CN105827916B - Camera module and manufacturing method thereof - Google Patents
Camera module and manufacturing method thereof Download PDFInfo
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- CN105827916B CN105827916B CN201610278035.0A CN201610278035A CN105827916B CN 105827916 B CN105827916 B CN 105827916B CN 201610278035 A CN201610278035 A CN 201610278035A CN 105827916 B CN105827916 B CN 105827916B
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- photosensitive
- photosensitive chip
- camera module
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- filter element
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention provides a camera module and a manufacturing method thereof, wherein the camera module comprises at least one circuit board, at least one optical lens, at least one protective frame, at least one photosensitive chip and at least one integrated packaging support, wherein the protective frame is convexly arranged on the outer peripheral side of a photosensitive area of the photosensitive chip, so that the problem that the material for forming the integrated packaging support flows to the photosensitive area of the photosensitive chip to damage the photosensitive chip in the molding process of the integrated packaging support for wrapping the circuit board and the non-photosensitive area of the photosensitive chip is solved.
Description
Technical Field
The present invention relates to the field of camera shooting, and in particular, to a camera module and a method for manufacturing the same.
Background
In recent years, electronic devices are becoming thinner and lighter, which puts more stringent requirements on the size of a camera module, which is one of standard configurations of electronic devices, and particularly on the height of the camera module. In addition, the user's requirement for the imaging quality of the camera module is also increasing. Therefore, how to reduce the size of the camera module and improve the imaging quality of the camera module is a technical problem that the camera module industry is to solve in recent years.
At present, an MOC (molding On chip) packaging process applied to the camera module industry is developed, and the MOC packaging process is to package a photosensitive chip and a circuit together in the process of packaging the camera module, so as to improve the structural strength of the camera module to the maximum extent, reduce the size of the camera module and reduce the occurrence of bad dust. Specifically, in the process of manufacturing the camera module by adopting an MOC packaging process, firstly, a photosensitive chip is attached to a circuit board, the photosensitive chip is conducted with the circuit board through a gold wire, then the circuit board is placed into a forming mold, a photosensitive area of the photosensitive chip faces the forming mold, and a support is formed by filling forming materials into the forming mold, wherein the support enables the photosensitive chip and the circuit board to be integrally combined. Although this has a positive effect on improving the structural strength of the camera module and reducing the size of the camera module, there are still problems with this manufacturing process of the camera module.
Firstly, in a general case, the photosensitive chip improves the photosensitive capability of the photosensitive chip through the microlenses matched with each pixel point one by one, the microlenses are usually in a micrometer level, so that the microlenses are extremely easy to be damaged or scratched, especially in a high-temperature and high-pressure state, the probability of the microlenses being damaged or scratched is greater, and generally, when any one of the microlenses in the photosensitive chip is damaged or scratched, the imaging quality of the camera module is necessarily affected. Secondly, there is tolerance in the mounting of the photosensitive chip and the circuit board, which causes a gap to exist between the photosensitive chip and the molding die after the molding die presses the non-photosensitive area of the photosensitive chip, and when the molding material is filled into the molding die, the molding material flows into the gap formed between the photosensitive chip and the molding die, which causes the bracket formed by the molding material to have "flash".
Disclosure of Invention
An object of the present invention is to provide a camera module and a method for manufacturing the same, in which the camera module provides a protection frame disposed on an outer circumferential side of a photosensitive region of a photosensitive chip, so that the protection frame prevents a molding material used to form an integral package support from damaging the photosensitive region of the photosensitive chip when the integral package support is molded.
An object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the protection frame prevents the occurrence of "flash" on the inner side of the integrated package support when the integrated package support is molded.
An object of the present invention is to provide an image pickup module and a method of manufacturing the same, in which the protection frame is provided on an outer peripheral side of a filter element, and prevents a situation in which "flash" occurs inside the integral packaging holder at the time of molding the integral packaging holder.
An object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the protection frame is convexly disposed at an outer circumferential side of the photosensitive region of the photosensitive chip, and a molding die for molding the integrated package support presses the protection frame, so that the molding die is prevented from directly contacting the photosensitive chip by the protection frame, thereby preventing the photosensitive region of the photosensitive chip from being damaged or scratched due to pressing.
An object of the present invention is to provide a camera module and a method for manufacturing the same, in which the protection frame has elasticity to provide a buffering capacity, and can be fully contacted with the molding die after the protection frame is pressed to perform a sealing function to isolate the photosensitive area of the photosensitive chip from the external environment, so as to prevent the photosensitive area of the photosensitive chip from being damaged when the integrated package support is molded.
An object of the present invention is to provide a camera module and a method for manufacturing the same, in which the protection frame has elasticity to provide a buffering capacity, so that the requirement for the flatness of the camera module and the requirement for the assembly of various mechanisms of the camera module can be reduced.
An object of the present invention is to provide a camera module and a method for manufacturing the same, in which the protection frame is overlapped on the photosensitive chip after molding, so as to improve the manufacturing efficiency of the camera module.
An object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the upper surface of the mold of the molding mold is provided with at least one cover film, the cover film can further protect the photosensitive chip when the upper portion of the mold of the molding mold is pressed, and in addition, the cover film can increase the demolding difficulty and increase the sealing performance so as to prevent 'flash'.
An object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the forming mold corresponding to the photosensitive area of the photosensitive chip can be designed to be concave, so that a safe distance is provided between the photosensitive area of the photosensitive chip and the forming mold, thereby further reducing the influence on the photosensitive chip.
An object of the present invention is to provide a camera module and a method for manufacturing the same, wherein the protective frame is covered with a protective film to facilitate the protective frame to be disposed on the photosensitive chip, and in addition, the protective film can also isolate the photosensitive area of the photosensitive chip from the external environment.
According to the present invention, a camera module capable of achieving the above objects and advantages and other advantages includes:
at least one circuit board;
at least one optical lens;
at least one protective frame;
the protective frame is convexly arranged on the outer periphery side of a photosensitive area of the photosensitive chip; and
at least one integrated packaging support, wherein the integrated packaging support is arranged to wrap the circuit board and the non-photosensitive area of the photosensitive chip so as to enable the integrated packaging support, the circuit board and the photosensitive chip to be combined into a whole, wherein the optical lens is arranged on the photosensitive path of the photosensitive chip, and the photosensitive chip is connected with the circuit board in a conduction mode.
