CN209402598U - Photosensory assembly, camera module and mobile terminal - Google Patents
Photosensory assembly, camera module and mobile terminal Download PDFInfo
- Publication number
- CN209402598U CN209402598U CN201920083132.3U CN201920083132U CN209402598U CN 209402598 U CN209402598 U CN 209402598U CN 201920083132 U CN201920083132 U CN 201920083132U CN 209402598 U CN209402598 U CN 209402598U
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- circuit board
- pad
- notch
- support plate
- closure member
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Camera Bodies And Camera Details Or Accessories (AREA)
- Studio Devices (AREA)
Abstract
The utility model relates to a kind of photosensory assembly, camera module and mobile terminals.The photosensory assembly, comprising: circuit board, including load-bearing surface, load-bearing surface include chip mounting portion and the frame portion positioned at chip mounting portion periphery, and frame portion is equipped with the first pad；Sensitive chip, is set to chip mounting portion, and sensitive chip is equipped with the second pad；Conductor wire is electrically connected the first, second pad；Bracket, including support plate, support plate are located at side of the sensitive chip far from load-bearing surface, form the first notch being located in circumferential direction；Closure member closes the first notch；Guard member at least coats the first pad and conductor wire close to one end of circuit board.In above-mentioned photosensory assembly; logical setting guard member, the material that can avoid the formation of closure member directly coat the first pad, conductor wire and the second pad, so as to avoid the formation of closure member material in solidification; because of the effect of material shrinkage, and there is electrically bad problem.
Description
The requires of the utility model applying date is on 08 28th, 2018, and application No. is 201810987852.2 Chinese patents
The priority of application.
Technical field
The utility model relates to field of camera technology, more particularly to a kind of photosensory assembly, camera module and mobile terminal.
Background technique
In recent years, the development trend of miniaturization is increasingly presented in electronic equipment, this is to the standard configuration as electronic equipment
One of the size of camera module propose more strict requirements, while the requirement to the pixel and quality of camera module is also got over
Come higher.
Traditional camera module generally includes circuit board, sensitive chip, electronic component, conductor wire, bracket and camera lens, sense
Optical chip and electronic component are set on circuit board, and electronic component is located at the outside of sensitive chip, the both ends point of conductor wire
It is not electrically connected with circuit board and sensitive chip far from the surface of circuit board, branch is set up on circuit board, and bracket is both ends open
Sensitive chip, conductor wire and electronic component are contained in bracket by hollow structure, and camera lens is set to bracket far from circuit board
On one end.When assembling above-mentioned camera module, the side wall of bracket is connect by the glue for drawing in circuit board with circuit board, bracket
Side wall needs to keep safe spacing with electronic component, causes the size of camera module larger.
In order to reduce the size of camera module, the bracket of bracket or lack part side wall without side wall can be used, to save
Side wall slightly corresponding with electronic component, so that the safe spacing of bracket and electronic component can not be reserved in assembling, into
And obtain the lesser camera module of size.And the bracket of bracket or lack part side wall without side wall can be formed in the circumferential it is scarce
Mouthful, sticking material can be flowed and be had to subsequent can insert from indentation, there, after material solidification, can form the envelope of closing notch
Closing member.And during forming closure member, the first pad, the conductor wire connecting on circuit board and with conductor wire are close electric
One end of road plate may all be wrapped up even on the second pad connecting on sensitive chip and with conductor wire by material, and
The material solidification stage may have the wind pulled conductor wire, even result in conductive thread breakage due to the effect of material shrinkage
Danger causes electrically bad.
Utility model content
Based on this, it is necessary to for when using that can flow and have sticking material filling notch, due to Material shrinkage
The effect of rate will lead to electrically bad problem, provide a kind of photosensory assembly, camera module and mobile terminal.
A kind of photosensory assembly, comprising:
Circuit board, including load-bearing surface, the load-bearing surface include chip mounting portion and be located at the chip mounting portion
The frame portion of periphery, the frame portion are equipped with the first pad；
Sensitive chip, is set to the chip mounting portion, and the sensitive chip is equipped with second far from the surface of the circuit board
Pad；
Conductor wire is electrically connected first pad and second pad；
Bracket, including support plate, the support plate is located at side of the sensitive chip far from the load-bearing surface, described
The edge of support plate and the frame portion interval are arranged, and form the first notch being located in circumferential direction；
Closure member is set to first notch, to close first notch；And
Guard member at least coats first pad and the conductor wire close to one end of the circuit board, to work as energy
It flows and has sticking material and flow between the support plate and the circuit board through first notch to be formed by curing
When stating closure member, the guard member, which is avoided that, to form the material of the closure member and first pad and the conductor wire are close
One end of the circuit board directly contacts.
In above-mentioned photosensory assembly, lead to setting guard member, the material that can avoid the formation of closure member directly coats the first weldering
Disk, conductor wire and the second pad, so as to avoid the formation of closure member material solidification when, because of the work of material shrinkage
With, and there is electrically bad problem.And since the step of forming guard member, can pre-fix prior to bracket in circuit board
The step of step and formation closure member, thus even if being also convenient for dismantling because other reasons lead to the problem for occurring electrically bad, with
So that repairing electrically bad problem can be realized.
The guard member coats first pad, the conductor wire and second weldering in one of the embodiments,
Disk.In this way, the first pad, conductor wire and the second pad can be protected preferably.
The shrinking percentage for forming the material of the guard member in one of the embodiments, is less than the material for forming the closure member
The shrinking percentage of material, the mobility for forming the material of the guard member is greater than the mobility for forming the material of the closure member, described
The hardness of guard member is less than the hardness of the closure member, and the elasticity of the guard member is greater than the elasticity of the closure member.In this way, energy
The effect because of material shrinkage is further decreased, and electrically bad problem occurs.
Surface of the sensitive chip far from the circuit board includes photographic department and circular institute in one of the embodiments,
Photographic department one week non-photo-sensing portion is stated, second pad is set to the non-photo-sensing portion, and the guard member is around the photographic department
One week, to stop the material for forming the closure member to flow to the photographic department of the sensitive chip.In this way, guard member not only has
There is the undesirable function of anti-electrical property, and has the function of adhesive-spill-preventing.
The spacing between the guard member and the photographic department is more than or equal to 300 microns in one of the embodiments,.Such as
This is flowed, but due to having between guard member and photographic department even if the material for forming closure member crosses guard member towards photographic department
Biggish spacing, the material for forming closure member are also difficult to reach photographic department, so as to preferably avoid the formation of the material of closure member
It flow to the photographic department of sensitive chip.
The non-photo-sensing portion includes mutually independent bonding pad and disconnected area in one of the embodiments, described
Second pad is set to the bonding pad, and the guard member is unsymmetric structure, the guard member on the bonding pad
Width is greater than the width for the guard member being located in the disconnected area.Due to being provided with the second pad on bonding pad, second
Pad is connect with conductor wire, and the second pad is not provided in disconnected area, the width of the guard member on the bonding pad of sensitive chip
The width for spending larger, preferably to coat the second pad and conductor wire, and be located in disconnected area guard member is smaller, Ke Yijie
Save the dosage of guard member.
The photosensory assembly further includes electronic component in one of the embodiments, and the electronic component is set to institute
Frame portion is stated, the electronic component is arranged adjacent to the electronic component, and first notch is in the circuit board to described
Opening width on the arragement direction of sensitive chip is greater than end face of the electronic component far from the circuit board and holds with described
The spacing between surface is carried, to avoid the electronic component.First notch can avoid electronic component, thus above-mentioned assembling
When photosensory assembly, the safe spacing of bracket and electronic component can not be reserved, and then lesser photosensitive group of size can be obtained
Part.
The bracket further includes the first protrusion in the support plate in one of the embodiments, and described first
Protrusion is connect far from one end of the support plate with the blank area of the frame portion, to pre-fixing the support plate in described
On circuit board.In this way, being highly convenient for pre-fixing support plate on circuit board.
The bracket further includes the second protrusion in one of the embodiments, and second protrusion is set to the support plate
On the surface of the circuit board, and with the frame portion interval, the lateral surface of second protrusion and the support plate
Lateral surface flushes, to form the second notch being located in circumferential direction, second notch is far from the electronic component, the envelope
Closing member is set to second notch, to close second notch.When with multiple first notches, near the first notch for having
Have electronic component, there is no electronic component near the first notch having, by be arranged the second protrusion can make height compared with
The first big notch becomes lesser second notch of height and reduces the filling of closure member so as to reduce the dosage of closure member
Highly.
A kind of camera module, comprising:
Above-mentioned photosensory assembly；And
Lens assembly, the surface set on the support plate far from the circuit board.
Above-mentioned camera module uses the lesser photosensory assembly of size, so as to obtain the lesser camera module of size.
A kind of mobile terminal, including above-mentioned camera module.Above-mentioned mobile terminal uses the lesser camera module of size, from
And the lesser mobile terminal of size can be obtained.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section for the camera module that an embodiment of the present invention provides；
Fig. 2 is the decomposition diagram of circuit board and bracket that an embodiment of the present invention provides；
Fig. 3 is the floor map of the circuit board in Fig. 2；
Fig. 4 is the stereoscopic schematic diagram of the bracket in Fig. 2；
Fig. 5 is the floor map of the first surface of the bracket in Fig. 4；
Fig. 6 is the floor map of the second surface of the bracket in Fig. 4；
Fig. 7 is the comparison schematic diagram of photosensory assembly shown in FIG. 1 and traditional photosensory assembly；
Fig. 8 is that camera module shown in FIG. 1 removes the diagrammatic cross-section after closure member；
Fig. 9 is the floor map of the bracket for the frame portion missing that an embodiment of the present invention provides；
Figure 10 is the floor map of the bracket for the frame portion missing that another embodiment of the utility model provides；
The floor map for the bracket that the frame that another embodiment of Figure 11 the utility model provides all lacks；
Figure 12 is the diagrammatic cross-section for the camera module that another embodiment of the utility model provides；
Figure 13 is the diagrammatic cross-section for the camera module that another embodiment of the utility model provides；
Figure 14 is that the camera module that another embodiment of the utility model provides removes the stereoscopic schematic diagram after closure member；
Figure 15 is the floor map of camera module shown in Figure 14；
Figure 16 is the sectional view of the line A-A in Figure 15；
Figure 17 is the sectional view of the line B-B in Figure 15；
Figure 18 is the stereogram exploded view of circuit board and bracket shown in Figure 14；
Figure 19 is the stereoscopic schematic diagram of the bracket in Figure 18；
Figure 20 is the overhead zoom camera mould group that an embodiment of the present invention provides；
Figure 21 is the underneath type zoom camera mould group that an embodiment of the present invention provides；
Figure 22 is the diagrammatic cross-section for the overhead fixed-focus camera module that an embodiment of the present invention provides；
Figure 23 is the diagrammatic cross-section for the photosensory assembly that another embodiment of the utility model provides；
Figure 24 is the partial enlarged view in Figure 23 at C.
Specific embodiment
To keep the above objects, features, and advantages of the utility model more obvious and easy to understand, with reference to the accompanying drawing to this
The specific embodiment of utility model is described in detail.Many details are explained in the following description in order to abundant
Understand the utility model.But the utility model can be implemented with being much different from other way described herein, this field
Technical staff can do similar improvement without prejudice to the utility model connotation, therefore the utility model is not by following public affairs
The limitation for the specific implementation opened.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specifically embodiment, it is not intended that in limitation the utility model.Term " and or " used herein includes
Any and all combinations of one or more related listed items.
As shown in Figure 1, an embodiment of the present invention provide camera module 10, including photosensory assembly 10a and be set to sense
Lens assembly 10b on optical assembly 10a.Lens assembly 10b is on the photosensitive path of photosensory assembly 10a.Light passes through camera lens
Photosensory assembly 10a is reached after component 10b, to realize imaging.
In the present embodiment, camera module 10 is applied on mobile terminal.Specifically, in the present embodiment, mobile terminal
Camera module 10 including terminal body (not shown) and on terminal body.More specifically, in the present embodiment, it is mobile whole
End is the portable mobile termianls such as smart phone, tablet computer.
As shown in Figure 1, photosensory assembly 10a includes circuit board 100, sensitive chip 200, electronic component 300, conductor wire
400, bracket 500, closure member 600 and optical filter 700.
Circuit board 100 is for carrying the elements such as sensitive chip 200.As shown in Figures 2 and 3, circuit board 100 includes carrying table
Face 110, load-bearing surface 110 include chip mounting portion 112 and the frame portion 114 positioned at 112 periphery of chip mounting portion.Some
In embodiment, frame portion 114 is closed-loop construct.In the present embodiment, frame portion 114 is square.Frame portion 114 includes first device
Part installing zone 1142 and blank area 1144.Component installing zone 1142 is for being arranged the first pad 120 and installation capacitor, electricity
The electronic components 300 such as resistance.
Sensitive chip 200 is set to chip mounting portion 112.In some embodiments, sensitive chip 200 and chip mounting portion
Adhesive layer is provided between 112.Sensitive chip 200 includes photosurface 210, and photosurface 210 includes photographic department 212 and surround
The non-photo-sensing portion 214 of photographic department 212.Non-photo-sensing portion 214 includes mutually independent bonding pad 2142 and disconnected area 2144.Even
Area 2142 is met for being electrically connected with circuit board 100.In some embodiments, bonding pad 2142 is provided with the second pad 220, and second
Pad 220 is connect with the first pad 120 by conductor wire 400.In some embodiments, conductor wire 400 is gold thread.
Bracket 500 includes support plate 510 and the first protrusion 520.Support plate 510 include opposite first surface 512 and
Second surface 514 namely support plate 510 are slab construction.Second surface 514 is used for connection lens component 10b.Support plate 510
Offer the light hole 530 through first surface 512 and second surface 514.First protrusion 520 is set to first surface 512.First
Protrusion 520 number be it is multiple, multiple first protrusions 520 are intervally arranged, for being separately connected with multiple blank areas 1144.
When making above-mentioned photosensory assembly 10a, the circuit board 100 with multiple blank areas 1144 is first provided；Tool is provided again
There is a bracket 500 of multiple first protrusions 520, the number of the first protrusion 520 is less than or equal to the number of blank area 1144, and every 1 the
One protrusion 520 is corresponding with a blank area 1144；In 1144 dispensing of blank area, and the first protrusion 520 is placed in the sky after dispensing
White area 1144；After glue curing between blank area 1144 and the first protrusion 520 forms adhesive layer, that is, realize bracket 500 and electricity
Pre-fixing between road plate 100.
As shown in fig. 7, traditional bracket 500a is the hollow structure of both ends open, the side wall 502 of bracket 500a is by drawing
It is connect in the bonded adhesives of circuit board 100a with circuit board 100a, the side wall 502 of bracket 500a provides support force for lens assembly.It passes
The side wall 502 of the bracket 500a of system is complete closed-loop construct, needs to occupy the biggish space circuit board 100a, and in group
When filling bracket 500a, the safe spacing of reserved bracket 500a and electronic component 300a are needed, is unfavorable for reducing camera module
The size of X/Y plane.
And in above-mentioned camera module 10, as shown in Figures 7 and 8, the first protrusion 520 provides support for lens assembly 10b
Power, bracket 500 is connect by multiple the first discrete protrusions 520 with circuit board 100, thus the side of at least partly support plate 510
Edge forms the first notch being located in circumferential direction because lacking the side wall between the edge and circuit board 100 of support plate 510
10c.Namely partial sidewall is at least omitted relative to traditional bracket 500a in the bracket 500 in above-mentioned camera module 10, is conducive to
Reduce the size of the X/Y plane of camera module 10.And multipoint mode contact is more flat than the assembling that face contact is easier to manage bracket 500
Whole degree.
In some embodiments, the first notch 10c of formation can avoid electronic component 300, thus assembling above-mentioned branch
When frame 500, the safe spacing of bracket 500 Yu electronic component 300 can not be reserved, reduces the ruler of the X/Y plane of bracket 500
It is very little, and then the lesser camera module 10 of size can be obtained.
As shown in figure 8, when making above-mentioned photosensory assembly 10a, after bracket 500 is pre-fixed with circuit board 100, circuit board
There are the first notch 10c between 100 and support plate 510, the first notch 10c can be filled using filler, in the first notch
10c goes out to form closure member 600 (as shown in Figure 1), thus the sense of closure optical chip 200 in the circumferential direction of sensitive chip 200, namely adopt
The frame (side wall) of the missing of bracket 500 is substituted with closure member 600.Closure member 600 is set, is avoided that sensitive chip 200 and outer
The contact of portion's air, can preferably protect sensitive chip 200, and closure member 600 can increase between support plate 510 and circuit board 100
Bonding strength so that the structure of entire photosensory assembly 10a is more stable.In some other embodiment, closure member 600 can also be with
It omits, it may for example comprise when the camera module 10 of above-mentioned photosensory assembly 10a is applied to mobile terminal, mobile terminal can be passed through
Shell completely cuts off sensitive chip 200 and ambient atmosphere, can also be promoted by the position limiting structure in mobile terminal entire photosensitive
The stability of component 10a.
In some embodiments, filler is that can flow and have sticking material, and closure member 600 can be by that can flow and have
Sticking material flows between support plate 510 and circuit board 100 through the first notch 10c, then cured technique is formed.In this way,
Closure member 600 can close the connectivity robustness between the first notch 10c and support plate 510 and circuit board 100.Tool
Body, in some embodiments, filler is bonded adhesives.In some other embodiment, semi-solid preparation and tool can also be first made
Sticking adhesive tape, then adhesive tape is pressed into the first notch 10c by the way of interference fit, last resolidification adhesive tape also can
Obtain closure member 600.
In some other embodiment, when omitting the first protrusion 520, it can will be propped up using auxiliary tools such as manipulators
Fagging 510 is suspended in 100 top of circuit board, then the dispensing between support plate 510 and circuit board 100, after glue curing, shape
At fixed point, fixed point is similar with the effect of the first protrusion 520, mainly pre- between realization support plate 510 and circuit board 100
It is fixed.The first notch 10c between fixed point is finally filled up using filler again.
In some embodiments, attached drawing 8 is please referred to, circuit board 100 and sensitive chip 200 are along Z-direction (namely height side
To) arrangement, the spacing between end face of the electronic component 300 far from circuit board 100 and load-bearing surface 110 is H1, the first notch
The opening width of 10c in the Z-axis direction is H2, and H2 is greater than H1, thus when the first notch 10c nearby electron component 300 is arranged
When, the first notch 10c can avoid electronic component 300 well, and then in assembling, can not reserve bracket 500 and electronics
The safe spacing of component 300 reduces the size of the X/Y plane of photosensory assembly 10a, and then it is lesser photosensitive to obtain size
Component 10a.And H2 is greater than H1, is highly convenient for filler and inwardly flows between support plate 510 and circuit board 100.
In some embodiments, support plate 510 is slab construction, and thickness is equal everywhere namely first surface 512 and second
Spacing between surface 514 is equal everywhere.In some other embodiment, support plate 510 or interior thickness are small, edge
The big non-flat structure of thickness can guarantee that H2 is greater than H1.
Under normal conditions, the height H1 of electronic component 300 is greater than the height of sensitive chip 200, also greater than conductor wire 400
Height.In some embodiments, the number of electronic component 300 is usually multiple, and the specification of each electronic component 300 is not
One, the height of some electronic components 300 is larger, and the height of some electronic components 300 is smaller.In some embodiments, it controls
Making the opening width of the first notch 10c in the Z-axis direction is the height H1 that H2 is greater than the maximum electronic component 300 of height, i.e.,
Support plate 510 can be made to be suspended from the top of sensitive chip 200, conductor wire 400 and all electronic components 300.Some
In embodiment, H2 is 200-500 microns.
Bracket 500 can be the bracket (bracket of no side wall) for the bracket namely Rimless that frame all lacks, bracket
500 may be the bracket (bracket of lack part side wall) of frame portion missing.Fig. 4 be shown in bracket 500 be frame portion
Divide the bracket of missing.It will elaborate the bracket that frame all lacks with several specific embodiments below and be lacked with frame portion
The bracket of mistake.
In some embodiments, as shown in FIG. 9 and 10, the edge of the end face of at least one the first protrusion 520 and support
The coincident of the first surface 512 of plate 510, namely there are lateral surface flushed with the lateral surface of support plate 510 it is first convex
Rise 510 namely at least one first protrusion 520 be respectively positioned on the edge of support plate 510, which can be regarded as propping up
The part frame (partial sidewall) of frame 500, at this point, bracket 500 is the bracket of frame portion missing.
In some embodiments, as shown in figure 11, the edge of the end face of the first all protrusions 520 with support plate 510
The edge interval of first surface 512 namely being respectively positioned in the lateral surface of support plate 510 for the first all protrusions 520, namely
The first all protrusions 520 is respectively positioned on the middle part of support plate 510, at this point, bracket 500 is the bracket that frame all lacks.
As shown in figure 9, Fig. 9 illustrates the bracket of the frame portion missing of an embodiment of the present invention offer.The bracket
500 include consistent first protrusion 520 of four size and shapes, and four the first protrusions 520 are located at support plate 510
Four corners, and it is respectively positioned on the edge of support plate 510, this four the first protrusions 520 can be regarded as the part side of bracket 500
Frame.After bracket 500 and circuit board 100 pre-fix, there are four the first notch 10c between circuit board 100 and support plate 510,
During forming closure member 600, glue can be drawn at the four sides of bracket 500, four the first notch 10c are all closed.
After drawing glue, filler can inwardly be flowed and (be flowed towards sensitive chip 200), to coat the weldering of electronic component 300, first
One end that disk 120 and conductor wire 400 are connect with the first pad 120, filler can also flow outward.As shown in figure 12, flexible electrical
The corresponding first notch 10c of road plate 20 can be used as flexible circuit board after filler is flowed to outward on flexible circuit board 20
20 reinforcement glue 22 is located at the first notch to increase intensity namely a part of the same closure member 600 of flexible circuit board 20
In 10c, another part is located at the junction of circuit board 100 and flexible circuit board 20.The other end of flexible circuit board 20 is arranged
There is connector 30.
It should be noted that can be by controlling the dosage of filler come the case where determining filler packing element.Shown in Fig. 2
For visual angle, sensitive chip 200 is square, and in two rows, two rows of electronic components 300 are distributed for multiple arrangements of electronic component 300
In the opposite left and right sides of sensitive chip 200, the more arrangements of conductor wire 400 are in three rows, and three row's conductor wires 400 are distributed in photosensitive
Upside, downside and the right side of chip 200,300 parallel interval of row's electronic component of row's conductor wire 400 and right side on right side
Arrangement.When drawing glue (filler), if glue amount is especially few, radially, filler may not wrap up electronic component 300, first
One end that pad 120 and conductor wire 400 are connect with the first pad 120；If glue amount is fewer, radially, filler can only be wrapped
The a part for covering the electronic component 300 in left side, cannot coat the electronic component 300 in left side completely, and filler can only coat
One end that the first pad 120 and conductor wire 400 of downside are connect with the first pad 120, cannot completely coated with conductive line 400 with
And second pad 220, filler can only coat part or all of the electronic component 300 on right side, and right side cannot be coated
Conductor wire 400.
The dosage of filler is bigger, the first notch 10c of easier closing, and the connection jail between support plate 510 and circuit board 100
Solidity is higher, but the dosage of filler is bigger, can increase accordingly filler overflow to sensitive chip 200 photographic department 212 probability, and
The photosensitive property for influencing sensitive chip 200, causes image quality to reduce.In some embodiments, amid all these factors, pass through control
The dosage of filler processed, radially so that at least covered section electronic component 300 of closure member 600 so that closure member 600 to
One end that the first pad 120 and conductor wire 400 are connect with the first pad 120 is coated less.
As shown in Figure 10, Figure 10 illustrates the bracket for the frame portion missing that another embodiment of the utility model provides.It should
Bracket 500 includes four the first protrusions 520, this four the first protrusions 520 can be regarded as the part frame of bracket 500.
In this embodiment, the first of top the raised 520 first protrusions 520 in long strip namely top by support plate 510 side
The side that face extends to opposite another side namely bracket 500 has complete side wall, the first protrusion of the other three 520
Shape and size uniformity cause, and are square block.Namely bracket 500 has a continuous frame and three discrete frames
Portion.After bracket 500 and circuit board 100 pre-fix, there are three the first notch 10c between circuit board 100 and support plate 510,
During forming closure member 600, glue can be drawn in three faces of bracket 500, three the first notch 10c are all closed.Such as figure
Shown in 13, the first protrusion 520 in long strip is located at bracket 500 close to the side of flexible circuit board 20, for holding for bracket 500
By forced position.In this way, in predetermined process, can only with the in long strip first raised 520 corresponding blank areas 1144
Dispensing, without in other 1144 dispensings of blank area, so that pre-cure step is simpler.
In the embodiment shown in fig. 13, flexible circuit board 20 and the in long strip first raised 520 faces, without
Glue is drawn to fill notch in the side corresponding with flexible circuit board 20 of bracket 500, can be avoided the occurrence of because of glue covering board
Interface on 100 for being electrically connected with flexible circuit board 20, and influence the electrical connection of flexible circuit board 20.And it can first draw
Glue fills notch, then in 100 over-assemble flexible circuit board 20 of circuit board, can also be first in 100 over-assemble flexible circuit of circuit board
After plate 20, then draw glue filling notch.
As shown in figure 11, Figure 11 illustrates the bracket that the frame of an embodiment of the present invention offer all lacks.The branch
Frame 500 includes four the first protrusions 520, and four the first protrusions 520 are respectively positioned on the middle part of support plate 510, cannot constitute branch
The frame of frame 500.After bracket 500 and circuit board 100 pre-fix, there are four first between circuit board 100 and support plate 510
Notch 10c can draw glue at the four sides of bracket 500, by four the first notch 10c during forming closure member 600
It is all closed.The frame of bracket 500 is made of closure member 600.
It should be noted that, although the first protrusion 520 of Fig. 9-Figure 11 signal is square, but the shape of the first protrusion 520
Shape be not limited to it is rectangular, can be any regular shape (such as cylinder, truncated cone-shaped, prism) or non-regular shape, can support
Support plate 510.
In some embodiments, closure member 600 is connect with the first protrusion 520.Wherein, when bracket 500 lacks for frame portion
When the bracket of mistake, closure member 600 needs to connect with the first protrusion 520, could form enclosed construction closing sensitive chip 200.?
In some embodiments, when bracket 500 is the bracket that frame all lacks, closure member 600 can not connect with the first protrusion 520
It connects, there are the first notch 10c between energy closed circuit plate 100 and support plate 510.Certainly, in some embodiments, when
When bracket 500 is the bracket that frame all lacks, closure member 600 can also be connect with the first protrusion 520.
In some embodiments, as shown in Figure 1, closure member 600 coats electronic component 300, the first pad 120 and leads
One end that electric wire 400 is connect with the first pad 120.In this way, closure member 600 can be well protected the weldering of electronic component 300, first
One end that disk 120 and conductor wire 400 are connect with the first pad 120.
As shown in Figure 1, in some embodiments, the first protrusion 520 be located at electronic component 300 and sensitive chip 200 it
Between.In some embodiments, electronic component 300 can also be located between the first protrusion 520 and sensitive chip 200.
In some embodiments, as shown in FIG. 12 and 13, bracket 500 further includes the second protrusion 540, the second protrusion 540
On first surface 512, and it is corresponding with the frame portion of load-bearing surface 110 114.The height of second protrusion 540 is convex less than first
520 height is played, is provided with closure member 600 between the second protrusion 540 and frame portion 114.Second protrusion 540, and second are set
Protrusion 540 height less than the first protrusion 520 height, thus when forming closure member 600, it is possible to reduce closure member 600
Dosage, to reduce the packed height of closure member 600.The number of second protrusion 540 can be one or more, when the second protrusion
When 540 number is multiple, multiple second protrusions 540 are intervally arranged.
When the lateral surface of the second protrusion 540 is flushed with the lateral surface of support plate 510, the second protrusion 540 can be used as branch
The frame of frame 500, and when the lateral surface of the second protrusion 540 is located in the lateral surface of support plate 510, the second protrusion 540 is not made
For the frame of bracket 500.As shown in Figure 12 and Figure 13, the lateral surface of the second protrusion 540 and the lateral surface of support plate 510 are neat
It is flat, frame of second protrusion 540 as bracket 500.
Second protrusion 540 can be connect with the first protrusion 520, can also be arranged with 540 interval of the second protrusion.Such as Figure 14 institute
Show, the second protrusion 540 is connect with the first protrusion 520.
In Figure 14-embodiment illustrated in fig. 19, the frame of the first protrusion 520 and the second protrusion 540 as bracket 500,
And second raised 540 connect with the first protrusion 520.
And the lateral surface for working as the second protrusion 540 is flushed with the lateral surface of support plate 510, and the height of the second protrusion 540 is small
In the height of the first protrusion 520, thus after bracket 500 and 100 precuring of circuit board, the second protrusion 540 and 100 shape of circuit board
It is arranged at interval, and forms the second notch 10f being located in circumferential direction.As shown in Figure 17-Figure 19, the second notch 10f is far from electronics
Component 300.When with multiple first notch 10c, the first notch 10c having nearby has electronic component 300, first had
There is no electronic component 300 near notch 10c, biggish first notch of height can be made by the way that the second protrusion 540 is arranged
10c becomes the lesser second notch 10f of height, so as to reduce the dosage of closure member 600, reduces the filling of closure member 600
Highly.
In some embodiments, as shown in Figure 17-Figure 19, the second notch 10f is arranged adjacent to conductor wire 400, is led with evacuation
Electric wire 400.Since the height of conductor wire 400 is usually less than the height of electronic component 300, the lesser second notch 10f of height
Conductor wire 400 can be avoided, so that the safe spacing of bracket 500 Yu conductor wire 400, Jin Erke can not be reserved in assembling
To obtain the lesser photosensory assembly 10a of size.
Opening width H3 of the second notch 10f in a first direction on 12 is too small, and resistance is larger, is unfavorable for filler and flows inward into
Between circuit board 100 and support plate 510.In some embodiments, the second notch 10f opening width on 12 in a first direction
H3 is greater than 100 microns, flows into through the second notch 10f to flow and have sticking filler and closes the second notch 10f, tool
Body, H3 is 100-200 microns.
In some embodiments, as shown in Figure 18 and Figure 19, sensitive chip 200 is square, two rows of electronic components 300 with
The opposite two sides of sensitive chip 200 are corresponding, and every row's electronic component 300 includes the electronic component that several are intervally arranged
300, two rows of conductor wires 400 are corresponding with the other two sides of sensitive chip 200 respectively, and every row's conductor wire 400 includes several intervals
The conductor wire 400 of arrangement.First notch 10c is two, and two the first notch 10c are corresponding with two rows of electronic components 300 respectively,
Second notch 10f is two, and two the second notch 10f are corresponding with two rows of conductor wires 400 respectively.
In some embodiments, as shown in Figure 15-Figure 19, bracket 500 further includes block 550, and block 550 is set to the first table
Face 512, and the edge of neighbouring light hole 530, and it is corresponding with the frame portion of load-bearing surface 110 114.In this way, forming closure member
It when 600, can prevent filler from flowing into chip mounting portion 112, filler is avoided to pollute sensitive chip 200.
In some embodiments, block 550 is corresponding with the line of demarcation of frame portion 114 and chip mounting portion 112.
In some embodiments, the height of block 550 is identical as the height of the first protrusion 520.Wherein, when block 550
When height is identical as the height of the first protrusion 520, block 550 had both had the function of the first protrusion 520, i.e., realization bracket 500 and
Circuit board 100 pre-fixes, and has the function of preventing filler from polluting sensitive chip 200.Namely when the first protrusion 520 is located at electronics
When between component 300 and sensitive chip 200, the first protrusion 520 can be for realizing the pre- solid of bracket 500 and circuit board 100
It is fixed, and can prevent filler from polluting sensitive chip 200.
In some embodiments, block 550 is connect with the first protrusion 520, and block 550 and the second protrusion 540 are mutually indepedent,
Namely block 550 is not connected to the second protrusion 540.
In Figure 18 and embodiment illustrated in fig. 19, the number of the first protrusion 520 is three, and three first protrusions 520 are distributed
In three corners of support plate 510.The number of second protrusion 540 is two, and two the second protrusions 540 are oppositely arranged, wherein
One second 540 two neighboring first protrusion 520 of connection of protrusion, another second protrusion 540 connect first protrusion 520.
The number of block 550 is two, and two blocks 550 are oppositely arranged, and is located between two the second protrusions 540.Block 550
Height is identical as the height of the first protrusion 520, and block 550 is connect with the first protrusion 520, and L-shaped, block 550 and first
The L-shaped entirety that protrusion 520 is constituted can be regarded as L-shaped first protrusion 520.Electronic component 300 is located at block 550 and branch
Between the edge of fagging 510 namely electronic component 300 is arranged adjacent to the first notch 10c.Conductor wire 400 is located at the second protrusion
Between 540 and light hole 530 namely conductor wire 400 is arranged adjacent to the second notch 10f.
In some embodiments, as shown in Fig. 1 and Figure 18, the invagination of second surface 514 forms the optical filtering around light hole 530
Piece mounting groove 516, optical filter 700 are set in mounting groove 516, and bonding is provided between optical filter 700 and the slot bottom of mounting groove 516
Layer 810.At this point, above-mentioned photosensory assembly 10a is overhead photosensory assembly.
In some embodiments, the invagination of first surface 512 forms the optical filter mounting groove 516 around light hole 530, filters
Piece 700 is set in mounting groove 516.At this point, above-mentioned photosensory assembly 10a is underneath type photosensory assembly.
As shown in Fig. 4, Fig. 5 and Fig. 6, support plate 510 offers escape hole slot 560, and escape hole slot 560 includes running through first
The escape hole 562 of surface 512 and second surface 514, and be opened in first surface 512 escape air drain 564, escape hole 562 with
Mounting groove 516 is mutually indepedent, and the both ends for escaping air drain 564 are connected to escape hole 562 and light hole 530 respectively, and escape air drain 564
Between escape hole 562 and light hole 530.After forming closure member 600, and fix optical filter 700 on mounting groove 516,
Baking with simultaneously solidify closure member 600 and bond optical filter 700 glue, the gas of expanded by heating can be escaped air drain 564 and
Escape hole 562 is discharged
In some embodiments, optical filter 700 can also be not provided on bracket 500, at this point, optical filter 700 can be received
It is dissolved in the figure that multiple first protrusions 520 are enclosed, and is directly arranged on the photosurface 210 of sensitive chip 200.
In some embodiments, above-mentioned photosensory assembly 10a can not also include optical filter 700, at this point it is possible to by optical filter
700 are set in lens assembly 10b.Lens assembly 10b can be with tight shot component, or zoom lens assemblies.
As shown in Figure 1, lens assembly 10b is fixed on the second surface 514 of support plate 510 by adhesive layer 820.Such as figure
Shown in 1 and Figure 17, camera module 10 shown in Fig. 1 and Figure 17 is fixed-focus camera module, and lens assembly 10b is integral type lens group
Part, integrated glasses head assembly include lens barrel and the eyeglass in lens barrel.Camera module 10 shown in Fig. 1 and Figure 17 is fixed for overhead
Burnt camera module.
As shown in figure 20, camera module 10 shown in Figure 20 is zoom camera mould group, and lens assembly 10b includes voice coil motor
910, the lens barrel 920 in voice coil motor 910 and the eyeglass in lens barrel 920.Voice coil motor 910 passes through pin 930
It is connect with circuit board 100.Voice coil motor 910 drives lens barrel 920 to drive eyeglass mobile, to realize auto-focusing.Shown in Figure 20
Camera module 10 is overhead zoom camera mould group.Camera module 10 shown in Figure 21 is underneath type zoom camera mould group.
In some embodiments, as shown in figure 20, pin 930 is located at 510 periphery of support plate, and pin 930 be in strip
Raised 520 faces of the first of shape, wherein the first protrusion 520 in long strip extends to the other side by the one side of support plate 510
Face.Pin 930 and the in long strip first raised 520 faces, without in the side corresponding with pin 930 of bracket 500
Glue is drawn to fill notch, can be avoided the occurrence of because of the pad on glue covering board 100 for being electrically connected with pin 930, and
Influence the electrical connection of pin 930.And pin 930 will not interfere with picture glue, can first draw glue filling notch, then in support plate 510
Over-assemble lens assembly 10b, can also be first after 510 over-assemble lens assembly 10b of support plate, then draws glue filling notch.
In some embodiments, as shown in figure 22, camera module 10 further includes guard member 10d, guard member 10d coated with conductive
Line 400.In some embodiments, while guard member 10d coated with conductive line 400, the both ends of guard member 10d also respectively with circuit
The non-photo-sensing portion 214 of plate 100 and sensitive chip 200 connection, to coat the second pad 220 and the first pad 120.In some implementations
In example, guard member 10d is the adhesive glue after solidifying.Guard member 10d can be identical with the material of closure member 600, can not also phase
Together.When making camera module 10, be initially formed guard member 10d, then by bracket 500 it is predetermined on circuit board 100, then shape again
At closure member 600.
During forming closure member 600, the first pad for being connect on circuit board 100 and with conductor wire 400
120, conductor wire 400 is close to one end of circuit board 100, even on second connect on sensitive chip 200 and with conductor wire 400
Pad 220 may all be wrapped up by filler namely the first pad 120, conductor wire 400 and the second pad 220 may all be filled out
Material package.And during the filler of mobility is formed by curing closure member 600, it, may due to the effect of filler shrinking percentage
In the presence of conductor wire 400 is pulled, conductor wire 400 and the first pad 120 and the second pad 220 is caused to be detached from, it is also possible to will lead to
Conductor wire 400 is broken, and electrically bad problem occurs.After the formation of closure member 600, when there is electrically bad problem
When, it is not easy to very much dismantle, leads to repair electrically bad problem and be difficult to carry out.
In some embodiments, before forming closure member 600, guard member 10d is first set, guard member 10d at least coats the
One pad 120 and conductor wire 400 are close to one end of circuit board 100, to lack when that can flow and have sticking material through first
When mouth 10c or the second notch 10f is flowed between support plate 510 and circuit board 100 to be formed by curing closure member 600, guard member
10d is avoided that form the material of closure member 600 direct close to one end of circuit board 100 with the first pad 120 and conductor wire 400
Contact.At this point, by the dosage of control material, can to avoid material and conductor wire 400 close to one end of the second pad 220, with
And second pad 220 directly contact.In some embodiments, guard member 10d coats the first pad 120, conductor wire 400 and second
Pad 220.
By the way that guard member 10d is arranged, the material that can avoid the formation of closure member 600 directly coats the first pad 120, conduction
Line 400 and the second pad 220, so as to avoid the formation of closure member 600 material solidification when, because of material shrinkage
Effect, and there is electrically bad problem.And due to formed guard member 10d the step of can be pre-fixed prior to bracket 500 in
The step of the step of circuit board 100 and formation closure member 600, thus even if because other reasons lead to electrically undesirable ask occur
Topic, is also convenient for dismantling, so that repairing electrically bad problem can be realized.
In some embodiments, guard member 10d is identical as the material of closure member 600.At this point, due to the material of guard member 10d
The dosage of material is far smaller than the dosage of the material of closure member 600, and the effect of the material shrinkage of guard member 10d is relatively small, can
To avoid there is electrically bad problem.
In some embodiments, guard member 10d is not identical as the material of closure member 600, wherein forms guard member 10d's
The shrinking percentage of material is less than the shrinking percentage for forming the material of closure member 600, and the mobility for forming the material of guard member 10d is greater than shape
At the mobility of the material of closure member 600, the hardness of guard member 10d is less than the hardness of closure member 600, the elasticity of guard member 10d
Greater than the elasticity of closure member 600.
In some embodiments, the second pad 220 is set to the non-photo-sensing portion 214 of sensitive chip 200, and guard member 10d is surround
Photographic department 212 1 weeks, to stop the material for forming closure member 600 to flow to the photographic department 212 of sensitive chip 200.At this point, guard member
10d not only has the undesirable function of anti-electrical property, and has the function of adhesive-spill-preventing.
In some embodiments, the spacing between guard member 10d and the photographic department 212 of sensitive chip 200 is more than or equal to 300
Micron.In this way, being flowed towards photographic department 212, but even if the material for forming closure member 600 crosses guard member 10d due to guard member
There is biggish spacing between 10d and photographic department 212, the material for forming closure member 600 is also difficult to reach photographic department 212, thus
The material that closure member 600 can preferably be avoided the formation of flow to the photographic department 212 of sensitive chip 200.
In some embodiments, guard member 10d is unsymmetric structure, on the bonding pad of sensitive chip 200 2142
The width of guard member 10d is greater than the width for the guard member 10d being located in disconnected area 2144.Due to being provided on bonding pad 2142
Second pad 220, the second pad 220 are connect with conductor wire 400, and the second pad 220 is not provided in disconnected area 2144, are located at sense
The width of guard member 10d on the bonding pad 2142 of optical chip 200 is larger, can preferably coat the second pad 220 and conductor wire
400, and the width for the guard member 10d being located in disconnected area 2144 is smaller, can save the dosage of guard member 10d.
In some embodiments, as shown in Figure 23 and Figure 24, camera module 10 further includes adhesive-spill-preventing part 10e, adhesive-spill-preventing part
10e is set on the first surface 512 of support plate 510, and adhesive-spill-preventing protrusion 10e relative to the first protrusion 520 closer to photosensitive core
Piece 200, for stopping the filler for forming closure member 600 to flow to the photographic department 212 of sensitive chip 200.Adhesive-spill-preventing part 10e is set to
In support plate 510, the area for being used to be arranged electronic component 300 of circuit board 100 can be occupied to avoid adhesive-spill-preventing part 510.
In some embodiments, adhesive-spill-preventing part 10e is arranged adjacent to light hole 530, and adhesive-spill-preventing part 10e is adjacent to light hole
530 settings can be interfered to avoid the electronic component 300 on adhesive-spill-preventing part 10e and circuit board 100.
In some embodiments, adhesive-spill-preventing part 10e is the closed hoop structure around 530 Kong Yizhou of light passing.In this way, can be with
More fully adhesive-spill-preventing.In some embodiments, adhesive-spill-preventing part 10e includes multiple anti-overflow blob of viscoses, and multiple anti-overflow blob of viscoses are around logical
The setting of the interval of unthreaded hole 530.In this way, not only can preferable adhesive-spill-preventing, but also can be according to actual design needs, two neighboring anti-overflow
The space of evacuation electronic component 300 is formed between blob of viscose.In some embodiments, as shown in figure 4, support plate 510 offers
Escape hole 562 through the two opposite surfaces of support plate 510, support plate 510 is offered close to the surface of circuit board 100 escapes gas
Slot 564, the both ends for escaping air drain 564 are connected to escape hole 562 and light hole 530 respectively, one end of adhesive-spill-preventing part 10e and escape air drain
564 side is adjacent, and the other end extends to the other side for escaping air drain 564 around light hole 530, and with escape the another of air drain 564
Side is adjacent.In this way, not only can preferable adhesive-spill-preventing, but also can be escaped from favor of gas.
In some embodiments, as shown in Figure 23 and Figure 24, the non-photo-sensing portion of adhesive-spill-preventing part 10e1 and sensitive chip 200
214 faces namely adhesive-spill-preventing part 10e1 are located at the orthographic projection on photosurface 210 and are located on photosurface 210.In some embodiments
In, as shown in Figure 23 and Figure 24, a part of adhesive-spill-preventing part 10e2 and 214 face of non-photo-sensing portion, another part and circuit board 100
114 face of frame portion.In some embodiments, adhesive-spill-preventing part 10e2 can also completely not with 214 face of non-photo-sensing portion, this
When, adhesive-spill-preventing part 10e2 completely with 114 face of frame portion of circuit board 100.
