CN205961279U - Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof - Google Patents

Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof Download PDF

Info

Publication number
CN205961279U
CN205961279U CN201620826033.6U CN201620826033U CN205961279U CN 205961279 U CN205961279 U CN 205961279U CN 201620826033 U CN201620826033 U CN 201620826033U CN 205961279 U CN205961279 U CN 205961279U
Authority
CN
China
Prior art keywords
molded base
photo
circuit board
camera module
sensitive cell
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201620826033.6U
Other languages
Chinese (zh)
Inventor
王明珠
陈振宇
郭楠
田中武彦
赵波杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201720121002.5U priority Critical patent/CN207251753U/en
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN201720121031.1U priority patent/CN207251754U/en
Priority to CN201620826033.6U priority patent/CN205961279U/en
Priority to CN201720121034.5U priority patent/CN206698309U/en
Priority to KR1020197005566A priority patent/KR102199508B1/en
Priority to JP2019503667A priority patent/JP7048573B2/en
Priority to EP23165641.4A priority patent/EP4224876A3/en
Priority to EP16911482.4A priority patent/EP3493517B1/en
Priority to KR1020207036542A priority patent/KR102352901B1/en
Priority to PCT/CN2016/103248 priority patent/WO2018023887A1/en
Priority to CN201680088072.3A priority patent/CN109716745B/en
Publication of CN205961279U publication Critical patent/CN205961279U/en
Application granted granted Critical
Priority to US15/439,909 priority patent/US10051167B2/en
Priority to US15/461,409 priority patent/US10498942B2/en
Priority to US15/461,402 priority patent/US10171716B2/en
Priority to TW106208437U priority patent/TWM557833U/en
Priority to TW106119407A priority patent/TWI698125B/en
Priority to US15/679,151 priority patent/US10136041B2/en
Priority to US15/679,153 priority patent/US10129451B2/en
Priority to US15/679,154 priority patent/US10230879B2/en
Priority to US15/785,374 priority patent/US10742859B2/en
Priority to US16/028,367 priority patent/US10708480B2/en
Priority to US16/157,061 priority patent/US10666847B2/en
Priority to US16/569,601 priority patent/US10986258B2/en
Priority to US17/203,673 priority patent/US11363184B2/en
Priority to JP2021055045A priority patent/JP7269273B2/en
Priority to US17/824,415 priority patent/US11575816B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

The utility model provides a module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof, this mould is moulded photosensitive assembly and is included the circuit board, the base is moulded to photosensitive element and mould, wherein the mould is moulded the base and is moulded technology and circuit board and the integrative combination of photosensitive element through the mould, wherein the mould is moulded the base and is formed the optical window, the optical window corresponds with the photosensitive element position, and the optical window cross -section construct become to be by down supreme gradually big trapezoidal or multistage trapezoidal, in order to make things convenient for the drawing of patterns, prevent that the matched mould from moulding the damage of base, avoid stray light and prevent that the mould from moulding in the technology damage to the lead wire of connecting photosensitive element and circuit board.

