CN105898120B - Camera module based on moulding technology - Google Patents
Camera module based on moulding technology Download PDFInfo
- Publication number
- CN105898120B CN105898120B CN201610250836.6A CN201610250836A CN105898120B CN 105898120 B CN105898120 B CN 105898120B CN 201610250836 A CN201610250836 A CN 201610250836A CN 105898120 B CN105898120 B CN 105898120B
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- China
- Prior art keywords
- wiring board
- encapsulation part
- camera module
- main body
- sensitive chip
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
One camera module based on moulding technology comprising: a camera lens, a sensitive chip and a circuit board module；Wherein the sensitive chip is installed in the circuit board module, and the camera lens is located at the photosensitive path of the sensitive chip；The circuit board module includes a wiring board portion and an encapsulation part, and the encapsulation part is based on moulding technology integral packaging and is connected to the wiring board portion, and the encapsulation part has a through-hole, provides photosensitive path for the sensitive chip.
Description
Technical field
The present invention relates to camera module fields, further, are related to a camera module based on moulding technology.
Background technique
As shown in Figure 1, being a camera module schematic diagram of traditional COB (Chip On Board chip package) technique.It is described
Camera module includes a wiring board 1P, a sensitive chip 2P, a pedestal 3P, an optical filter 4P, motor 5P and a camera lens 6P.It is described
Sensitive chip 2P is installed in the wiring board 1P, and the optical filter 4P is installed in the pedestal 3P, and the camera lens 6P is pacified
Loaded on the motor 5P, the motor 5P is installed in the pedestal 3P.
Camera shooting molding optical system be influences the key factor of the image quality of the camera module, and optical system and
There is very big relationship in the camera lens 6P, the optical axis of the optical filter 4P and the sensitive chip 2P and light incidence defence line.And
In the camera module of transmission, the pedestal 3P effect wherein be exactly be the optical filter 4P, the motor 5P or described
Camera lens 6P provides installation site, enables each component by the light path arrangement of optical system.
But the pedestal 3P of tradition COB technique is usually a plastic stent, and institute is fixed on by way of bonding
Wiring board 1P is stated, wherein there are many unfavorable factors.
It firstly, manufacture factor of traditional pedestal 3P due to its own, poor on planarization, therefore cannot be institute
It states motor 5P, the camera lens 6P and the optical filter 4P provides good mounting condition, so that the motor 5P, the camera lens 6P
It is easy to appear inclination or bias phenomenon with the optical filter 4P, hence for the motor 5P, the camera lens 6P and the optical filtering
The mounting process required precision of piece 4P is higher.
Secondly, traditional pedestal 3P is usually to be adhered to the wiring board 1P, therefore it is solid to work as pedestal 3P installation
Periodically, it is easy to appear inclination or deviation, further increases the accumulated error of camera module entirety.
In addition, some circuit devcie 11P, such as resistance, capacitor etc. have been usually installed on the wiring board 1P, these
Circuit devcie 11P protrudes from the surface the wiring board 1P, and the pedestal 3P then needs to be installed in the circuit devcie
On the wiring board 1P of 11P, and in traditional COB technique between wiring board 1P, circuit devcie 11P and bracket 3P
Assembling matching relationship have some unfavorable factors, be the pedestal 3P installation space it is smaller, to increase camera module
For the demand of lateral dimension.
Summary of the invention
It is an object of the present invention to provide a camera modules based on moulding technology, wherein the camera module includes
One circuit board module, the circuit board module include an encapsulation part and a wiring board portion, and the encapsulation part one is shaped in institute
Wiring board portion is stated, provides good mounting condition for a camera lens, a motor or an optical filter for the camera module.
It is an object of the present invention to provide a camera module based on moulding technology, wherein the circuit board module
The encapsulation part top is in planar, and the optical filter is installed in the top of the encapsulation part, so that the optical filter
The installation being flattened.
It is an object of the present invention to provide a camera module based on moulding technology, wherein the circuit board module
The encapsulation part has a mounting groove, and the optical filter is installed in the mounting groove, provides for the optical filter smooth, stable
Installation site.
It is an object of the present invention to provide a camera modules based on moulding technology, wherein the camera module includes
One support, the support are installed in the encapsulation part, and the optical filter is installed in the support.
It is an object of the present invention to provide a camera modules based on moulding technology, wherein the camera lens includes a mirror
Cylinder, the optical filter are installed in the lens barrel, install the optical filter without providing additional component.
It is an object of the present invention to provide a camera modules based on moulding technology, wherein the wiring board portion includes
One wiring board main body, the wiring board main body have an access, and the optical filter is installed in the access upper end, to reduce
The back focal length of the camera module.
It is an object of the present invention to provide a camera modules based on moulding technology, wherein the line part includes one
An at least circuit element, the circuit element protrude from the wiring board main body, and the circuit element is coated by the encapsulation part,
To which outside will not be directly exposed to, and increase the settable space of the encapsulation part.
In order to realize that the above goal of the invention, an aspect of of the present present invention provide a camera module based on moulding technology, packet
It includes: an at least camera lens, at least a sensitive chip and at least a circuit board module；Wherein the sensitive chip is installed in the line
Road board group part, the camera lens are located at the photosensitive path of the sensitive chip；The circuit board module includes a wiring board portion and one
Encapsulation part, the encapsulation part are based on moulding technology integral packaging and are connected to the wiring board portion, and the encapsulation part has a through-hole,
Photosensitive path is provided for the sensitive chip.
An embodiment according to the present invention, the camera module include an at least optical filter, and the optical filter is installed in
The encapsulation part, so that the optical filter is installed with being flattened.
An embodiment according to the present invention, encapsulation part described in the camera module have a top surface, and plane earth extends,
The optical filter is installed in the top surface.
An embodiment according to the present invention, the camera module include an at least motor, and the camera lens is installed in described
Motor, the motor are installed in the encapsulation part.
An embodiment according to the present invention, camera lens described in the camera module are installed in the encapsulation part.
An embodiment according to the present invention, encapsulation part described in the camera module have an at least mounting groove, the peace
Tankage is connected to the through-hole, and the optical filter is installed in the mounting groove.
An embodiment according to the present invention, mounting groove described in the camera module are connected to outside U-shapedly.
An embodiment according to the present invention, the camera module include an at least optical filter, an at least motor and at least one
Support, the optical filter are installed in the support, and the support is installed in the mounting groove, and the camera lens is installed in institute
Motor is stated, the motor is installed in the encapsulation part.
According to power one embodiment of the invention, the camera module includes an at least support and an at least optical filter, described
Optical filter is installed in the support, and the support is installed in the mounting groove.
An embodiment according to the present invention, the camera module include a support and an optical filter, and the optical filter is pacified
Loaded on the support, the support is installed in the encapsulation part.
An embodiment according to the present invention, the camera module include an at least motor, and the motor is installed in described
Support.
An embodiment according to the present invention, camera lens described in the camera module are installed in the support.
An embodiment according to the present invention, camera module described in the camera module include an at least support and at least one
Optical filter, the encapsulation part have a mounting groove, and the support is installed in the mounting groove of the encapsulation part, the optical filtering
Piece is installed in the support.
