CN108810349A - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
- Publication number
- CN108810349A CN108810349A CN201710528985.9A CN201710528985A CN108810349A CN 108810349 A CN108810349 A CN 108810349A CN 201710528985 A CN201710528985 A CN 201710528985A CN 108810349 A CN108810349 A CN 108810349A
- Authority
- CN
- China
- Prior art keywords
- light hole
- packaging body
- photosensitive element
- photosensory assembly
- photosensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The present invention relates to a kind of camera module and its photosensory assembly, photosensory assembly includes：Substrate；Photosensitive element is set on substrate；Packaging body, including the lower surface and upper surface that are oppositely arranged, packaging body are equipped with light hole, and photosensitive element is located in light hole；Light hole includes the first light hole and the second light hole, the side wall of first light hole is extended vertically from photosensitive element to second light hole one end of connection with respect to photosensitive element, and the side wall of the second light hole, which is tilted from the first light hole one end to upper surface of connection with respect to photosensitive element, to be extended；Lateral wall of the packaging body far from photosensitive element, which is tilted from following table away from upper surface, to be extended.Above-mentioned photosensory assembly, sidewall slope extension and diameter due to the second light hole of packaging body gradually increase on the direction far from photosensitive element, and the light quantity being radiated on photosensitive element increases.Moreover, the lateral wall of packaging body and the side wall of the second light hole are oblique, can be convenient for being used to form the molding mold release of packaging body.
Description
This application claims being submitted on May 6th, 2017, application No. is 201710317509.2, entitled " camera shootings
The priority of the Chinese patent application of module and its photosensory assembly ".
Technical field
The present invention relates to camera module fields, more particularly to a kind of camera module and its photosensory assembly.
Background technology
With the fast development of various smart machines, the smart machine for being integrated with camera module is improving the same of image quality
When, also increasingly as lightening direction is developed.And improve image quality mean the specification of electronic component constantly increase, quantity
It is on the increase, largely influences also constantly increasing for the area of the photosensitive element of image quality, therefore cause camera module
Assembling difficulty constantly increase, overall dimensions also constantly increase, therefore the lightening of camera module receives very big limitation, into
And limit the volume of the smart machine equipped with the camera module.
The camera module packaging technology generally used now is COB (Chip On Board) packaging technology, that is, camera shooting mould
Wiring board, photosensitive element, the holder etc. of group are made into respectively, then successively by passive electronic component, photosensitive element and holder
Encapsulation is in the circuit board.
However use above-mentioned molded method, it usually needs light hole is formed by supporting structure, is on wiring board
Sensitive chip provide passage of light.But currently, due to light be determine equipped with the photosensory assembly camera module at image quality
An important factor for amount, and current holder shape limits the size of thang-kng amount, reduces thang-kng amount and affects camera module
Image quality.
Invention content
Based on this, it is necessary to lead to because of fault of construction that thang-kng amount is smaller, not easy mold release for the light hole of photosensory assembly
The problem of, the camera module and its photosensory assembly of a kind of larger, the easy demoulding of thang-kng amount are provided.
A kind of photosensory assembly, including：
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensitive element includes photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body includes far from the photosensitive element
Upper surface, the packaging body is equipped with light hole, and the light hole is through photosensitive area described in the packaging body and face；
Wherein, the light hole includes the first light hole and the second light hole of connection, the side wall of first light hole
It is extended vertically from the photosensitive element to the upper surface of the packaging body, the side wall of second light hole is from first thang-kng
The apical margin in hole tilts the upper surface for extending to the packaging body, and the internal diameter of second light hole gradually increases in this direction
Greatly, the side wall of second light hole is in the cambered surface outwardly protruded.
Above-mentioned photosensory assembly, the sidewall slope extension and internal diameter due to the second light hole of packaging body are far from photosensitive element
Direction on gradually increase, therefore be radiated at the light quantity on photosensitive element increase, to improve the thang-kng amount of photosensory assembly.And
And second light hole side wall evagination, can be convenient for being used to form the molding mold release of packaging body, and avoid causing packaging body
Damage, finally improves the image quality of the camera module equipped with the photosensory assembly.
In addition, the side wall of the second light hole outwardly protrudes, the knot of the packaging body can be enhanced while convenient for mold releasability
Structure intensity.
The radius of the cambered surface is 0.02-0.5mm in one of the embodiments,.The setting of above-mentioned radius has taken into account de-
Mould avoids damage to consider of both packaging body and enhancing structure intensity.
First light hole is rounded in one of the embodiments, a diameter of 2-8mm.
First light hole is square in one of the embodiments, length 3-10mm, width 2.5-9.8mm.
The different shape of first light hole can match different types of photosensitive element, and photosensitive element is coordinated preferably to be felt
Light effect.
The width of the upper surface of the packaging body is 0.3-3mm, length 2.7-8.7mm in one of the embodiments,.
The above-mentioned size design of upper surface can not only meet the needs of stable optical component, but also take into account the miniaturization of camera module simultaneously
Design.
The height of the packaging body is 0.2-2.5mm in one of the embodiments,.Above-mentioned height design can expire simultaneously
Foot encapsulation requires and Miniaturization Design.
In one of the embodiments, the side wall of first light hole between the packaging body lateral wall at a distance from be
0.5-5.5mm.The design of above-mentioned distance has taken into account structural strength and Miniaturization Design.
Further include the conducting wire for connecting the photosensitive element and the substrate, the photosensitive member in one of the embodiments,
Part includes around the non-photo-sensing area of the photosensitive area, and the packaging body packed part non-photo-sensing area simultaneously coats the conducting wire.In this way,
Encapsulation body portion takes shape in reduce the overall volume of the photosensory assembly on photosensitive element, and can avoid conducting wire and be exposed to packaging body
It is damaged outside.
Photosensitive area edge of the side wall of first light hole from the photosensitive element be most in one of the embodiments,
Small distance is 0.05mm.
Photosensitive area edge of the side wall of first light hole from the photosensitive element be most in one of the embodiments,
Small distance is 0.2mm.The setting of above-mentioned distance makes camera module be obtained between the two preferably in miniaturization and image quality
Balance.
A kind of camera module, including camera lens module and above-mentioned photosensory assembly, the camera lens module are located at the packaging body
Upper surface.
Description of the drawings
Fig. 1 is the sectional view for the photosensory assembly that one embodiment of the invention provides.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.Keep the understanding to the disclosure more saturating on the contrary, purpose of providing these embodiments is
It is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the Listed Items of pass.
As shown in Figure 1, a kind of photosensory assembly 400 of an embodiment of the present invention, including substrate 420, photosensitive element 440 and
Packaging body 460.
Wherein, photosensitive element 440 is set on substrate 420 and is electrically connected with substrate 420.Packaging body 460 is set to substrate 420
On, including the lower surface 464 of close photosensitive element 440 being oppositely arranged and the upper surface 462 far from photosensitive element 440, encapsulation
Body 460 is equipped with the light hole 468 through upper surface 462 and lower surface 464.
Specifically, light hole 468 includes the first light hole 4682 and the second light hole 4684 of connection, the second light hole
4684 are equal to the internal diameter of the first light hole 4682 close to the internal diameter of 4682 side of the first light hole.The side wall of first light hole 4682
It is extended vertically from photosensitive element 440 to the upper surface 462 of the packaging body 460, the side wall of the second light hole 4684 is logical from first
The apical margin of unthreaded hole 4682 tilts the upper surface 462 for extending to the packaging body 460, and the internal diameter of the second light hole 4684 is in the party
Gradually increase upwards, the side wall of second light hole 4684 is in the cambered surface outwardly protruded.The side wall of second light hole 4684 to
Outer protrusion can enhance the structural strength of the packaging body 460 while convenient for mold releasability.
In one embodiment, the cambered surface radius r that the side wall of the second light hole 4684 outwardly protrudes is 0.02-0.5mm, preferably
0.3mm.It is unfavorable instead to demoulding if above-mentioned radius r is too small, if excessive, it is arranged without larger difference with flat, lift structure is strong
The effect unobvious of degree.The setting of above-mentioned radius r has taken into account demoulding and has avoided damage to two aspect of packaging body 460 and lift structure intensity
The considerations of.
Above-mentioned photosensory assembly 400, the sidewall slope extension and internal diameter due to the second light hole 4684 of packaging body 460 are remote
The light quantity for gradually increasing on direction from photosensitive element 440, therefore being radiated on photosensitive element 440 increases, to improve sense
The thang-kng amount of optical assembly 400.Moreover, the equal evagination of side wall of the second light hole 4684, can be convenient for being used to form packaging body 460 at
Type mold releasability, and avoid that packaging body 460 is caused to damage, finally improve the camera module equipped with the photosensory assembly 400
Image quality.
Further, since the side wall of the first light hole 4682 is vertically arranged with respect to photosensitive element 440, therefore can be in molded package
Removable barriers are set on photosensitive element 440 before body 460, the side wall of barriers can be supported in the first light hole 4682
Side wall on the material of packaging body 460 formed with blocking flow on photosensitive element 440, sealed to can avoid photosensitive element 440
It fills and is damaged in the forming process of body 460, and the overall construction intensity of the packaging body 460 also can be improved and be hardly damaged,
It plays a good protective effect, and other parts on the upper surface of packaging body 460 462 can be risen to photosensitive element 440
To firm supporting role.
In the present embodiment, substrate 420 is wiring board, may be, for example, hard circuit board, ceramic substrate (without soft board),
Or Rigid Flex, soft board.When substrate 420 is soft board, can be set in side of the substrate 420 far from photosensitive element 440
Stiffening plate (not shown) is set, to improve the intensity of substrate 420, to improve the overall construction intensity of the photosensory assembly 400.
Including photosurface 442 and back on the non-photo-sensing face that photosurface 442 is arranged, photosurface 442 includes photosensitive element 440
Photosensitive area 4421 and non-photo-sensing area 4422, and photosensitive area 4421 is located at 442 middle part of photosurface, non-photo-sensing area 4422 surrounds photosensitive area
4421 settings.
In one embodiment, 4422 part of non-photo-sensing area is embedded in packaging body 460 and is electrically connected to base by conducting wire 480
Plate 420, and conducting wire 480 is contained in completely in packaging body 460.In this way, 460 part of packaging body take shape on photosensitive element 440 with
Reduce the overall volume of the photosensory assembly 400, and can avoid conducting wire 480 and be exposed to outside packaging body 460 and be damaged.Wherein,
Conducting wire 480 can be gold thread, copper wire, aluminum steel or silver wire etc..
Further, packaging body 460 is formed in substrate 420 by molded mode.For example, using injection molding machine, lead to
Cross insert molding technique by substrate 420 carry out molding form packaging body 460.Packaging body 460 after molding and 420 secured phase of substrate
Even, compared with conventional stent is bonded by glue-line, the bonding force between packaging body 460 and substrate 420 is much greater.Specifically,
It can be nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer to use Shooting Technique to form the material of packaging body 460
Polymer) or PP (Polypropylene, polypropylene) etc..It can be selected it will be apparent to a skilled person that aforementioned
Manufacture and the material that can be selected are illustrative only the mode that can implement of the present invention, are not the present invention
Limitation.
Above-mentioned photosensory assembly 400 can have more while ensureing smaller size smaller to the optical axis direction of photosensitive element 440
Tilting the light extended can reach along the second light hole 4684 that sidewall slope is arranged on photosensitive element 440, to increase this
The thang-kng amount of light hole 468, to improve the image quality for the camera module for being equipped with the photosensory assembly 400.Also, it is radiated at
Light on the side wall of second light hole 4684 can be inclined by the reflection of the above-mentioned side wall of setting without reaching photosensitive element
440, to reduce influence of the reflection veiling glare to the image quality of the camera module equipped with the photosensitive element 440.Moreover, second
The side wall that the inclination of light hole 4684 extends can also be convenient for the molding mold release of packaging body 460, to avoid in knockout course
Middle damage packaging body 460.In addition, the photosensory assembly 400 can be improved in the part that packaging body 460 offers the first light hole 4684
Overall construction intensity provides preferable support for the part on the first surface 462 of packaging body 460.
Further, the first light hole 4682 can be rounded, a diameter of 2-8mm, preferred a diameter of 6.68mm.
Optionally, the first light hole 4682 can also be square, length 3-10mm, width 2.5-9.8mm, preferred long
Degree is 5.72mm, width 4.41mm.In one embodiment, the side wall of the first light hole 4682 is photosensitive from photosensitive element 440
4421 edge minimum range L of area is 0.05mm, preferably 0.2mm.If distance L is too small, potting resin etc. is different in encapsulation process
The risk that object influences the photosensitive area 4421 of photosensitive element 440 increases, and the foreign matter on photosensitive area 4421 will influence photosensitive area
4421 receive the effect of incident light, and then influence image quality.If distance L is excessive, on the one hand so that the volume of camera module increases
Greatly, be unfavorable for minimizing, on the other hand can also make 4422 stray light of non-photo-sensing area on photosensitive element 440 more and influence at
As quality.The setting of above-mentioned distance makes camera module obtain preferable balance between the two in miniaturization and image quality.
In one embodiment, the width W of the upper surface 462 of packaging body 460 is 0.3-3mm, preferably 1.65mm, length (Fig. 1
In perpendicular to drawing dimension) be 2.7-8.7mm, preferably 7.6mm.The upper surface 462 can be used for carrying optical module, though
The area increase of right upper surface 462 can be such that the contact surface of carrying optical module increases, steady to the installation of improving optical component
Soundness, but area crosses the overall volume that senior general increases camera module, cannot achieve Miniaturization Design.Above-mentioned upper surface 462
Size design can not only meet the needs of stable optical component, but also take into account the Miniaturization Design of camera module simultaneously.
In one embodiment, the height H of packaging body 460 is 0.2-2.5mm, preferably 0.41mm.The packaging body 460
Height H, which should consider that other electronic components on photosensitive element 440 or substrate 420 can be formed, to be encapsulated, and considering again will not
Increase the volume of camera module in short transverse.Above-mentioned height H designs can meet encapsulation requirement and Miniaturization Design simultaneously.
In one embodiment, the side wall of the first light hole 4682 distance T between 460 lateral wall of packaging body is 0.5-5.5mm,
Preferably 1.95mm.Distance T sizes influence the volume of the structural strength and camera module of packaging body 460, if distance T is excessive, though
Structural strength meets the requirements, but volume is excessive, cannot meet Miniaturization Design；If distance T is too small, although disclosure satisfy that small-sized
Change design, but structural strength is inadequate.The design of above-mentioned distance T has taken into account structural strength and Miniaturization Design.
A kind of camera module (not shown) of present pre-ferred embodiments, including above-mentioned photosensory assembly 400, further include mirror
Head mould group.
Specifically, when that need to use tight shot, the camera lens module includes camera lens, and the camera lens is located at the upper surface
462；When that need to use zoom lens, the camera lens module includes camera lens and the voice coil motor for being arranged the camera lens, the voice coil
Motor is located at the upper surface 462.Light is incident from camera lens and reaches the photosurface 442 of photosensitive element 440, photosensitive element 440
Convert optical signals into electric signal.
Above-mentioned camera module, the photosensory assembly for including due to it is while with smaller volume with larger thang-kng
Amount, therefore the camera module has preferable image quality and smaller volume, is conducive to the intelligence for being equipped with the camera module
Equipment develops while ensureing image quality to lightening direction.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (11)
1. a kind of photosensory assembly, which is characterized in that including：
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensitive element includes photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body includes upper far from the photosensitive element
Surface, the packaging body are equipped with light hole, and the light hole is through photosensitive area described in the packaging body and face；
Wherein, the light hole includes the first light hole and the second light hole of connection, and the side wall of first light hole is from institute
It states photosensitive element to extend vertically to the upper surface of the packaging body, the side wall of second light hole is from first light hole
Apical margin tilts the upper surface for extending to the packaging body, and the internal diameter of second light hole gradually increases in this direction, institute
The side wall for stating the second light hole is in the cambered surface outwardly protruded.
