TWI343740B - Image sensor package and imageing device therewith - Google Patents

Description

1343740 Correction and replacement of π on March 31, 100. Description of the Invention: [Technical Field] [0001] The present invention relates to an image pickup device and an image pickup device thereof, particularly for a small size image sensing Package and a small size image capture device. [Prior Art]

[0002] One of the core components of the image sensor coefficient camera product, in order to improve the imaging quality, integrate some passive components with the image sensor, thereby reducing the image sensor in the signal switching and transmission process. Generated noise crosstalk. Referring to FIG. 1 , a conventional integrated detector package 10 includes a base body 1 , a JE test wafer 3 , a second passive component 4 , and a transparent cover 5 . The support partner 2 is disposed on the base body. 1 is formed with a cavity 6 , the image sensing chip is received in the cavity 6 and electrically connected to the substrate 1 , and the passive component 4 is also accommodated in the cavity 6 . The inner cover is electrically connected to the base 1 , and the transparent cover 5 is fixed to the support member 2 to seal the cavity 6 . The image sensor integrates the passive component 4 and the image sensing die 3 into the same package, thereby improving the quality of the signal transmission. However, the package structure needs to be reserved for the passive component 4 on the substrate 1. A certain space, thus increasing the size of the entire image sensor package, is not conducive to miniaturization of the image sensor package and miniaturization of the product using the image sensor package. SUMMARY OF THE INVENTION [0004] In view of this, it is necessary to provide an effective use space for miniaturized imagery 096110286 Form Α Α 0101 Page 4 / Total 30 pages 1003111032-0 1343740 - Replacement page measurement after March 31, 100 Package. [0005] It is also necessary to provide an image capturing device that can effectively utilize space for the image sensor package. [0006] An image sensor package includes an image sensing chip, a substrate, a cover, and at least a passive component, the image sensing die includes an upper surface and a lower surface, and a sensing area and a non-sensing area surrounding the sensing area are formed on the upper surface thereof, wherein the sensing area is used for sensing light And converting the image into a signal, the image sensing chip is electrically and structurally connected to the φ substrate, and the cover is supported by the substrate above the image sensing chip, the image sensor package further comprising a carrier. The carrier is disposed on the non-image sensing area of the image sensing chip, and the passive component is disposed on the carrier and electrically connected to the substrate.

[0007] An image sensor package includes a substrate; an image sensing wafer, the image sensing wafer includes an upper surface and a lower surface, and a sensing region is formed on the upper surface thereof and the sensing is performed on the upper surface The sensing area of the area is for sensing light and converting it into an electrical signal. The image sensing chip is electrically and structurally connected to the substrate; a cover plate, the cover plate includes An electrode region and a non-electrode region, the non-electrode region being opposite to the sensing region of the image sensing chip, the cover plate being supported by the substrate above the image sensing wafer; at least one passive component, The passive component is disposed in the electrode region of the cover plate and electrically connected to the base. An image capturing device includes a lens module and an image sensor package disposed opposite the lens module, the image sensor package including an image sensing crystal, a substrate, and a cover And at least one passive component, 096110286 Form No. A0101 Page 5 / Total 30 Page 1003111032-0 1343740 [0009] [0010] [0011] 096110286

On March 31, 100, the shuttle is replacing the image sensing wafer including an upper surface and a lower surface, and a sensing area and a non-sensing area surrounding the sensing area are formed on the upper surface thereof, the sensing area For sensing light and converting it into an electrical signal, the image sensing chip is electrically and structurally connected to the substrate, and the cover is supported by the substrate above the image sensing wafer, and the image sensor package further includes A carrier is disposed on the non-image sensing area of the image sensing chip, and the passive component is disposed on the carrier and electrically connected to the substrate. An image capturing device includes: a circuit board; an image sensing chip, the image sensing chip includes an upper surface and a lower surface, and the sensing area and the ring are formed on the upper surface thereof to sense the flaw a sensing area, the sensing area is used for μ light and is connected to the sensing chip electrically and structurally, and the carrier is disposed on the non-image sensing area of the image sensing chip; at least one passive An element is disposed on the carrier and electrically connected to the base; a lens module, the mirror module is disposed on the circuit: ·. * ' * , *· , * * 'C*'. The board and the image sensing wafer are housed in Monet. Compared with the prior art, the present invention uses the passive component to be disposed on the non-image sensing area of the image sensing chip, and does not need to reserve space for the installation of the passive component on the substrate, thereby effectively utilizing the space, thereby achieving the reduction of the package. The purpose of volume.