In some embodiments, as shown in Figure 23 and Figure 24, adhesive-spill-preventing part 10e and the interval of non-photo-sensing portion 214 are arranged, to keep away
Allow conductor wire 400.In other embodiments, adhesive-spill-preventing part 10e can also directly be contacted with non-photo-sensing portion 214.
In some embodiments, the one end of adhesive-spill-preventing part 10e far from support plate 510 and sensitive chip 200 are far from circuit board
Interplanar where 100 surface is every setting.In this way, can be to avoid the conductor wire on adhesive-spill-preventing part 10e and sensitive chip 200
400 interference.In some embodiments, the spacing between adhesive-spill-preventing part 10e and disconnected area 2144 is less than or equal to 150 microns, prevents
Spacing between excessive glue part 10e and conductor wire 400 is less than or equal to 150 microns.Spacing is less than or equal to 150 microns, namely makes
Glue channel is smaller, to have preferable adhesive-spill-preventing effect.
In some embodiments, light hole 530 radially, at least partly adhesive-spill-preventing part 10e and bonding pad 2142 are just
To setting, at least partly adhesive-spill-preventing part 10e and disconnected 2144 face of area are arranged.In this way, can be to avoid adhesive-spill-preventing part 10e and electricity
Electronic component 300 on road plate 100 is interfered.
As shown in Figure 23 and Figure 24, in some embodiments, adhesive-spill-preventing part 10e includes the first adhesive-spill-preventing portion 10e1 and the
Two adhesive-spill-preventing portion 10e2, the first adhesive-spill-preventing portion 10e1 and the second adhesive-spill-preventing portion 10e2 respectively with bonding pad 2142 and disconnected area
2144 is corresponding, height of the height less than the second adhesive-spill-preventing portion 10e2 of the first adhesive-spill-preventing portion 10e1.Using height lesser first
Adhesive-spill-preventing portion 10e1 is corresponding with bonding pad 2142, can be to avoid the conductor wire on the first adhesive-spill-preventing portion 10e1 and bonding pad 2142
400 interference, and use height biggish second adhesive-spill-preventing portion 10e2 it is corresponding with disconnected area 2144, can make glue channel compared with
It is small, to have preferable adhesive-spill-preventing effect.
In some embodiments, the first adhesive-spill-preventing portion 10e1 and 2142 face of bonding pad, the second adhesive-spill-preventing portion 10e2 can be with
, can also be with 114 face of frame portion of circuit board 100 with disconnected 2144 face of area, it can also part and disconnected area 2144
Face, partially with 114 face of frame portion of circuit board 100.Namely light hole 530 radially, at least partly first is anti-overflow
Glue portion 10e1 and 2142 face of bonding pad are arranged, and at least partly the second adhesive-spill-preventing portion 10e2 and disconnected 2144 face of area are arranged.
In some embodiments, adhesive-spill-preventing part 10e can be to surround the cyclic structure that light hole 530 1 encloses, at this point, first
Adhesive-spill-preventing portion 10e1 is connect with the second adhesive-spill-preventing portion 10e2.
In some embodiments, as shown in Figure 16 and Figure 19, adhesive-spill-preventing part 10e may be block 550, at this point, anti-overflow
The orthographic projection that 114 face of frame portion namely adhesive-spill-preventing part 10e of glue part 10e and wiring board 100 are located on circuit board 100 is located at
On circuit board 100.
In some embodiments, as shown in Figure 16 and Figure 19, excessive glue part 10e is located at the periphery of sensitive chip 200, adhesive-spill-preventing
Part 10e is directly contacted with circuit board 100.In other embodiments, excessive glue part 10e is located at the periphery of sensitive chip 200, adhesive-spill-preventing
Part 10e can also be spaced with circuit board 100, and the interval between adhesive-spill-preventing part 10e and circuit board 100 can be convex by precuring first
The adhesive glue filling for playing 520 can also be closed the filler filling of part 600, can also be not filled.
During forming closure member 600, the dosage control for forming the material of closure member 600 is improper, will lead to be formed
The material of closure member 600 flow to the photographic department 212 of sensitive chip 200, influences the photosensitive property of sensitive chip 200, causes to be imaged
Quality reduces.By the way that adhesive-spill-preventing part 10e is arranged between circuit board 100 and support plate 510, when closure member 600 by can flow and
Have sticking material and solidifies shape after the first notch 10c or the second notch 10f is flowed between support plate 510 and circuit board 100
The photographic department 212 that Cheng Shi, adhesive-spill-preventing part 10e are used to that the material for forming closure member 600 to be stopped to flow to sensitive chip 200.Adhesive-spill-preventing
Part 10e can be baffle 550 shown in Figure 19, and baffle 550 connects circuit board 100 and support plate 510, and adhesive-spill-preventing part 10e can also
To be to be also possible to shown in Figure 23 and Figure 24 shown in Figure 22 around 212 1 weeks guard member 10d of photographic department, adhesive-spill-preventing part 10e
Adhesive-spill-preventing part 10e.
An embodiment of the present invention also provides a kind of production method of photosensory assembly, includes the following steps:
Step S1, provides package substrates, and package substrates include circuit board, sensitive chip and electronic component, circuit board packet
Load-bearing surface is included, load-bearing surface includes that chip mounting portion and the frame portion positioned at chip mounting portion periphery, sensitive chip are set to
Chip mounting portion, electronic component are set to frame portion.
Support plate is placed in the side of sensitive chip and electronic component far from load-bearing surface by step S2, institute's light hole with
Sensitive chip face, the edge and frame portion interval of support plate are arranged, and are formed positioned at circumferential upper and nearby electron component
First notch.
Step S3 closes the first notch, and forms the closure member between support plate and circuit board, closure member connection branch
Fagging and circuit board.
In some embodiments, in step s 2, it is fixed that first protrusion of the support plate close to the surface of circuit board will be set to
In the blank area of circuit board.
In some embodiments, in step s3, it can flow and have sticking material and flow into support from the first notch
After plate and circuit board, solidification obtains closure member.
In some embodiments, before carrying out step S2, further include the steps that guard member is arranged.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of photosensory assembly characterized by comprising
Circuit board, including load-bearing surface, the load-bearing surface include chip mounting portion and be located at chip mounting portion periphery
Frame portion, the frame portion be equipped with the first pad；
Sensitive chip, is set to the chip mounting portion, and the sensitive chip is equipped with the second pad far from the surface of the circuit board；
Conductor wire is electrically connected first pad and second pad；
Bracket, including support plate, the support plate are located at side of the sensitive chip far from the load-bearing surface, the support
The edge of plate and the frame portion interval are arranged, and form the first notch being located in circumferential direction；
Closure member is set to first notch, to close first notch；And
Guard member at least coats first pad and the conductor wire close to one end of the circuit board, thus when that can flow
And the sticking material of tool flows between the support plate and the circuit board through first notch to be formed by curing the envelope
When closing member, the guard member is avoided that form the material of the closure member and first pad and the conductor wire close to described
One end of circuit board directly contacts.
2. photosensory assembly according to claim 1, which is characterized in that the guard member coats first pad, described
Conductor wire and second pad.
3. photosensory assembly according to claim 1, which is characterized in that the shrinking percentage for forming the material of the guard member is less than
The shrinking percentage for forming the material of the closure member, the mobility for forming the material of the guard member, which is greater than, forms the closure member
The mobility of material, the hardness of the guard member are less than the hardness of the closure member, and the elasticity of the guard member is greater than the envelope
The elasticity of closing member.
4. photosensory assembly according to claim 1, which is characterized in that surface of the sensitive chip far from the circuit board
Including photographic department and around one week non-photo-sensing portion of the photographic department, second pad is set to the non-photo-sensing portion, the guarantor
Guard was around the photographic department one week, to stop the material for forming the closure member to flow to the described photosensitive of the sensitive chip
Portion.
5. photosensory assembly according to claim 4, which is characterized in that the spacing between the guard member and the photographic department
More than or equal to 300 microns；And/or
The non-photo-sensing portion includes mutually independent bonding pad and disconnected area, and second pad is set to the bonding pad,
The guard member is unsymmetric structure, and the width of the guard member on the bonding pad, which is greater than, is located at the disconnected area
On the guard member width.
6. photosensory assembly according to any one of claims 1-5, which is characterized in that the photosensory assembly further includes electronics
Component, the electronic component are set to the frame portion, and the electronic component is arranged adjacent to the electronic component, described
It is remote that opening width of first notch on the arragement direction of the circuit board to the sensitive chip is greater than the electronic component
The spacing between end face and the load-bearing surface from the circuit board, to avoid the electronic component.
7. photosensory assembly according to claim 6, which is characterized in that the bracket further includes being set in the support plate
First protrusion, first protrusion are connect far from one end of the support plate with the blank area of the frame portion, thus will be described
Support plate is pre-fixed on the circuit board.
8. photosensory assembly according to claim 7, which is characterized in that the bracket further includes second raised, described second
Protrusion is set to the support plate on the surface of the circuit board, and with the frame portion interval, second protrusion it is outer
Side is flushed with the lateral surface of the support plate, to form the second notch being located in circumferential direction, second notch is far from institute
Electronic component is stated, the closure member is set to second notch, to close second notch.
9. a kind of camera module characterized by comprising
Such as photosensory assembly of any of claims 1-8；And
Lens assembly, the surface set on the support plate far from the circuit board.
10. a kind of mobile terminal, which is characterized in that including camera module as claimed in claim 9.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810987852 | 2018-08-28 | ||
| CN2018109878522 | 2018-08-28 |
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| CN209402598U true CN209402598U (en) | 2019-09-17 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920083131.9U Active CN209402597U (en) | 2018-08-28 | 2019-01-18 | Bracket, camera module and mobile terminal |
| CN201910047161.9A Pending CN110868516A (en) | 2018-08-28 | 2019-01-18 | Photosensitive assembly, manufacturing method thereof, camera module and mobile terminal |
| CN201920083132.3U Active CN209402598U (en) | 2018-08-28 | 2019-01-18 | Photosensory assembly, camera module and mobile terminal |
| CN201910048768.9A Pending CN110868517A (en) | 2018-08-28 | 2019-01-18 | Photosensitive assembly, camera module and mobile terminal |
| CN201910047051.2A Pending CN110868515A (en) | 2018-08-28 | 2019-01-18 | Support, camera module and mobile terminal |
| CN201920083518.4U Active CN209402599U (en) | 2018-08-28 | 2019-01-18 | Photosensory assembly, camera module and mobile terminal |
| CN201920089182.2U Active CN209402601U (en) | 2018-08-28 | 2019-01-18 | Photosensory assembly, camera module and mobile terminal |
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| CN201920083131.9U Active CN209402597U (en) | 2018-08-28 | 2019-01-18 | Bracket, camera module and mobile terminal |
| CN201910047161.9A Pending CN110868516A (en) | 2018-08-28 | 2019-01-18 | Photosensitive assembly, manufacturing method thereof, camera module and mobile terminal |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910048768.9A Pending CN110868517A (en) | 2018-08-28 | 2019-01-18 | Photosensitive assembly, camera module and mobile terminal |
| CN201910047051.2A Pending CN110868515A (en) | 2018-08-28 | 2019-01-18 | Support, camera module and mobile terminal |
| CN201920083518.4U Active CN209402599U (en) | 2018-08-28 | 2019-01-18 | Photosensory assembly, camera module and mobile terminal |
| CN201920089182.2U Active CN209402601U (en) | 2018-08-28 | 2019-01-18 | Photosensory assembly, camera module and mobile terminal |
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| CN209402597U (en) * | 2018-08-28 | 2019-09-17 | 南昌欧菲光电技术有限公司 | Bracket, camera module and mobile terminal |
| CN110572561B (en) * | 2019-10-30 | 2020-10-23 | 无锡豪帮高科股份有限公司 | Production process of VCM mobile phone camera module |
| CN113037949B (en) * | 2019-12-09 | 2022-07-26 | 宁波舜宇光电信息有限公司 | Filter assembly, camera module and multi-camera module |
| CN113452875A (en) | 2020-03-26 | 2021-09-28 | 晋城三赢精密电子有限公司 | Lens base, camera module and electronic device |
| CN112068278B (en) * | 2020-09-17 | 2022-10-18 | 豪威光电子科技（上海）有限公司 | Lens module |
| CN112631116B (en) * | 2020-12-10 | 2022-03-15 | 广东湾区智能终端工业设计研究院有限公司 | Crown mounting structure and electronic equipment |
| CN114815447A (en) * | 2021-01-19 | 2022-07-29 | 晋城三赢精密电子有限公司 | Lens module and electronic device |
| KR102505442B1 (en) * | 2021-02-26 | 2023-03-03 | 삼성전기주식회사 | Camera Module |
| CN214278493U (en) * | 2021-03-17 | 2021-09-24 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN113156608B (en) * | 2021-04-16 | 2022-11-01 | 南昌欧菲光电技术有限公司 | Prism support, prism subassembly, module and electronic equipment make a video recording |
| CN115720288A (en) * | 2021-08-24 | 2023-02-28 | 晋城三赢精密电子有限公司 | Lens base, camera module and electronic device |
| CN115134502A (en) * | 2022-07-28 | 2022-09-30 | Oppo广东移动通信有限公司 | Support, light filtering assembly, camera and electronic device |
Family Cites Families (5)
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| US7554599B2 (en) * | 2006-03-02 | 2009-06-30 | Kingpak Technology, Inc. | Image sensor module with air escape hole and a method for manufacturing the same |
| CN109510932B (en) * | 2016-02-18 | 2021-05-04 | 宁波舜宇光电信息有限公司 | Camera module based on molding process, molded circuit board assembly of camera module and manufacturing method of camera module |
| CN106993123B (en) * | 2017-04-11 | 2024-03-05 | 昆山丘钛微电子科技有限公司 | Miniaturized camera device and manufacturing method thereof |
| CN206865596U (en) * | 2017-06-20 | 2018-01-09 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN209402597U (en) * | 2018-08-28 | 2019-09-17 | 南昌欧菲光电技术有限公司 | Bracket, camera module and mobile terminal |
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| CN110868515A (en) | 2020-03-06 |
| CN209402599U (en) | 2019-09-17 |
| CN209402597U (en) | 2019-09-17 |
| CN110868516A (en) | 2020-03-06 |
| CN110868517A (en) | 2020-03-06 |
| CN209402601U (en) | 2019-09-17 |
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