TWI758644B - Camera module, photosensitive element and manufacturing method thereof - Google Patents

Camera module, photosensitive element and manufacturing method thereof Download PDF

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TWI758644B
TWI758644B TW108135670D TW108135670D TWI758644B TW I758644 B TWI758644 B TW I758644B TW 108135670 D TW108135670 D TW 108135670D TW 108135670 D TW108135670 D TW 108135670D TW I758644 B TWI758644 B TW I758644B
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photosensitive
circuit board
camera module
wafer
present
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王明珠
趙波杰
田中武彥
欒仲禹
郭楠
陳振宇
黃楨
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大陸商寧波舜宇光電信息有限公司
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Priority claimed from CN201610143457.7A external-priority patent/CN105744130B/en
Priority claimed from CN201620191969.6U external-priority patent/CN205792875U/en
Priority claimed from CN201610142925.9A external-priority patent/CN105704354B/en
Priority claimed from CN201620191631.0U external-priority patent/CN205792874U/en
Priority claimed from CN201610202500.2A external-priority patent/CN105721754B/en
Priority claimed from CN201620269534.9U external-priority patent/CN205545597U/en
Priority claimed from CN201610278035.0A external-priority patent/CN105827916B/en
Priority claimed from CN201620373323.XU external-priority patent/CN205961266U/en
Priority claimed from CN201620590779.1U external-priority patent/CN206040618U/en
Priority claimed from CN201610430615.7A external-priority patent/CN107516651B/en
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
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    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14698—Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222—Sequential connecting processes
    • H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

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  • Microelectronics & Electronic Packaging (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Lens Barrels (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

一種攝像模組及其感光元件和製造方法，其中所述感光元件包括一封裝部和一感光部；所述感光部包括一線路板主體和一感光晶片，所述封裝部一體封裝成型於所述線路板主體和所述感光晶片。所述封裝部形成一通孔，所述通孔與所述感光晶片相對，以提供所述感光晶片光線通路。 A camera module, a photosensitive element and a manufacturing method thereof, wherein the photosensitive element includes a packaging part and a photosensitive part; the photosensitive part includes a circuit board main body and a photosensitive chip, and the packaging part is integrally packaged and molded on the A circuit board body and the photosensitive wafer. A through hole is formed in the packaging part, and the through hole is opposite to the photosensitive chip, so as to provide a light path of the photosensitive chip.

Description

攝像模組及其感光元件和製造方法 Camera module, photosensitive element and manufacturing method thereof

本發明涉及攝像模組領域，更進一步，涉及一攝像模組及其感光元件和製造方法。 The present invention relates to the field of camera modules, and furthermore, to a camera module, a photosensitive element and a manufacturing method thereof.

COB(Chip On Board，晶片封裝)工藝是攝像模組組裝製造過程中極為重要的一個工藝過程。傳統的COB工藝製成的攝像模組由線路板、感光晶片、鏡座、馬達驅動以及鏡頭等部件組裝而成。 The COB (Chip On Board, chip packaging) process is an extremely important process in the assembly and manufacturing process of the camera module. The camera module made by the traditional COB process is assembled from circuit board, photosensitive chip, lens holder, motor drive and lens and other components.

如圖1所示，是傳統的COB工藝製造的一攝像模組示意圖。所述攝像模組包括一線路板101P、一感光晶片102P、一支架103P、一濾光片104P、一馬達105P和一鏡頭106P。所述感光晶片102P被安裝於所述線路板101P，所述濾光片104P被安裝於所述支架103P，所述鏡頭106P被安裝於所述馬達105P，所述馬達105P被安裝於所述支架103P，以便於所述鏡頭106P位於所述感光晶片102P的感光路徑上。 As shown in FIG. 1 , it is a schematic diagram of a camera module manufactured by a traditional COB process. The camera module includes a circuit board 101P, a photosensitive chip 102P, a bracket 103P, a filter 104P, a motor 105P and a lens 106P. The photosensitive chip 102P is mounted on the circuit board 101P, the filter 104P is mounted on the holder 103P, the lens 106P is mounted on the motor 105P, and the motor 105P is mounted on the holder 103P, so that the lens 106P is located on the photosensitive path of the photosensitive wafer 102P.

值得一提的是，在所述線路板101P上通常被安裝有一些電路器件1011P，比如電阻、電容等，這些電路器件1011P凸出於所述線路板101P表面，而所述支架103P則需要被安裝於具有所述電路器件1011P的所述線路板101P上，而傳統的COB工藝中所述線路板101P、所述電路器件1011P以及所述 支架103P之間的組裝配合關係具有一些不利因素，且在一定程度上限制了攝像模組向輕薄化的發展。 It is worth mentioning that some circuit devices 1011P, such as resistors, capacitors, etc., are usually installed on the circuit board 101P. These circuit devices 1011P protrude from the surface of the circuit board 101P, and the bracket 103P needs to be mounted on the circuit board 101P having the circuit device 1011P, while the circuit board 101P, the circuit device 1011P and the circuit board 101P in the conventional COB process The assembly and cooperation relationship between the brackets 103P has some unfavorable factors, and to a certain extent, it limits the development of the camera module to be light and thin.

還值得一提的是，所述感光晶片102P通常是通過一些金線1021P電連接於所述線路板101P，以便於所述感光晶片102P和所述線路板101P之間的資訊傳輸。而基於所述金線1021P的特性與結構，所述金線1021P通常呈弧形地彎曲，凸出於所述線路板101P的表面，因此，所述感光晶片102P的組裝過程也是和所述電路器件1011P一樣，對攝像模組存在類似的影響因素。 It is also worth mentioning that the photosensitive chip 102P is usually electrically connected to the circuit board 101P through some gold wires 1021P, so as to facilitate information transmission between the photosensitive chip 102P and the circuit board 101P. Based on the characteristics and structure of the gold wire 1021P, the gold wire 1021P is usually curved in an arc shape and protrudes from the surface of the circuit board 101P. Therefore, the assembly process of the photosensitive chip 102P is also the same as that of the circuit. Like the device 1011P, there are similar factors affecting the camera module.

具體來說，首先，所述電路器件1011P以及所述金線1021P直接暴露於所述線路板101P的表面，因此在後續組裝的過程中，比如粘貼所述支架103P、焊接所述馬達105P等過程，不可避免的會受到影響，焊接時的阻焊劑、灰塵等容易黏著於所述電路器件1011P，而所述電路器件1011P與所述感光晶片102P位於相互連通的一個空間內，因此灰塵污染物很容易影響感光晶片102P，這樣的影響可能造成組裝後的攝像模組存在汙黑點等不良現象，降低了產品良率。 Specifically, first, the circuit device 1011P and the gold wire 1021P are directly exposed on the surface of the circuit board 101P, so in the subsequent assembly process, such as the process of pasting the bracket 103P, welding the motor 105P, etc. , it will inevitably be affected, and the solder resist, dust, etc. during soldering are easy to adhere to the circuit device 1011P, and the circuit device 1011P and the photosensitive chip 102P are located in a space that communicates with each other, so dust contamination is very It is easy to affect the photosensitive chip 102P, which may cause bad phenomena such as smudges and black spots in the assembled camera module, which reduces the product yield.

其次，所述支架103P位於所述電路器件1011P的外側，因此在安裝所述支架103P和所述線路板101P時，需要在所述支架103P和所述電路器件1011P之間預留一定的安全距離，且在水準方向以及向上的方向都需要預留安全距離，這在一定程度上增大了攝像模組厚度的需求量，使其厚度難以降低。 Secondly, the bracket 103P is located outside the circuit device 1011P, so when installing the bracket 103P and the circuit board 101P, a certain safety distance needs to be reserved between the bracket 103P and the circuit device 1011P , and a safety distance needs to be reserved in both the horizontal direction and the upward direction, which increases the demand for the thickness of the camera module to a certain extent, making it difficult to reduce the thickness.

第三，在COB組裝的過程中，所述支架103P或所述馬達105P通過膠水等粘貼物被粘貼於所述線路板101P，在粘貼時通常要進行AA(Active Arrangement自動校準)工藝，就是調整所述所述感光晶片102P和所述鏡頭106P的中心軸線，使其達到水準方向和豎直方向的一致，因此為了滿足AA工藝， 需要在所述支架103P與所述線路板101P以及所述支架103P與所述馬達105P之間都需要預設較多的膠水，使得相互之間留有調整空間，而這個需求一方面在一定程度上又增加了對攝像模組的厚度需求，使其厚度難以降低，另一方面，多次粘貼組裝過程很容易造成組裝的傾斜不一致，且對所述鏡座103P、所述線路板101P以及所述馬達105P的平整性要求較高。 Third, in the process of COB assembly, the bracket 103P or the motor 105P is pasted on the circuit board 101P through an adhesive such as glue. When pasting, an AA (Active Arrangement) process is usually performed, which is to adjust The central axes of the photosensitive wafer 102P and the lens 106P are aligned with the horizontal direction and the vertical direction. Therefore, in order to satisfy the AA process, It is necessary to preset a lot of glue between the bracket 103P and the circuit board 101P and between the bracket 103P and the motor 105P, so that there is room for adjustment, and this requirement is to a certain extent. On the other hand, the thickness requirement of the camera module is increased, so that it is difficult to reduce the thickness. The flatness requirement of the motor 105P is relatively high.

值得一提的是，所述支架103P通常是通過注塑成型的方式製造而成，由於選用材料以及製造工藝的限制，使得所述支架103P自身的表面平整性較差，因此一方面使得所述支架103P與所述線路板101P之間的粘接平整性以及穩定性較差，另一方面，使得所述支架3P為其他部件，如所述馬達105P和/或所述鏡頭106P提供的安裝平面的平整性較差，這些因素都會影響攝像模組最終品質以及批量化生產時良率的高低。 It is worth mentioning that the bracket 103P is usually manufactured by injection molding. Due to the limitation of the selected materials and the manufacturing process, the surface of the bracket 103P itself has poor flatness. Therefore, on the one hand, the bracket 103P is The bonding flatness and stability with the circuit board 101P are poor. On the other hand, the bracket 3P is made of other components, such as the flatness of the mounting plane provided by the motor 105P and/or the lens 106P. Poor, these factors will affect the final quality of the camera module and the level of yield in mass production.

此外，傳統的COB工藝中，所述線路板101P提供最基本的固定、支撐載體，因此，對於所述線路板101P本身要求具備一定的結構強度，這個要求使得所述線路板101P具有較大的厚度，從而從另一方面又預加了攝像模組的厚度需求。 In addition, in the traditional COB process, the circuit board 101P provides the most basic fixing and supporting carrier. Therefore, the circuit board 101P itself is required to have a certain structural strength, and this requirement makes the circuit board 101P have a larger Thickness, so on the other hand, the thickness requirement of the camera module is pre-added.

隨著各種電子產品、智慧設備的發展，攝像模組也越來越向高性能、輕薄化方向發展，而面對高圖元、高成像品質等各種高性能的發展要求，電路中的電子元器件越來越多、晶片的面積越來越大、驅動電阻、電容等被動元器件相應增多，這使得電子器件的規格越來越大、組裝難度不斷增大、攝像模組的整體尺寸越來越大，而從上述來看，鏡座、線路板以及電路元件等的傳統組裝方式在一定程度上也是攝像模組輕薄化發展的極大限制。且對於攝像模組需求量急劇增大的今天，批量化生產是必不可少的內容，如何讓產品的 性能改進，且能夠提高產品的良率，使得一項技術能夠真正投入生產應用，這對於攝像模組技術研究者以及生產製造商具有極其重要的意義。 With the development of various electronic products and smart devices, camera modules are also developing towards high performance and thinness. In the face of various high-performance development requirements such as high graphics elements and high imaging quality, the electronic There are more and more devices, the area of the wafer is getting larger and larger, and the passive components such as driving resistors and capacitors are increasing accordingly, which makes the specifications of electronic devices larger and larger, the assembly difficulty continues to increase, and the overall size of the camera module is increasing. The larger it is, and from the above point of view, the traditional assembly method of the mirror base, circuit board, and circuit components is also a great limitation to the development of light and thin camera modules to a certain extent. And today, with the sharp increase in the demand for camera modules, mass production is an indispensable content. How to make the product Performance improvement, and the ability to improve product yield, enable a technology to be truly put into production applications, which is of great significance to camera module technology researchers and manufacturers.

傳統手機攝像模組封裝線路板上面通常貼有電容和塑膠件，且阻容器件和塑膠件都是獨立存在，在空間上並不重疊，塑膠件起支撐作用。此種方案主要存在如下問題：1、塑膠支架單獨成型後通過膠水粘結在線路板上，容易因為塑膠支架本身的不平整和貼付的組裝傾斜，最終造成模組傾斜；2、阻容器件與感光晶片存在在同一空間內，阻容器件部分的灰塵不容易清洗乾淨，進而影響模組最終黑點污點不良；3、線路板部分結構強度不強；4、尺寸難以做到很小，尤其是橫向尺寸，兩個攝像模組之間的尺寸比較浪費，影響了整體的尺寸。近年來，電子設備越來越呈現出輕薄化的發展趨勢，這對於作為電子設備的標準配置之一的攝像模組，尤其是對於攝像模組的高度尺寸提出了更為苛刻的要求。另外，使用者對於攝像模組的成像品質的要求也越來越高。因此，如何減小攝像模組的尺寸和提高攝像模組的成像品質是攝像模組行業近年來致力於要解決的技術問題。 Capacitors and plastic parts are usually attached to the packaging circuit board of the traditional mobile phone camera module, and the resistance container parts and the plastic parts exist independently and do not overlap in space, and the plastic parts play a supporting role. This solution mainly has the following problems: 1. After the plastic bracket is formed separately, it is bonded to the circuit board by glue. It is easy to cause the module to tilt due to the unevenness of the plastic bracket itself and the inclination of the attached assembly; 2. The photosensitive chip exists in the same space, and the dust in the blocking part is not easy to clean, which will affect the final black spot and stain of the module; 3. The structural strength of the circuit board is not strong; 4. It is difficult to make the size small, especially Horizontal size, the size between the two camera modules is wasteful, which affects the overall size. In recent years, electronic devices are showing a trend of becoming thinner and lighter, which puts forward more stringent requirements for the camera module, which is one of the standard configurations of electronic devices, especially for the height and size of the camera module. In addition, users have higher and higher requirements on the imaging quality of the camera module. Therefore, how to reduce the size of the camera module and improve the imaging quality of the camera module is a technical problem to be solved by the camera module industry in recent years.

目前，應用於攝像模組行業的MOC(Molding On Chip)封裝工藝得到了發展，MOC封裝工藝是在攝像模組被封裝的過程中將感光晶片和線路封裝在一起，以最大程度地提高攝像模組的結構強度、減小攝像模組的尺寸和減少灰塵不良的情況出現。具體地說，在採用MOC封裝工藝製造攝像模組的過程中，首先將感光晶片貼裝於線路板上，並通過金線將所述感光晶片和所述線路板相導通，然後將所述線路板放入到成型模具中，並使所述感光晶片的感光區域朝向成型模具，通過向所述成型模具中填入成形材料的方式形成支架，其 中所述支架使所述感光晶片和所述線路板一體結合。儘管這樣的方式在提高所述攝像模組的結構強度和減小所述攝像模組的尺寸方面起到了積極的效果，但是，所述攝像模組的這種製造過程仍然存在諸多問題。 At present, the MOC (Molding On Chip) packaging process used in the camera module industry has been developed. The MOC packaging process is to package the photosensitive wafer and circuit together during the process of packaging the camera module to maximize the improvement of the camera module. The structural strength of the group, reducing the size of the camera module and reducing the occurrence of dust defects. Specifically, in the process of using the MOC packaging process to manufacture the camera module, the photosensitive chip is first mounted on the circuit board, and the photosensitive chip and the circuit board are connected to each other through gold wires, and then the circuit is connected to the circuit board. The plate is put into the forming mold, and the photosensitive area of the photosensitive wafer is directed toward the forming mold, and a bracket is formed by filling the forming material into the forming mold, which is In the bracket, the photosensitive wafer and the circuit board are integrally combined. Although this method has a positive effect in improving the structural strength of the camera module and reducing the size of the camera module, there are still many problems in the manufacturing process of the camera module.

首先，通常情況下，所述感光晶片通過與每個圖元點一一匹配的微透鏡來提高所述感光晶片的感光能力，所述微透鏡通常為微米級別的，這使得所述微透鏡極易被損壞或者被刮傷，尤其是在高溫高壓狀態下，所述微透鏡被損壞或者被刮傷的幾率更大，而一般所述感光晶片中的任何一個所述微透鏡被破壞或者被刮傷，則必要導致所述攝像模組的成像品質被影響。其次，所述感光晶片和所述線路板的貼裝存在公差，這導致在成型模具施壓於所述感光晶片的非感光區域之後，在所述感光晶片和成型模具之間會存在縫隙，當成形材料被填入成型模具後，成形材料會流入到形成於所述感光晶片與成型模具之間的縫隙，而導致成形材料形成的所述支架存在“飛邊”的情況，一方面由於成形材料的溫度比較高，一旦成形材料流動到所述感光晶片的感光區域，則必會給被設於所述感光晶片的感光區域的所述微透鏡造成損壞，另一方面形成於所述支架的“飛邊”可能會局部遮擋所述感光晶片的感光區域而造成產品不良。 First, in general, the photosensitive wafer improves the photosensitive ability of the photosensitive wafer through a microlens matched with each pixel point one by one, and the microlens is usually micron level, which makes the microlens extremely Easily damaged or scratched, especially under high temperature and high pressure conditions, the microlens is more likely to be damaged or scratched, and generally any one of the microlenses in the photosensitive wafer is damaged or scratched If damaged, the imaging quality of the camera module must be affected. Secondly, there is a tolerance in the mounting of the photosensitive wafer and the circuit board, which leads to a gap between the photosensitive wafer and the molding die after the molding die is pressed against the non-photosensitive area of the photosensitive wafer. After the molding material is filled into the molding die, the molding material will flow into the gap formed between the photosensitive wafer and the molding die, resulting in the presence of "flash" in the bracket formed by the molding material. On the one hand, due to the molding material The temperature is relatively high, once the forming material flows into the photosensitive area of the photosensitive wafer, it will definitely cause damage to the microlenses set in the photosensitive area of the photosensitive wafer. Flash" may partially block the photosensitive area of the photosensitive wafer, resulting in defective products.

光軸的一致性是影響攝像模組成像品質的一個重要因素，而光軸的一致性主要是指感光晶片的中心軸線與鏡頭的主光軸的共軸，因此D/A(Die/Attach晶片貼附)工藝是攝像模組組裝、製造過程中的一個重要工序。參照圖81A和81B是傳統攝像中經過D/A工藝後的晶片和線路板。傳統攝像模組中，通常是將一晶片501P貼附至一線路板502P上，也就是D/A過程，即，先在所述線路板表面502P上按特定形狀塗布熱固性導電膠或絕緣膠，比如以點膠的 方式畫點或十字形或交叉形，再將所述晶片501P貼附所述線路板502P上。通過貼附過程中的按壓動作使得膠水攤開，從而粘附所述晶片501P。最後通過加熱烘烤進行膠水乾燥固化，使得所述晶片501P固定在所述線路板502P表面。 The consistency of the optical axis is an important factor affecting the imaging quality of the camera module, and the consistency of the optical axis mainly refers to the coaxiality of the central axis of the photosensitive wafer and the main optical axis of the lens, so the D/A (Die/Attach wafer) The attachment) process is an important process in the assembly and manufacturing process of the camera module. 81A and 81B are wafers and circuit boards after D/A process in conventional imaging. In the traditional camera module, a chip 501P is usually attached to a circuit board 502P, that is, a D/A process, that is, a thermosetting conductive adhesive or insulating adhesive is firstly coated on the circuit board surface 502P in a specific shape, such as glue Draw a dot or a cross or a cross shape in a manner, and then attach the chip 501P to the circuit board 502P. Through the pressing action during the attaching process, the glue is spread out, thereby adhering the wafer 501P. Finally, the glue is dried and cured by heating and baking, so that the wafer 501P is fixed on the surface of the circuit board 502P.

從這裡可以明顯地瞭解到，由於在粘貼的過程中，在所述線路板502P上塗布膠體503P，通過後續按壓所述晶片501P的方式使得二者結合，因此，不能在所述線路板502P上塗布太多膠體503P，以防擠壓溢出線路板側邊，污染所述線路板502P或所述晶片501P，也就是說，這個過程的膠體503P的量和形狀都不易被掌控。通常是按預定形狀，塗布較少量的膠體503P，以保證膠體不會溢出所述晶片501P邊緣。在所述線路板502P上預定且較少的膠體503P，粘接的結果是在所述晶片501P的和所述線路板502P相對的邊緣區域出現一懸空區504P，且通常四周都是所述懸空區504P。懸空區域504P的存在，很容易使得所述晶片501P出現傾斜現象，比如所述晶片501P和所述線路板502P存在一個夾角θ°，如圖81B中所示，另一方面，按壓後的膠體503P分佈不均勻，平整度較差，比如誤差在20μm左右，這些情況都會影響光學系統光軸的一致性，影響攝像模組的成像品質。另外，這樣粘接的晶片501P和所述線路板502P的粘接穩定性較差，也就是說，所述晶片501P很容易在外力的作用下脫離所述線路板502P，可靠性較差。 It can be clearly understood from this that since the colloid 503P is coated on the circuit board 502P during the pasting process, and the two are combined by pressing the wafer 501P subsequently, therefore, the circuit board 502P cannot be placed on the circuit board 502P. Too much colloid 503P is applied to prevent extrusion from overflowing the side of the circuit board and contaminating the circuit board 502P or the wafer 501P. That is to say, the amount and shape of the colloid 503P in this process cannot be easily controlled. Usually, a small amount of the colloid 503P is applied in a predetermined shape to ensure that the colloid does not overflow the edge of the wafer 501P. Predetermined and less glue 503P on the circuit board 502P, the result of bonding is that a floating area 504P appears in the edge area of the wafer 501P opposite to the circuit board 502P, and the floating area is usually surrounded by the floating area. District 504P. The existence of the floating area 504P can easily cause the wafer 501P to tilt. For example, there is an included angle θ° between the wafer 501P and the circuit board 502P, as shown in FIG. 81B . On the other hand, the pressed colloid 503P Uneven distribution and poor flatness. For example, the error is about 20μm. These conditions will affect the consistency of the optical axis of the optical system and affect the imaging quality of the camera module. In addition, the bonding stability of the wafer 501P and the circuit board 502P thus bonded is poor, that is, the wafer 501P is easily separated from the circuit board 502P under the action of external force, and the reliability is poor.

進一步，參照圖81C，MOC(Molding On Chip，模塑於晶片)工藝是近期發展起來一種重要的晶片組裝工藝，這種工藝的主要流程是，先將所述晶片501P貼附於所述線路板502P，而後打金線505P，繼而模塑一模塑支架506P於所述線路板502P和所述晶片501P，將所述晶片501P的邊緣和所述線路板502P的連接區域進行模塑封裝。在這種工藝過程中，進行模塑形成所述模塑支 架506P時，所述晶片501P的邊緣區域會受到模具的按壓作用，而通過傳統的D/A工藝的所述晶片501P和所述線路板502P之間存在所述懸空區504P，這種按壓很容易使得所述晶片501P出現傾斜問題，甚至由於受力的不均勻而使得所述晶片501P邊緣碎裂。因此為了保證較好光軸一致性以及晶片的可靠性，一方面需要所述晶片和所述線路板粘接平整，另一方面對於模塑工藝的按壓過程精度要其較高，可是這些仍舊不能完全解決傳統的D/A工藝對攝像模組帶來可能的光軸不一致、解析不良、曲線異常、馬達CODE異常等問題。 Further, referring to FIG. 81C , the MOC (Molding On Chip) process is an important chip assembly process developed recently. The main process of this process is to attach the chip 501P to the circuit board first. 502P, then gold wire 505P is formed, and then a molding bracket 506P is molded on the circuit board 502P and the chip 501P, and the edge of the chip 501P and the connection area of the circuit board 502P are molded and packaged. During this process, molding is performed to form the molding support When mounting 506P, the edge area of the wafer 501P will be pressed by the mold, and the dangling area 504P exists between the wafer 501P and the circuit board 502P through the traditional D/A process, which is very pressing. It is easy to cause the wafer 501P to have a tilt problem, and even the edge of the wafer 501P may be broken due to uneven force. Therefore, in order to ensure better optical axis consistency and reliability of the wafer, on the one hand, the wafer and the circuit board need to be bonded smoothly, and on the other hand, the precision of the pressing process of the molding process needs to be high, but these still cannot It completely solves the problems that the traditional D/A process may bring to the camera module, such as inconsistent optical axis, poor resolution, abnormal curve, abnormal motor CODE, etc.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述感光元件包括一封裝部和一感光部，所述封裝部封裝成型於所述感光部。 An object of the present invention is to provide a camera module, a photosensitive element, and a manufacturing method thereof, wherein the photosensitive element includes a packaging part and a photosensitive part, and the packaging part is packaged and molded on the photosensitive part.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述封裝部一體成型於所述感光部，以便於提供平整的安裝平面。 An object of the present invention is to provide a camera module, a photosensitive element, and a manufacturing method thereof, wherein the encapsulation portion is integrally formed with the photosensitive portion, so as to provide a flat installation plane.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述感光部包括一感光晶片和一線路板主體，所述感光晶片通過至少一連接線電連接於所述線路板主體，所述封裝部包覆所述連接線，使其不會直接暴露於外部。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the photosensitive portion includes a photosensitive chip and a circuit board body, and the photosensitive chip is electrically connected to the circuit board through at least one connecting wire The main body, and the encapsulation part wraps the connection wire so as not to be directly exposed to the outside.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述連接線被通過模塑的製造方式一體地包覆于所述封裝部內部。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the connecting wire is integrally wrapped inside the encapsulation part by a molding manufacturing method.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述感光元件包括至少一電路元件，所述電路元件被包覆于所述封裝部內，以使其不會直接暴露於外部。 An object of the present invention is to provide a camera module, a photosensitive element, and a manufacturing method thereof, wherein the photosensitive element includes at least one circuit element, and the circuit element is encapsulated in the encapsulation portion so as not to be directly exposed on the outside.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述電路元件被通過模塑的製造方式一體地包覆于所述封裝部內部。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the circuit element is integrally wrapped inside the encapsulation part by a molding manufacturing method.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述感光晶片具有一感光區和一非感光區，所述封裝部模塑於所述感光晶片的非感光區，減小所述感光元件以及由其組裝的攝像模組的長寬尺寸。 One object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the photosensitive chip has a photosensitive area and a non-photosensitive area, and the encapsulation part is molded in the non-photosensitive area of the photosensitive chip, The length and width of the photosensitive element and the camera module assembled by the photosensitive element are reduced.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述線路板主體具有一內凹槽，所述感光晶片被設置於所述內凹槽內，從而降低對所述封裝部的高度要求。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the circuit board main body has an inner groove, and the photosensitive wafer is arranged in the inner groove, thereby reducing the exposure to the The height requirement of the package part.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述封裝部包括一包覆段和一濾光片安裝段，所述濾光片安裝段一體模塑連接于所述包覆段，所述濾光片安裝段適於被安裝一濾光片，從而不需要提供額外的濾光片安裝支架。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the encapsulation part includes a covering section and a filter mounting section, and the filter mounting section is integrally molded and connected to the In the cladding section, the filter mounting section is adapted to be mounted with an optical filter, so that no additional filter mounting brackets need to be provided.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述封裝部包括一鏡頭安裝段，其一體地向上延伸，適於在其內部安裝一鏡頭。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the encapsulation portion includes a lens mounting section, which integrally extends upward and is suitable for mounting a lens therein.

本發明的一個目的在於提供一基於模塑工藝的感光元件和攝像模組及其製造方法，其中所述鏡頭安裝段具有螺紋，以便於螺接一鏡頭。 An object of the present invention is to provide a photosensitive element and a camera module based on a molding process and a manufacturing method thereof, wherein the lens mounting section has threads to facilitate screwing a lens.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述感光元件包括一濾光片，所述濾光片模塑地設置於所述感光晶片的上方，從而通過所述濾光片保護所述感光晶片，且能夠減小由其組裝的攝像模組的後焦距，使得攝像模組的高度更小。 An object of the present invention is to provide a camera module, a photosensitive element, and a manufacturing method thereof, wherein the photosensitive element includes a filter, and the filter is molded and disposed above the photosensitive wafer, so as to pass through the photosensitive wafer. The filter protects the photosensitive wafer, and can reduce the back focal length of the camera module assembled by the filter, so that the height of the camera module is smaller.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述感光元件包括一加固層，所述加固層疊層地連接於所述線路板主 體的底側，從而增加所述線路板主體的結構強度，以便於採用厚度更小的所述線路板主體，且能夠提高所述線路板主體的散熱能力。 An object of the present invention is to provide a camera module, a photosensitive element, and a manufacturing method thereof, wherein the photosensitive element includes a reinforcement layer, and the reinforcement layer is connected to the main circuit board in a layered manner. Therefore, the structural strength of the circuit board body is increased, so that the circuit board body with a smaller thickness can be used, and the heat dissipation capability of the circuit board body can be improved.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述線路主體上具有至少一加固孔，所述封裝部延伸進入所述加固孔，從而增強所述封裝部與所述感光元件之間的粘接力，並且增加所述線路板主體的結構強度。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the circuit body has at least one reinforcement hole, and the encapsulation portion extends into the reinforcement hole, so as to strengthen the connection between the encapsulation portion and all the reinforcement holes. The adhesive force between the photosensitive elements is improved, and the structural strength of the circuit board main body is increased.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述封裝部上適於被安裝一馬達或一鏡頭，可以作為傳統的支架，提供所述馬達或所述鏡頭的支撐固定位置，且借助所述封裝部的模塑成型優勢，具有較好的平整度，從而得到減小攝像膜元件組裝傾斜誤差。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein a motor or a lens is suitable for being mounted on the packaging portion, which can be used as a traditional bracket to provide the motor or the lens. The fixed position is supported, and by virtue of the molding advantage of the packaging part, the flatness is good, thereby reducing the inclination error of the camera film element assembly.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述攝像模組採用模塑的方式進行組裝製造，從而改變傳統的攝像模組COB工藝。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the camera module is assembled and manufactured by molding, thereby changing the traditional COB process of the camera module.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其採用模塑的方式製造所述感光線路元件，從而得到模塑、一體化的所述感光組件。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, which manufacture the photosensitive circuit element by molding, thereby obtaining the molded and integrated photosensitive assembly.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述感光元件包括一馬達連接結構，以便於連接馬達，從而改變傳統的馬達焊接方式。 One object of the present invention is to provide a camera module, a photosensitive element, and a manufacturing method thereof, wherein the photosensitive element includes a motor connection structure to facilitate the connection of the motor, thereby changing the traditional motor welding method.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述封裝部至少部分地一體封裝所述線路板主體和所述感光晶片，向內擴展所述封裝部的可設置位置，使得所述攝像模組的尺寸可以進一步減小。 An object of the present invention is to provide a camera module, a photosensitive element, and a manufacturing method thereof, wherein the encapsulation part at least partially encapsulates the circuit board body and the photosensitive chip integrally, and expands the disposition of the encapsulation part inwardly. position, so that the size of the camera module can be further reduced.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述封裝部至少部分地一體封裝所述線路板主體和所述感光晶片，使得所述感光晶片更加穩定地連接於所述線路板主體。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the encapsulation part at least partially encapsulates the circuit board body and the photosensitive chip integrally, so that the photosensitive chip is more stably connected to the the circuit board body.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述封裝部至少部分地一體封裝所述線路板主體和所述感光晶片，增大所述封裝部和所述感光部的連接面積，從而使得所述封裝部連接更加穩定。 An object of the present invention is to provide a camera module, a photosensitive element, and a manufacturing method thereof, wherein the encapsulation part at least partially encapsulates the circuit board body and the photosensitive chip integrally, so as to increase the size of the packaging part and the photosensitive chip. The connection area of the part is increased, so that the connection of the package part is more stable.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述封裝部和所述感光部的相互連接面積較大，增強所述感光部的結構強度。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the mutual connection area between the encapsulation part and the photosensitive part is large, and the structural strength of the photosensitive part is enhanced.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述感光元件適於製造多鏡片、高圖元攝像模組。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the photosensitive element is suitable for manufacturing a multi-lens, high-picture element camera module.

本發明的一個目的在於提供一攝像模組及其感光元件和製造方法，其中所述封裝部形成傾斜度可控的內側面，有助於減少雜散光反射於所述感光晶片，從而提高成像品質。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the encapsulation portion forms an inner side surface with a controllable inclination, which helps to reduce the reflection of stray light on the photosensitive wafer, thereby improving the imaging quality .

本發明的一個目的在於提供一攝像模組及其感光元件及其製造方法，其中所述攝像模組適於應用於實際生產過程，提高產品批量生產良率，減低生產成本。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the camera module is suitable for application in the actual production process, so as to improve the mass production yield and reduce the production cost.

本發明的一個目的在於提供一基於一體封裝工藝的攝像模組，採用線路板側面或底面模塑方案，能夠增強模組的受力強度。 One object of the present invention is to provide a camera module based on an integrated packaging process, which adopts the side or bottom side molding solution of the circuit board, which can enhance the force strength of the module.

本發明的另一目的在於提供一基於一體封裝工藝的攝像模組，採用線路板側面模塑方案，能夠增加線路板切割效率。 Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts the side molding solution of the circuit board, which can increase the cutting efficiency of the circuit board.

本發明的另一目的在於提供一基於一體封裝工藝的攝像模組，採用線路板側面模塑方案，使模組設計更加靈活。 Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts the side molding solution of the circuit board, so that the module design is more flexible.

本發明的另一目的在於提供一基於一體封裝工藝的攝像模組，採用線路板底部模塑方案，能夠增強模組結構強度。 Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts the bottom molding solution of the circuit board, which can enhance the structural strength of the module.

本發明的另一目的在於提供一基於一體封裝工藝的攝像模組，採用線路板側面或底面模塑方案，能夠提升模組散熱效率。 Another object of the present invention is to provide a camera module based on an integrated packaging process, which can improve the heat dissipation efficiency of the module by adopting the side or bottom side molding solution of the circuit board.

本發明的另一目的在於提供一基於一體封裝工藝的攝像模組，採用線路板側面或底面模塑方案，能夠提高模組的感光晶片表面和封裝部的上表面的平行度，以及封裝部上表面的平整度。 Another object of the present invention is to provide a camera module based on an integrated packaging process, adopting the side or bottom side molding solution of the circuit board, which can improve the parallelism between the photosensitive chip surface of the module and the upper surface of the packaging part, and the surface of the packaging part can be improved. The flatness of the surface.

本發明的另一目的在於提供一基於一體封裝工藝的攝像模組，採用線路板側面或底面模塑方案，能夠減少加工工序，提高生產效率。 Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts the side or bottom side molding solution of the circuit board, which can reduce the processing steps and improve the production efficiency.

本發明的另一目的在於提供一基於一體封裝工藝的攝像模組，採用線路板側面或底面模塑方案，能夠使模組整體尺寸更小。 Another object of the present invention is to provide a camera module based on an integrated packaging process, using the side or bottom side molding solution of the circuit board, which can make the overall size of the module smaller.

本發明的另一目的在於提供一基於一體封裝工藝的攝像模組，採用線路板側面或底面模塑方案，能夠防止模組成型後灰塵進入影響性能。 Another object of the present invention is to provide a camera module based on an integrated packaging process, which adopts the side or bottom side molding solution of the circuit board, which can prevent the dust from entering and affecting the performance after the module is formed.

本發明的一個目的在於提供一攝像模組及其製造方法，其中所述攝像模組提供一保護框，所述保護框被設置於感光晶片的感光區域的外周側，以在一一體封裝支架成型時，所述保護框阻止用於形成所述一體封裝支架的成形材料損壞所述感光晶片的感光區域。 One object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the camera module is provided with a protective frame, and the protective frame is disposed on the outer peripheral side of the photosensitive area of the photosensitive chip, so as to encapsulate the bracket in one piece During molding, the protective frame prevents the molding material used to form the one-piece package holder from damaging the photosensitive area of the photosensitive wafer.

本發明的一個目的在於提供一攝像模組及其製造方法，其中在所述一體封裝支架成型時，所述保護框阻止在所述一體封裝支架的內側出現“飛邊”的情況。 One object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the protective frame prevents the occurrence of "flashes" on the inner side of the integrated packaging bracket when the integrated packaging bracket is formed.

本發明的一個目的在於提供一攝像模組及其製造方法，其中所述保護框被設置於濾光元件的外周側，在所述一體封裝支架成型時，所述保護框阻止在所述一體封裝支架的內側出現“飛邊”的情況。 One object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the protective frame is disposed on the outer peripheral side of the filter element, and when the integrated packaging bracket is formed, the protective frame prevents the integrated packaging There is a "flash" on the inside of the bracket.

本發明的一個目的在於提供一攝像模組及其製造方法，其中所述保護框被凸起地設置於所述感光晶片的感光區域的外周側，用於成型所述一體封裝支架的成型模具施壓於所述保護框，以藉由所述保護框阻止所述成型模具直接與所述感光晶片接觸，從而避免所述感光晶片的感光區域受壓而被損壞或者被刮傷。 An object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the protective frame is protrudingly disposed on the outer peripheral side of the photosensitive area of the photosensitive wafer, and a molding die for molding the integrated packaging bracket is applied Press the protective frame to prevent the molding die from directly contacting the photosensitive wafer by the protective frame, so as to prevent the photosensitive area of the photosensitive wafer from being damaged or scratched due to pressure.

本發明的一個目的在於提供一攝像模組及其製造方法，其中所述保護框具有彈性以提供緩衝能力，在所述保護框受壓後能夠與所述成型模具充分接觸，以起到密封作用而隔離所述感光晶片的感光區域與外部環境，從而在所述一體封裝支架成型時避免所述感光晶片的感光區域受損。 An object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the protective frame has elasticity to provide buffering capability, and after the protective frame is pressed, it can fully contact the molding die to play a sealing role The photosensitive area of the photosensitive chip is isolated from the external environment, so as to avoid damage to the photosensitive area of the photosensitive chip when the integrated packaging bracket is formed.

本發明的一個目的在於提供一攝像模組及其製造方法，其中所述保護框具有彈性以提供緩衝能力，從而可以降低對所述攝像模組的平整度的要求，和降低所述攝像模組的各個機構的裝配要求。 One object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the protective frame has elasticity to provide buffering capability, so as to reduce the requirement on the flatness of the camera module and reduce the Assembly requirements for each mechanism.

本發明的一個目的在於提供一攝像模組及其製造方法，其中所述保護框在成型後被重疊地設置於所述感光晶片，以提高所述攝像模組的製造效率。 An object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the protective frame is disposed on the photosensitive wafer overlappingly after being formed, so as to improve the manufacturing efficiency of the camera module.

本發明的一個目的在於提供一攝像模組及其製造方法，其中所述成型模具的模具上部表面設有至少一覆蓋膜，在所述成型模具的模具上部施壓時，所述覆蓋膜也可以對所述感光晶片提供進一步保護，另外，所述覆蓋膜也可以增加脫模難度和增加密封性，以防止“飛邊”。 One object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the upper surface of the mold of the forming mold is provided with at least one cover film, and the cover film can also be pressed when the upper part of the mold of the forming mold is pressed. To provide further protection for the photosensitive wafer, in addition, the cover film can also increase the difficulty of demolding and increase the sealing to prevent "flash".

本發明的一個目的在於提供一攝像模組及其製造方法，其中所述成型模具對應於所述感光晶片的感光區域可以內凹設計，以使所述感光晶片的感光區域和所述成型模具之間具有安全距離，從而讓進一步降低對所述感光晶片的影響。 An object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the forming mold can be concavely designed corresponding to the photosensitive area of the photosensitive wafer, so that the photosensitive area of the photosensitive wafer and the forming mold can be concavely designed. There is a safe distance between them, so as to further reduce the impact on the photosensitive wafer.

本發明的一個目的在於提供一攝像模組及其製造方法，其中所述保護框被覆蓋一層保護膜，以便於將所述保護框設置於所述感光晶片，另外，所述保護膜也可以隔離所述感光晶片的感光區域和外部環境。 An object of the present invention is to provide a camera module and a manufacturing method thereof, wherein the protective frame is covered with a protective film, so that the protective frame can be placed on the photosensitive wafer, and the protective film can also be isolated The photosensitive area of the photosensitive wafer and the external environment.

本發明的一個目的在於提供一感光元件和攝像模組及其製造方法，所述感光元件包括一感光晶片和一線路板主體，所述感光晶片通過一連接介質連接於所述線路板主體，且所述連接介質和所述感光晶片形狀相匹配。 An object of the present invention is to provide a photosensitive element and a camera module and a manufacturing method thereof, the photosensitive element includes a photosensitive chip and a circuit board body, the photosensitive chip is connected to the circuit board body through a connecting medium, and The connection medium and the photosensitive wafer are matched in shape.

本發明的一個目的在於提供一感光元件和攝像模組及其製造方法，所述感光晶片和所述線路板主體之間區域通過所述連接介質完全填充，不存在懸空區域，從而提高所述感光晶片的平整度，減少出現所述感光晶片相對所述線路板主體的傾斜現象。 One object of the present invention is to provide a photosensitive element, a camera module and a manufacturing method thereof, the area between the photosensitive wafer and the circuit board body is completely filled by the connecting medium, and there is no suspended area, thereby improving the photosensitive The flatness of the wafer reduces the tilting phenomenon of the photosensitive wafer relative to the main body of the circuit board.

本發明的一個目的在於提供一感光元件和攝像模組及其製造方法，所述感光晶片具有一正面和一背面，在製造所述感光元件時，可以在所述感光晶片背面噴塗所述連接介質，且切除多餘的所述連接介質，使得所述連接介質和所述感光晶片的形狀相匹配。 One object of the present invention is to provide a photosensitive element, a camera module and a manufacturing method thereof. The photosensitive wafer has a front side and a back side. When manufacturing the photosensitive element, the connection medium can be sprayed on the backside of the photosensitive wafer. , and cut off the excess connection medium, so that the shape of the connection medium and the photosensitive wafer match.

本發明的一個目的在於提供一感光元件和攝像模組及其製造方法，在製造所述感光元件時，通過滾壓的方式施加所述連接介質於所述感光晶片的背面，且切除多餘的所述連接介質，使得所述連接介質平整地貼附於所述感光晶片背面，保證所述感光晶片和所述線路板主體的粘接平整性。 One object of the present invention is to provide a photosensitive element, a camera module and a manufacturing method thereof. When manufacturing the photosensitive element, the connecting medium is applied to the backside of the photosensitive wafer by rolling, and the excess parts are cut off. The connecting medium is used so that the connecting medium is evenly attached to the back of the photosensitive wafer, and the bonding flatness between the photosensitive wafer and the main body of the circuit board is ensured.

本發明的一個目的在於提供一感光元件和攝像模組及其製造方法，所述連接介質包括一線路板膜，所述線路板膜貼被附於所述線路板主體，所述線路板膜和所述感光晶片形狀相匹配。 An object of the present invention is to provide a photosensitive element and a camera module and a manufacturing method thereof, wherein the connecting medium includes a circuit board film, the circuit board film is attached to the circuit board main body, the circuit board film and The photosensitive wafers are matched in shape.

本發明的一個目的在於提供一感光元件和攝像模組及其製造方法，其中在製造所述感光元件時，可以在一整版晶片背面設置所述連接介質，而後對整板晶片進行裁切形成多個單獨所述感光晶片，進一步分別將多個所述 感光晶片貼附於對應的所述線路板主體，適宜批量化生產，縮短所述感光元件的組裝工時，提升晶片貼附生產效率。 One object of the present invention is to provide a photosensitive element, a camera module and a manufacturing method thereof, wherein when manufacturing the photosensitive element, the connecting medium can be arranged on the back of a full-scale wafer, and then the full-board wafer is cut to form a plurality of individual photosensitive wafers, and further separate a plurality of the photosensitive wafers The photosensitive wafer is attached to the corresponding main body of the circuit board, which is suitable for mass production, shortens the assembly time of the photosensitive element, and improves the production efficiency of wafer attachment.

本發明的一個目的在於提供一感光元件和攝像模組及其製造方法，其中所述感光元件包括一模塑體，一體成型於所述線路板和所述感光晶片，所述晶片平整地貼附於所述線路板主體，從而使得在形成所述模塑體時，不會使得所述感光晶片產生傾斜，以保證攝像模組光軸的一致性。 An object of the present invention is to provide a photosensitive element, a camera module and a manufacturing method thereof, wherein the photosensitive element comprises a molded body, which is integrally formed on the circuit board and the photosensitive wafer, and the wafer is flatly attached on the main body of the circuit board, so that when the molded body is formed, the photosensitive wafer will not be inclined, so as to ensure the consistency of the optical axis of the camera module.

為了實現本發明的以上目的以及本發明的其他目的和優勢，本發明的一方面提供一攝像模組的感光元件，其包括：一封裝部和一感光部；所述感光部包括一線路板主體和一感光晶片，所述封裝部封裝成型於所述線路板主體和所述感光晶片。 In order to achieve the above object of the present invention and other objects and advantages of the present invention, one aspect of the present invention provides a photosensitive element of a camera module, which includes: a packaging part and a photosensitive part; the photosensitive part includes a circuit board main body and a photosensitive chip, the encapsulation part is packaged and molded on the circuit board body and the photosensitive chip.

根據本發明的一實施例，所述的感光組件中所述封裝部形成一通孔，所述通孔與所述感光晶片相對，以提供所述感光晶片光線通路。 According to an embodiment of the present invention, a through hole is formed in the package portion of the photosensitive component, and the through hole is opposite to the photosensitive chip, so as to provide a light path for the photosensitive chip.

根據本發明的一實施例，所述的感光組件中所述封裝部的所述通孔的底部呈由下至上逐漸增大的傾斜狀。 According to an embodiment of the present invention, the bottom of the through hole of the encapsulation part in the photosensitive component is inclined gradually from bottom to top.

根據本發明的一實施例，所述的感光組件中所述封裝部頂端適於安裝所述攝像模組的鏡頭、馬達或濾光片。 According to an embodiment of the present invention, the top end of the encapsulation portion of the photosensitive component is suitable for installing a lens, a motor or a filter of the camera module.

根據本發明的一實施例，所述的感光組件中所述封裝部頂端呈平面狀，以用於安裝所述攝像模組的鏡頭、馬達或濾光片。 According to an embodiment of the present invention, the top of the encapsulation portion in the photosensitive component is flat, and is used for installing the lens, motor or filter of the camera module.

根據本發明的一實施例，所述的感光元件中所述封裝部頂端具有一安裝槽，所述安裝槽連通於所述通孔，以用於安裝所述攝像模組的濾光片、鏡頭或馬達。 According to an embodiment of the present invention, in the photosensitive element, the top of the package portion has an installation groove, and the installation groove is communicated with the through hole for installing the filter and lens of the camera module. or motor.

根據本發明的一實施例，所述的感光組件中所述封裝部包括一包覆段、一濾光片安裝段和一鏡頭安裝段，所述濾光片安裝段和所述鏡頭安裝段依次由所述包覆段向上模塑延伸，且內部呈臺階狀，以便於安裝所述攝像模組 的濾光片和鏡頭。根據本發明的一實施例，所述的感光元件中所述鏡頭安裝段具有一鏡頭內壁，所述鏡頭內壁表面平整，以適於安裝一無螺紋鏡頭。 According to an embodiment of the present invention, the encapsulation part in the photosensitive assembly includes a covering section, a filter mounting section and a lens mounting section, the filter mounting section and the lens mounting section are in sequence It is molded and extended upward from the covering section, and the interior is stepped, so as to facilitate the installation of the camera module filters and lenses. According to an embodiment of the present invention, the lens mounting section of the photosensitive element has a lens inner wall, and the surface of the lens inner wall is flat, so as to be suitable for mounting a screwless lens.

根據本發明的一實施例，所述的感光元件中所述鏡頭安裝段具有一鏡頭內壁，所述鏡頭內壁表面具有螺紋，以適於安裝一帶螺紋鏡頭。 According to an embodiment of the present invention, the lens mounting section of the photosensitive element has a lens inner wall, and the surface of the lens inner wall has threads, so as to be suitable for mounting a threaded lens.

根據本發明的一實施例，所述的感光組件中所述感光部包括至少一連接線，所述連接線電連接所述感光晶片和所述線路板主體，所述封裝部包覆所述連接線，以使得所述連接線不會直接暴露於外部。 According to an embodiment of the present invention, the photosensitive portion in the photosensitive assembly includes at least one connection wire, the connection wire electrically connects the photosensitive chip and the circuit board body, and the encapsulation portion covers the connection wire so that the connecting wire is not directly exposed to the outside.

根據本發明的一實施例，所述的感光組件中所述連接線選自組合：金線、銀線、銅線或鋁線中的一種。 According to an embodiment of the present invention, the connection wire in the photosensitive component is selected from the group consisting of a gold wire, a silver wire, a copper wire or an aluminum wire.

根據本發明的一實施例，所述的感光元件中所述連接線呈弧形地連接所述線路板主體和所述感光晶片。 According to an embodiment of the present invention, in the photosensitive element, the connection line connects the circuit board main body and the photosensitive wafer in an arc shape.

根據本發明的一實施例，所述的感光元件中所述感光晶片包括一感光區和一非感光區，所述非感光區圍繞於所述感光區週邊，所述封裝部模塑延伸至所述感光晶片的所述非感光區，以擴展所述封裝部向內的可模塑範圍，減小所述封裝部的週邊尺寸。 According to an embodiment of the present invention, in the photosensitive element, the photosensitive wafer includes a photosensitive area and a non-photosensitive area, the non-photosensitive area surrounds the periphery of the photosensitive area, and the encapsulation portion is molded to extend to the The non-photosensitive area of the photosensitive wafer is used to expand the inward moldable range of the packaging part and reduce the peripheral size of the packaging part.

根據本發明的一實施例，所述的感光元件中所述感光部包括至少一電路元件，所述電路元件凸出於所述線路板主體，所述封裝部包覆所述電路元件，以使得所述電路元件不會直接暴露於外部。 According to an embodiment of the present invention, in the photosensitive element, the photosensitive portion includes at least one circuit element, the circuit element protrudes from the circuit board body, and the encapsulation portion covers the circuit element, so that The circuit elements are not directly exposed to the outside.

根據本發明的一實施例，所述的感光元件中所述電路元件選擇組合：電阻、電容、二極體、三級管、電位器、繼電器和繼電器中的其中一種或多種。 According to an embodiment of the present invention, the circuit elements in the photosensitive element are selected in combination: one or more of resistors, capacitors, diodes, triodes, potentiometers, relays and relays.

根據本發明的一實施例，所述的感光組件中所述感光部包括一濾光片，所述濾光片覆蓋於所述感光晶片，所述封裝部成型於所述線路板主體、 所述感光晶片和所述濾光片，以便於通過所述濾光片防護所述感光晶片，且減小所述攝像模組的後焦距，使其高度減小。 According to an embodiment of the present invention, in the photosensitive component, the photosensitive portion includes a filter, the filter covers the photosensitive chip, and the encapsulation portion is formed on the circuit board body, The photosensitive wafer and the optical filter are used to protect the photosensitive wafer through the optical filter, and to reduce the back focal length of the camera module and reduce its height.

根據本發明的一實施例，所述的感光組件中所述感光部包括一加固層，所述加固層疊層設置於所述線路板主體底部，以增強所述線路板主體的結構強度。 According to an embodiment of the present invention, the photosensitive portion of the photosensitive assembly includes a reinforcement layer, and the reinforcement laminated layer is disposed at the bottom of the circuit board main body to enhance the structural strength of the circuit board main body.

根據本發明的一實施例，所述的感光組件中所述加固層為金屬板，以增強所述感光部的散熱性能。 According to an embodiment of the present invention, in the photosensitive assembly, the reinforcement layer is a metal plate, so as to enhance the heat dissipation performance of the photosensitive portion.

根據本發明的一實施例，所述的感光組件中所述感光部包括一遮罩層，所述遮罩層包裹所述線路板主體和所述封裝部，以增強所述感光元件的抗電磁干擾性能。 According to an embodiment of the present invention, in the photosensitive component, the photosensitive portion includes a mask layer, and the mask layer wraps the circuit board body and the encapsulation portion to enhance the electromagnetic resistance of the photosensitive element. interfere with performance.

根據本發明的一實施例，所述的感光組件中所述遮罩層為金屬板或金屬網。 According to an embodiment of the present invention, the mask layer in the photosensitive element is a metal plate or a metal mesh.

根據本發明的一實施例，所述的感光元件中線路板主體具有至少一加固孔，所述封裝部延伸進入所述加固孔，以便於增強所述線路板主體的結構強度。 According to an embodiment of the present invention, the circuit board body in the photosensitive element has at least one reinforcement hole, and the encapsulation portion extends into the reinforcement hole, so as to enhance the structural strength of the circuit board body.

根據本發明的一實施例，所述的感光組件中所述加固孔為凹槽狀。 According to an embodiment of the present invention, the reinforcing holes in the photosensitive element are groove-shaped.

根據本發明的一實施例，所述的感光組件中所述加固孔為通孔，以使得所述封裝部的模塑材料與所述線路板主體充分接觸，且易於製造。 According to an embodiment of the present invention, the reinforcing hole in the photosensitive component is a through hole, so that the molding material of the encapsulation part is sufficiently contacted with the circuit board main body, and it is easy to manufacture.

根據本發明的一實施例，所述的感光元件中所述線路板主體的材料可以選自組合：軟硬結合板、陶瓷基板、PCB硬板或FPC。 According to an embodiment of the present invention, the material of the circuit board body in the photosensitive element can be selected from a combination of: a rigid-flex board, a ceramic substrate, a rigid PCB board or an FPC.

根據本發明的一實施例，所述的感光組件中所述封裝部的材料選自組合：尼龍、LCP、PP或樹脂中的一種或多種。 According to an embodiment of the present invention, the material of the encapsulation portion in the photosensitive component is selected from a combination of one or more of nylon, LCP, PP or resin.

本發明的另一方面提供一攝像模組的感光元件的製造方法，其包括步驟：在一線路板主體和一感光晶片上封裝成型一封裝部。 Another aspect of the present invention provides a method for manufacturing a photosensitive element of a camera module, which includes the steps of: encapsulating and molding an encapsulation portion on a circuit board body and a photosensitive chip.

根據本發明的一實施例，所述的感光元件的製造方法中包括步驟：在一線路板主體貼附所述感光晶片，且通過至少一連接線電連接。 According to an embodiment of the present invention, the manufacturing method of the photosensitive element includes the steps of: attaching the photosensitive chip to a main body of a circuit board and electrically connecting it through at least one connecting wire.

根據本發明的一實施例，所述的感光元件的製造方法中包括步驟：通過所述封裝部包覆所述連接線。 According to an embodiment of the present invention, the manufacturing method of the photosensitive element includes the step of: wrapping the connecting wire by the encapsulating part.

根據本發明的一實施例，所述的感光元件的製造方法中包括步驟：延伸所述封裝部至所述感光晶片的一非感光區。 According to an embodiment of the present invention, the manufacturing method of the photosensitive element includes the step of extending the encapsulation portion to a non-photosensitive area of the photosensitive chip.

根據本發明的一實施例，所述的感光元件的製造方法中包括步驟：在所述封裝部頂端形成一安裝槽，以便於安裝一濾光片、馬達或鏡頭。 According to an embodiment of the present invention, the manufacturing method of the photosensitive element includes the step of: forming a mounting groove on the top of the package portion to facilitate mounting a filter, a motor or a lens.

根據本發明的一實施例，所述的感光元件的製造方法中包括步驟：向上延伸所述封裝部，且內部形成兩階臺階狀結構，以便於安裝濾光片或鏡頭。 According to an embodiment of the present invention, the manufacturing method of the photosensitive element includes the steps of: extending the encapsulation part upwards, and forming a two-step stepped structure inside to facilitate the installation of filters or lenses.

根據本發明的一實施例，所述的感光元件的製造方法中包括步驟：在所述封裝部內壁設置螺紋結構，以便於安裝帶螺紋的鏡頭。 According to an embodiment of the present invention, the manufacturing method of the photosensitive element includes the step of: disposing a threaded structure on the inner wall of the packaging part, so as to facilitate the installation of a threaded lens.

根據本發明的一實施例，所述的感光元件的製造方法中包括步驟：在所述線路板主體上設置至少一凹槽狀加固孔，並使所述封裝部延伸進入所述加固孔。 According to an embodiment of the present invention, the manufacturing method of the photosensitive element includes the steps of: disposing at least one groove-shaped reinforcement hole on the circuit board main body, and extending the encapsulation part into the reinforcement hole.

根據本發明的一實施例，所述的感光元件的製造方法中包括步驟：在所述線路板主體上設置至少一通孔狀加固孔，並使所述封裝部延伸進入所述加固孔。 According to an embodiment of the present invention, the manufacturing method of the photosensitive element includes the steps of: disposing at least one through-hole-shaped reinforcement hole on the circuit board main body, and extending the encapsulation part into the reinforcement hole.

根據本發明的一實施例，所述的感光元件的製造方法中包括步驟：在所述線路板主體底層貼附一加固層，以增強所述線路板主體的結構強度。 According to an embodiment of the present invention, the manufacturing method of the photosensitive element includes the step of: attaching a reinforcement layer to the bottom layer of the circuit board main body to enhance the structural strength of the circuit board main body.

根據本發明的一實施例，所述的感光元件的製造方法中包括步驟：在所述線路板主體和所述封裝部包覆一遮罩層，以增強所述感光元件的抗電磁干擾性能。 According to an embodiment of the present invention, the manufacturing method of the photosensitive element includes the step of: covering the circuit board main body and the packaging part with a mask layer to enhance the anti-electromagnetic interference performance of the photosensitive element.

本發明的另一方面提供一攝像模組的感光元件，其包括一封裝部和一感光部；所感光部包括一線路板主體、一感光晶片和一濾光片，所述封裝部封裝成型於所述線路板主體、所述感光晶片和所述濾光片。 Another aspect of the present invention provides a photosensitive element of a camera module, which includes an encapsulation part and a photosensitive part; the photosensitive part includes a circuit board body, a photosensitive chip and a filter, and the encapsulation part is encapsulated and molded in a The circuit board body, the photosensitive wafer and the filter.

本發明的另一方面提供一攝像模組的感光元件中所述封裝部具有一鏡頭安裝槽，所述鏡頭安裝槽連通於所述通孔，以便於為所述攝像模組的鏡頭或馬達提供安裝位置 Another aspect of the present invention provides a photosensitive element of a camera module, wherein the encapsulation part has a lens mounting groove, and the lens mounting groove is communicated with the through hole, so as to provide a lens or a motor of the camera module. Installation location

本發明的另一方面提供一攝像模組的感光元件的製造方法，其包括步驟：在一線路板主體、一感光晶片和一濾光片上封裝一封裝部。 Another aspect of the present invention provides a method for manufacturing a photosensitive element of a camera module, which includes the steps of: encapsulating an encapsulation portion on a circuit board body, a photosensitive chip and a filter.

根據本發明的另一實施例，所述的感光元件的製造方法中包括步驟：在一線路板主體貼附所述感光晶片，且通過至少一連接線電連接。 According to another embodiment of the present invention, the manufacturing method of the photosensitive element includes the steps of: attaching the photosensitive chip to a main body of a circuit board and electrically connecting it through at least one connecting wire.

根據本發明的另一實施例，所述的感光元件的製造方法中包括步驟：在所述感光晶片上覆蓋所述濾光片，以防護所述感光晶片。 According to another embodiment of the present invention, the method for manufacturing a photosensitive element includes the step of: covering the photosensitive wafer with the filter to protect the photosensitive wafer.

根據本發明的另一實施例，所述的感光元件的製造方法中包括步驟：通過所述封裝部包覆所述連接線和所述濾光片。 According to another embodiment of the present invention, the manufacturing method of the photosensitive element includes the step of: wrapping the connecting wire and the filter by the encapsulating part.

根據本發明的另一實施例，所述的感光元件的製造方法中包括步驟：延伸所述封裝部至所述濾光片邊緣。 According to another embodiment of the present invention, the manufacturing method of the photosensitive element includes the step of: extending the encapsulation part to the edge of the filter.

根據本發明的另一方面提供一攝像模組，其包括一所述的感光組件；和一鏡頭；所述鏡頭位於所述感光元件的所述感光晶片的感光路徑。 According to another aspect of the present invention, a camera module is provided, which includes the photosensitive component; and a lens; the lens is located on a photosensitive path of the photosensitive chip of the photosensitive element.

根據本發明的一實施例，所述的攝像模組包括一支架，所述支架被安裝於所述感光組件，所述鏡頭被安裝於所述支架。 According to an embodiment of the present invention, the camera module includes a bracket, the bracket is mounted on the photosensitive component, and the lens is mounted on the bracket.

根據本發明的一實施例，所述的攝像模組包括一馬達，所述鏡頭被安裝於所述馬達，所述馬達被安裝於所述感光組件。 According to an embodiment of the present invention, the camera module includes a motor, the lens is mounted on the motor, and the motor is mounted on the photosensitive component.

根據本發明的一實施例，所述的攝像模組包括一濾光片，所述濾光片被安裝於所述感光組件。 According to an embodiment of the present invention, the camera module includes a filter, and the filter is mounted on the photosensitive component.

根據本發明的一實施例，所述的攝像模組包括一濾光片，所述濾光片被安裝於所述支架。 According to an embodiment of the present invention, the camera module includes a filter, and the filter is mounted on the bracket.

101P:線路板 101P: circuit board

102P:感光晶片 102P: photosensitive chip

103P:支架 103P: Bracket

104P:濾光片 104P: Filter

105P:馬達 105P: Motor

106P:鏡頭 106P: Lens

501P:晶片 501P: Wafer

502P:線路板 502P: circuit board

506P:模塑支架 506P: Molded bracket

1021P:金線 1021P: Gold Wire

1011P:電路器件 1011P: Circuit Devices

1010:感光元件 1010: Photosensitive element

101:1封裝部 101:1 Packaging Department

1012:感光部 1012: Photosensitive Department

10122:線路板主體 10122: Main body of circuit board

10121:感光晶片 10121: Photosensitive wafer

10123:電路元件 10123: Circuit Components

101100:通孔 101100: Through hole

10124:連接線 10124: connecting line

10120:0內側面 10120:0 inner side

α:傾斜角 α: Inclination angle

101211:感光區 101211: photosensitive area

101212:非感光區 101212: Non-photosensitive area

10111:包覆段 10111:Clad segment

10112:濾光片安裝段 10112: Filter Mounting Section

101121:安裝槽 101121: Mounting slot

1030:鏡頭 1030: Lens

1011A:封裝部 1011A: Packaging Department

1012A:感光部 1012A: Photosensitive part

10122A:線路板主體 10122A: Main body of circuit board

10121A:感光晶片 10121A: Photosensitive wafer

101100A:通孔 101100A: Through hole

10124A:連接線 10124A: connecting wire

101211A:感光區 101211A: Photosensitive area

101212A:非感光區 101212A: Non-photosensitive area

10111A:包覆段 10111A: Cladding segment

10112A:濾光片安裝段 10112A: Filter Mounting Section

101121A:安裝槽 101121A: Mounting slot

101222A:下沉孔 101222A: Sink hole

1030A:鏡頭 1030A: Lens

1010B:感光組件 1010B: Photosensitive components

10100B:攝像模組 10100B: Camera Module

1011B:封裝部 1011B: Packaging Department

1012B:感光部 1012B: Photosensitive part

10122B:線路板主體 10122B: circuit board body

10121B:感光晶片 10121B: Photosensitive wafer

10123B:電路元件 10123B: Circuit Components

101100B:通孔 101100B: Through hole

10124B:連接線 10124B: connecting wire

101211B:感光區 101211B: photosensitive area

101212B:非感光區 101212B: Non-photosensitive area

1020B:濾光片 1020B: Filter

10125B:加固層 10125B: Reinforcement layer

1040B:馬達 1040B: Motor

1010C:感光組件 1010C: Photosensitive components

10100C:攝像模組 10100C: Camera Module

1011C:封裝部 1011C: Packaging Department

1012C:感光部 1012C: Photosensitive part

10122C:線路板主體 10122C: Circuit board body

10121C:感光晶片 10121C: Photosensitive wafer

10123C:電路元件 10123C: Circuit Components

101100C:通孔 101100C:Through Hole

10124C:連接線 10124C: connecting wire

101212C:非感光區 101212C: Non-photosensitive area

1020C:濾光片 1020C: Filter

1030C:鏡頭 1030C: Lens

10122D:線路板主體 10122D: circuit board body

10121D:感光晶片 10121D: Photosensitive wafer

10123D:電路元件 10123D: Circuit Components

101100D:通孔 101100D:Through Hole

10124D:連接線 10124D: connecting wire

1020D:濾光片 1020D: Filter

101211D:感光區 101211D: photosensitive area

101212D:非感光區 101212D: Non-photosensitive area

10111D:包覆段 10111D:Clad segment

10112D:濾光片安裝段 10112D: Filter Mounting Section

10113D:鏡頭安裝段 10113D: Lens Mounting Section

1030D:鏡頭 1030D: Lens

101131D:鏡頭安裝槽 101131D: Lens Mounting Slot

101132D:鏡頭內壁 101132D: Lens inner wall

10111D:包覆段 10111D:Clad segment

10112D:濾光片安裝段 10112D: Filter Mounting Section

10113D:鏡頭安裝段 10113D: Lens Mounting Section

10123D:電路元件 10123D: Circuit Components

10124D:連接線 10124D: connecting wire

101121D:安裝槽 101121D: Mounting slot

101131D:外安裝槽 101131D: External mounting slot

1011E:封裝部 1011E: Packaging Department

1012E:感光部 1012E: Photosensitive part

10122E:線路板主體 10122E: Circuit board body

10121E:感光晶片 10121E: Photosensitive wafer

10123E:電路元件 10123E: Circuit Components

101100E:通孔 101100E: Through hole

1020E:濾光片 1020E: Filter

101211E:感光區 101211E: photosensitive area

101212E:非感光區 101212E: Non-photosensitive area

10111E:包覆段 10111E:Clad segment

10113E:鏡頭安裝段 10113E: Lens Mounting Section

101131E:鏡頭安裝槽 101131E: Lens mounting slot

1010F:感光組件 1010F: photosensitive components

10100F:攝像模組 10100F: Camera Module

1011F:封裝部 1011F: Packaging Department

1012F:感光部 1012F: photosensitive part

10122F:線路板主體 10122F: circuit board body

10121F:感光晶片 10121F: Photosensitive wafer

10123F:電路元件 10123F: Circuit Components

101100F:通孔 101100F: Through hole

10124F:連接線 10124F: connecting wire

101211F:感光區 101211F: photosensitive area

101212F:非感光區 101212F: Non-photosensitive area

10111F:包覆段 10111F:Clad segment

10112F:濾光片安裝段 10112F: Filter Mounting Section

101121F:安裝槽 101121F: Mounting slot

101221F:加固孔 101221F: Reinforcement hole

1010G:感光組件 1010G: photosensitive components

1011G:封裝部 1011G: Packaging Department

1012G:感光部 1012G: photosensitive part

10122G:線路板主體 10122G: circuit board body

10121G:感光晶片 10121G: Photosensitive chip

10123G:電路元件 10123G: Circuit Components

101100G:通孔 101100G: Through hole

10124G:連接線 10124G: connecting line

101211G:感光區 101211G: photosensitive area

101212G:非感光區 101212G: Non-photosensitive area

10111G:包覆段 10111G:Clad segment

10112G:濾光片安裝段 10112G: Filter Mounting Section

1020G:濾光片 1020G: Filter

101121G:安裝槽 101121G: Mounting slot

101221G:加固孔 101221G: Reinforcement hole

10100H:攝像模組 10100H: Camera module

1010H:感光組件 1010H: Photosensitive component

1050H:支架 1050H: Bracket

1020H:濾光片 1020H: Filter

1030H:鏡頭 1030H: Lens

1011H:封裝部 1011H: Packaging Department

1012H:感光部 1012H: Photosensitive part

10122H:線路板主體 10122H: circuit board main body

10121H:感光晶片 10121H: Photosensitive wafer

10123H:電路元件 10123H: Circuit Components

101100H:通孔 101100H: Through hole

10124H:連接線 10124H: connecting wire

101211H:感光區 101211H: photosensitive area

101212H:非感光區 101212H: Non-photosensitive area

10126I:遮罩層 10126I: mask layer

1050:支架 1050: Bracket

101300:缺口 101300: Notch

1051:濾光片槽 1051: Filter slot

1052:延伸腿 1052: Extension Legs

10115:下包覆部 10115: Lower cladding

101223:第一板體 101223: The first plate body

101224:第二板體 101224: Second plate body

101225:導電介質 101225: Conductive medium

10127:保護層 10127: Protective layer

1227:基板 1227: Substrate

1228:電路 1228: Circuits

200:電子設備本體 200: electronic equipment body

300:電子設備 300: Electronic Equipment

2010:感光組件 2010: Photosensitive components

20100:攝像模組 20100: Camera Module

2011:封裝部 2011: Packaging Department

2012:感光部 2012: Photosensitive Department

20122:線路板主體 20122: Main body of circuit board

20121:感光晶片 20121: Photosensitive wafer

20123:電路元件 20123: Circuit Components

201100:通孔 201100: Through hole

20124:連接線 20124: Connecting Lines

201200:內側面 201200: inner side

201211:感光區 201211: Photosensitive area

201212:非感光區 201212: Non-photosensitive area

20111:包覆段 20111: Cladding segment

20112:濾光片安裝段 20112: Filter Mounting Section

2020:濾光片 2020: Filters

201121:安裝槽 201121: Mounting slot

2013:馬達連接結構 2013: Motor connection structure

2040:馬達 2040: Motor

2041:馬達引腳 2041: Motor pins

2013:1引線 2013: 1 lead

201311:馬達連接端 201311: Motor connector

20133:引腳槽 20133: Pin Slots

20135:引腳槽 20135: Pin Slots

20132:電路接點 20132: Circuit Contacts

20136:雕刻線路 20136: Engraving Lines

2030:鏡頭 2030: Lens

2011A:封裝部 2011A: Packaging Department

2012A:感光部 2012A: Photosensitive Department

20122A:線路板主體 20122A: Main body of circuit board

20121A:感光晶片 20121A: Photosensitive wafer

20123A:電路元件 20123A: Circuit Components

201100A:通孔 201100A: Through hole

20124A:連接線 20124A: Connecting line

201222A:內凹槽 201222A: Inner groove

201211A:感光區 201211A: Photosensitive area

201212A:非感光區 201212A: Non-photosensitive area

20111A:包覆段 20111A: Cladding segment

20112A:濾光片安裝段 20112A: Filter Mounting Section

2020A:濾光片 2020A: Filters

201121A:安裝槽 201121A: Mounting slot

2010B:感光元件 2010B: Photosensitive element

2011B:封裝部 2011B: Packaging Department

2012B:感光部 2012B: Photosensitive Department

20122B:線路板主體 20122B: Main body of circuit board

20121B:感光晶片 20121B: Photosensitive wafer

20123B:電路元件 20123B: Circuit Components

201100B:通孔 201100B: Through hole

201211B:感光區 201211B: Photosensitive area

201212B:非感光區 201212B: Non-photosensitive area

2020B:濾光片 2020B: Filters

20125B:加固層 20125B: Reinforcement layer

2030B:鏡頭 2030B: Lens

2040B:馬達 2040B: Motor

20122C:線路板主體 20122C: Main body of circuit board

20121C:感光晶片 20121C: Photosensitive wafer

20123C:電路元件 20123C: Circuit Components

201100C:通孔 201100C: Through hole

20124C:連接線 20124C: Connecting Line

201211C:感光區 201211C: Photosensitive area

201212C:非感光區 201212C: Non-photosensitive area

2020C:濾光片 2020C: Filters

2030C:鏡頭 2030C: Lens

2010F:感光組件 2010F: Photosensitive components

2011F:封裝部 2011F: Packaging Department

2012F:感光部 2012F: Photosensitive Department

20122F:線路板主體 20122F: PCB main body

20121F:感光晶片 20121F: Photosensitive wafer

20123F:電路元件 20123F: Circuit Components

201100F:通孔 201100F: Through hole

20124F:連接線 20124F: Connecting Line

201211F:感光區 201211F: photosensitive area

201212F:非感光區 201212F: Non-photosensitive area

20111F:包覆段 20111F: Cladding segment

20112F:濾光片安裝段 20112F: Filter Mounting Section

2020F:濾光片 2020F: Filters

201121F:安裝槽 201121F: Mounting slot

201221F:加固孔 201221F: Reinforcement hole

2010G:感光組件 2010G: Photosensitive components

2011G:封裝部 2011G: Packaging Department

2012G:感光部 2012G: Photosensitive Department

20122G:線路板主體 20122G: Main body of circuit board

20121G:感光晶片 20121G: Photosensitive wafer

20123G:電路元件 20123G: Circuit Components

201100G:通孔 201100G: Through hole

20124G:連接線 20124G: Connecting line

201211G:感光區 201211G: photosensitive area

201212G:非感光區 201212G: Non-photosensitive area

20111G:包覆段 20111G:Clad segment

20112G:濾光片安裝段 20112G: Filter Mounting Section

2020G:濾光片 2020G: Filters

201121G:安裝槽 201121G: Mounting slot

2040G:馬達 2040G: Motor

2030G:鏡頭 2030G: Lens

20126I:遮罩層 20126I: Mask Layer

3010:封裝感光組件 3010: Package photosensitive components

3020:濾光片 3020: Filter

3030:鏡頭 3030: Lens

3040:馬達 3040: Motor

30121:感光晶片 30121: Photosensitive wafer

30122:線路板 30122: circuit board

30123:電子元器件 30123: Electronic Components

30124:組引線 30124: Group Leads

3010’:封裝感光組件 3010': Package photosensitive components

3020’:濾光片 3020': filter

3030’:鏡頭 3030': Lens

3040’:馬達 3040’: Motor

3011’:封裝部 3011’: Packaging Department

3012’:感光組件 3012': photosensitive component

30121’:感光晶片 30121': photosensitive wafer

30122’:線路板 30122': circuit board

30123’:電子元器件 30123’: Electronic Components

30124’:引線 30124': lead

301222’:側面 301222’: side

301223’:底部 301223': bottom

3011A:封裝部 3011A: Packaging Department

3012A:感光組件 3012A: Photosensitive components

3020A:濾光片 3020A: Filter

3030:鏡頭 3030: Lens

30121A:感光晶片 30121A: Photosensitive wafer

30122A:線路板 30122A: Circuit board

30123A:電子元器件 30123A: Electronic Components

30124A:引線 30124A: Lead

3011A’:封裝部 3011A’: Package Department

30122A’:線路板 30122A': circuit board

30123A’:電子元器件 30123A’: Electronic components

301121A:間隙槽 301121A: Clearance slot

30125B:補強板 30125B: Reinforcing plate

301221B:頂面 301221B: Top surface

301221B:側面 301221B: Side

301222B:側面 301222B: Side

301131D’:容納槽 301131D’: Receiving slot

3011D’:封裝部 3011D’: Package Department

30121D’:線路板 30121D’: circuit board

3020F:濾光片 3020F: Filter

3030F:鏡頭 3030F: Lens

3040F:馬達 3040F: Motor

3011F:封裝部 3011F: Packaging Department

3012F:感光組件 3012F: Photosensitive components

30121F:感光晶片 30121F: Photosensitive wafer

30122F:線路板 30122F: circuit board

30123F:電子元器件 30123F: Electronic Components

30124F:引線 30124F: Leads

301222F:側面 301222F: Side

301101F:封裝部引腳 301101F: Package pin

301102F:內部導線 301102F: Internal lead

3041F:馬達引腳 3041F: Motor pins

1103G:凹槽通道 1103G: Groove channel

1231G:線路板引腳 1231G: Board pins

3060G:焊接點 3060G: Welding point

303011H:封裝部 303011H: Packaging Department

301103H:凹槽通道 301103H: Groove channel

3041H:馬達引腳 3041H: Motor pins

3060H:焊接點為 3060H: The welding point is

301102H:內部導線 301102H: Internal lead

30122H:線路板 30122H: Circuit board

4030:光學鏡頭 4030: Optical Lens

4010:感光晶片 4010: Photosensitive wafer

4060:保護框 4060: Protection box

4070:線路板 4070: circuit board

4050:一體封裝支架 4050: One-piece package bracket

4060:保護框 4060: Protection box

4010:感光晶片 4010: Photosensitive wafer

4070:線路板 4070: circuit board

4050:一體封裝支架 4050: One-piece package bracket

4040:鏡頭支撐體 4040: Lens Support

4020:濾光元件 4020: filter element

4051:貼裝平臺 4051: Mounting Platform

4080:膠合層 4080: Glue layer

40100:成型模具 40100: Forming Die

40101:模具上部 40101: Upper part of the mold

40102:凹槽 40102: Groove

40102:覆蓋膜 40102: Overlay

4090:保護膜 4090: Protective film

4030A:光學鏡頭 4030A: Optical Lens

4010A:感光晶片 4010A: Photosensitive wafer

4060A:保護框 4060A: Protective frame

4070A:線路板 4070A: circuit board

4050A:一體封裝支架 4050A: One-piece package bracket

4020A:濾光元件 4020A: Filter element

4040A:鏡頭支撐體 4040A: Lens Support

4040A:鏡頭支撐體 4040A: Lens Support

4070A:線路板 4070A: circuit board

4010A:感光晶片 4010A: Photosensitive wafer

4080A:膠合層 4080A: Glue Layer

501:感光元件 501: Photosensitive element

5011:線路板主體 5011: Main body of circuit board

5012:感光晶片 5012: Photosensitive wafer

5013:連接介質 5013: Connection medium

50121:正面 50121: Front

50122:背面 50122: Back

5014:連接線 5014: Connection line

50130:晶圓片 50130: Wafer

50140:切割膜 50140: Cutting film

5013:連接介質 5013: Connection medium

5010:感光組件 5010: Photosensitive components

5050:支架 5050: Bracket

5020:濾光片 5020: Filter

5030:鏡頭 5030: Lens

5040:馬達 5040: Motor

5015:模塑體 5015: Molded body

5010:感光組件 5010: Photosensitive components

5020:濾光片 5020: Filter

5030:鏡頭 5030: Lens

5040:馬達 5040: Motor

5016:電路元件 5016: Circuit Components

圖1是傳統COB工藝的攝像模組剖視圖。 FIG. 1 is a cross-sectional view of a camera module of a conventional COB process.