[Embodiment] The image pickup apparatus provided in the embodiment of the present technical solution will be further described below with reference to the accompanying drawings. Referring to FIG. 2, in a first preferred embodiment of the image capturing device of the present invention, the image capturing device 100 includes an image sensor package 110 and a lens module form number A0101. Page 6 of 30 pages 1003111032-0 [0012] 1343740 - _ March 31, 100 revised replacement page group 130. The image sensor package 110 is aligned with the lens module. The image sensor package 110 includes a substrate 11 , an image sensing wafer 114 , a carrier 116 , two passive components 117 , a plurality of wires 118 , and a cover 119 . The substrate 112 is configured to receive the image sensing wafer 114. The substrate 112 includes an upper surface 1122 and a lower surface 1124. The upper surface 1122 is provided with a plurality of electrical connecting blocks 1123, and the lower surface thereof is 1124. A plurality of conductive bumps 1125 corresponding to the electrical connection blocks 1123 are disposed, and the electrical connection blocks Π 23 and the conductive bumps 11 25 are electrically connected by a circuit disposed inside the substrate 112. The image sensing chip 114 is a photosensitive element that converts the optical signal into an electrical signal. The image sensing wafer 114 has an upper surface 11 42 and a lower surface 1144. The upper surface 42 includes a sensing region 45 and A non-sensing area 1146 surrounding the sensing area 1145 is disposed on the non-sensing area 1146 with a plurality of wafer pads 1147. The image sensing wafer 114 is secured to the upper surface 1122 of the substrate 112 by a lower surface 1144 thereof. [0016] The carrier 116 is a thin connecting layer that provides a structural connection primarily by the connector. It can be understood that the carrier 116 can also provide electrical connection for the connected member at the same time. The carrier 116 is mainly composed of a resin adhesive. In addition, some conductive particles can be filled in the resin adhesive to form an anisotropic conductive connecting layer, that is, The conductive film is electrically conductive in the same direction and insulated in other directions. At the same time, a plurality of electrodes 1162 are combined to form a structural and electrical connection layer. The electrode 1162 is formed in a resin filled with conductive particles. The resin adhesive portion of the carrier 6 can be used to provide moisture resistance, followed by heat resistance, insulation, 096110286, form number A010, page 7 / total 30 pages, 1003111032-0 1343740, 100 years, after March 31, replacement And fixing the relative position of the connected member to the electrode 1162 in the carrier Πβ, and providing a certain pressing force to maintain the contact area between the electrode and the conductive particles. The conductive particles are used to electrically connect the electrodes of the connected member to the electrodes 11 62 disposed in the carrier 116. The carrier ι16 is disposed on the non-sensing area 114 6 of the upper surface 114 2 of the image sensing wafer 114. [0017] The passive component 117 is used to improve the quality of the image sensing signal transmission, and may be an inductor component, a battery component or a resistor component.

On the carrier 116, the passive component 117 is further provided with a plurality of electrodes (not labeled). The electrodes of the passive component 117 are electrically connected to the electrodes 1162 in the carrier U6 through the conductive fins in the carrier 116. [0018] A wire 118 is used to connect the image sensing crystal to the substrate 112, wherein

The seventh end is connected to the wafer pad 114 7 of the image sensing wafer 114 and the other end is connected to the electrical connection block 11 23 of the substrate 11 2 for electrically connecting the image sensing wafer 114 to the substrate 112. Another part; the wire, one of the π8 is connected and passive

The electrode of the V. J element 11 7 is electrically connected to the carrier 1 丨 & the electrode 11 6 2, the other end of the wire 118 is connected to the electrical connection block 1123 of the substrate 112 for electrically connecting the passive component 11 7 Connected to the substrate 11 2 . [0019]

