CN110022424B - Camera module and photosensitive assembly and manufacturing method thereof - Google Patents

Camera module and photosensitive assembly and manufacturing method thereof Download PDF

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Publication number
CN110022424B
CN110022424B CN201910061810.0A CN201910061810A CN110022424B CN 110022424 B CN110022424 B CN 110022424B CN 201910061810 A CN201910061810 A CN 201910061810A CN 110022424 B CN110022424 B CN 110022424B
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China
Prior art keywords
photosensitive
camera module
circuit board
main body
chip
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CN201910061810.0A
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CN110022424A (en
Inventor
田中武彦
赵波杰
王明珠
梅其敏
丁亮
蒋恒
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Ningbo Sunny Opotech Co Ltd
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Ningbo Sunny Opotech Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G02B13/0015—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design
    • G02B13/002—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface
    • G02B13/004—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras characterised by the lens design having at least one aspherical surface having four lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0075—Arrays characterized by non-optical structures, e.g. having integrated holding or alignment means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/006—Filter holders
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/021—Mountings, adjusting means, or light-tight connections, for optical elements for lenses for more than one lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14636—Interconnect structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Human Computer Interaction (AREA)
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  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)

Abstract

The invention provides a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the photosensitive assembly of the module comprises a packaging part; a light sensing portion and a support; the light sensing part comprises a circuit board main body and a light sensing chip, and the packaging part is packaged and molded on the circuit board main body and the light sensing chip; the packaging part is provided with a through hole which is opposite to the photosensitive chip so as to provide a light path of the photosensitive chip; the bracket is mounted to the enclosure.

Description

Camera module and photosensitive assembly and manufacturing method thereof
Technical Field
The invention relates to the field of camera modules, in particular to a camera module, a photosensitive assembly and a manufacturing method thereof.
Background
The COB (Chip On Board) process is an extremely important process in the assembly and manufacturing process of the camera module. What the module of making a video recording that traditional COB technology was made is that circuit board, sensitization chip, microscope base, motor drive and assembled through parts such as camera lens.
Fig. 1 is a schematic view of a camera module manufactured by a conventional COB process. The camera module comprises a circuit board 1P, a photosensitive chip 2P, a bracket 3P, an optical filter 4P, a motor 5P and a lens 6P. The photosensitive chip 2P is mounted on the circuit board 1P, the filter 4P is mounted on the bracket 3P, the lens 6P is mounted on the motor 5P, and the motor 5P is mounted on the bracket 3P, so that the lens 6P is located on a photosensitive path of the photosensitive chip 2P.
It is worth mentioning that some circuit devices 11P, such as resistors, capacitors, etc., are usually mounted on the circuit board 1P, these circuit devices 11P protrude from the surface of the circuit board 1P, and the bracket 3P needs to be mounted on the circuit board 1P with the circuit devices 11P, whereas the assembly and matching relationship among the circuit board 1P, the circuit devices 11P and the bracket 3P in the conventional COB process has some disadvantages and limits the development of the camera module towards lightness and thinness to some extent.
It is also worth mentioning that the photosensitive chip is usually electrically connected to the circuit board by some gold wires 21P, so as to facilitate information transmission between the photosensitive chip 2P and the circuit board 1P. Based on the characteristics and structure of the gold wire 21P, the gold wire 21P is usually curved in an arc shape and protrudes from the surface of the circuit board, so that the assembling process of the photosensitive chip is also the same as the circuit device 11P, and similar influence factors exist on the camera module.
Specifically, firstly, the circuit device 11P and the gold wires 21P are directly exposed on the surface of the circuit board 1P, so that in the subsequent assembling process, for example, the processes of attaching the bracket 3P and soldering the motor 5P, inevitably affected, solder resist, dust and the like during soldering are easily adhered to the circuit device 11P, and the circuit device 11P and the photosensitive chip 2P are located in a space communicated with each other, so that dust and contaminants easily affect the photosensitive chip 2P, which may cause the assembled camera module to have bad phenomena such as black spots and the like, thereby reducing the product yield.
Secondly, the bracket 3P is located outside the circuit device 11P, so that when the bracket 3P and the circuit board 1P are mounted, a certain safety distance needs to be reserved between the bracket 3P and the circuit device 11P, and a safety distance needs to be reserved in both the horizontal direction and the upward direction, which increases the requirement of the thickness of the camera module to some extent, and makes it difficult to reduce the thickness.
Thirdly, in the process of assembling the COB, the bracket 3P or the motor 5P is adhered to the circuit board 1P by an adhesive such as glue, in the pasting process, an AA (Active alignment) process is usually performed, that is, the central axes of the photosensitive chip 2P and the lens 6P are adjusted to be consistent with each other in the horizontal direction and the vertical direction, therefore, in order to satisfy the AA process, more glue needs to be preset between the bracket 3P and the circuit board 1P and between the lens base and the motor 5P, so that an adjustment space is left between each other, on one hand, the requirement increases the thickness requirement of the camera module to a certain extent, so that the thickness of the camera module is difficult to reduce, on the other hand, the inclination of the assembly is easy to be inconsistent due to multiple pasting and assembling processes, and the requirement on the flatness of the lens holder 3P, the circuit board 1P and the motor 5P is high.
In addition, in the conventional COB process, the circuit board 1P provides the most basic fixing and supporting carrier, and therefore, a certain structural strength is required for the circuit board 1P, and this requirement makes the circuit board 1P have a larger thickness, thereby pre-adding the thickness requirement of the camera module.
Along with the development of various electronic products and intelligent equipment, the camera module is also developing towards higher performance and lighter and thinner, and in the face of the development requirements of various high performances such as high pixel and high imaging quality, more and more electronic components and devices are arranged in the circuit, the area of the chip is larger and larger, and the number of passive components such as driving resistors and capacitors is correspondingly increased, so that the specification of the electronic components is larger and larger, the assembly difficulty is increased continuously, and the overall size of the camera module is larger and larger.
Disclosure of Invention
The invention aims to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the photosensitive assembly comprises a packaging part and a photosensitive part, and the packaging part is packaged and molded on the photosensitive part.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a method for manufacturing the same, wherein the photosensitive portion includes a photosensitive chip and a circuit board main body, the photosensitive chip is electrically connected to the circuit board main body through at least one connecting wire, and the packaging portion covers the connecting wire so as not to be directly exposed to the outside.
The invention aims to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the connecting wire is integrally wrapped inside the packaging part in a molding manufacturing mode.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a method for manufacturing the same, wherein the photosensitive assembly includes at least one circuit element, and the circuit element is encapsulated in the encapsulation portion so as not to be directly exposed to the outside.
The invention aims to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the circuit element is integrally wrapped inside the packaging part in a molding manufacturing mode.
The invention aims to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the photosensitive chip is provided with a photosensitive area and a non-photosensitive area, the packaging part is molded in the non-photosensitive area of the photosensitive chip, and the length and width dimensions of the photosensitive assembly and the camera module assembled by the photosensitive assembly are reduced.
The invention aims to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the circuit board main body is provided with an inner groove, and the photosensitive chip is arranged in the inner groove, so that the height requirement on the packaging part is reduced.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the package portion includes a covering section and a filter mounting section, the filter mounting section is integrally molded with the covering section, and the filter mounting section is adapted to be mounted with a filter, so that an additional filter mounting bracket is not required.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the photosensitive assembly includes an optical filter, and the optical filter is disposed over the photosensitive chip in a molding manner, so that the photosensitive chip is protected by the optical filter, and a back focus of the camera module assembled by the optical filter can be reduced, so that the height of the camera module is smaller.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a manufacturing method thereof, wherein the photosensitive assembly includes a reinforcing layer, and the reinforcing layer is laminated on the bottom side of the circuit board main body, so as to increase the structural strength of the circuit board main body, facilitate the adoption of the circuit board main body with smaller thickness, and improve the heat dissipation capability of the circuit board main body.
The invention aims to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the circuit main body is provided with at least one reinforcing hole, and the packaging part extends into the reinforcing hole, so that the bonding force between the packaging part and the photosensitive assembly is enhanced, and the structural strength of the circuit main body is enhanced.
An object of the present invention is to provide a camera module, a photosensitive assembly thereof and a method for manufacturing the same, wherein the packaging portion is adapted to be mounted with a motor or a lens, and can be used as a conventional bracket to provide a supporting and fixing position for the motor or the lens, and the packaging portion has better flatness due to the molding advantage of the packaging portion, thereby reducing the assembling tilt error of the camera module.
The invention aims to provide a camera module, a photosensitive assembly and a manufacturing method thereof, wherein the camera module is assembled and manufactured in a molding mode, so that the traditional COB process of the camera module is changed.
The invention aims to provide a camera module, a photosensitive assembly and a manufacturing method thereof, which adopt a molding mode to manufacture the photosensitive line assembly so as to obtain the molded and integrated photosensitive assembly.
To achieve the above objects and other objects and advantages in accordance with the purpose of the invention, a photosensitive assembly of a camera module according to an aspect of the invention includes: a packaging part and a light sensing part; the light sensing part comprises a circuit board main body and a light sensing chip, and the packaging part is packaged and molded on the circuit board main body and the light sensing chip.
According to an embodiment of the present invention, a through hole is formed in the encapsulation portion of the photosensitive assembly, and the through hole is opposite to the photosensitive chip to provide a light path for the photosensitive chip.
According to an embodiment of the present invention, the bottom of the through hole of the encapsulation portion in the photosensitive assembly is inclined and gradually increases from bottom to top.
According to an embodiment of the present invention, the top end of the packaging portion of the photosensitive assembly is suitable for mounting a lens, a motor or an optical filter of the camera module.
According to an embodiment of the present invention, the top end of the encapsulating portion of the photosensitive assembly is planar for mounting a lens, a motor or a filter of the camera module.
According to an embodiment of the present invention, the top end of the packaging portion of the photosensitive assembly has an installation groove, and the installation groove is communicated with the through hole for installing the optical filter, the lens or the motor of the camera module.
According to an embodiment of the present invention, the encapsulation portion of the photosensitive assembly includes a cladding section, a filter mounting section and a lens mounting section, the filter mounting section and the lens mounting section are sequentially molded and extended upward from the cladding section, and the interior of the filter mounting section and the lens mounting section are stepped, so as to facilitate mounting of the filter and the lens of the camera module. According to an embodiment of the present invention, the lens mounting section of the photosensitive assembly has a lens inner wall, and the surface of the lens inner wall is flat and suitable for mounting a non-threaded lens.
According to an embodiment of the present invention, the lens mounting section of the photosensitive assembly has a lens inner wall, and the surface of the lens inner wall has threads to fit a lens with threads.
According to an embodiment of the present invention, the photosensitive portion of the photosensitive assembly includes at least one connecting wire, each connecting wire electrically connects the photosensitive chip and the circuit board main body, and the encapsulating portion encapsulates the connecting wire, so that the connecting wire is not directly exposed to the outside.
According to an embodiment of the present invention, the connecting line in the photosensitive element is selected from a group consisting of: gold, silver, copper or aluminum wires.
According to an embodiment of the present invention, the connecting line of the photosensitive assembly connects the circuit board main body and the photosensitive chip in an arc shape.
According to an embodiment of the present invention, the photosensitive chip in the photosensitive assembly includes a photosensitive region and a non-photosensitive region, the non-photosensitive region surrounds a periphery of the photosensitive region, and the encapsulation portion is molded to extend to the non-photosensitive region of the photosensitive chip, so as to extend an inward moldable range of the encapsulation portion and reduce a peripheral dimension of the encapsulation portion.
According to an embodiment of the present invention, the light sensing portion of the light sensing assembly includes at least one circuit element, the circuit element protrudes from the circuit board main body, and the encapsulation portion encapsulates the circuit element, so that the circuit element is not directly exposed to the outside.
According to an embodiment of the present invention, the circuit elements in the photosensitive assembly are selected to combine: one or more of a resistor, a capacitor, a diode, a triode, a potentiometer, a relay and a relay.
According to an embodiment of the present invention, the light sensing portion of the light sensing assembly includes a light filter covering the light sensing chip, and the packaging portion is formed on the circuit board main body, the light sensing chip and the light filter, so as to protect the light sensing chip through the light filter, and reduce the back focus of the camera module, thereby reducing the height of the camera module.
According to an embodiment of the present invention, the light sensing portion of the light sensing assembly includes a reinforcing layer, and the reinforcing layer is laminated on the bottom of the circuit board body to enhance the structural strength of the circuit board body.
According to an embodiment of the present invention, the reinforcement layer in the photosensitive assembly is a metal plate to enhance the heat dissipation performance of the photosensitive portion.
According to an embodiment of the invention, the photosensitive part in the photosensitive assembly comprises a shielding layer, and the shielding layer wraps the circuit board main body and the packaging part so as to enhance the anti-electromagnetic interference performance of the photosensitive assembly.
According to an embodiment of the present invention, the shielding layer in the photosensitive assembly is a metal plate or a metal mesh.
According to an embodiment of the invention, the circuit board main body of the photosensitive assembly is provided with at least one reinforcing hole, and the encapsulating part extends into the reinforcing hole so as to enhance the structural strength of the circuit board main body.
According to an embodiment of the present invention, the reinforcing holes in the photosensitive assembly are groove-shaped.
According to an embodiment of the invention, the reinforcing holes in the photosensitive assembly are through holes, so that the molding material of the packaging part is in full contact with the circuit board main body, and the photosensitive assembly is easy to manufacture.
According to an embodiment of the present invention, the material of the circuit board body in the photosensitive assembly may be selected from the group consisting of: a rigid-flex board, a ceramic substrate, a PCB rigid board or an FPC.
According to an embodiment of the present invention, the material of the encapsulating portion in the photosensitive assembly is selected from a group consisting of: one or more of nylon, LCP, PP, or resin.
Another aspect of the present invention provides a method for manufacturing a photosensitive assembly of a camera module, comprising: a packaging part is packaged and molded on a circuit board main body and a photosensitive chip.
