KR101653926B1 - LED reflector and LED package having the same - Google Patents
LED reflector and LED package having the same Download PDFInfo
- Publication number
- KR101653926B1 KR101653926B1 KR1020150087372A KR20150087372A KR101653926B1 KR 101653926 B1 KR101653926 B1 KR 101653926B1 KR 1020150087372 A KR1020150087372 A KR 1020150087372A KR 20150087372 A KR20150087372 A KR 20150087372A KR 101653926 B1 KR101653926 B1 KR 101653926B1
- Authority
- KR
- South Korea
- Prior art keywords
- led
- lead frame
- reflector
- reflector body
- injection molding
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 238000001746 injection moulding Methods 0.000 claims abstract description 19
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 18
- 239000000057 synthetic resin Substances 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000004954 Polyphthalamide Substances 0.000 claims description 8
- 229920006336 epoxy molding compound Polymers 0.000 claims description 8
- 229920001123 polycyclohexylenedimethylene terephthalate Polymers 0.000 claims description 8
- 229920006375 polyphtalamide Polymers 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- 238000005520 cutting process Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 4
- 230000002708 enhancing effect Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 239000007769 metal material Substances 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 7
- 239000004926 polymethyl methacrylate Substances 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- 239000003963 antioxidant agent Substances 0.000 description 5
- 230000003078 antioxidant effect Effects 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229920003233 aromatic nylon Polymers 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002996 emotional effect Effects 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED reflector, an LED lens, and an LED package including the same. More particularly, the present invention relates to a LED reflector, a backlight unit (BLU) The present invention relates to an LED lens and an LED package including the same.
Currently, the camera technology of portable terminals is greatly developed. The camera of the mobile terminal is important in terms of capturing an emotional image by simply moving away from the function of photographing the subject according to the user's needs. In order to do so, not only the function of the camera but also the function of a device assisting the function of the camera Technology is being developed.
Meanwhile, the camera of the portable terminal is equipped with a flash module for brightly photographing a subject in a dark place where light is insufficient. In recent years, an LED flash module using a light emitting diode (LED) as a light source has become popular.
In order to improve the illumination characteristic of the LED device, a reflector coupled to the PCB substrate on which the LED device is mounted and concentrating the light emitted by the LED device is used in the LED flash module.
In general, the reflector has a shape in which a through hole is formed in the central region for converging light, the inner diameter of which is narrower toward the lower side than the upper side, so as to surround the LED element. In addition, the reflector is generally coated with a silver (antireflection coating) formed of a material such as copper, zinc, or aluminum formed by die casting, and an antioxidant to prevent oxidation of silver after silver plating.
However, in the conventional reflector, the antioxidant coated with silver after plating is melted or evaporated at a low temperature of about 80 ° C. When the antioxidant is exposed for a long time in a high temperature environment such as tropical fats, the antioxidant is melted or evaporated, There is a problem that the function as a reflector is deteriorated or can not be performed. In addition, the conventional reflector has a problem that the process is complicated and the manufacturing cost is high due to the plating process, the coating process, and the like.
Related Prior Art Document is disclosed in Japanese Patent Application Laid-Open No. 10-2014-0123866 (filed on October 23, 2014) and Published Patent Application No. 10-2010-0105287 Name of camera flash module, public date: September 29, 2010).
An object of the present invention is to provide an LED reflector, an LED lens and an LED package including the LED reflector, which can simplify the manufacturing process and reduce the manufacturing cost, while maintaining the reflection characteristic even when exposed to a high temperature environment for a long time.
According to an aspect of the present invention, there is provided a reflector comprising: a reflector body made of a synthetic resin material to surround an LED (Light Emitting Diode) element; And a metal lead frame coupled to a bottom surface of the reflector body and providing a bonding surface with the substrate, wherein the reflector body is provided integrally with the lead frame by insert injection molding The LED reflector being characterized in that:
Here, the reflector body is preferably made of a synthetic resin material such as polyphthalamide (PPA), epoxy molding compound (EMC), or polycyclohexylenedimethylene terephthalate (PCT).
The LED reflector body may further include a Zener diode bonded to the lead frame and embedded in the reflector body during the injection molding.
It is preferable that the lead frame includes a protrusion for enhancing a coupling force with the reflector body during the insert injection molding.
The protrusion is preferably formed by cutting a part of the lead frame and then bending it in an upward direction.
Preferably, the lead frame does not use a separate PCB substrate for mounting the LED element and the LED reflector, so that an LED mounting portion on which the LED element is mounted is formed.
It is preferable that the lead frame is constituted by a pair of frame members separated from each other, and the LED mounting portion is formed protruding toward the center of the reflector body at each of the pair of frame members.
According to an aspect of the present invention, there is provided a light emitting diode (LED) device comprising: a lens body made of a synthetic resin material to cover an LED (Light Emitting Diode) device; And a metal lead frame coupled to the bottom surface of the lens body and providing a bonding surface with the substrate, wherein the lens body is integrally provided with the lead frame by Insert Injection Molding This is accomplished by an LED lens which features.
Here, the lens body is preferably made of a transparent synthetic resin material including PMMA (Polymethyl Methacrylate).
The LED lens may further include a Zener diode bonded to the lead frame and embedded in the lens body during the insert injection molding.
It is preferable that the lead frame includes a protrusion for increasing a coupling force with the lens body during the injection molding.
The protrusion is preferably formed by cutting a part of the lead frame and then bending it in an upward direction.
Preferably, the lead frame does not use a separate PCB substrate for mounting the LED element and the LED lens, so that an LED mounting portion on which the LED element is mounted is formed.
It is preferable that the lead frame is composed of a pair of frame members separated from each other and the LED mounting portion is formed protruding toward the center of the lens body from each of the pair of frame members.
The object is achieved by an LED device comprising: an LED element; A substrate on which the LED element is mounted; And an LED reflector according to claim 1 or an LED lens according to claim 6 bonded to the substrate.
Since the reflector body or the lens body made of a synthetic resin material in the LED reflector or the LED lens is integrally formed with the lead frame made of metal by insert injection molding, the plating process, the coating process, and the like can be omitted, And the manufacturing cost can be reduced. In addition, in the conventional LED reflector, the antioxidant coated after silver plating is melted or evaporated in a high temperature environment to oxidize silver, thereby significantly reducing the reflection characteristic.
Further, in the LED reflector or LED lens of the present invention, an LED mounting part for mounting an LED element on a lead frame made of a metal is formed, and the LED element is directly mounted on the lead frame, so that the LED element and the LED reflector It is not necessary to use a separate PCB substrate for mounting, so that the overall structure and manufacturing process can be further simplified.
1 is a perspective view of an LED reflector according to an embodiment of the present invention;
2 is a cross-sectional view of the LED reflector taken along line II-II in FIG.
3 is a plan view of a lead frame in the LED reflector of Fig.
Fig. 4 is a perspective view of a lead frame having protrusions formed in the LED reflector of Fig. 1; Fig.
5 is a perspective view showing a state in which a zener diode is bonded to the lead frame of Fig. 3;
FIG. 6 is a cross-sectional view of an LED package according to an embodiment of the present invention, to which the LED reflector of FIG. 1 is applied; FIG.
7 is a plan view of an LED reflector according to another embodiment of the present invention.
8 is a cross-sectional view of the LED reflector according to line VIII-VIII in FIG. 7;
Fig. 9 is a perspective view of the lead frame in the LED reflector of Fig. 7; Fig.
10 is a perspective view of an LED lens according to an embodiment of the present invention;
In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.
Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in order to avoid unnecessary obscuration of the present invention.
FIG. 1 is a perspective view of an LED reflector according to an embodiment of the present invention, and FIG. 2 is a sectional view of an LED reflector taken along a line II-II in FIG.
Referring to FIGS. 1 and 2, the
Referring to FIGS. 1 and 2, the
The
As a reference, polyphthalamide (PPA) is a type of reinforced plastic, and is a crystalline synthetic resin generally called aromatic nylon. Since it has an aromatic structure, it is excellent in high strength, high rigidity, high heat resistance, low water absorption and dimensional stability Electric and electronic fields, automobile fields, industrial devices, and aircraft fields. Polycyclohexylene dimethylene terephthalate (PCT) is a super engineering plastic, and has recently been attracting attention as an LED reflector for TVs and lighting because it has excellent heat resistance, heat stability, reflectance and light resistance. Epoxy Molding Compound (EMC) is a composite material using 10 kinds of raw materials such as silica, epoxy resin, phenol resin, carbon black and flame retardant.
Fig. 3 is a plan view of the lead frame in the LED reflector of Fig. 1, and Fig. 4 is a perspective view of the lead frame in which the protrusion is formed in the LED reflector of Fig.
Referring to FIGS. 1 to 4, the
The combination of the
The
The
FIG. 5 is a perspective view showing a state in which a zener diode is bonded to the lead frame of FIG. 3. FIG.
Referring to FIG. 5, the
At this time, the
6 is a cross-sectional view of an LED package according to an embodiment of the present invention to which the LED reflector of FIG. 1 is applied.
6, an
FIG. 7 is a plan view of an LED reflector according to another embodiment of the present invention, FIG. 8 is a cross-sectional view of the LED reflector taken along line VIII-VIII of FIG. 7, and FIG. 9 is a perspective view of a lead frame in the LED reflector of FIG. Hereinafter, the LED reflector according to another embodiment of the present invention will be described with reference to FIGS. 7 to 9, focusing on differences from the above embodiment.
7 to 9, the LED reflector 100-1 according to the present embodiment includes a
The LED reflector 100-1 according to the present embodiment is similar to the LED reflector 100-1 according to the above embodiment except that the
In the LED reflector 100-1 according to the present embodiment, the lead frame 120-1 is composed of a pair of
As described above, according to the present invention, the
10 is a perspective view of an LED lens according to an embodiment of the present invention.
10, an
The
It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Accordingly, such modifications or variations are intended to fall within the scope of the appended claims.
100, 100-1: LED Reflector
110: Reflector body
120, 120-1: Lead frame
130: Zener diode
200: substrate
300: LED element
500: LED lens
510: lens body
Claims (9)
A lead frame made of a metal and coupled to a bottom surface of the reflector body and providing a bonding surface with the substrate; And
And a Zener diode bonded to the lead frame,
The reflector body is provided integrally with the lead frame by Insert Injection Molding,
Wherein the Zener diode is bonded to the lead frame before the insert injection molding and is embedded in the reflector body of the synthetic resin material when the insert injection molding is performed,
Wherein the lead frame includes protrusions for enhancing a bonding force with the reflector body during the injection molding of the insert,
The protrusion is formed by cutting four corner portions of the lead frame and then cutting the four corners of the lead frame upward. In the process of forming the protrusion, the opening formed in the thickness direction of the lead frame extends in the direction of the surface of the lead frame Are all closed.
The reflector body,
Wherein the LED reflector is made of a synthetic resin material selected from the group consisting of PPA (Poly Phthal Amide), EMC (Epoxy Molding Compound) and PCT (Poly Cyclohexylenedimethylene Terephthalate).
The lead frame includes:
Wherein an LED mounting portion on which the LED element is mounted is formed so that a separate PCB substrate for mounting the LED element and the LED reflector is not used.
Wherein the lead frame is composed of a pair of frame members separated from each other,
And the LED mounting portion is formed by projecting toward the center of the reflector body at each of the pair of frame members.
A substrate on which the LED element is mounted; And
The LED package according to claim 1, wherein the LED reflector is bonded to the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20150034572 | 2015-03-12 | ||
| KR1020150034572 | 2015-03-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR101653926B1 true KR101653926B1 (en) | 2016-09-02 |
Family
ID=56943213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150087372A KR101653926B1 (en) | 2015-03-12 | 2015-06-19 | LED reflector and LED package having the same |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101653926B1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101834087B1 (en) * | 2016-09-30 | 2018-04-13 | 조성은 | Package including housing integrated reflector and lens and manufacturing method thereof |
| KR20190020493A (en) | 2017-08-21 | 2019-03-04 | 주식회사 옵티맥 | Light emitting package |
| KR20220055126A (en) * | 2020-10-26 | 2022-05-03 | (주)위셀 | Combined structure of the lead frame and reflector of the LED package |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08186212A (en) * | 1995-01-05 | 1996-07-16 | Hitachi Ltd | Resin sealed electronic component and lead frame |
| JP2009200321A (en) * | 2008-02-22 | 2009-09-03 | Toshiba Corp | Light-emitting device and its manufacturing method |
| KR20100127757A (en) * | 2008-03-07 | 2010-12-06 | 오스람 옵토 세미컨덕터스 게엠베하 | Optoelectronic semiconductor component, device for recording image information and method for producing an optoelectronic semiconductor component |
| KR20130005824A (en) * | 2011-07-07 | 2013-01-16 | 김규한 | Led package and manufacturing method thereof |
-
2015
- 2015-06-19 KR KR1020150087372A patent/KR101653926B1/en active IP Right Grant
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08186212A (en) * | 1995-01-05 | 1996-07-16 | Hitachi Ltd | Resin sealed electronic component and lead frame |
| JP2009200321A (en) * | 2008-02-22 | 2009-09-03 | Toshiba Corp | Light-emitting device and its manufacturing method |
| KR20100127757A (en) * | 2008-03-07 | 2010-12-06 | 오스람 옵토 세미컨덕터스 게엠베하 | Optoelectronic semiconductor component, device for recording image information and method for producing an optoelectronic semiconductor component |
| KR20130005824A (en) * | 2011-07-07 | 2013-01-16 | 김규한 | Led package and manufacturing method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101834087B1 (en) * | 2016-09-30 | 2018-04-13 | 조성은 | Package including housing integrated reflector and lens and manufacturing method thereof |
| KR20190020493A (en) | 2017-08-21 | 2019-03-04 | 주식회사 옵티맥 | Light emitting package |
| KR20220055126A (en) * | 2020-10-26 | 2022-05-03 | (주)위셀 | Combined structure of the lead frame and reflector of the LED package |
| KR102421260B1 (en) | 2020-10-26 | 2022-07-15 | (주)위셀 | Combined structure of the lead frame and reflector of the LED package |
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