The transparent cover 119 is disposed on the base Π2 to seal the image sensing wafer 114 together with the substrate 112 to isolate the image sensing wafer i i 4 from the external environment. The reliability of the image sensing wafer 11 is improved. The lens 130 includes a lens barrel 132, a lens holder 134 and a splicing material 136'. The mirror quotient 132 is a hollow cylinder, and at least one set of lenses 1324 is disposed inside the lens for the required light to be worn. Over, one end of the lens barrel 132 is 096110286 Form No. A0101 Page 8 / Total 30 pages 1003111032-0 [0020] On March 31, 100, the shuttle replacement page is placed in the mirror holder 134. The mirror holder 34 is a stepped hollow cylinder, and includes a first receiving portion 1 342 and a second receiving portion 1344 located below and communicating therewith. The inner diameter of the second receiving portion 丨 344 is larger than The inside of the first accommodating portion I 344 is 杈. The second accommodating portion 1344 includes a side wall 346. The lens holder 134 is integrally connected to the image sensor package 丨1 through the side wall 1346 of the second accommodating portion 344 via the bonding material 136. And the image sensor package 11 〇 is received in the second accommodating portion 1 thereof. It can be understood that the diameters of the first accommodating portion 1342 and the second accommodating portion 1 344 of the lens holder 134 can be changed according to different requirements. The inner diameters of the two or the latter are the same or the latter is smaller than the former. this invention. The lens module 丨3 亦可 can also be fixed on the top of the image sensor 丨1 通过 through the lens holder 13 4 . [0021] In this embodiment, the passive component 117 is disposed on the non-image sensing area 1146 of the image sensing chip 114 by the carrier 116, and is packaged together with the image sensing chip 114 to improve the non-image sensing chip 114. The surface utilization of the image sensing area II 46 'saves space, no need to reserve space for the passive component on the substrate ,2, which improves the image sensor package u 应用 and the application of the image sensor package Π0 The space utilization rate of the image pickup device 1 is aimed at achieving a miniaturized image pickup device. [0022] Referring to FIG. 3, a second preferred embodiment of the image capture device of the present invention, the image capture device 2 is similar to the image capture device ι, including an image sensor package 210, a carrier 230, and a passive The image sensor package 210 includes a substrate 212, an image sensing wafer 214, and a cover 216. The base body 212 includes a first surface 2122 and a second surface 2124. A first frame 2122 is further formed with a convex frame 2126. 3 Form No. A0101 Page 9 / Total 30 Page 1003111032-0 1343740 100 March 31 The embossed frame 126 and the first surface 2122 define a cavity 2127. The image sensing wafer 214 is disposed in the cavity 212 7 . The image sensing chip 214 is a photosensitive element that converts the optical signal into an electrical signal. The image sensing wafer 214 has an upper surface 2142 and a lower surface 2144. The upper surface 2142 includes a sensing region 2145 and surrounds the sensing region. The non-sensing area 2146 of the 2145 is fixed on the base 212 and electrically connected to the base 212 through the lower surface 2144 of the image sensing wafer 2144. The cover 216 includes a front side 2162 and a back side 2164'. The cover 216 passes over the edge of the back side 2164

It is disposed on the convex frame 2126 of the base 212 for isolating the image sensing wafer 214 from the external environment. [Improving the reliability of the image sensing and wafer 214 [0024]

The lens barrel 262 is provided with at least one set of lenses 2624. One end of the lens barrel 262 is disposed at one end of the lens holder 264, and the lens holder 264 is not provided with one end of the FF 262 through the sleeve. ^ 3 6 is integrated with the image sensor package 210. ::’ r :

[0025] The difference between the image capturing device 200 and the image capturing device 1 is: [0026] a plurality of conductive sheets 2128 are further disposed on the top of the convex frame 21 26 of the base 212 in the image sensor package 210. The conductive sheet 2128 is electrically connected to the lower surface 2144 of the 212 through a circuit disposed inside the substrate 212, and can be electrically connected through an electrical connection point 2129 disposed on the lower surface 2144. [0027] The back surface 21 64 of the cover plate 216 further includes a non-electrode region 21 65 and an electrode region 2166 surrounding the non-electrode region 21 65. The non-electrode region 2165 and the image sensing disposed under the cover plate 216 Sensing area of wafer '214 2145 096110286 Form number Α 0101 Page 10 / Total 30 pages 1003111032-0 1343740