圖2是根據本發明的第一個優選實施例的感光組件的立體圖。 FIG. 2 is a perspective view of a photosensitive assembly according to the first preferred embodiment of the present invention.

圖3是根據本發明的第一個優選實施例的感光組件的剖視圖。 3 is a cross-sectional view of a photosensitive assembly according to a first preferred embodiment of the present invention.

圖4是根據本發明的第一個優選實施例的感光元件的製造過程示意圖。 FIG. 4 is a schematic diagram of the manufacturing process of the photosensitive element according to the first preferred embodiment of the present invention.

圖5是根據本發明的第一個優選實施例的感光元件的製造方法示意圖。 FIG. 5 is a schematic diagram of a manufacturing method of a photosensitive element according to the first preferred embodiment of the present invention.

圖6是根據本發明的第一個優選實施例的攝像模組剖視圖。 6 is a cross-sectional view of a camera module according to the first preferred embodiment of the present invention.

圖7是根據本發明的第一個優選實施例的攝像模組分解圖。 FIG. 7 is an exploded view of the camera module according to the first preferred embodiment of the present invention.

圖8是根據本發明的第一個優選實施例的另一攝像模組剖視圖。 8 is a cross-sectional view of another camera module according to the first preferred embodiment of the present invention.

圖9是根據本發明的第一個優選實施例的另一攝像模組的分解圖。 FIG. 9 is an exploded view of another camera module according to the first preferred embodiment of the present invention.

圖10A是根據本發明的第二個優選實施例的感光元件的剖視圖。 10A is a cross-sectional view of a photosensitive element according to a second preferred embodiment of the present invention.

圖10B是根據本發明的第二個優選實施例的變形實施方式。 Figure 10B is a variant embodiment according to the second preferred embodiment of the present invention.

圖11是根據本發明的第二個優選實施例的攝像模組剖視圖。 11 is a cross-sectional view of a camera module according to a second preferred embodiment of the present invention.

圖12是根據本發明的第三個優選實施例的感光組件的剖視圖。 12 is a cross-sectional view of a photosensitive assembly according to a third preferred embodiment of the present invention.

圖13是根據本發明的第三個優選實施例的攝像模組剖視圖。 13 is a cross-sectional view of a camera module according to a third preferred embodiment of the present invention.

圖14是根據本發明的第三個優選實施例的另一攝像模組剖視圖。 14 is a cross-sectional view of another camera module according to the third preferred embodiment of the present invention.

圖15是根據本發明的第四個優選實施例的感光組件的剖視圖。 15 is a cross-sectional view of a photosensitive assembly according to a fourth preferred embodiment of the present invention.

圖16是根據本發明的第四個優選實施例的感光元件製造方法示意圖。 FIG. 16 is a schematic diagram of a manufacturing method of a photosensitive element according to a fourth preferred embodiment of the present invention.

圖17是根據本發明的第四個優選實施例的攝像模組剖視圖。 17 is a cross-sectional view of a camera module according to a fourth preferred embodiment of the present invention.

圖18是根據本發明的第四個優選實施例的另一攝像模組剖視圖。 18 is a cross-sectional view of another camera module according to the fourth preferred embodiment of the present invention.

圖19A是根據本發明的第五個優選實施例的感光組件剖視圖。 19A is a cross-sectional view of a photosensitive assembly according to a fifth preferred embodiment of the present invention.

圖19B是根據本發明的第五個優選實施例的一變形實施方式。 FIG. 19B is a modified embodiment of the fifth preferred embodiment according to the present invention.

圖20A是根據本發明的第五個優選實施例的攝像模組剖視圖。 20A is a cross-sectional view of a camera module according to a fifth preferred embodiment of the present invention.

圖20B是根據本發明的第五個優選實施例的感光組件示意圖。 FIG. 20B is a schematic diagram of a photosensitive assembly according to the fifth preferred embodiment of the present invention.

圖21是根據本發明的第六個優選實施例的感光組件剖視圖。 21 is a cross-sectional view of a photosensitive assembly according to a sixth preferred embodiment of the present invention.

圖22是根據本發明的第六個優選實施例的攝像模組剖視圖。 22 is a cross-sectional view of a camera module according to a sixth preferred embodiment of the present invention.

圖23是根據本發明的第七個優選實施例的感光組件剖視圖。 23 is a cross-sectional view of a photosensitive assembly according to a seventh preferred embodiment of the present invention.

圖24是根據本發明的第七個優選實施例的感光元件分解圖。 24 is an exploded view of a photosensitive element according to a seventh preferred embodiment of the present invention.

圖25是根據本發明的第八個優選實施例的模組感光組件剖視圖。 25 is a cross-sectional view of a photosensitive assembly of a module according to an eighth preferred embodiment of the present invention.

圖26是根據本發明的第九個優選實施例的攝像模組剖視圖。 26 is a cross-sectional view of a camera module according to a ninth preferred embodiment of the present invention.

圖27是根據本發明的第十個優選實施例的攝像模組剖視圖。 27 is a cross-sectional view of a camera module according to a tenth preferred embodiment of the present invention.

圖28是根據本發明的第十一個優選實施例的感光元件示意圖。 28 is a schematic diagram of a photosensitive element according to an eleventh preferred embodiment of the present invention.

圖29是根據本發明的第十二個優選實施例的感光組件示意圖。 FIG. 29 is a schematic diagram of a photosensitive assembly according to a twelfth preferred embodiment of the present invention.

圖30是根據本發明的第十二優選實施例的感光元件的變形實施方式。 30 is a modified embodiment of the photosensitive element according to the twelfth preferred embodiment of the present invention.

圖31是根據本發明的第十三個優選實施例的感光組件示意圖。 FIG. 31 is a schematic diagram of a photosensitive assembly according to a thirteenth preferred embodiment of the present invention.

圖32A是根據本發明的第十四個優選實施例的感光組件示意圖。 32A is a schematic diagram of a photosensitive assembly according to a fourteenth preferred embodiment of the present invention.

圖32B是根據本發明的第十四個優選實施例的變形實施方式示意圖。 FIG. 32B is a schematic diagram of a variant embodiment according to the fourteenth preferred embodiment of the present invention.

圖33是根據本發明的上述優選實施例的組成的不同陣列攝像模組示意圖。 FIG. 33 is a schematic diagram of different array camera modules composed according to the above preferred embodiment of the present invention.

圖34是根據本發明的上述優選實施例的組成的另一陣列攝像模組示意圖。 FIG. 34 is a schematic diagram of another array camera module composed according to the above preferred embodiment of the present invention.

圖35是根據本發明的上述優選實施例的攝像模組應用示意圖。 FIG. 35 is a schematic diagram of the application of the camera module according to the above preferred embodiment of the present invention.

圖36A和36B是根據本發明的上述優選實施例的攝像模組的有益效果比較圖。 36A and 36B are comparative diagrams of the beneficial effects of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖37是根據本發明的第十六個優選實施例的感光組件的立體圖。 37 is a perspective view of a photosensitive assembly according to a sixteenth preferred embodiment of the present invention.

圖38是根據本發明的第十六個優選實施例的感光組件的剖視圖。 38 is a cross-sectional view of a photosensitive assembly according to a sixteenth preferred embodiment of the present invention.

圖39是根據本發明的第十六個優選實施例的感光元件的製造過程示意圖。 FIG. 39 is a schematic diagram of the manufacturing process of the photosensitive element according to the sixteenth preferred embodiment of the present invention.

圖40是根據本發明的第十六個優選實施例的感光元件的製造方法示意圖。 FIG. 40 is a schematic diagram of a method for manufacturing a photosensitive element according to a sixteenth preferred embodiment of the present invention.

圖41A、41B和圖41C是根據本發明的第十六個優選實施例的感光元件的馬達連接結構的不同實施方式示意圖。 41A, 41B and 41C are schematic views of different implementations of the motor connection structure of the photosensitive element according to the sixteenth preferred embodiment of the present invention.

圖42是根據本發明的第十六個優選實施例的攝像模組剖視圖。 42 is a cross-sectional view of a camera module according to a sixteenth preferred embodiment of the present invention.

圖43是根據本發明的第十六個優選實施例的攝像模組分解圖。 43 is an exploded view of a camera module according to a sixteenth preferred embodiment of the present invention.

圖44是根據本發明的第十六個優選實施例的另一攝像模組剖視圖。 44 is a cross-sectional view of another camera module according to the sixteenth preferred embodiment of the present invention.

圖45是根據本發明的第十六個優選實施例的另一攝像模組的分解圖。 45 is an exploded view of another camera module according to the sixteenth preferred embodiment of the present invention.

圖46是根據本發明的第十七個優選實施例的感光組件的剖視圖。 46 is a cross-sectional view of a photosensitive assembly according to a seventeenth preferred embodiment of the present invention.

圖47是根據本發明的第十七個優選實施例的攝像模組剖視圖。 47 is a cross-sectional view of a camera module according to a seventeenth preferred embodiment of the present invention.

圖48是根據本發明的第十八個優選實施例的感光組件的剖視圖。 48 is a cross-sectional view of a photosensitive assembly according to an eighteenth preferred embodiment of the present invention.

圖49是根據本發明的第十八個優選實施例的攝像模組剖視圖。 49 is a cross-sectional view of a camera module according to an eighteenth preferred embodiment of the present invention.

圖50是根據本發明的第十八個優選實施例的另一攝像模組剖視圖。 50 is a cross-sectional view of another camera module according to the eighteenth preferred embodiment of the present invention.

圖51是根據本發明的第十九個優選實施例的感光組件的剖視圖。 51 is a cross-sectional view of a photosensitive assembly according to a nineteenth preferred embodiment of the present invention.

圖52是根據本發明的第十九個優選實施例的感光元件製造方法示意圖。 FIG. 52 is a schematic diagram of a method for manufacturing a photosensitive element according to a nineteenth preferred embodiment of the present invention.

圖53是根據本發明的第十九個優選實施例的攝像模組剖視圖。 53 is a cross-sectional view of a camera module according to a nineteenth preferred embodiment of the present invention.

圖54是根據本發明的第十九個優選實施例的另一攝像模組剖視圖。 54 is a cross-sectional view of another camera module according to the nineteenth preferred embodiment of the present invention.

圖55是根據本發明的第二十個優選實施例的感光元件剖視圖。 55 is a cross-sectional view of a photosensitive element according to a twentieth preferred embodiment of the present invention.

圖56是根據本發明的第二十個優選實施例的感光元件分解圖。 56 is an exploded view of a photosensitive element according to a twentieth preferred embodiment of the present invention.

圖57是根據本發明的第二十一個優選實施例的模組感光元件剖視圖。 57 is a cross-sectional view of a photosensitive element of a module according to a twenty-first preferred embodiment of the present invention.

圖58是根據本發明的第二十一個優選優選實施的攝像模組剖視圖。 58 is a cross-sectional view of a camera module according to a twenty-first preferred embodiment of the present invention.

圖59是根據本發明的第二十二個優選實施例的攝像模組剖視圖。 59 is a cross-sectional view of a camera module according to a twenty-second preferred embodiment of the present invention.

圖60是根據本發明的一基於一體封裝工藝的攝像模組的一優選實施例的側面剖視圖。 60 is a side cross-sectional view of a preferred embodiment of a camera module based on an integrated packaging process according to the present invention.

圖61是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 61 is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖62A是對比技術形成的模塑形成攝像模組示意圖。 FIG. 62A is a schematic diagram of a molded camera module formed by a comparative technique.

圖62B是對比技術中傳統的模塑形成攝像模組示意圖。 FIG. 62B is a schematic diagram of a conventional camera module formed by molding in the comparative technology.

圖62C是對比技術中傳統的模塑形成攝像模組示意圖。 FIG. 62C is a schematic diagram of a conventional camera module formed by molding in the comparative technology.

圖62D是對比技術中傳統的模塑形成攝像模組示意圖。 FIG. 62D is a schematic diagram of a conventional molded camera module in the comparative technology.

圖62E是對比技術中傳統的模塑形成攝像模組示意圖。 FIG. 62E is a schematic diagram of a conventional camera module formed by molding in the comparative technology.

圖63A是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 63A is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖63B是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 63B is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖64是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 64 is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖65是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 65 is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖66A是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 66A is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖66B是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 66B is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖67A是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 67A is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖67B是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 67B is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖68A是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 68A is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖68B是根據本發明的一基於一體封裝工藝的攝像模組的另一實施例的側面剖視圖。 68B is a side cross-sectional view of another embodiment of a camera module based on an integrated packaging process according to the present invention.

圖69是根據本發明的一基於一體封裝工藝的攝像模組的上述實施例的馬達和線路板導通方式的側面剖視圖。 69 is a side cross-sectional view of the conduction mode between the motor and the circuit board of the above-mentioned embodiment of a camera module based on an integrated packaging process according to the present invention.

圖70是根據本發明的一基於一體封裝工藝的攝像模組的上述實施例的馬達和線路板另一種導通方式的側面剖視圖。 70 is a side cross-sectional view of another conduction mode of the motor and the circuit board of the above-mentioned embodiment of a camera module based on an integrated packaging process according to the present invention.

圖71是根據本發明的一基於一體封裝工藝的攝像模組的上述實施例的馬達和線路板另一種導通方式的側面剖視圖。 71 is a side cross-sectional view of another conduction mode between the motor and the circuit board of the above-mentioned embodiment of a camera module based on an integrated packaging process according to the present invention.

圖72是依本發明的一優選實施例的攝像模組被沿著中間位置剖開後的內部結構示意圖。 72 is a schematic diagram of the internal structure of the camera module according to a preferred embodiment of the present invention after being cut along the middle position.

圖73是依發明的上述優選實施例的攝像模組的線路板、感光晶片和保護框的結構關係立體示意圖。 73 is a perspective view showing the structural relationship among the circuit board, the photosensitive chip and the protection frame of the camera module according to the above preferred embodiment of the invention.

圖74A是依本發明的上述優選實施例的攝像模組的一製造過程之步驟一的剖視示意圖。 74A is a schematic cross-sectional view of step 1 of a manufacturing process of the camera module according to the above preferred embodiment of the present invention.

圖74B是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟二的剖視示意圖。 74B is a schematic cross-sectional view of step 2 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖74C是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟三的剖視示意圖。 74C is a schematic cross-sectional view of step 3 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖74D是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟四的剖視示意圖。 74D is a schematic cross-sectional view of step 4 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖74E是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟五的剖視示意圖。 74E is a schematic cross-sectional view of step 5 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖74F是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟六的剖視示意圖。 74F is a schematic cross-sectional view of step 6 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖75A是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟三的變形實施方式的剖視示意圖。 75A is a schematic cross-sectional view of a modified embodiment of step 3 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖75B是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟四的變形實施方式的剖視示意圖。 75B is a schematic cross-sectional view of a modified embodiment of step 4 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖76是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟四的另一變形實施方式的剖視示意圖。 76 is a schematic cross-sectional view of another modified embodiment of step 4 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖77A是依本發明的上述優選實施例的攝像模組的另一製造過程之步驟一的剖視示意圖。 77A is a schematic cross-sectional view of step 1 of another manufacturing process of the camera module according to the above preferred embodiment of the present invention.

圖77B是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟二的剖視示意圖。 77B is a schematic cross-sectional view of step 2 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖77C是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟三的剖視示意圖。 77C is a schematic cross-sectional view of step 3 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖77D是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟四的剖視示意圖。 77D is a schematic cross-sectional view of step 4 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖77E是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟五的剖視示意圖。 77E is a schematic cross-sectional view of step 5 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖77F是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟六的剖視示意圖。 77F is a schematic cross-sectional view of step 6 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖77G是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟七的剖視示意圖。 77G is a schematic cross-sectional view of step 7 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖78是依本發明的另一優選實施例的攝像模組被沿著中間位置剖開後的內部結構示意圖。 78 is a schematic diagram of the internal structure of the camera module according to another preferred embodiment of the present invention after being cut along the middle position.

圖79是依發明的上述優選實施例的攝像模組的線路板、感光晶片、濾光元件和保護框的結構關係立體示意圖。 79 is a perspective view showing the structural relationship of the circuit board, the photosensitive chip, the filter element and the protective frame of the camera module according to the above preferred embodiment of the invention.

圖80A是依本發明的上述優選實施例的攝像模組的一製造過程之步驟一的剖視示意圖。 80A is a schematic cross-sectional view of step 1 of a manufacturing process of the camera module according to the above preferred embodiment of the present invention.

圖80B是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟二的剖視示意圖。 80B is a schematic cross-sectional view of step 2 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖80C是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟三的剖視示意圖。 80C is a schematic cross-sectional view of step 3 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖80D是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟四的剖視示意圖。 80D is a schematic cross-sectional view of step 4 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖80E是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟五的剖視示意圖。 80E is a schematic cross-sectional view of step 5 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖80F是依本發明的上述優選實施例的攝像模組的上述製造過程之步驟六的剖視示意圖。 80F is a schematic cross-sectional view of step 6 of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the present invention.

圖80G是依本發明的上述優選實施例的攝像模組剖視示意圖。 80G is a schematic cross-sectional view of the camera module according to the above preferred embodiment of the present invention.

圖81A、81B、81C是傳統D/A工藝組裝的晶片和線路板。 81A, 81B, 81C are wafers and circuit boards assembled by conventional D/A process.

圖82是根據本發明的一個優選實施例的感光元件剖視示意圖。 82 is a schematic cross-sectional view of a photosensitive element according to a preferred embodiment of the present invention.

圖83是根據本發明的一個優選實施例的感光元件第一種製造過程示意圖。 FIG. 83 is a schematic diagram of the first manufacturing process of the photosensitive element according to a preferred embodiment of the present invention.

圖84是根據本發明的一個優選實施例的感光元件第一種製造方法框圖。 84 is a block diagram of a first method of manufacturing a photosensitive element according to a preferred embodiment of the present invention.

圖85是根據本發明的一個優選實施例的感光元件第二種製造過程示意圖。 85 is a schematic diagram of a second manufacturing process of a photosensitive element according to a preferred embodiment of the present invention.

圖86是根據本發明的一個優選實施例的感光元件第二種製造方法框圖。 FIG. 86 is a block diagram of a second method of manufacturing a photosensitive element according to a preferred embodiment of the present invention.

圖87A是根據本發明的一個優選實施例的感光元件第三種製造過程示意圖。 87A is a schematic diagram of a third manufacturing process of a photosensitive element according to a preferred embodiment of the present invention.

圖87B是根據本發明的一個優選實施例的感光元件的第四種製造過程示意圖。 FIG. 87B is a schematic diagram of a fourth manufacturing process of a photosensitive element according to a preferred embodiment of the present invention.

圖88是根據本發明的一個優選實施例的感光元件的第三種製造方法框圖。 88 is a block diagram of a third method of manufacturing a photosensitive element according to a preferred embodiment of the present invention.

圖89是根據本發明的一個優選實施例的應用所述感光元件的攝像模組剖視示意圖。 89 is a schematic cross-sectional view of a camera module using the photosensitive element according to a preferred embodiment of the present invention.

圖90是根據本發明的另一個優選實施例的感光元件剖視示意圖。 90 is a schematic cross-sectional view of a photosensitive element according to another preferred embodiment of the present invention.

圖91是根據本發明的另一個優選實施例的應用所述感光組件的攝像模組剖視示意圖。 91 is a schematic cross-sectional view of a camera module using the photosensitive component according to another preferred embodiment of the present invention.

以下描述用於揭露本發明以使本領域技術人員能夠實現本發明。以下描述中的優選實施例只作為舉例，本領域技術人員可以想到其他顯而易見的變型。在以下描述中界定的本發明的基本原理可以應用於其他實施方案、變形方案、改進方案、等同方案以及沒有背離本發明的精神和範圍的其他技術方案。 The following description serves to disclose the invention to enable those skilled in the art to practice the invention. The preferred embodiments described below are given by way of example only, and other obvious modifications will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

本領域技術人員應理解的是，在本發明的揭露中，術語“縱向”、“橫向”、“上”、“下”、“前”、“後”、“左”、“右”、“豎直”、“水準”、“頂”、“底”“內”、“外”等指示的方位或位置關係是基於附圖所示的方位或位置關係，其僅是為了便於描述本發明和簡化描述，而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作，因此上述術語不能理解為對本發明的限制。 It should be understood by those skilled in the art that in the disclosure of the present invention, the terms "portrait", "horizontal", "upper", "lower", "front", "rear", "left", "right", " The orientations or positional relationships indicated by vertical, horizontal, top, bottom, inside, and outside are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and The description is simplified rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus the above terms should not be construed as limiting the invention.

參照圖2至圖7，根據本發明的第一個優選實施例的感光組件和攝像模組被闡釋。所述感光元件1010用於組裝製造所述攝像模組。所述感光組件1010包括一封裝部1011和一感光部1012，所述封裝部1011一體封裝地連接於所述感光部1012，如模塑地連接於所述感光部1012。 2 to 7, a photosensitive assembly and a camera module according to a first preferred embodiment of the present invention are explained. The photosensitive element 1010 is used for assembling and manufacturing the camera module. The photosensitive component 1010 includes an encapsulation portion 1011 and a photosensitive portion 1012 , and the encapsulation portion 1011 is integrally encapsulated and connected to the photosensitive portion 1012 , such as being connected to the photosensitive portion 1012 by molding.

所述感光部1012包括一線路板主體10122和一感光晶片10121，所述感光晶片10121被設置於所述線路板主體10122上。根據本發明的這個實施例，所述感光晶片10121模塑地連接於所述線路板主體10122。特別地，所述封裝部1011以模塑於晶片的方式(Molding on Chip，MOC)模塑於所述感光部1012。 The photosensitive portion 1012 includes a circuit board body 10122 and a photosensitive wafer 10121 , and the photosensitive wafer 10121 is disposed on the circuit board body 10122 . According to this embodiment of the present invention, the photosensitive wafer 10121 is connected to the circuit board body 10122 by molding. In particular, the packaging portion 1011 is molded on the photosensitive portion 1012 by molding on a chip (MOC).

也就是說，所述封裝部1011至少部分地一體封裝所述線路板主體10122和所述感光晶片10121。 That is to say, the encapsulation part 1011 at least partially encapsulates the circuit board body 10122 and the photosensitive chip 10121 integrally.

根據本發明這個實施例，所述感光部1012包括一連接線路和至少一電路元件10123。所述連接線路預設於所述線路板主體10122，所述電路元件10123電連接於所述連接線路以及所述感光晶片10121，以供所述感光晶片10121的感光工作過程。所述電路元件10123被凸出地設置於所述線路板主體10122。所述電路元件10123可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 1012 includes a connecting line and at least one circuit element 10123 . The connection circuit is preset on the circuit board main body 10122 , and the circuit element 10123 is electrically connected to the connection circuit and the photosensitive chip 10121 for the photosensitive working process of the photosensitive chip 10121 . The circuit element 10123 is protrudingly disposed on the circuit board body 10122 . The circuit element 10123 can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.

值得一提的是，所述封裝部1011將所述電路元件10123包覆於其內部，因此使得所述電路元件10123不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片10121相通的環境中，從而當組裝所述攝像模組時，所述電路元件10123上不會沾染灰塵等污染物，也不會影響所述感光晶片10121，不同于傳統攝像模組中電路器件暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件10123表面，避免污染所述感光晶片10121而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation portion 1011 encapsulates the circuit element 10123 inside, so that the circuit element 10123 is not directly exposed to the space, more specifically, is not exposed to the The photosensitive chip 10121 is in the same environment, so that when the camera module is assembled, the circuit elements 10123 will not be contaminated with dust and other pollutants, and will not affect the photosensitive chip 10121, which is different from the circuit in the traditional camera module. Existing ways of device exposure, such as blocking the device, so as to prevent dust and debris from staying on the surface of the circuit element 10123 by molding and wrapping, to avoid contaminating the photosensitive chip 10121 and causing the camera module to appear black spots, etc. unpleasant sight.

所述封裝部1011一體成型於所述線路板主體10122和所述感光晶片10121的方式帶來諸多優勢，舉例地但不限於，第一，所述封裝部1011模塑一體成型於所述線路板主體10122和所述感光晶片10121，從而不需要像傳統COB模組中的所述支架3P粘接於所述線路板1P，節省畫膠空間，也不需要對所述封裝部1011進行AA調整；第二，所述封裝部1011模塑地一體成型於所述線路板主體10122和所述感光晶片10121，可以使得所述封裝部1011的表面平整性較好，優於傳統的注塑成型得到的所述支架3P的平整性；第三，所述封裝部1011模塑地一體成型於線路板主體10122和所感光晶片10121，使得所述封裝部1011的可成型或可設置區域向內擴展，從而使得所述攝像模組的整體尺寸向內壓縮，進一步提供所述攝像模組尺寸減小的可能範圍；第四，所述封裝部1011模塑地一體成型於所述線路板主體10122和所述感光晶片10121，使得所述所述感光晶片10121被所述封裝部1011更加穩定地固定於所述線路板主體10122，增加所述攝像模組的使用壽命；第五，所述封裝部1011模塑地一體成型於所述線路板主體10122和所述感光晶片10121，增大了所述封裝部1011和所述感光部1012整體的連接面積，從而使得所述封裝部1011連接更加穩定；第六，所述封裝部1011模塑地一體成型於所述線路板主體10122和所述感光晶片10121，使得所述封裝部1011和所述感光部1012的相互連接面積較大，從而通過所述封裝部1011增強所述感光部1012的結構強度；第七，所述封裝部1011模塑地一體成型於所述線路板主體10122和所述感光晶片10121的方式，使得所述感光組件1010能夠被應用於製造多鏡片、高圖元的攝像模組，使得模塑封裝工藝得以被應用於實際生產，適合現有的攝像模組各部件的發展需求；第八，所述封裝部1011模塑地一體成型於所述線路板主體10122的方式可以靈活地控制所述封裝部1011高度以及寬度，從而可以靈活控制所述攝像模組的後焦距大小，以及形成不同體積的模組，從而適應不同類型的攝像模組；第九，所述封裝部1011模塑 的一體成型於所述線路板主體10122，不需要膠水等連接介質，緊密地連接於所述線路板主體，增強所述線路板主體10122的結構強度，使得所述線路板主體10122的厚度可以進一步減小。 The way that the encapsulation part 1011 is integrally formed on the circuit board body 10122 and the photosensitive chip 10121 brings many advantages. For example, but not limited to, first, the encapsulation part 1011 is integrally formed on the circuit board. The main body 10122 and the photosensitive chip 10121 do not need to be bonded to the circuit board 1P like the bracket 3P in the traditional COB module, saving the space for drawing glue, and it does not need to perform AA adjustment on the packaging part 1011; Second, the encapsulation portion 1011 is integrally formed on the circuit board body 10122 and the photosensitive chip 10121 by molding, so that the surface of the encapsulation portion 1011 has better surface flatness, which is better than that obtained by traditional injection molding. The flatness of the bracket 3P; thirdly, the encapsulation part 1011 is integrally formed on the circuit board body 10122 and the photosensitive chip 10121 by molding, so that the moldable or settable area of the encapsulation part 1011 is expanded inward, so that the The overall size of the camera module is compressed inward, further providing a possible range for the size reduction of the camera module; fourth, the encapsulation portion 1011 is integrally formed on the circuit board body 10122 and the photosensitive chip 10121, so that the photosensitive chip 10121 is more stably fixed to the circuit board body 10122 by the packaging part 1011, and the service life of the camera module is increased; fifth, the packaging part 1011 is molded It is integrally formed on the circuit board main body 10122 and the photosensitive chip 10121, which increases the overall connection area of the packaging part 1011 and the photosensitive part 1012, thereby making the connection of the packaging part 1011 more stable; sixth, the The encapsulation part 1011 is integrally formed on the circuit board body 10122 and the photosensitive chip 10121 by molding, so that the interconnection area of the encapsulation part 1011 and the photosensitive part 1012 is larger, so that the packaging part 1011 enhances the The structural strength of the photosensitive portion 1012; seventh, the packaging portion 1011 is integrally formed with the circuit board body 10122 and the photosensitive wafer 10121, so that the photosensitive assembly 1010 can be used to manufacture multiple The camera module with lenses and high graphics elements enables the molding and packaging process to be applied to actual production, which is suitable for the development needs of various components of the existing camera module; eighth, the packaging part 1011 is integrally formed in the The way of the circuit board main body 10122 can flexibly control the height and width of the encapsulation portion 1011, so as to flexibly control the back focal length of the camera module, and form modules of different volumes, thereby adapting to different types of camera modules; Ninth, the encapsulation part 1011 is molded It is integrally formed on the circuit board main body 10122, and does not require a connecting medium such as glue, and is tightly connected to the circuit board main body, enhancing the structural strength of the circuit board main body 10122, so that the thickness of the circuit board main body 10122 can be further decrease.

還值得一提的是，攝像模組作為一種較小尺寸的產品，其組成部件尺寸都較小，因此任何小的區別可能對於攝像模組都會帶來較大的影響，因此這些變化，即使宏觀概念上較小，但是對於攝像模組的實際生產過程卻極其重要，甚至影響到是否可以將一個概念付諸於實際的生產過程。 It is also worth mentioning that the camera module is a product with a smaller size, and its components are all smaller in size, so any small difference may have a greater impact on the camera module, so these changes, even if the macro The concept is small, but it is extremely important to the actual production process of the camera module, and even affects whether a concept can be put into the actual production process.

還值得一提的是，攝像模組作為一個整體，其由眾多部件組成，如感光晶片、鏡頭、馬達等，這些部件相互適應。也就是說，各部件的發展並不是獨立的，而是相關的，比如圖元的提高，與感光晶片有關，也與鏡頭有關，而鏡頭需要安裝條件，與支撐部件有關。在這種實際的生產發展狀態中，早期的感光晶片的性能較低，鏡頭的鏡片數量也減少，比如可能只有一片、兩片，因此相應地對於支架的要求也較低，平整性、電子器件的暴露以及尺寸的大小等因素對攝像模組整體的影響並不是主要的考慮因素，更重要的在於基本硬體，如感光晶片和所述鏡頭的性能等的提升，而對於現階段的攝像模組，尤其是對應智慧手機快速發展階段的攝像模組，對其圖元、尺寸、精度等各方面的要求不斷提升，比如鏡片數量達到4片、5片、6片、7片等，這種需求也使得攝像模組的發展越來越細節化，比如本發明中的所述封裝部1011一體封裝所述線路板主體10122和所述感光晶片10121的方式，可能對於1片或者2片鏡片的鏡頭構成的攝像模組來說，並不需要進行這樣改進，或者這種改進並不能顯現其優勢，可是對於由較多鏡片的鏡頭構成的攝像模組來說，這種改進則成為一種適合發展趨勢的改進，可以使其優勢得以顯現，因此更適於投入實際的生產過程。且另一方面，在實際生產過程中一個重要因素是產品良率，也就是說產品在批量化生產時表現出來的整體性能的穩定性，而對於本發明實施例的 攝像模組，相對傳統COB的結構的攝像模組，其產品良率得到明顯提升，因此即使同樣大小的攝像模組，本發明的攝像模組也具有其優勢，適於批量化生產，降低生產成本，適於整個攝像模組行業的發展區域。當然，所述封裝部1011一體封裝所述線路板主體10122和所述感光晶片10121的方式，還具有其他更多優勢，在此不再一一列舉。 It is also worth mentioning that the camera module as a whole is composed of many components, such as a photosensitive chip, a lens, a motor, etc., and these components are adapted to each other. That is to say, the development of each component is not independent, but related. For example, the improvement of graphics elements is related to the photosensitive chip and the lens. The lens requires installation conditions and is related to the supporting components. In this actual production development state, the performance of the early photosensitive wafers is low, and the number of lenses of the lens is also reduced, for example, there may be only one or two lenses, so the requirements for the bracket are correspondingly lower, flatness, electronic devices The influence of factors such as exposure and size on the overall camera module is not the main consideration, but more important is the improvement of basic hardware, such as the performance of the photosensitive chip and the lens, and for the current camera module In particular, the camera modules corresponding to the rapid development stage of smart phones have continuously increased requirements for their graphic elements, size, accuracy, etc., for example, the number of lenses reaches 4, 5, 6, 7, etc. The demand also makes the development of the camera module more and more detailed. For example, the packaging part 1011 in the present invention integrally encapsulates the circuit board body 10122 and the photosensitive chip 10121 may be suitable for one or two lenses. For the camera module composed of lenses, such improvement is not required, or the improvement does not show its advantages, but for the camera module composed of lenses with more lenses, this improvement has become a suitable development. The improvement of the trend can make its advantages appear, so it is more suitable for the actual production process. On the other hand, an important factor in the actual production process is the product yield, that is to say, the stability of the overall performance of the product during mass production. Compared with the camera module of the traditional COB structure, the camera module has a significantly improved product yield, so even if the camera module of the same size, the camera module of the present invention has its advantages, is suitable for mass production, reduces production The cost is suitable for the development area of the entire camera module industry. Certainly, the manner in which the encapsulation part 1011 integrally encapsulates the circuit board body 10122 and the photosensitive chip 10121 has other advantages, which will not be listed here.

值得一提的是，在本發明的這個實施例中，以所述電路元件10123凸出於所述線路板主體10122為例進行說明，而在本發明的其他實施例中，所述電路元件10123可以被埋設於所述線路板主體10122而不凸出於所述線路板主體10122，或者被貼裝於所述線路板主體10122的背面，本領域的技術人員應當理解的是，所述電路元件10123的形狀、類型以及設置位置並不是本發明的限制。 It is worth mentioning that in this embodiment of the present invention, the circuit element 10123 protrudes from the circuit board main body 10122 is taken as an example for description, while in other embodiments of the present invention, the circuit element 10123 Can be embedded in the circuit board body 10122 without protruding from the circuit board body 10122, or mounted on the back of the circuit board body 10122, those skilled in the art should understand that the circuit element The shape, type and arrangement position of 10123 are not limitations of the present invention.

所述封裝部1011形成一通孔101100，以便於為所述感光晶片10121提供感光路徑。 A through hole 101100 is formed in the package portion 1011 so as to provide a photosensitive path for the photosensitive chip 10121 .

也就是說，所述封裝部1011提供一光窗，為所述感光晶片10121提供光線通路，從而使得經過位於所述封裝部1011上方的所述鏡頭1030(後續提出)的光線能夠到達所述感光晶片10121，而不被所述封裝部1011阻擋。 That is to say, the encapsulation part 1011 provides a light window to provide a light path for the photosensitive chip 10121, so that the light passing through the lens 1030 (described later) located above the encapsulation part 1011 can reach the photosensitive chip 10121 The wafer 10121 is not blocked by the package portion 1011 .

根據本發明的這個優選實施例，所述感光部1012包括至少一連接線10124，用於電連接所述感光晶片10121和所述線路板主體10122。進一步，所述連接線10124可以被實施為，具例地但不必限於，金線、銅線、鋁線、銀線等。特別地，所述連接線10124呈弧形地連接所述感光晶片10121和所述線路板主體10122。 According to this preferred embodiment of the present invention, the photosensitive portion 1012 includes at least one connecting wire 10124 for electrically connecting the photosensitive wafer 10121 and the circuit board main body 10122 . Further, the connecting wires 10124 may be implemented as, by way of example but not necessarily limited to, gold wires, copper wires, aluminum wires, silver wires, and the like. In particular, the connecting wire 10124 connects the photosensitive wafer 10121 and the circuit board main body 10122 in an arc shape.

值得一提的是，所述連接線10124被模塑于所述封裝部1011內部，從而可以借助所述封裝部1011將所述連接線10124進行包覆，而不會直接暴露於外部，從而在組裝所述攝像模組時，使得所述連接線10124不會受到任 何的碰觸損傷，同時減少環境因素對所述連接線10124的影響，如溫度，使得所述感光晶片10121和所述線路板主體10122之間的通訊連接穩定，這一點是完全不同于現有技術的。 It is worth mentioning that the connecting wire 10124 is molded inside the encapsulation part 1011, so that the connecting wire 10124 can be covered by the encapsulation part 1011 without being directly exposed to the outside. When assembling the camera module, the connecting wire 10124 will not be affected by any Any contact damage, while reducing the influence of environmental factors on the connecting wire 10124, such as temperature, makes the communication connection between the photosensitive chip 10121 and the circuit board main body 10122 stable, which is completely different from the prior art. of.

優選地，所述封裝部1011的所述通孔101100的底部呈由下至上逐漸增大的傾斜狀，但此形狀並不理解為限制本發明。 Preferably, the bottom of the through hole 101100 of the encapsulation part 1011 has an inclined shape that gradually increases from bottom to top, but this shape is not to be understood as limiting the present invention.

所述封裝部1011具有一內側面101200，所述內側面101200環繞形成所述通孔101100。所述內側面101200傾斜地設置，以使得所述通孔101100呈由下至上逐漸增大的傾斜狀。具體地，所述內側面101200具有一傾斜角α，即所述內側面101200的傾斜方向與垂直方向的夾角。 The package portion 1011 has an inner side surface 101200 , and the inner side surface 101200 forms the through hole 101100 around the inner side surface 101200 . The inner side surface 101200 is disposed obliquely, so that the through hole 101100 is inclined gradually increasing from bottom to top. Specifically, the inner side surface 101200 has an inclination angle α, that is, the included angle between the inclination direction of the inner side surface 101200 and the vertical direction.

值得一提的是，所述封裝部1011通過一成型模具(後續提出)一體成型製造，在所述封裝部1011成型後，所述成型模具需要脫離所述感光元件1010，即，拔模過程。由於成型模具與所述封裝部1011之間的相互作用力，比如擠壓力、摩擦力等，使得所述成型模具在拔出過程中，一方面所述成型模具很難拔出，另一方面，影響所述封裝部1011的成型形狀，出現毛刺，甚至更嚴重的現象，這些問題嚴重困擾實際生產，使得產品良率極低，而在本發明中，所述封裝部1011傾斜地設置，使得所述成型模具只要與所述封裝部1011產生一定位移，所述封裝部1011就會與成型模具之間產生間隙，從而減小所述成型模具對所述封裝部1011的影響，使得所述攝像模組得以投入實際的批量生產應用。值得注意的是，這些較小的設計點的改進，需要經過長久的實驗過程才能得到，且對於一個理論上看似可行的方案到是否可以投入生產之間的一些決定因素可能就是這些不易察覺的小改進。 It is worth mentioning that the encapsulation portion 1011 is integrally formed by a molding die (described later). After the encapsulation portion 1011 is formed, the molding die needs to be separated from the photosensitive element 1010 , that is, a mold release process. Due to the interaction force between the molding die and the encapsulation part 1011, such as extrusion force, frictional force, etc., during the pulling out process of the molding die, on the one hand, the molding die is difficult to pull out, and on the other hand , affecting the molding shape of the encapsulation part 1011, causing burrs, or even more serious phenomena, these problems seriously trouble the actual production, so that the product yield is extremely low, and in the present invention, the encapsulation part 1011 is arranged obliquely, so that all the As long as the molding die has a certain displacement with the packaging part 1011, a gap will be generated between the packaging part 1011 and the molding die, thereby reducing the influence of the molding die on the packaging part 1011, so that the camera mold The group was able to put into practical mass production applications. It is worth noting that improvements to these smaller design points require a long-term experimental process, and some of the determining factors between a theoretically plausible solution and whether it can be put into production may be these imperceptible factors. Small improvement.

所述傾斜角α的大小可以根據實際需求設計。 The size of the inclination angle α can be designed according to actual requirements.

所述封裝部1011的所述內側面101200的設置，以及所述內側面101200的傾斜結構存在諸多優勢，舉例地但不限於，第一，所述內側面101200 傾斜地設置適於實際生產的拔模過程，減少所述封裝部1011的毛刺並且使其得以投入實際生產應用；第二，所述內側面101200的設置，增大了所述鏡頭封閉的內空間的空氣直接接觸面積，且由於所述封裝部1011的一體成型材料特性的影響，從而使得內空間內的微塵更易於停留在所述封裝部1011的所述內側面101200，即，具有捕捉微塵的作用；第三，所述內側面101200傾斜的設置，改變進入的光線在所述內側面101200上的反射角度，減少雜散光反射至所述感光晶片10121的感光區，減少雜散光對成像品質的影響；第四，所述內側面101200傾斜地設置，所述封裝部1011的上埠增大，增加所述感光晶片10121的進光量。 The arrangement of the inner side surface 101200 of the packaging part 1011 and the inclined structure of the inner side surface 101200 have many advantages, for example but not limited to, first, the inner side surface 101200 The drafting process suitable for actual production is set obliquely, which reduces the burrs of the encapsulation part 1011 and enables it to be put into practical production applications; secondly, the setting of the inner side surface 101200 increases the inner space enclosed by the lens. The air directly contacts the area, and due to the influence of the characteristics of the integral molding material of the packaging part 1011, the dust in the inner space is more likely to stay on the inner side 101200 of the packaging part 1011, that is, it has the function of capturing the dust Third, the inclined setting of the inner side 101200 changes the reflection angle of the incoming light on the inner side 101200, reduces the reflection of stray light to the photosensitive area of the photosensitive wafer 10121, and reduces the influence of stray light on the imaging quality Fourth, the inner side surface 101200 is arranged obliquely, and the upper port of the encapsulation portion 1011 is enlarged to increase the light input amount of the photosensitive chip 10121.

本發明的一個目的在於提供一攝像模組及其感光元件及其製造方法，其中所述攝像模組適於應用於實際生產過程，提高產品批量生產良率，降低生產成本。 An object of the present invention is to provide a camera module, a photosensitive element and a manufacturing method thereof, wherein the camera module is suitable for application in the actual production process, so as to improve the mass production yield and reduce the production cost.

值得一提的是，所述封裝部1011包覆所述電路元件10123和所述連接線10124，具有保護所述電路元件10123和所述連接線10124及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部1011不限於包覆所述電路元件10123或所述連接線10124。也就是說，在本發明的其他實施例中，所述封裝部1011可以直接模塑於沒有凸出的所述電路元件10123的所述線路板主體10122，也可以是模塑於所述電路元件10123外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 1011 covers the circuit element 10123 and the connecting wire 10124, and has the aspects of protecting the circuit element 10123 and the connecting wire 10124 and the camera module for obtaining better performance. However, those skilled in the art should understand that the encapsulation part 1011 is not limited to encapsulating the circuit elements 10123 or the connection wires 10124 . That is, in other embodiments of the present invention, the encapsulation portion 1011 may be directly molded on the circuit board body 10122 of the circuit element 10123 without protruding, or may be molded on the circuit element 10123 outside, around and other different locations.

進一步，所述感光晶片10121具有一感光區101211和一非感光區101212，所述非感光區101212環繞於所述感光區101211週邊。所述感光區101211用於進行感光作用，所述連接線10124連接於所述非感光區101212。 Further, the photosensitive wafer 10121 has a photosensitive area 101211 and a non-photosensitive area 101212 , and the non-photosensitive area 101212 surrounds the periphery of the photosensitive area 101211 . The photosensitive area 101211 is used for photosensitive action, and the connection line 10124 is connected to the non-photosensitive area 101212 .

根據本發明的這個優選實施例，所述封裝部1011延伸於所述感光晶片10121的所述非感光區101212，從而將所述感光晶片10121通過模塑的方 式疊層固定於所述線路板主體10122。通過這樣的方式，如模塑於晶片的方式(Molding on Chip，MOC)擴大了所述封裝部1011向內的可模塑範圍，從而可以減小所述線路板主體10122以及所述封裝部1011的外側的結構性部分，進一步減小所述感光元件1010的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 1011 extends from the non-photosensitive area 101212 of the photosensitive wafer 10121, so that the photosensitive wafer 10121 is passed through the molding process. The type stack is fixed to the circuit board main body 10122 . In this way, the inward molding range of the packaging part 1011 can be expanded, such as molding on a chip (MOC), so that the circuit board body 10122 and the packaging part 1011 can be reduced in size The outer structural part of the photosensitive element 1010 further reduces the length and width dimensions of the photosensitive element 1010 and reduces the length and width dimensions of the camera module assembled by it.

在本發明的這個實施例中，所述封裝部1011凸起地圍繞於所述感光晶片10121的所述感光區101211外側，特別地，所述封裝部1011一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件1010被用於組裝所述攝像模組時，所述感光晶片10121被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 1011 protrudes around the outside of the photosensitive area 101211 of the photosensitive wafer 10121, and in particular, the encapsulation portion 1011 is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so when the photosensitive element 1010 is used to assemble the camera module, the photosensitive wafer 10121 is sealed inside to form a closed inner space.

具體地，在製造所述感光元件1010時，可以選取一傳統的線路板作為所述線路板主體10122，在所述線路板主體10122上設置一所述感光晶片10121，將所述感光晶片10121通過所述連接線10124電連接，進而在初步組裝後的所述線路板主體10122和感光晶片10121部件上進行模塑，比如用半導體封裝中常用的模壓工藝(Molding)形成所述封裝部1011，或所述線路板主體10122可以選擇為用注塑機，通過嵌入成型(Insert Molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部1011，所述線路板主體10122可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)等。所述封裝部1011形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部1011可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用熱熔性樹脂或熱固性樹脂。本領域技術人員應當理解的 是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 1010, a conventional circuit board can be selected as the circuit board body 10122, a photosensitive wafer 10121 is set on the circuit board body 10122, and the photosensitive wafer 10121 is passed through The connecting wires 10124 are electrically connected, and then molding is performed on the circuit board main body 10122 and the photosensitive wafer 10121 after preliminary assembly, for example, the packaging portion 1011 is formed by a molding process commonly used in semiconductor packaging, or The circuit board main body 10122 can be selected to use an injection molding machine to mold the circuit board after the SMT process (Surface Mount Technology) through the Insert Molding process to form the package portion 1011, and the package portion 1011 is formed. The circuit board body 10122 can be selected as, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a PCB rigid board (without a flex board), and the like. The manner in which the encapsulation part 1011 is formed may be selected from, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the encapsulation part 1011 are, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and heat can be used for the molding process. Melting resin or thermosetting resin. It should be understood by those skilled in the art Yes, the aforementioned optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation modes of the present invention, and are not intended to limit the present invention.

值得一提的是，基於本發明的所述感光組件1010的模塑成型的方式，所述感光元件1010更適合拼版作業，一次完成較多量的所述感光元件1010的製造，比如可以達到90個，而傳統的注塑封裝部，即鏡座，需要先塗畫膠水，並且一般一次只能貼裝一個，在注塑過程中一般一次性生產4-8個，最多只能生產32個。 It is worth mentioning that, based on the molding method of the photosensitive element 1010 of the present invention, the photosensitive element 1010 is more suitable for imposition operations, and a large number of the photosensitive elements 1010 can be manufactured at one time, for example, up to 90 , while the traditional injection molding package, that is, the mirror base, needs to be painted with glue first, and generally only one can be mounted at a time. In the injection molding process, 4-8 pieces are generally produced at one time, and a maximum of 32 pieces can be produced.

所述封裝部1011包覆所述電路元件10123以及所述連接線10124的方式帶來諸多優勢，舉例地但不限於，第一，所述封裝部1011包覆所述電路元件10123以及所述連接線10124，因此不需要為所述電路元件10123以及所述連接線10124預留額外的安全空間，提供所述攝像模組尺寸減小的可能性；第二，所述封裝部1011包覆所述電路元件10123以及所述連接線10124，使得所述電路元件10123和所述連接線10124被穩定地固定於內部，避免組裝過程中碰觸等不必要的影響，且減小在攝像模組使用過程中可能產生的晃動等因素帶來的影響；第三，所述封裝部1011包覆所述電路元件10123以及所述連接線10124，使得所述電路元件10123和所述連接線10124與其他部件以及相互之間隔離，減小外部以及相互之間的電磁影響，使其工作更加穩定；第四，所述封裝部1011包覆所述電路元件10123以及所述連接線10124，從而使得所述電路元件10123以及所述連接線10124不會直接暴露於鏡頭封閉的內空間，從而避免所述電路元件10123以及所述連接線10124上的微塵等雜物金進入內空間而影響成像品質，且避免所述電路元件10123以及所述連接線10124反射雜散光到達所述感光晶片10121從而影響成像品質；第五，所述封裝部1011包覆所述連接金線，使得所述封裝部1011一體成型的區域向內擴展至所述感光晶片10121的非感光區。 The encapsulation portion 1011 encapsulates the circuit element 10123 and the connection wire 10124 to bring many advantages. For example, but not limited to, first, the encapsulation portion 1011 encapsulates the circuit element 10123 and the connection. Therefore, there is no need to reserve additional safety space for the circuit element 10123 and the connecting wire 10124, which provides the possibility of reducing the size of the camera module; secondly, the encapsulation part 1011 covers the The circuit element 10123 and the connecting wire 10124 make the circuit element 10123 and the connecting wire 10124 be stably fixed inside, avoid unnecessary influences such as contact during the assembly process, and reduce the use of the camera module. The influence of factors such as shaking that may occur in the process; thirdly, the encapsulation part 1011 covers the circuit element 10123 and the connecting wire 10124, so that the circuit element 10123 and the connecting wire 10124 and other components and They are isolated from each other to reduce external and mutual electromagnetic influences and make their work more stable; fourth, the encapsulation portion 1011 wraps the circuit elements 10123 and the connecting wires 10124, so that the circuit elements 10123 and the connecting wire 10124 will not be directly exposed to the inner space enclosed by the lens, so as to prevent the circuit element 10123 and the dust on the connecting wire 10124 from entering the inner space and affect the imaging quality, and avoid the The circuit element 10123 and the connecting wire 10124 reflect stray light to reach the photosensitive chip 10121 and thus affect the imaging quality; fifthly, the encapsulation part 1011 wraps the connecting gold wire, so that the integrally formed area of the encapsulation part 1011 faces toward the image quality. It extends to the non-photosensitive area of the photosensitive wafer 10121.

進一步，所述封裝部1011包括一包覆段10111和一濾光片安裝段10112，所述濾光片安裝段10112模塑地一體連接于所述包覆段10111，所述包覆段10111模塑連接於所述線路板主體10122，用於包覆所述電路元件10123和所述連接線10124。所述濾光片安裝段10112用於安裝一濾光片1020，也就是說，當所述感光元件1010被用於組裝所述攝像模組時，所述攝像模組的所述濾光片1020被安裝於所述濾光片安裝段10112，使得所述濾光片1020位於所述感光晶片10121的感光路徑上，且不需要提供額外的濾光片安裝支架。也就是說，所述封裝部1011在此處具有傳統支架的功能，但是基於模塑工藝的優勢，所述濾光片安裝段10112頂部可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述濾光片1020平整地被安裝，這一點也是優於傳統的攝像模組。特別地，所述濾光片1020為一紅外截止濾光片IRCF。 Further, the encapsulation part 1011 includes a covering section 10111 and a filter mounting section 10112, the filter mounting section 10112 is integrally connected to the covering section 10111 by molding, and the covering section 10111 is molded It is plastically connected to the circuit board main body 10122 for covering the circuit elements 10123 and the connecting wires 10124 . The filter mounting section 10112 is used to install a filter 1020, that is, when the photosensitive element 1010 is used to assemble the camera module, the filter 1020 of the camera module It is mounted on the filter mounting section 10112, so that the filter 1020 is located on the photosensitive path of the photosensitive wafer 10121, and there is no need to provide an additional filter mounting bracket. That is to say, the encapsulation part 1011 has the function of a traditional bracket, but based on the advantages of the molding process, the top of the filter mounting section 10112 can be made to have good flatness by the molding process. , so that the optical filter 1020 is installed flatly, which is also superior to the traditional camera module. In particular, the filter 1020 is an infrared cut filter IRCF.

更進一步，所述濾光片安裝段10112具有一安裝槽101121，所述安裝槽101211連通於所述通孔101100，為所述濾光片1020提供充足的安裝空間，使得所述濾光片1020不會凸出於所述濾光片安裝段10112的頂表面101122。也就是說，所述封裝部1011上端設置所述安裝槽101121，從而可以將所述濾光片1020安裝於其中。 Furthermore, the filter installation section 10112 has an installation groove 101121, and the installation groove 101211 communicates with the through hole 101100 to provide sufficient installation space for the optical filter 1020, so that the optical filter 1020 It does not protrude from the top surface 101122 of the filter mounting section 10112. That is to say, the mounting groove 101121 is provided on the upper end of the packaging portion 1011, so that the optical filter 1020 can be mounted therein.

值得一提的是，在本發明的這個實施例中，所述安裝槽101121可以用於安裝濾光片，而在本發明的其他實施中，所述安裝槽101121可以用來安裝所述攝像模組的馬達或鏡頭等部件，本領域的技術人員應當理解的是，所述安裝槽101121的用途並不是本發明的限制。 It is worth mentioning that in this embodiment of the present invention, the installation groove 101121 can be used to install a filter, while in other implementations of the present invention, the installation groove 101121 can be used to install the camera module It should be understood by those skilled in the art that the use of the mounting slot 101121 is not a limitation of the present invention.

值得一提的是，所述封裝部1011的內壁可以根據所述連接線10124的形狀而設置，比如設置為傾斜狀，從而在包覆所述連接線10124的同時使得所述感光晶片10121可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部1011的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part 1011 can be set according to the shape of the connecting wire 10124 , for example, set to be inclined, so that the photosensitive chip 10121 can be covered while the connecting wire 10124 is covered. more light is received. Those skilled in the art should understand that the shape of the packaging portion 1011 is not a limitation of the present invention.

參照圖2至圖7，根據本發明的第一個優選實施例的攝像模組。所述攝像模組可以是一定焦模組(Fix Focus Model，FFM)。所述攝像模組10100包括一所述感光組件1010、一所述濾光片1020和一鏡頭1030。 2 to 7, a camera module according to a first preferred embodiment of the present invention. The camera module may be a fixed focus module (Fix Focus Model, FFM). The camera module 10100 includes a photosensitive component 1010 , a filter 1020 and a lens 1030 .

所述濾光片1020被安裝於所述感光組件1010，所述鏡頭1030被安裝於所述感光組件1010上。 The filter 1020 is mounted on the photosensitive component 1010 , and the lens 1030 is mounted on the photosensitive component 1010 .

更具體地，所述濾光片1020被安裝於所述感光組件1010的所述封裝部1011的所述濾光片安裝段10112的所述安裝槽101121。所述鏡頭1030被安裝於所述感光組件1010的所述封裝部1011的所述濾光片安裝段10112的頂部。也就是說，所述濾光片1020被安裝於所述安裝槽，所述鏡頭1030被安裝于所述封裝部1011頂端。 More specifically, the filter 1020 is installed in the installation groove 101121 of the filter installation section 10112 of the packaging part 1011 of the photosensitive component 1010 . The lens 1030 is mounted on the top of the filter mounting section 10112 of the packaging portion 1011 of the photosensitive component 1010 . That is, the filter 1020 is installed in the installation groove, and the lens 1030 is installed in the top end of the packaging part 1011 .

還值得一提的是，所述鏡頭1030被安裝於所述感光組件1010的所述封裝部1011的所述濾光片安裝段10112頂端，從而所述封裝部1011相當於傳統攝像模組中的支架的功能，為所述鏡頭1030提供支撐、固定位置，但是組裝卻不同于傳統COB工藝過程。傳統COB工藝的攝像模組的支架以粘貼的方式固定於線路板，而所述封裝部1011通過模塑工藝固定於所述線路板主體10122，不需要粘貼固定過程，模塑方式相對於粘貼固定具有更好的連接穩定性以及工藝過程的可控性，且在所述封裝部1011與所述線路板主體10122之間不需要預留AA調整的膠水空間，因此減小了傳統攝像模組AA調整的預留空間，且在達到結構強度的條件下，本發明的模塑方案中的所述線路板主體10122的厚度可以更小，當濾光片被直接貼於模塑面時，鏡頭後焦可以更短，使得攝像模組的厚度得以減小；另一方面，所述封裝部1011包覆所述電路元件10123和所述連接線10124，使得傳統的支架功能和電路元件10123以及所述連接線10124可以在空間上重疊設置，不需要像傳統攝像模組，在電路器件周圍預留安全距離，從而使得具有支架功能的所述封裝部1011的高度可以設置在較 小的範圍，從而進一步提供了攝像模組厚度可以減小的空間。此外，所述封裝部1011代替傳統的支架，避免了支架在粘貼組裝時帶來的傾斜誤差，減小了攝像模組組裝的累積公差。且所述封裝部1011包覆所述連接線10124，且所述封裝部1011延伸至所述感光晶片10121的非感光區101212，使得所述封裝部1011可以向內收縮，從而進一步減小所述攝像模組的橫向的長寬尺寸。 It is also worth mentioning that the lens 1030 is mounted on the top of the filter mounting section 10112 of the encapsulation portion 1011 of the photosensitive component 1010, so that the encapsulation portion 1011 is equivalent to a conventional camera module. The function of the bracket is to provide support and a fixed position for the lens 1030, but the assembly is different from the traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by means of sticking, and the encapsulation part 1011 is fixed to the main body 10122 of the circuit board by a molding process, and no sticking and fixing process is required. It has better connection stability and process controllability, and there is no need to reserve glue space for AA adjustment between the packaging part 1011 and the circuit board body 10122, thus reducing the AA of the traditional camera module Adjusted reserved space, and under the condition of achieving structural strength, the thickness of the circuit board main body 10122 in the molding solution of the present invention can be smaller. When the filter is directly attached to the molding surface, the back of the lens The focal length can be shorter, so that the thickness of the camera module can be reduced; on the other hand, the encapsulation part 1011 covers the circuit element 10123 and the connecting wire 10124, so that the traditional bracket function and the circuit element 10123 and the The connecting wires 10124 can be overlapped in space, and there is no need to reserve a safe distance around the circuit device like a traditional camera module, so that the height of the encapsulation part 1011 with the bracket function can be set at a higher height. A small range, thereby further providing a space where the thickness of the camera module can be reduced. In addition, the encapsulation part 1011 replaces the traditional bracket, which avoids the inclination error caused when the bracket is pasted and assembled, and reduces the cumulative tolerance of the camera module assembly. And the encapsulation part 1011 covers the connection line 10124, and the encapsulation part 1011 extends to the non-photosensitive area 101212 of the photosensitive chip 10121, so that the encapsulation part 1011 can be retracted inward, thereby further reducing the The horizontal length and width of the camera module.

參照圖2至圖5以及圖8和圖9，是根據本發明的第一個優選實施例的另一攝像模組10100，所述攝像模組10100可以為一動焦攝像模組(Automatic Focus Model，AFM)。所述攝像模組包括一所述感光組件1010、一所述濾光片1020、一所述馬達1040和一鏡頭1030。 2 to 5 and FIGS. 8 and 9, it is another camera module 10100 according to the first preferred embodiment of the present invention, the camera module 10100 can be a moving focus camera module (Automatic Focus Model, AFM). The camera module includes a photosensitive component 1010 , a filter 1020 , a motor 1040 and a lens 1030 .

所述濾光片1020被安裝於所述感光組件1010，所述鏡頭1030被安裝於所述馬達1040，所述馬達1040被安裝於所述感光組件1010上。 The filter 1020 is mounted on the photosensitive element 1010 , the lens 1030 is mounted on the motor 1040 , and the motor 1040 is mounted on the photosensitive element 1010 .

進一步，所述濾光片1020被安裝於所述感光組件1010的所述封裝部1011的所述濾光片安裝段10112的所述安裝槽101121。所述馬達1040被安裝於所述感光組件1010的所述封裝部1011的所述濾光片安裝段10112頂端。也就是說，所述濾光片1020被安裝于所述封裝部1011的所述安裝槽，所述鏡頭1030被安裝於所述馬達1040，所述馬達1040被安裝于所述封裝部1011的頂端。 Further, the filter 1020 is installed in the installation groove 101121 of the filter installation section 10112 of the package portion 1011 of the photosensitive component 1010 . The motor 1040 is mounted on the top of the filter mounting section 10112 of the packaging portion 1011 of the photosensitive element 1010 . That is, the filter 1020 is mounted on the mounting groove of the package portion 1011 , the lens 1030 is mounted on the motor 1040 , and the motor 1040 is mounted on the top of the package portion 1011 . .

特別地，當所述引腳通過導電膠貼附方式粘接於所述電路接點時，可以不需要焊接導線來連接所述馬達1040和所述感光部1012的所述線路板主體10122，從而減少馬達焊接的工藝過程。 In particular, when the pins are adhered to the circuit contacts by means of conductive adhesive, there is no need to solder wires to connect the motor 1040 and the circuit board main body 10122 of the photosensitive portion 1012, thereby Reduce the process of motor welding.

所述馬達1040被安裝于所述封裝部1011，也就是說，所述馬達1040被支撐于所述封裝部1011的頂端。由於所述封裝部1011通過模具由一體成型的方式形成於所述線路板主體10122，因此可以為所述馬達1040提供平整的安裝平面，即，提供平整的所述頂表面101122，方便在組裝所述攝像模組時，對所述馬達1040進行AA調整，使得所述攝像模組易於達到光軸一致的要求。 The motor 1040 is mounted on the packaging part 1011 , that is, the motor 1040 is supported on the top of the packaging part 1011 . Since the encapsulation portion 1011 is integrally formed on the circuit board body 10122 by a mold, a flat installation plane can be provided for the motor 1040, that is, a flat top surface 101122 can be provided, which is convenient for the assembly process. When the camera module is installed, AA adjustment is performed on the motor 1040, so that the camera module can easily meet the requirement of consistent optical axes.

本領域技術人員應當理解的是，上述攝像模組的結構和類型僅作為舉例，來說明所述攝像模組可以被實施的方式，並不是本發明的限制。 It should be understood by those skilled in the art that the structures and types of the above-mentioned camera modules are only used as examples to illustrate the manner in which the camera modules can be implemented, and are not limitations of the present invention.

參照圖10A和圖11，根據本發明的第二個優選實施例的攝像模組感光元件1010A和攝像模組10100A。所述感光元件1010A用於組裝製造所述攝像模組10100A，從而得到模塑型的攝像模組。所述感光組件1010A包括一封裝部1011A和一感光部1012A，所述封裝部1011A模塑地連接於所述感光部1012A。 10A and 11 , a camera module photosensitive element 1010A and a camera module 10100A according to the second preferred embodiment of the present invention. The photosensitive element 1010A is used to assemble and manufacture the camera module 10100A, thereby obtaining a molded camera module. The photosensitive component 1010A includes an encapsulation portion 1011A and a photosensitive portion 1012A, and the encapsulation portion 1011A is connected to the photosensitive portion 1012A by molding.

所述感光部1012A包括一線路板主體10122A和一感光晶片10121A，所述感光晶片10121A被設置於所述線路板主體10122A上。根據本發明的這個實施例，所述感光晶片10121A模塑地連接於所述線路板主體10122。 The photosensitive portion 1012A includes a circuit board body 10122A and a photosensitive wafer 10121A, and the photosensitive wafer 10121A is disposed on the circuit board body 10122A. According to this embodiment of the present invention, the photosensitive wafer 10121A is connected to the circuit board body 10122 by molding.

根據本發明這個實施例，所述感光部1012A包括一連接線路和至少一電路元件10123A。所述連接線路預設於所述線路板主體10122A，所述電路元件10123A電連接於所述連接線路以及所述感光晶片10121A，以供所述感光晶片10121A的感光工作過程。所述電路元件10123A凸出地設置於所述線路板主體10122A。所述電路元件10123A可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 1012A includes a connecting line and at least one circuit element 10123A. The connection circuit is preset on the circuit board main body 10122A, and the circuit element 10123A is electrically connected to the connection circuit and the photosensitive chip 10121A for the photosensitive working process of the photosensitive chip 10121A. The circuit element 10123A is protrudingly disposed on the circuit board body 10122A. The circuit element 10123A may be, by way of example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay or a driver, and the like.

值得一提的是，所述封裝部1011A將所述電路元件10123A包覆於其內部，因此使得所述電路元件10123A不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片10121A相通的環境中，從而當組裝所述攝像模組時，所述電路元件10123A上不會沾染灰塵等污染物，也不會影響所述感光晶片10121A，不同于傳統攝像模組中電路元件10123A暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件10123A表面，避免污染所述感光晶片10121A而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation portion 1011A encapsulates the circuit element 10123A inside, so that the circuit element 10123A is not directly exposed to the space, more specifically, is not exposed to the The photosensitive chip 10121A is in the same environment, so when the camera module is assembled, the circuit element 10123A will not be contaminated with dust and other pollutants, nor will it affect the photosensitive chip 10121A, which is different from the circuit in the traditional camera module. The existence of the exposed element 10123A, such as a container, can prevent dust and debris from staying on the surface of the circuit element 10123A by molding and wrapping, and avoid contaminating the photosensitive chip 10121A and causing the camera module to have black spots. and other adverse phenomena.

所述封裝部1011A形成一通孔101100A，以便於為所述感光晶片10121A提供感光路徑。 A through hole 101100A is formed in the package portion 1011A, so as to provide a photosensitive path for the photosensitive chip 10121A.

根據本發明的這個優選實施例，所述感光部1012A包括至少一連接線10124A，用於電連接所述感光晶片10121A和所述線路板主體10122A。進一步，所述連接線10124A可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線10124A呈弧形地連接所述感光晶片10121A和所述線路板主體10122A。值得一提的是，所述連接線10124A被模塑于所述封裝部1011A內部，從而可以借助所述封裝部1011A將所述連接線10124A進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線10124A不會受到任何的碰觸損傷，同時減少環境因素對個所述連接線10124A的影響，如溫度，使得所述感光晶片10121A和所述線路板主體10122A之間的通訊連接穩定，這一點是完全不同于現有技術的。 According to this preferred embodiment of the present invention, the photosensitive portion 1012A includes at least one connecting wire 10124A for electrically connecting the photosensitive wafer 10121A and the circuit board main body 10122A. Further, the connecting wire 10124A may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connecting wire 10124A connects the photosensitive wafer 10121A and the circuit board main body 10122A in an arc shape. It is worth mentioning that the connecting wire 10124A is molded inside the packaging part 1011A, so that the connecting wire 10124A can be covered by the packaging part 1011A without being directly exposed to the outside, so as to assemble When the camera module is used, the connecting wire 10124A will not be damaged by any touch, and the influence of environmental factors on the connecting wire 10124A, such as temperature, is reduced, so that the photosensitive chip 10121A and the circuit board are The communication connection between the main bodies 10122A is stable, which is completely different from the prior art.

值得一提的是，所述封裝部1011A包覆所述電路元件10123A和所述連接線10124A，具有保護所述電路元件10123A和所述連接線10124A及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部1011A不限於包覆所述電路元件10123A或所述連接線10124A。也就是說，在本發明的其他實施例中，所述封裝部1011A可以直接模塑於沒有凸出的所述電路元件10123A的所述線路板主體10122A，也可以是模塑於所述電路元件10123A外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 1011A covers the circuit element 10123A and the connecting wire 10124A, and protects the circuit element 10123A and the connecting wire 10124A and a camera module with better performance. However, those skilled in the art should understand that the encapsulation portion 1011A is not limited to encapsulating the circuit element 10123A or the connecting wire 10124A. That is to say, in other embodiments of the present invention, the encapsulation portion 1011A may be directly molded on the circuit board body 10122A of the circuit element 10123A without protrusions, or may be molded on the circuit element 10123A outside and around different locations.