Description

Camera module and its molding photosensory assembly and mould
Technical field
The utility model is related to camera module field, further, is related to camera module and its one-tenth of moulding technology making Pattern tool and manufacture method.
Background technology
Camera module be intelligent electronic device can not obtain one of scarce part, citing ground but be not limited to smart mobile phone, phase Mechanical, electrical brain equipment, wearable device etc..And the continuous development with various smart machines and popularization, the requirement to camera module Also more and more higher.
In recent years, the development that intelligent electronic device generation is advanced by leaps and bounds, increasingly tends to lightening, and camera module will adapt to Its development, also increasingly requires multifunction, lightening, miniaturization, so that the more and more thinner that electronic equipment can do, and full Sufficient equipment is for the imaging requirements of camera module.Therefore camera module production firm is persistently devoted to design, manufactures satisfaction The camera module of these requirements.
Molded packages technology is the emerging a kind of encapsulation technology growing up on the basis of traditional COB encapsulation.As shone Figure 1A Shown, it is the wiring board using the encapsulation of existing integral packaging technology.In such an embodiment, encapsulation part 1 is passed through integral packaging Mode is packaged in wiring board 2 and sensitive chip 3, and coats the electronic devices and components on wiring board and electrical connection chip and circuit The lead of plate, thus the space that the electronic devices and components reducing camera module independently take is so that the size of camera module can subtract Little, and solve the problems, such as the image quality of the dust impact camera module of attachment on electronic devices and components.
With respect to traditional support rack type COB encapsulation technology, this encapsulation technology in theory, has more excellent Gesture, but for a period of time, this encapsulation technology only stays in theory or manual experimental stage, and does not obtain very well Enforcement, do not put into reality production in carry out quantify produce, trace it to its cause, have following aspects.
First, though integral packaging technology is one in other large scale industry fields knows technology, but in camera module Field is but new application, and different industries need the object that produces by way of molding different, faced by problem also different.With As a example smart mobile phone, body is more and more lightening, so thickness is fewer and feweri, therefore it is required that camera module also to reach such Thickness, just will not increase the integral thickness of mobile phone, well imagine, the part in camera module is all in less size etc. Level is processed, and the ideal structure of therefore design but can not be produced by way of conventional.In said structure, it usually needs Through hole is formed by described encapsulation part 1, provides passage of light for the sensitive chip 3 on wiring board 2, this through hole is commonly designed For vertical flat column, this structure does not have king-sized defect for basic theories in structure, but does not consider real The problem that border volume production exists when producing.That is, this technology only rests on the manual test stage, actual life but can not be put into Produce.More specifically, packaging technology is required for mould, with reference to Figure 1B and Fig. 1 C, when the forming blocks 4 of the upper mould of mould are During vertical flat column, in moulding process, in upper mould with the position that contacts of the encapsulation part that formed, in mould separating mold member During material, because upper mould bottom is sharp prismatic so that mould can affect to mold the shape of the encapsulation part 1 being formed in the process extracted Shape, so as to produce deformation, such as produces overlap, in addition when upper mould is pulled out and departs from encapsulation part, the outside of upper die forming block 4 Face can produce therebetween larger frictional force with encapsulation part 1 always, thus being likely to damage encapsulation part 1, this impact exists Large scale industry field may be able to be ignored, but in this undersized fine-grained production field of camera module, but becomes one Individual vital influence factor, so the through hole theoretical construct of vertical flat column is feasible, unsuitable volume production is implemented.
Secondly, camera module is a kind of optical electron device, and light is the key factor determining image quality.Reference picture 1D, in conventional stent assembling mode, the support 5 being installed on wiring board needs the installing space 6 of reserved electronic devices and components, because This formed in concave space, the presence in this space improves the size of camera module, but after light incidence, little direct irradiation in The reflection light of rack inner wall, therefore rack inner wall is less, does not interfere with the image quality of camera module.And work as support and be replaced For existing flat column encapsulation part 1 when, reference picture 1E, compared to supporting structure, after the light incidence camera lens of identical incidence angle, The light of reflection will not be produced in supporting structure, and the inwall of encapsulation part 1 can be acted in the structure of integral packaging, and Reflection light is accessible to sensitive chip 3, thus increasing stray light so that the image quality of camera module reduces, because For this is from quality of optical imaging, the structure of through hole of encapsulation part 1 interior formation side shape post simultaneously is not suitable for putting into application.
Finally, when being assembled into camera module, encapsulation part 1 typically requires the installation part such as camera lens or motor, therefore seals Dress portion 1 needs to meet certain structural strength, and when therefore arranging encapsulation part 1 shape, needing will be anti-to luminous flux, structural strength, light Penetrate rate, conveniently stripped and prevent the demoulding from numerous aspects such as the damage of encapsulation part 1 are taken into consideration to design, and existing encapsulation part These factors are not obviously taken into consideration by 1 structure.
Content of the invention
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein Described camera module includes molding photosensory assembly by moulding technology is formed one, and wherein said molding photosensory assembly can pass through into The molded Process Planning modelling volume production experiment of pattern tool.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein Described molding photosensory assembly includes a circuit board, a photo-sensitive cell and be shaped in described circuit board and described photo-sensitive cell A molded base, described molded base forms an optical window, and wherein said optical window is not flat column of the prior art, so exists In manufacture craft, reduce the damage to described molded base for the optical window forming blocks of a molding tool, and be easy to optical window shaping The extracting of block.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein The formation between at least a portion that described photo-sensitive cell one extends and optical axis direction of described molded base has at an acute angle One first conveniently stripped inclination angle, after moulding technology forms described molded base, described optical window forming blocks can smooth be pulled out Go out, reduce the friction with described molded base, so that described molded base can maintain the original state as far as possible, reduce described optical window The impact bringing when forming blocks are extracted.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein At least a portion medial surface of the described molded base that described molded base extends from the top surface of described photo-sensitive cell one with The angle of optical axis is defined as described first inclination angle, so that the light being incident to described medial surface is difficult to reach described photosensitive unit Part, reduces the impact to image quality for the veiling glare.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein In the lateral surface of described molded base, at least one lateral surface and the angle in the direction of optical axis are conveniently stripped at an acute angle one second Inclination angle, when being manufactured by described mould, the spacing block of described mould is extracted in the outside of described molded base When, the friction between reducing outside the described spacing block of described mould and described molded base, so that described molding The described lateral surface of pedestal maintains the original state as far as possible, and the described spacing block of described mould is easily extracted.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein There is inside described molded base a Part I medial surface of the inclination extending from described photo-sensitive cell successively, extend described One Part II medial surface of Part I medial surface, and the Part III obliquely extending described Part II medial surface Medial surface, described Part III medial surface is defined as one the 3rd conveniently stripped inclination angle with the angle of optical axis, thus described When the optical window forming blocks of mould are pulled out, reduce the base portion of described optical window forming blocks and the inner side on described molded base top Between friction, the described Part II medial surface obtaining described molded base maintains the original state as far as possible, and described mould Described mould is easily extracted.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein Described first inclination angle within a predetermined range, is conveniently extracted and is not damaged and connect drawing of described photo-sensitive cell and described circuit board Line.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein Mould bottom side is usually provided with one layer of layers of elastomeric film, these inclination angle on-right angles, thus preventing described film layer is punctured.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein Described molded base has a top side face, and the angular dimension at described first, second, and third inclination angle is within a predetermined range, convenient The extracting of described optical window forming blocks and described spacing block, the size being again unlikely to make described top side face too little and can not be to driver Or camera lens provides firm installation region.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein The angular dimension at described first, second, and third inclination angle within a predetermined range, facilitates extracting of described optical window forming blocks, convenient Extracting of described optical window forming blocks, can provide firm installation region to optical filter or optical filter microscope base again.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein Described molded base is formed with gradient optical window, increasing light flux, and the visual field and the angle that meet described photo-sensitive cell are incident The requirement of scope.
A purpose of the present utility model is to provide a camera module and its molding photosensory assembly and mould, wherein Each described draft angle is equipped with predetermined angular range it is ensured that the structural strength of described molding, light reflectance and reduction The demoulding rubs.
In order to realize at least one goal of the invention above, one side of the present utility model provides a molding photosensory assembly, mould Mould photosensory assembly, be applied to a camera module, it includes at least one circuit board, at least one photo-sensitive cell, and at least one molding base Seat, described molded base is joined integrally with described circuit board and described photo-sensitive cell by moulding technology, wherein said molding base Seat forms at least one optical window, and described optical window is corresponding with described photo-sensitive cell position, and described molded base is from described photosensitive unit At least a portion medial surface that part one extends obliquely extends.
In certain embodiments, the optical axis of described at least a portion medial surface of described molded base and described camera module Corner dimension between straight line is 10 °～80 °.
In certain embodiments, described molded base has a non-photo-sensing area one of the top surface from described photo-sensitive cell The medial surface that body extends linearly, thus whole medial surfaces of described molded base obliquely extend, described molding base Between the described medial surface of seat and the optical axis straight line of described camera module, there is an inclination angle that is conveniently stripped and avoiding veiling glare The magnitude range of α, wherein α is 10 °～80 °.As selected from 10 °～30 °, 30 °～45 °, 45 °～55 ° or 55 °～80 °.
In certain embodiments, pass through one group of lead conducting between described photo-sensitive cell and described circuit board to connect, wherein The routing connected mode of described lead is when described photo-sensitive cell is towards described circuit board, and the numerical value of α is selected from 10 °～55 °.
In certain embodiments, pass through one group of lead conducting between described photo-sensitive cell and described circuit board to connect, wherein The routing connected mode of described lead is when described circuit board is towards described photo-sensitive cell, and the numerical value of α is selected from 10 °～88 °.
In certain embodiments, described molded base has the lateral surface integratedly extending linearly from described circuit board, There is between the optical axis straight line of the lateral surface of wherein said molded base and described camera module a conveniently stripped inclination angle γ, Wherein the magnitude range of γ is 3 °～45 °.As selected from 3 °～15 °, 15 °～30 °, or 30 °～45 °.
In certain embodiments, described molded base has a top side groove on top, and described molded base has bending The medial surface extending, it includes the Part I medial surface integratedly extending successively, a Part II medial surface and one the Three portion of medial side, described Part I medial surface one obliquely extends a non-sense of a top surface of described photo-sensitive cell Light area, described Part III medial surface one obliquely extends described Part II medial surface, in wherein said Part II Side and described Part III medial surface define formation described top side groove.
In certain embodiments, have between described Part I medial surface and the optical axis straight line of described camera module conveniently The demoulding and the inclined angle alpha avoiding veiling glare, the wherein magnitude range of α are 10 °～80 °, described Part III medial surface and institute There is between the optical axis straight line stating camera module an angle of inclination beta that is conveniently stripped and avoiding veiling glare, the wherein magnitude range of β is 3 °～30 °.
In certain embodiments, the numerical value of α is selected from 10 °～30 °, 30 °～45 °, 45 °～55 ° or 55 °～80 °, wherein β Numerical value be selected from 3 °～15 °, 15 °～20 ° or 20 °～30 °.
In certain embodiments, described Part II medial surface is based on parallel with the described top surface of described photo-sensitive cell.
In certain embodiments, described molding photosensory assembly also has one or more driver pin grooves, wherein defines Between the pin trough wall surface of each described driver pin groove and the optical axis straight line of described camera module, there is conveniently stripped one The magnitude range of inclination angle δ, wherein δ is 3 °～30 °.
In certain embodiments, described molding photosensory assembly also includes at least one optical filter, described optical filter and described sense Optical element is superimposed, described molded base integratedly in package shape in described optical filter, described photo-sensitive cell and described circuit board.
In certain embodiments, the outside of at least one outer peripheral face in the described lateral surface of described molded base, described The substrate of circuit board leaves the pressing being easy to press of at least one spacing block of a molding tool in moulding technology apart from W, its number Value scope is 0.1～0.6mm.
In certain embodiments, the material surface of described molded base is in the reflectivity of range of light wavelengths 435-660nm Less than 5%.
Described optical window cross-sectional configuration of the present utility model becomes in gradually big trapezoidal or multistage trapezoidal from the bottom to top, de- to facilitate Mould, prevent the damage to molded base, avoid veiling glare and prevent in moulding technology to connecting described photo-sensitive cell and described The damage of the described lead of circuit board.
The utility model also provides a camera module, and it includes at least one camera lens and photosensitive group of above-mentioned at least one molding Part, described molding photosensory assembly includes at least one circuit board, at least one photo-sensitive cell, and at least one molded base, described molding Pedestal is joined integrally with described circuit board and described photo-sensitive cell by moulding technology, and wherein said molded base forms at least one Optical window, described optical window is described photo-sensitive cell and a passage of light mentioned by described camera lens, and described molded base is from described sense At least a portion medial surface that optical element one extends obliquely extends.
In certain embodiments, described molding photosensory assembly also includes at least one optical filter, described optical filter and described sense Optical element is superimposed, described molded base integratedly in package shape in described optical filter, described photo-sensitive cell and described circuit.
In certain embodiments, it also includes at least one optical filter, and described optical filter is installed on the top of described molded base End.
In certain embodiments, it also includes at least one optical filter, and described optical filter is installed on the institute of described molded base State top side groove.
In certain embodiments, it also includes at least one optical filter microscope base and at least one optical filter, and described optical filter is installed In described optical filter microscope base, described optical filter microscope base is installed on the top of described molded base.
In certain embodiments, it also includes at least one driver, and described driver is installed on the top of described molded base So that described molded base supports described driver, wherein said camera lens is installed on automatically right to realize in described driver for side Burnt.
In certain embodiments, it also includes at least one barrier element ringwise, to prevent described moulding technology middle mold Moulding material reaches a photosensitive area of described photo-sensitive cell.
In certain embodiments, multiple described camera modules are assembled into an array camera module.
In certain embodiments, described molding photosensory assembly includes multiple described photo-sensitive cells and has multiple described light Window, thus form an array camera module with multiple described camera lenses.
The utility model also provides an electronic equipment, and it includes above-mentioned one or more described camera module.Described electricity Sub- equipment including but not limited to mobile phone, computer, television set, intelligence can screw on equipment, the vehicles, camera and supervising device.
The utility model also provides a molding to have, and is applied to make photosensitive group of at least one molding of at least one camera module Part, it includes mutually separating or one first mutually closely sealed mould and one second mould, and wherein said first and second moulds exist Form at least one forming cavity when mutually closely sealed, and described mould is configured with least one optical window forming blocks in described forming cavity And the pedestal profiled guide slot around described optical window forming blocks, wherein when in described forming cavity install be connected with least one sense At least one circuit board of optical element, the moulding material being filled in described pedestal profiled guide slot experiences liquid under temperature control function State curing molding to the conversion process of solid-state, forms a molded base in the position of corresponding described pedestal profiled guide slot, right The position of described optical window forming blocks should form an optical window of described molded base, wherein said molded base is shaped in described At least a portion non-photo-sensing area of circuit board and described photo-sensitive cell is to form the described molding photosensory assembly of described camera module.
In certain embodiments, described optical window forming blocks have, along its periphery, the base interior side surface shaping that an inclination extends Face, for forming the medial surface that described molded base integrated linear extends.
In certain embodiments, the side of having between the described base interior side surface forming surface of described optical window forming blocks and vertical curve Just an inclination angle of the demoulding, the wherein magnitude range of α are 10 °～80 °.
In certain embodiments, described optical window forming blocks include a pressure head portion and integratedly extend described pressure head portion one Groove shape, described groove shape has larger internal diameter than described pressure head portion, for the top in described molded base Side forms a top side groove.
In certain embodiments, described pressure head portion has conveniently stripped along between the lateral surface and vertical curve of its periphery and keeps away Exempt from an inclined angle alpha of veiling glare, the wherein magnitude range of α is 10 °～80 °, and described groove shape is along the lateral surface of its periphery There is and vertical curve between an angle of inclination beta, the wherein magnitude range of β is 3 °～30 °.Described photo-sensitive cell and described circuit board it Between connected by the conducting of one group of lead, the routing connected mode of wherein said lead is towards described circuit from described photo-sensitive cell During plate, the numerical value of α is selected from 10 °～55 °；The routing connected mode of wherein said lead is towards described photosensitive from described circuit board During element, the numerical value of α is selected from 10 °～88.
In certain embodiments, described first mould also includes at least one spacing block, and described spacing block has outside a pedestal Side forming surface, it has a conveniently stripped inclination angle γ and vertical curve between, and the numerical value of γ is selected from 3 °～45 °.
Brief description
The structural representation of the photosensory assembly of Figure 1A existing process encapsulation.
Figure 1B is the forming process schematic diagram of existing photosensory assembly.
Fig. 1 C is the knockout course schematic diagram of photosensory assembly in existing integral packaging technique
The camera module light path schematic diagram that Fig. 1 D tradition COB mode encapsulates.
The camera module light path schematic diagram of Fig. 1 E existing integral packaging mode.
Fig. 2 is that the manufacture of the molding photosensory assembly of the camera module according to first preferred embodiment of the present utility model sets Standby block diagram representation.
Fig. 3 A is the perspective exploded view of the camera module according to first preferred embodiment of the present utility model.
Fig. 3 B be the camera module according to above-mentioned first preferred embodiment of the present utility model along its length Sectional view.
Fig. 4 is the vertical of the molding photosensory assembly of the camera module according to above-mentioned first preferred embodiment of the present utility model Body schematic diagram.
Fig. 5 is the molding photosensory assembly of the camera module according to above-mentioned first preferred embodiment of the present utility model along figure The cross-sectional schematic of line A-A in 4.
