CN113485054B

CN113485054B - Camera module for reducing stray light and photosensitive assembly thereof

Info

Publication number: CN113485054B
Application number: CN202110594997.8A
Authority: CN
Inventors: 赵波杰; 郭楠; 梅哲文; 田中武彦
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2017-09-28
Filing date: 2017-09-28
Publication date: 2022-12-06
Anticipated expiration: 2037-09-28
Also published as: CN109581785A; CN109581785B; CN113485054A

Abstract

Reduce stray light's module of making a video recording and sensitization subassembly thereof, this sensitization subassembly includes: the light filtering device comprises a circuit board, a photosensitive element, a molding base and a light filtering element, wherein the photosensitive element is operatively connected to the circuit board, the molding base is integrally combined with the circuit board and the photosensitive element to form an optical window, the light filtering element comprises a light filtering element main body and a light shielding layer arranged on the bottom side of the light filtering element main body, and the light shielding layer is used for enabling light to enter the optical window to reach the light passage of the photosensitive element and reducing stray light reaching the photosensitive element.

Description

Camera module for reducing stray light and photosensitive assembly thereof

Technical Field

The invention relates to the field of camera modules, in particular to a photosensitive assembly manufactured by a molding process and a camera module with the photosensitive assembly and capable of reducing stray light.

Background

The camera module is one of the parts of the intelligent electronic device that cannot be obtained, such as but not limited to a smart phone, a camera, a computer device, a wearable device, and the like. And along with the continuous development and the popularization of various smart machines, the requirement to the module of making a video recording is also higher and higher.

As shown in fig. 1A, the conventional COB process packaged camera module includes a circuit board 101, a photosensitive chip 102, a support 103, a filter 104, and a lens assembly 105. The circuit board 101 is mounted with a series of electronic components 106, and the mounting position of the bracket 103 is located outside the electronic components 106 mounted on the circuit board 101, so that a space 107 for avoiding the electronic components 105 is formed on the bottom side of the bracket 103. As shown in fig. 1A, it has a predetermined effect of removing stray light, for example, when the stray light M1 reaches the circuit board 101, it is reflected into the avoidance space 107, so as not to be reflected to the filter 104, and is reflected by the bottom surface of the filter 104 to reach the photosensitive chip 102 to form stray light.

The molding packaging technology of the camera module is a newly developed packaging technology based on the traditional COB packaging. As shown in fig. 1B, the camera module packaged by the conventional integrated package technology includes a circuit board 201, a photo sensor chip 202, a package portion 203, a filter 204, and a lens assembly 205. In this structure, the packaging part 203 is packaged in the circuit board 201 and the photosensitive chip 202 in an integrated packaging manner, so as to form an integrated packaging assembly, and the packaging part 203 covers a series of electronic components 206 of the circuit board 201 and a series of leads 207 electrically connecting the photosensitive chip 202 and the circuit board 201, so that the length, width and thickness of the camera module can be reduced, the assembly tolerance can be reduced, the lens assembly 205 above the integrated packaging assembly can be smoothly mounted, and the problem that dust attached to the electronic components 206 affects the imaging quality of the camera module is solved.

However, as shown in fig. 1B, since the encapsulating portion 203 integrally extends from the photosensitive chip 202 and embeds the electronic component 206 and the leads 207, the avoiding space 107 in the conventional COB is not required, but the integral encapsulating technique still has a problem of a certain degree of stray light, that is, the inner surface 2031 of the encapsulating portion 203 has a predetermined reflection effect on light, which may cause the light to be reflected to the photosensitive chip 202 to generate stray light. More specifically, as shown in the figure, a part of the light beam M2 reaching the inner surface 2031 of the packaging portion 203 is reflected to reach the bottom surface 2042 of the filter 204, and is further reflected to reach the photo chip 202 to form stray light. In addition, in order to reduce stray light, it is common practice to dispose a light shielding film 2041 on the top side of the filter 204, that is, the side of the filter 204 facing the lens assembly 205 is formed with the light shielding film 2041, so that a light-transmitting region is formed in the middle of the filter 204, and part of the stray light M3 can be blocked by the light shielding layer 2041 to prevent it from entering the package portion 201, but the light shielding film 2041 cannot solve the stray light generated by the light M2.

In addition, to facilitate demolding, the inner surface 2031 of the package 203 is generally formed to integrally extend obliquely from the photosensitive chip 202, which results in a reduction in the area of the top surface of the package 203, and the top side of the package 203 requires components such as the upper optics of the camera module, e.g., the lens assembly 205, or additional lens holders. However, the smaller area of the top surface of the encapsulant 203 may not provide a sufficient mounting surface for the upper optics of the camera module, such that the upper optics cannot be securely mounted.

Disclosure of Invention

An objective of the present invention is to provide a camera module and a photosensitive assembly thereof, in which a light-shielding layer is disposed on a bottom side of a filter body of a filter element of the photosensitive assembly of the camera module, so that an effective light-transmitting region is formed in a central region of the filter body to reduce stray light reaching an interior of a molding base.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof, wherein at least a portion of light reflected by an inner surface of the mold base after entering the mold base can be absorbed by the light-shielding layer, so as to prevent the light from being reflected by the light-filtering element and reaching a photosensitive element to form stray light.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof that reduce stray light, wherein the light shielding layer is located between a filter element body of the filter element and the mold base, thereby reducing light emitted toward the inner surface of the mold base and effectively avoiding stray light.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof capable of reducing stray light, wherein in some embodiments, the filter element is attached to the mold base, wherein a light-suppressing groove is formed between the light-shielding layer and the inner surface of the mold base at the outer peripheral portion of the light window of the mold base, and at least a portion of stray light entering the light-suppressing groove is reflected by the inner surface of the mold base and absorbed by the light-shielding layer, thereby effectively suppressing stray light from being emitted from the light-suppressing groove.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof, wherein the photosensitive assembly further includes a filter element support, the filter element is assembled in a top groove of the filter element support, the filter element support is assembled in the molding base, wherein a light-suppressing groove is formed at an outer peripheral portion of an optical window of the molding base between the light-shielding layer, an inner surface of the filter element support and the inner surface of the molding base, and at least a portion of the stray light entering the light-suppressing groove is reflected by the inner surface of the molding base and absorbed by the light-shielding layer, so as to effectively suppress the stray light from being emitted from the light-suppressing groove.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof, wherein the photosensitive assembly further includes a filter element holder, the filter element holder is assembled in a bottom groove of the filter element holder, the filter element holder is assembled in the molding base, wherein a light-suppressing groove is formed between the light-shielding layer and the inner surface of the molding base at the outer peripheral portion of the optical window of the molding base, and at least a portion of the stray light entering the light-suppressing groove is reflected by the inner surface of the molding base and absorbed by the light-shielding layer, so as to effectively suppress the stray light from being emitted from the light-suppressing groove.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof, wherein the filter element further includes a top shielding layer disposed on the top surface of the filter element body, so that both sides of the filter element body have light blocking and absorbing structures, thereby further enhancing the effect of reducing the stray light reaching the photosensitive element.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof, wherein the shielding layer is a black absorptive material, and can absorb most of the light energy, and a very small portion of the light can be reflected, so as to effectively absorb the stray light.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof capable of reducing stray light, wherein in some embodiments, when the filter element is assembled in the bottom groove of the filter element holder, the position of a bottom lens of the lens can be moved downward, thereby reducing the back focal length of the camera module and further reducing the height of the camera module.

It is an object of the present invention to provide a camera module and a light sensing assembly thereof with reduced stray light, wherein in some embodiments, the mold base includes a light sensing element engaging portion and a top side extension portion integrally extending, the inner surfaces of which have different extension angles, wherein the top side extension portion has a smaller included angle with the optical axis, thereby increasing the area of the top surface of the top side extension portion, thereby providing a larger area mounting surface for a lens or filter holder or lens assembly above the camera module for securely mounting the lens, filter holder or lens assembly.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof, which can reduce stray light, wherein in some embodiments, the top-side extension portion has a smaller angle with an optical axis, so as to reduce the area of the filter element.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof, wherein the light shielding layer reduces light incident on the inner surface of the top-side extension portion, so as to prevent the light incident on the inner surface of the top-side extension portion from being reflected to reach the photosensitive element to form stray light, which affects the imaging quality of the camera module.

An object of the present invention is to provide a camera module and a photosensitive assembly thereof, which can reduce stray light, wherein in some embodiments, an included angle between the top-side extending portion and an optical axis is smaller than an included angle between the photosensitive element combining portion and the optical axis, so as to prevent a light window forming portion of a forming die from pressing on a connecting line connecting the photosensitive element and the circuit board in a molding process, thereby damaging the connecting line.

It is an object of the present invention to provide a camera module and a photosensitive assembly thereof with reduced stray light, wherein in some embodiments, the photosensitive element bonding portion and the top side extension portion cooperate with each other, the structure of the photosensitive element bonding portion facilitates demolding and stray light reduction, and the top side extension portion is used for increasing the area of the top surface of the molding base and the structure of the top side extension portion prevents the connecting wire from being crushed by a pressing head in a molding process.

To achieve at least one of the above objects, the present invention provides a photosensitive assembly of a camera module, including:

a circuit board;

a photosensitive element, said photosensitive element being operatively connected to said circuit board;

a molding base integrally combined with the circuit board and the photosensitive element and forming an optical window; and

and the light shielding layer forms a light passage for enabling light to enter the light window and reduces stray light reaching the photosensitive element.

According to another aspect of the present invention, the present invention further provides a camera module, which includes:

a lens;

a circuit board;

and the light filtering element is positioned between the lens and the photosensitive element and comprises a light filtering element body and a light shielding layer arranged at the bottom side of the light filtering element body, and the light shielding layer is used for enabling light to enter a light passage of the light window and reducing stray light reaching the photosensitive element.

According to another aspect of the present invention, the present invention further provides an electronic device, which includes one or more of the camera modules described above. Including, but not limited to, cell phones, computers, televisions, smart wearable devices, vehicles, cameras, and surveillance equipment.

Drawings

Fig. 1A is a schematic structural view of a camera module according to a conventional COB process.

Fig. 1B is a schematic structural diagram of a camera module formed by a conventional integrated packaging process.

Fig. 2 is a schematic exploded perspective view of a camera module according to a first preferred embodiment of the present invention.

Fig. 3A isbase:Sub>A sectional view of the camera module according to the first preferred embodiment of the present invention taken along the linebase:Sub>A-base:Sub>A in fig. 2.

Fig. 3B is a schematic diagram illustrating the principle of reducing stray light of the photosensitive component of the camera module according to the first preferred embodiment of the present invention.

Fig. 4A is a cross-sectional view of a camera module according to a variant of the above-described first preferred embodiment of the present invention.

Fig. 4B is a schematic diagram of the principle of reducing stray light of the photosensitive member of the image pickup module according to a modified implementation of the above-described first preferred embodiment of the present invention.

Fig. 5A is a schematic structural diagram of a camera module according to a second preferred embodiment of the invention.

Fig. 5B is an enlarged schematic view of B in fig. 5A.

Fig. 6A is a schematic diagram illustrating that the bottom-side light-shielding layer of the photosensitive element of the camera module according to the second preferred embodiment of the invention can reduce the stray light reflected to the photosensitive element more effectively than the top-side light-shielding layer in fig. 6B.

Fig. 6B is a schematic diagram illustrating an optical path of the light filter element of the photosensitive member with the light shielding layer attached to the top side.

Fig. 7A is a sectional view illustrating the molten molding material pushed into the base forming guide groove in the molding die in the molding process according to the second preferred embodiment of the present invention.

Fig. 7B is a sectional view showing the case where the base forming guide groove is filled with the molten molding material according to the above-described second preferred embodiment of the present invention.

Fig. 7C illustrates a cross-sectional view of the molded base formed by performing the demolding step according to the above-described second preferred embodiment of the present invention.

Fig. 8A is a schematic diagram illustrating that the light-shielding layers are attached to two sides of the photosensitive component according to a modified embodiment of the second preferred embodiment of the present invention, so as to effectively reduce stray light.

Fig. 8B illustrates a sectional view of a camera module according to another modified embodiment of the above second preferred embodiment of the present invention.

Fig. 9 is a sectional view illustrating a camera module according to another modified example of the above-described second preferred embodiment of the present invention.

Fig. 10 illustrates a cross-sectional view of a camera module according to another variant of the above second preferred embodiment of the present invention.

Fig. 11 is a perspective exploded view illustrating a camera module according to a third preferred embodiment of the present invention.

Fig. 12A is a sectional view of the camera module according to the third preferred embodiment of the present invention taken along the line C-C of fig. 11.

Fig. 12B is an enlarged schematic view at D in fig. 12A.

Fig. 13A is a schematic diagram illustrating that the bottom-side light-shielding layer of the photosensitive element of the camera module according to the third preferred embodiment of the invention can more effectively reduce the stray light reflected to the photosensitive element compared to the top-side light-shielding layer in fig. 13B.

Fig. 13B is a schematic diagram illustrating an optical path of the light filter element top-side light shielding layer of the photosensitive member.

Fig. 14A is a sectional view of a camera module according to a variation of the above-described third preferred embodiment of the present invention.

Fig. 14B is a sectional view of a camera module according to another modified embodiment of the above-described third preferred embodiment of the present invention.

Fig. 15 is a schematic exploded perspective view of a camera module according to a fourth preferred embodiment of the invention.

Fig. 16 is a sectional view of the camera module according to the fourth preferred embodiment of the present invention taken along the line E-E in fig. 15.

Fig. 17A is a schematic diagram illustrating that the bottom-side light-shielding layer of the photosensitive element of the camera module according to the fourth preferred embodiment of the invention can more effectively reduce the stray light reflected to the photosensitive element compared to the top-side light-shielding layer in fig. 17B.

Fig. 17 is a schematic view illustrating an optical path of a light filter element of a photosensitive member with a light shielding layer attached to a top side.

Fig. 18 is a sectional view illustrating a camera module according to a modified embodiment of the fourth preferred embodiment of the present invention.

Fig. 19 is a sectional view illustrating a camera module according to another modified embodiment of the fourth preferred embodiment of the present invention.

Fig. 20 is a schematic structural diagram of the camera module according to the present invention applied to an intelligent electronic device.

Detailed Description

The following description is provided to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships that are based on those shown in the drawings, which are merely for convenience in describing the present disclosure and to simplify the description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus the terms above should not be construed as limiting the present disclosure.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Fig. 2 to 3B show a camera module 100 and a photosensitive assembly 10 thereof according to a first preferred embodiment of the present invention. The camera module 100 can be applied to various electronic devices 300, as shown in fig. 20, the electronic device 300 includes a device body 301 and one or more camera modules 100 installed on the device body 301, the electronic device 300 is, for example and without limitation, a smart phone, a wearable device, a computer device, a television, a vehicle, a camera, a monitoring device, and the like, and the camera modules cooperate with the electronic device to capture and reproduce images of a target object.

More specifically, the image capturing module 100 illustrated in the figure includes the photosensitive element 10 and a lens 30. The photosensitive assembly 10 includes a circuit board 11, a mold base 12, a photosensitive element 13 and a filter element 14, wherein the mold base 12 includes a base body 121 integrally formed on the circuit board 11 and the photosensitive element 13 and forming an optical window 122, and the optical window 122 is a closed space and provides a light path for the photosensitive element 13. The mold base 12 of the present invention is integrally molded with the circuit board 11 and the photosensitive element 13 through a molding process, such as a transfer molding process, so that the mold base 12 can replace a lens holder or a bracket of a conventional camera module, and the lens holder or the bracket does not need to be attached to the circuit board 11 by glue, similar to the conventional packaging process.

The circuit board 11 may be a hard board, a soft board, a rigid-flex board, a ceramic substrate, or the like. In this embodiment, the circuit board 11 is a rigid-flex board, which includes a substrate 111 and a plurality of electronic components 112 formed on the substrate 111, such as by SMT, and the electronic components 112 include, but are not limited to, resistors, capacitors, driving devices, and the like. In this embodiment of the present invention, the mold base 12 integrally covers the electronic component 112, so as to prevent dust and impurities from adhering to the electronic component 112 and further contaminating the photosensitive element 13, which affects the imaging effect, like in a conventional camera module. It is understood that the circuit board 11 may not have the electronic component 112, and the electronic component 112 may be mounted on the top surface of the substrate 111, may be mounted on the bottom surface of the substrate 111, or may be embedded in the substrate 111. When disposed on the top surface of the substrate 111, the electronic components 112 may be disposed around the photosensitive element 13 and located on multiple sides of the photosensitive element 13, for example, the electronic components 112 may be disposed on two pairs of opposite sides of the photosensitive element 13, or on one pair of opposite sides of the electronic components 112.

The circuit board 11 and the photosensitive element 13 are operatively connected, and as shown in the figure, the circuit board 11 and the photosensitive element 13 have electrical connection elements, such as pads, on their surfaces, respectively, and are connected by one or more sets of connection wires 15, and the molding base 12 integrally embeds the connection wires 15.

In this embodiment of the invention, the top side of the mold base 12 forms a flat surface for mounting the filter element 14. The filter element 14 includes a filter element body 141 and a light shielding layer 142, and the filter element body 141, which may be an infrared filter element, is located on the top side of the mold base 12 and between the photosensitive element 13 and the lens 30 to filter infrared rays passing through the lens 30. The filter element body 141 material may include an IR film (infrared cut film), an AR film (antireflection coating), white glass, blue glass, a resin material, a coating composite material, crystal, and the like. The light shielding layer 142 is located at the bottom side of the filter element body 141 and between the filter element body 141 and the mold base 12, and the light shielding layer 142 is a light absorbing material, which makes the filter element body 141 form a middle effective light transmitting area 1411 and a peripheral area 1412, so that light passing through the lens 30 can only pass through the effective light transmitting area 1411 and reach the inside of the mold base 12. The light-shielding layer 142, which is an annular structure, has a window formed in the middle, that is, the light-shielding layer 142 forms a light path 1420 for effective light to enter the light window 122 and then reach the light-sensing element 13 and reduces stray light reaching the light-sensing element 13.

The photosensitive element 13 has a photosensitive region 131 in the middle and a non-photosensitive region 132 around the photosensitive region 131, and the light shielding layer 142 has an inner edge 1421 and an outer edge 1422. The distance between the inner edge 1421 of the light shielding layer 142 and the optical axis X is greater than or equal to, or slightly smaller than, the distance between the outer edge 1311 of the photosensitive region 131 and the optical axis X. That is, the area of the light path 1420 is equal to or slightly smaller than the area of the photosensitive region 131.

The outer edge 1422 of the light shielding layer 142 is located outside the inner edge 1241 of the top surface 124 of the mold base 12, i.e., no light-transmitting region is formed between the inner edge 1241 of the top surface 124 of the mold base 12 and the outer edge 1422 of the light shielding layer 142.

That is, compared to the prior art shown in fig. 1B, the light shielding layer 142 of the present invention is disposed on the side of the filter element body 141 adjacent to the photosensitive element 13, unlike the light shielding film 2041 in fig. 1B disposed on the side of the filter 204 facing the lens assembly 205 thereof. That is, the light shielding layer 142 of the present invention is formed on the outer edge of the bottom surface of the filter element body 141 to block stray light from reaching the photosensitive element 13.

More specifically, as shown in fig. 3B, a part of the stray light L11 reaching the upper surface of the filter element body 141 of the filter element 14 is reflected by the upper surface of the filter element body 141 and does not enter the light window 122 of the mold base 12, and when refracted to enter the surrounding area 1412 outside the light-transmitting area 1411 above the light-shielding layer 142, the stray light is absorbed by the light-shielding layer 142 and cannot enter the light window 122 inside the mold base 12, so that the purpose of blocking a part of the stray light is achieved.

In this embodiment of the present invention, the inner surface of the mold base 12 preferably has a central symmetric structure, and has an inclined inner surface 123 extending obliquely upward from the photosensitive element 13, and when another portion of the stray light L12 passes through the effective light-transmitting region 1411 of the filter element body 141 and enters the inner surface 123, the other portion of the stray light L12 is reflected by the inclined inner surface 123 of the mold base 12 to the light-shielding layer 142 and is absorbed by the light-shielding layer 142, so that the stray light is not further reflected to reach the photosensitive element 13, which affects the imaging quality of the camera module 100.

That is, by disposing the light shielding layer 142 between the mold base 12 and the filter element body 141, stray light directed to the inclined inner surface 123 of the mold base 12 can be effectively absorbed, while in fig. 1B, the light shielding film 2041 is formed on the top surface of the filter 204, so that the stray light M2 reaching the bottom surface of the filter 204 is reflected to the photo chip 202, which affects the imaging quality of the module.

Accordingly, the light shielding layer 142 is adjacent to the inner surface 123 of the mold base 12, and between the two, an outer portion of the light window 122 forms a light suppressing groove 1221, and the light suppressing groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in fig. 3B, the stray light L12 enters the light-suppressing groove 1221, and is suppressed from being emitted from the light-suppressing groove 1221. More specifically, the stray light L12 can be reflected only at the inclined inner surface 123 and absorbed by the light shielding layer 142, so that the optical path of the stray light L12 is maintained in the light suppressing grooves 1221, thereby effectively reducing the stray light reaching the photosensitive element 13.

As shown in fig. 3B, the inclined inner surface 123 extends downward from the light-shielding layer 142, the light-shielding layer 142 extends horizontally from the inclined inner surface 123, and an included angle γ is formed between the light-shielding layer 142 and the inclined inner surface 123, where the included angle γ is an acute angle or a right angle, so as to prevent light incident on the inclined inner surface 123 from being reflected to the light-sensing element 13 to form stray light.

In addition, the light shielding layer 142 is provided on the bottom surface of the filter element body 141, and stray light directly emitted to the inner surface 123 of the mold base 12 can be reduced compared to the light shielding layer provided on the top surface of the filter element body 141.

It is understood that in this embodiment of the present invention, the lens 30 is assembled to the top surface 124 of the mold base 12 to form a focus camera module. In other embodiments, the lens 30 may be assembled to a lens barrel that is mounted to the top surface 124 of the mold base 12. Alternatively, in another embodiment, the lens 30 may be assembled with an actuator mounted to the top surface 124 of the mold base 12, thus forming an autofocus camera module.

The filter element 141 may be attached to the top surface 124 of the mold base 12, such as by being glued to the top surface 124 of the mold base 12. The light shielding layer 142 may be formed on the bottom surface of the filter element body 141 in various manners, such as adhering to the bottom surface of the filter element body 141, or the light shielding layer 142 is formed on the bottom surface of the filter element body 141 by using a photolithography process or a silk screen process.

The light shielding layer 142 may be applied to the bottom surface of the filter element body 141 by photolithography, which is a conventional photolithography process. The step of coating the light shielding layer 142 on the bottom surface of the filter element body 141 by using a yellow light process includes the following steps: cleaning and drying the filter element body 141; priming the filter element body 141, and spin-coating a photoresist on the filter element body 141; soft baking the filter element body 141; performing alignment exposure on the filter element body 141; post-baking the filter element body 141; developing the filter element body 141; hard baking the filter element body 141; the filter element body 141 is etched to finally form the filter element 14. The photoresist is a black absorptive material, and can absorb most of the light energy incident on the light-shielding layer 142, for example, more than 95% of the light energy can be absorbed, and only a very small portion of the light can be reflected after being incident on the light-shielding layer 142.

The photoresist used in the yellow light process is a photosensitive material, has unique characteristics, and can be chemically changed into substances which are easily soluble in acid or alkali under the action of UV light. Coating photoresist on a substrate, providing a corresponding photomask according to the required shape of a product, covering the photomask on the photoresist, exposing the photoresist to ensure that the photoresist region which is not covered by the photomask is subjected to chemical change, and dissolving or reserving the photoresist by using acid or alkali to form a pattern which is the same as or complementary to the shape of the photomask. The photoresist used in the present invention is opaque coating, which has the characteristics of opacity in addition to the photosensitive characteristics of the conventional photoresist, thereby forming the light shielding layer 142 that absorbs stray light.

The photomask of the present invention may adopt an annular photomask having the same shape as the light-shielding layer 142, for example, the photoresist is coated on the bottom surface of the light filter element body 141 during the manufacturing process, the photomask is covered on the photoresist for exposure, the photoresist which is chemically changed in the middle needs to be removed after the exposure, the light-shielding layer 142 is formed in the region covered by the photomask, the outer frame edge of the photomask determines the position of the outer edge 1422 of the light-shielding layer 142, and the inner frame edge of the photomask determines the position of the inner edge 1421 of the light-shielding layer 142.

In addition, it should be noted that, when the yellow light process is adopted, the thickness of the light-shielding layer 142 is relatively small, and may be, for example, 2 μm to 3 μm.

In the silk-screen process, the light shielding layer 142 is coated on the bottom surface of the filter element main body 141 by using the silk-screen process, which specifically includes the following steps: applying a light absorbing ink to the filter element body 141 through a screen plate; the filter element 14 is obtained by baking the filter element body 141 coated with the above light absorbing ink. Accordingly, the ink is a black absorptive opaque material, which can absorb most of the light energy incident on the light-shielding layer 142, for example, can absorb more than 95% of the light energy, and only a very small portion of the light can be reflected after being incident on the light-shielding layer 142. Through the silk-screen printing process, the thickness of the light shielding layer can be 7-12 microns.

As shown in fig. 4A and 4B, according to a variant of the above first embodiment of the present invention, the photosensitive assembly 10 of the camera module 100 includes the circuit board 11, the mold base 12, the photosensitive element 13 and the filter element 14. Wherein the mold base 12 has a top side recess 125 on a top side thereof, the top side recess 125 being used for assembling the filter element 14. That is, in this embodiment of the present invention, the top surface 124 of the mold base 12 may be a multi-step surface, for example, as illustrated in fig. 4A and 4B, the top surface 124 is divided into a plurality of portions of non-coplanar top surfaces, such as a first portion top surface 124A and a second portion top surface 124B, the first portion top surface 124A is recessed relative to the second portion top surface 124B toward the photosensitive element 13, so that the top groove 125 is formed on the top side of the first portion top surface 124A, and the filter element 14 is assembled to the top groove 125, thereby reducing the distance between the filter element 14 and the photosensitive element 13 and reducing the overall size of the camera module 100.

Accordingly, the outer edge 1422 of the light shielding layer 142 is located outside the inner edge 1241 of the first portion top surface 124a of the mold base 12, i.e., no light-transmitting region is formed between the inner edge 1241 of the first portion top surface 124a of the mold base 12 and the outer edge 1422 of the light shielding layer 142.

As shown in fig. 4B, a part of the stray light L21 incident on the upper surface of the filter element body 141 of the filter element 14 is reflected by the upper surface of the filter element body 141 and does not enter the light window 122 of the mold base 12, and when refracted to enter the surrounding region 1412 outside the light-transmitting region 1411 above the light-shielding layer 142, the stray light is absorbed by the light-shielding layer 142 and cannot enter the light window 122 inside the mold base 12, so as to block a part of the stray light.