According to a preferred embodiment of the present invention, the size of the inner side of the protective frame is greater than or equal to the size of the photosensitive area of the photosensitive chip.
According to a preferred embodiment of the present invention, the outer side of the protective frame has a size smaller than or equal to the size of the photosensitive chip.
According to a preferred embodiment of the present invention, the protective frame has elasticity.
According to a preferred embodiment of the present invention, the camera module further includes a glue layer, wherein the glue layer is disposed between the protective frame and the outer periphery of the photosensitive area of the photosensitive chip, so as to connect the protective frame and the outer periphery of the photosensitive area of the photosensitive chip via the glue layer.
According to a preferred embodiment of the present invention, the integrated package support is further configured to wrap an outer side surface of the protection frame.
According to a preferred embodiment of the present invention, the camera module further comprises a lens holder, wherein the lens holder is disposed on the integrated package support, and the optical lens is disposed on the lens holder.
According to a preferred embodiment of the present invention, the lens support is integrally formed with the integral package support.
According to a preferred embodiment of the present invention, the lens holder is a motor, and the motor is conductively connected to the circuit board.
According to a preferred embodiment of the present invention, the camera module further includes a filter element, wherein the filter element is disposed on top of the integrated package support, so that the filter element is located between the photosensitive chip and the optical lens.
According to an aspect of the present invention, there is provided a camera module, comprising:
at least one circuit board;
at least one optical lens;
at least one protective frame;
at least one photosensitive chip;
at least one filter element, wherein the filter element is overlapped on the photosensitive chip, and the protective frame is arranged on the outer periphery of the filter element; and
the integrated packaging support is arranged to coat the peripheral side of the light filtering element and the circuit board, so that the integrated packaging support, the light filtering element, the photosensitive chip and the circuit board are combined into a whole, the optical lens is arranged in a photosensitive path of the photosensitive chip, and the photosensitive chip is in conduction connection with the circuit board.
According to a preferred embodiment of the present invention, the size of the inner side of the protection frame is greater than or equal to the size of the photosensitive area of the photosensitive chip, so that the protection frame does not block the photosensitive area of the photosensitive chip.
According to a preferred embodiment of the present invention, the protective frame has elasticity.
According to a preferred embodiment of the present invention, the camera module further includes a bonding layer, wherein the bonding layer is disposed between the protection frame and the filter element to connect the protection frame and the outer periphery of the filter element by the bonding layer.
According to a preferred embodiment of the present invention, the integrated package support is further configured to wrap an outer side surface of the protection frame.
According to a preferred embodiment of the present invention, the camera module further comprises a lens holder, wherein the lens holder is disposed on the integrated package support, and the optical lens is disposed on the lens holder.
According to a preferred embodiment of the present invention, the lens support is integrally formed with the integral package support.
According to an aspect of the present invention, the present invention further provides a method for manufacturing a camera module, wherein the method includes the steps of:
(a) connecting at least one photosensitive chip with at least one circuit board in a conduction manner;
(b) providing at least one protection frame, wherein the protection frame is arranged on the outer periphery side of a photosensitive area of the photosensitive chip;
(c) pressing the protective frame through the inner surface of the upper part of a mold of a forming mold so as to isolate a photosensitive area and a non-photosensitive area of the photosensitive chip;
(d) wrapping the non-photosensitive area of the circuit board and the photosensitive chip by using a forming material added into the forming die, so as to form an integrated packaging support which is integrated with the photosensitive chip and the circuit board after the forming material is cured; and
(e) and providing at least one optical lens, wherein the optical lens is arranged on a photosensitive path of the photosensitive chip to manufacture the camera module.
According to a preferred embodiment of the present invention, in the step (b), a protective film is disposed on an upper portion of the protective frame so that the protective film corresponds to the light sensing region of the light sensing chip, and after the step (d), the protective film is removed from the protective frame.
According to a preferred embodiment of the present invention, in the method, a groove is formed in a portion of the upper mold portion of the molding mold corresponding to the photosensitive region, so that in the step (c), the inner surface of the upper mold portion is kept at a safe distance from the photosensitive region of the photosensitive chip.
According to a preferred embodiment of the present invention, a cover film is provided on an inner surface of the upper portion of the molding die.
According to a preferred embodiment of the present invention, in the step (d), the molding material further wraps the outer side surface of the protection frame to form the integrated package support integrally combined with the photosensitive chip, the circuit board and the protection frame after the molding material is cured.
According to a preferred embodiment of the present invention, before the step (e), further comprising the steps of:
and attaching at least one filter element to the top of the integrated packaging support, and keeping the filter element between the photosensitive chip and the optical lens.
According to a preferred embodiment of the present invention, in the step (b), a glue layer is formed between the outer periphery of the photosensitive region of the photosensitive chip and the protective frame to connect the protective frame and the outer periphery of the photosensitive chip by the glue layer.
According to a preferred embodiment of the present invention, in the above method, glue is applied to the outer peripheral side of the protective frame and/or the photosensitive region of the photosensitive chip to form the glue layer after the glue is cured.
According to a preferred embodiment of the invention, in the above method, the glue is cured by thermal curing or UV light.
According to an aspect of the present invention, the present invention further provides a method for manufacturing a camera module, wherein the method includes the steps of:
(A) connecting at least one photosensitive chip with at least one circuit board in a conduction manner;
(B) superposing a filter element on the photosensitive chip;
(C) providing at least one protection frame, wherein the protection frame is arranged on the outer periphery side of the filter element;
(D) pressing the protection frame through an inner surface of an upper part of a forming die to isolate an inner area and an outer periphery of the filter element;
(E) wrapping the outer peripheral sides of the circuit board and the optical filter element by a forming material added into the forming die so as to form an integrated package support which is integrally combined with the optical filter element, the photosensitive chip and the circuit board after the forming material is cured; and
(F) and providing at least one optical lens, wherein the optical lens is arranged on a photosensitive path of the photosensitive chip to manufacture the camera module.
According to a preferred embodiment of the present invention, in the step (E), the molding material further includes an outer side surface of the protection frame to form the integrated package support integrally combined with the photosensitive chip, the circuit board, the filter element and the protection frame after the molding material is cured.