Fig. 6 is the molding photosensory assembly illustrating the camera module according to above-mentioned first preferred embodiment of the present utility model Conveniently stripped inclination angle close-up schematic view.
Fig. 7 is that the effect avoiding veiling glare of the camera module according to above-mentioned first preferred embodiment of the present utility model is shown It is intended to.
Fig. 8 A illustrates according to the described molding photosensory assembly of above-mentioned first preferred embodiment of the present utility model In mould, liquid molding material is advanced sectional view during pedestal profiled guide slot, wherein this sectional view corresponds in Fig. 4 The sectional view in the line A-A direction illustrated.
Fig. 8 B illustrates according to the described molding photosensory assembly of above-mentioned first preferred embodiment of the present utility model Execute molded step in the described mould of manufacturing equipment and formed molded base corresponding to line A-A direction in Fig. 4 Sectional view.
Fig. 8 C is the described molding photosensory assembly of above-mentioned first preferred embodiment according to this invention molded Later knockout course schematic diagram.
Fig. 9 illustrates another change of the described molding photosensory assembly according to above-mentioned first preferred embodiment of the present utility model The structural representation of shape embodiment.
Figure 10 is the perspective exploded view of the camera module according to second preferred embodiment of the present utility model.
Figure 11 be the camera module according to above-mentioned second preferred embodiment of the present utility model along its length Sectional view.
Figure 12 is a deformation implementation side of the camera module according to above-mentioned second preferred embodiment of the present utility model The sectional view of formula.
Figure 13 is the molding photosensory assembly of the camera module according to above-mentioned second preferred embodiment of the present utility model Schematic perspective view.
Figure 14 is the molding photosensory assembly edge of the camera module according to above-mentioned second preferred embodiment of the present utility model The cross-sectional schematic of line C-C in Figure 13.
Figure 15 is photosensitive group of molding illustrating the camera module according to above-mentioned second preferred embodiment of the present utility model The close-up schematic view at the conveniently stripped inclination angle of part.
Figure 16 illustrates according to the described molding photosensory assembly of above-mentioned second preferred embodiment of the present utility model In mould, liquid molding material is advanced sectional view during pedestal jigsaw profiled guide slot, wherein this sectional view corresponds to figure The sectional view in the line C-C direction illustrated in 13.
Figure 17 illustrates according to the described molding photosensory assembly of above-mentioned second preferred embodiment of the present utility model In mould, liquid molding material is advanced sectional view during pedestal jigsaw profiled guide slot, wherein this sectional view corresponds to figure The sectional view in the line C-C direction illustrated in 13.
Figure 18 illustrates according to the described molding photosensory assembly of above-mentioned second preferred embodiment of the present utility model Execute molded step in mould and form the sectional view corresponding to E-E line direction in Figure 13 of molded base jigsaw.
Figure 19 is to be molded as according to the described molding photosensory assembly of above-mentioned second preferred embodiment of the present utility model The later knockout course schematic diagram of type.
Figure 20 is photosensitive group of the described molding that the moulding technology according to above-mentioned second embodiment of the present utility model makes The perspective view of part jigsaw.
Figure 21 is photosensitive group of the described molding that the moulding technology according to above-mentioned second embodiment of the present utility model makes The cleaved monomer obtaining of part jigsaw molds the structural representation of photosensory assembly.
Figure 22 is the described molding of the other variant embodiment according to above-mentioned second embodiment of the present utility model The sectional view of photosensory assembly.
Figure 23 is the camera module of the other variant embodiment according to second preferred embodiment of the present utility model Cross-sectional schematic.
Figure 24 is the camera module of the other variant embodiment according to second preferred embodiment of the present utility model Cross-sectional schematic.
Figure 25 is the structural representation being applied to mobile phone according to above-mentioned camera module of the present utility model.
Figure 26 is the described molding sense illustrating the moulding technology according to above-mentioned second embodiment of the present utility model to make The close-up schematic view at the conveniently stripped inclination angle of first example of optical assembly.
Figure 27 is the described molding sense illustrating the moulding technology according to above-mentioned second embodiment of the present utility model to make The close-up schematic view at the conveniently stripped inclination angle of second example of optical assembly.
Figure 28 is the described molding sense illustrating the moulding technology according to above-mentioned second embodiment of the present utility model to make The close-up schematic view at the conveniently stripped inclination angle of the 3rd example of optical assembly.
Figure 29 is the described molding sense illustrating the moulding technology according to above-mentioned second embodiment of the present utility model to make The close-up schematic view at the conveniently stripped inclination angle of the 4th example of optical assembly.
Figure 30 is the described molding sense illustrating the moulding technology according to above-mentioned second embodiment of the present utility model to make The close-up schematic view at the conveniently stripped inclination angle of the 5th example of optical assembly.
Figure 31 is the described molding sense illustrating the moulding technology according to above-mentioned second embodiment of the present utility model to make The close-up schematic view at the conveniently stripped inclination angle of the 6th example of optical assembly.
Figure 32 is the described molding sense illustrating the moulding technology according to above-mentioned second embodiment of the present utility model to make The close-up schematic view at the conveniently stripped inclination angle of the 7th example of optical assembly.
Specific embodiment
Hereinafter describe for disclosing the utility model so that those skilled in the art are capable of the utility model.Hereinafter retouch Preferred embodiment in stating is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.Retouch following The general principle of the present utility model defining in stating can apply to other embodiments, deformation program, improvement project, etc. Tongfang Case and the other technologies scheme without departing from spirit and scope of the present utility model.
It will be understood by those skilled in the art that of the present utility model disclose in, term " longitudinal ", " horizontal ", " on ", The orientation of instruction such as D score, "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outward " or position are closed System is based on orientation shown in the drawings or position relationship, and it is for only for ease of description the utility model and simplifies description, and not Be instruction or the hint device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore go up State term it is not intended that to restriction of the present utility model.
It is understood that term " " is interpreted as " at least one " or " one or more ", that is, in one embodiment, The quantity of one element can be one, and in a further embodiment, the quantity of this element can be multiple, and term " " is no It is understood that to be the restriction to quantity.
As shown in Fig. 1 to Fig. 8 C, it is the camera module according to first preferred embodiment of the present utility model.Described shooting Module can be applied to various electronic equipments, citing ground but be not limited to smart mobile phone, wearable device, computer equipment, TV Machine, the vehicles, camera, supervising device etc., described camera module coordinates described electronic equipment to realize the figure to destination object As collection and reproduction.
More specifically, a molding photosensory assembly 10 of described camera module 100 and its manufacturing equipment 200.Described molding sense Optical assembly 10 includes a circuit board 11, a molded base 12 and a photo-sensitive cell 13.Described molding base wherein of the present utility model Seat 12 by described manufacturing equipment 200 unitary packed on described circuit board 11 and described photo-sensitive cell 13, thus described Molded base 12 can replace microscope base or the support of traditional camera module, and do not need to need in similar conventional package technique by Microscope base or support are attached at circuit board by glue.
Described camera module 100 further includes a camera lens 30.Wherein said molded base 12 includes an annular molding Main body 121 and centre has an optical window 122, to provide a passage of light to described camera lens 30 and described photo-sensitive cell 13.Institute State photo-sensitive cell 13 and be operatively connected to described circuit board 11, will such as by way of COB (Chip On Board) plays lead Described photo-sensitive cell 13 is connected to described circuit board 11 and is located at the top side of described circuit board 11.Described photo-sensitive cell 13 and described Camera lens 30 is assembled in the both sides of described molded base 12 respectively, and the arrangement of optical alignment ground, makes the light through described camera lens 30 Line can reach described photo-sensitive cell via described optical window 122, thus can make described shooting mould after photoelectric conversion effect Group 100 is provided optical imagery.
As shown in Figure 3 A and Figure 3 B, described camera module 100 can be to have a driver 40 such as voice coil motor, piezoelectricity horse The dynamic Jiao's camera module reaching etc., described camera lens 30 is installed on described driver 40.Described molded base 12 can be used for supporting institute State driver 40.The top side of described molded base 12 is also provided with an optical filter 50, for being filtered through described camera lens 30 light, can be such as cutoff filter.In this embodiment of the present utility model and in accompanying drawing, taken the photograph with dynamic Jiao As a example module, a kind of mode that the utility model can be carried out be described, but be not restriction, of the present utility model its In his embodiment, described camera lens 30 can be installed in described molding photosensory assembly 10, without described driver 40, also It is to say, form one and focus module, those skilled in the art is it should be appreciated that the type of described camera module is not this reality With new restriction, described camera module 100 can be to focus camera module, or dynamic Jiao's camera module.
Described circuit board 11 includes a substrate 111, and it is as many in mounted by SMT technique to be formed at described substrate 111 Individual electronic devices and components 112, described electronic devices and components 112 include but is not limited to resistance, electric capacity, driving element etc..New in this practicality In this embodiment of type, described molded base 12 is integratedly coated on described electronic devices and components 112, thus preventing similar tradition In camera module, dust, debris stick on described electronic devices and components 112, and further pollute described photo-sensitive cell 13, Thus affecting imaging effect.It is understood that it is also possible to described electronic devices and components 112 in other variant embodiment Inside it is embedded in described substrate 111, that is, described electronic devices and components 112 can be not exposed to outward.The substrate 111 of described circuit board 111 can To be PCB hardboard, PCB soft board, Rigid Flex, ceramic substrate etc..It is noted that this is preferred of the present utility model In embodiment, because described molded base 12 can coat these electronic devices and components 112 completely, electronic devices and components 112 can It is embedded in described substrate 111 with not interior, described substrate 111 is only used for forming conducting circuit, so that the described mould being finally obtained Moulding photosensory assembly 10, to be able to thickness less.
In this preferred embodiment of the present utility model, described photo-sensitive cell 13 is superimposed on being located at of described circuit board 11 The smooth congruent region of described electronic devices and components 112 inner side, and molded technique will be in described circuit board 11 and described sense Described molded base 12 is formed on optical element 13, i.e. described molded base 11 and described circuit board 11 and described photosensitive Element 13 integratedly combines.Described photo-sensitive cell 13 has a top surface 131, and described top surface 131 has the photosensitive area in central authorities Domain 1311 and the non-photo-sensing region 1312 around described photosensitive region 1311.Described molded base 12 is integratedly coated at least one Partly described non-photo-sensing region 1312 and described circuit board 11.
Further, as shown in Fig. 2 the manufacturing equipment 200 of the described molding photosensory assembly 10 of described camera module 100 Have 210 including a molding, a moulding material feeding machanism 220, a die fixture 230, an attemperating unit 250 and a control Device 260 processed, described moulding material feeding machanism 220 is used for providing described moulding material 14 to described pedestal profiled guide slot 215.Institute State die fixture 230 for controlling die sinking and the matched moulds of described mould 210, described attemperating unit 250 is used for institute State moulding material 14 to be heated or cooled, described controller 260 is used for automatically controlling described moulding material in moulding technology Feeding machanism 220, described die fixture 230, and the operation of described attemperating unit 250.
Described mould 210 includes can molding one with matched moulds in the presence of described die fixture 230 One mould 211 and one second mould 212, that is, described die fixture 230 can be by described first mould 211 and described second Mould 212 mutually separately forms a forming cavity 213 with mutually closely sealed, and in matched moulds, described circuit board 11 is fixed on described forming cavity 213 Interior and liquid described moulding material 14 enters described forming cavity 213, thus being shaped on described circuit board 11, And form the described molded base 12 being shaped on described circuit board 11 and described photo-sensitive cell 13 after cured.
More specifically, described shaping module 210 further include optical window forming blocks 214 and having be formed at described A pedestal profiled guide slot 215 around optical window forming blocks 214, in described first and second moulds 211 and 212 matched moulds, described Optical window forming blocks 214 and described pedestal profiled guide slot 215 extend in described forming cavity 213, and liquid described molding Material 14 is populated into described pedestal profiled guide slot 215, and the position of corresponding described optical window forming blocks 214 is unable to liquid filling body The described moulding material 14 of shape, thus in the position of corresponding described pedestal profiled guide slot 215, liquid described moulding material 14 The molded body 121 of the annular of described molded base 12 can be formed after cured, and in corresponding described optical window forming blocks 214 Position can form the described optical window 122 of described molded base 12.Described moulding material 14 can select but be not limited to nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer), PP (Polypropylene, polypropylene), asphalt mixtures modified by epoxy resin Fat etc..
Described first and second moulds 211 and 212 can be to produce two moulds of relative movement, in such as two moulds One of fixing, another may move；Or two moulds are all removable, the utility model is not exposed to limit in this respect System.In the example of this embodiment of the present utility model, described first mould 211 is tangibly embodied as a fixing upper mould, and Described second mould 212 is embodied as a removable lower mould.In described fixation, mould and described removable lower mould are coaxially arranged, as institute State removable lower mould and can form tight closure when with described fixing Ccope closing machine along multiple locating shaft upward slidings Described forming cavity 213.
Described second mould 212 is that described lower mould can have a circuit board locating slot 2121, its can in groove-like or Formed by locating dowel, for installing and fixing described circuit board 11, and described optical window forming blocks 214 and the shaping of described pedestal are led Groove 215 can be formed at described first mould 211, that is, be formed at described upper mould, when described first and second moulds 211 and 212 During matched moulds, form described forming cavity 213.And liquid described moulding material 14 is injected into the top side of described circuit board 11 Described pedestal profiled guide slot 215, thus form described molded base in the top side of described circuit board 11 and described photo-sensitive cell 13 12.
It is understood that it is on described that described circuit board locating slot 2121 can also be arranged at described first mould 211 Mould, for installing and fixing described circuit board 11, and described optical window forming blocks 214 and described pedestal profiled guide slot 215 can be with shapes Become in described second mould 211, when described first and second moulds 211 and 212 matched moulds, form described forming cavity 213.Described Can just arrange facing to ground in circuit board 11 mould on described, and liquid described moulding material 14 be injected into inverted The described pedestal profiled guide slot 215 of the bottom side of described circuit board 11, thus form institute in the bottom side of inverted described circuit board 11 State molded base 12.
More specifically, in described first and second moulds 211 and 212 matched moulds and when executing molding step, described optical window becomes Type block 214 is superimposed on the photosensitive region 1311 of the top surface 131 of described photo-sensitive cell 13 and fits tightly, thus liquid institute State the photosensitive region that moulding material 14 is prevented from entering the top surface 131 of described photo-sensitive cell 13 on described circuit board 11 1311, thus the described optical window of described molded base 12 can be ultimately formed in the position of corresponding described optical window forming blocks 214 122.
It is understood that the forming surface that described first mould 211 forms described pedestal profiled guide slot 215 can be configured to Burnishing surface, and it is in same plane, so when described molded base 12 curing molding, the top table of described molded base 12 Face is more smooth, thus being described driver 40, other load bearing components of described camera lens 30 or described camera lens provide smooth peace Dress condition, reduces the heeling error of the described camera module 100 after assembling.
It is noted that described pedestal profiled guide slot 215 and described optical window forming blocks 214 can integrally formed in institute State the first mould 211.Can also be that described first mould 211 further includes dismountable molding structure, described shaping knot It has been configured to described pedestal profiled guide slot 215 and described optical window forming blocks 214.So, according to photosensitive group different of described moldings The shape and size of part 10 require the such as diameter of described molded base and thickness etc., can design the described of different shape and size Pedestal profiled guide slot 215 and described optical window forming blocks 214.So it is only necessary to replace different molding structures, you can so that described Manufacturing equipment is suitably applied the described molding photosensory assembly 10 of different size requirement.It is understood that described second mould 212 correspondingly can also include dismountable fixed block, to provide the described groove 2121 of different shape and size, thus convenient Change the described circuit board 11 adapting to different shape and size.
It is understood that described moulding material 14 can be heat-fusible materials such as thermoplastic material, by described Heat-fusible materials heating fusing in solid-state is become liquid described moulding material 14 by attemperating unit 250.In described molding During shaping, the described moulding material 14 of hot melt is able to curing molding through the process of cooling.Described moulding material 14 can also be thermosets, by the thermosets heating fusing in solid-state is become liquid described moulding material 14.Described molded during, heat cured described moulding material 14 solidifies through further heating process, and And no longer can melt after hardening, thus form described molded base 12.
It is understood that in described moulding technology of the present utility model, described moulding material 14 can be block, Granular or powder, becomes liquid after its heated effect in described mould 210, then more cured from And form described molded base 12.
It is understood that in this embodiment, illustrating the moulding technology of a described circuit board 11, in the application, Moulding technology can also be carried out to multiple independent described circuit boards 11 simultaneously.Or can also be using hereinafter second reality Apply the jigsaw operation mentioned in example.
It is the institute of the described camera module 100 according to this preferred embodiment of the present utility model as shown in Fig. 8 A to Fig. 8 C State the manufacture process schematic diagram of molding photosensory assembly 10, as shown in Figure 8 A, described mould 210 is in matched moulds state, treats mould The described circuit board 11 moulded and the described moulding material 14 of solid-state are in position, and the described moulding material 14 of solid-state is heated, from And when described moulding material 14 is molten into liquid condition or semi-solid state, be admitted to described pedestal profiled guide slot 215, and arrive Reach described optical window forming blocks 214 around.
As shown in Figure 8 B, when being stuffed entirely with liquid described moulding material 14 in described pedestal profiled guide slot 215, Liquid described moulding material 14 curing molding is made to be formed in one in described circuit board 11 and described through solidification process again The described molded base 12 of photo-sensitive cell 13.So that described moulding material 14 is as thermosets as a example, heated fusing and be in liquid The described moulding material 14 of body shape is again through heating process, thus curing molding.
As shown in Figure 8 C, after described moulding material 14 solidify to form described molded base 12, execution is of the present utility model de- Mold process, that is, described die fixture 230 so that described first and second moulds 211 and 212 is located remotely from each other, so described optical window Forming blocks 214 leave described molded base 12, make to form described optical window 122 in described molded base 12.
In the prior art, as shown in Figure 1B, forming blocks 4 bottom of flat column has sharp rib, during withdrawing pattern, Sharp rib can produce larger friction with the medial surface of encapsulation part 1, thus the medial surface of encapsulation part 1 can be damaged.And in this reality In new, the structure of described optical window forming blocks 214 of the present utility model, it is not result in described molded base 12 is damaged.
