CN108810350A - Camera module and its photosensory assembly - Google Patents
Camera module and its photosensory assembly Download PDFInfo
- Publication number
- CN108810350A CN108810350A CN201710529021.6A CN201710529021A CN108810350A CN 108810350 A CN108810350 A CN 108810350A CN 201710529021 A CN201710529021 A CN 201710529021A CN 108810350 A CN108810350 A CN 108810350A
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- China
- Prior art keywords
- light hole
- packaging body
- photosensory assembly
- photosensitive
- assembly according
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Abstract
The present invention relates to a kind of camera module and its photosensory assembly, photosensory assembly includes：Substrate；Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensory assembly includes photosensitive area and the non-photo-sensing area around the photosensitive area；And packaging body, it is set on the substrate and is equipped with perforative light hole；First light hole and the second light hole that the light hole includes connection and being arranged in ladder, the side wall of first light hole is extended vertically from photosensitive element to the upper surface of packaging body, the internal diameter of second light hole is more than the internal diameter of the first light hole, and second light hole gradually increase from bottom to top, the side wall of the second light hole is in the cambered surface being recessed inwardly.Above-mentioned photosensory assembly, since the diameter of the second light hole of packaging body gradually increases on the direction far from photosensitive element, the light quantity being radiated on photosensitive element increases.Moreover, the side wall of the second light hole is recessed inwardly, can be convenient for being used to form the molding mold release of packaging body.
Description
This application claims being submitted on May 6th, 2017, application No. is 201710317509.2, entitled " camera shootings
The priority of the Chinese patent application of module and its photosensory assembly ".
Technical field
The present invention relates to camera module fields, more particularly to a kind of camera module and its photosensory assembly.
Background technology
With the fast development of various smart machines, the smart machine for being integrated with camera module is improving the same of image quality
When, also increasingly as lightening direction is developed.And improve image quality mean the specification of electronic component constantly increase, quantity
It is on the increase, largely influences also constantly increasing for the area of the photosensitive element of image quality, therefore cause camera module
Assembling difficulty constantly increase, overall dimensions also constantly increase, therefore the lightening of camera module receives very big limitation, into
And limit the volume of the smart machine equipped with the camera module.
The camera module packaging technology generally used now is COB (Chip On Board) packaging technology, that is, camera shooting mould
Wiring board, photosensitive element, the holder etc. of group are made into respectively, then successively by passive electronic component, photosensitive element and holder
Encapsulation is in the circuit board.
However use above-mentioned molded method, it usually needs light hole is formed by supporting structure, is on wiring board
Sensitive chip provide passage of light.But currently, due to light be determine equipped with the photosensory assembly camera module at image quality
An important factor for amount, and current holder shape limits the size of thang-kng amount, reduces thang-kng amount and affects camera module
Image quality.
Invention content
Based on this, it is necessary to lead to because of fault of construction that thang-kng amount is smaller, not easy mold release for the light hole of photosensory assembly
The problem of, the camera module and its photosensory assembly of a kind of larger, the easy demoulding of thang-kng amount are provided.
A kind of photosensory assembly, including：
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, the photosensory assembly include photosensitive area and
Around the non-photo-sensing area of the photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body includes far from the photosensitive element
Upper surface, the packaging body is equipped with light hole, and the light hole is through photosensitive area described in the packaging body and face；
Wherein, the light hole includes the first light hole and the second light hole of connection, first light hole and described
Second light hole is arranged in ladder, and the side wall of first light hole hangs down from the photosensitive element to the upper surface of the packaging body
Straight to extend, the internal diameter of second light hole is more than the internal diameter of first light hole, and second light hole is from bottom to top
Gradually increase, the side wall of second light hole is in the cambered surface being recessed inwardly.