On March 31, 1DD, the positive replacement "S is relatively positive; the area of the non-electrode region 2165 is equal to or larger than the area of the sensing region 2145, and the electrode region 2166 of the cover plate 216 is provided with a plurality of electrodes 2167'. One end of each of the electrodes 2167 is electrically connected to the conductive sheet 21 28 of the top of the convex frame 2126 of the base 212 by a cover plate 216. [0028] The carrier 230 is a thin connecting layer, which can function as an electrical connection and a structural connection, such as an anisotropic conductive film or an anisotropic conductive paste. The carrier 230 is disposed on the cover. The electrode region 2166 of the back surface 2164 of the plate 216 is on. [0029] The passive component 240 is disposed on the carrier 230, and is electrically and electrically connected to the electrode region 21 6 of the cover 21 & [0030] In the embodiment, the conductive electrode 2167 is disposed on the cover 216 of the image sensor package 21, and the passive component 240 is structurally and electrically connected to the cover 216 through the carrier 230, and then The cover plate 216 is pressed against the convex frame 2126 of the base 212, and the conductive electrodes 2 67 are respectively pressed onto the conductive piece 2128 at the top of the convex frame 21 26, and the circuit and the electrical property disposed inside the base 2 2 are electrically connected. The connection point 2129 is electrically connected. The passive component 240 is disposed in a space formed between the cover 6 of the image sensor package 210 and the non-sensing area 2146 of the image sensing chip 214, thereby improving the image sensor package 210 and applying the same. The space utilization rate of the image capturing device 200 of the image sensor package 2 is achieved for the purpose of miniaturization of the image capturing device 2 and the image sensor package. [0031] Please refer to FIG. 4, which is a third preferred embodiment of the image capturing device of the present invention. The image capturing device 300 is similar to the image capturing device 2A, and includes an image sense 096110286 Form Compilation A0101 Page 1 of 30 Page 10031U032-0 1343740 [0033] [0035] 096110286 On March 31, 100, the shuttle module 310, the carrier 330, the passive component 340, and the lens module 360. The image sensor package 310 includes a substrate 312, an image sensing wafer 314, and a cover 316. The base 312 includes a first surface 3122 and a second surface 314. The first surface 3122 further defines a convex frame 3126. The convex frame 3126 and the first surface 3122 define a cavity 3127. The test wafer 314 is disposed in the cavity 3127. A plurality of conductive sheets 3128 are disposed on the top of the convex frame 3126 of the base 312. The conductive sheets 3128 are electrically connected to the electrical connection points 31 (9) provided on the lower surface 3124 of the base 312 through a circuit disposed inside the base 312. The image sensing wafer 314 is a light number. The image sensing wafer 314 has 3144, and the upper surface 3142 includes

The image-sensing wafer 3.14 is fixed on the substrate 312 and electrically connected to the substrate 3Ϊ2 through the lower surface 3144 of the sensing region 314 5 . The cover plate 316 includes a front surface 31 and a rear surface 31, and a cover portion is provided on the back surface of the base 312. The wafer 314 is isolated from the external environment to improve the reliability of the image sensing wafer 3j4. The lens module 360 includes a lens barrel 362, a lens holder 364 and a dry material 366. The lens barrel 362 is provided with at least one set of lenses 3624. One end of the lens barrel 362 is placed on the lens holder 364. At one end, the lens holder 364 is not provided with one end of the lens barrel 362 and is integrally connected to the image sensor package 310 by an adhesive material 366. The difference between the image capturing device 300 and the image capturing device 2 is: Form No. Α0101 Page 12 of 30 1003111032-0