According to a preferred embodiment of the invention, in the above method, the forming material is a fluid material or a granular material.
Drawings
Fig. 1 is a schematic view of an internal structure of a camera module according to a preferred embodiment of the present invention, which is cut along a middle position.
Fig. 2 is a schematic perspective view of the structural relationship among the circuit board, the photosensitive chip and the protective frame of the camera module according to the above preferred embodiment of the invention.
Fig. 3A is a schematic cross-sectional view of a first step in a manufacturing process of the camera module according to the above preferred embodiment of the invention.
Fig. 3B is a schematic cross-sectional view of step two of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the invention.
Fig. 3C is a schematic cross-sectional view of the third step of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 3D is a schematic cross-sectional view of step four of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 3E is a schematic cross-sectional view of step five of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 3F is a schematic cross-sectional view of step six of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the invention.
Fig. 4A is a schematic cross-sectional view of a variation of the third step of the manufacturing process of the camera module according to the preferred embodiment of the present invention.
Fig. 4B is a schematic cross-sectional view of a modified embodiment of step four of the above-described manufacturing process of the camera module according to the above-described preferred embodiment of the present invention.
Fig. 5 is a schematic cross-sectional view of another variation of the fourth step of the manufacturing process of the camera module according to the preferred embodiment of the present invention.
Fig. 6A is a schematic cross-sectional view of a first step in another manufacturing process of the camera module according to the above preferred embodiment of the invention.
Fig. 6B is a schematic cross-sectional view of step two of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 6C is a schematic cross-sectional view of the third step of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 6D is a schematic cross-sectional view of step four of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 6E is a schematic cross-sectional view of step five of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 6F is a schematic cross-sectional view of step six of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 6G is a schematic cross-sectional view of a seventh step of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 7 is a schematic view of an internal structure of a camera module according to another preferred embodiment of the present invention, which is cut along a middle position.
Fig. 8 is a schematic perspective view of the structural relationship among the circuit board, the photosensitive chip, the filter element and the protective frame of the camera module according to the above preferred embodiment of the invention.
Fig. 9A is a schematic cross-sectional view of a first step in a manufacturing process of the camera module according to the above preferred embodiment of the invention.
Fig. 9B is a schematic cross-sectional view of step two of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 9C is a schematic cross-sectional view of the third step of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 9D is a schematic cross-sectional view of step four of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 9E is a schematic cross-sectional view of step five of the manufacturing process of the camera module according to the preferred embodiment of the invention.
Fig. 9F is a schematic cross-sectional view of step six of the above-mentioned manufacturing process of the camera module according to the above-mentioned preferred embodiment of the invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
Referring to fig. 1 to 3F of the accompanying drawings of the specification, a camera module and a method of manufacturing the camera module according to a preferred embodiment of the present invention are illustrated. The camera module comprises at least one optical lens 10, at least one photosensitive chip 20, at least one protection frame 30, at least one circuit board 40 and at least one integrated package support 50.
It is to be noted that the term "a" used in the description of the present invention regarding the structure of the camera module and the method of manufacturing the camera module is to be understood as "at least one" or "one or more", that is, in one embodiment, the number of one element may be one, and in another embodiment, the number of the element may be plural, and thus, the term "a" is not to be understood as a limitation on the number.
Similarly, any directional terms used in disclosing and describing the structure of the camera module and the method for manufacturing the camera module of the present invention, such as "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, which are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and thus the above terms should not be construed as limiting the present invention.
It should be noted that the camera module of the present invention can be a fixed focus camera module or a zoom camera module. In other words, whether the camera module of the present invention allows focusing is not limited to the content and scope of the present invention.
It should be noted that the camera module of the present invention may be a single-lens camera module, or may be a multi-lens camera module, for example, in a specific example, the camera module may be implemented as an array camera module. In other words, the number of the optical lenses 10 of the camera module of the present invention does not limit the content and scope of the present invention.
Specifically, in the camera module of the present invention, the protection frame 30 is convexly disposed on the outer peripheral side of the photosensitive area of the photosensitive chip 20, the photosensitive chip 20 is conductively connected to the circuit board 40, the integrated package bracket 50 is disposed to wrap the circuit board 40 and the non-photosensitive area of the photosensitive chip 20, so that the integrated package bracket 50, the photosensitive chip 20 and the circuit board 40 are integrated into a whole, and the optical lens 10 is disposed in the photosensitive path of the photosensitive chip 20. The light reflected by the object can be converged inside the camera module through the optical lens 10, so as to be further received by the photosensitive chip 20 and subjected to photoelectric conversion to generate an image related to the object.
In a specific example of the camera module of the present invention, the photosensitive chip 20 is attached to the circuit board 40, and the photosensitive chip 20 is conductively connected to the circuit board 40 through a wire bonding process. For example, gold wires are bonded between the non-photosensitive area of the photosensitive chip 20 and the circuit board 40, so as to electrically connect the photosensitive chip 20 and the circuit board 40 by the gold wires, as shown in fig. 1.
In another specific example of the camera module according to the present invention, the photosensitive chip 20 is mounted on the circuit board 40 and is electrically connected to the circuit board 40, for example, a chip pad is disposed in a non-photosensitive region of the photosensitive chip 20, the circuit board 40 is disposed with a circuit board pad, and when the photosensitive chip 20 is mounted on the circuit board 40, the chip pad of the photosensitive chip 20 and the circuit board pad of the circuit board 40 are electrically connected.
The protective frame 30 has a hollow structure so that the protective frame 30 can be disposed around the outer circumference of the photosensitive region of the photosensitive chip 20. Preferably, the size of the inner side of the protection frame 30 is greater than or equal to the size of the photosensitive area of the photosensitive chip 20, so that when the protection frame 30 is convexly disposed on the photosensitive chip 20, the protection frame 30 can be held at the outer circumferential side of the photosensitive area of the photosensitive chip 20, so that the protection frame 30 does not block the photosensitive area of the photosensitive chip 20.
Preferably, the size of the outer side of the protective frame 30 is smaller than the size of the photosensitive chip 20, so that when the protective frame 30 is convexly disposed on the photosensitive chip 20, the photosensitive chip 20 and the circuit board 40 can be conducted outside the non-photosensitive area of the photosensitive chip 20 through a wire bonding process. However, it can be understood by those skilled in the art that when the photosensitive chip 20 and the circuit board 40 are conductively connected through the chip pad and the circuit board pad, the outer side of the protective frame 30 may have a size corresponding to that of the photosensitive chip 20.
The integrated packaging support 50 wraps the non-photosensitive area of the circuit board 40 and the photosensitive chip 20 after molding, so that the integrated packaging support 50, the circuit board 40 and the photosensitive chip 20 are combined into a whole, and by such a way, the structural stability of the camera module can be increased, the volume of the camera module can be reduced, and the camera module can be applied to electronic equipment pursuing lightness and thinness.
Further, the integrated package support 50 is disposed to wrap the outer circumferential side of the protection frame 30, so that the integrated package support 50, the circuit board 40, the protection frame 30 and the photosensitive chip 20 are integrated.
Further, as shown in fig. 1, the image capturing module includes at least one lens holder 60, wherein the lens holder 60 is disposed on the upper portion of the integrated package support 50, and the optical lens 10 is disposed on the lens holder 60, such that the optical lens 10 is held on the photosensitive path of the photosensitive chip 20 by the lens holder 60.
In a specific example of the camera module according to the present invention, the lens support body 60 is disposed on the upper portion of the integrated package holder 50 after molding. In another specific example of the camera module according to the present invention, the lens support 60 may be integrally formed with the integral packaging bracket 50, so as to reduce the packaging error of the camera module, which is beneficial to improve the imaging quality of the camera module.
Preferably, the lens holder 60 may be implemented as a motor, that is, the optical lens 10 is operably disposed on the lens holder 60, so that the optical lens 10 is driven by the lens holder 60 to move back and forth along the photosensitive path of the photosensitive chip 20, thereby adjusting the focal length of the camera module by changing the position between the optical lens 10 and the photosensitive chip 20. It is noted that the lens holder 60 may be various drivers for driving the optical lens 10 to move back and forth along the photosensitive path of the photosensitive chip 20, for example, in this preferred embodiment of the present invention, the lens holder 60 may be implemented as a voice coil motor.
It will be understood by those skilled in the art that when the lens holder 60 is implemented as a motor, the lens holder 60 and the circuit board 40 are conductively connected.
Further, as shown in fig. 1, the camera module includes a filter element 70, wherein the filter element 70 is disposed between the optical lens 10 and the photosensitive chip 20, and when the light reflected by the object is converged into the camera module from the optical lens 10, the light is filtered by the filter element 70 and then received by the photosensitive chip 20 for photoelectric conversion, so as to improve the imaging quality of the camera module. In other words, the filter element 70 can reduce noise to improve the imaging quality of the camera module.
It should be noted that the type of the filter element 70 may not be limited, for example, in one specific example of the camera module of the present invention, the filter element 70 may be implemented as an infrared cut filter to filter the infrared part of the light by the filter element 70, and in another specific example of the camera module of the present invention, the filter element 70 is implemented as a full-transmission spectral filter.
The integrated package holder 50 forms at least one mounting platform 51 for mounting the filter element 70, for example, the mounting platform 51 may be a mounting groove formed on the integrated package holder 50 or the mounting platform 51 may be a plane formed on the integrated package holder 50. In other words, the filter element 70 may be directly attached to the upper portion of the integrated package support 50.
Fig. 3A to 3F are schematic diagrams of a manufacturing process of the camera module according to the present invention, wherein, for convenience of description, all of fig. 3A to 3F are cross-sectional views showing structural relationships among the optical lens 10, the photosensitive chip 20, the protective frame 30, the circuit board 40, the integrated package holder 50, and other elements of the camera module.
In this step shown in fig. 3A, the photosensitive chip 20 is turned on the wiring board 40. It can be understood by those skilled in the art that, in this step shown in fig. 3A, after the photosensitive chip 20 is attached to the circuit board 40, the photosensitive chip 20 and the circuit board 30 are electrically connected through a wire bonding process, which is only an exemplary description, and such an electrically connecting manner of the photosensitive chip 20 and the circuit board 40 does not limit the content and scope of the present invention. In another example of the camera module of the present invention, the photosensitive chip 20 and the circuit board 40 may also be directly connected by conduction through a chip pad and a circuit board pad.
In this step shown in fig. 3B, the protective frame 30 is provided to protrude to the outer peripheral side of the photosensitive region of the photosensitive chip 20. Specifically, in the manufacturing process of the image pickup module according to the present invention, after the protective frame 30 is provided, the protective frame 30 is provided to protrude to the outer peripheral side of the light sensing region of the light sensing chip 20. Preferably, a glue layer 80 is formed between the protective frame 30 and the outer periphery of the photosensitive area of the photosensitive chip 20, and the glue layer 80 is used for connecting the protective frame 30 and the outer periphery of the photosensitive area of the photosensitive chip 20.
For example, in one example of the image pickup module of the present invention, glue is disposed on the outer peripheral side of the light sensing region of the protection frame 30 and/or the light sensing chip 20 to form the glue layer 80 on the outer peripheral side of the light sensing region of the protection frame 30 and/or the light sensing chip 20. That is, the adhesive layer 80 is formed on the surface of at least one of the protective frame 30 and the outer peripheral side of the photosensitive region of the photosensitive chip 20. Subsequently, the adhesive layer 80 is used to connect the protective frame 30 and the outer peripheral side of the photosensitive region of the photosensitive chip 20.
Preferably, after the glue is disposed on the outer circumferential sides of the light-sensing areas of the protective frame 30 and the light-sensing chip 20, the glue can be quickly formed into the glue layer 80 for connecting the outer circumferential sides of the light-sensing areas of the protective frame 30 and the light-sensing chip 20 by means of thermal curing or UV light curing. In another example of the camera module according to the present invention, the protective frame 30 may be provided with the adhesive layer 80, so that the protective frame 30 may be directly disposed on the outer periphery of the photosensitive region of the photosensitive chip 20 during the process of packaging the camera module.
In addition, the protection frame 30 may be formed by an injection molding process or a stamping process, for example, the protection frame 30 may be a plastic member formed by an injection molding process.
