CN108810344A - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
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- CN108810344A CN108810344A CN201710528971.7A CN201710528971A CN108810344A CN 108810344 A CN108810344 A CN 108810344A CN 201710528971 A CN201710528971 A CN 201710528971A CN 108810344 A CN108810344 A CN 108810344A
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- Prior art keywords
- light hole
- packaging body
- photosensory assembly
- side wall
- photosensitive element
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 claims abstract description 80
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 230000003287 optical effect Effects 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 7
- 238000000465 moulding Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000004743 Polypropylene Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- -1 Polypropylene Polymers 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004313 glare Effects 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
The present invention relates to a kind of camera module and its photosensory assembly, photosensory assembly includes：Substrate；Photosensitive element is set on substrate and is electrically connected with substrate；Packaging body is packaged on substrate and photosensitive element, including upper surface, and packaging body is equipped with light hole, photosensitive element face light hole；Light hole includes the first light hole and the second light hole, the side wall of first light hole is extended vertically from photosensitive element to packaging body upper surface, the side wall of second light hole tilts the upper surface for extending to packaging body from the apical margin of the first light hole, and second the internal diameter of light hole gradually increase in this direction, the side wall of the second light hole is equipped with protrusion.Above-mentioned photosensory assembly, sidewall slope extension and diameter due to the second light hole of packaging body gradually increase on the direction far from photosensitive element, and the light quantity being radiated on photosensitive element increases.Moreover, the lateral wall of packaging body and the side wall of the second light hole are oblique, can be convenient for being used to form the molding mold release of packaging body.
Description
This application claims being submitted on May 6th, 2017, application No. is 201710317509.2, entitled " camera shootings
The priority of the Chinese patent application of module and its photosensory assembly ".
Technical field
The present invention relates to camera module fields, more particularly to a kind of camera module and its photosensory assembly.
Background technology
With the fast development of various smart machines, the smart machine for being integrated with camera module is improving the same of image quality
When, also increasingly as lightening direction is developed.And improve image quality mean the specification of electronic component constantly increase, quantity
It is on the increase, largely influences also constantly increasing for the area of the photosensitive element of image quality, therefore cause camera module
Assembling difficulty constantly increase, overall dimensions also constantly increase, therefore the lightening of camera module receives very big limitation, into
And limit the volume of the smart machine equipped with the camera module.
The camera module packaging technology generally used now is COB (Chip On Board) packaging technology, that is, camera shooting mould
Wiring board, photosensitive element, the holder etc. of group are made into respectively, then successively by passive electronic component, photosensitive element and holder
Encapsulation is in the circuit board.
However use above-mentioned molded method, it usually needs light hole is formed by supporting structure, is on wiring board
Sensitive chip provide passage of light.But currently, due to light be determine equipped with the photosensory assembly camera module at image quality
An important factor for amount, and current holder shape limits the size of thang-kng amount, reduces thang-kng amount and affects camera module
Image quality.
Invention content
Based on this, it is necessary to lead to because of fault of construction that thang-kng amount is smaller, not easy mold release for the light hole of photosensory assembly
The problem of, the camera module and its photosensory assembly of a kind of larger, the easy demoulding of thang-kng amount are provided.
A kind of photosensory assembly, including：
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensitive element includes photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body includes far from the photosensitive element
Upper surface, the packaging body is equipped with light hole, and the light hole is through photosensitive area described in the packaging body and face；
Wherein, the light hole includes the first light hole and the second light hole of connection, the side wall of first light hole
It is extended vertically from the photosensitive element to the packaging body upper surface, the side wall of second light hole is from first light hole
Apical margin tilt and extend to the upper surface of the packaging body, and the internal diameter of second light hole gradually increases in this direction,
The side wall of second light hole is equipped with protrusion.
Above-mentioned photosensory assembly, the sidewall slope extension and internal diameter due to the second light hole of packaging body are far from photosensitive element
Direction on gradually increase, therefore be radiated at the light quantity on photosensitive element increase, to improve the thang-kng amount of photosensory assembly.And
And second light hole side wall it is oblique, can be convenient for being used to form the molding mold release of packaging body, and avoid to packaging body
It causes to damage, finally improves the image quality of the camera module equipped with the photosensory assembly.
In addition, the second light hole sidewall surfaces are roughened, the protrusion of formation constitutes multiple reflectings surface with reflection light, makes photograph
The light penetrated on the side wall of the second light hole can be miscellaneous to reduce reflection by reflective surface without reaching photosensitive element
Influence of the light to the image quality of the camera module equipped with the photosensitive element.
The protrusion is zigzag in one of the embodiments,.
First light hole is rounded in one of the embodiments, a diameter of 2-8mm.
A diameter of 3-7mm of first light hole in one of the embodiments,.
First light hole is square in one of the embodiments, length 3-10mm, width 2.5-9.8mm.
The length of first light hole is 4-7mm, width 3.5-6.5mm in one of the embodiments,.Described
The different shape of one light hole can match different types of photosensitive element, and photosensitive element is coordinated to obtain better photosensitive effect
Fruit.
The width of the upper surface of the packaging body is 0.3-3mm, length 2.7-8.7mm in one of the embodiments,.
The above-mentioned size design of upper surface can not only meet the needs of stable camera lens module, but also take into account the miniaturization of camera module simultaneously
Design.
The height of the packaging body is 0.2-2.5mm in one of the embodiments,.Above-mentioned height design can expire simultaneously
Foot encapsulation requires and Miniaturization Design.
The packaging body includes lateral wall in one of the embodiments, side wall and the envelope of first light hole
It is 0.5-5.5mm to fill the distance between external side wall.
In one of the embodiments, the side wall of first light hole between the packaging body lateral wall at a distance from be
0.93-2.14mm.The design of above-mentioned distance has taken into account structural strength and Miniaturization Design.
The packaging body includes the lower surface being oppositely arranged with the upper surface, Yi Jilian in one of the embodiments,
The lateral wall for being connected between the upper and lower surface and being oppositely arranged with the side wall of the light hole, the lateral wall is from institute
State following table and tilted towards the upper surface and extended, and the outer diameter of the packaging body is gradually reduced from bottom to top, the lateral wall with
The angle of optical axis is 0 ° -60 °.
The angle of the lateral wall and optical axis is 10 ° -30 ° in one of the embodiments,.The above-mentioned inclination angle of lateral wall
Degree is designed with conducive to the molding mold release of packaging body and avoids damage to packaging body.
The side wall of second light hole and the angle of optical axis are 3 ° -85 ° in one of the embodiments,.
The side wall of second light hole and the angle of optical axis are 20 ° -40 ° in one of the embodiments,.In this way,
Make the light for tilting extension to the optical axis direction of photosensitive element that can be reached along the second light hole while conducive to molding mold release
On photosensitive element, increase the thang-kng amount of the light hole, so improve the camera module equipped with the photosensory assembly at image quality
Amount.
Further include the conducting wire for connecting the photosensitive element and the substrate, the photosensitive member in one of the embodiments,
Part includes around the non-photo-sensing area of photosensitive area, and the packaging body packed part non-photo-sensing area simultaneously coats the conducting wire.In this way, encapsulation
Body portion takes shape in reduce the overall volume of the photosensory assembly on photosensitive element, and can avoid conducting wire be exposed to packaging body it is outer and
It is damaged.
Photosensitive area edge of the side wall of first light hole from the photosensitive element be most in one of the embodiments,
Small distance is 0.05mm.
Photosensitive area edge of the side wall of first light hole from the photosensitive element be most in one of the embodiments,
Small distance is 0.2mm.The setting of above-mentioned distance makes camera module be obtained between the two preferably in miniaturization and image quality
Balance.
A kind of camera module, including camera lens module and above-mentioned photosensory assembly, the camera lens module are located at the packaging body
Upper surface.
Description of the drawings
Fig. 1 is the sectional view for the photosensory assembly that an embodiment provides.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.Keep the understanding to the disclosure more saturating on the contrary, purpose of providing these embodiments is
It is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the Listed Items of pass.
As shown in Figure 1, a kind of photosensory assembly 600 of an embodiment of the present invention, including substrate 620, photosensitive element 640 and
Packaging body 660.
Wherein, photosensitive element 640 is set on substrate 620 and is electrically connected with substrate 620, and the photosensitive element 640 includes
Photosensitive area 6421.Packaging body 660 is packaged on substrate 620 and photosensitive element 640, including the close photosensitive element being oppositely arranged
640 lower surface 664 and the upper surface 662 of separate photosensitive element 640, packaging body 660, which is equipped with, runs through upper surface 662 and lower surface
664 light hole 168.Lateral wall of the packaging body 660 far from photosensitive element 640 is tilted from lower surface 664 to upper surface 662 to be prolonged
Stretch, and the outer diameter of packaging body 660 from lower surface 664 to 662 direction of upper surface along being gradually reduced, that is, packaging body 660 it is outer without leave
It is gradually reduced on down.
Specifically, light hole 668 includes the first light hole 6682 and the second light hole 6684 of connection, the first light hole
6682 side wall is extended vertically from photosensitive element 640 to 660 upper surface 662 of packaging body, and the side wall of the second light hole 6684 is from
The apical margin inclination of one light hole 6682 extends to the upper surface 662, and the internal diameter of the second light hole 6684 in this direction by
It is cumulative big.
Above-mentioned photosensory assembly 600, the sidewall slope extension and outer diameter due to the second light hole 6684 of packaging body 660 are remote
The light quantity for gradually increasing on direction from photosensitive element 640, therefore being radiated on photosensitive element 640 increases, to improve sense
The thang-kng amount of optical assembly 600.Moreover, the lateral wall of packaging body 660 and the side wall of the second light hole 6684 are oblique, it can be just
It in being used to form the molding mold release of packaging body 660, and avoids that packaging body 660 is caused to damage, finally improve equipped with should
The image quality of the camera module of photosensory assembly 600.
Further, since the side wall of the first light hole 6682 is vertically arranged with respect to photosensitive element 640, therefore can be in molded package
Removable barriers are set on photosensitive element 640 before body 660, the side wall of barriers can be supported in the first light hole 6682
Side wall on the material of packaging body 660 formed with blocking flow on photosensitive element 640, sealed to can avoid photosensitive element 640
It fills and is damaged in the forming process of body 660, and the overall construction intensity of the packaging body 660 also can be improved and be hardly damaged,
It plays a good protective effect, and other parts on the upper surface of packaging body 660 662 can be risen to photosensitive element 640
To firm supporting role.
The angle of lateral wall and optical axis of the packaging body 660 far from photosensitive element 640 is 0 ° -60 °, further preferably 10 ° -
30 °, to avoid damage to packaging body 660 conducive to the molding mold release of packaging body 660.
The side wall of second light hole 6684 and the angle of optical axis are 3 ° -85 °, further preferably 20 ° -40 °.Second thang-kng
Section of the hole 6684 in the plane perpendicular to photosensitive element 640 is at isosceles trapezoid.In this way, conducive to the same of molding mold release
When make to the optical axis direction of photosensitive element 640 tilt extend light can along the second light hole 6684 reach photosensitive element 640 along,
The thang-kng amount of the light hole 668 is increased, and then improves the image quality of the camera module equipped with the photosensory assembly 600.
In the present embodiment, substrate 620 is wiring board, may be, for example, hard circuit board, ceramic substrate (without soft board),
Or Rigid Flex, soft board.When substrate 620 is soft board, can be set in side of the substrate 620 far from photosensitive element 640
Stiffening plate (not shown) is set, to improve the intensity of substrate 620, to improve the overall construction intensity of the photosensory assembly 600.
Including photosurface 642 and back on the non-photo-sensing face that photosurface 642 is arranged, photosurface 642 includes photosensitive element 640
Photosensitive area 6421 and non-photo-sensing area 6422, and photosensitive area 6421 is located at 642 middle part of photosurface, non-photo-sensing area 6422 surrounds photosensitive area
6421 settings.
In one embodiment, the photosensory assembly further includes conducting wire 680, and the conducting wire 680 is electrically connected the photosensitive element
640 and the substrate 620.680 one end of the conducting wire is located at the non-photo-sensing area 6422, and the other end is located at the substrate 620, institute
It states 660 packed part non-photo-sensing area 6422 of packaging body and coats the conducting wire 680.In this way, 660 part of packaging body take shape in it is photosensitive
To reduce the overall volume of the photosensory assembly 600 on element 640, and can avoid conducting wire 680 be exposed to packaging body 660 it is outer and by
Damage.Wherein, conducting wire 680 can be gold thread, copper wire, aluminum steel or silver wire etc..Further, packaging body 660 is by being molded as
The mode of type is formed in substrate 620 and the packaging body 660.For example, using injection molding machine, by insert molding technique by substrate
620, which carry out molding, forms packaging body 660.Packaging body 660 after molding is securely connected with substrate 620, passes through glue with conventional stent
Layer bonding is compared, and the bonding force between packaging body 660 and substrate 620 is much greater.Specifically, it is formed and is encapsulated using Shooting Technique
The material of body 660 can be nylon, LCP (Liquid Crystal Polymer, polymeric liquid crystal copolymer) or PP
(Polypropylene, polypropylene) etc..It will be apparent to a skilled person that the aforementioned manufacture that can be selected with
And the material that can be selected, it is illustrative only the mode that can implement of the present invention, is not the limitation of the present invention.
Above-mentioned photosensory assembly 600 can have more while ensureing smaller size smaller to the optical axis direction of photosensitive element 640
Tilting the light extended can reach along the second light hole 6684 that sidewall slope is arranged on photosensitive element 640, to increase this
The thang-kng amount of light hole 668, to improve the image quality for the camera module for being equipped with the photosensory assembly 600.Also, it is radiated at
Light on the side wall of second light hole 6684 can be inclined by the reflection of the above-mentioned side wall of setting without reaching photosensitive element
640, to reduce influence of the reflection veiling glare to the image quality of the camera module equipped with the photosensitive element 640.Moreover, second
The side wall that the inclination of light hole 6684 extends can also be convenient for the molding mold release of packaging body 660, to avoid in knockout course
Middle damage packaging body 660.In addition, the photosensory assembly 600 can be improved in the part that packaging body 660 offers the first light hole 6684
Overall construction intensity provides preferable support for the part on the first surface 662 of packaging body 660.
The side wall of second light hole 6684 is equipped with protrusion 6684a.Raised 6684a can be serrated.In this way, the second thang-kng
Raised 6684a on hole 6684 forms multiple reflectings surface with reflection light, makes to be radiated on the side wall of the second light hole 6684
Light can be by reflective surface without reaching photosensitive element 640, to reduce reflection veiling glare to being equipped with the photosensitive element 640
Camera module image quality influence.
Further, the first light hole 6682 can be rounded, a diameter of 2-8mm, further preferred a diameter of 3-7mm.
Optionally, the first light hole 6682 can also be square, length 3-10mm, width 2.5-9.8mm, further excellent
The length of choosing is 4-7mm, width 3.5-6.5mm.The different shape of first light hole 6682 can match different type
Photosensitive element 640, and photosensitive element 640 is coordinated to obtain better photosensitive effect.In one embodiment, the first light hole 6682
Photosensitive area 6421 of the side wall from photosensitive element 640 edge minimum range L be 0.05mm, further preferably 0.2mm.If away from
Too small from L, the risk of the photosensitive area 6421 of the foreign materials aways such as potting resin photosensitive element 640 increases in encapsulation process, and is feeling
Foreign matter in light area 6421 will influence photosensitive area 6421 and receive the effect of incident light, and then influence image quality.If distance L mistakes
Greatly, on the one hand so that the volume increase of camera module, is unfavorable for minimizing, on the other hand can also make on photosensitive element 640
6422 stray light of non-photo-sensing area is more and influences image quality.The setting of above-mentioned distance L make camera module miniaturization and at
As quality obtains preferable balance between the two.
In one embodiment, the width W of the upper surface 662 of packaging body 660 is 0.3-3mm, and length is (perpendicular to drawing in Fig. 1
Dimension) be 2.7-8.7mm.The upper surface 662 can be used for carrying camera lens module, although the area of upper surface 662 increases energy
Enough increase the contact surface of carrying camera lens module, to promote the installation stable degree of camera lens module, but area crosses senior general's increase
The overall volume of camera module, cannot achieve Miniaturization Design.The size design of above-mentioned upper surface 662 can both meet stable mirror
The demand of head mould group, and the Miniaturization Design of camera module has been taken into account simultaneously.
In one embodiment, the height H of packaging body 660 is 0.2-2.5mm.The height H of the packaging body 660 should consider can
To form encapsulation to other electronic components on photosensitive element 640 or substrate 620, consider to take the photograph in short transverse increase again
As the volume of module.Above-mentioned height H designs can meet encapsulation requirement and Miniaturization Design simultaneously.
In one embodiment, the side wall of the first light hole 6682 distance T between 660 lateral wall of packaging body is 0.5-5.5mm,
Further preferably 0.93-2.14mm.Distance T can be understood as the thickness of packaging body 660.In some embodiments, packaging body
660 lateral wall is obliquely installed, thus thickness everywhere is inconsistent.Distance T sizes influence the structural strength of packaging body 660 and take the photograph
As the volume of module, if apart from excessive, though structural strength meets the requirements, volume is excessive, cannot meet Miniaturization Design；If
Distance T is too small, although disclosure satisfy that Miniaturization Design, structural strength is inadequate.It is strong that the design of above-mentioned distance T has taken into account structure
Degree and Miniaturization Design.
A kind of camera module (not shown) of present pre-ferred embodiments, including above-mentioned photosensory assembly 600, further include mirror
Head mould group, the camera lens module are located at the upper surface 662 of the packaging body 660.
Specifically, when that need to use tight shot, the camera lens module includes camera lens, and the camera lens is located at the packaging body
660 upper surface 662；When that need to use zoom lens, the camera lens module includes camera lens and is arranged the voice coil horse of the camera lens
It reaches, the voice coil motor is located at the upper surface 662 of the packaging body 660.Light is incident from camera lens and reaches photosensitive element 640
Photosurface 642, the photosensitive element 640 convert optical signals into electric signal.
Above-mentioned camera module, the photosensory assembly for including due to it is while with smaller volume with larger thang-kng
Amount, therefore the camera module has preferable image quality and smaller volume, is conducive to the intelligence for being equipped with the camera module
Equipment develops while ensureing image quality to lightening direction.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (18)
1. a kind of photosensory assembly, which is characterized in that including：
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensitive element includes photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body includes upper far from the photosensitive element
Surface, the packaging body are equipped with light hole, and the light hole is through photosensitive area described in the packaging body and face；
Wherein, the light hole includes the first light hole and the second light hole of connection, and the side wall of first light hole is from institute
It states photosensitive element to extend vertically to the packaging body upper surface, the side wall of second light hole is from the top of first light hole
Edge tilts the upper surface for extending to the packaging body, and the internal diameter of second light hole gradually increases in this direction, described
The side wall of second light hole is equipped with protrusion.
2. photosensory assembly according to claim 1, which is characterized in that the protrusion is zigzag.
3. photosensory assembly according to claim 1, which is characterized in that first light hole is rounded, a diameter of 2-
8mm。
4. photosensory assembly according to claim 3, which is characterized in that a diameter of 3-7mm of first light hole.
5. photosensory assembly according to claim 1, which is characterized in that first light hole is square, length 3-
10mm, width 2.5-9.8mm.
6. photosensory assembly according to claim 5, which is characterized in that the length of first light hole is 4-7mm, width
For 3.5-6.5mm.
7. photosensory assembly according to claim 5, which is characterized in that the width of the upper surface of the packaging body is 0.3-
3mm, length 2.7-8.7mm.
8. photosensory assembly according to claim 1, which is characterized in that the height of the packaging body is 0.2-2.5mm.
9. photosensory assembly according to claim 1, which is characterized in that the packaging body includes lateral wall, and described first is logical
The side wall of unthreaded hole between the packaging body lateral wall at a distance from be 0.5-5.5mm.
10. photosensory assembly according to claim 9, which is characterized in that the side wall of first light hole and the encapsulation
Distance between external side wall is 0.93-2.14mm.
11. photosensory assembly according to claim 1, which is characterized in that the packaging body includes opposite with the upper surface
The lower surface of setting, and be connected between the upper and lower surface and be oppositely arranged with the side wall of the light hole outer
Side wall, the lateral wall from the following table towards the upper surface tilt extend, and the outer diameter of the packaging body from bottom to top by
Decrescence small, the angle of the lateral wall and optical axis is 0 ° -60 °.
12. photosensory assembly according to claim 11, which is characterized in that the angle of the lateral wall and optical axis is 10 °-
30°。
13. photosensory assembly according to claim 1, which is characterized in that the folder of the side wall and optical axis of second light hole
Angle is 3 ° -85 °.
14. photosensory assembly according to claim 13, which is characterized in that the folder of the side wall and optical axis of second light hole
Angle is 20 ° -40 °.
15. according to the photosensory assembly described in claim 1~14 any one, which is characterized in that further include that connection is described photosensitive
The conducting wire of element and the substrate, the photosensitive element include around the non-photo-sensing area of photosensitive area, the packaging body packed part
Non-photo-sensing area simultaneously coats the conducting wire.
16. photosensory assembly according to claim 15, which is characterized in that the side wall of the first through hole is from the photosensitive member
The minimum range of the photosensitive area edge of part is 0.05mm.
17. photosensory assembly according to claim 15, which is characterized in that the side wall of first light hole is photosensitive from described
The minimum range of the photosensitive area edge of element is 0.2mm.
18. a kind of camera module, which is characterized in that the sense including camera lens module and as described in claim 1~17 any one
Optical assembly, the camera lens module are located at the upper surface of the packaging body.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710317509 | 2017-05-06 | ||
| CN2017103175092 | 2017-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108810344A true CN108810344A (en) | 2018-11-13 |
Family
ID=61334695
Family Applications (28)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720787619.0U Active CN206922905U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720787684.3U Active CN207184627U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720787578.5U Active CN206922904U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528974.0A Withdrawn CN108810346A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528955.8A Pending CN108810341A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
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Families Citing this family (8)
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| CN206922905U (en) * | 2017-05-06 | 2018-01-23 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN110164984B (en) * | 2018-02-13 | 2024-02-09 | 宁波舜宇光电信息有限公司 | Integrated photosensitive module, photosensitive assembly, camera module and preparation method |
| CN208572292U (en) * | 2018-03-18 | 2019-03-01 | 宁波舜宇光电信息有限公司 | Depth information camera module and its base assembly and electronic equipment |
| CN108769466B (en) * | 2018-05-30 | 2021-01-29 | 信利光电股份有限公司 | Camera module, manufacturing method and electronic equipment |
| TWI768127B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, optical image system and optical image capturing manufacture method |
| TWI768126B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, image system and optical image capturing manufacture method |
| TWI768128B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module and imaging system, manufacture method thereof |
| TWI754099B (en) * | 2018-09-21 | 2022-02-01 | 先進光電科技股份有限公司 | Optical image capturing module |
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Also Published As
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| CN207117777U (en) | 2018-03-16 |
| CN108810353A (en) | 2018-11-13 |
| CN108810342A (en) | 2018-11-13 |
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| CN206922905U (en) | 2018-01-23 |
| CN207184626U (en) | 2018-04-03 |
| CN207184628U (en) | 2018-04-03 |
| CN206922906U (en) | 2018-01-23 |
| CN206922907U (en) | 2018-01-23 |
| CN108810341A (en) | 2018-11-13 |
| CN206977548U (en) | 2018-02-06 |
| CN206977546U (en) | 2018-02-06 |
| CN108810347A (en) | 2018-11-13 |
| CN108810348A (en) | 2018-11-13 |
| CN207184627U (en) | 2018-04-03 |
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