bonding, tape aut〇mated bonding, etc., and the substrate 1122. Electrical connection. [0015] The passive component 116 is used to improve the quality of the image sensing signal transmission, and may be a discrete component that improves the signal transmission quality, such as an inductor component, a capacitor component, or a resistor component, and is disposed on the sidewall 1124 of the substrate 112. And electrically connected to the circuit disposed on the sidewall 1124. The wire 118 is used to electrically connect the image sensing chip 114 to the substrate 112. One end of the wire 118 is connected to the wafer pad 1147 of the image sensing wafer 114, and the other end is connected to the substrate 1122 of the substrate 112. The circuit is electrically connected. [0017] The cover plate 117 is a light transmissive body such as a glass piece, a high light transmissive resin or a lens made of other materials, etc. The cover plate 117 is supported by the image sensing wafer 114 by the side wall 1124 of the base Π2. Above, the image sensing wafer 114 is sealed with the substrate 112, thereby isolating the image sensing wafer 114 from the external environment 096114998 Form No. A0101, page 7 of 23, 1003118434-0 1345305, to improve the reliability of the image sensor wafer 114. Sex.
[0018]所述鏡頭130包栝/個鏡筒I32和一個鏡座。所述鏡 筒132爲一中空:枉體’其内部設置有至少一組鏡片I324， 用以供所需之光線穿過，該鏡筒I32之一端容置於鏡座 134内。鏡座丨34爲一階梯狀中空柱體，其包括第一容置 部1342及位於其下方且與其相連通之第二容置部1344 ’ 所述第二容置部1 344之内徑大於第一容置部1342之内徑 。所述第二容置部1344包括一個端壁1 346，該鏡座U4 可由其第二容置部1344之端壁1346通過粘接材料136與 影像感測器封装110相連接成一體。可以理解，所述鏡座 134之第一容置部1342及第二容置部1344之内徑可以根 據不同需求而作相應變化，如上兩者内徑相同或者後者 小於前者同樣玎適用於本發明。 [〇〇19] 可以理解，本發明中所述之影像攝取裝置100中設置於影 像感測器封裝11〇之基體112上之蓋板117可以由設置於 其上之鏡頭130取代，從而簡化結構及工藝，以達到節省 材料降低成本之功效。 [0020] 本實施例中，將被動元件116設置於基想112之側壁1124 上，充分利用了該影像感測器封裝11 〇之内部空間，有效 整合影像感測晶片114及被動元件116，從而大大減小了 影像感測器封裝體積，從而也相應減小了使用該影像感 測器封裝110之影像攝取裝置1 〇〇之體積。 [0021] 請一併參閲囷3、4及5，爲本發明影像攝取裝置之第二較 佳實施例，該影像攝取裝置200與影像攝取裝置100相似 096114998 表單編號A0101 第8頁/共23頁 1003118434-0 134.5305 100年D4月07日 頁 | ，其中部分相同之部件採用相同之標號，上述相同部件 已於影像攝取裝置100詳細介紹’將不再次冗述。該影像 攝取裝置200包括影像感測器封裝210及與其對正設置之 鏡頭模組13 0，所述影像感測器封裝210包括基體212、 影像感測晶片114、被動元件116及蓋板117。該影像攝 取裝置200與影像攝取裝置100之區別在於： [0022] 影像感測器封裝210中之基體21 2爲一用於承載影像感測 晶片114及被動元件之116之可撓性載體《該基體212上 包括一基板2122、由該基板2122四周側邊垂直向外延伸 出之兩組翼板2124、2126及形成於基板2122及翼板 2124、2126上之電路（圚未示），該電路用以與設置於該 基體上之如影像感測晶片114及被動元件116等電氣元件 電氣連接。 [0023]所述基板2122包括一正面2123及一背面2125，於其背面 2125上形成有多個電性連接塊2127，該電性連接塊2127 通過設置於主基板2122内之電路與設置於基板2122及翼 板2124及2126上之圖案化電路相電連接，從而供該影像 感測器封裝210對外電性連接或者電性及結構性連接。該 基板2122之尺寸爲與影像感測晶片U4之尺寸相近似且能 夠爲影像感測晶片114提供電性連接爲最佳。 [0024] 096114998 所迷具⑽淑⑴b可沿基奶⑵之四周侧邊向基板 2122之正面2123料，並可料至與正面2123大致垂直 之位置’且相互密閉連接，從而形成-基板2122爲底兩 組翼板2124、2126爲侧壁之容腔。其中所述密閉連接 可以通過純材料213來實現，同時爲保證所述翼板犯4 表單編號A0J01 % 9 ^ 1003118434-0 1345305 100年04月07日修正替換頁 及2126彎折後通過粘接材料213牢固粘接，可使其中一組 翼板2124或者2126沿基板2122四侧周邊長度方向之尺寸 略小於另一組翼板2126或者2124中對應位置之長度，以 便於所述翼板2124、21 26彎折後有足夠之塗膠面積，從 而保證所述翼板之間能夠通過粘接材料213牢固之粘接。 其中，所述粘接材料213爲一結構性連接材料，其可以是 樹脂、矽膠、紫外樹脂或者環氧樹脂等，其塗佈於基體 212之翼板2124及2126之相鄰之連接處.[0018] The lens 130 encloses a lens barrel I32 and a lens holder. The lens barrel 132 is a hollow body: the body is provided with at least one set of lenses I324 for the required light to pass through, and one end of the lens barrel I32 is received in the lens holder 134. The mirror holder 34 is a stepped hollow cylinder, and includes a first accommodating portion 1342 and a second accommodating portion 1344 ′ located therebeing and communicating therewith. The inner diameter of the second accommodating portion 1 344 is greater than The inner diameter of a receiving portion 1342. The second