2. photosensory assembly according to claim 1, which is characterized in that the radius of the cambered surface is 0.02-0.5mm.
3. photosensory assembly according to claim 1, which is characterized in that first light hole is rounded, a diameter of 2-
8mm。
4. photosensory assembly according to claim 1, which is characterized in that first light hole is square, length 3-
10mm, width 2.5-9.8mm.
5. photosensory assembly according to claim 4, which is characterized in that the width of the upper surface of the packaging body is 0.3-
3mm, length 2.7-8.7mm.
6. photosensory assembly according to claim 1, which is characterized in that the height of the packaging body is 0.2-2.5mm.
7. photosensory assembly according to claim 1, which is characterized in that the side wall of first light hole and the packaging body
Distance between lateral wall is 0.5-5.5mm.
8. according to the photosensory assembly described in claim 1~7 any one, which is characterized in that further include the connection photosensitive member
The conducting wire of part and the substrate, the photosensitive element include around the non-photo-sensing area of the photosensitive area, the packaging body encapsulation part
Point non-photo-sensing area simultaneously coats the conducting wire.
9. photosensory assembly according to claim 8, which is characterized in that the side wall of first light hole is from the photosensitive member
The minimum range of the photosensitive area edge of part is 0.05mm.
10. photosensory assembly according to claim 8, which is characterized in that the side wall of first light hole is photosensitive from described
The minimum range of the photosensitive area edge of element is 0.2mm.
11. a kind of camera module, which is characterized in that the sense including camera lens module and as described in claim 1~10 any one
Optical assembly, the camera lens module are located at the upper surface of the packaging body.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2017103175092 | 2017-05-06 | ||
| CN201710317509 | 2017-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108810349A true CN108810349A (en) | 2018-11-13 |
Family
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| CN201720787684.3U Active CN207184627U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710529021.6A Pending CN108810350A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528985.9A Pending CN108810349A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528982.5A Withdrawn CN108810348A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
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| CN201710528974.0A Withdrawn CN108810346A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528955.8A Pending CN108810341A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
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| CN201710529126.1A Withdrawn CN108810351A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
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| CN201720790456.1U Active CN206977549U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710529150.5A Withdrawn CN108810352A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720790430.7U Active CN206977546U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720863228.2U Active CN207117777U (en) | 2017-05-06 | 2017-07-14 | Camera module and its photosensory assembly |
| CN201710576887.2A Withdrawn CN108810354A (en) | 2017-05-06 | 2017-07-14 | Camera module and its photosensory assembly |
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| CN207184628U (en) * | 2017-05-06 | 2018-04-03 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN110164984B (en) * | 2018-02-13 | 2024-02-09 | 宁波舜宇光电信息有限公司 | Integrated photosensitive module, photosensitive assembly, camera module and preparation method |
| CN208572292U (en) * | 2018-03-18 | 2019-03-01 | 宁波舜宇光电信息有限公司 | Depth information camera module and its base assembly and electronic equipment |
| CN108769466B (en) * | 2018-05-30 | 2021-01-29 | 信利光电股份有限公司 | Camera module, manufacturing method and electronic equipment |
| TWI768126B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, image system and optical image capturing manufacture method |
| TWI768127B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, optical image system and optical image capturing manufacture method |
| TWI768128B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module and imaging system, manufacture method thereof |
| TWI754099B (en) * | 2018-09-21 | 2022-02-01 | 先進光電科技股份有限公司 | Optical image capturing module |
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| CN206977550U (en) | 2018-02-06 |
| CN207184627U (en) | 2018-04-03 |
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| CN108810343A (en) | 2018-11-13 |
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| CN108810350A (en) | 2018-11-13 |
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| CN108810353A (en) | 2018-11-13 |
| CN206977546U (en) | 2018-02-06 |
| CN108810345A (en) | 2018-11-13 |
| CN207184628U (en) | 2018-04-03 |
| CN206977551U (en) | 2018-02-06 |
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