In this embodiment of the present invention, the mold base 12 has an inner surface 123 extending obliquely upward integrally from the photosensitive element 13, which includes a multi-part inner surface, shown as a bottom-part inner surface 123a and a top-part inner surface 123b. The bottom portion inner surface 123a is integrally extended obliquely from the photosensitive element 13, the top portion inner surface 123b is integrally extended from the first portion top surface 124a, and the top groove 125 is formed at an inner side of the second portion inner surface 123b and a top side of the first portion top surface 124 a. When another part of the stray light L22 passes through the effective light-transmitting region 1411 of the filter element body 141 and is incident on the bottom-side inner surface 123a, the other part of the stray light L is reflected by the bottom-side inner surface 123a of the mold base 12 to the light-shielding layer 142 and is absorbed by the light-shielding layer 142, so that the stray light L is not further reflected to reach the light-sensing element 13, which affects the imaging quality of the camera module 100.

That is, by disposing the light shielding layer 142 between the mold base 12 and the filter element body 141, stray light directed to the bottom-side portion inner surface 123a of the mold base 12 can be effectively absorbed, and accordingly, the light shielding layer 142 is adjacent to the bottom-side portion inner surface 123a of the mold base 12, the bottom-side portion inner surface 123a of the mold base 12 extends downward from the light shielding layer 142, and between both, a space for suppressing the stray light from being emitted is formed in an outer portion of the light window 122 with a light suppressing groove 1221, so that the stray light L22 enters into the light suppressing groove 1221 and cannot be emitted in the light suppressing groove 1221. More specifically, the stray light L12 can be reflected only at the bottom-side portion inner surface 123a and absorbed by the light shielding layer 142, so that the optical path of the stray light L12 is maintained in the light suppressing groove 1221, thereby effectively reducing the stray light reaching the photosensitive element 13.

Referring to fig. 5A to 7C, a camera module 100 and a photosensitive assembly 10 thereof according to a second preferred embodiment of the present invention, similarly, the camera module 100 includes the photosensitive assembly 10, the lens 30 and a lens bearing element 40. The lens 30 is assembled to the lens carrier 40 to form a lens assembly. The lens carrier 40 may be an actuator or a fixed barrel. In this embodiment, the lens bearing element is a driver, and the driver can be implemented as a voice coil motor, a piezoelectric motor, a thermodynamic driver, a micro-electromechanical driver, or the like, so as to realize an auto-focusing function, thereby forming an auto-focusing camera module.

Correspondingly, the photosensitive assembly 10 includes a circuit board 11, a molding base 12, a photosensitive element 13 and a filter element 14, the molding base 12 includes a base body 121 integrally formed on the circuit board 11 and the photosensitive element 13 and forming an optical window 122, the optical window 122 is a closed space and provides a light path for the photosensitive element 13.

The filter element 14 includes a filter element body 141 and a light shielding layer 142, the light shielding layer 142 is located at the bottom side of the filter element body 141 and located between the filter element body 141 and the mold base 12, the light shielding layer 142 is a light absorbing material, which enables the filter element body 141 to form a middle effective light transmitting area 1411 and a peripheral area 1412, and light passing through the lens 30 can only reach the interior of the mold base 12 through the effective light transmitting area 1411. The light-shielding layer 142, which is an annular structure, has a window formed in the middle, that is, the light-shielding layer 142 forms a light path 1420 for light to enter the light window 122 and then reach the light-sensing element 13 and reduces stray light reaching the light-sensing element 13.

The photosensitive element 13 has a photosensitive region 131 in the middle and a non-photosensitive region 132 around the photosensitive region 131, and the light shielding layer 142 has an inner edge 1421 and an outer edge 1422. The distance between the inner edge 1421 of the light shielding layer 142 and the optical axis X is greater than or equal to, or slightly smaller than, the distance between the outer edge 1311 of the photosensitive region 131 and the optical axis X.

In this embodiment of the present invention, the inner surface of the base body 121 of the mold base 12 preferably has a central symmetrical structure including a plurality of portions having inner surfaces extending in different directions, for example, the base body 121 of the mold base 12 includes three portions, i.e., a photosensitive element bonding portion 1211 and a top side extension portion 1212 located around the light window 122 shown in fig. 5A, and a circuit board bonding portion 1213 located around the photosensitive element 13 and integrally bonded to the outer peripheral surface of the photosensitive element 13 and the top surface of the circuit board 11, which are integrally extended to form an integral structure. The photosensitive element combining portion 1211 and the photosensitive element combining portion 1211 have inner surfaces integrally extended from the photosensitive element 13, which are defined as a first portion inner surface 1231 of the mold base 12, and the topside extension portion 1212 has an inner surface integrally extended from the photosensitive element combining portion 1211, which is defined as a second portion inner surface 1232 of the mold base 12, the second portion inner surface 1232 integrally extending from the first portion inner surface 1231.

The inner surfaces 1231 and 1232 of the light sensing element combining portion 1211 and the top side extension portion 1212 extend at different slopes, respectively, the second portion inner surface 1232 of the top side extension portion 1212 extends upward at a greater slope with respect to the first portion inner surface 1231 of the light sensing element combining portion 1211, or the second portion inner surface 1232 of the top side extension portion 1212 extends upward nearly without a slope, that is, the second portion inner surface 1232 of the top side extension portion 1212 extends substantially perpendicular to the top surface of the light sensing element 13, the top side extension portion 1212 becomes a vertical extension portion, so that the area of the top surface of the top side extension portion 1212 can be relatively large, that is, the top surface of the top side extension portion 1212 determines the area of the top surface 124 of the molding base 12, and the extending structure of the light sensing element combining portion 1211 and the top side extension portion 1212 can increase the area of the top surface 124 of the molding base 12, so that a larger mounting area can be provided for a lens or a lens assembly above the light sensing assembly 10, so that a lens or a lens assembly above can be mounted more firmly, and the area of the filter element 14 can be reduced.

That is, in order to facilitate the demolding of the molding process and prevent the stray light, the photosensitive element combining portion 1211 is formed in a structure in which the first portion inner surface 1231 defined by the inner surface thereof extends upward from the photosensitive element 13 with a relatively small slope, and the second portion inner surface 1232 defined by the inner surface of the top-side extending portion 1212 integrally extends from the first portion inner surface 1231 while turning, and extends upward with a relatively large slope or without a slope, that is, an included angle is formed between the second portion inner surface 1232 of the molding base 12 and the first portion inner surface 1231, so that the area size of the top surface 124 of the molding base 12 can be effectively increased with respect to the upward extension with a slope of a fixed slope.

As shown in fig. 5B, an included angle between the first portion inner surface 1231 defined by the inner surface of the photosensitive element combining portion 1211 and the optical axis X of the image capturing module 100 is α, an included angle between the second portion inner surface 1232 defined by the inner surface of the top-side extending portion 1212 and the optical axis X of the image capturing module 100 is β, where α is in a range from 3 ° to 80 °, β is in a range from 0 ° to 10 °, and α > β. For example, in one embodiment, α has a value of 3 °, β has a value of 0 °; in one embodiment, α has a value of 30 °, β has a value of 0 °; in one embodiment, α has a value of 60 °, β has a value of 0 °; in one embodiment, α has a value of 45 °, β has a value of 5 °; in one embodiment, α has a value of 80 ° and β has a value of 10 °.

That is, the included angle β between the second partial inner surface 1232 defined by the inner surface of the top-side extending portion 1212 and the optical axis X of the camera module 100 is smaller than the included angle α between the first partial inner surface 1231 defined by the inner surface of the photosensitive element combining portion 1211 and the optical axis X of the camera module 100, so that the second partial inner surface 1232 of the top-side extending portion 1212 extends upward with a larger slope or in a direction perpendicular to the photosensitive element 13, thereby increasing the area of the top surface 124 of the mold base 12.

As shown in fig. 5B, in the preferred embodiment of the present invention, preferably, the thickness H1 of the photosensitive element combining portion 1211 ranges from 0.05mm to 0.7mm, and the thickness H2 of the top side extension portion 1212 ranges from 0.02mm to 0.6mm. For example, in one embodiment, the thickness H1 of the photosensitive element combining portion 1211 is in a range of 0.08mm, and the thickness H2 of the top side extension portion 1212 is in a range of 0.5mm; in one embodiment, the thickness H1 of the photosensitive element combining portion 1211 is in a range of 0.4mm, and the thickness H2 of the top side extension portion 1212 is in a range of 0.3mm; in one embodiment, the thickness H1 of the photosensitive element combining portion 1211 ranges from 0.5mm, and the thickness H2 of the top side extension portion 1212 ranges from 0.1mm.

It is understood that the second portion inner surface 1232 of the top side extension 1212 is turned from the first portion inner surface 1231 to extend in a direction having a smaller angle with the optical axis X, so that the pressing head pressed on the photosensitive element 13 can avoid the connecting wire 15 between the circuit board 11 and the photosensitive element 13 in the molding process, thereby preventing the connecting wire 15 from being crushed. That is, in some cases, if the mold base 12 to be formed extends with a relatively small constant slope, such as an angle of 45 ° to 80 ° between the inner surface and the optical axis X, the pressing head pressed against the photosensitive element 13 during the molding process may hit the connection line 15 to cause damage to the connection line 15.

As shown in fig. 6A, an included angle α between the first portion inner surface 1231 defined by the inner surface of the light-sensing element combining portion 1211 and the optical axis X of the image capturing module 100 may be relatively large, so that the light L32 incident on the first portion inner surface 1231 is not directly reflected to the light-sensing element 13 to form stray light. That is, the light-sensing element combining portion 1211 and the top-side extension portion 1212 cooperate with each other, the structure of the light-sensing element combining portion 1211 facilitates mold release and reduces stray light, and the top-side extension portion 1212 is used to increase the area of the top surface 124 of the mold base 12 and the structure of the top-side extension portion 1212 prevents the connecting wire 15 from being crushed by a ram during the molding process. That is, preferably, the position 1230 where the first partial inner surface 1231 and the second partial inner surface 1232 are connected is located inside the connection line 15. The turning point between the photosensitive element combining portion 1211 and the top side extension portion 1212 does not exceed the position of the connecting wire 15, i.e. the photosensitive element combining portion 1211 completes the transition to the top side extension portion 1212 before extending to the position of the connecting wire 15, so as to avoid the connecting wire 15 from being crushed by a pressing head in the molding process. For example, when the top extension 1212 is a vertical extension, the distance between the position of the inner edge 1241 of the top surface 124 of the mold base 12 and the optical axis X of the camera module is not smaller than the distance between the connection line 15 and the optical axis X of the camera module, so that the top extension 1212 increases the area of the top surface 124 of the mold base 12.

As shown in fig. 6B, when the filter element 14 is provided with the light shielding layer 143 only on the top side, it can absorb a part of the light N31, but the light N32 is reflected by the mold base and the bottom surface of the filter element to form stray light.

When the light shielding layer 142 is disposed on the bottom side of the filter element 14, as shown in fig. 6A, part of the stray light L31 incident on the upper surface of the filter element body 141 of the filter element 14 is reflected by the upper surface of the filter element body 141 and does not enter the light window 122 of the mold base 12, and is refracted to enter the surrounding region 1412 outside the light transmitting region 1411 above the light shielding layer 142, and is absorbed by the light shielding layer 142 and cannot enter the light window 122 inside the mold base 12, so as to block part of the stray light.

When another portion of the stray light L32 passes through the effective light-transmitting region 1411 of the filter element body 141 and is incident on the first portion of the inner surface 1231, the other portion of the stray light L is reflected by the inclined first portion of the inner surface 1231 of the mold base 12 upwards to the light-shielding layer 142 or further reflected by the second portion of the inner surface 1232 to the light-shielding layer 142, so as to be absorbed by the light-shielding layer 142, and thus is not further reflected to reach the photosensitive element 13, which affects the imaging quality of the camera module 100.

Accordingly, the light shielding layer 142 is adjacent to the second partial inner surface 1232 of the mold base 12, the second partial inner surface 1232 of the mold base 12 extends downward from the light shielding layer 142, and an outer portion of the light window 122 forms a light-suppressing groove 1221 between the light shielding layer 142, the first partial inner surface 1231 and the second partial inner surface 1232, and the light-suppressing groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in fig. 6A, the stray light L32 enters the light-suppressing groove 1221 and cannot exit the light-suppressing groove 1221.

It can be understood that, because the light shielding layer 142 is adjacent to the second portion inner surface 1232 of the mold base 12, the light shielding layer 142 effectively reduces the light that passes through the filter element body 141 and reaches the second portion inner surface 1232, so as to avoid the light that is incident on the second portion inner surface 1232 being reflected by the second portion inner surface 1232 and reaching the photosensitive element 13 to form stray light and affect the imaging quality of the camera module 100.

As shown in fig. 6A, the second portion inner surface 1232 extends downward from the light shielding layer 142, the light shielding layer 142 extends from the second portion inner surface 1232 in the horizontal direction, an included angle γ is formed between the light shielding layer 142 and the second portion inner surface 1232, and the included angle γ is an acute angle or a right angle, so that the light-suppressing groove 1221 formed in such a structure prevents the light incident to the inner surface 123 from being reflected to the light-sensing element 13 to form stray light.

Fig. 7A to 7C are schematic views illustrating a manufacturing process of an integrated assembly of the circuit board 11, the mold base 12 and the photosensitive element 13 of the photosensitive assembly 10 according to the present invention. The manufacturing apparatus 200 includes a forming mold 210, the forming mold 210 includes a first mold 211 and a second mold 212 capable of opening and closing a mold, that is, a mold fixing device capable of separating and closely fitting the first mold 211 and the second mold 212 to form a forming cavity 213, when closing the mold, the circuit board 11 connected to the photosensitive element 13 is fixed in the forming cavity 213, and the fluid molding material 16 enters the forming cavity 213 to be integrally formed on the circuit board 11 and the photosensitive element 13, and after being cured, the molding base 12 integrally formed on the circuit board 11 and the photosensitive element 13 is formed. It will be appreciated that the integral components described above are typically produced in a panel-to-panel manner during the manufacturing process, i.e., the unitary molded base is formed on a circuit board panel and then cut to form the integral components of the present invention. In fig. 7A to 7C, a process of forming one of the integrated components is illustrated as an example.

More specifically, the forming mold 210 further has a base forming guide groove 215 and includes a light window forming portion 214 located in the base forming guide groove 215. When the first and

second molds

211 and 212 are closed, the light window forming portion 214 and the base forming guide groove 215 extend in the forming cavity 213, and the molding material 16 in fluid form is filled into the base forming guide groove 215, and the molding material 16 in fluid form cannot be filled at a position corresponding to the light window forming portion 214, so that the molding material 16 in fluid form after being cured at a position corresponding to the base forming guide groove 215 can form the molding base 12 including the annular molding body 121 of the molding base 12 corresponding to each photosensitive assembly 10, and the light window 122 of the molding base 12 is formed at a position corresponding to the light window forming portion 214. The molding material 16 may be selected from, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), epoxy, and the like.

More specifically, when the first and

second molds

211 and 212 are closed and the molding step is performed, the optical window forming part 214 is overlapped on the top surface of the photosensitive element 13 and closely attached, so that the molding material 16 in a fluid state is prevented from entering the photosensitive region 131 of the photosensitive element 13 on the circuit board 11, and the optical window 122 of the mold base 12 can be finally formed at a position corresponding to the optical window forming part 214. It is understood that the light window forming part 214 may be a solid structure, or may be a structure having a groove shape inside as shown in the drawing. It will be appreciated that in another variation, the bottom side of the first mold 211 may also be provided with an elastomeric membrane to provide cushioning and facilitate demolding after the molding process.

As shown in fig. 7A to 7C, the light window forming portion 214 is press-fit on the photosensitive element 13, and for correspondingly forming the photosensitive element combining portion 1211 and the top side extending portion 1212 of the molding base 12, the light window forming portion 214 has a bottom side forming portion 2141 and a top side forming portion 2142, and the bottom side forming portion 2141 is a frustum-shaped structure having an inner diameter gradually increasing from the bottom side toward the top side. An included angle α is formed between the outer surface 21411 of the bottom-side molding portion 2141 and the optical axis X perpendicular to the photosensitive element 13, and an included angle β is formed between the outer surface 21421 of the top-side molding portion 2142 and the optical axis X perpendicular to the photosensitive element 13. Accordingly, α has a value ranging from 3 ° to 80 °, β has a value ranging from 0 ° to 10 °, and α > β. The top forming portion 2142 extends divergently from the bottom forming portion 2141, and is not pressed against the connecting wire 15 during the molding process to damage the connecting wire 15.

The light window molding part 214 has a first partial outer surface 21411 and a second partial outer surface 21421 which form angles α and β with an optical axis X perpendicular to the light sensing element 13 from the bottom side toward the top side, respectively, where α is in a range of 3 ° to 80 °, β is in a range of 0 ° to 10 °, and α > β. Thereby, after the molding process, the molding base 12 is formed into the photosensitive element combining portion 1211 and the top-side extension portion 1212, and the photosensitive element combining portion 1211 is formed into a structure in which the first portion inner surface 1231 defined by the inner surface thereof extends upward from the photosensitive element 13 with a relatively small slope, and the second portion inner surface 1232 defined by the inner surface of the top-side extension portion 1212 integrally extends inflected from the first portion inner surface 1231 and extends upward with a relatively large slope or no slope. That is, an included angle between the first portion inner surface 1231 defined by the inner surface of the photosensitive element combining portion 1211 and the optical axis X of the image capturing module 100 is α, and an included angle between the second portion inner surface 1232 defined by the inner surface of the top side extending portion 1212 and the optical axis X of the image capturing module 100 is β, where α is in a range from 3 ° to 80 °, β is in a range from 0 ° to 10 °, and α > β. It is understood that the light window forming part 214 is a bent and extended structure, and the molding material 16 entering the space of the non-photosensitive region 132 of the photosensitive element 13 and the bottom portion of the base forming groove 215 of the first portion outer surface 21411 of the light window forming part 214 can be reduced in the molding process, so that the volume of the molding material 16 in the space is small, the generated pressure and pressure are small, and the molding material is not easy to enter the photosensitive region 131 of the photosensitive element 13, i.e. the generation of "flash" is avoided.

As shown in fig. 8A, according to a modified embodiment of the second preferred embodiment of the present invention, in this embodiment, the top surface of the filter element body 141 is further provided with a topside light shielding layer 143, so that the topside light shielding layer 143 and the light shielding layer 142 cooperate to enhance the effect of reducing stray light. More specifically, the light L41 incident on the topside light shielding layer 143 is absorbed by the topside light shielding layer 143, and the light L42 is absorbed by the light shielding layer 142. It is to be understood that the topside light shielding layer 143 may be provided in the second preferred embodiment.

As shown in fig. 8B, according to a modified embodiment of the second preferred embodiment of the present invention, the image capturing module 100 includes the photosensitive assembly 10, the lens 30 and a lens bearing element 40. The lens 30 is assembled to the lens carrier 40 to form a lens assembly. The lens carrier 40 may be a fixed lens barrel, so as to form a focus-adjustable image pickup module.

Correspondingly, the photosensitive assembly 10 includes a circuit board 11, a molding base 12, a photosensitive element 13 and a filter element 14, the molding base 12 includes a base body 121 integrally formed on the circuit board 11 and the photosensitive element 13 and forming an optical window 122, the optical window 122 is a closed space and provides a light path for the photosensitive element 13. The filter element 14 includes a filter element body 141 and a light shielding layer 142, and the light shielding layer 142 is a light-absorbing and light-impermeable material and is located on the bottom side of the filter element body 141 and between the filter element body 141 and the mold base 12.

Wherein the mold base 12 has a top recess 125 on its top side, the top recess 125 being used for assembling the filter element 14. That is, in this embodiment of the present invention, the top surface 124 of the mold base 12 may be a multi-step surface, the top surface 124 is divided into a plurality of portions of top surfaces that are not coplanar, such as a first portion top surface 124a and a second portion top surface 124b, the first portion top surface 124a is recessed with respect to the second portion top surface 124b toward the photosensitive element 13, such that the top groove 125 is formed on the top side of the first portion top surface 124a, and the filter element 14 is assembled to the top groove 125.

The top-side extension 1212 of the mold base 12 is correspondingly two-piece and forms the top-side recess 125 on its top side. The inner surface 123 of the mold base 12 includes a second portion inner surface 1232 and a third portion inner surface 1233 formed by the first portion inner surface 1231 and the top-side extension portion 1212 of the photosensitive element combining portion 1211, the light shielding layer 142 is adjacent to the second portion inner surface 1232 of the mold base 12, and the light-suppressing groove 1221 is formed between the first portion inner surface 1231 and the second portion inner surface 1232, so that a space for suppressing the emission of stray light is formed. That is, the light incident on the first-portion inner surface 1231 is directly reflected to the light-shielding layer 142 or is further reflected by the second-portion inner surface 1232 to the light-shielding layer 142 to be absorbed by the light-shielding layer 142, thereby reducing stray light. The topside light shielding layer 143 is also disposed on the topside of the filter element 14 to enhance the effect of eliminating the stray light.

It can be understood that, in the embodiments of fig. 2 to fig. 9, the wire bonding direction of the connection wire 15 is from the photosensitive element 13 to the circuit board 11, that is, by disposing the photosensitive element connection pad on the photosensitive element 13, the wire bonding jig forms a first end of the connection wire 15 connected to the photosensitive element connection pad by wire bonding on the top end of the photosensitive element connection pad, then raises the preset position, and then moves toward the circuit board connection pad on the circuit board and descends again to form a second end of the connection wire 15 connected to the circuit board connection pad on the top end of the circuit board connection pad.

As shown in fig. 9, according to another modified embodiment of the second preferred embodiment of the present invention, the electronic component 112 of the circuit board 11 of the photosensitive assembly 10 of the camera module 100 is attached to the bottom side thereof, and accordingly, the photosensitive assembly 10 further includes one or more bottom side molding portions 19 integrally embedding the electronic component 112. That is, the electronic components 112 are not mounted on the top side of the circuit board 11, and these electronic components 112 are disposed on the bottom side of the circuit board 11, and are formed by the bottom molding portion 19, which may be a plurality of independent portions, or may form an integrally molded base, so as to embed the electronic components 112 and form a bottom flat supporting surface. The bottom molding part 19 and the molding base 12 may be formed separately from each other or in a single molding process, for example, the circuit board 11 may have through holes, and the molding material 16 may reach both sides of the circuit board 11 in the molding process.

It is understood that the space on the bottom side of the circuit board 11 under the photosensitive element 13 can also be used to arrange the electronic components 112, so that the area size of the circuit board 11 is significantly reduced in this embodiment, unlike the above-described embodiment in which the electronic components 112 need to be arranged around the photosensitive element 13.

Accordingly, the mold base 12 includes the photosensitive element combining portion 1211 and the top-side extending portion 1212, so that when the size of the photosensitive assembly 10 is further reduced, the top-side extending portion 1212 is bent to extend, and the area of the top surface 124 of the mold base 12 is increased, so as to provide a larger mounting surface for the lens bearing element 40 and the filter element 14. And the filter element 14 includes a bottom-side light-shielding layer 142 and a top-side light-shielding layer 143 disposed on both sides of the filter element body 141, thereby enhancing the effect of eliminating stray light.

As shown in fig. 10, the wire bonding connection between the photosensitive element 13 and the circuit board 11 is from the circuit board 11 to the photosensitive element 13. That is, by providing the circuit board connection pad on the circuit board 11, a wire bonding jig first forms a second end of the connection wire 15 connected to the circuit board connection pad by wire bonding at the top end of the circuit board connection pad, then raises the preset position, then translates toward the circuit board connection pad direction and forms a first end opposite to the connection wire 15 connected to the photo sensitive element connection pad at the top end of the photo sensitive element connection pad, so that the connection wire 15 extends in a curved shape, and the top end height h2 of the connection wire 15 is lower than that in the embodiment of fig. 2 to 9, taking fig. 9 as an example, the height h1 of the top end of the connection wire is lower, so that in a molding process, the space for the optical window molding portion 214 of the molding mold 210 to avoid the connection wire 15 is reduced, and the height of the top side extension portion 1212 can be higher.

Fig. 11 to 13A show a camera module 100 according to a third preferred embodiment of the present invention, wherein the camera module 100 includes a photosensitive element 10 and a lens 30. The lens 30 is assembled to the photosensitive assembly to form a fixed focus camera module. It is understood that, in another variant, the lens may also be disposed on a driver or a fixed lens barrel to form a lens assembly, and the lens assembly is assembled to the photosensitive assembly.

Correspondingly, the photosensitive assembly 10 includes a circuit board 11, a molding base 12, a photosensitive element 13, a filter element 14 and a filter element support 17, the molding base 12 includes a base body 121 integrally formed on the circuit board 11 and the photosensitive element 13 and forming an optical window 122, the optical window 122 is a closed space and provides a light path for the photosensitive element 13.

The filter element holder 17 is assembled to the mold base 12, and has a window 171 on a bottom side and a top side mounting groove 172, and the filter element 14 is assembled to the top side mounting groove 172, so that the filter element 14 assembled to the filter element holder 17 is less likely to be damaged than directly assembled to the mold base 12.

The filter element 14 includes a filter element body 141, a bottom light shielding layer 142 and a top light shielding layer 143, the light shielding layer 142 is located on the bottom side of the filter element body 141 and located between the filter element body 141 and the inner top surface of the filter element holder 17, the light shielding layer 142 is a light absorbing material, which enables the filter element body 141 to form a middle effective light transmitting region 1411 and a peripheral region 1412, and light passing through the lens 30 can only reach the inside of the mold base 12 through the effective light transmitting region 1411. The light-shielding layer 142, which is a ring-shaped structure, has a window formed in the middle, that is, the light-shielding layer 142 forms a light passage 1420 for allowing light to enter the light window 122 and reduces stray light reaching the light-sensing element 13, and the top-side light-shielding layer 143 can enhance the effect of reducing stray light.

The photosensitive element 13 has a photosensitive region 131 in the middle and a non-photosensitive region 132 around the photosensitive region 131, and the light shielding layer 142 has an inner edge 1421 and an outer edge 1422. The distance between the inner edge 1421 of the light-shielding layer 142 and the optical axis X is greater than or equal to, or slightly less than the distance between the outer edge 1311 of the light-sensing region 131 and the optical axis X.

The outer edge 1422 of the light shielding layer 142 is located outside the inner edge 1701 of the top surface of the filter element holder 17, i.e., no light transmitting region is formed between the inner edge of the top surface of the filter element holder 17 and the outer edge 1422 of the light shielding layer 142.

In this embodiment of the present invention, the base body 121 of the mold base 12 includes a plurality of portions whose inner surfaces extend in different directions, for example, the base body 121 of the mold base 12 includes three portions, i.e., a photosensitive element bonding portion 1211 and a top-side extension portion 1212 shown in fig. 12A and 12B located around the optical window 122, and a circuit board bonding portion 1213 at the bottom side of the photosensitive element bonding portion 1211. The photosensitive-element combining portion 1211 has an inner surface integrally extending from the photosensitive element 13, which is defined as a first-portion inner surface 1231 of the molding base 12, and the top-side extension portion 1212 has an inner surface integrally extending from the photosensitive-element combining portion 1211, which is defined as a second-portion inner surface 1232 of the molding base 12, the second-portion inner surface 1232 integrally extending from the first-portion inner surface 1231.

The

inner surfaces

1231 and 1232 of the light sensing element combining portion 1211 and the top side extending portion 1212 respectively extend at different slopes, the second portion inner surface 1232 of the top side extending portion 1212 extends upward at a greater slope with respect to the first portion inner surface 1231 of the light sensing element combining portion 1211, or the second portion inner surface 1232 of the top side extending portion 1212 extends upward nearly without a slope, i.e., the second portion inner surface 1232 of the top side extending portion 1212 extends substantially perpendicular to the top surface of the light sensing element 13, so that the area of the top surface of the top side extending portion 1212 can be relatively large, i.e., the top side extending portion 1212 determines the area of the top surface 124 of the molding base 12, and the extending structure of the light sensing element combining portion 1211 and the top side extending portion 1212 can increase the area of the top surface 124 of the molding base 12, so that a larger mounting area can be provided for the lens or lens assembly above the light sensing assembly 10 or the filter element holder 17, for example, in this embodiment, the top surface 124 of the molding base 12 can be more firmly mounted with the filter element holder 17 above. And such a structure can reduce the area of the filter element 14.

As shown in fig. 12B, an included angle between the first portion inner surface 1231 defined by the inner surface of the photosensitive element combining portion 1211 and the optical axis X of the image capturing module 100 is α, an included angle between the second portion inner surface 1232 defined by the inner surface of the top-side extending portion 1212 and the optical axis X of the image capturing module 100 is β, where α is in a range from 3 ° to 80 °, β is in a range from 0 ° to 10 °, and α > β.

That is, the included angle β between the second partial inner surface 1232 defined by the inner surface of the top-side extension portion 1212 and the optical axis X of the camera module 100 is smaller than the included angle α between the first partial inner surface 1231 defined by the inner surface of the photosensitive element 1211 and the optical axis X of the camera module 100, so that the second partial inner surface 1232 of the top-side extension portion 1212 extends upward with a greater slope or in a direction perpendicular to the photosensitive element 13, thereby increasing the area of the top surface 124 of the mold base 12.

As shown in fig. 12B, in the preferred embodiment of the present invention, preferably, the thickness H1 of the photosensitive element combining portion 1211 ranges from 0.05mm to 0.7mm, and the thickness H2 of the top side extension portion 1212 ranges from 0.02mm to 0.6mm.

As shown in fig. 13B, when the filter element 14 is provided with the topside light shielding layer 143 only on the topside, it can absorb a part of the light ray N51, but the light ray N52 may be reflected by the bottom surfaces of the mold base and the filter element to form stray light.

When the filter element 14 is provided with the light-shielding layer 142 and the topside light-shielding layer 143, as shown in fig. 13A, part of stray light L51 incident on the upper surface of the filter element body 141 of the filter element 14 is absorbed by the topside light-shielding layer 143, thereby serving the purpose of blocking part of stray light.

When another portion of the stray light L52 passes through the effective light-transmitting region 1411 of the filter element body 141 and is incident on the first portion of the inner surface 1231, the other portion of the stray light L is reflected by the inclined first portion of the inner surface 1231 of the mold base 12 upwards to the light-shielding layer 142 or further reflected by the second portion of the inner surface 1232 to the light-shielding layer 142, so as to be absorbed by the light-shielding layer 142, and thus is not further reflected to reach the photosensitive element 13, which affects the imaging quality of the camera module 100.

Accordingly, the light shielding layer 142 and the inner surface 1702 of the filter element support 17 located under the filter element are adjacent to each other, the inner surface 1702 of the filter element support 17 located under the filter element extends downward from the light shielding layer 142, and between the light shielding layer 142 and the inner surface 1702 of the filter element support 17 located under the filter element, the first portion inner surface 1231 and the second portion inner surface 1232, a light-suppressing groove 1221 is formed at an outer portion of the light window 122, and the light-suppressing groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in fig. 13A, the stray light L52 enters the light-suppressing groove 1221 and cannot exit the light-suppressing groove 1221.

Moreover, it can be understood that, because the light shielding layer 142 and the filter element support 17 are located adjacent to the inner surface 1702 under the filter element, the light shielding layer 142 effectively reduces the light that passes through the filter element body 141 and reaches the inner surface 1702 under the filter element and the second portion inner surface 1232, so as to prevent the light that is incident on the inner surface 1702 under the filter element and the second portion inner surface 1232 from being reflected and reaching the photosensitive element 13 to form stray light and affect the imaging quality of the camera module 100.

As shown in fig. 14A, according to a variation of the above-described third preferred embodiment of the present invention, in this embodiment, the filter element 14 may be provided with the light shielding layer 142 only on the bottom side of the filter element body 141, and the top side may be free of the above-described top side light shielding layer 143.

As shown in fig. 14B, according to another modified embodiment of the above-described third preferred embodiment of the present invention, the top side of the mold base 12 is formed with a top side groove 125, the filter holder 17 is assembled to the top side groove 125 so as to move down its position, and the lens 30 can be assembled to the top side of the mold base 12. That is, the top surface 124 of the mold base 12 enlarged by multi-sectional extension is used to assemble the filter element holder 17 and the lens 30.

Referring to fig. 15 to 17A, a camera module 100 according to a fourth preferred embodiment of the present invention is shown, and the structure of the camera module 100 is similar to that of the third preferred embodiment, and the camera module 100 includes a photosensitive element 10 and a lens 30. The lens 30 is assembled to the photosensitive assembly to form a fixed focus camera module. It is understood that, in another variant, the lens may also be disposed on a driver or a fixed lens barrel to form a lens assembly, and the lens assembly is assembled to the photosensitive assembly.

Correspondingly, the photosensitive assembly 10 includes a circuit board 11, a molding base 12, a photosensitive element 13, a filter element 14 and a filter element support 17, the molding base 12 includes a base body 121 integrally formed on the circuit board 11 and the photosensitive element 13 and forming an optical window 122, the optical window 122 is a closed space and provides a light path for the photosensitive element 13. The molding base 12 includes a photosensitive element combining portion 1211 and a top-side extension portion 1212 extending in multi-segments, and

inner surfaces

1231 and 1232 extending in different directions, respectively, for reducing stray light and increasing the area of the top surface 124 of the molding base 12.

The filter holder 17 is assembled to the mold base 12, and has a top opening 171 and a bottom mounting groove 173, and the filter 14 is assembled to the bottom mounting groove 173 in a reverse manner. The filter element 14 includes a filter element body 141 and a light shielding layer 142, and the light shielding layer 142 is disposed on a bottom side of the filter element body 141. Thus, similarly, the light-shielding layer 142 can function to reduce stray light reaching the photosensitive element 13.

In addition, the lens 30 includes a carrier 31 and one or more lenses 32 assembled on the carrier 31, wherein because the filter element 14 is inversely installed on the filter element holder 17, so that the filter element 14 does not protrude from the upper surface of the filter element holder 17, the bottommost lens of the one or more lenses 32 of the lens 30 can be moved downward relatively, thereby reducing the distance between the lens and the photosensitive element 13, and thus reducing the back focal length of the camera module 100.

As shown in fig. 17B, when the filter element 14 is provided with the light shielding layer 143 only on the top side, it can absorb a part of the light N61, but the light N62 is reflected by the mold base and the bottom surface of the filter element to form stray light.

When the filter element 14 is provided with the light shielding layer 142 on the bottom side, as shown in fig. 17A, part of stray light L61 incident on the upper surface of the filter element holder 17 is reflected without entering the light window 122 of the mold base 12, thereby serving the purpose of blocking part of stray light.

When another portion of the stray light L62 passes through the effective light-transmitting region 1411 of the filter element body 141 and is incident on the first portion of the inner surface 1231, the other portion of the stray light L is reflected by the inclined first portion of the inner surface 1231 of the mold base 12 upwards to the light-shielding layer 142 or further reflected by the second portion of the inner surface 1232 to the light-shielding layer 142, so as to be absorbed by the light-shielding layer 142, and thus is not further reflected to reach the photosensitive element 13, which affects the imaging quality of the camera module 100. It should be noted that the filter element 14 may further include a topside light shielding layer 143 on the topside of the filter element body 141, so as to enhance the effect of reducing stray light.

Accordingly, the light shielding layer 142 is adjacent to the second partial inner surface 1232 of the mold base 12, the second partial inner surface 1232 of the mold base 12 extends downward from the light shielding layer 142, and a light-suppressing groove 1221 is formed on the outer side portion of the light window 122 between the light shielding layer 142, the first partial inner surface 1231 and the second partial inner surface 1232, and the light-suppressing groove 1221 is a space for suppressing the emission of stray light. More specifically, as shown in fig. 17A, the stray light L62 enters the light-suppressing groove 1221 and cannot exit the light-suppressing groove 1221.

Moreover, it can be understood that, because the light shielding layer 142 and the second portion inner surface 1232 of the mold base 12, the light shielding layer 142 effectively reduces the light that passes through the filter element body 141 and reaches the second portion inner surface 1232, so as to avoid the light that is incident on the second portion inner surface 1232 being reflected and reaching the photosensitive element 13 to form stray light and affect the imaging quality of the camera module 100.

As shown in fig. 18, according to another variation of the fourth embodiment of the present invention, the bonding wires 15 are routed from the circuit board 11 to the photosensitive element 13, so that the light window forming portion 214 does not need to provide any space for the bonding wires 15 during the molding process, and the top side extension portion 1212 has a larger height to increase the area of the top surface 124 of the mold base 12.