receiving portion 1344 includes an end wall 1 346. The lens holder U4 can be integrally connected to the image sensor package 110 by the end wall 1346 of the second receiving portion 1344 via the bonding material 136. It can be understood that the inner diameters of the first accommodating portion 1342 and the second accommodating portion 1344 of the lens holder 134 can be changed according to different requirements, and the inner diameters of the two are the same or the latter is smaller than the former. . [19] It can be understood that the cover 117 disposed on the base 112 of the image sensor package 11 in the image pickup apparatus 100 of the present invention can be replaced by the lens 130 disposed thereon, thereby simplifying the structure. And process to achieve the effect of saving materials and reducing costs. In this embodiment, the passive component 116 is disposed on the sidewall 1124 of the base 112, and the internal space of the image sensor package 11 is fully utilized to effectively integrate the image sensing chip 114 and the passive component 116. The image sensor package volume is greatly reduced, thereby correspondingly reducing the volume of the image pickup device 1 using the image sensor package 110. [0021] Please refer to FIGS. 3, 4 and 5 as a second preferred embodiment of the image capturing device of the present invention. The image capturing device 200 is similar to the image capturing device 100. 096114998 Form No. A0101 Page 8 of 23 Page 1003118434-0 134.5305 100 years of the month of D07, the same reference numerals are used for the same components, and the same components have been described in detail in the image capturing apparatus 100 'will not be redundant again. The image capturing device 200 includes an image sensor package 210 and a lens module 130 disposed opposite thereto. The image sensor package 210 includes a substrate 212, an image sensing wafer 114, a passive component 116, and a cover 117. The image capturing device 200 is different from the image capturing device 100 in that: [0022] The substrate 21 2 in the image sensor package 210 is a flexible carrier for carrying the image sensing chip 114 and the passive component 116. The substrate 212 includes a substrate 2122, two sets of wings 2124 and 2126 extending perpendicularly from the sides of the substrate 2122, and circuits (not shown) formed on the substrate 2122 and the wings 2124 and 2126. For electrically connecting to electrical components such as image sensing wafer 114 and passive component 116 disposed on the substrate. The substrate 2122 includes a front surface 2123 and a back surface 2125. A plurality of electrical connection blocks 2127 are formed on the back surface 2125. The electrical connection block 2127 is disposed on the substrate through a circuit disposed in the main substrate 2122. The patterned circuit on the 2122 and the wings 2124 and 2126 is electrically connected to provide external electrical connection or electrical and structural connection of the image sensor package 210. The size of the substrate 2122 is similar to the size of the image sensing wafer U4 and is capable of providing an electrical connection to the image sensing wafer 114. [0024] 096114998 (10) Shu (1) b can be along the side of the base milk (2) to the front surface 2123 of the substrate 2122, and can be fed to the position 2123 substantially perpendicular to the front surface 2123 and sealed together, thereby forming a substrate 2122 The bottom two sets of wings 2124, 2126 are the walls of the side walls. Wherein