不同於上述優選實施例的是，所述線路板主體10122A具有一內凹槽101222A，所述感光晶片10121A被設置於所述內凹槽101222A內，從而使得所述感光晶片10121A和所述線路板主體10122A的相對高度降低，從而當所述封裝部1011A包覆所述感光晶片10121A，減小對所述封裝部1011A的高度要求，從而減小所述感光元件1010A組裝的攝像模組的高度。 Different from the above preferred embodiment, the circuit board main body 10122A has an inner groove 101222A, and the photosensitive wafer 10121A is arranged in the inner groove 101222A, so that the photosensitive wafer 10121A and the circuit board The relative height of the main body 10122A is reduced, so that when the packaging part 1011A wraps the photosensitive chip 10121A, the height requirement for the packaging part 1011A is reduced, thereby reducing the height of the camera module assembled with the photosensitive element 1010A.

進一步，所述感光晶片10121A具有一感光區101211A和一非感光區101212A，所述非感光區101212A環繞於所述感光區101211A週邊。所述感光區101211A用於進行感光作用，所述連接線10124A連接於所述非感光區101212A。 Further, the photosensitive wafer 10121A has a photosensitive area 101211A and a non-photosensitive area 101212A, and the non-photosensitive area 101212A surrounds the periphery of the photosensitive area 101211A. The photosensitive area 101211A is used for photosensitive action, and the connection line 10124A is connected to the non-photosensitive area 101212A.

根據本發明的這個優選實施例，所述封裝部1011A延伸於所述感光晶片10121A的所述非感光區101212A，從而將所述感光晶片10121A通過模塑的方式疊層固定於所述線路板主體10122A。通過這樣的方式，如模塑於晶片的方式(Molding on chip，MOC)擴大了所述封裝部1011A向內的可模塑範圍，從而可以減小所述線路板主體10122A以及所述封裝部1011A外側的結構性部分，進一步減小所述感光元件1012A的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 1011A extends to the non-photosensitive area 101212A of the photosensitive wafer 10121A, so that the photosensitive wafer 10121A is laminated and fixed to the circuit board body by molding 10122A. In this way, the moldable range of the encapsulation portion 1011A inward is expanded, such as molding on chip (MOC), so that the circuit board body 10122A and the encapsulation portion 1011A can be reduced in size The outer structural part further reduces the length and width of the photosensitive element 1012A, and reduces the length and width of the camera module assembled by it.

在本發明的這個實施例中，所述封裝部1011A凸起地圍繞於所述感光晶片10121A的所述感光區101211A外側，特別地，所述封裝部1011A一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件1010A被用於組裝所述攝像模組時，所述感光晶片10121A被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 1011A protrudes around the outside of the photosensitive region 101211A of the photosensitive wafer 10121A, and in particular, the encapsulation portion 1011A is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so that when the photosensitive element 1010A is used to assemble the camera module, the photosensitive wafer 10121A is sealed inside to form a closed inner space.

進一步，所述封裝部1011A包括一包覆段10111A和一濾光片安裝段10112A，所述濾光片安裝段10112A模塑地一體連接于所述包覆段10111A，所述包覆段10111A模塑連接於所述線路板主體10122A，用於包覆所述電路元件10123A和所述連接線10124A。所述濾光片安裝段10112A用於安裝一濾光片1020A，也就是說，當所述感光元件1010A被用於組裝所述攝像模組時，所述攝像模組的濾光片1020A被安裝於所述濾光片安裝段10112A，使得所述濾光片1020A位於所述感光晶片10121A的感光路徑上，且不需要提供額外的濾光片1020A安裝支架。也就是說，所述封裝部1011A在此處具有傳統支架的 功能，但是基於模塑工藝的優勢，所述濾光片安裝段10112A頂部可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述濾光片1020A平整地被安裝，這一點也是優於傳統的攝像模組。 Further, the encapsulation portion 1011A includes a covering section 10111A and a filter mounting section 10112A, the filter mounting section 10112A is integrally connected to the covering section 10111A by molding, and the covering section 10111A is molded It is plastically connected to the circuit board main body 10122A for covering the circuit element 10123A and the connecting wire 10124A. The filter installation section 10112A is used to install a filter 1020A, that is, when the photosensitive element 1010A is used to assemble the camera module, the filter 1020A of the camera module is installed In the filter mounting section 10112A, the filter 1020A is located on the photosensitive path of the photosensitive wafer 10121A, and there is no need to provide an additional mounting bracket for the filter 1020A. That is, the encapsulation portion 1011A here has the function, but based on the advantages of the molding process, the top of the filter mounting section 10112A can be made to have good flatness by the molding process, so that the filter 1020A can be installed flatly. It is also superior to traditional camera modules.

更進一步，所述濾光片安裝段10112A具有一安裝槽101121A，所述安裝槽101121A連通於所述通孔101100A，為所述濾光片1020A提供充足的安裝空間，使得所述濾光片1020A不會凸出于濾光片安裝段10112A的頂表面101122A。也就是說，所述封裝部1011A上端設置所述安裝槽101121A，從而將所述濾光片1020A穩定的安裝于所述封裝部1011A，且不會凸出于所述封裝部1011A的頂端。 Furthermore, the filter installation section 10112A has an installation groove 101121A, and the installation groove 101121A communicates with the through hole 101100A to provide sufficient installation space for the optical filter 1020A, so that the optical filter 1020A can be installed. Does not protrude from the top surface 101122A of the filter mounting segment 10112A. That is to say, the mounting groove 101121A is provided on the upper end of the package portion 1011A, so that the filter 1020A is stably mounted on the package portion 1011A without protruding from the top of the package portion 1011A.

值得一提的是，所述封裝部1011A的內壁可以根據所述連接線的形狀的而設置，比如設置為傾斜狀，從而在包覆所述連接線10124A的同時使得所述感光晶片10121A可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部1011A的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part 1011A can be set according to the shape of the connecting wire, for example, set to be inclined, so that the photosensitive chip 10121A can be covered while the connecting wire 10124A is covered. more light is received. Those skilled in the art should understand that the shape of the packaging portion 1011A is not a limitation of the present invention.

參照圖10B，根據本發明的第二個優選實施例的變形實施方式，所述感光元件1010A的所述線路板主體10122A具有一下沉孔101222A，所述感光晶片10121A被下沉地設置於所述下沉孔101222A，從而使得所述感光晶片10121A和所述線路板主體10122A的相對高度降低，從而當所述封裝部1011A包覆所述感光晶片10121A時，減小對所述封裝部1011A的高度要求，從而減小所述感光元件1010A組裝的攝像模組的高度。 Referring to FIG. 10B , according to a modified implementation of the second preferred embodiment of the present invention, the circuit board main body 10122A of the photosensitive element 1010A has a countersunk hole 101222A, and the photosensitive wafer 10121A is disposed in the sunken manner. A sink hole 101222A is formed to reduce the relative height of the photosensitive wafer 10121A and the circuit board body 10122A, so that when the package portion 1011A wraps the photosensitive wafer 10121A, the height of the package portion 1011A is reduced. requirements, thereby reducing the height of the camera module assembled with the photosensitive element 1010A.

所述下沉孔101222A是通孔結構，連通所述線路板主體兩側的空間，從而增大所述感光晶片10121A的可下沉範圍。所述感光晶片10121A與所述線路板主體10122A的高度相對位置可以根據需求選擇，比如所述感光晶片10121A和所述線路板主體10122A的頂面高度一致、所述感光晶片10121A和所 述線路板主體10122A的底面高度一致、所述感光晶片10121A和所述線路板主體10122A的頂面和底面高度都不一致等。 The sink hole 101222A is a through-hole structure, connecting the spaces on both sides of the circuit board body, thereby increasing the sinkable range of the photosensitive wafer 10121A. The height relative position of the photosensitive wafer 10121A and the circuit board main body 10122A can be selected according to requirements. The height of the bottom surface of the circuit board body 10122A is the same, and the heights of the top surface and the bottom surface of the photosensitive wafer 10121A and the circuit board body 10122A are not the same.

所述連接線10124A一端連接所述感光晶片10121A，另一端連接所述線路板主體10122A，即，所述下沉孔101222A的週邊區域，從而使得所述下沉孔101222A更多區域用於設置所述感光晶片10121A，從而適於容納面積更大的所述感光晶片10121A，或者減小所述下沉孔101222A的區域面積。 One end of the connecting line 10124A is connected to the photosensitive wafer 10121A, and the other end is connected to the circuit board main body 10122A, that is, the peripheral area of the sink hole 101222A, so that more area of the sink hole 101222A is used for setting all the The photosensitive wafer 10121A is suitable for accommodating the photosensitive wafer 10121A with a larger area, or the area of the sink hole 101222A is reduced.

參照圖11，根據本發明的第二個優選實施例的攝像模組10100A。所述攝像模組可以是一定焦模組。所述攝像模組包括一所述感光組件1010A、一所述濾光片1020A和一鏡頭1030A。 11 , a camera module 10100A according to a second preferred embodiment of the present invention is shown. The camera module can be a fixed focus module. The camera module includes a photosensitive component 1010A, a filter 1020A and a lens 1030A.

所述濾光片1020A被安裝於所述感光組件1010A，所述鏡頭1030A被安裝於所述感光組件1010A上。 The filter 1020A is mounted on the photosensitive element 1010A, and the lens 1030A is mounted on the photosensitive element 1010A.

更具體地，所述濾光片1020A被安裝於所述感光組件1010A的所述封裝部1011A的所述濾光片安裝段10111A的所述安裝槽1111A。所述鏡頭1030A被安裝於所述感光組件1010A的所述封裝部1011A的所述濾光片安裝段10111A的頂端。換句話說，所述濾光片1020A被安裝于所述封裝部1011A的所述安裝糟1111A，所述鏡頭1030A被安裝于所述封裝部1011A的頂端。 More specifically, the filter 1020A is installed in the installation groove 1111A of the filter installation section 10111A of the packaging portion 1011A of the photosensitive component 1010A. The lens 1030A is mounted on the top of the filter mounting section 10111A of the packaging portion 1011A of the photosensitive element 1010A. In other words, the filter 1020A is mounted on the mounting slot 1111A of the package portion 1011A, and the lens 1030A is mounted on the top of the package portion 1011A.

在本發明的其他實施例中，所述感光元件1010A還可以被組裝為一動焦攝像模組。本領域的技術人員應當理解的是，所述定焦攝像模組僅作為舉例來說明本發明，並不是本發明的限制。 In other embodiments of the present invention, the photosensitive element 1010A can also be assembled into a moving focus camera module. It should be understood by those skilled in the art that the fixed-focus camera module is only used as an example to illustrate the present invention, and is not a limitation of the present invention.

參照圖12和圖13，根據本發明的第三個優選實施例的感光組件1010B和攝像模組10100B。所述感光元件1010B用於組裝製造所述攝像模組，從而得到模塑型的攝像模組。所述感光組件1010B包括一封裝部1011B和一感光部1012B，所述封裝部1011B模塑地連接於所述感光部1012B。 12 and 13, a photosensitive assembly 1010B and a camera module 10100B according to the third preferred embodiment of the present invention. The photosensitive element 1010B is used for assembling and manufacturing the camera module, thereby obtaining a molded camera module. The photosensitive component 1010B includes a package portion 1011B and a photosensitive portion 1012B, and the package portion 1011B is connected to the photosensitive portion 1012B by molding.

所述感光部1012B包括一線路板主體10122B和一感光晶片10121B，所述感光晶片10121B被設置於所述線路板主體10122B上。根據本發明的這個實施例，所述感光晶片10121B模塑地連接於所述線路板主體10122。 The photosensitive portion 1012B includes a circuit board body 10122B and a photosensitive wafer 10121B, and the photosensitive wafer 10121B is disposed on the circuit board body 10122B. According to this embodiment of the present invention, the photosensitive wafer 10121B is connected to the circuit board body 10122 by molding.

根據本發明這個實施例，所述感光部1012B包括一連接線路和至少一電路元件10123B。所述連接線路預設於所述線路板主體10122B，所述電路元件10123B電連接於所述連接線路以及所述感光晶片10121B，以供所述感光晶片10121B的感光工作過程。所述電路元件10123B凸出地設置於所述線路板主體10122B。所述電路元件10123B可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 1012B includes a connecting line and at least one circuit element 10123B. The connection circuit is preset on the circuit board body 10122B, and the circuit element 10123B is electrically connected to the connection circuit and the photosensitive chip 10121B for the photosensitive working process of the photosensitive chip 10121B. The circuit element 10123B is protrudingly disposed on the circuit board body 10122B. The circuit element 10123B can be, by way of example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.

值得一提的是，所述封裝部1011B將所述電路元件10123B包覆於其內部，因此使得所述電路元件10123B不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片10121B相通的環境中，從而當組裝為所述攝像模組時，所述電路元件10123B上不會沾染灰塵等污染物，也不會影響所述感光晶片10121B，不同于傳統攝像模組中電路元件10123B暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件10123B表面，避免污染所述感光晶片10121B而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation part 1011B encapsulates the circuit element 10123B inside, so that the circuit element 10123B will not be directly exposed to the space, more specifically, will not be exposed to the In the environment where the photosensitive chip 10121B is connected, so that when assembled into the camera module, the circuit element 10123B will not be contaminated with dust and other pollutants, nor will it affect the photosensitive chip 10121B, which is different from the traditional camera module. The circuit element 10123B is exposed in a way, such as a blocking device, so as to prevent dust and debris from staying on the surface of the circuit element 10123B by molding and wrapping, and avoid contaminating the photosensitive chip 10121B and making the camera module appear dirty and black Points and other undesirable phenomena.

所述封裝部1011B形成一通孔101100B，以便於為所述感光晶片10121B提供感光路徑。 A through hole 101100B is formed in the package portion 1011B, so as to provide a photosensitive path for the photosensitive chip 10121B.

根據本發明的這個優選實施例，所述感光部1012B包括至少一連接線10124B，用於電連接所述感光晶片10121B和所述線路板主體10122B。進一步，所述連接線10124B可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線10124B呈弧形地連接所述感光晶片10121B和所述線路板主體10122B。 According to this preferred embodiment of the present invention, the photosensitive portion 1012B includes at least one connecting wire 10124B for electrically connecting the photosensitive wafer 10121B and the circuit board main body 10122B. Further, the connecting wire 10124B may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connecting wire 10124B connects the photosensitive wafer 10121B and the circuit board main body 10122B in an arc shape.

值得一提的是，所述連接線10124B被模塑于所述封裝部1011B內部，從而可以借助所述封裝部1011B將所述連接線10124B進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線10124B不會受到任何的碰觸損傷，同時減少環境因素對個所述連接線10124B的影響，如溫度，使得所述感光晶片10121B和所述線路板主體10122B之間的通訊連接穩定，這一點是完全不提供于現有技術的。 It is worth mentioning that the connecting wire 10124B is molded inside the packaging part 1011B, so that the connecting wire 10124B can be covered by the packaging part 1011B without being directly exposed to the outside, so as to assemble When the camera module is used, the connection line 10124B will not be damaged by any contact, and the influence of environmental factors on the connection line 10124B, such as temperature, is reduced, so that the photosensitive chip 10121B and the circuit board are The communication connection between the main bodies 10122B is stable, which is completely not provided in the prior art.

值得一提的是，所述封裝部1011B包覆所述電路元件10123B和所述連接線10124B，具有保護所述電路元件10123B和所述連接線10124B及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部1011B不限於包覆所述電路元件10123B或所述連接線10124B。也就是說，在本發明的其他實施例中，所述封裝部1011B可以直接模塑於沒有凸出的所述電路元件10123B的所述線路板主體10122B，也可以是模塑於所述電路元件10123B外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 1011B covers the circuit element 10123B and the connecting wire 10124B, and has the aspects of protecting the circuit element 10123B and the connecting wire 10124B and the camera module for obtaining better performance. However, those skilled in the art should understand that the encapsulation part 1011B is not limited to encapsulating the circuit element 10123B or the connection wire 10124B. That is to say, in other embodiments of the present invention, the encapsulation portion 1011B may be directly molded on the circuit board body 10122B of the circuit element 10123B without protrusions, or may be molded on the circuit element 10123B outside and around different positions.

進一步，所述感光晶片10121B具有一感光區101211B和一非感光區101212B，所述非感光區101212B環繞於所述感光區101211B週邊。所述感光區101211B用於進行感光作用，所述連接線10124B連接於所述非感光區101212B。 Further, the photosensitive wafer 10121B has a photosensitive area 101211B and a non-photosensitive area 101212B, and the non-photosensitive area 101212B surrounds the periphery of the photosensitive area 101211B. The photosensitive area 101211B is used for photosensitive action, and the connection line 10124B is connected to the non-photosensitive area 101212B.

根據本發明的這個優選實施例，所述封裝部1011B延伸於所述感光晶片10121B的所述非感光區101212B，從而將所述感光晶片10121B通過模塑的方式疊層固定於所述線路板主體10122B。通過這樣的方式，如模塑於晶片的方式(Molding on Chip，MOC)擴大了所述封裝部1011B向內的可模塑範圍，從而可以減小所述線路板主體10122B以及所述封裝部1011B外側的結構性部分，進一步減小所述模塑感光部1012B件的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 1011B extends to the non-photosensitive area 101212B of the photosensitive wafer 10121B, so that the photosensitive wafer 10121B is laminated and fixed to the circuit board body by molding 10122B. In this way, the inward molding range of the package portion 1011B can be expanded by molding on a chip (MOC), so that the circuit board body 10122B and the package portion 1011B can be reduced in size The outer structural part further reduces the length and width of the molded photosensitive part 1012B, and reduces the length and width of the camera module assembled therefrom.

在本發明的這個實施例中，所述封裝部1011B凸起地圍繞於所述感光晶片10121B的所述感光區101211B外側，特別地，所述封裝部1011B一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件1010B被用於組裝所述攝像模組時，所述感光晶片10121B被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 1011B protrudes around the outside of the photosensitive region 101211B of the photosensitive wafer 10121B, and in particular, the encapsulation portion 1011B is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so when the photosensitive element 1010B is used to assemble the camera module, the photosensitive wafer 10121B is sealed inside to form a closed inner space.

具體地，在製造所述感光元件1010B時，可以選取一傳統的線路板作為所述線路板主體10122B，在所述線路板主體10122B上設置一所述感光晶片10121B，將所述感光晶片10121B通過所述連接線10124B電連接，進而在初步組裝後的所述線路板主體10122B和感光晶片10121B部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部1011B，或用半導體封裝中常用的模壓工藝形成所述封裝部1011B。所述線路板主體10122B可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)等。所述封裝部1011B形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部1011B可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用熱熔性樹脂或熱固性樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 1010B, a conventional circuit board can be selected as the circuit board body 10122B, a photosensitive wafer 10121B is set on the circuit board body 10122B, and the photosensitive wafer 10121B is passed through the circuit board body 10122B. The connecting wires 10124B are electrically connected, and then molding is performed on the circuit board main body 10122B and the photosensitive wafer 10121B after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The circuit board after the surface mount process) is molded to form the package portion 1011B, or the package portion 1011B is formed by a molding process commonly used in semiconductor packaging. The circuit board body 10122B can be selected to be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a hard PCB board (without a flex board), and the like. The manner of forming the encapsulation part 1011B can be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The material that can be selected for the encapsulation part 1011B is, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and heat can be used for the molding process. Melting resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

進一步，所述封裝部1011B頂端表面平整，適於安裝一濾光片1020B，也就是說，當所述感光元件1010B被用於組裝所述攝像模組時，所述攝像模組的濾光片1020B被安裝于所述封裝部1011B的頂端表面，使得所述濾光片1020B位於所述感光晶片10121B的感光路徑上，且不需要提供額外的濾光片 1020B安裝支架。也就是說，所述封裝部1011B在此處具有傳統支架的功能，但是基於模塑工藝的優勢，所述模頂部1011B可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述濾光片1020B平整地被安裝，這一點也是優於傳統的攝像模組。 Further, the top surface of the encapsulation portion 1011B is flat and suitable for installing a filter 1020B, that is to say, when the photosensitive element 1010B is used to assemble the camera module, the filter of the camera module 1020B is mounted on the top surface of the package part 1011B, so that the filter 1020B is located on the photosensitive path of the photosensitive wafer 10121B, and no additional filter needs to be provided 1020B mounting bracket. That is to say, the encapsulation part 1011B has the function of a traditional bracket here, but based on the advantages of the molding process, the mold top 1011B can be made to have good flatness by means of the molding process, so that all The filter 1020B is installed flat, which is also superior to the traditional camera module.

不同於上述優選實施例的是，在本發明的這個實施例中，所述感光元件1010B的所述感光部1012B包括一加固層10125B，所述加固層10125B疊層地連接於所述線路板主體10122B底層，以便於加強所述線路板主體10122B的結構強度。也就是說，在所述線路板主體10122B上所述封裝部1011B以及所述感光晶片10121B所在的區域底層貼裝所述加固層10125B，從而使得所述線路板主體10122B穩定可靠地支撐所述封裝部1011B和所述感光晶片10121B。 Different from the above preferred embodiment, in this embodiment of the present invention, the photosensitive portion 1012B of the photosensitive element 1010B includes a reinforcement layer 10125B, and the reinforcement layer 10125B is laminated and connected to the circuit board main body 10122B bottom layer, in order to strengthen the structural strength of the circuit board main body 10122B. That is to say, the reinforcing layer 10125B is bottom-mounted on the circuit board main body 10122B where the package portion 1011B and the photosensitive chip 10121B are located, so that the circuit board main body 10122B can stably and reliably support the package part 1011B and the photosensitive wafer 10121B.

進一步，所述加固層10125B為一金屬板，所述金屬板貼附於所述線路板主體10122B的底層，增加所述線路板主體10122B的結構強度，另一方面，增加所述感光組件1010B的散熱性能，能有效散失所述感光晶片10121B發出的熱量。 Further, the reinforcing layer 10125B is a metal plate, and the metal plate is attached to the bottom layer of the circuit board main body 10122B to increase the structural strength of the circuit board main body 10122B, and on the other hand, increase the strength of the photosensitive element 1010B The heat dissipation performance can effectively dissipate the heat emitted by the photosensitive chip 10121B.

值得一提的是，所述線路板主體10122B可以採用FPC(Flex Print Circuit，撓性印製電路板)，而通過所述加固層10125B增強所述FPC的剛性，使得具有良好彎曲性能的FPC能夠滿足所述感光元件1010B的承載要求。也就是說，所述線路板主體10122B的可選擇範圍更加廣泛，例如PCB(Printed Circuit Board，剛性印製電路板)，FPC，RF(Rigid Flex，軟硬結合板)。通過所述加固層10125B增加所述線路板主體10122B的結構強度並且提高散熱性能，從而可以減小所述線路板主體10122B的厚度，使得所述感光組件1010B的高度進一步減小，以及由其組裝得到的攝像模組的高度減小。 It is worth mentioning that the main body 10122B of the circuit board can adopt FPC (Flex Print Circuit, flexible printed circuit board), and the rigidity of the FPC is enhanced by the reinforcement layer 10125B, so that the FPC with good bending performance can be The bearing requirements of the photosensitive element 1010B are met. That is to say, the circuit board main body 10122B has a wider range of options, such as PCB (Printed Circuit Board, rigid printed circuit board), FPC, RF (Rigid Flex, rigid-flex board). Through the reinforcement layer 10125B, the structural strength of the circuit board body 10122B is increased and the heat dissipation performance is improved, so that the thickness of the circuit board body 10122B can be reduced, so that the height of the photosensitive assembly 1010B can be further reduced, and the assembly by the same The height of the resulting camera module is reduced.

值得一提的是，在本發明的這個實施例中，所述加固層10125呈板狀重疊於所述線路板主體10122B，而在本發明的其他實施例中，所述加固層 10125B可以延伸至包裹所述封裝部1011B側壁，從而在增強所述感光元件1010B的結構強度的同時，增強其抗電磁干擾能力。 It is worth mentioning that, in this embodiment of the present invention, the reinforcing layer 10125 overlaps the circuit board main body 10122B in a plate shape, while in other embodiments of the present invention, the reinforcing layer The 10125B can extend to wrap around the side wall of the encapsulation portion 1011B, so as to enhance the structural strength of the photosensitive element 1010B and enhance its anti-electromagnetic interference capability.

值得一提的是，所述封裝部的內壁可以根據所述連接線的形狀的而設置，比如設置為傾斜狀，從而在包覆所述連接線10124B的同時使得所述感光晶片10121B可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部1011B的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part can be set according to the shape of the connecting wire, for example, set to be inclined, so that the photosensitive chip 10121B can receive the connecting wire 10124B while covering the connecting wire 10124B. to more light. Those skilled in the art should understand that the shape of the packaging part 1011B is not a limitation of the present invention.

參照圖12和圖13，根據本發明的第三個優選實施例的攝像模組10100B。所述攝像模組10100B可以是一定焦模組(Fix Focus Model，FFM)。所述攝像模組包括一所述感光組件1010B、一所述濾光片1020B和一鏡頭1030B。 12 and 13, a camera module 10100B according to a third preferred embodiment of the present invention is shown. The camera module 10100B may be a fixed focus module (Fix Focus Model, FFM). The camera module includes a photosensitive component 1010B, a filter 1020B and a lens 1030B.

所述濾光片1020B被安裝於所述感光組件1010B，所述鏡頭1030B被安裝於所述感光組件1010B上。 The filter 1020B is mounted on the photosensitive element 1010B, and the lens 1030B is mounted on the photosensitive element 1010B.

更具體地，所述濾光片1020B被安裝於所述感光組件1010B的所述封裝部1011B頂端。所述鏡頭1030B被安裝於所述感光組件1010B的所述封裝部1011B的頂端。特別地，所述濾光片1020B和所述鏡頭1030B在所述封裝部1011B的具體安裝位置可以根據具體需要協調配置。 More specifically, the filter 1020B is mounted on the top end of the packaging portion 1011B of the photosensitive element 1010B. The lens 1030B is mounted on the top of the package portion 1011B of the photosensitive element 1010B. In particular, the specific installation positions of the optical filter 1020B and the lens 1030B in the packaging portion 1011B can be coordinated and configured according to specific needs.

還值得一提的是，所述鏡頭1030B被安裝於所述感光組件1010B的所述封裝部1011B的頂端，從而所述封裝部1011B相當於傳統攝像模組中的支架的功能，為所述鏡頭1030B提供支撐、固定位置，但是組裝卻不同于傳統COB工藝過程。傳統COB工藝的攝像模組的支架以粘貼的方式固定於線路板，而所述封裝部1011B通過模塑工藝固定於所述線路板主體10122B，不需要粘貼固定過程，模塑方式相對於粘貼固定具有更好的連接穩定性以及工藝過程的可控性，且在所述封裝部1011B與所述線路板主體10122B之間不需要預留AA調整的膠水空間，因此減小了傳統攝像模組AA調整的預留空間，使得攝像模組的 厚度得以減小；另一方面，所述封裝部1011B包覆所述電路元件10123B和所述連接線10124B，使得傳統的支架功能和電路元件10123B以及所述連接線10124B可以在空間上重疊設置，不需要像傳統攝像模組，在電路器件周圍預留安全距離，從而使得具有支架功能的所述封裝部1011B的高度可以設置在較小的範圍，從而進一步提供了攝像模組厚度可以減小的空間。此外，所述封裝部1011B代替傳統的支架，避免了支架在粘貼組裝時帶來的傾斜誤差，減小了攝像模組組裝的累積公差。且所述封裝部1011B包覆所述連接線10124B，且所述封裝部1011B延伸至所述感光晶片10121B的非感光區101212B，使得所述封裝部1011B可以向內收縮，從而進一步減小所述攝像模組的橫向的長寬尺寸。 It is also worth mentioning that the lens 1030B is mounted on the top of the encapsulation part 1011B of the photosensitive element 1010B, so that the encapsulation part 1011B is equivalent to the function of a bracket in a conventional camera module, which is the lens 1030B provides support, fixed position, but assembly is different from traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by sticking, and the encapsulation part 1011B is fixed to the circuit board main body 10122B by a molding process, and the sticking and fixing process is not required. It has better connection stability and process controllability, and there is no need to reserve glue space for AA adjustment between the packaging part 1011B and the circuit board body 10122B, thus reducing the AA of the traditional camera module Adjust the reserved space so that the camera module The thickness is reduced; on the other hand, the encapsulation part 1011B encapsulates the circuit element 10123B and the connection wire 10124B, so that the conventional bracket function and the circuit element 10123B and the connection wire 10124B can be arranged to overlap in space, It is not necessary to reserve a safe distance around the circuit device like a traditional camera module, so that the height of the encapsulation part 1011B with the bracket function can be set in a small range, thereby further providing a reduced thickness of the camera module. space. In addition, the encapsulation part 1011B replaces the traditional bracket, which avoids the inclination error caused when the bracket is pasted and assembled, and reduces the cumulative tolerance of the camera module assembly. And the encapsulation portion 1011B wraps the connection line 10124B, and the encapsulation portion 1011B extends to the non-photosensitive area 101212B of the photosensitive chip 10121B, so that the encapsulation portion 1011B can shrink inward, thereby further reducing the The horizontal length and width of the camera module.

參照圖12和圖14，根據本發明的第三個優選實施例的另一攝像模組將被闡釋。所述攝像模組10100B可以為一動焦攝像模組。所述攝像模組包括一所述感光組件1010B、一所述濾光片1020B、一馬達1040B和一鏡頭1030B。 12 and 14, another camera module according to the third preferred embodiment of the present invention will be explained. The camera module 10100B can be a moving focus camera module. The camera module includes a photosensitive component 1010B, a filter 1020B, a motor 1040B and a lens 1030B.

所述濾光片1020B被安裝於所述感光組件1010B，所述鏡頭1030B被安裝於所述馬達1040B，所述馬達1040B被安裝於所述模塑感光組件1010B上。 The filter 1020B is mounted on the photosensitive element 1010B, the lens 1030B is mounted on the motor 1040B, and the motor 1040B is mounted on the molded photosensitive element 1010B.

更進一步，所述濾光片1020B被安裝於所述感光組件1010B的所述封裝部1011B的頂端。所述馬達1040B安裝於所述感光組件1010B的所述封裝部1011B的頂端。特別地，所述濾光片1020B和所述馬達1040B在所述封裝部1011B的具體安裝位置可以根據具體需要協調配置。 Furthermore, the filter 1020B is mounted on the top of the encapsulation portion 1011B of the photosensitive element 1010B. The motor 1040B is mounted on the top of the package portion 1011B of the photosensitive element 1010B. In particular, the specific installation positions of the optical filter 1020B and the motor 1040B in the packaging portion 1011B can be coordinated and configured according to specific needs.

本領域技術人員應當理解的是，上述攝像模組的結構和類型僅作為舉例，來說明所述攝像模組可以被實施的方式，並不是本發明的限制。 It should be understood by those skilled in the art that the structures and types of the above-mentioned camera modules are only used as examples to illustrate the manner in which the camera modules can be implemented, and are not limitations of the present invention.

參照圖15和圖17，根據本發明的第四個優選實施例的感光組件1010C和攝像模組10100C將被闡釋。所述感光元件1010C用於組裝製造所述攝 像模組，從而得到模塑型的攝像模組。所述感光組件1010C包括一封裝部1011C和感光部1012C，所述封裝部1011C模塑地連接於所述感光部1012C。 15 and 17, a photosensitive assembly 1010C and a camera module 10100C according to a fourth preferred embodiment of the present invention will be explained. The photosensitive element 1010C is used to assemble and manufacture the image module, thereby obtaining a molded camera module. The photosensitive component 1010C includes a packaging portion 1011C and a photosensitive portion 1012C, and the packaging portion 1011C is connected to the photosensitive portion 1012C by molding.

所述感光部1012C包括一線路板主體10122C和一感光晶片10121C，所述感光晶片10121C被設置於所述線路板主體10122C上。根據本發明的這個實施例，所述感光晶片10121C模塑地連接於所述線路板主體10122。 The photosensitive portion 1012C includes a circuit board body 10122C and a photosensitive wafer 10121C, and the photosensitive wafer 10121C is disposed on the circuit board body 10122C. According to this embodiment of the present invention, the photosensitive wafer 10121C is connected to the circuit board body 10122 by molding.

根據本發明這個實施例，所述感光部1012C包括一連接線路和至少一電路元件10123C。所述連接線路預設於所述線路板主體10122C，所述電路元件10123C電連接於所述連接線路以及所述感光晶片10121C，以供所述感光晶片10121C的感光工作過程。所述電路元件10123C凸出地設置於所述線路板主體10122C。所述電路元件10123C可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 1012C includes a connecting line and at least one circuit element 10123C. The connection circuit is preset on the circuit board main body 10122C, and the circuit element 10123C is electrically connected to the connection circuit and the photosensitive chip 10121C for the photosensitive working process of the photosensitive chip 10121C. The circuit element 10123C is protrudingly disposed on the circuit board body 10122C. The circuit element 10123C can be, by way of example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.

值得一提的是，所述封裝部1011C將所述電路元件10123C包覆於其內部，因此使得所述電路元件10123C不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片10121C相通的環境中，從而當組裝為所述攝像模組時，所述電路元件10123C上不會沾染灰塵等污染物，也不會影響所述感光晶片10121C，不同于傳統攝像模組中電路元件10123C暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件10123C表面，避免污染所述感光晶片10121C而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation portion 1011C encapsulates the circuit element 10123C inside, so that the circuit element 10123C is not directly exposed to the space, more specifically, is not exposed to the In the environment where the photosensitive chip 10121C is connected, so that when assembled into the camera module, the circuit element 10123C will not be contaminated with dust and other pollutants, nor will it affect the photosensitive chip 10121C, which is different from the traditional camera module. The existence of the circuit element 10123C exposed, such as a container, so as to prevent dust and debris from staying on the surface of the circuit element 10123C by molding and wrapping, so as to avoid contaminating the photosensitive chip 10121C and making the camera module appear dirty and black Points and other undesirable phenomena.

所述封裝部1011C形成一通孔101100C，以便於為所述感光晶片10121C提供感光路徑。 A through hole 101100C is formed in the package portion 1011C, so as to provide a photosensitive path for the photosensitive chip 10121C.

根據本發明的這個優選實施例，所述感光部1012C包括至少一連接線10124C，用於電連接所述感光晶片10121C和所述線路板主體10122C。進一步，所述連接線10124C可以被實施為，舉例地但不限於，金線、銅線、鋁 線、銀線等。特別地，所述連接線10124C呈弧形地連接所述感光晶片10121C和所述線路板主體10122C。 According to this preferred embodiment of the present invention, the photosensitive portion 1012C includes at least one connection line 10124C for electrically connecting the photosensitive wafer 10121C and the circuit board main body 10122C. Further, the connecting wire 10124C may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire wire, silver wire, etc. In particular, the connecting wire 10124C connects the photosensitive wafer 10121C and the circuit board main body 10122C in an arc shape.

值得一提的是，所述連接線10124C被模塑于所述封裝部1011C內部，從而可以借助所述封裝部1011C將所述連接線10124C進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線10124C不會受到任何的碰觸損傷，同時減少環境因素對個所述連接線10124C的影響，如溫度，使得所述感光晶片10121C和所述線路板主體10122C之間的通訊連接穩定，這一點是完全不提供于現有技術的。 It is worth mentioning that the connecting wire 10124C is molded inside the packaging part 1011C, so that the connecting wire 10124C can be covered by the packaging part 1011C without being directly exposed to the outside, so as to assemble When the camera module is used, the connecting wire 10124C will not be damaged by any touch, and the influence of environmental factors on the connecting wire 10124C, such as temperature, is reduced, so that the photosensitive chip 10121C and the circuit board are The communication connection between the main bodies 10122C is stable, which is completely not provided in the prior art.

值得一提的是，所述封裝部1011C包覆所述電路元件10123C和所述連接線10124C，具有保護所述電路元件10123C和所述連接線10124C及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部1011C不限於包覆所述電路元件10123C或所述連接線10124C。也就是說，在本發明的其他實施例中，所述封裝部1011C可以直接模塑於沒有凸出的所述電路元件10123C的所述線路板主體10122C，也可以是模塑於所述電路元件10123C外側、周圍等不同位置。 It is worth mentioning that the encapsulation portion 1011C covers the circuit element 10123C and the connecting wire 10124C, and protects the circuit element 10123C and the connecting wire 10124C, as well as a camera module for better performance. However, those skilled in the art should understand that the encapsulation portion 1011C is not limited to encapsulating the circuit element 10123C or the connecting wire 10124C. That is to say, in other embodiments of the present invention, the encapsulation portion 1011C may be directly molded on the circuit board body 10122C of the circuit element 10123C without protruding, or may be molded on the circuit element 10123C outside and around different positions.

進一步，所述感光晶片10121C具有一感光區101211C和一非感光區101212C，所述非感光區101212C環繞於所述感光區101211C週邊。所述感光區101211C用於進行感光作用，所述連接線10124C連接於所述非感光區101212C。 Further, the photosensitive wafer 10121C has a photosensitive area 101211C and a non-photosensitive area 101212C, and the non-photosensitive area 101212C surrounds the periphery of the photosensitive area 101211C. The photosensitive area 101211C is used for photosensitive action, and the connection line 10124C is connected to the non-photosensitive area 101212C.

根據本發明的這個優選實施例，所述封裝部1011C延伸於所述感光晶片10121C的所述非感光區101212C，從而將所述感光晶片10121C通過模塑的方式疊層固定於所述線路板主體10122C。通過這樣的方式，如模塑於晶片的方式(Molding on the chip)擴大了所述封裝部1011C向內的可模塑範圍，從而可以減小所述線路板主體10122C以及所述封裝部1011C的外側的結構性部分， 進一步減小所述感光元件的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 1011C extends from the non-photosensitive area 101212C of the photosensitive wafer 10121C, so that the photosensitive wafer 10121C is laminated and fixed to the circuit board body by molding 10122C. In this way, the inward molding range of the encapsulation portion 1011C is expanded, such as molding on the chip, so that the circuit board body 10122C and the encapsulation portion 1011C can be reduced in size. the outer structural part, The length and width dimensions of the photosensitive element are further reduced, and the length and width dimensions of the camera module assembled therewith are reduced.

在本發明的這個實施例中，所述封裝部1011C凸起地圍繞於所述感光晶片10121C的所述感光區101211C外側，特別地，所述封裝部1011C一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件1010C被用於組裝所述攝像模組時，所述感光晶片10121C被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 1011C protrudes around the outside of the photosensitive region 101211C of the photosensitive wafer 10121C, and in particular, the encapsulation portion 1011C is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so when the photosensitive element 1010C is used to assemble the camera module, the photosensitive wafer 10121C is sealed inside to form a closed inner space.

具體地，在製造所述感光元件1010C時，可以選取一傳統的線路板作為所述線路板主體10122C，在所述線路板主體10122C上設置一所述感光晶片10121C，將所述感光晶片10121C通過所述連接線10124C電連接，進而在初步組裝後的所述線路板主體10122C和感光晶片10121C部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部1011C，或用半導體封裝中常用的模壓工藝形成所述封裝部1011C。所述線路板主體10122C可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)等。所述封裝部1011C形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部1011C可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用熱熔性樹脂或熱固性樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 1010C, a conventional circuit board can be selected as the circuit board body 10122C, a photosensitive wafer 10121C is set on the circuit board body 10122C, and the photosensitive wafer 10121C is passed through the circuit board body 10122C. The connecting wires 10124C are electrically connected, and then molding is performed on the circuit board body 10122C and the photosensitive wafer 10121C after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The circuit board after the surface mount process) is molded to form the package portion 1011C, or the package portion 1011C is formed by a molding process commonly used in semiconductor packaging. The circuit board body 10122C can be selected to be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a hard PCB board (without a flex board), and the like. The manner in which the encapsulation portion 1011C is formed may be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the encapsulation part 1011C are, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and heat can be used for the molding process. Melting resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

所述感光組件1010C進一步包括一濾光片1020C，所述濾光片1020C模塑地疊層設置於所述感光晶片10121C上。所述濾光片1020C的邊緣被 模塑于所述封裝部1011C，從而固定所述濾光片1020C。值得一提的是，所述濾光片1020C覆蓋於所述感光晶片10121C上方，將所述感光晶片10121C與外部環境隔離，保護所述感光晶片10121C受到損傷以及防止灰塵的進入。 The photosensitive element 1010C further includes a filter 1020C, and the filter 1020C is molded and laminated on the photosensitive wafer 10121C. The edge of the filter 1020C is The filter 1020C is fixed by molding on the encapsulation portion 1011C. It is worth mentioning that the filter 1020C covers the top of the photosensitive wafer 10121C, isolates the photosensitive wafer 10121C from the external environment, protects the photosensitive wafer 10121C from damage and prevents dust from entering.

在製造所述感光元件1010C時，先將所述感光晶片10121C貼附於所述線路板主體10122C，並將所述連接於所述感光晶片10121C和所述線路板主體10122C，進而將所述濾光片1020C貼附於所述感光晶片10121C上，進一步，將所述線路板主體10122C和所述感光晶片10121C和所述濾光片1020C進行模塑，形成所述封裝部1011C。在模塑時，由於所述濾光片1020C覆蓋於所述感光晶片10121C上，因此能夠防止模塑的模具對於所述感光晶片10121C的傷害，且由於所述濾光片1020C與所述感光晶片10121C的距離減小，因此可以使得由其組裝的攝像模組的後焦距縮小，從而減小所述攝像模組的高度，另一方面，由於不需要為所述濾光片1020C提供額外的支撐部件，因此也在一定程度上使得所述攝像模組的厚度得以進一步減小。 When manufacturing the photosensitive element 1010C, the photosensitive wafer 10121C is first attached to the circuit board main body 10122C, and the photosensitive wafer 10121C and the circuit board main body 10122C are connected to the photosensitive wafer 10121C, and then the filter The light sheet 1020C is attached to the photosensitive wafer 10121C, and further, the circuit board main body 10122C, the photosensitive wafer 10121C and the light filter 1020C are molded to form the packaging portion 1011C. During molding, since the filter 1020C covers the photosensitive wafer 10121C, damage to the photosensitive wafer 10121C can be prevented by the molded mold, and the filter 1020C and the photosensitive wafer 10121C can be prevented from being damaged. The distance of 10121C is reduced, so the back focal length of the camera module assembled by it can be reduced, thereby reducing the height of the camera module. On the other hand, since there is no need to provide additional support for the filter 1020C Therefore, to a certain extent, the thickness of the camera module can be further reduced.

值得一提的是，所述封裝部1010C的內壁可以根據所述連接線的形狀的而設置，比如設置為傾斜狀，從而在包覆所述連接線10124C的同時使得所述感光晶片10121C可以接收到等多光線。本領域的技術人員應當理解的是，所述封裝部1011C的形狀並不是本發明的限制。 It is worth mentioning that, the inner wall of the encapsulation part 1010C can be set according to the shape of the connecting wire, for example, set to be inclined, so that the photosensitive chip 10121C can be covered while the connecting wire 10124C is covered. Receives multiple rays of light. Those skilled in the art should understand that the shape of the packaging portion 1011C is not a limitation of the present invention.

參照圖15至圖17，根據本發明的第四個優選實施例的攝像模組10100C。所述攝像模組可以是一定焦模組。所述攝像模組包括一所述感光組件1010C和一鏡頭1030C。所述鏡頭1030C被安裝於所述感光元件1010C上，組裝形成所述攝像模組。 15 to 17 , a camera module 10100C according to a fourth preferred embodiment of the present invention is shown. The camera module can be a fixed focus module. The camera module includes a photosensitive component 1010C and a lens 1030C. The lens 1030C is mounted on the photosensitive element 1010C, and assembled to form the camera module.

特別地，所述鏡頭1030C可以通過粘接的方式固定於所述感光元件1010C的所述封裝部1011C的頂端，且借助模塑工藝中模具製造的特點，使得 所述封裝部1011C的頂端具有較好的平整性，為所述鏡頭1030C提供良好的安裝條件，從而獲得優質的攝像模組。 In particular, the lens 1030C can be fixed to the top of the encapsulation portion 1011C of the photosensitive element 1010C by means of bonding, and by virtue of the characteristics of mold manufacturing in the molding process, the The top of the encapsulation portion 1011C has good flatness, which provides good installation conditions for the lens 1030C, thereby obtaining a high-quality camera module.

值得一提的是，所述鏡頭1030C被安裝於所述感光組件1010C的所述封裝部1011C的頂端，從而所述封裝部1011C相當於傳統攝像模組中的支架的功能，為所述鏡頭1030C提供支撐、固定位置，但是組裝卻不同于傳統COB工藝過程。傳統COB工藝的攝像模組的支架以粘貼的方式固定於線路板，而所述封裝部1011C通過模塑工藝固定於所述線路板主體10122C，不需要粘貼固定過程，模塑方式相對於粘貼固定具有更好的連接穩定性以及工藝過程的可控性，且在所述封裝部1011C與所述線路板主體10122C之間不需要預留AA調整的膠水空間，因此減小了傳統攝像模組AA調整的預留空間，使得攝像模組的厚度得以減小；另一方面，所述封裝部1011C包覆所述電路元件10123C和所述連接線10124C，使得傳統的支架功能和電路元件10123C以及所述連接線10124C可以在空間上重疊設置，不需要像傳統攝像模組，在電路器件周圍預留安全距離，從而使得具有支架功能的所述封裝部1011C的高度可以設置在較小的範圍，從而進一步提供了攝像模組厚度可以減小的空間。此外，所述封裝部1011C代替傳統的支架，避免了支架在粘貼組裝時帶來的傾斜誤差，減小了攝像模組組裝的累積公差。且所述封裝部1011C包覆所述連接線10124C，且所述封裝部1011C延伸至所述感光晶片10121C的非感光區101212C，使得所述封裝部1011C可以向內收縮，從而進一步減小所述攝像模組的橫向長寬尺寸。而且，所述感光元件1010C將所述濾光片1020C模塑在其內部，因此在組裝所述攝像模組時，不需要再次進行濾光片的粘貼安裝過程，從而減少攝像模組組裝工藝過程，提高工作效率，這些都是優於現有技術的。 It is worth mentioning that the lens 1030C is mounted on the top of the encapsulation part 1011C of the photosensitive element 1010C, so that the encapsulation part 1011C is equivalent to the function of a bracket in a conventional camera module, which is the lens 1030C Provide support, fixed position, but assembly is different from traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by sticking, and the encapsulation part 1011C is fixed to the circuit board main body 10122C by a molding process, and the sticking and fixing process is not required. It has better connection stability and process controllability, and there is no need to reserve glue space for AA adjustment between the packaging part 1011C and the circuit board body 10122C, thus reducing the size of the traditional camera module AA The adjusted reserved space reduces the thickness of the camera module; on the other hand, the encapsulation portion 1011C encapsulates the circuit element 10123C and the connecting wire 10124C, so that the traditional bracket function and the circuit element 10123C and all The connecting wires 10124C can be overlapped in space, and there is no need to reserve a safe distance around the circuit device like a traditional camera module, so that the height of the encapsulation portion 1011C with the bracket function can be set in a smaller range, thereby This further provides a space where the thickness of the camera module can be reduced. In addition, the encapsulation part 1011C replaces the traditional bracket, which avoids the inclination error caused when the bracket is pasted and assembled, and reduces the cumulative tolerance of the camera module assembly. And the encapsulation portion 1011C wraps the connection line 10124C, and the encapsulation portion 1011C extends to the non-photosensitive area 101212C of the photosensitive chip 10121C, so that the encapsulation portion 1011C can shrink inward, thereby further reducing the The horizontal length and width of the camera module. Moreover, the photosensitive element 1010C molds the filter 1020C inside, so when assembling the camera module, there is no need to perform the process of pasting and installing the filter again, thereby reducing the process of assembling the camera module , improve work efficiency, which are superior to the existing technology.

參照圖15、圖16和圖18，是根據本發明的第四個優選實施例的另一攝像模組10100C將被闡釋。所述攝像模組可以為一動焦攝像模組 (Automatic Focus Model，AFM)。所述攝像模組包括一所述感光組件1010C、一馬達1040C和一鏡頭1030C。 15, 16 and 18, another camera module 10100C according to the fourth preferred embodiment of the present invention will be explained. The camera module can be a moving focus camera module (Automatic Focus Model, AFM). The camera module includes a photosensitive component 1010C, a motor 1040C and a lens 1030C.

所述鏡頭1030C被安裝於所述馬達1040C，所述馬達1040C被安裝於所述感光元件1010C上，以便於通過所述馬達1040C調節所述攝像模組焦距。所述馬達1040C安裝於所述感光組件1010C的所述封裝部1011C的頂端。 The lens 1030C is mounted on the motor 1040C, and the motor 1040C is mounted on the photosensitive element 1010C, so that the focal length of the camera module can be adjusted by the motor 1040C. The motor 1040C is mounted on the top of the package portion 1011C of the photosensitive element 1010C.

本領域技術人員應當理解的是，上述攝像模組的結構和類型僅作為舉例，來說明所述攝像模組可以被實施的方式，並不是本發明的限制。 It should be understood by those skilled in the art that the structures and types of the above-mentioned camera modules are only used as examples to illustrate the manner in which the camera modules can be implemented, and are not limitations of the present invention.

參照圖19A和20A，根據本發明的第五個優選實施例的感光組件1010D和攝像模組10100D將被闡釋。所述感光元件1010D用於組裝製造所述攝像模組，從而得到模塑型的所述攝像模組。所述感光組件1010D包括一封裝部1011D和一感光部1012D，所述封裝部1011D模塑地連接於所述感光部1012D。 19A and 20A, a photosensitive assembly 1010D and a camera module 10100D according to a fifth preferred embodiment of the present invention will be explained. The photosensitive element 1010D is used to assemble and manufacture the camera module, thereby obtaining the molded camera module. The photosensitive component 1010D includes a packaging portion 1011D and a photosensitive portion 1012D, and the packaging portion 1011D is connected to the photosensitive portion 1012D by molding.

特別地，所述封裝部以MOC的方式模塑於所述感光部1012D。 In particular, the encapsulation portion is molded on the photosensitive portion 1012D in a MOC manner.

所述感光部1012D包括一線路板主體10122D和一感光晶片10121D，所述感光晶片10121D被設置於所述線路板主體10122D上。根據本發明的這個實施例，所述感光晶片10121D模塑地連接於所述線路板主體10122D。 The photosensitive portion 1012D includes a circuit board body 10122D and a photosensitive wafer 10121D, and the photosensitive wafer 10121D is disposed on the circuit board body 10122D. According to this embodiment of the present invention, the photosensitive wafer 10121D is connected to the circuit board body 10122D by molding.

根據本發明這個實施例，所述感光部1012D包括一連接線路和至少一電路元件10123D。所述連接線路預設於所述線路板主體10122D，所述電路元件10123D電連接於所述連接線路以及所述感光晶片10121D，以供所述感光晶片10121D的感光工作過程。所述電路元件10123D凸出地設置於所述線路板主體10122D。所述電路元件10123D可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。值得一提的是，所述封裝部1011D將所述電路元件10123D包覆於其內部，因此使得所述電路元件10123D不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片10121D相通 的環境中，從而當組裝為所述攝像模組時，所述電路元件10123D上不會沾染灰塵等污染物，也不會影響所述感光晶片10121D，不同于傳統攝像模組中電路元件10123D暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件10123D表面，避免污染所述感光晶片10121D而使得攝像模組出現汙黑點等不良現象。 According to this embodiment of the present invention, the photosensitive portion 1012D includes a connecting line and at least one circuit element 10123D. The connection circuit is preset on the circuit board main body 10122D, and the circuit element 10123D is electrically connected to the connection circuit and the photosensitive chip 10121D for the photosensitive working process of the photosensitive chip 10121D. The circuit element 10123D is protrudingly disposed on the circuit board body 10122D. The circuit element 10123D may be, by way of example and not limitation, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like. It is worth mentioning that the encapsulation part 1011D encapsulates the circuit element 10123D inside, so that the circuit element 10123D will not be directly exposed to the space, more specifically, will not be exposed to the The photosensitive chip 10121D is connected Therefore, when assembled into the camera module, the circuit element 10123D will not be contaminated with contaminants such as dust, and will not affect the photosensitive chip 10121D, which is different from the exposure of the circuit element 10123D in the conventional camera module. Existence method, such as blocking the container, so as to prevent dust and debris from staying on the surface of the circuit element 10123D by molding and wrapping, to avoid contamination of the photosensitive chip 10121D and cause the camera module to appear black spots and other undesirable phenomena .

所述封裝部1011D形成一通孔101100D，以便於為所述感光晶片10121D提供感光路徑。 A through hole 101100D is formed in the package portion 1011D so as to provide a photosensitive path for the photosensitive chip 10121D.

根據本發明的這個優選實施例，所述感光部1012D包括至少一連接線10124D，用於電連接所述感光晶片10121D和所述線路板主體10122D。進一步，所述連接線10124D可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線10124D呈弧形地連接所述感光晶片10121D和所述線路板主體10122D。 According to this preferred embodiment of the present invention, the photosensitive portion 1012D includes at least one connecting wire 10124D for electrically connecting the photosensitive wafer 10121D and the circuit board main body 10122D. Further, the connecting wire 10124D may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connection line 10124D connects the photosensitive wafer 10121D and the circuit board main body 10122D in an arc shape.

值得一提的是，所述連接線10124D被模塑于所述封裝部1011D內部，從而可以借助所述封裝部1011D將所述連接線10124D進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線10124D不會受到任何的碰觸損傷，同時減少環境因素對所述連接線10124D的影響，如溫度，使得所述感光晶片10121D和所述線路板主體10122D之間的通訊連接穩定，這一點是完全不同于現有技術的。 It is worth mentioning that the connecting wire 10124D is molded inside the packaging part 1011D, so that the connecting wire 10124D can be covered by the packaging part 1011D without being directly exposed to the outside, so as to assemble When the camera module is used, the connecting wire 10124D will not be damaged by any touch, and the influence of environmental factors on the connecting wire 10124D, such as temperature, can be reduced, so that the photosensitive chip 10121D and the circuit board body The communication connection between 10122Ds is stable, which is completely different from the existing technology.

值得一提的是，所述封裝部1011D包覆所述電路元件10123D和所述連接線10124D，具有保護所述電路元件10123D和所述連接線10124D及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部1011D不限於包覆所述電路元件10123D或所述連接線10124D。也就是說，在本發明的其他實施例中，所述封裝部1011D可以直接模塑於沒有 凸出的所述電路元件10123D的所述線路板主體10122D，也可以是模塑於所述電路元件10123D外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 1011D covers the circuit element 10123D and the connecting wire 10124D, and protects the circuit element 10123D and the connecting wire 10124D and the camera module for better performance. However, those skilled in the art should understand that the encapsulation part 1011D is not limited to encapsulating the circuit element 10123D or the connecting wire 10124D. That is, in other embodiments of the present invention, the encapsulation part 1011D can be directly molded without The circuit board main body 10122D of the protruding circuit element 10123D may also be molded at different positions outside and around the circuit element 10123D.

所述感光組件1010D進一步包括一濾光片1020D，所述濾光片1020D模塑地疊層設置於所述感光晶片10121D上。所述濾光片1020D的邊緣被模塑于所述封裝部1011D，從而固定所述濾光片1020D。值得一提的是，所述濾光片1020D覆蓋於所述感光晶片10121D上方，將所述感光晶片10121D與外部環境隔離，保護所述感光晶片10121D不受到損傷以及防止灰塵的進入。 The photosensitive component 1010D further includes a filter 1020D, and the filter 1020D is molded and laminated on the photosensitive wafer 10121D. The edge of the filter 1020D is molded on the encapsulation portion 1011D, thereby fixing the filter 1020D. It is worth mentioning that the filter 1020D covers the photosensitive wafer 10121D, isolates the photosensitive wafer 10121D from the external environment, protects the photosensitive wafer 10121D from damage and prevents dust from entering.

進一步，所述感光晶片10121D具有一感光區101211D和一非感光區101212D，所述非感光區101212D環繞於所述感光區101211D週邊。所述感光區101211D用於進行感光作用，所述連接線10124D連接於所述非感光區101212D。 Further, the photosensitive wafer 10121D has a photosensitive area 101211D and a non-photosensitive area 101212D, and the non-photosensitive area 101212D surrounds the periphery of the photosensitive area 101211D. The photosensitive area 101211D is used for photosensitive action, and the connection line 10124D is connected to the non-photosensitive area 101212D.

根據本發明的這個優選實施例，所述封裝部1011D延伸於所述感光晶片10121D的所述非感光區101212D，從而將所述感光晶片10121D通過模塑的方式疊層固定於所述線路板主體10122D。通過這樣的方式，如模塑於晶片的方式(Molding on the Chip，MOC)擴大了所述封裝部1011D向內的可模塑範圍，從而可以減小所述線路板主體10122D以及所述封裝部1011D的外側的結構性部分，進一步減小所述感光部1012D的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 1011D extends to the non-photosensitive area 101212D of the photosensitive wafer 10121D, so that the photosensitive wafer 10121D is laminated and fixed to the circuit board body by molding 10122D. In this way, the molding on the chip (Molding on the Chip, MOC) expands the inward moldable range of the package portion 1011D, so that the circuit board body 10122D and the package portion can be reduced in size The outer structural part of 1011D further reduces the length and width of the photosensitive portion 1012D, and reduces the length and width of the camera module assembled by it.

在本發明的這個實施例中，所述封裝部1011D凸起地圍繞於所述感光晶片10121D的所述感光區101211D外側，特別地，所述封裝部1011D一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件1010D被用於組裝所述攝像模組時，所述感光晶片10121D被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 1011D protrudes around the outside of the photosensitive region 101211D of the photosensitive wafer 10121D, and in particular, the encapsulation portion 1011D is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so when the photosensitive element 1010D is used to assemble the camera module, the photosensitive wafer 10121D is sealed inside to form a closed inner space.

具體地，在製造所述感光元件1010D時，可以選取一傳統的線路板作為所述線路板主體10122D，在所述線路板主體10122D上設置一所述感光晶片10121D，將所述感光晶片10121D通過所述連接線10124D電連接，進而在初步組裝後的所述線路板主體10122D和感光晶片10121D部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部1011D，或用半導體封裝中常用的模壓工藝形成所述封裝部1011D。所述線路板主體10122D可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)等。所述封裝部1011D形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部1011D可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用熱熔性樹脂或熱固性樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 1010D, a conventional circuit board can be selected as the circuit board body 10122D, a photosensitive wafer 10121D is set on the circuit board body 10122D, and the photosensitive wafer 10121D is passed through the circuit board body 10122D. The connecting wires 10124D are electrically connected, and then molding is performed on the circuit board body 10122D and the photosensitive wafer 10121D after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The circuit board after the surface mount process) is molded to form the package portion 1011D, or the package portion 1011D is formed by a molding process commonly used in semiconductor packaging. The circuit board body 10122D can be selected to be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a hard PCB board (without a flex board), and the like. The manner of forming the encapsulation portion 1011D may be selected as, for example, but not limited to, injection molding process, molding process, and the like. The material that can be selected for the encapsulation part 1011D is, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and heat can be used for the molding process. Melting resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

進一步，所述封裝部1011D包括一包覆段10111D、一濾光片安裝段10112D和一鏡頭安裝段10113D，所述濾光片安裝段10112D和所述鏡頭安裝段10113D依次一體地模塑連接于所述包覆段10111D，所述包覆段10111D模塑連接於所述線路板主體10122D，用於包覆所述電路元件10123D和所述連接線10124D。所述鏡頭安裝段10113D用於安裝一鏡頭1030D，也就是說，當所述感光元件1010D被用於組裝所述攝像模組時，所述鏡頭1030D被安裝于所述封裝部1011D的所述鏡頭安裝段10113D內側，以便於為所述鏡頭1030D提供穩定的安裝位置。所述鏡頭安裝段10113D具有一鏡頭安裝槽101131D，所述鏡頭安裝槽101131D連通於所述通孔101100D，為所述鏡頭1030D提供充足的安裝空 間。也就是說，所述封裝部1011D具有一所述濾光片安裝槽101121D和一所述鏡頭安裝槽101131D，所述濾光片1020D被安裝於所述安裝槽101121D，所述鏡頭1030D被安裝於所述鏡頭安裝槽101131D。圖19A和圖20所示，所述濾光片1020D被一體封裝于所述封裝部1011的所包覆段，因此不需要設置所述安裝槽101121D。 Further, the encapsulation part 1011D includes a covering section 10111D, a filter mounting section 10112D and a lens mounting section 10113D, the filter mounting section 10112D and the lens mounting section 10113D are integrally molded and connected to the The cladding section 10111D is connected to the circuit board body 10122D by molding, and is used for cladding the circuit element 10123D and the connecting wire 10124D. The lens mounting section 10113D is used to mount a lens 1030D, that is, when the photosensitive element 1010D is used to assemble the camera module, the lens 1030D is mounted on the lens of the packaging portion 1011D The inner side of the mounting section 10113D is in order to provide a stable mounting position for the lens 1030D. The lens mounting section 10113D has a lens mounting groove 101131D, and the lens mounting groove 101131D is communicated with the through hole 101100D to provide sufficient mounting space for the lens 1030D. between. That is to say, the package portion 1011D has a filter mounting groove 101121D and a lens mounting groove 101131D, the filter 1020D is mounted in the mounting groove 101121D, and the lens 1030D is mounted in the mounting groove 101121D. The lens mounting groove 101131D. As shown in FIG. 19A and FIG. 20 , the optical filter 1020D is integrally packaged in the covered section of the package portion 1011 , so the mounting groove 101121D does not need to be provided.

所述鏡頭安裝段10113D一體地向上延伸，且內部形成臺階狀結構，為所述鏡頭1030D提供支撐固定位置，從而不需要提供額外的部件來安裝所述鏡頭1030D。換句話說，所述封裝部1011D一體地向上延伸，且內部形成臺階狀，以分別包覆所述電路元件和所述連接線以及支撐所述鏡頭。 The lens mounting section 10113D integrally extends upward, and forms a stepped structure inside to provide a supporting and fixing position for the lens 1030D, so that no additional components are required to mount the lens 1030D. In other words, the encapsulation portion 1011D integrally extends upward, and forms a step shape inside to cover the circuit element and the connecting wire and support the lens, respectively.

所述鏡頭安裝段10113D具有一鏡頭內壁101132D，所述鏡頭內壁101132D呈閉合環形，適於為所述鏡頭1030D提供安裝空間。值得一提的是，所述鏡頭安裝段10113D的所述鏡頭內壁101132D表面平整，從而適於安裝無螺紋的所述鏡頭1030D，形成定焦模組。特別地，所述鏡頭1030D可以通過粘接的方式固定於所述鏡頭安裝段10113D。當然，所述鏡頭內壁201132還可以是開放式的環形結構，也就是說，可以是帶有開口的結構，本領域的技術人員應當理解的是，所述鏡頭內壁101132D的結構並不是本發明的限制。 The lens mounting section 10113D has a lens inner wall 101132D, and the lens inner wall 101132D is in the shape of a closed ring, suitable for providing an installation space for the lens 1030D. It is worth mentioning that the inner wall 101132D of the lens of the lens mounting section 10113D has a flat surface, which is suitable for installing the lens 1030D without threads to form a fixed focus module. In particular, the lens 1030D can be fixed to the lens mounting section 10113D by means of bonding. Of course, the lens inner wall 201132 can also be an open annular structure, that is to say, it can be a structure with an opening. Those skilled in the art should understand that the structure of the lens inner wall 101132D is not the original structure. Invention limitations.

值得一提的是，所述封裝部1011D的所述包覆段10111D的內壁可以根據所述連接線的形狀的而設置，比如設置為傾斜狀，從而在包覆所述連接線10124D的同時使得所述感光晶片10121D可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部1011D的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the covering section 10111D of the encapsulation part 1011D can be set according to the shape of the connecting wire, for example, set to be inclined, so that the connecting wire 10124D is covered at the same time. So that the photosensitive wafer 10121D can receive more light. Those skilled in the art should understand that the shape of the packaging part 1011D is not a limitation of the present invention.

參照圖19B，根據本發明的第五個優選實施例的變形實施方式，所述感光元件1010D中，所述封裝部1011D包括一包覆段10111D、一濾光片安裝段10112D和一鏡頭安裝段10113D，所述濾光片安裝段10112D和所述鏡頭安裝段10113D依次一體地模塑連接于所述包覆段10111D，所述包覆段10111D模 塑連接於所述線路板主體10122D，用於包覆所述電路元件10123D和所述連接線10124D。所述鏡頭安裝段10113D用於安裝一鏡頭1030D，也就是說，當所述感光元件1010D被用於組裝所述攝像模組時，所述鏡頭1030D被安裝于所述封裝部1011D的所述鏡頭安裝段10113D內側，以便於為所述鏡頭1030D提供穩定的安裝位置。所述鏡頭安裝段10113D具有一鏡頭安裝槽101131D，所述鏡頭安裝槽101131D連通於所述通孔101100D，為所述鏡頭1030D提供充足的安裝空間。也就是說，所述封裝部1011D具有一所述安裝槽101121D和一所述鏡頭安裝槽101131D，所述濾光片1020D被安裝於所述安裝槽101121D，所述鏡頭1030D被安裝於所述鏡頭安裝槽101131D。 19B , according to the modified implementation of the fifth preferred embodiment of the present invention, in the photosensitive element 1010D, the packaging portion 1011D includes a covering section 10111D, a filter mounting section 10112D and a lens mounting section 10113D, the filter mounting section 10112D and the lens mounting section 10113D are sequentially integrally molded and connected to the cladding section 10111D, and the cladding section 10111D is molded It is plastically connected to the circuit board body 10122D for covering the circuit element 10123D and the connecting wire 10124D. The lens mounting section 10113D is used to mount a lens 1030D, that is, when the photosensitive element 1010D is used to assemble the camera module, the lens 1030D is mounted on the lens of the packaging portion 1011D The inner side of the mounting section 10113D is in order to provide a stable mounting position for the lens 1030D. The lens mounting section 10113D has a lens mounting groove 101131D, and the lens mounting groove 101131D communicates with the through hole 101100D to provide sufficient mounting space for the lens 1030D. That is to say, the package portion 1011D has a mounting groove 101121D and a lens mounting groove 101131D, the filter 1020D is mounted in the mounting groove 101121D, and the lens 1030D is mounted on the lens Mounting slot 101131D.

所述鏡頭安裝段10113D一體地向上延伸，且內部形成臺階狀結構，為所述鏡頭1030D提供支撐固定位置，從而不需要提供額外的部件來安裝所述鏡頭1030D。換句話說，所述封裝部1011D一體地向上延伸，且內部形成臺階狀，以分別包覆所述電路元件10123D和所述連接線10124D，並且為所述濾光片1020D和所述鏡頭1030D提供安裝位置。所述鏡頭安裝段10113D限位所述鏡頭或所述馬達1040，從而使得所述鏡頭1030D或所述馬達1040D快速、準確地安裝於對應的位置。 The lens mounting section 10113D integrally extends upward, and forms a stepped structure inside to provide a supporting and fixing position for the lens 1030D, so that no additional components are required to mount the lens 1030D. In other words, the encapsulation part 1011D integrally extends upward, and forms a step shape inside to cover the circuit element 10123D and the connecting wire 10124D respectively, and provide the filter 1020D and the lens 1030D installation location. The lens mounting section 10113D limits the lens or the motor 1040, so that the lens 1030D or the motor 1040D can be quickly and accurately installed at the corresponding position.

所述鏡頭安裝段10113D的高度和結構可以根據需求設置，可以是封閉的圓筒型結構，也可以是存在間隙的、間隔的限位壁或限位柱。 The height and structure of the lens mounting section 10113D can be set according to requirements, and it can be a closed cylindrical structure, or a limit wall or a limit column with gaps and intervals.

參照圖20A，根據本發明的第五個優選實施例的攝像模組10100D。所述攝像模組可以是一定焦模組。所述攝像模組包括一所述感光組件1010D和一所述鏡頭1030D。 Referring to FIG. 20A , a camera module 10100D according to a fifth preferred embodiment of the present invention is shown. The camera module can be a fixed focus module. The camera module includes the photosensitive component 1010D and the lens 1030D.

更具體地，所述鏡頭1030D被安裝於所述感光組件1010D的所述封裝部1011D的所述鏡頭安裝段10113D的所述鏡頭安裝槽101131D。所述濾光片1020D被模塑於所述感光元件1011D，因此不需要提供額外的濾光片，也不 需要在組裝所述攝像模塑時，單獨安裝濾光片，因此，減少組裝的過程，且模塑濾光片的方式使得所述攝像模組的後焦距可以減小。 More specifically, the lens 1030D is mounted in the lens mounting groove 101131D of the lens mounting section 10113D of the packaging portion 1011D of the photosensitive component 1010D. The filter 1020D is molded into the photosensitive element 1011D, so there is no need to provide additional filters, nor When assembling the camera molding, the filter needs to be installed separately, so the assembling process is reduced, and the way of molding the filter can reduce the back focal length of the camera module.

還值得一提的是，所述鏡頭1030D被安裝於所述感光組件1010D的所述封裝部1011D的所述鏡頭安裝段10113D，從而所述封裝部1011D相當於傳統攝像模組中的支架或鏡筒的功能，為所述鏡頭1030D提供支撐、固定位置，但是組裝卻不同于傳統COB工藝過程。傳統COB工藝的攝像模組的支架以粘貼的方式固定於線路板，而所述封裝部1011D通過模塑工藝固定於所述線路板主體10122D，不需要粘貼固定過程，模塑方式相對於粘貼固定具有更好的連接穩定性以及工藝過程的可控性，且在所述封裝部1011D與所述線路板主體10122D之間不需要預留AA調整的膠水空間，因此減小了傳統攝像模組AA調整的預留空間，使得攝像模組的厚度得以減小，而且根據本發明的模塑方式的所述封裝部1011D具有較好的平整度，因此在組裝所述攝像模組時，可以不進行AA調整；另一方面，所述封裝部1011D包覆所述電路元件10123D和所述連接線10124D，使得傳統的支架功能和電路元件10123D以及所述連接線10124D可以在空間上重疊設置，不需要像傳統攝像模組，在電路器件周圍預留安全距離，從而使得具有支架功能的所述封裝部1011D的高度可以設置在較小的範圍，從而進一步提供了攝像模組厚度可以減小的空間。此外，所述封裝部1011D代替傳統的支架，且為所述鏡頭1030D提供安裝位置，避免了支架在粘貼組裝時帶來的傾斜誤差，減小了攝像模組組裝的累積公差。且所述封裝部1011D包覆所述連接線10124D，且所述封裝部1011D延伸至所述感光晶片10121D的非感光區101212D，使得所述封裝部1011D可以向內收縮，從而進一步減小所述攝像模組的橫向的長寬尺寸。 It is also worth mentioning that the lens 1030D is mounted on the lens mounting section 10113D of the encapsulation portion 1011D of the photosensitive component 1010D, so that the encapsulation portion 1011D is equivalent to a bracket or a mirror in a conventional camera module. The function of the barrel is to provide support and a fixed position for the lens 1030D, but the assembly is different from the traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by sticking, and the encapsulation part 1011D is fixed to the circuit board main body 10122D by a molding process, and the sticking and fixing process is not required. It has better connection stability and process controllability, and there is no need to reserve glue space for AA adjustment between the packaging part 1011D and the circuit board body 10122D, thus reducing the size of the traditional camera module AA The adjusted reserved space reduces the thickness of the camera module, and the encapsulation part 1011D according to the molding method of the present invention has better flatness, so when assembling the camera module, it is not necessary to carry out AA adjustment; on the other hand, the encapsulation part 1011D wraps the circuit element 10123D and the connecting wire 10124D, so that the traditional bracket function and the circuit element 10123D and the connecting wire 10124D can be spatially overlapped, without the need for Like a traditional camera module, a safe distance is reserved around the circuit device, so that the height of the package portion 1011D with the bracket function can be set in a small range, thereby further providing a space where the thickness of the camera module can be reduced. In addition, the encapsulation portion 1011D replaces the traditional bracket, and provides a mounting position for the lens 1030D, which avoids the tilt error caused by the bracket assembly, and reduces the cumulative tolerance of the camera module assembly. And the encapsulation portion 1011D covers the connection line 10124D, and the encapsulation portion 1011D extends to the non-photosensitive area 101212D of the photosensitive chip 10121D, so that the encapsulation portion 1011D can be retracted inward, thereby further reducing the The horizontal length and width of the camera module.

圖20B是根據本發明的第五個優選實施例的另一變形實施方式的攝像模組10100D。所述封裝部1011D包括一包覆段10111D、一濾光片安裝段 10112D和一凸起10113D，所述濾光片安裝段10112D和所述凸起10113D依次一體地模塑連接于所述包覆段10111D，所述包覆段10111D模塑連接於所述線路板主體10122D，用於包覆所述電路元件10123D和所述連接線10124D。 FIG. 20B is a camera module 10100D according to another modification of the fifth preferred embodiment of the present invention. The encapsulation part 1011D includes a covering section 10111D and a filter mounting section 10112D and a protrusion 10113D, the filter mounting section 10112D and the protrusion 10113D are sequentially integrally molded and connected to the cladding section 10111D, and the cladding section 10111D is molded and connected to the circuit board body 10122D, for covering the circuit element 10123D and the connecting wire 10124D.

所述凸起10113D自所述濾光片安裝段1112D部分地向上延伸，並且於所述濾光片安裝段10112D形成一外安裝槽101131D，以便於安裝所述鏡頭1030D或所述馬達1040D。也就是說，所述凸起10113D將所述鏡頭1030D或所述馬達1040D安裝位置與所述感光元件1010D的內部空間隔離，以便於阻擋所述鏡頭1030D或所述馬達1040D的粘接介質，如膠水向內部擴散，而污染所述鏡頭1030D中的鏡片或所述攝像模組內部。也就是說，所述封裝部1011D具有一所述安裝槽101121D、一所述外安裝槽101131D，所述安裝槽101121位於內側，用於安裝所述濾光片1020D，所述外安裝槽101131D位於外側，用於安裝所述鏡頭1030D或所述馬達1040D。 The protrusion 10113D partially extends upward from the filter mounting section 1112D, and an outer mounting groove 101131D is formed in the filter mounting section 10112D to facilitate mounting the lens 1030D or the motor 1040D. That is to say, the protrusion 10113D isolates the installation position of the lens 1030D or the motor 1040D from the inner space of the photosensitive element 1010D, so as to block the adhesive medium of the lens 1030D or the motor 1040D, such as The glue spreads to the inside and contaminates the lens in the lens 1030D or the inside of the camera module. That is to say, the encapsulation portion 1011D has the mounting groove 101121D and the outer mounting groove 101131D, the mounting groove 101121 is located on the inner side for mounting the optical filter 1020D, and the outer mounting groove 101131D is located at the inner side. The outer side is used to install the lens 1030D or the motor 1040D.

參照圖21和圖22，根據本發明第六個優選實施例的感光元件1010E和攝像模組10100E將被闡釋。所述感光元件1010E用於組裝製造所述攝像模組，從而得到模塑型的所述攝像模組。所述感光組件1010E包括一封裝部1011E和感光部1012E，所述封裝部1011E模塑地連接於所述感光部1012E。 21 and 22, a photosensitive element 1010E and a camera module 10100E according to a sixth preferred embodiment of the present invention will be explained. The photosensitive element 1010E is used for assembling and manufacturing the camera module, so as to obtain the molded camera module. The photosensitive assembly 1010E includes a package portion 1011E and a photosensitive portion 1012E, and the package portion 1011E is connected to the photosensitive portion 1012E by molding.

所述感光部1012E包括一線路板主體10122E和一感光晶片10121E，所述感光晶片10121E被設置於所述線路板主體10122E上。根據本發明的這個實施例，所述感光晶片10121E模塑地連接於所述線路板主體10122。 The photosensitive portion 1012E includes a circuit board body 10122E and a photosensitive wafer 10121E, and the photosensitive wafer 10121E is disposed on the circuit board body 10122E. According to this embodiment of the present invention, the photosensitive wafer 10121E is connected to the circuit board body 10122 by molding.

根據本發明這個實施例，所述感光部1012E包括一連接線路和至少一電路元件10123E。所述連接線路預設於所述線路板主體10122E，所述電路元件10123E電連接於所述連接線路以及所述感光晶片10121E，以供所述感光晶片10121E的感光工作過程。所述電路元件10123E凸出地設置於所述線路板主體 10122E。所述電路元件10123E可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 1012E includes a connecting line and at least one circuit element 10123E. The connection circuit is preset on the circuit board body 10122E, and the circuit element 10123E is electrically connected to the connection circuit and the photosensitive chip 10121E for the photosensitive working process of the photosensitive chip 10121E. The circuit element 10123E is protrudingly disposed on the main body of the circuit board 10122E. The circuit element 10123E can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay or a driver, and the like.

值得一提的是，所述封裝部1011E將所述電路元件10123E包覆於其內部，因此使得所述電路元件10123E不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片10121E相通的環境中，從而當組裝為所述攝像模組時，所述電路元件10123E上不會沾染灰塵等污染物，也不會影響所述感光晶片10121E，不同于傳統攝像模組中電路元件10123E暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件10123E表面，避免污染所述感光晶片10121E而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation portion 1011E encapsulates the circuit element 10123E inside, so that the circuit element 10123E is not directly exposed to the space, more specifically, is not exposed to the The photosensitive chip 10121E is in the same environment, so that when assembled into the camera module, the circuit element 10123E will not be contaminated with dust and other pollutants, nor will it affect the photosensitive chip 10121E, which is different from the traditional camera module. The circuit element 10123E is exposed in a way, such as a container, so as to prevent dust and debris from staying on the surface of the circuit element 10123E by molding and wrapping, so as to avoid contaminating the photosensitive chip 10121E and making the camera module appear dirty and black Points and other undesirable phenomena.

所述封裝部1011E形成一通孔101100E，以便於為所述感光晶片10121E提供感光路徑。 A through hole 101100E is formed in the package portion 1011E, so as to provide a photosensitive path for the photosensitive chip 10121E.

根據本發明的這個優選實施例，所述感光部1012E包括至少一連接線10124E，用於電連接所述感光晶片10121E和所述線路板主體10122E。進一步，所述連接線10124E可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線10124E呈弧形地連接所述感光晶片10121E和所述線路板主體10122E。 According to this preferred embodiment of the present invention, the photosensitive portion 1012E includes at least one connecting wire 10124E for electrically connecting the photosensitive wafer 10121E and the circuit board main body 10122E. Further, the connecting wire 10124E may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connecting wire 10124E connects the photosensitive wafer 10121E and the circuit board main body 10122E in an arc shape.

值得一提的是，所述連接線10124E被模塑于所述封裝部1011E內部，從而可以借助所述封裝部1011E將所述連接線10124E進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線10124E不會受到任何的碰觸損傷，同時減少環境因素對各所述連接線10124E的影響，如溫度，使得所述感光晶片10121E和所述線路板主體10122E之間的通訊連接穩定，這一點是完全不提供于現有技術的。 It is worth mentioning that the connecting wire 10124E is molded inside the packaging part 1011E, so that the connecting wire 10124E can be covered by the packaging part 1011E without being directly exposed to the outside, so as to assemble When the camera module is used, the connection wires 10124E will not be damaged by any touch, and the influence of environmental factors on the connection wires 10124E, such as temperature, is reduced, so that the photosensitive chip 10121E and the circuit board are The communication connection between the main bodies 10122E is stable, which is completely not provided in the prior art.

值得一提的是，所述封裝部1011E包覆所述電路元件10123E和所述連接線10124E，具有保護所述電路元件10123E和所述連接線10124E及其得到 更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部1011E不限於包覆所述電路元件10123E或所述連接線10124E。也就是說，在本發明的其他實施例中，所述封裝部1011E可以直接模塑於沒有凸出的所述電路元件10123E的所述線路板主體10122E，也可以是模塑於所述電路元件10123E外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 1011E covers the circuit element 10123E and the connecting wire 10124E, and has the function of protecting the circuit element 10123E and the connecting wire 10124E and the resulting However, those skilled in the art should understand that the encapsulation portion 1011E is not limited to encapsulating the circuit element 10123E or the connecting wire 10124E. That is to say, in other embodiments of the present invention, the encapsulation portion 1011E may be directly molded on the circuit board body 10122E of the circuit element 10123E without protruding, or may be molded on the circuit element 10123E outside, around and other different positions.

所述感光組件1010E進一步包括一濾光片1020E，所述濾光片1020E模塑地疊層設置於所述感光晶片10121E上。所述濾光片1020E的邊緣被模塑于所述封裝部1011E，從而固定所述濾光片1020E。值得一提的是，所述濾光片1020E覆蓋於所述感光晶片10121E上方，將所述感光晶片10121E與外部環境隔離，保護所述感光晶片10121E不受到損傷以及防止灰塵的進入。 The photosensitive element 1010E further includes a filter 1020E, and the filter 1020E is laminated on the photosensitive wafer 10121E by molding. The edge of the filter 1020E is molded on the encapsulation portion 1011E, thereby fixing the filter 1020E. It is worth mentioning that the filter 1020E covers the photosensitive wafer 10121E, isolates the photosensitive wafer 10121E from the external environment, protects the photosensitive wafer 10121E from damage and prevents dust from entering.

進一步，所述感光晶片10121E具有一感光區101211E和一非感光區101212E，所述非感光區101212E環繞於所述感光區101211E週邊。所述感光區101211E用於進行感光作用，所述連接線10124E連接於所述非感光區101212E。 Further, the photosensitive wafer 10121E has a photosensitive area 101211E and a non-photosensitive area 101212E, and the non-photosensitive area 101212E surrounds the periphery of the photosensitive area 101211E. The photosensitive area 101211E is used for photosensitive action, and the connection line 10124E is connected to the non-photosensitive area 101212E.

根據本發明的這個優選實施例，所述封裝部1011E延伸於所述感光晶片10121E的所述非感光區101212E，從而將所述感光晶片10121E通過模塑的方式疊層固定於所述線路板主體10122E。通過這樣的方式，如模塑於晶片的方式(Molding on chip)擴大了所述封裝部1011E向內的可模塑範圍，從而可以減小所述線路板主體10122E以及所述封裝部1011E的外側的結構性部分，進一步減小所述模塑感光部1012E的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 1011E extends to the non-photosensitive area 101212E of the photosensitive wafer 10121E, so that the photosensitive wafer 10121E is laminated and fixed to the circuit board body by molding 10122E. In this way, the inward moldable range of the encapsulation portion 1011E can be expanded by molding on a chip, so that the circuit board body 10122E and the outside of the encapsulation portion 1011E can be reduced The structural part of , further reduces the length and width of the molded photosensitive portion 1012E, and reduces the length and width of the camera module assembled by it.

在本發明的這個實施例中，所述封裝部1011E凸起地圍繞於所述感光晶片10121E的所述感光區101211E外側，特別地，所述封裝部1011E一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件1010E被 用於組裝所述攝像模組時，所述感光晶片10121E被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 1011E protrudes around the outside of the photosensitive region 101211E of the photosensitive wafer 10121E, and in particular, the encapsulation portion 1011E is integrally closed and connected, so that the encapsulation portion has good sealing properties, so that when the photosensitive element 1010E is When used for assembling the camera module, the photosensitive chip 10121E is sealed inside to form a closed inner space.

具體地，在製造所述感光元件1010E時，可以選取一傳統的線路板作為所述線路板主體10122E，在所述線路板主體10122E上設置一所述感光晶片10121E，將所述感光晶片10121E通過所述連接線10124E電連接，進而在初步組裝後的所述線路板主體10122E和感光晶片10121E部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部1011E，或用半導體封裝中常用的模壓工藝形成所述封裝部1011E。所述線路板主體10122E可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)等。所述封裝部1011E形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部1011E可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用熱熔性樹脂或熱固性樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 1010E, a conventional circuit board can be selected as the circuit board body 10122E, a photosensitive wafer 10121E is set on the circuit board body 10122E, and the photosensitive wafer 10121E is passed through the circuit board body 10122E. The connecting wires 10124E are electrically connected, and then molding is performed on the circuit board main body 10122E and the photosensitive wafer 10121E after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The circuit board after the surface mount process) is molded to form the package portion 1011E, or the package portion 1011E is formed by a molding process commonly used in semiconductor packaging. The circuit board body 10122E can be selected to be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a hard PCB board (without a flex board), and the like. The manner in which the encapsulation part 1011E is formed may be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the encapsulation part 1011E are, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and heat can be used for the molding process. Melting resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

進一步，所述封裝部1011E包括一包覆段10111E和一鏡頭安裝段10113E，所述鏡頭安裝段10113E一體地模塑連接于所述包覆段10111E，所述包覆段10111E模塑連接於所述線路板主體10122E，用於包覆所述電路元件10123E和所述連接線10124E。所述鏡頭安裝段10113E用於安裝一鏡頭1030E，也就是說，當所述感光元件1010E被用於組裝所述攝像模組時，所述鏡頭1030E被安裝于所述封裝部1011E的所述鏡頭安裝段10113E內側，以便於為所述鏡頭1030E提供穩定的安裝位置。 Further, the encapsulation part 1011E includes a covering section 10111E and a lens mounting section 10113E, the lens mounting section 10113E is integrally molded and connected to the covering section 10111E, and the covering section 10111E is molded and connected to the The circuit board main body 10122E is used to cover the circuit element 10123E and the connecting wire 10124E. The lens mounting section 10113E is used to mount a lens 1030E, that is, when the photosensitive element 1010E is used to assemble the camera module, the lens 1030E is mounted on the lens of the packaging portion 1011E The inside of the mounting section 10113E, so as to provide a stable mounting position for the lens 1030E.

更進一步，所述鏡頭安裝段10113E具有一鏡頭安裝槽101131E，所述鏡頭安裝槽101131E連通於所述通孔101100E，為所述鏡頭1030E提供充足的安裝空間。也就是說，所述封裝部1011E具有一所述鏡頭安裝槽101131E，所述鏡頭1030E被安裝於所述鏡頭安裝槽101131E。 Furthermore, the lens mounting section 10113E has a lens mounting groove 101131E, and the lens mounting groove 101131E communicates with the through hole 101100E to provide sufficient mounting space for the lens 1030E. That is, the package portion 1011E has the lens mounting groove 101131E, and the lens 1030E is mounted in the lens mounting groove 101131E.

所述鏡頭安裝段10113E沿所述包覆部10111E一體地向上延伸，且內部形成臺階狀結構，為所述鏡頭1030E提供支撐固定位置，從而不需要提供額外的部件來安裝所述鏡頭1030E。換句話說，所述封裝部1011E一體地向上延伸，且內部形成臺階狀，以分別包覆所述電路元件和所述連接線10124E，並且支撐所述鏡頭1030E。 The lens mounting section 10113E integrally extends upward along the cladding portion 10111E, and forms a stepped structure inside to provide a supporting and fixing position for the lens 1030E, so that no additional components are required to mount the lens 1030E. In other words, the encapsulation portion 1011E integrally extends upward, and forms a step shape inside to cover the circuit element and the connection wire 10124E respectively, and support the lens 1030E.

所述鏡頭安裝段10113E具有一鏡頭內壁101132E，所述鏡頭內壁101132E呈閉合環形，適於鏡頭1030E提供安裝空間。值得一提的是，所述鏡頭安裝段10113E的所述鏡頭內壁表面101132E具有螺紋結構，從而適於安裝帶螺紋的所述鏡頭1030E，形成定焦模組。特別地，所述鏡頭1030E可以通過螺接的方式固定於所述鏡頭安裝段10113E。 The lens mounting section 10113E has a lens inner wall 101132E, and the lens inner wall 101132E is in the shape of a closed ring, suitable for providing an installation space for the lens 1030E. It is worth mentioning that the lens inner wall surface 101132E of the lens mounting section 10113E has a threaded structure, which is suitable for installing the threaded lens 1030E to form a fixed focus module. In particular, the lens 1030E can be fixed to the lens mounting section 10113E by screwing.

值得一提的是，所述封裝部1011的所述包覆段10111E的內壁可以根據所述連接線的形狀的而設置，比如設置為傾斜狀，從而在包覆所述連接線10124E的同時使得所述感光晶片10121E可以接收到等多光線。本領域的技術人員應當理解的是，所述封裝部1011E的形狀並不是本發明的限制。 It is worth mentioning that, the inner wall of the covering section 10111E of the encapsulation part 1011 can be set according to the shape of the connecting wire, for example, set to be inclined, so as to cover the connecting wire 10124E at the same time So that the photosensitive wafer 10121E can receive the same amount of light. Those skilled in the art should understand that the shape of the encapsulation part 1011E is not a limitation of the present invention.

參照圖22，根據本發明的第六個優選實施例的攝像模組10100E。所述攝像模組可以是一定焦模組。所述攝像模組包括一所述感光組件1010E和一所述鏡頭1030E。 22, a camera module 10100E according to a sixth preferred embodiment of the present invention is shown. The camera module can be a fixed focus module. The camera module includes a photosensitive component 1010E and a lens 1030E.

更具體地，所述鏡頭1030E被安裝於所述感光組件1010E的所述封裝部1011E的所述鏡頭安裝段10113E的所述鏡頭安裝槽101131E。所述濾光片1020E被模塑於所述感光元件1011E，因此不需要提供額外的濾光片，也不需要 在組裝所述攝像模塑時，單獨安裝濾光片，因此，減少所述攝像模組的組裝過程，且模塑濾光片的方式使得所述攝像模組的後焦距可以減小。 More specifically, the lens 1030E is mounted in the lens mounting groove 101131E of the lens mounting section 10113E of the packaging portion 1011E of the photosensitive component 1010E. The filter 1020E is molded into the photosensitive element 1011E, so there is no need to provide additional filters, nor When assembling the camera molding, the filter is installed separately, so the assembling process of the camera module is reduced, and the way of molding the filter allows the back focal length of the camera module to be reduced.

還值得一提的是，所述鏡頭1030E被安裝於所述感光組件1010E的所述封裝部1011E的所述鏡頭安裝段10113E，從而所述封裝部1011E相當於傳統攝像模組中的支架或鏡筒的功能，為所述鏡頭1030E提供支撐、固定位置，但是組裝卻不同于傳統COB工藝過程。傳統COB工藝的攝像模組的支架以粘貼的方式固定於線路板，而所述封裝部1011E通過模塑工藝固定於所述線路板主體10122E，不需要粘貼固定過程，模塑方式相對於粘貼固定具有更好的連接穩定性以及工藝過程的可控性，且在所述封裝部1011E與所述線路板主體10122E之間不需要預留AA調整的膠水空間，因此減小了傳統攝像模組AA調整的預留空間，使得攝像模組的厚度得以減小；另一方面，所述封裝部1011E包覆所述電路元件10123E和所述連接線10124E，使得傳統的支架功能和電路元件10123E以及所述連接線10124E可以在空間上重疊設置，不需要像傳統攝像模組，在電路器件周圍預留安全距離，從而使得具有支架功能的所述封裝部1011E的高度可以設置在較小的範圍，從而進一步提供了攝像模組厚度可以減小的空間。此外，所述封裝部1011E代替傳統的支架，且為所述鏡頭1030E提供安裝位置，避免了支架在粘貼組裝時帶來的傾斜誤差，減小了攝像模組組裝的累積公差。且所述封裝部1011E包覆所述連接線10124E，且所述封裝部1011E延伸至所述感光晶片10121E的非感光區101212E，使得所述封裝部1011E可以向內收縮，從而進一步減小所述攝像模組的橫向的長寬尺寸。 It is also worth mentioning that the lens 1030E is mounted on the lens mounting section 10113E of the encapsulation portion 1011E of the photosensitive component 1010E, so that the encapsulation portion 1011E is equivalent to a bracket or a mirror in a conventional camera module. The function of the barrel is to provide support and a fixed position for the lens 1030E, but the assembly is different from the traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by sticking, and the encapsulation part 1011E is fixed to the circuit board main body 10122E by a molding process, and the sticking and fixing process is not required, and the molding method is relatively fixed by sticking. It has better connection stability and process controllability, and there is no need to reserve glue space for AA adjustment between the packaging part 1011E and the circuit board body 10122E, thus reducing the AA of the traditional camera module Adjust the reserved space to reduce the thickness of the camera module; on the other hand, the encapsulation part 1011E covers the circuit element 10123E and the connecting wire 10124E, so that the traditional bracket function and the circuit element 10123E and all The connecting wires 10124E can be overlapped in space, and there is no need to reserve a safe distance around the circuit device like a traditional camera module, so that the height of the encapsulation portion 1011E with the bracket function can be set in a smaller range, thereby This further provides a space where the thickness of the camera module can be reduced. In addition, the encapsulation part 1011E replaces the traditional bracket, and provides a mounting position for the lens 1030E, which avoids the tilt error caused by the bracket assembly and reduces the cumulative tolerance of the camera module assembly. And the encapsulation portion 1011E wraps the connection line 10124E, and the encapsulation portion 1011E extends to the non-photosensitive area 101212E of the photosensitive chip 10121E, so that the encapsulation portion 1011E can shrink inward, thereby further reducing the The horizontal length and width of the camera module.

參照圖23和圖24，根據本發明的第七個優選實施例的感光組件1010F和攝像模組10100F將被闡釋。所述感光元件1010F用於組裝製造所述攝像模組，從而得到模塑型的所述攝像模組。所述感光組件1010F包括一封裝部1011F和一感光部1012F，所述封裝部1011F模塑地連接於所述感光部1012F。 23 and 24, a photosensitive assembly 1010F and a camera module 10100F according to a seventh preferred embodiment of the present invention will be explained. The photosensitive element 1010F is used to assemble and manufacture the camera module, thereby obtaining the molded camera module. The photosensitive component 1010F includes a package portion 1011F and a photosensitive portion 1012F, and the package portion 1011F is connected to the photosensitive portion 1012F by molding.

所述感光部1012F包括一線路板主體10122F和一感光晶片10121F，所述感光晶片10121F被設置於所述線路板主體10122F上。根據本發明的這個實施例，所述感光晶片10121F模塑地連接於所述線路主體10122F。 The photosensitive portion 1012F includes a circuit board body 10122F and a photosensitive wafer 10121F, and the photosensitive wafer 10121F is disposed on the circuit board body 10122F. According to this embodiment of the present invention, the photosensitive wafer 10121F is mold-connected to the line body 10122F.

根據本發明這個實施例，所述感光部1012F包括一連接線路和至少一電路元件10123F。所述連接線路預設於所述線路板主體10122F，所述電路元件10123F電連接於所述連接線路以及所述感光晶片10121F，以供所述感光晶片10121F的感光工作過程。所述電路元件10123F凸出地設置於所述線路板主體10122F。所述電路元件10123F可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 1012F includes a connecting line and at least one circuit element 10123F. The connection circuit is preset on the circuit board main body 10122F, and the circuit element 10123F is electrically connected to the connection circuit and the photosensitive chip 10121F for the photosensitive working process of the photosensitive chip 10121F. The circuit element 10123F is protrudingly disposed on the circuit board body 10122F. The circuit element 10123F can be, by way of example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.

值得一提的是，所述封裝部1011F將所述電路元件10123F包覆於其內部，因此使得所述電路元件10123F不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片10121F相通的環境中，從而當組裝為所述攝像模組時，所述電路元件10123F上不會沾染灰塵等污染物，也不會影響所述感光晶片10121F，不同于傳統攝像模組中電路元件10123F暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件10123F表面，避免污染所述感光晶片10121F而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation part 1011F encapsulates the circuit element 10123F inside, so that the circuit element 10123F will not be directly exposed to the space, more specifically, will not be exposed to the The photosensitive chip 10121F is in the same environment, so that when assembled into the camera module, the circuit element 10123F will not be contaminated with dust and other pollutants, nor will it affect the photosensitive chip 10121F, which is different from the traditional camera module. The circuit element 10123F is exposed in a way, such as a blocking device, so as to prevent dust and debris from staying on the surface of the circuit element 10123F by molding and wrapping, so as to avoid contaminating the photosensitive chip 10121F and making the camera module appear dirty and black Points and other undesirable phenomena.

所述封裝部1011F形成一通孔101100F，以便於為所述感光晶片10121F提供感光路徑。 A through hole 101100F is formed in the package portion 1011F, so as to provide a photosensitive path for the photosensitive chip 10121F.

根據本發明的這個優選實施例，所述感光部1012F包括至少一連接線10124F，用於電連接所述感光晶片10121F和所述線路板主體10122F。進一步，所述連接線10124F可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線10124F呈弧形地連接所述感光晶片10121F和所述線路板主體10122F。 According to this preferred embodiment of the present invention, the photosensitive portion 1012F includes at least one connecting wire 10124F for electrically connecting the photosensitive wafer 10121F and the circuit board main body 10122F. Further, the connecting wire 10124F may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connecting wire 10124F connects the photosensitive wafer 10121F and the circuit board main body 10122F in an arc shape.

值得一提的是，所述連接線10124F被模塑于所述封裝部1011F內部，從而可以借助所述封裝部1011F將所述連接線10124F進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線10124F不會受到任何的碰觸損傷，同時減少環境因素對個所述連接線10124F的影響，如溫度、濕度，使得所述感光晶片10121F和所述線路板主體10122F之間的通訊連接穩定，這一點是完全不同于現有技術的。 It is worth mentioning that the connecting wire 10124F is molded inside the packaging part 1011F, so that the connecting wire 10124F can be covered by the packaging part 1011F without being directly exposed to the outside, so as to assemble When the camera module is used, the connecting line 10124F will not be damaged by any touch, and the influence of environmental factors on the connecting line 10124F, such as temperature and humidity, is reduced, so that the photosensitive chip 10121F and the The communication connection between the circuit board main bodies 10122F is stable, which is completely different from the prior art.

值得一提的是，所述封裝部1011F包覆所述電路元件10123F和所述連接線10124F，具有保護所述電路元件10123F和所述連接線10124F及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部1011F不限於包覆所述電路元件10123F或所述連接線10124F。也就是說，在本發明的其他實施例中，所述封裝部1011F可以直接模塑於沒有凸出的所述電路元件10123F的所述線路板主體10122F，也可以是模塑於所述電路元件10123F外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 1011F covers the circuit element 10123F and the connecting wire 10124F, and has the aspects of protecting the circuit element 10123F and the connecting wire 10124F and the camera module for obtaining better performance. However, those skilled in the art should understand that the encapsulation portion 1011F is not limited to encapsulating the circuit element 10123F or the connecting wire 10124F. That is to say, in other embodiments of the present invention, the encapsulation portion 1011F may be directly molded on the circuit board body 10122F of the circuit element 10123F without protruding, or may be molded on the circuit element 10123F outside, around and other different positions.

進一步，所述感光晶片10121F具有一感光區101211F和一非感光區101212F，所述非感光區101212F環繞於所述感光區101211F週邊。所述感光區101211F用於進行感光作用，所述連接線10124F連接於所述非感光區101212F。 Further, the photosensitive wafer 10121F has a photosensitive area 101211F and a non-photosensitive area 101212F, and the non-photosensitive area 101212F surrounds the periphery of the photosensitive area 101211F. The photosensitive area 101211F is used for photosensitive action, and the connection line 10124F is connected to the non-photosensitive area 101212F.

根據本發明的這個優選實施例，所述封裝部1011F延伸於所述感光晶片10121F的所述非感光區101212F，從而將所述感光晶片10121F通過模塑的方式疊層固定於所述線路板主體10122F。通過這樣的方式，如模塑於晶片的方式(Molding on chip)擴大了所述封裝部1011F向內的可模塑範圍，從而可以減小所述線路板主體10122F以及所述封裝部1011F的外側的結構性部分，進一步減小所述模塑感光部1012F件的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 1011F extends to the non-photosensitive area 101212F of the photosensitive wafer 10121F, so that the photosensitive wafer 10121F is laminated and fixed to the circuit board body by molding 10122F. In this way, the moldable range of the encapsulation portion 1011F inwards is expanded, such as molding on a chip, so that the circuit board body 10122F and the outside of the encapsulation portion 1011F can be reduced The structural part of 1012F further reduces the length and width of the molded photosensitive part 1012F, and reduces the length and width of the camera module assembled by it.

在本發明的這個實施例中，所述封裝部1011F凸起地圍繞於所述感光晶片10121F的所述感光區101211F外側，特別地，所述封裝部1011F一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件1010F被用於組裝所述攝像模組時，所述感光晶片10121F被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 1011F protrudes around the outside of the photosensitive region 101211F of the photosensitive wafer 10121F, and in particular, the encapsulation portion 1011F is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so that when the photosensitive element 1010F is used to assemble the camera module, the photosensitive wafer 10121F is sealed inside to form a closed inner space.

具體地，在製造所述感光元件1010F時，可以選取一傳統的線路板作為所述線路板主體10122F，在所述線路板主體10122F上設置一所述感光晶片10121F，將所述感光晶片10121F通過所述連接線10124F電連接，進而在初步組裝後的所述線路板主體10122F和感光晶片10121F部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部1011F，或用半導體封裝中常用的模壓工藝形成所述封裝部1011F。所述線路板主體10122F可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)等。所述封裝部1011F形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部1011F可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用熱熔性樹脂或熱固性樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 1010F, a conventional circuit board can be selected as the circuit board body 10122F, a photosensitive wafer 10121F is set on the circuit board body 10122F, and the photosensitive wafer 10121F is passed through The connecting wires 10124F are electrically connected, and then molding is performed on the circuit board main body 10122F and the photosensitive wafer 10121F after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The circuit board after the surface mount process) is molded to form the package portion 1011F, or the package portion 1011F is formed by a molding process commonly used in semiconductor packaging. The circuit board body 10122F can be selected to be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a hard PCB board (without a flex board), and the like. The manner in which the encapsulation portion 1011F is formed may be selected from, for example, but not limited to, an injection molding process, a molding process, and the like. The material that can be selected for the encapsulation part 1011F is, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and heat can be used for the molding process. Melting resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

進一步，所述封裝部1011F包括一包覆段10111F和一濾光片安裝段10112F，所述濾光片安裝段10112F模塑地一體連接于所述包覆段10111F，所述包覆段10111F模塑連接於所述線路板主體10122F，用於包覆所述電路元件10123F和所述連接線10124F。所述濾光片安裝段10112F用於安裝一濾光片1020F，也就是說，當所述感光元件1010F被用於組裝所述攝像模組時，所述攝 像模組的濾光片1020F被安裝於所述濾光片安裝段10112F，使得所述濾光片1020F位於所述感光晶片10121F的感光路徑上，且不需要提供額外的濾光片安裝支架。也就是說，所述封裝部1011F在此處具有傳統支架的功能，但是基於模塑工藝的優勢，所述濾光片安裝段10112F頂部可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述濾光片1020F平整地被安裝，這一點也是優於傳統的攝像模組。 Further, the encapsulation portion 1011F includes a coating section 10111F and a filter mounting section 10112F, the filter mounting section 10112F is integrally connected to the coating section 10111F by molding, and the coating section 10111F molds It is plastically connected to the circuit board main body 10122F for covering the circuit element 10123F and the connecting wire 10124F. The filter installation section 10112F is used to install a filter 1020F, that is, when the photosensitive element 1010F is used to assemble the camera module, the camera The filter 1020F of the image module is mounted on the filter mounting section 10112F, so that the filter 1020F is located on the photosensitive path of the photosensitive wafer 10121F, and no additional filter mounting bracket is required. That is to say, the encapsulation part 1011F has the function of a traditional bracket, but based on the advantages of the molding process, the top of the filter mounting section 10112F can be made to have good flatness by the molding process. , so that the optical filter 1020F is installed flatly, which is also superior to the traditional camera module.

更進一步，所述濾光片安裝段10112F具有一安裝槽101121F，所述安裝槽101121F連通於所述通孔101100F，為所述濾光片1020F提供充足的安裝空間，使得所述濾光片1020F不會凸出于濾光片安裝段10112F的頂表面101122F。也就是說，所述封裝部1011F上端設置所述安裝槽101121F，以便於將所述濾光片1020F安裝于所述封裝部1011F且不會凸出于所述封裝部1011F的頂端。 Furthermore, the filter installation section 10112F has an installation groove 101121F, and the installation groove 101121F is communicated with the through hole 101100F to provide sufficient installation space for the optical filter 1020F, so that the optical filter 1020F can be installed. Does not protrude from the top surface 101122F of the filter mounting segment 10112F. That is to say, the mounting groove 101121F is provided on the upper end of the package portion 1011F, so that the filter 1020F can be mounted on the package portion 1011F without protruding from the top of the package portion 1011F.

值得一提的是，所述封裝部1011F的內壁可以根據所述連接線10124F的形狀的而設置，比如設置為傾斜狀，從而在包覆所述連接線10124F的同時使得所述感光晶片10121F可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部1011F的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part 1011F can be set according to the shape of the connecting wire 10124F, for example, set to be inclined, so that the photosensitive chip 10121F can be covered while the connecting wire 10124F is covered. more light can be received. Those skilled in the art should understand that the shape of the packaging portion 1011F is not a limitation of the present invention.

不同於上述優選實施例的是，所述線路板主體10122F具有至少一加固孔101221F，所述封裝部1011F延伸進入所述加固孔101221F內，從而增強所述線路板主體10122F的結構強度。換句話說，兩種不同材料相互結合，從而形成複合材料結構，使得作為基體的所述線路板主體10122F的結構強度增強。 Different from the above preferred embodiment, the circuit board body 10122F has at least one reinforcement hole 101221F, and the encapsulation portion 1011F extends into the reinforcement hole 101221F, thereby enhancing the structural strength of the circuit board body 10122F. In other words, two different materials are combined with each other to form a composite material structure, so that the structural strength of the circuit board main body 10122F as a base is enhanced.

所述加固孔101221F的位置可以根據需要選擇，以及根據所述線路板的結構強度需求來設置，比如呈對稱的結構。借由所述加固孔101221F的設置使得所述線路板主體10122F的結構強度增強，從而可以減小所述線路板主 體10122F的厚度，減小由其組裝的攝像模組的厚度，且提高所述感光元件1010F的散熱性能。 The positions of the reinforcement holes 101221F can be selected according to requirements and set according to the structural strength requirements of the circuit board, such as a symmetrical structure. Through the arrangement of the reinforcing holes 101221F, the structural strength of the circuit board main body 10122F can be enhanced, so that the main body of the circuit board can be reduced in size. The thickness of the body 10122F is reduced, the thickness of the camera module assembled therefrom is reduced, and the heat dissipation performance of the photosensitive element 1010F is improved.

值得一提的是，在本發明的這個實施例中，所述加固孔101221F為凹槽狀，從而製造所述感光元件1010F時，所述封裝部1011F的模塑材料不會由所述加固孔101221F漏出。 It is worth mentioning that, in this embodiment of the present invention, the reinforcing hole 101221F is in the shape of a groove, so that when the photosensitive element 1010F is manufactured, the molding material of the encapsulation part 1011F will not be affected by the reinforcing hole 101221F leaked.

與上述優選實施例類似，所述感光元件1010F可以被組裝為定焦模組或動焦模組，本領域的技術人員應當理解的是，所述感光元件1010F的組裝應用方式不是本發明的限制。 Similar to the above preferred embodiment, the photosensitive element 1010F can be assembled into a fixed focus module or a moving focus module. Those skilled in the art should understand that the assembly and application of the photosensitive element 1010F is not a limitation of the present invention .

參照圖25，根據本發明的第八個優選實施例的感光組件1010G將被闡釋。所述感光元件1010G用於組裝製造所述攝像模組，從而得到模塑型的所述攝像模組。所述感光組件1010G包括一封裝部1011G和感光部1012G，所述封裝部1011G模塑地連接於所述感光部1012G。 25, a photosensitive assembly 1010G according to an eighth preferred embodiment of the present invention will be explained. The photosensitive element 1010G is used to assemble and manufacture the camera module, thereby obtaining the molded camera module. The photosensitive component 1010G includes a packaging portion 1011G and a photosensitive portion 1012G, and the packaging portion 1011G is connected to the photosensitive portion 1012G by molding.

所述感光部1012G包括一線路板主體10122G和一感光晶片10121G，所述感光晶片10121G被設置於所述線路板主體10122G上。根據本發明的這個實施例，所述感光晶片10121G模塑地連接於所述線路板主體10122。 The photosensitive portion 1012G includes a circuit board body 10122G and a photosensitive wafer 10121G, and the photosensitive wafer 10121G is disposed on the circuit board body 10122G. According to this embodiment of the present invention, the photosensitive wafer 10121G is connected to the circuit board body 10122 by molding.

根據本發明這個實施例，所述感光部1012G包括一連接線路和至少一電路元件10123G。所述連接線路預設於所述線路板主體10122G，所述電路元件10123G電連接於所述連接線路以及所述感光晶片10121G，以供所述感光晶片10121G的感光工作過程。所述電路元件10123G凸出地設置於所述線路板主體10122G。所述電路元件10123G可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 1012G includes a connecting line and at least one circuit element 10123G. The connection circuit is preset on the circuit board main body 10122G, and the circuit element 10123G is electrically connected to the connection circuit and the photosensitive chip 10121G for the photosensitive working process of the photosensitive chip 10121G. The circuit element 10123G is protrudingly disposed on the circuit board body 10122G. The circuit element 10123G can be, by way of example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.

值得一提的是，所述封裝部1011G將所述電路元件10123G包覆於其內部，因此使得所述電路元件10123G不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片10121G相通的環境中，從而當組裝為所述攝像 模組時，所述電路元件10123G上不會沾染灰塵等污染物，也不會影響所述感光晶片10121G，不同于傳統攝像模組中電路元件10123G暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件10123G表面，避免污染所述感光晶片10121G而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation part 1011G encapsulates the circuit element 10123G inside, so that the circuit element 10123G is not directly exposed to the space, more specifically, is not exposed to the The photosensitive wafer 10121G communicates with the environment, so that when assembled for the camera During the module, the circuit element 10123G will not be contaminated with contaminants such as dust, and will not affect the photosensitive chip 10121G, which is different from the way in which the circuit element 10123G is exposed in the traditional camera module, such as the blocking device, so that the The method of molding and coating prevents dust and sundries from staying on the surface of the circuit element 10123G, and avoids contamination of the photosensitive chip 10121G, which causes the camera module to have black spots and other undesirable phenomena.

所述封裝部1011G形成一通孔101100G，以便於為所述感光晶片10121G提供感光路徑。 A through hole 101100G is formed in the package portion 1011G so as to provide a photosensitive path for the photosensitive chip 10121G.

根據本發明的這個優選實施例，所述感光部1012G包括至少一連接線10124G，用於電連接所述感光晶片10121G和所述線路板主體10122G。進一步，所述連接線10124G可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線10124G呈弧形地連接所述感光晶片10121G和所述線路板主體10122G。 According to this preferred embodiment of the present invention, the photosensitive portion 1012G includes at least one connecting wire 10124G for electrically connecting the photosensitive wafer 10121G and the circuit board main body 10122G. Further, the connecting wire 10124G may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connecting wire 10124G connects the photosensitive wafer 10121G and the circuit board main body 10122G in an arc shape.

值得一提的是，所述連接線10124G被模塑于所述封裝部1011G內部，從而可以借助所述封裝部1011G將所述連接線10124G進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線10124G不會受到任何的碰觸損傷，同時減少環境因素對個所述連接線10124G的影響，如溫度，使得所述感光晶片10121G和所述線路板主體10122G之間的通訊連接穩定，這一點是完全不提供于現有技術的。 It is worth mentioning that the connecting wire 10124G is molded inside the packaging part 1011G, so that the connecting wire 10124G can be covered by the packaging part 1011G without being directly exposed to the outside, so as to assemble When the camera module is used, the connecting line 10124G will not be damaged by any touch, and the influence of environmental factors on the connecting line 10124G, such as temperature, is reduced, so that the photosensitive chip 10121G and the circuit board are The communication connection between the main bodies 10122G is stable, which is completely not provided in the prior art.

值得一提的是，所述封裝部1011G包覆所述電路元件10123G和所述連接線10124G，具有保護所述電路元件10123G和所述連接線10124G及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部1011G不限於包覆所述電路元件10123G或所述連接線10124G。也就是說，在本發明的其他實施例中，所述封裝部1011G可以直接模塑於沒有凸出的所述電路元件10123G的所述線路板主體10122G，也可以是模塑於所述電路元件10123G外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 1011G covers the circuit element 10123G and the connecting wire 10124G, and protects the circuit element 10123G and the connecting wire 10124G and the camera module for better performance. However, those skilled in the art should understand that the encapsulation part 1011G is not limited to encapsulating the circuit element 10123G or the connecting wire 10124G. That is to say, in other embodiments of the present invention, the encapsulation portion 1011G may be directly molded on the circuit board body 10122G of the circuit element 10123G without protruding, or may be molded on the circuit element 10123G outside and around different locations.

進一步，所述感光晶片10121G具有一感光區101211G和一非感光區101212G，所述非感光區101212G環繞於所述感光區101211G週邊。所述感光區101211G用於進行感光作用，所述連接線10124G連接於所述非感光區101212G。 Further, the photosensitive wafer 10121G has a photosensitive area 101211G and a non-photosensitive area 101212G, and the non-photosensitive area 101212G surrounds the periphery of the photosensitive area 101211G. The photosensitive area 101211G is used for photosensitive action, and the connection line 10124G is connected to the non-photosensitive area 101212G.

根據本發明的這個優選實施例，所述封裝部1011G延伸於所述感光晶片10121G的所述非感光區101212G，從而將所述感光晶片10121G通過模塑的方式疊層固定於所述線路板主體10122G。通過這樣的方式，如模塑於晶片的方式(Molding on chip)擴大了所述封裝部1011G向內的可模塑範圍，從而可以減小所述線路板主體10122G以及所述封裝部1011G的外側的結構性部分，進一步減小所述模塑感光部1012G的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 1011G extends to the non-photosensitive area 101212G of the photosensitive wafer 10121G, so that the photosensitive wafer 10121G is laminated and fixed to the circuit board body by molding 10122G. In this way, the moldable range of the encapsulation portion 1011G inwards is expanded, such as molding on a chip, so that the circuit board body 10122G and the outside of the encapsulation portion 1011G can be reduced It further reduces the length and width of the molded photosensitive portion 1012G, and reduces the length and width of the camera module assembled therefrom.

在本發明的這個實施例中，所述封裝部1011G凸起地圍繞於所述感光晶片10121G的所述感光區101211G外側，特別地，所述封裝部1011G一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件1010G被用於組裝所述攝像模組時，所述感光晶片10121G被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 1011G protrudes around the outside of the photosensitive region 101211G of the photosensitive wafer 10121G, and in particular, the encapsulation portion 1011G is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so when the photosensitive element 1010G is used to assemble the camera module, the photosensitive wafer 10121G is sealed inside to form a closed inner space.

具體地，在製造所述感光元件1010G時，可以選取一傳統的線路板作為所述線路板主體10122G，在所述線路板主體10122G上設置一所述感光晶片10121G，將所述感光晶片10121G通過所述連接線10124G電連接，進而在初步組裝後的所述線路板主體10122G和感光晶片10121G部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部1011G，或用半導體封裝中常用的模壓工藝形成所述封裝部1011G。所述線路板主體10122G可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬 板(不帶軟板)等。所述封裝部1011G形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部1011G可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用熱熔性樹脂或熱固性樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 1010G, a conventional circuit board can be selected as the circuit board body 10122G, a photosensitive wafer 10121G is set on the circuit board body 10122G, and the photosensitive wafer 10121G is passed through the circuit board body 10122G. The connecting wires 10124G are electrically connected, and then molding is performed on the circuit board body 10122G and the photosensitive wafer 10121G after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The circuit board after the surface mount process) is molded to form the package portion 1011G, or the package portion 1011G is formed by a molding process commonly used in semiconductor packaging. The circuit board main body 10122G can be selected as, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a rigid PCB board (without soft board), etc. The manner of forming the encapsulation portion 1011G may be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The material that can be selected for the encapsulation part 1011G is, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and heat can be used for the molding process. Melting resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

進一步，所述封裝部1011G包括一包覆段10111G和一濾光片安裝段10112G，所述濾光片安裝段10112G模塑地一體連接于所述包覆段10111G，所述包覆段10111G模塑連接於所述線路板主體10122G，用於包覆所述電路元件10123G和所述連接線10124G。所述濾光片安裝段10112G用於安裝一濾光片1020G，也就是說，當所述感光元件1010G被用於組裝所述攝像模組時，所述攝像模組的濾光片1020G被安裝於所述濾光片安裝段10112G，使得所述濾光片1020G位於所述感光晶片10121G的感光路徑上，且不需要提供額外的濾光片1020G安裝支架。也就是說，所述封裝部1011G在此處具有傳統支架的功能，但是基於模塑工藝的優勢，所述濾光片安裝段10112G頂部可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述濾光片1020G平整地被安裝，這一點也是優於傳統的攝像模組。 Further, the encapsulation portion 1011G includes a coating section 10111G and a filter mounting section 10112G, the filter mounting section 10112G is integrally connected to the coating section 10111G by molding, and the coating section 10111G is molded integrally. It is plastically connected to the circuit board main body 10122G for covering the circuit element 10123G and the connecting wire 10124G. The filter installation section 10112G is used to install a filter 1020G, that is, when the photosensitive element 1010G is used to assemble the camera module, the filter 1020G of the camera module is installed In the filter installation section 10112G, the filter 1020G is located on the photosensitive path of the photosensitive wafer 10121G, and there is no need to provide an additional filter 1020G mounting bracket. That is to say, the encapsulation part 1011G has the function of a traditional bracket here, but based on the advantages of the molding process, the top of the filter mounting section 10112G can be made to have good flatness by means of the molding process. , so that the optical filter 1020G is installed flatly, which is also superior to the traditional camera module.

更進一步，所述濾光片安裝段10112G具有一安裝槽101121G，所述安裝槽連通於所述通孔101100G，為所述濾光片1020G提供充足的安裝空間，使得所述濾光片1020G不會凸出于濾光片安裝段10112G的頂表面101122G。也就是說，所述封裝部1011F上端設置所述安裝槽101121F，以便於將所述濾光片1020F安裝于所述封裝部1011F且不會凸出于所述封裝部1011F的頂端。 Further, the filter installation section 10112G has an installation groove 101121G, and the installation groove is communicated with the through hole 101100G to provide sufficient installation space for the optical filter 1020G, so that the optical filter 1020G does not It will protrude from the top surface 101122G of the filter mounting segment 10112G. That is to say, the mounting groove 101121F is provided on the upper end of the package portion 1011F, so that the filter 1020F can be mounted on the package portion 1011F without protruding from the top of the package portion 1011F.

值得一提的是，所述封裝部1011G的內壁可以根據所述連接線的形狀的而設置，比如設置為傾斜狀，從而在包覆所述連接線10124G的同時使得所述感光晶片10121G可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部1011G的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part 1011G can be set according to the shape of the connecting wire, for example, set to be inclined, so that the photosensitive chip 10121G can be covered while the connecting wire 10124G is covered. more light is received. Those skilled in the art should understand that the shape of the packaging portion 1011G is not a limitation of the present invention.

不同於上述優選實施例的是，所述線路板主體10122G具有至少一加固孔101221G，所述封裝部1011G延伸進入所述加固孔101221G內，從而增強所述線路板主體10122G的結構強度。換句話說，兩種不同材料相互結合，從而形成複合材料結構，使得作為基體的所述線路板主體10122G的結構強度增強。 Different from the above preferred embodiment, the circuit board body 10122G has at least one reinforcement hole 101221G, and the encapsulation portion 1011G extends into the reinforcement hole 101221G, thereby enhancing the structural strength of the circuit board body 10122G. In other words, two different materials are combined with each other to form a composite material structure, so that the structural strength of the circuit board main body 10122G as a base is enhanced.

所述加固孔101221G的位置可以根據需要選擇，以及根據所述線路板的結構強度需求來設置，比如呈對稱的結構。借由所述加固孔101221G的設置使得所述線路板主體10122G的結構強度增強，從而可以減小所述線路板主體10122G的厚度，減小由其組裝的攝像模組的厚度，且提高所述感光元件1010G的散熱性能。 The positions of the reinforcement holes 101221G can be selected according to requirements and set according to the structural strength requirements of the circuit board, such as a symmetrical structure. Through the arrangement of the reinforcing holes 101221G, the structural strength of the circuit board body 10122G can be enhanced, so that the thickness of the circuit board body 10122G can be reduced, the thickness of the camera module assembled therefrom can be reduced, and the The heat dissipation performance of the photosensitive element 1010G.

值得一提的是，根據本發明的這個優選實施例，所述加固孔101221G為穿孔，也就是說，穿過所述線路板主體10122G，使得所述線路板主體10122G的兩側連通，從而製造所述感光元件1010G時，所述封裝部1011G的模塑材料充分的與所述線路板主體10122G結合，形成更加牢固的複合材料結構，且相對所述凹槽的結構，所述穿孔更容易加工製造。 It is worth mentioning that, according to this preferred embodiment of the present invention, the reinforcing hole 101221G is a perforation, that is to say, it passes through the circuit board main body 10122G, so that the two sides of the circuit board main body 10122G are connected, thereby manufacturing When the photosensitive element 1010G is used, the molding material of the encapsulation part 1011G is sufficiently combined with the circuit board body 10122G to form a stronger composite material structure, and the perforation is easier to process than the groove structure. manufacture.

與上述優選實施例類似，所述感光元件1010G可以被組裝為定焦模組或動焦模組，本領域的技術人員應當理解的是，所述感光元件1010G的組裝應用方式不是本發明的限制。 Similar to the above preferred embodiment, the photosensitive element 1010G can be assembled into a fixed focus module or a moving focus module. Those skilled in the art should understand that the assembly and application of the photosensitive element 1010G is not a limitation of the present invention .

參照圖26，根據本發明的第九個優選實施例的攝像模組10100H將被闡釋。所述攝像模組可以是一定焦模組(Fix Focus Model，FFM)。所述 攝像模組10100H包括一感光組件1010H、一支架1050H、一濾光片1020H和一鏡頭1030H。 26, a camera module 10100H according to a ninth preferred embodiment of the present invention will be explained. The camera module may be a fixed focus module (Fix Focus Model, FFM). said The camera module 10100H includes a photosensitive component 1010H, a bracket 1050H, a filter 1020H and a lens 1030H.

所述支架1050H被安裝於所述感光組件1010H上，所述濾光片1020H被安裝於所述支架1050H，所述鏡頭1030H被安裝於所述支架1050H上。 The bracket 1050H is mounted on the photosensitive assembly 1010H, the filter 1020H is mounted on the bracket 1050H, and the lens 1030H is mounted on the bracket 1050H.

所述感光組件1010H包括一封裝部1011H和一感光部1012H，所述封裝部1011H模塑地連接於所述感光部1012H。 The photosensitive component 1010H includes a packaging portion 1011H and a photosensitive portion 1012H, and the packaging portion 1011H is connected to the photosensitive portion 1012H by molding.

所述感光部1012H包括一線路板主體10122H和一感光晶片10121H，所述感光晶片10121H被設置於所述線路板主體10122H上。根據本發明的這個實施例，所述感光晶片10121H模塑地連接於所述線路板主體10122。 The photosensitive portion 1012H includes a circuit board body 10122H and a photosensitive wafer 10121H, and the photosensitive wafer 10121H is disposed on the circuit board body 10122H. According to this embodiment of the present invention, the photosensitive wafer 10121H is connected to the circuit board body 10122 by molding.

根據本發明這個實施例，所述感光部1012H包括一連接線路和至少一電路元件10123H。所述連接線路預設於所述線路板主體10122H，所述電路元件10123H電連接於所述連接線路以及所述感光晶片10121H，以供所述感光晶片10121H的感光工作過程。所述電路元件10123H凸出地設置於所述線路板主體10122H。所述電路元件10123H可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 1012H includes a connecting line and at least one circuit element 10123H. The connection circuit is preset on the circuit board body 10122H, and the circuit element 10123H is electrically connected to the connection circuit and the photosensitive chip 10121H for the photosensitive working process of the photosensitive chip 10121H. The circuit element 10123H is protrudingly disposed on the circuit board body 10122H. The circuit element 10123H may be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay or a driver, and the like.

值得一提的是，所述封裝部1011H將所述電路元件10123H包覆於其內部，因此使得所述電路元件10123H不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片10121H相通的環境中，從而當組裝為所述攝像模組時，所述電路元件10123H上不會沾染灰塵等污染物，也不會影響所述感光晶片10121H，不同于傳統攝像模組中電路元件10123H暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件10123H表面，避免污染所述感光晶片10121H而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation portion 1011H encapsulates the circuit element 10123H inside, so that the circuit element 10123H is not directly exposed to the space, more specifically, is not exposed to the In the environment where the photosensitive chip 10121H is connected, so that when assembled into the camera module, the circuit element 10123H will not be contaminated with dust and other pollutants, nor will it affect the photosensitive chip 10121H, which is different from the traditional camera module. The existence of the circuit element 10123H exposed, such as a container, so as to prevent dust and debris from staying on the surface of the circuit element 10123H by molding and wrapping, so as to avoid contaminating the photosensitive chip 10121H and making the camera module appear dirty and black Points and other undesirable phenomena.

所述封裝部1011H形成一通孔101100H，以便於為所述感光晶片10121H提供感光路徑。 A through hole 101100H is formed in the package portion 1011H so as to provide a photosensitive path for the photosensitive chip 10121H.

根據本發明的這個優選實施例，所述感光部1012H包括至少一連接線10124H，用於電連接所述感光晶片10121H和所述線路板主體10122H。進一步，所述連接線10124H可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線10124H呈弧形地連接所述感光晶片10121H和所述線路板主體10122H。 According to this preferred embodiment of the present invention, the photosensitive portion 1012H includes at least one connecting wire 10124H for electrically connecting the photosensitive wafer 10121H and the circuit board main body 10122H. Further, the connecting wire 10124H may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connecting wire 10124H connects the photosensitive wafer 10121H and the circuit board main body 10122H in an arc shape.

值得一提的是，所述連接線10124H被模塑于所述封裝部1011H內部，從而可以借助所述封裝部1011H將所述連接線10124H進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線10124H不會受到任何的碰觸損傷，同時減少環境因素對個所述連接線10124H的影響，如溫度，使得所述感光晶片10121H和所述線路板主體10122H之間的通訊連接穩定，這一點是完全不提供于現有技術的。 It is worth mentioning that the connecting wire 10124H is molded inside the packaging part 1011H, so that the connecting wire 10124H can be covered by the packaging part 1011H without being directly exposed to the outside, so as to assemble When the camera module is used, the connection wire 10124H will not be damaged by any touch, and the influence of environmental factors on the connection wire 10124H, such as temperature, is reduced, so that the photosensitive chip 10121H and the circuit board are The communication connection between the main bodies 10122H is stable, which is completely not provided in the prior art.

值得一提的是，所述封裝部1011H包覆所述電路元件10123H和所述連接線10124H，具有保護所述電路元件10123H和所述連接線10124H以及得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部1011H不限於包覆所述電路元件10123H或所述連接線10124H。也就是說，在本發明的其他實施例中，所述封裝部1011H可以直接模塑於沒有凸出的所述電路元件10123H的所述線路板主體10122H，也可以是模塑於所述電路元件10123H外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 1011H covers the circuit element 10123H and the connecting wire 10124H, and has the function of protecting the circuit element 10123H and the connecting wire 10124H and obtaining a camera module with better performance. Advantages, but those skilled in the art should understand that the encapsulation portion 1011H is not limited to encapsulating the circuit element 10123H or the connecting wire 10124H. That is to say, in other embodiments of the present invention, the encapsulation portion 1011H may be directly molded on the circuit board body 10122H of the circuit element 10123H without protruding, or may be molded on the circuit element 10123H outside and around different positions.

進一步，所述感光晶片10121H具有一感光區101211H和一非感光區101212H，所述非感光區101212H環繞於所述感光區101211H週邊。所述感光區101211H用於進行感光作用，所述連接線10124H連接於所述非感光區101212H。 Further, the photosensitive wafer 10121H has a photosensitive area 101211H and a non-photosensitive area 101212H, and the non-photosensitive area 101212H surrounds the periphery of the photosensitive area 101211H. The photosensitive area 101211H is used for photosensitive action, and the connection line 10124H is connected to the non-photosensitive area 101212H.

根據本發明的這個優選實施例，所述封裝部1011H延伸於所述感光晶片10121H的所述非感光區101212H，從而將所述感光晶片10121H通過模塑 的方式疊層固定於所述線路板主體10122H。通過這樣的方式，如模塑於晶片的方式(Molding on the chip，MOC)擴大了所述封裝部1011H向內的可模塑範圍，從而可以減小所述線路板主體10122H以及所述封裝部1011H的外側的結構性部分，進一步減小所述模塑感光部1012H件的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 1011H extends to the non-photosensitive area 101212H of the photosensitive wafer 10121H, so that the photosensitive wafer 10121H is molded by molding It is laminated and fixed to the circuit board main body 10122H in a way. In this way, for example, molding on the chip (MOC) expands the inward moldable range of the encapsulation portion 1011H, so that the circuit board body 10122H and the encapsulation portion can be reduced in size. The outer structural part of 1011H further reduces the length and width of the molded photosensitive part 1012H, and reduces the length and width of the camera module assembled therefrom.

在本發明的這個實施例中，所述封裝部1011H凸起地圍繞於所述感光晶片10121H的所述感光區101211H外側，特別地，所述封裝部1011H一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件1010H被用於組裝所述攝像模組時，所述感光晶片10121H被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 1011H protrudes around the outside of the photosensitive region 101211H of the photosensitive wafer 10121H, and in particular, the encapsulation portion 1011H is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so when the photosensitive element 1010H is used to assemble the camera module, the photosensitive wafer 10121H is sealed inside to form a closed inner space.

具體地，在製造所述感光元件1010H時，可以選取一傳統的線路板作為所述線路板主體10122H，在所述線路板主體10122H上設置一所述感光晶片10121H，將所述感光晶片10121H通過所述連接線10124H電連接，進而在初步組裝後的所述線路板主體10122H和感光晶片10121H部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部1011H，或用半導體封裝中常用的模壓工藝形成所述封裝部1011H。所述線路板主體10122H可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)等。所述封裝部1011H形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部1011H可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用熱熔性樹脂或熱固性樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以 選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 1010H, a conventional circuit board can be selected as the circuit board body 10122H, a photosensitive wafer 10121H is set on the circuit board body 10122H, and the photosensitive wafer 10121H is passed through the circuit board body 10122H. The connecting wires 10124H are electrically connected, and then molding is performed on the circuit board body 10122H and the photosensitive wafer 10121H after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The packaging part 1011H is formed by molding the circuit board after the surface mount process), or the packaging part 1011H is formed by a molding process commonly used in semiconductor packaging. The circuit board body 10122H can be selected to be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a hard PCB board (without a flex board), and the like. The manner in which the encapsulation portion 1011H is formed may be selected from, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the encapsulation part 1011H are, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and heat can be used for the molding process. Melting resin or thermosetting resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and The materials chosen are merely illustrative of ways in which the invention may be practiced, and are not limiting of the invention.

所述封裝部1011H在此處為所述支架1050H提供安裝位置，基於模塑工藝的優勢，所述封裝部1011H可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述支架1050H平整地被安裝。 The encapsulation portion 1011H here provides an installation position for the bracket 1050H. Based on the advantages of the molding process, the encapsulation portion 1011H can be made to have good flatness by means of the molding process, so that the bracket can be The 1050H is installed flat.

值得一提的是，所述封裝部1011H的內壁可以根據所述連接線的形狀的而設置，比如設置為傾斜狀，從而在包覆所述連接線10124H的同時使得所述感光晶片10121H可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部1011H的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part 1011H can be set according to the shape of the connecting wire, for example, set to be inclined, so that the photosensitive chip 10121H can be covered while the connecting wire 10124H is covered. more light is received. Those skilled in the art should understand that the shape of the packaging portion 1011H is not a limitation of the present invention.

所述感光元件在本發明的其他實施例中，還可以組裝為動焦攝像模組，從而可以改變所述攝像模組的焦距，本領域的技術人員應當理解的是，所述攝像模組的類型並不是本發明的限制。 In other embodiments of the present invention, the photosensitive element can also be assembled into a moving focus camera module, so that the focal length of the camera module can be changed. Those skilled in the art should understand that the Type is not a limitation of the present invention.

參照圖27是根據本發明的第十個優選實施例的感光組件1010和攝像模組10100。不同於上述優選實施例的是，所述感光組件1010包括一遮罩層10126I，所述遮罩層10126I包裹所述線路板主體10122和所述封裝部1011，從而在增強所述線路板主體10122的結構強度的同時，增強所述感光元件1010的抗電磁干擾能力。 27 is a photosensitive assembly 1010 and a camera module 10100 according to the tenth preferred embodiment of the present invention. Different from the above preferred embodiment, the photosensitive component 1010 includes a mask layer 10126I, and the mask layer 10126I wraps the circuit board main body 10122 and the encapsulation part 1011, so as to strengthen the circuit board main body 10122 At the same time, the anti-electromagnetic interference capability of the photosensitive element 1010 is enhanced.

更進一步，所述遮罩層10126I為一金屬層，可以為板狀結構或網狀結構。 Furthermore, the mask layer 10126I is a metal layer, which can be a plate-like structure or a mesh-like structure.

參照圖28，根據本發明的第十一個優選實施例的感光元件1010。所述感光組件1010包括一支架1050，所述支架1050補充設置于所述封裝部1011，與所述封裝部1011形成封閉的通孔101100。 28, a photosensitive element 1010 according to an eleventh preferred embodiment of the present invention. The photosensitive component 1010 includes a bracket 1050 , the bracket 1050 is additionally disposed on the packaging part 1011 , and forms a closed through hole 101100 with the packaging part 1011 .

進一步，所述封裝部1011具有一缺口101300，所述支架1050補充設置於所述缺口101300，從而使得所述缺口101300封閉，形成所述通孔 101100。也就是說，所述封裝部1011並不是形成封閉的環形結構，而通過所述支架1050的補充後形成封閉結構。 Further, the encapsulation part 1011 has a gap 101300, and the bracket 1050 is additionally disposed in the gap 101300, so that the gap 101300 is closed and the through hole is formed 101100. That is to say, the encapsulation part 1011 does not form a closed annular structure, but forms a closed structure after being supplemented by the bracket 1050 .

所述支架1050具有一濾光片槽1051，用於安裝所述濾光片1020。所述支架1050補充于所述封裝部1011，以便於為所述濾光片1020提供安裝位置。 The bracket 1050 has a filter slot 1051 for installing the filter 1020 . The bracket 1050 is supplemented to the packaging portion 1011 so as to provide a mounting position for the optical filter 1020 .

所述支架1050包括一延伸腿1052，補充於所述缺口101300，延伸連接至所述線路板主體10122，以便於將所述缺口101300封閉，形成封閉的所述通孔101100。 The bracket 1050 includes an extension leg 1052 , which is supplemented to the notch 101300 and is extended and connected to the circuit board main body 10122 , so as to close the notch 101300 and form the closed through hole 101100 .

在圖中所示方式中，所述封裝部1011形成平臺結構，所述支架1050被支撐於所述平臺結構，且所述支架1050為所述濾光片1020提供安裝位置。在本發明的另一實施例中，所述封裝部1011可以具有所述濾光片安裝槽，用於安裝所述支架1050，且所述延伸腿1052延伸連接於所述線路板主體10122。進一步，所述封裝部1011的所述缺口101300以及所述支架的所述延伸腿1052的結構可以為楔形結構，以便於所述支架1050順利、穩定地被安裝于所述封裝部1011。當然，在本發明的其他實施例中，所述支架1050還可以是其他形狀，本領域的技術人員應當理解的是，所述支架1050的結構並不是本發明的限制。 In the manner shown in the figure, the encapsulation portion 1011 forms a platform structure, the bracket 1050 is supported on the platform structure, and the bracket 1050 provides a mounting position for the optical filter 1020 . In another embodiment of the present invention, the encapsulation part 1011 may have the filter mounting slot for mounting the bracket 1050 , and the extension legs 1052 are extended and connected to the circuit board body 10122 . Further, the structure of the notch 101300 of the encapsulation part 1011 and the extension legs 1052 of the bracket can be a wedge-shaped structure, so that the bracket 1050 can be smoothly and stably installed on the encapsulation part 1011 . Certainly, in other embodiments of the present invention, the bracket 1050 may also have other shapes, and those skilled in the art should understand that the structure of the bracket 1050 is not a limitation of the present invention.

進一步，所述支架1050向下延伸連接於所述線路板主體10122，舉例地但不限於，通過膠水連接於所述線路板主體10122。 Further, the bracket 1050 is downwardly extended and connected to the circuit board main body 10122, for example, but not limited to, connected to the circuit board main body 10122 through glue.

也就是說，在這種方式中，所述感光晶片10121的至少部分所述非感光區101212被所述封裝部1011一體封裝，且至少部分所述非感光區101212未被所述封裝部1011一體封裝。未被所述封裝部1011一體封裝的所述非感光區101212，對應所述支架1050的延伸位置。 That is to say, in this way, at least part of the non-photosensitive area 101212 of the photosensitive wafer 10121 is integrally packaged by the packaging part 1011 , and at least part of the non-photosensitive area 101212 is not integrated by the packaging part 1011 package. The non-photosensitive area 101212 that is not integrally encapsulated by the encapsulating portion 1011 corresponds to the extending position of the bracket 1050 .

參照圖29，根據本發明的第十二個優選實施例的感光組件1010。在這種實施方式中，所述電路元件10123被設置於所述線路板主體10122的背面。比如，多個所述電路元件10123被相互間隔地貼裝於所述線路板主體10122的背面。也就是說，所述電路元件10123可以不被設置於所述線路板主體10122的正面，即，可以不被設置於所述感光晶片10121的周圍，從而不需要在所述線路板正面的所述感光晶片的周圍區域預留所述電路元件10123的安裝位置，從而減小所述線路板主體10122的長寬尺寸，從而減少所述攝像模組的長寬尺寸，以使得所述攝像模組能夠被應用於追求輕薄化的所述電子設備。 Referring to FIG. 29, a photosensitive assembly 1010 according to a twelfth preferred embodiment of the present invention is shown. In this embodiment, the circuit element 10123 is provided on the back surface of the circuit board body 10122 . For example, a plurality of the circuit elements 10123 are mounted on the back surface of the circuit board main body 10122 at a distance from each other. That is to say, the circuit element 10123 may not be disposed on the front surface of the circuit board main body 10122, that is, may not be disposed around the photosensitive wafer 10121, so that the The mounting position of the circuit element 10123 is reserved in the surrounding area of the photosensitive chip, thereby reducing the length and width of the circuit board body 10122, thereby reducing the length and width of the camera module, so that the camera module can It is applied to the electronic device that pursues thinning.

所述電路元件10123被設置於所述線路板主體10122的背面，也就是說，所述電路元件10123可以被設置於所述線路板主體10122的背面與所述感光晶片10121相對的位置，從而使得所述電路元件10123可設置區域大大增加。當所述電路元件10123被設置於所述電路板主體10122的正面時，只能被設置於所述感光晶片10121的周圍，因此對線路板板主體10122的面積要求較大，且在形成所述封裝部1011時，所述封裝部1011需要包覆所述電路元件10123，因此必須成型的面積較大，這些在一定程度上限制了所述感光元件1010以及所述攝像模組尺寸減小的可能性。 The circuit element 10123 is disposed on the backside of the circuit board main body 10122, that is, the circuit element 10123 can be disposed on the backside of the circuit board main body 10122 at a position opposite to the photosensitive wafer 10121, so that the The area where the circuit elements 10123 can be arranged is greatly increased. When the circuit element 10123 is arranged on the front side of the circuit board main body 10122, it can only be arranged around the photosensitive wafer 10121, so the area of the circuit board main body 10122 is required to be larger, and when the circuit board main body 10122 is formed, the When encapsulating the part 1011, the encapsulating part 1011 needs to cover the circuit element 10123, so the area that must be formed is larger, which limits the possibility of reducing the size of the photosensitive element 1010 and the camera module to a certain extent sex.

參照圖30，根據本發明的第十二個優選實施例的變形實施方式的感光元件1010，所述電路元件10123被設置於所述線路板主體10122的背面，所述封裝部1011包覆所述電路元件10123。 Referring to FIG. 30 , according to the photosensitive element 1010 of the modified embodiment of the twelfth preferred embodiment of the present invention, the circuit element 10123 is disposed on the back of the circuit board main body 10122 , and the encapsulation part 1011 covers the Circuit element 10123.

進一步，所述封裝部1011包括一下包覆部10115，所述下包覆部10115被設置於所述線路板主體10122的背面。所述包覆部10115一體成型於所述線路板主體10122的背面，從而包覆位於所述線路板主體10122背面的所述電路元件10123，從而使得所述的電路元件被穩定地設置。 Further, the encapsulation part 1011 includes a lower cladding part 10115 , and the lower cladding part 10115 is disposed on the back of the circuit board main body 10122 . The covering portion 10115 is integrally formed on the backside of the circuit board main body 10122 to cover the circuit elements 10123 located on the backside of the circuit board main body 10122, so that the circuit elements are stably arranged.

值得一提的是，在製造的過程中，所述下包覆部10115可以與位於所述線路板主體10122上方的所述包覆段10111、所述濾光片安裝段10112等一體成型而形成，也可以單獨成型的方式設置。也就是說，可以在所述線路板主體10122上一次成型之後，再在所述線路板主體10122的背面一次成型所述下包覆部101115，本領域的技術人員應當理解的是，所述下包覆部10115成型方式以及成型區域大小，並不是本發明的限制。 It is worth mentioning that, during the manufacturing process, the lower cladding portion 10115 can be integrally formed with the cladding section 10111 and the filter mounting section 10112 located above the circuit board body 10122. , and can also be set in a separate molding manner. That is to say, the lower cladding portion 101115 may be once formed on the back of the circuit board main body 10122 after the circuit board main body 10122 is once formed. Those skilled in the art should understand that the lower cladding portion 101115 is The molding method of the cladding portion 10115 and the size of the molding area are not limitations of the present invention.

參照圖31，根據本發明的第十三個優選實施例的感光組件1010。所述線路板主體10122包括一第一板體101223和第二板體101224，所述第一板體101223電連接於所述第二板體101224。進一步，所述第一板體101223通過一導電介質101225電連於所述第二板體101224。所述導電介質101225舉例地但不限於，各向異性導電膠。特別地，所述第一板體101223可以是一硬板，所述第二板體101224可以是一軟板。 31, a photosensitive assembly 1010 according to a thirteenth preferred embodiment of the present invention is shown. The circuit board body 10122 includes a first board body 101223 and a second board body 101224 , and the first board body 101223 is electrically connected to the second board body 101224 . Further, the first board body 101223 is electrically connected to the second board body 101224 through a conductive medium 101225 . The conductive medium 101225 is, for example, but not limited to, anisotropic conductive adhesive. In particular, the first board body 101223 may be a rigid board, and the second board body 101224 may be a flexible board.

所述感光晶片10121被設置於所述第一板體101223，所述封裝部1011至少部分地一體封裝所述第一板體101223和所述感光晶片10121的至少部分所述非感光區。 The photosensitive wafer 10121 is disposed on the first plate body 101223 , and the encapsulation part 1011 at least partially encapsulates the first plate body 101223 and at least part of the non-photosensitive area of the photosensitive wafer 10121 .

進一步，所述感光晶片10121通過所述連接線10124電連接於所述第一板體101223。 Further, the photosensitive wafer 10121 is electrically connected to the first board body 101223 through the connecting wire 10124 .

在這個實施例附圖中，所述第二板體101224搭接於所述第一板體101223的正面，並且通過所述導電介質101225電連接於所述第一板體101223。 In the drawings of this embodiment, the second board 101224 overlaps the front surface of the first board 101223 and is electrically connected to the first board 101223 through the conductive medium 101225 .

在另一實施例中，所述第二板體101224可以拼接於所述第一板體101223，並且通過所述導電介質101225電連接於所述第一板體101223。 In another embodiment, the second board body 101224 can be spliced to the first board body 101223 and electrically connected to the first board body 101223 through the conductive medium 101225 .

在另一實施例中，所述第二板體101224可以連接於所述第一板體101223的背面，並且通過所述導電介質101225電連接於所述第一板體101223。 In another embodiment, the second board body 101224 may be connected to the back of the first board body 101223 and electrically connected to the first board body 101223 through the conductive medium 101225 .

在製造所述感光元件1010時，在一種方式中，可以先將所述封裝部1011一體成型於所述第一板體101223，而後電連接所述第一板體101223和所述第二板體101224。而在另一種方式中，可以先將所述第一板體101223和所述第二板體101224先進行電連接，而後將所述封裝部1011一體成型於所述第一板體101223。當然，所述封裝部1011可以一體成型於所述第一板體101223和所述第二板體101224的連接位置，從而將所述第一板體101223和所述第二板體101224穩定地固定，本領域的技術人員應當理解的是，所述第一板體101223和所述第二板體101224的連接方式以及所述封裝部1011的成型位置並不是本發明的限制。 When manufacturing the photosensitive element 1010, in one way, the encapsulation part 1011 can be integrally formed on the first board body 101223, and then the first board body 101223 and the second board body can be electrically connected 101224. In another way, the first board body 101223 and the second board body 101224 can be electrically connected first, and then the packaging part 1011 can be integrally formed on the first board body 101223 . Of course, the encapsulation part 1011 can be integrally formed at the connection position of the first board body 101223 and the second board body 101224, so as to stably fix the first board body 101223 and the second board body 101224 It should be understood by those skilled in the art that the connection manner of the first board body 101223 and the second board body 101224 and the molding position of the packaging part 1011 are not limitations of the present invention.