According to an embodiment of the present invention, the method for manufacturing the photosensitive assembly includes the steps of: the photosensitive chip is attached to a circuit board main body and is electrically connected through at least one connecting wire.
According to an embodiment of the present invention, the method for manufacturing the photosensitive assembly includes the steps of: and the connecting wire is wrapped by the packaging part.
According to an embodiment of the present invention, the method for manufacturing the photosensitive assembly includes the steps of: and extending the packaging part to a non-photosensitive area of the photosensitive chip.
According to an embodiment of the present invention, the method for manufacturing the photosensitive assembly includes the steps of: and a mounting groove is formed at the top end of the packaging part so as to be convenient for mounting an optical filter, a motor or a lens.
According to an embodiment of the present invention, the method for manufacturing the photosensitive assembly includes the steps of: the packaging part extends upwards, and a two-step stepped structure is formed inside the packaging part so as to facilitate the installation of the optical filter or the lens.
According to an embodiment of the present invention, the method for manufacturing the photosensitive assembly includes the steps of: and a thread structure is arranged on the inner wall of the packaging part so as to be convenient for mounting the lens with threads.
According to an embodiment of the present invention, the method for manufacturing the photosensitive assembly includes the steps of: at least one groove-shaped reinforcing hole is formed in the circuit board main body, and the packaging part extends into the reinforcing hole.
According to an embodiment of the present invention, the method for manufacturing the photosensitive assembly includes the steps of: at least one through hole-shaped reinforcing hole is formed in the circuit board main body, and the packaging part extends into the reinforcing hole.
According to an embodiment of the present invention, the method for manufacturing the photosensitive assembly includes the steps of: and attaching a reinforcing layer to the bottom layer of the circuit board main body to enhance the structural strength of the circuit board main body.
According to an embodiment of the present invention, the method for manufacturing the photosensitive assembly includes the steps of: and the circuit board main body and the packaging part are coated with a shielding layer so as to enhance the anti-electromagnetic interference performance of the photosensitive assembly.
Another aspect of the present invention provides a photosensitive assembly of a camera module, which includes a package portion and a photosensitive portion; the light sensing part comprises a circuit board main body, a light sensing chip and a light filter, and the packaging part is packaged and molded on the circuit board main body, the light sensing chip and the light filter.
Another aspect of the present invention provides a camera module, wherein the package portion of the photosensitive assembly has a lens mounting groove, and the lens mounting groove is communicated with the through hole to provide a mounting position for a lens or a motor of the camera module
Another aspect of the present invention provides a method for manufacturing a photosensitive assembly of a camera module, comprising: a package part is packaged on a circuit board main body, a photosensitive chip and a filter.
According to another embodiment of the present invention, the method for manufacturing the photosensitive assembly comprises the steps of: the photosensitive chip is attached to a circuit board main body and is electrically connected through at least one connecting wire.
According to another embodiment of the present invention, the method for manufacturing the photosensitive assembly comprises the steps of: and covering the optical filter on the photosensitive chip to protect the photosensitive chip.
According to another embodiment of the present invention, the method for manufacturing the photosensitive assembly comprises the steps of: and the connecting wire and the optical filter are wrapped by the packaging part.
According to another embodiment of the present invention, the method for manufacturing the photosensitive assembly comprises the steps of: and extending the packaging part to the edge of the optical filter.
According to another aspect of the present invention, a camera module is provided, which includes the photosensitive assembly; and a lens; the lens is positioned on a photosensitive path of the photosensitive chip of the photosensitive assembly.
According to an embodiment of the present invention, the camera module includes a bracket, the bracket is mounted on the photosensitive assembly, and the lens is mounted on the bracket.
According to an embodiment of the present invention, the camera module includes a motor, the lens is mounted on the motor, and the motor is mounted on the photosensitive assembly.
According to an embodiment of the present invention, the image capturing module includes a filter, and the filter is mounted on the photosensitive assembly.
According to an embodiment of the present invention, the image capturing module includes an optical filter, and the optical filter is mounted on the bracket.
Drawings
Fig. 1 is a sectional view of a camera module of a conventional COB process.
Fig. 2 is a perspective view of a photosensitive assembly according to a first preferred embodiment of the present invention.
FIG. 3 is a cross-sectional view of a photosensitive assembly according to a first preferred embodiment of the present invention.
Fig. 4 is a schematic view of a manufacturing process of a photosensitive assembly according to a first preferred embodiment of the present invention.
Fig. 5 is a schematic view of a method of manufacturing a photosensitive assembly according to a first preferred embodiment of the present invention.
Fig. 6 is a sectional view of a camera module according to a first preferred embodiment of the present invention.
Fig. 7 is an exploded view of a camera module according to a first preferred embodiment of the present invention.
Fig. 8 is a cross-sectional view of another camera module according to the first preferred embodiment of the present invention.
Fig. 9 is an exploded view of another camera module according to the first preferred embodiment of the present invention.
Fig. 10 is a sectional view of a photosensitive assembly according to a second preferred embodiment of the present invention.
Fig. 11 is a sectional view of a camera module according to a second preferred embodiment of the present invention.
Fig. 12 is a sectional view of a photosensitive assembly according to a third preferred embodiment of the present invention.
Fig. 13 is a sectional view of a camera module according to a third preferred embodiment of the present invention.
Fig. 14 is a cross-sectional view of another camera module according to a third preferred embodiment of the present invention.
FIG. 15 is a cross-sectional view of a photosensitive assembly according to a fourth preferred embodiment of the present invention.
FIG. 16 is a schematic view of a photosensitive assembly manufacturing method according to a fourth preferred embodiment of the present invention.
Fig. 17 is a sectional view of a camera module according to a fourth preferred embodiment of the present invention.
Fig. 18 is a cross-sectional view of another camera module according to a fourth preferred embodiment of the present invention.
FIG. 19 is a sectional view of a photosensitive assembly according to a fifth preferred embodiment of the present invention.
Fig. 20 is a sectional view of a camera module according to a fifth preferred embodiment of the present invention.
FIG. 21 is a sectional view of a photosensitive assembly according to a sixth preferred embodiment of the present invention.
Fig. 22 is a sectional view of a camera module according to a sixth preferred embodiment of the present invention.
FIG. 23 is a sectional view of a photosensitive assembly according to a seventh preferred embodiment of the present invention.
Fig. 24 is an exploded view of a photosensitive assembly according to a seventh preferred embodiment of the present invention.
FIG. 25 is a cross-sectional view of a modular photosensitive assembly according to an eighth preferred embodiment of the present invention.
Fig. 26 is a sectional view of a camera module according to a ninth preferred embodiment of the present invention.
Fig. 27 is a sectional view of a camera module according to a tenth preferred embodiment of the present invention.
Fig. 28A and 28B are comparison diagrams of advantageous effects of the camera module according to the above preferred embodiment of the present invention.
Detailed Description
The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be constructed and operated in a particular orientation and thus are not to be considered limiting.
Referring to fig. 2 to 7, a photosensitive assembly and a camera module according to a first preferred embodiment of the present invention are illustrated. The photosensitive assembly 10 is used for assembling and manufacturing the camera module. The photosensitive assembly 10 includes an encapsulating portion 11 and a photosensitive portion 12, wherein the encapsulating portion 11 is integrally connected to the photosensitive portion 12 in an encapsulating manner, such as molding, and is connected to the photosensitive portion 12.
The light sensing part 12 includes a circuit board main body 122 and a light sensing chip 121, and the light sensing chip 121 is disposed on the circuit board main body 122. According to this embodiment of the present invention, the photosensitive chip 121 is mold-attached to the wiring board main body 122. Specifically, the encapsulation portion 11 is molded to the light sensing portion 12 in a Molding On Chip (MOC) manner.
According to this embodiment of the present invention, the light sensing section 12 includes a connection line (not shown) and at least one circuit element 123. The connecting line is preset in the circuit board main body 122, and the circuit element 123 is electrically connected to the connecting line and the photosensitive chip 121, so as to provide a photosensitive working process of the photosensitive chip 121. The circuit element 123 is protrudingly disposed on the circuit board main body 122. The circuit element 123 may be, for example and without limitation, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.
It should be noted that the circuit element 123 is encapsulated inside the encapsulating portion 11, so that the circuit element 123 is not directly exposed in the space, more specifically, is not exposed in the environment communicated with the photosensitive chip 121, and when the camera module is assembled, the circuit element 123 is not contaminated by dust and other pollutants, and the photosensitive chip 121 is not affected, which is different from the existing manner of exposing circuit devices in the conventional camera module, such as a capacitor blocking member, so that dust and other impurities are prevented from staying on the surface of the circuit element 123 by a mold encapsulation manner, and the undesirable phenomena of contamination of the photosensitive chip 121 and occurrence of black spots of the camera module are avoided.
It should be noted that, in this embodiment of the present invention, the circuit element 123 protrudes from the circuit board main body 122 for illustration, while in other embodiments of the present invention, the circuit element 123 may be embedded in the circuit board main body 123 without protruding from the circuit board main body, and it should be understood by those skilled in the art that the shape, type and arrangement position of the circuit element 123 are not limitations of the present invention.
The package portion 11 forms a through hole 1100 to provide a photosensitive path for the photosensitive chip 121.
According to this preferred embodiment of the present invention, the light sensing section 12 includes at least one connecting wire 124 for electrically connecting the light sensing chip 121 and the circuit board main body 122. Further, each of the connection lines 124 may be implemented as, specifically but not necessarily limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like. Particularly, the connecting line 124 connects the photosensitive chip 121 and the circuit board main body 122 in an arc shape.
It should be noted that, each of the connecting wires 124 is molded inside the package portion 11, so that each of the connecting wires 124 can be covered by the package portion 11 without being directly exposed to the outside, and thus, when the camera module is assembled, the connecting wires 124 are not damaged by any touch, and at the same time, the influence of environmental factors, such as temperature, on each of the connecting wires 124 is reduced, so that the communication connection between the photosensitive chip 121 and the circuit board main body 122 is stable, which is completely different from the prior art.
Preferably, the bottom of the through hole 1100 of the encapsulation part 11 is inclined to be gradually increased from bottom to top, but this shape is not to be construed as limiting the present invention.
It should be noted that the encapsulating portion 11 encapsulates the circuit element 123 and the connecting wire 124, which has advantages in protecting the circuit element 123 and the connecting wire 124 and obtaining a better performance of the camera module, but it should be understood by those skilled in the art that the encapsulating portion 11 is not limited to encapsulating the circuit element 123 or the connecting wire 124. That is, in other embodiments of the present invention, the package portion 11 may be directly molded on the circuit board main body 122 without the protruding circuit element 123, or may be molded on different positions such as the outer side and the periphery of the circuit element 123.
Further, the photo-sensing chip 121 has a photo-sensing region 1211 and a non-photo-sensing region 1212, and the non-photo-sensing region 1212 surrounds the periphery of the photo-sensing region 1211. The photosensitive region 1211 is used for performing a photosensitive function, and the connecting line 124 is connected to the non-photosensitive region 1212.
According to the preferred embodiment of the present invention, the encapsulation portion 11 extends to the non-photosensitive area 1212 of the photosensitive chip 121, so that the photosensitive chip 121 is stacked and fixed to the circuit board main body 122 by molding. In this way, the inward moldable range of the package 11 is expanded by Molding On Chip (MOC), so that the structural portions of the circuit board main body 122 and the outer side of the package 11 can be reduced, the length and width dimensions of the photosensitive assembly 10 can be further reduced, and the length and width dimensions of the camera module assembled by the photosensitive assembly can be reduced.
In this embodiment of the present invention, the encapsulation portion 11 convexly surrounds the outside of the light sensing region 1211 of the light sensing chip 121, and particularly, the encapsulation portion 11 is integrally connected in a closed manner, so that the encapsulation portion has good sealing performance, so that when the light sensing assembly 10 is used for assembling the camera module, the light sensing chip 121 is sealed inside to form a closed inner space.
Specifically, in manufacturing the photosensitive assembly 10, a conventional circuit board can be selected as the circuit board main body 122, the circuit board main body 122 is provided with the photosensitive chip 121, the photosensitive chip 121 is electrically connected through the connecting wire 124, then, Molding is performed on the molded circuit board body 122 and the photosensitive chip 121 after the initial assembly, for example, Molding process (Molding) commonly used in semiconductor packaging is used to form the packaging part 11, or the circuit board main body 122 may be selected to be formed by Molding the circuit board subjected to the SMT (Surface Mount Technology) process into the package portion 11 by an Insert Molding (Insert Molding) process using an injection Molding machine, the circuit board main body 122 can be selected, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner in which the enclosure 11 is formed may be selected, by way of example and not limitation, from an injection molding process, a molding process, and the like. The material of the sealing portion 11 is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc. may be selected as the injection molding process, and resin may be used as the molding process. It will be appreciated by persons skilled in the art that the foregoing alternative forms of manufacture, as well as alternative materials, are merely illustrative of the possible embodiments of the invention and are not limiting of the invention.
It should be noted that, based on the molding method of the photosensitive assembly 10 of the present invention, the photosensitive assembly 10 is more suitable for the imposition work, and the manufacturing of a larger number of photosensitive assemblies 10 can be completed at one time, for example, 90 photosensitive assemblies can be completed, whereas the conventional circuit board can only be manufactured at most 8 photosensitive assemblies at one time.
Further, the package portion 11 includes a wrapping section 111 and a filter mounting section 112, the filter mounting section 112 is integrally connected to the wrapping section 111 by molding, and the wrapping section 111 is connected to the circuit board main body 122 by molding for wrapping the circuit element 123 and the connecting wire 124. The filter mounting section 112 is used for mounting a filter 20, that is, when the photosensitive assembly 10 is used for assembling the camera module, the filter 20 of the camera module is mounted on the filter mounting section 112, so that the filter 20 is located on the photosensitive path of the photosensitive chip 121, and no additional filter mounting bracket is required. That is, the encapsulating portion 11 functions as a conventional bracket, but the top of the filter mounting segment 112 can be molded to have good flatness due to the advantages of the molding process, so that the filter 20 can be mounted flatly, which is also superior to the conventional camera module. In particular, the filter 20 is an infrared cut filter IRCF.
Furthermore, the filter mounting section 112 has a mounting groove 1121, and the mounting groove 1211 is connected to the through hole 1100 to provide a sufficient mounting space for the filter 20, so that the filter 20 does not protrude from the top surface of the lens mounting section 112. That is, the mounting groove is provided at the upper end of the packing part 11 so that the optical filter 20 can be mounted therein.
It should be noted that, in this embodiment of the present invention, the mounting groove 1121 may be used for mounting a filter, and in other embodiments of the present invention, the mounting groove 1121 may be used for mounting a component such as a motor or a lens of the camera module, and it should be understood by those skilled in the art that the purpose of the mounting groove is not limited by the present invention.
It is worth mentioning that the inner wall of the package portion 11 may be disposed according to the shape of the connection, such as being disposed in an inclined shape, so as to cover the connection line 124 while allowing the photo sensor chip 121 to receive more light. It will be appreciated by those skilled in the art that the shape of the enclosure 11 is not a limitation of the present invention.
Referring to fig. 2 to 7, a camera module according to a first preferred embodiment of the present invention. The camera module may be a Fixed Focus Module (FFM). The camera module comprises the photosensitive assembly 10, the optical filter 20 and a lens 30.
The filter 20 is mounted on the photosensitive assembly 10, and the lens 30 is mounted on the photosensitive assembly 10.
More specifically, the filter 20 is mounted to the mounting groove 1121 of the filter mounting segment 112 of the sealing part 11 of the photosensitive assembly 10. The lens 30 is mounted on the top of the filter mounting segment 112 of the encapsulation 11 of the photosensitive assembly 10. That is, the filter is mounted in the mounting groove, and the lens 30 is mounted on the top end of the package portion 11.
It should be noted that the lens 30 is mounted on the top end of the filter mounting segment 112 of the packaging part 11 of the photosensitive assembly 10, so that the packaging part 11 functions as a support in a conventional camera module, and provides a supporting and fixing position for the lens 30, but the assembly is different from the conventional COB process. The bracket of the camera module of the traditional COB process is fixed on a circuit board in a sticking way, the packaging part 11 is fixed on the circuit board main body 122 through a molding process without a sticking and fixing process, the molding way has better connection stability and controllability of the process compared with the sticking and fixing, and a glue space for AA adjustment is not required to be reserved between the packaging part 11 and the circuit board main body 122, so that the reserved space for AA adjustment of the traditional camera module is reduced, and under the condition of achieving equal structural strength, the thickness of the circuit board main body 122 in the molding scheme of the invention can be smaller, when an optical filter is directly stuck on the molding surface, the back focus of a lens can be shorter, so that the thickness of the camera module can be reduced; on the other hand, the encapsulating portion 11 encapsulates the circuit element 123 and the connecting line 124, so that the conventional support function and the circuit element 123 and the connecting line 124 can be overlapped in space, and a safety distance is reserved around the circuit device without the need of a conventional camera module, so that the height of the encapsulating portion 11 with the support function can be set in a smaller range, and a space in which the thickness of the camera module can be reduced is further provided. In addition, the packaging part 11 replaces a traditional support, so that the inclination error caused by the support in the process of pasting and assembling is avoided, and the accumulated tolerance of the camera module assembly is reduced. The package portion 11 covers the connecting line 124, and the package portion 11 extends to the non-photosensitive region 1212 of the photosensitive chip 121, so that the package portion 11 can contract inward, thereby further reducing the transverse length and width dimensions of the camera module.
Referring to fig. 2 to 5 and fig. 8 and 9, another image module according to a first preferred embodiment of the present invention is shown, and the image module may be an Automatic Focus Module (AFM). The camera module comprises the photosensitive assembly 10, the optical filter 20, the motor 40 and a lens 30.
The filter 20 is mounted to the photosensitive assembly 10, the lens 30 is mounted to the motor 40, and the motor 40 is mounted to the mold line assembly 10.
Further, the filter 20 is mounted to the mounting groove 1121 of the filter mounting segment 112 of the sealing part 11 of the photosensitive module 10. The motor 40 is mounted on the top end of the filter mounting section 112 of the packaging part 11 of the photosensitive assembly 10. That is, the filter 20 is mounted to the mounting groove of the package 11, the lens 30 is mounted to the motor 40, and the motor 40 is mounted to the top end of the package 11.
In particular, when the pins are adhered to the circuit pads by means of conductive paste, no soldering wire is required to connect the motor 40 and the circuit board main body 122 of the light sensing part 12, thereby reducing the number of processes for soldering the motor.
It should be understood by those skilled in the art that the above-described structure and type of camera module are only examples to illustrate the manner in which the camera module may be implemented and are not limitations of the present invention.
Referring to fig. 10 and 11, a camera module photosensitive assembly and a camera module according to a second preferred embodiment of the present invention. The photosensitive assembly 10A is used for assembling and manufacturing the camera module, so that a molded camera module is obtained. The photosensitive assembly 10A includes a sealing portion 11A and a photosensitive portion 12A, and the sealing portion 11A is connected to the photosensitive portion 12A by molding.
The light sensing portion 12A includes a circuit board main body 122A and a light sensing chip 121A, and the light sensing chip 121A is disposed on the circuit board main body 122A. According to this embodiment of the present invention, the photosensitive chip 121A is mold-coupled to the line version body.
According to this embodiment of the present invention, the light sensing section 12A includes a connection line (not shown) and at least one circuit element 123A. The connecting line is preset in the circuit board main body 122A, and the circuit element 123A is electrically connected to the connecting line and the photosensitive chip 121A, so as to provide a photosensitive working process of the photosensitive chip 121A. The circuit element 123A is protrudingly disposed on the circuit board main body 122A. The circuit element 123A may be, for example and without limitation, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.
It should be noted that the circuit element 123A is encapsulated by the encapsulating portion 11A, so that the circuit element 123A is not directly exposed in the space, more specifically, is not exposed in the environment communicated with the photosensitive chip 121A, when the camera module is assembled, the circuit element 123A is not contaminated by contaminants such as dust, and the photosensitive chip 121A is not affected, which is different from the existing manner of exposing the circuit element 123A in the conventional camera module, such as a container blocking member, so that the dust and the contaminants are prevented from staying on the surface of the circuit element 123A by the mold encapsulation manner, and the adverse phenomena of contamination of the photosensitive chip 121A and occurrence of black spots in the camera module are avoided.
The packaging part 11A forms a through hole 1100A so as to provide a photosensitive path for the photosensitive chip 121A.
According to this preferred embodiment of the present invention, the light sensing section 12A includes at least one connecting line 124A for electrically connecting the light sensing chip 121A and the wiring board main body 122A. Further, each of the connection lines 124A may be implemented as, specifically but not necessarily limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like. Particularly, the connecting line 124A connects the photosensitive chip 121A and the circuit board main body 122A in an arc shape. It should be noted that each of the connecting wires 124A is molded inside the package portion 11A, so that each of the connecting wires 124A can be covered by the package portion 11A without being directly exposed to the outside, and thus, when the camera module is assembled, the connecting wires 124A are not damaged by any touch, and at the same time, the influence of environmental factors on the connecting wires 124A, such as temperature, is reduced, so that the communication connection between the photosensitive chip 121A and the circuit board main body 122A is stable, which is completely different from the prior art.
It should be noted that the encapsulating portion 11A encapsulates the circuit element 123A and the connecting wire 124A, which has advantages in protecting the circuit element 123A and the connecting wire 124A and obtaining a more functional camera module, but it should be understood by those skilled in the art that the encapsulating portion 11A is not limited to encapsulating the circuit element 123A or the connecting wire 124A. That is, in other embodiments of the present invention, the package portion 11A may be directly molded on the circuit board main body 122A without the protruding circuit element 123A, or may be molded at different positions outside or around the circuit element 123A.
Different from the above preferred embodiment, the circuit board main body 122A has an inner groove 1222A, and the photosensitive chip 121A is disposed in the inner groove 1222A, so that the relative height between the photosensitive chip 121A and the circuit board main body 122A is reduced, and thus when the packaging part 11A covers the photosensitive chip 121A, the height requirement for the packaging part 11A is reduced, thereby reducing the height of the camera module assembled by the photosensitive assembly 10A.
Further, the photo-sensing chip 121A has a photo-sensing area 1211A and a non-photo-sensing area 1212A, and the non-photo-sensing area 1212A surrounds the periphery of the photo-sensing area 1211A. The photosensitive region 1211A is used for performing a photosensitive function, and the connecting line 124A is connected to the non-photosensitive region 1212A.
According to this preferred embodiment of the present invention, the encapsulation portion 11A extends from the non-photosensitive area 1212A of the photosensitive chip 121A, so as to fix the photosensitive chip 121A to the circuit board main body 122A in a stacked manner by molding. In this way, the inward moldable range of the package portion 11A is expanded by Molding on a chip (MOC), so that the structural portions of the circuit board main body 122A and the outer side of the package portion 11A can be reduced, the length and width of the photosensitive element 12A can be further reduced, and the length and width of the camera module assembled by the photosensitive element can be reduced.
In this embodiment of the present invention, the encapsulation portion 11A convexly surrounds the outside of the photosensitive region 1211A of the photosensitive chip 121A, and particularly, the encapsulation portion 11A is integrally and closely connected, so that the sealing performance is good, so that when the photosensitive assembly 10A is used for assembling the camera module, the photosensitive chip 121A is sealed inside to form a closed inner space.
Further, the package portion 11A includes a wrapping section 111A and a filter mounting section 112A, the filter mounting section 112A is integrally connected to the wrapping section 111A in a molding manner, and the wrapping section 111A is connected to the circuit board main body 122A in a molding manner for wrapping the circuit element 123A and the connecting wire 124A. The filter mounting section 112A is used for mounting a filter 20A, that is, when the photosensitive assembly 10A is used for assembling the camera module, the filter 20A of the camera module is mounted on the filter mounting section 112A, so that the filter 20A is located on the photosensitive path of the photosensitive chip 121A, and no additional filter 20A mounting bracket is required. That is, the encapsulating portion 11A functions as a conventional holder, but the top of the filter mounting segment 112A can be molded to have good flatness due to the advantages of the molding process, so that the filter 20A can be mounted flatly, which is also superior to the conventional camera module.
Furthermore, the filter mounting segment 112A has a mounting groove 1121A, and the supporting groove is communicated with the through hole 1100A to provide sufficient mounting space for the filter 20A, so that the filter 20A does not protrude from the top surface of the filter mounting segment 112A. That is, the mounting groove is disposed at the upper end of the sealing portion 11A, so that the filter 20A is stably mounted on the sealing portion 11A and does not protrude from the top end of the sealing portion 11A.
It is worth mentioning that the inner wall of the mold may be disposed according to the shape of the connection, such as disposed in an inclined shape, so as to cover the connection line 124A while allowing the photo sensor chip 121A to receive more light. It should be understood by those skilled in the art that the shape of the packing portion 11A is not a limitation of the present invention.
Referring to fig. 11 and 12, a camera module according to a second preferred embodiment of the present invention. The camera module can be a fixed focus module. The camera module comprises the photosensitive assembly 10A, the optical filter 20A and a lens 30A.
The filter 20A is mounted on the photosensitive assembly 10A, and the lens 30A is mounted on the photosensitive assembly 10A.
More specifically, the filter 20A is mounted to the mounting groove 1111A of the filter mounting section 111A of the package portion 11A of the photosensitive member 10A. The lens 30A is mounted on the top end of the filter mounting section 111A of the package portion 11A of the photosensitive element 10A. In other words, the filter 20A is mounted to the IR supporting groove 1111A of the package portion 11A, and the lens 30A is mounted to the top end of the package portion 11A.
In other embodiments of the present invention, the photosensitive assembly 10A can also be assembled into a moving focus camera module. It should be understood by those skilled in the art that the fixed focus camera module is only used for illustrating the present invention, and is not limited by the present invention.
Referring to fig. 12 and 13, a photosensitive assembly and a camera module according to a third preferred embodiment of the present invention. The photosensitive assembly 10B is used for assembling and manufacturing the camera module, so that a molded camera module is obtained. The photosensitive assembly 10B includes a sealing portion 11B and a photosensitive portion 12B, and the sealing portion 11B is connected to the photosensitive portion 12B by molding.
The light sensing portion 12B includes a circuit board main body 122B and a light sensing chip 121B, and the light sensing chip 121B is disposed on the circuit board main body 122B. According to this embodiment of the present invention, the photosensitive chip 121B is mold-coupled to the wiring version body.
According to this embodiment of the present invention, the light sensing section 12B includes a connection wiring (not shown) and at least one circuit element 123B. The connecting line is pre-arranged in the circuit board main body 122B, and the circuit element 123B is electrically connected to the connecting line and the photosensitive chip 121B for photosensitive operation of the photosensitive chip 121B. The circuit element 123B is protrudingly disposed on the circuit board main body 122B. The circuit element 123B may be, for example, but not limited to, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.
It should be noted that the circuit element 123B is encapsulated by the encapsulating portion 11B, so that the circuit element 123B is not directly exposed in the space, more specifically, is not exposed in the environment communicated with the photosensitive chip 121B, and when the camera module is assembled, the circuit element 123B is not contaminated by contaminants such as dust, and the photosensitive chip 121B is not affected, which is different from the conventional camera module in which the circuit element 123B is exposed, such as a container blocking member, so that the dust and the contaminants are prevented from staying on the surface of the circuit element 123B by a mold encapsulation method, and the adverse phenomena such as contamination of the photosensitive chip 121B and black spots of the camera module are avoided.
The packaging part 11B forms a through hole 1100B to provide a photosensitive path for the photosensitive chip 121B.
According to this preferred embodiment of the present invention, the light sensing section 12B includes at least one connecting line 124B for electrically connecting the light sensing chip 121B and the wiring board main body 122B. Further, each of the connection lines 124B may be implemented as, specifically but not necessarily limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like. Particularly, the connecting line 124B connects the photosensitive chip 121B and the circuit board main body 122B in an arc shape.
It should be noted that each of the connecting wires 124B is molded inside the package portion 11B, so that each of the connecting wires 124B can be covered by the package portion 11B without being directly exposed to the outside, and thus when the camera module is assembled, the connecting wires 124B are not damaged by any touch, and at the same time, the influence of environmental factors on the connecting wires 124B, such as temperature, is reduced, so that the communication connection between the photosensitive chip 121B and the circuit board main body 122B is stable, which is not provided in the prior art at all.
It is worth mentioning that the sealing portion 11B covers the circuit element 123B and the connecting line 124B, which has advantages in protecting the circuit element 123B and the connecting line 124B and obtaining a more functional camera module, but it should be understood by those skilled in the art that the sealing portion 11B is not limited to cover the circuit element 123B or the connecting line 124B. That is, in other embodiments of the present invention, the package portion 11B may be directly molded on the circuit board main body 122B without the protruding circuit element 123B, or may be molded at different positions outside or around the circuit element 123B.
Further, the photosensitive chip 121B has a photosensitive region 1211B and a non-photosensitive region 1212B, wherein the non-photosensitive region 1212B surrounds the periphery of the photosensitive region 1211B. The photosensitive region 1211B is used for performing a photosensitive function, and the connecting line 124B is connected to the non-photosensitive region 1212B.
According to this preferred embodiment of the present invention, the encapsulation portion 11B extends from the non-photosensitive area 1212B of the photosensitive chip 121B, so that the photosensitive chip 121B is stacked and fixed to the circuit board main body 122B by molding. In this way, the inward moldable range of the package part 11B is expanded by Molding On Chip (MOC), so that the structural portions of the circuit board main body 122B and the outer side of the package part 11B can be reduced, the length and width of the molded light-sensing part 12B can be further reduced, and the length and width of the camera module assembled by the molded light-sensing part can be reduced.
In this embodiment of the present invention, the encapsulation portion 11B convexly surrounds the outside of the photosensitive region 1211B of the photosensitive chip 121B, and particularly, the encapsulation portion 11B is integrally and closely connected, so that the sealing performance is good, so that when the photosensitive assembly 10B is used for assembling the camera module, the photosensitive chip 121B is sealed inside to form a closed inner space.
Specifically, when manufacturing the photosensitive assembly 10B, a conventional circuit board may be selected as the circuit board main body 122B, the photosensitive chip 121B is disposed on the circuit board main body 122B, the photosensitive chip 121B is electrically connected to the connecting line 124B, and then the molded circuit board main body 122B and the photosensitive chip 121B are molded after the initial assembly, for example, an injection molding machine is used to mold the circuit board after performing an SMT (Surface Mount Technology) process by an insert molding (molding) process to form the package portion 11B, or the package portion 11B is formed by a molding process commonly used in semiconductor packaging. The circuit board main body 122B may be selected, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner in which the enclosure portion 11B is formed may be selected, by way of example and not limitation, from an injection molding process, a molding process, and the like. The material of the sealing portion 11B is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc. may be selected as the injection molding process, and resin may be used as the molding process. It will be appreciated by persons skilled in the art that the foregoing alternative forms of manufacture, as well as alternative materials, are merely illustrative of the possible embodiments of the invention and are not limiting of the invention.
Further, the top surface of the packaging part 11B is flat and suitable for mounting a filter 20B, that is, when the photosensitive assembly 10B is used to assemble the camera module, the filter 20B of the camera module is mounted on the top surface of the packaging part 11B, so that the filter 20B is located on the photosensitive path of the photosensitive chip 121B, and no additional filter 20B mounting bracket is required. That is, the sealing portion 11B functions as a conventional holder, but the mold top portion 11B may have good flatness by means of a molding process, so that the optical filter 20B is smoothly mounted, which is superior to a conventional camera module, based on the advantages of a molding process.
Unlike the preferred embodiment, in this embodiment of the present invention, the light sensing portion 12B of the light sensing assembly 10B includes a reinforcing layer 125B, and the reinforcing layer 125B is laminated on the bottom layer of the circuit board main body 122B to reinforce the structural strength of the circuit board main body 122B. That is, the reinforcing layer 125B is bottom-mounted on the circuit board main body 122B in the region where the sealing part 11B and the photosensitive chip 121B are located, so that the circuit board main body 122B stably and reliably supports the sealing part 11B and the photosensitive chip 121B.
Further, the reinforcing layer 125B is a metal plate, and the metal plate is attached to the bottom layer of the circuit board main body 122B, so that the structural strength of the circuit board main body 122B is increased, and on the other hand, the heat dissipation performance of the photosensitive assembly 10B is increased, and the heat emitted by the photosensitive chip 121B can be effectively dissipated.
It is worth mentioning that the Circuit board main body 122B may adopt an FPC (flexible printed Circuit), and the rigidity of the FPC is enhanced by the reinforcing layer 125B, so that the FPC having a good bending performance can satisfy the bearing requirement of the photosensitive assembly 10B. That is, the Circuit Board main body 122B can be selected from a wider range, such as PCB (Printed Circuit Board), FPC, and RF (Printed Flex). The reinforcing layer 125B increases the structural strength of the circuit board main body 122B and improves heat dissipation performance, so that the thickness of the circuit board main body 122B can be reduced, the height of the photosensitive assembly 10B can be further reduced, and the height of a camera module assembled by the photosensitive assembly can be reduced.
It should be noted that, in this embodiment of the present invention, the reinforcing layer 125 is overlapped on the circuit board main body 122B in a plate shape, while in other embodiments of the present invention, the reinforcing layer 125B may extend to wrap the side wall of the encapsulating portion 11B, so as to enhance the structural strength of the photosensitive assembly 10B and enhance the anti-electromagnetic interference capability thereof.
It is worth mentioning that the inner wall of the packaging part may be disposed according to the shape of the connection, such as disposed in an inclined shape, so as to cover the connection line 124B and enable the photosensitive chip 121B to receive more light. It should be understood by those skilled in the art that the shape of the encapsulant 11B is not a limitation of the present invention.
Referring to fig. 12 and 13, a camera module according to a third preferred embodiment of the present invention. The camera module may be a Fixed Focus Module (FFM). The camera module comprises the photosensitive assembly 10B, the optical filter 20B and a lens 30B.
The filter 20B is mounted on the photosensitive element 10B, and the lens 30B is mounted on the photosensitive element 10B.
More specifically, the filter 20B is mounted on the top end of the sealing portion 11B of the photosensitive element 10B. The lens 30B is mounted on the top end of the package portion 11B of the photosensitive element 10B. In particular, the specific installation positions of the filter 20B and the lens 30B in the packaging part 11B can be coordinated according to specific needs.
It should be noted that the lens 30B is mounted on the top end of the packaging portion 11B of the photosensitive assembly 10B, so that the packaging portion 11B functions as a support in a conventional camera module, and provides a supporting and fixing position for the lens 30B, but the assembly is different from the conventional COB process. The bracket of the camera module of the traditional COB process is fixed on a circuit board in a sticking way, the packaging part 11B is fixed on the circuit board main body 122B through a molding process without a sticking and fixing process, the molding mode has better connection stability and controllability of the process compared with the sticking and fixing, and a glue space for AA adjustment is not required to be reserved between the packaging part 11B and the circuit board main body 122B, so that the reserved space for AA adjustment of the traditional camera module is reduced, and the thickness of the camera module is reduced; on the other hand, the encapsulating portion 11B encapsulates the circuit element 123B and the connecting line 124B, so that the conventional bracket function and the circuit element 123B and the connecting line 124B can be spatially overlapped, and a safe distance is reserved around the circuit device without the need of a conventional camera module, so that the height of the encapsulating portion 11B having the bracket function can be set in a small range, thereby further providing a space in which the thickness of the camera module can be reduced. In addition, the packaging part 11B replaces a traditional support, so that the inclination error caused by the support in the process of pasting and assembling is avoided, and the accumulated tolerance of the camera module assembly is reduced. The package portion 11B covers the connecting line 124B, and the package portion 11B extends to the non-photosensitive region 1212B of the photosensitive chip 121B, so that the package portion 11B can contract inward, thereby further reducing the transverse length and width of the camera module.
Referring to fig. 12 and 14, another camera module according to a third preferred embodiment of the present invention will be explained. The camera module can be a moving-focus camera module. The camera module comprises the photosensitive assembly 10B, the optical filter 20B, a motor 40B and a lens 30B.
The filter 20B is mounted to the photosensitive member 10B, the lens 30B is mounted to the motor 40B, and the motor 40B is mounted to the mold wiring member.
Further, the filter 20B is mounted on the top end of the sealing portion 11B of the photosensitive element 10B. The motor 40B is mounted on the top end of the sealing portion 11B of the photosensitive member 10B. In particular, the specific installation positions of the optical filter 20B and the motor 40B in the packaging part 11B can be coordinated according to specific needs.
In particular, the engraved line 114B electrically connects the motor 40B and the circuit board main body 122B of the light sensing section 12B, so that a soldering wire may not be required to connect the motor 40B and the circuit board main body 122B of the light sensing section 12B, reducing the process of motor soldering.
It should be understood by those skilled in the art that the above-described structure and type of camera module are only examples to illustrate the manner in which the camera module may be implemented and are not limitations of the present invention.
Referring to fig. 15 and 17, a photosensitive assembly and a camera module according to a fourth preferred embodiment of the present invention will be explained. The photosensitive assembly 10C is used for assembling and manufacturing the camera module, so that a molded camera module is obtained. The photosensitive assembly 10C includes a sealing portion 11C and a photosensitive portion 12C, and the sealing portion 11C is connected to the photosensitive portion 12C by molding.
The light sensing portion 12C includes a circuit board main body 122C and a light sensing chip 121C, and the light sensing chip 121C is disposed on the circuit board main body 122C. According to this embodiment of the present invention, the photosensitive chip 121C is mold-coupled to the wiring version body.
According to this embodiment of the present invention, the light sensing section 12C includes a connection line (not shown) and at least one circuit element 123C. The connecting line is preset in the circuit board main body 122C, and the circuit element 123C is electrically connected to the connecting line and the photosensitive chip 121C, so as to provide a photosensitive working process of the photosensitive chip 121C. The circuit element 123C is protrudingly disposed on the circuit board main body 122C. The circuit element 123C may be, for example and without limitation, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.
It should be noted that the circuit element 123C is encapsulated by the encapsulating portion 11C, so that the circuit element 123C is not directly exposed in the space, more specifically, is not exposed in the environment communicated with the photosensitive chip 121C, and when the camera module is assembled, the circuit element 123C is not contaminated by contaminants such as dust, and the photosensitive chip 121C is not affected, which is different from the existing manner of exposing the circuit element 123C in the conventional camera module, such as a container blocking member, so that the dust and the contaminants are prevented from staying on the surface of the circuit element 123C by the mold encapsulation manner, and the adverse phenomena of contamination of the photosensitive chip 121C and occurrence of black spots of the camera module are avoided.
The packaging part 11C forms a through hole 1100C to provide a photosensitive path for the photosensitive chip 121C.
According to this preferred embodiment of the present invention, the light sensing section 12C includes at least one connecting line 124C for electrically connecting the light sensing chip 121C and the wiring board main body 122C. Further, each of the connection lines 124C may be implemented as, specifically but not necessarily limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like. Particularly, the connecting line 124C connects the photosensitive chip 121C and the circuit board main body 122C in an arc shape.
It should be noted that each of the connecting wires 124C is molded inside the package portion 11C, so that each of the connecting wires 124C can be covered by the package portion 11C without being directly exposed to the outside, and thus, when the camera module is assembled, the connecting wires 124C are not damaged by any touch, and at the same time, the influence of environmental factors on the connecting wires 124C, such as temperature, is reduced, so that the communication connection between the photosensitive chip 121C and the circuit board main body 122C is stable, which is not provided in the prior art at all.
It should be noted that the encapsulating portion 11C encapsulates the circuit element 123C and the connecting wire 124C, which has advantages in protecting the circuit element 123C and the connecting wire 124C and obtaining a more functional camera module, but it should be understood by those skilled in the art that the encapsulating portion 11C is not limited to encapsulating the circuit element 123C or the connecting wire 124C. That is, in other embodiments of the present invention, the package portion 11C may be directly molded on the circuit board main body 122C without the protruding circuit element 123C, or may be molded at different positions outside or around the circuit element 123C.
Further, the photo-sensing chip 121C has a photo-sensing area 1211C and a non-photo-sensing area 1212C, and the non-photo-sensing area 1212C surrounds the periphery of the photo-sensing area 1211C. The photosensitive region 1211C is used for performing a photosensitive function, and the connecting line 124C is connected to the non-photosensitive region 1212C.
According to this preferred embodiment of the present invention, the encapsulating portion 11C extends from the non-photosensitive area 1212C of the photosensitive chip 121C, so that the photosensitive chip 121C is stacked and fixed on the circuit board main body 122C by molding. In this way, the inward moldable range of the package portion 11C is expanded by Molding on the chip (Molding on the chip), so that the structural portions of the circuit board main body 122C and the outer side of the package portion 11C can be reduced, the length and width dimensions of the photosensitive element can be further reduced, and the length and width dimensions of the camera module assembled by the photosensitive element can be reduced.
In this embodiment of the present invention, the encapsulation portion 11C convexly surrounds the outside of the light sensing region 1211C of the light sensing chip 121C, and particularly, the encapsulation portion 11C is integrally and closely connected, so that the sealing performance is good, so that when the light sensing assembly 10C is used for assembling the camera module, the light sensing chip 121C is sealed inside to form a closed inner space.
Specifically, when manufacturing the photosensitive assembly 10C, a conventional circuit board may be selected as the circuit board main body 122C, the photosensitive chip 121C is disposed on the circuit board main body 122C, the photosensitive chip 121C is electrically connected through the connecting wire 124C, and then the molded circuit board main body 122C and the photosensitive chip 121C after the initial assembly are molded, for example, an injection molding machine is used to mold the circuit board after performing an SMT (Surface Mount Technology) process by an insert molding (molding) process to form the package portion 11C, or the package portion 11C is formed by a molding process commonly used in semiconductor packaging. The circuit board main body 122C may be selected, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner in which the encapsulation 11C is formed may be selected, by way of example and not limitation, from an injection molding process, a molding process, and the like. The material of the sealing portion 11C is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc. may be selected as the injection molding process, and resin may be used as the molding process. It will be appreciated by persons skilled in the art that the foregoing alternative forms of manufacture, as well as alternative materials, are merely illustrative of the possible embodiments of the invention and are not limiting of the invention.
The photosensitive assembly 10C further includes a filter 20C, and the filter 20C is stacked on the photosensitive chip 121C by molding. The edge of the filter 20C is molded to the package portion 11C, thereby fixing the filter 20C. It is worth mentioning that the filter 20C covers above the photosensitive chip 121C, and isolates the photosensitive chip 121C from the external environment, thereby protecting the photosensitive chip 121C from being damaged and preventing dust from entering.
When the photosensitive assembly 10C is manufactured, the photosensitive chip 121C is attached to the circuit board main body 122C, the circuit board main body 121C and the circuit board main body 122C are connected, the optical filter 20C is attached to the photosensitive chip 121C, and further, the circuit board main body 122C, the photosensitive chip 121C and the optical filter 20C are molded to form the package portion 11C. During molding, the optical filter 20C covers the photosensitive chip 121C, so that damage to the photosensitive chip 121C caused by a mold for molding can be prevented, and the back focal length of the camera module assembled by the optical filter 20C can be reduced due to the reduction of the distance between the optical filter 20C and the photosensitive chip 121C, so that the height of the camera module is reduced, and on the other hand, the thickness of the camera module is further reduced to a certain extent due to the fact that no additional supporting component is required to be provided for the optical filter 20C.
It should be noted that the inner wall of the package portion 10C may be disposed, for example, inclined, according to the shape of the connection, so as to cover the connection line 124C and enable the photosensitive chip 121C to receive more light rays. It should be understood by those skilled in the art that the shape of the encapsulant 11C is not a limitation of the present invention.
Referring to fig. 15 to 17, a camera module according to a fourth preferred embodiment of the present invention. The camera module can be a fixed focus module. The camera module comprises the photosensitive assembly 10C and a lens 30C. The lens 30C is mounted on the photosensitive element 10C, and assembled to form the camera module.
Particularly, the lens 30C may be fixed to the top end of the encapsulating portion 11C of the photosensitive component 10C by bonding, and by virtue of the characteristics of mold manufacturing in the molding process, the top end of the encapsulating portion 11C has better flatness, so as to provide good installation conditions for the lens 30C, thereby obtaining a high-quality camera module.
It should be noted that the lens 30C is mounted on the top end of the packaging portion 11C of the photosensitive assembly 10C, so that the packaging portion 11C is equivalent to a bracket in a conventional camera module, and provides a supporting and fixing position for the lens 30C, but the assembly is different from the conventional COB process. The bracket of the camera module of the traditional COB process is fixed on the circuit board in a sticking way, the packaging part 11C is fixed on the circuit board main body 122C through a molding process, the sticking and fixing process is not needed, the molding way has better connection stability and controllability of the process compared with the sticking and fixing, and a glue space for AA adjustment is not needed to be reserved between the packaging part 11C and the circuit board main body 122C, so that the reserved space for AA adjustment of the traditional camera module is reduced, and the thickness of the camera module is reduced; on the other hand, the encapsulating portion 11C encapsulates the circuit element 123C and the connecting line 124C, so that the conventional bracket function, the circuit element 123C and the connecting line 124C can be spatially overlapped, and a safe distance is reserved around the circuit device without the need of a conventional camera module, so that the height of the encapsulating portion 11C having the bracket function can be set in a small range, and a space in which the thickness of the camera module can be reduced is further provided. In addition, the packaging part 11C replaces a traditional support, so that the inclination error caused by the support in the process of pasting and assembling is avoided, and the accumulated tolerance of the camera module assembly is reduced. The encapsulating portion 11C encapsulates the connecting line 124C, and the encapsulating portion 11C extends to the non-photosensitive region 1212C of the photosensitive chip 121C, so that the encapsulating portion 11C can contract inward, thereby further reducing the transverse length and width dimensions of the camera module. Moreover, the photosensitive assembly 10C molds the optical filter 20C therein, so that the process of attaching and mounting the optical filter is not required again when the camera module is assembled, thereby reducing the process of assembling the camera module and improving the working efficiency, which are superior to those of the prior art.
Referring to fig. 15, 16 and 18, another camera module according to a fourth preferred embodiment of the present invention will be explained. The camera module can be an Automatic Focus camera module (AFM). The camera module comprises the photosensitive assembly 10C, a motor 40C and a lens 30C.
The lens 30C is mounted on the motor 40C, and the motor 40C is mounted on the photosensitive assembly 10C, so that the focal length of the camera module can be adjusted by the motor 40C. The motor 40C is mounted on the top end of the sealing portion 11C of the photosensitive member 10C.
In particular, the engraved line 114C electrically connects the motor 40C and the circuit board main body 122C of the light sensing section 12C, so that a soldering wire may not be required to connect the motor 40C and the circuit board main body 122C of the light sensing section 12C, reducing the process of motor soldering.
It should be understood by those skilled in the art that the above-described structure and type of camera module are only examples to illustrate the manner in which the camera module may be implemented and are not limitations of the present invention.
Referring to fig. 19 and 20, a photosensitive assembly and a camera module according to a fifth preferred embodiment of the present invention will be explained. The photosensitive assembly 10D is used for assembling and manufacturing the camera module, so as to obtain the molded camera module. The photosensitive assembly 10D includes a sealing portion 11D and a photosensitive portion 12D, and the sealing portion 11D is connected to the photosensitive portion 12D by molding.
Specifically, the encapsulating portion is molded to the light sensing portion 12D in the MOC manner.
The light sensing portion 12D includes a circuit board main body 122D and a light sensing chip 121D, and the light sensing chip 121D is disposed on the circuit board main body 122D. According to this embodiment of the present invention, the photosensitive chip 121D is mold-attached to the wiring board main body 122D.
According to this embodiment of the present invention, the light sensing section 12D includes a connection line (not shown) and at least one circuit element 123D. The connecting line is preset in the circuit board main body 122D, and the circuit element 123D is electrically connected to the connecting line and the photosensitive chip 121D, so as to provide a photosensitive working process of the photosensitive chip 121D. The circuit element 123D is protrudingly disposed on the circuit board main body 122D. The circuit element 123D may be, for example and without limitation, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like. It should be noted that the circuit element 123D is covered by the packaging portion 11D, so that the circuit element 123D is not directly exposed in the space, more specifically, is not exposed in the environment communicated with the photosensitive chip 121D, and when the camera module is assembled, the circuit element 123D is not contaminated by contaminants such as dust, and the photosensitive chip 121D is not affected, which is different from the existing manner of exposing the circuit element 123D in the conventional camera module, such as a container blocking member, so that the dust and the contaminants are prevented from staying on the surface of the circuit element 123D by a mold covering manner, and the adverse phenomena such as contamination of the photosensitive chip 121D and black spots of the camera module are avoided.
The packaging portion 11D forms a through hole 1100D to provide a photosensitive path for the photosensitive chip 121D.
According to this preferred embodiment of the present invention, the light sensing section 12D includes at least one connecting line 124D for electrically connecting the light sensing chip 121D and the wiring board main body 122D. Further, each of the connection lines 124D may be implemented as, specifically but not necessarily limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like. Particularly, the connecting line 124D connects the photosensitive chip 121D and the circuit board main body 122D in an arc shape.
It should be noted that each of the connecting wires 124D is molded inside the package portion 11D, so that each of the connecting wires 124D can be covered by the package portion 11D without being directly exposed to the outside, and thus, when the camera module is assembled, the connecting wires 124D are not damaged by any touch, and at the same time, the influence of environmental factors on the connecting wires 124D, such as temperature, is reduced, so that the communication connection between the photosensitive chip 121D and the circuit board main body 122D is stable, which is not provided in the prior art at all.
It should be noted that the encapsulating portion 11D encapsulates the circuit element 123D and the connecting wire 124D, which has advantages in protecting the circuit element 123D and the connecting wire 124D and obtaining a more functional image pickup module, but it should be understood by those skilled in the art that the encapsulating portion 11D is not limited to encapsulating the circuit element 123D or the connecting wire 124D. That is, in other embodiments of the present invention, the package portion 11D may be directly molded on the circuit board main body 122D without the protruding circuit element 123D, or may be molded at different positions outside or around the circuit element 123D.
The photosensitive assembly 10D further includes a filter 20D, and the filter 20D is stacked on the photosensitive chip 121D by molding. The edge of the filter 20D is molded in the package portion 11D, thereby fixing the filter 20D. It is worth mentioning that the filter 20D covers above the photosensitive chip 121D, and isolates the photosensitive chip 121D from the external environment, thereby protecting the photosensitive chip 121D from being damaged and preventing dust from entering.
Further, the photo-sensing chip 121D has a photo-sensing area 1211D and a non-photo-sensing area 1212D, and the non-photo-sensing area 1212D surrounds the periphery of the photo-sensing area 1211D. The photosensitive region 1211D is used for performing a photosensitive function, and the connecting line 124D is connected to the non-photosensitive region 1212D.
According to this preferred embodiment of the present invention, the encapsulating portion 11D extends from the non-photosensitive area 1212D of the photosensitive chip 121D, so that the photosensitive chip 121D is stacked and fixed on the circuit board main body 122D by molding. In this way, the inward moldable range of the package 11D is expanded by Molding on the Chip (MOC), so that the structural portions of the circuit board body 122D and the outer side of the package 11D can be reduced, the length and width of the molded second light sensing part 12D can be further reduced, and the length and width of the camera module assembled therefrom can be reduced.
In this embodiment of the present invention, the encapsulation portion 11D convexly surrounds the outside of the photosensitive region 1211D of the photosensitive chip 121D, and particularly, the encapsulation portion 11D is integrally connected in a closed manner, so that the sealing performance is good, so that when the photosensitive assembly 10D is used for assembling the camera module, the photosensitive chip 121D is sealed inside to form a closed inner space.
Specifically, when manufacturing the photosensitive assembly 10D, a conventional circuit board may be selected as the circuit board main body 122D, the photosensitive chip 121D is disposed on the circuit board main body 122D, and the photosensitive chip 121D is electrically connected to the connecting wire 124D, so that the molded circuit board main body 122D and the photosensitive chip 121D are molded after the initial assembly, for example, an injection molding machine is used to mold the circuit board after the SMT (Surface Mount Technology) process is performed by an insert molding (molding) process to form the package portion 11D, or the package portion 11D is formed by a molding process commonly used in semiconductor packaging. The circuit board main body 122D may be selected, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner in which the encapsulation 11D is formed may be selected, by way of example and not limitation, from an injection molding process, a molding process, and the like. The material of the sealing portion 11D is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc. may be selected as the injection molding process, and resin may be used as the molding process. It will be appreciated by persons skilled in the art that the foregoing alternative forms of manufacture, as well as alternative materials, are merely illustrative of the possible embodiments of the invention and are not limiting of the invention.
Further, the packaging portion 11D includes a covering section 111D, a filter mounting section 112D and a lens mounting section 113D, the filter mounting section 112D and the lens mounting section 113D are sequentially and integrally connected to the covering section 111D in a molding manner, and the covering section 111D is connected to the circuit board main body 122D in a molding manner, and is used for covering the circuit element 123D and the connecting wire 124D. The lens mounting section 113D is used for mounting a lens 30D, that is, when the photosensitive assembly 10D is used for assembling the camera module, the lens 30D is mounted inside the lens mounting section 113D of the packaging part 11D so as to provide a stable mounting position for the lens 30D. The lens mounting section 113D has a lens mounting groove 1131D, and the lens mounting groove 1131D communicates with the through hole 1100D to provide a sufficient mounting space for the lens 30D. That is, the sealing part 11D has the mounting groove 1121D and the lens mounting groove 1131D, the filter 20D is mounted in the mounting groove 1121D, and the lens 30D is mounted in the lens mounting groove 1131D.
The lens mounting section 113D integrally extends upward and is internally formed with a stepped structure to provide a supporting and fixing position for the lens 30D, so that it is not necessary to provide an additional part for mounting the lens 30D. In other words, the package portion 11D integrally extends upward and is stepped inside to respectively cover the circuit elements and the connecting wires and support the lens.
The lens mounting section 113D has a lens inner wall 1132D, the lens inner wall 1132D is a closed ring shape, and is suitable for providing a mounting space for the lens 30D. It should be noted that the inner wall 1132D of the lens mounting section 113D has a flat surface, so that the lens 30D without a screw thread is suitable for mounting to form a fixed focus module. In particular, the lens 30D may be fixed to the lens mount section 113D by means of bonding.
It is worth mentioning that the inner wall of the wrapping segment 111D of the encapsulating portion 11D may be disposed according to the shape of the connection, such as being disposed in an inclined shape, so as to wrap the connection line 124D while allowing the photosensitive chip 121D to receive more light. It should be understood by those skilled in the art that the shape of the packing portion 11D is not a limitation of the present invention.
Referring to fig. 20, a camera module according to a fifth preferred embodiment of the present invention. The camera module can be a fixed focus module. The camera module comprises the photosensitive assembly 10D and the lens 30D.
More specifically, the lens 30D is mounted to the lens mounting groove 1131D of the lens mounting section 113D of the packaging portion 11D of the photosensitive member 10D. The filter 20D is molded on the photosensitive element 11D, so that there is no need to provide an additional filter, and there is no need to separately install the filter when assembling the image pickup mold, thereby reducing the assembling process, and the back focus of the image pickup module can be reduced by molding the filter.
It should be noted that the lens 30D is mounted on the lens mounting section 113D of the packaging portion 11D of the photosensitive assembly 10D, so that the packaging portion 11D is equivalent to a bracket or a lens barrel in a conventional camera module, and provides a supporting and fixing position for the lens 30D, but the assembly is different from the conventional COB process. The bracket of the camera module of the traditional COB process is fixed on a circuit board in a sticking way, the packaging part 11D is fixed on the circuit board main body 122D through a molding process without a sticking and fixing process, the molding way has better connection stability and controllability of the process compared with the sticking and fixing, and a glue space for AA adjustment is not required to be reserved between the packaging part 11D and the circuit board main body 122D, so that the reserved space for AA adjustment of the traditional camera module is reduced, the thickness of the camera module is reduced, and the packaging part 11D according to the molding way of the invention has better flatness, so that the AA adjustment is not required when the camera module is assembled; on the other hand, the encapsulating portion 11D encapsulates the circuit element 123D and the connecting line 124D, so that the conventional bracket function, the circuit element 123D and the connecting line 124D can be spatially overlapped, and a safe distance is reserved around the circuit device without the need of a conventional camera module, so that the height of the encapsulating portion 11D having the bracket function can be set in a small range, thereby further providing a space in which the thickness of the camera module can be reduced. In addition, the packaging part 11D replaces a traditional support and provides a mounting position for the lens 30D, so that an inclination error caused by the support during pasting and assembling is avoided, and an accumulated tolerance of camera module assembling is reduced. The package portion 11D covers the connecting line 124D, and the package portion 11D extends to the non-photosensitive region 1212D of the photosensitive chip 121D, so that the package portion 11D can contract inward, thereby further reducing the transverse length and width of the camera module.
Referring to fig. 21 and 22, a photosensitive assembly and a camera module according to a sixth preferred embodiment of the present invention will be explained. The photosensitive assembly 10E is used for assembling and manufacturing the camera module, so that the camera module of a molded type is obtained. The photosensitive assembly 10E includes a sealing portion 11E and a photosensitive portion 12E, and the sealing portion 11E is connected to the photosensitive portion 12E by molding.
The light sensing portion 12E includes a circuit board main body 122E and a light sensing chip 121E, and the light sensing chip 121E is disposed on the circuit board main body 122E. According to this embodiment of the present invention, the photosensitive chip 121E is mold-coupled to the wiring version body.
According to this embodiment of the present invention, the light sensing section 12E includes a connection wiring (not shown) and at least one circuit element 123E. The connecting line is preset in the circuit board main body 122E, and the circuit element 123E is electrically connected to the connecting line and the photosensitive chip 121E, so as to provide a photosensitive working process of the photosensitive chip 121E. The circuit element 123E is protrudingly disposed on the circuit board main body 122E. The circuit element 123E may be, for example and without limitation, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.
It should be noted that the circuit element 123E is encapsulated by the encapsulating portion 11E, so that the circuit element 123E is not directly exposed in the space, more specifically, not exposed in the environment communicated with the photosensitive chip 121E, and thus when the camera module is assembled, the circuit element 123E is not contaminated by contaminants such as dust, and the photosensitive chip 121E is not affected, which is different from the existing manner of exposing the circuit element 123E in the conventional camera module, such as a container blocking member, so that the dust and the contaminants are prevented from staying on the surface of the circuit element 123E by the mold encapsulation manner, and the adverse phenomena such as contamination of the photosensitive chip 121E and black spots of the camera module are avoided.
The packaging portion 11E forms a through hole 1100E to provide a photosensitive path for the photosensitive chip 121E.
According to this preferred embodiment of the present invention, the light sensing section 12E includes at least one connecting wire 124E for electrically connecting the light sensing chip 121E and the wiring board main body 122E. Further, each of the connection lines 124E may be implemented as, specifically but not necessarily limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like. Particularly, the connecting line 124E connects the photosensitive chip 121E and the circuit board main body 122E in an arc shape.
It should be noted that each of the connecting wires 124E is molded inside the package portion 11E, so that each of the connecting wires 124E can be covered by the package portion 11E without being directly exposed to the outside, and thus, when the camera module is assembled, the connecting wires 124E are not damaged by any touch, and at the same time, the influence of environmental factors on the connecting wires 124E, such as temperature, is reduced, so that the communication connection between the photosensitive chip 121E and the circuit board main body 122E is stable, which is not provided in the prior art at all.
It is worth mentioning that the encapsulating portion 11E encapsulates the circuit element 123E and the connecting wire 124E, which has advantages in protecting the circuit element 123E and the connecting wire 124E and obtaining a more functional camera module, but it should be understood by those skilled in the art that the encapsulating portion 11E is not limited to encapsulate the circuit element 123E or the connecting wire 124E. That is, in other embodiments of the present invention, the package portion 11E may be directly molded on the circuit board main body 122E without the protruding circuit element 123E, or may be molded at different positions outside or around the circuit element 123E.
The photosensitive assembly 10E further includes a filter 20E, and the filter 20E is stacked on the photosensitive chip 121E by molding. The edge of the filter 20E is molded to the package portion 11E, thereby fixing the filter 20E. It is worth mentioning that the filter 20E covers above the photosensitive chip 121E, and isolates the photosensitive chip 121E from the external environment, thereby protecting the photosensitive chip 121E from being damaged and preventing dust from entering.
Further, the photo-sensing chip 121E has a photo-sensing area 1211E and a non-photo-sensing area 1212E, and the non-photo-sensing area 1212E surrounds the periphery of the photo-sensing area 1211E. The photosensitive region 1211E is used for performing a photosensitive function, and the connecting line 124E is connected to the non-photosensitive region 1212E.
According to this preferred embodiment of the present invention, the encapsulating portion 11E extends from the non-photosensitive area 1212E of the photosensitive chip 121E, so that the photosensitive chip 121E is stacked and fixed on the circuit board main body 122E by molding. In this way, the inward moldable range of the package 11E is expanded by Molding on a chip (Molding on chip), so that the structural portions of the circuit board body 122E and the outer side of the package 11E can be reduced, the length and width of the molded light-sensing part 12E can be further reduced, and the length and width of the camera module assembled by the molded light-sensing part can be reduced.
In this embodiment of the present invention, the encapsulation portion 11E convexly surrounds the outside of the photosensitive region 1211E of the photosensitive chip 121E, and particularly, the encapsulation portion 11E is integrally connected in a closed manner, so that the sealing performance is good, so that when the photosensitive assembly 10E is used for assembling the camera module, the photosensitive chip 121E is sealed inside to form a closed inner space.
Specifically, when manufacturing the photosensitive assembly 10E, a conventional circuit board may be selected as the circuit board main body 122E, the photosensitive chip 121E is disposed on the circuit board main body 122E, the photosensitive chip 121E is electrically connected through the connecting line 124E, and then molding is performed on the molded circuit board main body 122E and the photosensitive chip 121E after the initial assembly, for example, an injection molding machine is used to mold the circuit board after performing an SMT (Surface Mount Technology) process by an insert molding (molding) process to form the encapsulation portion 11E, or the encapsulation portion 11E is formed by a molding process commonly used in semiconductor packaging. The circuit board main body 122E may be selected, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner in which the encapsulation 11E is formed may be selected, by way of example and not limitation, from an injection molding process, a molding process, and the like. The material of the sealing portion 11E is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc. may be selected as the injection molding process, and resin may be used as the molding process. It will be appreciated by persons skilled in the art that the foregoing alternative forms of manufacture, as well as alternative materials, are merely illustrative of the possible embodiments of the invention and are not limiting of the invention.
Further, the packaging part 11E includes a covering section 111E and a lens mounting section 113E, the lens mounting section 113E is integrally connected to the covering section 111E by molding, and the covering section 111E is connected to the circuit board main body 122E by molding, for covering the circuit element 123E and the connecting wire 124E. The lens mounting section 113E is used for mounting a lens 30E, that is, when the photosensitive assembly 10E is used for assembling the camera module, the lens 30E is mounted inside the lens mounting section 113E of the packaging part 11E, so as to provide a stable mounting position for the lens 30E.
Further, the lens mounting section 113E has a lens mounting groove 1131E, and the lens mounting groove 1131E is communicated with the through hole 1100E, so as to provide sufficient mounting space for the lens 30E. That is, the package portion 11E has the lens mounting groove 1131E, and the lens 30E is mounted in the lens mounting groove 1131E.
The lens mounting section 113E integrally extends upward along the covering 111E and is internally formed with a stepped structure to provide a supporting and fixing position for the lens 30E, so that it is not necessary to provide an additional part for mounting the lens 30E. In other words, the package portion 11E integrally extends upward and is stepped inside to respectively cover the circuit elements and the connection line 124E and support the lens 30E.
The lens mounting section 113E has a lens inner wall 1132E, and the lens inner wall 1132E is in a closed ring shape and is suitable for the lens 30E to provide a mounting space. It should be noted that the surface of the inner lens wall 1132E of the lens mounting section 113E has a thread structure, so as to be suitable for mounting the threaded lens 30E to form a fixed focus module. In particular, the lens 30E may be fixed to the lens mounting section 113E by a screw coupling manner.
It is worth mentioning that the inner wall of the molded cladding section 111E may be arranged, for example, inclined according to the shape of the connection, so as to cover the connection line 124E and enable the photosensitive chip 121E to receive multiple light rays. It should be understood by those skilled in the art that the shape of the packing portion 11E is not a limitation of the present invention.
Referring to fig. 22, a camera module according to a sixth preferred embodiment of the present invention. The camera module can be a fixed focus module. The camera module comprises the photosensitive assembly 10E and the lens 30E.
More specifically, the lens 30E is mounted to the lens mounting groove 1131E of the lens mounting section 113E of the package portion 11E of the photosensitive member 10E. The filter 20E is molded on the photosensitive element 11E, so that it is not necessary to provide an additional filter, and it is also not necessary to separately install the filter when assembling the camera module, thereby reducing the assembly process of the camera module, and the back focus of the camera module can be reduced by molding the filter.
It should be noted that the lens 30E is mounted on the lens mounting section 113E of the packaging part 11E of the photosensitive assembly 10E, so that the packaging part 11E functions as a bracket or a lens barrel in a conventional camera module, and provides a supporting and fixing position for the lens 30E, but the assembly is different from the conventional COB process. The bracket of the camera module of the traditional COB process is fixed on the circuit board in a sticking way, the packaging part 11E is fixed on the circuit board main body 122E through a molding process, the sticking and fixing process is not needed, the molding way has better connection stability and controllability of the process compared with the sticking and fixing, and a glue space for AA adjustment is not needed to be reserved between the packaging part 11E and the circuit board main body 122E, so that the reserved space for AA adjustment of the traditional camera module is reduced, and the thickness of the camera module is reduced; on the other hand, the encapsulating portion 11E encapsulates the circuit element 123E and the connecting line 124E, so that the conventional support function, the circuit element 123E and the connecting line 124E can be spatially overlapped, and a safe distance is reserved around the circuit device without the need of a conventional camera module, so that the height of the encapsulating portion 11E having the support function can be set in a small range, thereby further providing a space in which the thickness of the camera module can be reduced. In addition, the packaging part 11E replaces a traditional bracket and provides a mounting position for the lens 30E, so that an inclination error caused by the bracket during pasting and assembling is avoided, and an accumulated tolerance of camera module assembling is reduced. The package portion 11E covers the connecting line 124E, and the package portion 11E extends to the non-photosensitive area 1212E of the photosensitive chip 121E, so that the package portion 11E can contract inward, thereby further reducing the transverse length and width of the camera module.
Referring to fig. 23 and 24, a photosensitive assembly and a camera module according to a seventh preferred embodiment of the present invention will be explained. The photosensitive assembly 10F is used for assembling and manufacturing the camera module, so that the camera module of a molding type is obtained. The photosensitive assembly 10F includes a sealing portion 11F and a photosensitive portion 12F, and the sealing portion 11F is connected to the photosensitive portion 12F by molding.
The light sensing portion 12F includes a circuit board body 122F and a light sensing chip 121F, and the light sensing chip 121F is disposed on the circuit board body 122F. According to this embodiment of the present invention, the photosensitive chip 121F is mold-coupled to the wiring body 122F.
According to this embodiment of the present invention, the light sensing section 12F includes a connection wiring (not shown) and at least one circuit element 123F. The connecting line is preset in the circuit board main body 122F, and the circuit element 123F is electrically connected to the connecting line and the photosensitive chip 121F, so as to provide a photosensitive working process of the photosensitive chip 121F. The circuit element 123F is protrudingly disposed on the circuit board main body 122F. The circuit element 123F may be, for example and without limitation, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.
It should be noted that the circuit element 123F is encapsulated by the encapsulating portion 11F, so that the circuit element 123F is not directly exposed in the space, more specifically, is not exposed in the environment communicated with the photosensitive chip 121F, and when the camera module is assembled, the circuit element 123F is not contaminated by dust and other contaminants, and the photosensitive chip 121F is not affected, which is different from the conventional camera module in which the circuit element 123F is exposed, such as a container blocking member, so that dust and other contaminants are prevented from staying on the surface of the circuit element 123F by a mold encapsulation method, and the undesirable phenomena of contamination of the photosensitive chip 121F and occurrence of black spots of the camera module are avoided.
The packaging portion 11F forms a through hole 1100F to provide a photosensitive path for the photosensitive chip 121F.
According to this preferred embodiment of the present invention, the light sensing section 12F includes at least one connecting wire 124F for electrically connecting the light sensing chip 121F and the wiring board main body 122F. Further, each of the connection lines 124F may be implemented as, specifically but not necessarily limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like. Particularly, the connecting line 124F connects the photosensitive chip 121F and the circuit board main body 122F in an arc shape.
It should be noted that each of the connecting wires 124F is molded inside the package portion 11F, so that each of the connecting wires 124F can be covered by the package portion 11F without being directly exposed to the outside, and thus, when the camera module is assembled, the connecting wires 124F are not damaged by any touch, and at the same time, the influence of environmental factors on the connecting wires 124F, such as temperature, is reduced, so that the communication connection between the photosensitive chip 121F and the circuit board main body 122F is stable, which is not provided in the prior art at all.
It should be noted that the encapsulating portion 11F encapsulates the circuit element 123F and the connecting wire 124F, which has advantages in protecting the circuit element 123F and the connecting wire 124F and obtaining a more functional camera module, but it should be understood by those skilled in the art that the encapsulating portion 11F is not limited to encapsulating the circuit element 123F or the connecting wire 124F. That is, in other embodiments of the present invention, the sealing portion 11F may be directly molded on the circuit board main body 122F without the protruding circuit element 123F, or may be molded at different positions outside or around the circuit element 123F.
Further, the photo-sensing chip 121F has a photo-sensing region 1211F and a non-photo-sensing region 1212F, wherein the non-photo-sensing region 1212F surrounds the periphery of the photo-sensing region 1211F. The photosensitive region 1211F is used for performing a photosensitive function, and the connecting line 124F is connected to the non-photosensitive region 1212F.
According to this preferred embodiment of the present invention, the encapsulating portion 11F extends from the non-photosensitive area 1212F of the photosensitive chip 121F, so that the photosensitive chip 121F is stacked and fixed to the circuit board main body 122F by molding. In this way, the inward moldable range of the package 11F is expanded by Molding on a chip (Molding on chip), so that the structural portions of the circuit board body 122F and the outer side of the package 11F can be reduced, the length and width of the molded light-sensing part 12F can be further reduced, and the length and width of the camera module assembled by the molded light-sensing part can be reduced.
In this embodiment of the present invention, the encapsulation portion 11F convexly surrounds the outside of the light sensing region 1211F of the light sensing chip 121F, and particularly, the encapsulation portion 11F is integrally connected in a closed manner, so that the sealing performance is good, so that when the light sensing assembly 10F is used for assembling the camera module, the light sensing chip 121F is sealed inside to form a closed inner space.
Specifically, when manufacturing the photosensitive assembly 10F, a conventional circuit board may be selected as the circuit board main body 122F, the photosensitive chip 121F is disposed on the circuit board main body 122F, the photosensitive chip 121F is electrically connected through the connecting wire 124F, and then the molded circuit board main body 122F and the photosensitive chip 121F after the initial assembly are molded, for example, an injection molding machine is used to mold the circuit board after the SMT (Surface Mount Technology) process is performed through an insert molding (molding) process to form the package portion 11F, or the package portion 11F is formed through a molding process commonly used in semiconductor packaging. The circuit board main body 122F may be selected, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner in which the enclosure 11F is formed may be selected, by way of example and not limitation, from an injection molding process, a molding process, and the like. The material of the sealing portion 11F is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc. may be selected as the injection molding process, and resin may be used as the molding process. It will be appreciated by persons skilled in the art that the foregoing alternative forms of manufacture, as well as alternative materials, are merely illustrative of the possible embodiments of the invention and are not limiting of the invention.
Further, the package portion 11F includes a cover segment 111F and a filter mounting segment 112F, the filter mounting segment 112F is integrally connected to the cover segment 111F by molding, and the cover segment 111F is connected to the circuit board main body 122F by molding, for covering the circuit element 123F and the connecting wire 124F. The filter mounting section 112F is used for mounting a filter 20F, that is, when the photosensitive assembly 10F is used for assembling the camera module, the filter 20F of the camera module is mounted on the filter mounting section 112F, so that the filter 20F is located on the photosensitive path of the photosensitive chip 121F, and no additional filter 20F mounting bracket is required. That is, the encapsulating portion 11F functions as a conventional holder, but the top of the filter mounting segment 112F can be molded to have good flatness due to the advantages of the molding process, so that the filter 20F can be mounted flat, which is also superior to the conventional camera module.
Furthermore, the filter mounting segment 112F has a mounting groove 1121F, and the supporting groove is communicated with the through hole 1100F to provide sufficient mounting space for the filter 20F, so that the filter 20F does not protrude from the top surface of the filter mounting segment 112F. That is, the mounting groove 1121F is provided at the upper end of the sealing part 11F so that the filter 20F is mounted on the sealing part 11F and does not protrude from the top end of the sealing part 11F.
It is worth mentioning that the inner wall of the sealing portion 11F may be disposed, for example, in an inclined shape according to the shape of the connecting line 124F, so as to cover the connecting line 124F and allow the photosensitive chip 121F to receive the same number of light rays. It should be understood by those skilled in the art that the shape of the encapsulant 11F is not a limitation of the present invention.
Unlike the preferred embodiment, the circuit board main body 122F has at least one reinforcing hole 1221F, and the encapsulating portion 11F extends into the reinforcing hole 1221F, thereby reinforcing the structural strength of the circuit board main body 122F. In other words, two different materials are combined with each other to form a composite material structure, so that the structural strength of the wiring board main body 122F as a base is enhanced.
The positions of the reinforcing holes 1221F may be selected as desired, and may be set according to the structural strength requirements of the circuit board, for example, in a symmetrical structure. The reinforcing holes 1221F are provided to enhance the structural strength of the circuit board main body 122F, so that the thickness of the circuit board main body 122F can be reduced, the thickness of a camera module assembled by the circuit board main body 122F can be reduced, and the heat dissipation performance of the photosensitive assembly 10F can be improved.
It is worth mentioning that, in this embodiment of the present invention, the reinforcing holes 1221F are groove-shaped, so that the molding material of the encapsulating portion 11F does not leak out of the reinforcing holes 1221F when the photosensitive assembly 10F is manufactured.
Similar to the above preferred embodiment, the photosensitive assembly 10F can be assembled into a fixed focus module or a moving focus module, and it should be understood by those skilled in the art that the assembling application of the photosensitive assembly 10F is not a limitation of the present invention.
Referring to fig. 25, a photosensitive assembly according to an eighth preferred embodiment of the present invention will be explained. The photosensitive assembly 10G is used for assembling and manufacturing the camera module, so that the camera module of a molding type is obtained. The photosensitive assembly 10G includes a sealing portion 11G and a photosensitive portion 12G, and the sealing portion 11G is connected to the photosensitive portion 12G by molding.
The light sensing portion 12G includes a circuit board main body 122G and a light sensing chip 121G, and the light sensing chip 121G is disposed on the circuit board main body 122G. According to this embodiment of the present invention, the photosensitive chip 121G is mold-coupled to the line version body.
According to this embodiment of the present invention, the light sensing section 12G includes a connection line (not shown) and at least one circuit element 123G. The connecting line is preset in the circuit board main body 122G, and the circuit element 123G is electrically connected to the connecting line and the photosensitive chip 121G for photosensitive operation of the photosensitive chip 121G. The circuit element 123G is protrudingly disposed on the circuit board main body 122G. The circuit element 123G may be, for example and without limitation, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.
It should be noted that the circuit element 123G is covered by the packaging portion 11G, so that the circuit element 123G is not directly exposed in the space, more specifically, in the environment communicating with the photosensitive chip 121G, and when the camera module is assembled, the circuit element 123G is not contaminated by contaminants such as dust, and the photosensitive chip 121G is not affected, which is different from the conventional camera module in which the circuit element 123G is exposed, such as a container blocking member, so that the dust and the contaminants are prevented from staying on the surface of the circuit element 123G by a mold covering manner, and the adverse phenomena of the photosensitive chip 121G, such as black spots, of the camera module are prevented from being contaminated.
The packaging part 11G forms a through hole 1100G to provide a photosensitive path for the photosensitive chip 121G.
According to this preferred embodiment of the present invention, the light sensing section 12G includes at least one connection line 124G for electrically connecting the light sensing chip 121G and the wiring board main body 122G. Further, each of the connection lines 124G may be implemented as, specifically but not necessarily limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like. Particularly, the connecting line 124G connects the photosensitive chip 121G and the circuit board main body 122G in an arc shape.
It should be noted that each of the connecting wires 124G is molded inside the package portion 11G, so that each of the connecting wires 124G can be covered by the package portion 11G without being directly exposed to the outside, and thus, when the camera module is assembled, the connecting wires 124G are not damaged by any touch, and at the same time, the influence of environmental factors on the connecting wires 124G, such as temperature, is reduced, so that the communication connection between the photosensitive chip 121G and the circuit board main body 122G is stable, which is not provided in the prior art at all.
It should be noted that the encapsulating portion 11G encapsulates the circuit element 123G and the connecting wire 124G, which has advantages in protecting the circuit element 123G and the connecting wire 124G and obtaining a better performance of the camera module, but it should be understood by those skilled in the art that the encapsulating portion 11G is not limited to encapsulate the circuit element 123G or the connecting wire 124G. That is, in other embodiments of the present invention, the package portion 11G may be directly molded on the circuit board main body 122G without the protruding circuit element 123G, or may be molded at different positions outside or around the circuit element 123G.
Further, the photo-sensing chip 121G has a photo-sensing area 1211G and a non-photo-sensing area 1212G, and the non-photo-sensing area 1212G surrounds the periphery of the photo-sensing area 1211G. The photosensitive region 1211G is used for performing a photosensitive function, and the connecting line 124G is connected to the non-photosensitive region 1212G.
According to this preferred embodiment of the present invention, the encapsulation portion 11G extends to the non-photosensitive area 1212G of the photosensitive chip 121G, so that the photosensitive chip 121G is stacked and fixed to the circuit board main body 122G by molding. In this way, the inward moldable range of the package 11G is expanded by Molding on a chip (Molding on chip), so that the structural portions of the circuit board body 122G and the outer side of the package 11G can be reduced, the length and width dimensions of the molded light-sensing part 12G can be further reduced, and the length and width dimensions of the camera module assembled by the molded light-sensing part can be reduced.
In this embodiment of the present invention, the encapsulation portion 11G convexly surrounds the outside of the photosensitive region 1211G of the photosensitive chip 121G, and particularly, the encapsulation portion 11G is integrally and closely connected, so that the sealing performance is good, so that when the photosensitive assembly 10G is used for assembling the camera module, the photosensitive chip 121G is sealed inside to form a closed inner space.
Specifically, when manufacturing the photosensitive assembly 10G, a conventional circuit board may be selected as the circuit board main body 122G, the photosensitive chip 121G is disposed on the circuit board main body 122G, the photosensitive chip 121G is electrically connected to the connecting line 124G, and then the molded circuit board main body 122G and the photosensitive chip 121G are molded after the initial assembly, for example, an injection molding machine is used to mold the circuit board after performing an SMT (Surface Mount Technology) process by an insert molding (molding) process to form the package portion 11G, or the package portion 11G is formed by a molding process commonly used in semiconductor packaging. The circuit board main body 122G can be selected, for example and without limitation, from a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner in which the sealing portion 11G is formed may be selected, for example, but not limited to, an injection molding process, a molding process, and the like. The material of the sealing portion 11G is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc. may be selected as the injection molding process, and resin may be used as the molding process. It will be appreciated by persons skilled in the art that the foregoing alternative forms of manufacture, as well as alternative materials, are merely illustrative of the possible embodiments of the invention and are not limiting of the invention.
Further, the package portion 11G includes a wrapping section 111G and a filter mounting section 112G, the filter mounting section 112G is integrally connected to the wrapping section 111G by molding, and the wrapping section 111G is connected to the circuit board main body 122G by molding and is used for wrapping the circuit element 123G and the connecting wire 124G. The filter mounting section 112G is used for mounting a filter 20G, that is, when the photosensitive assembly 10G is used for assembling the camera module, the filter 20G of the camera module is mounted on the filter mounting section 112G, so that the filter 20G is located on the photosensitive path of the photosensitive chip 121G, and an additional filter 20G mounting bracket is not required to be provided. That is, the encapsulating portion 11G functions as a conventional holder, but the top of the filter mounting segment 112G can be molded to have good flatness due to the advantages of the molding process, so that the filter 20G can be mounted flat, which is also superior to the conventional camera module.
Furthermore, the filter mounting section 112G has a mounting groove 1121G, and the supporting groove is communicated with the through hole 1100G to provide a sufficient mounting space for the filter 20G, so that the filter 20G does not protrude from the top surface of the filter mounting section 112G. That is, the mounting groove 1121F is provided at the upper end of the sealing part 11F so that the filter 20F is mounted on the sealing part 11F and does not protrude from the top end of the sealing part 11F.
It is worth mentioning that the inner wall of the sealing portion 11G may be disposed according to the shape of the connection, such as being disposed in an inclined shape, so as to cover the connection line 124G and enable the photosensitive chip 121G to receive more light. It should be understood by those skilled in the art that the shape of the packing portion 11G is not a limitation of the present invention.
Unlike the preferred embodiment, the circuit board main body 122G has at least one reinforcing hole 1221G, and the encapsulating portion 11G extends into the reinforcing hole 1221G, thereby reinforcing the structural strength of the circuit board main body 122G. In other words, two different materials are combined with each other to form a composite material structure, so that the structural strength of the wiring board main body 122G as a base is enhanced.
The position of the reinforcing holes 1221G may be selected as desired, and may be set according to the structural strength requirement of the circuit board, for example, in a symmetrical structure. The reinforcing hole 1221G enhances the structural strength of the circuit board main body 122G, so that the thickness of the circuit board main body 122G can be reduced, the thickness of a camera module assembled by the circuit board main body 122G can be reduced, and the heat dissipation performance of the photosensitive assembly 10G can be improved.
It should be noted that, according to the preferred embodiment of the present invention, the reinforcing holes 1221G are through holes, that is, through the circuit board main body 122G, so that two sides of the circuit board main body 122G are communicated, so that when the photosensitive assembly 10G is manufactured, the molding material of the encapsulating portion 11G is sufficiently combined with the circuit board main body 122G, a more firm composite material structure is formed, and the through holes are easier to process and manufacture relative to the structure of the grooves.
Similar to the above preferred embodiment, the photosensitive assembly 10G can be assembled into a fixed focus module or a movable focus module, and it should be understood by those skilled in the art that the assembling application of the photosensitive assembly 10G is not a limitation of the present invention.
Referring to fig. 26, a camera module according to a ninth preferred embodiment of the present invention will be explained. The camera module may be a Fixed Focus Module (FFM). The camera module comprises a photosensitive assembly 10H, a support 50H, a filter 20H and a lens 30H.
The holder 50H is mounted on the photosensitive element 10H, the filter 20H is mounted on the holder 50H, and the lens 30H is mounted on the holder 50H.
The photosensitive assembly 10H includes a sealing portion 11H and a photosensitive portion 12H, and the sealing portion 11H is connected to the photosensitive portion 12H by molding.
The light sensing portion 12H includes a circuit board main body 122H and a light sensing chip 121H, and the light sensing chip 121H is disposed on the circuit board main body 122H. According to this embodiment of the present invention, the photosensitive chip 121H is mold-coupled to the line version body.
According to this embodiment of the present invention, the light sensing section 12H includes a connection line (not shown) and at least one circuit element 123H. The connecting line is preset in the circuit board main body 122H, and the circuit element 123H is electrically connected to the connecting line and the photosensitive chip 121H, so as to provide a photosensitive working process of the photosensitive chip 121H. The circuit element 123H is protrudingly disposed on the circuit board main body 122H. The circuit element 123H may be, for example and without limitation, a resistor, a capacitor, a diode, a transistor, a potentiometer, a relay, a driver, or the like.
It should be noted that the circuit element 123H is covered by the packaging portion 11H, so that the circuit element 123H is not directly exposed in the space, more specifically, in the environment communicating with the photosensitive chip 121H, and thus when the camera module is assembled, the circuit element 123H is not contaminated by contaminants such as dust, and the photosensitive chip 121H is not affected, which is different from the conventional camera module in which the circuit element 123H is exposed, such as a container blocking member, so that the dust and the contaminants are prevented from staying on the surface of the circuit element 123H by a mold covering manner, and the adverse phenomena of the photosensitive chip 121H, such as black spots, of the camera module are prevented from being contaminated.
The packaging portion 11H forms a through hole 1100H to provide a photosensitive path for the photosensitive chip 121H.
According to this preferred embodiment of the present invention, the light sensing section 12H includes at least one connecting line 124H for electrically connecting the light sensing chip 121H and the wiring board main body 122H. Further, each of the connection lines 124H may be implemented as, specifically but not necessarily limited to, a gold wire, a copper wire, an aluminum wire, a silver wire, or the like. Particularly, the connecting line 124H connects the photosensitive chip 121H and the circuit board main body 122H in an arc shape.
It should be noted that each of the connecting wires 124H is molded inside the package portion 11H, so that each of the connecting wires 124H can be covered by the package portion 11H without being directly exposed to the outside, and thus, when the camera module is assembled, the connecting wires 124H are not damaged by any touch, and at the same time, the influence of environmental factors on the connecting wires 124H, such as temperature, is reduced, so that the communication connection between the photosensitive chip 121H and the circuit board main body 122H is stable, which is not provided in the prior art at all.
It should be noted that the encapsulating portion 11H encapsulates the circuit element 123H and the connecting wire 124H, which has advantages in protecting the circuit element 123H and the connecting wire 124H and obtaining a more functional camera module, but it should be understood by those skilled in the art that the encapsulating portion 11H is not limited to encapsulating the circuit element 123H or the connecting wire 124H. That is, in other embodiments of the present invention, the package portion 11H may be directly molded on the circuit board main body 122H without the protruding circuit element 123H, or may be molded at different positions outside or around the circuit element 123H.
Further, the photo-sensing chip 121H has a photo-sensing region 1211H and a non-photo-sensing region 1212H, and the non-photo-sensing region 1212H surrounds the periphery of the photo-sensing region 1211H. The photosensitive region 1211H is used for performing a photosensitive function, and the connecting line 124H is connected to the non-photosensitive region 1212H.
According to this preferred embodiment of the present invention, the encapsulation portion 11H extends to the non-photosensitive area 1212H of the photosensitive chip 121H, so that the photosensitive chip 121H is stacked and fixed to the circuit board main body 122H by molding. In this way, the inward Molding range of the package portion 11H is expanded by Molding on the chip (MOC), so that the structural portions of the circuit board main body 122H and the outer side of the package portion 11H can be reduced, the length and width of the molded light-sensing portion 12H can be further reduced, and the length and width of the camera module assembled by the molded light-sensing portion can be reduced.
In this embodiment of the present invention, the encapsulation portion 11H convexly surrounds the outside of the light sensing region 1211H of the light sensing chip 121H, and particularly, the encapsulation portion 11H is integrally connected in a closed manner, so that the encapsulation portion has good sealing performance, so that when the light sensing assembly 10H is used for assembling the camera module, the light sensing chip 121H is sealed inside to form a closed inner space.
Specifically, when manufacturing the photosensitive assembly 10H, a conventional circuit board may be selected as the circuit board main body 122H, the photosensitive chip 121H is disposed on the circuit board main body 122H, the photosensitive chip 121H is electrically connected through the connecting wire 124H, and then the molded circuit board main body 122H and the photosensitive chip 121H after the initial assembly are molded, for example, an injection molding machine is used to mold the circuit board after the SMT (Surface Mount Technology) process is performed through an insert molding (molding) process to form the package portion 11H, or the package portion 11H is formed through a molding process commonly used in semiconductor packaging. The circuit board main body 122H can be selected, for example, but not limited to, a rigid-flex board, a ceramic substrate (without a flexible board), a PCB rigid board (without a flexible board), and the like. The manner in which the encapsulation 11H is formed may be selected, by way of example and not limitation, from an injection molding process, a molding process, and the like. The material of the sealing portion 11H is, for example, but not limited to, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc. may be selected as the injection molding process, and resin may be used as the molding process. It will be appreciated by persons skilled in the art that the foregoing alternative forms of manufacture, as well as alternative materials, are merely illustrative of the possible embodiments of the invention and are not limiting of the invention.
The enclosure 11H provides a mounting location for the bracket 50H, and the enclosure 11H can be molded to have good flatness due to the advantages of the molding process, so that the bracket 50H can be mounted smoothly.
It is worth mentioning that the inner wall of the packaging part 11H may be disposed according to the shape of the connection, such as being disposed in an inclined shape, so as to cover the connection line 124H and enable the photosensitive chip 121H to receive more light. It should be understood by those skilled in the art that the shape of the packing portion 11H is not a limitation of the present invention.
The molded circuit assembly may also be assembled into a moving focus camera module in other embodiments of the present invention, so that the focal length of the camera module can be changed, and it should be understood by those skilled in the art that the type of camera module is not a limitation of the present invention.
Fig. 27 is a photosensitive assembly and a camera module according to a tenth preferred embodiment of the present invention. Different from the above preferred embodiment, the photosensitive assembly 10 includes a shielding layer 126I, and the shielding layer 126I wraps the circuit board main body 122 and the packaging part 11, so as to enhance the structural strength of the circuit board main body 122 and enhance the electromagnetic interference resistance of the photosensitive assembly 10.
Further, the shielding layer 126I is a metal layer, and may be a plate structure or a mesh structure.
Referring to fig. 28A and 28B, a comparison between the camera module according to the above preferred embodiment of the present invention and a conventional camera module is illustrated. In fig. 28A, the left side represents a conventional camera module, and the right side represents a camera module in the present invention. In fig. 28B, the left side represents a conventional wiring board manufacturing process, and the right side represents a photosensitive element manufacturing process of the present invention.
From the above, it can be clearly seen that the photosensitive assembly and the camera module of the present invention have the following advantages:
1. the length and width of the camera module can be reduced, and the packaging part and the circuit element, such as the resistance capacitance device, can be overlapped in space; in the traditional scheme, the bracket is required to be arranged outside the capacitor, and a certain safety distance is required to be reserved.
2. The inclination of the module is reduced, the packaging part can replace the design of the existing plastic bracket, and the accumulated tolerance is reduced;
3. the structural strength of the circuit board is improved by molding, and the strength can be improved because the packaging part can play a supporting role under the same structural strength, so that the circuit board can be thinner, and the height of the module is reduced;
4. in the height space, the capacitor and the base of the traditional scheme need to be reserved for assembling a safe space, the molding process can be omitted, and the height of the module is reduced; the safe clearance needs to be reserved apart from the support to traditional scheme electric capacity top, prevents to interfere, and the new scheme can be directly fill the plastic around the electric capacity.
5. The resistance-capacitance device can be wrapped by molding, so that bad module smudginess and blackness caused by solder resist, dust and the like in the resistance-capacitance device area can be avoided, and the product yield is improved;
6. the photosensitive assembly is suitable for high-efficiency large-scale mass production, and is more suitable for large-scale makeup operation. Based on the molding mode of the photosensitive assembly, the photosensitive assembly is more suitable for makeup operation, and the manufacturing of a large number of photosensitive assemblies can be completed at one time, for example, 80 to 90 photosensitive assemblies can be completed, while the traditional circuit board can only produce 8 photosensitive assemblies at one time.
It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims (25)

1. A sensitization subassembly of module of making a video recording, its characterized in that includes:
a packaging part;
a light sensing portion; and
a support; the light sensing part comprises a circuit board main body and a light sensing chip, the packaging part is packaged and formed on the circuit board main body and the light sensing chip in a molding mode, a through hole is formed in the packaging part and is opposite to the light sensing chip so as to provide a light path of the light sensing chip, the packaging part is provided with a flat top surface, the support is installed on the top surface of the packaging part, the light sensing component comprises a light filter, and the light filter is installed on the support.
2. The photosensitive assembly of claim 1 wherein the holder has a slot, the filter being mounted to the slot.
3. The photosensitive assembly according to claim 1, wherein the top end of the packaging part has a mounting groove, and the mounting groove is communicated with the through hole.
4. The photosensitive assembly of claim 3 wherein said bracket is mounted to said mounting slot.
5. The photosensitive assembly according to any one of claims 1 to 4, wherein the bottom of the through hole of the encapsulation portion is inclined to increase gradually from bottom to top.
6. A photosensitive assembly according to any one of claims 1 to 4 wherein the mount is for mounting a lens and/or motor of the camera module.
7. The photosensitive assembly according to any one of claims 1 to 4, wherein the photosensitive part includes at least one circuit component, the circuit component protrudes from the circuit board main body, and the encapsulating part encapsulates the circuit component.
8. The photosensitive assembly according to any one of claims 1 to 4, wherein the photosensitive portion includes at least one connection line, each of the connection lines electrically connects the photosensitive chip and the circuit board main body, and the encapsulating portion encapsulates the connection line.
9. The photosensitive assembly of any one of claims 1-4, wherein the photosensitive chip includes a photosensitive region and a non-photosensitive region, the non-photosensitive region surrounding the photosensitive region, the encapsulant extending to the non-photosensitive region of the photosensitive chip.
10. The photosensitive assembly of any of claims 1-4, wherein the photosensitive portion includes a reinforcement layer, the reinforcement layer being laminated to the bottom of the circuit board body.
11. A photosensitive assembly according to any one of claims 1 to 4, wherein at least a part of the inner wall of the package portion for forming the through hole is an inclined inner wall.
12. A camera module, comprising:
the light sensing assembly comprises a packaging part, a light sensing part, a support and a light filter, wherein the light filter is arranged on the support, the light sensing part comprises a circuit board main body and a light sensing chip, the packaging part is molded and packaged on the circuit board main body and the light sensing chip, a through hole is formed in the packaging part and is opposite to the light sensing chip so as to provide a light path of the light sensing chip, the packaging part is provided with a flat top surface, and the support is arranged on the top surface of the packaging part; and
and the lens is positioned on a photosensitive path of the photosensitive chip of the photosensitive component.
13. The camera module of claim 12, wherein the bracket has a slot, the filter being mounted to the slot.
14. The camera module of claim 12, wherein the lens is mounted to the bracket.
15. The camera module of claim 12, wherein the camera module includes a motor, the lens being mounted to the motor, the motor being mounted to the bracket.
16. The camera module according to claim 12, wherein the top end of the enclosure portion has a mounting groove, and the mounting groove is communicated with the through hole.
17. The camera module of claim 16, wherein the bracket is mounted to the mounting slot.
18. The camera module of claim 17, wherein the lens is mounted to the enclosure.
19. The camera module of claim 17, wherein the camera module includes a motor, the lens being mounted to the motor, the motor being mounted to the enclosure.
20. The camera module according to any one of claims 15-19, wherein the bottom of the through hole of the sealing portion is inclined to increase gradually from bottom to top.
21. The camera module of any of claims 15-19, wherein the light-sensing portion comprises at least one circuit component, the circuit component protrudes from the circuit board body, and the encapsulation portion encapsulates the circuit component.
22. The camera module according to any of claims 15-19, wherein the light sensing portion comprises at least one connecting wire, each connecting wire electrically connects the light sensing chip and the circuit board body, and the encapsulating portion encapsulates the connecting wire.
23. The camera module according to any of claims 15-19, wherein the die includes a photosensitive region and a non-photosensitive region, the non-photosensitive region surrounds the photosensitive region, and the encapsulant is molded to extend to the non-photosensitive region of the die.
24. The camera module of any of claims 15-19, wherein the light-sensing portion comprises a reinforcement layer, and the reinforcement layer is laminated on the bottom of the circuit board body.
25. The camera module of any of claims 15-19, wherein at least a portion of the interior wall of the enclosure portion that is configured to form the through-hole is a sloped interior wall.
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