More specifically, in this embodiment of the present utility model, as shown in Fig. 8 A to Fig. 8 C, described optical window forming blocks 214 Section tapered, that is, described optical window forming blocks 214 be cone-shaped as frustum, inside it be solid it is also possible to hollow, It is similar to a hollow cap, it can be located on described photo-sensitive cell 13 to facilitate follow-up moulding technology.
In this example of the present utility model, it is solid construction, and described optical window forming blocks 214 have bottom side One stitching surface 2141, and the periphery forming surface extending linearly extending around direction, to be molded as a base interior side surface Face 2142.Angle between base interior side surface forming surface 2142 and vertical curve is the first inclined angle alpha, and it is not of the prior art 0 degree of angle, but acute angle.More specifically, preferably 10 °～80 ° of the magnitude range of described first angle α, it is highly preferred that 30 °～55 °.
It is understood that as shown in Figure 5 and Figure 6, in the described mould of this described camera module 100 of the present utility model The described molded body 121 moulding the described molded base 12 of photosensory assembly 10 has the medial surface 124 extending linearly, described interior Have onesize between the rectilinear direction of optical axis Y of described photo-sensitive cell 13 of side 124 and described molding photosensory assembly 10 Described first inclined angle alpha.
The size of the numerical value of described first angle α is not to be the bigger the better, as shown in fig. 6, described photo-sensitive cell 13 passes through One group of electric connection structure is connected with described circuit board 11.More specifically, described electric connection structure is included located at described photosensitive unit The one photo-sensitive cell terminal pad 132 in the described non-photo-sensing area 1312 of part 13, located at the one of the described substrate 111 of described circuit board 11 Circuit board terminal pad 113, and extend in the lead between photo-sensitive cell terminal pad 132 and described circuit board terminal pad 113 15, thus realizing the conducting connection of described photo-sensitive cell 13 and described circuit board 11.Described lead 15 citing ground but be not limited to gold Line, silver wire, copper cash and aluminum steel etc..The shape of described photo-sensitive cell terminal pad 132 and described circuit board terminal pad 113 can be lifted Example ground but be not limited to box-shaped, spherical etc..In order to, in molding process planning, described optical window forming blocks 214 are pressed on described sense During optical element, described optical window forming blocks 214 are unlikely to damage described lead 15 by pressure and lead to the fracture of described lead 15, described optical window The described base interior side surface forming surface 2142 of forming blocks 214 must not exceed the peak of described lead 15.And according to routing The difference of mode, the greatest measure of described first angle α is also had any different, also will be further concrete in specific example below Analysis.
As shown in Figure 8 A, the section of described optical window forming blocks 214 is trapezoidal in be gradually increased from the bottom to top, correspondingly, shape Described optical window 122 section of the described molded base 12 becoming is in trapezoidal, the described molded base that opening is gradually increased from the bottom to top 12 described medial surface 124 not with and the preferred scope of described first angle α is 10 °～80 °, it is highly preferred that 30 °～ 55 °, thus conveniently stripped, described lead 15 will not be damaged again.And the described molded base 12 of the trapezoidal shape in section is described Optical window 122 can guarantee that intensity with material-saving again.
It is noted that the selection of the magnitude range of the first angle α described in the utility model is additionally it is possible to be effectively prevented from Veiling glare.In the camera module of existing molded packages, reference picture 1E, light is incident by camera lens, and some light reaches described Sensitive chip carries out photosensitization, and another part light, such as Fig. 1 D light L are projected to the vertical described of described encapsulation part 1 Inwall, it is easy to reach described sensitive chip 3 after being reflected by the described inwall of described encapsulation part 1, participates in described sensitive chip 3 Photoelectric conversion process in the middle of, thus have impact on the image quality of described camera module.And according to embodiment of the present utility model, With reference to Fig. 7, light is incident by described camera lens, and some light reaches described photo-sensitive cell 13, another part light, such as same sample prescription To light M be projected to inclination described molded base 12 described medial surface 124, by the described inner side of described molded base 12 Face 124 is reflected, so that described reflection light is away from described photo-sensitive cell 13, without reaching described photo-sensitive cell 13, ginseng With the photosensitization of described photo-sensitive cell 13, therefore decrease the impact of the reflection image quality to described camera module for the veiling glare.
It is noted that in the present invention, the material surface of described molded base 12 is in range of light wavelengths 435- The reflectivity of 660nm is less than 5%.That is, the light that major part is incident to the surface of described molded base 12 can not be anti- Penetrate and form the interference veiling glare reaching described photo-sensitive cell 13, thus significantly decreasing the impact of reflection veiling glare.
In addition, as shown in FIG., described molded base 12 has the medial surface 124 of circumferential direction along in it, along its periphery side To lateral surface 125 and annular top side face 126.Described medial surface 124 integratedly extends the top table of described photo-sensitive cell 13 Face 131, described lateral surface 125 integratedly extends the top surface 1111 of the described substrate 111 of described circuit board 11.Described shaping Described first mould 211 of mould 210 is further provided with one or more spacing blocks 216, for the shape in moulding technology Become the described lateral surface 125 of described molded base 12.More specifically, described spacing block 216 has a pedestal lateral surface forming surface 2161, to determine the described lateral surface of the described molded base 12 making described moulding material 14 be solidified to form in moulding technology 125 location and shape.There is between described spacing block 216 and described optical window forming blocks 214 a top side face forming surface 217, with Determine to make the position of the described top side face 126 of described molded base 12 that described moulding material 14 is solidified to form in moulding technology Put and shape.In the prior art, the lateral surface of encapsulation part 1 is also vertical with wiring board, that is, outside the pedestal of the spacing block of mould Vertically, thus during demoulding, the pedestal lateral surface forming surface of mould is outer with encapsulation part 1 always for side forming surface Side rubs, thus inconvenient stripping operation, and also easily damage the lateral surface of the encapsulation part 1 being formed.
And in the utility model, described pedestal lateral surface forming surface 2161 has one second inclination angle with vertical direction γ, has an equal amount of described second inclination angle between the described lateral surface 125 of described molded base 12 and optical axis Y-direction γ, when that is, described molded base 12 is horizontally disposed, has institute between the described lateral surface 125 of described molded base 12 and vertical curve State the second inclination angle γ.The described demoulding for convenience, this angle is acute angle, and in order that the described top of described molded base 12 Side 126 has enough sizes, to facilitate completing of subsequently described camera lens 30 or described driver 40, described second inclination angle γ can not be too big.If that is, described second inclination angle γ is too big, and the described medial surface 124 of described molded base 12 All inclined with described lateral surface 125, can lead to its top side face 126 length too little it is impossible to be firmly installed described mirror 30 or described drivers 40.In addition in this embodiment, the bottom of described driver 40 has binding face, and it fits in institute State the described top side face 126 of molded base 12, when described top side face 126 size of described molded base 12 is too little, such as less than institute When stating binding face, may result in described driver 40 be inconvenient to align installation, and be installed on institute in described driver 40 State the described top side face 126 of molded base 12, may rock and built on the sand it is impossible to shatter-resistant anticollision.Therefore, in the utility model In, the numerical value maximum of the angle of described second inclination angle γ is preferably no more than 45 °.In addition, its minimum of a value is conveniently being capable of mould The stripping operation moulding technique can facilitate the processing and fabricating of described mould 210 again, therefore, in the utility model, described second Preferably not less than 3 ° of the numerical value minimum of a value of the angle of inclination angle γ.Therefore, described second inclination angle γ's of the present utility model is suitable Preferably scope is 3 °～45 °, more preferably 3 °～15 °.It is noted that as shown in figure 5, for convenience of the demoulding and to described The pressing of the described substrate 111 of circuit board 11, described lateral surface 125 and the described circuit board of the described molded base 12 after shaping The outer edge of 11 described substrate 111 can form a pressing apart from W, that is, in mould the first day of the lunar month technique, be suitable for described spacing block 216 and press Region on the described substrate 111 of described circuit board 11, it is the described lateral surface 125 of described molded base 12 from described electricity Position and the distance of the outer edge of described substrate 111 of described circuit board 11 that described substrate 111 one of road plate 11 extends, example If this pressing can be 0.1～0.6mm apart from W, such as in a specific example, this pressing apart from W can be 0.2mm.
It is understood that due to there is described first inclined angle alpha of above range and described second inclination angle γ, i.e. institute State the described medial surface 124 of molded base 12 and described lateral surface 125 has gradient, thus in the demoulding, with described first Frictional force between mould 211 reduces, and easily extracts, so that described molded base 12 obtains preferably completed state.More specifically Ground, as seen in fig. 8 c, after moulding technology forms described molded base 12 of solidification, when starting stripping operation, described optical window Forming blocks 214 and described spacing block 216 start to move straight up, and the described base interior side surface of described optical window forming blocks 214 becomes The described pedestal lateral surface forming surface 2161 of type face 2142 and described spacing block 216 is described interior with described molded base 12 respectively Side 124 and described lateral surface 125 separate, thus described base interior side surface forming surface 2142 He of described optical window forming blocks 214 The described pedestal lateral surface forming surface 2161 of described spacing block 216 respectively will not be with the described medial surface of described molded base 12 124 and described lateral surface 125 phase CONTACT WITH FRICTION and damage the described medial surface 124 of described molded base 12 and described lateral surface 125, it can be facilitated smoothly to extract simultaneously again.
Meanwhile, described mould 210 forms the shape of described pedestal profiled guide slot 215, does not have rectangular dead angle, properly The gradient so that flow-like described moulding material 14 enter described pedestal profiled guide slot 215, mobility is more preferable.And, In described first inclined angle alpha with described second inclination angle γ is acute angle, and unlike right angle of the prior art, thus described molding The described top surface 131 of the described photo-sensitive cell 13 of photosensory assembly 10 and the folder of the described medial surface 124 of described molded base 12 Angle becomes more mellow and full obtuse angle, and described optical window forming blocks 214 and described spacing block 216 will not form sharp corner angle and scratch The described medial surface 124 of described molded base 12 and described lateral surface 125.And, the setting of the scope of described first inclined angle alpha Make described molded base 12 it can be avoided that the image quality of camera module 100 described in stray light.
As shown in figure 9, according to other variant embodiment, described filter element 50 can be folded with described photo-sensitive cell 13 Close, then pass through moulding technology formation of the present utility model again and be integrated in described filter element 50, described photo-sensitive cell 13 Described molded base 12 with described circuit board 11.
It is the described mould of the described camera module 100 according to second embodiment of the present utility model as shown in Figure 10 is to 21 Mould photosensory assembly 10 and its manufacture process.In this embodiment, make a molding photosensory assembly by way of jigsaw operation and spell Plate 1000, then cutting obtains described molding photosensory assembly 10.
Correspondingly, more specifically, described mould 210 forms a forming cavity 213 in matched moulds, and multiple light are provided Window forming blocks 214 and one or more pedestal jigsaw profiled guide slot 2150, it is equivalent to and provides the multiple pedestals being connected and become Type guide groove 215, these pedestal profiled guide slot 215 form the guide groove of an entirety.
Before moulding technology, first make a multiple-printed-panel for circuit board 1100, it includes the circuit board 11 of multiple integrally connecteds, and And each described circuit board 11 can be connected to described photo-sensitive cell 13 by way of routing connects.
When the described multiple-printed-panel for circuit board 1100 being connected with multiple described photo-sensitive cells 13 is placed in described forming cavity 213, And when described mould 210 is in matched moulds state, the described moulding material 14 of solid-state is heated and melts and be admitted to institute State pedestal jigsaw profiled guide slot 2150, thus being filled in each described optical window forming blocks 214 around.Finally, liquid institute State moulding material 14 through a solidification process, make the liquid described mould in described pedestal jigsaw profiled guide slot 2150 Moulding material 14 solidifies and hardens and is integrally molded into each described circuit board 11 of described multiple-printed-panel for circuit board 1100 and described thus being formed Described molded base 12 on photo-sensitive cell 13, these molded base 12 form holistic molded base jigsaw 1200.
Fit tightly for forming surface and the described circuit board 11 of described first mould 211 and described photo-sensitive cell 13 and Conveniently stripped, the forming surface of described first mould 211 and described circuit board 11 and described photo-sensitive cell 13 are additionally provided with an elasticity Film layer 219.
It is noted that described each described mould molding the monomer that the cleaved making of photosensory assembly jigsaw 1000 obtains Mould photosensory assembly 10 to be used for making dynamic Jiao's camera module when being automatic focusing camera module, described mould 210 is further It is provided with multiple driver pin Slot shaping blocks 218, each described driver pin Slot shaping block 218 extends into described pedestal Jigsaw profiled guide slot 2150, thus in molding process, liquid described moulding material 14 will not be filled and be corresponded to each The position of described driver pin Slot shaping block 218, thus after the curing step, in described molding photosensory assembly jigsaw 1000 Described molded base jigsaw 1200 in form multiple described optical windows 122 and multiple driver pin groove 127, cleaved making The described molded base 12 of each described molding photosensory assembly 10 of the monomer obtaining is configured with described driver pin groove 127, thus when making described dynamic Jiao's camera module 100, the pin 41 of described driver 40 is able to by welding or conducting resinl The modes such as attaching are connected to the described circuit board 11 of described molding photosensory assembly 10.
It is understood that the manufacture craft of the molding photosensory assembly 10 with respect to the monomer of above-mentioned first embodiment, In jigsaw operation, the adjacent two described pedestal profiled guide slot 215 for forming two described molded base 12 is equivalent to Integrally cross together, and multiple described optical window forming blocks 214 are arranged apart from one another by ground, so that described moulding material 14 is final Formed an integrally-built described molded base jigsaw 1200.
In the step making the described molding photosensory assembly 10 of monomer：Can be by described molding photosensory assembly jigsaw 1000 Cut to obtain multiple independent described molding photosensory assemblies 10, for making the camera module of monomer.Can also be by one The two or more described molding photosensory assembly 10 connecting separates from described molding photosensory assembly jigsaw 1000 cutting, for system Make split type array camera module, that is, each described camera module of described array camera module each have independent described Molding photosensory assembly 10, two of which or multiple described molding photosensory assembly 10 can be connected to the control of an electronic equipment respectively Mainboard processed, two such or multiple described molding photosensory assembly 10 make the array camera module obtaining can be by multiple shooting moulds The image that group shoots is sent to described control mainboard and carries out Image Information Processing.
As shown in figure 22, the moulding technology of described jigsaw operation may also be used for making and has two or more described optical windows 122 molding photosensory assembly 10, the array that wherein such described molding photosensory assembly 10 can be used to make common substrate is taken the photograph As module.That is, taking make double described molding photosensory assemblies 10 taking the photograph module as a example, described multiple-printed-panel for circuit board 1100 each In molding process planning, a described circuit board substrate 111 is correspondingly provided with two described optical window shapings to individual circuit board 11 Block 214, two apart from one another by described optical window forming blocks 214 surrounding be two one connection pedestal profiled guide slot 215, this Sample after moulding technology completes, each described circuit board 11 formed share a described circuit board substrate 111 there are two The disjunctor molded base of described optical window 122, two described photo-sensitive cells 13 of corresponding installation and two described camera lenses 30.And it is described The described substrate 111 of circuit board 11 can connect to the control mainboard of an electronic equipment, so make in this embodiment and obtain The image that multiple camera modules can be shot of array camera module be sent to described control mainboard and carry out Image Information Processing.
As shown in figure 23, according to a variant embodiment, the described molded base 12 of moulding technology of the present utility model Further can also integratedly extend to form a camera lens installation portion 16, in it, have through hole 161, be suitable to described camera lens 30 is installed. It is noted that described optical window forming blocks 214 and described spacing block 216 are in the position of corner angle only curved chamfered transition, can To be understood by, in above-described embodiment, described optical window forming blocks 214 and described spacing block 216 also can in the position of corner angle It is configured to curved chamfered transition, in order to avoid causing the damage to the described molded base 12 being formed during the demoulding.
As shown in figure 24, according to other variant embodiment, before moulding technology, described photo-sensitive cell 13 can set Be equipped with the barrier element 17 of an annular, its mount or be applied to described photo-sensitive cell 13 described top surface 131 described non-photo-sensing Area 1312, and there is elasticity, thus in moulding technology, described optical window forming blocks 214 are pressed on described barrier element 17, with Prevent described moulding material 14 from entering the described photosensitive area 1311 of described photo-sensitive cell 13, and described optical window forming blocks 214 Described stitching surface 2141 with described photo-sensitive cell 13 separately, thus the described stitching surface 2141 of described optical window forming blocks 214 is not The described photosensitive area 1311 of described photo-sensitive cell 13 can be damaged.In a specific example, described barrier element 17 is in square ring-type, And it is embodied as step glue, be coated with the described non-photo-sensing area 1312 of the described top surface 131 of described photo-sensitive cell 13 or draw The mode of glue applies glue, then forms described barrier element 17 after glue curing.
Shown in reference picture 11- Figure 15, to further illustrate the described shooting of described second embodiment of the present utility model The structure of module 100, described camera module 100 includes a molding photosensory assembly 10.Described molding photosensory assembly 10 includes an electricity Road plate 11, a molded base 12 and a photo-sensitive cell 13.Described camera module 100 further includes a camera lens 30.Wherein institute State that molded base 12 includes an annular molded body 121 and centre has an optical window 122, with to described camera lens 30 with described Photo-sensitive cell 13 provides a passage of light.Described photo-sensitive cell 13 is operatively connected to described circuit board 11, is such as beaten by COB Described photo-sensitive cell 13 is connected to described circuit board 11 and is located at the top side of described circuit board 11 by the mode of lead.Described photosensitive Element 13 and described camera lens 30 are assembled in the both sides of described molded base 12 respectively, and the arrangement of optical alignment ground, make through institute The light stating mirror light 30 can reach described photo-sensitive cell via described optical window 122, thus can after photoelectric conversion effect Described camera module 100 is made to be provided optical imagery.It is described camera module 100 as shown in figure 25 in an intelligent electronic device Application in 300, as described above camera module 100 be applied to a mobile phone, and arrange along its thickness direction, and respective in front and back One or more described camera modules 100 can be configured.
It is distinguished with above-mentioned first embodiment, and the top side of described molded base 12 forms a top side groove 123, For installing described optical filter 50.Or described top side groove 123 is used for convenient support one extra optical filter microscope base 60, described Optical filter microscope base 60 is used for installing described optical filter 50, as shown in Figure 12.
Correspondingly, described circuit board 11 includes a substrate 111, and is formed at described substrate 111 as pasted by SMT technique Multiple electronic devices and components 112 of dress.Described photo-sensitive cell 13 has a top surface 131, has the photosensitive area 1311 in central authorities altogether With outer peripheral non-photo-sensing area 1312, described molded base 12 integrally formed in described circuit board 11 and described photo-sensitive cell 13 At least a portion described non-photo-sensing area 1312, and described electronic devices and components 112 are coated.
Described molded base 12 has a medial surface 124, a lateral surface 125 and a top side face 126, that is, along its inner circumferential side To described medial surface 124, define described ring along the described lateral surface 125 of its peripheral direction and the described top side face 126 of annular The shape of shape molded body 121.
In this embodiment, the flat interior surface of the non-linear extension of described medial surface 124 of described molded base 12, and It is the inner surface that bending extends, more specifically, it further includes the Part I medial surface 1241 integrally extending, one the Two portion of medial side 1242 and a Part III medial surface 1243.As shown in FIG., with described camera module 100 vertical direction ground Arrangement explanation, described Part I medial surface 1241 integratedly obliquely extends the described non-photo-sensing area of described photo-sensitive cell 13 1312, described Part II medial surface 1242 extends described Part I medial surface 1241 substantially in the horizontal direction, described Part III medial surface 1243 integratedly obliquely extends described Part II medial surface 1242.The ring of described molded base 12 The described molded body 121 of shape is correspondingly formed abutment portion 121a of bottom side, and integratedly extends described abutment portion One stage portion 121b of 121a.Described stage portion 121b can form an integral ring-shaped step or multisection type, and such as three Segmentation, and certain one side of described molded base does not have the step of projection.Described stage portion 121b is with respect to described abutment portion 121a has larger internal diameter.The inner surface of described abutment portion 121a is the institute of the described medial surface 124 of described molded base 12 State Part I medial surface 1241, the top surface of described abutment portion 121a is the described medial surface 124 of described molded base 12 Described Part II medial surface 1242, the inner surface of described stage portion 121b is the described medial surface 124 of described molded base 12 Described Part III medial surface 1243, the top surface of described stage portion 121b is the described top side face of described molded base 12 126.
It is understood that the rectilinear direction of the optical axis Y of described Part I medial surface 1241 and described camera module 100 Between there is one first inclined angle alpha, that is, when described camera module 100 vertical direction arranges, described Part I medial surface There is between 1241 and vertical curve described first inclined angle alpha.The bearing of trend of described Part II medial surface 1242 is substantially vertical Rectilinear direction in the optical axis Y of described camera module 100.Described Part III medial surface 1243 and described camera module 100 There is between the rectilinear direction of optical axis Y one the 3rd angle of inclination beta, that is, when described camera module 100 vertical direction arranges, described There is between three portion of medial side 1243 and vertical curve described 3rd angle of inclination beta.
The described outside of the top surface 1111 of the described substrate 111 extending described circuit board 11 of described molded base 12 Face 125 can include one or more outer peripheral faces 1251, wherein in second embodiment of the present utility model, because can make The described molding photosensory assembly jigsaw 1000 of integrally connected, finally cutting obtains the molding photosensory assembly 10 of monomer, wherein said Some outer peripheral faces 1251 of the described lateral surface 125 of the peripheral direction of described molded base 12 of molding photosensory assembly 10 are through cutting Cut and obtain, such that it is able to be vertical burnishing surface, and at least one outer peripheral face 1251 passes through described mould in moulding technology The pedestal lateral surface forming surface 2161 of 210 described spacing block 216 defines and is formed, and shown in Figure 21, it is described that cutting obtains The front outer peripheral face 1251 of molding photosensory assembly 10 passes through the described pedestal of the corresponding described spacing block 216 of described mould 210 Lateral surface forming surface 2161 is formed, and has between described front outer peripheral face 1251 and the rectilinear direction of optical axis Y of described camera module 100 Have one second inclination angle γ, that is, when described camera module 100 vertical direction arranges, described front outer peripheral face 1251 and vertical curve it Between there is described second inclination angle γ.In addition, described molded base 12 is also formed with one or more driver pin grooves 127, It each has pin trough wall surface 1271, the rectilinear direction of the optical axis Y of described pin trough wall surface 1271 and described camera module 100 Between there is one the 4th inclination angle δ, that is, when described camera module 100 vertical direction arranges, described pin groove side face 1271 with There is between vertical curve described 4th inclination angle δ.
It is noted that similar above-described embodiment, as shown in figure 14, for convenience of the demoulding and to described circuit board 11 The pressing of described substrate 111, the described lateral surface 125 of described molded base 12 is from the described substrate 111 1 of described circuit board 11 The position that body extends is W with the pressing distance of the outer edge of described substrate 111 of described circuit board 11, and this pressing can apart from W To be 0.1～0.6mm, such as this pressing can be 0.2mm apart from W.
In this embodiment of the present utility model, described first inclined angle alpha scope is 10 °～80 °, specifically real at some Apply in example, it can be 10 °～30 °, or 30 °～45 °, or 45 °～55 °, or 55 °～80 °.Described second inclination angle γ scope It is 3 °～45 °, in certain embodiments, it can be 3 °～15 °, or 15 °～30 °, or 30 °～45 °.Described 3rd inclines Oblique angle β scope is 3 °～30 °, and in certain embodiments, it can be 3 °～15 °, or 15 °～20 °, or 20 °～30 °. Described 4th inclination angle δ scope is 3 °～45 °, and in certain embodiments, it can be 3 °～15 °, or 15 °～30 °, or 30 °～45 °.
Described optical window forming blocks 214 and described spacing block 216 are in frustum, the linear property transition of its corner angle or Curvedly more roundedly excessive, but the angular range that each face extends is substantially in above-mentioned concrete scope.
Accordingly, the global formation face of described first mould 211 configuration of described mould 210, above-mentioned for being formed The described molded base 12 of structure.More specifically, as shown in FIG., described optical window forming blocks 214 include the pressure head portion of a bottom side The groove shape 214b of 214a and a top side.Described pressure head portion 214a and described groove shape 214b is provided commonly for being formed The described optical window 122 of described molded base 12, described groove shape 214b is used for being formed in the top side of described molded base 12 Described top side groove 123.
It is understood that described optical window forming blocks 214 include a stitching surface 2141 of bottom side, and the base of peripheral direction Seat medial surface forming surface 2142.Further, in this embodiment, the described base interior side surface of described optical window forming blocks 214 Forming surface 2142 includes the Part I forming surface 21421 integrally extending, a Part II forming surface 21422 and one the 3rd Divide forming surface 21423.To be respectively correspondingly used for forming the described Part I that the one of described molded base 12 inner side extends Medial surface 1241, described Part II medial surface 1242 and described Part III medial surface 1243.
In this embodiment of the present utility model, as shown in FIG., described camera module 100 is vertically placed, and described takes the photograph As the rectilinear direction of the optical axis Y of described photo-sensitive cell 13 of module 100 is parallel with vertical curve.Accordingly, described Part I There is between forming surface 21421 and vertical curve described first inclined angle alpha, its magnitude range is 10 °～88 °, described Part III There is between forming surface 21423 and vertical curve described 3rd angle of inclination beta, its magnitude range is 3 °～30 °.
Correspondingly, the bottom side of described pressure head portion 214a forms the described stitching surface 2141 of described optical window forming blocks 214, institute The lateral surface stating pressure head portion 214a forms the described Part I forming surface 21421 of described optical window forming blocks 214, and described groove becomes The bottom side of type portion 214b forms the described Part II forming surface 21422 of described optical window forming blocks 214, described groove shape The lateral surface of 214b forms the described Part III forming surface 21423 of described optical window forming blocks 214, described pressure head portion 214a and institute State groove shape 214b to be configured in frustum.Described pressure head portion 214a and described groove shape 214b section are trapezoidal, Thus preventing the damage of the film layer 219 to described elasticity.More specifically, in existing skill. taking described groove shape 214b as a example Forming blocks in art have sharp corner angle, during demoulding, easily in described Part II forming surface 21422 and described The position that three part forming surface 21423 connect, punctures the film layer 219 of described elasticity.And described groove shape 214b is in bottom side And the described Part II forming surface 21422 that is respectively provided with of outer circumferential side and described Part III forming surface 21423 between in obtuse angle, Thus facilitating the demoulding of described groove shape 214b.
Wherein at least one outer peripheral face 1251 of the described lateral surface 125 of correspondence described molding photosensory assembly 10, described separation Block 216 has a pedestal lateral surface forming surface 2161, and it has described second inclination angle γ and vertical curve between, and it is suitable Magnitude range is 3 °～45 °.
The multiple described driver pin Slot shaping block 218 that described mould 210 further provides has a pin Groove side forming surface 2181, it has described 4th inclination angle δ and vertical curve between, and its suitable magnitude range is 3 °～ 30°.
Correspondingly, the above-mentioned construction of described first mould 211 of described mould 210 of the present utility model and described Molded base has following advantages.
In a first aspect, facilitating the described optical window forming blocks 214 of described first mould 211 configuration and described spacing block 216 Stripping operation.I.e. due to providing conveniently stripped described first inclined angle alpha at an acute angle, described second inclination angle γ, described 3rd angle of inclination beta and described 4th inclination angle δ, described optical window forming blocks 214 and described spacing block 216 and described molded base 12 Between friction reduce, easily extract, described molded base 12 can obtain preferably completed state.As shown in figure 19, as long as Described optical window forming blocks 214 and described spacing block 216 and described molded base 12 away from and upper and lower relative displacement occurs, institute State optical window forming blocks 214 and described spacing block 216 no longer produces friction with described molded base 12, i.e. described optical window forming blocks 214 described base interior side surface forming surface 21421,21422 and 21423 and the described medial surface 1241 of described molded base 12, 1242 and 1243 are separated, the institute of the described pedestal lateral surface forming surface of described spacing block 216 2161 and described molded base 12 State lateral surface 125 to be separated, so described optical window forming blocks 214 and described spacing block 216 can be relatively with described molded base 12 Swimmingly extract, thus reducing the completed state impact on described molded base 12.
Second aspect, described mould 210 forms the shape of described pedestal jigsaw profiled guide slot 2150, does not have rectangular Dead angle, the suitable gradient so that flow-like described moulding material 14 enter described pedestal jigsaw profiled guide slot 215 when, Mobility is more preferable.That is, described moulding material 14 is typically fluid state during molded, need described Flowing in forming cavity 213, and the effect of the size of flow region impact filling.Described pedestal jigsaw shaping of the present utility model is led The structure of groove 2150 can make flowing velocity increase such that it is able to be molded within the shorter time, is more conducive to described molding base The shaping of seat 12
The third aspect, described first inclined angle alpha at an acute angle, described second inclination angle γ, described 3rd angle of inclination beta and institute State the 4th inclination angle δ, unlike right angle of the prior art, described optical window forming blocks 214 and described spacing block 216 will not form point Sharp corner angle and scratch described medial surface 124 and the described lateral surface 125 of described molded base 12.
Fourth aspect, described first inclined angle alpha of acute angle, described second inclination angle γ, described 3rd angle of inclination beta and described The setting of the 4th inclination angle δ is so that the described medial surface 124 of described molded base 12, described lateral surface 125 He at least partially Described pin trough wall surface 1271 is inclined so that the volume of described molded base 12 is relatively small, overall needs filling Described moulding material 14 reduces.
5th aspect, the setting of described first inclined angle alpha of acute angle and the scope of the 3rd angle of inclination beta makes described molding base Seat 12 is it can be avoided that the image quality of camera module 100 described in stray light.More specifically, it reduces spurious rays reaches institute State the possibility of photo-sensitive cell 13.That is, when the veiling glare in described camera module 100 is incident to described molded base 12 Bending extend described medial surface 124 when, inside skewed described Part I medial surface 1241 and described Part III Face 1243, and horizontal direction extend described Part II medial surface 1242 incident veiling glare is reflexed to away from described sense Optical element 13, thus veiling glare is not easily accessible to described photo-sensitive cell 13 and the image quality of described camera module 100 is produced Impact.
In addition, described first inclined angle alpha, described second inclination angle γ, the span of described 3rd angle of inclination beta alsos for Described molded base 12 is enable preferably to execute the function of its support, top side face 126 as described in ensure has enough sizes, With facilitate subsequently described camera lens 30 or described driver 40 complete it is ensured that described Part II medial surface 1242 have enough Size, installs described optical filter 50 or described optical filter microscope base 60 to facilitate.I.e. described first inclined angle alpha, described second inclination Angle γ, the value of described 3rd angle of inclination beta can not be too big, lead to as too little in the length of its top side face 126 it is impossible to described camera lens 30 or described driver 40 provides firm installation site.And described first inclined angle alpha also needs to consideration can not described optical window Forming blocks 214 can not be pressed onto described lead 15, and leads to described lead 15 to rupture.
Below, to illustrate described first inclination angle with seven examples of described second embodiment of Figure 26 to Figure 32 α, described second inclination angle γ, the span of described 3rd angle of inclination beta.In this seven examples, described molded base 12 There is between described Part I medial surface 1241 and vertical curve described first inclined angle alpha, described molded base 12 is circumferentially Around between at least one outer peripheral face 1251 in the described lateral surface 125 in direction and vertical curve, there is described second inclination angle γ, Have the described 3rd between the described Part III medial surface 1243 of the described medial surface 124 of described molded base 12 and vertical curve Angle of inclination beta.The described Part I medial surface 1241 of described molded base 12 is connected with described photo-sensitive cell 13 position and institute State Part I medial surface 1241 and be connected the distance between position with described Part II medial surface 1242 for L1, described first Portion of medial side 1241 is connected with described Part II medial surface 1242 position and described top side face 126 and described Part III The distance between the position that is connected of medial surface 1243 is L2, and the length of the described top side face 126 of described molded base 12 is L3, The distance between the described top side face 126 of described molded base 12 and top surface of described substrate 111 of described circuit board 11 are H1, the distance between top surface of described substrate 111 of described Part II medial surface 1242 and described circuit board 11 is H2, institute Stating the distance between lead 15 peak and described photo-sensitive cell 13 is H3.
As shown in Figure 26 to Figure 28, in these three examples, beating between described photo-sensitive cell 13 and described circuit board 11 Line connected mode is from described photo-sensitive cell 13 to described circuit board 11.Pass through to arrange described sense on described photo-sensitive cell 13 Optical element terminal pad 132, it is extremely described photosensitive that routing tool first forms connection in the top routing of described photo-sensitive cell terminal pad 132 One first end 151 of the described lead 15 of element terminal pad 132, then can raise predeterminated position, connect then towards circuit board Disk 113 direction is mobile and declines to form connection to described circuit board terminal pad on the top of described circuit board terminal pad 113 again One second end 152 of 113 described lead 15, so described lead 15 is in that bending ground extends, and leads to described lead 15 Top can not be in moulding technology by the described Part I base interior side surface forming surface 21421 of described optical window forming blocks 214 Damage by pressure, thus the size of described first inclined angle alpha has threshold limit value.
As shown in Figure 29 to Figure 32, in this four examples, beating between described photo-sensitive cell 13 and described circuit board 11 Line connected mode is from described circuit board 11 to described photo-sensitive cell 13.Pass through the described electricity of upper setting in described circuit board 11 Road plate terminal pad 113, routing tool first forms in the top routing of described circuit board terminal pad 113 and connects to described circuit board even Connect the second end 152 of the described lead 15 of disk 113, then can raise predeterminated position, then towards circuit board terminal pad 113 direction Translation simultaneously forms, on the top of described inductance optical element terminal pad 132, the described lead 15 connecting to photo-sensitive cell terminal pad 132 Contrary first end 151, so described lead 15 is in that bending ground extends, and leads to the top of described lead 15 can not be Damaged by pressure by the described Part I base interior side surface forming surface 21421 of described optical window forming blocks 214 during moulding technology, thus described The size of the first inclined angle alpha has threshold limit value.In addition, in order that described Part II medial surface 1242 and described top side face 126 There are enough sizes, described second inclination angle γ and described 3rd angle of inclination beta also should not be excessive.I.e. described second inclination angle γ and There is restricting relation between the span of described 3rd angle of inclination beta and above-mentioned parameter L1, L2, L3, H1, H2 and H3.
As shown in Figure 26, α angle size is 10 °, and β angle size is 3 °, and γ angle size is 3 °.Wherein L1 numerical value is 0.23mm, L2 numerical value is 1.09mm, and L3 numerical value is 0.99mm, and H1 numerical value is 1.30mm, and H2 numerical value is 0.93mm, and H3 numerical value is 0.17mm.Described first inclined angle alpha, described second inclination angle γ, described 3rd angle of inclination beta obtains suitable minimum of a value.
As shown in Figure 27, α angle size is 30 °, and β angle size is 20 °, and γ angle size is 30 °.Wherein L1 numerical value is 0.38mm, L2 numerical value is 1.25mm, and L3 numerical value is 0.21mm, and H1 numerical value is 1.34mm, and H2 numerical value is 0.93mm, and H3 numerical value is 0.17mm.
As shown in Figure 28, α angle size is 55 °, and β angle size is 30 °, and γ angle size is 45 °.Wherein L1 numerical value is 0.54mm, L2 numerical value is 0.39mm, and L3 numerical value is 0.42mm, and H1 numerical value is 0.86mm, and H2 numerical value is 0.38mm, and H3 numerical value is 0.17mm.Wherein the routing connected mode between described photo-sensitive cell 13 and described circuit board 11 is from described photo-sensitive cell 13 During to described circuit board 11, it is 55 ° that described first inclined angle alpha obtains maximum.
More specifically, as shown in Figure 29, α angle size is 10 °, and β angle size is 30 °, and γ angle size is 45 °.Wherein L1 Numerical value is 0.23mm, and L2 numerical value is 1.28mm, and L3 numerical value is 0.82mm, and H1 numerical value is 1.30mm, and H2 numerical value is 0.93mm, H3 number It is worth for 0.13mm.The size of described first inclined angle alpha is suitable minimum of a value, and described second inclination angle γ and the described 3rd tilts The size of angle beta is suitable maximum.
As shown in Figure 30, α angle size is 30 °, and β angle size is 20 °, and γ angle size is 30 °.Wherein L1 numerical value is 0.38mm, L2 numerical value is 1.24mm, and L3 numerical value is 0.21mm, and H1 numerical value is 1.34mm, and H2 numerical value is 0.93mm, and H3 numerical value is 0.13mm.
As shown in Figure 31, α angle size is 45 °, and β angle size is 15 °, and γ angle size is 15 °.Wherein L1 numerical value is 0.73mm, L2 numerical value is 0.65mm, and L3 numerical value is 1.88mm, and H1 numerical value is 1.33mm, and H2 numerical value is 1.00mm, and H3 numerical value is 0.13mm.
As shown in Figure 32, α angle size is 80 °, and β angle size is 3 °, and γ angle size is 3 °.Wherein L1 numerical value is 1.57mm, L2 numerical value is 0.15mm, and L3 numerical value is 2.19mm, and H1 numerical value is 1.45mm, and H2 numerical value is 0.54mm, and H3 numerical value is 0.13mm.Wherein the routing connected mode between described photo-sensitive cell 13 and described circuit board 11 be from described circuit board 11 to During described photo-sensitive cell 13, because described lead will not need to raise lead to the routing mode in Figure 26-Figure 28, lead to institute The peak position stating lead 51 reduces, and it is 80 ° that described first inclined angle alpha obtains maximum.And it is in this illustration, described The size of the second inclination angle γ and described 3rd angle of inclination beta is suitable minimum of a value.
It is understood that the concrete numerical value of above-mentioned parameter L1, L2, L3, H1, H2 and H3 is only used as illustrating and is not intended to limit The utility model, in actual applications, the specification requirement according to described camera module 100 and described molding photosensory assembly 10 is not Same, can change.
According in this embodiment of the present utility model, can be shown by the data of above example as an example, institute The optimum range stating the first inclined angle alpha is 10 °～80 °, and the optimum range of described second inclination angle γ is 3 °～45 °, described The optimum range of three angle of inclination beta is 3 °～30 °.
It should be understood by those skilled in the art that the embodiment of the present utility model shown in foregoing description and accompanying drawing is only used as Illustrate and be not intended to limit the utility model.The purpose of this utility model is completely and be effectively realized.Work(of the present utility model Can and structural principle shown in an embodiment and illustrated, without departing under described principle, embodiment of the present utility model Can there is any deformation or change.

Claims (53)

1. a molding photosensory assembly, is applied to a camera module it is characterised in that including at least one circuit board, at least one is photosensitive Element, and at least one molded base, described molded base passes through moulding technology and described circuit board and described photo-sensitive cell one In conjunction with wherein said molded base forms at least one optical window, and described optical window is corresponding with described photo-sensitive cell position, and described mould At least a portion medial surface moulding pedestal from the one extension of described photo-sensitive cell obliquely extends.
2. molding photosensory assembly according to claim 1, described at least a portion medial surface of wherein said molded base Corner dimension and the optical axis straight line of described camera module between is 10 °～80 °.
3. molding photosensory assembly according to claim 1, wherein said molded base has from described photo-sensitive cell The medial surface that one non-photo-sensing area of top surface integratedly linearly extends, thus whole medial surfaces of described molded base are in incline Ramp-like extension, has conveniently stripped between the described medial surface of described molded base and the optical axis straight line of described camera module and keeps away Exempt from an inclined angle alpha of veiling glare, the wherein magnitude range of α is 10 °～80 °.
4. molding photosensory assembly according to claim 3, the numerical value of wherein said inclined angle alpha be selected from 10 °～30 °, 30 °～ 45 °, 45 °～55 ° or 55 °～80 °.
5. molding photosensory assembly according to claim 3, passes through one between wherein said photo-sensitive cell and described circuit board Group lead conducting connects, and the routing connected mode of wherein said lead is when described photo-sensitive cell is towards described circuit board, α's Numerical value is selected from 10 °～55 °.
6. molding photosensory assembly according to claim 3, passes through one between wherein said photo-sensitive cell and described circuit board Group lead conducting connects, and the routing connected mode of wherein said lead is when described circuit board is towards described photo-sensitive cell, α's Numerical value is selected from 10 °～88 °.
7. molding photosensory assembly according to claim 1, wherein said molded base has from described circuit board integratedly The lateral surface extending linearly, the side of having between the optical axis straight line of the lateral surface of wherein said molded base and described camera module Just an inclination angle γ of the demoulding, the wherein magnitude range of γ are 3 °～45 °.
8. molding photosensory assembly according to claim 3, wherein said molded base has from described circuit board integratedly The lateral surface extending linearly, the side of having between the optical axis straight line of the lateral surface of wherein said molded base and described camera module Just an inclination angle γ of the demoulding, the wherein magnitude range of γ are 3 °～45 °.
9. molding photosensory assembly according to claim 8, the wherein numerical value of γ are selected from 3 °～15 °, 15 °～30 °, or 30 ° ～45 °.
10. molding photosensory assembly according to claim 1, wherein said molded base has a top side groove on top, Described molded base has the medial surface that bending extends, and it includes the Part I medial surface integratedly extending successively, and one Part II medial surface and a Part III medial surface, described Part I medial surface one obliquely extends described photosensitive unit One non-photo-sensing area of one top surface of part, described Part III medial surface one obliquely extends inside described Part II Face, wherein said Part II medial surface and described Part III medial surface define formation described top side groove.
11. molding photosensory assemblies according to claim 10, wherein said Part I medial surface and described camera module Optical axis straight line between have conveniently stripped and avoid an inclined angle alpha of veiling glare, the wherein magnitude range of α is 10 °～80 °, Have conveniently stripped and avoiding veiling glare one between described Part III medial surface and the optical axis straight line of described camera module to incline The magnitude range of oblique angle β, wherein β is 3 °～30 °.
12. molding photosensory assemblies according to claim 11, the wherein numerical value of α are selected from 10 °～30 °, 30 °～45 °, 45 ° ～55 ° or 55 °～80 °, the wherein numerical value of β is selected from 3 °～15 °, 15 °～20 ° or 20 °～30 °.
13. molding photosensory assemblies according to claim 11, pass through between wherein said photo-sensitive cell and described circuit board One group of lead conducting connects, and the routing connected mode of wherein said lead is α when described photo-sensitive cell is towards described circuit board Numerical value be selected from 10 °～55 °.
14. molding photosensory assemblies according to claim 11, pass through between wherein said photo-sensitive cell and described circuit board One group of lead conducting connects, and the routing connected mode of wherein said lead is α when described circuit board is towards described photo-sensitive cell Numerical value be selected from 10 °～88 °.
15. molding photosensory assemblies according to claim 11, wherein said Part II medial surface is based on photosensitive with described The described top surface of element is parallel.
16. molding photosensory assemblies according to claim 11, wherein said molded base has from described circuit board one One lateral surface of linear extension, the lateral surface of wherein said molded base includes arranging multiple outer peripheral faces along around direction, its In there is a conveniently stripped inclination angle γ, wherein between at least one described outer peripheral face and optical axis straight line of described camera module The magnitude range of γ is 3 °～45 °.
17. molding photosensory assemblies according to claim 16, the wherein numerical value of γ are selected from 3 °～15 °, 15 °～30 °, or 30 °～45 °.
18. also have one according to described molding photosensory assembly arbitrary in claim 1 to 17, wherein said molding photosensory assembly Individual or multiple driver pin grooves, wherein define the pin trough wall surface of each described driver pin groove and described camera module There is between optical axis straight line a conveniently stripped inclination angle δ, the wherein magnitude range of δ is 3 °～30 °.
19. according to described molding photosensory assembly arbitrary in claim 1 to 17, wherein said molding photosensory assembly also include to A few optical filter, described optical filter is superimposed with described photo-sensitive cell, described molded base integratedly in package shape in described filter Mating plate, described photo-sensitive cell and described circuit board.
20. according to described molding photosensory assembly arbitrary in claim 7 and 16 to 17, wherein described in described molded base The outside of at least one outer peripheral face in lateral surface, the substrate of described circuit board leaves at least one of a molding tool in moulding technology Apart from W, its number range is 0.1～0.6mm for the pressing being easy to press of spacing block.
21. exist according to described molding photosensory assembly arbitrary in claim 1 to 17, the material surface of wherein said molded base The reflectivity of range of light wavelengths 435-660nm is less than 5%.
, it is characterised in that including at least one camera lens and at least one molding photosensory assembly, described molding is photosensitive for 22. 1 camera modules Assembly includes at least one circuit board, at least one photo-sensitive cell, and at least one molded base, and described molded base passes through moulding technology Joined integrally with described circuit board and described photo-sensitive cell, wherein said molded base forms at least one optical window, and described optical window is Described photo-sensitive cell and described camera lens provide a passage of light, and described molded base is from the one extension of described photo-sensitive cell At least a portion medial surface obliquely extends.
23. camera modules according to claim 22, described at least a portion medial surface of described molded base with described Corner dimension between the optical axis straight line of camera module is 10 °～80 °.
24. camera modules according to claim 22, wherein said molded base has from described photo-sensitive cell one top table The medial surface that the one non-photo-sensing area in face integratedly linearly extends, thus whole medial surfaces of described molded base are oblique Extend, have conveniently stripped between the described medial surface of described molded base and the optical axis straight line of described camera module and avoid miscellaneous One inclined angle alpha of astigmatism, the wherein magnitude range of α are 10 °～80 °, more specifically be selected from 10 °～30 °, 30 °～45 °, 45 °～ 55 ° or 55 °～80 °.
25. camera modules according to claim 24, pass through one group between wherein said photo-sensitive cell and described circuit board Lead conducting connects, and the routing connected mode of wherein said lead is the number of α when described photo-sensitive cell is towards described circuit board Value is selected from 10 °～55 °；The routing connected mode of wherein said lead is when described circuit board is towards described photo-sensitive cell, α's Numerical value is selected from 10 °～88 °.
26. camera modules according to claim 25, wherein said molded base has from described circuit board one ground wire Property the lateral surface that extends, have conveniently between the optical axis straight line of the lateral surface of wherein said molded base and described camera module One inclination angle γ of the demoulding, the wherein magnitude range of γ are 3 °～45 °, are more specifically selected from 3 °～15 °, 15 °～30 °, or 30 ° ～45 °.
27. camera modules according to claim 22, described molded base has a top side groove, described molding on top Pedestal has the medial surface that bending extends, and it includes the Part I medial surface integratedly extending successively, a Part II Medial surface and a Part III medial surface, described Part I medial surface one obliquely extends a top of described photo-sensitive cell The one non-photo-sensing area on surface, described Part III medial surface one obliquely extends described Part II medial surface, wherein institute State Part II medial surface and described Part III medial surface defines formation described top side groove.
The light of 28. camera modules according to claim 27, wherein said Part I medial surface and described camera module There is between axle straight line an inclined angle alpha that is conveniently stripped and avoiding veiling glare, the wherein magnitude range of α is 10 °～80 °, described There is between the optical axis straight line of Part III medial surface and described camera module an inclination angle that is conveniently stripped and avoiding veiling glare The magnitude range of β, wherein β is 3 °～30 °.
29. according to the camera module described in claim 28, wherein the numerical value of α be selected from 10 °～30 °, 30 °～45 °, 45 °～55 ° or 55 °～80 °, the wherein numerical value of β is selected from 3 °～15 °, 15 °～20 ° or 20 °～30 °.
30. camera modules according to claim 28, pass through one group between wherein said photo-sensitive cell and described circuit board Lead conducting connects, and the routing connected mode of wherein said lead is the number of α when described photo-sensitive cell is towards described circuit board Value is selected from 10 °～55 °；The routing connected mode of wherein said lead is when described circuit board is towards described photo-sensitive cell, α's Numerical value is selected from 10 °～88 °.
31. camera modules according to claim 28, wherein said Part II medial surface is based on and described photo-sensitive cell Described top surface parallel.
32. camera modules according to claim 22, wherein said molded base has from described circuit board one ground wire Property the lateral surface that extends, the lateral surface of wherein said molded base includes along around arranging multiple outer peripheral faces in direction, wherein extremely Few have a conveniently stripped inclination angle γ between a described outer peripheral face and the optical axis straight line of described camera module, wherein γ Magnitude range is 3 °～45 °, is more specifically selected from 3 °～15 °, 15 °～30 °, or 30 °～45 °.
33. camera modules according to claim 28, wherein said molded base has from described circuit board one ground wire Property the lateral surface that extends, the lateral surface of wherein said molded base includes along around arranging multiple outer peripheral faces in direction, wherein extremely Few have a conveniently stripped inclination angle γ between a described outer peripheral face and the optical axis straight line of described camera module, wherein γ Magnitude range is 3 °～45 °, is more specifically selected from 3 °～15 °, 15 °～30 °, or 30 °～45 °
34. also have one according to described camera module arbitrary in claim 22 to 33, wherein said molding photosensory assembly Or multiple driver pin groove, wherein define the pin trough wall surface of each described driver pin groove and the light of described camera module There is between axle straight line a conveniently stripped inclination angle δ, the wherein magnitude range of δ is 3 °～30 °.
35. also include at least according to described camera module arbitrary in claim 22 to 33, wherein said molding photosensory assembly One optical filter, described optical filter is superimposed with described photo-sensitive cell, described molded base integratedly in package shape in described optical filtering Piece, described photo-sensitive cell and described circuit.
36., according to described camera module arbitrary in claim 22 to 33, wherein also include at least one optical filter, described optical filtering Piece is installed on the top of described molded base.
37., according to described camera module arbitrary in claim 27-31 and 33, wherein also include at least one optical filter, institute State the described top side groove that optical filter is installed on described molded base.
38. according to described camera module arbitrary in claim 22 to 33, wherein also includes at least one optical filter microscope base and extremely A few optical filter, described optical filter is installed on described optical filter microscope base, and described optical filter microscope base is installed on described molded base Top.
39., according to described camera module arbitrary in claim 22 to 33, wherein also include at least one driver, described driving Device is installed on the top side of described molded base so that described molded base supports described driver, and wherein said camera lens is installed on institute State in driver to realize auto-focusing.
40. camera modules according to claim 22, wherein also include at least one barrier element ringwise, to prevent State the photosensitive area that moulding material in moulding technology reaches described photo-sensitive cell.
41. are assembled into according to described camera module arbitrary in claim 22 to 33, plurality of described camera module for a moment Row camera module.
42. include multiple institutes according to described camera module arbitrary in claim 22 to 33, wherein said molding photosensory assembly State photo-sensitive cell and there are multiple described optical windows, thus forming an array camera module with multiple described camera lenses.
43. according to described camera module arbitrary in claim 26 and 32 to 33, wherein described outer in described molded base The outside of at least one outer peripheral face in side, the substrate of described circuit board leaves at least one point of a molding tool in moulding technology Apart from W, its number range is 0.1～0.6mm for the pressing being easy to press of spacer block.
44. according to described camera module arbitrary in claim 22 to 33, and the material surface of wherein said molded base is in light The reflectivity of line wave-length coverage 435-660nm is less than 5%.
45. 1 electronic equipments it is characterised in that include one or more according to described shooting arbitrary in claim 22-44 Module.
46. electronic equipments according to claim 45 are it is characterised in that described electronic equipment is selected from mobile phone, computer, TV Machine, intelligence can screw on equipment, the vehicles, camera and supervising device.
47. a molding tools, be applied to make at least one molding photosensory assembly of at least one camera module it is characterised in that its Including can mutually separate or one first mutually closely sealed mould and one second mould, wherein said first and second moulds are mutually closely sealed When form at least one forming cavity, and described mould is configured with least one optical window forming blocks in described forming cavity and is located at A pedestal profiled guide slot around described optical window forming blocks, wherein when in described forming cavity install be connected with least one photo-sensitive cell At least one circuit board, the moulding material being filled in described pedestal profiled guide slot experiences liquid to solid under temperature control function The conversion process of state and curing molding, form a molded base in the position of corresponding described pedestal profiled guide slot, corresponding described The position of optical window forming blocks forms an optical window of described molded base, and wherein said molded base is shaped in described circuit board With at least a portion non-photo-sensing area of described photo-sensitive cell described molding photosensory assembly to form described camera module.
48. moulds according to claim 47, wherein said optical window forming blocks have an inclination along its periphery and extend Base interior side surface forming surface, for forming the medial surface that described molded base integrated linear extends.
49. moulds according to claim 48, the described base interior side surface forming surface of wherein said optical window forming blocks There is and vertical curve between a conveniently stripped inclination angle, the wherein magnitude range of α is 10 °～80 °.
50. moulds according to claim 47, wherein said optical window forming blocks include a pressure head portion and integratedly prolong Stretch in a groove shape in described pressure head portion, described groove shape has larger internal diameter than described pressure head portion, for Form a top side groove in the top side of described molded base.
51. moulds according to claim 50, wherein said pressure head portion along its periphery lateral surface and vertical curve it Between have conveniently stripped and avoid an inclined angle alpha of veiling glare, the wherein magnitude range of α is 10 °～80 °, described groove shaping Portion has an angle of inclination beta along between the lateral surface and vertical curve of its periphery, and the wherein magnitude range of β is 3 °～30 °.
52. moulds according to claim 51, pass through one group between wherein said photo-sensitive cell and described circuit board Lead conducting connects, and the routing connected mode of wherein said lead is the number of α when described photo-sensitive cell is towards described circuit board Value is selected from 10 °～55 °；The routing connected mode of wherein said lead is when described circuit board is towards described photo-sensitive cell, α's Numerical value is selected from 10 °～88.
53. also include at least one point according to described mould arbitrary in claim 47 to 52, wherein said first mould Spacer block, described spacing block has a pedestal lateral surface forming surface, and it has a conveniently stripped inclination angle γ and vertical curve between, The numerical value of γ is selected from 3 °～45 °.
CN201620826033.6U 2016-08-01 2016-08-01 Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof Active CN205961279U (en)