the hermetic connection can be realized by the pure material 213, and at the same time, to ensure that the wing board commits 4 form number A0J01 % 9 ^ 1003118434-0 1345305 April 07, revised correction page and 2126 bent through the bonding material The 213 is firmly bonded so that the length of one of the wings 2124 or 2126 along the circumference of the four sides of the substrate 2122 is slightly smaller than the length of the corresponding position of the other set of wings 2126 or 2124 to facilitate the wings 2124, 21 After the bending, there is enough glued area to ensure that the wings can be firmly bonded by the bonding material 213. The bonding material 213 is a structural connecting material, which may be a resin, a silicone resin, an ultraviolet resin or an epoxy resin, etc., which is applied to the adjacent joints of the wings 2124 and 2126 of the substrate 212.
[0025] 影像感測晶片114電性連接於所述基體212之基板2122上 。被動元件電性連接於翼板2124、2126上。蓋板117經 由基體212之翼板2124及2126支撐於影像感測晶片114之 上方，與基體212—同將影像感測晶片114密封，從而將 影像感測晶片114與外部環境隔離，提高影像感測晶片 114之可靠性。 [0026] 製造時，首先將影像感測晶片114電性及結構性連接於 基體212之基板2122之正面2123 ;然後，將被動元件116 分別電性連接於基體212之翼板2124及2126上；接著將 所述翼板2124及2126連同設置於其上之被動元件116 — 同沿基體112之基板2122之四周側邊向其正面21 23彎折 ，並將相鄰之翼板密閉連接於一起；至此，被動元件116 則被設置於由基體212之基板2122爲底及翼板2124、 2126爲側壁之容腔内，且被固設於由翼板2124、2126形 成之側壁上。最後將所述蓋板117罩設於基體212之翼板 2124及2126之端部，完成整個影像感測器封裝210之封 裝。完成影像感測器210之封裝之後再將所述鏡頭130通 096114998 表單編號A0101 苐10頁/共23頁 1003118434-0 134,5305 100年04月07日修正替换頁 過其鏡座134與所述影像感測器封裝210相固接。 [0027] 可以理解’本發明中所述基體212之基板2122及翼板 2124及翼板2126^以係相互獨立之部件，所述基板2122 及各翼板2126通過柔性電路板或者設置於翼板2124、 212 6邊緣部與基板212對應sx置之電性連接點相電連接.， 通過粘接材料213將所述基板2122、翼板2124及翼板 2126結構性連接。該種結構可以降低一體之可撓性基體 212被彎折後之回復力，從而提高此結構之影像感測器封 裝及使用該種影像感測器封裝之影像攝取裝置之可靠性 〇 [0028] 可以理解，本發明中所述之影像感測器封裝110中，其基 體212之翼板2124及翼板2126除了應用粘接材料將其粘 接於一起外，也可藉由於翼板2丨24及翼板2126之側邊上 設置相互對應且能夠相互配合之連接結構如相互對應及 凸塊及凹槽，所述凸塊及凹槽可為楔形塊與楔形槽等結 構，從而提高翼板2124及翼板2126之連接可靠性。 [0029] 本實施例中，被動元件11 6設置於基體212中由基板2122 及翼板2124、2126所形成之容腔之側壁上，充分利用了 該影像感測器封裝之内部空間’有效整合了影像感測 晶片114及被動元件116 ’從而大大減小了影像感測器封 裝之體積，從而也相應滅小了使用該影像感測器封裝110 之影像攝取裝置100之體積。另，利用所述撓性基體212 可彎折之特性’使得製造過程中被動元件116安裝更加方 便，可靠性更高。 096114998 表單編號A0101 第Π買/共23頁 1003118434-0 1345305 [~1〇〇 年 04j~0Ti 1 [0030] 請參見圖6，本發明影像攝取裝置之第三較佳實施例，該 影像攝取裝置300與影像攝取裝置100相似，其具有一影 像感測晶片314、至少一被動元件316及鏡頭模組330。 該影像攝取裝置200與影像攝取裝置100之區別在於： [麵]該影像攝取裝置300中影像感測晶片114之載體爲一電路 板140，該電路板140包括一上表面142，於其上表面142 上形成有一與影像感測晶片114之尺寸相當之晶片承載區 144，所述影像感測晶片114電性及結構性連接於該晶片 承載區144上。該電路板140還包括由晶片承載區144邊 緣向外延伸形成之至少一翼部146，該翼部146可沿該晶 片承載區144之邊緣向電路板140之上表面142彎折，並 可彎折到與上表面142大致垂直之位置，形成一側壁。所 述被動元件116電性連接於該翼部146上，並隨翼部146 一同彎折置於所述影像感測晶片114之非影像感測區1146 上方。所述鏡頭模組130將藉由其鏡座134之端部固設於 所述電路板140上，並將影像感測晶片114、被動元件 116及彎折之翼部146收容於其内’所述電路板140之翼 部146與相鄰之鏡頭模組130中鏡座134之端壁1346間填 充有粘接材料136用於固定該翼部146同時將所述鏡頭模 組130中之第二容置空間1344與外部隔離。 [〇〇32] 本實施例中，採用直接將影像感測晶片114、被動元件 116及鏡頭模組130設置於形成有翼部146之電路板140上 ，省去了影像攝取裝置中之基體112及蓋板117，可 進一步縮小該影像攝取裝置2〇〇之體積，同時更具有節省 材料、簡化工藝、降低成本之功效。另，該實施例中可 096114998 表單編號A0101 第12頁/共23頁 1003118434-0 134.5305 - 100年04月07日修正替换頁 根據實際需要來設置電路板140上之翼部146之數量，從 而提高電路板之利用率及生產效率。 [0033] 可以理解，本發明中所述基體112之基板1122、翼板 1124及翼板1126可為相互獨立之部件，所述基板1122及 各翼板1124、1126通過柔性電路板或者設置於翼板1124 、1126邊緣部與基板112對應設置之電性連接點相電連 接，通過粘接材料11 3將所述基板1122、翼板1124及翼 板1126結構性連接。該種結構可降低一體之可撓性基體 112被彎折後之回復力，從而提高該結構之影像感測器封 裝及使用該種影像感測器封裝之影像攝取裝置之可靠性 [0034] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施方式，本 發明之範圍並不以上述實施方式為限，舉凡熟悉本案技 藝之人士，在援依本案發明精神所作之等效修飾或變化 ，皆應包含於以下之申請專利範圍内。 【圖式簡單說明】 [0035] 圖1係先前之一影像感測器之剖視圖。 [0036] 圖2係本發明影像攝取裝置第一較佳實施例之剖視圖。 [0037] 圖3係本發明影像攝取裝置第二較佳實施例之剖視圖。 [0038] 圖4係本發明影像攝取裝置第二較佳實施例之部分展開圖 [0039] 圖5係本發明影像攝取裝置第二較佳實施例之部分展俯視 圖。 1003118434-0 096114998 表單編號A0101 第13頁/共23頁 1345305 100年04月07日修正替換頁 [0040] 圖6係本發明影像攝取裝置第三較佳實施例之剖視圖。 【主要元件符號說明】 [0041] (習知） [0042] 影像感測器封裝：10 [0043] 基體：1 [0044] 支撐件：2 [0045] 影像感測晶片：3 [0046] 被動元件：4 [0047] 透明蓋板：5 [0048] 容腔：6 [0049] (本發明） [0050] 影像攝取裝置：100、200 [0051] 影像感測器封裝：110、210 [0052] 基體：112、212 [0053] 基板：1122 [0054] 側壁：1124 [0055] 第一表面：1123 [0056] 容腔：1126 [0057] 第二表面：1125 [0058] 影像感測晶片：114 表單編號A0101 第14頁/共23頁 096114998 1003118434-0 100年04月07日修正替換頁 1345305 [0059] 上表面：1142 [0060] 下表面：1144 [0061] 感測區：1145 [0062] 非感測區：1146 [0063] 晶片焊墊：1147 [0064] 被動元件：116 [0065] 導線：118 [0066] 蓋板：117 [0067] 鏡頭模組：130 [0068] 鏡筒：132 [0069] 鏡片：1324 [0070] 鏡座：134 [0071] 第一容置部：1342 [0072] 第二容置部：1344 [0073] 端壁：1346 [0074] 基板：2122 [0075] 翼板·· 2124、2126 [0076] 正面：2123 [0077] 背面：2125 096114998 表單編號A0101 第15頁/共23頁 1003118434-0 1345305 100年04月07日修正替換頁 [0078] 電性連接塊：2127 [0079] 粘接材料：213 [0080] 影像攝取裝置：300 [0081] 電路板：140 [0082] 上表面：142 [0083] 晶片承載區：144 [0084] 翼部：146 [0085] 黏接材料：136 1003118434-0 096114998 表單編號A0101 第16頁/共23頁[0025] The image sensing wafer 114 is electrically connected to the substrate 2122 of the substrate 212. The passive components are electrically connected to the wings 2124, 2126. The cover 117 is supported on the image sensing wafer 114 via the wings 2124 and 2126 of the base 212, and the image sensing wafer 114 is sealed together with the base 212 to isolate the image sensing wafer 114 from the external environment, thereby improving the image sense. The reliability of the wafer 114 is measured. [0026] At the time of manufacture, the image sensing wafer 114 is electrically and structurally connected to the front surface 2123 of the substrate 2122 of the substrate 212; then, the passive component 116 is electrically connected to the wings 2124 and 2126 of the substrate 212, respectively; Then, the wings 2124 and 2126 are bent along the peripheral sides of the substrate 2122 along the substrate 112 to the front surface 21 23 along with the passive elements 116 disposed thereon, and the adjacent wings are hermetically connected together; So far, the passive component 116 is disposed in the cavity of the base plate 2122 of the base body 212 and the side walls of the wings 2124 and 2126, and is fixed on the side wall formed by the wings 2124 and 2126. Finally, the cover 117 is placed on the ends of the wings 2124 and 2126 of the base 212 to complete the packaging of the entire image sensor package 210. After completing the encapsulation of the image sensor 210, the lens 130 is passed through 096114998, form number A0101 苐 10 pages, total 23 pages, 1003118434-0 134, 5305, and the correction page of April 7, 100, passes through the mirror holder 134 and the The image sensor package 210 is fixed. [0027] It can be understood that the substrate 2122 and the wing 2124 and the wing 2126 of the base 212 in the present invention are independent components, and the substrate 2122 and the wings 2126 are passed through a flexible circuit board or disposed on the wing. The edge portions of the 2124 and 212 6 are electrically connected to the electrical connection points of the substrate 212 corresponding to the sx. The substrate 2122, the blade 2124 and the blade 2126 are structurally connected by the bonding material 213. The structure can reduce the restoring force of the integrated flexible substrate 212 after being bent, thereby improving the reliability of the image sensor package of the structure and the image capturing device using the image sensor package [0028] It can be understood that, in the image sensor package 110 of the present invention, the wings 2124 and the wings 2126 of the base 212 