An embodiment according to the present invention, support described in the camera module have one first support in the inside at top
Slot and there is one second seat slot in the outside of bottom, first seat slot is for installing the optical filter, and described second
Seat slot makes the base clip together in the encapsulation part, so that the optical filter reduces at a distance from the sensitive chip.
An embodiment according to the present invention, camera module described in the camera module include an at least motor and at least one
Optical filter, the optical filter are installed in the motor, and the motor is installed in the encapsulation part.
An embodiment according to the present invention, the camera module include an at least optical filter, and the camera lens includes a lens barrel
An at least eyeglass, each eyeglass are installed in the lens barrel, and the optical filter is located at each institute by by the lens barrel is installed on
State the lower section of eyeglass.
An embodiment according to the present invention, the camera module include an at least optical filter, and the line part includes a line
Road plate main body, the encapsulation part integral packaging are connected to the wiring board main body, and the wiring board main body has an access, described
In the access, the optical filter is covered in the access of the wiring board main body for sensitive chip upside-down mounting.
An embodiment according to the present invention, the one envelope in a manner of being molded or be molded of encapsulation part described in the camera module
Load is connected to the wiring board portion.
An embodiment according to the present invention, wiring board portion described in the camera module is including a wiring board main body and at least
One circuit element, the circuit element protrude from the wiring board main body, and the encapsulation part coats the circuit element, so that its
It is not exposed to the space being connected to the sensitive chip.
An embodiment according to the present invention, at least two sides at the top of the encapsulation part are respectively provided with an at least raised step,
Its inside forms a mounting groove, and the camera module further includes an at least support and an at least optical filter, and the support is installed on
The mounting groove on the inside of the raised step, the optical filter are installed on the support.
The top surface of an embodiment according to the present invention, at least side at the top of the encapsulation part is not provided with the protrusion
Step, to be used to support the support.
An embodiment according to the present invention, the raised step top surface are higher than the surface of the support, the camera shooting mould
Group further includes a motor, and the motor is mounted on the raised step.
Detailed description of the invention
Fig. 1 is the camera module schematic cross-sectional view of traditional COB technique.
Fig. 2 is the camera module schematic cross-sectional view based on moulding technology of first preferred embodiment according to the present invention.
Fig. 3 is the camera module stereo decomposing signal based on moulding technology of first preferred embodiment according to the present invention
Figure.
Fig. 4 is another embodiment party of the camera module based on moulding technology of first preferred embodiment according to the present invention
Formula.
Fig. 5 is the camera module schematic cross-sectional view based on moulding technology of second preferred embodiment according to the present invention.
Fig. 6 is the camera module schematic cross-sectional view based on moulding technology of third preferred embodiment according to the present invention.
Fig. 7 is the camera shooting molding schematic cross-sectional view based on moulding technology of the 4th preferred embodiment according to the present invention.
Fig. 8 is the camera module schematic cross-sectional view based on moulding technology of the 5th preferred embodiment according to the present invention.
Fig. 9 is the camera module schematic cross-sectional view based on moulding technology of the 6th preferred embodiment according to the present invention.
Figure 10 is the camera module schematic cross-sectional view based on moulding technology of the 7th preferred embodiment according to the present invention.
Figure 11 A, 11B are the camera module difference angles based on moulding technology of the 8th preferred embodiment according to the present invention
Spend schematic cross-sectional view.
Figure 12 is the part isometric of the camera module based on moulding technology of the 8th preferred embodiment according to the present invention
Figure.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.It is excellent in being described below
Embodiment is selected to be only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.It defines in the following description
Basic principle of the invention can be applied to other embodiments, deformation scheme, improvement project, equivalent program and do not carry on the back
Other technologies scheme from the spirit and scope of the present invention.
It will be understood by those skilled in the art that in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper",
The orientation of the instructions such as "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside" or position are closed
System is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description of the present invention and simplification of the description, without referring to
Show or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore above-mentioned art
Language is not considered as limiting the invention.
It as shown in Figures 2 to 4, is camera module of first preferred embodiment based on moulding technology according to the present invention.
The camera module can be applied to various electronic equipments, to assist use that can carry out shooting work by the camera module
It moves, such as the camera module can be used to shoot image or video image of object or person etc..Preferably, the camera shooting
Mould group can be applied a mobile electronic device, such as the mobile electronic device that can be but not limited to mobile phone or tablet computer
Equipment.
As shown in Figures 2 to 4, the camera module includes a circuit board module 10, a sensitive chip 30 and a camera lens 50.
Further, the sensitive chip 30 is installed in the circuit board module 10, and the camera lens 50 is located at the route
On board group part 10, and the camera lens 50 is located at the photosensitive path of the sensitive chip 30.The circuit board module 10 can be by coupling
It is connected to the electronic equipment, to be used cooperatively with the electronic equipment.Those skilled in the art is it should be understood that described
Camera lens 50 and the chip can cooperate filmed image.Specifically, subject, the light reflected such as object or person
After through the camera lens 50, received by the sensitive chip 30 to carry out photoelectric conversion.In other words, the sensitive chip 30
Electric signal can be converted optical signal into, and the electric signal can be transferred into the electricity by the circuit board module 10
Sub- equipment, to generate image relevant to the reference object on the electronic equipment.
The circuit board module 10 includes an encapsulation part 11 and a wiring board portion 12, the encapsulation part 11 integrally company of encapsulation
Be connected to the wiring board portion 12, molding be connected to as described in wiring board portion 12.More specifically, the encapsulation part 11 passes through molding
It is connected to the wiring board portion in mode (Molding On Board, the MOB) molding of wiring board, moulding technology can be injection molding
Or the techniques such as molding.
The wiring board portion 12 includes a wiring board main body 121, and the encapsulation part 11 is integrally connected to the wiring board master
Body 121.The encapsulation part 11 forms a through-hole 111, so that the encapsulation part 11 is around 30 outside of sensitive chip, and
And provide the passage of light of the camera lens 50 and the sensitive chip 30.The sensitive chip 30 is arranged at the through-hole 111
The prime number wiring board main body 121 of corresponding position.
The wiring board portion 12 includes 31 road of a connecting line and an at least circuit element 122, and 31 tunnel of connecting line is default
In the wiring board main body 121, the circuit element 122 is electrically connected to the connection circuit, for the sensitive chip 30
The photosensitive course of work.The circuit element 122 can be, citing ground but be not limited to, resistance, capacitor, diode, triode, electricity
Position device, relay, driver etc..
It is noted that 122 element of circuit element can be coated on inside by the encapsulation part 11, so that
The circuit element 122 will not be directly exposed in space, more specifically, be not exposed to be connected with the sensitive chip 30
In logical enclosed environment.The existing way of circuit devcie in different traditional camera modules, as capacitance resistance ware protrudes from wiring board
Mode, to prevent dust, sundries from staying in the circuit element 122 and polluting the sensitive chip 30.Of the invention
In this embodiment, it is illustrated so that the circuit element 122 protrudes from the wiring board main body 121 as an example, and in the present invention
Other embodiments in, the circuit element 122 is embedded in inside the wiring board main body 121, and the non-bulging route
Plate main body 121, those skilled in the art it should be understood that the circuit element 122 structure, type and the position being set
Setting not is limitation of the invention.It is understood that circuit devcie protrudes from the route in the camera module of transmission
Plate, and pedestal can only be installed in the outside of the circuit element 122, therefore the circuit devcie and the pedestal require one
Fixed spatial position, thus it is more demanding in lateral size to wiring board.And for taking the photograph based on moulding technology of the invention
As mould group, 11 integral packaging of encapsulation part coats the circuit element 122, therefore described in the wiring board main body 121
Encapsulation part 11 and the circuit element 122 are overlapped in space, to increase what the encapsulation part 11 can be inwardly arranged
Space reduces and extends demand to outside the wiring board main body 121, to reduce the lateral dimension of the camera module, makes
It can satisfy the equipment of miniature requirement.