As shown in fig. 2, the protection frame 30 is a hollow structure, so that the protection frame 30 can be convexly disposed on the outer peripheral side of the photosensitive area of the photosensitive chip 20 to isolate the photosensitive area of the photosensitive chip 20 from the external environment, and thus, in the subsequent process of packaging the image capture module, the protection frame 30 can prevent contaminants from entering the photosensitive area of the photosensitive chip 20 to cause bad contamination points.
In this step shown in fig. 3C, the integral package support 50 is formed by a molding die 100 during the process of packaging the camera module, wherein the molding die 100 includes a die upper portion 101, and an inner surface of the die upper portion 101 presses the protective frame 30 to isolate the photosensitive area of the photosensitive chip 20 from the external environment.
As will be understood by those skilled in the art, the protection frame 30 is convexly disposed at the outer peripheral side of the photosensitive region of the photosensitive chip 20, so that when the inner surface of the upper mold part 101 presses the protection frame 30, the protection frame 30 can prevent the inner surface of the upper mold part 101 from contacting the photosensitive region of the photosensitive chip 20, and thus the protection frame 30 can prevent the inner surface of the upper mold part 101 from damaging or scratching the photosensitive region of the photosensitive chip 20.
Further, referring to fig. 5, a modified example of the manufacturing process of the camera module is shown, wherein a groove 102 is formed in a concave manner at a position of the inner surface of the upper mold part 101 corresponding to the photosensitive area of the photosensitive chip 20, so that in the process of molding the integrated package support 50 by the molding mold 100, the groove 102 can enable the photosensitive area of the photosensitive chip 20 and the inner surface of the upper mold part 101 to have a safety gap, thereby further reducing the influence of the upper mold part 101 on the photosensitive chip 20 to prevent the photosensitive chip 20 from being damaged or scratched by the inner surface of the upper mold part 101.
Preferably, the protective frame 30 has elasticity so that when the inner surface of the upper mold part 101 presses the protective frame 30, the protective frame 30 can play a role of buffering to prevent the pressure generated by the upper mold part 101 from damaging the photosensitive chip 20. In addition, due to limitations of the manufacturing process of the photo sensor 20, the manufacturing process of the circuit board 40, and the mounting process of the photo sensor 20 and the circuit board 40, there may be a mounting tilt after the photo sensor 20 is mounted on the circuit board 40, and at this time, when the inner surface of the upper mold part 101 presses the protective frame 30, the protective frame 30 may be deformed to isolate the photo sensing area of the photo sensor 20 from the external environment, so as to prevent the molding material for forming the integrated package support 50 from entering the photo sensing area of the photo sensor 20.
In this step shown in fig. 3D, the molding material is added into the upper mold part 101, and the integrated package support 50 is formed after the molding material is cured, wherein the integrated package support 50 wraps the non-photosensitive area of the circuit board 40 and the photosensitive chip 20, so that the integrated package support 50, the circuit board 40 and the photosensitive chip 20 are integrated. Preferably, the integrated package support 50 further wraps the outer circumferential side of the protection frame 30, so that the integrated package support 50, the circuit board 40, the protection frame 30 and the photosensitive chip 20 are integrated. It is worth mentioning that the forming material is fluid or granular. After the molding die 100 is removed, the integrated package holder 50, the circuit board 40, the protective frame 30, and the photosensitive chip 20, which are integrally combined, can be obtained as shown in fig. 3E.
It will be understood by those skilled in the art that the photosensitive area of the photosensitive chip 20 and the external environment are isolated, so that the molding material does not flow to the photosensitive area of the photosensitive chip 20 after the molding material is added to the upper mold part 101, and thus the protective frame 30 can prevent the molding material from damaging the photosensitive area of the photosensitive chip 20. In addition, the protection frame 30 has elasticity, so that no gap exists between the protection frame 30 and the upper mold part 101 which is pressed on the protection frame 30, therefore, the phenomenon of 'flash' can not occur in the process of solidifying the forming material which is added into the upper mold part 101, and the imaging quality of the camera module is ensured.
Further, referring to a modified example of the manufacturing process of the image pickup module shown in fig. 4A and 4B, an inner surface of the mold upper 101 is provided with a cover film 103, and when the inner surface of the mold upper 101 presses the protective frame 30, the cover film 103 provided on the mold upper 101 directly contacts the protective frame 30, so that the photosensitive chip 20 is further protected by the cover film 103. In addition, it is understood that the cover film 103 can increase the difficulty of demolding and increase the sealing performance, thereby preventing the formation material from generating the phenomenon of "flash" on the inner side of the integrated package support 50 during the curing process.
In this step shown in fig. 3F, the filter element 70 and the optical lens 10 are respectively disposed in the photosensitive paths of the photosensitive chips 20 to manufacture the image pickup module. Preferably, the filter element 70 is attached to the integrated package holder 50, and the optical lens 10 is held in a photosensitive path of the photosensitive chip 20 by the lens holder 60 provided in the integrated package holder 50.
Fig. 6A to 6G are schematic views illustrating another manufacturing process of the camera module according to the present invention. In this step shown in fig. 6A, the photosensitive chip 20 is turned on the wiring board 40.
In this step shown in fig. 6B, the protective frame 30 is provided to protrude to the outer peripheral side of the photosensitive region of the photosensitive chip 20. Preferably, a protection film 90 is disposed on an upper portion of the protection frame 30 so as to absorb the protection frame 30 by vacuum absorption and attach the protection frame 30 to an outer circumferential side of the photosensitive region of the photosensitive chip 20. It can be understood by those skilled in the art that, after the protection frame 30 is disposed on the outer periphery of the photosensitive region of the photosensitive chip 20, the protection film 90 correspondingly covers the upper portion of the photosensitive region of the photosensitive chip 20, so as to isolate the photosensitive region of the photosensitive chip 20 from the external environment by the protection film 90 and the protection frame 30, thereby subsequently preventing the forming material from flowing to the photosensitive region of the photosensitive chip 20.
In this step shown in fig. 6C, the protective frame 30 is pressed by the inner surface of the upper mold part 101 of the molding mold 100 to further isolate the photosensitive region of the photosensitive chip 20 from the external environment.