of the substrate 212 can be bonded together by using an adhesive material, and can also be used by the flaps 2丨24. And the side edges of the wing 2126 are provided with mutually corresponding and mutually compatible connection structures, such as mutual counterparts, and the protrusions and the grooves. The protrusions and the grooves may be wedge-shaped blocks and wedge-shaped grooves, thereby improving the wing 2124. And the connection reliability of the wing 2126. In this embodiment, the passive component 116 is disposed on the sidewall of the cavity formed by the substrate 2122 and the wings 2124 and 2126 in the base 212, and fully utilizes the internal space of the image sensor package to effectively integrate. The image sensing wafer 114 and the passive component 116' greatly reduce the volume of the image sensor package, thereby correspondingly reducing the volume of the image capture device 100 using the image sensor package 110. In addition, the use of the flexible nature of the flexible substrate 212 makes the passive component 116 easier to install and more reliable during manufacturing. 096114998 Form No. A0101 Dimensional Buying/Total 23 Pages 1003118434-0 1345305 [~1〇〇年04j~0Ti 1 [0030] Please refer to FIG. 6, a third preferred embodiment of the image capturing apparatus of the present invention, the image capturing apparatus Similar to the image capture device 100, the 300 has an image sensing chip 314, at least one passive component 316, and a lens module 330. The difference between the image capturing device 200 and the image capturing device 100 is that the carrier of the image sensing chip 114 in the image capturing device 300 is a circuit board 140, and the circuit board 140 includes an upper surface 142 on the upper surface thereof. A wafer carrying area 144 corresponding to the size of the image sensing wafer 114 is formed on the 142, and the image sensing wafer 114 is electrically and structurally connected to the wafer carrying area 144. The circuit board 140 further includes at least one wing portion 146 extending outwardly from the edge of the wafer carrying region 144. The wing portion 146 can be bent along the edge of the wafer carrying region 144 toward the upper surface 142 of the circuit board 140 and can be bent To a position substantially perpendicular to the upper surface 142, a side wall is formed. The passive component 116 is electrically connected to the wing 146 and is bent together with the wing 146 to be placed over the non-image sensing area 1146 of the image sensing wafer 114. The lens module 130 is fixed on the circuit board 140 by the end of the lens holder 134, and the image sensing chip 114, the passive component 116 and the bent wing portion 146 are received therein. The wing portion 146 of the circuit board 140 and the end wall 1346 of the lens holder 134 of the adjacent lens module 130 are filled with an adhesive material 136 for fixing the wing portion 146 while the second of the lens module 130 The accommodating space 1344 is isolated from the outside. In this embodiment, the image sensing chip 114, the passive component 116, and the lens module 130 are directly disposed on the circuit board 140 formed with the wing portion 146, and the substrate 112 in the image pickup device is omitted. And the cover plate 117 can further reduce the volume of the image capturing device 2, and at the same time, has the effects of saving materials, simplifying the process, and reducing the cost. In addition, in this embodiment, 096114998 Form No. A0101 Page 12/23 pages 1003118434-0 