1343740 On March 31, 100, the shuttle replacement page [0036]

The front surface 3162 of the cover plate 316 further includes a non-electrode region 3165 and an electrode region 3166 surrounding the non-electrode region 31 65. The non-electrode region 3165 and the image sensing chip 314 disposed under the cover plate 316 are sensed. The measurement area 3145 is relatively positive, and the area of the non-electrode area 3165 is equal to or larger than the area of the sensing area 3145. The electrode area 3166 of the cover 316 is provided with a plurality of conductive electrodes 3167. One end of each of the conductive electrodes 3167 is disposed. In the electrode region 3166, the other end of the cover plate 316 is bent twice and then fixed on the edge of the back surface 3164 of the cover transparent plate 316. The conductive electrodes 3167 are respectively pressed by the cover plate 316. The conductive sheet 3128 on the top of the convex frame 3126 of the base 312 is electrically connected to the conductive sheet 3128. [0037] The carrier 330 is a thin connecting layer, which can function as an electrical connection and a structural connection, such as an anisotropic conductive film or an anisotropic conductive paste. The carrier 330 is disposed on the cover. Plate 316 has an electrode region 3166 on front side 3162. [0038] The passive component 340 is disposed on the carrier 330, and is electrically and electrically connected to the electrode region of the cover 316 by the carrier 330. [0039] In the present embodiment, the passive component 340 is disposed in the electrode region 3166 of the transparent cover 316 of the image sensor package 310. The electrode region 3166 corresponds to the image sensing chip 314 in the image sensor package 310. The image sensing area 3146' eliminates the need to reserve space for the passive component 34 on the circuit board 32', thereby saving space, reducing the image sensor package 31 and applying image capture of the image sensor package 310. The purpose of the volume of the device 300 [0040] Please refer to FIG. 5, a fourth preferred embodiment of the image capturing device of the present invention, the 096110286 form number A0101 page 13 / total 30 pages 1003111032-0 1343740 100 March 31 The image capture device 400 includes a video sensor package 410, a carrier 430, a passive component 440, and a lens module 460. [0041] The image sensor package 410 includes a substrate. 412. An image sensing wafer 414 and a cover 416. The base 412 includes a first surface 4122 and a second surface 4124. The first surface 4122 further defines a convex frame 4126. The convex frame 4126 and the first surface 4122 define a cavity 4127. The image sensing is performed. The wafer 414 is disposed in the cavity 4127. [0042] The image sensing chip 414 is a photosensitive member that converts the optical signal into telecommunications.

The image sensing wafer 414 has a 4144, and the upper surface 4142 includes and the non-sensing region 4146 around the sensing region 4145. The lower surface 4144 is fixed on the substrate 412 and electrically connected to the substrate 412. connection. [0043]

The lower surface cover 416 includes a front surface 4162 and a rear surface 4164. The front surface 4162 of the cover further includes a non-electrode region 4165. The electrode region 4166 of the electrode region 41 6 5 is disposed. The sensing area 4145_ of the image sensing wafer 414 under the cover 416 is relatively positive, the area of the non-electrode area 4165 is equal to or larger than the area of the sensing area 4145, and a plurality of conductive areas are disposed in the electrode area 4166 of the cover 416. The electrode 4167 is disposed on the convex frame 4126 of the base 412 through the edge portion of the back surface 4164 for isolating the image sensing wafer 414 from the external environment, thereby improving the reliability of the image sensing wafer 414. The carrier 430 is a thin connecting layer, which can function as an electrical connection and a structural connection, such as an anisotropic conductive film or an anisotropic conductive paste, etc. 096110286 Form No. A0101 Page 14 of 30 1003111032-0 [3434] 1343740 100 DJ 31st, the shuttle IE replaces the sheet material, and the carrier 430 is disposed on the electrode region 41 6 6 of the front surface 4162 of the cover plate 416. [0045] The passive component 440 is disposed on the carrier 430, and is electrically and electrically connected to the electrode region of the cover 416 by the carrier 430. [0046] The lens module 460 includes a lens barrel 462 and a lens holder 464. The lens barrel 462 is provided with at least one set of lenses, and one end of the lens barrel 462 is disposed at one end of the mirror holder 436. The difference between the image capturing device 400 and the image capturing device 300 is as follows: [0048] The image capturing device 400 further includes a circuit board 420 and a plurality of wires 450, and the circuit board 420 is provided with a patterned circuit for performing Electrical transmission. The image sensor package 410 is structurally and electrically connected to the circuit board 420 via a second surface 4124 of the base 412. The lens module 4β is not provided with one end of the lens barrel 462 connected to the The circuit board 420 is mounted on the inside of the device. [0049] One end of the plurality of wires 450 is connected to the electrode 4167 of the cover plate 416, and the other end is connected to the image forming circuit of the circuit board for being disposed on the cover plate 41 6 The upper passive component 440 is electrically connected to the circuit board 420. It can be understood that some electrodes may be disposed in the carrier 430 and electrically connected to the circuit board 420 through the wires 450, thereby electrically connecting the passive component 440. Connected to the circuit board 420. [0050] In the present embodiment, the image capturing device 400 is similar to the image capturing device 300, and the passive component 440 is disposed in the electrode region 4166 of the cover 41 6 of the image sensor package 4*0, and the electrode region 4166 corresponds to The image sensor is used to view the non-image sensing area 4146 of the image sensing chip 414 in 410, so that no 096110286 form is prepared, 101 0101, page 15 / total 30 pages 1003111032-0 1343740, and the replacement page needs to be revised on March 31, 100. Space is reserved for the passive component 440 on the circuit board 420, thereby saving space, and the purpose of reducing the volume of the image sensor package 41 0 and the image capturing device 400 of the image sensor package 410 is achieved. Referring to FIG. 6, a fifth preferred embodiment of the image capture device of the present invention includes a circuit board 510, an image sensing chip 520, a carrier 530, a passive component 540, a wire 550, and a mirror mount 560. And lens barrel 570