Above-mentioned photosensory assembly, since the internal diameter of the second light hole of packaging body gradually increases on the direction far from photosensitive element
Greatly, therefore it is radiated at the increase of the light quantity on photosensitive element, to improve the thang-kng amount of photosensory assembly.Moreover, the second light hole
Side wall be in the cambered surface that is recessed inwardly, can be convenient for being used to form the molding mold release of packaging body, and avoid causing packaging body
Damage, finally improves the image quality of the camera module equipped with the photosensory assembly.
In addition, when the side wall of the second light hole is recessed inwardly, it can be in the structural strength for ensureing the packaging body to play support
While with protective effect, reduces material utilization amount and reduce material cost.Moreover, the side wall smoothly extended can be de- convenient for mold
Packaging body is avoided damage to while mould.
Further, second light hole is arranged in ladder with first light hole and forms step surface, can protect
It demonstrate,proves the packaging body and saves material utilization amount while there is certain supporting role to support the part placed thereon.Also, when encapsulation
When installing other parts by glue on body, the glue overflowed between part and upper surface can flow on step surface and can avoid
Glue is flowed directly on photosensitive element and damages photosensitive element.
The radius of the cambered surface is 0.02-0.5mm in one of the embodiments,.The setting of above-mentioned radius has taken into account de-
Mould avoids damage to packaging body and reduces consider of both material utilization amount.
First light hole is rounded in one of the embodiments, a diameter of 2-8mm.
First light hole is square in one of the embodiments, length 3-10mm, width 2.5-9.8mm.
The different shape of first light hole can match different types of photosensitive element, and photosensitive element is coordinated preferably to be felt
Light effect.
The width of the upper surface of the packaging body is 0.3-3mm, length 2.7-8.7mm in one of the embodiments,.
The above-mentioned size design of upper surface can not only meet the needs of stable optical component, but also take into account the miniaturization of camera module simultaneously
Design.
The height of the packaging body is 0.35-1.7mm in one of the embodiments,.Above-mentioned height design can be simultaneously
Meet encapsulation requirement and Miniaturization Design.
The packaging body includes lateral wall in one of the embodiments, the side wall and packaging body of first light hole
Distance between lateral wall is 0.5-5.5mm.The design of above-mentioned distance has taken into account structural strength and Miniaturization Design.
Step surface is formed between first light hole and second light hole in one of the embodiments, it is described
The width of step surface is 0.2-0.6mm.The setting of above-mentioned width has taken into account the structural strength of packaging body and has prevented glue overflow
Effect.
The packaging body includes the lower surface being oppositely arranged with the upper surface, Yi Jilian in one of the embodiments,
The lateral wall for being connected between the upper and lower surface and being oppositely arranged with the side wall of the light hole, the lateral wall is from institute
State following table and tilted towards the upper surface and extended, and the outer diameter of the packaging body is gradually reduced from bottom to top, the lateral wall with
Angle between optical axis is 0 ° -60 °.
The angle between the lateral wall and optical axis is 10 ° -30 ° in one of the embodiments,.The above-mentioned of lateral wall inclines
Rake angle is designed with conducive to the molding mold release of packaging body and avoids damage to packaging body.
Further include the conducting wire for connecting the photosensitive element and the substrate, the packaging body in one of the embodiments,
Packed part non-photo-sensing area simultaneously coats the conducting wire.In this way, encapsulation body portion takes shape on photosensitive element to reduce this photosensitive group
The overall volume of part, and can avoid conducting wire and be exposed to outside packaging body and be damaged.
Photosensitive area edge of the side wall of first light hole from the photosensitive element be most in one of the embodiments,
Small distance is 0.05mm.
Photosensitive area edge of the side wall of first light hole from the photosensitive element be most in one of the embodiments,
Small distance is 0.2mm.The setting of above-mentioned distance makes camera module be obtained between the two preferably in miniaturization and image quality
Balance.
A kind of camera module, including camera lens module and above-mentioned photosensory assembly, the camera lens module are located at the packaging body
Upper surface.
Description of the drawings
Fig. 1 is the sectional view for the photosensory assembly that one embodiment of the invention provides.
Specific implementation mode
To facilitate the understanding of the present invention, below with reference to relevant drawings to invention is more fully described.In attached drawing
Give the preferred embodiment of the present invention.But the present invention can realize in many different forms, however it is not limited to herein
Described embodiment.Keep the understanding to the disclosure more saturating on the contrary, purpose of providing these embodiments is
It is thorough comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article and belong to the technical field of the present invention
The normally understood meaning of technical staff is identical.Used term is intended merely to description tool in the description of the invention herein
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more phases
Any and all combinations of the Listed Items of pass.
As shown in Figure 1, a kind of photosensory assembly 400 of an embodiment of the present invention, including substrate 420, photosensitive element 440 and
Packaging body 460.
Wherein, photosensitive element 440 is set on substrate 420 and is electrically connected with substrate 420.Packaging body 460 is set to substrate 420
And on the photosensitive element 440, including the lower surface 464 of close photosensitive element 440 that is oppositely arranged and far from photosensitive element 440
Upper surface 462, packaging body 460 be equipped with through upper surface 462 and lower surface 464 light hole 468.Packaging body 460 is far from sense
The lateral wall of optical element 440 tilts extension from lower surface 464 to upper surface 462, and the outer diameter of packaging body 460 is along from lower surface
464 are gradually reduced to 462 direction of upper surface.
Specifically, light hole 468 includes the first light hole 4682 and the second light hole 4684 of connection, the first light hole
4682 and second light hole 4684 be arranged in ladder, the internal diameter of second light hole 4684 is more than first light hole 4682
Internal diameter.The side wall of first light hole 4682 is extended vertically from photosensitive element 440 to the upper surface 462 of the packaging body 460, the
Two light holes 1684 gradually increase from bottom to top, and the side wall of second light hole 4684 is in the cambered surface being recessed inwardly.
Above-mentioned photosensory assembly 400, due to the side wall of the second light hole 4684 of packaging body 460 be in the cambered surface that is recessed inwardly and
Internal diameter gradually increases on the direction far from photosensitive element 440, therefore the light quantity being radiated on photosensitive element 440 increases, to
Improve the thang-kng amount of photosensory assembly 400.And second the side wall of light hole 4684 be recessed inwardly, can ensure the packaging body
While 460 structural strength is to play support with protective effect, reduces material utilization amount and reduce material cost.In addition, smooth
The side wall of extension can avoid damage to packaging body 460 while convenient for mold releasability.
Furthermore it, can be in molded package since the side wall of the first light hole 4682 is vertically arranged with respect to photosensitive element 440
Removable barriers are set on photosensitive element 440 before body 460, the side wall of barriers can be supported in the first light hole 4682
Side wall on the material of packaging body 460 formed with blocking flow on photosensitive element 440, sealed to can avoid photosensitive element 440
It fills and is damaged in the forming process of body 460, and the overall construction intensity of the packaging body 460 also can be improved and be hardly damaged,
It plays a good protective effect, and other parts on the upper surface of packaging body 460 462 can be risen to photosensitive element 440
To firm supporting role.
Lateral wall of the packaging body 460 far from photosensitive element 440 is relatively orthogonal to direction (the i.e. optical axis of photosensitive element 440
Direction) inclination angle alpha be 0-60 °, further preferably 10 ° -30 °, to conducive to packaging body 460 molding mold release and
Avoid damage to packaging body 460.
In the present embodiment, substrate 420 is wiring board, may be, for example, hard circuit board, ceramic substrate (without soft board),
Or Rigid Flex, soft board.When substrate 420 is soft board, can be set in side of the substrate 420 far from photosensitive element 440
Stiffening plate (not shown) is set, to improve the intensity of substrate 420, to improve the overall construction intensity of the photosensory assembly 400.
Including photosurface 442 and back on the non-photo-sensing face that photosurface 442 is arranged, photosurface 442 includes photosensitive element 440
Photosensitive area 4421 and non-photo-sensing area 4422, and photosensitive area 4421 is located at 442 middle part of photosurface, non-photo-sensing area 4422 surrounds photosensitive area
Setting.
In one embodiment, 4422 part of non-photo-sensing area is embedded in packaging body 460 and is electrically connected to base by conducting wire 480
Plate 420, and conducting wire 480 is contained in completely in packaging body 460.In this way, 460 part of packaging body take shape on photosensitive element 440 with
Reduce the overall volume of the photosensory assembly 400, and can avoid conducting wire 480 and be exposed to outside packaging body 460 and be damaged.Wherein,
Conducting wire 480 can be gold thread, copper wire, aluminum steel or silver wire etc..
Further, packaging body 460 is formed in substrate 420 by molded mode.For example, using injection molding machine, lead to
Cross insert molding technique by substrate 420 carry out molding form packaging body 460.Packaging body 460 after molding and 420 secured phase of substrate
Even, compared with conventional stent is bonded by glue-line, the bonding force between packaging body 460 and substrate 420 is much greater.Specifically,
It can be nylon, LCP (Liquid Crystal Polymer, liquid crystal polymer to use Shooting Technique to form the material of packaging body 460
Polymer) or PP (Polypropylene, polypropylene) etc..It can be selected it will be apparent to a skilled person that aforementioned
Manufacture and the material that can be selected are illustrative only the mode that can implement of the present invention, are not the present invention
Limitation.
The internal diameter of second light hole 4684 is more than the internal diameter of the first light hole 4682, and then in the second light hole 4684 and the
Step surface 461 is formed between one light hole 4682.In this way, can have certain supporting role to support ensureing the packaging body 460
Material utilization amount is saved while the part placed thereon.Also, when installing other parts by glue on packaging body 460, from
The glue overflowed between part and upper surface 462 can flow on step surface 461 and can avoid glue and be flowed directly to photosensitive element 440
Above damage photosensitive element 440.The width D of above-mentioned step surface 461 is 0.2-0.6mm, preferably 0.5mm.If width D is excessive,
The intensity that packaging body 460 corresponds at the second light hole 4682 will be influenced to will be unable to play a supporting role and keep away if width D is too small
Exempt from the effect of glue damage photosensitive element 440, the setting of above-mentioned width D has taken into account the structural strength of packaging body 460 and prevented glue
The effect of water overflow.
Further, the first light hole 4682 can be rounded, a diameter of 2-8mm, preferred a diameter of 6.68mm.
Optionally, the first light hole 4682 can also be square, length 3-10mm, width 2.5-9.8mm, preferred long
Degree is 5.72mm, width 4.41mm.In one embodiment, the side wall of first light hole 4682 is from photosensitive element 440
4421 edge minimum range L of photosensitive area is 0.05mm, preferably 0.2mm.If distance L is too small, potting resin in encapsulation process
The risk of the photosensitive area 4421 of equal foreign materials aways photosensitive element 440 increases, and the foreign matter on photosensitive area 4421 will influence it is photosensitive
Area 4421 receives the effect of incident light, and then influences image quality.If distance L is excessive, on the one hand so that the volume of camera module
Increase, be unfavorable for minimizing, on the other hand can also so that 4422 stray light of non-photo-sensing area on photosensitive element 440 is more and influences
Image quality.The setting of above-mentioned distance makes camera module obtain preferable balance between the two in miniaturization and image quality.
In one embodiment, the width W of the upper surface 462 of packaging body 460 is 0.3-3mm, preferably 1.65mm, length (Fig. 1
In perpendicular to drawing dimension) be 2.7-8.7mm, preferably 7.6mm.The upper surface 462 can be used for carrying optical module, though
The area increase of right upper surface 462 can be such that the contact surface of carrying optical module increases, steady to the installation of improving optical component
Soundness, but area crosses the overall volume that senior general increases camera module, cannot achieve Miniaturization Design.Above-mentioned upper surface 462
Size design can not only meet the needs of stable optical component, but also take into account the Miniaturization Design of camera module simultaneously.
In one embodiment, the height H of packaging body 460 is 0.35-1.7mm, preferably 0.71mm.The packaging body 460
Height H should consider can to other electronic components on photosensitive element 440 or substrate 420 formed encapsulate, consider again not
The volume of camera module can be increased in short transverse.Above-mentioned height H designs can meet encapsulation requirement and Miniaturization Design simultaneously.
In one embodiment, the side wall of the first light hole 4682 distance T between 460 lateral wall of packaging body is 0.5-
5.5mm, preferably 1.95mm.Distance T can be understood as the thickness of packaging body 460.In some embodiments, packaging body 460
Lateral wall is obliquely installed, thus thickness everywhere is inconsistent.Distance T sizes influence the structural strength and camera shooting mould of packaging body 460
The volume of group, if distance T is excessive, though structural strength meets the requirements, volume is excessive, cannot meet Miniaturization Design；If away from
Too small from T, although disclosure satisfy that Miniaturization Design, structural strength is inadequate.The design of above-mentioned distance T has taken into account structural strength
And Miniaturization Design.
In one embodiment, the cambered surface radius r that the side wall of the second light hole 4684 is recessed inwardly is 0.02-0.5mm, preferably
0.2mm.It is unfavorable instead to demoulding if above-mentioned radius r is too small, if excessive, with flat setting without larger difference, reduce material and use
The effect unobvious of amount.The setting of above-mentioned radius r has taken into account demoulding and has avoided damage to packaging body 460 and reduce two aspect of material utilization amount
The considerations of.
A kind of camera module (not shown) of present pre-ferred embodiments, including above-mentioned photosensory assembly 400, further include mirror
Head mould group.
Specifically, when that need to use tight shot, the camera lens module includes camera lens, and the camera lens is located at the upper surface
462；When that need to use zoom lens, the camera lens module includes camera lens and the voice coil motor for being arranged the camera lens, the voice coil
Motor is located at the upper surface 462.Light is incident from camera lens and reaches the photosurface 442 of photosensitive element 440, photosensitive element 440
Convert optical signals into electric signal.
Above-mentioned camera module, the photosensory assembly for including due to it is while with smaller volume with larger thang-kng
Amount, therefore the camera module has preferable image quality and smaller volume, is conducive to the intelligence for being equipped with the camera module
Equipment develops while ensureing image quality to lightening direction.
Each technical characteristic of embodiment described above can be combined arbitrarily, to keep description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (14)
1. a kind of photosensory assembly, which is characterized in that including：
Substrate；
Photosensitive element is set on the substrate and is electrically connected with the substrate, and the photosensory assembly includes photosensitive area and surrounds
The non-photo-sensing area of the photosensitive area；And
Packaging body is packaged on the substrate and the photosensitive element, and the packaging body includes upper far from the photosensitive element
Surface, the packaging body are equipped with light hole, and the light hole is through photosensitive area described in the packaging body and face；
Wherein, the light hole includes the first light hole and the second light hole of connection, first light hole and described second
Light hole is arranged in ladder, and the side wall of first light hole vertically prolongs from the photosensitive element to the upper surface of the packaging body
It stretches, the internal diameter of second light hole is more than the internal diameter of first light hole, and second light hole is gradual from bottom to top
Increase, the side wall of second light hole is in the cambered surface being recessed inwardly.
2. photosensory assembly according to claim 1, which is characterized in that the radius of the cambered surface is 0.02-0.5mm.
3. photosensory assembly according to claim 1, which is characterized in that first light hole is rounded, a diameter of 2-
8mm。
4. photosensory assembly according to claim 1, which is characterized in that first light hole is square, length 3-
10mm, width 2.5-9.8mm.
5. photosensory assembly according to claim 4, which is characterized in that the width of the upper surface of the packaging body is 0.3-
3mm, length 2.7-8.7mm.
6. photosensory assembly according to claim 1, which is characterized in that the height of the packaging body is 0.35-1.7mm.
7. photosensory assembly according to claim 1, which is characterized in that the packaging body includes lateral wall, and described first is logical
The side wall of unthreaded hole between packaging body lateral wall at a distance from be 0.5-5.5mm.
8. photosensory assembly according to claim 1, which is characterized in that first light hole and second light hole it
Between form step surface, the width of the step surface is 0.2-0.6mm.
9. photosensory assembly according to claim 1, which is characterized in that the packaging body includes sets opposite with the upper surface
The lower surface set, and the outside that is connected between the upper and lower surface and is oppositely arranged with the side wall of the light hole
Wall, the lateral wall, which is tilted from the following table towards the upper surface, to be extended, and the outer diameter of the packaging body is gradual from bottom to top
Reduce, the angle between the lateral wall and optical axis is 0 ° -60 °.
10. photosensory assembly according to claim 9, which is characterized in that the angle between the lateral wall and optical axis is
10°-30°。
11. according to the photosensory assembly described in claim 1~10 any one, which is characterized in that further include that connection is described photosensitive
The conducting wire of element and the substrate, the packaging body packed part non-photo-sensing area simultaneously coat the conducting wire.
12. photosensory assembly according to claim 11, which is characterized in that the side wall of first light hole is photosensitive from described
The minimum range of the photosensitive area edge of element is 0.05mm.
13. photosensory assembly according to claim 11, which is characterized in that the side wall of first light hole is photosensitive from described
The minimum range of the photosensitive area edge of element is 0.2mm.
14. a kind of camera module, which is characterized in that the sense including camera lens module and as described in claim 1~13 any one
Optical assembly, the camera lens module are located at the upper surface of the packaging body.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2017103175092 | 2017-05-06 | ||
| CN201710317509 | 2017-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108810350A true CN108810350A (en) | 2018-11-13 |
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| CN201720787681.XU Active CN207184626U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720787684.3U Active CN207184627U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710529021.6A Pending CN108810350A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528985.9A Pending CN108810349A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528982.5A Withdrawn CN108810348A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528978.9A Withdrawn CN108810347A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528974.0A Withdrawn CN108810346A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528955.8A Pending CN108810341A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528972.1A Withdrawn CN108810345A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720790443.4U Active CN206977547U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
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| CN201710528971.7A Pending CN108810344A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720790444.9U Active CN206977548U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
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| CN201720787643.4U Active CN206922906U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710529126.1A Withdrawn CN108810351A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528965.1A Pending CN108810342A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201710528967.0A Withdrawn CN108810343A (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
| CN201720790460.8U Active CN206977550U (en) | 2017-05-06 | 2017-07-01 | Camera module and its photosensory assembly |
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| CN207184628U (en) * | 2017-05-06 | 2018-04-03 | 南昌欧菲光电技术有限公司 | Camera module and its photosensory assembly |
| CN110164984B (en) * | 2018-02-13 | 2024-02-09 | 宁波舜宇光电信息有限公司 | Integrated photosensitive module, photosensitive assembly, camera module and preparation method |
| CN208572292U (en) * | 2018-03-18 | 2019-03-01 | 宁波舜宇光电信息有限公司 | Depth information camera module and its base assembly and electronic equipment |
| CN108769466B (en) * | 2018-05-30 | 2021-01-29 | 信利光电股份有限公司 | Camera module, manufacturing method and electronic equipment |
| TWI768126B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, image system and optical image capturing manufacture method |
| TWI768127B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module, optical image system and optical image capturing manufacture method |
| TWI768128B (en) * | 2018-09-21 | 2022-06-21 | 先進光電科技股份有限公司 | Optical image capturing module and imaging system, manufacture method thereof |
| TWI754099B (en) * | 2018-09-21 | 2022-02-01 | 先進光電科技股份有限公司 | Optical image capturing module |
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| CN206977546U (en) | 2018-02-06 |
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| CN207184628U (en) | 2018-04-03 |
| CN206977551U (en) | 2018-02-06 |
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