參照圖32A，根據本發明的第十四個優選實施例的感光組件1010。在本發明的這個實施例中，所述感光元件1010包括一保護層10127，所述保護層10127被設置於所述線路板主體10122，以使得所述線路板主體10122表面平整，並且在製造的過程中保護所述線路板主體10122。 32A, a photosensitive assembly 1010 according to a fourteenth preferred embodiment of the present invention is shown. In this embodiment of the present invention, the photosensitive element 1010 includes a protective layer 10127, and the protective layer 10127 is disposed on the circuit board main body 10122, so that the surface of the circuit board main body 10122 is flat, and during the manufacturing process The circuit board body 10122 is protected during the process.

進一步，所述線路板主體10122包括一基板1227和至少一電路1228，所述電路1228被設置於所述基板1227。所述保護層10127覆蓋於所述電路，從而保護所述電路，且填充所述電路1228在所述基板1227表面形成的凹凸不平的區域。 Further, the circuit board body 10122 includes a substrate 1227 and at least one circuit 1228 , and the circuit 1228 is disposed on the substrate 1227 . The protective layer 10127 covers the circuit so as to protect the circuit and fill the uneven area formed by the circuit 1228 on the surface of the substrate 1227 .

所述保護層10127可以延展至所述基板的邊緣位置，以便於在製造所述感光元件，緩衝、支撐所述成型模具，從而保護所述線路板主體10122，防止所述成型模具在合模時的衝壓力對損傷所述線路板主體。 The protective layer 10127 can be extended to the edge of the substrate, so as to buffer and support the forming mold during the manufacture of the photosensitive element, so as to protect the circuit board main body 10122 and prevent the forming mold from being clamped when the mold is closed. The punching force will damage the main body of the circuit board.

在製造的過程中，所述保護層可以在所述線路板主體10122上貼裝所述感光晶片10121後設置所述保護層10127，也可以先在所述線路板主體上設置所述保護層10127，而後貼裝所述感光晶片10121。 In the manufacturing process, the protective layer 10127 may be provided after the photosensitive wafer 10121 is mounted on the circuit board body 10122, or the protective layer 10127 may be provided on the circuit board body first , and then mount the photosensitive wafer 10121.

舉例地，在一些實施例中，可以將油墨等介質塗覆於所述線路板主體10122，以藉由油墨等介質在所述線路板主體10122上形成所述保護層。所述保護層10122的厚度以及所述設置區域根據需求設置。 For example, in some embodiments, a medium such as ink may be coated on the circuit board main body 10122 to form the protective layer on the circuit board main body 10122 by using a medium such as ink. The thickness of the protective layer 10122 and the setting area are set according to requirements.

在一些實施例中，所述保護層10127可以被設置於所述感光晶片10121的周圍區域。比如，在所述線路板主體10122上貼裝所述感光晶片10121，並且通過所述連接線10124將所述感光晶片10121電連接於所述線路板主體10122，而後在所述感光晶片周圍的所述線路板主體區域塗覆油墨等介質，形成所述保護層。 In some embodiments, the protective layer 10127 may be disposed on the surrounding area of the photosensitive wafer 10121 . For example, the photosensitive wafer 10121 is mounted on the circuit board main body 10122, and the photosensitive wafer 10121 is electrically connected to the circuit board main body 10122 through the connecting wires 10124, and then the photosensitive wafer 10121 is placed around the photosensitive wafer. The main body area of the circuit board is coated with a medium such as ink to form the protective layer.

參照圖32B，在這種實施方式中，所述保護層10127可以被設置於所述所述感光晶片的至少部分所述非感光區101212，以便於保護所述感光晶片10121。也就是說，在通過所述成型模具形成所述封裝部1011時，所述成型模具可以不直接與所述線路板主體10122以及所述感光晶片10121接觸，而被所述保護層10127支撐，從而保護所述線路板主體10122和所述感光晶片10121。 Referring to FIG. 32B , in this embodiment, the protective layer 10127 may be disposed on at least part of the non-photosensitive area 101212 of the photosensitive wafer, so as to protect the photosensitive wafer 10121 . That is to say, when the encapsulation part 1011 is formed by the molding die, the molding die may not be in direct contact with the circuit board body 10122 and the photosensitive wafer 10121, but is supported by the protective layer 10127, thereby The circuit board body 10122 and the photosensitive wafer 10121 are protected.

在所述線路板主體10122和/或所述感光晶片10121上設置所述保護層10127帶來諸多優勢，舉例地但不限於，第一，填充所述線路板主體10121的不平整區域，從而使得所述線路板主體10121表面平整，方便一體成型所述封裝部1011；第二，在通過所述成型模具形成所述封裝部1011時，緩衝、支撐所述成型模具，減小所述成型模具對所述線路板主體10121和/或所述感光晶片的衝壓作用；第三，所述保護層具有彈性，與所述成型模具的邊緣接觸，防止成型材料在模塑的過程中出現溢流而產生飛邊；第四，在所述感光元件1010成型後，由於所述保護層10127彈性優於所述封裝部1011和所述線路板主體 10122，從而柔性地緩衝所述封裝部1011和所述線路板主體10122之間的相互作用力，使得所述線路板主體10122不易於由於環境溫度等因素的影響而與所述封裝部1011脫離，且避免影響其他部件，比如所述濾光片1020。當然，所述保護層10127的設置還具有其他眾多優勢，在此不再一一列舉。值得一提的是，所述彈性是比較所述封裝部1011和所述線路板主體10122而言，且不會影響所述攝像模組的成像品質。 Disposing the protective layer 10127 on the circuit board body 10122 and/or the photosensitive wafer 10121 brings many advantages, for example, but not limited to, first, filling the uneven area of the circuit board body 10121, so that the The surface of the circuit board body 10121 is flat, which is convenient for integral molding of the encapsulation part 1011; secondly, when the encapsulation part 1011 is formed by the molding die, the molding die is buffered and supported to reduce the size of the molding die. The punching action of the circuit board main body 10121 and/or the photosensitive wafer; thirdly, the protective layer has elasticity and is in contact with the edge of the molding die to prevent the molding material from overflowing during the molding process. Fourth, after the photosensitive element 1010 is formed, the elasticity of the protective layer 10127 is better than that of the encapsulation part 1011 and the circuit board body 10122, so as to flexibly buffer the interaction force between the packaging part 1011 and the circuit board body 10122, so that the circuit board body 10122 is not easy to be separated from the packaging part 1011 due to the influence of environmental temperature and other factors, And avoid affecting other components, such as the filter 1020 . Of course, the arrangement of the protective layer 10127 also has many other advantages, which will not be listed one by one here. It is worth mentioning that the elasticity is compared with the packaging portion 1011 and the circuit board main body 10122, and will not affect the imaging quality of the camera module.

參照圖33，上述優選實施例的各攝像模組可以組成一陣列攝像模組。所述陣列攝像模組包括至少兩所述攝像模組10100，各所述攝像模組10100相互配合實現所述陣列攝像模組的圖像採集，且各所述攝像模組10100獨立。 Referring to FIG. 33 , each camera module of the above preferred embodiment can form an array of camera modules. The array camera module includes at least two camera modules 10100, each of the camera modules 10100 cooperates with each other to realize the image capture of the array camera module, and each of the camera modules 10100 is independent.

在本發明的這個實施例中，各所述攝像模組10100相互獨立，通過一外框體10400組裝而成。也就是說，各所述攝像模組10100的各部件不相互連接，可以自由地組合。各所述攝像模組10100可以通過膠水粘接固定的方式固定於所述外框體10400。 In this embodiment of the present invention, each of the camera modules 10100 is independent of each other, and is assembled by an outer frame 10400 . That is to say, the components of each of the camera modules 10100 are not connected to each other and can be freely combined. Each of the camera modules 10100 may be fixed to the outer frame body 10400 by means of adhesive bonding.

上述各優選實施例的攝像模組10100和各所述感光組件1010以及各實施例中特徵的組合形成攝像模組都可以用於組裝所述陣列攝像模組，並不限於圖中所示方式。 The camera module 10100 of each of the above preferred embodiments and each of the photosensitive assemblies 1010 and the camera module formed by the combination of the features in each embodiment can be used to assemble the array camera module, and are not limited to the methods shown in the figures.

參照圖34，上述優選實施例的各攝像模組10100可以組成另一陣列攝像模組。所述陣列攝像模組包括至少兩所述攝像模組10100，各所述攝像模組10100相互配合實現所述陣列攝像模組的圖像採集，且各所述攝像模組10100相互連接。 Referring to FIG. 34 , each camera module 10100 of the above preferred embodiment can form another array camera module. The array camera module includes at least two camera modules 10100, the camera modules 10100 cooperate with each other to realize the image capture of the array camera module, and the camera modules 10100 are connected to each other.

在一實施例中，各所述攝像模組10100的所述線路板主體10122相互連接，形成一一體的線路板主體，從而可以設置一共用連接器。 In one embodiment, the circuit board bodies 10122 of the camera modules 10100 are connected to each other to form an integrated circuit board body, so that a common connector can be provided.

在一實施例中，各所述攝像模組10100的所述封裝部1011一體連接，形成一連體封裝部。也就是說，在成型時，在各所述線路板主體10122和各所述感光晶片10121上一次成型形成連體的兩個所述封裝部1011，從而使得兩所述攝像模組10100的所述感光元件1010相互連接。 In one embodiment, the packaging parts 1011 of the camera modules 10100 are integrally connected to form a one-piece packaging part. That is to say, during molding, each of the circuit board main bodies 10122 and each of the photosensitive wafers 10121 is molded to form two conjoined encapsulation parts 1011 at one time, so that the The photosensitive elements 1010 are connected to each other.

在一實施例中，各所述攝像模組的所述支架1050一體連接，形成一連體支架，以便於通過所述連體支架將各所述感光元件1010連接。 In one embodiment, the brackets 1050 of the camera modules are integrally connected to form a conjoined bracket, so as to connect the photosensitive elements 1010 through the conjoined bracket.

在本發明的上述實施中，以由兩個所述攝像模組100構成的雙攝陣列攝像模組為例進行說明，而在發明的其他實施例中還可以有更多所述攝像模組100，比如三個及三個以上，本領域的技術人員應當理解的是，所述攝像模組100的數量並不是本發明的限制。 In the above implementation of the present invention, a dual-camera array camera module composed of two camera modules 100 is taken as an example for description, but in other embodiments of the present invention, there may be more camera modules 100 , such as three or more, those skilled in the art should understand that the number of the camera modules 100 is not a limitation of the present invention.

參照圖35，所述攝像模組10100能夠被應用於一電子設備本體200，以便於配合所述電子設別本體200形成一具有圖像採集功能的電子設備300。舉例地但不限於所述電子設備300被具體實施為智慧手機。 Referring to FIG. 35 , the camera module 10100 can be applied to an electronic device body 200 so as to cooperate with the electronic device body 200 to form an electronic device 300 with an image capture function. By way of example but not limitation, the electronic device 300 is embodied as a smart phone.

所述電子設備本體200儘管在附圖1B中被實施為智慧手機，在本發明的其他示例中，所述電子設備本體200也可以被實施為平板電腦、筆記型電腦、相機、個人數位助理、電子書、MP3/4/5等任何能夠被配置所述攝像模組10100的電子設備。當然，本領域的技術人員應當理解，在冰箱、洗衣機、電視機等傳統的家電上配置所述攝像模組10100也是可能的，或者在防盜門、牆壁等建築上配置所述攝像模組10100也是可能的，因此，所述攝像模組10100的應用環境和使用方式並不應被視為對本發明的所述攝像模組10100的內容和範圍的限制。 Although the electronic device body 200 is implemented as a smart phone in FIG. 1B , in other examples of the present invention, the electronic device body 200 can also be implemented as a tablet computer, a notebook computer, a camera, a personal digital assistant, Any electronic device that can be configured with the camera module 10100, such as e-books, MP3/4/5, etc. Of course, those skilled in the art should understand that it is also possible to configure the camera module 10100 on traditional home appliances such as refrigerators, washing machines, televisions, etc., or configure the camera module 10100 on buildings such as security doors and walls. Possibly, therefore, the application environment and usage of the camera module 10100 should not be regarded as limiting the content and scope of the camera module 10100 of the present invention.

參照圖36A和36B，根據本發明上述優選實施例的攝像模組和傳統攝像模組的比較示意圖。圖36A中，左側代表傳統的攝像模組，右側代表本 發明的中的攝像模組。圖36B中，左側代表傳統的線路板製造過程，右側代表本發明的感光元件製造過程。 Referring to FIGS. 36A and 36B , a comparison diagram of a camera module according to the above-described preferred embodiment of the present invention and a conventional camera module are shown. In Figure 36A, the left side represents the traditional camera module, and the right side represents the present The camera module in the invention. In FIG. 36B, the left side represents the conventional circuit board manufacturing process, and the right side represents the photosensitive element manufacturing process of the present invention.

綜合上述內容，可以很明顯的看到，本發明的感光元件和攝像模組具有以下優勢： Based on the above content, it can be clearly seen that the photosensitive element and camera module of the present invention have the following advantages:

1、可以減小攝像模組的長寬尺寸，封裝部分與電路元件，如阻容器件部分空間上可以重疊；傳統方案支架需在電容外側，且需要預留一定安全距離，本發明的方案可以直接利用電容空間，直接在電容周圍充填塑膠。 1. The length and width of the camera module can be reduced, and the packaging part and the circuit components, such as the resistance part, can overlap in space; the traditional solution bracket needs to be outside the capacitor, and a certain safety distance needs to be reserved. The solution of the present invention can Directly use the capacitor space and directly fill the plastic around the capacitor.

2、降低模組傾斜，封裝部分可替代現有塑膠支架設計，減小累計公差； 2. Reduce the tilt of the module, and the packaging part can replace the existing plastic bracket design to reduce the cumulative tolerance;

3、模塑提升線路板結構強度，同等結構強度下，因為封裝部分可以起到支撐作用，可以增加強度，線路板可以做的更薄，降低模組高度； 3. Molding improves the structural strength of the circuit board. Under the same structural strength, because the encapsulation part can play a supporting role, the strength can be increased, the circuit board can be made thinner, and the height of the module can be reduced;

4、在高度空間上，傳統方案電容與底座需要預留組裝安全空間，模塑工藝可以不預留，降低模組高度；傳統方案電容頂端距離支架需要預留安全間隙，防止干涉，新方案可以直接在電容周圍充填塑膠。 4. In terms of height space, the capacitor and base of the traditional solution need to reserve a safe space for assembly, and the molding process can not be reserved to reduce the height of the module; the top of the capacitor in the traditional solution needs to reserve a safety gap to prevent interference, and the new solution can Fill plastic directly around the capacitor.

5、電阻電容器件可以通過模塑包裹起來，可以避免阻容器件區域助焊劑、灰塵等所導致的模組汙黑點不良，提升產品良率； 5. The resistive capacitor device can be wrapped by molding, which can avoid the bad black spots of the module caused by flux, dust, etc. in the resistive device region, and improve the product yield;

6、適合高效率大規模量產，本發明的感光組件更適於大量拼版作業。基於本發明的所述感光組件的模塑成型的方式，所述感光元件更適合拼版作業，一次完成較多量的感光元件的製造，比如可以達到80至90個，而傳統的支架一次最多只能生產8個。 6. It is suitable for high-efficiency mass production, and the photosensitive assembly of the present invention is more suitable for a large number of imposition operations. Based on the molding method of the photosensitive element of the present invention, the photosensitive element is more suitable for imposition operations, and a relatively large number of photosensitive elements can be manufactured at one time, for example, 80 to 90, while the traditional bracket can only be used at most at one time. 8 are produced.

參照圖37至圖43，根據本發明的第十六個優選實施例的感光組件2010和攝像模組20100被闡釋。所述感光元件2010用於組裝製造所述攝像模組。所述感光組件2010包括一封裝部2011和一感光部2012，所述封裝部2011一體封裝地連接於所述感光部2012，例如模塑的方式形成一體結構。 37 to 43 , a photosensitive assembly 2010 and a camera module 20100 according to the sixteenth preferred embodiment of the present invention are illustrated. The photosensitive element 2010 is used for assembling and manufacturing the camera module. The photosensitive component 2010 includes an encapsulation portion 2011 and a photosensitive portion 2012 , and the encapsulation portion 2011 is integrally connected to the photosensitive portion 2012 , such as by molding to form an integrated structure.

所述感光部2012包括一線路板主體20122和一感光晶片20121，所述感光晶片20121被設置於所述線路板主體20122上。根據本發明的這個實施例，所述感光晶片20121模塑地連接於所述線路板主體20122。特別地，所述封裝部2011以模塑於晶片的方式(Molding on Chip，MOC)模塑於所述感光部2012。 The photosensitive portion 2012 includes a circuit board body 20122 and a photosensitive wafer 20121 , and the photosensitive wafer 20121 is disposed on the circuit board body 20122 . According to this embodiment of the present invention, the photosensitive wafer 20121 is connected to the circuit board body 20122 by molding. In particular, the encapsulation portion 2011 is molded on the photosensitive portion 2012 by molding on a chip (MOC).

根據本發明這個實施例，所述感光部2012包括一連接線路和至少一電路元件20123。所述連接線路預設於所述線路板主體20122，所述電路元件20123電連接於所述連接線路以及所述感光晶片20121，以供所述感光晶片20121的感光工作過程。所述電路元件20123被凸出地設置於所述線路板主體20122。所述電路元件20123可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 2012 includes a connecting line and at least one circuit element 20123 . The connection circuit is preset on the circuit board main body 20122 , and the circuit element 20123 is electrically connected to the connection circuit and the photosensitive chip 20121 for the photosensitive working process of the photosensitive chip 20121 . The circuit element 20123 is protrudingly disposed on the circuit board body 20122 . The circuit element 20123 can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay or a driver, and the like.

值得一提的是，所述封裝部2011將所述電路元件20123包覆於其內部，因此使得所述電路元件20123不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片20121相通的環境中，從而當組裝所述攝像模組時，所述電路元件20123上不會沾染灰塵等污染物，也不會影響所述感光晶片20121，不同于傳統攝像模組中電路器件暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件20123表面，避免污染所述感光晶片20121而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation part 2011 wraps the circuit element 20123 inside, so that the circuit element 20123 is not directly exposed to the space, more specifically, is not exposed to the The photosensitive chip 20121 is in the same environment, so when the camera module is assembled, the circuit element 20123 will not be contaminated with dust and other pollutants, nor will it affect the photosensitive chip 20121, which is different from the circuit in the traditional camera module. The existence of device exposure, such as blocking the device, so as to prevent dust and debris from staying on the surface of the circuit element 20123 by molding and wrapping, to avoid contaminating the photosensitive chip 20121 and causing the camera module to appear black spots, etc. unpleasant sight.

值得一提的是，在本發明的這個實施例中，以所述電路元件20123凸出於所述線路板主體20122為例進行說明，而在本發明的其他實施例中，所述電路元件20123可以埋設於所述線路板主體20123而不凸出於所述線路板主體，本領域的技術人員應當理解的是，所述電路元件20123的形狀、類型以及設置位置並不是本發明的限制。 It is worth mentioning that in this embodiment of the present invention, the circuit element 20123 protrudes from the circuit board main body 20122 is used as an example for description, while in other embodiments of the present invention, the circuit element 20123 It can be embedded in the circuit board body 20123 without protruding from the circuit board body. Those skilled in the art should understand that the shape, type and arrangement position of the circuit element 20123 are not limited by the present invention.

所述封裝部2011形成一通孔201100，以便於為所述感光晶片20121提供感光路徑。 A through hole 201100 is formed in the packaging part 2011 so as to provide a photosensitive path for the photosensitive chip 20121 .

也就是說，所述封裝部2011提供一光窗，為所述感光晶片20121提供光線通路，從而使得經過位於所述封裝部2011上方的所述鏡頭2030(後續提出)的光線能夠到達所述感光晶片20121，而不被所述封裝部2011阻擋。 That is, the encapsulation portion 2011 provides a light window to provide a light path for the photosensitive chip 20121, so that the light passing through the lens 2030 (described later) located above the encapsulation portion 2011 can reach the photosensitive chip 20121. The wafer 20121 is not blocked by the package portion 2011 .

根據本發明的這個優選實施例，所述感光部2012包括至少一連接線20124，用於電連接所述感光晶片20121和所述線路板主體20122。進一步，20所述連接線20124可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線20124呈弧形地連接所述感光晶片20121和所述線路板主體20122。 According to this preferred embodiment of the present invention, the photosensitive portion 2012 includes at least one connection line 20124 for electrically connecting the photosensitive wafer 20121 and the circuit board main body 20122 . Further, the connecting wires 20124 described in 20 may be implemented as, for example but not limited to, gold wires, copper wires, aluminum wires, silver wires, and the like. In particular, the connecting wire 20124 connects the photosensitive wafer 20121 and the circuit board main body 20122 in an arc shape.

值得一提的是，20所述連接線20124被模塑于所述封裝部2011內部，從而可以借助所述封裝部2011將20所述連接線20124進行包覆，而不會直接暴露於外部，從而在組裝所述攝像模組時，使得所述連接線20124不會受到任何的碰觸損傷，同時減少環境因素對個所述連接線20124的影響，如溫度、濕度，使得所述感光晶片20121和所述線路板主體20122之間的通訊連接穩定，這一點是完全不同于現有技術的。 It is worth mentioning that the connecting wires 20124 are molded inside the encapsulation part 2011 , so that the connecting wires 20124 can be covered by the encapsulation part 2011 without being directly exposed to the outside. Therefore, when assembling the camera module, the connecting wires 20124 will not be damaged by any contact, and the influence of environmental factors on the connecting wires 20124, such as temperature and humidity, will be reduced, so that the photosensitive chip 20121 The communication connection with the circuit board main body 20122 is stable, which is completely different from the prior art.

所述封裝部2011的所述通孔201100的底部呈由下至上逐漸增大的傾斜狀，可以理解的本發明中的的所述通孔201100的形狀並不限於這個傾斜形狀。 The bottom of the through hole 201100 of the package part 2011 is inclined gradually from bottom to top. It is understood that the shape of the through hole 201100 in the present invention is not limited to this inclined shape.

所述封裝部2011具有一內側面201200，所述內側面201200環繞形成所述通孔201100。所述內側面201200傾斜地設置，以使得所述通孔201100呈由下至上逐漸增大的傾斜狀。具體地，所述內側面201200具有一傾斜角α，即所述內側面201200的傾斜方向與垂直方向的夾角。 The package portion 2011 has an inner side surface 201200, and the inner side surface 201200 forms the through hole 201100 around the inner side surface 201200 . The inner side surface 201200 is disposed obliquely, so that the through hole 201100 is inclined gradually increasing from bottom to top. Specifically, the inner side surface 201200 has an inclination angle α, that is, the included angle between the inclination direction of the inner side surface 201200 and the vertical direction.

值得一提的是，所述封裝部2011包覆所述電路元件20123和所述連接線20124，具有保護所述電路元件20123和所述連接線20124及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部2011不限於包覆所述電路元件20123或所述連接線20124。也就是說，在本發明的其他實施例中，所述封裝部2011可以直接模塑於沒有凸出的所述電路元件20123的所述線路板主體20122，也可以是模塑於所述電路元件20123外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 2011 covers the circuit element 20123 and the connecting wire 20124, and has the aspects of protecting the circuit element 20123 and the connecting wire 20124 and the camera module for obtaining better performance. However, those skilled in the art should understand that the encapsulation part 2011 is not limited to encapsulating the circuit element 20123 or the connection wire 20124. That is to say, in other embodiments of the present invention, the encapsulation portion 2011 may be directly molded on the circuit board body 20122 of the circuit element 20123 without protruding, or may be molded on the circuit element 20123 outside, around and other different locations.

進一步，所述感光晶片20121具有一感光區201211和一非感光區201212，所述非感光區201212環繞於所述感光區201211週邊。所述感光區201211用於進行感光作用，所述連接線20124連接於所述非感光區201212。 Further, the photosensitive wafer 20121 has a photosensitive area 201211 and a non-photosensitive area 201212, and the non-photosensitive area 201212 surrounds the periphery of the photosensitive area 201211. The photosensitive area 201211 is used for photosensitive action, and the connection line 20124 is connected to the non-photosensitive area 201212 .

根據本發明的這個優選實施例，所述封裝部2011延伸於所述感光晶片20121的所述非感光區201212，從而將所述感光晶片20121通過模塑的方式疊層固定於所述線路板主體20122。通過這樣的方式，如模塑於晶片的方式(Molding on Chip，MOC)擴大了所述封裝部2011向內的可模塑範圍，從而可以減小所述線路板主體20122以及所述封裝部2011的外側的結構性部分，進一步減小所述感光元件2010的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 2011 extends from the non-photosensitive area 201212 of the photosensitive wafer 20121, so that the photosensitive wafer 20121 is laminated and fixed to the circuit board body by molding 20122. In this way, for example, molding on chip (MOC) expands the inward molding range of the packaging portion 2011 , so that the circuit board body 20122 and the packaging portion 2011 can be reduced in size. The outer structural part of the photosensitive element 2010 further reduces the length and width dimensions of the photosensitive element 2010 and reduces the length and width dimensions of the camera module assembled by it.

在本發明的這個實施例中，所述封裝部2011凸起地圍繞於所述感光晶片20121的所述感光區201211外側，特別地，所述封裝部2011一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件2010被用於組裝所述攝像模組時，所述感光晶片20121被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 2011 protrudes around the outside of the photosensitive area 201211 of the photosensitive wafer 20121, and in particular, the encapsulation portion 2011 is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so when the photosensitive element 2010 is used to assemble the camera module, the photosensitive wafer 20121 is sealed inside to form a closed inner space.

具體地，在製造所述感光元件2010時，可以選取一傳統的線路板作為所述線路板主體20122，在所述線路板主體20122上設置一所述感光晶片 20121，將所述感光晶片20121通過所述連接線20124電連接，進而在初步組裝後的所述線路板主體20122和感光晶片20121部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部2011，或用半導體封裝中常用的模壓工藝形成所述封裝部2011。所述線路板主體20122可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)等。所述封裝部2011形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部2011可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用環氧樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 2010, a conventional circuit board can be selected as the circuit board main body 20122, and a photosensitive wafer is arranged on the circuit board main body 20122. 20121, the photosensitive wafer 20121 is electrically connected through the connecting wires 20124, and then the circuit board main body 20122 and the photosensitive wafer 20121 after preliminary assembly are molded, such as by an injection molding machine, by insert molding (molding) Process The circuit board subjected to the SMT process (Surface Mount Technology) is molded to form the package portion 2011, or the package portion 2011 is formed by a molding process commonly used in semiconductor packaging. The circuit board body 20122 can be selected to be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a hard PCB board (without a flex board), and the like. The manner in which the encapsulation part 2011 is formed may be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The material that can be selected for the encapsulation part 2011 is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and a ring can be selected for the molding process. Oxygen resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

值得一提的是，基於本發明的所述感光組件2010的模塑成型的方式，所述感光元件2010更適合拼版作業，一次完成較多量的所述感光元件2010的製造，比如可以達到90個，而傳統的支架一次注塑封裝部，即鏡座，需要先塗畫膠水，並且一般一次只能貼裝一個，在注塑過程中一般一次性生產4-8個，最多只能生產32個。 It is worth mentioning that, based on the molding method of the photosensitive element 2010 of the present invention, the photosensitive element 2010 is more suitable for imposition operations, and a large number of the photosensitive elements 2010 can be manufactured at one time, for example, up to 90 However, the traditional one-shot injection molding part of the bracket, that is, the mirror base, needs to be painted with glue first, and generally only one can be mounted at a time. During the injection molding process, 4-8 pieces are generally produced at one time, and a maximum of 32 pieces can be produced.

進一步，所述封裝部2011包括一包覆段20111和一濾光片安裝段20112，所述濾光片安裝段20112模塑地一體連接于所述包覆段20111，所述包覆段20111模塑連接於所述線路板主體20122，用於包覆所述電路元件20123和所述連接線20124。所述濾光片安裝段20112用於安裝一濾光片2020，也就是說，當所述感光元件2010被用於組裝所述攝像模組時，所述攝像模組的所述濾光片2020被安裝於所述濾光片安裝段20112，使得所述濾光片2020位於所述感光晶片20121的感光路徑上，且不需要提供額外的濾光片安裝支架。也就是 說，所述封裝部2011在此處具有傳統支架的功能，但是基於模塑工藝的優勢，所述濾光片安裝段20112頂部可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述濾光片2020平整地被安裝，這一點也是優於傳統的攝像模組。 Further, the encapsulation part 2011 includes a covering section 20111 and a filter mounting section 20112, the filter mounting section 20112 is integrally connected to the covering section 20111 by molding, and the covering section 20111 is molded It is plastically connected to the circuit board body 20122 for covering the circuit elements 20123 and the connecting wires 20124 . The filter installation section 20112 is used to install a filter 2020, that is, when the photosensitive element 2010 is used to assemble the camera module, the filter 2020 of the camera module It is mounted on the filter mounting section 20112, so that the filter 2020 is located on the photosensitive path of the photosensitive wafer 20121, and there is no need to provide an additional filter mounting bracket. that is Said, the encapsulation part 2011 has the function of a traditional bracket here, but based on the advantages of the molding process, the top of the filter mounting section 20112 can be made to have good flatness by the molding process, so as to The optical filter 2020 can be installed evenly, which is also superior to the traditional camera module.

更進一步，所述濾光片安裝段20112具有一安裝槽201121，所述安裝槽201211連通於所述通孔201100，為所述濾光片2020提供充足的安裝空間，使得所述濾光片2020不會凸出於所述濾光片安裝段20112的頂表面201122。也就是說，所述封裝部2011上端設置所述安裝槽201121，從而可以將所述濾光片2020安裝於其中。特別地，所述濾光片2020為一紅外截止濾光片IRCF。 Furthermore, the filter installation section 20112 has an installation slot 201121, and the installation slot 201211 communicates with the through hole 201100 to provide sufficient installation space for the filter 2020, so that the filter 2020 It does not protrude from the top surface 201122 of the filter mounting section 20112. That is to say, the mounting groove 201121 is provided on the upper end of the packaging portion 2011, so that the optical filter 2020 can be mounted therein. In particular, the filter 2020 is an infrared cut filter IRCF.

值得一提的是，在本發明的這個實施例中，所述安裝槽201121可以用於安裝濾光片，而在本發明的其他實施中，所述安裝槽201121可以用來安裝所述攝像模組的馬達或鏡頭等部件，本領域的技術人員應當理解的是，所述安裝槽201121的用途並不是本發明的限制。 It is worth mentioning that in this embodiment of the present invention, the installation groove 201121 can be used to install a filter, while in other implementations of the present invention, the installation groove 201121 can be used to install the camera module Those skilled in the art should understand that the use of the mounting groove 201121 is not a limitation of the present invention.

值得一提的是，所述封裝部2011的內壁可以根據所述連接線20124的形狀而設置，比如設置為傾斜狀，從而在包覆所述連接線20124的同時使得所述感光晶片20121可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部2011的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part 2011 can be set according to the shape of the connecting wire 20124, for example, set to be inclined, so that the photosensitive chip 20121 can be covered while the connecting wire 20124 is covered. more light is received. Those skilled in the art should understand that the shape of the packaging part 2011 is not a limitation of the present invention.

進一步，根據本發明的這個優選實施例，所述感光元件2010包括一馬達連接結構2013，用於連接所述攝像模組的一馬達2040。所述馬達2040具有至少一馬達引腳2041。所述馬達連接結構2013包括至少一引線20131，各所述引線20131用於電連接所述馬達2040和所述線路板主體20122。各所述引線20131電連接於線路板主體20122。進一步，所述引線20131電連接於所述線路板主體20122的連接電路。所述引線20131被設置于所述封裝部2011，並且延伸 至所述封裝部2011的頂端。所述引線20131包括一馬達連接端201311，顯露于所述封裝部2011的頂端，用於電連接所述馬達2040的所述引腳2041。值得一提的是，所述引線20131可以在形成所述封裝部2011時以埋設方式設置。在傳統的連接方式中，諸如驅動馬達等部件都是通過設置單獨的導線來連接於線路板，製造工藝相對複雜，而在本發明的這種模塑時埋設所述引線20114的方式可以取代傳統的馬達焊接等工藝過程，並且使得電路連接更加穩定。特別地，在本發明的一實施中，所述引線20131為一導線，被埋設于所述封裝部2011內部。舉例地，所述馬達引腳2041可以通過導電膠連接於所述馬達連接端201311，也可以通過焊接的方式連接於所述馬達連接端201311。 Further, according to this preferred embodiment of the present invention, the photosensitive element 2010 includes a motor connecting structure 2013 for connecting a motor 2040 of the camera module. The motor 2040 has at least one motor pin 2041 . The motor connection structure 2013 includes at least one lead wire 20131 , and each lead wire 20131 is used to electrically connect the motor 2040 and the circuit board main body 20122 . Each of the leads 20131 is electrically connected to the circuit board main body 20122 . Further, the lead 20131 is electrically connected to the connection circuit of the circuit board body 20122 . The lead 20131 is provided on the package portion 2011 and extends to the top of the package portion 2011 . The lead 20131 includes a motor connecting end 201311 exposed on the top of the package portion 2011 for electrically connecting the pins 2041 of the motor 2040 . It is worth mentioning that the lead 20131 can be embedded in the form of the encapsulation portion 2011 . In the traditional connection method, components such as the drive motor are connected to the circuit board by arranging separate wires, and the manufacturing process is relatively complicated, and the method of burying the lead 20114 during the molding of the present invention can replace the traditional method process such as motor welding, and make the circuit connection more stable. In particular, in an implementation of the present invention, the lead 20131 is a wire embedded in the package portion 2011 . For example, the motor pins 2041 can be connected to the motor connecting end 201311 by conductive glue, or can be connected to the motor connecting end 201311 by welding.

值得一提的是，所述引線20131的埋設位置以及所述引線20131的所述馬達連接端201311在所述封裝部2011顯示的位置可以根據需要設置。比如，在本發明的一實施例中，所述引線20131的所述馬達連接端201311可以被設置于所述封裝部2011的週邊，即所述封裝部2011的頂表面，所述濾光片安裝段20112的頂表面201122，而在本發明的另一實施例中，所述馬達連接端201311可以被設置于所述封裝部2011的內圍，即所述封裝部2011的所述安裝槽201121底面，從而可以提供所述馬達2040不同的安裝位置。換句話說，當所述馬達2040需要安裝至所述封裝部2011頂部時，所述馬達連接端201311設置于所述封裝部2011週邊頂表面，當所述馬達2040需要安裝至所述安裝槽201121時，所述馬達連接端201311設置于所述封裝部2011的內圍，即所述安裝槽201121底面。 It is worth mentioning that the buried position of the lead 20131 and the position of the motor connecting end 201311 of the lead 20131 displayed on the package portion 2011 can be set as required. For example, in an embodiment of the present invention, the motor connecting end 201311 of the lead wire 20131 can be disposed on the periphery of the packaging part 2011, that is, the top surface of the packaging part 2011, and the filter is installed The top surface 201122 of the segment 20112, and in another embodiment of the present invention, the motor connecting end 201311 can be disposed on the inner periphery of the packaging part 2011, that is, the bottom surface of the mounting groove 201121 of the packaging part 2011 , so that different installation positions of the motor 2040 can be provided. In other words, when the motor 2040 needs to be installed on the top of the packaging part 2011 , the motor connecting end 201311 is disposed on the top surface of the periphery of the packaging part 2011 , and when the motor 2040 needs to be installed in the installation groove 201121 , the motor connecting end 201311 is disposed on the inner periphery of the packaging portion 2011 , that is, the bottom surface of the mounting groove 201121 .

也就是說，在製造所述感光元件2010時，先貼裝所述感光晶片20121，而後在所述線路板主體20122以及所述感光晶片20121上，以MOC的方式模塑所述封裝部2011，且在模塑時可以以埋設方式在所述封裝部2011內部設置所述引線20131，並且使得所述引線20131電連接於所述線路板主體20122， 且使得所述引線20131的所述馬達連接端201311顯示于所述封裝部2011的頂端，以便於連接於所述馬達2040的所述引腳2041。舉例地，在所述感光元件2010被用於組裝所述攝像模塑時，所述馬達2040的各所述引腳2041通過焊接的方式連接於所述引線20131的所述馬達連接端201311，從而使得所述馬達2040電連接於所述線路板主體20122，且需要設置單獨的導線將所述馬達2040和所述線路板主體20122連接，且使得所述馬達2040的所述引腳2042的長度可以減小。 That is to say, when the photosensitive element 2010 is manufactured, the photosensitive wafer 20121 is first mounted, and then the packaging portion 2011 is molded on the circuit board body 20122 and the photosensitive wafer 20121 in a MOC manner. And the lead 20131 can be embedded in the package part 2011 during molding, and the lead 20131 can be electrically connected to the circuit board body 20122, And the motor connecting end 201311 of the lead wire 20131 is displayed on the top of the package part 2011 so as to be connected to the pin 2041 of the motor 2040 . For example, when the photosensitive element 2010 is used to assemble the camera molding, each of the pins 2041 of the motor 2040 is connected to the motor connection end 201311 of the lead 20131 by welding, so that The motor 2040 is electrically connected to the circuit board main body 20122, and a separate wire needs to be provided to connect the motor 2040 and the circuit board main body 20122, and the length of the pins 2042 of the motor 2040 can be decrease.

值得一提的是，所述引線20131的埋設位置可以根據需要設置，比如，在本發明的一個實施例中，可以設置于所述封裝部2011的內部，將所述引線20131隱藏，而在另一個實施例中，可以將所述引線20131埋設于所述封裝部2011的表面，本領域的技術人員應當理解的是，所述引線20131的位置並不是本發明的限制。 It is worth mentioning that the buried position of the lead 20131 can be set as required. For example, in an embodiment of the present invention, it can be set inside the package part 2011 to hide the lead 20131, and the lead 20131 can be hidden in another In one embodiment, the lead 20131 may be buried on the surface of the package portion 2011 , and those skilled in the art should understand that the position of the lead 20131 is not a limitation of the present invention.

參照圖41A是根據本發明的上述優選實施例的所述馬達連接結構的一等效實施例。所述馬達連接結構2013包括至少一引腳槽20133，所述引腳槽20133用於容納所述攝像模組的所述馬達2040的所述引腳2041。所述引腳槽20133被設置于所述封裝部2011上端。所述馬達連接結構2013包括至少一引線20134，，所述引線20134用於電連接所述馬達2040和所述線路板主體20122。所述引線20134被設置于所述封裝部2011，並且向上延伸至所述封裝部2011的所述引腳槽20133的槽底壁。所述引線20134包括一馬達連接端1341，顯露于所述封裝部2011的所述引腳槽20133的槽底壁，用於電連接所述馬達2040的所述引腳2041。特別地，在一種實施方式中，所述馬達連接端1341可以被實施為一焊盤。所述引線20134可以被實施為一導線，被埋設于所述封裝部2011內部。 41A is an equivalent embodiment of the motor connection structure according to the above-described preferred embodiment of the present invention. The motor connecting structure 2013 includes at least one pin slot 20133, and the pin slot 20133 is used to accommodate the pin 2041 of the motor 2040 of the camera module. The lead groove 20133 is disposed on the upper end of the package portion 2011 . The motor connection structure 2013 includes at least one lead wire 20134 , and the lead wire 20134 is used to electrically connect the motor 2040 and the circuit board main body 20122 . The lead 20134 is disposed on the package part 2011 and extends upward to the bottom wall of the lead groove 20133 of the package part 2011 . The lead 20134 includes a motor connecting end 1341 exposed on the bottom wall of the lead groove 20133 of the package portion 2011 for electrically connecting the lead 2041 of the motor 2040 . In particular, in one embodiment, the motor connection end 1341 may be implemented as a pad. The lead 20134 may be implemented as a wire and embedded in the package portion 2011 .

也就是說，在製造所述感光元件2010時，先貼裝所述感光芯20121片，而後在所述線路板主體20122以及所述感光晶片20121上，以MOC的 方式模塑所述封裝部2011，並且預設預定長度的所述引腳槽20133，且在模塑時可以埋設方式設置所述引線20134，並且使得所述引線20134電連接於所述線路板主體20122，且使得所述引線20134的所述馬達連接端1341顯示于所述封裝部2011的所述引腳槽20133的槽底壁，以便於連接於所述馬達2040的所述引腳2041。舉例地，在所述感光元件2010被用於組裝所述攝像模塑時，所述馬達2040的各所述引腳2041插入所述引腳槽20133，且通過焊接的方式連接於所述引線20134的所述馬達連接端1341，從而使得所述馬達2040電連接於所述線路板主體20122，且需要設置單獨的導線將所述馬達2040和所述線路板主體20122連接，且使得所述馬達2040的所述引腳2042可以穩定地連接，防止外部不需要的碰觸所述馬達引腳2041。特別地，所述引線20134可以被實施為一導線，被埋設于所述封裝部2011內部。 That is to say, when manufacturing the photosensitive element 2010, the photosensitive core 20121 is first mounted, and then the circuit board main body 20122 and the photosensitive wafer 20121 are mounted with MOC. The encapsulation part 2011 is molded in a manner, and the lead groove 20133 of a predetermined length is preset, and the lead 20134 can be embedded in the molding process, and the lead 20134 is electrically connected to the circuit board body. 20122, and the motor connecting end 1341 of the lead 20134 is displayed on the bottom wall of the lead groove 20133 of the package part 2011 so as to be connected to the lead 2041 of the motor 2040. For example, when the photosensitive element 2010 is used to assemble the camera molding, each of the pins 2041 of the motor 2040 is inserted into the pin slot 20133 and connected to the lead 20134 by welding The motor connecting end 1341 is connected to the motor 2040, so that the motor 2040 is electrically connected to the circuit board body 20122, and a separate wire needs to be provided to connect the motor 2040 and the circuit board body 20122, and make the motor 2040 The pin 2042 can be stably connected to prevent unwanted external contact with the motor pin 2041. In particular, the lead 20134 may be implemented as a wire and embedded in the package portion 2011 .

值得一提的是，所述引線20134的埋設位置可以根據需要設置，比如，在本發明的一個實施例中，可以設置于所述封裝部2011的內部，將所述引線20134隱藏，而在另一個實施例中，可以將所述引線20134埋設于所述封裝部2011的表面，本領域的技術人員應當理解的是，所述引線20134的位置並不是本發明的限制。 It is worth mentioning that the buried position of the lead 20134 can be set as required. For example, in an embodiment of the present invention, it can be set inside the package part 2011 to hide the lead 20134, and the lead 20134 can be hidden in another In one embodiment, the lead 20134 may be buried on the surface of the package portion 2011 , and those skilled in the art should understand that the position of the lead 20134 is not a limitation of the present invention.

參照圖41B，是根據本發明的上述優選實施例的馬達連接結構的另一等效實施例。所述馬達連接結構2013包括一引腳槽20135，所述引腳槽20135用於容納所述攝像模組的所述馬達2040的所述引腳2041。所述引腳槽20135被設置于所述封裝部2011。所述馬達連接結構2013包括至少一電路接點20132，所述電路接點20132預設於所述線路板主體20122，並且電連接於所述線路板主體內20122的所述連接線路。更進一步，各所述引腳槽20135由所述封裝部2011的頂端延伸至所述線路板主體20122，並且使得所述電路接點20132顯 示。在一實施例方式中，所述馬達引腳2041適於插入所述引腳槽20135，並且可以與所述電路接點20132焊接連接。 Referring to FIG. 41B , there is another equivalent embodiment of the motor connection structure according to the above-described preferred embodiment of the present invention. The motor connecting structure 2013 includes a pin slot 20135 for accommodating the pin 2041 of the motor 2040 of the camera module. The lead groove 20135 is disposed in the package portion 2011 . The motor connection structure 2013 includes at least one circuit contact 20132 . The circuit contact 20132 is preset on the circuit board body 20122 and is electrically connected to the connection circuit in the circuit board body 20122 . Furthermore, each of the pin grooves 20135 extends from the top of the package portion 2011 to the circuit board body 20122, and makes the circuit contacts 20132 appear obvious. Show. In one embodiment, the motor pins 2041 are adapted to be inserted into the pin slots 20135 and can be connected to the circuit contacts 20132 by welding.

也就是說，在製造所述感光元件2010時，在所述線路板主體20122上預設各所述電路接點20132，進而貼裝所述感光芯20121片，而後在所述線路板主體20122以及所述感光晶片20121上，以MOC的方式模塑所述封裝部2011，並且預設預定長度的所述引腳槽20135，且使得所述電路接點20132通過所述引腳槽20135顯示，以便於連接於所述馬達2040的所述引腳2041。舉例地，在所述感光元件2010被用於組裝所述攝像模組時，所述馬達2040的各所述引腳2041插入所述引腳槽20135，且通過焊接的方式連接於線路板主體20122上的所述電路接點20132，從而使得所述馬達2040電連接於所述線路板主體20122，且使得所述馬達2040的所述引腳2041可以穩定地連接，防止外部不需要的碰觸所述馬達引腳2041。 That is to say, when manufacturing the photosensitive element 2010, each of the circuit contacts 20132 is preset on the circuit board body 20122, and then the photosensitive core 20121 pieces are mounted, and then the circuit board body 20122 and On the photosensitive chip 20121, the encapsulation part 2011 is molded in a MOC manner, and the lead groove 20135 of a predetermined length is preset, and the circuit contacts 20132 are displayed through the lead groove 20135, so that is connected to the pin 2041 of the motor 2040 . For example, when the photosensitive element 2010 is used to assemble the camera module, each of the pins 2041 of the motor 2040 is inserted into the pin slot 20135 and connected to the circuit board main body 20122 by welding The circuit contacts 20132 on the motor 2040 are electrically connected to the circuit board body 20122, and the pins 2041 of the motor 2040 can be stably connected to prevent unwanted external contact Describe the motor pin 2041.

參照圖41C，是根據本發明的上述優選實施裡馬達連接結構的另一等效實施例。所述馬達連接結構2013包括至少一雕刻線路20136，所述雕刻線路20136用於電連接所述線路板主體20122上的所述連接線路、所述感光晶片20121以及馬達等部件。舉例地但不限於，所述雕刻線路20136可以通過鐳射成型(LDS)的方式在形成所述封裝部2011時設置。舉例地，在本發明的一實施例中，所述雕刻線路20136通過鐳射直接成型的方式設置于所述封裝部2011的表面。在傳統的連接方式中，諸如驅動馬達等部件都是通過設置單獨的導線來連接於線路板，製造工藝相對複雜，而在本發明的這種模塑時設置所述雕刻線路20136的方式可以取代傳統的馬達引腳焊接或插接等工藝過程，並且使得電路連接更加穩定。更具體地，所述雕刻線路20136的形成過程可以是，現在所述封裝部2011設置雕刻槽，而後在所述雕刻槽內以電鍍或化鍍的方式設置電路。 Referring to Figure 41C, there is another equivalent embodiment of the motor connection structure according to the above-described preferred embodiment of the present invention. The motor connection structure 2013 includes at least one engraving circuit 20136, and the engraving circuit 20136 is used to electrically connect the connecting circuit on the circuit board main body 20122, the photosensitive chip 20121, the motor and other components. For example, but not limited to, the engraving circuit 20136 may be provided when the encapsulation part 2011 is formed by means of laser forming (LDS). For example, in an embodiment of the present invention, the engraving circuit 20136 is disposed on the surface of the package portion 2011 by direct laser molding. In the traditional connection method, components such as the drive motor are connected to the circuit board by arranging separate wires, and the manufacturing process is relatively complicated, and the method of disposing the engraving circuit 20136 during the molding of the present invention can replace The traditional process of motor pin welding or plugging makes the circuit connection more stable. More specifically, the formation process of the engraved circuit 20136 may be that now the encapsulation part 2011 is provided with an engraved groove, and then a circuit is provided in the engraved groove by electroplating or electroless plating.

參照圖37至圖40以及圖42和圖43，是根據本發明的第十六個優選實施例的一攝像模組，所述攝像模組可以為一動焦攝像模組(Automatic Focus Model，AFM)。所述攝像模組20100包括一所述感光組件2010、一所述濾光片2020、一所述馬達2040和一鏡頭2030。 37 to 40 and FIGS. 42 and 43, it is a camera module according to the sixteenth preferred embodiment of the present invention, and the camera module can be a moving focus camera module (Automatic Focus Model, AFM) . The camera module 20100 includes a photosensitive component 2010 , a filter 2020 , a motor 2040 and a lens 2030 .

所述濾光片2020被安裝於所述感光組件2010，所述鏡頭2030被安裝於所述馬達2040，所述馬達2040被安裝於所述感光組件2010上。 The filter 2020 is mounted on the photosensitive element 2010 , the lens 2030 is mounted on the motor 2040 , and the motor 2040 is mounted on the photosensitive element 2010 .

進一步，所述濾光片2020被安裝於所述感光組件2010的所述封裝部2011的所述濾光片安裝段20112的所述安裝槽201121。所述馬達2040被安裝於所述感光組件2010的所述封裝部2011的所述濾光片安裝段20112頂端。也就是說，所述濾光片2020被安裝于所述封裝部2011的所述安裝槽，所述鏡頭2030被安裝於所述馬達2040，所述馬達2040被安裝于所述封裝部2011的頂端。 Further, the filter 2020 is installed in the installation groove 201121 of the filter installation section 20112 of the packaging part 2011 of the photosensitive component 2010 . The motor 2040 is mounted on the top of the filter mounting section 20112 of the packaging portion 2011 of the photosensitive element 2010 . That is, the filter 2020 is mounted on the mounting groove of the package portion 2011 , the lens 2030 is mounted on the motor 2040 , and the motor 2040 is mounted on the top of the package portion 2011 .

特別地，所述馬達2040的所述馬達引腳2041電連接於所述感光元件的所述電路接點20132，從而通過所述引線20131電連接於所述線路板主體20122。所述馬達引腳2041可以通過導電膠連接於所述引線20131的所述馬達連接端201311，也可以通過焊接的方式連接於所述馬達連接端201311。 Particularly, the motor pins 2041 of the motor 2040 are electrically connected to the circuit contacts 20132 of the photosensitive element, so as to be electrically connected to the circuit board body 20122 through the lead wires 20131 . The motor pins 2041 can be connected to the motor connecting ends 201311 of the lead wires 20131 by conductive glue, or can be connected to the motor connecting ends 201311 by welding.

特別地，當所述引腳通過導電膠貼附方式粘接於所述電路接點時，可以不需要焊接導線來連接所述馬達2040和所述感光部2012的所述線路板主體20122，從而減少馬達焊接的工藝過程。 In particular, when the pins are adhered to the circuit contacts by means of conductive adhesive, there is no need to solder wires to connect the motor 2040 and the circuit board main body 20122 of the photosensitive portion 2012, thereby Reduce the process of motor welding.

值得一提的是，在本發明的這個實施例中，以所述引線20131連接所述馬達2040的方式來說明本發明電連接馬達的方式，而在本發明的其他實施例所述，可以選擇不同方式的所述馬達連接結構2013來連接所述馬達2040，例如，選取圖41A、41B、41C中示例的方式，也就是說，所述圖41A、41B、41C中對應的不同馬達連接結構都可以與不同感光元件結合，從而提供不同馬 達連接方式，本領域的技術人員應當理解的是，圖中所示方式，並不是本發明的限制。 It is worth mentioning that, in this embodiment of the present invention, the way of connecting the lead wire 20131 to the motor 2040 is used to illustrate the way of electrically connecting the motor in the present invention, while in other embodiments of the present invention, you can choose The motor connection structure 2013 in different ways is used to connect the motor 2040. For example, the methods shown in FIGS. 41A, 41B, and 41C are selected, that is, the different motor connection structures in the FIGS. Can be combined with different photosensitive elements to provide different horses It should be understood by those skilled in the art that the manner shown in the figures is not a limitation of the present invention.

本領域技術人員應當理解的是，上述攝像模組的結構和類型僅作為舉例，來說明所述攝像模組可以被實施的方式，並不是本發明的限制。 It should be understood by those skilled in the art that the structures and types of the above-mentioned camera modules are only used as examples to illustrate the manner in which the camera modules can be implemented, and are not limitations of the present invention.

參照圖37至圖40以及圖44和圖45，根據本發明的第十六個優選實施例的另一攝像模組。所述攝像模組可以是一定焦模組(Fix Focus Model，FFM)。所述攝像模組20100包括一所述感光組件2010、一所述濾光片2020和一鏡頭2030。 37 to 40 and FIGS. 44 and 45, another camera module according to the sixteenth preferred embodiment of the present invention. The camera module may be a fixed focus module (Fix Focus Model, FFM). The camera module 20100 includes a photosensitive component 2010 , a filter 2020 and a lens 2030 .

所述濾光片2020被安裝於所述感光組件2010，所述鏡頭2030被安裝於所述感光組件2010上。 The filter 2020 is mounted on the photosensitive component 2010 , and the lens 2030 is mounted on the photosensitive component 2010 .

更具體地，所述濾光片2020被安裝於所述感光組件2010的所述封裝部2011的所述濾光片安裝段20112的所述安裝槽201121。所述鏡頭2030被按安裝於所述感光組件2010的所述封裝部2011的所述濾光片安裝段20112的頂部。也就是說，所述濾光片被安裝於所述安裝槽，所述鏡頭2030被安裝于所述封裝部2011頂端。 More specifically, the filter 2020 is installed in the installation groove 201121 of the filter installation section 20112 of the packaging part 2011 of the photosensitive component 2010 . The lens 2030 is mounted on the top of the filter mounting section 20112 of the packaging portion 2011 of the photosensitive component 2010 by pressing. That is, the filter is installed in the installation groove, and the lens 2030 is installed on the top of the package portion 2011 .

還值得一提的是，所述鏡頭2030被安裝於所述感光組件2010的所述封裝部2011的所述濾光片安裝段20112頂端，從而所述封裝部2011相當於傳統攝像模組中的支架的功能，為所述鏡頭2030提供支撐、固定位置，但是組裝卻不同于傳統COB工藝過程。傳統COB工藝的攝像模組的支架以粘貼的方式固定於線路板，而所述封裝部2011通過模塑工藝固定於所述線路板主體20122，不需要粘貼固定過程，模塑方式相對於粘貼固定具有更好的連接穩定性以及工藝過程的可控性，且在所述封裝部2011與所述線路板主體20122之間不需要預留AA調整的膠水空間，因此減小了傳統攝像模組AA調整的預留空間，使得攝像模組的厚度得以減小；另一方面，所述封裝部2011包覆所述電路 元件20123和所述連接線20124，使得傳統的支架功能和電路元件20123以及所述連接線20124可以在空間上重疊設置，不需要像傳統攝像模組，在電路器件周圍預留安全距離，從而使得具有支架功能的所述封裝部2011的高度可以設置在較小的範圍，從而進一步提供了攝像模組厚度可以減小的空間。此外，所述封裝部2011代替傳統的支架，避免了支架在粘貼組裝時帶來的傾斜誤差，減小了攝像模組組裝的累積公差。且所述封裝部2011包覆所述連接線20124，且所述封裝部2011延伸至所述感光晶片20121的非感光區201212，使得所述封裝部2011可以向內收縮，從而進一步減小所述攝像模組的橫向的長寬尺寸。 It is also worth mentioning that the lens 2030 is mounted on the top of the filter mounting section 20112 of the encapsulation portion 2011 of the photosensitive component 2010, so that the encapsulation portion 2011 is equivalent to a conventional camera module. The function of the bracket is to provide support and a fixed position for the lens 2030, but the assembly is different from the traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by means of sticking, and the encapsulation part 2011 is fixed to the main body 20122 of the circuit board by a molding process, and no sticking and fixing process is required. It has better connection stability and process controllability, and there is no need to reserve glue space for AA adjustment between the packaging part 2011 and the circuit board main body 20122, so the traditional camera module AA is reduced. The adjusted reserved space reduces the thickness of the camera module; on the other hand, the encapsulation part 2011 covers the circuit The element 20123 and the connecting wire 20124 allow the traditional bracket function and the circuit element 20123 and the connecting wire 20124 to be overlapped in space, and there is no need to reserve a safe distance around the circuit device like a traditional camera module, so that the The height of the encapsulation portion 2011 having the function of a bracket can be set in a relatively small range, thereby further providing a space where the thickness of the camera module can be reduced. In addition, the encapsulation part 2011 replaces the traditional bracket, which avoids the inclination error caused when the bracket is pasted and assembled, and reduces the cumulative tolerance of the camera module assembly. And the encapsulation part 2011 wraps the connection line 20124, and the encapsulation part 2011 extends to the non-photosensitive area 201212 of the photosensitive chip 20121, so that the encapsulation part 2011 can be retracted inward, thereby further reducing the The horizontal length and width of the camera module.

參照圖46和圖47，根據本發明的第十七優選實施例的攝像模組感光組件和攝像模組。所述感光元件2010A用於組裝製造所述攝像模組20100A，從而得到模塑型的攝像模組。所述感光組件2010A包括一封裝部2011A和一感光部2012A，所述封裝部2011A模塑地連接於所述感光部2012A。 Referring to FIG. 46 and FIG. 47 , the photosensitive assembly and the camera module of the camera module according to the seventeenth preferred embodiment of the present invention are shown. The photosensitive element 2010A is used to assemble and manufacture the camera module 20100A, thereby obtaining a molded camera module. The photosensitive component 2010A includes a package portion 2011A and a photosensitive portion 2012A, and the package portion 2011A is connected to the photosensitive portion 2012A by molding.

所述感光部2012A包括一線路板主體20122A和一感光晶片20121A，所述感光晶片20121A被設置於所述線路板主體20122A上。根據本發明的這個實施例，所述感光晶片20121A模塑地連接於所述線路板主體20122A。 The photosensitive portion 2012A includes a circuit board body 20122A and a photosensitive wafer 20121A, and the photosensitive wafer 20121A is disposed on the circuit board body 20122A. According to this embodiment of the present invention, the photosensitive wafer 20121A is connected to the circuit board body 20122A by molding.

根據本發明這個實施例，所述感光部2012A包括一連接線路和至少一電路元件20123A。所述連接線路預設於所述線路板主體20122A，所述電路元件20123A電連接於所述連接線路以及所述感光晶片20121A，以供所述感光晶片20121A的感光工作過程。所述電路元件20123A凸出地設置於所述線路板主體20122A。所述電路元件20123A可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 2012A includes a connecting line and at least one circuit element 20123A. The connection circuit is preset on the circuit board main body 20122A, and the circuit element 20123A is electrically connected to the connection circuit and the photosensitive chip 20121A for the photosensitive working process of the photosensitive chip 20121A. The circuit element 20123A is protrudingly disposed on the circuit board body 20122A. The circuit element 20123A can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay or a driver, and the like.

值得一提的是，所述封裝部2011A將所述電路元件20123A包覆於其內部，因此使得所述電路元件20123A不會直接暴露於空間內，更具體地 說，不會暴露於與所述感光晶片20121A相通的環境中，從而當組裝為所述攝像模組時，所述電路元件20123A上不會沾染灰塵等污染物，也不會影響所述感光晶片20121A，不同于傳統攝像模組中電路元件20123A暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件20123A表面，避免污染所述感光晶片20121A而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation part 2011A encapsulates the circuit element 20123A inside, so that the circuit element 20123A is not directly exposed to the space, more specifically In other words, it will not be exposed to the environment that communicates with the photosensitive chip 20121A, so that when assembled into the camera module, the circuit element 20123A will not be contaminated with contaminants such as dust, and will not affect the photosensitive chip. 20121A is different from the existing way of exposing the circuit element 20123A in the traditional camera module, such as resisting the container, so as to prevent dust and sundries from staying on the surface of the circuit element 20123A by molding and wrapping, so as to avoid contamination of the photosensitive chip 20121A, resulting in bad phenomena such as smudges and black spots in the camera module.

所述封裝部2011A形成一通孔201100A，以便於為所述感光晶片20121A提供感光路徑。 A through hole 201100A is formed in the package portion 2011A so as to provide a photosensitive path for the photosensitive chip 20121A.

根據本發明的這個優選實施例，所述感光部2012A包括至少一連接線20124A，用於電連接所述感光晶片20121A和所述線路板主體20122A。進一步，所述連接線20124A可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線20124A呈弧形地連接所述感光晶片20121A和所述線路板主體20122A。值得一提的是，所述連接線20124A被模塑于所述封裝部2011A內部，從而可以借助所述封裝部2011A將所述連接線20124A進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線20124A不會受到任何的碰觸損傷，同時減少環境因素對個所述連接線20124A的影響，如溫度，使得所述感光晶片20121A和所述線路板主體20122A之間的通訊連接穩定，這一點是完全不同于現有技術的。 According to this preferred embodiment of the present invention, the photosensitive portion 2012A includes at least one connecting wire 20124A for electrically connecting the photosensitive wafer 20121A and the circuit board main body 20122A. Further, the connecting wire 20124A may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connecting wire 20124A connects the photosensitive wafer 20121A and the circuit board main body 20122A in an arc shape. It is worth mentioning that the connecting wire 20124A is molded inside the packaging part 2011A, so that the connecting wire 20124A can be covered by the packaging part 2011A without being directly exposed to the outside, so as to assemble When the camera module is used, the connecting wire 20124A will not be damaged by any touch, and the influence of environmental factors on the connecting wire 20124A, such as temperature, is reduced, so that the photosensitive chip 20121A and the circuit board are The communication connection between the main bodies 20122A is stable, which is completely different from the prior art.

值得一提的是，所述封裝部2011A包覆所述電路元件20123A和所述連接線20124A，具有保護所述電路元件20123A和所述連接線20124A及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部2011A不限於包覆所述電路元件20123A或所述連接線20124A。也就是說，在本發明的其他實施例中，所述封裝部2011A可以直接模塑於沒有凸出的所述電路元件20123A的所述線路板主體20122A，也可以是模塑於所述電路元件20123A外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 2011A covers the circuit element 20123A and the connecting wire 20124A, and protects the circuit element 20123A and the connecting wire 20124A and the camera module for better performance. However, those skilled in the art should understand that the encapsulation part 2011A is not limited to encapsulating the circuit element 20123A or the connecting wire 20124A. That is to say, in other embodiments of the present invention, the encapsulation portion 2011A may be directly molded on the circuit board body 20122A of the circuit element 20123A without protrusions, or may be molded on the circuit element 20123A outside and around different locations.

不同於上述優選實施例的是，所述線路板主體20122A具有一內凹槽201222A，所述感光晶片20121A被設置於所述內凹槽201222A內，從而使得所述感光晶片20121A和所述線路板主體20122A的相對高度降低，從而當所述封裝部2011A包覆所述感光晶片20121A，減小對所述封裝部2011A的高度要求，從而減小所述感光元件2010A組裝的攝像模組的高度。 Different from the above preferred embodiment, the circuit board main body 20122A has an inner groove 20122A, and the photosensitive wafer 20121A is arranged in the inner groove 201222A, so that the photosensitive wafer 20121A and the circuit board The relative height of the main body 20122A is reduced, so that when the packaging part 2011A covers the photosensitive chip 20121A, the height requirement for the packaging part 2011A is reduced, thereby reducing the height of the camera module assembled with the photosensitive element 2010A.

進一步，所述感光晶片20121A具有一感光區201211A和一非感光區201212A，所述非感光區201212A環繞於所述感光區201211A週邊。所述感光區201211A用於進行感光作用，所述連接線20124A連接於所述非感光區201212A。 Further, the photosensitive wafer 20121A has a photosensitive area 201211A and a non-photosensitive area 201212A, and the non-photosensitive area 201212A surrounds the periphery of the photosensitive area 201211A. The photosensitive area 201211A is used for photosensitive action, and the connection line 20124A is connected to the non-photosensitive area 201212A.

根據本發明的這個優選實施例，所述封裝部2011A延伸於所述感光晶片20121A的所述非感光區201212A，從而將所述感光晶片20121A通過模塑的方式疊層固定於所述線路板主體20122A。通過這樣的方式，如模塑於晶片的方式(Molding on chip，MOC)擴大了所述封裝部2011A向內的可模塑範圍，從而可以減小所述線路板主體20122A以及所述封裝部2011A的外側的結構性部分，進一步減小所述感光元件2012A的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 2011A extends to the non-photosensitive area 201212A of the photosensitive wafer 20121A, so that the photosensitive wafer 20121A is laminated and fixed to the circuit board body by molding 20122A. In this way, the inward molding range of the packaging part 2011A can be expanded, such as molding on chip (MOC), so that the circuit board body 20122A and the packaging part 2011A can be reduced in size The outer structural part of the photosensitive element 2012A further reduces the length and width dimensions of the photosensitive element 2012A, and reduces the length and width dimensions of the camera module assembled by it.

在本發明的這個實施例中，所述封裝部2011A凸起地圍繞於所述感光晶片20121A的所述感光區201211A外側，特別地，所述封裝部2011A一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件2010A被用於組裝所述攝像模組時，所述感光晶片20121A被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 2011A protrudes around the outside of the photosensitive region 201211A of the photosensitive wafer 20121A, and in particular, the encapsulation portion 2011A is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so that when the photosensitive element 2010A is used to assemble the camera module, the photosensitive wafer 20121A is sealed inside to form a closed inner space.

進一步，所述封裝部2011A包括一包覆段20111A和一濾光片安裝段20112A，所述濾光片安裝段20112A模塑地一體連接于所述包覆段20111A，所述包覆段20111A模塑連接於所述線路板主體20122A，用於包覆所 述電路元件20123A和所述連接線20124A。所述濾光片安裝段20112A用於安裝一濾光片2020A，也就是說，當所述感光元件2010A被用於組裝所述攝像模組時，所述攝像模組的濾光片2020A被安裝於所述濾光片安裝段20112A，使得所述濾光片2020A位於所述感光晶片20121A的感光路徑上，且不需要提供額外的濾光片2020A安裝支架。也就是說，所述封裝部2011A在此處具有傳統支架的功能，但是基於模塑工藝的優勢，所述濾光片安裝段20112A頂部可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述濾光片2020A平整地被安裝，這一點也是優於傳統的攝像模組。 Further, the encapsulation portion 2011A includes a covering section 20111A and a filter mounting section 20112A, the filter mounting section 20112A is integrally connected to the covering section 20111A by molding, and the covering section 20111A is molded Plastic connection to the circuit board main body 20122A, used to cover the The circuit element 20123A and the connecting line 20124A. The filter installation section 20112A is used to install a filter 2020A, that is, when the photosensitive element 2010A is used to assemble the camera module, the filter 2020A of the camera module is installed In the filter mounting section 20112A, the filter 2020A is located on the photosensitive path of the photosensitive wafer 20121A, and there is no need to provide an additional mounting bracket for the filter 2020A. That is to say, the encapsulation part 2011A has the function of a traditional bracket here, but based on the advantages of the molding process, the top of the filter mounting section 20112A can be made to have good flatness by means of the molding process. , so that the optical filter 2020A is installed flatly, which is also superior to the traditional camera module.

更進一步，所述濾光片安裝段20112A具有一安裝槽201121A，所述安裝槽201121A連通於所述通孔201100A，為所述濾光片2020A提供充足的安裝空間，使得所述濾光片2020A不會凸出于濾光片安裝段20112A的頂表面201122A。也就是說，所述封裝部2011A上端設置所述安裝槽201121A，從而將所述濾光片2020A穩定的安裝于所述封裝部2011A，且不會凸出于所述封裝部2011A的頂端。 Furthermore, the filter installation section 20112A has an installation groove 201121A, and the installation groove 201121A communicates with the through hole 201100A to provide sufficient installation space for the optical filter 2020A, so that the optical filter 2020A can be installed. Does not protrude from the top surface 201122A of the filter mounting segment 20112A. That is to say, the mounting groove 201121A is provided on the upper end of the packaging portion 2011A, so that the optical filter 2020A is stably mounted on the packaging portion 2011A without protruding from the top of the packaging portion 2011A.

值得一提的是，所述模塑的內壁可以根據所述連接線20124的形狀而設置，比如設置為傾斜狀，從而在包覆所述連接線20124A的同時使得所述感光晶片20121A可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部2011A的形狀並不是本發明的限制。 It is worth mentioning that the molded inner wall can be set according to the shape of the connecting wire 20124, for example, set to be inclined, so that the photosensitive wafer 20121A can receive the connecting wire 20124A while covering the connecting wire 20124A. to more light. Those skilled in the art should understand that the shape of the packaging portion 2011A is not a limitation of the present invention.

參照圖46和圖47，根據本發明的第十七優選實施例的攝像模組。所述攝像模組可以為一動焦攝像模組(Automatic Focus Model，AFM)。所述攝像模組包括一所述感光組件2010A、一所述濾光片2020A、一所述馬達2040A和一鏡頭2030A。 46 and 47, a camera module according to a seventeenth preferred embodiment of the present invention is shown. The camera module can be an automatic focus camera module (Automatic Focus Model, AFM). The camera module includes a photosensitive component 2010A, a filter 2020A, a motor 2040A and a lens 2030A.

所述濾光片2020A被安裝於所述感光組件2010A，所述鏡頭2030A被安裝於所述馬達2040A，所述馬達2040A被安裝於所述感光組件2010A上。 The filter 2020A is mounted on the photosensitive element 2010A, the lens 2030A is mounted on the motor 2040A, and the motor 2040A is mounted on the photosensitive element 2010A.

進一步，所述濾光片2020A被安裝於所述感光組件2010A的所述封裝部2011A的所述濾光片安裝段20112A的所述安裝槽201121A。所述馬達2040A被安裝於所述感光組件2010A的所述封裝部2011A的所述濾光片安裝段20112A頂端。也就是說，所述濾光片2020A被安裝于所述封裝部2011A的所述安裝槽201121A，所述鏡頭2030A被安裝於所述馬達2040A，所述馬達2040A被安裝于所述封裝部2011A的頂端。 Further, the filter 2020A is installed in the installation groove 201121A of the filter installation section 20112A of the packaging portion 2011A of the photosensitive component 2010A. The motor 2040A is mounted on the top of the filter mounting section 20112A of the packaging portion 2011A of the photosensitive element 2010A. That is, the filter 2020A is mounted in the mounting groove 201121A of the package portion 2011A, the lens 2030A is mounted on the motor 2040A, and the motor 2040A is mounted on the mounting portion 2011A of the package portion 2011A. top.

特別地，所述馬達2040A通過所述馬達連接結構2013電連接於所述感光元件2010A，所述馬達4A0的所述馬達引腳2041A電連接於所述感光元件2010的所述電路接點20132，從而通過所述引線20131電連接於所述線路板主體20122。所述馬達引腳2041可以通過導電膠膜連接於所述引線20131的所述馬達連接端201311，也可以通過焊接的方式連接於所述馬達連接端201311。 In particular, the motor 2040A is electrically connected to the photosensitive element 2010A through the motor connection structure 2013, the motor pin 2041A of the motor 4A0 is electrically connected to the circuit contact 20132 of the photosensitive element 2010, Therefore, it is electrically connected to the circuit board main body 20122 through the leads 20131 . The motor pins 2041 can be connected to the motor connecting ends 201311 of the lead wires 20131 through a conductive adhesive film, or can be connected to the motor connecting ends 201311 by welding.

特別地，當所述馬達引腳2041A通過導電膠貼附方式粘接於所述電路接點時，可以不需要焊接導線來連接所述馬2040A和所述感光部2012的所述線路板主體20122，從而減少馬達焊接的工藝過程。 In particular, when the motor pins 2041A are adhered to the circuit contacts by means of conductive adhesive, there is no need for soldering wires to connect the motor 2040A and the circuit board main body 20122 of the photosensitive portion 2012 , thereby reducing the process of motor welding.

值得一提的是，在本發明的這個實施例中，以所述引線20131連接所述馬達2040A的方式來說明本發明電連接馬達的方式，而在本發明的其他實施例所述，可以選擇不同方式的所述馬達連接結構2013來連接所述馬達2040A，例如，選取圖41A、41B、41C中示例的方式，也就是說，所述41A、41B、41C中對應的不同馬達連接結構都可以與本實施例中的所述感光元件2010A結合，從而提供不同馬達連接方式，本領域的技術人員應當理解的是，圖中所示方式，並不是本發明的限制。 It is worth mentioning that, in this embodiment of the present invention, the way of electrically connecting the motor 2040A of the present invention is described in the way that the lead wire 20131 is connected to the motor 2040A, while in other embodiments of the present invention, you can choose The motor connection structure 2013 can be connected to the motor 2040A in different ways. For example, the methods shown in FIGS. 41A , 41B and 41C are selected, that is, the different motor connection structures corresponding to the 41A, 41B and 41C In combination with the photosensitive element 2010A in this embodiment, different motor connection modes are provided. Those skilled in the art should understand that the modes shown in the figures are not limitations of the present invention.

在本發明的其他實施例中，所述感光元件2010A還可以被組裝為一定焦攝像模組，本領域的技術人員應當理解的是，所述攝像模組的類型不是本發明的限制。 In other embodiments of the present invention, the photosensitive element 2010A may also be assembled into a fixed-focus camera module. Those skilled in the art should understand that the type of the camera module is not a limitation of the present invention.

參照圖48和圖49，根據本發明的第十八優選實施例的感光組件和攝像模組。所述感光元件2010B用於組裝製造所述攝像模組，從而得到模塑型的攝像模組。所述感光組件2010B包括一封裝部2011B和一感光部2012B，所述封裝部2011B模塑地連接於所述感光部2012B。 48 and 49, the photosensitive assembly and the camera module according to the eighteenth preferred embodiment of the present invention are shown. The photosensitive element 2010B is used to assemble and manufacture the camera module to obtain a molded camera module. The photosensitive component 2010B includes an encapsulation portion 2011B and a photosensitive portion 2012B, and the encapsulation portion 2011B is connected to the photosensitive portion 2012B by molding.

所述感光部2012B包括一線路板主體20122B和一感光晶片20121B，所述感光晶片20121B被設置於所述線路板主體20122B上。根據本發明的這個實施例，所述感光晶片20121B模塑地連接於所述線路板主體20122B。 The photosensitive portion 2012B includes a circuit board body 20122B and a photosensitive wafer 20121B, and the photosensitive wafer 20121B is disposed on the circuit board body 20122B. According to this embodiment of the present invention, the photosensitive wafer 20121B is connected to the circuit board body 20122B by molding.

根據本發明這個實施例，所述感光部2012B包括一連接線路和至少一電路元件20123B。所述連接線路預設於所述線路板主體20122B，所述電路元件20123B電連接於所述連接線路以及所述感光晶片20121B，以供所述感光晶片20121B的感光工作過程。所述電路元件20123B凸出地設置於所述線路板主體20122B。所述電路元件20123B可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 2012B includes a connecting line and at least one circuit element 20123B. The connection circuit is preset on the circuit board body 20122B, and the circuit element 20123B is electrically connected to the connection circuit and the photosensitive chip 20121B for the photosensitive working process of the photosensitive chip 20121B. The circuit element 20123B is protrudingly disposed on the circuit board body 20122B. The circuit element 20123B can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay or a driver, and the like.

值得一提的是，所述封裝部2011B將所述電路元件20123B包覆於其內部，因此使得所述電路元件20123B不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片20121B相通的環境中，從而當組裝為所述攝像模組時，所述電路元件20123B上不會沾染灰塵等污染物，也不會影響所述感光晶片20121B，不同于傳統攝像模組中電路元件20123B暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件20123B表面，避免污染所述感光晶片20121B而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation part 2011B encapsulates the circuit element 20123B inside, so that the circuit element 20123B will not be directly exposed to the space, more specifically, will not be exposed to the The photosensitive chip 20121B is in the same environment, so when assembled into the camera module, the circuit element 20123B will not be contaminated with dust and other pollutants, nor will it affect the photosensitive chip 20121B, which is different from the traditional camera module. The existence of the circuit element 20123B exposed, such as a container, so as to prevent dust and debris from staying on the surface of the circuit element 20123B by molding and wrapping, so as to avoid contaminating the photosensitive chip 20121B and making the camera module appear dirty and black Points and other undesirable phenomena.

所述封裝部2011B形成一通孔201100B，以便於為所述感光晶片20121B提供感光路徑。 A through hole 201100B is formed in the package portion 2011B, so as to provide a photosensitive path for the photosensitive chip 20121B.

根據本發明的這個優選實施例，所述感光部2012B包括至少一連接線20124B，用於電連接所述感光晶片20121B和所述線路板主體20122B。進一步，所述連接線20124B可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線20124B呈弧形地連接所述感光晶片20121B和所述線路板主體20122B。 According to this preferred embodiment of the present invention, the photosensitive portion 2012B includes at least one connection line 20124B for electrically connecting the photosensitive wafer 20121B and the circuit board main body 20122B. Further, the connecting wire 20124B may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connecting wire 20124B connects the photosensitive wafer 20121B and the circuit board main body 20122B in an arc shape.

值得一提的是，所述連接線20124B被模塑于所述封裝部2011B內部，從而可以借助所述封裝部2011B將所述連接線20124B進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線20124B不會受到任何的碰觸損傷，同時減少環境因素對各所述連接線20124B的影響，如溫度、濕度，使得所述感光晶片20121B和所述線路板主體20122B之間的通訊連接穩定，這一點是完全不提供于現有技術的。 It is worth mentioning that the connecting wire 20124B is molded inside the packaging part 2011B, so that the connecting wire 20124B can be covered by the packaging part 2011B without being directly exposed to the outside, so as to assemble When the camera module is used, the connecting wires 20124B will not be damaged by any touch, and the influence of environmental factors on the connecting wires 20124B, such as temperature and humidity, is reduced, so that the photosensitive chip 20121B and the The communication connection between the circuit board main bodies 20122B is stable, which is completely not provided in the prior art.

值得一提的是，所述封裝部2011B包覆所述電路元件20123B和所述連接線20124B，具有保護所述電路元件20123B和所述連接線20124B及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部2011B不限於包覆所述電路元件20123B或所述連接線20124B。也就是說，在本發明的其他實施例中，所述封裝部2011B可以直接模塑於沒有凸出的所述電路元件20123B的所述線路板主體20122B，也可以是模塑於所述電路元件20123B外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 2011B covers the circuit element 20123B and the connecting wire 20124B, and protects the circuit element 20123B and the connecting wire 20124B and the camera module for better performance. However, those skilled in the art should understand that the encapsulation part 2011B is not limited to encapsulating the circuit element 20123B or the connecting wire 20124B. That is to say, in other embodiments of the present invention, the encapsulation portion 2011B may be directly molded on the circuit board body 20122B of the circuit element 20123B without protrusions, or may be molded on the circuit element 20123B outside and around different locations.

進一步，所述感光晶片20121B具有一感光區201211B和一非感光區201212B，所述非感光區201212B環繞於所述感光區201211B週邊。所述感光區201211B用於進行感光作用，所述連接線20124B連接於所述非感光區201212B。 Further, the photosensitive wafer 20121B has a photosensitive area 201211B and a non-photosensitive area 201212B, and the non-photosensitive area 201212B surrounds the periphery of the photosensitive area 201211B. The photosensitive area 201211B is used for photosensitive action, and the connection line 20124B is connected to the non-photosensitive area 201212B.

根據本發明的這個優選實施例，所述封裝部2011B延伸於所述感光晶片20121B的所述非感光區201212B，從而將所述感光晶片20121B通過模塑的方式疊層固定於所述線路板主體20122B。通過這樣的方式，如模塑於晶片的方式(Molding on Chip，MOC)擴大了所述封裝部2011B向內的可模塑範圍，從而可以減小所述線路板主體20122B以及所述封裝部2011B的外側的結構性部分，進一步減小所述模塑感光部件2012B的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 2011B extends to the non-photosensitive area 201212B of the photosensitive wafer 20121B, so that the photosensitive wafer 20121B is laminated and fixed to the circuit board body by molding 20122B. In this way, the inward molding range of the packaging part 2011B can be expanded by molding on a chip (MOC), so that the circuit board body 20122B and the packaging part 2011B can be reduced in size The structural part on the outer side further reduces the length and width of the molded photosensitive member 2012B, and reduces the length and width of the camera module assembled by it.

在本發明的這個實施例中，所述封裝部2011B凸起地圍繞於所述感光晶片20121B的所述感光區201211B外側，特別地，所述封裝部2011B一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件2010B被用於組裝所述攝像模組時，所述感光晶片20121B被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 2011B protrudes around the outside of the photosensitive area 201211B of the photosensitive wafer 20121B, and in particular, the encapsulation portion 2011B is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so when the photosensitive element 2010B is used to assemble the camera module, the photosensitive wafer 20121B is sealed inside to form a closed inner space.

具體地，在製造所述感光元件2010B時，可以選取一傳統的線路板作為所述線路板主體20122B，在所述線路板主體20122B上設置一所述感光晶片20121B，將所述感光晶片20121B通過所述連接線20124B電連接，進而在初步組裝後的所述線路板主體20122B和感光晶片20121B部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部2011B，或用半導體封裝中常用的模壓工藝形成所述封裝部2011B。所述線路板主體20122B可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)等。所述封裝部2011B形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部2011B可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用環氧樹脂。本領 域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 2010B, a conventional circuit board can be selected as the circuit board body 20122B, a photosensitive wafer 20121B is arranged on the circuit board body 20122B, and the photosensitive wafer 20121B is passed through the circuit board body 20122B. The connecting wires 20124B are electrically connected, and then molding is performed on the circuit board main body 20122B and the photosensitive wafer 20121B after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The circuit board after the surface mount process) is molded to form the package portion 2011B, or the package portion 2011B is formed by a molding process commonly used in semiconductor packaging. The circuit board body 20122B can be selected to be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a hard PCB board (without a flex board), and the like. The manner in which the encapsulation part 2011B is formed may be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The material that can be selected for the encapsulation part 2011B is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and a ring can be selected for the molding process. Oxygen resin. ability It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

進一步，所述封裝部2011B頂端表面平整，適於安裝一濾光片2020B，也就是說，當所述感光元件2010B被用於組裝所述攝像模組時，所述攝像模組的濾光片2020B被安裝于所述封裝部2011B的頂端表面，使得所述濾光片2020B位於所述感光晶片20121B的感光路徑上，且不需要提供額外的濾光片安裝支架。也就是說，所述封裝部2011B在此處具有傳統支架的功能，但是基於模塑工藝的優勢，所述模頂部2011B可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述濾光片2020B平整地被安裝，這一點也是優於傳統的攝像模組。 Further, the top surface of the encapsulation portion 2011B is flat and suitable for installing a filter 2020B, that is to say, when the photosensitive element 2010B is used to assemble the camera module, the filter of the camera module The 2020B is mounted on the top surface of the package portion 2011B, so that the filter 2020B is located on the photosensitive path of the photosensitive wafer 20121B, and no additional filter mounting bracket is required. That is to say, the encapsulation part 2011B has the function of a traditional bracket here, but based on the advantages of the molding process, the mold top 2011B can be made to have good flatness by means of the molding process, so that all The filter 2020B is installed flat, which is also better than the traditional camera module.

不同於上述優選實施例的是，在本發明的這個實施例中，所述感光元件2010B的所述感光部2012B包括一加固層20125B，所述加固層20125B疊層地連接於所述線路板主體20122B底層，以便於加強所述線路板主體20122B的結構強度。也就是說，在所述線路板主體20122B上所述封裝部2011B以及所述感光晶片20121B所在的區域底層貼裝所述加固層20125B，從而使得所述線路板主體20122B穩定可靠地支撐所述封裝部2011B和所述感光晶片20121B。 Different from the above preferred embodiment, in this embodiment of the present invention, the photosensitive portion 2012B of the photosensitive element 2010B includes a reinforcement layer 20125B, and the reinforcement layer 20125B is laminated and connected to the circuit board main body 20122B bottom layer, in order to strengthen the structural strength of the circuit board main body 20122B. That is to say, the reinforcing layer 20125B is bottom-mounted on the circuit board body 20122B where the package portion 2011B and the photosensitive chip 20121B are located, so that the circuit board body 20122B can stably and reliably support the package part 2011B and the photosensitive wafer 20121B.

進一步，所述加固層20125B為一金屬板，所述金屬板貼附於所述線路板主體20122B的底層，增加所述線路板主體20122B的結構強度，另一方面，增加所述感光組件2010B的散熱性能，能有效散失所述感光晶片20121B發出的熱量。 Further, the reinforcing layer 20125B is a metal plate, and the metal plate is attached to the bottom layer of the circuit board main body 20122B to increase the structural strength of the circuit board main body 20122B, and on the other hand, increase the strength of the photosensitive element 2010B The heat dissipation performance can effectively dissipate the heat emitted by the photosensitive chip 20121B.

值得一提的是，所述線路板主體20122B可以採用FPC(Flex Print Circuit，撓性印製電路板)，而通過所述加固層20125B增強所述FPC的剛性，使得具有良好彎曲性能的FPC能夠滿足所述感光元件2010B的承載要求。也就是說，所述線路板主體20122B的可選擇範圍更加廣泛，例如PCB(Printed Circuit Board，剛性印製電路板)，FPC，RF(Rigid Flex，軟硬結合板)。通過所述加固層20125B增加所述線路板主體20122B的結構強度並且提高散熱性能，從而可以減小所述線路板主體20122B的厚度，使得所述感光組件2010B的高度進一步減小，以及由其組裝得到的攝像模組的高度減小。 It is worth mentioning that the main body 20122B of the circuit board can use FPC (Flex Print Circuit, flexible printed circuit board), and the rigidity of the FPC is enhanced by the reinforcement layer 20125B, so that the FPC with good bending performance can be The bearing requirements of the photosensitive element 2010B are met. That is to say, the optional range of the circuit board body 20122B is wider, such as PCB (Printed Circuit Board, rigid printed circuit board), FPC, RF (Rigid Flex, rigid-flex board). Through the reinforcement layer 20125B, the structural strength of the circuit board body 20122B is increased and the heat dissipation performance is improved, so that the thickness of the circuit board body 20122B can be reduced, so that the height of the photosensitive component 2010B can be further reduced, and the assembly by the same The height of the resulting camera module is reduced.

值得一提的是，在本發明的這個實施例中，所述加固層20125呈板狀重疊於所述線路板主體20122B，而在本發明的其他實施例中，所述加固層20125B可以延伸至包裹所述封裝部2011B側壁，從而在增強所述感光元件2010B的結構強度的同時，增強其抗電磁干擾能力。 It is worth mentioning that in this embodiment of the present invention, the reinforcing layer 20125 overlaps the circuit board main body 20122B in a plate shape, while in other embodiments of the present invention, the reinforcing layer 20125B may extend to The sidewall of the encapsulation portion 2011B is wrapped, so as to enhance the structural strength of the photosensitive element 2010B and enhance its anti-electromagnetic interference capability.

值得一提的是，所述封裝部的內壁可以根據所述連接線20124的形狀而設置，比如設置為傾斜狀，從而在包覆所述連接線20124B的同時使得所述感光晶片20121B可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部2011B的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part can be set according to the shape of the connecting wire 20124, for example, set to be inclined, so that the photosensitive chip 20121B can receive to more light. Those skilled in the art should understand that the shape of the encapsulation part 2011B is not a limitation of the present invention.

參照圖48和圖49，根據本發明的第十八優選實施例的攝像模組。所述攝像模組可以是一定焦模組(Fix Focus Model，FFM)。所述攝像模組包括一所述感光組件2010B、一所述濾光片2020B和一鏡頭2030B。 48 and 49, a camera module according to an eighteenth preferred embodiment of the present invention is shown. The camera module may be a fixed focus module (Fix Focus Model, FFM). The camera module includes a photosensitive component 2010B, a filter 2020B and a lens 2030B.

所述濾光片2020B被安裝於所述感光組件2010B，所述鏡頭2030B被安裝於所述感光組件2010B上。 The filter 2020B is mounted on the photosensitive component 2010B, and the lens 2030B is mounted on the photosensitive component 2010B.

更具體地，所述濾光片2020B被安裝於所述感光組件2010B的所述封裝部2011B頂端。所述鏡頭2030B被按安裝於所述感光組件2010B的所述封裝部2011B的頂端。特別地，所述濾光片2020B和所述鏡頭2030B在所述封裝部2011B的具體安裝位置可以根據具體需要協調配置。 More specifically, the filter 2020B is mounted on the top of the packaging portion 2011B of the photosensitive component 2010B. The lens 2030B is mounted on the top of the package portion 2011B of the photosensitive element 2010B. In particular, the specific installation positions of the optical filter 2020B and the lens 2030B in the packaging part 2011B can be coordinated and configured according to specific needs.

還值得一提的是，所述鏡頭2030B被安裝於所述感光組件2010B的所述封裝部2011B的頂端，從而所述封裝部2011B相當於傳統攝像模組中的支架的功能，為所述鏡頭2030B提供支撐、固定位置，但是組裝卻不同于傳統 COB工藝過程。傳統COB工藝的攝像模組的支架以粘貼的方式固定於線路板，而所述封裝部2011B通過模塑工藝固定於所述線路板主體20122B，不需要粘貼固定過程，模塑方式相對於粘貼固定具有更好的連接穩定性以及工藝過程的可控性，且在所述封裝部2011B與所述線路板主體20122B之間不需要預留AA調整的膠水空間，因此減小了傳統攝像模組AA調整的預留空間，使得攝像模組的厚度得以減小；另一方面，所述封裝部2011B包覆所述電路元件20123B和所述連接線20124B，使得傳統的支架功能和電路元件20123B以及所述連接線20124B可以在空間上重疊設置，不需要像傳統攝像模組，在電路器件周圍預留安全距離，從而使得具有支架功能的所述封裝部2011B的高度可以設置在較小的範圍，從而進一步提供了攝像模組厚度可以減小的空間。此外，所述封裝部2011B代替傳統的支架，避免了支架在粘貼組裝時帶來的傾斜誤差，減小了攝像模組組裝的累積公差。且所述封裝部2011B包覆所述連接線20124B，且所述封裝部2011B延伸至所述感光晶片20121B的非感光區201212B，使得所述封裝部2011B可以向內收縮，從而進一步減小所述攝像模組的橫向的長寬尺寸。 It is also worth mentioning that the lens 2030B is mounted on the top of the encapsulation part 2011B of the photosensitive component 2010B, so that the encapsulation part 2011B is equivalent to the function of a bracket in a conventional camera module, which is the lens 2030B provides support, fixed position, but assembly is different from traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by sticking, and the encapsulation part 2011B is fixed to the circuit board main body 20122B by a molding process, and the sticking and fixing process is not required. It has better connection stability and process controllability, and there is no need to reserve glue space for AA adjustment between the packaging part 2011B and the circuit board main body 20122B, so the traditional camera module AA is reduced. Adjust the reserved space to reduce the thickness of the camera module; on the other hand, the encapsulation part 2011B covers the circuit element 20123B and the connecting wire 20124B, so that the traditional bracket function and the circuit element 20123B and all The connecting wires 20124B can be overlapped in space, and there is no need to reserve a safe distance around the circuit device like a traditional camera module, so that the height of the encapsulation portion 2011B with the bracket function can be set in a smaller range, thereby This further provides a space where the thickness of the camera module can be reduced. In addition, the encapsulation part 2011B replaces the traditional bracket, which avoids the inclination error caused when the bracket is pasted and assembled, and reduces the cumulative tolerance of the camera module assembly. And the encapsulation part 2011B covers the connection line 20124B, and the encapsulation part 2011B extends to the non-photosensitive area 201212B of the photosensitive chip 20121B, so that the encapsulation part 2011B can shrink inwardly, thereby further reducing the The horizontal length and width of the camera module.

所述攝像模組可以為一動焦攝像模組。所述攝像模組包括一所述感光組件2010B、一所述濾光片2020B、一馬達2040B和一鏡頭2030B。 The camera module can be a moving focus camera module. The camera module includes a photosensitive component 2010B, a filter 2020B, a motor 2040B and a lens 2030B.

所述濾光片2020B被安裝於所述感光組件2010B，所述鏡頭2030B被安裝於所述馬達2040B，所述馬達2040B被安裝於所述感光組件上。 The filter 2020B is mounted on the photosensitive element 2010B, the lens 2030B is mounted on the motor 2040B, and the motor 2040B is mounted on the photosensitive element.

更進一步，所述濾光片2020B被安裝於所述感光組件2010B的所述封裝部2011B的頂端。所述馬達2040B安裝於所述感光組件2010B的所述封裝部2011B的頂端。特別地，所述濾光片2020B和所述馬達2040B在所述封裝部2011B的具體安裝位置可以根據具體需要協調配置。 Furthermore, the filter 2020B is mounted on the top of the encapsulation portion 2011B of the photosensitive element 2010B. The motor 2040B is mounted on the top of the package portion 2011B of the photosensitive element 2010B. In particular, the specific installation positions of the optical filter 2020B and the motor 2040B in the packaging part 2011B can be coordinated and configured according to specific needs.

本領域技術人員應當理解的是，上述攝像模組的結構和類型僅作為舉例，來說明所述攝像模組可以被實施的方式，並不是本發明的限制。 It should be understood by those skilled in the art that the structures and types of the above-mentioned camera modules are only used as examples to illustrate the manner in which the camera modules can be implemented, and are not limitations of the present invention.

特別地，所述馬達2040B通過所述馬達連接結構2013電連接於所述感光元件2010B，所述馬達2040B的所述馬達引腳2041B電連接於所述感光元件2010的所述電路接點20132，從而通過所述引線20131電連接於所述線路板主體20122。所述馬達引腳2041B可以通過導電膠膜連接於所述引線20131的所述馬達連接端201311，也可以通過焊接的方式連接於所述馬達連接端201311。 In particular, the motor 2040B is electrically connected to the photosensitive element 2010B through the motor connection structure 2013 , the motor pins 2041B of the motor 2040B are electrically connected to the circuit contacts 20132 of the photosensitive element 2010 , Therefore, it is electrically connected to the circuit board main body 20122 through the leads 20131 . The motor pins 2041B can be connected to the motor connecting ends 201311 of the lead wires 20131 through a conductive adhesive film, or can be connected to the motor connecting ends 201311 by welding.

特別地，當所述馬達引腳2041B通過導電膠貼附方式粘接於所述電路接點時，可以不需要焊接導線來連接所述馬2040B和所述感光部2012的所述線路板主體20122，從而減少馬達焊接的工藝過程。 In particular, when the motor pins 2041B are adhered to the circuit contacts by means of conductive adhesive, there is no need for soldering wires to connect the motor 2040B and the circuit board main body 20122 of the photosensitive portion 2012 , thereby reducing the process of motor welding.

值得一提的是，在本發明的這個實施例中，以所述引線20131連接所述馬達2040B的方式來說明本發明電連接馬達的方式，而在本發明的其他實施例所述，可以選擇不同方式的所述馬達連接結構2013來連接所述馬達2040B，例如，選取圖41A、41B、41C中示例的方式，也就是說，所述41A、41B、41C中對應的不同馬達連接結構都可以與本實施例中的所述感光元件2010B結合，從而提供不同馬達連接方式，本領域的技術人員應當理解的是，圖中所示方式，並不是本發明的限制。 It is worth mentioning that, in this embodiment of the present invention, the method of electrically connecting the motor 2040B of the present invention is described in the way that the lead wire 20131 is connected to the motor 2040B, while in other embodiments of the present invention, you can choose The motor connection structure 2013 can be connected to the motor 2040B in different ways. For example, the methods shown in FIGS. 41A , 41B and 41C are selected, that is, the different motor connection structures corresponding to the 41A, 41B and 41C Combined with the photosensitive element 2010B in this embodiment to provide different motor connection modes, those skilled in the art should understand that the modes shown in the figures are not limitations of the present invention.

參照圖51和圖52，根據本發明的第十九個優選實施例的感光組件和攝像模組將被闡釋。所述感光元件2010C用於組裝製造所述攝像模組，從而得到模塑型的攝像模組。所述感光組件2010C包括一封裝部2011C和感光部2012C，所述封裝部2011C模塑地連接於所述感光部2012C。 51 and 52, a photosensitive assembly and a camera module according to a nineteenth preferred embodiment of the present invention will be explained. The photosensitive element 2010C is used to assemble and manufacture the camera module to obtain a molded camera module. The photosensitive component 2010C includes a package portion 2011C and a photosensitive portion 2012C, and the package portion 2011C is connected to the photosensitive portion 2012C by molding.

所述感光部2012C包括一線路板主體20122C和一感光晶片20121C，所述感光晶片20121C被設置於所述線路板主體20122C上。根據本發明的這個實施例，所述感光晶片20121C模塑地連接於所述線路板主體。 The photosensitive portion 2012C includes a circuit board body 20122C and a photosensitive wafer 20121C, and the photosensitive wafer 20121C is disposed on the circuit board body 20122C. According to this embodiment of the present invention, the photosensitive wafer 20121C is connected to the circuit board body by molding.

根據本發明這個實施例，所述感光部2012C包括一連接線路和至少一電路元件20123C。所述連接線路預設於所述線路板主體20122C，所述電路 元件20123C電連接於所述連接線路以及所述感光晶片20121C，以供所述感光晶片20121C的感光工作過程。所述電路元件20123C凸出地設置於所述線路板主體20122C。所述電路元件20123C可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 2012C includes a connecting line and at least one circuit element 20123C. The connection circuit is preset on the circuit board main body 20122C, and the circuit The element 20123C is electrically connected to the connection lines and the photosensitive wafer 20121C for the photosensitive working process of the photosensitive wafer 20121C. The circuit element 20123C is protrudingly disposed on the circuit board body 20122C. The circuit element 20123C can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay or a driver, and the like.

值得一提的是，所述封裝部2011C將所述電路元件20123C包覆於其內部，因此使得所述電路元件20123C不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片20121C相通的環境中，從而當組裝為所述攝像模組時，所述電路元件20123C上不會沾染灰塵等污染物，也不會影響所述感光晶片20121C，不同于傳統攝像模組中電路元件20123C暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件20123C表面，避免污染所述感光晶片20121C而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation part 2011C encapsulates the circuit element 20123C inside, so that the circuit element 20123C is not directly exposed to the space, more specifically, not exposed to the The photosensitive chip 20121C is in the same environment, so that when assembled into the camera module, the circuit element 20123C will not be contaminated with dust and other pollutants, nor will it affect the photosensitive chip 20121C, which is different from the traditional camera module. The existence of the circuit element 20123C exposed, such as a container, so as to prevent dust and debris from staying on the surface of the circuit element 20123C by molding and wrapping, and avoid contaminating the photosensitive chip 20121C and making the camera module appear dirty and black Points and other undesirable phenomena.

所述封裝部2011C形成一通孔201100C，以便於為所述感光晶片20121C提供感光路徑。 A through hole 201100C is formed in the package portion 2011C, so as to provide a photosensitive path for the photosensitive chip 20121C.

根據本發明的這個優選實施例，所述感光部2012C包括至少一連接線20124C，用於電連接所述感光晶片20121C和所述線路板主體20122C。進一步，所述連接線20124C可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線20124C呈弧形地連接所述感光晶片20121C和所述線路板主體20122C。 According to this preferred embodiment of the present invention, the photosensitive portion 2012C includes at least one connecting wire 20124C for electrically connecting the photosensitive wafer 20121C and the circuit board main body 20122C. Further, the connection wire 20124C may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connecting wire 20124C connects the photosensitive wafer 20121C and the circuit board main body 20122C in an arc shape.

值得一提的是，所述連接線20124C被模塑于所述封裝部2011C內部，從而可以借助所述封裝部2011C將20所述連接線20124C進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線20124C不會受到任何的碰觸損傷，同時減少環境因素對各所述連接線20124C的影響，如溫度、濕度，使得所述感光晶片20121C和所述線路板主體20122C之間的通訊連接穩定，這一點是完全不提供于現有技術的。 It is worth mentioning that the connecting wire 20124C is molded inside the packaging part 2011C, so that the connecting wire 20124C can be covered by the packaging part 2011C without being directly exposed to the outside, thereby When assembling the camera module, the connecting wires 20124C will not be damaged by any touch, and the influence of environmental factors on the connecting wires 20124C, such as temperature and humidity, will be reduced, so that the photosensitive chip 20121C and all the connecting wires 20124C will be reduced. The communication connection between the circuit board main bodies 20122C is stable, which is completely not provided in the prior art.

值得一提的是，所述封裝部2011C包覆所述電路元件20123C和所述連接線20124C，具有保護所述電路元件20123C和所述連接線20124C及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部2011C不限於包覆所述電路元件20123C或所述連接線20124C。也就是說，在本發明的其他實施例中，所述封裝部2011C可以直接模塑於沒有凸出的所述電路元件20123C的所述線路板主體20122C，也可以是模塑於所述電路元件20123C外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 2011C covers the circuit element 20123C and the connecting wire 20124C, and protects the circuit element 20123C and the connecting wire 20124C and the camera module for better performance. However, those skilled in the art should understand that the encapsulation part 2011C is not limited to encapsulating the circuit element 20123C or the connecting wire 20124C. That is to say, in other embodiments of the present invention, the encapsulation portion 2011C may be directly molded on the circuit board body 20122C of the circuit element 20123C without protrusions, or may be molded on the circuit element 20123C outside and around different locations.

進一步，所述感光晶片20121C具有一感光區201211C和一非感光區201212C，所述非感光區201212C環繞於所述感光區201211C週邊。所述感光區201211C用於進行感光作用，所述連接線20124C連接於所述非感光區201212C。 Further, the photosensitive wafer 20121C has a photosensitive area 201211C and a non-photosensitive area 201212C, and the non-photosensitive area 201212C surrounds the periphery of the photosensitive area 201211C. The photosensitive area 201211C is used for photosensitive action, and the connection line 20124C is connected to the non-photosensitive area 201212C.

根據本發明的這個優選實施例，所述封裝部2011C延伸於所述感光晶片20121C的所述非感光區201212C，從而將所述感光晶片20121C通過模塑的方式疊層固定於所述線路板主體20122C。通過這樣的方式，如模塑於晶片的方式(Molding on the chip)擴大了所述封裝部2011C向內的可模塑範圍，從而可以減小所述線路板主體20122C以及所述封裝部2011C的外側的結構性部分，進一步減小所述感光元件的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 2011C extends from the non-photosensitive area 201212C of the photosensitive wafer 20121C, so that the photosensitive wafer 20121C is laminated and fixed to the circuit board body by molding 20122C. In this way, the inward moldable range of the encapsulation part 2011C is expanded by molding on the chip, so that the thickness of the circuit board body 20122C and the encapsulation part 2011C can be reduced. The outer structural part further reduces the length and width of the photosensitive element, and reduces the length and width of the camera module assembled by it.

在本發明的這個實施例中，所述封裝部2011C凸起地圍繞於所述感光晶片20121C的所述感光區201211C外側，特別地，所述封裝部2011C一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件2010C被用於組裝所述攝像模組時，所述感光晶片20121C被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 2011C protrudes around the outside of the photosensitive area 201211C of the photosensitive wafer 20121C, and in particular, the encapsulation portion 2011C is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so that when the photosensitive element 2010C is used to assemble the camera module, the photosensitive wafer 20121C is sealed inside to form a closed inner space.

具體地，在製造所述感光元件2010C時，可以選取一傳統的線路板作為所述線路板主體20122C，在所述線路板主體20122C上設置一所述感光晶片20121C，將所述感光晶片20121C通過所述連接線20124C電連接，進而在初步組裝後的所述線路板主體20122C和感光晶片20121C部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部2011C，或用半導體封裝中常用的模壓工藝形成所述封裝部2011C。所述線路板主體20122C可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)、柔性線路板(FPC)等。所述封裝部2011C形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部2011C可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用環氧樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 2010C, a conventional circuit board can be selected as the circuit board body 20122C, a photosensitive wafer 20121C is set on the circuit board body 20122C, and the photosensitive wafer 20121C is passed through the circuit board body 20122C. The connecting wires 20124C are electrically connected, and then molding is performed on the circuit board main body 20122C and the photosensitive wafer 20121C after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The circuit board after the surface mount process) is molded to form the package portion 2011C, or the package portion 2011C is formed by a molding process commonly used in semiconductor packaging. The circuit board body 20122C can be selected to be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a rigid PCB board (without a flex board), a flexible circuit board (FPC), and the like. The manner in which the encapsulation part 2011C is formed may be selected from, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the encapsulation part 2011C are, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and ring Oxygen resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

所述感光組件2010C進一步包括一濾光片2020C，所述濾光片2020C模塑地疊層設置於所述感光晶片20121C上。所述濾光片2020C的邊緣被模塑于所述封裝部2011C，從而固定所述濾光片2020C。值得一提的是，所述濾光片2020C覆蓋於所述感光晶片20121C上方，將所述感光晶片20121C與外部環境隔離，保護所述感光晶片20121C受到損傷以及防止灰塵的進入。 The photosensitive component 2010C further includes a filter 2020C, and the filter 2020C is molded and laminated on the photosensitive wafer 20121C. The edge of the filter 2020C is molded on the encapsulation portion 2011C, thereby fixing the filter 2020C. It is worth mentioning that the filter 2020C covers the top of the photosensitive wafer 20121C, isolates the photosensitive wafer 20121C from the external environment, protects the photosensitive wafer 20121C from damage and prevents dust from entering.

在製造所述感光元件2010C時，先將所述感光晶片20121C貼附於所述線路板主體20122C，並將所述連接於所述感光晶片20121C和所述線路板主體20122C，進而將所述濾光片2020C貼附於所述感光晶片20121C上，進一步，將所述線路板主體20122C和所述感光晶片20121C和所述濾光片2020C進行模 塑，形成所述封裝部2011C。在模塑時，由於所述濾光片2020C覆蓋於所述感光晶片20121C上，因此能夠防止模塑的模具對於所述感光晶片20121C的傷害，且由於所述濾光片2020C與所述感光晶片20121C的距離減小，因此可以使得由其組裝的攝像模組的後焦距縮小，從而減小所述攝像模組的高度，另一方面，由於不需要為所述濾光片2020C提供額外的支撐部件，因此也在一定程度上使得所述攝像模組的厚度得以進一步減小。 When manufacturing the photosensitive element 2010C, the photosensitive wafer 20121C is first attached to the circuit board main body 20122C, and the photosensitive wafer 20121C and the circuit board main body 20122C are connected to the photosensitive wafer 20121C and the circuit board main body 20122C, and then the filter The light sheet 2020C is attached to the photosensitive wafer 20121C, and further, the circuit board main body 20122C, the photosensitive wafer 20121C and the light filter 2020C are molded. plastic to form the package portion 2011C. During molding, since the filter 2020C covers the photosensitive wafer 20121C, damage to the photosensitive wafer 20121C can be prevented by the molded mold, and the filter 2020C and the photosensitive wafer 20121C can be prevented from being damaged. The distance of 20121C is reduced, so the back focal length of the camera module assembled by it can be reduced, thereby reducing the height of the camera module. On the other hand, since there is no need to provide additional support for the filter 2020C Therefore, to a certain extent, the thickness of the camera module can be further reduced.

值得一提的是，所述封裝部2010C的內壁可以根據所述連接線20124的形狀而設置，比如設置為傾斜狀，從而在包覆所述連接線20124C的同時使得所述感光晶片20121C可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部2011C的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part 2010C can be set according to the shape of the connecting wire 20124, for example, set to be inclined, so that the photosensitive chip 20121C can be covered while the connecting wire 20124C is covered. more light is received. Those skilled in the art should understand that the shape of the packaging part 2011C is not a limitation of the present invention.

參照圖51至圖53，根據本發明的第十九個優選實施例的攝像模組。所述攝像模組可以是一定焦模組。所述攝像模組20100C包括一所述感光組件2010C和一鏡頭2030C。所述鏡頭2030C被安裝於所述感光元件2010C上，組裝形成所述攝像模組。 51 to 53, a camera module according to a nineteenth preferred embodiment of the present invention. The camera module can be a fixed focus module. The camera module 20100C includes a photosensitive component 2010C and a lens 2030C. The lens 2030C is mounted on the photosensitive element 2010C, and assembled to form the camera module.

特別地，所述鏡頭2030C可以通過粘接的方式固定於所述感光元件2010C的所述封裝部2011C的頂端，且借助模塑工藝中模具製造的特點，使得所述封裝部2011C的頂端具有較好的平整性，為所述鏡頭2030C提供良好的安裝條件，從而獲得優質的攝像模組。 In particular, the lens 2030C can be fixed to the top of the encapsulation portion 2011C of the photosensitive element 2010C by means of adhesive bonding, and the top of the encapsulation portion 2011C has a relatively high quality by virtue of the characteristics of mold manufacturing in the molding process. Good flatness provides good installation conditions for the lens 2030C, thereby obtaining a high-quality camera module.

值得一提的是，所述鏡頭2030C被安裝於所述感光組件2010C的所述封裝部2011C的頂端，從而所述封裝部2011C相當於傳統攝像模組中的支架的功能，為所述鏡頭2030C提供支撐、固定位置，但是組裝卻不同于傳統COB工藝過程。傳統COB工藝的攝像模組的支架以粘貼的方式固定於線路板，而所述封裝部2011C通過模塑工藝固定於所述線路板主體20122C，不需要粘貼固定過程，模塑方式相對於粘貼固定具有更好的連接穩定性以及工藝過程的可控 性，且在所述封裝部2011C與所述線路板主體20122C之間不需要預留AA調整的膠水空間，因此減小了傳統攝像模組AA調整的預留空間，使得攝像模組的厚度得以減小；另一方面，所述封裝部2011C包覆所述電路元件20123C和所述連接線20124C，使得傳統的支架功能和電路元件20123C以及所述連接線20124C可以在空間上重疊設置，不需要像傳統攝像模組，在電路器件周圍預留安全距離，從而使得具有支架功能的所述封裝部2011C的高度可以設置在較小的範圍，從而進一步提供了攝像模組厚度可以減小的空間。此外，所述封裝部2011C代替傳統的支架，避免了支架在粘貼組裝時帶來的傾斜誤差，減小了攝像模組組裝的累積公差。且所述封裝部2011C包覆所述連接線20124C，且所述封裝部2011C延伸至所述感光晶片20121C的非感光區201212C，使得所述封裝部2011C可以向內收縮，從而進一步減小所述攝像模組的橫向的長寬尺寸。而且，所述感光元件2010C將所述濾光片2020C模塑其內部，因此在組裝所述攝像模組時，不需要再次進行濾光片的粘貼安裝過程，從而減少攝像模組組裝工藝過程，提高工作效率，這些都是優於現有技術的。 It is worth mentioning that the lens 2030C is mounted on the top of the encapsulation part 2011C of the photosensitive element 2010C, so that the encapsulation part 2011C is equivalent to the function of a bracket in a conventional camera module, which is the lens 2030C Provide support, fixed position, but assembly is different from traditional COB process. The bracket of the camera module of the traditional COB process is fixed to the circuit board by sticking, and the encapsulation part 2011C is fixed to the circuit board main body 20122C by a molding process, and the sticking and fixing process is not required. Better connection stability and process control and there is no need to reserve glue space for AA adjustment between the packaging part 2011C and the circuit board body 20122C, so the reserved space for AA adjustment of the traditional camera module is reduced, so that the thickness of the camera module can be reduced. On the other hand, the encapsulation part 2011C wraps the circuit element 20123C and the connection wire 20124C, so that the conventional bracket function and the circuit element 20123C and the connection wire 20124C can be spatially overlapped and arranged without the need for Like a traditional camera module, a safety distance is reserved around the circuit device, so that the height of the package portion 2011C with a bracket function can be set in a small range, thereby further providing a space where the thickness of the camera module can be reduced. In addition, the encapsulation part 2011C replaces the traditional bracket, which avoids the inclination error caused when the bracket is pasted and assembled, and reduces the cumulative tolerance of the camera module assembly. And the encapsulation portion 2011C wraps the connection line 20124C, and the encapsulation portion 2011C extends to the non-photosensitive area 201212C of the photosensitive chip 20121C, so that the encapsulation portion 2011C can be retracted inward, thereby further reducing the The horizontal length and width of the camera module. Moreover, the photosensitive element 2010C molds the filter 2020C inside, so when assembling the camera module, there is no need to carry out the process of pasting and installing the filter again, thereby reducing the assembly process of the camera module. Improve work efficiency, these are superior to the existing technology.

參照圖51、圖52和圖54，是根據本發明的第十九個優選實施例的另一攝像模組將被闡釋。所述攝像模組20100C可以為一動焦攝像模組(Automatic Focus Model，AFM)。所述攝像模組包括一所述感光組件2010C、一馬達2040C和一鏡頭2030C。 51, 52 and 54, another camera module according to the nineteenth preferred embodiment of the present invention will be explained. The camera module 20100C may be an automatic focus camera module (Automatic Focus Model, AFM). The camera module includes a photosensitive component 2010C, a motor 2040C and a lens 2030C.

所述鏡頭2030C被安裝於所述馬達2040C，所述馬達2040C被安裝於所述感光元件2010C上，以便於通過所述馬達2040C調節所述攝像模組焦距。所述馬達2040C安裝於所述感光組件2010C的所述封裝部2011C的頂端。 The lens 2030C is mounted on the motor 2040C, and the motor 2040C is mounted on the photosensitive element 2010C, so that the focal length of the camera module can be adjusted by the motor 2040C. The motor 2040C is mounted on the top of the package portion 2011C of the photosensitive element 2010C.

特別地，所述馬達2040C通過所述馬達連接結構2013電連接於所述感光元件 In particular, the motor 2040C is electrically connected to the photosensitive element through the motor connection structure 2013

2010C，所述馬達2040C的所述馬達引腳2041C電連接於所述感光元件2010C的所述電路接點20132，從而通過所述引線20131電連接於所述線路板主體20122。所述馬達引腳2041C可以通過導電膠膜連接於所述引線20131的所述馬達連接端201311，也可以通過焊接的方式連接於所述馬達連接端201311。 In 2010C, the motor pins 2041C of the motor 2040C are electrically connected to the circuit contacts 20132 of the photosensitive element 2010C, so as to be electrically connected to the circuit board main body 20122 through the leads 20131 . The motor pins 2041C may be connected to the motor connection ends 201311 of the lead wires 20131 through a conductive adhesive film, or may be connected to the motor connection ends 201311 by welding.

特別地，當所述馬達引腳2041C通過導電膠貼附方式粘接於所述電路接點時，可以不需要焊接導線來連接所述馬2040C和所述感光部2012的所述線路板主體20122，從而減少馬達焊接的工藝過程。 In particular, when the motor pins 2041C are adhered to the circuit contacts by means of conductive adhesive, there is no need for soldering wires to connect the motor 2040C and the circuit board main body 20122 of the photosensitive portion 2012 , thereby reducing the process of motor welding.

值得一提的是，在本發明的這個實施例中，以所述引線20131連接所述馬達2040C的方式來說明本發明電連接馬達的方式，而在本發明的其他實施例所述，可以選擇不同方式的所述馬達連接結構2013來連接所述馬達2040C，例如，選取圖41A、41B、41C中示例的方式，也就是說，所述41A、41B、41C中對應的不同馬達連接結構都可以與本實施例中的所述感光元件2010C結合，從而提供不同馬達連接方式，本領域的技術人員應當理解的是，圖中所示方式，並不是本發明的限制。 It is worth mentioning that, in this embodiment of the present invention, the way of connecting the lead wire 20131 to the motor 2040C is used to illustrate the way of electrically connecting the motor of the present invention, while in other embodiments of the present invention, you can choose The motor connection structure 2013 can be connected to the motor 2040C in different ways. For example, the methods shown in FIGS. 41A , 41B and 41C are selected, that is, the different motor connection structures corresponding to the 41A, 41B and 41C In combination with the photosensitive element 2010C in this embodiment, different motor connection modes are provided. Those skilled in the art should understand that the modes shown in the figures are not limitations of the present invention.

本領域技術人員應當理解的是，上述攝像模組的結構和類型僅作為舉例，來說明所述攝像模組可以被實施的方式，並不是本發明的限制。 It should be understood by those skilled in the art that the structures and types of the above-mentioned camera modules are only used as examples to illustrate the manner in which the camera modules can be implemented, and are not limitations of the present invention.

參照圖55和圖56，根據本發明的第二十個優選實施例的感光元件和攝像模組將被闡釋。所述感光元件2010F用於組裝製造所述攝像模組，從而得到模塑型的所述攝像模組。所述感光組件2010F包括一封裝部2011F和一感光部2012F，所述封裝部2011F模塑地連接於所述感光部2012F。 55 and 56, a photosensitive element and a camera module according to a twentieth preferred embodiment of the present invention will be explained. The photosensitive element 2010F is used to assemble and manufacture the camera module, thereby obtaining the molded camera module. The photosensitive component 2010F includes a package portion 2011F and a photosensitive portion 2012F, and the package portion 2011F is connected to the photosensitive portion 2012F by molding.

所述感光部2012F包括一線路板主體20122F和一感光晶片20121F，所述感光晶片20121F被設置於所述線路板主體20122F上。根據本發明的這個實施例，所述感光晶片20121F模塑地連接於所述線路板主體20122F。 The photosensitive portion 2012F includes a circuit board body 20122F and a photosensitive wafer 20121F, and the photosensitive wafer 20121F is disposed on the circuit board body 20122F. According to this embodiment of the present invention, the photosensitive wafer 20121F is connected to the circuit board body 20122F by molding.

根據本發明這個實施例，所述感光部2012F包括一連接線路和至少一電路元件20123F。所述連接線路預設於所述線路板主體20122F，所述電路元件20123F電連接於所述連接線路以及所述感光晶片20121F，以供所述感光晶片20121F的感光工作過程。所述電路元件20123F凸出地設置於所述線路板主體20122F。所述電路元件20123F可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 2012F includes a connecting line and at least one circuit element 20123F. The connection circuit is preset on the circuit board body 20122F, and the circuit element 20123F is electrically connected to the connection circuit and the photosensitive chip 20121F for the photosensitive working process of the photosensitive chip 20121F. The circuit element 20123F is protrudingly disposed on the circuit board body 20122F. The circuit element 20123F can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.

值得一提的是，所述封裝部2011F將所述電路元件20123F包覆於其內部，因此使得所述電路元件20123F不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片20121F相通的環境中，從而當組裝為所述攝像模組時，所述電路元件20123F上不會沾染灰塵等污染物，也不會影響所述感光晶片20121F，不同于傳統攝像模組中電路元件20123F暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件20123F表面，避免污染所述感光晶片20121F而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation part 2011F encapsulates the circuit element 20123F inside, so that the circuit element 20123F will not be directly exposed to the space, more specifically, will not be exposed to the The photosensitive chip 20121F is in the same environment, so that when assembled into the camera module, the circuit element 20123F will not be contaminated with dust and other pollutants, nor will it affect the photosensitive chip 20121F, which is different from the traditional camera module. The existence of the circuit element 20123F exposed, such as a container, can prevent dust and debris from staying on the surface of the circuit element 20123F by molding and wrapping, and avoid contaminating the photosensitive chip 20121F and making the camera module appear dirty and black Points and other undesirable phenomena.

所述封裝部2011F形成一通孔201100F，以便於為所述感光晶片20121F提供感光路徑。 A through hole 201100F is formed in the package portion 2011F, so as to provide a photosensitive path for the photosensitive chip 20121F.

根據本發明的這個優選實施例，所述感光部2012F包括至少一連接線20124F，用於電連接所述感光晶片20121F和所述線路板主體20122F。進一步，所述連接線20124F可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線20124F呈弧形地連接所述感光晶片20121F和所述線路板主體20122F。 According to this preferred embodiment of the present invention, the photosensitive portion 2012F includes at least one connecting wire 20124F for electrically connecting the photosensitive wafer 20121F and the circuit board main body 20122F. Further, the connection wire 20124F may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connection line 20124F connects the photosensitive wafer 20121F and the circuit board main body 20122F in an arc shape.

值得一提的是，所述連接線20124F被模塑于所述封裝部2011F內部，從而可以借助所述封裝部2011F將所述連接線20124F進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線20124F不會受到任何的碰觸損傷，同時減少環境因素對各所述連接線20124F的影響，如溫度，使 得所述感光晶片20121F和所述線路板主體20122F之間的通訊連接穩定，這一點是完全不提供于現有技術的。 It is worth mentioning that the connecting wire 20124F is molded inside the packaging part 2011F, so that the connecting wire 20124F can be covered by the packaging part 2011F without being directly exposed to the outside, so as to assemble When the camera module is used, the connecting wires 20124F will not be damaged by any touch, and the influence of environmental factors on the connecting wires 20124F, such as temperature, can be reduced. The stable communication connection between the photosensitive chip 20121F and the circuit board main body 20122F is completely not provided in the prior art.

值得一提的是，所述封裝部2011F包覆所述電路元件20123F和所述連接線20124F，具有保護所述電路元件20123F和所述連接線20124F及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部2011F不限於包覆所述電路元件20123F或所述連接線20124F。也就是說，在本發明的其他實施例中，所述封裝部2011F可以直接模塑於沒有凸出的所述電路元件20123F的所述線路板主體20122F，也可以是模塑於所述電路元件20123F外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 2011F covers the circuit element 20123F and the connecting wire 20124F, and protects the circuit element 20123F and the connecting wire 20124F and the camera module for better performance. However, those skilled in the art should understand that the encapsulation part 2011F is not limited to encapsulating the circuit element 20123F or the connecting wire 20124F. That is to say, in other embodiments of the present invention, the encapsulation portion 2011F may be directly molded on the circuit board body 20122F of the circuit element 20123F without protruding, or may be molded on the circuit element 20123F outside, around and other different locations.

進一步，所述感光晶片20121F具有一感光區201211F和一非感光區201212F，所述非感光區201212F環繞於所述感光區201211F週邊。所述感光區201211F用於進行感光作用，所述連接線20124F連接於所述非感光區201212F。 Further, the photosensitive wafer 20121F has a photosensitive area 201211F and a non-photosensitive area 201212F, and the non-photosensitive area 201212F surrounds the periphery of the photosensitive area 201211F. The photosensitive area 201211F is used for photosensitive action, and the connection line 20124F is connected to the non-photosensitive area 201212F.

根據本發明的這個優選實施例，所述封裝部2011F延伸於所述感光晶片20121F的所述非感光區201212F，從而將所述感光晶片20121F通過模塑的方式疊層固定於所述線路板主體20122F。通過這樣的方式，如模塑於晶片的方式(Molding on chip)擴大了所述封裝部2011F向內的可模塑範圍，從而可以減小所述線路板主體20122F以及所述封裝部2011F的外側的結構性部分，進一步減小所述模塑感光部2012F件的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 2011F extends to the non-photosensitive area 201212F of the photosensitive wafer 20121F, so that the photosensitive wafer 20121F is laminated and fixed to the circuit board body by molding 20122F. In this way, the moldable range of the encapsulation portion 2011F inwards is expanded, such as molding on a chip, so that the circuit board body 20122F and the outside of the encapsulation portion 2011F can be reduced The structural part of , further reduces the length and width of the molded photosensitive part 2012F, and reduces the length and width of the camera module assembled by it.

在本發明的這個實施例中，所述封裝部2011F凸起地圍繞於所述感光晶片20121F的所述感光區201211F外側，特別地，所述封裝部2011F一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件2010F被 用於組裝所述攝像模組時，所述感光晶片20121F被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 2011F protrudes around the outside of the photosensitive region 201211F of the photosensitive wafer 20121F, and in particular, the encapsulation portion 2011F is integrally closed and connected, so that the encapsulation portion has good sealing properties, so that when the photosensitive element 2010F is When used for assembling the camera module, the photosensitive chip 20121F is sealed inside to form a closed inner space.

具體地，在製造所述感光元件2010F時，可以選取一傳統的線路板作為所述線路板主體20122F，在所述線路板主體20122F上設置一所述感光晶片20121F，將所述感光晶片20121F通過所述連接線20124F電連接，進而在初步組裝後的所述線路板主體20122F和感光晶片20121F部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部2011F，或用半導體封裝中常用的模壓工藝形成所述封裝部2011F。所述線路板主體20122F可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬板(不帶軟板)等。所述封裝部2011F形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部2011F可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用環氧樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 2010F, a conventional circuit board can be selected as the circuit board body 20122F, a photosensitive wafer 20121F is set on the circuit board body 20122F, and the photosensitive wafer 20121F is passed through the circuit board body 20122F. The connecting wires 20124F are electrically connected, and then molding is performed on the circuit board main body 20122F and the photosensitive wafer 20121F after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The circuit board after the surface mount process) is molded to form the package portion 2011F, or the package portion 2011F is formed by a molding process commonly used in semiconductor packaging. The circuit board body 20122F can be selected to be, for example but not limited to, a rigid-flex board, a ceramic substrate (without a flex board), a hard PCB board (without a flex board), and the like. The manner in which the encapsulation part 2011F is formed may be selected as, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the encapsulation part 2011F are, for example but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and ring Oxygen resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

進一步，所述封裝部2011F包括一包覆段20111F和一濾光片安裝段20112F，所述濾光片安裝段20112F模塑地一體連接于所述包覆段20111F，所述包覆段20111F模塑連接於所述線路板主體20122F，用於包覆所述電路元件20123F和所述連接線20124F。所述濾光片安裝段20112F用於安裝一濾光片2020F，也就是說，當所述感光元件2010F被用於組裝所述攝像模組時，所述攝像模組的濾光片2020F被安裝於所述濾光片安裝段20112F，使得所述濾光片2020F位於所述感光晶片20121F的感光路徑上，且不需要提供額外的濾光片2020F安裝支架。也就是說，所述封裝部2011F在此處具有傳統支架的功能，但 是基於模塑工藝的優勢，所述濾光片安裝段20112F頂部可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述濾光片2020F平整地被安裝，這一點也是優於傳統的攝像模組。 Further, the encapsulation portion 2011F includes a coating section 20111F and a filter mounting section 20112F, the filter mounting section 20112F is integrally connected to the coating section 20111F, and the coating section 20111F is molded integrally. It is plastically connected to the circuit board body 20122F for covering the circuit element 20123F and the connecting wire 20124F. The filter installation section 20112F is used to install a filter 2020F, that is, when the photosensitive element 2010F is used to assemble the camera module, the filter 2020F of the camera module is installed In the filter mounting section 20112F, the filter 2020F is located on the photosensitive path of the photosensitive wafer 20121F, and there is no need to provide an additional filter 2020F mounting bracket. That is, the encapsulation portion 2011F has the function of a conventional bracket here, but Based on the advantages of the molding process, the top of the filter installation section 20112F can be made to have good flatness by the molding process, so that the filter 2020F can be installed flatly, which is also an advantage. on traditional camera modules.

更進一步，所述濾光片安裝段20112F具有一安裝槽201121F，所述安裝槽連通於所述通孔201100F，為所述濾光片2020F提供充足的安裝空間，使得所述濾光片2020F不會凸出于濾光片安裝段20112F的頂表面。也就是說，所述封裝部2011F上端設置所述安裝槽201121F，以便於將所述濾光片2020F安裝于所述封裝部2011F且不會凸出于所述封裝部2011F的頂端。 Further, the filter installation section 20112F has an installation groove 201121F, and the installation groove communicates with the through hole 201100F to provide sufficient installation space for the optical filter 2020F, so that the optical filter 2020F does not will protrude from the top surface of the filter mounting section 20112F. That is to say, the mounting groove 201121F is provided on the upper end of the encapsulation portion 2011F, so that the filter 2020F can be mounted on the encapsulation portion 2011F without protruding from the top of the encapsulation portion 2011F.

值得一提的是，所述封裝部2011F的內壁可以根據所述連接線20124F的形狀而設置，比如設置為傾斜狀，從而在包覆所述連接線20124F的同時使得所述感光晶片20121F可以接收到等多光線。本領域的技術人員應當理解的是，所述封裝部2011F的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part 2011F can be set according to the shape of the connecting wire 20124F, for example, set to be inclined, so that the photosensitive chip 20121F can be covered while the connecting wire 20124F is covered. Receives multiple rays of light. Those skilled in the art should understand that the shape of the packaging part 2011F is not a limitation of the present invention.

不同於上述優選實施例的是，所述線路板主體20122F具有至少一加固孔201221F，所述封裝部2011F延伸進入所述加固孔201221F內，從而增強所述線路板主體20122F的結構強度。換句話說，兩種不同材料相互結合，從而形成複合材料結構，使得作為基體的所述線路板主體20122F的結構強度增強。 Different from the above preferred embodiment, the circuit board main body 20122F has at least one reinforcement hole 201221F, and the encapsulation portion 2011F extends into the reinforcement hole 201221F, thereby enhancing the structural strength of the circuit board main body 20122F. In other words, two different materials are combined with each other to form a composite material structure, so that the structural strength of the circuit board main body 20122F as a base is enhanced.

所述加固孔201221F的位置可以根據需要選擇，以及根據所述線路板的結構強度需求來設置，比如呈對稱的結構。借由所述加固孔201221F的設置使得所述線路板主體20122F的結構強度增強，從而可以減小所述線路板主體20122F的厚度，減小由其組裝的攝像模組的厚度，且提高所述感光元件2010F的散熱性能。 The positions of the reinforcement holes 201221F can be selected according to requirements and set according to the structural strength requirements of the circuit board, such as a symmetrical structure. The arrangement of the reinforcing holes 201221F enhances the structural strength of the circuit board body 20122F, thereby reducing the thickness of the circuit board body 20122F, reducing the thickness of the camera module assembled therefrom, and increasing the Thermal performance of the photosensitive element 2010F.

值得一提的是，在本發明的這個實施例中，所述加固孔201221F為凹槽狀，從而製造所述感光元件2010F時，所述封裝部2011F的模塑材料不會由所述加固孔201221F漏出。 It is worth mentioning that, in this embodiment of the present invention, the reinforcing holes 201221F are groove-shaped, so that when the photosensitive element 2010F is manufactured, the molding material of the encapsulation portion 2011F will not be affected by the reinforcing holes. 201221F leaked.

與上述優選實施例類似，所述感光元件2010F可以被組裝為定焦模組或動焦模組，本領域的技術人員應當理解的是，所述感光元件2010F的組裝應用方式不是本發明的限制。 Similar to the above preferred embodiment, the photosensitive element 2010F can be assembled into a fixed focus module or a moving focus module. Those skilled in the art should understand that the assembly and application of the photosensitive element 2010F is not a limitation of the present invention .

參照圖57和58，根據本發明的第二十一個優選實施例的感光元件和攝像模組將被闡釋。所述感光元件2010G用於組裝製造所述攝像模組，從而得到模塑型的所述攝像模組。所述感光組件2010G包括一封裝部2011G和感光部2012G，所述封裝部2011G模塑地連接於所述感光部2012G。 57 and 58, a photosensitive element and a camera module according to a twenty-first preferred embodiment of the present invention will be explained. The photosensitive element 2010G is used to assemble and manufacture the camera module, thereby obtaining the molded camera module. The photosensitive component 2010G includes a packaging portion 2011G and a photosensitive portion 2012G, and the packaging portion 2011G is connected to the photosensitive portion 2012G by molding.

所述感光部2012G包括一線路板主體20122G和一感光晶片20121G，所述感光晶片20121G被設置於所述線路板主體20122G上。根據本發明的這個實施例，所述感光晶片20121G模塑地連接於所述線路板主體20122G。 The photosensitive portion 2012G includes a circuit board body 20122G and a photosensitive wafer 20121G, and the photosensitive wafer 20121G is disposed on the circuit board body 20122G. According to this embodiment of the present invention, the photosensitive wafer 20121G is connected to the circuit board body 20122G by molding.

根據本發明這個實施例，所述感光部2012G包括一連接線路和至少一電路元件20123G。所述連接線路預設於所述線路板主體20122G，所述電路元件20123G電連接於所述連接線路以及所述感光晶片20121G，以供所述感光晶片20121G的感光工作過程。所述電路元件20123G凸出地設置於所述線路板主體20122G。所述電路元件20123G可以是，舉例地但不限於，電阻、電容、二極體、三極管、電位器、繼電器或驅動器等。 According to this embodiment of the present invention, the photosensitive portion 2012G includes a connecting line and at least one circuit element 20123G. The connection circuit is preset on the circuit board main body 20122G, and the circuit element 20123G is electrically connected to the connection circuit and the photosensitive chip 20121G for the photosensitive working process of the photosensitive chip 20121G. The circuit element 20123G is protrudingly disposed on the circuit board body 20122G. The circuit element 20123G can be, for example but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.

值得一提的是，所述封裝部2011G將所述電路元件20123G包覆於其內部，因此使得所述電路元件20123G不會直接暴露於空間內，更具體地說，不會暴露於與所述感光晶片20121G相通的環境中，從而當組裝為所述攝像模組時，所述電路元件20123G上不會沾染灰塵等污染物，也不會影響所述感光 晶片20121G，不同于傳統攝像模組中電路元件20123G暴露的存在方式，如阻容器件，從而通過模塑包覆的方式防止灰塵、雜物停留於所述電路元件20123G表面，避免污染所述感光晶片20121G而使得攝像模組出現汙黑點等不良現象。 It is worth mentioning that the encapsulation part 2011G encapsulates the circuit element 20123G inside, so that the circuit element 20123G is not directly exposed to the space, more specifically, is not exposed to the The photosensitive chip 20121G is in the same environment, so that when assembled into the camera module, the circuit element 20123G will not be contaminated with dust and other pollutants, nor will it affect the photosensitive The wafer 20121G is different from the existing way of exposure of the circuit element 20123G in the traditional camera module, such as a resistive device, so as to prevent dust and debris from staying on the surface of the circuit element 20123G by molding and wrapping to avoid contamination of the photosensitive The chip 20121G causes the camera module to have bad phenomena such as smudges and black spots.

所述封裝部2011G形成一通孔201100G，以便於為所述感光晶片20121G提供感光路徑。 A through hole 201100G is formed in the package portion 2011G, so as to provide a photosensitive path for the photosensitive chip 20121G.

根據本發明的這個優選實施例，所述感光部2012G包括至少一連接線20124G，用於電連接所述感光晶片20121G和所述線路板主體20122G。進一步，所述連接線20124G可以被實施為，舉例地但不限於，金線、銅線、鋁線、銀線等。特別地，所述連接線20124G呈弧形地連接所述感光晶片20121G和所述線路板主體20122G。 According to this preferred embodiment of the present invention, the photosensitive portion 2012G includes at least one connecting wire 20124G for electrically connecting the photosensitive wafer 20121G and the circuit board main body 20122G. Further, the connection wire 20124G may be implemented as, for example but not limited to, gold wire, copper wire, aluminum wire, silver wire, and the like. In particular, the connecting wire 20124G connects the photosensitive wafer 20121G and the circuit board main body 20122G in an arc shape.

值得一提的是，所述連接線20124G被模塑于所述封裝部2011G內部，從而可以借助所述封裝部2011G將所述連接線20124G進行包覆，而不會直接暴露於外部，從而組裝所述攝像模組時，使得所述連接線20124G不會受到任何的碰觸損傷，同時減少環境因素對個所述連接線20124G的影響，如溫度、濕度，使得所述感光晶片20121G和所述線路板主體20122G之間的通訊連接穩定，這一點是完全不提供于現有技術的。 It is worth mentioning that the connecting wire 20124G is molded inside the packaging part 2011G, so that the connecting wire 20124G can be covered by the packaging part 2011G without being directly exposed to the outside, so as to assemble When the camera module is used, the connecting line 20124G will not be damaged by any touch, and the influence of environmental factors on the connecting line 20124G, such as temperature and humidity, is reduced, so that the photosensitive chip 20121G and the The communication connection between the circuit board main bodies 20122G is stable, which is completely not provided in the prior art.

值得一提的是，所述封裝部2011G包覆所述電路元件20123G和所述連接線20124G，具有保護所述電路元件20123G和所述連接線20124G及其得到更優性能的攝像模組等方面的優勢，但是本領域的技術人員應當理解的是，所述封裝部2011G不限於包覆所述電路元件20123G或所述連接線20124G。也就是說，在本發明的其他實施例中，所述封裝部2011G可以直接模塑於沒有凸出的所述電路元件20123G的所述線路板主體20122G，也可以是模塑於所述電路元件20123G外側、周圍等不同位置。 It is worth mentioning that the encapsulation part 2011G covers the circuit element 20123G and the connecting wire 20124G, and protects the circuit element 20123G and the connecting wire 20124G and a camera module with better performance. However, those skilled in the art should understand that the encapsulation part 2011G is not limited to encapsulating the circuit element 20123G or the connecting wire 20124G. That is to say, in other embodiments of the present invention, the packaging portion 2011G may be directly molded on the circuit board body 20122G of the circuit element 20123G without protruding, or may be molded on the circuit element 20123G outside and around different locations.

進一步，所述感光晶片20121G具有一感光區201211G和一非感光區201212G，所述非感光區201212G環繞於所述感光區201211G週邊。所述感光區201211G用於進行感光作用，所述連接線20124G連接於所述非感光區201212G。 Further, the photosensitive wafer 20121G has a photosensitive area 201211G and a non-photosensitive area 201212G, and the non-photosensitive area 201212G surrounds the periphery of the photosensitive area 201211G. The photosensitive area 201211G is used for photosensitive action, and the connection line 20124G is connected to the non-photosensitive area 201212G.

根據本發明的這個優選實施例，所述封裝部2011G延伸於所述感光晶片20121G的所述非感光區201212G，從而將所述感光晶片20121G通過模塑的方式疊層固定於所述線路板主體20122G。通過這樣的方式，如模塑於晶片的方式(Molding on chip)擴大了所述封裝部2011G向內的可模塑範圍，從而可以減小所述線路板主體20122G以及所述封裝部2011G的外側的結構性部分，進一步減小所述模塑感光部2012G的長寬尺寸，減小由其組裝的所述攝像模組的長寬尺寸。 According to this preferred embodiment of the present invention, the encapsulation portion 2011G extends to the non-photosensitive area 201212G of the photosensitive wafer 20121G, so that the photosensitive wafer 20121G is laminated and fixed to the circuit board body by molding 20122G. In this way, the moldable range of the encapsulation part 2011G inwards is expanded, such as molding on a chip, so that the circuit board body 20122G and the outside of the encapsulation part 2011G can be reduced It further reduces the length and width of the molded photosensitive portion 2012G, and reduces the length and width of the camera module assembled therefrom.

在本發明的這個實施例中，所述封裝部2011G凸起地圍繞於所述感光晶片20121G的所述感光區201211G外側，特別地，所述封裝部2011G一體地閉合連接，使得所述封裝部具有良好的密封性，從而當所述感光元件2010G被用於組裝所述攝像模組時，所述感光晶片20121G被密封于內部，形成一封閉內空間。 In this embodiment of the present invention, the encapsulation portion 2011G protrudes around the outside of the photosensitive region 201211G of the photosensitive wafer 20121G, and in particular, the encapsulation portion 2011G is integrally closed and connected, so that the encapsulation portion It has good sealing performance, so when the photosensitive element 2010G is used to assemble the camera module, the photosensitive wafer 20121G is sealed inside to form a closed inner space.

具體地，在製造所述感光元件2010G時，可以選取一傳統的線路板作為所述線路板主體20122G，在所述線路板主體20122G上設置一所述感光晶片20121G，將所述感光晶片20121G通過所述連接線20124G電連接，進而在初步組裝後的所述線路板主體20122G和感光晶片20121G部件上進行模塑，如用注塑機，通過嵌入成型(molding)工藝將進行SMT工藝(Surface Mount Technology表面貼裝工藝)後的線路板進行模塑形成所述封裝部2011G，或用半導體封裝中常用的模壓工藝形成所述封裝部2011G。所述線路板主體20122G可以選擇為，舉例地但不限於，軟硬結合板、陶瓷基板(不帶軟板)、PCB硬 板(不帶軟板)等。所述封裝部2011G形成的方式可以選擇為，舉例地但不限於，注塑工藝、模壓工藝等。所述封裝部2011G可以選擇的材料為，舉例地但不限於，注塑工藝可以選擇尼龍、LCP(Liquid Crystal Polymer，液晶高分子聚合物)、PP(Polypropylene，聚丙烯)等，模壓工藝可以採用環氧樹脂。本領域技術人員應當理解的是，前述可以選擇的製造方式以及可以選擇的材料，僅作為舉例說明本發明的可以實施的方式，並不是本發明的限制。 Specifically, when manufacturing the photosensitive element 2010G, a conventional circuit board can be selected as the circuit board body 20122G, a photosensitive wafer 20121G is set on the circuit board body 20122G, and the photosensitive wafer 20121G is passed through the circuit board body 20122G. The connecting wires 20124G are electrically connected, and then molding is performed on the circuit board main body 20122G and the photosensitive wafer 20121G after preliminary assembly. For example, using an injection molding machine, an SMT process (Surface Mount Technology The circuit board after the surface mount process) is molded to form the package portion 2011G, or the package portion 2011G is formed by a molding process commonly used in semiconductor packaging. The circuit board main body 20122G can be selected as, for example but not limited to, a flexible-rigid board, a ceramic substrate (without a flexible board), a PCB-hard board. board (without soft board), etc. The manner in which the encapsulation portion 2011G is formed may be selected from, for example, but not limited to, an injection molding process, a molding process, and the like. The materials that can be selected for the encapsulation part 2011G are, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer), PP (Polypropylene, polypropylene), etc. can be selected for the injection molding process, and ring Oxygen resin. It should be understood by those skilled in the art that the foregoing optional manufacturing methods and optional materials are only used as examples to illustrate the possible implementation manners of the present invention, and are not intended to limit the present invention.

進一步，所述封裝部2011G包括一包覆段20111G和一濾光片安裝段20112G，所述濾光片安裝段20112G模塑地一體連接于所述包覆段20111G，所述包覆段20111G模塑連接於所述線路板主體20122G，用於包覆所述電路元件20123G和所述連接線20124G。所述濾光片安裝段20112G用於安裝一濾光片2020G，也就是說，當所述感光元件2010G被用於組裝所述攝像模組時，所述攝像模組的濾光片2020G被安裝於所述濾光片安裝段20112G，使得所述濾光片2020G位於所述感光晶片20121G的感光路徑上，且不需要提供額外的濾光片2020G安裝支架。也就是說，所述封裝部2011G在此處具有傳統支架的功能，但是基於模塑工藝的優勢，所述濾光片安裝段20112G頂部可以借助模具化的工藝方式，使其具有良好的平整性，從而使得所述濾光片2020G平整地被安裝，這一點也是優於傳統的攝像模組。 Further, the encapsulation portion 2011G includes a coating section 20111G and a filter mounting section 20112G, the filter mounting section 20112G is integrally connected to the coating section 20111G, and the coating section 20111G is molded integrally. It is plastically connected to the circuit board main body 20122G for covering the circuit element 20123G and the connecting wire 20124G. The filter installation section 20112G is used to install a filter 2020G, that is, when the photosensitive element 2010G is used to assemble the camera module, the filter 2020G of the camera module is installed In the filter installation section 20112G, the filter 2020G is located on the photosensitive path of the photosensitive wafer 20121G, and there is no need to provide an additional filter 2020G mounting bracket. That is to say, the encapsulation part 2011G has the function of a traditional bracket here, but based on the advantages of the molding process, the top of the filter mounting section 20112G can be made to have good flatness by means of the molding process. , so that the optical filter 2020G is installed flatly, which is also superior to the traditional camera module.

更進一步，所述濾光片安裝段20112G具有一安裝槽201121G，所述安裝槽201121G連通於所述通孔201100G，為所述濾光片2020G提供充足的安裝空間，使得所述濾光片2020G不會凸出于濾光片安裝段20112G的頂表面。也就是說，所述封裝部2011F上端設置所述安裝槽201121F，以便於將所述濾光片2020F安裝于所述封裝部2011F且不會凸出于所述封裝部2011F的頂端。 Furthermore, the filter installation section 20112G has an installation groove 201121G, and the installation groove 201121G communicates with the through hole 201100G to provide sufficient installation space for the optical filter 2020G, so that the optical filter 2020G Does not protrude from the top surface of the filter mounting section 20112G. That is to say, the mounting groove 201121F is provided on the upper end of the encapsulation portion 2011F, so that the filter 2020F can be mounted on the encapsulation portion 2011F without protruding from the top of the encapsulation portion 2011F.

值得一提的是，所述封裝部2011G的內壁可以根據所述連接線20124的形狀而設置，比如設置為傾斜狀，從而在包覆所述連接線20124G的同 時使得所述感光晶片20121G可以接收到更多光線。本領域的技術人員應當理解的是，所述封裝部2011G的形狀並不是本發明的限制。 It is worth mentioning that the inner wall of the encapsulation part 2011G can be set according to the shape of the connecting wire 20124, for example, set in an inclined shape, so that at the same time as wrapping the connecting wire 20124G At this time, the photosensitive wafer 20121G can receive more light. Those skilled in the art should understand that the shape of the packaging part 2011G is not a limitation of the present invention.

不同於上述優選實施例的是，所述線路板主體20122G具有至少一加固孔201221G，所述封裝部2011G延伸進入所述加固孔201221G內，從而增強所述線路板主體20122G的結構強度。換句話說，兩種不同材料相互結合，從而形成複合材料結構，使得作為基體的所述線路板主體20122G的結構強度增強。 Different from the above preferred embodiment, the circuit board main body 20122G has at least one reinforcement hole 201221G, and the encapsulation portion 2011G extends into the reinforcement hole 201221G, thereby enhancing the structural strength of the circuit board main body 20122G. In other words, two different materials are combined with each other to form a composite material structure, so that the structural strength of the circuit board main body 20122G as a base is enhanced.

所述加固孔201221G的位置可以根據需要選擇，以及根據所述線路板的結構強度需求來設置，比如呈對稱的結構。借由所述加固孔201221G的設置使得所述線路板主體20122G的結構強度增強，從而可以減小所述線路板主體20122G的厚度，減小由其組裝的攝像模組的厚度，且提高所述感光元件2010G的散熱性能。 The positions of the reinforcement holes 201221G can be selected according to requirements and set according to the structural strength requirements of the circuit board, such as a symmetrical structure. The arrangement of the reinforcing holes 201221G enhances the structural strength of the circuit board main body 20122G, so that the thickness of the circuit board main body 20122G can be reduced, the thickness of the camera module assembled therefrom can be reduced, and the Thermal performance of the photosensitive element 2010G.