134.5305 - Correction replacement page of April 07, 100 sets the number of wings 146 on the circuit board 140 according to actual needs, thereby improving Board utilization and production efficiency. [0033] It can be understood that the substrate 1122, the wing 1124 and the wing 1126 of the base 112 in the present invention may be independent components, and the substrate 1122 and the wings 1124, 1126 pass through the flexible circuit board or are disposed on the wing. The edge portions of the plates 1124 and 1126 are electrically connected to the electrical connection points corresponding to the substrate 112, and the substrate 1122, the blade 1124 and the blade 1126 are structurally connected by the bonding material 113. The structure can reduce the restoring force of the integrated flexible substrate 112 after being bent, thereby improving the reliability of the image sensor package of the structure and the image capturing device using the image sensor package [0034] As described above, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above-described embodiments, and those skilled in the art will be equivalently modified or changed in accordance with the spirit of the invention. All should be included in the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS [0035] FIG. 1 is a cross-sectional view of a prior image sensor. 2 is a cross-sectional view showing a first preferred embodiment of the image pickup apparatus of the present invention. 3 is a cross-sectional view showing a second preferred embodiment of the image pickup apparatus of the present invention. 4 is a partial exploded view of a second preferred embodiment of the image pickup apparatus of the present invention. [0039] FIG. 5 is a partial plan view showing a second preferred embodiment of the image pickup apparatus of the present invention. 1003118434-0 096114998 Form No. A0101 Page 13 of 23 1345305 Correction Replacement Page of April 07, 100 [0040] FIG. 6 is a cross-sectional view showing a third preferred embodiment of the image pickup apparatus of the present invention. [Main Component Symbol Description] [0041] (General) [0042] Image Sensor Package: 10 [0043] Base: 1 [0044] Support: 2 [0045] Image Sensing Wafer: 3 [0046] Passive Components :4 [0047] Transparent cover: 5 [0048] cavity: 6 [0049] (Invention) [0050] Image pickup device: 100, 200 [0051] Image sensor package: 110, 210 [0052] : 112, 212 [0053] Substrate: 1122 [0054] Sidewall: 1124 [0055] First surface: 1123 [0056] Capacitance: 1126 [0057] Second surface: 1125 [0058] Image sensing wafer: 114 Form number A0101 Page 14 of 23 096114998 1003118434-0 Correction replacement page 1345305 of April 07 [0059] Upper surface: 1142 [0060] Lower surface: 1144 [0061] Sensing area: 1145 [0062] Non-sensing Zone: 1146 [0063] Wafer Pad: 1147 [0064] Passive Component: 116 [0065] Wire: 118 [0066] Cover: 117 [0067] Lens Module: 130 [0068] Lens Tube: 132 [0069] Lens :1324 [0070] Mirror mount: 134 [0071] First accommodating portion: 1342 [0072] Second accommodating portion: 1344 [0073] End wall: 1346 [0074] Substrate: 2122 [0075] Wing Board·· 2124, 2126 [0076] Front: 2123 [0077] Back: 2125 096114998 Form No. A0101 Page 15/Total 23 Page 1003118434-0 1345305 Correction Replacement Page [0078] of April 07 [0078] Electrical Connection Block: 2127 [0079] Bonding material: 213 [0080] Image capturing device: 300 [0081] Circuit board: 140 [0082] Upper surface: 142 [0083] Wafer carrying area: 144 [0084] Wing: 146 [0085] Sticky Connection material: 136 1003118434-0 096114998 Form number A0101 Page 16 of 23