In this step shown in fig. 6D, the molding material is added into the molding die 101, and the integrated package support 50 is formed after the molding material is cured, wherein the integrated package support 50 wraps the non-photosensitive area of the circuit board 40 and the photosensitive chip 20, so that the integrated package support 50, the circuit board 40 and the photosensitive chip 20 are integrated. Preferably, the integrated package support 50 further wraps the outer circumferential side of the protection frame 30, so that the integrated package support 50, the circuit board 40, the protection frame 30 and the photosensitive chip 20 are integrated. After the molding die 100 is removed, the integrally combined integrated package holder 50, the wiring board 40, the protective frame 30, and the photosensitive chip 20 can be obtained as shown in fig. 6E, in which the protective film 90 is still disposed on the protective frame 30.
In this step shown in fig. 6F, the protective film 90 is removed from the protective frame 30 to obtain an integrally combined integrated package holder 50, the wiring board 40, the protective frame 30, and the photosensitive chip 20.
In this step shown in fig. 6G, the filter element 70 and the optical lens 10 are respectively disposed in the photosensitive paths of the photosensitive chips 20 to manufacture the image pickup module.
According to fig. 7 to 9G of the drawings, the image pickup module according to another preferred embodiment of the present invention is illustrated, wherein the image pickup module comprises at least one optical lens 10A, at least one photosensitive chip 20A, at least one protection frame 30A, at least one circuit board 40A, at least one integrated package support 50A and at least one optical filter element 70A, wherein the photosensitive chip 20A and the circuit board 40A are electrically connected, the optical filter element 70A is overlapped on the photosensitive chip 20A, the protection frame 30A is disposed on the outer periphery of the optical filter element 70A, so that the protection frame 30A does not block the photosensitive area of the photosensitive chip 20A, the integrated package support 50A is disposed to wrap the outer peripheries of the circuit board 40A and the optical filter element 70A, so that the integrated package support 50A, The filter element 70A, the photosensitive chip 20A and the circuit board 40A are integrally combined, wherein the optical lens 10A is disposed in a photosensitive path of the photosensitive chip 20A. The light reflected by the object is converged inside the camera module through the optical lens 10A, so as to be further received by the photosensitive chip 20A and subjected to photoelectric conversion to generate an image related to the object.
Preferably, the integrated package holder 50A wraps the outer peripheries of the circuit board 40A and the filter element 70A during molding, so that the integrated package holder 50A, the filter element 70A, the photosensitive chip 20A, and the circuit board 40A are integrally combined.
More preferably, the integrated package support 50A further wraps the outer side edge of the protection frame 30A, so that the integrated package support 50A, the filter element 70A, the photosensitive chip 20A, the circuit board 40A and the protection frame 30A are integrally combined.
The protective frame 30A is protrudingly disposed at an outer periphery of the optical filter element 70A, so that when an inner surface of the upper mold portion 101A of a forming mold 100A is subsequently pressed against the protective frame 30A, the inner surface of the upper mold portion 101A does not contact a surface of the optical filter element 70A, thereby preventing the inner surface of the upper mold portion 101A from damaging or scratching the optical filter element 70A. That is, the protective frame 30A, which is protrudingly disposed on the outer circumference of the optical filter element 70A, forms a safety distance between the surface of the optical filter element 70A and the inner surface of the upper mold part 101A to prevent the inner surface of the upper mold part 101A from damaging or scratching the optical filter element 70A.
Further, the camera module includes at least one lens support 60A, wherein the lens support 60A is disposed on the upper portion of the integrated package support 50A, and the optical lens 10A is disposed on the lens support 60A, so that the optical lens 10A is held on the photosensitive path of the photosensitive chip 20A by the lens support 60A.
In a specific example of the camera module according to the present invention, the lens support body 60A is disposed on the upper portion of the integrated package holder 50A after molding. In another specific example of the camera module according to the present invention, the lens support 60A may be integrally formed with the integral packaging bracket 50A, so as to reduce the packaging error of the camera module, which is beneficial to improve the imaging quality of the camera module.
Preferably, the lens support 60A may be implemented as a motor, that is, the optical lens 10A is operably disposed on the lens support 60A to drive the optical lens 10A to move back and forth along the photosensitive path of the photosensitive chip 20A through the lens support 60A, so as to adjust the focal length of the image pickup module by changing the position between the optical lens 10A and the photosensitive chip 20A. It should be noted that the lens support 60A may be various drivers for driving the optical lens 10A to move back and forth along the photosensitive path of the photosensitive chip 20A, for example, in the preferred embodiment of the present invention, the lens support 60A may be implemented as a voice coil motor.
It will be understood by those skilled in the art that when the lens holder 60A is implemented as a motor, the lens holder 60A and the wiring board 40A are conductively connected.
Fig. 9A to 9G are schematic views illustrating a manufacturing process of the camera module according to the present invention. In this step shown in fig. 9A, the photosensitive chip 20A is conductively connected to the circuit board 40A, which is thought to be the same as the above preferred embodiment of the present invention, and the manner in which the photosensitive chip 20A and the circuit board 40A are conductively connected is not limited.
In this step shown in fig. 9B, the filter element 70A is overlappingly provided on the photosensitive chip 20A. It can be understood by those skilled in the art that the filter element 70A and the photosensitive chip 20A are disposed in an overlapping manner, so as to reduce the back focal length of the camera module, thereby facilitating the miniaturization of the camera module, so that the camera module can be applied to electronic devices that seek for lightness and thinness.
In this step shown in step 9C, the protective frame 30A is placed on the outer periphery of the filter element 70A, wherein the protective frame 30A does not block the photosensitive area of the photosensitive chip 20A. It will be understood by those skilled in the art that after the bezel 30A is provided, the bezel 30A may be disposed to the outer periphery of the filter element 70A by a glue layer 80A. That is, the adhesive layer 80A disposed between the protective frame 30A and the filter element 70A serves to connect the protective frame 30A and the filter element 70A.
In this step shown in fig. 9D, the protective frame 30A is pressed by the inner surface of the upper mold part 101A to isolate the inner area of the filter element 70A, which has a size greater than or equal to the photosensitive area of the photosensitive chip 20A, from the outer periphery, so as to prevent the protective frame 30A from blocking the photosensitive area of the photosensitive chip 20A. It will be understood by those skilled in the art that the protection frame 30A is convexly disposed at the outer periphery of the filter element 70A, so that when the inner surface of the mold upper portion 101A presses the protection frame 30A, the protection frame 30A can prevent the inner surface of the mold upper portion 101A from contacting the photosensitive region of the filter element 70A, and thus the protection frame 30A can prevent the inner surface of the mold upper portion 101A from damaging or scratching the inner region of the filter element 70A.