值得一提的是，根據本發明的這個優選實施例，所述加固孔201221G為穿孔，也就是說，穿過所述線路板主體20122G，使得所述線路板主體20122G的兩側連通，從而製造所述感光元件2010G時，所述封裝部2011G的模塑材料充分的與所述線路板主體20122G結合，形成更加牢固的複合材料結構，且相對所述凹槽的結構，所述穿孔更容易加工製造。 It is worth mentioning that, according to this preferred embodiment of the present invention, the reinforcing hole 201221G is a perforation, that is to say, it passes through the circuit board main body 20122G, so that the two sides of the circuit board main body 20122G are connected, thereby manufacturing When the photosensitive element 2010G is used, the molding material of the encapsulation part 2011G is sufficiently combined with the circuit board body 20122G to form a stronger composite material structure, and the perforation is easier to process than the groove structure. manufacture.

參照圖57和58，所述攝像模組20100G包括一所述感光組件2010G、一所述濾光片2020G、一馬達2040G和一鏡頭2030G。 57 and 58, the camera module 20100G includes a photosensitive component 2010G, a filter 2020G, a motor 2040G and a lens 2030G.

所述濾光片2020G被安裝於所述感光組件2010G，所述鏡頭2030G被安裝於所述馬達2040G，所述馬達2040G被安裝於所述感光組件2010G上。 The filter 2020G is mounted on the photosensitive element 2010G, the lens 2030G is mounted on the motor 2040G, and the motor 2040G is mounted on the photosensitive element 2010G.

更進一步，所述濾光片2020G被安裝於所述感光組件2010G的所述封裝部2011G的所述安裝槽。所述馬達2040G安裝於所述感光組件2010G的所 述封裝部2011G的頂端。特別地，所述濾光片2020G和所述馬達2040G在所述封裝部2011G的具體安裝位置可以根據具體需要協調配置。 Furthermore, the optical filter 2020G is installed in the installation groove of the packaging portion 2011G of the photosensitive component 2010G. The motor 2040G is installed on all parts of the photosensitive element 2010G. The top end of the encapsulation portion 2011G. In particular, the specific installation positions of the optical filter 2020G and the motor 2040G on the packaging part 2011G can be coordinated and configured according to specific needs.

特別地，所述馬達2040G通過所述馬達連接結構2013電連接於所述感光元件2010G，所述馬達4G0的所述馬達引腳2041G電連接於所述感光元件2010的所述電路接點20132，從而通過所述引線20131電連接於所述線路板主體20122。所述馬達引腳2041G可以通過導電膠膜連接於所述引線20131的所述馬達連接端201311，也可以通過焊接的方式連接於所述馬達連接端201311。 Particularly, the motor 2040G is electrically connected to the photosensitive element 2010G through the motor connection structure 2013 , and the motor pin 2041G of the motor 4G0 is electrically connected to the circuit contact 20132 of the photosensitive element 2010 , Therefore, it is electrically connected to the circuit board main body 20122 through the leads 20131 . The motor pins 2041G may be connected to the motor connection ends 201311 of the lead wires 20131 through a conductive adhesive film, or may be connected to the motor connection ends 201311 by welding.

特別地，當所述馬達引腳2041G通過導電膠貼附方式粘接於所述電路接點時，可以不需要焊接導線來連接所述馬2040G和所述感光部2012的所述線路板主體20122，從而減少馬達焊接的工藝過程。 In particular, when the motor pins 2041G are attached to the circuit contacts by means of conductive adhesive, there is no need to solder wires to connect the motor 2040G and the circuit board main body 20122 of the photosensitive portion 2012 , thereby reducing the process of motor welding.

值得一提的是，在本發明的這個實施例中，以所述引線20131連接所述馬達2040G的方式來說明本發明電連接馬達的方式，而在本發明的其他實施例所述，可以選擇不同方式的所述馬達連接結構2013來連接所述馬達2040G，例如，選取圖41A、41B、41C中示例的方式，也就是說，所述41A、41B、41C中對應的不同馬達連接結構都可以與本實施例中的所述感光元件2010G結合，從而提供不同馬達連接方式，本領域的技術人員應當理解的是，圖中所示方式，並不是本發明的限制。 It is worth mentioning that, in this embodiment of the present invention, the way of connecting the lead wire 20131 to the motor 2040G is used to illustrate the way of electrically connecting the motor of the present invention, while in other embodiments of the present invention, you can choose The motor 2040G can be connected to the motor 2040G by using the motor connection structure 2013 in different ways. For example, the methods illustrated in FIGS. 41A , 41B and 41C are selected, that is, the different motor connection structures corresponding to the 41A, 41B and 41C can be used. In combination with the photosensitive element 2010G in this embodiment, different motor connection modes are provided. Those skilled in the art should understand that the modes shown in the figures are not limitations of the present invention.

與上述優選實施例類似，所述感光元件2010G可以被組裝為定焦模組或動焦模組，本領域的技術人員應當理解的是，所述感光元件2010G的組裝應用方式不是本發明的限制。參照圖59是根據本發明的第二十二個優選實施例的感光元件和攝像模組。不同於上述優選實施例的是，所述感光組件2010包括一遮罩層20126I，所述遮罩層20126I包裹所述線路板主體20122和所述封裝部 2011，從而在增強所述線路板主體20122的結構強度的同時，增強所述感光元件2010的抗電磁干擾能力。 Similar to the above preferred embodiment, the photosensitive element 2010G can be assembled into a fixed focus module or a moving focus module. Those skilled in the art should understand that the assembly and application of the photosensitive element 2010G is not a limitation of the present invention . 59 is a photosensitive element and a camera module according to a twenty-second preferred embodiment of the present invention. Different from the above preferred embodiment, the photosensitive component 2010 includes a mask layer 20126I, and the mask layer 20126I wraps the circuit board main body 20122 and the packaging portion 2011, thereby enhancing the anti-electromagnetic interference capability of the photosensitive element 2010 while enhancing the structural strength of the circuit board main body 20122.

更進一步，所述遮罩層20126I為一金屬層，可以為板狀結構或網狀結構。 Furthermore, the mask layer 20126I is a metal layer, which can be a plate-like structure or a mesh-like structure.

由於本發明的所述模組是基於封裝工藝一體封裝形成，在本發明的各實施例中，以封裝工藝中的模塑工藝為例說明。因此，為了更清楚地揭露本發明的內容，首先對模塑工藝作簡要的說明。模塑工藝一般有兩種實現形式，一種是MOB(Molding On Board)，也就是說將封裝部僅僅形成在模組的線路板上；另一種是MOC(Molding On Chip)，也就是說將封裝部形成在模組的線路板和感光晶片上。本發明將在後續揭露中分別從不同的模塑實現形式中列舉實施例。 Since the module of the present invention is integrally packaged and formed based on the packaging process, in each embodiment of the present invention, the molding process in the packaging process is used as an example for description. Therefore, in order to disclose the content of the present invention more clearly, a brief description of the molding process is first made. The molding process generally has two implementation forms, one is MOB (Molding On Board), which means that the packaging part is only formed on the circuit board of the module; the other is MOC (Molding On Chip), which means that the packaging is formed on the board. The part is formed on the circuit board and the photosensitive wafer of the module. The present invention will enumerate embodiments from different molding implementation forms in the subsequent disclosure.

此外，模塑工藝一般從設備的不同上來說有注塑和模壓。注塑還可分注塑成型模壓法和壓鑄法。注射成型機(簡稱注射機或注塑機)是將熱塑性材料或熱固性材料利用塑膠成型模具製成各種形狀的塑膠製品的主要成型設備，注射成型是通過注塑機和模具來實現的。模壓是壓縮模塑的簡稱，又稱壓塑。模壓材料例如塑膠或橡膠膠料在閉合模腔內借助加熱、加壓而成型為製品。在本發明中採用模塑工藝中的模壓來說明，但是本領域的技術人員可以理解的是，本發明並不僅僅局限於模壓工藝，還有其他封裝工藝，本發明並不受此限制。 In addition, the molding process generally includes injection molding and molding in terms of equipment. Injection molding can also be divided into injection molding and die casting. Injection molding machine (referred to as injection machine or injection molding machine) is the main molding equipment for making thermoplastic materials or thermosetting materials into various shapes of plastic products using plastic molding molds. Injection molding is achieved by injection molding machines and molds. Molding is the abbreviation of compression molding, also known as compression molding. Molding materials such as plastic or rubber compounds are formed into articles by heating and pressing in a closed mold cavity. In the present invention, the molding in the molding process is used to illustrate, but those skilled in the art can understand that the present invention is not limited to the molding process, and there are other packaging processes, and the present invention is not limited thereto.

如圖60所示為本發明的一基於一體封裝工藝的攝像模組的一優選實施例，採用的為MOB工藝。所述基於一體封裝工藝的攝像模組包括一封裝感光組件3010、一濾光片3020、一鏡頭3030和一馬達3040。本領域的技術人員可以理解的是，所述馬達3040在其他實施例例如涉及定焦(FF)模組中可以沒有，本發明並不受此限制。也就是說，本發明的這個優選實施例中是以自動對 焦(AF)模組為例。在所述封裝感光組件3010包括一封裝部3011和一感光組件3012。所述感光元件3012進一步包括一感光晶片30121和一線路板30122、其配置有一組電子元器件30123(例如電阻、電容、驅動等，後面簡稱為IC)和一組引線30124。所述引線30124連接並將所述感光晶片30121和所述線路板30122導通，當然所述感光晶片30121和所述線路板30122也可以有其他導通方式。在本發明的這個優選實施例中，所述引線30124可以被實施為金線。所述封裝部3011作為承載所述濾光片3020的支架，所述封裝部3011可以具有電氣性能，如可以雕刻線路通電連通所述馬達3040和所述感光組件3012，能夠取代傳統的馬達焊線，減少傳統的工藝制程。當然，所述馬達3040和所述線路板30122也可以通過傳統的馬焊腳焊接而導通。在封裝過程中，所述封裝部3011將所述線路板30122進行封裝，在本發明的這個優選實施例中，所述封裝部3011封裝所述線路板30122上除與所述感光晶片30121以及所述引線30124接觸以外的區域。所述封裝部3011不僅封裝所述線路板30122的頂表面301221，所述封裝部3011還封裝包覆所述線路板30122的至少一側面301222。可以理解的是，在封裝過程中，所述封裝部3011也可以將所述電子元器件30123一體封裝。 FIG. 60 shows a preferred embodiment of a camera module based on an integrated packaging process of the present invention, which adopts the MOB process. The camera module based on the integrated packaging process includes a packaged photosensitive component 3010 , a filter 3020 , a lens 3030 and a motor 3040 . Those skilled in the art can understand that the motor 3040 may not be included in other embodiments such as fixed focus (FF) modules, and the present invention is not limited thereto. That is, in this preferred embodiment of the present invention, the automatic Take the focus (AF) module as an example. The packaged photosensitive component 3010 includes a package portion 3011 and a photosensitive component 3012 . The photosensitive element 3012 further includes a photosensitive wafer 30121 and a circuit board 30122, which are configured with a set of electronic components 30123 (such as resistors, capacitors, drivers, etc., hereinafter referred to as IC) and a set of leads 30124. The lead 30124 is connected and conducts the photosensitive chip 30121 and the circuit board 30122. Of course, the photosensitive chip 30121 and the circuit board 30122 may also have other conduction methods. In this preferred embodiment of the present invention, the leads 30124 may be implemented as gold wires. The encapsulation part 3011 is used as a bracket for carrying the optical filter 3020, and the encapsulation part 3011 can have electrical properties, such as engraving lines can be electrically connected to the motor 3040 and the photosensitive component 3012, which can replace the traditional motor welding wire , reduce the traditional process. Of course, the motor 3040 and the circuit board 30122 can also be connected through traditional horse soldering. During the encapsulation process, the encapsulation part 3011 encapsulates the circuit board 30122. In this preferred embodiment of the present invention, the encapsulation part 3011 encapsulates the circuit board 30122 except for the photosensitive chip 30121 and all other parts of the circuit board 30122. Areas other than the lead 30124 contact. The encapsulation part 3011 not only encapsulates the top surface 301221 of the circuit board 30122 , but also encapsulates at least one side surface 301222 of the circuit board 30122 . It can be understood that, in the packaging process, the packaging part 3011 can also package the electronic components 30123 in one piece.

如圖62A至圖62E所示為對比技術中的模塑形成模組。圖62A中封裝部3011P左側的部分和線路板30122P齊平，此種線路板30122P的側面與封裝部3011P側面齊平的設計通常也為對比技術所採納的。因此，為達到以上設計要求，如圖62B所示，在模組組裝前需要達到圖中的結構，在模塑時所述線路板30122P做如圖62B的處理，也就是將兩片以上的所述線路板30122P連接在一起，進行模塑，最後在圖62B中間部分用機器切割，但是就需要新增切割設備。如果不用圖62B中的方式，考慮到所述線路板30122P與模具對位有一定的偏差，所述線路板30122P的邊緣不可能與所述封裝部3011P齊平設計，所以通常只能設計成如圖62C所示，圖中所述線路板30122P需要凸出一段用於模具壓 合，所述線路板30122P凸出長度在數值上通常為0.1mm~10mm。如圖62E所示，如果不採用切割，此段所述線路板30122P凸出部分會影響模組最終尺寸，使模組尺寸增加0.1mm~10mm，影響了產品的品質。 Figures 62A to 62E illustrate a molding die set in a comparative art. In FIG. 62A , the left part of the package part 3011P is flush with the circuit board 30122P, and the design that the side of the circuit board 30122P is flush with the side of the package part 3011P is also generally adopted by the comparison technology. Therefore, in order to meet the above design requirements, as shown in Figure 62B, the structure in the figure needs to be achieved before the module is assembled. During molding, the circuit board 30122P is processed as shown in Figure 62B, that is, two or more pieces of all The above circuit boards 30122P are connected together, molded, and finally cut with a machine in the middle part of FIG. 62B, but additional cutting equipment is required. If the method in FIG. 62B is not used, considering that the alignment of the circuit board 30122P and the mold has a certain deviation, the edge of the circuit board 30122P cannot be designed to be flush with the packaging portion 3011P, so it is usually only designed as follows As shown in Figure 62C, the circuit board 30122P in the figure needs to protrude a section for mold pressing In conclusion, the protruding length of the circuit board 30122P is usually 0.1mm~10mm in value. As shown in Figure 62E, if cutting is not used, the protruding part of the circuit board 30122P described in this section will affect the final size of the module, increasing the size of the module by 0.1mm~10mm, which affects the quality of the product.

因此，和對比技術相比，本發明的所述基於一體封裝工藝的攝像模組，對所述線路板30122進行內縮設計，使所述封裝部3011的側面包覆所述線路板30122的所述側面301222，從而所述封裝部3011的側面與所述線路板30122仍預留一定錯位空間，在模塑完之後側面沒有所述線路板30122凸出的情況，減少切割工序，提高了產品的品質。 Therefore, compared with the comparative technology, the camera module based on the integrated packaging process of the present invention is designed to shrink the circuit board 30122, so that the side of the packaging portion 3011 covers all the circuit board 30122. the side surface 301222, so that the side surface of the encapsulation part 3011 and the circuit board 30122 still reserve a certain dislocation space, after the molding is completed, the side surface does not have the protruding situation of the circuit board 30122, which reduces the cutting process and improves the product quality. quality.

值得一提的是，所述封裝部3011可以對所述線路板30122的兩個側邊都進行封裝包覆。本發明的這個優選實施中，由於右側還有其他元件如柔性線路板連接，因此，僅封裝了所述線路板30122的左側邊，即所述側面301222。但是，本領域的技術人員可以理解的是，所述封裝部3011不僅可以封裝所述線路板30122的所述側面301222，在其他實施例中，還可以同時側面封裝包覆所述線路板30122的兩個側面的局部或全部區域，本發明並不受此限制。 It is worth mentioning that the encapsulation part 3011 can encapsulate and cover both sides of the circuit board 30122 . In this preferred implementation of the present invention, since there are other components connected on the right side, such as a flexible circuit board, only the left side of the circuit board 30122, that is, the side surface 301222, is encapsulated. However, those skilled in the art can understand that the encapsulation part 3011 can not only encapsulate the side surface 301222 of the circuit board 30122, but in other embodiments, can also encapsulate the side surface of the circuit board 30122 at the same time. Part or all of the areas of the two sides, the present invention is not limited thereto.

如圖61所示為本發明的所述基於一體封裝工藝的攝像模組的另一種實施方式，為了保證模塑工藝之後的模組能夠便於裝機和定位，並提高平整度，同樣是採用MOB形式，所述基於一體封裝工藝的攝像模組包括一封裝感光組件3010’、一濾光片3020’、一鏡頭3030’和一馬達3040’。同樣地，由於以AF模組為例，因此揭露了所述馬達3040’，但是在其他FF模組中，可以不需要所述馬達3040’，本發明並不受此限制。 Figure 61 shows another embodiment of the camera module based on the integrated packaging process of the present invention. In order to ensure that the module after the molding process can be easily installed and positioned, and to improve the flatness, the MOB form is also used. , the camera module based on the integrated packaging process includes a packaged photosensitive component 3010', a filter 3020', a lens 3030' and a motor 3040'. Similarly, since the AF module is taken as an example, the motor 3040' is disclosed, but in other FF modules, the motor 3040' may not be required, and the present invention is not limited thereto.

具體地，所述封裝感光組件3010’包括一封裝部3011’和一感光組件3012’。所述感光元件3012’進一步包括一感光晶片30121’、和一線路板30122’，其配置有一組電子元器件30123’和一組引線30124’。所述封 裝部3011’作為承載所述濾光片3020’的支架，所述模組部3011’雕刻線路通電連通所述馬達3040’和所述感光組件3012’。與本發明的上述優選實施例相比，在模塑過程中，除了所述封裝部3011’將所述線路板30122’和所述電子元器件30123’進行封裝，且封裝包覆所述線路板30122’的所述頂面301221’和至少一側面301222’以外，所述封裝部3011’對所述線路板30122’的一底部301223’也進行模塑封裝。從而保證了模塑完成後，所述基於一體封裝工藝的攝像模組從整體上的側面和底部的平整性，也便於安裝定位在其他工裝上。 Specifically, the packaged photosensitive component 3010' includes a package portion 3011' and a photosensitive component 3012'. The photosensitive element 3012' further includes a photosensitive wafer 30121' and a circuit board 30122', which is configured with a set of electronic components 30123' and a set of leads 30124'. the seal The mounting part 3011' serves as a bracket for carrying the optical filter 3020', and the engraving circuit of the module part 3011' is electrically connected to the motor 3040' and the photosensitive component 3012'. Compared with the above-mentioned preferred embodiment of the present invention, in the molding process, the circuit board 30122 ′ and the electronic component 30123 ′ are encapsulated in addition to the encapsulation part 3011 ′, and the encapsulation wraps the circuit board In addition to the top surface 301221' and at least one side surface 301222' of the 30122', the encapsulation part 3011' also molds and encapsulates a bottom 301223' of the circuit board 30122'. Therefore, after the molding is completed, the overall flatness of the side and bottom of the camera module based on the integrated packaging process is ensured, and it is also convenient for installation and positioning on other tooling.

值得一提的是，所述封裝部3011’可以封裝包覆所述線路板30122’的整個所述底部301223’，也可以在其他實施例中，根據不同的需要，封裝包覆所述線路板30122’的所述底部301223’的一部分，本發明並不受此限制。 It is worth mentioning that the encapsulation portion 3011 ′ can encapsulate and cover the entire bottom portion 301223 ′ of the circuit board 30122 ′, or in other embodiments, according to different needs, encapsulate and cover the circuit board A part of the bottom 301223' of 30122', the present invention is not limited thereto.

值得一提的是，本發明的這個優選實施例中，由於所述攝像模組的圖中示意的右側還可以連接其他元件或者進行其他加工工藝，因此所述線路板30122’的右側面並沒有進行封裝，但是在其他實施例中，所述封裝部3011’能夠同時封裝包覆所述線路板30122’的兩個或者多個側面，且同時封裝包覆所述線路板30122’的所述底部301223’的全部或者部分區域，本發明並不受此限制。 It is worth mentioning that, in this preferred embodiment of the present invention, since the right side of the camera module shown in the figure can also be connected to other components or perform other processing processes, the right side of the circuit board 30122' does not have However, in other embodiments, the encapsulation part 3011 ′ can encapsulate and cover two or more sides of the circuit board 30122 ′ at the same time, and simultaneously encapsulate and cover the bottom of the circuit board 30122 ′ 301223', the present invention is not limited thereto.

圖60和圖61所示的兩個實施例中採用了MOB的形式來揭露，以下變形實施例換為採用MOC的形式，並結合各種不同的模組結構來揭露對線路板的側面或底面進行模組部封裝。 The two embodiments shown in FIG. 60 and FIG. 61 use the form of MOB to disclose, the following modified embodiments are replaced by the form of MOC, and combine various module structures to disclose the side or bottom surface of the circuit board. Module package.

如圖63A所示為本發明的所述基於一體封裝工藝的攝像模組的另一實施例。所述基於一體封裝工藝的攝像模組包括一封裝部3011A、一感光組件3012A、一濾光片3020A和一鏡頭3030。所述感光元件3012A進一步包括一感光晶片30121A和一線路板30122A，其配置有一組電子元器件30123A和一組引 線30124A。所述封裝部3011A作為承載所述濾光片3020A的支架，直接在所述線路板30122A上除了晶片感光區以外的其它區域成型。也就是說，本發明的這個實施例採用MOC形式。值得一提的是，所述感光晶片30121A包括一感光區域301211A和所述感光區域301211A以外的一非感光區域301212A，在封裝時，所述封裝部3011A沒有封裝所述感光區域301211A。而是封裝所述感光晶片30121A的所述非感光區域301212A。所述非感光區域301212A還設置有引腳和所述引線30124A連接，用於導通所述感光晶片30121A。 FIG. 63A shows another embodiment of the camera module based on the integrated packaging process of the present invention. The camera module based on the integrated packaging process includes a packaging part 3011A, a photosensitive component 3012A, a filter 3020A and a lens 3030 . The photosensitive element 3012A further includes a photosensitive wafer 30121A and a circuit board 30122A, which are configured with a set of electronic components 30123A and a set of lead wires. Line 30124A. The encapsulation part 3011A is used as a bracket for carrying the optical filter 3020A, and is directly formed on the circuit board 30122A except for the photosensitive area of the chip. That is, this embodiment of the invention takes the form of an MOC. It is worth mentioning that the photosensitive chip 30121A includes a photosensitive area 301211A and a non-photosensitive area 301212A other than the photosensitive area 301211A. During packaging, the packaging portion 3011A does not encapsulate the photosensitive area 301211A. Instead, the non-photosensitive area 301212A of the photosensitive wafer 30121A is encapsulated. The non-photosensitive area 301212A is also provided with pins connected to the leads 30124A for conducting the photosensitive wafer 30121A.

類似地，在圖63A所示的所述基於一體封裝工藝的攝像模組中，所述線路板30122A進行了內縮設計，使所述封裝部3011A的側面包覆所述線路板30122A的所述側面301222A，從而所述封裝部3011A的側面與所述線路板30122A仍預留一定錯位空間，在模塑完之後側面沒有所述線路板30122A凸出的情況。此外，在基於本實施例的其他變形方式中，所述封裝部3011A可以對所述線路板30122A的多個側面都進行封裝包覆。 Similarly, in the camera module based on the integrated packaging process shown in FIG. 63A , the circuit board 30122A is designed to be retracted, so that the side of the packaging portion 3011A covers the side of the circuit board 30122A. side surface 301222A, so that the side surface of the encapsulation part 3011A and the circuit board 30122A still reserve a certain space for dislocation, and the circuit board 30122A does not protrude from the side surface after molding. In addition, in other modifications based on this embodiment, the encapsulation portion 3011A may encapsulate and cover multiple side surfaces of the circuit board 30122A.

如圖63B所示為本發明的所述基於一體封裝工藝的攝像模組的另一實施例。和圖3063A中的實施例不同的是，除了所述封裝部3011A’將所述線路板30122A’和所述電子元器件30123A’進行封裝，且封裝包覆所述線路板30122A’的所述頂面301221A’和至少一側面301222A’以外，所述封裝部3011A’對所述線路板30122A’的一底部301223A’也進行模塑封裝。從而保證了模塑完成後，所述基於一體封裝工藝的攝像模組從整體上的側面和底部的平整性，也便於安裝定位在其他工裝上。 FIG. 63B shows another embodiment of the camera module based on the integrated packaging process of the present invention. Different from the embodiment in FIG. 3063A, except that the packaging part 3011A' encapsulates the circuit board 30122A' and the electronic components 30123A', and the package covers the top of the circuit board 30122A' In addition to the surface 301221A' and at least one side surface 301222A', the encapsulation part 3011A' also molds and encapsulates a bottom 301223A' of the circuit board 30122A'. Therefore, after the molding is completed, the overall flatness of the side and bottom of the camera module based on the integrated packaging process is ensured, and it is also convenient for installation and positioning on other tooling.

如圖64所示為本發明的所述基於一體封裝工藝的攝像模組的另一實施例。和圖63A中的實施例不同的是，所述封裝部3011B的頂部設計結構不同，圖63A的實施例中，所述封裝部3011A的頂部向上凸出，並和所述濾光片3020A的側邊之間具有一間隙槽301121A，用於安裝不同的鏡頭或者馬達。而 圖64的實施例中並沒有所述間隙槽。此外，所述線路板30122B的底面緊貼有一補強板30125B。所述補強板30125B可以被實施為一金屬板。其他結構和圖63A中的結構相同。為所述封裝部3011B將所述線路板30122B的頂面301221B、至少一側面301221B、所述補強板30125B的側部、所述感光晶片30121B的非感光區域301212B、所述電子元器件30123B以及所述引線30124B全部包覆封裝成型。 FIG. 64 shows another embodiment of the camera module based on the integrated packaging process of the present invention. The difference from the embodiment in FIG. 63A is that the top design structure of the encapsulation part 3011B is different. In the embodiment of FIG. 63A , the top of the encapsulation part 3011A protrudes upward, and is different from the side of the filter 3020A. There is a gap 301121A between the sides for installing different lenses or motors. and The clearance slot is absent in the embodiment of Figure 64 . In addition, a reinforcing plate 30125B is closely attached to the bottom surface of the circuit board 30122B. The reinforcing plate 30125B may be implemented as a metal plate. Other structures are the same as those in FIG. 63A. For the packaging part 3011B, the top surface 301221B of the circuit board 30122B, at least one side surface 301221B, the side part of the reinforcing plate 30125B, the non-photosensitive area 301212B of the photosensitive chip 30121B, the electronic components 30123B and all the The leads 30124B are all encapsulated and molded.

如圖65所示為本發明的所述基於一體封裝工藝的攝像模組的另一實施例。和圖64中的實施例不同的是，針對所述線路板30122B’和所述補強板30125B’，除了所述封裝部3011B’將所述線路板30122B’的所述頂面301221B’和至少一側面301222B’以外，所述封裝部3011B’對所述補強板30125B’的底部也進行模塑封裝。從而保證了模塑完成後，所述基於一體封裝工藝的攝像模組從整體上的側面和底部的平整性，也便於安裝定位。 FIG. 65 shows another embodiment of the camera module based on the integrated packaging process of the present invention. Different from the embodiment shown in FIG. 64 , for the circuit board 30122B' and the reinforcing plate 30125B', except for the encapsulation part 3011B', the top surface 301221B' of the circuit board 30122B' and at least one Besides the side surface 301222B', the encapsulation part 3011B' also molds and encapsulates the bottom of the reinforcing plate 30125B'. Therefore, after the molding is completed, the overall flatness of the side and bottom of the camera module based on the integrated packaging process is also facilitated for installation and positioning.

圖66A所示的模組結構是對圖64實施例中模組結構的一個變形，其他結構相同，不同的是，將所述濾光片3020C放在所述感光晶片30121C上一起利用所述封裝部3011C進行封裝。這樣能減少所述感光晶片30121C在封裝和使用過程中的傷害，而且能夠縮小鏡頭的後焦距，從而使尺寸更小。 The structure of the module shown in FIG. 66A is a modification of the structure of the module in the embodiment of FIG. 64 , the other structures are the same, except that the filter 3020C is placed on the photosensitive chip 30121C and the package is used together part 3011C for encapsulation. In this way, the damage of the photosensitive wafer 30121C during packaging and use can be reduced, and the back focal length of the lens can be reduced, thereby making the size smaller.

類似地，圖66B所示的模組結構是對圖65實施例中模組結構的一個變形，其他結構相同，不同的是，將所述濾光片3020C’放在所述感光晶片30121C’上一起利用所述封裝部3011C’進行封裝。這樣能減少所述感光晶片30121C’在封裝和使用過程中的傷害，而且能夠縮小鏡頭的後焦距，從而使尺寸更小，這樣也能減小高度，能放走所述感光晶片30121C’發出的熱量，具有很高的散熱能力。 Similarly, the module structure shown in FIG. 66B is a modification of the module structure in the embodiment shown in FIG. 65, and the other structures are the same, except that the filter 3020C' is placed on the photosensitive wafer 30121C' They are packaged together with the package part 3011C'. In this way, the damage of the photosensitive chip 30121C' during packaging and use can be reduced, and the back focal length of the lens can be reduced, so that the size can be smaller, and the height can also be reduced. heat, has a high heat dissipation capacity.

圖67A是基於圖66A的實施例中模組結構的一個變形。主要在於所述封裝部3011D的變形。所述封裝部3011D的頂部分別向上延伸形成承載壁 30113D，所述承載壁30111D形成一容納槽301131D，用於容納鏡頭。也就是說，所述封裝部3011D能夠直接承載鏡頭，從而實現高精度定焦(FF)模組。 Fig. 67A is a modification of the module structure in the embodiment based on Fig. 66A. It mainly lies in the deformation of the encapsulation portion 3011D. The tops of the encapsulation parts 3011D are respectively extended upward to form bearing walls 30113D, the bearing wall 30111D forms an accommodating groove 301131D for accommodating the lens. That is to say, the encapsulation part 3011D can directly carry the lens, so as to realize a high-precision fixed focus (FF) module.

圖67B是基於圖66B的實施例中模組結構的一個變形。主要在於所述封裝部3011D’的變形。所述封裝部3011D’包覆所述線路板30121D’的底面，並且其頂部分別向上延伸形成承載壁30111D’，所述承載壁30111D’形成一容納槽1111D’，用於容納鏡頭。也就是說，所述封裝部3011D’能夠直接承載鏡頭，從而實現高精度定焦(FF)模組。 Fig. 67B is a modification of the module structure in the embodiment based on Fig. 66B. It mainly lies in the deformation of the encapsulation portion 3011D'. The encapsulation portion 3011D' covers the bottom surface of the circuit board 30121D', and the tops thereof respectively extend upward to form bearing walls 30111D', and the bearing walls 30111D' form an accommodating groove 1111D' for accommodating the lens. That is to say, the encapsulation part 3011D' can directly carry the lens, thereby realizing a high-precision fixed focus (FF) module.

圖68A和68B是基於圖67A的實施例中模組結構的一個變形。主要在於所述封裝部3011E的變形。因此，所述線路板30121E設有一個或多個穿孔30126E，形成所述封裝部3011E的成形材料進入所述穿孔30126E並且被埋入所述穿孔30126E，從而進一步地加強對所述線路板30121E的補強作用。類似地，所述封裝部3011E可以不僅包覆在所述線路板30121E的頂面，還可以包覆至所述線路板30121E的側面和底面。可以理解的是，這裡的所述線路板30121E設置所述穿孔30126E的方式也可以應用于本發明的其他實施例。 Figures 68A and 68B are a variation of the module structure in the embodiment based on Figure 67A. It mainly lies in the deformation of the encapsulation portion 3011E. Therefore, the circuit board 30121E is provided with one or more through holes 30126E, and the molding material forming the encapsulation portion 3011E enters the through holes 30126E and is buried in the through holes 30126E, thereby further strengthening the resistance to the circuit board 30121E. Reinforcing effect. Similarly, the encapsulation part 3011E may not only cover the top surface of the circuit board 30121E, but also cover the side and bottom surfaces of the circuit board 30121E. It can be understood that, the manner in which the circuit board 30121E is provided with the through hole 30126E can also be applied to other embodiments of the present invention.

值得一提的是，基於圖63A至66B所示的各實施例中，在上述實施例的MOC的技術上，當需要連接馬達時，馬達引腳與線路板導通的圖69至71中的幾種連接方式。 It is worth mentioning that, based on the various embodiments shown in FIGS. 63A to 66B , in terms of the MOC technology of the above-mentioned embodiments, when the motor needs to be connected, the motor pins are connected to the circuit board in some of FIGS. 69 to 71 . a connection method.

如圖69所示是一變形實施例結構，採用的為MOC工藝。所述基於一體封裝工藝的攝像模組包括一封裝感光組件、一濾光片3020F、一鏡頭3030F和一馬達3040F。也就是說，本發明的這個優選實施例中是以自動對焦(AF)模組為例。所述封裝感光組件包括一封裝部3011F和一感光組件3012F。所述感光元件3012F進一步包括一感光晶片30121F、一線路板30122F、一組電子元器件30123F和一組引線30124F。所述引線30124F連接並導通所述感光晶片30121F和所述線路板30122F。在本發明的這個實施例中，所述引線30124F可以 被實施為金線。所述封裝部3011F作為承載所述濾光片3020F的支架。在封裝過程中，所述封裝部3011F將所述線路板30122F進行封裝，在本發明的這個實施例中，所述封裝部3011F封裝所述線路板30122F上除所述感光晶片30121F的感光區域以外的部分。所述封裝部3011F不僅封裝所述線路板30122F的頂表面301221F，所述封裝部3011F還封裝包覆所述線路板30122F的至少一側面301222F。可以理解的是，在封裝過程中，所述封裝部3011F也將所述電子元器件30123F一體封裝。 As shown in FIG. 69 , the structure of a variant embodiment is adopted, and the MOC process is adopted. The camera module based on the integrated packaging process includes a packaged photosensitive component, a filter 3020F, a lens 3030F and a motor 3040F. That is to say, in this preferred embodiment of the present invention, an auto focus (AF) module is used as an example. The packaged photosensitive component includes a package portion 3011F and a photosensitive component 3012F. The photosensitive element 3012F further includes a photosensitive wafer 30121F, a circuit board 30122F, a set of electronic components 30123F and a set of lead wires 30124F. The lead 30124F connects and conducts the photosensitive chip 30121F and the circuit board 30122F. In this embodiment of the invention, the lead 30124F can be Implemented as gold wire. The encapsulation portion 3011F serves as a bracket for carrying the optical filter 3020F. During the encapsulation process, the encapsulation part 3011F encapsulates the circuit board 30122F. In this embodiment of the present invention, the encapsulation part 3011F encapsulates the circuit board 30122F except the photosensitive area of the photosensitive chip 30121F part. The encapsulation part 3011F not only encapsulates the top surface 301221F of the circuit board 30122F, but also encapsulates at least one side surface 301222F of the circuit board 30122F. It can be understood that, during the packaging process, the packaging part 3011F also packages the electronic components 30123F in one piece.

值得一提的是，所述封裝部3011F的一封裝部引腳301101F和所述馬達3040F為電學導通，通過所述封裝部3011F的一內部導線301102F，將所述馬達3040F的至少一馬達引腳3041F與所述線路板30122F導通，這種實施方式可以不需要採用焊接工藝。 It is worth mentioning that a package pin 301101F of the package part 3011F and the motor 3040F are electrically connected, and at least one motor pin of the motor 3040F is connected through an inner wire 301102F of the package part 3011F. 3041F is in conduction with the circuit board 30122F, and this embodiment does not require a soldering process.

而如圖70所示的實施例中，可以採用焊接工藝，所述封裝部3011G有直通上下的一凹槽通道1103G，可以用來放置所述馬達引腳3041G，使所述馬達引腳3041G通過所述凹槽通道1103G與所述線路板30122G的一線路板引腳1231G在一焊接點3060G進行焊接。 In the embodiment shown in FIG. 70, a soldering process can be used, and the package portion 3011G has a groove channel 1103G that is directly connected to the upper and lower sides, which can be used to place the motor pins 3041G so that the motor pins 3041G can pass through. The groove channel 1103G is welded to a circuit board pin 1231G of the circuit board 30122G at a welding point 3060G.

相應地，圖71中的結構與圖69，圖70結構比較相似，不過由於所述封裝部303011H的高度比較高，圖69，圖70的結構中的馬達引腳可能在設計上無法達到很長，這樣就只能採用圖71的結構。也就是說，所述封裝部303011H外壁的凹槽通道301103H並非直通到底，而是所述馬達引腳3041H在所述凹槽通道301103H中與所述封裝部3011H的所述封裝部引腳301101H焊接，一焊接點為3060H，且直接通過所述封裝部3011H的所述內部導線301102H與所述線路板30122H相連，從而實現馬達與線路板之間的導通。 Correspondingly, the structure in FIG. 71 is similar to the structure in FIG. 69 and FIG. 70 , but because the height of the package part 303011H is relatively high, the motor pins in the structure in FIG. 69 and FIG. 70 may not be designed to be very long. , so only the structure of Figure 71 can be used. That is to say, the groove channel 301103H of the outer wall of the package part 303011H does not go straight to the bottom, but the motor pins 3041H are welded with the package part pins 301101H of the package part 3011H in the groove channel 301103H , a welding point is 3060H, and is directly connected to the circuit board 30122H through the inner wire 301102H of the package portion 3011H, so as to realize the conduction between the motor and the circuit board.

另外，根據另外的一種實施方式，所述封裝部也可以在表面利用鐳射直接成型工藝形成電鍍導電線路，用來連接所述馬達和所述線路板。當 然，所述封裝部也可以不具有上述實施例中提到的電氣性能，而是採用傳統的方式將所述馬達與所述線路板通過焊接方式焊接。 In addition, according to another embodiment, the encapsulation part can also form electroplating conductive lines on the surface by a laser direct molding process, which is used to connect the motor and the circuit board. when Of course, the encapsulation part may also not have the electrical properties mentioned in the above embodiments, but the motor and the circuit board may be welded in a conventional manner.

本領域的技術人員可以理解的是，圖69至71示意的三個實施例中僅僅是為了說明在有馬達的情況下，所述馬達和所述線路板導通的不同方式。三個實施例中的所述封裝部並不僅僅封裝所述線路板的頂面和側面，還可以如前述各變形實施例中提到的，封裝所述線路板的底面。此外，所述攝像模組的其他結構也可以做相應的變形，本發明並不受此限制。 It can be understood by those skilled in the art that the three embodiments shown in FIGS. 69 to 71 are only for illustrating different ways of conducting conduction between the motor and the circuit board in the case of a motor. The encapsulation part in the three embodiments not only encapsulates the top surface and the side surface of the circuit board, but also encapsulates the bottom surface of the circuit board as mentioned in the foregoing variant embodiments. In addition, other structures of the camera module can also be modified accordingly, and the present invention is not limited thereto.

參考說明書附圖之圖72至圖74F，依本發明的一優選實施例的攝像模組及所述攝像模組的製造方法被闡明。所述攝像模組包括至少一光學鏡頭4030、至少一感光晶片4010、至少一保護框4060、至少一線路板4070以及至少一一體封裝支架4050。 Referring to FIGS. 72 to 74F of the accompanying drawings, a camera module and a manufacturing method of the camera module according to a preferred embodiment of the present invention are illustrated. The camera module includes at least one optical lens 4030 , at least one photosensitive chip 4010 , at least one protective frame 4060 , at least one circuit board 4070 and at least one integrated packaging bracket 4050 .

值得一提的是，在本發明的關於所述攝像模組的結構和所述攝像模組的製造方法的描述中使用到的術語“一”應被理解為“至少一”或“一個或多個”，即在一個實施例中，一個元件的數量可以是一個，而在另外的實施例中，該元件的數量可以為多個，因此，術語“一”不能理解為對數量的限制。 It is worth mentioning that the term "a" used in the description of the structure of the camera module and the manufacturing method of the camera module of the present invention should be understood as "at least one" or "one or more". "One", that is, in one embodiment, the number of an element may be one, and in another embodiment, the number of the element may be multiple, therefore, the term "one" should not be construed as a limitation on the number.

類似地，在揭露和闡述本發明的所述攝像模組的結構和所述攝像模組的製造方法時使用到的任何方向性的術語，例如“縱向”、“橫向”、“上”、“下”、“前”、“後”、“左”、“右”、“豎直”、“水準”、“頂”、“底”、“內”、“外”等指示的方位或位置關係是基於附圖所示的方位或位置關係，其僅是為了便於描述本發明和簡化描述，而不是指示或暗示所指的裝置或元件必須具有特定的方位、以特定的方位構造和操作，因此上述術語不能理解為對本發明的限制。 Similarly, any directional terms used in disclosing and explaining the structure of the camera module and the manufacturing method of the camera module of the present invention, such as "portrait", "horizontal", "top", " The orientation or position relationship indicated by "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. It is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore The above terms should not be construed as limiting the present invention.

更值得一提的是，本發明的所述攝像模組可以是定焦攝像模組，也可以是變焦攝像模組。換言之，本發明的所述攝像模組是否允許調焦並不限制本發明的內容和範圍。 It is worth mentioning that the camera module of the present invention may be a fixed-focus camera module or a zoom camera module. In other words, whether the camera module of the present invention allows focus adjustment does not limit the content and scope of the present invention.

更值得一提的是，本發明的所述攝像模組可以是單鏡頭攝像模組，也可以是多鏡頭攝像模組，例如在一個具體的示例中，所述攝像模組可以被實施為陣列攝像模組。換言之，本發明的所述攝像模組的所述光學鏡頭4030的數量並不限制本發明的內容和範圍。 It is worth mentioning that the camera module of the present invention may be a single-lens camera module or a multi-lens camera module. For example, in a specific example, the camera module may be implemented as an array. camera module. In other words, the number of the optical lenses 4030 of the camera module of the present invention does not limit the content and scope of the present invention.

具體地說，在本發明的所述攝像模組中，所述保護框4060被凸起地設置於所述感光晶片4010的感光區域的外周側，所述感光晶片4010與所述線路板4070被導通連接，所述一體封裝支架4050被設置包裹所述線路板4070和所述感光晶片4010的非感光區域，以使所述一體封裝支架4050、所述感光晶片4010和所述線路板4070結合為一體，所述光學鏡頭4030被設置於所述感光晶片4010的感光路徑。被物體反射的光線能夠通過所述光學鏡頭4030被彙聚到所述攝像模組的內部，以進一步被所述感光晶片4010接收和進行光電轉化而生成與物體相關的圖像。 Specifically, in the camera module of the present invention, the protection frame 4060 is protrudingly disposed on the outer peripheral side of the photosensitive area of the photosensitive wafer 4010, and the photosensitive wafer 4010 and the circuit board 4070 are separated by Conductive connection, the integrated packaging bracket 4050 is configured to wrap the circuit board 4070 and the non-photosensitive area of the photosensitive wafer 4010, so that the integrated packaging bracket 4050, the photosensitive wafer 4010 and the circuit board 4070 are combined into a As a whole, the optical lens 4030 is disposed on the photosensitive path of the photosensitive wafer 4010 . The light reflected by the object can be collected into the interior of the camera module through the optical lens 4030 to be further received by the photosensitive wafer 4010 and photoelectrically converted to generate an image related to the object.

在本發明的所述攝像模組的一個具體的示例中，所述感光晶片4010被貼裝於所述線路板4070，並且所述感光晶片4010通過打線工藝與所述線路板4070被導通連接。例如在所述感光晶片4010的非感光區域和所述線路板4070之間打金線，以藉由金線導通連接所述感光晶片4010和所述線路板4070，如圖72所示。 In a specific example of the camera module of the present invention, the photosensitive wafer 4010 is mounted on the circuit board 4070, and the photosensitive wafer 4010 is electrically connected to the circuit board 4070 through a wire bonding process. For example, a gold wire is formed between the non-photosensitive area of the photosensitive chip 4010 and the circuit board 4070 to connect the photosensitive chip 4010 and the circuit board 4070 through the gold wire, as shown in FIG. 72 .

在本發明的所述攝像模組的另一個具體的示例中，所述感光晶片4010在被貼裝於所述線路板4070的同時被導通連接於所述線路板4070，例如所述感光晶片4010的非感光區域設有晶片焊盤，所述線路板4070設有線路板焊 盤，在將所述感光晶片4010貼裝於所述線路板4070時，使所述感光晶片4010的晶片焊盤和所述線路板4070的線路板焊盤被導通連接。 In another specific example of the camera module of the present invention, the photosensitive chip 4010 is electrically connected to the circuit board 4070 while being mounted on the circuit board 4070 , for example, the photosensitive chip 4010 The non-photosensitive area is provided with die pads, and the circuit board 4070 is provided with circuit board soldering When the photosensitive wafer 4010 is mounted on the circuit board 4070, the die pads of the photosensitive wafer 4010 and the circuit board pads of the circuit board 4070 are electrically connected.

所述保護框4060是中空結構，以使所述保護框4060能夠被環設於所述感光晶片4010的感光區域的外周側。優選地，所述保護框4060的內側邊的尺寸大於或者等於所述感光晶片4010的感光區域的尺寸，從而當所述保護框4060被凸起地設置於所述感光晶片4010時，所述保護框4060能夠被保持在所述感光晶片4010的感光區域的外周側，以使所述保護框4060不會遮擋所述感光晶片4010的感光區域。 The protective frame 4060 is a hollow structure, so that the protective frame 4060 can be arranged around the outer peripheral side of the photosensitive area of the photosensitive wafer 4010 . Preferably, the size of the inner side of the protective frame 4060 is greater than or equal to the size of the photosensitive area of the photosensitive wafer 4010, so that when the protective frame 4060 is protruded on the photosensitive wafer 4010, the The protective frame 4060 can be held on the outer peripheral side of the photosensitive area of the photosensitive wafer 4010 so that the protective frame 4060 does not block the photosensitive area of the photosensitive wafer 4010 .

優選地，所述保護框4060的外側邊的尺寸小於所述感光晶片4010的尺寸，從而當所述保護框4060被凸起地設置於所述感光晶片4010時，在所述感光晶片4010的非感光區域的外側可以通過打線的工藝將所述感光晶片4010和所述線路板4070導通。儘管如此，本領域的技術人員可以理解的是，當所述感光晶片4010和所述線路板4070通過晶片焊盤和線路板焊盤被導通連接時，所述保護框4060的外側邊的尺寸可以與所述感光晶片4010的尺寸一致。 Preferably, the size of the outer side of the protective frame 4060 is smaller than the size of the photosensitive wafer 4010, so that when the protective frame 4060 is protruded on the photosensitive wafer 4010, the photosensitive wafer 4010 On the outside of the non-photosensitive area, the photosensitive wafer 4010 and the circuit board 4070 may be electrically connected through a wire bonding process. Nonetheless, those skilled in the art can understand that when the photosensitive wafer 4010 and the circuit board 4070 are electrically connected through the die pad and the circuit board pad, the size of the outer side of the protection frame 4060 The size of the photosensitive wafer 4010 may be the same.

所述一體封裝支架4050在成型後包裹所述線路板4070和所述感光晶片4010的非感光區域，從而使所述一體封裝支架4050、所述線路板4070和所述感光晶片4010結合為一體，通過這樣的方式，能夠增加所述攝像模組的結構穩定性和減小所述攝像模組的體積，以使所述攝像模組能夠被應用於追求輕薄化的電子設備。 The integrated packaging bracket 4050 wraps the circuit board 4070 and the non-photosensitive area of the photosensitive wafer 4010 after being formed, so that the integrated packaging bracket 4050, the circuit board 4070 and the photosensitive wafer 4010 are integrated into one body. In this way, the structural stability of the camera module can be increased and the volume of the camera module can be reduced, so that the camera module can be applied to electronic equipment that pursues thinning.

進一步地，所述一體封裝支架4050被設置包裹所述保護框4060的外周側，以使所述一體封裝支架4050、所述線路板4070、所述保護框4060和所述感光晶片4010結合為一體。 Further, the integrated packaging bracket 4050 is configured to wrap around the outer peripheral side of the protection frame 4060 , so that the integrated packaging bracket 4050 , the circuit board 4070 , the protection frame 4060 and the photosensitive chip 4010 are integrated into one .

進一步地，如圖72所示，所述攝像模組包括至少一鏡頭支撐體4040，其中所述鏡頭支撐體4040被設置於所述一體封裝支架4050的上部，所述 光學鏡頭4030被設置於所述鏡頭支撐體4040，以藉由所述鏡頭支撐體4040使所述光學鏡頭4030被保持在所述感光晶片4010的感光路徑。 Further, as shown in FIG. 72 , the camera module includes at least one lens support body 4040 , wherein the lens support body 4040 is arranged on the upper part of the integrated packaging bracket 4050 , the The optical lens 4030 is disposed on the lens supporting body 4040 , so that the optical lens 4030 is kept in the photosensitive path of the photosensitive wafer 4010 by the lens supporting body 4040 .

在本發明的所述攝像模組的一個具體的示例中，所述鏡頭支撐體4040在成型後被設置於所述一體封裝支架4050的上部。在本發明的所述攝像模組的另一個具體的示例中，所述鏡頭支撐體4040可以與所述一體封裝支架4050一體地成型，通過這樣的方式，能夠降低所述攝像模組的封裝誤差，以有利於提高所述攝像模組的成像品質。 In a specific example of the camera module of the present invention, the lens support body 4040 is disposed on the upper part of the integrated packaging bracket 4050 after being formed. In another specific example of the camera module of the present invention, the lens support body 4040 can be integrally formed with the integrated packaging bracket 4050, and in this way, the packaging error of the camera module can be reduced , so as to improve the imaging quality of the camera module.

優選地，所述鏡頭支撐體4040可以被實施為一馬達，也就是說，所述光學鏡頭4030被可操作地設置於所述鏡頭支撐體4040，以通過所述鏡頭支撐體4040驅動所述光學鏡頭4030沿著所述感光晶片4010的感光路徑來回移動，從而通過改變所述光學鏡頭4030與所述感光晶片4010之間的位置來調整所述攝像模組的焦距。值得一提的是，所述鏡頭支撐體4040可以是各種驅動器，以供驅動所述光學鏡頭4030沿著所述感光晶片4010的感光路徑來回移動，例如在本發明的這個優選的實施例中，所述鏡頭支撐體4040可以被實施為音圈馬達。 Preferably, the lens support 4040 can be implemented as a motor, that is, the optical lens 4030 is operably disposed on the lens support 4040 to drive the optical lens through the lens support 4040 The lens 4030 moves back and forth along the photosensitive path of the photosensitive chip 4010 , so as to adjust the focal length of the camera module by changing the position between the optical lens 4030 and the photosensitive chip 4010 . It is worth mentioning that the lens support 4040 can be various drivers for driving the optical lens 4030 to move back and forth along the photosensitive path of the photosensitive wafer 4010. For example, in this preferred embodiment of the present invention, The lens supporter 4040 may be implemented as a voice coil motor.

本領域的技術人員可以理解的是，當所述鏡頭支撐體4040被實施為馬達時，所述鏡頭支撐體4040與所述線路板4070被導通連接。 Those skilled in the art can understand that when the lens support body 4040 is implemented as a motor, the lens support body 4040 and the circuit board 4070 are electrically connected.

進一步地，如圖72所示，所述攝像模組包括一濾光元件4020，其中所述濾光元件4020被設置於所述光學鏡頭4030和所述感光晶片4010之間，當被物體反射的光線自所述光學鏡頭4030被彙聚到所述攝像模組的內部時，光線經由所述濾光元件4020的過濾後被所述感光晶片4010接收和進行光電轉化，以改善所述攝像模組的成像品質。換言之，所述濾光元件4020能夠起到降噪的作用，以改善所述攝像模組的成像品質。 Further, as shown in FIG. 72, the camera module includes a filter element 4020, wherein the filter element 4020 is disposed between the optical lens 4030 and the photosensitive wafer 4010, when the light reflected by the object When the light is collected from the optical lens 4030 to the interior of the camera module, the light is filtered by the filter element 4020 and then received by the photosensitive chip 4010 and photoelectrically converted, so as to improve the performance of the camera module. Image quality. In other words, the filter element 4020 can play the role of noise reduction, so as to improve the imaging quality of the camera module.

值得一提的是，所述濾光元件4020的類型可以不受限制，例如在本發明的所述攝像模組的一個具體的示例中，所述濾光元件4020可以被實施為紅外截止濾光片，以藉由所述濾光元件4020過濾光線中的紅外線部分，而在本發明的所述攝像模組的另一個具體的示例中，所述濾光元件4020被實施為可見光譜濾光片。 It is worth mentioning that the type of the filter element 4020 may not be limited. For example, in a specific example of the camera module of the present invention, the filter element 4020 may be implemented as an infrared cut filter. The filter element 4020 is used to filter the infrared part of the light, and in another specific example of the camera module of the present invention, the filter element 4020 is implemented as a visible spectrum filter .

所述一體封裝支架4050形成至少一貼裝平臺4051，以供被貼裝所述濾光元件4020，例如所述貼裝平臺4051可以是形成於所述一體封裝支架4050上部的安裝槽或者所述貼裝平臺4051可以是形成於所述一體封裝支架4050上部的平面。換言之，所述濾光元件4020可以被直接貼裝在所述一體封裝支架4050的上部。 The integrated package bracket 4050 forms at least one mounting platform 4051 for mounting the filter element 4020 . The mounting platform 4051 may be a flat surface formed on the upper part of the integrated package bracket 4050 . In other words, the filter element 4020 can be directly mounted on the upper part of the integrated package bracket 4050 .

如圖74A至圖74F是依本發明的所述攝像模組的一製造過程的示意圖，其中在圖74A至圖74F中，為了方便說明，全部以剖視圖的方式表示所述攝像模組的所述光學鏡頭4030、所述感光晶片4010、所述保護框4060、所述線路板4070以及所述一體封裝支架4050等元件的結構關係。 74A to 74F are schematic diagrams of a manufacturing process of the camera module according to the present invention. The structural relationship of the optical lens 4030 , the photosensitive chip 4010 , the protection frame 4060 , the circuit board 4070 , and the integrated package bracket 4050 .

在圖74A示出的這個步驟中，將所述感光晶片4010導通所述線路板4070。本領域的技術人員可以理解的是，在圖74A示出的這個步驟中，在將所述感光晶片4010貼裝於所述線路板4070後，再通過打線工藝將所述感光晶片4010和所述線路板4030導通連接方式，僅僅為舉例性的描述，這種將所述感光晶片4010和所述線路板4070導通連接方式並不構成對本發明的內容和範圍的限制。在本發明的所述攝像模組的另一個示例中，所述感光晶片4010和所述線路板4070還可以通過晶片焊盤和線路板焊盤被直接導通連接。 In this step shown in FIG. 74A , the photosensitive wafer 4010 is connected to the circuit board 4070 . Those skilled in the art can understand that, in this step shown in FIG. 74A, after the photosensitive wafer 4010 is mounted on the circuit board 4070, the photosensitive wafer 4010 and the photosensitive wafer 4010 are bonded to the circuit board 4070 through a wire bonding process. The conductive connection manner of the circuit board 4030 is only an exemplary description, and the conductive connection manner of the photosensitive wafer 4010 and the circuit board 4070 does not limit the content and scope of the present invention. In another example of the camera module of the present invention, the photosensitive wafer 4010 and the circuit board 4070 may also be directly connected to each other through a die pad and a circuit board pad.

在圖74B示出的這個步驟中，將所述保護框4060凸起地設置於所述感光晶片4010的感光區域的外周側。具體地說，在本發明的所述攝像模組的製造過程中，在所述保護框4060被提供後，將所述保護框4060凸起地設置於所 述感光晶片4010的感光區域的外周側。優選地，在所述保護框4060和所述感光晶片4010的感光區域的外周側之間形成一膠合層4080，所述膠合層4080用於連接所述保護框4060和所述感光晶片4010的感光區域的外周側。 In this step shown in FIG. 74B , the protective frame 4060 is disposed on the outer peripheral side of the photosensitive area of the photosensitive wafer 4010 so as to be convex. Specifically, in the manufacturing process of the camera module of the present invention, after the protective frame 4060 is provided, the protective frame 4060 is protruded on the The outer peripheral side of the photosensitive region of the photosensitive wafer 4010. Preferably, an adhesive layer 4080 is formed between the protective frame 4060 and the outer peripheral side of the photosensitive area of the photosensitive wafer 4010 , and the adhesive layer 4080 is used for connecting the protective frame 4060 and the photosensitive wafer 4010 . the outer peripheral side of the area.

例如在本發明的所述攝像模組的一個實例中，將膠水設置在所述保護框4060和/或所述感光晶片4010的感光區域的外周側，以在所述保護框4060和/或所述感光晶片4010的感光區域的外周側形成所述膠合層4080。也就是說，所述保護框4060和所述感光晶片4010的感光區域的外周側中的至少一個的表面形成所述膠合層4080。在後續，所述膠合層4080用於將所述保護框4060和所述感光晶片4010的感光區域的外周側連接在一起。 For example, in an example of the camera module of the present invention, glue is arranged on the outer peripheral side of the protective frame 4060 and/or the photosensitive area of the photosensitive wafer 4010, so that the protective frame 4060 and/or the photosensitive area is The adhesive layer 4080 is formed on the outer peripheral side of the photosensitive region of the photosensitive wafer 4010 . That is, the adhesive layer 4080 is formed on the surface of at least one of the protective frame 4060 and the outer peripheral side of the photosensitive region of the photosensitive wafer 4010 . Subsequently, the adhesive layer 4080 is used to connect the protective frame 4060 and the outer peripheral side of the photosensitive area of the photosensitive wafer 4010 together.

優選地，當膠水設置在所述保護框4060和所述感光晶片4010的感光區域的外周側之後，可以通過熱固化或者UV光照固化的方式使膠水快速地形成用於連接所述保護框4060和所述感光晶片4010的感光區域的外周側的所述膠合層4080。而在本發明的所述攝像模組的另一個示例中，所述保護框4060可以自帶所述膠合層4080，從而在封裝所述攝像模組的過程中，可以直接將所述保護框4060設置在所述感光晶片4010的感光區域的外周側。 Preferably, after the glue is disposed on the outer peripheral side of the protective frame 4060 and the photosensitive area of the photosensitive wafer 4010, the glue can be rapidly formed by thermal curing or UV light curing for connecting the protective frame 4060 and the photosensitive wafer 4010. The adhesive layer 4080 on the outer peripheral side of the photosensitive area of the photosensitive wafer 4010 . In another example of the camera module of the present invention, the protective frame 4060 may have its own adhesive layer 4080, so that during the process of packaging the camera module, the protective frame 4060 can be directly attached to the protective frame 4060. It is arranged on the outer peripheral side of the photosensitive region of the photosensitive wafer 4010 .

另外，所述保護框4060可以是通過注塑工藝或者衝壓工藝形成的，例如所述保護框4060可以是通過注塑工藝形成的塑膠件。 In addition, the protective frame 4060 may be formed by an injection molding process or a stamping process, for example, the protective frame 4060 may be a plastic part formed by an injection molding process.

如圖73所述，所述保護框4060是中空結構，從而使得所述保護框4060能夠被凸起地設置於所述感光晶片4010的感光區域的外周側，以用於隔離所述感光晶片4020的感光區域和外部環境，從而在後續封裝所述攝像模組的過程中，所述保護框4060能夠防止污染物進入所述感光晶片4010的感光區域而造成汙壞點不良。 As shown in FIG. 73 , the protective frame 4060 is a hollow structure, so that the protective frame 4060 can be convexly disposed on the outer peripheral side of the photosensitive area of the photosensitive wafer 4010 for isolating the photosensitive wafer 4020 Therefore, in the subsequent process of packaging the camera module, the protection frame 4060 can prevent contaminants from entering the photosensitive area of the photosensitive wafer 4010 and cause defective contamination.

在圖74C示出的這個步驟中，通過一成型模具40100在所述攝像模組被封裝的過程中形成所述一體封裝支架4050，其中所述成型模具40100包 括一模具上部40101，所述模具上部40101的內表面施壓於所述保護框4060，以隔離所述感光晶片4010的感光區域和外部環境。 In this step shown in FIG. 74C , the one-piece package bracket 4050 is formed by a molding die 40100 during the process of packaging the camera module, wherein the molding die 40100 wraps A mold upper portion 40101 is included, and the inner surface of the mold upper portion 40101 is pressed against the protective frame 4060 to isolate the photosensitive area of the photosensitive wafer 4010 from the external environment.

本領域的技術人員可以理解的是，所述保護框4060被凸起地設置於所述感光晶片4010的感光區域的外周側，從而當所述模具上部40101的內表面施壓於所述保護框4060時，所述保護框4060能夠阻止所述模具上部40101的內表面與所述感光晶片4010的感光區域接觸，從而所述保護框4060能夠阻止所述模具上部40101的內表面損壞或者刮傷所述感光晶片4010的感光區域。 Those skilled in the art can understand that the protective frame 4060 is protrudingly disposed on the outer peripheral side of the photosensitive area of the photosensitive wafer 4010, so that when the inner surface of the mold upper portion 40101 is pressed against the protective frame 4060, the protective frame 4060 can prevent the inner surface of the upper mold 40101 from contacting the photosensitive area of the photosensitive wafer 4010, so that the protective frame 4060 can prevent the inner surface of the upper mold 40101 from being damaged or scratched. The photosensitive area of the photosensitive wafer 4010 is described.

進一步地，參考圖76示出的所述攝像模組的製造過程的一個變形示例，其中所述模具上部40101的內表面對應於所述感光晶片4010的感光區域的部位通過內凹的方式形成一凹槽40102，從而在藉由所述成型模具40100成型所述一體封裝支架4050的過程中，所述凹槽40102能夠使所述感光晶片4010的感光區域與所述模具上部40101的內表面具有安全間隙，從而進一步降低所述模具上部40101對所述感光晶片4010的影響，以防止所述感光晶片4010被所述模具上部40101的內表面損壞或者刮傷。 Further, referring to a modification example of the manufacturing process of the camera module shown in FIG. 76 , a portion of the inner surface of the upper mold portion 40101 corresponding to the photosensitive area of the photosensitive wafer 4010 is formed by concave. A groove 40102 is formed, so that the groove 40102 can make the photosensitive area of the photosensitive wafer 4010 and the inner surface of the upper part 40101 of the mold safe Therefore, the influence of the upper mold 40101 on the photosensitive wafer 4010 is further reduced, so as to prevent the photosensitive wafer 4010 from being damaged or scratched by the inner surface of the upper mold 40101 .

優選地，所述保護框4060具有彈性，從而當所述模具上部40101的內表面施壓於所述保護框4060時，所述保護框4060能夠起到緩衝作用，以防止所述模具上部40101產生的壓力損壞所述感光晶片4010。另外，受限於所述感光晶片4010的製造工藝和所述線路板4070的製造工藝以及所述感光晶片4010和所述線路板4070的貼裝工藝的限制，在所述感光晶片4010被貼裝於所述線路板4070之後可能會存在貼裝傾斜，此時，當所述模具上部40101的內表面施壓於所述保護框4060時，所述保護框4060能夠產生變形，以使所述感光晶片4010的感光區域與外部環境相隔離，以防止用於形成所述一體封裝支架4050的成形材料進入所述感光晶片4010的感光區域。 Preferably, the protective frame 4060 has elasticity, so that when the inner surface of the upper mold portion 40101 is pressed against the protective frame 4060, the protective frame 4060 can play a buffer role to prevent the upper mold portion 40101 from generating The pressure damages the photosensitive wafer 4010. In addition, limited by the manufacturing process of the photosensitive wafer 4010 and the manufacturing process of the circuit board 4070 and the limitations of the mounting process of the photosensitive wafer 4010 and the circuit board 4070, the photosensitive wafer 4010 is mounted on the There may be a mounting tilt after the circuit board 4070. At this time, when the inner surface of the upper part of the mold 40101 is pressed against the protective frame 4060, the protective frame 4060 can be deformed to make the photosensitive The photosensitive area of the wafer 4010 is isolated from the external environment to prevent the molding material used to form the one-piece package holder 4050 from entering the photosensitive area of the photosensitive wafer 4010 .

在圖74D示出的這個步驟中，將所述成形材料加入到所述模具上部40101中，在所述成形材料固化後形成所述一體封裝支架4050，其中所述一體封裝支架4050包裹所述線路板4070和所述感光晶片4010的非感光區域，以使所述一體封裝支架4050、所述線路板4070和所述感光晶片4010結合為一體。優選地，所述一體封裝支架4050進一步包裹所述保護框4060的外周側，以使所述一體封裝支架4050、所述線路板4070、所述保護框4060和所述感光晶片4010結合為一體。值得一提的是，所述成形材料是流質或者顆粒狀。在將所述成型模具40100移離之後，可以得到如圖74E示出的一體結合的所述一體封裝支架4050、所述線路板4070、所述保護框4060和所述感光晶片4010。 In this step shown in FIG. 74D, the molding material is added into the upper part 40101 of the mold, and after the molding material is cured, the one-piece packaging bracket 4050 is formed, wherein the one-piece packaging bracket 4050 wraps the circuit The board 4070 and the non-photosensitive area of the photosensitive wafer 4010 are combined, so that the integrated package bracket 4050 , the circuit board 4070 and the photosensitive wafer 4010 are integrated into one. Preferably, the integrated packaging bracket 4050 further wraps the outer peripheral side of the protection frame 4060 , so that the integrated packaging bracket 4050 , the circuit board 4070 , the protection frame 4060 and the photosensitive chip 4010 are integrated into one. It is worth mentioning that the forming material is fluid or granular. After the forming mold 40100 is removed, the integrated package bracket 4050 , the circuit board 4070 , the protection frame 4060 and the photosensitive wafer 4010 can be obtained as shown in FIG. 74E .

本領域的技術人員可以理解的是，所述感光晶片4010的感光區域和外部環境被隔離，從而當所述成形材料被加入到所述模具上部40101後，所述成形材料不會流動到所述感光晶片4010的感光區域，從而所述保護框4060能夠阻止所述成形材料損壞所述感光晶片4010的感光區域。另外，所述保護框4060具有彈性，以使所述保護框4060和施壓於所述保護框4060的所述模具上部40101之間沒有縫隙，因此，在被加入所述模具上部40101的所述成形材料固化的過程中不會出現“飛邊”的現象，以保證所述攝像模組的成像品質。 Those skilled in the art can understand that the photosensitive area of the photosensitive wafer 4010 is isolated from the external environment, so that when the forming material is added to the upper part 40101 of the mold, the forming material will not flow to the The photosensitive area of the photosensitive wafer 4010, so that the protective frame 4060 can prevent the forming material from damaging the photosensitive area of the photosensitive wafer 4010. In addition, the protective frame 4060 has elasticity, so that there is no gap between the protective frame 4060 and the upper mold 40101 pressed against the protective frame 4060. During the curing process of the forming material, there will be no "flash" phenomenon, so as to ensure the imaging quality of the camera module.

進一步地，參考圖75A和圖75B示出的所述攝像模組的製造過程的一個變形示例，其中所述模具上部40101的內表面被設有一覆蓋膜40102，當所述模具上部40101的內表面施壓於所述保護框4060時，被設於所述模具上部40101的所述覆蓋膜40102與所述保護框4060直接接觸，從而藉由所述覆蓋膜40103對所述感光晶片4010提供進一步的保護。另外，可以理解的是，所述覆蓋膜40102可以降低脫模難度和增加密封性，從而防止所述成形材料在固化的過程中在所述一體封裝支架4050的內側出現“飛邊”的現象。 Further, referring to FIG. 75A and FIG. 75B, a modification example of the manufacturing process of the camera module is shown, wherein the inner surface of the upper mold 40101 is provided with a cover film 40102, when the inner surface of the upper mold 40101 is provided with a cover film 40102 When pressing on the protective frame 4060, the cover film 40102 provided on the upper part of the mold 40101 is in direct contact with the protective frame 4060, so that the cover film 40103 provides further protection to the photosensitive wafer 4010. Protect. In addition, it can be understood that the cover film 40102 can reduce the difficulty of demolding and increase the sealing performance, so as to prevent the phenomenon of "flash" appearing on the inner side of the integrated packaging bracket 4050 during the curing process of the molding material.

在圖74F示出的這個步驟中，將所述濾光元件4020和所述光學鏡頭4030分別設置於所述感光晶片4010的感光路徑，以制得所述攝像模組。優選地，所述濾光元件4020被貼裝於所述一體封裝支架4050，所述光學鏡頭4030通過被設置於所述一體封裝支架4050的所述鏡頭支撐體4040被保持在所述感光晶片4010的感光路徑。 In this step shown in FIG. 74F , the filter element 4020 and the optical lens 4030 are respectively disposed on the photosensitive path of the photosensitive wafer 4010 to manufacture the camera module. Preferably, the filter element 4020 is mounted on the integrated package bracket 4050 , and the optical lens 4030 is held on the photosensitive wafer 4010 by the lens support 4040 provided on the integrated package bracket 4050 . photosensitive path.

如圖77A至圖77G是依本發明的所述攝像模組的另一製造過程的示意圖。在圖77A示出的這個步驟中，將所述感光晶片4010導通所述線路板4070。 77A to 77G are schematic diagrams of another manufacturing process of the camera module according to the present invention. In this step shown in FIG. 77A , the photosensitive wafer 4010 is connected to the circuit board 4070 .

在圖77B示出的這個步驟中，將所述保護框4060凸起地設置於所述感光晶片4010的感光區域的外周側。優選地，所述保護框4060的上部被設有一保護膜4090，以便於通過真空吸附的方式吸取所述保護框4060和將所述保護框4060貼裝於所述感光晶片4010的感光區域的外周側。本領域的技術人員可以理解的是，當所述保護框4060被設置於所述感光晶片4010的感光區域的外周側之後，所述保護膜4090對應地覆蓋於所述感光晶片4010的感光區域的上部，以藉由所述保護膜4090和所述保護框4060隔離所述感光晶片4010的感光區域和外部環境，從而在後續防止所述成形材料流動到所述感光晶片4010的感光區域。 In this step shown in FIG. 77B , the protective frame 4060 is disposed on the outer peripheral side of the photosensitive area of the photosensitive wafer 4010 so as to be convex. Preferably, a protective film 4090 is provided on the upper part of the protective frame 4060 so as to absorb the protective frame 4060 by vacuum suction and attach the protective frame 4060 to the outer periphery of the photosensitive area of the photosensitive wafer 4010 side. Those skilled in the art can understand that, after the protective frame 4060 is disposed on the outer peripheral side of the photosensitive area of the photosensitive wafer 4010 , the protective film 4090 correspondingly covers the photosensitive area of the photosensitive wafer 4010 . The upper part is used to isolate the photosensitive area of the photosensitive wafer 4010 from the external environment by the protective film 4090 and the protective frame 4060 , so as to prevent the molding material from flowing to the photosensitive area of the photosensitive wafer 4010 later.

在圖77C示出的這個步驟中，通過所述成型模具40100的所述模具上部40101的內表面施壓於所述保護框4060，以進一步隔離所述感光晶片4010的感光區域和外部環境。 In this step shown in FIG. 77C , the protective frame 4060 is pressed by the inner surface of the mold upper part 40101 of the forming mold 40100 to further isolate the photosensitive area of the photosensitive wafer 4010 from the external environment.

在圖77D示出的這個步驟中，將所述成形材料加入所述成型模具40101中，在所述成形材料固化後形成所述一體封裝支架4060，其中所述一體封裝支架4050包裹所述線路板4070和所述感光晶片4010的非感光區域，以使所述一體封裝支架4050、所述線路板4070和所述感光晶片4010結合為一體。優選地，所述一體封裝支架4050進一步包裹所述保護框4060的外周側，以使所述一 體封裝支架4050、所述線路板4070、所述保護框4060和所述感光晶片4010結合為一體。在將所述成型模具40101移離之後，可以得到如圖77E示出的一體結合的一體封裝支架4050、所述線路板4070、所述保護框4060和所述感光晶片4010，其中所述保護膜4090仍然被設置於所述保護框4060。 In this step shown in FIG. 77D , the molding material is added into the molding die 40101, and the integrated packaging bracket 4060 is formed after the molding material is cured, wherein the integrated packaging bracket 4050 wraps the circuit board 4070 and the non-photosensitive area of the photosensitive wafer 4010, so that the integrated packaging bracket 4050, the circuit board 4070 and the photosensitive wafer 4010 are integrated into one. Preferably, the integrated packaging bracket 4050 further wraps the outer peripheral side of the protection frame 4060, so that the one The body packaging bracket 4050 , the circuit board 4070 , the protection frame 4060 and the photosensitive chip 4010 are integrated into one. After the forming mold 40101 is removed, an integrated package bracket 4050, the circuit board 4070, the protective frame 4060 and the photosensitive wafer 4010 can be obtained as shown in FIG. 77E, wherein the protective film 4090 is still set to the protection frame 4060.