It is noted that the encapsulation part 11, which coats the circuit element 122, has the protection circuit element 122,
It makes it from advantage that is contaminated and accidentally being touched, while advantage is brought to corresponding camera module, but the skill of this field
Art personnel are it should be understood that the encapsulation part 11 is not limited to coat the circuit element 122.That is, of the invention
In other embodiments, the encapsulation part 11 can directly be molded into the wiring board for the circuit element 122 not protruded
Main body 121 is also possible to be molded into the outside of the circuit element 122, the different locations such as surrounding.
In this embodiment of the invention, the 11 protrusion ground of encapsulation part is around 30 outside of sensitive chip, especially
Ground, the encapsulation part 11 are integrally closed connection, make it have good leakproofness, thus when the camera lens 50 is installed in institute
When stating the photosensitive path of sensitive chip 30, the sensitive chip 30 is sealed in inside, to form space in corresponding closing.
Specifically, when manufacturing the circuit board module 10, it can choose a traditional wiring board as the wiring board
Main body 121 is molded on 121 surface of wiring board main body.For example, in one embodiment, injection molding machine can be used, by embedding
SMT technique (Surface Mount Technology surface mount process) will be carried out by entering molding (Insert Molding) technique
Wiring board afterwards carries out integral packaging, such as molded packages, forms the encapsulation part 11, or by common in semiconductor packages
Mould pressing process forms the encapsulation part 11.Further, each sensitive chip 30 is mounted on the wiring board main body 121, after
And each sensitive chip 30 is electrically connected with the wiring board main body 121, for example play gold thread electrical connection.The wiring board
Main body 121 can choose for, citing ground but be not limited to, Rigid Flex, ceramic substrate (without soft board), PCB hardboard are (without soft
Plate) etc..The mode that the encapsulation part 11 is formed can choose as, citing ground but be not limited to, Shooting Technique, mould pressing process etc..Institute
The material that stating encapsulation part 11 can choose is, citing ground but is not limited to, and Shooting Technique can choose nylon, LCP (Liquid
Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene) etc., mould pressing process can use
Epoxy resin.It will be apparent to a skilled person that the aforementioned manufacture that can choose and the material that can choose,
It is illustrative only the mode that can be implemented of the invention, is not limitation of the invention.
In other embodiments of the invention, the process for manufacturing the circuit board module 10 is also possible that first to the line
Road plate main body 121 carries out SMT technique, and then the sensitive chip 30 is mounted on the wiring board main body 121, and will be described
Sensitive chip 30 is electrically connected with the wiring board main body 121, for example plays gold thread electrical connection, then will be to the wiring board master
Body 121 carries out integral packaging, such as molded packages, the encapsulation part 11 is formed by way of insert molding, or by partly leading
Common mould pressing process forms the encapsulation part 11 in body encapsulation.Those skilled in the art is it should be understood that the route
The manufacturing sequence of board group part 10 is not limitation of the invention.
The camera module includes an optical filter 40, and the optical filter 40 is installed in the encapsulation part 11, in order to for
The optical filter 40 provides stable, smooth mounting condition.
More specifically, in one embodiment of this invention, the optical filter 40 is implemented as a cutoff filter 40
(Infra-Red Cut Filter, IRCF), the cutoff filter 40 are using precision optics coating technique in optics
The optical film that high refractive index is alternately plated on substrate realizes that visible region (400-630nm) is high thoroughly, near-infrared (700-1100nm)
The optical filter 40 of cut-off can eliminate infrared light to the Imaging of the sensitive chip 30, such as CCD or CMOS.
By being added the cutoff filter 40 in the imaging system of the camera module, stop imaging system portion interference at
The infrared light of image quality amount so that the camera module the best perception of human eye is more in line at image.
It is noted that, such as CCD or CMOS, the induction and human eye to light are different, human eye due to the sensitive chip 30
It can only see the visible light of 380-780nm wave band, and the sensitive chip 30 can then incude more multiband, such as infrared light and purple
Outer light, it is especially very sensitive to infrared light, therefore have to be inhibited infrared light in the camera module, and keeping can
Light-exposed high transmission, so that the induction of the sensitive chip 30 is close to human eye, so that the figure of camera module shooting
Induction as also complying with eyes, therefore the cutoff filter 40 is indispensable for the camera module.
Particularly, in an embodiment of the present invention, the optical filter 40 can be selected from combination: wafer scale IR cut filter
Piece, narrow band filter, smalt IRCF.Those skilled in the art it should be understood that the type of the optical filter 40 not
It is limitation of the invention.
In the camera module that traditional COB is assembled, optical filter is usually installed in plastic feet, and pedestal is usually logical
The mode for crossing bonding is installed on wiring board, therefore this plastic feet and corresponding mounting means are not easy to occur deviating or incline
Tiltedly, and the surface smoothness of plastic stent is poor, therefore cannot provide good mounting condition for optical filter 40.According to the present invention
This preferred embodiment, the optical filter 40 is installed in the encapsulation part 11, and is based on moulding technology, can obtain good
Surface plain, therefore smooth mounting condition, and integrally formed mode can be provided for the optical filter 40, so that described
Encapsulation part 11 is less prone to offset, tilt phenomenon, to reduce the cumulative limit when optical filter 40 installation.
In this embodiment in accordance with the invention, the integrated plane of the top surface 112 of the encapsulation part 11 extends, the optical filter
40 are installed in the top surface 112 of the encapsulation part 11.Particularly, the optical filter 40 can be connected by way of bonding
It is connected to the top surface 112 of the encapsulation part 11.
In this embodiment in accordance with the invention, the camera module includes a motor 60, such as voice coil motor, the camera lens 50
It is installed in the motor 60, in order to drive the camera lens 50 to move by the motor 60, adjusts the camera module
Focal length, that is to say, that the camera module is a dynamic burnt mould group (Automatic Focus Model, AFM).
The motor 60 is installed in the encapsulation part 11 of the circuit board module 10, further, 60 quilt of motor
It is installed on the top surface 112 of the encapsulation part 11, that is to say, that the optical filter 40 and motor 60 is mutually coordinated accounts for
With the top surface 112 of the encapsulation part 11.
The camera lens 50 is installed in the motor 60, and the motor 60 and the optical filter 40 are installed in the encapsulation
Portion 11, so that the encapsulation part 11 is equivalent to the function of the pedestal of traditional camera module, it is the motor 60 and the optical filter
40 provide support, fixed position, but manufacture, assembling and form are but different from traditional COB technique.Traditional COB technique
The pedestal of camera module wiring board is fixed in a manner of being bonded, and the encapsulation part 11 is by way of being molded into wiring board
It is fixed on the wiring board main body 121, does not need the process of being adhesively fixed, molding mode has more preferable relative to adhering fixed mode
Connective stability and technical process controllability, planarization is higher, provides for the motor 60 and the optical filter 40
Good mounting condition, and the glue space of AA adjustment is not present in the encapsulation part 11 and the wiring board main body 121, therefore saves
The reserved space for having gone traditional camera module AA adjustment, so that the thickness of the camera module is reduced；On the other hand, described
Encapsulation part 11 coats the circuit element 122, allow conventional base space and 122 installation space of circuit element spatially
Overlapping, does not need as traditional camera module, and safe distance is reserved around circuit devcie, so that with base functions
The encapsulation part 11 can be set in lesser size, to further provide the space that camera module thickness can reduce.
In addition, the encapsulation part 11 replaces traditional pedestal, pedestal bring heeling error when pasting assembling is avoided, institute is reduced
State the cumulative limit of camera module assembling.
It's also worth mentioning that the shape of the encapsulation part 11 can more it needs to be determined that, such as in the circuit element
122 positions extend internally, and form a protrusion, thus increase the corresponding width of the encapsulation part 11, and not described
The position of circuit element 122, the disjunctor molded section consistently extend, and form the shape of comparison rule, and width is smaller.Ability
The technical staff in domain is it should be understood that the concrete shape of the encapsulation part 11 is not limitation of the invention.
This embodiment according to the invention, the sensitive chip 30 can be powered by an at least connecting line 31 and be connected to institute
Wiring board main body 121 is stated, and can be powered and be connected to 31 tunnel of connecting line.The connecting line 31 may be implemented as, citing
It ground but is not limited to, gold thread, copper wire, aluminum steel, silver wire.Particularly, the connecting line 31 of the sensitive chip 30 can pass through biography
The COB mode of system is connected to the wiring board main body 121, citing ground but is not limited to, the mode of welding.That is, the sense
The connection of optical chip 30 and the wiring board main body 121 can make full use of existing mature interconnection technique, to reduce improved technology
Cost, traditional technique and equipment are made full use of, the wasting of resources is avoided.Certainly, those skilled in the art should
It is understood that the connection of the sensitive chip 30 and the wiring board main body 121 can also by it is other it is any can be real
The connection type of existing goal of the invention of the invention realizes that the present invention is unrestricted in this regard.
It is noted that each sensitive chip 30 is arranged at the line in of the invention this embodiment
The upper surface of road plate main body 121, the encapsulation part 11 is around the outside of the sensitive chip 30.Manufacturing the route board group
It when part 10, can choose different manufacturing sequences, citing ground but be not limited to, it in one embodiment, can be first in the route
The sensitive chip 30 is installed, then in 30 outside of sensitive chip, 121 upper mold of wiring board main body in plate main body 121
Moulding will protrude above the cladding of the circuit element 122 of the wiring board main body 121 in the inner at the encapsulation part 11
Portion.And in another embodiment of the invention, it can be first in the 121 upper mold moulding of wiring board main body at the encapsulation part
11, and the circuit element 122 that will protrude above the wiring board main body 121 is coated on inside it, it then will be described photosensitive
Chip 30 is installed on the wiring board main body 121, is located at the inside of the encapsulation part 11.
It is another embodiment of the camera module of first preferred embodiment according to the present invention referring to Fig. 4, it is described to take the photograph
As mould group can be a fixed-focus mould group (Fix Focus Model, FFM).In the camera module, the camera lens 50 is mounted
It cannot freely be adjusted in the focal length of the top surface 112 of the encapsulation part 11, i.e., the described camera module.50 He of camera lens
The optical filter 40 is coordinated to configure the top surface 112 of the encapsulation part 11.Those skilled in the art it should be understood that
The type of the camera shooting molding is not limitation of the invention.
It is noted that this preferred embodiment according to the present invention, the encapsulation part 11 can be used to support installation
The optical filter 40 and the camera lens 50, have the function of conventional base, and the advantage based on molding, and the encapsulation part 11 can be with
The planarization and consistency of the encapsulation part 11 are controlled by mold, thus for the colour filter of the camera module and described
Camera lens 50 provides smooth and consistent installation environment, to be easier to ensure that camera lens 50 and optical filter 40 and sensitive chip 30
Optical axis consistency, this point is that traditional camera module is not readily reachable by.
As shown in figure 5, being the camera module of second preferred embodiment according to the present invention.Different from above-mentioned preferred implementation
Example, there is the encapsulation part 11 mounting groove a 113A, the mounting groove 113A to be connected to the through-hole 111, to be institute
It states optical filter 40 and sufficient installation space is provided.That is, the top surface 112 of the encapsulation part 11 is in step-like knot
Structure, and it is not integrated extension, it can be used for installing the optical filter 40, the camera lens 50 on each step of the top surface 112
Or the motor 60.
Further, the height of the mounting groove 113A is greater than the thickness of the optical filter 40, so that the optical filter 40
When being installed in the mounting groove 113A, the optical filter 40 will not protrude from the top of the encapsulation part 11.
Particularly, this embodiment according to the invention, the optical filter 40 are square, the shape of the mounting groove 113A
It is adapted with the shape of the optical filter 40.That is, the mounting groove 113A is connected to the through-hole 111 in side's annular.
It is noted that in this embodiment in accordance with the invention, the mounting groove 113A can be used for installing the filter
Mating plate 40, and in other implementations of the invention, the mounting groove 113A can be used to install the motor 60 of the camera module
Or the equal components of the camera lens 50, those skilled in the art is it should be understood that the purposes of the mounting groove 113 is not this hair
Bright limitation.
It's also worth mentioning that in this embodiment in accordance with the invention, be illustrated by taking dynamic burnt mould group as an example in attached drawing, and
In other embodiments of the invention, it is described camera shooting can be a fixed-focus mould group, those skilled in the art it should be understood that
The type of the camera module is not limitation of the invention.
As shown in fig. 6, being the camera module section view based on moulding technology of third preferred embodiment according to the present invention
Schematic diagram.Different from above preferred embodiment, the camera module includes support a 70B, the support 70B for installing
The optical filter 40.The support 70B is installed in the encapsulation part 11, and the optical filter 40 is installed in the encapsulation part
11, the motor 60 or the camera lens 50 are installed in the support 70B.
This embodiment according to the invention, the support 70B have one first seat slot 71B and one second seat slot
72B, first seat slot 71B are for installing the optical filter 40, so that the surface of the optical filter 40 will not protrude from institute
State the top of support 70B.Second seat slot 72B, for being installed on the encapsulation part 11, so that 11 edge of the encapsulation part
The support 70 upwardly extends, and the positional of the optical filter 40 is to downward, to reduce the back focal length of the camera module.
In other words, the support 70B extends into the through-hole 111, and extends downwardly, thus by the optical filter 40
Be supported in 30 top of the sensitive chip, and using the space in the through-hole 111 so that optical filter 40 be stably installed it is same
When, the optical filter 40 will not occupy exterior space.
It is noted that the distance that the support 70B extends internally is located at except the photosensitive area of the sensitive chip 30,
That is, the support 70B will not block the photosensitive area of the sensitive chip 30, to avoid the sensitive chip is influenced
The size of 30 photo-process, the support 70B can be designed with specific requirements.
In this embodiment of the invention and respective drawings, it is illustrated by taking dynamic burnt mould group as an example, the camera lens 50
By by the motor 60 is installed on, the motor 60 is installed in the support 70B.That is, the support 70 is described
Optical filter 40 and the motor 60 provide installation site.And in this other embodiment of the present invention, the camera module may be used also
To be a fixed-focus mould group.The camera lens 50 is installed in the support 70B, that is to say, that the support 70B is the optical filter
40 and the camera lens 50 provide installation site, those skilled in the art it should be understood that the support 70B specific structure
Type with the camera module is not limitation of the invention.
As shown in fig. 7, being the camera shooting molding section view based on moulding technology of the 4th preferred embodiment according to the present invention
Schematic diagram.Different from above preferred embodiment, the encapsulation part 11 has a mounting groove 113C, the mounting groove 113C company
Pass through the through-hole 111.That is, the top surface 112 of the encapsulation part 11 is in step-like structure, and one is not it
Extend.
The camera module includes support a 70C, the support 70C for installing the optical filter 40.The support 70C
It is installed in the encapsulation part 11, the optical filter 40 is installed in the encapsulation part 11, the motor 60 or the camera lens 50
It is installed in the encapsulation part 11.
Further, the support 70C is installed in the mounting groove 113C of the encapsulation part 11, and the mounting groove
The height of 113C is greater than the mounting height of the support 70C, so that the support 70C will not protrude from the encapsulation part 11
The end.
This embodiment according to the invention, the support 70C have one first seat slot 71C and one second seat slot
72C, first seat slot 71C are for installing the optical filter 40, so that the surface of the optical filter 40 will not protrude from institute
State the top of support 70C.Second seat slot 72C, for being installed on the encapsulation part 11, so that 11 edge of the encapsulation part
The support 70C is upwardly extended, and the positional of the optical filter 40 is to downward, to reduce the rear coke of the camera module
Away from.It is understood that the support 70C can also be without above-mentioned second seat slot 72C, institute in other variant embodiments
The smooth bottom surface for stating support 72C is directly mounted on the encapsulation part 11.
In other words, the support 70C extends into the through-hole 111, and extends downwardly, thus by the optical filter 40
Be supported in 30 top of the sensitive chip, and using the space in the through-hole 111 so that optical filter 40 be stably installed it is same
When, the optical filter 40 will not occupy exterior space.
It is noted that the distance that the support 70C extends internally is located at except the photosensitive area of the sensitive chip 30,
That is, the support 70C will not block the sensitive chip 30, to avoid the photosensitive mistake for influencing the sensitive chip 30
The size of journey, the support 70C can be designed with specific requirements.
Different from third preferred embodiment, the mounting groove of second seat slot 71C and the encapsulation
113C cooperate, form matched clamping structure so that the support 70C be stabilized be installed on the mounting groove
In 113C.With respect to third preferred embodiment, the optical filter 40 in this embodiment is smaller apart from the sensitive chip 30,
The camera module with smaller back focal length can be obtained.
In this embodiment of the invention and respective drawings, it is illustrated by taking dynamic burnt mould group as an example, the camera lens 50
By by the motor 60 is installed on, the motor 60 is installed in the support 70C.That is, the support 70C is described
Optical filter 40 and the motor 60 provide installation site.And in this other embodiment of the present invention, the camera module may be used also
To be a fixed-focus mould group.The camera lens 50 is installed in the support 70C, that is to say, that the support 70C is the optical filter
40 and the camera lens 50 provide installation site, those skilled in the art it should be understood that the support 70 specific structure
Type with the camera module is not limitation of the invention.
As shown in figure 8, being the camera module section view based on moulding technology of the 5th preferred embodiment according to the present invention
Schematic diagram.Different from above preferred embodiment, the optical filter 40 is installed in a motor 60D, and the motor 60D is pacified
Loaded on the encapsulation part 11, the optical filter 40 is installed without providing additional component.
The motor 60D includes a lower end 61D, and the lower end 61D is adapted to be mounted to the optical filter 40.Namely
It says, the camera lens 50 is installed in the upper end of the motor 60D, and the optical filter 40 is installed in the described of the motor 60D
Lower end 61D, positioned at the lower section of the camera lens 50.
In this embodiment of the invention, the optical filter 40 is installed in the motor 60D, without providing volume
Outer component installs the optical filter 40, and the motor 60D is directly mounted to the encapsulation part 11, is the motor
60D provides smooth mounting condition.
As shown in figure 9, being the camera module section view based on moulding technology of the 6th preferred embodiment according to the present invention
Schematic diagram.Different from above preferred embodiment, the camera lens 50E includes an a lens barrel 51E and at least eyeglass 52E, each institute
Eyeglass 52E is stated to be installed in the lens barrel 51E.
This embodiment according to the invention, the optical filter 40 by being installed in the lens barrel 51E, are located at each described
The optical filter 40 is installed without providing additional component in the lower section of eyeglass 52E.
More specifically, the lens barrel 51E includes a bottom 511E, the bottom 511E is for installing the optical filter 40.
The shape of the pedestal of the lens barrel 51E and the optical filter 40 is adapted, that is to say, that and the pedestal is in hollow square structure,
In order to which the optical filter 40 is installed on wherein.The top the lens barrel 51E is for installing the eyeglass 52E, and the eyeglass
The shape of 52E is adapted, and lower part is adapted for installing the optical filter 40, and with the shape of the optical filter 40, therefore,
The cylindrical cylinder in the lens barrel 51E entirety top, and the inside of lower part is square, and the round tube and described rectangular integrally connect
It connects.
The motor 60 is installed in the encapsulation part 11, and the optical filter 40 is installed in the lens barrel 51E, thus not
Need to provide additional component to install the optical filter 40.
It as shown in Figure 10, is the camera module section view based on moulding technology of the 7th preferred embodiment according to the present invention
Schematic diagram.Different from above preferred embodiment, the circuit board module 10 includes a wiring board main body 121F, the route
Plate main body 121F is suitable for installing the sensitive chip 30 with the lower part of access a 1211F, the access 1211F.It is each described logical
Road makes the two sides wiring board main body 121F or more be connected, thus when the sensitive chip 30 is by the wiring board main body
The back side of 121F and when photosensitive area is installed on the wiring board main body 121F upward, the photosensitive area of the sensitive chip 30
The light entered by the camera lens 50 can be received.
Further, there is the wiring board main body 121F external groove 1212F, the external groove 1212F to be connected to pair
The access answered provides the installation site of the sensitive chip 30.Particularly, described in being installed in when the sensitive chip 30
When external groove 1212F, the outer surface of the sensitive chip 30 is consistent with the outer surface of the wiring board main body 121F, is located at same
Plane, to guarantee the profile pattern of the circuit board module 10.
In this embodiment in accordance with the invention, the access is in step-like, consequently facilitating installing the sensitive chip 30, is
The sensitive chip 30 provides stable installation site, and shows its photosensitive area in interior space.
It is noted that in this embodiment in accordance with the invention, provide it is a kind of different from traditional chip mounting means,
That is, flip-chip mode (Flip Chip, FC).By the sensitive chip 30 from the back side direction of the wiring board main body 121F
It is installed on the wiring board main body 121F, rather than as needing the front from the wiring board main body 121F in above-described embodiment,
That is, from the top of the wiring board main body 121F, and the photosensitive area of the sensitive chip 30 is installed on the wiring board upward
Main body 121F.Such structure and mounting means, so that the sensitive chip 30 and the encapsulation part 11 are relatively independent, it is described
The installation of sensitive chip 30 not will receive the influence of the encapsulation part 11, the encapsulation part 11 it is molded to the photosensitive core
The influence of piece 30 is also smaller.In addition, the sensitive chip 30 is embedded in the lateral surface of the wiring board main body 121F, and will not protrude
Make in the medial surface of the wiring board main body 121F so that reserving bigger space on the inside of the wiring board main body 121F
The height for obtaining the encapsulation part 11 not will receive the height limitation of the sensitive chip 30, and the encapsulation part 11 is reached
Smaller height.
It is noted that in this embodiment in accordance with the invention, the optical filter 40 is installed in the upper end of the access,
That is the optical filter 40 is covered in the access of the wiring board main body 121F, do not need to pacify the optical filter 40
Loaded on the encapsulation part 11, to greatly reduce the back focal length of the array camera module, reduce the height of the camera shooting.It is special
Not, it is cutoff filter IRCF that the optical filter 40, which can be carried out example,.That is, the optical filter 40 is mounted
In the wiring board main body 121F, without providing additional component, such as support.
It is the camera shooting mould based on moulding technology of the 8th preferred embodiment according to the present invention as shown in Figure 11 A to 12
Group.Different from above preferred embodiment, there is the encapsulation part 11 a mounting groove 113G, the mounting groove 113G to be connected to
The through-hole 111.It that is, the top surface 112G of the encapsulation part 11 is in step-like structure, and is not integrally to prolong
It stretches.
Further, the camera module includes support a 70G, the support 70G for installing the optical filter 40.It is described
Support 70G is installed in the encapsulation part 11, and the optical filter 40 is installed in the support 70G, the motor 60 or described
Camera lens 50 is installed in the encapsulation part 11.
Further, the encapsulation part 11 has raised step 114G in at least two sides of top side, and at least one side does not have
Above-mentioned raised step 114, and mounting groove 113G is formed, the support 70G is installed in the installation of the encapsulation part 11
Slot 113G, and the height of the mounting groove 113G is greater than the mounting height of the support 70G, so that the support 70G is not
The top of the encapsulation part 11 can be protruded from.For example, the height of the mounting groove 113G is bigger than the height of the support 70G
0.05mm, so that the bottom of the motor 60 will not be directly contacted with when the motor 60 is installed in the encapsulation part 11
The support 70G, and the camera lens being mounted in a motor 60 will not be contacted with the support 70G.It is worth mentioning
, in this embodiment in accordance with the invention, it is illustrated by taking dynamic burnt camera module as an example, the motor is installed in the envelope
Dress portion 11, and in other embodiments of the invention, the camera module can also be fixed-focus mould group, and the camera lens 50 is mounted
In the encapsulation part 11, particularly, the lens barrel and eyeglass of the support 70G and the camera lens 50 are not directly contacted with.
It is understood that when 30 size of sensitive chip is larger, and when 11 wall thickness of the encapsulation part is smaller, it is above-mentioned to set
Meter can still make the encapsulation part 11 provide space to install the support 70G, thus for installing the optical filter.Such as figure
Shown in 11A to Figure 12, the top of the encapsulation part 11 can form the raised step 114 three sides, and the other side does not have
There is the raised step 114 and is directly used in the support support 70G.Cut-away view as illustrated in figure 11A, it can be seen that left and right
There are the raised step 114 in two sides, and inside is for installing the support 70G.And cross-sectional view other shown in Figure 11 B
In, the top surface of the left side encapsulation part 11 directly supports the support 70G, and the inside of the raised step 114 on right side
For being limited to the support 70G.
Moreover, the top surface of the raised step 114 can be higher than the top surface of the support 70G in this embodiment,
The motor 60 described in this way is mounted on the raised step 114, thus because the encapsulation part 11 is integrally formed, and the motor
60 contact with the raised step 114 of the encapsulation part 11, so as to reduce the inclination of the motor.
It is noted that the circuit element 122, which can not be, is equably arranged in the wiring board main body 121, because
The position of this setting encapsulation part 11 reserved in the wiring board main body is not the symmetric relation of rule, such as in band
There is the side of the circuit element 122 to reserve wider, without the side relative narrower of the circuit element 122, this
In the case of the problem is that, in the more difficult setting in the relatively narrow position of the encapsulation part mounting groove, and in of the invention this
In embodiment, the mounting groove 113G is U-shaped, that is to say, that in the relatively narrow side of the encapsulation part 11, the mounting groove connects
113G passes through outside, and wider in the encapsulation part 11, and the mounting groove 113G is only connected to the through-hole 111, and does not connect
External environment is passed through, to form a U-shaped mounting groove 113G.The support 70G is installed in the mounting groove
113G, and stable support can be obtained in the wider or relatively narrow region of the encapsulation part 11, so that the optical filter
40 are stably mounted.
It is noted that an embodiment according to the present invention, the height of the mounting groove 113G is greater than the support 70G
Height, therefore in the U-shaped opening region of the mounting groove 113G, when the support 70G is installed in the mounting groove 113G
When, there are gaps between the support 70G and the side of the motor 60, therefore in the camera module, pass through a sealing
The gap is sealed by object, so that the sensitive chip 30 and outside are mutually isolated.Particularly, in one embodiment, institute
Stating sealer is colloid.That is, after group installs the camera module, by the colloid by the support in the envelope
Dress portion 11 is sealed.
This embodiment according to the invention, the support 70G have one first seat slot 71G and one second seat slot
72G, first seat slot 71G are for installing the optical filter 40, so that the surface of the optical filter 40 will not protrude from institute
State the top of support 70G.Second seat slot 72G, for being installed on the encapsulation part 11, so that 11 edge of the encapsulation part
The support 70G is upwardly extended, and the positional of the optical filter 40 is to downward, to reduce the rear coke of the camera module
Away from.
In other words, the support 70G extends into the through-hole 111, and extends downwardly, thus by the optical filter 40
Be supported in 30 top of the sensitive chip, and using the space in the through-hole 111 so that optical filter 40 be stably installed it is same
When, the optical filter 40 will not occupy exterior space.
It is noted that the distance that the support 70G extends internally is located at except the photosensitive area of the sensitive chip 30,
That is, the support 70G will not block the sensitive chip 30, to avoid the photosensitive mistake for influencing the sensitive chip 30
The size of journey, the support 70G can be designed with specific requirements.
Different from third preferred embodiment, the mounting groove of second seat slot 71G and the encapsulation
113G cooperate, form matched clamping structure so that the support 70G be stabilized be installed on the mounting groove
In 113G.With respect to third preferred embodiment, the optical filter 40 in this embodiment is smaller apart from the sensitive chip 30,
The camera module with smaller back focal length can be obtained.
In this embodiment of the invention and respective drawings, it is illustrated by taking dynamic burnt mould group as an example, the camera lens 50
By by the motor 60 is installed on, the motor 60 is installed in the support 70G.That is, the support 70C is described
Optical filter 40 and the motor 60 provide installation site.And in this other embodiment of the present invention, the camera module may be used also
To be a fixed-focus mould group.The camera lens 50 is installed in the support 70G, that is to say, that the support 70G is the optical filter
40 and the camera lens 50 provide installation site, those skilled in the art it should be understood that the support 70G specific structure
Type with the camera module is not limitation of the invention.
In above-described embodiment and attached drawing, it is illustrated the principle of the present invention by taking dynamic burnt mould group as an example, and of the invention
In other embodiments, the camera module can also be that fixed-focus molds, and those skilled in the art is it should be understood that described take the photograph
As the type of mould group is not limitation of the invention.
It should be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating
And it is not intended to limit the present invention.The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention exists
It shows and illustrates in embodiment, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (33)
1. the camera module based on moulding technology characterized by comprising
An at least camera lens；
An at least sensitive chip；With
An at least circuit board module；Wherein the sensitive chip is installed in the circuit board module, and the camera lens is located at described
The photosensitive path of sensitive chip；The circuit board module includes a wiring board portion and an encapsulation part, and the wiring board portion includes one
Wiring board main body and at least circuit element for protruding from the wiring board main body, the encapsulation part are based on moulding technology and integrally seal
Load is connected to the wiring board main body in the wiring board portion and coats the circuit element, and the encapsulation part has a through-hole,
Photosensitive path is provided for the sensitive chip, wherein the camera module includes an optical filter, it is described after the encapsulation part molding
Optical filter is installed in the encapsulation part, so that the optical filter is installed with being flattened, wherein the encapsulation part is in the line
The width dimensions of the side for being equipped with the circuit element of road plate main body are greater than the encapsulation part in the wiring board main body
The side for not being equipped with the circuit element width dimensions.
2. camera module according to claim 1, wherein the encapsulation part has a top surface, plane earth extends, described
Optical filter is installed in the top surface.
3. camera module according to claim 1, wherein the camera module includes an at least motor, the camera lens is pacified
Loaded on the motor, the motor is installed in the encapsulation part.
4. camera module according to claim 1, wherein the camera lens is installed in the encapsulation part.
5. camera module according to claim 1, wherein the encapsulation part has a mounting groove, the mounting groove is connected to
The through-hole, the optical filter are installed in the mounting groove.
6. camera module according to claim 5, wherein camera module includes an at least motor, and the motor is installed in
The encapsulation part.
7. camera module according to claim 5, wherein the camera lens is installed in the encapsulation part.
8. camera module according to claim 5, wherein the mounting groove is connected to outside U-shapedly.
9. camera module according to claim 8, wherein the camera module includes an at least motor and an at least support,
The optical filter is installed in the support, and the support is installed in the mounting groove, and the camera lens is installed in the horse
It reaches, the motor is installed in the encapsulation part.
10. camera module according to claim 8, wherein the camera module includes an at least support, the optical filter
It is installed in the support, the support is installed in the mounting groove.
11. camera module according to any one of claims 1 to 10, wherein the encapsulation part in a manner of being molded or be molded one
Body encapsulation is connected to the wiring board portion.
12. the camera module based on integrated moulding technology characterized by comprising
An at least camera lens；
An at least sensitive chip；With
An at least circuit board module；Wherein the sensitive chip is installed in the circuit board module, and the camera lens is located at described
The photosensitive path of sensitive chip；The circuit board module includes a wiring board portion and an encapsulation part, and the wiring board portion includes one
Wiring board main body and at least circuit element for protruding from the wiring board main body, the encapsulation part are based on moulding technology and integrally seal
Load is connected to the wiring board main body in the wiring board portion and coats the circuit element, and the encapsulation part has a through-hole,
Photosensitive path is provided for the sensitive chip, the camera module includes an at least support and an at least optical filter, the optical filtering
Piece is installed in the support, and the support is installed in the encapsulation part, wherein the encapsulation part is in the wiring board main body
The side for being equipped with the circuit element width dimensions be greater than the encapsulation part not set in the wiring board main body
It is equipped with the width dimensions of the side of the circuit element.
13. camera module according to claim 12, wherein the camera module includes an at least motor, the motor quilt
It is installed on the support.
14. camera module according to claim 12, wherein the camera lens is installed in the support.
15. any camera module in 2 to 14 according to claim 1, wherein side of the encapsulation part to be molded or be molded
Formula integral packaging is connected to the wiring board portion.
16. the camera module based on moulding technology characterized by comprising
An at least camera lens；
An at least sensitive chip；With
An at least circuit board module；Wherein the sensitive chip is installed in the circuit board module, and the camera lens is located at described
The photosensitive path of sensitive chip；The circuit board module includes a wiring board portion and an encapsulation part, and the wiring board portion includes one
Wiring board main body and at least circuit element for protruding from the wiring board main body, the encapsulation part are based on moulding technology and integrally seal
Load is connected to the wiring board main body in the wiring board portion and coats the circuit element, and the encapsulation part has a through-hole,
Photosensitive path is provided for the sensitive chip, wherein the camera module includes an at least support and an at least optical filter, it is described
Encapsulation part has a mounting groove, and the support is installed in the mounting groove of the encapsulation part, and the optical filter is installed in
The support, wherein the encapsulation part is in the width dimensions of the side for being equipped with the circuit element of the wiring board main body
Greater than the encapsulation part in the width dimensions of the side for not being equipped with the circuit element of the wiring board main body.
17. camera module according to claim 16, wherein the support has one first seat slot in the inside at top
There is one second seat slot with the outside in bottom, first seat slot is for installing the optical filter, second support
Slot makes the base clip together in the encapsulation part, so that the optical filter reduces at a distance from the sensitive chip.
18. camera module according to claim 16, wherein the mounting groove is connected to outside U-shapedly.
19. camera module according to claim 16, wherein camera module includes an at least motor, and the motor is mounted
In the encapsulation part.
20. camera module according to claim 16, wherein the camera lens is installed in the encapsulation part.
21. any camera module in 6 to 20 according to claim 1, wherein side of the encapsulation part to be molded or be molded
Formula integral packaging is connected to the wiring board portion.
22. the camera module based on moulding technology characterized by comprising
An at least camera lens；
An at least sensitive chip；With
An at least circuit board module；Wherein the sensitive chip is installed in the circuit board module, and the camera lens is located at described
The photosensitive path of sensitive chip；The circuit board module includes a wiring board portion and an encapsulation part, and the wiring board portion includes one
Wiring board main body and at least circuit element for protruding from the wiring board main body, the encapsulation part are based on moulding technology and integrally seal
Load is connected to the wiring board main body in the wiring board portion and coats the circuit element, and the encapsulation part has a through-hole,
Photosensitive path is provided for the sensitive chip, wherein the camera module includes an at least motor and an at least optical filter, it is described
Optical filter is installed in the motor, and the motor is installed in the encapsulation part, wherein the encapsulation part is in the wiring board
The width dimensions of the side for being equipped with the circuit element of main body be greater than the encapsulation part in the wiring board main body not
It is equipped with the width dimensions of the side of the circuit element.
23. camera module according to claim 22, wherein encapsulation part integral packaging in a manner of being molded or be molded
It is connected to the wiring board portion.