Preferably, the protection frame 30A has elasticity so that when the inner surface of the mold upper 101A presses the protection frame 30A, the protection frame 30A can play a role of buffering to prevent the filter element 70A from being damaged by the pressure generated from the mold upper 101A.
In this step shown in fig. 9E, the molding material is added to the upper mold part 101A, and the integrated package support 50A is formed after the molding material is cured, wherein the integrated package support 50A wraps around the outer peripheries of the wiring board 40A and the filter element 70A to integrate the integrated package support 50A, the wiring board 40A, the photosensitive chip 20A, and the filter element 70A. Preferably, the integrated package support 50A further wraps the outer circumferential side of the protection frame 30A, so that the integrated package support 50A, the circuit board 40A, the protection frame 30A, the photosensitive chip 20A and the filter element 70A are integrated. It is worth mentioning that the forming material is fluid or granular. After the molding die 100A is removed, the integrated package holder 50A, the wiring board 40A, the protective frame 30A, the photosensitive chip 20A, and the filter element 70A, which are integrally combined, can be obtained as shown in fig. 9F.
It will be understood by those skilled in the art that the inner region and the outer periphery of the filter element 70A are isolated so that the molding material does not flow to the inner region of the filter element 70A after the molding material is added to the upper mold part 101A, so that the bezel 30A can prevent the molding material from damaging the inner region of the filter element 70A. In addition, the protection frame 30A has elasticity, so that no gap exists between the protection frame 30A and the upper mold part 101A pressed on the protection frame 30A, and therefore, no 'flash' phenomenon occurs in the process of curing the molding material added to the upper mold part 101A, so as to ensure the imaging quality of the camera module.
In this step shown in fig. 9G, the filter element 70A and the optical lens 10A are respectively disposed in the photosensitive paths of the photosensitive chips 20A to produce the image pickup module.
Furthermore, the invention also provides a manufacturing method of the camera module, wherein the manufacturing method comprises the following steps:
(a) the at least one photosensitive chip 20 and the at least one circuit board 40 are connected in a conduction manner;
(b) providing at least one protection frame 30, wherein the protection frame 30 is arranged on the outer periphery side of the photosensitive area of the photosensitive chip 20;
(c) pressing the protective frame 30 by the inner surface of the upper mold part 101 of a molding mold 100 to isolate the photosensitive area and the non-photosensitive area of the photosensitive chip 20;
(d) wrapping the non-photosensitive areas of the circuit board 40 and the photosensitive chip 20 with a molding material added to the molding mold 100 to form an integrated package support 50 integrally combined with the photosensitive chip 20 and the circuit board 40 after the molding material is cured; and
(e) providing at least one optical lens 10, wherein the optical lens 10 is disposed in a photosensitive path of the photosensitive chip 20 to form the image capturing module.
Furthermore, the present invention provides a method for manufacturing a camera module, wherein the method comprises the following steps:
(A) the at least one photosensitive chip 20 and the at least one circuit board 40 are connected in a conduction manner;
(B) laminating a filter element 70 on the photosensitive chip;
(C) providing at least one protection frame 30, wherein the protection frame 30 is disposed on an outer circumferential side of the filter element 70;
(D) pressing the protection frame 30 by an inner surface of a mold upper part 101 of a molding mold 100 to isolate an inner region and an outer peripheral side of the filter element 70;
(E) wrapping outer peripheral sides of the circuit board 40 and the filter element 20 with a molding material added to the molding die 100 to form an integrated package holder 50 integrally combined with the filter element 70, the photosensitive chip 20, and the circuit board 40 after the molding material is cured; and
(F) providing at least one optical lens 10, wherein the optical lens 10 is disposed in a photosensitive path of the photosensitive chip 20 to form the image capturing module.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention.
The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (21)
1. A camera module, comprising:
at least one circuit board;
at least one optical lens;
at least one protective frame;
the protective frame is convexly arranged on the outer periphery side of a photosensitive area of the photosensitive chip; and
at least one integrated package support, wherein the integrated package support is configured to wrap the non-photosensitive area of the circuit board and the photosensitive chip, so that the integrated package support, the circuit board and the photosensitive chip are combined into a whole, wherein the optical lens is configured in the photosensitive path of the photosensitive chip, wherein the photosensitive chip is in conduction connection with the circuit board, the camera module comprises a filter element, wherein the filter element is configured at the top of the integrated package support, the internal side surface of the protection frame, the top surface of the photosensitive chip and the bottom surface of the filter element form a closed space, the internal side surface of the integrated package support extends upwards from the top surface of the protection frame, the camera module further comprises a glue layer, wherein the glue layer is configured between the protection frame and the peripheral side of the photosensitive area of the photosensitive chip, the protective frame is connected with the outer periphery of the photosensitive area of the photosensitive chip through the cementing layer.
2. The camera module of claim 1, wherein the size of the inner side edge of the protective frame is greater than or equal to the size of the photosensitive area of the photosensitive chip.
3. The camera module of claim 2, wherein the outer side of the protective frame has a size less than or equal to the size of the photo-sensing chip.
4. The camera module of claim 1, wherein the bezel is resilient.
5. The camera module of claim 1, wherein the integral encapsulating frame is further configured to wrap an outer side of the bezel.
6. The camera module of any of claims 1-5, further comprising a lens holder, wherein the lens holder is disposed on the unitary package support and the optical lens is disposed on the lens holder.
7. The camera module of claim 6, wherein the lens support is integrally formed with the integral package support.
8. The camera module of claim 6, wherein the lens holder is a motor, and the motor is electrically connected to the circuit board.
9. The camera module according to any of claims 1-5, wherein the filter element is located between the photo-sensing chip and the optical lens, the top portion is a plane, and the filter element is disposed on the plane.
10. The camera module of claim 6, wherein the filter element is positioned between the photo-sensing chip and the optical lens, the top portion has a mounting groove, and the filter element is disposed in the mounting groove.