In addition, a window 171 is formed on the top side of the filter element support 17, and the length of the inward extension of the top side portion 174 of the filter element support 17 may be greater than or equal to the length of the inward extension of the light shielding layer 142, so that the area of the window 171 may not be greater than the area of the light passage 1420, so that the top surface of the filter element support 17 acts to block a part of the stray light L71, thereby eliminating the need to provide the top side light shielding layer 143 on the top side of the filter element 14. The stray light L72 can be absorbed by the light-shielding layer 142.

As shown in fig. 19, according to another modified embodiment of the fourth embodiment of the present invention, the photosensitive assembly 10 includes a circuit board 11, a mold base 12, a photosensitive element 13, a filter element 14, a filter element holder 17 and a blocking frame 18. The molding base 12 is integrally combined with the circuit board, the photosensitive element 13 and the frame 18, the filter element 14 is assembled on the filter element holder 17, and the filter element holder 17 is assembled on the top side of the molding base 12. The light-shielding layer 142 of the filter element 14, similar to the fourth preferred embodiment, is disposed at the bottom side of the filter element body 142, and can reduce stray light.

The annular frame 18 is disposed on the photosensitive element 13, and is used for pressing the light window forming portion 214 against the frame 18 in a molding process to prevent the fluid molding material 16 from flowing into the photosensitive region 131 of the photosensitive element 13, wherein the molding base 12 is integrally formed on the circuit board, the photosensitive element 13 and the frame 18, and the frame 18 may be glue in a preferred embodiment, which may have a predetermined elasticity, such as an elastic modulus ranging from 0.1Gpa to 1Gpa.

A base body 121 of the mold base 12 includes a photosensitive element combining portion 1211 and a top side extension portion 1212 located around the light window 122, and a circuit board combining portion 1213 located around the photosensitive element 13 and on the top side of the circuit board 11 at the bottom side of the photosensitive element combining portion 1211. The photosensitive element combining portion 1211 is integrally combined with the circuit board 11, the photosensitive element 13 and the barrier frame 18, and has a first partial inner surface 1231 obliquely extending from the barrier frame 18, and the top-side extension portion 1212 has a second partial inner surface 1232 divergently extending from the first partial inner surface 1231, so that such a structure enables the light reflection action of the oblique first partial inner surface 1231 to reduce stray light, and the divergently extending second partial inner surface 1232 enables the top surface of the top-side extension portion 1212 to have a larger mounting area, and the angle between the two partial inner surfaces and the optical axis X is similar to that of the foregoing embodiment. It is understood that the stop frame 18 of this embodiment may also be applied to other embodiments of the present invention.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments, and any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. A photosensitive assembly, comprising:

a circuit board;

a photosensitive element, wherein the photosensitive element has a photosensitive region and a non-photosensitive region located around the photosensitive region, and wherein the photosensitive element is operatively connected to the circuit board;

a molding base, wherein the molding base has an optical window and a top surface, wherein the molding base is integrally bonded to the circuit board and the non-photosensitive region of the photosensitive element, and the photosensitive region of the photosensitive element corresponds to the optical window of the molding base; and

a light filtering element, wherein the light filtering element is held above the top surface of the mold base to cover the light window of the mold base, wherein the light filtering element comprises a light filtering element body and a light shielding layer located at a bottom side of the light filtering element body, the light shielding layer forms a light path for passing light through the light window of the mold base to the light sensing region of the light sensing element and reduces stray light reaching the light sensing element, wherein an included angle γ is formed between the light shielding layer and at least a part of an inner surface of the mold base, the included angle γ being an acute angle or a right angle, wherein a distance between an inner edge of the light shielding layer and an optical axis X is smaller than a distance between an inner edge of the top surface of the mold base and the optical axis X, and an outer edge of the light shielding layer is located outside the inner edge of the top surface of the mold base.

2. The photosensitive assembly of claim 1 wherein the filter element is attached to the top surface of the mold base.

3. The photosensitive assembly of claim 1, further comprising a filter holder, wherein the filter holder has a window, the filter is assembled to the filter holder and covers the window of the filter holder, and wherein the filter holder is attached to the top surface of the mold base.

4. The photosensitive assembly of claim 3, wherein the filter holder has a top side mounting slot, the filter being assembled to the top side mounting slot.

5. The photosensitive assembly of claim 3, wherein the filter holder has an underside mounting groove, and the filter is assembled in the underside mounting groove of the filter holder in a flip-chip manner.

6. The photosensitive assembly of claim 1 wherein the light-shielding layer is a light-absorbing material.

7. The photosensitive assembly according to claim 6, wherein the light shielding layer is provided on a bottom surface of the filter element body.

8. The photosensitive assembly of claim 7, wherein the light shielding layer is in a ring shape with a window formed in the middle such that the light shielding layer forms an effective light transmitting region in the middle and a peripheral region of the filter element body, light being allowed to pass through the effective light transmitting region of the filter element body to the light window of the mold base.

9. The photosensitive assembly according to claim 6, wherein an outer edge of the light shielding layer is located outside an inner edge of the top surface of the mold base so that a light transmitting region is not formed between the outer edge of the light shielding layer and the inner edge of the top surface of the mold base.

10. The photosensitive assembly of claim 6 wherein the light shield layer is adjacent to the inner surface of the mold base and the outer portion of the light window of the mold base forms a light-inhibiting groove between the light shield layer and the inner surface of the mold base.

11. The photosensitive assembly of claim 7, wherein the light shielding layer is attached to a bottom surface of the filter element body.

12. The photosensitive assembly of claim 7, wherein the light shielding layer is formed on the bottom surface of the filter body by a photolithography process.

13. The photosensitive assembly of claim 7, wherein the light shielding layer is formed on the bottom surface of the filter element body by a screen printing process.

14. The photosensitive assembly according to any one of claims 6 to 13, wherein the inner surface of the mold base is an inclined inner surface such that an included angle γ formed by the light shielding layer and the inner surface of the mold base is an acute angle.

15. The photosensitive assembly according to any one of claims 6 to 13, wherein the top surface of the mold base has a first portion top surface and a second portion top surface, the first portion top surface being recessed relative to the second portion top surface toward the photosensitive element to form a top groove of the mold base on a top side of the first portion top surface, wherein the filter element is attached to the first portion top surface of the mold base to be held in the top groove of the mold base.

16. The photosensitive assembly of any one of claims 6 to 13, wherein the mold base includes a photosensitive element bonding portion and a top side extension portion around the light window, and a circuit board bonding portion around the photosensitive element integrally bonded to the non-photosensitive region of the photosensitive element and the top surface of the circuit board, wherein the photosensitive element bonding portion has a first portion inner surface integrally extending from the photosensitive element, the top side extension portion has a second portion inner surface integrally extending from the photosensitive element bonding portion, the second portion inner surface integrally extends from the first portion inner surface, and the first portion inner surface and the second portion inner surface extend at different slopes.

17. The photosensitive assembly of claim 16, wherein the second portion inner surface of the top side extension extends perpendicular to the non-photosensitive region of the photosensitive element.

18. The photosensitive assembly of claim 16 wherein said second portion interior surface of said top side extension extends upwardly at a greater slope relative to said first portion interior surface of said photosensitive element engaging portion.

19. The photosensitive assembly of claim 18, wherein an angle between the first portion of the inner surface of the photosensitive element engaging portion and the optical axis of the photosensitive assembly is α, which has a value in a range of 3 ° to 80 °, wherein an angle between the second portion of the inner surface of the top side extension portion and the optical axis of the photosensitive assembly is β, which has a value in a range of 0 ° to 10 °, and α > β.

20. The photosensitive assembly according to any one of claims 1 to 13, wherein the filter element has a topside light shielding layer provided on a top surface of the filter element main body.

21. The photosensitive component of claim 20, wherein a distance between the inner edge of the topside light shield layer and the optical axis of the photosensitive component is less than a distance between the inner edge of the light shield layer and the optical axis of the photosensitive component.

22. A camera module, its characterized in that includes a photosensitive assembly and a camera lens, wherein photosensitive assembly further includes:

a circuit board;

a light sensing element, wherein the light sensing element has a light sensing area and a non-light sensing area located around the light sensing area, wherein the light sensing element is operably connected to the circuit board, wherein the lens is maintained in a light sensing path of the light sensing element;

23. An electronic device, comprising a device main body and at least one camera module installed on the device main body, wherein the camera module comprises a photosensitive component and a lens, wherein the photosensitive component further comprises:

a circuit board;

a photosensitive element, wherein said photosensitive element has a photosensitive region and a non-photosensitive region located around said photosensitive region, wherein said photosensitive element is operably connected to said circuit board, wherein said lens is maintained in a photosensitive path of said photosensitive element;

a light filtering element, wherein the light filtering element is held above the top surface of the mold base to cover the light window of the mold base, wherein the light filtering element comprises a light filtering element body and a light shielding layer located at the bottom side of the light filtering element body, the light shielding layer forms a light path for passing light through the light window of the mold base to the light sensing region of the light sensing element and reduces stray light reaching the light sensing element, wherein an included angle γ is formed between the light shielding layer and at least a part of the inner surface of the mold base, the included angle γ being an acute angle or a right angle, wherein the distance between the inner edge of the light shielding layer and the optical axis X is smaller than the distance between the inner edge of the top surface of the mold base and the optical axis X, and the outer edge of the light shielding layer is located outside the inner edge of the top surface of the mold base.