The circuit board 510 is configured to carry the image sensing chip 520 and the lens holder 560, and is provided with a patterned circuit for transmitting the sensing signal of the image sensing chip 520.

number. The image sensing wafer 520 is converted into a photoelectric signal. The image sensing wafer 520 has a lower surface 524, and the upper surface 52 2 includes a sensing region 520 and a ring mold: the sensing region 5 A non-sensing area 526 of 25 is disposed on the non-sensing area 526 with a plurality of wafer solder pads 527. The image sensing wafer 5 is crimped 4: its surface is fixed on the circuit board 51 0. [0054] The carrier 530 is a thin connecting layer, which mainly provides electrical and structural connections for passive components. It is mainly composed of a resin adhesive, a conductive ion, and an electrode 532 anisotropic conductive film, that is, the conductive film can be electrically conducted in one direction and insulated in other directions. The conductive particles are filled in a resin adhesive, and the electrode 532 is filled with a resin of conductive particles, wherein the resin adhesive portion can be used to provide moisture-proof, heat-resistant, insulating, and fixed passive components 540 and the carrier 530. The electrode 532 is placed and provides a certain pressing force to maintain the contact area between the particles of the electrode 532. Conductive particles are used to be numbered 1003111032-0 0961 10286 Form number Α0101 Page 16 / Total 30 pages 1343740 • ·· 100 years 〇 March 31 revision "100 | The electrode of the connector and the electrode 532 set in the carrier 530 The carrier 530 is disposed on the non-sensing area 526 of the upper surface 522 of the image sensing chip 520. [0055] The passive component 540 is used to improve the quality of the image sensing signal transmission, and may be an inductive component or a capacitive component. The resistor element is disposed on the carrier 530. The passive component 540 is further provided with a plurality of electrodes (not labeled). The electrode of the passive component 540 and the electrode 530 of the carrier 530 pass through the conductive particles disposed on the carrier 530. The electrical connection φ [0056] The wire 550 is used to electrically connect the image sensing chip 520 and the passive component 540 to the circuit board 510, wherein one end of the partial wire 550 is connected to the die pad 527 of the image sensing die 520. The other end is connected to the circuit board, on the patterned circuit of 51, to electrically connect the image sensing wafer 50 to the circuit board 510; the other end of the wire 550 is connected to the electrode of the carrier 530. One end is connected to the conductive line of the circuit board 510 for electrically connecting the passive component 540 to the circuit board 510. [0057] The mirror mount 560 is a stepped hollow body including a first receiving portion 562 and located The second accommodating portion 564 is disposed below the second accommodating portion 564, and the inner diameter of the second accommodating portion 564 is larger than the inner diameter of the first accommodating portion 562. The second accommodating portion 564 includes a dam wall 566. The lens holder 560 is fixed on the circuit board 510 through the sidewall 566 of the second receiving portion 564 , and the image sensing chip 520 and the passive component disposed on the image sensing chip 520 are received by the second receiving portion 564 . [0058] The lens barrel 570 is a middle-hole cylinder, and the lens barrel 570 is sequentially provided with a filter 572 and a lens 574. One end of the lens barrel 570 is received in the mirror holder 560 096110286 Form 煸珑A0101 Page 17 of 30 1003111032-0 1343740 On March 31, 100, the shuttle is replacing the first accommodating portion 562. The light can be incident through the filter 572 and the lens 574 and irradiated on the image sensing wafer. 5 2 0 sensing area 5 2 5 . [0059] In this embodiment, the passive component 540 is set by the carrier 530 The non-sensing area 526 of the image sensing chip 520 is disposed, and the space between the sensing area 525 of the image sensing chip 520 and the wafer pad 527 is fully utilized, and no additional reservation is required for the passive component 540. Space, thereby saving space, and achieving the purpose of miniaturizing the image capturing device. [0060]