24. the camera module based on moulding technology characterized by comprising
An at least camera lens；
An at least sensitive chip；With
An at least circuit board module；Wherein the sensitive chip is installed in the circuit board module, and the camera lens is located at described
The photosensitive path of sensitive chip；The circuit board module includes a wiring board portion and an encapsulation part, and the wiring board portion includes one
Wiring board main body and at least circuit element for protruding from the wiring board main body, the encapsulation part are based on moulding technology and integrally seal
Load is connected to the wiring board main body in the wiring board portion and coats the circuit element, and the encapsulation part has a through-hole,
Photosensitive path is provided for the sensitive chip, wherein the camera module includes an at least optical filter, the camera lens includes a mirror
Cylinder and an at least eyeglass, each eyeglass are installed in the lens barrel, and the optical filter is located at each by by the lens barrel is installed on
The lower section of the eyeglass, wherein the encapsulation part is in the width of the side for being equipped with the circuit element of the wiring board main body
It spends size and is greater than the encapsulation part in the width dimensions of the side for not being equipped with the circuit element of the wiring board main body.
25. camera module according to claim 24, wherein encapsulation part integral packaging in a manner of being molded or be molded
It is connected to the wiring board portion.
26. the camera module based on moulding technology characterized by comprising
An at least camera lens；
An at least sensitive chip；With
An at least circuit board module；Wherein the sensitive chip is installed in the circuit board module, and the camera lens is located at described
The photosensitive path of sensitive chip；The circuit board module includes a wiring board portion and an encapsulation part, and the wiring board portion includes one
Wiring board main body and at least circuit element for protruding from the wiring board main body, the encapsulation part are based on moulding technology and integrally seal
Load is connected to the wiring board main body in the wiring board portion and coats the circuit element, and the encapsulation part has a through-hole,
Photosensitive path is provided for the sensitive chip, wherein the camera module includes an at least optical filter, the wiring board portion includes
One wiring board main body, the encapsulation part integral packaging are connected to the wiring board main body, and the wiring board main body has an access,
In the access, the optical filter is covered in the access of the wiring board main body for the sensitive chip upside-down mounting, wherein described
Encapsulation part in the side for being equipped with the circuit element of the wiring board main body width dimensions be greater than the encapsulation part in
The width dimensions of the side for not being equipped with the circuit element of the wiring board main body.
27. camera module according to claim 26, wherein the camera module includes an at least motor, the camera lens quilt
It is installed on the motor, the motor is installed in the encapsulation part.
28. camera module according to claim 26, wherein the camera lens is installed in the encapsulation part.
29. according to the camera module any in claim 26 to 28, wherein side of the encapsulation part to be molded or be molded
Formula integral packaging is connected to the wiring board portion.
30. the camera module based on moulding technology characterized by comprising
An at least camera lens；
An at least sensitive chip；With
An at least circuit board module；Wherein the sensitive chip is installed in the circuit board module, and the camera lens is located at described
The photosensitive path of sensitive chip；The circuit board module includes a wiring board portion and an encapsulation part, and the wiring board portion includes one
Wiring board main body and at least circuit element for protruding from the wiring board main body, the encapsulation part are based on moulding technology and integrally seal
Load is connected to the wiring board main body in the wiring board portion and coats the circuit element, and the encapsulation part has a through-hole,
Photosensitive path is provided for the sensitive chip, wherein at least two sides at the top of the encapsulation part are respectively provided at least one raised platform
Rank, inside form a mounting groove, and the camera module further includes an at least support and an at least optical filter, the support installation
The mounting groove on the inside of the raised step, the optical filter are installed on the support, wherein the encapsulation part is in described
The width dimensions of the side for being equipped with the circuit element of wiring board main body are greater than the encapsulation part in the wiring board master
The width dimensions of the side for not being equipped with the circuit element of body.
31. camera module according to claim 30, wherein the top surface of at least side at the top of the encapsulation part does not have
The raised step is set, to be used to support the support.
32. camera module according to claim 31, wherein the raised step top surface is higher than the surface of the support,
The camera module further includes a motor, and the motor is mounted on the raised step.
33. according to the camera module any in claim 30 to 32, wherein side of the encapsulation part to be molded or be molded
Formula integral packaging is connected to the wiring board portion.
Priority Applications (25)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610250836.6A CN105898120B (en) | 2016-04-21 | 2016-04-21 | Camera module based on moulding technology |
| CN201911129020.8A CN110708454B (en) | 2016-04-21 | 2016-04-21 | Camera module based on molding process |
| KR1020187026982A KR102282687B1 (en) | 2016-02-18 | 2016-07-28 | Camera module based on integrated packaging process, integrated base part thereof, and manufacturing method thereof |
| US15/999,858 US11877044B2 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method thereof |
| CN201690000252.7U CN208353432U (en) | 2016-02-18 | 2016-07-28 | Camera module and its integral base component based on integral packaging technique |
| PCT/CN2016/092020 WO2017140092A1 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| JP2018543321A JP6829259B2 (en) | 2016-02-18 | 2016-07-28 | Integrated packaging process-based camera module, its integrated base parts, and how to manufacture them |
| EP16890320.1A EP3419275A4 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| KR1020217023290A KR102465474B1 (en) | 2016-02-18 | 2016-07-28 | Integral packaging process-based camera module, integral base component of same, and manufacturing method therefor |
| PCT/CN2016/106402 WO2017181668A1 (en) | 2016-04-21 | 2016-11-18 | Camera module and array camera module based on integration packaging process |
| US15/512,065 US10477088B2 (en) | 2016-04-21 | 2016-11-18 | Camera module and array camera module based on integral packaging technology |
| JP2018555482A JP6952052B2 (en) | 2016-04-21 | 2016-11-18 | Camera modules and array camera modules based on integrated packaging technology |
| KR1020187033639A KR102152517B1 (en) | 2016-04-21 | 2016-11-18 | Camera module and array camera module based on integrated packaging process |
| TW108100066A TWI743429B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process, integrated base assembly and manufacturing method thereof |
| TW108100078A TWI708987B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process and integrated base assembly and manufacturing method thereof |
| TW106204229U TWM561225U (en) | 2016-04-01 | 2017-03-26 | Integral packaging process-based camera module and integral base component of same |
| TW106110049A TWI648587B (en) | 2016-04-01 | 2017-03-26 | Camera module based on integrated packaging process and integrated base assembly and manufacturing |
| US15/627,418 US10110791B2 (en) | 2016-04-21 | 2017-06-19 | Camera module and array camera module based on integral packaging technology |
| US15/627,408 US10129452B2 (en) | 2016-04-21 | 2017-06-19 | Camera module and array camera module based on integral packaging technology |
| US15/627,437 US10194064B2 (en) | 2016-04-21 | 2017-06-19 | Array camera module based on integral packaging technology |
| US15/627,429 US9848109B2 (en) | 2016-04-21 | 2017-06-19 | Camera module and array camera module based on integral packaging technology |
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| US16/575,357 US11533416B2 (en) | 2016-04-21 | 2019-09-18 | Camera module and array camera module based on integral packaging technology |
| JP2021007710A JP2021073520A (en) | 2016-02-18 | 2021-01-21 | Integral package process base camera module, integral base component thereof, and manufacturing method thereof |
| US17/833,025 US20220303441A1 (en) | 2016-04-21 | 2022-06-06 | Camera module and array camera module based on integral packaging technology |
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| CN105898120A (en) | 2016-08-24 |
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