在圖77F示出的這個步驟中，將所述保護膜4090從所述保護框4060上移除，以得到一體結合的一體封裝支架4050、所述線路板4070、所述保護框4060和所述感光晶片4010。 In this step shown in FIG. 77F , the protective film 4090 is removed from the protective frame 4060 to obtain an integrated package bracket 4050 , the circuit board 4070 , the protective frame 4060 and the Photosensitive wafer 4010.

在圖77G中示出的這個步驟中，將所述濾光元件4020和所述光學鏡頭4030分別設置於所述感光晶片4010的感光路徑，以制得所述攝像模組。 In this step shown in FIG. 77G , the filter element 4020 and the optical lens 4030 are respectively disposed on the photosensitive path of the photosensitive wafer 4010 to manufacture the camera module.

根據說明書附圖之圖78至圖80G，依本發明的另一優選實施例的所述攝像模組被闡明，其中所述攝像模組包括至少一光學鏡頭4030A、至少一感光晶片4010A、至少一保護框4060A、至少一線路板4070A、至少一一體封裝支架4050A以及至少一濾光元件4020A，其中所述感光晶片4010A和所述線路板4070A被導通連接，所述濾光元件4020A被重疊地設置於所述感光晶片4010A，所述保護框4060A被設置於所述濾光元件4020A的外周邊，以使所述保護框4060A沒有遮擋所述感光晶片4010A的感光區域，所述一體封裝支架4050A被設置包裹所述線路板4070A和所述濾光元件4020A的外周邊，以使所述一體封裝支架4050A、所述濾光元件4020A、所述感光晶片4010A和所述線路板4070A一體結合，其中所述光學鏡頭4030A被設置於所述感光晶片4010A的感光路徑。被物體反射的光線通過所述光學鏡頭4030A被彙聚到所述攝像模組的內部，以進一步被所述感光晶片4010A接收和進行光電轉化而生成與物體相關的圖像。 78 to 80G of the accompanying drawings, the camera module according to another preferred embodiment of the present invention is illustrated, wherein the camera module includes at least one optical lens 4030A, at least one photosensitive chip 4010A, at least one A protective frame 4060A, at least one circuit board 4070A, at least one integrated packaging bracket 4050A, and at least one filter element 4020A, wherein the photosensitive chip 4010A and the circuit board 4070A are electrically connected, and the filter element 4020A is overlapped Set on the photosensitive chip 4010A, the protective frame 4060A is set on the outer periphery of the filter element 4020A, so that the protective frame 4060A does not block the photosensitive area of the photosensitive chip 4010A, the integrated packaging bracket 4050A It is set to wrap the outer periphery of the circuit board 4070A and the filter element 4020A, so that the integrated packaging bracket 4050A, the filter element 4020A, the photosensitive wafer 4010A and the circuit board 4070A are integrated into one body, wherein The optical lens 4030A is disposed on the photosensitive path of the photosensitive wafer 4010A. The light reflected by the object is collected into the interior of the camera module through the optical lens 4030A to be further received by the photosensitive wafer 4010A and photoelectrically converted to generate an image related to the object.

優選地，所述一體封裝支架4050A在成型時包裹所述線路板4070A和所述濾光元件4020A的外周邊，以使所述一體封裝支架4050A、所述濾光元件4020A、所述感光晶片4010A和所述線路板4070A一體結合。 Preferably, the integrated packaging bracket 4050A wraps the outer periphery of the circuit board 4070A and the filter element 4020A during molding, so that the integrated packaging bracket 4050A, the filter element 4020A, the photosensitive wafer 4010A It is integrated with the circuit board 4070A.

更優選地，所述一體封裝支架4050A進一步包裹所述保護框4060A的外側邊，以使所述一體封裝支架4050A、所述濾光元件4020A、所述感光晶片4010A、所述線路板4070A和所述保護框4060A一體結合。 More preferably, the integrated packaging bracket 4050A further wraps the outer side of the protection frame 4060A, so that the integrated packaging bracket 4050A, the filter element 4020A, the photosensitive chip 4010A, the circuit board 4070A and the The protection frame 4060A is integrally combined.

所述保護框4060A被凸起地設置於所述濾光元件4020A的外周邊，從而在後續當一成型模具40100A的模具上部40101A的內表面施壓於所述保護框4060A時，所述模具上部40101A的內表面不會與所述濾光元件4020A的表面接觸，從而防止所述模具上部40101A的內表面損壞或者刮傷所述濾光元件4020A。也就是說，被凸起地設置於所述濾光元件4020A的外周邊的所述保護框4060A，使所述濾光元件4020A的表面與所述模具上部40101A的內表面形成安全距離，以防止所述模具上部40101A的內表面損壞或者刮傷所述濾光元件4020A。 The protective frame 4060A is protruded on the outer periphery of the filter element 4020A, so that when the inner surface of the upper mold portion 40101A of a molding mold 40100A is pressed against the protective frame 4060A, the upper portion of the mold The inner surface of 40101A does not come into contact with the surface of the filter element 4020A, thereby preventing the inner surface of the mold upper portion 40101A from damaging or scratching the filter element 4020A. That is to say, the protective frame 4060A, which is protrudingly disposed on the outer periphery of the filter element 4020A, forms a safe distance between the surface of the filter element 4020A and the inner surface of the upper part of the mold 40101A to prevent The inner surface of the mold upper portion 40101A damages or scratches the filter element 4020A.

進一步地，所述攝像模組包括至少一鏡頭支撐體4040A，其中所述鏡頭支撐體4040A被設置於所述一體封裝支架4050A的上部，所述光學鏡頭4030A被設置於所述鏡頭支撐體4040A，以藉由所述鏡頭支撐體4040A使所述光學鏡頭4030A被保持在所述感光晶片4010A的感光路徑。 Further, the camera module includes at least one lens support body 4040A, wherein the lens support body 4040A is arranged on the upper part of the integrated packaging bracket 4050A, and the optical lens 4030A is arranged on the lens support body 4040A, The optical lens 4030A is held in the photosensitive path of the photosensitive wafer 4010A by the lens support 4040A.

在本發明的所述攝像模組的一個具體的示例中，所述鏡頭支撐體4040A在成型後被設置於所述一體封裝支架4050A的上部。在本發明的所述攝像模組的另一個具體的示例中，所述鏡頭支撐體4040A可以與所述一體封裝支架4050A一體地成型，通過這樣的方式，能夠降低所述攝像模組的封裝誤差，以有利於提高所述攝像模組的成像品質。 In a specific example of the camera module of the present invention, the lens support body 4040A is disposed on the upper part of the integrated packaging bracket 4050A after being formed. In another specific example of the camera module of the present invention, the lens support body 4040A can be integrally formed with the integrated packaging bracket 4050A, and in this way, the packaging error of the camera module can be reduced , so as to improve the imaging quality of the camera module.

優選地，所述鏡頭支撐體4040A可以被實施為一馬達，也就是說，所述光學鏡頭4030A被可操作地設置於所述鏡頭支撐體4040A，以通過所述鏡頭支撐體4040A驅動所述光學鏡頭4030A沿著所述感光晶片4010A的感光路徑來回移動，從而通過改變所述光學鏡頭4030A與所述感光晶片4010A之間的 位置來調整所述攝像模組的焦距。值得一提的是，所述鏡頭支撐體4040A可以是各種驅動器，以供驅動所述光學鏡頭4030A沿著所述感光晶片4010A的感光路徑來回移動，例如在本發明的這個優選的實施例中，所述鏡頭支撐體4040A可以被實施為音圈馬達。 Preferably, the lens support 4040A can be implemented as a motor, that is, the optical lens 4030A is operably disposed on the lens support 4040A to drive the optical lens through the lens support 4040A The lens 4030A moves back and forth along the photosensitive path of the photosensitive wafer 4010A, thereby changing the distance between the optical lens 4030A and the photosensitive wafer 4010A. position to adjust the focal length of the camera module. It is worth mentioning that the lens support body 4040A can be various drivers for driving the optical lens 4030A to move back and forth along the photosensitive path of the photosensitive wafer 4010A. For example, in this preferred embodiment of the present invention, The lens support 4040A may be implemented as a voice coil motor.

本領域的技術人員可以理解的是，當所述鏡頭支撐體4040A被實施為馬達時，所述鏡頭支撐體4040A與所述線路板4070A被導通連接。 Those skilled in the art can understand that when the lens support body 4040A is implemented as a motor, the lens support body 4040A and the circuit board 4070A are electrically connected.

如圖80A至圖80G所示是本發明的所述攝像模組的一製造過程的示意圖。在圖80A示出的這個步驟中，所述感光晶片4010A被導通連接所述線路板4070A，與本發明的上述優選實施例相似，所述感光晶片4010A和所述線路板4070A被導通連接的方式不受限制。 80A to 80G are schematic diagrams of a manufacturing process of the camera module of the present invention. In this step shown in FIG. 80A , the photosensitive wafer 4010A is electrically connected to the circuit board 4070A. Similar to the above-mentioned preferred embodiment of the present invention, the photosensitive wafer 4010A and the circuit board 4070A are electrically connected to each other. Unrestricted.

在圖80B示出的這個步驟中，將所述濾光元件4020A重疊地設置於所述感光晶片4010A。本領域的技術人員可以理解的是，將所述濾光元件4020A和所述感光晶片4010A重疊設置的方式能夠減少所述攝像模組的後焦焦距，從而有利於所述攝像模組的小型化，以便於使所述攝像模組被應用於追求輕薄化的電子設備。 In this step shown in FIG. 80B , the filter element 4020A is disposed on the photosensitive wafer 4010A in an overlapping manner. Those skilled in the art can understand that the overlapping arrangement of the filter element 4020A and the photosensitive wafer 4010A can reduce the back focal length of the camera module, thereby facilitating the miniaturization of the camera module , so that the camera module can be applied to electronic devices that pursue thinning.

在步驟80C示出的這個步驟中，將所述保護框4060A放置於所述濾光元件4020A的外周邊，其中所述保護框4060A不會遮擋所述感光晶片4010A的感光區域。本領域的技術人員可以理解的是，在所述保護框4060A被提供後，可以通過一膠合層4080A將所述保護框4060A設置於所述濾光元件4020A的外周邊。也就是說，被設置於所述保護框4060A和所述濾光元件4020A之間的所述膠合層4080A用於連接所述保護框4060A和所述濾光元件4020A。 In this step shown in step 80C, the protective frame 4060A is placed on the outer periphery of the filter element 4020A, wherein the protective frame 4060A will not block the photosensitive area of the photosensitive wafer 4010A. Those skilled in the art can understand that, after the protective frame 4060A is provided, the protective frame 4060A can be disposed on the outer periphery of the filter element 4020A through an adhesive layer 4080A. That is, the adhesive layer 4080A disposed between the protection frame 4060A and the filter element 4020A is used to connect the protection frame 4060A and the filter element 4020A.

在圖80D示出的這個步驟中，通過所述模具上部40101A的內表面施壓於所述保護框4060A，以隔離所述濾光元件4020A的內部區域和外周邊，其中所述濾光元件4020A的內部區域的尺寸大於或者等於所述感光晶片 4010A的感光區域，以防止所述保護框4060A遮擋所述感光晶片4010A的感光區域。本領域的技術人員可以理解的是，所述保護框4060A被凸起地設置於所述濾光元件4020A的外周邊，從而當所述模具上部40101A的內表面施壓於所述保護框4060A時，所述保護框4060A能夠阻止所述模具上部40101A的內表面與所述濾光元件4020A的感光區域接觸，從而所述保護框4060A能夠阻止所述模具上部40101A的內表面損壞或者刮傷所述濾光元件4020A的內部區域。 In this step shown in FIG. 80D, pressure is applied to the protective frame 4060A through the inner surface of the upper mold portion 40101A to isolate the inner region and the outer periphery of the filter element 4020A, wherein the filter element 4020A The size of the inner region is greater than or equal to the photosensitive wafer 4010A to prevent the protective frame 4060A from blocking the photosensitive area of the photosensitive wafer 4010A. Those skilled in the art can understand that the protective frame 4060A is protrudingly disposed on the outer periphery of the filter element 4020A, so that when the inner surface of the upper mold portion 40101A presses the protective frame 4060A , the protective frame 4060A can prevent the inner surface of the upper mold 40101A from contacting the photosensitive area of the filter element 4020A, so that the protective frame 4060A can prevent the inner surface of the upper mold 40101A from being damaged or scratched The inner region of filter element 4020A.

優選地，所述保護框4060A具有彈性，從而當所述模具上部40101A的內表面施壓於所述保護框4060A時，所述保護框4060A能夠起到緩衝作用，以防止所述模具上部40101A產生的壓力損壞所述濾光元件4020A。 Preferably, the protective frame 4060A has elasticity, so that when the inner surface of the upper mold portion 40101A is pressed against the protective frame 4060A, the protective frame 4060A can play a buffering role to prevent the upper mold portion 40101A from producing The pressure damages the filter element 4020A.

在圖80E示出的這個步驟中，將所述成形材料加入到所述模具上部40101A中，在所述成形材料固化後形成所所述一體封裝支架4050A，其中所述一體封裝支架4050A包裹所述線路板4070A和所述濾光元件4020A的外周邊，以使所述一體封裝支架4050A、所述線路板4070A、所述感光晶片4010A和所述濾光元件4020A結合為一體。優選地，所述一體封裝支架4050A進一步包裹所述保護框4060A的外周側，以使所述一體封裝支架4050A、所述線路板4070A、所述保護框4060A、所述感光晶片4010A和所述濾光元件4020A結合為一體。值得一提的是，所述成形材料是流質或者顆粒狀。在將所述成型模具40100A移離之後，可以得到如圖80F示出的一體結合的所述一體封裝支架4050A、所述線路板4070A、所述保護框4060A、所述感光晶片4010A和所述濾光元件4020A。 In this step shown in FIG. 80E, the molding material is added to the upper part 40101A of the mold, and the integral packaging bracket 4050A is formed after the molding material is cured, wherein the integral packaging bracket 4050A wraps the The outer periphery of the circuit board 4070A and the filter element 4020A, so that the integrated packaging bracket 4050A, the circuit board 4070A, the photosensitive wafer 4010A and the filter element 4020A are integrated into one. Preferably, the integrated packaging bracket 4050A further wraps the outer peripheral side of the protection frame 4060A, so that the integrated packaging bracket 4050A, the circuit board 4070A, the protection frame 4060A, the photosensitive wafer 4010A and the filter The light element 4020A is integrated into one. It is worth mentioning that the forming material is fluid or granular. After the forming mold 40100A is removed, the integrated package bracket 4050A, the circuit board 4070A, the protection frame 4060A, the photosensitive wafer 4010A and the filter can be obtained as shown in FIG. 80F . Optical element 4020A.

本領域的技術人員可以理解的是，所述濾光元件4020A的內部區域和外周邊被隔離，從而當所述成形材料被加入到所述模具上部40101A後，所述成形材料不會流動到所述濾光元件4020A的內部區域，從而所述保護框4060A能夠阻止所述成形材料損壞所述濾光元件4020A的內部區域。另外，所述保護框4060A具有彈性，以使所述保護框4060A和施壓於所述保護框4060A的 所述模具上部40101A之間沒有縫隙，因此，在被加入所述模具上部40101A的所述成形材料固化的過程中不會出現“飛邊”的現象，以保證所述攝像模組的成像品質。 It will be understood by those skilled in the art that the inner region and outer perimeter of the filter element 4020A are isolated so that when the forming material is added to the upper mold portion 40101A, the forming material does not flow to all the inner area of the filter element 4020A, so that the protective frame 4060A can prevent the molding material from damaging the inner area of the filter element 4020A. In addition, the protection frame 4060A has elasticity, so that the protection frame 4060A and the pressure on the protection frame 4060A There is no gap between the upper parts of the mold 40101A, so there is no "flash" phenomenon during the curing process of the molding material added to the upper part of the mold 40101A, so as to ensure the imaging quality of the camera module.

在圖80G示出的這個步驟中，將所述濾光元件4020A和所述光學鏡頭4030A分別設置於所述感光晶片4010A的感光路徑，以制得所述攝像模組。 In this step shown in FIG. 80G , the filter element 4020A and the optical lens 4030A are respectively disposed on the photosensitive paths of the photosensitive wafer 4010A to manufacture the camera module.

進一步地，本發明還提供一攝像模組的製造方法，其中所述製造方法包括如下步驟：將至少一感光晶片4010和至少一線路板4070導通連接；提供至少一保護框4060，其中所述保護框4060被設置於所述感光晶片4010的感光區域的外周側；通過一成型模具40100的模具上部40101的內表面施壓於所述保護框4060，以隔離所述感光晶片4010的感光區域和非感光區域；藉由被加入所述成型模具40100的成形材料包裹所述線路板4070和所述感光晶片4010的非感光區域，以在所述成形材料固化後形成與所述感光晶片4010和所述線路板4070一體結合的一一體封裝支架4050；以及提供至少一光學鏡頭4030，其中所述光學鏡頭4030被設置於所述感光晶片4010的感光路徑，以製成所述攝像模組。 Further, the present invention also provides a manufacturing method of a camera module, wherein the manufacturing method includes the following steps: connecting at least one photosensitive chip 4010 and at least one circuit board 4070 in a conductive manner; providing at least one protection frame 4060, wherein the protection The frame 4060 is arranged on the outer peripheral side of the photosensitive area of the photosensitive wafer 4010; the inner surface of the upper mold 40101 of a molding die 40100 is pressed against the protective frame 4060 to isolate the photosensitive area of the photosensitive wafer 4010 from the non-photosensitive area. Photosensitive area; wrap the circuit board 4070 and the non-photosensitive area of the photosensitive wafer 4010 by the molding material added to the molding die 40100 to form the photosensitive wafer 4010 and the photosensitive wafer 4010 after the molding material is cured The circuit board 4070 is integrated with an integrated package bracket 4050; and at least one optical lens 4030 is provided, wherein the optical lens 4030 is disposed on the photosensitive path of the photosensitive chip 4010 to form the camera module.

更進一步地，本發明還提供給一攝像模組的製造方法，其中所述製造方法包括如下步驟：將至少一感光晶片4010和至少一線路板4070導通連接；將一濾光元件4020疊合於所述感光晶片；提供至少一保護框4060，其中所述保護框4060被設置於所述濾光元件4020的外周側； 通過一成型模具40100的模具上部40101的內表面施壓於所述保護框4060，以隔離所述濾光元件4020的內部區域和外周側；藉由被加入所述成型模具40100的成形材料包裹所述線路板4070和所述濾光元件4020的外周側，以在所述成形材料固化後形成與所述濾光元件4020、所述感光晶片4010和所述線路板4070一體結合的一一體封裝支架4050；以及提供至少一光學鏡頭4030，其中所述光學鏡頭4030被設置於所述感光晶片4010的感光路徑，以製成所述攝像模組。 Further, the present invention also provides a manufacturing method of a camera module, wherein the manufacturing method includes the following steps: connecting at least one photosensitive chip 4010 and at least one circuit board 4070 in a conductive manner; superimposing a filter element 4020 on the the photosensitive wafer; provide at least one protective frame 4060, wherein the protective frame 4060 is arranged on the outer peripheral side of the filter element 4020; The protective frame 4060 is pressed by the inner surface of the upper part 40101 of a molding mold 40100 to isolate the inner region and the outer peripheral side of the filter element 4020; the peripheral side of the circuit board 4070 and the filter element 4020 to form an integrated package integrated with the filter element 4020, the photosensitive wafer 4010 and the circuit board 4070 after the molding material is cured A bracket 4050; and at least one optical lens 4030 is provided, wherein the optical lens 4030 is disposed on the photosensitive path of the photosensitive chip 4010 to form the camera module.

如圖81至圖89所示，是根據本發明的一個優選實施例的感光元件和攝像模組。所述感光元件5010包括一線路板主體5011、一感光晶片5012和一連接介質5013。 As shown in Figures 81 to 89, it is a photosensitive element and a camera module according to a preferred embodiment of the present invention. The photosensitive element 5010 includes a circuit board body 5011 , a photosensitive wafer 5012 and a connection medium 5013 .

所述感光晶片5012通過所述連接介質5013被貼附於所述線路板主體5011。 The photosensitive wafer 5012 is attached to the circuit board main body 5011 through the connection medium 5013 .

所述感光晶片5012具有一正面50121和一背面50122。所述正面50121朝向外側，即與所述線路板主體5011相背的方向，所述正面50121用於感光。所述背面50122朝向所述線路板主體5011方向，所述連接介質5013被設置於所述感光晶片5012的所述背面50122和所述線路板主體5011之間，將所述感光晶片5012固定於所述線路板主體5011。 The photosensitive wafer 5012 has a front side 50121 and a back side 50122 . The front surface 50121 faces the outside, that is, the direction opposite to the main body 5011 of the circuit board, and the front surface 50121 is used for light-sensing. The back side 50122 faces the direction of the circuit board main body 5011, and the connection medium 5013 is disposed between the back side 50122 of the photosensitive wafer 5012 and the circuit board main body 5011, and the photosensitive wafer 5012 is fixed to the circuit board body 5011. The circuit board main body 5011 is described.

值得一提的是，所述連接介質5013的形狀和所述感光晶片5012相匹配，從而使得所述感光晶片5012穩定地、平整地貼附於所述線路板主體5011。不同于傳統的D/A貼附方式得到的所述晶片的所述線路板，由前述可知，參照圖81A、81B，傳統的D/A方式得到的所述晶片501P和所述線路板502P，通常在所述線路板2P和所述晶片501P之間存在所述懸空區域4P，使得所述晶片501P粘接不穩定、平整性較差，且容易出現傾斜。而根據本發明的優選 實施例，所述連接介質5013均勻地分佈於所述感光晶片5012和所述線路板主體5011之間，使得所述感光晶片5012背面50122和所述線路板主體5011之間的區域被所述連接介質5013充分地填充，提升了所述連接介質5013的覆蓋面積，不存在所述懸空區域，從而使得所述感光晶片5012平整、穩定地連接於所述線路板主體5011。 It is worth mentioning that the shape of the connection medium 5013 matches the photosensitive wafer 5012 , so that the photosensitive wafer 5012 is stably and flatly attached to the circuit board main body 5011 . Different from the circuit board of the wafer obtained by the traditional D/A attachment method, as can be seen from the foregoing, referring to FIGS. 81A and 81B , the wafer 501P and the circuit board 502P obtained by the traditional D/A method, Usually, the floating area 4P exists between the circuit board 2P and the wafer 501P, so that the wafer 501P is unstable in adhesion, poor in flatness, and prone to tilt. According to the preferred In an embodiment, the connection medium 5013 is evenly distributed between the photosensitive wafer 5012 and the circuit board body 5011, so that the area between the back surface 50122 of the photosensitive wafer 5012 and the circuit board body 5011 is connected by the connection The medium 5013 is sufficiently filled, which increases the coverage area of the connecting medium 5013 and does not have the floating area, so that the photosensitive wafer 5012 is connected to the circuit board main body 5011 flatly and stably.

根據本發明的這個實施例，具體地，所述連接介質5013為UV膠膜、熱固膠膜或UV熱固膠膜中的其中一種。 According to this embodiment of the present invention, specifically, the connection medium 5013 is one of a UV adhesive film, a thermosetting adhesive film or a UV thermosetting adhesive film.

根據本發明的這個實施例，所述感光元件5010包括至少一連接線5014，各所述連接線5014電連接所述感光晶片5012和所述線路板主體5011。所述連接線5014可以為，舉例地但不限於，金線、銀線、銅線、鋁線。也就是說，通過各所述連接線5014使得所述感光晶片5012和所述線路板主體5011電信號連通，當所述感光晶片5012進行感光時，將光信號轉變為電信號，通過連接線5014所述電信號傳遞至所述線路板主體5011。 According to this embodiment of the present invention, the photosensitive element 5010 includes at least one connection line 5014 , and each of the connection lines 5014 is electrically connected to the photosensitive wafer 5012 and the circuit board main body 5011 . The connecting wire 5014 can be, for example but not limited to, gold wire, silver wire, copper wire, and aluminum wire. That is to say, the light-sensitive wafer 5012 and the circuit board main body 5011 are connected with electrical signals through each of the connecting wires 5014 . The electrical signal is transmitted to the circuit board body 5011 .

參照圖83和圖84所示，所述感光元件5010的第一種製造過程示意。在這種製造方法中，在製造所述感光元件5010時，先在所述感光晶片5012的所述背面50122附著一層所述連接介質5013，使得所述連接介質5013貼附於所述感光晶片5012的所述背面50122。其中所述附著方式可以通過噴塗、旋塗、滾刷或印刷等方式實現。所述連接介質5013可以為UV膠膜、熱固膠膜或UV熱固膠膜中的其中一種。 Referring to FIG. 83 and FIG. 84 , the first manufacturing process of the photosensitive element 5010 is illustrated. In this manufacturing method, when manufacturing the photosensitive element 5010, a layer of the connection medium 5013 is first attached to the back surface 50122 of the photosensitive wafer 5012, so that the connection medium 5013 is attached to the photosensitive wafer 5012 of the back 50122. The attachment method can be realized by spraying, spin coating, rolling or printing. The connecting medium 5013 may be one of UV adhesive film, thermosetting adhesive film or UV thermosetting adhesive film.

進而通過UV的方式或熱固的方式使得所述連接介質5013呈半固化狀態，使得所述連接介質5013的形狀不易變化。UV方式，即紫外照射方式。熱固的方式，即加熱固化的方式。 Furthermore, the connection medium 5013 is in a semi-cured state by means of UV or thermosetting, so that the shape of the connection medium 5013 is not easily changed. UV method, that is, ultraviolet irradiation method. The way of thermosetting, that is, the way of heat curing.

值得一提的是，在獲取所述感光晶片5012時，通常是對一晶圓片50130進行切分而得到，因此，為了進行切割工藝，需要在所述連接介質 5013上貼附一切割膜50140，進一步，對帶有所述連接介質5013和所述切割膜50140的所述晶圓片50130進行裁切，使得所述晶圓片50130形成多個所述感光晶片5012，也就是說，通過裁切的方式裁剪所述晶圓片50130，使得所述連接介質5013和所述感光晶片5012的形狀一致。 It is worth mentioning that when obtaining the photosensitive wafer 5012, it is usually obtained by slicing a wafer 50130. Therefore, in order to perform the slicing process, the connection medium needs to be A dicing film 50140 is attached on the 5013, and further, the wafer 50130 with the connecting medium 5013 and the dicing film 50140 is cut, so that the wafer 50130 forms a plurality of the photosensitive chips 5012, that is, cutting the wafer 50130 by cutting, so that the shape of the connection medium 5013 and the photosensitive wafer 5012 are consistent.

進一步，將所述切割膜50140去除，將帶有所述連接介質5013的所述感光晶片5012貼附於所述線路板主體5011，也就是說，通過所述連接介質5013將所述感光晶片5012和所述線路板主體5011相連接固定，並且通過按壓、加熱或烘烤工藝使得所述連接介質5013進行固化，從而使得所述感光晶片5012與所述線路板主體5011穩定連接。特別地，在本發明的一實施例中，在所述感光晶片5012貼附於所述線路板主體5011之前，還包括對所述感光晶片5012的清洗步驟，即，清洗所述感光晶片5012，除去所述感光晶片5012上沾染的灰塵。 Further, the dicing film 50140 is removed, and the photosensitive wafer 5012 with the connection medium 5013 is attached to the circuit board main body 5011 , that is, the photosensitive wafer 5012 is attached to the circuit board body 5011 through the connection medium 5013 . The circuit board body 5011 is connected and fixed, and the connection medium 5013 is cured by pressing, heating or baking, so that the photosensitive wafer 5012 is stably connected to the circuit board body 5011 . In particular, in an embodiment of the present invention, before the photosensitive wafer 5012 is attached to the circuit board body 5011, a cleaning step of the photosensitive wafer 5012 is further included, that is, cleaning the photosensitive wafer 5012, The dust contaminated on the photosensitive wafer 5012 is removed.

值得一提的是，在本發明的另一種實施方式，在所述感光晶片5012形成的過程中，可以將所述切割膜50140貼附於所述晶圓片50130的正面，從而方便將所述晶圓片50130切割為多個所述感光晶片5012。在切割後，將所述切割膜50140去除，從而得到所述感光晶片5012。也就是說，所述切割膜50140可以被設置於所述晶圓片50130的正面和/或背面，本領域的技術人員應當理解的是，所述切割膜50140的設置位置，並不是本發明的限制。 It is worth mentioning that, in another embodiment of the present invention, in the process of forming the photosensitive wafer 5012, the dicing film 50140 can be attached to the front surface of the wafer 50130, so as to facilitate the The wafer 50130 is cut into a plurality of the photosensitive wafers 5012 . After dicing, the dicing film 50140 is removed to obtain the photosensitive wafer 5012 . That is to say, the dicing film 50140 can be disposed on the front and/or back of the wafer 50130, and those skilled in the art should understand that the location of the dicing film 50140 is not a function of the present invention limit.

進一步，設置各所述連接線5014於所述感光晶片5012和所述線路板主體5011，使得所述感光晶片5012和所述線路板主體5011可通電連接。比如，通過W/B(Wired/Bond，晶片邦定)工藝，在所述感光晶片5012和所述線路板主體5011上打金線。 Further, each of the connecting wires 5014 is arranged on the photosensitive wafer 5012 and the circuit board body 5011 , so that the photosensitive wafer 5012 and the circuit board body 5011 can be electrically connected. For example, gold wires are printed on the photosensitive wafer 5012 and the circuit board main body 5011 through a W/B (Wired/Bond, wafer bonding) process.

值得一提的是，傳統的D/A方式中，通常在所述線路板502P表面進行點膠，而後將所述晶片501P直接放置於點膠區域，通過按壓的作用，使得膠水擴展，因此膠體503P的形狀存在極大的不確定性，也就是說，可能分佈不 均勻，且不易控制。而根據本發明的優選實施例，所述連接介質5013被貼附於所述感光晶片5012的所述背面50122，並且使得所述連接介質5013均勻分佈於所述感光晶片5012的所述背面50122，以連續面的形式存在，而非離散點或線段的形式存在，保證所述感光晶片5012和所述線路板主體5011的連接平整性。進一步，所述感光晶片5012在貼附於所述線路板主體5011之前，以半固態的形式存在，自身形狀相對確定，因此當所述感光晶片5012通過所述連接介質5013貼附於所述線路板主體5011時，所述連接介質5013的形狀變化較小，對所述感光晶片5012和所述線路板的連接平整性影響較小，比如所述感光晶片5012的平整度可達到2μm。此外，根據本發明的優選實施例，提升了所述連接介質5013對所述感光晶片5012的背面50122的覆蓋面積，避免周圍出現所述懸空區4P，因此降低了W/B作業晶片受損的風險，也就是說，更易於設置所述連接線5014於所述感光晶片5012和所述線路板主體5011。 It is worth mentioning that, in the traditional D/A method, glue is usually dispensed on the surface of the circuit board 502P, and then the wafer 501P is directly placed in the dispensing area. The shape of 503P is subject to great uncertainty, that is, the distribution may not be Uniform and difficult to control. According to a preferred embodiment of the present invention, the connection medium 5013 is attached to the back surface 50122 of the photosensitive wafer 5012, and the connection medium 5013 is uniformly distributed on the back surface 50122 of the photosensitive wafer 5012, Existing in the form of a continuous surface, rather than in the form of discrete points or line segments, ensures the smoothness of the connection between the photosensitive wafer 5012 and the circuit board main body 5011 . Further, before the photosensitive wafer 5012 is attached to the circuit board main body 5011, it exists in a semi-solid form, and its shape is relatively determined. Therefore, when the photosensitive wafer 5012 is attached to the circuit through the connection medium 5013 When the board body 5011 is used, the shape of the connection medium 5013 changes little, and has little effect on the connection flatness of the photosensitive wafer 5012 and the circuit board. For example, the flatness of the photosensitive wafer 5012 can reach 2 μm. In addition, according to the preferred embodiment of the present invention, the coverage area of the connection medium 5013 on the back surface 50122 of the photosensitive wafer 5012 is increased, so as to avoid the floating area 4P around, thereby reducing the damage to the wafer during W/B operation. Risk, that is, it is easier to set the connecting wires 5014 on the photosensitive wafer 5012 and the circuit board body 5011 .

相應地，本發明提供一感光元件的製造方法1000，其包括步驟：1100：附著一半固態的連接介質5013於一感光晶片5012的背面50122：1200：通過所述連接介質5013貼附所述感光晶片5012於一線路板主體5011；1300：固化所述連接介質5013，使得所述感光晶片5012和所述線路板主體5011平整、穩定連接；和1400：設置至少一連接線5014於所述感光晶片5012和所述線路板主體5011，使得所述感光晶片5012和所述線路板主體5011可通電連接。 Correspondingly, the present invention provides a manufacturing method 1000 of a photosensitive element, which includes steps: 1100 : attaching a semi-solid connection medium 5013 to the back of a photosensitive wafer 5012 50122 : 1200 : attaching the photosensitive wafer through the connection medium 5013 5012 on a circuit board body 5011; 1300: curing the connection medium 5013, so that the photosensitive chip 5012 and the circuit board body 5011 are connected flatly and stably; and 1400: at least one connecting line 5014 is provided on the photosensitive chip 5012 and the circuit board body 5011, so that the photosensitive wafer 5012 and the circuit board body 5011 can be electrically connected.

其中所述步驟1100進一步可以分解為：1110：附著所述連接介質5013於一晶圓片50130的背面50122； 1120：附著一切割膜50140於所述連接介質5013的外側；1130：半固化所述連接介質5013；和1140：切割所述晶圓片50130，獲得帶有半固態所述連接介質5013的所述感光晶片5012。 The step 1100 can be further decomposed into: 1110: attaching the connection medium 5013 to the back surface 50122 of a wafer 50130; 1120: attach a dicing film 50140 to the outside of the connecting medium 5013; 1130: semi-solidify the connecting medium 5013; and 1140: cut the wafer 50130 to obtain the semi-solid connecting medium 5013 Photosensitive wafer 5012.

所述步驟1110、1120、1130和1140適合應用於批量化生產所述感光元件5010，當單獨提供所述感光晶片5012而用於製造所述感光元件5010時，可以在所述感光晶片5012的所述背面50122附著所述連接介質5013，而後對所述連接介質5013進行半固化，進一步，將所述感光晶片5012通過所述連接介質5013貼附於所述線路板主體5011。也就是說，所述切割膜50140以及所述裁切過程並不是必須要執行的步驟。當然所述步驟1100中，還可以是，附著一切割膜50140於所述晶圓片50130的正面，而後進行切割所述晶圓片50130。還可以包括步驟，去除所述切割膜50140，比如通過紫外光照的方式的去除。 The steps 1110 , 1120 , 1130 and 1140 are suitable for mass production of the photosensitive element 5010 . When the photosensitive wafer 5012 is provided separately for manufacturing the photosensitive element 5010 , it can be used in all parts of the photosensitive wafer 5012 . The connection medium 5013 is attached to the back surface 50122 , and then the connection medium 5013 is semi-cured. Further, the photosensitive wafer 5012 is attached to the circuit board main body 5011 through the connection medium 5013 . That is to say, the cutting film 50140 and the cutting process are not necessarily steps. Of course, in the step 1100, a dicing film 50140 may also be attached to the front surface of the wafer 50130, and then the wafer 50130 is cut. It may also include a step of removing the dicing film 50140, such as removal by means of ultraviolet light.

在所述步驟1110中的附著方式，可以為噴塗、旋塗、滾刷或印刷中的其中一種。所述連接介質5013為UV膠膜、熱固膠膜或UV熱固膠膜中的其中一種。 The attachment method in the step 1110 may be one of spray coating, spin coating, roller brushing or printing. The connecting medium 5013 is one of UV adhesive film, thermosetting adhesive film or UV thermosetting adhesive film.

所述步驟1130中的半固化過程可以通過紫外照射、加熱等方式實現。 The semi-curing process in the step 1130 may be implemented by means of ultraviolet irradiation, heating, or the like.

所述步驟1200中包括步驟1210：清洗所述感光晶片5012。 The step 1200 includes step 1210 : cleaning the photosensitive wafer 5012 .

所述步驟1300中的固化方式，可以為按壓、加熱或烘烤等方式。 The curing method in the step 1300 may be pressing, heating or baking.

所述步驟1400中的設置方式為打金線的方式。 The setting method in the step 1400 is the method of making gold lines.

值得一提的是，本發明的所述感光元件5010的製造方法適於批量化生產，比如在所述晶圓片50130的背面50122整體附著所述連接介質5013，進而將所述晶圓片50130進行晶元切割，得到多個所述感光晶片5012，進而將 各所述感光晶片5012分別貼附於各所述線路板主體5011，從而一次形成多個所述感光組件5010，提高生產效率。不同于傳統的方式，需要單獨點膠，單獨粘接，效率較低。 It is worth mentioning that the manufacturing method of the photosensitive element 5010 of the present invention is suitable for mass production. For example, the connection medium 5013 is integrally attached to the back surface 50122 of the wafer 50130, and then the wafer 50130 is attached. Die cutting is performed to obtain a plurality of the photosensitive wafers 5012, and then the Each of the photosensitive wafers 5012 is respectively attached to each of the circuit board main bodies 5011 , so as to form a plurality of the photosensitive components 5010 at one time, thereby improving production efficiency. Different from the traditional method, it needs to be dispensed separately and bonded separately, which is less efficient.

參照圖85和圖86所示，所述感光元件5010的第二種製造方法。在這種製造方法中，在製造所述感光元件5010時，先在切割膜50140上附著一層所述連接介質5013，並且對所述連接介質5013進行半固化。所述附著的方式可以為噴塗、旋塗、滾刷或印刷等方式，所述連接介質5013為UV膠膜、熱固膠膜或UV熱固膠膜中的其中一種。特別地，所連接介質5013的形狀為預定形狀，比如和所述感光晶片5012匹配的形狀。 Referring to FIG. 85 and FIG. 86 , the second manufacturing method of the photosensitive element 5010 is shown. In this manufacturing method, when manufacturing the photosensitive element 5010, a layer of the connecting medium 5013 is firstly attached to the dicing film 50140, and the connecting medium 5013 is semi-cured. The attachment method can be spraying, spin coating, rolling or printing, and the connecting medium 5013 is one of UV adhesive film, thermosetting adhesive film or UV thermosetting adhesive film. In particular, the shape of the connected medium 5013 is a predetermined shape, such as a shape matching the photosensitive wafer 5012 .

在通常生產的過程中，所述感光晶片5012的獲得方式通常是對所述晶圓片50130切割而得到，因此將帶有所述連接介質5013的所述切割膜50140貼附於所述晶圓片50130，而後對所述晶圓片50130進行切分，從而得到單獨的所述感光晶片5012，且所述感光晶片5012帶有半固態的所述連接介質5013。 In the usual production process, the photosensitive wafer 5012 is usually obtained by cutting the wafer 50130, so the cutting film 50140 with the connecting medium 5013 is attached to the wafer The wafer 50130 is cut, and then the wafer 50130 is cut to obtain the individual photosensitive wafer 5012, and the photosensitive wafer 5012 has the semi-solid connection medium 5013.

也就是說，借助所述切割膜50140將所述連接介質5013的貼附於所述晶圓片50130的所述背面50122，使得所述連接介質5013連接於感光晶片5012的所述背面50122。特別地，可以通過滾壓的方式將所述晶片貼附於所述晶圓片50130的所述背面50122。 That is, the connection medium 5013 is attached to the backside 50122 of the wafer 50130 by means of the dicing film 50140 , so that the connection medium 5013 is connected to the backside 50122 of the photosensitive wafer 5012 . In particular, the wafer can be attached to the back surface 50122 of the wafer 50130 by rolling.

值得一提的是，在將所述連接介質5013附著於所述切割膜50140之後，需要對所述連接介質5013進行半固化，比如通過UV或熱固定的方式使得所述連接介質5013呈半固化狀態使得所述連接介質5013的形狀不易變化。UV方式，即紫外照射方式。熱固的方式，即加熱固化的方式。 It is worth mentioning that after attaching the connecting medium 5013 to the dicing film 50140, the connecting medium 5013 needs to be semi-cured, for example, by UV or thermal fixing to make the connecting medium 5013 semi-cured The state makes the shape of the connection medium 5013 difficult to change. UV method, that is, ultraviolet irradiation method. The way of thermosetting, that is, the way of heat curing.

進一步，將帶有所述連接介質5013的所述感光晶片5012貼附於所述線路板主體5011，也就是說，通過所述連接介質5013將所述感光晶片5012 和所述線路板主體5011相連接固定，並且通過按壓、加熱或烘烤工藝使得所述連接介質5013進行固化，從而使得所述感光晶片5012與所述線路板主體5011穩定連接。特別地，在本發明的一實施例中，在所述感光晶片5012貼附於所述線路板主體5011之前，還包括對所述感光晶片5012的清洗步驟，除去所述感光晶片5012上沾染的灰塵。 Further, the photosensitive wafer 5012 with the connection medium 5013 is attached to the circuit board main body 5011 , that is, the photosensitive wafer 5012 is attached to the circuit board body 5011 through the connection medium 5013 . The circuit board body 5011 is connected and fixed, and the connection medium 5013 is cured by pressing, heating or baking, so that the photosensitive wafer 5012 is stably connected to the circuit board body 5011 . In particular, in an embodiment of the present invention, before the photosensitive wafer 5012 is attached to the circuit board main body 5011 , a cleaning step of the photosensitive wafer 5012 is further included to remove the contamination on the photosensitive wafer 5012 . dust.

進一步，設置各所述連接線5014於所述感光晶片5012和所述線路板主體5011，使得所述感光晶片5012和所述線路板主體5011可通電連接。 Further, each of the connecting wires 5014 is arranged on the photosensitive wafer 5012 and the circuit board body 5011 , so that the photosensitive wafer 5012 and the circuit board body 5011 can be electrically connected.

相應地，本發明提供一感光元件的製造方法2000，其包括步驟：2100：附著一半固態的連接介質5013於一感光晶片5012的背面50122：2200：通過所述連接介質5013貼附所述感光晶片5012於一線路板主體5011；2300：固化所連接介質5013，使得所述感光晶片5012和所述線路板主體5011平整、穩定地連接；和2400：設置至少一連接線5014於所述感光晶片5012和所述線路板主體5011，使得所述感光晶片5012和所述線路板主體5011可通電連接。 Correspondingly, the present invention provides a manufacturing method 2000 of a photosensitive element, which includes steps: 2100 : attaching a semi-solid connection medium 5013 to the back of a photosensitive wafer 5012 50122 : 2200 : attaching the photosensitive wafer through the connection medium 5013 5012 on a circuit board body 5011; 2300: curing the connected medium 5013, so that the photosensitive chip 5012 and the circuit board body 5011 are connected flatly and stably; and 2400: at least one connecting line 5014 is arranged on the photosensitive chip 5012 and the circuit board body 5011, so that the photosensitive wafer 5012 and the circuit board body 5011 can be electrically connected.

其中所述步驟2100進一步可以分解為：2110：附著所述連接介質5013於一切割膜50140；2120：半固化所述連接介質5013；2130：附著所述連接介質5013於一晶圓片50130；和2140：切割所述晶圓晶片，獲得帶有所述半固態所述連接介質5013的所述感光晶片5012。 The step 2100 can be further decomposed into: 2110: attaching the connection medium 5013 to a dicing film 50140; 2120: semi-curing the connection medium 5013; 2130: attaching the connection medium 5013 to a wafer 50130; and 2140: Cut the wafer to obtain the photosensitive wafer 5012 with the semi-solid connection medium 5013.

所述步驟2110、2120、2130和2140適合應用於批量化生產所述感光組件5010。 The steps 2110 , 2120 , 2130 and 2140 are suitable for mass production of the photosensitive assembly 5010 .

在所述步驟2110中的附著方式，可以為噴塗、旋塗、滾刷或印刷中的其中一種。所述步驟2120中的附著方式，可以為滾壓的方式。 The attachment method in the step 2110 may be one of spraying, spin coating, rolling or printing. The attachment method in the step 2120 may be a rolling method.

所述連接介質5013為UV膠膜、熱固膠膜或UV熱固膠膜中的其中一種。 The connecting medium 5013 is one of UV adhesive film, thermosetting adhesive film or UV thermosetting adhesive film.

所述步驟2120中的半固化過程可以通過紫外照射、加熱等方式實現。 The semi-curing process in the step 2120 may be implemented by means of ultraviolet irradiation, heating, or the like.

所述步驟2200中包括步驟：清洗所述感光晶片5012。 The step 2200 includes the step of cleaning the photosensitive wafer 5012 .

所述步驟2300中的固化方式，可以為按壓、加熱或烘烤等方式。 The curing method in the step 2300 may be pressing, heating or baking.

所述步驟2400中的設置方式為打金線的方式。 The setting method in the step 2400 is the method of making gold lines.

參照圖87A和圖88所示，所述感光元件5010的第三種製造過程示意。在這種製造方法中，在製造所述感光元件5010時，先在所述線路板主體5011上附著所述連接介質5013，使得所線路板主體5011提供可連接位置。 Referring to FIG. 87A and FIG. 88 , a third manufacturing process of the photosensitive element 5010 is illustrated. In this manufacturing method, when manufacturing the photosensitive element 5010, the connection medium 5013 is first attached to the circuit board body 5011, so that the circuit board body 5011 provides a connectable position.

根據本發明的這個實施例，將所述連接介質5013進行半固化，比如通過UV的方式或熱固的方式使得所述連接介質5013呈半固化狀態，使得所述連接介質5013的形狀不易變化。UV方式，即紫外照射方式。熱固的方式，即加熱固化的方式。 According to this embodiment of the present invention, the connecting medium 5013 is semi-cured, such as by UV or thermosetting, so that the connecting medium 5013 is in a semi-cured state, so that the shape of the connecting medium 5013 is not easily changed. UV method, that is, ultraviolet irradiation method. The way of thermosetting, that is, the way of heat curing.

而在本發明的另一實施例中，可以不進行半固化過程，也就是說，在這種方法中，所述半固化並不是必須的步驟。 In another embodiment of the present invention, the semi-curing process may not be performed, that is, in this method, the semi-curing is not a necessary step.

進而將所述感光晶片5012貼附於所述線路板主體5011，最後對所述連接介質5013進行固化，形成穩定、平整的所述感光組件5010。所述連接介質5013可以UV膠膜、熱固膠膜或UV熱固膠膜中的其中一種。 Then, the photosensitive wafer 5012 is attached to the circuit board main body 5011 , and finally the connection medium 5013 is cured to form the stable and flat photosensitive assembly 5010 . The connecting medium 5013 can be one of UV adhesive film, thermosetting adhesive film or UV thermosetting adhesive film.

值得一提的是，在這種製造過程中，所述連接介質5013的附著方式可以通過噴塗、刮膠、刮刷或印刷等方式實現，從而在所述線路板主體5011上對應所述感光晶片5012的位置形成一層均勻分佈、具有一定厚度的薄膜，作為D/A貼片的粘接劑，並且對所述連接介質5013半固化，而後將所述感光晶片5012貼附於所述線路板主體5011，通過按壓、加熱按壓或烘烤工藝將所述感光晶片5012和線路板主體5011穩定、可靠連接。不同于傳統的點膠粘接方式，本方法中提高了所述連接介質5013的覆蓋面積，使得所述感光晶片5012和所述線路板主體5011之間不會存在懸空區域，提高平整性。且在所述感光晶片5012貼附於所述線路板主體5011之間，對所述連接介質5013進行半固化，使得所述連接介質5013的形狀相對穩定，而不易改變，從而在後續將所述感光晶片5012貼附於所述線路板主體5011進行按壓、加熱按壓或烘烤等工藝過程時，所述連接介質5013的形變量較小，從而保證所述感光晶片5012和所述線路板主體5011的連接平整性。 It is worth mentioning that in this manufacturing process, the attachment method of the connection medium 5013 can be realized by spraying, squeegee, squeegee or printing, so as to correspond to the photosensitive wafer on the circuit board main body 5011 The position of 5012 forms a layer of evenly distributed film with a certain thickness, which is used as the adhesive of the D/A patch, and semi-cures the connecting medium 5013, and then attaches the photosensitive wafer 5012 to the main body of the circuit board 5011. Stably and reliably connect the photosensitive wafer 5012 and the circuit board main body 5011 through a pressing, heating pressing or baking process. Different from the traditional dispensing and bonding method, in this method, the coverage area of the connection medium 5013 is increased, so that there is no suspended area between the photosensitive wafer 5012 and the circuit board main body 5011, and the flatness is improved. And between the photosensitive wafer 5012 is attached to the circuit board main body 5011, the connection medium 5013 is semi-cured, so that the shape of the connection medium 5013 is relatively stable and not easy to change, so that the subsequent When the photosensitive wafer 5012 is attached to the circuit board body 5011 for pressing, heat pressing or baking, the deformation of the connection medium 5013 is small, so as to ensure the photosensitive wafer 5012 and the circuit board body 5011 connection smoothness.

進一步，設置各所述連接線5014於所述感光晶片5012和所述線路板主體5011，使得所述感光晶片5012和所述線路板主體5011可通電連接。比如，通過W/B(Wired/Bond晶片綁定)工藝，在所述感光晶片5012和所述線路板主體5011上打金線。 Further, each of the connecting wires 5014 is arranged on the photosensitive wafer 5012 and the circuit board body 5011 , so that the photosensitive wafer 5012 and the circuit board body 5011 can be electrically connected. For example, gold wires are printed on the photosensitive wafer 5012 and the circuit board body 5011 through a W/B (Wired/Bond wafer bonding) process.

參照圖87B，是根據本發明的優選實施例的感光元件的第四種製造過程。在這種製造方法中，在製造所述感光元件5010時，先在所述線路板主體5011上附著所述連接介質5013，使得所線路板主體5011提供可連接位置。而不同上述第三種製造過程的是，在這種製造過程中，所述連接介質5013是通過貼附的方式附著於所述線路板主體5011。比如，在所述線路板主體5011表面預定位置貼附預定形狀的雙面膠膜，所述雙面膠膜的形狀與所述感光晶片5012相 匹配，從而使得所述感光晶片5012平整的、無間隙地貼附於所述線路板主體5011。 87B, it is a fourth manufacturing process of the photosensitive element according to the preferred embodiment of the present invention. In this manufacturing method, when manufacturing the photosensitive element 5010, the connection medium 5013 is first attached to the circuit board body 5011, so that the circuit board body 5011 provides a connectable position. What is different from the above-mentioned third manufacturing process is that in this manufacturing process, the connection medium 5013 is attached to the circuit board main body 5011 by means of attachment. For example, a double-sided adhesive film with a predetermined shape is attached to a predetermined position on the surface of the circuit board main body 5011, and the shape of the double-sided adhesive film is the same as that of the photosensitive wafer 5012. Matching, so that the photosensitive wafer 5012 is attached to the circuit board main body 5011 flatly and without gaps.

進一步，在一種實施方式中，在貼附所述連接介質5013後，可以通過UV照射預固化所述連接介質5013，而後貼附所述感光晶片5012至所述連接介質5013上，繼而對所述連接介質5013進行熱固，使得所述感光晶片5012和所述線路板主體5011穩定連接。也就是說，在這種方式中，所述連接介質5013可以選擇具有UV固化性能的材料進行粘接。 Further, in one embodiment, after attaching the connection medium 5013, the connection medium 5013 can be pre-cured by UV irradiation, and then the photosensitive wafer 5012 is attached to the connection medium 5013, and then the The connection medium 5013 is thermally solidified, so that the photosensitive wafer 5012 and the circuit board main body 5011 are stably connected. That is to say, in this manner, the connecting medium 5013 can be bonded by selecting a material with UV curing properties.

在另一種實施方式中，貼附所述連接介質5013後，可以不進行UV照射預固化所述連接介質5013，而是直接貼附所述感光晶片5012至所述連接介質5013上，而後對所述連接介質5013進行熱固，使得所述感光晶片5012和所述線路板主體5011穩定連接。也就是說，在這種方式中，所述連接介質5013可以選取不具有UV固化性能的材料進行粘接。 In another embodiment, after attaching the connection medium 5013, the connection medium 5013 may not be pre-cured by UV irradiation, but the photosensitive wafer 5012 may be directly attached to the connection medium 5013, and then the The connection medium 5013 is thermally solidified, so that the photosensitive wafer 5012 and the circuit board main body 5011 are stably connected. That is to say, in this manner, the connecting medium 5013 can be bonded with a material that does not have UV curing properties.

相應地，根據本發明的上述兩種製造過程，本發明提供一感光元件5010的製造方法3000，其包括步驟：3100：附著一預定形狀的連接介質5013於一線路板主體5011；3200：通過所述連接介質5013貼附所述感光晶片5012於一線路板主體5011；3300：固化所連接介質5013，使得所述感光晶片5012和所述線路板主體5011平整、穩定連接；和3400：設置至少一連接線5014於所述感光晶片5012和所述線路板主體5011，使得所述感光晶片5012和所述線路板主體5011可通電連接。 Correspondingly, according to the above two manufacturing processes of the present invention, the present invention provides a manufacturing method 3000 of a photosensitive element 5010, which includes steps: 3100: attaching a predetermined-shaped connecting medium 5013 to a circuit board body 5011; 3200: passing the The connecting medium 5013 is attached to the photosensitive chip 5012 on a circuit board body 5011; 3300: curing the connected medium 5013, so that the photosensitive chip 5012 and the circuit board body 5011 are connected flatly and stably; and 3400: setting at least one Connecting wires 5014 are connected between the photosensitive wafer 5012 and the circuit board body 5011 , so that the photosensitive wafer 5012 and the circuit board body 5011 can be electrically connected.

其中所述步驟3100進一步可以分解為：3110：附著所述連接介質5013於所述線路板主體5011；和3120：半固化所述連接介質5013。 The step 3100 can be further decomposed into: 3110: attaching the connection medium 5013 to the circuit board body 5011; and 3120: semi-curing the connection medium 5013.

在所述步驟3110中的附著方式，可以噴塗、刮膠、刮刷、印刷和貼附中的其中一種。所述連接介質5013為UV膠膜、熱固膠膜或UV熱固膠膜中的其中一種。且所述預定形狀與所述感光晶片5012的形狀相匹配，從而使得所述感光晶片5012平整地貼附於所述線路板主體5011，不會出現所述懸空區504P。且通過半固化過程，使得連接介質5013的形狀相對固定，不易產生變化。值得一提的是，所述半固化過程並不是必須的步驟，也就是說，在其他實施例中，可以直接塗布與所述感光晶片5012相對應的所述連接介質5013，而後進行粘接。 The attachment method in the step 3110 may be one of spraying, squeegeeing, scraping, printing and attaching. The connecting medium 5013 is one of UV adhesive film, thermosetting adhesive film or UV thermosetting adhesive film. And the predetermined shape matches the shape of the photosensitive wafer 5012 , so that the photosensitive wafer 5012 is evenly attached to the circuit board body 5011 without the floating area 504P. And through the semi-curing process, the shape of the connection medium 5013 is relatively fixed and is not easily changed. It is worth mentioning that the semi-curing process is not a necessary step, that is, in other embodiments, the connection medium 5013 corresponding to the photosensitive wafer 5012 may be directly coated and then bonded.

所述步驟3300中的固化方式，可以為按壓、加熱或烘烤等方式。 The curing method in the step 3300 may be pressing, heating or baking.

所述步驟3400中的設置方式為打金線的方式。 The setting method in the step 3400 is the method of making gold lines.

參照圖89是根據本發明的一個優選實施例的攝像模組。所述攝像模組包括一所述感光組件5010、一支架5050、一濾光片5020、一鏡頭5030和一馬達5040。所述支架5050被安裝於所述感光組件5010，所述濾光片5020被安裝於所述支架5050，位於所述感光組件5010的所述感光晶片5012的感光路徑上，所述50鏡頭5030被安裝於所述馬達5040，以便於通過所述馬達5040調整所述攝像模組的焦距，所述馬達5040被安裝於所述支架5050，以使得所述鏡頭5030位於所述感光晶片5012的感光路徑上。 89 is a camera module according to a preferred embodiment of the present invention. The camera module includes a photosensitive component 5010 , a bracket 5050 , a filter 5020 , a lens 5030 and a motor 5040 . The bracket 5050 is installed on the photosensitive component 5010, the filter 5020 is installed on the bracket 5050, and is located on the photosensitive path of the photosensitive wafer 5012 of the photosensitive component 5010, and the 50 lens 5030 is Installed on the motor 5040 to adjust the focal length of the camera module through the motor 5040, the motor 5040 is installed on the bracket 5050, so that the lens 5030 is located in the photosensitive path of the photosensitive chip 5012 superior.

值得一提的是，所述感光組件5010在所述攝像模組的應用，使得所述感光晶片5012具有較好的平整度，從而更容易調整所述感光晶片5012和所述濾光片5020以及所述鏡頭5030光軸的一致性，從而使得所述攝像模組具有更好的成像品質，解決所述攝像模組在測試過程中出現的解析不良，成像曲線異常、馬達5040CODE異常等問題。 It is worth mentioning that the application of the photosensitive element 5010 in the camera module enables the photosensitive wafer 5012 to have better flatness, so that it is easier to adjust the photosensitive wafer 5012, the filter 5020 and the The consistency of the optical axis of the lens 5030 enables the camera module to have better imaging quality, and solves problems such as poor resolution of the camera module, abnormal imaging curves, and abnormal motor 5040CODE during the testing process.

值得一提的是，在本發明的這個實施例中，以動焦攝像模組AFM為例進行說明，而在本發明的其他實施例中，所述攝像模組還可以是定焦模組FF，也就是說，不包括所述馬達5040，本領域的技術人員應當理解的是，所述攝像模組的具體形狀和類型並不是本發明的限制。 It is worth mentioning that, in this embodiment of the present invention, the moving focus camera module AFM is used as an example for illustration, and in other embodiments of the present invention, the camera module may also be a fixed focus module FF. , that is to say, the motor 5040 is not included. Those skilled in the art should understand that the specific shape and type of the camera module is not a limitation of the present invention.

如圖90和圖91所示，是根據本發明的另一個優選實施例的感光元件5010和攝像模組。不同於上述優選實施例的是，所述感光組件5010包括一模塑體5015，所述模塑體5015一體成型地所述線路板主體5011和所述感光晶片5012。 As shown in FIG. 90 and FIG. 91, it is a photosensitive element 5010 and a camera module according to another preferred embodiment of the present invention. Different from the above-mentioned preferred embodiment, the photosensitive assembly 5010 includes a molded body 5015, and the molded body 5015 is integrally formed with the circuit board body 5011 and the photosensitive wafer 5012.

值得一提的是，在傳統的D/A方式中，由於所述晶片和所述線路板連接的邊緣區域，通常會出現所述懸空區域，從而在進行D/A工藝之後，進行模塑形成所述模塑體5015，需要通過模具對所述晶片的邊緣進行按壓，因此，由於所述懸空區域的存在，很容易使得所述感光晶片5012出現傾斜或損傷，從而不利於所述模塑體5015的形成，且不利於組裝所述攝像模組。而根據本發發明的這個實施例，所述感光晶片5012通過所述連接介質5013平整地連接於所述線路板主體5011，且不存在所述懸空區域，因此更易於形成所述模塑體5015，且使得所述模塑體5015保持平整。 It is worth mentioning that in the traditional D/A method, the floating area usually occurs due to the edge area where the wafer and the circuit board are connected, so that after the D/A process is performed, molding is performed. The molded body 5015 needs to be pressed against the edge of the wafer by the mold. Therefore, due to the existence of the suspended area, the photosensitive wafer 5012 is easily inclined or damaged, which is not conducive to the molded body. 5015, and is not conducive to assembling the camera module. According to this embodiment of the present invention, the photosensitive wafer 5012 is evenly connected to the circuit board main body 5011 through the connecting medium 5013, and there is no floating area, so it is easier to form the molded body 5015 , and keep the molded body 5015 flat.

參照圖91，是應用本發明的這個實施例的所述感光元件的攝像模組，所述攝像模組包括一感光組件5010、一濾光片5020、一鏡頭5030和一馬達5040。 Referring to FIG. 91 , it is a camera module applying the photosensitive element of this embodiment of the present invention. The camera module includes a photosensitive component 5010 , a filter 5020 , a lens 5030 and a motor 5040 .

所述濾光片5020被安裝於所述感光組件5010的所述模塑體5015，位於所述感光組件5010的所述感光晶片5012的感光路徑上，所述鏡頭5030被安裝於所述馬達5040，以便於通過所述馬達5040調整所述攝像模組的焦距，所述馬達5040被安裝於所述模塑體5015，以使得所述鏡頭5030位於所述感光晶片5012的感光路徑上。 The filter 5020 is mounted on the molded body 5015 of the photosensitive assembly 5010, located on the photosensitive path of the photosensitive wafer 5012 of the photosensitive assembly 5010, and the lens 5030 is mounted on the motor 5040 , so that the focal length of the camera module can be adjusted by the motor 5040 . The motor 5040 is mounted on the molded body 5015 , so that the lens 5030 is located on the photosensitive path of the photosensitive chip 5012 .

值得一提的是，所述感光組件5010在所述攝像模組的應用，使得所述感光晶片5012和所述模塑體5015都具有較好的平整度，從而更容易調整所述感光晶片5012和所述濾光片5020以及所述鏡頭5030光軸的一致性，解決形成所述模塑體5015時帶來的晶片傾斜問題，從而使得所述攝像模組具有更好的成像品質，解決所述攝像模組在測試過程中出現的解析不良，成像曲線異常、馬達CODE異常等問題。因此本發明的所述感光組件5010尤其適用於模塑型的所述攝像模組。 It is worth mentioning that the application of the photosensitive element 5010 in the camera module enables both the photosensitive wafer 5012 and the molded body 5015 to have good flatness, so that the photosensitive wafer 5012 can be adjusted more easily The consistency with the optical axis of the filter 5020 and the lens 5030 solves the problem of wafer inclination when the molded body 5015 is formed, so that the camera module has better imaging quality and solves the problem of The camera module has problems such as poor resolution, abnormal imaging curve, and abnormal motor CODE during the test process. Therefore, the photosensitive element 5010 of the present invention is especially suitable for the molded camera module.

所述感光元件5010包括至少一電路元件5016，凸出於所述線路板主體5011，且被所述模塑體5015包覆。 The photosensitive element 5010 includes at least one circuit element 5016 protruding from the circuit board body 5011 and covered by the molding body 5015 .

所述模塑體5015一體封裝於所述感光晶片5012的所述正面50121的非感光區，從而使得所述感光晶片5012和所述線路板主體5011連接更加牢固。 The molded body 5015 is integrally packaged in the non-photosensitive area of the front surface 50121 of the photosensitive chip 5012, so that the photosensitive chip 5012 and the circuit board body 5011 are connected more firmly.

值得一提的是，在本發明的這個實施例中，以動焦攝像模組AFM為例進行說明，而在本發明的其他實施例中，所述攝像模組還可以是定焦模組FFM，也就是說，不包括所述馬達5040，本領域的技術人員應當理解的是，所述攝像模組的具體形狀和類型並不是本發明的限制。 It is worth mentioning that in this embodiment of the present invention, the moving focus camera module AFM is used as an example for illustration, while in other embodiments of the present invention, the camera module may also be a fixed focus module FFM , that is to say, the motor 5040 is not included. Those skilled in the art should understand that the specific shape and type of the camera module is not a limitation of the present invention.

本領域的技術人員應理解，上述描述及附圖中所示的本發明的實施例只作為舉例而並不限制本發明。本發明的目的已經完整並有效地實現。本發明的功能及結構原理已在實施例中展示和說明，在沒有背離所述原理下，本發明的實施方式可以有任何變形或修改。 It should be understood by those skilled in the art that the embodiments of the present invention shown in the above description and the accompanying drawings are only examples and do not limit the present invention. The objects of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been shown and described in the embodiments, and the embodiments of the present invention may be modified or modified in any way without departing from the principles.

1010:感光元件 1010: Photosensitive element

1011:封裝部 1011: Packaging Department

1012:感光部 1012: Photosensitive Department

1020:濾光片 1020: Filter

1030:鏡頭 1030: Lens

1040:馬達 1040: Motor

10100:攝像模組 10100: Camera Module

10111:包覆段 10111:Clad segment

10112:濾光片安裝段 10112: Filter Mounting Section

10121:感光晶片 10121: Photosensitive wafer

10122:線路板主體 10122: Main body of circuit board

10123:電路元件 10123: Circuit Components

10124:連接線 10124: connecting line

101100:通孔 101100: Through hole

101200:內側面 101200: inner side

101211:感光區 101211: photosensitive area

101212:非感光區 101212: Non-photosensitive area

101121:安裝槽 101121: Mounting slot

101122:頂表面 101122: Top surface

α:傾斜角 α: Inclination angle

Claims (18)

一種攝像模組的感光元件，其包括：一封裝部，其是熱固性樹脂模塑成型，其中所述封裝部包括一濾光片安裝段和一凸起，其中所述凸起自所述濾光片安裝段部分地向上延伸，並相對所述凸起形成一安裝槽和一外安裝槽，其中所述安裝槽位於內側，用於安裝所述攝像模組的濾光片，所述外安裝槽位於外側，用於安裝所述攝像模組的鏡頭或馬達；以及一感光部；所述感光部包括一線路板主體和一感光晶片，所述封裝部一體模塑成型地封裝於所述線路板主體，其中所述封裝部形成一通孔，所述通孔與所述感光晶片相對，以提供所述感光晶片光線通路。 A photosensitive element of a camera module, comprising: an encapsulation part, which is molded by thermosetting resin, wherein the encapsulation part includes a filter installation section and a protrusion, wherein the protrusion is separated from the filter The chip mounting section partially extends upward, and forms a mounting groove and an outer mounting groove relative to the protrusion, wherein the mounting groove is located on the inner side and is used for mounting the optical filter of the camera module, and the outer mounting groove It is located on the outside and is used to install the lens or motor of the camera module; and a photosensitive part; the photosensitive part includes a circuit board main body and a photosensitive chip, and the packaging part is integrally molded and packaged on the circuit board The main body, wherein the encapsulation part forms a through hole, and the through hole is opposite to the photosensitive chip, so as to provide a light path of the photosensitive chip. 根據申請專利範圍第1項所述的感光元件，其中所述封裝部的側面包覆所述線路板主體的側面。 The photosensitive element according to claim 1, wherein the side surface of the encapsulation portion covers the side surface of the circuit board main body. 根據申請專利範圍第1項所述的感光元件，其中所述線路板主體具有一內凹槽，所述感光晶片被設置於所述內凹槽內，從而使得所述感光晶片和所述線路板主體的相對高度降低，從而當所述封裝部包覆所述感光晶片，減小對所述封裝部的高度要求，從而減小所述感光元件組裝的攝像模組的高度。 The photosensitive element according to claim 1, wherein the circuit board main body has an inner groove, and the photosensitive wafer is disposed in the inner groove, so that the photosensitive wafer and the circuit board The relative height of the main body is reduced, so that when the packaging part wraps the photosensitive wafer, the height requirement for the packaging part is reduced, thereby reducing the height of the camera module assembled with the photosensitive element. 根據申請專利範圍第1項所述的感光元件，其中所述線路板主體具有一下沉孔，所述感光晶片被下沉地設置於所述下沉孔，從而使得所述感光晶片和所述線路板主體的相對高度降低，從而當所述封裝部包覆所述感光晶片時，減小對所述封裝部的高度要求，從而減小所述感光元件組裝的攝像模組的高度。 The photosensitive element according to claim 1, wherein the circuit board main body has a counterbore, and the photosensitive wafer is disposed in the counterbore so that the photosensitive wafer and the wiring The relative height of the board body is reduced, so that when the packaging part wraps the photosensitive wafer, the height requirement for the packaging part is reduced, thereby reducing the height of the camera module assembled with the photosensitive element. 根據申請專利範圍第4項所述的感光元件，其中所述下沉孔是通孔結構。 The photosensitive element according to claim 4, wherein the sink hole is a through hole structure. 根據申請專利範圍第1項所述的感光元件，其中所述封裝部用於形成所述通孔的內壁的至少一部分為傾斜內壁。 The photosensitive element according to claim 1, wherein at least a part of an inner wall of the encapsulation portion for forming the through hole is an inclined inner wall. 根據申請專利範圍第1項所述的感光元件，其中所述封裝部的所述通孔的底部呈由下至上逐漸增大的傾斜狀。 The photosensitive element according to claim 1, wherein the bottom of the through hole of the encapsulation portion is inclined gradually increasing from bottom to top. 根據申請專利範圍第1項所述的感光元件，其中所述封裝部的表面具有至少一雕刻線路。 The photosensitive element according to claim 1, wherein the surface of the encapsulation portion has at least one engraving circuit. 根據申請專利範圍第1項所述的感光元件，其中所述感光部還包括與所述線路板主體的底面緊貼的一補強板，其中所述封裝部包覆所述補強板的側部。 The photosensitive element according to claim 1, wherein the photosensitive portion further comprises a reinforcing plate that is in close contact with the bottom surface of the circuit board main body, wherein the encapsulation portion covers the side portion of the reinforcing plate. 根據申請專利範圍第9項所述的感光元件，其中所述補強板被實施為一金屬板。 The photosensitive element according to claim 9, wherein the reinforcing plate is implemented as a metal plate. 根據申請專利範圍第1項所述的感光元件，其中所述感光部還包括設置於所述線路板主體背面的至少一電路元件，其中所述封裝部包覆所述電路元件。 The photosensitive element according to claim 1, wherein the photosensitive portion further comprises at least one circuit element disposed on the backside of the circuit board body, wherein the encapsulation portion encapsulates the circuit element. 根據申請專利範圍第1項所述的感光元件，其中所述線路主體上具有至少一加固孔，所述封裝部延伸進入所述加固孔，從而增強所述封裝部與所述感光元件之間的粘接力。 The photosensitive element according to claim 1, wherein the circuit body has at least one reinforcement hole, and the encapsulation portion extends into the reinforcement hole, thereby enhancing the connection between the packaging portion and the photosensitive element. Adhesion. 根據申請專利範圍第1項所述的感光元件，其中所述感光部包括一遮罩層，所述遮罩層包裹所述線路板主體和所述封裝部，以增強所述感光元件的抗電磁干擾性能。 The photosensitive element according to claim 1, wherein the photosensitive portion includes a mask layer, and the mask layer wraps the circuit board body and the encapsulation portion to enhance the electromagnetic resistance of the photosensitive element interfere with performance. 根據申請專利範圍第1項所述的感光元件，其包括一保護框，所述保護框被凸起地設置於所述感光晶片的感光區域的外周側。 The photosensitive element according to claim 1, comprising a protective frame, the protective frame is protrudingly disposed on the outer peripheral side of the photosensitive region of the photosensitive wafer. 根據申請專利範圍第14項所述的感光元件，其中所述保護框具有彈性以提供緩衝能力。 The photosensitive element according to claim 14, wherein the protective frame has elasticity to provide buffering capability. 根據申請專利範圍第1項所述的感光元件，其中所述感光部包括一連接介質完全填充所述感光晶片和所述線路板主體之間區域，從而提高所述感光晶片的平整度，減少出現所述感光晶片相對所述線路板主體的傾斜現象。 The photosensitive element according to claim 1, wherein the photosensitive portion includes a connecting medium to completely fill the area between the photosensitive wafer and the circuit board body, thereby improving the flatness of the photosensitive wafer and reducing the occurrence of The inclination phenomenon of the photosensitive wafer relative to the main body of the circuit board. 根據申請專利範圍第1項所述的感光元件，其中所述感光部包括一連接介質，其中所述感光晶片通過所述連接介質連接於所述線路板主體，且所述連接介質和所述感光晶片形狀相匹配。 The photosensitive element according to claim 1, wherein the photosensitive portion includes a connection medium, wherein the photosensitive wafer is connected to the circuit board body through the connection medium, and the connection medium and the photosensitive wafer shape to match. 一種感光元件的製造方法，其包括步驟：貼附所述感光晶片於一線路板主體；所述感光晶片和所述線路板主體可通電連接；以及在所述線路板主體和所述感光晶片上以熱固性樹脂一體模塑地封裝形成一封裝部，其包括一濾光片安裝段和一凸起，其中所述凸起自所述濾光片安裝段部分地向上延伸，並相對所述凸起形成位於內側的一安裝槽和位於外側的一外安裝槽；以及一濾光片設置於所述封裝部的所述安裝槽。 A method for manufacturing a photosensitive element, comprising the steps of: attaching the photosensitive wafer to a circuit board body; the photosensitive wafer and the circuit board body can be electrically connected; and attaching the photosensitive wafer to the circuit board body and the photosensitive wafer An encapsulation part is formed by integral molding with thermosetting resin, which includes a filter mounting section and a protrusion, wherein the protrusion partially extends upward from the filter mounting section and is opposite to the protrusion An installation groove on the inner side and an outer installation groove on the outer side are formed; and a filter is arranged in the installation groove of the packaging part.
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