In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a few preferred embodiments of the present invention, and the scope of the present invention is not limited to those skilled in the art, and the invention may be included in the following application. BRIEF DESCRIPTION OF THE DRAWINGS [0061] FIG. 1 is a cross-sectional view of a conventional image sensor. 2 is a cross-sectional view of the image pickup device of the present invention. 3 is a cross-sectional view showing a second preferred embodiment of the image pickup apparatus of the present invention. 4 is a cross-sectional view showing a third preferred embodiment of the image pickup apparatus of the present invention. 5 is a cross-sectional view showing a fourth preferred embodiment of the image pickup apparatus of the present invention. 6 is a cross-sectional view showing a fifth preferred embodiment of the image pickup apparatus of the present invention. [Description of Main Component Symbols] [0067] (Regular) Image Sensor Package: 10 [0068] Base: 1 096110286 Form No. A0101 Page 18 of 30 1003111032-0 1343740

100 years D3 month 31 revision key ^ page [0069] support: 2 [0070] image sensing chip: 3 [0071] passive component: 4 [0072] transparent cover: 5 [0073] cavity: 6 [0074 [Invention] [0075] Image capturing device: 1 〇〇, 200, 300, 400 '500 [0076] Image sensor package: 110, 210, 310, 410 [0077] Base: 112, 212, 312, 412 [0078] Upper surface: 1122, 2122, 3122, 4122 [0079] Lower surface: 1124, 2124, 3124, 4124 [0080] Electrical connection block: 1123 [0081] Conductive & block: 1125 [0082] Image sense Test wafer: 114, 214, 314, 414 '520 [0083] Upper surface: 1142, 2142, 3142, 4142, 522 [0084] Lower surface: 1144, 2144, 3144, 4144, 524 [0085] Sensing area: 1145 2145, 3145, 4145, 525 [0086] Non-sensing area: 1146, 2146, 3146, 4146 '526 [10487] Wafer pads: 1147, 527 Form number Λ 0101 Page 19 / Total 30 pages 096110286 1003111032-0 1343740 Correction replacement page on March 31, 100 [0088] [0010] [0099] [0099] [0099] [0099] 0101] [010 2] [0105] Carrier: 116 ' 230 ' 330 ' 430 ' 530 Electrode: 1162, 532 Passive components: 117, 240, 340, 440, 540 Conductor: 118, 450, 550 Cover Board: 119, 216, 316, 416 Lens: 130 Lens barrel: 132, 262, 362, 462, 570 convex frame: 2126, 3126, 4126, cavity: 2127, 3127, 4127 Conductive sheet: 2128, 3128 Electrical connection Points: 2129, 2129, 3129 (cover) front: 2162, 3162, 4162 (cover) back: 2164, 3164, 4164

Lens: 1324, 2624, 3 grid 24

Second accommodating part: 1 344, 564 Side wall: 1 346, 566 Bonding material: 136, 266, 366,

096110286 Form No. A0101 Page 20/Total 30 Page 1003111032-0 1343740 The shuttle is replacing the page on March 31, 100 [0107] Non-electrode area: 2165, 3165, 4165 [0108] Electrode area: 2166, 3166, 4166 [0109 Conductive electrode: 2167, 3167, 4167 [0110] Lens module: 260, 360, 460 [0111] Circuit board: 420, 510 [0112] Filter: 572 [0113] Lens: 574

096110286 Form No. A0101 Page 21 of 30 1003111032-0

Claims (1)

1343740 Correction and replacement page on March 31, 100. Patent application scope: 1. An image sensor package comprising: a substrate; an image sensing wafer, the image sensing wafer comprising an upper surface and a lower surface a sensing area and a non-sensing area surrounding the sensing area are formed on the upper surface thereof, wherein the sensing area is used for sensing light and converting it into an electrical signal, the image sensing the electrical properties and structure of the wafer Connected to the substrate; a cover plate is supported by the substrate above the image sensing wafer; a carrier disposed in the non-image sensing area of the image sensing chip At least one passive component, the passive charging, and electrically connected to the substrate, as in the image sensor of claim 1, wherein the carrier is an electrical and structural connecting layer 3. Patent application No. 2, the shore detector package, wherein the carrier is an anisotropic conductor composed of a bonding resin and a conductive particle, and an electrical connection layer. 4 . An image sensor package comprising: a substrate; an image sensing wafer, wherein the image sensing wafer includes an upper surface and a lower surface, and a sensing region is formed on the upper surface thereof and surrounds the sensing region a non-sensing area for sensing light and converting it into an electrical signal, the image sensing chip being electrically and structurally connected to the substrate; a cover plate, the cover plate comprising An electrode region and a non-electrode region, wherein the non-electrode region is opposite to the sensing region of the image sensing chip, the cover plate is formed by the base 096110286, form number A0101, page 22, total 30 pages, 1003111032-0 1343740 Nuclear replacement page of March 31, 100 10 . 11 . 12 is supported on the image sensing wafer; at least one passive component is disposed in the electrode region of the cover and electrically connected to the substrate. The image sensor package of claim 4, wherein the image sensor package further comprises a plurality of wires, the passive component being electrically connected to the substrate by the wires. The image sensor package of claim 4, wherein a convex frame is formed on the base body, and a plurality of conductive sheets are disposed on the top of the convex frame, and the plurality of conductive sheets are electrically connected through a circuit disposed inside the base body. Connected to the bottom of the substrate, a plurality of conductive electrodes are disposed in the cover electrode region, and the passive component is disposed on the electrode region of the cover plate and electrically connected to the conductive electrode disposed thereon. The cover plate is fixed on the convex frame of the base body, and the conductive electrode disposed on the cover plate is electrically connected to the conductive sheet on the convex frame. The image sensor package of claim 6, wherein the cover plate comprises a front surface and a back surface, and the cover plate is disposed on the convex frame of the base body through the back edge thereof, the electrode region Formed on the back of the cover. The image sensor package of claim 7, wherein the electrode region is formed on a front side of the cover. The image sensor package of any one of claims 4 to 8, wherein the image sensor package further comprises a carrier disposed on an electrode area of the cover, the passive component setting On the carrier. The image sensor package of claim 9, wherein the carrier is an electrical and structural connection layer. The image sensor package of claim 10, wherein the carrier is an anisotropic conductive film composed of a bonding resin and conductive particles. An image capturing device comprising: 096110286 Form No. A0101 Page 23/Total 30 Page 1003111032-0 1343740 On March 31, 100, the shuttle is replacing a page lens module; and the lens module is set as claimed. The image sensor package of any one of claims 4 to 8. The image capturing module of claim 12, wherein the lens module further comprises a lens holder, a lens and an adhesive material, wherein the lens houses an imaging lens and a filter. The lens is coupled to the lens holder, and the lens holder is integrally coupled to the image sensor package by the bonding material. The image capturing device includes a circuit board; an image sensing chip, the image sensing a surface on which a sensing region is formed, the sensing region for sensing light And a non-sensing signal of the surface of the image sensing chip, wherein the image sensing chip is electrically and structurally connected to the power; the carrier is disposed on the non-image sensing area 15 of the image sensing chip 16 at least one passive component disposed on the carrier and electrically connected to the base; a lens module, the lens module is disposed on the circuit board and the image is sensed The wafer is housed therein. The image capture device of claim 14, wherein the carrier is an electrically and structurally connected layer. The image pickup device according to claim 14, wherein the carrier is an anisotropic conductive connection layer composed of a binder resin, conductive particles, and a conductive electrode. 096110286 Form No. A0101 Page 24 of 30 1003111032-0