CN110868517A

CN110868517A - Photosensitive assembly, camera module and mobile terminal

Info

Publication number: CN110868517A
Application number: CN201910048768.9A
Authority: CN
Inventors: 朱淑敏; 刘进宝
Original assignee: Nanchang OFilm Optoelectronics Technology Co Ltd
Current assignee: Nanchang OFilm Tech Co Ltd; Nanchang OFilm Optoelectronics Technology Co Ltd
Priority date: 2018-08-28
Filing date: 2019-01-18
Publication date: 2020-03-06
Also published as: CN110868515A; CN209402601U; CN209402598U; CN110868516A; CN110868516B; CN209402599U; CN209402597U

Abstract

The invention relates to a photosensitive assembly, a camera module and a mobile terminal. This photosensitive assembly includes: the circuit board comprises a bearing surface with a chip mounting part and a frame part; the photosensitive chip is arranged on the chip mounting part, and the photosensitive surface comprises a photosensitive part; the support comprises a support plate, the support plate is positioned on one side of the photosensitive chip, and the edge of the support plate and the frame part are arranged at intervals to form a first notch positioned in the circumferential direction; a closure member closing the first notch; the photosensitive assembly further comprises an anti-glue-overflow piece, wherein when the sealing piece is formed by solidification after flowing a material which can flow and has viscosity between the supporting plate and the circuit board through the first notch, the anti-glue-overflow piece is used for blocking the material forming the sealing piece from flowing to the photosensitive part of the photosensitive chip. In above-mentioned photosensitive assembly, through set up the anti-overflow glue spare between circuit board and backup pad, can effectively avoid photosensitive chip's sensitization portion to be used for forming the material pollution of closing member, avoid appearing the condition that the formation of image quality reduces.

Description

Photosensitive assembly, camera module and mobile terminal

The invention requires the priority of Chinese patent application with application number of 201810987852.2 and application date of 28/08 in 2018.

Technical Field

The invention relates to the technical field of camera shooting, in particular to a photosensitive assembly, a camera shooting module and a mobile terminal.

Background

In recent years, electronic devices are increasingly becoming more compact, which puts more stringent requirements on the size of the camera module, which is one of the standard configurations of electronic devices, and demands on the pixel and quality of the camera module are also becoming higher.

The traditional camera module generally comprises a circuit board, a photosensitive chip, an electronic component, a support and a lens, wherein the photosensitive chip and the electronic component are arranged on the circuit board, the electronic component is positioned outside the photosensitive chip, the support is arranged on the circuit board, the support is of a hollow structure with two open ends so as to accommodate the photosensitive chip and the electronic component in the support, and the lens is arranged at one end of the support, which is far away from the circuit board. When the above-mentioned module of making a video recording of equipment, the lateral wall of support is connected with the circuit board through drawing the glue in the circuit board, and the lateral wall of support needs to keep safe interval with electronic components, leads to the size of the module of making a video recording great.

In order to reduce the size of the camera module, a bracket without a side wall or a bracket without a part of side wall can be adopted to omit the side wall corresponding to the electronic component, so that the safe distance between the bracket and the electronic component can be not reserved when the camera module is assembled, and the camera module with smaller size is obtained. The bracket without the side wall or the bracket without part of the side wall can form a gap in the circumferential direction, and then the gap can be filled with a material which can flow and is sticky, and after the material is solidified, a sealing piece for sealing the gap can be formed. In the process of forming the sealing member, the material forming the sealing member may flow to the photosensitive part of the photosensitive chip, which affects the photosensitive performance of the photosensitive chip, resulting in reduced image quality.

Disclosure of Invention

Therefore, it is necessary to provide a photosensitive assembly, a camera module and a mobile terminal, which are used to solve the problem that the material forming the sealing member may flow to the photosensitive portion of the photosensitive chip, which affects the photosensitive performance of the photosensitive chip and reduces the imaging quality.

A photosensitive assembly comprising:

the circuit board comprises a bearing surface, wherein the bearing surface comprises a chip mounting part and a frame part positioned on the periphery of the chip mounting part;

the photosensitive chip is arranged on the chip mounting part, the surface of the photosensitive chip, which is far away from the circuit board, is a photosensitive surface, and the photosensitive surface comprises a photosensitive part;

the support comprises a support plate, the support plate is positioned on one side, away from the bearing surface, of the photosensitive chip, and the edge of the support plate and the frame part are arranged at intervals to form a first notch positioned in the circumferential direction;

the closing piece is arranged on the first notch so as to close the first notch;

the photosensitive assembly further comprises an anti-glue-overflow piece arranged between the circuit board and the supporting plate, and when the sealing piece is formed by the fact that a material which can flow and is sticky flows into the supporting plate through the first notch and is solidified between the supporting plate and the circuit board, the anti-glue-overflow piece is used for blocking the material forming the sealing piece from flowing to the photosensitive part of the photosensitive chip.

In above-mentioned photosensitive assembly, through set up the anti-overflow glue spare between circuit board and backup pad, when the closure spare by can flow and have sticky material flow in between backup pad and the circuit board postcure formation through first breach, the anti-overflow glue spare can block the material that forms the closure spare and flow to the sensitization portion of photosensitive chip to the sensitization portion that can effectively avoid photosensitive chip is used for forming the material pollution of closure spare, avoids appearing the condition that the formation of image quality reduces.

In one embodiment, the supporting plate is provided with a light through hole opposite to the light sensing part, the anti-overflow glue member is arranged on the surface of the supporting plate close to the circuit board, and the anti-overflow glue member is a closed ring-shaped structure surrounding the light through hole for one circle. The anti-overflow is glued on the backup pad, can avoid the anti-overflow to glue the area that the part occupies being used for of circuit board and sets up electronic components, and closed annular structure, the anti-overflow that can be more comprehensive glues.

In one embodiment, the supporting plate is provided with a light through hole opposite to the light sensing part, the glue overflow preventing member is arranged on the surface of the supporting plate close to the circuit board, the glue overflow preventing member comprises a plurality of glue overflow preventing blocks, and the glue overflow preventing blocks are arranged around the light through hole at intervals. The anti-overflow is glued on the piece locates the backup pad, can avoid the anti-overflow to glue the area that the piece occupies being used for of circuit board and set up electronic components, and a plurality of anti-overflow is glued the piece and is encircleed the unthreaded hole interval that leads to and set up and both can be better and prevent the overflow and glue, can form the space of dodging electronic components between two adjacent anti-overflow glue pieces according to actual design needs again.

In one embodiment, the supporting plate is provided with a light through hole opposite to the light sensing part, the anti-overflow glue member is arranged on the surface of the supporting plate close to the circuit board, the supporting plate is provided with air escape holes penetrating through two opposite surfaces of the supporting plate, the surface of the supporting plate close to the circuit board is provided with an air escape groove, two ends of the air escape groove are respectively communicated with the air escape holes and the light through hole, one end of the anti-overflow glue member is adjacent to one side of the air escape groove, and the other end of the anti-overflow glue member extends to the other side of the air escape groove around the light through hole and is adjacent to the other side of the air escape groove. The anti-overflow is glued on the backup pad, can avoid the anti-overflow to glue the area that the part occupies being used for of circuit board and sets up electronic components, and above-mentioned structure both can be better prevents the overflow and glues, can do benefit to gaseous escape again.

In one embodiment, the photosensitive surface further comprises a non-photosensitive part surrounding the photosensitive part, the non-photosensitive part comprises a connection region and a non-connection region which are independent of each other, and the connection region is electrically connected with the circuit board through a conductive wire; the anti-overflow is glued the piece and is located the backup pad is close to the surface of circuit board, the anti-overflow is glued the piece and is included first anti-overflow and glues portion and second anti-overflow and glue the portion, the height that first anti-overflow was glued the portion is less than the height that the portion was glued to the second anti-overflow, first anti-overflow glue the portion with the joining region corresponds and with the conductor wire interval sets up, the second anti-overflow glue the portion with non-joining region corresponds and the interval sets up. Adopt highly less first anti-overflow to glue portion and joining region and correspond, can avoid first anti-overflow to glue portion and joining region on the conductor wire interfere, and adopt highly great second anti-overflow to glue portion and non-joining region and correspond, can be so that cross gluey passageway less to have better anti-overflow and glue the effect.

In one embodiment, the glue overflow preventing member is arranged on the surface of the supporting plate close to the circuit board, the glue overflow preventing member is arranged on the periphery of the photosensitive chip, and a bonding layer is arranged between one end of the glue overflow preventing member, which is far away from the supporting plate, and the circuit board. So, the anti-overflow is glued the piece and has both had the anti-overflow and glue the function, has again and makes the backup pad in advance to be fixed in the function on the circuit board.

In one embodiment, the photosensitive assembly further includes an electronic component, the electronic component is disposed on the frame portion, the electronic component is disposed adjacent to the first notch, and an opening width of the first notch in the arrangement direction from the circuit board to the photosensitive chip is greater than a distance between an end surface of the electronic component far away from the circuit board and the bearing surface, so as to avoid the electronic component. Electronic components can be dodged to first breach to when the above-mentioned sensitization subassembly of equipment, can not reserve the safe interval of support and electronic components, and then can obtain the less sensitization subassembly of size.

In one embodiment, the bracket further comprises a first protrusion arranged on the support plate, and one end of the first protrusion, which is far away from the support plate, is connected with the blank area of the frame part, so that the support plate is pre-fixed on the circuit board. Thus, it is very convenient to pre-fix the support plate on the circuit board.

In one embodiment, the bracket further includes a second protrusion, the second protrusion is disposed on a surface of the supporting plate close to the circuit board and spaced from the frame portion, an outer side surface of the second protrusion is flush with an outer side surface of the supporting plate, so as to form a second notch located in the circumferential direction, the second notch is far away from the electronic component, and the sealing member is disposed in the second notch, so as to seal the second notch. When having a plurality of first breachs, there is electronic components near some first breach, and there is not electronic components near some first breach, can make the great first breach of height become highly less second breach through setting up the second arch to can reduce the quantity of closure, reduce the packing height of closure.

In one embodiment, the photosensitive assembly further includes a conductive wire, the frame portion is provided with a first bonding pad, the photosensitive surface is provided with a second bonding pad, the conductive wire connects the first bonding pad and the second bonding pad, and the second notch is disposed adjacent to the conductive wire so as to avoid the conductive wire. Because the height of the conducting wire is usually less than the height of the electronic component, the conducting wire can be avoided through the second notch with smaller height, so that the safe distance between the bracket and the conducting wire can be avoided during assembly, and a photosensitive assembly with smaller size can be obtained.

A camera module, comprising:

the photosensitive assembly; and

the lens assembly is arranged on the surface, far away from the circuit board, of the supporting plate.

The camera module uses the photosensitive assembly with smaller size, so that the camera module with smaller size can be obtained.

A mobile terminal comprises the camera module. The mobile terminal uses the camera module with smaller size, so that the mobile terminal with smaller size can be obtained.

Drawings

Fig. 1 is a schematic cross-sectional view of a camera module according to an embodiment of the present invention;

fig. 2 is an exploded view of a circuit board and a bracket according to an embodiment of the invention;

FIG. 3 is a schematic plan view of the circuit board of FIG. 2;

FIG. 4 is a perspective view of the bracket of FIG. 2;

FIG. 5 is a schematic plan view of a first surface of the stent of FIG. 4;

FIG. 6 is a schematic plan view of a second surface of the stent of FIG. 4;

FIG. 7 is a schematic diagram illustrating a comparison between the photosensitive assembly shown in FIG. 1 and a conventional photosensitive assembly;

FIG. 8 is a schematic cross-sectional view of the camera module of FIG. 1 with the closure member removed;

FIG. 9 is a schematic plan view of a bracket with a missing frame portion according to an embodiment of the present invention;

FIG. 10 is a schematic plan view of a bracket with a missing frame portion according to another embodiment of the present invention;

FIG. 11 is a schematic plan view of a bracket with a completely missing border according to another embodiment of the present invention;

fig. 12 is a schematic cross-sectional view of a camera module according to another embodiment of the invention;

fig. 13 is a schematic cross-sectional view of a camera module according to another embodiment of the invention;

FIG. 14 is a perspective view of another embodiment of the present invention showing a camera module with the closure member removed;

FIG. 15 is a schematic plan view of the camera module of FIG. 14;

FIG. 16 is a cross-sectional view taken along line A-A of FIG. 15;

FIG. 17 is a cross-sectional view taken along line B-B of FIG. 15;

FIG. 18 is an exploded perspective view of the circuit board and bracket of FIG. 14;

FIG. 19 is a perspective view of the bracket of FIG. 18;

fig. 20 is a top zoom camera module according to an embodiment of the present invention;

fig. 21 is a bottom zoom camera module according to an embodiment of the present invention;

fig. 22 is a schematic cross-sectional view of an overhead fixed-focus camera module according to an embodiment of the present invention;

FIG. 23 is a schematic cross-sectional view of a photosensitive assembly according to another embodiment of the invention;

fig. 24 is a partial enlarged view at C in fig. 23.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

As shown in fig. 1, the camera module 10 according to an embodiment of the present invention includes a photosensitive element 10a and a lens element 10b disposed on the photosensitive element 10 a. The lens assembly 10b is disposed on the photosensitive path of the photosensitive assembly 10 a. The light reaches the photosensitive assembly 10a after passing through the lens assembly 10b, thereby realizing imaging.

In this embodiment, the camera module 10 is applied to a mobile terminal. Specifically, in the present embodiment, the mobile terminal includes a terminal body (not shown) and a camera module 10 disposed on the terminal body. More specifically, in the present embodiment, the mobile terminal is a portable mobile terminal such as a smart phone and a tablet computer.

As shown in fig. 1, the photosensitive assembly 10a includes a circuit board 100, a photosensitive chip 200, an electronic component 300, a conductive wire 400, a holder 500, a sealing member 600, and an optical filter 700.

The circuit board 100 is used for carrying the photosensitive chip 200 and other components. As shown in fig. 2 and 3, the circuit board 100 includes a carrier surface 110, and the carrier surface 110 includes a chip mounting portion 112 and a frame portion 114 located at an outer periphery of the chip mounting portion 112. In some embodiments, bezel portion 114 is a closed loop structure. In the present embodiment, the frame portion 114 has a square shape. The bezel portion 114 includes a component mounting area 1142 and a blank area 1144. The component mounting section 1142 is used for providing the first pads 120 and mounting the electronic components 300 such as capacitors and resistors.

The photosensitive chip 200 is provided in the chip mounting portion 112. In some embodiments, an adhesive layer is disposed between the photosensitive chip 200 and the chip mounting portion 112. The photosensitive chip 200 includes a photosensitive surface 210, and the photosensitive surface 210 includes a photosensitive portion 212 and a non-photosensitive portion 214 surrounding the photosensitive portion 212. The non-light-sensing portion 214 includes a connection region 2142 and a non-connection region 2144 that are independent of each other. The connection region 2142 is used for electrical connection with the circuit board 100. In some embodiments, the connection region 2142 is provided with the second pad 220, and the second pad 220 and the first pad 120 are connected by a conductive line 400. In some embodiments, conductive line 400 is a gold line.

The bracket 500 includes a support plate 510 and a first protrusion 520. The supporting plate 510 includes a first surface 512 and a second surface 514 opposite to each other, i.e., the supporting plate 510 is a flat plate structure. The second surface 514 is used to connect the lens assembly 10 b. The supporting plate 510 is formed with a light-passing hole 530 penetrating the first surface 512 and the second surface 514. The first protrusion 520 is disposed on the first surface 512. The number of the first protrusions 520 is plural, and the plural first protrusions 520 are arranged at intervals and are used for being connected with the plural blank areas 1144 respectively.

When manufacturing the photosensitive assembly 10a, a circuit board 100 having a plurality of blank areas 1144 is provided; providing a bracket 500 having a plurality of first protrusions 520, wherein the number of the first protrusions 520 is less than or equal to the number of the blank regions 1144, and each first protrusion 520 corresponds to one blank region 1144; dispensing glue on the blank region 1144, and placing the first bump 520 on the dispensed blank region 1144; after the glue between the blank region 1144 and the first bump 520 is cured to form an adhesive layer, the pre-fixing between the bracket 500 and the circuit board 100 is achieved.

As shown in fig. 7, the conventional holder 500a is a hollow structure with two open ends, the sidewall 502 of the holder 500a is connected to the circuit board 100a by the adhesive glue scribed on the circuit board 100a, and the sidewall 502 of the holder 500a provides a supporting force for the lens assembly. The sidewall 502 of the conventional bracket 500a is a complete closed-loop structure, and needs to occupy a larger space of the circuit board 100a, and when the bracket 500a is assembled, a safety space between the bracket 500a and the electronic component 300a needs to be reserved, which is not favorable for reducing the size of the XY plane of the camera module.

In the camera module 10, as shown in fig. 7 and 8, the first protrusion 520 provides a supporting force for the lens assembly 10b, and the bracket 500 is connected to the circuit board 100 by a plurality of discrete first protrusions 520, so that at least a portion of the edge of the supporting plate 510 lacks a sidewall between the edge of the supporting plate 510 and the circuit board 100, and a first notch 10c in the circumferential direction is formed. That is, the bracket 500 of the camera module 10 omits at least a part of the side wall relative to the conventional bracket 500a, which is beneficial to reducing the size of the XY plane of the camera module 10. Also, the multi-point contact more easily manages the assembling flatness of the bracket 500 than the surface contact.

In some embodiments, the formed first notch 10c can avoid the electronic component 300, so that when the bracket 500 is assembled, the safe distance between the bracket 500 and the electronic component 300 is not reserved, the size of the XY plane of the bracket 500 is reduced, and the camera module 10 with a smaller size can be obtained.

As shown in fig. 8, after the bracket 500 and the circuit board 100 are pre-fixed in manufacturing the photosensitive assembly 10a, a first gap 10c exists between the circuit board 100 and the supporting plate 510, and the first gap 10c may be filled with a filler to form a sealing member 600 (shown in fig. 1) at the first gap 10c, so as to seal the photosensitive chip 200 in the circumferential direction of the photosensitive chip 200, that is, to replace the frame (side wall) missing from the bracket 500 with the sealing member 600. The sealing member 600 is provided to prevent the photosensitive chip 200 from contacting with the outside air, so as to better protect the photosensitive chip 200, and the sealing member 600 can increase the connection strength between the supporting plate 510 and the circuit board 100, so that the structure of the entire photosensitive assembly 10a is more stable. In other embodiments, the enclosure 600 may be omitted, for example, when the camera module 10 including the photosensitive assembly 10a is applied to a mobile terminal, the photosensitive chip 200 may be isolated from the outside atmosphere by a housing of the mobile terminal, and the stability of the entire photosensitive assembly 10a may also be improved by a limiting structure in the mobile terminal.

In some embodiments, the filling material is a flowable and adhesive material, and the sealing member 600 may be formed by flowing the flowable and adhesive material between the supporting plate 510 and the circuit board 100 through the first notch 10c and then through a curing process. In this way, the sealing member 600 can seal the first notch 10c and increase the connection between the supporting plate 510 and the circuit board 100. Specifically, in some embodiments, the filler is a bonding glue. In other embodiments, the sealing member 600 can also be obtained by first manufacturing a semi-cured adhesive tape, then pressing the adhesive tape into the first notch 10c by interference fit, and finally curing the adhesive tape.

In other embodiments, when the first protrusion 520 is omitted, an auxiliary tool such as a robot may be used to suspend the supporting board 510 above the circuit board 100, and then glue is dispensed between the supporting board 510 and the circuit board 100, after the glue is cured, a fixing point is formed, which is similar to the first protrusion 520, and mainly achieves the pre-fixing between the supporting board 510 and the circuit board 100. Finally, the first gap 10c between the fixing points is filled with filling materials.

In some embodiments, referring to fig. 8, the circuit board 100 and the photosensitive chips 200 are arranged along the Z direction (i.e., the height direction), the distance between the end surface of the electronic component 300 away from the circuit board 100 and the carrying surface 110 is H1, the opening width of the first notch 10c in the Z axis direction is H2, and H2 is greater than H1, so that when the first notch 10c is disposed adjacent to the electronic component 300, the first notch 10c can better avoid the electronic component 300, and further, during assembly, the safe distance between the bracket 500 and the electronic component 300 is not reserved, the size of the XY plane of the photosensitive assembly 10a is reduced, and further, the photosensitive assembly 10a with a smaller size can be obtained. Also, H2 is larger than H1, which greatly facilitates the inward flow of the filler material between the support plate 510 and the circuit board 100.

In some embodiments, the support plate 510 is a flat plate structure with a thickness that is equal everywhere, i.e., the spacing between the first surface 512 and the second surface 514 is equal everywhere. In other embodiments, the supporting plate 510 may be a non-flat plate structure with a small middle thickness and a large edge thickness, so as to ensure that H2 is larger than H1.

Generally, the height H1 of the electronic component 300 is greater than the height of the photosensitive chip 200 and greater than the height of the conductive line 400. In some embodiments, the number of the electronic components 300 is usually plural, the specifications of the electronic components 300 are different, the height of some electronic components 300 is larger, and the height of some electronic components 300 is smaller. In some embodiments, the opening width H2 of the first notch 10c in the Z-axis direction is controlled to be larger than the height H1 of the electronic component 300 with the largest height, so that the supporting plate 510 is suspended above the photosensitive chip 200, the conductive wire 400 and all the electronic components 300. In some embodiments, H2 is 200-500 microns.

The frame 500 may be a frame with a missing frame, i.e., a frame without a frame (a frame without a side wall), or the frame 500 may be a frame with a missing frame (a frame without a side wall). Fig. 4 shows a stent 500 with a missing border portion. The brackets with the border entirely missing and the brackets with the border partially missing will be described in detail in the following with several specific embodiments.

In some embodiments, as shown in fig. 9 and 10, an edge of an end surface of the at least one first protrusion 520 coincides with an edge of the first surface 512 of the support plate 510, that is, there is a first protrusion 510 whose outer side surface is flush with the outer side surface of the support plate 510, that is, the at least one first protrusion 520 is located at an edge of the support plate 510, and the first protrusion 520 may be regarded as a partial frame (partial side wall) of the bracket 500, in this case, the bracket 500 is a bracket whose frame is partially missing.

In some embodiments, as shown in fig. 11, the edges of the end surfaces of all the first protrusions 520 are spaced apart from the edges of the first surface 512 of the supporting plate 510, that is, all the first protrusions 520 are located in the outer side surface of the supporting plate 510, that is, all the first protrusions 520 are located in the middle of the supporting plate 510, and in this case, the bracket 500 is a bracket with all the missing borders.

As shown in fig. 9, fig. 9 illustrates a bracket provided with a missing frame portion according to an embodiment of the present invention. The bracket 500 includes four first protrusions 520 with the same size and shape, the four first protrusions 520 are respectively located at four corners of the supporting plate 510 and are located at the edge of the supporting plate 510, and the four first protrusions 520 can be regarded as partial frames of the bracket 500. After the bracket 500 is pre-fixed with the circuit board 100, four first gaps 10c exist between the circuit board 100 and the supporting plate 510, and during the process of forming the sealing member 600, glue can be drawn on four sides of the bracket 500 to seal all four first gaps 10 c.

After the scribing, the filler flows inward (toward the photosensitive chip 200) to cover the electronic component 300, the first pad 120 and the end of the conductive wire 400 connected to the first pad 120, and the filler also flows outward. As shown in fig. 12, the flexible circuit board 20 corresponds to a first notch 10c, and after the filling material flows outward to the flexible circuit board 20, the filling material can be used as a reinforcing glue 22 of the flexible circuit board 20 to increase the strength of the flexible circuit board 20, that is, a part of the same sealing member 600 is located in the first notch 10c, and another part is located at the connection position of the circuit board 100 and the flexible circuit board 20. The other end of the flexible circuit board 20 is provided with a connector 30.

It should be noted that the condition of the packing wrap may be determined by controlling the amount of packing. Taking the view angle shown in fig. 2 as an example, the photosensitive chip 200 is square, the plurality of electronic components 300 are arranged in two rows, two rows of electronic components 300 are distributed on the left and right sides of the photosensitive chip 200, the plurality of conductive wires 400 are arranged in three rows, three rows of conductive wires 400 are distributed on the upper side, the lower side and the right side of the photosensitive chip 200, and one row of conductive wires 400 on the right side is arranged in parallel with one row of electronic components 300 on the right side at intervals. In the case of scribing (filling), if the amount of glue is particularly small, the filling may not wrap the electronic component 300, the first pad 120, and the end of the conductive line 400 connected to the first pad 120 in the radial direction; if the amount of glue is relatively small, the filler may cover only a part of the left electronic component 300 and may not completely cover the left electronic component 300 in the radial direction, the filler may cover only the upper and lower first pads 120 and one end of the conductive line 400 connected to the first pad 120 and may not completely cover the conductive line 400 and the second pad 220, and the filler may cover only a part or all of the right electronic component 300 and may not cover the right conductive line 400.

The larger the amount of the filler, the easier the first notch 10c is closed, and the stronger the connection between the supporting plate 510 and the circuit board 100 is, but the larger the amount of the filler is, the probability that the filler overflows to the light sensing portion 212 of the light sensing chip 200 is correspondingly increased, thereby affecting the light sensing performance of the light sensing chip 200, and causing the image quality to be reduced. In some embodiments, combining the above factors, the amount of the filler is controlled, such that the sealing member 600 covers at least a portion of the electronic component 300 in the radial direction, such that the sealing member 600 covers at least the first pad 120 and the end of the conductive wire 400 connected to the first pad 120.

As shown in fig. 10, fig. 10 illustrates a bracket provided with a missing frame portion according to another embodiment of the present invention. The bracket 500 includes four first protrusions 520, and each of the four first protrusions 520 may be considered as a part of the frame of the bracket 500. In this embodiment, the top first protrusion 520 is in a shape of a long strip, that is, the top first protrusion 520 extends from one side of the supporting plate 510 to the other side, that is, one side of the bracket 500 has a complete sidewall, and the other three first protrusions 520 have the same shape and size and are in a shape of a square. That is, the stent 500 has one continuous border and three discrete border portions. After the bracket 500 is pre-fixed with the circuit board 100, three first gaps 10c exist between the circuit board 100 and the supporting plate 510, and during the process of forming the sealing member 600, glue can be drawn on three sides of the bracket 500 to seal all the three first gaps 10 c. As shown in fig. 13, the first protrusion 520 having an elongated shape is located on a side of the bracket 500 close to the flexible circuit board 20, and is a bearing position of the bracket 500. In this way, in the predetermined step, the adhesive can be dispensed only in the blank region 1144 corresponding to the strip-shaped first bump 520, but not in other blank regions 1144, so that the pre-curing step is simpler.

In the embodiment shown in fig. 13, the flexible circuit board 20 is directly opposite to the first protrusion 520 in the shape of an elongated strip, so that glue does not need to be drawn on the side of the bracket 500 corresponding to the flexible circuit board 20 to fill the gap, and the influence on the electrical connection of the flexible circuit board 20 due to the fact that the glue covers the interface on the circuit board 100 for electrically connecting with the flexible circuit board 20 can be avoided. Moreover, the notch may be filled with glue and then the flexible printed circuit board 20 may be assembled on the circuit board 100, or the notch may be filled with glue after the flexible printed circuit board 20 is assembled on the circuit board 100.

As shown in fig. 11, fig. 11 illustrates a bracket provided by an embodiment of the present invention, in which all of the borders are missing. The bracket 500 includes four first protrusions 520, and the four first protrusions 520 are located at the middle of the supporting plate 510 and cannot form a frame of the bracket 500. After the bracket 500 is pre-fixed with the circuit board 100, four first gaps 10c exist between the circuit board 100 and the supporting plate 510, and during the process of forming the sealing member 600, glue can be drawn on four sides of the bracket 500 to seal all four first gaps 10 c. The frame of the stand 500 is formed by an enclosure 600.

Although the first protrusions 520 illustrated in fig. 9 to 11 are all square, the shape of the first protrusions 520 is not limited to square, and may be any regular shape (e.g., cylindrical, truncated cone, prism) or irregular shape, and may support the support plate 510.

In some embodiments, closure 600 is coupled to first projection 520. When the frame 500 is a frame with a missing frame portion, the sealing member 600 needs to be connected to the first protrusion 520 to form a sealing structure to seal the photosensitive chip 200. In some embodiments, when the bracket 500 is a bracket with a frame missing completely, the sealing member 600 may not be connected to the first protrusion 520, and can seal the first gap 10c between the circuit board 100 and the supporting plate 510. Of course, in some embodiments, when the bracket 500 is a bracket with a frame missing entirely, the closing member 600 may be connected with the first protrusion 520.

In some embodiments, as shown in fig. 1, the enclosure 600 encloses the electronic component 300, the first pad 120, and an end of the conductive wire 400 connected to the first pad 120. In this way, the sealing member 600 can protect the electronic component 300, the first land 120, and the end of the conductive wire 400 connected to the first land 120 well.

As shown in fig. 1, in some embodiments, the first bump 520 is located between the electronic component 300 and the photosensitive chip 200. In some embodiments, the electronic component 300 may also be located between the first bump 520 and the photosensitive chip 200.

In some embodiments, as shown in fig. 12 and 13, the bracket 500 further includes a second protrusion 540, and the second protrusion 540 is disposed on the first surface 512 and corresponds to the frame portion 114 of the bearing surface 110. The height of the second protrusion 540 is smaller than that of the first protrusion 520, and the closing member 600 is disposed between the second protrusion 540 and the frame part 114. The provision of the second protrusions 540 with the height of the second protrusions 540 being less than the height of the first protrusions 520 allows for a reduction in the amount of closure 600 used to reduce the fill height of the closure 600 when forming the closure 600. The number of the second protrusions 540 may be one or more, and when the number of the second protrusions 540 is plural, the plurality of second protrusions 540 are arranged at intervals.

The second protrusions 540 may serve as a frame of the supporter 500 when the outer sides of the second protrusions 540 are flush with the outer side of the support plate 510, and the second protrusions 540 may not serve as a frame of the supporter 500 when the outer sides of the second protrusions 540 are located within the outer side of the support plate 510. As shown in fig. 12 and 13, the outer side surface of the second protrusion 540 is flush with the outer side surface of the support plate 510, and the second protrusion 540 serves as a frame of the bracket 500.

The second protrusion 540 may be connected to the first protrusion 520, or may be spaced apart from the second protrusion 540. As shown in fig. 14, the second projection 540 is connected to the first projection 520.

In the embodiment shown in fig. 14-19, the first protrusion 520 and the second protrusion 540 both serve as the frame of the bracket 500, and the second protrusion 540 is connected to the first protrusion 520.

When the outer side of the second protrusion 540 is flush with the outer side of the support plate 510, and the height of the second protrusion 540 is less than the height of the first protrusion 520, after the bracket 500 and the circuit board 100 are pre-cured, the second protrusion 540 and the circuit board 100 are arranged at an interval, and a second notch 10f located in the circumferential direction is formed. As shown in fig. 17 to 19, the second notch 10f is away from the electronic component 300. When a plurality of first notches 10c are provided, the electronic component 300 is provided near some first notches 10c, and the electronic component 300 is not provided near some first notches 10c, and the first notches 10c having a larger height can be changed to the second notches 10f having a smaller height by providing the second protrusions 540, so that the amount of the closure 600 used can be reduced, and the filling height of the closure 600 can be reduced.

In some embodiments, as shown in fig. 17-19, second gap 10f is disposed adjacent conductive line 400 to clear conductive line 400. Since the height of the conductive line 400 is generally smaller than the height of the electronic component 300, the second notch 10f with a smaller height can avoid the conductive line 400, so that a safe distance between the bracket 500 and the conductive line 400 is not reserved during assembly, and the photosensitive assembly 10a with a smaller size can be obtained.

The opening width H3 of the second notch 10f in the first direction 12 is too small, and the resistance is too large, so that the filler is not easy to flow inward between the circuit board 100 and the supporting plate 510. In some embodiments, the opening width H3 of the second notch 10f in the first direction 12 is greater than 100 micrometers, so that the flowable and viscous filler flows in through the second notch 10f to close the second notch 10f, specifically, H3 is 100 and 200 micrometers.

In some embodiments, as shown in fig. 18 and 19, the photosensitive chip 200 is square, two rows of electronic components 300 correspond to two opposite sides of the photosensitive chip 200, each row of electronic components 300 includes a plurality of electronic components 300 arranged at intervals, two rows of conductive wires 400 respectively correspond to the other two sides of the photosensitive chip 200, and each row of conductive wires 400 includes a plurality of conductive wires 400 arranged at intervals. The number of the first notches 10c is two, the two first notches 10c correspond to the two rows of electronic components 300, the number of the second notches 10f is two, and the two second notches 10f correspond to the two rows of conductive wires 400.

In some embodiments, as shown in fig. 15-19, the bracket 500 further includes a stopper 550, and the stopper 550 is disposed on the first surface 512 and adjacent to an edge of the light passing hole 530, and corresponds to the frame portion 114 of the bearing surface 110. In this way, when the sealing member 600 is formed, the filler can be prevented from flowing into the chip mounting portion 112, and the photosensitive chip 200 can be prevented from being contaminated by the filler.

In some embodiments, the stops 550 correspond to the boundaries of the bezel portion 114 and the chip mounting portion 112.

In some embodiments, the height of the stop 550 is the same as the height of the first protrusion 520. When the height of the stopper 550 is the same as that of the first protrusion 520, the stopper 550 has the function of the first protrusion 520, that is, the support 500 and the circuit board 100 are pre-fixed, and also has the function of preventing the filler from contaminating the photosensitive chip 200. That is, when the first bump 520 is located between the electronic component 300 and the photosensitive chip 200, the first bump 520 can be used to pre-fix the bracket 500 and the circuit board 100 and prevent the filler from contaminating the photosensitive chip 200.

In some embodiments, the stop 550 is coupled to the first protrusion 520, and the stop 550 is independent from the second protrusion 540, i.e., the stop 550 is not coupled to the second protrusion 540.

In the embodiment shown in fig. 18 and 19, the number of the first protrusions 520 is three, and three first protrusions 520 are distributed at three corners of the supporting plate 510. The number of the second protrusions 540 is two, and two second protrusions 540 are oppositely arranged, wherein one second protrusion 540 connects two adjacent first protrusions 520, and the other second protrusion 540 connects one first protrusion 520. The number of the stoppers 550 is two, and the two stoppers 550 are disposed opposite to each other and between the two second protrusions 540. The height of the stopper 550 is the same as that of the first protrusion 520, the stopper 550 is connected to the first protrusion 520 and has an L-shape, and the L-shape formed by the stopper 550 and the first protrusion 520 can be regarded as the L-shaped first protrusion 520. The electronic component 300 is located between the stopper 550 and the edge of the supporting plate 510, that is, the electronic component 300 is disposed adjacent to the first notch 10 c. The conductive line 400 is located between the second protrusion 540 and the light passing hole 530, that is, the conductive line 400 is disposed adjacent to the second notch 10 f.

In some embodiments, as shown in fig. 1 and 18, the second surface 514 is recessed to form a filter mounting groove 516 surrounding the light transmitting hole 530, the filter 700 is disposed in the mounting groove 516, and an adhesive layer 810 is disposed between the filter 700 and the bottom of the mounting groove 516. In this case, the photosensitive unit 10a is an overhead photosensitive unit.

In some embodiments, the first surface 512 is recessed to form a filter mounting groove 516 surrounding the light transmitting hole 530, and the filter 700 is disposed in the mounting groove 516. In this case, the photosensitive assembly 10a is a bottom-mount type photosensitive assembly.

As shown in fig. 4, 5 and 6, the supporting plate 510 is provided with an air escape hole 560, the air escape hole 560 includes an air escape hole 562 penetrating through the first surface 512 and the second surface 514, and an air escape groove 564 provided on the first surface 512, the air escape hole 562 and the mounting groove 516 are independent from each other, two ends of the air escape groove 564 are respectively communicated with the air escape hole 562 and the light passing hole 530, and the air escape groove 564 is located between the air escape hole 562 and the light passing hole 530. After the sealing member 600 is formed and the optical filter 700 is fixed on the mounting groove 516, the sealing member 600 and the glue adhering to the optical filter 700 are cured by baking, and the gas expanded by heating can be exhausted through the gas escape groove 564 and the gas escape hole 562

In some embodiments, the filter 700 may not be disposed on the support 500, and in this case, the filter 700 may be accommodated in a pattern formed by enclosing the plurality of first protrusions 520 and directly disposed on the light-sensing surface 210 of the light-sensing chip 200.

In some embodiments, the photosensitive assembly 10a may not include the filter 700, and in this case, the filter 700 may be disposed in the lens assembly 10 b. The lens assembly 10b may be a fixed focus lens assembly or a zoom lens assembly.

As shown in fig. 1, the lens assembly 10b is fixed to the second surface 514 of the support plate 510 by an adhesive layer 820. As shown in fig. 1 and 17, the camera module 10 shown in fig. 1 and 17 is a fixed-focus camera module, and the lens assembly 10b is an integral lens assembly including a lens barrel and a lens disposed in the lens barrel. The camera module 10 shown in fig. 1 and 17 is a top-mount fixed-focus camera module.

As shown in fig. 20, the camera module 10 shown in fig. 20 is a zoom camera module, and the lens assembly 10b includes a voice coil motor 910, a lens barrel 920 disposed in the voice coil motor 910, and a lens disposed in the lens barrel 920. The voice coil motor 910 is connected to the circuit board 100 through pins 930. The voice coil motor 910 drives the lens barrel 920 to drive the lens to move, so as to achieve automatic focusing. The camera module 10 shown in fig. 20 is a top-mount zoom camera module. The camera module 10 shown in fig. 21 is a down zoom camera module.

In some embodiments, as shown in fig. 20, the pins 930 are located on the outer periphery of the supporting plate 510, and the pins 930 are opposite to the first elongated protrusions 520, wherein the first elongated protrusions 520 extend from one side surface to the other side surface of the supporting plate 510. The pins 930 are opposite to the strip-shaped first protrusions 520, so that glue does not need to be drawn on the side of the bracket 500 corresponding to the pins 930 to fill the gaps, and the influence on the electrical connection of the pins 930 due to the fact that the glue covers the bonding pad on the circuit board 100, which is used for being electrically connected with the pins 930, can be avoided. The lead 930 may not interfere with the glue, and the glue may be first drawn to fill the gap and then the lens assembly 10b may be assembled on the supporting plate 510, or the glue may be first drawn to fill the gap after the lens assembly 10b is assembled on the supporting plate 510.

In some embodiments, as shown in fig. 22, the camera module 10 further includes a protection member 10d, and the protection member 10d covers the conductive wire 400. In some embodiments, while the protection member 10d covers the conductive wire 400, two ends of the protection member 10d are connected to the non-photosensitive portions 214 of the circuit board 100 and the photosensitive chip 200 respectively to cover the second pads 220 and the first pads 120. In some embodiments, the protector 10d is a cured adhesive glue. The protector 10d and the closure 600 may be made of the same material or different materials. In manufacturing the camera module 10, the protection member 10d is formed, the holder 500 is attached to the circuit board 100, and the sealing member 600 is formed.

In the process of forming the sealing member 600, the first pad 120 on the circuit board 100 and connected to the conductive trace 400, the conductive trace 400 near one end of the circuit board 100, and even the second pad 220 on the photosensitive chip 200 and connected to the conductive trace 400 may be wrapped by the filler, that is, the first pad 120, the conductive trace 400, and the second pad 220 may be wrapped by the filler. In the process of curing the flowable filler to form the sealing member 600, the shrinkage rate of the filler may cause a strain on the conductive line 400, which may cause the conductive line 400 to be separated from the first pad 120 and the second pad 220, and may cause the conductive line 400 to be broken, thereby causing electrical defects. Also, once the sealing member 600 is formed, when an electrical failure occurs, it is very inconvenient to detach, resulting in difficulty in repairing the electrical failure.

In some embodiments, the protection member 10d is disposed before the formation of the sealing member 600, and the protection member 10d covers at least one end of the first pad 120 and the conductive trace 400 close to the circuit board 100, so that when the flowable and viscous material flows between the supporting plate 510 and the circuit board 100 through the first notch 10c or the second notch 10f to be cured to form the sealing member 600, the protection member 10d can prevent the material forming the sealing member 600 from directly contacting the first pad 120 and the end of the conductive trace 400 close to the circuit board 100. At this time, by controlling the amount of the material, it is possible to prevent the material from being in direct contact with one end of the conductive line 400 near the second pad 220 and the second pad 220. In some embodiments, the protective member 10d covers the first pads 120, the conductive lines 400, and the second pads 220.

By providing the protection member 10d, it is possible to prevent the material forming the sealing member 600 from directly covering the first pad 120, the conductive wire 400, and the second pad 220, and thus it is possible to prevent the material forming the sealing member 600 from causing electrical defects due to the effect of the shrinkage of the material during curing. Moreover, since the step of forming the protective member 10d may precede the step of pre-fixing the bracket 500 to the circuit board 100 and the step of forming the sealing member 600, even if the electrical defect occurs due to other reasons, the disassembly is facilitated, so that the repair of the electrical defect can be realized.

In some embodiments, the protector 10d is made of the same material as the closure 600. At this time, since the amount of the material of the protector 10d is much smaller than that of the material of the closure 600, the effect of the material shrinkage of the protector 10d is relatively small, and the problem of electrical defects can be avoided.

In some embodiments, the protector 10d is made of a material different from that of the closure 600, wherein the shrinkage rate of the material forming the protector 10d is smaller than that of the material forming the closure 600, the flowability of the material forming the protector 10d is larger than that of the material forming the closure 600, the hardness of the protector 10d is smaller than that of the closure 600, and the elasticity of the protector 10d is larger than that of the closure 600.

In some embodiments, the second pads 220 are disposed on the non-photosensitive portion 214 of the photosensitive chip 200, and the protection member 10d surrounds the photosensitive portion 212 for a circle to block the material forming the sealing member 600 from flowing to the photosensitive portion 212 of the photosensitive chip 200. In this case, the protection member 10d has not only a function of preventing electrical defects but also a function of preventing glue overflow.

In some embodiments, the distance between the protection member 10d and the light sensing portion 212 of the light sensing chip 200 is greater than or equal to 300 micrometers. In this way, even if the material forming the sealing member 600 flows toward the light sensing portion 212 beyond the protective member 10d, the material forming the sealing member 600 hardly reaches the light sensing portion 212 due to the large space between the protective member 10d and the light sensing portion 212, so that the material forming the sealing member 600 can be prevented from flowing to the light sensing portion 212 of the photo chip 200 better.

In some embodiments, the protection member 10d has an asymmetric structure, and the width of the protection member 10d on the connection region 2142 of the photo-sensing chip 200 is greater than the width of the protection member 10d on the non-connection region 2144. Since the second pad 220 is disposed on the connection region 2142, the second pad 220 is connected to the conductive wire 400, the second pad 220 is not disposed on the non-connection region 2144, the width of the protection member 10d on the connection region 2142 of the photo-sensing chip 200 is larger, so as to better cover the second pad 220 and the conductive wire 400, and the width of the protection member 10d on the non-connection region 2144 is smaller, so as to save the usage of the protection member 10 d.

In some embodiments, as shown in fig. 23 and 24, the camera module 10 further includes an anti-glue-overflow member 10e, the anti-glue-overflow member 10e is disposed on the first surface 512 of the supporting plate 510, and the anti-glue-overflow protrusion 10e is closer to the photosensitive chip 200 than the first protrusion 520, for blocking the filler forming the sealing member 600 from flowing to the photosensitive part 212 of the photosensitive chip 200. The glue overflow preventing member 10e is disposed on the supporting plate 510, so that the glue overflow preventing member 510 can be prevented from occupying the area of the circuit board 100 where the electronic component 300 is disposed.

In some embodiments, the glue overflow prevention member 10e is disposed adjacent to the light passing hole 530, and the glue overflow prevention member 10e is disposed adjacent to the light passing hole 530, so as to prevent the glue overflow prevention member 10e from interfering with the electronic components 300 on the circuit board 100.

In some embodiments, the glue overflow prevention member 10e is a closed ring structure surrounding the hole for passing light 530. Therefore, the glue can be prevented from overflowing more comprehensively. In some embodiments, the glue overflow preventing member 10e includes a plurality of glue overflow preventing blocks, which are spaced around the light passing hole 530. Therefore, the glue overflow prevention block can well prevent glue overflow, and a space for avoiding the electronic component 300 is formed between two adjacent glue overflow prevention blocks according to actual design requirements. In some embodiments, as shown in fig. 4, the supporting plate 510 is provided with an air escape hole 562 penetrating through two opposite surfaces of the supporting plate 510, the surface of the supporting plate 510 close to the circuit board 100 is provided with an air escape groove 564, two ends of the air escape groove 564 are respectively communicated with the air escape hole 562 and the light through hole 530, one end of the anti-overflow glue 10e is adjacent to one side of the air escape groove 564, and the other end extends to the other side of the air escape groove 564 around the light through hole 530 and is adjacent to the other side of the air escape groove 564. Therefore, the glue overflow prevention device can better prevent glue overflow and is beneficial to gas escape.

In some embodiments, as shown in fig. 23 and 24, the glue overflow prevention member 10e1 is directly opposite to the non-photosensitive portion 214 of the photosensitive chip 200, that is, the orthogonal projection of the glue overflow prevention member 10e1 on the photosensitive surface 210 is located on the photosensitive surface 210. In some embodiments, as shown in fig. 23 and 24, a portion of the glue overflow preventing member 10e2 is opposite to the non-photosensitive portion 214, and another portion is opposite to the frame portion 114 of the circuit board 100. In some embodiments, the glue overflow prevention member 10e2 may not be directly opposite to the non-photosensitive portion 214, and the glue overflow prevention member 10e2 may be directly opposite to the frame portion 114 of the circuit board 100.

In some embodiments, as shown in fig. 23 and 24, the glue overflow preventing member 10e is disposed at a distance from the non-photosensitive portion 214 to avoid the conductive wire 400. In other embodiments, the glue overflow preventing member 10e may also be in direct contact with the non-photosensitive portion 214.

In some embodiments, an end of the glue overflow preventing member 10e away from the supporting plate 510 is spaced apart from a plane on which the surface of the photosensitive chip 200 away from the circuit board 100 is located. Thus, the anti-overflow glue 10e can be prevented from interfering with the conductive wires 400 on the photosensitive chip 200. In some embodiments, the distance between the glue-overflow preventing member 10e and the non-connection region 2144 is equal to or less than 150 micrometers, and the distance between the glue-overflow preventing member 10e and the conductive line 400 is equal to or less than 150 micrometers. The distance is less than or equal to 150 micrometers, so that the glue passing channel is smaller, and a better glue overflow prevention effect is achieved.

In some embodiments, at least a portion of the glue overflow preventing member 10e is disposed opposite to the connection region 2142, and at least a portion of the glue overflow preventing member 10e is disposed opposite to the non-connection region 2144 in a radial direction of the light passing hole 530. Thus, the interference between the glue overflow prevention member 10e and the electronic component 300 on the circuit board 100 can be avoided.

As shown in fig. 23 and 24, in some embodiments, the glue-overflow preventing member 10e includes a first glue-overflow preventing portion 10e1 and a second glue-overflow preventing portion 10e2, the first glue-overflow preventing portion 10e1 and the second glue-overflow preventing portion 10e2 correspond to the connecting region 2142 and the non-connecting region 2144, respectively, and the height of the first glue-overflow preventing portion 10e1 is smaller than the height of the second glue-overflow preventing portion 10e 2. The first glue overflow preventing portion 10e1 with a smaller height is adopted to correspond to the connection region 2142, so that the interference between the first glue overflow preventing portion 10e1 and the conductive wire 400 on the connection region 2142 can be avoided, and the second glue overflow preventing portion 10e2 with a larger height is adopted to correspond to the non-connection region 2144, so that the glue passing channel is smaller, and a better glue overflow preventing effect is achieved.

In some embodiments, the first glue overflow preventing portion 10e1 is opposite to the connection region 2142, and the second glue overflow preventing portion 10e2 may be opposite to the non-connection region 2144, or opposite to the frame portion 114 of the circuit board 100, or partially opposite to the non-connection region 2144, and partially opposite to the frame portion 114 of the circuit board 100. That is, in the radial direction of the light passing hole 530, at least a part of the first glue overflow preventing portion 10e1 is disposed opposite to the connection region 2142, and at least a part of the second glue overflow preventing portion 10e2 is disposed opposite to the non-connection region 2144.

In some embodiments, the glue-overflow preventing member 10e may be a ring-shaped structure surrounding the light passing hole 530 by one turn, and at this time, the first glue-overflow preventing portion 10e1 is connected to the second glue-overflow preventing portion 10e 2.

In some embodiments, as shown in fig. 16 and fig. 19, the glue overflow preventing member 10e may also be a stopper 550, in which case, the glue overflow preventing member 10e is directly opposite to the frame portion 114 of the circuit board 100, that is, an orthographic projection of the glue overflow preventing member 10e on the circuit board 100 is located on the circuit board 100.

In some embodiments, as shown in fig. 16 and 19, the overflow preventing member 10e is located at the periphery of the photosensitive chip 200, and the overflow preventing member 10e is in direct contact with the circuit board 100. In other embodiments, the glue overflow prevention member 10e is located at the periphery of the photosensitive chip 200, the glue overflow prevention member 10e may be spaced apart from the circuit board 100, and the space between the glue overflow prevention member 10e and the circuit board 100 may be filled with the adhesive glue of the pre-cured first bump 520, may be filled with the filler of the sealing member 600, or may not be filled.

In the process of forming the sealing member 600, the amount of material forming the sealing member 600 is improperly controlled, which may cause the material forming the sealing member 600 to flow to the photosensitive part 212 of the photosensitive chip 200, affect the photosensitive performance of the photosensitive chip 200, and cause a reduction in image quality. By providing the glue overflow preventing member 10e between the circuit board 100 and the support plate 510, when the sealing member 600 is formed by curing after a material that can flow and has viscosity flows between the support plate 510 and the circuit board 100 through the first notch 10c or the second notch 10f, the glue overflow preventing member 10e serves to block the material forming the sealing member 600 from flowing to the light sensing portion 212 of the photosensitive chip 200. The glue overflow preventing member 10e may be the blocking plate 550 shown in fig. 19, the blocking plate 550 connects the circuit board 100 and the supporting plate 510, the glue overflow preventing member 10e may be the protecting member 10d shown in fig. 22 that surrounds the photosensitive section 212 for one circle, and the glue overflow preventing member 10e may be the glue overflow preventing member 10e shown in fig. 23 and 24.

An embodiment of the present invention further provides a method for manufacturing a photosensitive assembly, including the following steps:

step S1, providing a package substrate, wherein the package substrate comprises a circuit board, a photosensitive chip and an electronic component, the circuit board comprises a bearing surface, the bearing surface comprises a chip mounting part and a frame part located at the periphery of the chip mounting part, the photosensitive chip is arranged on the chip mounting part, and the electronic component is arranged on the frame part.

Step S2, the supporting plate is disposed on a side of the photosensitive chip and the electronic component away from the bearing surface, the light hole is opposite to the photosensitive chip, and the edge of the supporting plate and the frame part are disposed at an interval to form a first notch located in the circumferential direction and adjacent to the electronic component.

Step S3, closing the first notch and forming a sealing member between the support plate and the circuit board, the sealing member connecting the support plate and the circuit board.

In some embodiments, in step S2, the first bump disposed on the surface of the support board close to the circuit board is fixed to the blank area of the circuit board.

In some embodiments, in step S3, after the flowable and viscous material flows into the support board and the circuit board from the first notch, the flowable and viscous material is cured to obtain the sealing member.

In some embodiments, before performing step S2, a step of providing a protector is further included.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A photosensitive assembly, comprising:

2. The photosensitive assembly of claim 1, wherein the supporting plate is provided with a light through hole facing the photosensitive part, and the glue overflow preventing member is arranged on the surface of the supporting plate close to the circuit board;

the anti-overflow glue piece is a closed annular structure surrounding the light through hole for one circle;

or the anti-overflow glue piece comprises a plurality of anti-overflow glue blocks, and the anti-overflow glue blocks are arranged around the light through hole at intervals;

or, the support plate is provided with air escape holes penetrating through two opposite surfaces of the support plate, the surface of the support plate close to the circuit board is provided with an air escape groove, two ends of the air escape groove are respectively communicated with the air escape holes and the light through hole, one end of the anti-overflow rubber part is adjacent to one side of the air escape groove, and the other end of the anti-overflow rubber part surrounds the light through hole, extends to the other side of the air escape groove and is adjacent to the other side of the air escape groove.

3. The photosensitive assembly of claim 1, wherein the photosensitive surface further comprises a non-photosensitive portion surrounding the photosensitive portion, the non-photosensitive portion comprises a connection area and a non-connection area which are independent of each other, and the connection area is electrically connected with the circuit board through a conductive wire;

the anti-overflow is glued the piece and is located the backup pad is close to the surface of circuit board, the anti-overflow is glued the piece and is included first anti-overflow and glues portion and second anti-overflow and glue the portion, the height that first anti-overflow was glued the portion is less than the height that the portion was glued to the second anti-overflow, first anti-overflow glue the portion with the joining region corresponds and with the conductor wire interval sets up, the second anti-overflow glue the portion with non-joining region corresponds and the interval sets up.

4. The photosensitive assembly according to claim 2, wherein the glue overflow preventing member is disposed on a surface of the supporting plate close to the circuit board, the glue overflow preventing member is disposed on a periphery of the photosensitive chip, and a bonding layer is disposed between an end of the glue overflow preventing member away from the supporting plate and the circuit board.

5. A photosensitive assembly according to any one of claims 1 to 4, further comprising an electronic component, wherein the electronic component is disposed on the frame portion, the electronic component is disposed adjacent to the first notch, and an opening width of the first notch in the arrangement direction from the circuit board to the photosensitive chip is greater than a distance between an end surface of the electronic component far from the circuit board and the bearing surface, so as to avoid the electronic component.

6. A photosensitive assembly according to claim 5, wherein the bracket further includes a first protrusion disposed on the supporting plate, and an end of the first protrusion away from the supporting plate is connected to the blank area of the rim portion, so as to pre-fix the supporting plate on the circuit board.

7. A photosensitive assembly according to claim 6, wherein the bracket further includes a second protrusion, the second protrusion is disposed on a surface of the supporting plate close to the circuit board and spaced from the frame portion, an outer side surface of the second protrusion is flush with an outer side surface of the supporting plate, so as to form a second gap located in the circumferential direction, the second gap is away from the electronic component, and the sealing member is disposed in the second gap to seal the second gap.

8. The photosensitive assembly of claim 7, further comprising a conductive wire, wherein the frame portion is provided with a first bonding pad, the photosensitive surface is provided with a second bonding pad, the conductive wire connects the first bonding pad and the second bonding pad, and the second gap is disposed adjacent to the conductive wire to avoid the conductive wire.

9. The utility model provides a module of making a video recording which characterized in that includes:

the photosensitive assembly of any one of claims 1-8; and

10. A mobile terminal characterized by comprising the camera module according to claim 9.