Priority Applications (26)

Application Number Priority Date Filing Date Title
CN201720121031.1U CN207251754U (en) 2016-08-01 2016-08-01 Array camera module and electronic equipment
CN201620826033.6U CN205961279U (en) 2016-08-01 2016-08-01 Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof
CN201720121034.5U CN206698309U (en) 2016-08-01 2016-08-01 Camera module and its molding photosensory assembly and mould
CN201720121002.5U CN207251753U (en) 2016-08-01 2016-08-01 Mold photosensory assembly jigsaw and its manufacturing equipment
KR1020197005566A KR102199508B1 (en) 2016-08-01 2016-10-25 Photographic module, molded circuit board component, molded photosensitive component, and manufacturing method
JP2019503667A JP7048573B2 (en) 2016-08-01 2016-10-25 Camera module and its molded circuit board assembly and molded photosensitive assembly and manufacturing method
EP23165641.4A EP4224876A3 (en) 2016-08-01 2016-10-25 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
EP16911482.4A EP3493517B1 (en) 2016-08-01 2016-10-25 Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods
KR1020207036542A KR102352901B1 (en) 2016-08-01 2016-10-25 Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods
PCT/CN2016/103248 WO2018023887A1 (en) 2016-08-01 2016-10-25 Photographing module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing methods
CN201680088072.3A CN109716745B (en) 2016-08-01 2016-10-25 Camera module, molded circuit board assembly and molded photosensitive assembly thereof and manufacturing method
US15/439,909 US10051167B2 (en) 2016-08-01 2017-02-22 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US15/461,409 US10498942B2 (en) 2016-08-01 2017-03-16 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US15/461,402 US10171716B2 (en) 2016-08-01 2017-03-16 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
TW106119407A TWI698125B (en) 2016-08-01 2017-06-12 Camera module and its molded photosensitive element and manufacturing method
TW106208437U TWM557833U (en) 2016-08-01 2017-06-12 Camera module, molded photosensitive element, molding die, and its electronic equipment
US15/679,151 US10136041B2 (en) 2016-08-01 2017-08-16 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US15/679,153 US10129451B2 (en) 2016-08-01 2017-08-17 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US15/679,154 US10230879B2 (en) 2016-08-01 2017-08-17 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US15/785,374 US10742859B2 (en) 2016-08-01 2017-10-16 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US16/028,367 US10708480B2 (en) 2016-08-01 2018-07-05 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US16/157,061 US10666847B2 (en) 2016-08-01 2018-10-10 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US16/569,601 US10986258B2 (en) 2016-08-01 2019-09-12 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
US17/203,673 US11363184B2 (en) 2016-08-01 2021-03-16 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof
JP2021055045A JP7269273B2 (en) 2016-08-01 2021-03-29 Camera module and its molded circuit board assembly, molded photosensitive assembly and manufacturing method
US17/824,415 US11575816B2 (en) 2016-08-01 2022-05-25 Camera module, molded circuit board assembly, molded photosensitive assembly and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620826033.6U CN205961279U (en) 2016-08-01 2016-08-01 Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof

Related Child Applications (3)

Application Number Title Priority Date Filing Date
CN201720121002.5U Division CN207251753U (en) 2016-08-01 2016-08-01 Mold photosensory assembly jigsaw and its manufacturing equipment
CN201720121031.1U Division CN207251754U (en) 2016-08-01 2016-08-01 Array camera module and electronic equipment
CN201720121034.5U Division CN206698309U (en) 2016-08-01 2016-08-01 Camera module and its molding photosensory assembly and mould

Publications (1)

Publication Number Publication Date
CN205961279U true CN205961279U (en) 2017-02-15

Family

ID=57972756

Family Applications (4)

Application Number Title Priority Date Filing Date
CN201720121002.5U Active CN207251753U (en) 2016-08-01 2016-08-01 Mold photosensory assembly jigsaw and its manufacturing equipment
CN201720121034.5U Active CN206698309U (en) 2016-08-01 2016-08-01 Camera module and its molding photosensory assembly and mould
CN201620826033.6U Active CN205961279U (en) 2016-08-01 2016-08-01 Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof
CN201720121031.1U Active CN207251754U (en) 2016-08-01 2016-08-01 Array camera module and electronic equipment

Family Applications Before (2)

Application Number Title Priority Date Filing Date
CN201720121002.5U Active CN207251753U (en) 2016-08-01 2016-08-01 Mold photosensory assembly jigsaw and its manufacturing equipment
CN201720121034.5U Active CN206698309U (en) 2016-08-01 2016-08-01 Camera module and its molding photosensory assembly and mould

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201720121031.1U Active CN207251754U (en) 2016-08-01 2016-08-01 Array camera module and electronic equipment

Country Status (1)

Country Link
CN (4) CN207251753U (en)

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017211267A1 (en) * 2016-06-06 2017-12-14 宁波舜宇光电信息有限公司 Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board
WO2018006673A1 (en) * 2016-07-03 2018-01-11 宁波舜宇光电信息有限公司 Photosensitive component, and camera module and manufacturing method therefor
CN107872610A (en) * 2017-12-19 2018-04-03 广东欧珀移动通信有限公司 The lens assembly of camera and there is its camera, electronic equipment
CN107910345A (en) * 2017-12-19 2018-04-13 宁波舜宇光电信息有限公司 Photosensory assembly, camera module, photosensory assembly jigsaw and corresponding production method
CN108735706A (en) * 2017-04-25 2018-11-02 京瓷株式会社 Electronic component mounting substrate, electronic device and electronic module
CN108810344A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810340A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810329A (en) * 2017-04-28 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its antisitic defect photosensory assembly
CN108810338A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810339A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108933883A (en) * 2017-05-25 2018-12-04 南昌欧菲光电技术有限公司 Camera module
GB2563193A (en) * 2017-03-23 2018-12-12 Cambridge Mechatronics Ltd IR filter flange
CN109218568A (en) * 2017-06-30 2019-01-15 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN109218582A (en) * 2018-09-29 2019-01-15 Oppo广东移动通信有限公司 Mould group and preparation method thereof, camera and electronic device
CN109218567A (en) * 2017-06-30 2019-01-15 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
WO2019015692A1 (en) * 2017-07-21 2019-01-24 宁波舜宇光电信息有限公司 Camera module, support base thereof, photosensitive device, manufacturing method, and electronic apparatus
WO2019033961A1 (en) * 2017-08-18 2019-02-21 宁波舜宇光电信息有限公司 Photosensitive assembly, imaging module, intelligent terminal, and method and mould for manufacturing photosensitive assembly
WO2019033897A1 (en) * 2017-08-14 2019-02-21 宁波舜宇光电信息有限公司 Imaging assembly and manufacturing method therefor, as well as molding mold, camera module and intelligent terminal
CN109413303A (en) * 2017-08-18 2019-03-01 宁波舜宇光电信息有限公司 Photosensory assembly, imaging modules, intelligent terminal and the method and mold that manufacture photosensory assembly
WO2019047960A1 (en) * 2017-09-11 2019-03-14 宁波舜宇光电信息有限公司 Camera module, and photosensitive component, electronic device, forming mold and manufacturing method thereof
CN109495671A (en) * 2017-09-11 2019-03-19 宁波舜宇光电信息有限公司 Camera module and its photosensory assembly and manufacturing method
CN109510922A (en) * 2017-09-15 2019-03-22 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN109510923A (en) * 2017-09-15 2019-03-22 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
WO2019062609A1 (en) * 2017-09-28 2019-04-04 宁波舜宇光电信息有限公司 Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof
WO2019062610A1 (en) * 2017-09-28 2019-04-04 宁波舜宇光电信息有限公司 Camera module for reducing stray light and photosensitive assembly thereof, and electronic device
CN109581785A (en) * 2017-09-28 2019-04-05 宁波舜宇光电信息有限公司 Reduce the camera module and its photosensory assembly of stray light
CN109585464A (en) * 2017-09-28 2019-04-05 宁波舜宇光电信息有限公司 Camera module and its photosensory assembly and manufacturing method
CN109698894A (en) * 2017-10-20 2019-04-30 宁波舜宇光电信息有限公司 Photosensory assembly and camera module based on metallic support
CN109905574A (en) * 2017-12-08 2019-06-18 纮华电子科技（上海）有限公司 A kind of camera module and its packaging method
WO2019120197A1 (en) * 2017-12-19 2019-06-27 宁波舜宇光电信息有限公司 Photosensitive assembly, photographing module, and photosensitive assembly jointed board and corresponding manufacturing method thereof
CN110650273A (en) * 2016-08-01 2020-01-03 宁波舜宇光电信息有限公司 Camera module, molded photosensitive assembly thereof and manufacturing method
CN111344616A (en) * 2017-08-14 2020-06-26 宁波舜宇光电信息有限公司 Imaging assembly and manufacturing method thereof, molding die, camera module and intelligent terminal
CN113180651A (en) * 2021-04-23 2021-07-30 安徽华米信息科技有限公司 Physiological parameter detection mechanism and wearable equipment
US20210289112A1 (en) * 2018-07-26 2021-09-16 Ningbo Sunny Opotech Co., Ltd. Molding assembly, camera module, molding assembly jointed board and manufacturing method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108076271B (en) * 2017-12-19 2020-11-24 Oppo广东移动通信有限公司 Lens assembly, camera with same and electronic equipment
CN108076272B (en) * 2017-12-19 2020-09-25 Oppo广东移动通信有限公司 Lens assembly, camera with same and electronic equipment
CN108650443B (en) * 2018-05-29 2020-09-04 Oppo广东移动通信有限公司 Electronic device and control method thereof
CN114244984B (en) * 2021-12-16 2024-03-26 维沃移动通信有限公司 Liquid lens module and electronic equipment

Cited By (79)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017211267A1 (en) * 2016-06-06 2017-12-14 宁波舜宇光电信息有限公司 Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board
WO2018006673A1 (en) * 2016-07-03 2018-01-11 宁波舜宇光电信息有限公司 Photosensitive component, and camera module and manufacturing method therefor
CN110650273A (en) * 2016-08-01 2020-01-03 宁波舜宇光电信息有限公司 Camera module, molded photosensitive assembly thereof and manufacturing method
GB2563193B (en) * 2017-03-23 2020-01-01 Cambridge Mechatronics Ltd IR filter flange
GB2563193A (en) * 2017-03-23 2018-12-12 Cambridge Mechatronics Ltd IR filter flange
CN108735706A (en) * 2017-04-25 2018-11-02 京瓷株式会社 Electronic component mounting substrate, electronic device and electronic module
CN108735706B (en) * 2017-04-25 2021-11-02 京瓷株式会社 Substrate for mounting electronic component, electronic device, and electronic module
CN108810329A (en) * 2017-04-28 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its antisitic defect photosensory assembly
CN108810338A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810341A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810349A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810339A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810342A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810340B (en) * 2017-05-06 2021-10-08 南昌欧菲光电技术有限公司 Camera module and photosensitive assembly thereof
CN108810340A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810350A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108810344A (en) * 2017-05-06 2018-11-13 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN108933883A (en) * 2017-05-25 2018-12-04 南昌欧菲光电技术有限公司 Camera module
CN109218568A (en) * 2017-06-30 2019-01-15 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN109218567A (en) * 2017-06-30 2019-01-15 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
WO2019015692A1 (en) * 2017-07-21 2019-01-24 宁波舜宇光电信息有限公司 Camera module, support base thereof, photosensitive device, manufacturing method, and electronic apparatus
KR20200041320A (en) * 2017-08-14 2020-04-21 닝보 써니 오포테크 코., 엘티디. Imaging assembly and its manufacturing method and molding mold, camera module and intelligent terminal
CN111344616A (en) * 2017-08-14 2020-06-26 宁波舜宇光电信息有限公司 Imaging assembly and manufacturing method thereof, molding die, camera module and intelligent terminal
JP2020530664A (en) * 2017-08-14 2020-10-22 ▲寧▼波舜宇光▲電▼信息有限公司 Imaging assembly and its manufacturing method, mold mold, imaging module and smart terminal
EP3671302A4 (en) * 2017-08-14 2020-09-02 Ningbo Sunny Opotech Co., Ltd. Imaging assembly and manufacturing method therefor, as well as molding mold, camera module and intelligent terminal
TWI716712B (en) * 2017-08-14 2021-01-21 中國商寧波舜宇光電信息有限公司 Imaging component and manufacturing method thereof, molding die, camera module and intelligent terminal
WO2019033897A1 (en) * 2017-08-14 2019-02-21 宁波舜宇光电信息有限公司 Imaging assembly and manufacturing method therefor, as well as molding mold, camera module and intelligent terminal
KR102393994B1 (en) * 2017-08-14 2022-05-03 닝보 써니 오포테크 코., 엘티디. Imaging assembly and its manufacturing method and molding mold, camera module and intelligent terminal
JP7104776B2 (en) 2017-08-14 2022-07-21 ▲寧▼波舜宇光▲電▼信息有限公司 Imaging assembly and its manufacturing method, mold mold, imaging module and smart terminal
JP6992163B2 (en) 2017-08-18 2022-01-13 ▲寧▼波舜宇光▲電▼信息有限公司 Manufacturing methods and molds for photosensitive assemblies, imaging modules, smart terminals and photosensitive assemblies
US11843009B2 (en) 2017-08-18 2023-12-12 Ningbo Sunny Opotech Co., Ltd. Photosensitive assembly, imaging module, smart terminal, and method and mould for manufacturing photosensitive assembly
WO2019033961A1 (en) * 2017-08-18 2019-02-21 宁波舜宇光电信息有限公司 Photosensitive assembly, imaging module, intelligent terminal, and method and mould for manufacturing photosensitive assembly
CN110832836B (en) * 2017-08-18 2022-02-22 宁波舜宇光电信息有限公司 Photosensitive assembly, imaging module, intelligent terminal, method for manufacturing photosensitive assembly and mold
CN109413303A (en) * 2017-08-18 2019-03-01 宁波舜宇光电信息有限公司 Photosensory assembly, imaging modules, intelligent terminal and the method and mold that manufacture photosensory assembly
CN109413303B (en) * 2017-08-18 2023-06-30 宁波舜宇光电信息有限公司 Photosensitive assembly, imaging module, intelligent terminal, and method and mold for manufacturing photosensitive assembly
CN110832836A (en) * 2017-08-18 2020-02-21 宁波舜宇光电信息有限公司 Photosensitive assembly, imaging module, intelligent terminal, method for manufacturing photosensitive assembly and mold
JP2020532200A (en) * 2017-08-18 2020-11-05 ▲寧▼波舜宇光▲電▼信息有限公司 Manufacturing methods and molds for photosensitive assemblies, imaging modules, smart terminals and photosensitive assemblies
KR102509124B1 (en) 2017-08-18 2023-03-10 닝보 써니 오포테크 코., 엘티디. Photosensitive assembly, imaging module, intelligent terminal, and method and mould for manufacturing photosensitive assembly
KR20220071294A (en) * 2017-08-18 2022-05-31 닝보 써니 오포테크 코., 엘티디. Photosensitive assembly, imaging module, intelligent terminal, and method and mould for manufacturing photosensitive assembly
EP3672220A4 (en) * 2017-08-18 2020-09-09 Ningbo Sunny Opotech Co., Ltd. Photosensitive assembly, imaging module, intelligent terminal, and method and mould for manufacturing photosensitive assembly
EP3684045A4 (en) * 2017-09-11 2021-04-28 Ningbo Sunny Opotech Co., Ltd. Camera module, and photosensitive component, electronic device, forming mold and manufacturing method thereof
TWI699118B (en) * 2017-09-11 2020-07-11 大陸商寧波舜宇光電信息有限公司 Camera module and its photosensitive element, electronic equipment, molding die and manufacturing method
WO2019047960A1 (en) * 2017-09-11 2019-03-14 宁波舜宇光电信息有限公司 Camera module, and photosensitive component, electronic device, forming mold and manufacturing method thereof
CN109495671B (en) * 2017-09-11 2023-12-26 宁波舜宇光电信息有限公司 Image pickup module, photosensitive assembly thereof and manufacturing method
CN109495671A (en) * 2017-09-11 2019-03-19 宁波舜宇光电信息有限公司 Camera module and its photosensory assembly and manufacturing method
US11433584B2 (en) 2017-09-11 2022-09-06 Ningbo Sunny Opotech Co., Ltd. Camera module, and photosensitive component, electronic device, forming mold and manufacturing method thereof
CN109510922A (en) * 2017-09-15 2019-03-22 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN109510923A (en) * 2017-09-15 2019-03-22 南昌欧菲光电技术有限公司 Camera module and its photosensory assembly
CN111133742A (en) * 2017-09-28 2020-05-08 宁波舜宇光电信息有限公司 Camera module, photosensitive assembly splicing plate, forming mold and manufacturing method thereof
JP7042335B2 (en) 2017-09-28 2022-03-25 ▲寧▼波舜宇光▲電▼信息有限公司 Camera module, photosensitive assembly, photosensitive assembly joint panel, and its molding mold and manufacturing method.
JP2020535041A (en) * 2017-09-28 2020-12-03 ▲寧▼波舜宇光▲電▼信息有限公司 Camera module, photosensitive assembly, photosensitive assembly joint panel, and its molding mold and manufacturing method
CN109581785B (en) * 2017-09-28 2021-05-04 宁波舜宇光电信息有限公司 Camera module for reducing stray light and photosensitive assembly thereof
TWI734028B (en) * 2017-09-28 2021-07-21 大陸商寧波舜宇光電信息有限公司 Camera module, photosensitive component, penalization of photosensitive component, mold of the penalization and manufacturing method
US11881491B2 (en) 2017-09-28 2024-01-23 Ningbo Sunny Opotech Co., Ltd. Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof
EP4220724A3 (en) * 2017-09-28 2023-09-13 Ningbo Sunny Opotech Co., Ltd. Camera module, photosensitive assembly, photosensitive assembly jointed panel, and molding die thereof and manufacturing method thereof
WO2019062609A1 (en) * 2017-09-28 2019-04-04 宁波舜宇光电信息有限公司 Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof
EP3691241A4 (en) * 2017-09-28 2020-10-14 Ningbo Sunny Opotech Co., Ltd. Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof
CN113485054A (en) * 2017-09-28 2021-10-08 宁波舜宇光电信息有限公司 Camera module for reducing stray light and photosensitive assembly thereof
CN111133742B (en) * 2017-09-28 2021-10-19 宁波舜宇光电信息有限公司 Camera module, photosensitive assembly splicing plate, forming mold and manufacturing method thereof
KR102320910B1 (en) * 2017-09-28 2021-11-02 닝보 써니 오포테크 코., 엘티디. Camera module, photosensitive assembly, photosensitive assembly alignment plate, forming die and manufacturing method thereof
US11664397B2 (en) 2017-09-28 2023-05-30 Ningbo Sunny Opotech Co., Ltd. Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof
KR20200042003A (en) * 2017-09-28 2020-04-22 닝보 써니 오포테크 코., 엘티디. Camera module, photosensitive assembly, photosensitive assembly custom plate and molding die thereof and manufacturing method
WO2019062610A1 (en) * 2017-09-28 2019-04-04 宁波舜宇光电信息有限公司 Camera module for reducing stray light and photosensitive assembly thereof, and electronic device
CN113485054B (en) * 2017-09-28 2022-12-06 宁波舜宇光电信息有限公司 Camera module for reducing stray light and photosensitive assembly thereof
US11315967B2 (en) 2017-09-28 2022-04-26 Ningbo Sunny Opotech Co., Ltd. Camera module, photosensitive component, photosensitive-component joined panel, and forming die thereof and manufacturing method thereof
CN109581785A (en) * 2017-09-28 2019-04-05 宁波舜宇光电信息有限公司 Reduce the camera module and its photosensory assembly of stray light
CN109585464A (en) * 2017-09-28 2019-04-05 宁波舜宇光电信息有限公司 Camera module and its photosensory assembly and manufacturing method
CN109698894A (en) * 2017-10-20 2019-04-30 宁波舜宇光电信息有限公司 Photosensory assembly and camera module based on metallic support
CN111345021A (en) * 2017-10-20 2020-06-26 宁波舜宇光电信息有限公司 Photosensitive assembly and camera module based on metal support
CN109905574A (en) * 2017-12-08 2019-06-18 纮华电子科技（上海）有限公司 A kind of camera module and its packaging method
US20200388641A1 (en) * 2017-12-19 2020-12-10 Ningbo Sunny Opotech Co., Ltd. Photosensitive assembly, photographing module, and photosensitive assembly jointed board and corresponding manufacturing method thereof
WO2019120197A1 (en) * 2017-12-19 2019-06-27 宁波舜宇光电信息有限公司 Photosensitive assembly, photographing module, and photosensitive assembly jointed board and corresponding manufacturing method thereof
US11646332B2 (en) 2017-12-19 2023-05-09 Ningbo Sunny Opotech Co., Ltd. Photosensitive assembly, photographing module, and photosensitive assembly jointed board and corresponding manufacturing method thereof
CN107910345A (en) * 2017-12-19 2018-04-13 宁波舜宇光电信息有限公司 Photosensory assembly, camera module, photosensory assembly jigsaw and corresponding production method
CN107872610A (en) * 2017-12-19 2018-04-03 广东欧珀移动通信有限公司 The lens assembly of camera and there is its camera, electronic equipment
CN107910345B (en) * 2017-12-19 2024-04-09 宁波舜宇光电信息有限公司 Photosensitive assembly, camera module, photosensitive assembly jointed board and corresponding manufacturing method
US20210289112A1 (en) * 2018-07-26 2021-09-16 Ningbo Sunny Opotech Co., Ltd. Molding assembly, camera module, molding assembly jointed board and manufacturing method
CN109218582A (en) * 2018-09-29 2019-01-15 Oppo广东移动通信有限公司 Mould group and preparation method thereof, camera and electronic device
CN113180651A (en) * 2021-04-23 2021-07-30 安徽华米信息科技有限公司 Physiological parameter detection mechanism and wearable equipment

Also Published As

Publication number Publication date
CN206698309U (en) 2017-12-01
CN207251754U (en) 2018-04-17
CN207251753U (en) 2018-04-17

Similar Documents

Publication Publication Date Title
CN205961279U (en) Module of making a video recording and photosensitive assembly and forming die are moulded to mould thereof
CN206302476U (en) Camera module and its molded circuit board component and mould and electronic equipment
CN107682591A (en) Camera module and its molding photosensory assembly and manufacture method
CN109716745A (en) Camera module and its molded circuit board component and molding photosensory assembly and manufacturing method
TWI685065B (en) Camera module and its molded circuit board components and manufacturing method
TWI698125B (en) Camera module and its molded photosensitive element and manufacturing method
CN102687051B (en) Image-capturing lens unit
CN205883378U (en) Photosensitive assembly of module makes a video recording
TWI734028B (en) Camera module, photosensitive component, penalization of photosensitive component, mold of the penalization and manufacturing method
CN107209342A (en) Manufacture method, image planes side group lens, the manufacture method of image planes side group lens and the photographing element of camera model
US7957081B2 (en) Optical glass lens set and manufacturing method thereof
CN207744032U (en) Camera module and its photosensory assembly and electronic equipment and molding die
CN109585464A (en) Camera module and its photosensory assembly and manufacturing method
CN107682592A (en) Camera module and its molded circuit board component and manufacture method
US7803291B2 (en) Plastic lens, manufacturing method thereof, production tracing management method thereof, and optical pickup device
CN203811963U (en) Camera shooting module group and camera device
CN203720513U (en) Camera module and camera device
CN109495671B (en) Image pickup module, photosensitive assembly thereof and manufacturing method
CN104076414B (en) The manufacture method of lens combination
JP2008151836A (en) Optical element

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant