CN106506929B - A kind of camera module and mobile terminal - Google Patents
A kind of camera module and mobile terminal Download PDFInfo
- Publication number
- CN106506929B CN106506929B CN201611208723.6A CN201611208723A CN106506929B CN 106506929 B CN106506929 B CN 106506929B CN 201611208723 A CN201611208723 A CN 201611208723A CN 106506929 B CN106506929 B CN 106506929B
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- pedestal
- optical filter
- circuit board
- camera lens
- image sensor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Blocking Light For Cameras (AREA)
Abstract
The embodiment of the invention provides a kind of camera module and mobile terminals, wherein, camera module includes: camera lens, voice coil motor, pedestal, optical filter, circuit board and imaging sensor, camera lens is installed on voice coil motor, pedestal has opposite first surface, second surface and inner cavity through first surface and second surface, voice coil motor is installed on first surface, the second surface of pedestal is installed on circuit board, imaging sensor is built in the inner cavity of pedestal, and circuit board is coaxially installed on camera lens, optical filter is fitted in the upper surface of imaging sensor, the inner cavity of pedestal is greater than the area of optical filter in the smallest cross-section area perpendicular to camera lens axis direction, using the embodiment of the present invention, optical filter will not be squeezed because of pedestal causes optical filter to rupture, the space of the fixed optical filter of pedestal is saved simultaneously, more designs are provided for camera lens Space can reduce optical length to reduce the height of camera module, be conducive to mobile terminal to frivolous convenient and fast trend development.
Description
Technical field
The present invention relates to optical camera technical fields, more particularly to a kind of camera module and mobile terminal.
Background technique
With the progress of electronic technology, various electronic products, mobile terminal, computer and electronic watch etc. are usual
It is both provided with camera module.All tend to develop to frivolous, short and small direction for easy to carry or installation, various electronic products.
In order to meet the frivolous convenient requirement of electronic product, product structure space is smaller and smaller, and corresponding camera
Mould group belongs to optics product, and structure is smaller, bigger on optical property influence, as shown in Figure 1, being the knot of existing camera module
Structure schematic diagram, camera module include camera lens 1, voice coil motor 2, optical filter 3, pedestal 4, imaging sensor 5 and circuit board 6, filter
Mating plate 3 is installed on the supporting part of the composition of pedestal 4.
Existing camera module has the following problems:
1) optical filter 3 is installed on the supporting part of pedestal 4, and the supporting part of pedestal 4 is usually made relatively thin since space limits,
It is typically only 0.2-0.3mm and is plastic cement material, will lead to structural strength deficiency in this way, pedestal squeezes filter in falling process
Mating plate 3 causes optical filter 3 to rupture.
2) total height=camera lens optical length TTL (Total Track Length)+image sensing of camera module
The thickness H2 of the height H1+ circuit board 6 of device 5, in order to guarantee optical length TTL to guarantee the optical property of camera, in image
In the case that sensor and circuit board are certain, the total height of camera module can only be increased, it is frivolous convenient to be unfavorable for electronic product
It is required that.
Summary of the invention
The embodiment of the present invention provides a kind of camera module and mobile terminal, to solve the pedestal of current camera module
Structural strength deficiency causes optical filter rupture and camera module excessive overall height to be unfavorable for the light and portable development of electronic product
The problem of.
In a first aspect, providing a kind of camera module, comprising: camera lens, voice coil motor, pedestal, optical filter, circuit board and
Imaging sensor, the camera lens are installed on the voice coil motor, wherein
The pedestal has opposite first surface, second surface and runs through the first surface and the second surface
Inner cavity, the voice coil motor is installed on the first surface, and the second surface of the pedestal is installed on the circuit board；
Described image sensor is built in the inner cavity of the pedestal, and is coaxially installed on the circuit board with the camera lens
On, the optical filter is fitted in the upper surface of described image sensor, and the inner cavity of the pedestal is perpendicular to the camera lens axle center
The smallest cross-section area in direction is greater than the area of the optical filter.
Second aspect provides a kind of mobile terminal, and the mobile terminal includes camera module, the camera module
It include: camera lens, voice coil motor, pedestal, optical filter, circuit board and imaging sensor, the camera lens is installed on the voice coil motor,
Wherein,
The pedestal has opposite first surface, second surface and runs through the first surface and the second surface
Inner cavity, the voice coil motor is installed on the first surface, and the second surface of the pedestal is installed on the circuit board；
Described image sensor is built in the inner cavity of the pedestal, and is coaxially installed on the circuit board with the camera lens
On, the optical filter is fitted in the upper surface of described image sensor, and the inner cavity of the pedestal is perpendicular to the camera lens axle center
The smallest cross-section area in direction is greater than the area of the optical filter.
The camera module of the embodiment of the present invention, comprising: camera lens, voice coil motor, pedestal, optical filter, circuit board and image
Sensor, camera lens are installed on the voice coil motor, wherein pedestal has opposite first surface, second surface and through the
The inner cavity on one surface and the second surface, voice coil motor are installed on first surface, and the second surface of pedestal is installed on circuit board；
Imaging sensor is built in the inner cavity of pedestal, and is coaxially installed on circuit board with camera lens, and optical filter is fitted in image sensing
The upper surface of device, the inner cavity of pedestal are greater than the area of optical filter, this hair in the smallest cross-section area perpendicular to camera lens axis direction
Bright embodiment directly fits optical filter on the image sensor, and optical filter is not contacted with pedestal, and it is solid to solve current optical filter
When being scheduled on pedestal, since understructure intensity deficiency squeezes the problem of optical filter causes optical filter to rupture, while pedestal is saved
The space of fixed optical filter, provides more design spaces for camera lens, can suitably reduce optical length and entirely be taken the photograph with reducing
As the height of head mould group, be conducive to mobile terminal to frivolous convenient and fast trend development.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below by institute in the description to the embodiment of the present invention
Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the invention
Example, for those of ordinary skill in the art, without any creative labor, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is the structural schematic diagram of existing camera module；
Fig. 2 is a kind of structural schematic diagram of camera module of the embodiment of the present invention one；
Fig. 3 is a kind of structural schematic diagram of camera module of the embodiment of the present invention two.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are some of the embodiments of the present invention, instead of all the embodiments.Based on this hair
Embodiment in bright, every other implementation obtained by those of ordinary skill in the art without making creative efforts
Example, shall fall within the protection scope of the present invention.
Embodiment one
The embodiment of the present invention one discloses a kind of camera module, which includes: camera lens, voice coil motor, bottom
Seat, optical filter, circuit board and imaging sensor, camera lens are installed on voice coil motor,
Wherein, pedestal has opposite first surface, second surface and the inner cavity through first surface and second surface,
Voice coil motor is installed on first surface, and the second surface of pedestal is installed on circuit board；
Imaging sensor is built in the inner cavity of pedestal, and is coaxially installed on circuit board with camera lens, and optical filter is fitted in
The upper surface of imaging sensor, the inner cavity of pedestal are greater than the face of optical filter in the smallest cross-section area perpendicular to camera lens axis direction
Product.
In practical applications, when camera module is focused, camera lens can pass through pedestal under the drive of voice coil motor
Inner cavity, close to imaging sensor, to form clearly image surface on the image sensor.
Preferably, optical filter is bonded with imaging sensor by glue or semiconductor packages, since the inner cavity of pedestal exists
Be greater than the area of optical filter perpendicular to the smallest cross-section area of camera lens axis direction so that optical filter on imaging sensor with
Pedestal is discontiguous.
Embodiment one in order to enable those skilled in the art to better understand the present invention is illustrated below by way of specific example:
It is illustrated in figure 2 a kind of structural schematic diagram of camera module of the embodiment of the present invention one, the camera module packet
Include: camera lens 10, voice coil motor 20, optical filter 30, pedestal 40, imaging sensor 50 and circuit board 60, camera lens 10 are installed on voice coil
Motor 20.
Pedestal 40 can be a closed loop part plastic parts, i.e., pedestal 40 is in the outer of the cross section perpendicular to 10 axis direction of camera lens
Shape profile can be rectangular, the round or polygon of closure, and pedestal 40 has opposite first surface 401, second surface 402
And through the inner cavity 403 of first surface 401 and second surface 402.
Voice coil motor 20 can be installed on first surface 401 by modes such as viscose glue, screw thread or buckles, and the of pedestal 40
The reserved pedestal installation position that two surfaces 402 can be installed on circuit board 60 by viscose glue or buckle, specifically, can be the bottom of at
The corresponding plastic cement bottom surface of second surface 402 of seat 40 is provided with groove, corresponding boss is provided on circuit board 60, so that bottom
Seat 40 and the better location and installation of circuit board 60, naturally it is also possible to buckle structure is set, is directly installed, the embodiment of the present invention
It is without limitation.
Imaging sensor 50 can be CCD (Charge-coupled Device, charge coupled cell) or CMOS
(Complementary Metal Oxide Semiconductor, complementary metal oxide semiconductor), in imaging sensor 50
It is placed in the inner cavity 403 of pedestal 40, and is coaxially installed on circuit board 60 with camera lens 10, specifically, being provided on circuit board 60
It the installation position of imaging sensor 50 can be by preset on gold thread and circuit board 60 after imaging sensor 50 is placed in installation position
Leg forms electrical connection after being welded.
Optical filter 30 can be cutoff filter, can also be other optical filters, such as narrow band filter certainly,
Bandpass filter etc..
It in practical applications, can be by mounting work automatically when optical filter 30 is fitted in the upper surface of imaging sensor 50
Skill fitting, such as by automatic attaching equipment, first apply glue around imaging sensor 50, then it will be filtered by suction nozzle
Piece 30 fits to the surface of imaging sensor 50；It can certainly be manufactured by semiconductor packaging in imaging sensor 50
When optical filter 30 is directly encapsulated into the surface of imaging sensor 50.
Preferably, the inner cavity 403 of pedestal 40 is greater than optical filter 30 in the smallest cross-section area perpendicular to camera lens axis direction
Area, in this way, optical filter 30 and pedestal 40 be it is discontiguous, avoid pedestal 40 because structural strength deficiency squeeze optical filter
30, cause optical filter 30 to rupture.
In practical applications, when camera module is focused, since pedestal 40 does not need installation optical filter 30, pedestal 40
Inner cavity 403 is designed bigger, and camera lens 10 can be by the inner cavity 403 of pedestal 40, close to image under the drive of voice coil motor 20
Sensor 50, to form clearly image surface on imaging sensor 50, so that 10 design space of camera lens increases to improve
Optical effect can reduce optical length suitably to reduce the height of entire camera module.
The camera module of the embodiment of the present invention, comprising: camera lens, voice coil motor, pedestal, optical filter, circuit board and image
Sensor, camera lens are installed on the voice coil motor, wherein pedestal has opposite first surface, second surface and through the
The inner cavity on one surface and the second surface, voice coil motor are installed on first surface, and the second surface of pedestal is installed on circuit board；
Imaging sensor is built in the inner cavity of pedestal, and is coaxially installed on circuit board with camera lens, and optical filter is fitted in image sensing
The upper surface of device, the inner cavity of pedestal are greater than the area of optical filter, this hair in the smallest cross-section area perpendicular to camera lens axis direction
Bright embodiment directly fits optical filter on the image sensor, and optical filter is not contacted with pedestal, and it is solid to solve current optical filter
When being scheduled on pedestal, the problem of causing optical filter to rupture due to understructure intensity deficiency, while pedestal saves fixed optical filtering
The space of piece provides more design spaces for optical system, can reduce optical length suitably to reduce entire camera
The height of mould group is conducive to mobile terminal to frivolous convenient and fast trend development.
Embodiment two
Referring to embodiment one, embodiment two is provided with an accommodating chamber on the basis of example 1, on circuit board, and image passes
Sensor is fixed in accommodating chamber.
More preferably, imaging sensor can be fixed on accommodating chamber by insulative glue, and imaging sensor is fixed on accommodating chamber
Afterwards, electrical connection is formed after being welded by preset leg on gold thread and circuit board, the depth of accommodating chamber can be set
After imaging sensor is fixed, the upper surface of imaging sensor and circuit board upper surface same plane.
Embodiment two in order to enable those skilled in the art to better understand the present invention are illustrated below by way of specific example:
It is illustrated in figure 3 a kind of structural schematic diagram of camera module of the embodiment of the present invention two, the camera module packet
Include: camera lens 10, voice coil motor 20, optical filter 30, pedestal 40, imaging sensor 50 and circuit board 60, camera lens 10 are installed on voice coil
Motor 20.
Wherein, pedestal 40 has opposite first surface 401, second surface 402 and runs through first surface 401 and second
The inner cavity 403 on surface 402, voice coil motor 20 are installed on first surface 401, and the second surface 402 of pedestal 40 is installed on circuit board
60。
Imaging sensor 50 are built in the inner cavity 403 of pedestal 40, and are coaxially installed on circuit board 60 with camera lens 10,
Optical filter 30 is fitted in the upper surface of imaging sensor 50, the inner cavity 403 of pedestal 40 perpendicular to 10 axis direction of camera lens most
Small cross-sectional area is greater than the area of optical filter 30.
In practical applications, when camera module is focused, camera lens 10 can pass through bottom under the drive of voice coil motor 20
The inner cavity 403 of seat 40, close to imaging sensor 50, to form clearly image surface on imaging sensor 50.
Preferably, optical filter 30 is bonded with imaging sensor 50 by glue or semiconductor packages, due to pedestal 40
Inner cavity 403 is greater than the area of optical filter 30 in the smallest cross-section area perpendicular to 10 axis direction of camera lens, so that image sensing
Optical filter on device is discontiguous with pedestal.
Preferably, an accommodating chamber 601 is provided on circuit board 60, imaging sensor 50 is fixed in accommodating chamber 601, specifically
Imaging sensor 50 accommodating chamber 601 is fixed on by insulative glue, can be with after imaging sensor 50 is fixed on accommodating chamber 601
Electrical connection is formed after being welded by preset leg on gold thread and circuit board 60, the depth of accommodating chamber 601 can be set to
After imaging sensor 50 is fixed, the upper surface of imaging sensor 50 and 60 upper surface same plane of circuit board can reduce gold
Gold thread camber after wire bonding so that the design space of optical system is more, simultaneously because the surface of imaging sensor 50 with
60 upper surface same plane of circuit board, can make the height of camera module reduce.
In the embodiment of the present invention, optical filter is directly fitted on the image sensor, optical filter is not contacted with pedestal, is solved
When current optical filter is fixed on the base, the problem of causing optical filter to rupture due to understructure intensity deficiency, while pedestal
The space of fixed optical filter is saved, more design spaces is provided for Optical System Design, can suitably reduce optical length
To reduce the height of entire camera module, be conducive to mobile terminal to frivolous convenient and fast trend development.
Further, accommodating chamber is set on circuit boards, imaging sensor is fixed in accommodating chamber, imaging sensor it is upper
Surface and circuit board surface same plane, the gold thread camber after gold thread welding can be effectively reduced, so that optical system is set
It is more to count space, simultaneously because the imaging surface of imaging sensor and circuit board same plane, eliminate imaging sensor thickness
It influences, the height of camera module can be made to be designed smaller, be conducive to mobile terminal to frivolous convenient and fast trend development.
Embodiment three
The embodiment of the present invention three discloses a kind of mobile terminal, and the mobile terminal includes camera module, the camera shooting
Head mould group includes: camera lens, voice coil motor, pedestal, optical filter, circuit board and imaging sensor, and the camera lens is installed on the sound
Coil motor, wherein
The pedestal has opposite first surface, second surface and runs through the first surface and the second surface
Inner cavity, the voice coil motor is installed on the first surface, and the second surface of the pedestal is installed on the circuit board；
Described image sensor is built in the inner cavity of the pedestal, and is coaxially installed on the circuit board with the camera lens
On, the optical filter is fitted in the upper surface of described image sensor, and the inner cavity of the pedestal is perpendicular to the camera lens axle center
The smallest cross-section area in direction is greater than the area of the optical filter.
Preferably, the camera lens is sensed by the inner cavity of the pedestal close to described image under the drive of voice coil motor
Device.
Preferably, an accommodating chamber is provided on the circuit board, described image sensor is fixed in the accommodating chamber.
Preferably, described image sensor is fixed on the accommodating chamber by glue.
Preferably, the optical filter is bonded with described image sensor by glue or semiconductor packages.
The mobile terminal of the embodiment of the present invention includes camera module, which is directly attached to figure for optical filter
As on sensor, optical filter is not contacted with pedestal, when solving current optical filter and being fixed on the base, due to understructure intensity
The problem of deficiency causes optical filter to rupture, while pedestal saves the space of fixed optical filter, provides more for optical system
Design space can reduce the height of entire camera module, be conducive to mobile terminal to frivolous convenient and fast trend development.
Further, accommodating chamber is set on circuit boards, imaging sensor is fixed in accommodating chamber, imaging sensor it is upper
Surface and circuit board surface same plane, the gold thread camber after gold thread welding can be effectively reduced, so that optical system is set
It is more to count space, simultaneously because the imaging surface of imaging sensor and circuit board same plane, eliminate imaging sensor thickness
It influences, the height of camera module can be made to be designed smaller, be conducive to mobile terminal to frivolous convenient and fast trend development.
It should be noted that embodiment one, embodiment two and embodiment three have similarity, not exhaustive place, each reality
It is cross-referenced to apply example.
Although the preferred embodiment of the embodiment of the present invention has been described, once a person skilled in the art knows bases
This creative concept, then additional changes and modifications can be made to these embodiments.So the following claims are intended to be interpreted as
Including preferred embodiment and fall into all change and modification of range of embodiment of the invention.
Finally, it is to be noted that, herein, the terms "include", "comprise" or its any other variant are intended to
Cover non-exclusive inclusion, so that including that process, method, article or the terminal device of a series of elements not only include
Those elements, but also including other elements that are not explicitly listed, or further include for this process, method, article or
The intrinsic element of person's terminal device.In the absence of more restrictions, the element limited by sentence "including a ...",
Be not precluded is including that there is also other identical elements in the process, method of the element, article or terminal device.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (8)
1. a kind of camera module, which is characterized in that the camera module includes: camera lens, voice coil motor, pedestal, optical filter,
Circuit board and imaging sensor, the camera lens are installed on the voice coil motor, wherein
The pedestal has opposite first surface, second surface and in the first surface and the second surface
Chamber, the voice coil motor are installed on the first surface, and the second surface of the pedestal is installed on the circuit board；
Described image sensor is built in the inner cavity of the pedestal, and is coaxially installed on the circuit board with the camera lens,
The optical filter is fitted in the upper surface of described image sensor, and the inner cavity of the pedestal is perpendicular to the camera lens axis direction
Smallest cross-section area be greater than the area of the optical filter, also, the optical filter in described image sensor is not contacted with pedestal；
Wherein, the upper surface of described image sensor and the circuit board surface same plane；
Wherein, the camera lens under the drive of voice coil motor by the inner cavity of the pedestal close to described image sensor.
2. camera module according to claim 1, which is characterized in that be provided with an accommodating chamber, institute on the circuit board
Imaging sensor is stated to be fixed in the accommodating chamber.
3. camera module according to claim 2, which is characterized in that described image sensor is fixed on institute by glue
State accommodating chamber.
4. camera module according to claim 1, which is characterized in that the optical filter passes through with described image sensor
Glue fitting or semiconductor packages.
5. a kind of mobile terminal, which is characterized in that the mobile terminal includes camera module, and the camera module includes:
Camera lens, voice coil motor, pedestal, optical filter, circuit board and imaging sensor, the camera lens are installed on the voice coil motor, wherein
The pedestal has opposite first surface, second surface and in the first surface and the second surface
Chamber, the voice coil motor are installed on the first surface, and the second surface of the pedestal is installed on the circuit board；
Described image sensor is built in the inner cavity of the pedestal, and is coaxially installed on the circuit board with the camera lens,
The optical filter is fitted in the upper surface of described image sensor, and the inner cavity of the pedestal is perpendicular to the camera lens axis direction
Smallest cross-section area be greater than the area of the optical filter, also, the optical filter in described image sensor is not contacted with pedestal；
Wherein, the upper surface of described image sensor and the circuit board surface same plane；
Wherein, the camera lens under the drive of voice coil motor by the inner cavity of the pedestal close to described image sensor.
6. mobile terminal according to claim 5, which is characterized in that an accommodating chamber is provided on the circuit board, it is described
Imaging sensor is fixed in the accommodating chamber.
7. mobile terminal according to claim 6, which is characterized in that described image sensor is fixed on described by glue
Accommodating chamber.
8. mobile terminal according to claim 5, which is characterized in that the optical filter and described image sensor pass through glue
Water fitting or semiconductor packages.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201611208723.6A CN106506929B (en) | 2016-12-23 | 2016-12-23 | A kind of camera module and mobile terminal |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611208723.6A CN106506929B (en) | 2016-12-23 | 2016-12-23 | A kind of camera module and mobile terminal |
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| CN106506929A CN106506929A (en) | 2017-03-15 |
| CN106506929B true CN106506929B (en) | 2019-11-22 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107132720B (en) * | 2017-07-07 | 2023-08-11 | 奥比中光科技集团股份有限公司 | Light-emitting device and optical projection module thereof |
| CN108458785A (en) * | 2018-01-31 | 2018-08-28 | 云谷（固安）科技有限公司 | Spectral detection component and preparation method thereof, spectrometer |
| CN109218582A (en) * | 2018-09-29 | 2019-01-15 | Oppo广东移动通信有限公司 | Mould group and preparation method thereof, camera and electronic device |
| CN109451215A (en) * | 2018-11-15 | 2019-03-08 | 维沃移动通信（杭州）有限公司 | A kind of camera module and terminal |
| CN109471117A (en) * | 2018-11-21 | 2019-03-15 | 维沃移动通信（杭州）有限公司 | A kind of terminal device |
| CN109819151A (en) * | 2019-02-26 | 2019-05-28 | 苏州昀冢电子科技有限公司 | A kind of voice coil motor pedestal, voice coil motor and camera module |
| CN109981958A (en) * | 2019-04-24 | 2019-07-05 | 维沃移动通信（杭州）有限公司 | The production method of camera module, terminal device and camera module |
| CN113363170B (en) * | 2021-05-11 | 2024-01-19 | 苏州昀冢电子科技股份有限公司 | Camera module chip packaging base combination and manufacturing method thereof |
| CN113676631B (en) * | 2021-08-09 | 2023-05-26 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| CN116847184A (en) * | 2022-03-22 | 2023-10-03 | 华为技术有限公司 | Camera module |
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