CN110708454B - Camera module based on molding process - Google Patents
Camera module based on molding process Download PDFInfo
- Publication number
- CN110708454B CN110708454B CN201911129020.8A CN201911129020A CN110708454B CN 110708454 B CN110708454 B CN 110708454B CN 201911129020 A CN201911129020 A CN 201911129020A CN 110708454 B CN110708454 B CN 110708454B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- camera module
- filter
- support
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
A camera module based on a molding process comprises: a lens, a photosensitive chip and a circuit board component; the photosensitive chip is mounted on the circuit board assembly, and the lens is located in a photosensitive path of the photosensitive chip; the circuit board assembly comprises a circuit board part and a packaging part, wherein the packaging part is integrally packaged and connected with the circuit board part based on a molding process, and the packaging part is provided with a through hole and provides a photosensitive path for the photosensitive chip.
Description
Technical Field
The invention relates to the field of camera modules, in particular to a camera module based on a molding process.
Background
Fig. 1 is a schematic diagram of a camera module in a conventional COB (Chip On Board) process. The camera module comprises a circuit board 1P, a photosensitive chip 2P, a base 3P, an optical filter 4P, a motor 5P and a lens 6P. The photosensitive chip 2P is mounted on the wiring board 1P, the filter 4P is mounted on the base 3P, the lens 6P is mounted on the motor 5P, and the motor 5P is mounted on the base 3P.
The optical system of the camera module is a key factor influencing the imaging quality of the camera module, and the optical system has a great relationship with the optical axes of the lens 6P, the optical filter 4P and the photosensitive chip 2P and the ray incidence prevention line. In the transmission camera module, the base 3P is used for providing a mounting position for the optical filter 4P, the motor 5P or the lens 6P, so that each component can be arranged according to the optical path of the optical system.
However, the base 3P of the conventional COB process is usually a plastic bracket, and is fixed to the circuit board 1P by means of adhesion, wherein there are many disadvantages.
First, the conventional base 3P is poor in flatness due to its own manufacturing factors, and thus cannot provide good mounting conditions for the motor 5P, the lens 6P, and the optical filter 4P, so that the motor 5P, the lens 6P, and the optical filter 4P are prone to tilt or deviation, and thus the requirement for the precision of the mounting process of the motor 5P, the lens 6P, and the optical filter 4P is high.
Next, the conventional base 3P is usually bonded to the circuit board 1P, so that when the base 3P is mounted and fixed, inclination or deviation is likely to occur, and the cumulative error of the entire camera module is further increased.
In addition, circuit devices 11P, such as resistors, capacitors, etc., are usually mounted on the circuit board 1P, these circuit devices 11P protrude from the surface of the circuit board 1P, and the base 3P needs to be mounted on the circuit board 1P with the circuit devices 11P, whereas the assembly and matching relationship among the circuit board 1P, the circuit devices 11P and the bracket 3P in the conventional COB process has some disadvantages, and the mounting space for the base 3P is small, thereby increasing the requirement of the camera module on the transverse dimension.
Disclosure of Invention
One objective of the present invention is to provide a camera module based on a molding process, wherein the camera module includes a circuit board assembly, the circuit board assembly includes a package portion and a circuit board portion, and the package portion is integrally formed on the circuit board portion to provide good mounting conditions for a lens, a motor or a filter of the camera module.
The invention aims to provide a camera module based on a molding process, wherein the top end of the packaging part of the circuit board assembly is planar, and the optical filter is installed at the top end of the packaging part, so that the optical filter is installed flatly.
An object of the present invention is to provide a camera module based on a molding process, wherein the packaging portion of the circuit board assembly has a mounting groove, and the optical filter is mounted in the mounting groove to provide a flat and stable mounting position for the optical filter.
An object of the present invention is to provide a camera module based on a molding process, wherein the camera module comprises a support, the support is mounted on the packaging part, and the optical filter is mounted on the support.
An object of the present invention is to provide a camera module based on a molding process, in which the lens includes a barrel, and the optical filter is mounted in the barrel, so that it is not necessary to provide an additional part for mounting the optical filter.
An object of the present invention is to provide a camera module based on a molding process, wherein the circuit board portion includes a circuit board main body having a passage, and the optical filter is mounted at an upper end of the passage, thereby reducing a back focus of the camera module.
An object of the present invention is to provide a camera module based on a molding process, wherein the circuit portion includes at least one circuit component, the circuit component protrudes from the circuit board main body, and the circuit component is covered by the encapsulation portion, so that the circuit component is not directly exposed to the outside, and the space available for the encapsulation portion is increased.
In order to achieve the above object, an aspect of the present invention provides a camera module based on a molding process, including: the device comprises at least one lens, at least one photosensitive chip and at least one circuit board component; the photosensitive chip is mounted on the circuit board assembly, and the lens is located in a photosensitive path of the photosensitive chip; the circuit board assembly comprises a circuit board part and a packaging part, wherein the packaging part is integrally packaged and connected with the circuit board part based on a molding process, and the packaging part is provided with a through hole and provides a photosensitive path for the photosensitive chip.
According to an embodiment of the present invention, the image capturing module includes at least one optical filter, and the optical filter is mounted on the package portion, so that the optical filter is mounted flatly.
According to an embodiment of the present invention, the package portion of the camera module has a top surface, and the filter is mounted on the top surface and extends in a plane.
According to an embodiment of the present invention, the camera module includes at least one motor, the lens is mounted on the motor, and the motor is mounted on the package portion.
According to an embodiment of the present invention, the lens of the camera module is mounted on the package portion.
According to an embodiment of the present invention, the packaging portion of the camera module has at least one mounting groove, the mounting groove is communicated with the through hole, and the optical filter is mounted in the mounting groove.
According to an embodiment of the present invention, the mounting groove of the camera module is U-shaped and communicated with the outside.
According to an embodiment of the present invention, the camera module includes at least one optical filter, at least one motor, and at least one support, the optical filter is mounted on the support, the support is mounted on the mounting groove, the lens is mounted on the motor, and the motor is mounted on the package portion.
According to an embodiment of the invention, the camera module comprises at least one support and at least one filter, the filter is mounted on the support, and the support is mounted on the mounting groove.
According to an embodiment of the present invention, the image capturing module includes a support and a filter, the filter is mounted on the support, and the support is mounted on the package portion.
According to an embodiment of the present invention, the camera module includes at least one motor, and the motor is mounted on the support.
According to an embodiment of the present invention, the lens of the camera module is mounted on the support.
According to an embodiment of the present invention, the image capturing module of the image capturing module includes at least one support and at least one optical filter, the packaging portion has a mounting groove, the support is mounted in the mounting groove of the packaging portion, and the optical filter is mounted on the support.