11. The manufacturing method of the camera module is characterized by comprising the following steps:
(a) connecting at least one photosensitive chip with at least one circuit board in a conduction manner;
(b) providing at least one protection frame, wherein the protection frame is arranged on the outer periphery side of a photosensitive area of the photosensitive chip, and a bonding layer is formed between the outer periphery side of the photosensitive area of the photosensitive chip and the protection frame so as to connect the protection frame and the outer periphery side of the photosensitive chip through the bonding layer;
(c) pressing the protective frame through the inner surface of the upper part of a mold of a forming mold so as to isolate a photosensitive area and a non-photosensitive area of the photosensitive chip;
(d) wrapping the non-photosensitive area of the circuit board and the photosensitive chip by using a forming material added into the forming mold so as to form an integrated packaging support integrally combined with the photosensitive chip and the circuit board after the forming material is cured, wherein the inner side surface of the integrated packaging support extends upwards from the top surface of the protection frame; and
(e) providing at least one optical lens, wherein the optical lens is set up in the sensitization route of sensitization chip, in order to make the module of making a video recording, the module of making a video recording includes a filter element, wherein the filter element set up in the top of integrative encapsulation support, integrative encapsulation support medial surface the bearer bar medial surface sensitization chip top surface with the filter element bottom surface forms an enclosure space.
12. The manufacturing method according to claim 11, wherein in the step (b), a protective film is provided on an upper portion of the protective frame so that the protective film corresponds to a light-sensing region of the light-sensing chip, and after the step (d), the protective film is removed from the protective frame.
13. The manufacturing method as claimed in claim 11, wherein in the above method, a recess is formed in the upper mold portion of the molding die at a portion corresponding to the photosensitive region, so that in the step (c), the inner surface of the upper mold portion is kept at a safe distance from the photosensitive region of the photosensitive chip.
14. The manufacturing method as claimed in claim 12, wherein in the above method, a recess is formed in the upper mold portion of the molding die at a portion corresponding to the photosensitive region, so that in the step (c), the inner surface of the upper mold portion is kept at a safe distance from the photosensitive region of the photosensitive chip.
15. The manufacturing method according to claim 11, wherein a cover film is provided on an inner surface of the upper mold portion of the molding die.
16. The manufacturing method according to claim 14, wherein a cover film is provided on an inner surface of the upper mold portion of the molding die.
17. The manufacturing method according to any one of claims 11 to 16, wherein in the step (d), the molding material further wraps an outer side surface of the protective frame to form the integrated package support integrally combined with the photosensitive chip, the wiring board, and the protective frame after the molding material is cured.
18. The manufacturing method according to any one of claims 11 to 16, wherein before the step (e), further comprising the step of:
and attaching at least one filter element to the top of the integrated packaging support, and keeping the filter element between the photosensitive chip and the optical lens.
19. The method of manufacturing of claim 17, wherein prior to the step (e), further comprising the step of:
and attaching at least one filter element to the top of the integrated packaging support, and keeping the filter element between the photosensitive chip and the optical lens.
20. The manufacturing method according to claim 11, wherein in the above method, glue is applied to an outer peripheral side of the protective frame and/or a photosensitive region of the photosensitive chip to form the glue layer after the glue is cured.
21. A method of manufacturing according to claim 20, wherein in the above method the glue is cured by thermal curing or UV light.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610278035.0A CN105827916B (en) | 2016-04-28 | 2016-04-28 | Camera module and manufacturing method thereof |
| US16/088,435 US11289521B2 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| EP23176877.1A EP4231653A3 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| PCT/CN2016/103247 WO2017166798A1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| KR1020187031125A KR102152516B1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly, manufacturing method thereof, and electronic device |
| EP16896568.9A EP3468165B1 (en) | 2016-03-28 | 2016-10-25 | Camera module and molded photosensitive assembly and manufacturing method therefor, and electronic device |
| JP2018550699A JP7025345B2 (en) | 2016-03-28 | 2016-10-25 | Camera modules and molded photosensitive assemblies and their manufacturing methods, and electronic devices |
| US16/082,533 US20190148429A1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| EP17765753.3A EP3429183A4 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| KR1020187029304A KR20180132684A (en) | 2016-03-12 | 2017-03-09 | Camera module, its photosensitive part and method of manufacturing the same |
| JP2018548099A JP7071926B2 (en) | 2016-03-12 | 2017-03-09 | Camera module and its photosensitive parts and their manufacturing method |
| KR1020217005352A KR102360319B1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| KR1020217005344A KR102294537B1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| PCT/CN2017/076041 WO2017157211A1 (en) | 2016-03-12 | 2017-03-09 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW106108217A TWI754632B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135674A TW202019155A (en) | 2016-03-12 | 2017-03-13 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW108135671A TWI769403B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135674D TWI758645B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135672A TWI742441B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135670D TWI758644B (en) | 2016-03-12 | 2017-03-13 | Camera module, photosensitive element and manufacturing method thereof |
| TW108135670A TW202017356A (en) | 2016-03-12 | 2017-03-13 | Camera module, and photosensitive component thereof and manufacturing method therefor |
| TW106203507U TWM559558U (en) | 2016-03-12 | 2017-03-13 | Camera module and light-sensing component |
| TW108117229A TWI706213B (en) | 2016-03-28 | 2017-03-25 | Camera module and its molded photosensitive component |
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| PCT/CN2017/082000 WO2017186120A2 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| KR1020187034256A KR102147896B1 (en) | 2016-04-28 | 2017-04-26 | Photographic module and molding photosensitive assembly thereof, semi-finished product of molding photosensitive assembly and manufacturing method and electronic device |
| JP2018556877A JP6865232B2 (en) | 2016-04-28 | 2017-04-26 | Imaging modules, their molding photosensitive assemblies, semi-finished products of molding photosensitive assemblies, their manufacturing methods, and electronic devices. |
| KR1020207019834A KR102281383B1 (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
| KR1020217022035A KR20210091363A (en) | 2016-04-28 | 2017-04-26 | Image capturing module and molded photosensitive assembly therefor, molded photosensitive assembly semi-finished product and manufacturing method, and electronic device |
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610278035.0A CN105827916B (en) | 2016-04-28 | 2016-04-28 | Camera module and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105827916A CN105827916A (en) | 2016-08-03 |
| CN105827916B true CN105827916B (en) | 2020-07-24 |
Family
ID=56527914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610278035.0A Active CN105827916B (en) | 2016-03-12 | 2016-04-28 | Camera module and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105827916B (en) |
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