According to an embodiment of the present invention, the support in the camera module has a first support groove on an inner side of a top portion and a second support groove on an outer side of a bottom portion, the first support groove is used for mounting the optical filter, and the second support groove enables the support to be clamped in the packaging portion, so that a distance between the optical filter and the photosensitive chip is reduced.
According to an embodiment of the present invention, the camera module includes at least one motor and at least one filter, the filter is mounted on the motor, and the motor is mounted on the package.
According to an embodiment of the present invention, the image capturing module includes at least one optical filter, the lens includes a lens barrel and at least one lens, each lens is mounted on the lens barrel, and the optical filter is mounted on the lens barrel and located below each lens.
According to an embodiment of the present invention, the image capturing module includes at least one optical filter, the circuit portion includes a circuit board main body, the packaging portion is integrally packaged and connected to the circuit board main body, the circuit board main body has a passage, the photosensitive chip is inversely installed in the passage, and the optical filter covers the passage of the circuit board main body.
According to an embodiment of the present invention, the package portion of the camera module is integrally connected to the circuit board portion by injection molding or mold pressing.
According to an embodiment of the present invention, the circuit board portion of the camera module includes a circuit board main body and at least one circuit component, the circuit component protrudes from the circuit board main body, and the package portion covers the circuit component so as not to be exposed to a space communicated with the photosensitive chip.
According to an embodiment of the present invention, at least two sides of the top of the package portion respectively have at least one protruding step, and an installation groove is formed on the inner side of the protruding step, the camera module further includes at least one support and at least one optical filter, the support is installed in the installation groove on the inner side of the protruding step, and the optical filter is installed on the support.
According to an embodiment of the invention, a top surface of at least one side of the top of the encapsulation is not provided with the raised step for supporting the support.
According to an embodiment of the present invention, the top surface of the raised step is higher than the surface of the support, and the camera module further includes a motor attached to the raised step.
Drawings
Fig. 1 is a schematic cross-sectional view of a camera module according to a conventional COB process.
Fig. 2 is a schematic cross-sectional view of a camera module based on a molding process according to a first preferred embodiment of the present invention.
Fig. 3 is a schematic exploded perspective view of a camera module based on a molding process according to a first preferred embodiment of the present invention.
Fig. 4 is another implementation of a camera module based on a molding process according to a first preferred embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of a camera module based on a molding process according to a second preferred embodiment of the present invention.
Fig. 6 is a schematic cross-sectional view of a camera module based on a molding process according to a third preferred embodiment of the present invention.
Fig. 7 is a schematic cross-sectional view of an image pickup molding based on a molding process according to a fourth preferred embodiment of the present invention.
Fig. 8 is a schematic cross-sectional view of a camera module based on a molding process according to a fifth preferred embodiment of the present invention.
Fig. 9 is a schematic cross-sectional view of a camera module based on a molding process according to a sixth preferred embodiment of the present invention.
Fig. 10 is a schematic sectional view of a camera module based on a molding process according to a seventh preferred embodiment of the present invention.
Fig. 11A and 11B are schematic cross-sectional views from different angles of a camera module based on a molding process according to an eighth preferred embodiment of the invention.
Fig. 12 is a partial perspective view of a camera module according to an eighth preferred embodiment of the present invention based on a molding process.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
As shown in fig. 2 to 4, the present invention is a camera module based on a molding process according to a first preferred embodiment of the present invention. The camera module can be applied to various electronic devices to assist in shooting activities through the camera module, for example, the camera module can be used for shooting images or video images of objects or people. Preferably, the camera module can be applied to a mobile electronic device, for example, the mobile electronic device can be, but is not limited to, a mobile phone or a tablet computer device.
As shown in fig. 2 to 4, the camera module includes a circuit board assembly 10, a photosensitive chip 30 and a lens 50.
Further, the photosensitive chip 30 is mounted on the circuit board assembly 10, the lens 50 is located on the circuit board assembly 10, and the lens 50 is located in a photosensitive path of the photosensitive chip 30. The wiring board assembly 10 may be coupled to the electronic device for use with the electronic device. It will be understood by those skilled in the art that the lens 50 and the chip may cooperate to capture an image. Specifically, light reflected by a subject such as an object or a person passes through the lens 50 and is received by the photo sensor chip 30 to be photoelectrically converted. In other words, the photosensitive chip 30 can convert the optical signal into an electrical signal, and the electrical signal can be transmitted to the electronic device through the circuit board assembly 10, so that an image related to the photographic subject is generated on the electronic device.
The circuit board assembly 10 includes a packaging portion 11 and a circuit board portion 12, and the packaging portion 11 is integrally packaged and connected to the circuit board portion 12, such as molded and connected to the circuit board portion 12. More specifically, the package portion 11 is molded and connected to the circuit Board portion by Molding On Board (MOB), and the Molding process may be injection Molding or mold pressing.
The circuit board portion 12 includes a circuit board main body 121, and the package portion 11 is integrally connected to the circuit board main body 121. The packaging part 11 forms a through hole 111, so that the packaging part 11 surrounds the outer side of the photosensitive chip 30 and provides a light path for the lens 50 and the photosensitive chip 30. The photosensitive chip 30 is disposed on the prime number circuit board main body 121 corresponding to the through hole 111.
The circuit board portion 12 includes a connecting line 31 and at least one circuit component 122, the connecting line 31 is preset in the circuit board main body 121, and the circuit component 122 is electrically connected to the connecting line for the photosensitive working process of the photosensitive chip 30. The circuit element 122 may be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, etc.
It should be noted that the package portion 11 can enclose the circuit element 122 inside, so that the circuit element 122 is not directly exposed to the space, and more specifically, is not exposed to the closed environment communicating with the photosensitive chip 30. Different from the conventional camera module in which the circuit device is present, for example, the capacitance-resisting device protrudes from the circuit board, dust and impurities are prevented from staying in the circuit element 122 and contaminating the photosensitive chip 30. In this embodiment of the present invention, the circuit element 122 is illustrated as protruding from the circuit board main body 121, while in other embodiments of the present invention, the circuit element 122 is embedded inside the circuit board main body 121 without protruding from the circuit board main body 121, and it should be understood by those skilled in the art that the structure, type and location of the circuit element 122 are not limited by the present invention. It can be understood that in the driving camera module, the circuit device protrudes from the circuit board, and the base can only be installed outside the circuit component 122, so that both the circuit device and the base need a certain space position, and thus the requirement for the transverse dimension of the circuit board is high. For the camera module based on the molding process of the present invention, the encapsulating portion 11 is integrally encapsulated in the circuit board main body 121 and encapsulates the circuit element 122, so that the encapsulating portion 11 and the circuit element 122 are overlapped in space, thereby increasing the space in which the encapsulating portion 11 can be disposed inwards, reducing the requirement for external extension of the circuit board main body 121, and reducing the lateral dimension of the camera module, so that the camera module can meet the requirement for miniaturization.
It should be noted that the encapsulating portion 11 encapsulates the circuit element 122, so as to protect the circuit element 122 from being contaminated and mistakenly touched, and at the same time, provide advantages for the corresponding camera module, but it should be understood by those skilled in the art that the encapsulating portion 11 is not limited to encapsulating the circuit element 122. That is, in other embodiments of the present invention, the package portion 11 may be directly molded on the circuit board main body 121 without the protruding circuit element 122, or may be molded on different positions such as the outer side and the periphery of the circuit element 122.
In this embodiment of the present invention, the encapsulation part 11 is convexly surrounding the outside of the photosensitive chip 30, and particularly, the encapsulation part 11 is integrally connected in a closed manner so as to have good sealing performance, so that when the lens 50 is installed on the photosensitive path of the photosensitive chip 30, the photosensitive chip 30 is sealed inside, thereby forming a corresponding closed inner space.
Specifically, in manufacturing the circuit board assembly 10, a conventional circuit board may be selected as the circuit board main body 121, and molding may be performed on the surface of the circuit board main body 121. For example, in one embodiment, the encapsulation portion 11 may be formed by integrally encapsulating, such as Molding, the circuit board subjected to the SMT (Surface Mount Technology) process by an Insert Molding (Insert Molding) process using an injection Molding machine, or by forming the encapsulation portion 11 by a Molding process commonly used in semiconductor packaging. Further, each of the photosensitive chips 30 is attached to the circuit board main body 121, and then each of the photosensitive chips 30 is electrically connected to the circuit board main body 121, for example, by gold plating. The circuit board main body 121 may be selected, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner in which the enclosure 11 is formed may be selected, by way of example and not limitation, from an injection molding process, a molding process, and the like. The material of the sealing portion 11 is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc. may be selected as the injection molding process, and epoxy resin may be used as the molding process. It will be appreciated by persons skilled in the art that the foregoing alternative forms of manufacture, as well as alternative materials, are merely illustrative of the possible embodiments of the invention and are not limiting of the invention.
In other embodiments of the present invention, the process of manufacturing the circuit board assembly 10 may further include performing an SMT process on the circuit board main body 121, attaching the photosensitive chip 30 to the circuit board main body 121, electrically connecting the photosensitive chip 30 and the circuit board main body 121, for example, electrically connecting a gold wire, and then integrally packaging the circuit board main body 121, for example, molding the circuit board main body to form the packaging portion 11 by insert molding, or forming the packaging portion 11 by a molding process commonly used in semiconductor packaging. It should be understood by those skilled in the art that the order of manufacture of the wiring board assembly 10 is not a limitation of the present invention.
The camera module comprises a filter 40, and the filter 40 is mounted on the packaging part 11 so as to provide stable and flat mounting conditions for the filter 40.
More specifically, in an embodiment of the present invention, the Filter 40 is implemented as an infrared-Cut Filter 40 (IRCF), and the infrared-Cut Filter 40 is an optical Filter 40 that is formed by alternately plating optical films with high refractive index on an optical substrate by using a precision optical plating technique to realize high transmittance in the visible light region (400-. The infrared cut-off filter 40 is added into an imaging system of the camera module to block infrared light of the imaging system which partially interferes with imaging quality, so that an image formed by the camera module is more in line with the best feeling of human eyes.
It should be noted that, because the light sensing chip 30, such as CCD or CMOS, is different from human eyes in light sensing, human eyes can only see visible light in the 380-780nm band, and the light sensing chip 30 can sense more bands, such as infrared light and ultraviolet light, and is especially sensitive to infrared light, infrared light must be suppressed in the camera module, and high transmittance of visible light is maintained, so that the sensing of the light sensing chip 30 is close to human eyes, and the image taken by the camera module also conforms to the sensing of eyes, so the infrared cut-off filter 40 is indispensable for the camera module.
In particular, in an embodiment of the present invention, the filter 40 may be selected from the group consisting of: wafer level infrared cut-off filter, narrow band filter, blue glass IRCF. It will be understood by those skilled in the art that the type of filter 40 is not a limitation of the present invention.
In the conventional COB-assembled camera module, the optical filter is usually mounted on the plastic base, and the base is usually mounted on the circuit board by bonding, so that the plastic base and the corresponding mounting method are not easy to deviate or incline, and the surface flatness of the plastic support is poor, so that a good mounting condition cannot be provided for the optical filter 40. According to the preferred embodiment of the present invention, the optical filter 40 is mounted on the encapsulation portion 11, and a good surface flatness can be obtained based on a molding process, so that a flat mounting condition can be provided for the optical filter 40, and the encapsulation portion 11 is not easily displaced or tilted in an integrated manner, thereby reducing an accumulated tolerance when the optical filter 40 is mounted.
In this embodiment of the present invention, the top surface 112 of the package 11 integrally extends in a plane, and the filter 40 is mounted on the top surface 112 of the package 11. In particular, the filter 40 may be attached to the top surface 112 of the encapsulation 11 by means of adhesion.
In this embodiment of the present invention, the camera module includes a motor 60, such as a voice coil motor, and the lens 50 is mounted on the motor 60, so that the motor 60 drives the lens 50 to move, and the focal length of the camera module is adjusted, that is, the camera module is an Automatic Focus Module (AFM).
The motor 60 is mounted to the package 11 of the circuit board assembly 10, and further, the motor 60 is mounted to the top surface 112 of the package 11, that is, the filter 40 and the motor 60 cooperatively occupy the top surface 112 of the package 11.
The lens 50 is mounted to the motor 60, and the motor 60 and the filter 40 are mounted to the package 11, so that the package 11 functions as a base of a conventional camera module, and provides a support and a fixed position for the motor 60 and the filter 40, but the manufacturing, assembly and form are different from those of the conventional COB process. The base of the traditional COB camera module is fixed on the circuit board in a bonding mode, the packaging part 11 is fixed on the circuit board main body 121 in a mode of being molded on the circuit board, a bonding and fixing process is not needed, the molding mode has better connection stability and controllability of the technological process compared with the bonding and fixing mode, the smoothness is higher, good installation conditions are provided for the motor 60 and the optical filter 40, and the packaging part 11 and the circuit board main body 121 do not have glue space for AA adjustment, so that a reserved space for AA adjustment of the traditional camera module is omitted, and the thickness of the camera module is reduced; on the other hand, the packaging part 11 covers the circuit element 122, so that the space of the conventional base and the installation space of the circuit element 122 can be overlapped in space, and a safe distance is reserved around the circuit device without the need of a conventional camera module, so that the packaging part 11 with the base function can be arranged in a smaller size, and a space for reducing the thickness of the camera module is further provided. In addition, the packaging part 11 replaces a traditional base, so that the inclination error caused by the base in the process of pasting and assembling is avoided, and the accumulated tolerance of the camera module assembly is reduced.
It is also worth mentioning that the shape of the packaging part 11 may be determined more specifically, for example, by extending inward at the position of the circuit component 122 to form a protrusion, so as to increase the corresponding width of the packaging part 11, while at the position without the circuit component 122, the one-piece molding part extends uniformly to form a more regular shape with a smaller width. It will be appreciated by those skilled in the art that the particular shape of the enclosure 11 is not a limitation of the present invention.
According to this embodiment of the present invention, the photosensitive chip 30 is electrically connectable to the wiring board main body 121 through at least one connection line 31, and is electrically connectable to the connection line 31. The connection line 31 may be implemented by, for example, but not limited to, a gold wire, a copper wire, an aluminum wire, a silver wire. In particular, the connecting wires 31 of the photosensitive chip 30 can be connected to the circuit board main body 121 by a conventional COB method, for example, but not limited to, soldering. That is, the connection between the photosensitive chip 30 and the circuit board body 121 can make full use of the existing mature connection technology, so as to reduce the cost of the improved technology, make full use of the traditional process and equipment, and avoid the waste of resources. Of course, it should be understood by those skilled in the art that the connection between the photosensitive chip 30 and the circuit board main body 121 can be realized by any other connection method capable of achieving the object of the present invention, and the present invention is not limited in this respect.
It should be noted that, in this embodiment of the present invention, each of the photosensitive chips 30 is disposed on the upper surface of the circuit board main body 121, and the encapsulating portion 11 surrounds the outer side of the photosensitive chip 30. In manufacturing the circuit board assembly 10, different manufacturing sequences may be selected, for example, but not limited to, in one embodiment, the photosensitive chip 30 may be mounted on the circuit board main body 121, and then the circuit board main body 121 is molded to form the package portion 11 outside the photosensitive chip 30, and the circuit elements 122 protruding from the circuit board main body 121 are covered inside the package portion. In another embodiment of the present invention, the package 11 may be molded on the circuit board main body 121, the circuit elements 122 protruding from the circuit board main body 121 may be covered therein, and the photosensitive chip 30 may be mounted on the circuit board main body 121 so as to be located inside the package 11.
Referring to fig. 4, there is another implementation of the camera module according to the first preferred embodiment of the present invention, and the camera module may be a Fixed Focus Module (FFM). In the camera module, the lens 50 is mounted on the top surface 112 of the package 11, i.e., the focal length of the camera module cannot be freely adjusted. The lens 50 and the filter 40 cooperatively configure the top surface 112 of the package 11. It will be appreciated by those skilled in the art that the type of camera molding is not a limitation of the present invention.
It should be noted that, according to the preferred embodiment of the present invention, the packaging part 11 can be used to support and mount the filter 40 and the lens 50, and has the function of a conventional base, and the packaging part 11 can control the flatness and uniformity of the packaging part 11 by means of a mold based on the advantage of molding, so as to provide a flat and uniform mounting environment for the color filter and the lens 50 of the camera module, thereby more easily ensuring the uniformity of the optical axes of the lens 50, the filter 40 and the photosensitive chip 30, which is not easily achieved by the conventional camera module.
Fig. 5 shows a camera module according to a second preferred embodiment of the present invention. Unlike the preferred embodiment, the packaging part 11 has a mounting groove 113A, and the mounting groove 113A is communicated with the through hole 111 to provide a sufficient mounting space for the filter 40. That is, the top surface 112 of the package portion 11 has a step-like structure, rather than extending integrally, and steps of the top surface 112 are used for mounting the filter 40, the lens 50 or the motor 60.
Further, the height of the mounting groove 113A is greater than the thickness of the optical filter 40, so that when the optical filter 40 is mounted in the mounting groove 113A, the optical filter 40 does not protrude from the top end of the package portion 11.
In particular, according to this embodiment of the present invention, the filter 40 has a square shape, and the shape of the installation groove 113A is adapted to the shape of the filter 40. That is, the mounting groove 113A is in a square ring shape and communicates with the through hole 111.
It should be noted that in this embodiment of the present invention, the mounting groove 113A may be used for mounting the optical filter 40, while in other implementations of the present invention, the mounting groove 113A may be used for mounting components such as the motor 60 or the lens 50 of the camera module, and it should be understood by those skilled in the art that the purpose of the mounting groove 113 is not limited by the present invention.
It should be noted that, in this embodiment of the present invention, the moving focus module is illustrated in the drawings as an example, and in other embodiments of the present invention, the camera may be a fixed focus module, and it should be understood by those skilled in the art that the type of the camera module is not limited by the present invention.
Fig. 6 is a schematic cross-sectional view of a camera module based on a molding process according to a third preferred embodiment of the present invention. Unlike the preferred embodiment, the camera module includes a holder 70B, and the holder 70B is used for mounting the filter 40. The mount 70B is attached to the package 11, the filter 40 is attached to the package 11, and the motor 60 or the lens 50 is attached to the mount 70B.
According to this embodiment of the present invention, the holder 70B has a first holder groove 71B and a second holder groove 72B, and the first holder groove 71B is used for mounting the filter 40 such that the surface of the filter 40 does not protrude from the top end of the holder 70B. The second seat groove 72B is configured to be mounted on the packaging part 11, so that the packaging part 11 extends upward along the seat 70, and the filter 40 is located downward, thereby reducing the back focus of the camera module.
In other words, the support 70B extends into the through hole 111 and extends downward, so as to support the filter 40 above the photosensitive chip 30, and utilize the space in the through hole 111, so that the filter 40 is stably installed without occupying the external space while the filter 40 occupies the external space.
It should be noted that the inward extending distance of the support 70B is located outside the photosensitive area of the photosensitive chip 30, that is, the support 70B does not shield the photosensitive area of the photosensitive chip 30, so as to avoid affecting the photosensitive process of the photosensitive chip 30, and the size of the support 70B can be designed according to specific requirements.
In this embodiment of the present invention and the accompanying drawings, a moving focus module is taken as an example, the lens 50 is mounted on the motor 60, and the motor 60 is mounted on the support 70B. That is, the holder 70 provides a mounting position for the filter 40 and the motor 60. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 50 is mounted on the mount 70B, that is, the mount 70B provides a mounting location for the filter 40 and the lens 50, and it should be understood by those skilled in the art that the specific structure of the mount 70B and the type of camera module are not limitations of the present invention.
Fig. 7 is a schematic cross-sectional view of an image pickup molding based on a molding process according to a fourth preferred embodiment of the present invention. Unlike the preferred embodiment, the packing part 11 has a mounting groove 113C, and the mounting groove 113C is communicated with the through hole 111. That is, the top surface 112 of the packing portion 11 has a stepped structure, and does not integrally extend.
The camera module comprises a support 70C, and the support 70C is used for mounting the optical filter 40. The holder 70C is attached to the package 11, the filter 40 is attached to the package 11, and the motor 60 or the lens 50 is attached to the package 11.
Further, the support 70C is mounted to the mounting groove 113C of the enclosure 11, and the height of the mounting groove 113C is greater than the mounting height of the support 70C, so that the support 70C does not protrude from the end of the enclosure 11.
According to this embodiment of the present invention, the holder 70C has a first holder groove 71C and a second holder groove 72C, and the first holder groove 71C is used for mounting the filter 40 so that the surface of the filter 40 does not protrude from the top end of the holder 70C. The second seat groove 72C is configured to be mounted on the packaging portion 11, so that the packaging portion 11 extends upward along the seat 70C, and the filter 40 is located downward, thereby reducing the back focus of the camera module. It is understood that in other modified embodiments, the seat 70C may not have the second seat groove 72C, and the flat bottom surface of the seat 72C is directly attached to the package portion 11.
In other words, the support 70C extends into the through hole 111 and extends downward, so as to support the filter 40 above the photosensitive chip 30, and utilize the space in the through hole 111, so that the filter 40 is stably installed without occupying the external space while the filter 40 occupies the external space.
It should be noted that the inward extending distance of the support 70C is located outside the photosensitive area of the photosensitive chip 30, that is, the support 70C does not shield the photosensitive chip 30, so as to avoid affecting the photosensitive process of the photosensitive chip 30, and the size of the support 70C can be designed according to specific requirements.
Unlike the third preferred embodiment, the second holder groove 71C and the mounting groove 113C of the package are matched to form a matching snap structure, so that the holder 70C is stably mounted in the mounting groove 113C. Compared with the third preferred embodiment, the filter 40 in this embodiment is smaller from the photosensitive chip 30, and the camera module with smaller back focal length can be obtained.
In this embodiment of the present invention and the accompanying drawings, a moving focus module is taken as an example, the lens 50 is mounted on the motor 60, and the motor 60 is mounted on the support 70C. That is, the holder 70C provides a mounting position for the filter 40 and the motor 60. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 50 is mounted on the support 70C, that is, the support 70C provides a mounting position for the filter 40 and the lens 50, and it should be understood by those skilled in the art that the specific structure of the support 70 and the type of the camera module are not limitations of the present invention.
Fig. 8 is a schematic cross-sectional view of a camera module based on a molding process according to a fifth preferred embodiment of the present invention. Unlike the preferred embodiment described above, the filter 40 is mounted to a motor 60D, and the motor 60D is mounted to the packing part 11, so that it is not necessary to provide an additional part for mounting the filter 40.
The motor 60D includes a lower end portion 61D, and the lower end portion 61D is adapted to be mounted to the filter 40. That is, the lens 50 is attached to the upper end of the motor 60D, and the filter 40 is attached to the lower end portion 61D of the motor 60D and positioned below the lens 50.
In this embodiment of the present invention, the filter 40 is mounted to the motor 60D, so that it is not necessary to provide an additional part for mounting the filter 40, and the motor 60D is directly mounted to the packing part 11, providing a flat mounting condition for the motor 60D.
Fig. 9 is a schematic cross-sectional view of a camera module based on a molding process according to a sixth preferred embodiment of the present invention. Unlike the preferred embodiment, the lens 50E includes a lens barrel 51E and at least one lens 52E, and each lens 52E is installed in the lens barrel 51E.
According to this embodiment of the present invention, the optical filter 40 is press-fitted into the lens barrel 51E below each of the lenses 52E, so that it is not necessary to provide an additional part for fitting the optical filter 40.
More specifically, the lens barrel 51E includes a bottom 511E, and the bottom 511E is used for mounting the optical filter 40. The base of the lens barrel 51E is adapted to the shape of the optical filter 40, that is, the base has a hollow square structure, so that the optical filter 40 can be conveniently installed therein. The upper part of the lens barrel 51E is used for mounting the lens 52E, and the shape of the lens 52E is adapted, and the lower part is used for mounting the optical filter 40 and is adapted to the shape of the optical filter 40, so that the whole upper part of the lens barrel 51E is a circular tubular column, the inner part of the lower part is square, and the circular tube and the square are integrally connected.
The motor 60 is mounted to the package part 11, and the filter 40 is mounted to the lens barrel 51E, so that it is not necessary to provide an additional part for mounting the filter 40.
Fig. 10 is a schematic sectional view of a camera module based on a molding process according to a seventh preferred embodiment of the present invention. Unlike the above preferred embodiment, the circuit board assembly 10 includes a circuit board body 121F, the circuit board body 121F has a passage 1211F, and a lower portion of the passage 1211F is adapted to mount the photosensitive chip 30. Each of the paths makes the upper and lower sides of the circuit board body 121F communicate with each other, so that when the photosensitive chip 30 is mounted on the circuit board body 121F from the back of the circuit board body 121F with the photosensitive area facing upward, the photosensitive area of the photosensitive chip 30 can receive the light entering from the lens 50.
Further, the circuit board main body 121F has an outer groove 1212F, and the outer groove 1212F is connected to the corresponding passage to provide a mounting position for the photosensitive chip 30. In particular, when the photosensitive chip 30 is mounted in the outer groove 1212F, the outer surface of the photosensitive chip 30 and the outer surface of the circuit board main body 121F are consistent and located on the same plane, so as to ensure the surface flatness of the circuit board assembly 10.
In this embodiment of the present invention, the passage is stepped to facilitate mounting of the photo chip 30, provide a stable mounting position for the photo chip 30, and present a photo-sensing area thereof in an inner space.
It is worth mentioning that in this embodiment of the present invention, a Flip Chip (FC) is provided, which is different from the conventional Chip mounting method. The photosensitive chip 30 is mounted on the circuit board main body 121F from the rear direction of the circuit board main body 121F, instead of from the front side of the circuit board main body 121F, i.e., from above the circuit board main body 121F as in the above-described embodiment, with the photosensitive region of the photosensitive chip 30 facing upward on the circuit board main body 121F. Due to the structure and the installation mode, the photosensitive chip 30 and the packaging part 11 are relatively independent, the installation of the photosensitive chip 30 is not influenced by the packaging part 11, and the influence of the molding of the packaging part 11 on the photosensitive chip 30 is small. In addition, the photosensitive chip 30 is embedded in the outer side surface of the circuit board body 121F and does not protrude from the inner side surface of the circuit board body 121F, so that a larger space is reserved inside the circuit board body 121F, the height of the package portion 11 is not limited by the height of the photosensitive chip 30, and the package portion 11 can reach a smaller height.
It should be noted that, in this embodiment of the present invention, the filter 40 is installed at the upper end of the passage, that is, the filter 40 covers the passage of the circuit board main body 121F, and the filter 40 does not need to be installed in the encapsulating portion 11, so that the back focus of the array camera module is greatly reduced, and the camera height is reduced. In particular, the filter 40 may be embodied as an infrared cut filter IRCF. That is, the filter 40 is mounted to the wiring board main body 121F without providing an additional member such as a holder.
As shown in fig. 11A to 12, is a camera module based on a molding process according to an eighth preferred embodiment of the present invention. Unlike the preferred embodiment, the packing part 11 has a mounting groove 113G, and the mounting groove 113G is communicated with the through hole 111. That is, the top surface 112G of the packing portion 11 has a step-like structure, and does not integrally extend.
Further, the camera module comprises a support 70G, and the support 70G is used for mounting the optical filter 40. The mount 70G is attached to the package 11, the filter 40 is attached to the mount 70G, and the motor 60 or the lens 50 is attached to the package 11.
Further, the package part 11 has a protruding step 114G on at least two sides of the top side, at least one side is free of the protruding step 114, and a mounting groove 113G is formed, the support 70G is mounted in the mounting groove 113G of the package part 11, and the height of the mounting groove 113G is greater than the mounting height of the support 70G, so that the support 70G does not protrude from the top end of the package part 11. For example, the height of the mounting groove 113G is 0.05mm greater than the height of the support 70G, so that when the motor 60 is mounted to the packaging part 11, the bottom of the motor 60 does not directly contact the support 70G, and the lens mounted in the motor 60 does not contact the support 70G. It should be noted that, in this embodiment of the present invention, a moving-focus camera module is taken as an example, the motor is installed in the packaging part 11, while in other embodiments of the present invention, the camera module may also be a fixed-focus module, the lens 50 is installed in the packaging part 11, and particularly, the support 70G is not in direct contact with the lens barrel and the lens of the lens 50.
It can be understood that, when the photosensitive chip 30 is larger in size and the wall thickness of the encapsulating portion 11 is smaller, the above design still enables the encapsulating portion 11 to provide a space for installing the support 70G so as to install the filter. As shown in fig. 11A to 12, the top of the package portion 11 may be formed with the raised step 114 on three sides, and the other side is directly used to support the support 70G without the raised step 114. As shown in the cross-sectional view of FIG. 11A, it can be seen that the raised step 114 is present on both the left and right sides, and the inside is used to mount the pedestal 70G. In the other cross-sectional view shown in fig. 11B, the top surface of the package portion 11 on the left side directly supports the seat 70G, and the inner side of the raised step 114 on the right side serves to limit the seat 70G.
Also, in this embodiment, the top surface of the raised step 114 may be higher than the top surface of the seat 70G, so that the motor 60 is attached to the raised step 114, thereby reducing the tilt of the motor because the enclosure 11 is integrally formed and the motor 60 is in contact with only the raised step 114 of the enclosure 11.
It is worth mentioning that the circuit components 122 may not be uniformly arranged on the circuit board main body 121, so that the positions of the packaging parts 11 reserved on the circuit board main body are not in regular symmetry, such as a wider side reserved on the side with the circuit components 122 and a relatively narrower side without the circuit components 122, in which case there is a problem that it is difficult to arrange the mounting groove at the position where the packaging parts are narrower, whereas in this embodiment of the invention, the mounting groove 113G is U-shaped, that is, at the narrower side of the packaging part 11, the mounting groove connection 113G is open to the outside, and at the wider side of the packaging part 11, the mounting groove 113G is only communicated with the through hole 111 and is not communicated with the outside environment, thereby forming a U-shaped mounting groove 113G. The holder 70G is mounted to the mounting groove 113G and can be stably supported in a wide or narrow region of the packing part 11, so that the filter 40 is stably mounted.
It should be noted that, according to an embodiment of the present invention, the height of the mounting groove 113G is greater than the height of the support 70G, so that in the U-shaped opening region of the mounting groove 113G, when the support 70G is mounted in the mounting groove 113G, a gap exists between the support 70G and the side surface of the motor 60, and therefore, in the camera module, the gap is sealed by a sealing material, so that the photosensitive chip 30 is isolated from the outside. In particular, in one embodiment, the encapsulant is a gel. That is, after the camera module is assembled, the mount is sealed in the sealing portion 11 by the adhesive.
According to this embodiment of the present invention, the holder 70G has a first holder groove 71G and a second holder groove 72G, and the first holder groove 71G is used for mounting the filter 40 so that the surface of the filter 40 does not protrude from the top end of the holder 70G. The second seat groove 72G is configured to be mounted on the packaging part 11, so that the packaging part 11 extends upwards along the seat 70G, and the filter 40 is located downwards, thereby reducing the back focus of the camera module.
In other words, the support 70G extends into the through hole 111 and extends downward, so as to support the filter 40 above the photosensitive chip 30, and utilize the space in the through hole 111, so that the filter 40 is stably installed without occupying the external space while the filter 40 occupies the external space.
It should be noted that the inward extending distance of the support 70G is located outside the photosensitive area of the photosensitive chip 30, that is, the support 70G does not shield the photosensitive chip 30, so as to avoid affecting the photosensitive process of the photosensitive chip 30, and the size of the support 70G can be designed according to specific requirements.
Unlike the third preferred embodiment, the second holder groove 71G and the mounting groove 113G of the package are matched to form a matching snap structure, so that the holder 70G is stably mounted in the mounting groove 113G. Compared with the third preferred embodiment, the filter 40 in this embodiment is smaller from the photosensitive chip 30, and the camera module with smaller back focal length can be obtained.
In this embodiment of the present invention and the accompanying drawings, a moving focus module is taken as an example, the lens 50 is mounted on the motor 60, and the motor 60 is mounted on the support 70G. That is, the holder 70C provides a mounting position for the filter 40 and the motor 60. In other embodiments of the present invention, the camera module may also be a fixed focus module. The lens 50 is mounted on the mount 70G, that is, the mount 70G provides a mounting location for the filter 40 and the lens 50, and it should be understood by those skilled in the art that the specific structure of the mount 70G and the type of the camera module are not limitations of the present invention.
In the above embodiments and the accompanying drawings, the principle of the present invention is described by taking a moving focus module as an example, but in other embodiments of the present invention, the camera module may also be a fixed focus module, and it should be understood by those skilled in the art that the type of the camera module is not limited by the present invention.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (8)
1. Module of making a video recording based on an organic whole molding process, its characterized in that includes:
at least one photosensitive chip;
at least one support;
at least one optical filter; and
the circuit board assembly comprises a circuit board part and a packaging part, the packaging part is integrally packaged and connected to the circuit board part based on a molding process, the packaging part is provided with a through hole, the photosensitive chip is mounted on the circuit board part, the through hole provides a photosensitive path for the photosensitive chip, the optical filter is mounted on the support, and the support is mounted on the packaging part;
the top end of the packaging part is provided with a mounting groove which is communicated with the through hole, the support is mounted in the mounting groove, and the height of the mounting groove is greater than that of the support;
at least two sides of the top of the packaging part are respectively provided with at least one raised step, at least one side of the top of the packaging part is not provided with the raised steps, the mounting groove is formed in the raised steps, and the top surface of the raised steps is higher than the surface of the support.
2. The camera module according to claim 1, wherein the holder has a first holder groove on an inner side of a top portion and a second holder groove on an outer side of a bottom portion, the first holder groove is used for mounting the filter, and the second holder groove allows the holder to be engaged with the package portion so that a distance between the filter and the photosensitive chip is reduced.
3. The camera module of claim 2, wherein the enclosure portion has a mounting slot, the second holder slot engaging the holder with the mounting slot.
4. The camera module of any of claims 1-3, wherein the camera module includes at least one motor, the motor being mounted to the enclosure.
5. The camera module of claim 1 or 2, wherein the camera module comprises at least one motor, the motor being mounted to the support.
6. The camera module of claim 2, wherein the surface of the filter is lower than the top end of the holder.
7. The camera module according to claim 1, wherein the circuit board portion includes a circuit board main body and at least one circuit component protruding from the circuit board main body, and the encapsulating portion integrally encapsulates the circuit board main body connected to the circuit board portion and covers the circuit component based on a molding process.
8. The camera module according to claim 7, wherein a width dimension of the sealing portion on a side of the circuit board main body where the circuit element is provided is larger than a width dimension of the sealing portion on a side of the circuit board main body where the circuit element is not provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911129020.8A CN110708454B (en) | 2016-04-21 | 2016-04-21 | Camera module based on molding process |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911129020.8A CN110708454B (en) | 2016-04-21 | 2016-04-21 | Camera module based on molding process |
| CN201610250836.6A CN105898120B (en) | 2016-04-21 | 2016-04-21 | Camera module based on moulding technology |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610250836.6A Division CN105898120B (en) | 2016-02-18 | 2016-04-21 | Camera module based on moulding technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110708454A CN110708454A (en) | 2020-01-17 |
| CN110708454B true CN110708454B (en) | 2021-10-08 |
Family
ID=56704327
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911129020.8A Active CN110708454B (en) | 2016-04-21 | 2016-04-21 | Camera module based on molding process |
| CN201610250836.6A Active CN105898120B (en) | 2016-02-18 | 2016-04-21 | Camera module based on moulding technology |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610250836.6A Active CN105898120B (en) | 2016-02-18 | 2016-04-21 | Camera module based on moulding technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN110708454B (en) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105847645B (en) * | 2016-05-11 | 2020-03-10 | 宁波舜宇光电信息有限公司 | Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof |
| WO2017140092A1 (en) | 2016-02-18 | 2017-08-24 | 宁波舜宇光电信息有限公司 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| CN107957649A (en) * | 2016-10-14 | 2018-04-24 | 宁波舜宇光电信息有限公司 | Camera module and array camera module based on integral packaging technique |
| US10477088B2 (en) * | 2016-04-21 | 2019-11-12 | Ningbo Sunny Opotech Co., Ltd. | Camera module and array camera module based on integral packaging technology |
| TWM561915U (en) * | 2016-10-14 | 2018-06-11 | Ningbo Sunny Opotech Co Ltd | Photographing module and array photographing module based upon integrally packaging technique |
| CN115134490B (en) * | 2016-11-28 | 2024-04-09 | 宁波舜宇光电信息有限公司 | Sinking camera module, sinking photosensitive assembly and manufacturing method thereof |
| WO2018145644A1 (en) * | 2017-02-08 | 2018-08-16 | 宁波舜宇光电信息有限公司 | Camera module, moulded photosensitive component thereof, manufacturing method therefor, and electronic device |
| CN106993123B (en) * | 2017-04-11 | 2024-03-05 | 昆山丘钛微电子科技有限公司 | Miniaturized camera device and manufacturing method thereof |
| CN106911884A (en) * | 2017-04-12 | 2017-06-30 | 瑞声声学科技(深圳)有限公司 | IMAQ module |
| CN107071252A (en) * | 2017-05-16 | 2017-08-18 | 昆山丘钛微电子科技有限公司 | Direct attaching type miniaturization cam device of optical filter and preparation method thereof |
| CN106973210A (en) * | 2017-05-16 | 2017-07-21 | 昆山丘钛微电子科技有限公司 | Plastic packaging adds stent-type to minimize cam device and preparation method thereof |
| CN107094229A (en) * | 2017-06-30 | 2017-08-25 | 珠海市魅族科技有限公司 | Assemble method, camera module and the mobile terminal of camera module |
| CN109391750B (en) * | 2017-08-05 | 2023-05-12 | 宁波舜宇光电信息有限公司 | Fixed focus camera module |
| CN109510921A (en) * | 2017-09-15 | 2019-03-22 | 南昌欧菲光电技术有限公司 | Camera module |
| CN109698894B (en) * | 2017-10-20 | 2023-06-30 | 宁波舜宇光电信息有限公司 | Photosensitive assembly and camera module based on metal support |
| CN107819986B (en) * | 2017-10-30 | 2020-11-10 | 合肥恒研智能科技有限公司 | Bracket, lens assembly and mobile terminal |
| CN109905574A (en) * | 2017-12-08 | 2019-06-18 | 纮华电子科技（上海）有限公司 | A kind of camera module and its packaging method |
| CN107920194B (en) * | 2017-12-19 | 2020-03-20 | Oppo广东移动通信有限公司 | Lens assembly of camera, camera and electronic equipment |
| CN108040196B (en) * | 2017-12-19 | 2020-06-23 | Oppo广东移动通信有限公司 | Lens assembly of camera, camera and electronic equipment |
| CN108040197B (en) * | 2017-12-19 | 2020-06-19 | Oppo广东移动通信有限公司 | Lens assembly of camera, camera and electronic equipment |
| TWI766103B (en) * | 2018-09-21 | 2022-06-01 | 先進光電科技股份有限公司 | Optical imaging module |
| CN111083315B (en) * | 2018-10-19 | 2023-10-27 | 宁波舜宇光电信息有限公司 | No-air-escape hole type photosensitive assembly, camera shooting module and manufacturing method |
| CN111277734B (en) * | 2018-12-04 | 2023-10-27 | 宁波舜宇光电信息有限公司 | Image pickup module and manufacturing method thereof |
| CN109688315A (en) * | 2019-02-27 | 2019-04-26 | 昆山丘钛微电子科技有限公司 | Camera mould group and its assemble method |
| JP6748252B1 (en) * | 2019-03-19 | 2020-08-26 | 東芝エレベータ株式会社 | elevator |
| CN112217964A (en) * | 2019-07-11 | 2021-01-12 | 南昌欧菲光电技术有限公司 | Support, camera module and electronic equipment terminal |
| CN112584005A (en) * | 2019-09-30 | 2021-03-30 | 南昌欧菲光电技术有限公司 | Camera module and electronic equipment |
| CN112637448B (en) * | 2019-10-08 | 2022-11-15 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and terminal equipment |
| CN112714239B (en) * | 2019-10-25 | 2022-07-22 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module, method thereof and electronic equipment |
| CN113132584B (en) * | 2020-01-10 | 2022-07-12 | 宁波舜宇光电信息有限公司 | Light filtering component, camera module and multi-camera module |
| CN113204105B (en) * | 2020-01-15 | 2023-01-24 | 宁波舜宇光电信息有限公司 | Split zoom lens, camera module and corresponding assembling method |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1117996A (en) * | 1997-06-25 | 1999-01-22 | Matsushita Electron Corp | Image pickup unit |
| CN101989555A (en) * | 2009-07-29 | 2011-03-23 | 胜开科技股份有限公司 | Manufacturing method for molding image sensor package structure and image sensor package structure thereof |
| CN102782574A (en) * | 2010-01-11 | 2012-11-14 | 弗莱克斯电子有限责任公司 | Camera module with molded tape flip chip imager mount and method of manufacture |
| CN103402049A (en) * | 2013-07-28 | 2013-11-20 | 宁波远大成立科技股份有限公司 | Image sensing element and manufacturing method |
| CN103700634A (en) * | 2013-11-06 | 2014-04-02 | 南昌欧菲光电技术有限公司 | Camera module, and encapsulating structure and encapsulating method thereof |
| CN104570266A (en) * | 2013-10-25 | 2015-04-29 | 罗伯特·博世有限公司 | Imaging module for a camera and manufacturing method for the same |
| CN105474616A (en) * | 2013-08-22 | 2016-04-06 | 索尼公司 | Imaging device, manufacturing device, manufacturing method, and electronic device |
| CN105493300A (en) * | 2013-08-16 | 2016-04-13 | 株式会社流明斯 | Chip-on-board type light emitting device package and method for manufacturing same |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100508146C (en) * | 2007-10-31 | 2009-07-01 | 无锡凯尔科技有限公司 | SMT-free encapsulation method of imaging sensor |
| US8411192B2 (en) * | 2007-11-15 | 2013-04-02 | Sharp Kabushiki Kaisha | Image capturing module, method for manufacturing the image capturing module, and electronic information device |
| US9018725B2 (en) * | 2011-09-02 | 2015-04-28 | Optiz, Inc. | Stepped package for image sensor and method of making same |
| US9258467B2 (en) * | 2013-11-19 | 2016-02-09 | Stmicroelectronics Pte Ltd. | Camera module |
| CN105187697B (en) * | 2015-08-04 | 2019-12-31 | 宁波舜宇光电信息有限公司 | Multi-lens camera module conjoined bracket, multi-lens camera module and application thereof |
| CN205792878U (en) * | 2016-04-21 | 2016-12-07 | 宁波舜宇光电信息有限公司 | Camera module based on moulding technology |
-
2016
- 2016-04-21 CN CN201911129020.8A patent/CN110708454B/en active Active
- 2016-04-21 CN CN201610250836.6A patent/CN105898120B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1117996A (en) * | 1997-06-25 | 1999-01-22 | Matsushita Electron Corp | Image pickup unit |
| CN101989555A (en) * | 2009-07-29 | 2011-03-23 | 胜开科技股份有限公司 | Manufacturing method for molding image sensor package structure and image sensor package structure thereof |
| CN102782574A (en) * | 2010-01-11 | 2012-11-14 | 弗莱克斯电子有限责任公司 | Camera module with molded tape flip chip imager mount and method of manufacture |
| CN103402049A (en) * | 2013-07-28 | 2013-11-20 | 宁波远大成立科技股份有限公司 | Image sensing element and manufacturing method |
| CN105493300A (en) * | 2013-08-16 | 2016-04-13 | 株式会社流明斯 | Chip-on-board type light emitting device package and method for manufacturing same |
| CN105474616A (en) * | 2013-08-22 | 2016-04-06 | 索尼公司 | Imaging device, manufacturing device, manufacturing method, and electronic device |
| CN104570266A (en) * | 2013-10-25 | 2015-04-29 | 罗伯特·博世有限公司 | Imaging module for a camera and manufacturing method for the same |
| CN103700634A (en) * | 2013-11-06 | 2014-04-02 | 南昌欧菲光电技术有限公司 | Camera module, and encapsulating structure and encapsulating method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105898120A (en) | 2016-08-24 |
| CN105898120B (en) | 2019-11-29 |
| CN110708454A (en) | 2020-01-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110708454B (en) | Camera module based on molding process | |
| CN105847645B (en) | Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof | |
| CN109510932B (en) | Camera module based on molding process, molded circuit board assembly of camera module and manufacturing method of camera module | |
| CN110089101B (en) | Image pickup module, molded photosensitive assembly thereof, manufacturing method of molded photosensitive assembly and electronic equipment | |
| KR102193819B1 (en) | Array imaging module, molded photosensitive assembly and manufacturing method thereof, and electronic device | |
| CN110089105B (en) | Array camera module with height difference, circuit board assembly, manufacturing method of array camera module and circuit board assembly and electronic equipment | |
| US11163216B2 (en) | Array imaging module and molded photosensitive assembly, circuit board assembly and manufacturing methods thereof for electronic device | |
| TWI708987B (en) | Camera module based on integrated packaging process and integrated base assembly and manufacturing method thereof | |
| WO2017166798A1 (en) | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device | |
| CN107566691B (en) | Photosensitive assembly, camera module and manufacturing method thereof | |
| TWI657306B (en) | Array camera module and molded photosensitive component thereof, circuit board assembly and manufacturing method, and electronic device | |
| WO2017220015A1 (en) | Fixed-focus camera module and manufacturing method therefor | |
| CN205792878U (en) | Camera module based on moulding technology | |
| KR102465474B1 (en) | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor | |
| US20060146170A1 (en) | Imaging device, portable terminal using the same, and image device producing method | |
| CN108270949B (en) | Split type array camera module and manufacturing method thereof | |
| WO2018121793A1 (en) | Separable photographic array module and manufacturing method thereof | |
| TWI685255B (en) | Split array camera module and manufacturing method thereof | |
| CN217087989U (en) | Photoelectric module and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |