CN112600999A

CN112600999A - Camera module, molded circuit board assembly thereof, preparation method and electronic equipment

Info

Publication number: CN112600999A
Application number: CN202011416963.1A
Authority: CN
Inventors: 陈振宇; 王明珠; 田中武彦; 郭楠; 赵波杰
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2016-12-30
Filing date: 2016-12-30
Publication date: 2021-04-02
Also published as: CN108270948A; WO2018121752A1; CN110089100A

Abstract

Disclosed are a camera module, a molded circuit board assembly thereof, a manufacturing method and an electronic device. The molded circuit board assembly includes: a molded base having at least one optical window; a circuit board including a substrate and a connection plate, wherein the connection plate is electrically connected to the substrate, the substrate is used for conducting the photosensitive chip, and the molded base is integrally combined with the base; and a reinforcing part integrally combined to a back surface of the substrate.

Description

Camera module, molded circuit board assembly thereof, preparation method and electronic equipment

The present application is a divisional application of chinese patent application having an application number of 201611261899.8 entitled "camera module and its molded circuit board assembly and manufacturing method, and electronic device with camera module".

Technical Field

The application relates to the field of optical imaging, in particular to a camera module, a molded circuit board assembly of the camera module, a preparation method of the molded circuit board assembly and electronic equipment.

Background

In recent years, a camera module has been developed as one of standard configurations of an electronic apparatus, in which the camera module can not only help the camera module to obtain an image about a scene or an object, but also receive an operation from a user to make the electronic apparatus provide various functions, which makes the electronic apparatus increasingly move toward intellectualization. In addition, the market is more and more pursuing for lighter and thinner electronic devices which are convenient to carry and use, so that the lighter and thinner electronic devices become development trends of the electronic devices, and the lighter, thinner and intelligent development trends of the electronic devices make the requirements on the size and the imaging quality of the camera module more and more severe in month 3.

Therefore, how to solve the problems of reducing the volume of the camera module and the problems in the process on the basis of ensuring even improving the imaging quality of the camera module is the focus of the following discussion of the present invention.

Disclosure of Invention

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic apparatus having the camera module, wherein the camera module can be downsized, so that the camera module is particularly suitable for being applied to electronic apparatuses in which slimness is sought.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic apparatus having the camera module, wherein the circuit board assembly forms a molded base on at least one substrate through a molding process, so that the camera module is compact.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic apparatus with a camera module, wherein the circuit board assembly provides a connection plate whose module connection side is electrically connected to the substrate.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic apparatus with a camera module, in which the mold base is first molded on the substrate, and then the module connection side of the connection plate is electrically connected to the substrate.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic apparatus with a camera module, in which a molding die can directly press a position of a module connection side of a board to be used for connecting a connection board when a molding process is performed, to effectively reinforce the effectiveness of connection between the board and the connection board.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic apparatus having the camera module, in which a plurality of substrates can be arranged as a layout unit to be molded simultaneously, so that higher arrangement efficiency and higher molding efficiency can be obtained with respect to a rigid-flex board or a substrate to which a flexible board is connected, thereby improving production efficiency of the camera module.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic apparatus with the camera module, wherein the molded base can further embed a connection position of the substrate and the connection plate, so that reliability of the connection position can be ensured.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic apparatus with the camera module, in which the molded base can further embed the connection position of the substrate and the connection plate, so that the reinforcing member for reinforcing the substrate and the connection plate can be replaced by the molded base to save space and reduce the number of processes.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method for manufacturing the same, and an electronic device with the camera module, wherein the molded base can further extend to the device connecting side of the connecting plate, so as to meet the structural requirements of positioning, limiting, fixing, shielding, etc.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic device having the camera module, wherein the molded base can further wrap an overflowing portion of a conductive medium for connecting the substrate and the connecting board, so as to prevent the overflowing conductive medium from contaminating the camera module, and to ensure an aesthetic appearance of the camera module.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic apparatus having the camera module, in which the connection board can be electrically connected to at least a portion of the back surface of the substrate, so that, when the substrate is subjected to a molding process, the utilization rate of the horizontal dimension of the imposition unit can be further improved and the density of the substrate of the imposition unit can be further improved, thereby achieving better material utilization rate and production efficiency.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic apparatus having the camera module, wherein the connection board can be connected to a side of the board, so that the extending direction of the connection board and the extending direction of the board can be made different, thereby facilitating the subsequent connection of the connection board and the electronic apparatus.

An object of the present invention is to provide a camera module, a molded circuit board assembly thereof, a method of manufacturing the same, and an electronic device having the camera module, wherein the connecting plate can be connected to a side of the substrate, so that the overall size of the camera module can be reduced to reduce the space occupied by the camera module in the electronic device.

In accordance with one aspect of the present invention, the present invention further provides a molded circuit board assembly comprising:

a molded base, wherein the molded base has at least one optical window; and

at least one circuit board, wherein the circuit board comprises at least one substrate and at least one connecting board, wherein the connecting board is connected to the substrate, the substrate is used for conducting at least one photosensitive chip, and the molded base is integrally combined with the substrate, so that the photosensitive chip corresponds to the optical window of the molded base.

According to one embodiment of the invention, the connection plate is connected to the front side of the base plate.

According to one embodiment of the invention, the connection plate is connected to the back side of the base plate.

According to one embodiment of the invention, the connection plate is connected to a side edge of the base plate.

According to an embodiment of the invention, the molded base further embeds the connection locations of the connection plate and the base plate.

According to another aspect of the present invention, the present invention further provides a camera module, which includes:

at least one optical lens;

at least one photosensitive chip; and

at least one circuit board assembly, wherein the circuit board assembly comprises at least one molded base and at least one circuit board, wherein the molded base has at least one optical window, wherein the circuit board comprises at least one substrate and at least one connecting plate, wherein the connecting plate is connected to the substrate, the substrate and the photosensitive chip are conducted, the molded base is integrally combined with the substrate, so that the photosensitive chip corresponds to the optical window of the molded base, and the optical lens is held in a photosensitive path of the photosensitive chip.

According to one aspect of the present invention, the present invention further provides a method of manufacturing a molded circuit board assembly, wherein the method of manufacturing includes the steps of:

a) molding a mold base having at least one optical window on at least one substrate; and

b) connecting a connecting plate to the substrate to manufacture the molded circuit board assembly.

According to one embodiment of the present invention, the step (b) is performed before the step (a), thereby connecting the connection plate to the base plate and then molding the mold base on the base plate.

According to one embodiment of the present invention, at least two of the substrates are arranged to form an imposition unit prior to the step (a), so that the imposition unit is simultaneously molded on at least two of the substrates in the step (a).

According to another aspect of the present invention, the present invention further provides an electronic device, comprising:

an electronic device body; and

at least one camera module, wherein the camera module is set up in the electronic equipment body, wherein the camera module further includes:

at least one optical lens;

at least one photosensitive chip; and

Further objects and advantages of the present application will become apparent from an understanding of the ensuing description and drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the claims.

Drawings

The foregoing and other objects, features and advantages of the application will be apparent from the following more particular description of embodiments of the application, as illustrated in the accompanying drawings. The accompanying drawings are included to provide a further understanding of the embodiments of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application and not to limit the application. In the drawings, like reference numbers generally represent like parts or steps.

Fig. 1 is a perspective view of an electronic device according to a preferred embodiment of the invention.

Fig. 2 is a schematic perspective view of a camera module according to a preferred embodiment of the invention.

Fig. 3A is a schematic cross-sectional view of the camera module according to the above preferred embodiment of the invention.

Fig. 3B is a schematic cross-sectional view of a modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 4 is a schematic cross-sectional view of a circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 5 is a schematic diagram of one of the manufacturing steps of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 6 is a schematic diagram of a second manufacturing step of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 7 is a schematic cross-sectional view of a third manufacturing step of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 8 is a schematic cross-sectional view of four manufacturing steps of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 9 is a schematic cross-sectional view of five steps of manufacturing the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 10 is a schematic cross-sectional view illustrating six steps of manufacturing the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 11 is a schematic cross-sectional view of a seventh step of manufacturing the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 12 is a schematic sectional view of an eighth manufacturing step of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 13 is a schematic cross-sectional view of a variation of the camera module according to the above preferred embodiment of the invention.

Fig. 14 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 15 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 16 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 17 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 18 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 19 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 20 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 21 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 22 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 23 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 24 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 25 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 26 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 27 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 28A is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 28B is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 29 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 30 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 31 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 32 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 33 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 34 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 35 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 36 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 37 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 38 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 39 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 40 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 41 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 42 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 43 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 44 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 45 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 46 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 47 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 48A is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 48B is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 49A is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 49B is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 50 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 51 is a schematic diagram of one of the manufacturing steps of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 52 is a schematic diagram of a second manufacturing step of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 53 is a schematic cross-sectional view of a third manufacturing step of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 54 is a schematic cross-sectional view illustrating four manufacturing steps of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 55 is a schematic cross-sectional view illustrating five steps of manufacturing the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 56 is a schematic cross-sectional view illustrating six steps of manufacturing the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 57 is a schematic sectional view of the seventh manufacturing step of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 58 is a schematic sectional view of an eighth manufacturing step of the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 59 is a schematic sectional view of nine steps of manufacturing the circuit board assembly of the camera module according to the above preferred embodiment of the invention.

Fig. 60 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 61 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 62 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 63 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 64 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 65 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 66 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 67 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 68 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 69 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 70 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 71A is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 71B is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 72 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention. Fig. 73 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 74 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 75 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 76 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 77 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 78 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 79 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 80 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 81 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 82 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 83 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 84 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 85 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 86 is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 87 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 88 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 89 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 90 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 91 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 92 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 93 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 94 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 95 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 96 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 97 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 98 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 99 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 100 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 101 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 102 is a schematic cross-sectional view of another variant of the camera module according to the above preferred embodiment of the invention.

Fig. 103 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 104 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 105 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 106 is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Fig. 107 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 108 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 109 is a schematic cross-sectional view of another variation of the camera module according to the above preferred embodiment of the invention.

Fig. 110 is a schematic cross-sectional view of another modified embodiment of the camera module according to the above preferred embodiment of the invention.

Detailed Description

Hereinafter, example embodiments according to the present application will be described in detail with reference to the accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the present application and not restrictive of the broad disclosure of all embodiments, and that this disclosure is not to be considered as limited to the exemplary embodiments described herein.

The following description is presented to disclose the invention so as to enable any person skilled in the art to practice the invention. The preferred embodiments described below are intended to be examples only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention defined in the following description may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for the convenience of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be considered limiting.

It is understood that the terms "a" and "an" should be interpreted as meaning that a number of one element or element is one in one embodiment, while a number of other elements is one in another embodiment, and the terms "a" and "an" should not be interpreted as limiting the number.

Referring to fig. 1 of the drawings of the specification of the present invention, an electronic device with a camera module according to a preferred embodiment of the present invention is illustrated, wherein the electronic device includes at least one camera module 100 and an electronic device body 200, and the camera module 100 is disposed on the electronic device body 200 for assisting the electronic device body 200 in capturing images.

It should be noted that although fig. 1 illustrates an embodiment in which the camera module 100 is disposed on the back surface of the electronic apparatus body 200 (the side facing away from the display screen of the electronic apparatus body 200), it is understood that the camera module 100 may be disposed on the front surface of the electronic apparatus body 200 (the side of the display screen of the electronic apparatus body 200), or at least one camera module 100 may be disposed on the back surface of the electronic apparatus body 200 and at least one camera module 100 may be disposed on the front surface of the electronic apparatus body 200. Of course, it can be understood by those skilled in the art that the camera module 100 may be disposed on the side of the electronic device body 200.

In addition, the type of the camera module 100 is not limited in the electronic device of the present invention, although the camera module 100 is implemented as a single-lens camera module in the example shown in fig. 1, and in other examples, the camera module 100 may also be implemented as an array camera module, such as but not limited to a dual-lens camera module.

In addition, although the electronic device body 200 of the electronic device shown in fig. 1 is implemented as an example of a smart phone, in other embodiments, the electronic device body 200 may also be implemented as any electronic product capable of being configured with the camera module 100, such as a tablet computer, an electronic book, an MP3/4/5, a personal digital assistant, a camera, a television, a washing machine, a refrigerator, and the like.

Referring to fig. 2 to 3B, the camera module 100 includes at least one optical lens 10, at least one photosensitive chip 20, and at least one circuit board assembly 30, wherein the photosensitive chip 20 is conductively connected to the circuit board assembly 30, and the optical lens 10 is held in a photosensitive path of the photosensitive chip 20. In addition, the circuit board assembly 30 and the electronic apparatus body 200 can be connected to each other, for example, the circuit board assembly 30 and the electronic apparatus body 200 can be electrically connected, so that the camera module 100 is connected to the electronic apparatus body 200. The light reflected by the object enters the camera module 100 from the optical lens 10, and is then received and photoelectrically converted by the photosensitive chip 20 to form an image, so as to obtain an image of the object, wherein a digital signal of the image of the object can be subsequently transmitted to the electronic device body 200, for example, but not limited to, the digital signal can be stored in a memory of the electronic device body 200, and can also be stored in a cloud through the electronic device body 200, and can also be displayed on a display screen of the electronic device body 200.

The circuit board assembly 30 includes a circuit board 31 and a molded base 32. The circuit board 31 includes at least one rigid substrate 311 and at least one flexible connecting plate 312, the substrate 311 has at least one flat mounting area 3111 and an edge area 3112, the connecting plate 312 has a module connecting side 3121 and an equipment connecting side 3122, wherein the photo sensor chip 20 is mounted on the mounting area 3111 of the substrate 311, the mold base 32 and the edge area 3112 of the substrate 311 are integrally combined, wherein the mold base 32 has at least one light window 321, and wherein the photo sensor chip 20 has a photo sensor area corresponding to the light window 321 of the mold base 32. The module connection side 3121 of the connection plate 312 and the edge region 3112 of the substrate 311 are electrically connected together so that the circuit of the connection plate 312 and the circuit of the substrate 311 are conducted, wherein the device connection side 3122 of the connection plate 312 can be electrically connected to the electronic device body 200.

The photosensitive chip 20 and the substrate 311 can be conducted through at least one lead 33, wherein the lead 33 can make two ends of the lead 33 respectively communicate with the photosensitive chip 20 and the substrate 311 through a wire bonding process. The bonding direction of the lead 33 is not limited in the present invention, for example, the bonding direction of the lead 33 may be from the photosensitive chip 20 to the substrate 31, or from the substrate 31 to the photosensitive chip 20. The type of the lead 33 is also not limited, and for example, the lead 33 may be a gold wire, a silver wire, a copper wire, or the like.

Further, the substrate 311 of the circuit board 31 has a front surface 3113 and a back surface 3114, wherein the front surface 3113 and the back surface 3114 correspond to each other. It is understood that, in general, the front face 3113 and the back face 3114 of the substrate 311 are used to define the thickness of the substrate 311. It is understood that the substrate 311 includes at least one layer of plate material, for example, the substrate 311 may be implemented as a hard plate, in which case, the surface of the upper portion of the substrate 311 is defined as the front surface 3113, and the surface of the lower portion of the substrate 311 is defined as the back surface 3114. For another example, the substrate 311 may be formed by stacking a plurality of plates, and thus, it is understood that only the exposed side of the uppermost plate of the substrate 311 is defined as the front surface 3113, and the exposed side of the lowermost plate of the substrate 31 is defined as the back surface 3114. It is understood that the mounting region 3111 and the edge region 3112 of the substrate 311 are formed on the front surface 3113 of the substrate 311.

Although the substrate 311 is generally square, for example, may be square or rectangular when viewed from the top, it will be understood by those skilled in the art that the substrate 311 may have other specific shapes, for example, the substrate 311 may have a substantially square shape when viewed from the top, and the image pickup module 100 of the present invention is not limited in this respect.

In addition, the module connecting side 3121 of the connection plate 312 is generally connected to one side of the edge region 3112 of the substrate 311, and hereinafter, for convenience of description, one side of the edge region 3112 of the substrate 311 used for connecting the module connecting side 3121 of the connection plate 312 is defined as a connection edge side 31121, and one side of the edge region 3112 of the substrate 311 not used for connecting the module connecting side 3121 of the connection plate 312 is defined as a free edge side 31122. Accordingly, it can be understood that the front surface 3113 of the substrate 311 forms the mounting region 3111, the connection edge side 31121 and the free edge side 31122.

It should be noted that the type of the substrate 311 is not limited in the camera module 100 of the present invention, for example, the substrate 311 may be, but is not limited to, a hard board, a rigid-flex board, a ceramic board, and the like, and the type of the connecting board 312 is also not limited in the camera module 100 of the present invention.

The circuit board assembly 30 may further include at least one electronic component 34, wherein at least one of the electronic components 34 may be mounted on the edge region 3112 of the substrate 311 of the circuit board 31, and preferably, the electronic component 34 is mounted on the free edge side 31122 of the substrate 311. The molded base 32 may not embed the electronic components 34 after molding, may embed at least a portion of at least one of the electronic components 34, or may embed all of the electronic components 34. It is understood that when the molded base 32 embeds the electronic component 34 after molding, the molded base 32 can prevent the electronic component 34 from contacting the external environment, thereby preventing the surface of the electronic component 34 from being oxidized. When the mold base 32 embeds all the electronic components 34 after molding, the mold base 32 can separate the adjacent electronic components 34 to prevent the adjacent electronic components 34 from having a bad image of mutual interference, and in addition, the mold base 32 can make the distance between the adjacent electronic components 34 smaller, so that the free edge side 31122 of the substrate 311 can be mounted with a larger number of electronic components 34 and a larger size.

In addition, the mold base 32 can also separate the electronic component 34 from the photosensitive chip 20 to prevent the photosensitive area of the photosensitive chip 20 from being contaminated by the falling objects on the surface of the electronic component 34 or the falling objects at the connecting position of the electronic component 34 and the substrate 311. For example, the molding base 32 may separate the electronic component 34 from the photosensitive chip 20 by embedding the electronic component 34, or may separate the electronic component 34 from the photosensitive chip 20 by respectively locating the electronic component 34 and the photosensitive chip 20 on both sides of the molding base 32.

In other examples, the electronic component 34 may be attached to the back surface 3114 of the substrate 311, so that the length and width of the image pickup module 100 can be further reduced, and the electronic component 34 and the photosensitive chip 20 can be separated from each other.

It is worth mentioning that the type of the electronic component 34 is not limited, for example, the electronic component 34 may be implemented as, but not limited to, a driver, a relay, a processor, a resistor, a capacitor, etc.

Further, with reference to fig. 3A, the camera module 100 includes at least one filter element 40, wherein the filter element 40 is held between the photosensitive chip 20 and the optical lens 10, so that the light reflected by the object entering the camera module 100 from the optical lens 10 is received by the photosensitive chip 20 after passing through the filter element 40, thereby improving the imaging quality of the camera module 100. The type of the filter element 40 is not limited and is selected as desired, for example, in this example, the filter element 40 may be implemented as an infrared cut filter.

The filter element 40 is attached to the top surface of the mold base 32 such that the filter element 40 is held between the optical lens 10 and the photosensitive chip 20.

Further, the top surface of the mold base 32 has at least one outer side surface 322 and at least one inner side surface 323, wherein in one example, the plane of the outer side surface 322 of the mold base 32 and the plane of the inner side surface 323 are in the same plane, and the filter element 40 is attached to the inner side surface 323 of the mold base 32. In another example, a plane of the outer side surface 322 of the mold base 32 and a plane of the inner side surface 323 have a height difference, for example, the plane of the outer side surface 322 of the mold base 32 is higher than the plane of the inner side surface 323, so that the mold base 32 forms at least one filter mounting groove 324, wherein the filter mounting groove 324 communicates with the light window 321, and wherein the filter element 40 mounted on the inner side surface 323 of the mold base 32 is received in the filter mounting groove 324.

In the modified embodiment of the camera module 100 shown in fig. 3B, the camera module 100 further includes at least one frame-shaped holder 50, wherein the filter element 40 is attached to the holder 50, and the holder 50 is attached to the inner side surface 323 of the mold base 32, so that the filter element 40 is held between the optical lens 10 and the photosensitive chip 20, in such a way that the size of the filter element 40 can be reduced to reduce the manufacturing cost of the camera module 100.

The camera module 100 may be an auto-focus and zoom camera module, and referring to fig. 3A and 3B, the camera module 100 may further include at least one driver 60, wherein the optical lens 10 is drivably disposed on the driver 60, and the driver 60 is attached to the outer surface 322 of the mold base 32, so that the optical lens 10 is maintained in the photosensitive path of the photosensitive chip 20. The driver 60 can drive the optical lens 10 to move along the photosensitive path of the photosensitive chip 20, so as to realize focusing and zooming of the image pickup module 100 by adjusting the relative positions of the optical lens 10 and the photosensitive chip 20. It is worth mentioning that the driver 60 may be implemented as, but not limited to, a voice coil motor.

In addition, the image pickup module 100 may also be implemented as a fixed focus image pickup module, that is, the distance between the optical lens 10 and the photosensitive chip 20 is not allowed to be adjusted. For example, in one embodiment, the optical lens 10 may be held on the photosensitive path of the photosensitive chip 20 by a lens barrel, wherein the lens barrel may be attached to the outer side surface 322 of the mold base 32, or may integrally extend from the outer side surface 322 of the mold base 32, and in another embodiment, the optical lens 10 may be directly attached to the mold base 32, for example, the optical lens 10 may be attached to the outer side surface 322 of the mold base 32.

Referring to fig. 5 to 11 of the drawings accompanying the present specification, a manufacturing process of the circuit board assembly 30 of the camera module 100 is explained.

Referring to fig. 5 and 6, two or more substrates 311 may be arranged together to form a imposition unit 300 for a subsequent molding process. For example, in this example, the plurality of substrates 311 may be arranged in two rows to form the imposition unit 300. Each of the electronic components 34 may then be attached to the edge region 3112 of each of the substrates 311. Preferably, each of the electronic components 34 may be attached to the free edge side 31122 of each of the substrates 311, respectively. However, it is understood by those skilled in the art that it is possible to mount the electronic component 34 on the connection edge side 31121 of the substrate 311 or mount the electronic component 34 on the back surface 3114 of the substrate 311. Alternatively, the electronic component 34 may be attached to the substrate 311, and then the substrate 311 may be arranged to form the imposition unit 30.

It should be noted that the substrate 311 may be arranged in other patterns, or the substrate 311 may not be arranged, so that in the subsequent molding process, the molding process may be separately performed on the substrate 311 to form the molding base 32 integrally combined with the substrate 311.

Preferably, the distance between the adjacent substrates 311 of the imposition unit 300 ranges from 0.01mm to 500mm (including 0.01mm and 500mm), and preferably from 0.05mm to 200mm (including 0.05mm and 200 mm). The minimum size of the imposition unit 300 ranges from 1mm to 100000mm (including 1mm and 100000mm), and preferably from 10mm to 1000mm (including 10mm and 1000 mm).

Referring to fig. 7, 8, 9 and 10, the imposition unit 300 is placed in a molding die 400 to perform a molding process.

Specifically, the molding die 400 includes an upper die 401 and a lower die 402, wherein at least one of the upper die 401 and the lower die 402 can be operated to enable clamping and drawing of the molding die 400, wherein at least one molding space 403 can be formed between the upper die 401 and the lower die 402 when the upper die 401 and the lower die 402 are clamped. In addition, when two or more molding spaces 403 are formed between the upper mold 401 and the lower mold 402, at least one communication passage 404 may be formed between the upper mold 401 and the lower mold 402 to communicate the adjacent molding spaces 403.

Further, the upper mold 401 may include a molding guide element 4011 and at least one optical window molding element 4012, wherein each of the optical window molding elements 4012 is molded to the molding guide element 4011, respectively, to form a molding guide groove 4013 between the molding guide element 4011 and the optical window molding element 4012. It is worth mentioning that each of the light window forming elements 4012 may be integrally formed on the forming guide element 4011, or each of the light window forming elements 4012 may be separately formed on the forming guide element 4012.

When the upper mold 401 and the lower mold 402 are clamped, the molding die 400 forms each of the molding spaces 403 at the position of each of the molding guide grooves 4013. In addition, the forming mold 400 may further include a cover film 405, wherein the cover film 405 is disposed on the forming surface 4014 of the upper mold 401 in an overlapping manner, for example, the cover film 405 may be disposed on the forming surface 4014 of the upper mold 401 in an overlapping manner in a manner of being attached to the forming surface 4014 of the upper mold 401. It is worth mentioning that the forming surface 4014 according to the present invention at least includes the laminating surface of the light window forming element 4012, and may further include an inner surface of the forming guide element 4011.

When the imposition unit 300 is placed in the molding die 400, at least a portion of the edge area 3112 of each substrate 311 of the imposition unit 300 corresponds to each molding space 403, wherein the press-fit surface of each light window molding element 4012 may be respectively press-fitted in the mounting area 3111 of each substrate 311 of the imposition unit 300. It is understood that the cover film 405 can separate the press-fit surface of the light window molding element 4012 from the mounting area 3111 of the substrate 311 to protect the mounting area 3111. Preferably, the cover film 405 has elasticity to buffer the impact of the molding die 400 on the substrate 311 when clamped.

A fluid molding material 500 is added into at least one of the molding spaces 300, the molding material 500 fills all the molding spaces 403 of the molding die 400 through the communication channel 404, and after the molding material 500 is cured and the molding die 400 is subjected to a die-drawing operation, the molding base 32 integrally combined with the substrate 311 is formed, wherein the optical window 321 of the molding base 32 is formed at a position corresponding to the optical window molding element 4012. It is understood that when the molding material 500 is cured in the molding die 400 to form the molding base 32, the cover film 405 is located between the molding base 32 and the molding surface 4014 of the upper die 401, so that the cover film 405 can facilitate the molding die 400 to be subjected to a die-drawing operation, for example, the cover film 405 facilitates the upper die 401 to be subjected to die-drawing operation.

It is worth mentioning that the molding material 500 may be, but is not limited to, solid particles, liquid, a mixture of liquid and solid particles.

Referring to fig. 3A, 3B and 10, in order to facilitate the drawing of the forming mold 400, the inner surface 325 of the molding base 32 is preferably an inclined surface, and specifically, an included angle formed by the extending direction of the inner surface 325 of the molding base 32 and the optical axis of the photosensitive chip 20 is set as a parameter α, where the parameter α has a value ranging from 0 ° to 60 ° (including 0 ° and 60 °), preferably from 5 ° to 35 ° (including 5 ° and 35 °).

Next, referring to fig. 11, after the molding process is performed on the imposition unit 300, each of the base boards 311 constituting the imposition unit 300 may be separated to obtain a semi-finished product of the circuit board assembly 30, for example, the semi-finished product of the circuit board assembly 30 may be obtained by removing an unnecessary portion in the molded and/or base boards 311 by a cutting or etching process.

It is worth mentioning that, in an example, in order to facilitate the cutting of the imposition unit 300 after the molding process, and also due to the abrasion, the cutting blade may form a slightly tapered section, and the separation edge of the semi-finished product of the circuit board assembly 30 obtained after the cutting may have a slight inclination, referring to fig. 11, it is assumed that the extending direction of the side edge 3115 of the substrate 311 of the semi-finished product of the circuit board assembly 30 and the optical axis of the photosensitive chip 20 form an included angle parameter β, wherein the parameter β is in a range of 0 ° to 10 ° (including 0 ° and 10 °), and preferably in a range of 0 ° to 5 ° (including 0 ° and 5 °). In another example, in order to facilitate the etching and also due to the continuity of the etching, the separation edge of the semi-finished product of the circuit board assembly 30 obtained after the etching has a slight slope, and referring to fig. 11, it is assumed that the extending direction of the side edge 3115 of the substrate 311 of the semi-finished product of the circuit board assembly 30 and the optical axis of the photosensitive chip 20 form an included angle parameter β, wherein the parameter β is in a range of 0 ° to 10 ° (including 0 ° and 10 °), and preferably in a range of 0 ° to 5 ° (including 0 ° and 5 °). Of course, it is understood that the slope of the side edge 3115 of the substrate 311 of the semi-finished circuit board assembly 30 may be removed in a subsequent process, for example, the side edge 3115 of the substrate 311 may be subjected to a vertical, smooth, rounded side shape by polishing or deburring.

Referring to fig. 12, the module connection side 3121 of the connection plate 312 is electrically connected to the connection edge side 31121 of the substrate 311 to obtain the circuit board assembly 30. The module connecting side 3121 of the connecting plate 312 and the connecting edge side 31121 of the substrate 311 may be electrically connected together, for example, by a conductive medium, wherein the connection manner of the mold connecting side 32121 of the connecting plate 312 and the connecting edge side 31121 of the substrate 311 may be implemented as, but not limited to, ACF, ACP, soldering, connectors, etc.

Next, referring to fig. 4, the photo sensor chip 20 is mounted on the mounting region 3111 of the substrate 311 through the light window 321 of the mold base 32, and at least one lead 33 may be formed between the photo sensor chip 20 and the substrate 311 through a wire bonding process to connect the substrate 311 and the photo sensor chip 20, and the photo sensor chip 20 corresponds to the light window 321 of the mold base 32.

Of course, it is understood that the photosensitive chip 20 may be mounted on the mounting region 3111 of the substrate 311, the photosensitive chip 20 and the substrate 311 may be conducted, and then the module connecting side 3121 of the connecting plate 312 and the connecting edge side 31121 of the substrate 311 may be electrically connected.

With continued reference to fig. 12, after the module connecting side 3121 of the connecting plate 312 is connected to the connecting edge side 31121 of the substrate 311, the module connecting side 3121 of the connecting plate 312 may cover at least a portion of the connecting edge side 31121 of the substrate 311. For example, in this embodiment of the camera module 100 of the present invention, the connection edge side 31121 of the substrate 311 has an edge outer side 311211 and an edge inner side 311212, wherein the edge inner side 311212 is located between the edge outer side 311211 and the outer surface 326 of the mold base 32, wherein the module connection side 3121 of the connection plate 312 is electrically connected to the edge outer side 311211 of the substrate 311, i.e., there is a safety distance between the connection plate 312 and the outer surface 326 of the mold base 32.

Let the width dimension of the edge outer side 311211 of the substrate 311 be L1 and the width dimension of the edge inner side 311212 of the substrate 311 be L2, wherein the width dimension of the edge outer side 311211 of the substrate 311 be L1 is in the range of 0.01mm to 5mm (including 0.01mm and 5mm), preferably 0.1mm to 2mm (including 0.1mm and 2mm), and wherein the width dimension of the edge inner side 311212 of the substrate 311 be L2 is in the range of 0.01mm to 5mm (including 0.01mm and 5mm), preferably 0.05mm to 2mm (including 0.05mm and 2 mm).

It is understood that the module connecting side 3121 of the connecting plate 312 and the connecting edge side 31121 of the substrate 311 may be electrically connected first, and then the molding process may be performed by the molding die 400, so that in fig. 7 to 9, the molding die 400 may press the connecting position of the substrate 311 and the connecting plate 312 to effectively reinforce the connection effectiveness between the substrate 311 and the connecting plate 312.

In addition, the present invention can perform a batch molding by performing a molding process on the substrate 311 after the substrate 311 is arranged to form the composition unit 300, or can improve an arrangement efficiency and a higher molding efficiency by performing a molding process on the substrate 311 after the connecting plate 312 and the substrate 311 are electrically connected together and then arranged to form the composition unit 300.

It is understood that, subsequently, the filter element 40 may be attached to the mold base 32 and the optical lens 10 may be held in the photosensitive path of the photosensitive chip 20 by the driver 60 or the lens barrel, etc. to manufacture the camera module 100.

Fig. 13 shows a modified embodiment of the camera module 100, in which the mold base 32 embeds the connection positions of the substrate 311 and the connection plate 312 after molding, for example, after the connection plate 312 and the substrate 311 are electrically connected, a molding process is performed to embed the connection positions of the substrate 311 and the connection plate 312 after molding the mold base 32, in such a way that, on the one hand, the reliability of the connection positions of the substrate 311 and the connection plate 312 can be ensured, on the other hand, the connection positions of the substrate 311 and the connection plate 312 can be fixed without requiring an additional component to save space and reduce processes, and on the other hand, the mold base 32 can further embed at least a part of the connection plate 312 to achieve positioning, limiting, positioning, and the like, Fixing, shielding and the like. Similar to the above embodiment, the width dimension L1 of the outer edge 311211 of the substrate 311 ranges from 0.01mm to 5mm (including 0.01mm and 5mm), preferably from 0.1mm to 2mm (including 0.1mm and 2mm), and the width dimension of the inner side of the mold base 32 from the outer edge 311211 ranges from 0.01mm to 8mm (including 0.01mm and 8mm), preferably from 0.05mm to 3mm (including 0.05mm and 3 mm).

Fig. 14 shows a modified embodiment of the camera module 100, in which the mold base 32 further embeds at least a portion of the non-photosensitive region of the photosensitive chip 20, so that the photosensitive chip 20, the substrate 311, and the mold base 32 are integrally combined, and the leads 33 can also be embedded inside the mold base 32, so as to ensure good electrical properties of the leads 33 by the mold base 32. For example, the photosensitive chip 20 may be attached to the attaching area 3111 of the substrate 311, and then a molding process is performed, so that the molded base 32 embeds at least a portion of the non-photosensitive area of the photosensitive chip 20.

Fig. 15 shows another variant of the camera module 100, in which the camera module 100 further comprises at least one frame-shaped support element 70, wherein the support member 70 may be disposed at the edge region 3112 of the substrate 311, or the support member 70 may be formed at the edge region 3112 of the substrate 311, wherein the molded base 32 after molding embeds at least the outer side edge 71 of the support element 70, so that the photosensitive chip 20, the base plate 311, the supporting member 70 and the mold base 32 are integrally combined, wherein the molded base 32 can embed at least a portion of the lead 33, or the support element 70 embeds at least a portion of the lead 33, the mold base 32 and the support member 70 each embed at least a portion of the lead 33. In further examples, the molded base 32 may also further embed at least a portion of the top surface 72 of the support element 70.

The supporting member 70 can be formed by, but not limited to, glue after curing, or metal plating or electroless plating, or solvent-deprived curing after solution coating, so that the supporting member 70 protrudes from the front surface 3113 of the substrate 311, and thus the supporting member 70 can block the molding material 500 from entering the mounting region 3111 of the substrate 311 during a molding process to ensure the flatness of the mounting region 3111. In addition, the support member 70 may have elasticity so that an impact force generated in the upper mold 401 and the lower mold 402 is absorbed by the support member 70 to avoid acting on the substrate 311 when the molding die 400 is clamped, and the support member 70 may prevent a gap from being generated between the top surface 72 of the support member 70 and the molding surface 4014 of the upper mold 401 by deforming. And, the supporting member 70 can support the molding surface 4014 of the upper mold 401 to prevent the upper mold 401 from pressing the lead 33, thereby ensuring good electrical characteristics of the lead 33.

Fig. 16 shows another modified embodiment of the camera module 100, wherein the supporting member 70 may also be disposed in the non-photosensitive region of the photosensitive chip 20, or the supporting member 70 may also be formed in the non-photosensitive region of the photosensitive chip 20, so that the mold base 32, the substrate 311, the photosensitive chip 20, and the supporting member 70 can be integrally combined during the molding process.

Fig. 17 shows another modified embodiment of the camera module 100, in which the filter element 40 can be overlapped on the photosensitive chip 20, and then a molding process is performed, so that the molding base 32 further embeds the edge of the filter element 40, i.e. the molding base 32, the substrate 311, the photosensitive chip 20 and the filter element 40 can be integrally combined.

Fig. 18 shows another modified embodiment of the camera module 100, in which the supporting member 70 is provided at the edge of the filter element 40 or the supporting member 70 is formed after the filter element 40 is overlapped on the photosensitive chip 20, so that at least a part of the supporting member 70 can be embedded in the mold base 32 at the time of the molding process, so that the mold base 32, the substrate 311, the photosensitive chip 20, the filter element 40, and the supporting member 70 can be integrally combined.

Fig. 19 shows another variant embodiment of the camera module 100, in which the substrate 311 has at least one receiving space 3116, and the receiving space 3116 can be implemented as a recess for receiving the photosensitive chip 20, in such a way that the height dimension of the camera module 100 can be reduced.

Fig. 20 shows another variant embodiment of the camera module 100, in which the mold base 32 may further embed the non-photosensitive region of the photosensitive chip 20.

Fig. 21 shows another modified embodiment of the camera module 100, in which the accommodating space 3116 may be implemented as a through hole, in which the photosensitive chip 20 is held in the accommodating space 3116, and the photosensitive chip 20 and the substrate 311 are conducted, so that the height dimension of the camera module 100 may be further reduced.

Fig. 22 shows another variant embodiment of the camera module 100, in which the mold base 32 can further embed the non-photosensitive region of the photosensitive chip 20.

Fig. 23 shows another modified embodiment of the camera module 100, wherein the circuit board assembly 30 further includes at least one reinforcing portion 35, wherein the reinforcing portion 35 is integrally combined with the back surface 3114 of the substrate 311 to reinforce the strength of the substrate 311 by the reinforcing portion 35, in such a way that the substrate 311 can be selected from a plate material with a thinner thickness to reduce the height dimension of the camera module 100. The reinforcement part 35 and the mold base 32 may be formed on the back surface 3114 and the front surface 3113 of the board 311 by the same process, respectively, the mold base 32 may be molded on the front surface 3113 of the board 311, and then the reinforcement part 35 may be molded on the back surface 3114 of the board 311, or the reinforcement part 35 may be molded on the back surface 3114 of the board 311, and then the mold base 32 may be molded on the front surface 3113 of the board 311.

Fig. 24 shows another modified embodiment of the camera module 100, in which the substrate 311 has the accommodating space 3116 implemented as a through hole, the photosensitive chip 20 is attached to the reinforcing part 35 and located in the accommodating space 3116, wherein the photosensitive chip 20 is conducted with the substrate 311 through the lead 33, so that the flatness of the photosensitive chip 20 is not limited to that of the substrate 311, so that the substrate 311 can be made of a thinner plate material, thereby further reducing the height dimension of the camera module.

Fig. 25 shows another modified embodiment of the image pickup module 100, wherein the reinforcing part 35 further has a receiving groove 351, wherein the receiving groove 351 of the reinforcing part 35 corresponds to the receiving space 3116 of the substrate 311, wherein the photosensitive chip 20 is received in the receiving groove 315 of the reinforcing part 35, and the photosensitive chip 20 corresponds to the receiving space 3116 of the substrate 311, so that the flatness of the photosensitive chip 20 is not limited by the flatness of the substrate 311, and the height dimension of the image pickup module 100 is further reduced.

Fig. 26 shows a further variant of the camera module 100, in which the base plate 311 has at least one holding space 3117, wherein the holding space 3117 is embodied as a recess, wherein a portion of the mold base 32 is formed in the holding space 3117 of the base plate 311.

Fig. 27 shows another variant embodiment of the camera module 100, in which the holding space 3117 of the base plate 311 is embodied as a through-hole, wherein a portion of the mold base 32 is molded in the holding space 3117 of the base plate 311. It is understood that in other examples, at least one of the holding spaces 3117 may be implemented as a through hole, and the other holding spaces 3117 may be implemented as a groove.

Fig. 28A shows another modified embodiment of the camera module 100, in which at least one of the holding spaces 3117 of the base plate 311 is implemented as a through hole, wherein the mold material 500 is formed to be integrally coupled to the mold base 32 and the reinforcement part 35 of the base plate 311 on the front surface 3113 and the back surface 3114 of the base plate 311, respectively, after passing through the holding space 3117 in a molding process.

Fig. 28B shows another modified embodiment of the camera module 100, in which the photosensitive chip 20 can also be attached to the substrate 311 by a flip-chip process, and the photosensitive area of the photosensitive chip 20 corresponds to the optical window 321 of the mold base 32 through the accommodating space 3116 implemented as a through hole of the substrate 311.

It should be noted that the camera module 100 is implemented as an array camera module in the following description, and the features and advantages of the camera module 100 of the present invention are described by taking the example that the array camera module is further embodied as a dual-lens camera module, it is understood that the array camera module may also have more optical lenses 10, and therefore, the camera module 100 of the dual-lens camera module should not be construed as limiting the content and scope of the camera module 100 of the present invention.

Fig. 29 shows another modified embodiment of the camera module 100, wherein the camera module 100 includes two optical lenses 10, two photosensitive chips 20 and one circuit board assembly 30, wherein the circuit board assembly 30 includes one circuit board 31, at least one mold base 32 and at least two sets of leads 33, wherein the circuit board 31 includes at least one substrate 311 and at least one connecting board 312, the module connecting side 3121 of the connecting board 312 is electrically connected to the connecting edge side 31121 of the substrate 311, the substrate 311 has two mounting areas 3111, wherein each photosensitive chip 20 is respectively mounted to each mounting area 3111 of the substrate 311, and each photosensitive chip 20 and the substrate 311 are conducted through the leads 33, wherein the mold base 32 has two light windows 321, so that each of the light sensing chips 20 corresponds to each of the light windows 321, respectively, and each of the optical lenses 10 is held in a light sensing path of each of the light sensing chips 20, respectively.

In addition, the camera module 100 may further include two drivers 60, wherein each optical lens 10 is respectively and drivably disposed on each driver 60, and each driver 60 is respectively attached to the mold base 32, so that each optical lens 10 is respectively held on the photosensitive path of each photosensitive chip 20.

Further, the camera module 100 may further include at least one filter element 40, wherein each filter element 40 is respectively held between each optical lens 10 and each photosensitive chip 20. For example, each of the filter elements 40 may be respectively attached to the mold base 32 such that each of the filter elements 40 is respectively held between each of the optical lenses 10 and each of the photosensitive chips 20.

It should be noted that the image capturing module 100 shown in fig. 29 is only an example, and when the image capturing module 100 is implemented to include more optical lenses 10, the number of the photosensitive chips 20, the number of the filter elements 40, and the number of the drivers 60 may be consistent with the number of the optical lenses 10. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 30 shows another modified embodiment of the camera module 100, wherein the circuit board 31 of the circuit board assembly 30 may include two substrates 311 and two connecting plates 312, wherein each connecting plate 312 is electrically connected to each substrate 311, wherein each substrate 311 has one mounting region 3111, wherein the photosensitive chip 20 is mounted on each mounting region 3111 of each substrate 311, and wherein the mold base 32 is integrally bonded to each substrate 3111, so as to integrate the two substrates 3111 and the mold base 32. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photo-sensitive chips 20.

Fig. 31 shows another modified embodiment of the camera module 100, wherein the camera module 100 further comprises at least one lens barrel 80. Specifically, the camera module 100 in this example may include two lens barrels 80, wherein each optical lens 10 is respectively disposed on the lens barrels 80, and each lens barrel 80 is respectively attached to the mold base 32, so that each optical lens 10 is respectively held in the photosensitive path of each photosensitive chip 20. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 32 shows another modified embodiment of the camera module 100, in which each lens barrel 80 may also extend integrally to the mold base 32, i.e. the lens barrel 80 may be integrally formed with the mold base 32. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 33 shows another modified embodiment of the camera module 100, in which one lens barrel 80 integrally extends to the mold base 32, and the other lens barrel 80 is attached to the mold base 32. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 34 shows another modified embodiment of the camera module 100, in which one of the optical lenses 10 is drivably provided to the actuator 60, the actuator 60 is attached to the mold base 32, and the other optical lens 10 is provided to the lens barrel 80, the lens barrel 80 is attached to the mold base 32. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 35 shows another modified embodiment of the camera module 100, in which one of the optical lenses 10 is drivably provided to the actuator 60, the actuator 60 is attached to the mold base 32, and the other optical lens 10 is provided to the lens barrel 80, wherein the lens barrel 80 integrally extends from the mold base 32. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 36 shows another modified embodiment of the image capturing module 100, wherein the image capturing module 100 further includes at least one support 90, wherein the mold base 32 molds a portion of the substrate 311 such that at least one of the photosensitive chips 20 corresponds to the light window 321 of the mold base 32, the support 90 is attached to another portion of the substrate 311 such that the photosensitive chip 20 corresponds to the light through hole 91 of the support 90, wherein each of the optical lenses 10 is respectively and drivably disposed on each of the drivers 60, at least one of the drivers 60 is attached to the mold base 32, and the other drivers 60 are attached to the support 90 such that each of the optical lenses 10 is respectively retained in the light sensing path of each of the photosensitive chips 20. It is understood that it is also possible to provide each optical lens 10 to each lens barrel 80, or to provide at least one optical lens 10 to the driver 60, and to provide another optical lens 10 to the holder 90. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 37 shows another modified embodiment of the camera module 100, in which the mold base 32 of the camera module 100 may further embed the connection position of the connection plate 312 and the substrate 311 to ensure the reliability of the circuit board 31 at the connection position of the connection plate 312 and the substrate 311. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 38 shows another modified embodiment of the camera module 100, in which after the support member 70 is disposed on the edge region 3112 of the substrate 311 or the support member 70 is formed on the edge region 3112 of the substrate 311, a molding process is performed to embed at least a part of the support member 70 in the mold base 32, so that the substrate 311, the mold base 32, and the support member 70 are integrally combined. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 39 shows another modified embodiment of the camera module 100, in which the mold base 32 can further embed the non-photosensitive region of the photosensitive chip 20, so that the substrate 311, the photosensitive chip 20, and the mold base 32 are integrally combined. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 40 shows another modified embodiment of the image pickup module 100, in which after the supporting member 70 is disposed in the non-photosensitive region of the photosensitive chip 20 or the supporting member 70 is formed in the non-photosensitive region of the photosensitive chip 20, a molding process is performed to embed at least a portion of the supporting member 70 in the mold base 32, so that the substrate 311, the photosensitive chip 20, the mold base 32, and the supporting member 70 are integrally combined. In addition, the mold base 32 may further embed at least one non-photosensitive region of the photosensitive chip 20.

Fig. 41 shows another modified embodiment of the image pickup module 100, in which the back surface 3114 of the substrate 311 may also be at least partially molded with the reinforcing portion 35 to reinforce the strength of the substrate 311, so that the flatness of the photosensitive chip 20 can be further ensured. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 42 shows another modified embodiment of the camera module 100, in which the substrate 311 has at least one accommodating space 3116, and each of the photosensitive chips 20 is accommodated in each of the accommodating spaces 3116, respectively, to reduce the height of the camera module 100. It is understood that the receiving space 3116 may be implemented as a groove, and may also be implemented as a through hole. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 43 shows another modified embodiment of the camera module 100, wherein the substrate 311 may also have at least one receiving space 3116, so that one of the photo-sensing chips 20 can be attached to the attaching area 3111 of the substrate 311, and the other photo-sensing chip 20 can be received in the receiving space 3116, so that two photo-sensing chips 20 have a height difference. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 44 shows another modified embodiment of the camera module 100, in which the back face 3114 of the substrate 311 is at least partially molded with the reinforcing portion 35, and each of the photosensitive chips 20 is attached to the reinforcing portion 35, so that the flatness of each of the photosensitive chips 20 is no longer limited by the flatness of the substrate 311, and thus the substrate 311 can be made of a thinner plate material to further reduce the height dimension of the camera module 100. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 45 shows another modified embodiment of the camera module 100, the back surface 3114 of the substrate 311 may be at least partially molded with the reinforcing portion 35, one of the photosensitive chips 20 is attached to the reinforcing portion 35, and the other photosensitive chip 20 is attached to the attachment area 3111 of the substrate 311, so that the two photosensitive chips 20 have a height difference. In addition, the molded base 32 can further embed the non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 46 shows another variant embodiment of the camera module 100, in which the number of filter elements 40 can be implemented as one, so that each optical lens 10 can correspond to a different position of the filter element 40. In addition, the mold base 32 may further bury a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 47 shows another modified embodiment of the camera module 100, in which at least one filter element 40 may be respectively disposed on at least one of the brackets 50, wherein each of the brackets 50 is attached to the mold base 32, so that each of the filter elements 40 disposed on the brackets 50 is respectively held between each of the optical lenses 10 and each of the photosensitive chips 20. In addition, the size of the filter element 40 can be reduced to reduce the manufacturing cost of the camera module 100. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photo-sensitive chips 20.

Fig. 48A shows another modified embodiment of the camera module 100, in which the number of the filter elements 40 and the number of the optical lenses 10 and the photosensitive chips 20 correspond to each other, and the bracket 50 may be implemented as one, wherein each of the filter elements 40 is respectively disposed at different positions of the bracket 50, and the bracket 50 is attached to the mold base 32, so that each of the filter elements 40 is respectively held between each of the optical lenses 10 and each of the photosensitive chips 20. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 48B shows another modified embodiment of the camera module 100, in which at least one of the photosensitive chips 20 can be attached to the substrate 311 by a flip-chip process, and the photosensitive area of the photosensitive chip 20 can correspond to the optical window 321 of the mold base 32 through the receiving space 3116 implemented as a through hole of the substrate 311. Although fig. 48B shows the image pickup module 100 in this example, two photosensitive chips 20 are mounted on the substrate 311 by a flip-chip process, in another example, at least one photosensitive chip 20 may be mounted on the substrate 311 by a flip-chip process, and at least another photosensitive chip 20 may be directly mounted on the mounting region 3111 of the substrate 311, or another photosensitive chip 20 may be held in the accommodating space 3116 of the substrate 311. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 49A shows another modified embodiment of the camera module 100, in which the module connection side 3121 of the connection board 312 of the circuit board 31 of the circuit board assembly 30 may not be electrically connected to the front face 3113 of the substrate 311, for example, in this example of the camera module 100 shown in fig. 49, the module connection side 3121 of the connection board 312 may also be electrically connected to the back face 3114 of the substrate 311, so that it is not necessary to consider the size and position of the photosensitive core 20 when electrically connecting the module connection side 3121 of the connection board 312 and the substrate 311, for ease of fabrication.

It is noted that the module connection side 3121 of the connection plate 312 may cover at least a portion of the back surface 3114 of the substrate 311 after the module connection side 3121 of the connection plate 312 is electrically connected to the back surface 3114 of the substrate 311. For example, in this example of the camera module 100 shown in fig. 49, the module connection side 3121 of the connection plate 312 may be electrically connected to one side of the back surface 3114 of the substrate 311, while in other examples, the module connection side 3121 of the connection plate 312 may also cover the entire back surface 3114 of the substrate 311, as shown in fig. 50. Of course, in other examples, the connection position between the connecting plate 312 and the base plate 311 by the measurement 3121 may also be "square," C, "L," or any other possible shape, and of course, may also be an irregular shape, which is selected according to the needs.

It should be noted that the back surface 3114 of the substrate 311 may also be uneven, for example, the back surface 3114 may be provided with a notch 31141 for accommodating the module connecting side 3121 of the connecting plate 312 electrically connected to the back surface 3114 of the substrate 311, thereby reducing the height of the camera module 100, as shown in fig. 49B.

With further reference to fig. 49A, when the module connecting side 3121 of the connection board 312 and one side of the back surface 3114 of the substrate 311 are electrically connected, a width parameter L3 of an overlapping area of the module connecting side 3121 of the connection board 312 and the back surface 3114 of the substrate 311 is set, wherein a width parameter L3 of an overlapping area of the module connecting side 3121 of the connection board 312 and the back surface 3114 of the substrate 311 ranges from 0.01mm to 5mm (including 0.01mm and 5mm), preferably from 0.1mm to 2mm (including 0.1mm and 2 mm).

In addition, the inner surface 325 of the molding base 32 is preferably sloped to facilitate the drawing of the forming mold 400 after the molding base 32 is molded by a molding process. Preferably, the included angle parameter α formed by the inner surface 325 of the mold base 32 and the optical axis of the photosensitive chip 20 is in the range of 0 ° to 60 ° (including 0 ° and 60 °), and preferably in the range of 5 ° to 35 ° (including 5 ° and 35 °).

In addition, the driver 60 further has at least one driver pin 61, wherein the driver pin 61 can extend from the driver 60 to the substrate 311 after passing through the molded base 32, and the driver pin 61 can be connected to the substrate 311. It should be noted that the driver pins 61 passing through the molded base 32 according to the present invention means that the driver pins 61 extend from the upper portion to the lower portion of the molded base 32, for example, the driver pins 61 may pass through the inside of the molded base 32 or extend along the surface of the molded base 32.

Further, the molded base 32 is provided with at least one driver pin slot 327 for receiving the driver pin 61. Wherein the driver pin slot 327 is located on the outer surface 326 of the molded base 32, e.g., the outer surface 326 of the molded base 32 may be recessed to form the driver pin slot 327. The outer surface 326 of the molded base 32 forms at least a first slot wall 3271 and at least two second slot walls 3272, wherein the two second slot walls 3272 are located on both sides of the first slot wall 3271 to define the driver pin slot 327 by the first slot wall 3271 and each of the second slot walls 3272. Preferably, an inclined surface of the first groove wall 3271 sets an included angle parameter formed by an extending direction of the first groove wall 3271 and an optical axis direction of the photosensitive chip 20 to be θ, where the parameter θ is an acute angle. Preferably, the parameter θ has a value in the range of 3 ° to 45 ° (including 3 ° and 45 °), preferably 3 ° to 15 ° (including 3 ° and 15 °). In addition, the outer surface 326 of the mold base 32 may also form the driver pin groove 327 with an arc-shaped cross section, wherein the extension direction of the driver pin groove 327 may be inclined. An included angle parameter formed by the extending direction of the driver pin groove 327 and the optical axis direction of the photosensitive chip 20 is set to be θ, wherein the parameter θ is an acute angle. Preferably, the parameter θ has a value in the range of 3 ° to 45 ° (including 3 ° and 45 °), preferably 3 ° to 15 ° (including 3 ° and 15 °).

Referring to fig. 51-58 of the drawings accompanying this specification, the flow of manufacturing the circuit board assembly 30 of the camera module 100 is illustrated.

Referring to fig. 51 and 52, two or more substrates 311 may be arranged at intervals to form one imposition unit 300, so as to facilitate a subsequent molding process. It is understood that, since in this embodiment of the camera module 100 of the present invention, there may be no need to reserve a position for electrically connecting the module connecting side 3121 of the connecting plate 312 on the front face 3113 of the substrates 311, each of the substrates 311 of the imposition unit 300 may be brought closer together more compactly to improve the utilization of the imposition unit 300. The distance between the adjacent substrates 311 of the imposition unit 300 ranges from 0.01mm to 500mm (including 0.01mm and 500mm), and preferably ranges from 0.05mm to 200mm (including 0.05mm and 200 mm). In order to improve the stability of the partial molding when the molding process is performed, the minimum size of the imposition unit 300 ranges from 1mm to 100000mm (including 1mm and 100000mm), and preferably from 10mm to 1000mm (including 10mm and 1000 mm).

It should be noted that, before the molding process, the connecting plate 312 may be electrically connected to the back surface 3114 of the substrate 311, and at this time, the molding die 400 needs to be reserved for the pressing width and the draft angle. Then, each of the electronic components 34 is attached to the edge region 3112 of the substrate 311. Of course, it is understood by those skilled in the art that it is also possible to attach the electronic component 34 to the back surface 3114 of the substrate 311.

It can be understood that each electronic component 34 may be attached to the substrate 311, and then each substrate 311 is arranged to form the typesetting unit 300.

Referring to fig. 53, 54, 55 and 56, the imposition unit 300 is placed in the molding die 400 for a molding process.

Referring to fig. 57, after the molding process is performed on the imposition unit 300, each of the substrates 311 constituting the imposition unit 300 may be separated to obtain a semi-finished product of the circuit board assembly 30, for example, but not limited to, each of the substrates 311 constituting the imposition unit 300 may be separated by a process such as cutting or etching.

It is worth mentioning that, in an example, in order to facilitate the cutting of the imposition unit 300 after the molding process, and also due to the abrasion, the cutting blade may form a slightly tapered section, and the separation edge of the semi-finished product of the circuit board assembly 30 obtained after the cutting may have a slight inclination, referring to fig. 11, it is assumed that the extending direction of the side edge 3115 of the substrate 311 of the semi-finished product of the circuit board assembly 30 and the optical axis of the photosensitive chip 20 form an included angle parameter β, wherein the parameter β is in a range of 0 ° to 10 ° (including 0 ° and 10 °), and preferably in a range of 0 ° to 5 ° (including 0 ° and 5 °). In another example, in order to facilitate the etching and also because of the continuity of the etching, the separating edge of the semi-finished product of the circuit board assembly 30 obtained after the etching will also have a slight degree of profanity, and referring to fig. 11, it is assumed that the extending direction of the side edge 3115 of the substrate 311 of the semi-finished product of the circuit board assembly 30 and the optical axis of the photosensitive chip 20 form an included angle parameter β, wherein the parameter β is in the range of 0 ° to 10 ° (including 0 ° and 10 °), and preferably in the range of 0 ° to 5 ° (including 0 ° and 5 °). Of course, it is understood that the slope of the side edge 3115 of the substrate 311 of the semi-finished circuit board assembly 30 may be removed in a subsequent process, for example, the side edge 3115 of the substrate 311 may be subjected to a vertical, smooth, rounded side shape by polishing or deburring.

Referring to fig. 58, the module connection side 3121 of the connection plate 312 is electrically connected to the side of the back surface 3114 of the substrate 311 to obtain the circuit board assembly 30.

Referring to fig. 59, the photo sensor chip 20 is mounted on the mounting region 3111 of the substrate 311 through the light window 321 of the mold base 32, and at least one lead 33 may be formed between the photo sensor chip 20 and the substrate 311 through a wire bonding process to connect the substrate 311 and the photo sensor chip 20, and the photo sensor chip 20 corresponds to the light window 321 of the mold base 32.

Fig. 60 shows another modified embodiment of the camera module 100, in which the mold base 32 further embeds at least a portion of the non-photosensitive region of the photosensitive chip 20, so that the photosensitive chip 20, the substrate 311, and the mold base 32 are integrally combined, and the leads 33 can also be embedded inside the mold base 32 to ensure good electrical properties of the leads 33 by the mold base 32. For example, in this example of the camera module 100, the photosensitive chip 20 may be attached to the attaching area 3111 of the substrate 31, and then the molding process is performed, so that the molded base 32 embeds at least a portion of the non-photosensitive area of the photosensitive chip 20.

Fig. 61 shows another modified embodiment of the camera module 100, wherein the camera module 100 further includes at least one frame-shaped support member 70, wherein the support member 70 can be disposed on the edge region 3112 of the substrate 311, or the support member 70 can be formed on the edge region 3112 of the substrate 311, wherein the mold base 32 after molding at least embeds the outer side edge 71 of the support member 70, so that the substrate 311, the support member 70, and the mold base 32 are integrally combined, wherein the mold base 32 can embed at least a portion of the lead 33, or the support member 70 embeds at least a portion of the lead 33, and the mold base 32 and the support member 70 embed at least a portion of the lead 33, respectively. In further examples, the molded base 32 may also further embed at least a portion of the top surface 72 of the support element 70.

Fig. 62 shows another modified embodiment of the camera module 100, wherein the supporting member 70 may also be disposed in the non-photosensitive region of the photosensitive chip 20, or the supporting member 70 may also be formed in the non-photosensitive region of the photosensitive chip 20, so that the mold base 32, the substrate 311, the photosensitive chip 20, and the supporting member 70 can be integrally combined during the molding process.

Fig. 63 shows another modified embodiment of the camera module 100, in which the substrate 311 has at least one accommodating space 3116, wherein the accommodating space 3116 is used for accommodating the photosensitive chip 20, so that the height dimension of the camera module 100 can be reduced, wherein the photosensitive chip 20 is attached to the connecting plate 312, so that the photosensitive chip 20 is held in the accommodating space 3116 by the connecting plate 312. Preferably, the receiving space 3116 may be implemented as a through hole. However, it can be understood by those skilled in the art that the accommodating space 3116 can be implemented as a groove in other examples of the camera module 100.

Fig. 64 shows another variation of the camera module 100 in which the mold base 32 may further embed at least a portion of the non-photosensitive area of the photosensitive chip 20.

Fig. 65 shows another modified embodiment of the camera module 100, in which the connection position of the module connection side 3121 of the connection plate 312 and the back surface 3114 of the substrate 311 may be in a shape of "square", that is, the module connection side 3121 of the connection plate 312 has a through hole 3123, the through hole 3123 of the connection plate 312 corresponds to the accommodation space 3116 of the substrate 311 after the module connection side 3121 of the connection plate 312 is electrically connected to the back surface 3114 of the substrate 311, wherein at least a portion of the photosensitive chip 20 may be accommodated in the through hole 3123 of the connection plate 312, so that there may be no contact between the photosensitive chip 20 and the connection plate 312, in such a manner that the flatness of the photosensitive chip 20 may not be affected by the connection plate 312, so as to ensure the imaging quality of the camera module 100.

Fig. 66 shows another modified embodiment of the camera module 100, in which a portion of the back surface 3114 of the substrate 311 is used to connect the module connecting side 3121 of the connecting plate 312, and another portion of the substrate 311 can be integrally bonded to the reinforcing portion 35, wherein the photosensitive chip 20 can be directly attached to the reinforcing portion 35, so that the flatness of the photosensitive chip 20 can be ensured by the reinforcing portion 35 to further improve the imaging quality of the camera module 100.

Fig. 67 shows another modified embodiment of the image pickup module 100, wherein the reinforcing portion 35 may also form a receiving groove 351, wherein the photosensitive chip 20 is received in the receiving groove 351 of the reinforcing portion 35 to further reduce the height of the image pickup module 100.

Fig. 68 shows another modified embodiment of the camera module 100, in which the reinforcement portion 35 may further embed the connection position of the module connection side 3121 of the connection plate 312 and the back surface 3114 of the board 311 to ensure the reliability of the connection position, thereby preventing the module connection side 3121 of the connection plate 312 from coming off the back surface 3114 of the board 311. The back surface 3114 of the base plate 311 is provided with the notch 31141 for accommodating the module connection side 3121 of the connection plate 312.

Fig. 69 shows another modified embodiment of the camera module 100, in which the substrate 311 has at least one holding space 3117, wherein a portion of the mold base 32 may be integrally formed with the holding space 3117 of the substrate 311 to prevent the mold base 32 and the substrate 311 from falling off, thereby ensuring reliability of the camera module 100. Preferably, the holding space 3117 of the substrate 311 may be implemented as a through hole, although in other examples of the camera module 100, the holding space 3117 of the substrate 311 may also be implemented as a blind hole, or a portion of the holding space 3117 may be implemented as a through hole and another portion of the holding space 3117 may be implemented as a blind hole.

Fig. 70 shows another modified embodiment of the camera module 100, in which a part of the reinforcing portion 35 may be integrally formed in the holding space 3117 of the base plate 311 to prevent the reinforcing portion 35 and the base plate 311 from coming off, thereby ensuring the reliability of the camera module 100.

Fig. 71A shows another modified embodiment of the camera module 100, in which at least one of the holding spaces 3117 of the base plate 311 is implemented as a through hole, wherein the mold material 500 is formed to be integrally coupled to the mold base 32 and the reinforcement part 35 of the base plate 311 on the front surface 3113 and the back surface 3114 of the base plate 311, respectively, after passing through the holding space 3117 in a molding process.

Fig. 71B shows another modified embodiment of the camera module 100, in which the photosensitive chip 20 can also be attached to the substrate 311 by a flip-chip process, and the photosensitive area of the photosensitive chip 20 corresponds to the optical window 321 of the mold base 32 through the receiving space 3116 implemented as a through hole of the substrate 311.

Fig. 72 shows another modified embodiment of the camera module 100, wherein the camera module 100 includes two optical lenses 10, two photosensitive chips 20, and one circuit board assembly 30, wherein the circuit board assembly 30 includes one circuit board 31, one mold base 32, and at least two sets of leads 33, wherein the circuit board 31 includes one substrate 311 and one connecting board 312, the module connecting side 3121 of the connecting board 312 is electrically connected to the back surface 3114 of the substrate 311, the substrate 311 has two mounting areas 3111, wherein each photosensitive chip 20 is respectively mounted on each mounting area 3111 of the substrate 311, and each photosensitive chip 20 and the substrate 311 are conducted through the leads 33, wherein the mold base 32 has two light windows 321, so that each of the photo-sensing chips 20 corresponds to each of the light windows 321, respectively, wherein each of the optical lenses 10 is held in a photo-sensing path of each of the photo-sensing chips 20, respectively.

Further, the camera module 100 may further include at least two filter elements 40, wherein each filter element 40 is respectively held between each optical lens 10 and each photosensitive chip 20. For example, each of the filter elements 40 may be respectively attached to the mold base 32 such that each of the filter elements 40 is respectively held between each of the optical lenses 10 and each of the photosensitive chips 20.

It should be noted that the image capturing module 100 shown in fig. 72 is only an example, and when the image capturing module 100 is implemented to include more optical lenses 10, the number of the photosensitive chips 20, the number of the filter elements 40, and the number of the drivers 60 may all be the same as the number of the optical lenses 10. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 73 shows another modified embodiment of the camera module 100, wherein the circuit board 31 of the circuit board assembly 30 may also include two substrates 311 and two connecting plates 312, wherein each connecting plate 312 is electrically connected to each substrate 311, wherein each substrate 311 has one mounting area 3111, wherein the photosensitive chip 20 is mounted on each mounting area 3111 of each substrate 311, and wherein the mold base 32 is integrally bonded to each substrate 3111, so as to integrate the two substrates 3111 and the mold base 32. In addition, the molding base 32 may further embed at least one non-photosensitive region of the photosensitive chip 20.

Fig. 74 shows another modified embodiment of the camera module 100, wherein the camera module 100 further comprises at least one lens barrel 80. Specifically, the camera module 100 in this example may include two lens barrels 80, wherein each optical lens 10 is respectively disposed on the lens barrels 80, and each lens barrel 80 is respectively attached to the mold base 32, so that each optical lens 10 is respectively held in the photosensitive path of each photosensitive chip 20. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 75 shows another modified embodiment of the camera module 100, in which each lens barrel 80 may also extend integrally to the mold base 32, i.e. the lens barrel 80 may be integrally formed with the mold base 32. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 76 shows another modified embodiment of the camera module 100, in which one lens barrel 80 integrally extends to the mold base 32, and the other lens barrel 80 is attached to the mold base 32. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 77 shows another modified embodiment of the camera module 100, in which one of the optical lenses 10 is drivably provided to the driver 60, the driver 60 is attached to the mold base 32, and the other optical lens 10 is provided to the lens barrel 80, the lens barrel 80 is attached to the mold base 32. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 78 shows another modified embodiment of the camera module 100, in which one of the optical lenses 10 is drivably provided to the actuator 60, the actuator 60 is attached to the mold base 32, and the other optical lens 10 is provided to the lens barrel 80, wherein the lens barrel 80 integrally extends from the mold base 32. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 79 shows another modified embodiment of the image capturing module 100, wherein the image capturing module 100 further includes a support 90, wherein the mold base 32 molds a portion of the substrate 311 such that one of the photosensitive chips 20 corresponds to the light window 321 of the mold base 32, the support 90 is attached to another portion of the substrate 311 such that the photosensitive chip 20 corresponds to the light through hole 91 of the support 90, wherein each of the optical lenses 10 is respectively and drivably disposed on each of the drivers 60, one of the drivers 60 is attached to the mold base 32, and the other of the drivers 60 is attached to the support 90 such that each of the optical lenses 10 is respectively held in the light sensing path of each of the photosensitive chips 20. It is understood that it is also possible to provide each optical lens 10 to each lens barrel 80, or to provide one optical lens 10 to the driver 60 and another optical lens 10 to the mount 90. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 80 shows another modified embodiment of the camera module 100, in which the mold base 32 may further embed at least a portion of the non-photosensitive region of the photosensitive chip 20, so that the mold base 32, the photosensitive chip 20 and the substrate 311 are integrally combined. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 81 shows another modified embodiment of the camera module 100, in which after the support member 70 is provided on the base plate 311 or the support member 70 is molded on the base plate 311, a molding process is performed such that the mold base 32 embeds at least a portion of the support member 70, thereby integrally bonding the mold base 32, the base plate 311, and the support member 70. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 82 shows another modified embodiment of the image pickup module 100, in which after the supporting member 70 is disposed in the non-photosensitive region of the photosensitive chip 20 or the supporting member 70 is formed in the non-photosensitive region of the photosensitive chip 20, a molding process is performed to embed at least a portion of the supporting member 70 in the molding base 32, so that the molding base 32, the photosensitive chip 20, the substrate 311, and the supporting member 70 are integrally combined. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 83 shows another modified embodiment of the camera module 100, in which the substrate 311 has at least one accommodating space 3116, for example, in this specific example, the camera module 100 may include two accommodating spaces 3116 for accommodating each of the photosensitive chips 20, so that the height dimension of the camera module 100 can be reduced. Preferably, the receiving space 3116 may be implemented as a through hole, and of course, in other examples, the receiving space 3116 may also be implemented as a blind hole. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 84 shows another modified embodiment of the camera module 100, in which the number of the accommodating spaces 3116 of the substrate 311 is smaller than the number of the photosensitive chips 20, for example, the substrate 311 may have one accommodating space 3116, one of the photosensitive chips 20 is attached to the attaching area 3111 of the substrate 311, and the other photosensitive chip 20 is held in the accommodating space 3116, so that a height difference can be provided between the two photosensitive chips 20. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 85 shows another modified embodiment of the camera module 100, in which the module connecting side 3121 of the connecting plate 312 is attached to one side of the back surface 3114 of the substrate 311, and the other side of the back surface 3114 of the substrate 311 may also be molded with at least one reinforcing portion 35 through a molding process, wherein each photosensitive chip 20 is attached to the reinforcing portion 35, respectively, so that each photosensitive chip 20 may not contact the substrate 311, thereby enabling the substrate 311 to be selected from a plate material with a thinner thickness, reducing the height dimension of the camera module 100, and ensuring the flatness of the photosensitive chip 20. In addition, the mold base 32 may further bury a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 86 shows another modified embodiment of the camera module 100, in which the reinforcing portion 35 may further embed the connection position of the module connection side 3121 of the connection plate 312 and the back surface 3114 of the base plate 311 to ensure the reliability of the connection position. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 87 shows another modified embodiment of the image pickup module 100, wherein the reinforcing portion 35 may further provide at least one receiving groove 351, for example, in this embodiment, the number of the receiving grooves 351 of the reinforcing portion 35 is the same as the number of the photosensitive chips 20, so that each photosensitive chip 20 is received in each receiving groove 351 of the reinforcing portion 35, but in other examples, the number of the receiving grooves 351 may be less than the number of the photosensitive chips 20, so that each photosensitive chip 20 has a height difference. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 88 shows another modified embodiment of the camera module 100, in which the base plate 311 has at least one holding space 3117, wherein a portion of the mold base 32 may be integrally formed with each of the holding spaces 3117 of the base plate 311. It is understood that the holding space 3117 may be implemented as a through hole or a blind hole. In addition, the mold base 32 may further embed at least one non-photosensitive region of the photosensitive chip 20.

Fig. 89 shows another modified embodiment of the camera module 100, in which at least one of the holding spaces 3117 of the base plate 311 may be implemented as a through hole, so that the molding material 500 can be integrally bonded to the mold base 32 and the reinforcement part 35 of the base plate 311 in the molding process after passing through the holding space 3117 at the front surface 3113 and the back surface 3114 of the base plate 311, respectively. In addition, the mold base 32 may further embed at least one non-photosensitive region of the photosensitive chip 20.

Fig. 90 shows another variant embodiment of the camera module 100, in which the number of filter elements 40 can be implemented as one, so that each optical lens 10 is associated with a different position of the filter element 40. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 91 shows another modified embodiment of the camera module 100, in which each of the filter elements 40 may be disposed on each of the brackets 50, respectively, wherein each of the brackets 50 is attached to the mold base 32, respectively, so that each of the filter elements 40 is held between each of the optical lenses 10 and each of the photosensitive chips 20, respectively. In addition, the size of the filter element 40 can be reduced to reduce the manufacturing cost of the camera module 100. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 92 shows another modified embodiment of the camera module 100, in which the number of the filter elements 40 and the number of the optical lenses 10 and the photosensitive chips 20 correspond to each other, and the bracket 50 may be implemented as one, wherein each of the filter elements 40 is respectively disposed at different positions of the bracket 50, and the bracket 50 is attached to the mold base 32, so that each of the filter elements 40 is respectively held between each of the optical lenses 10 and each of the photosensitive chips 20. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 93 shows another modified embodiment of the camera module 100, in which at least one of the photosensitive chips 20 can be attached to the substrate 311 by a flip-chip process, and the photosensitive area of the photosensitive chip 20 can correspond to the optical window 321 of the mold base 32 through the receiving space 3116 implemented as a through hole of the substrate 311. Although in this example of the imaging module 100 shown in fig. 93, both the photosensitive chips 20 are attached to the substrate 311 by a flip-chip process, in another example, one of the photosensitive chips 20 may be attached to the substrate 311 by a flip-chip process, and the other photosensitive chip 20 may be directly attached to the attachment region 3111 of the substrate 311, or the other photosensitive chip 20 may be held in the accommodation space 3116 of the substrate 311. In addition, the mold base 32 may further embed at least one non-photosensitive region of the photosensitive chip 20.

Fig. 94 shows another modified embodiment of the camera module 100, wherein the module connecting side 3121 of the connecting plate 312 may be further connected to the side 3115 of the substrate 311, that is, the extending direction of the connecting plate 312 and the extending direction of the substrate 311 may be different, for example, the extending direction of the connecting plate 312 and the extending direction of the substrate 311 may be perpendicular to each other, so that when the camera module 100 is mounted on the electronic device body 200, the phenomenon that the connecting plate 312 is broken due to an excessively large bending arc can be avoided.

In other words, in the camera module 100 according to the present invention, the extending directions of the connection plate 312 and the substrate 311 are different, so that an angle at which the connection plate 312 needs to be bent can be reserved, and when the camera module 100 is mounted on the electronic apparatus body 200, the connection plate 312 can be deformed as little as possible, thereby ensuring the reliability of the camera module 100. Preferably, an included angle of 90 ° or approximately 90 ° may be generated between the connecting plate 312 and the substrate 311 to further reduce the volume of the camera module 100, so that the space occupied by the camera module 100 in the electronic device body 200 can be reduced.

Further, the side 3115 of the substrate 311 used for connecting the connecting plate 312 forms a connecting portion 31150, wherein the thickness of the connecting portion 31150 is defined as a parameter H, and the thickness parameter H of the connecting portion 31150 ranges from 0.01mm to 10mm (including 0.01mm and 10mm), and preferably ranges from 0.1mm to 5mm (including 0.1mm and 5mm), so that the reliability of the connecting position between the connecting plate 312 and the substrate 311 can be ensured. It is understood that the thickness of the connection portion 31150 of the substrate 311 may be different from the thickness of the other position of the substrate 311, for example, the thickness of the connection portion 31150 of the substrate 311 may be larger than the thickness of the other position of the substrate 311, or the thickness of the connection portion 31150 of the substrate 311 may be the same as the thickness of the other position of the substrate 311. In addition, at least one of the side edges 3115 of the substrate 311 forms the connection portion 31150.

It should be noted that, in an embodiment of the camera module 100 of the present invention, the substrate 311 may be molded, and then the connection board 312 is connected to the connection portion 31150 of the substrate 311 through the conductive medium. In another embodiment of the camera module 100 according to the present invention, the connection plate 312 may be connected to the connection portion 31150 of the substrate 311 through the conductive medium, and then a molding process may be performed, so that the mold base 32 integrally coupled to the substrate 311 may embed the conductive medium overflowing when the substrate 311 and the connection plate 312 are connected by using the conductive medium, thereby preventing the conductive medium from contaminating other components of the camera module 100 and ensuring the aesthetic appearance.

It should be noted that, when the connection board 312 is connected to the connection portion 31150 of the substrate 311 through the conductive medium, and then the molding process is performed, the connection board 312 may be placed in a pre-opened groove of the forming mold 400, so as to not affect the flatness and stability of the placement of the substrate 311, thereby ensuring the batch molding process.

In addition, the substrate 311 has the accommodating space 3116 for accommodating the photosensitive chip 20, so that the height of the camera module 100 can be reduced. It is worth mentioning that the receiving space 3116 may be implemented as a through hole or a groove.

Fig. 95 shows another modified embodiment of the camera module 100, in which the mold base 32 can further embed the non-photosensitive region of the photosensitive chip 20, so that the substrate 311, the mold base 32, and the photosensitive chip 20 are integrally combined.

Fig. 96 shows another variant embodiment of the camera module 100, in which the substrate 311 can also be provided with the support element 70 or form the support element 70, and the mold base 32 can embed at least a part of the support element 70, so that the substrate 311, the support element 70 and the mold base 32 are integrally joined.

Fig. 97 shows another modified embodiment of the camera module 100, in which the non-photosensitive region of the photosensitive chip 20 may be provided with the supporting member 70 or form the supporting member 70, and the mold base 32 may embed at least a portion of the supporting member 70, so that the substrate 311, the supporting member 70, the mold base 32, and the photosensitive chip 20 are integrally combined.

Fig. 98 shows another modified embodiment of the camera module 100, wherein the photosensitive chip 20 can be attached to the substrate 311 by a flip-chip process, so that the photosensitive area of the photosensitive chip 20 passes through the accommodating space 3116 of the substrate 311 and corresponds to the optical window 321 of the mold base 32.

Fig. 99 shows another modified embodiment of the camera module 100, in which the back surface 3114 of the substrate 311 may be integrally combined with the reinforcing part 35 to reinforce the strength of the substrate 311 by the reinforcing part 35. In addition, the photosensitive chip 20 can be directly attached to the reinforcing portion 35, so that the flatness of the photosensitive chip 20 can be ensured by the reinforcing portion 35 to improve the imaging quality of the camera module 100.

Fig. 100 shows another modified embodiment of the image pickup module 100, wherein the reinforcing portion 35 may also be provided with the receiving groove 351 for receiving the photosensitive chip 20, so that the height of the image pickup module 100 can be further increased.

Fig. 101 shows another modified embodiment of the camera module 100, the base plate 311 may be provided with at least one holding space 3117, wherein at least one holding space 3117 may be implemented as a through hole, so that, after the molding material 500 can pass through the holding space 3117 implemented as a through hole in the molding process, the molding base 32 and the reinforcing part 35 integrally coupled to the base plate 311 are formed on the front surface 3113 and the back surface 3114 of the base plate 311, respectively.

Fig. 102 shows another modified embodiment of the camera module 100, wherein the camera module 100 includes two optical lenses 10, two photosensitive chips 20, and one circuit board assembly 30, wherein the circuit board assembly 30 includes one circuit board 31, one molded base 32, and at least two sets of leads 33, wherein the circuit board 31 includes one substrate 311 and one connecting plate 312, the module connecting side 3121 of the connecting plate 312 is electrically connected to the connecting portion 31150 of the substrate 311, the substrate 311 has two receiving spaces 3116 for respectively receiving each photosensitive chip 20 and conducting each photosensitive chip 20 and the substrate 311 through the leads 33, wherein the molded base 32 has two light windows 321 such that each photosensitive chip 20 corresponds to each light window 321, wherein each of the optical lenses 10 is respectively held at the light sensing path of each of the light sensing chips 20. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 103 shows another modified embodiment of the camera module 100, in which the mold base 32 can further embed at least a portion of the non-photosensitive region of the photosensitive chip 20, so that the substrate 311, the mold base 32, and each of the photosensitive chips 20 are integrally bonded. In addition, the molded base 32 can further embed the non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 104 shows another modified embodiment of the camera module 100, in which the substrate 311 may also be provided with the support element 70 or form the support element 70, and the mold base 32 may embed at least a portion of the support element 70 so that the substrate 311, the support element 70, and the mold base 32 are integrally joined. In addition, the mold base 32 may further embed at least one non-photosensitive region of the photosensitive chip 20.

Fig. 105 shows another modified embodiment of the camera module 100, in which the non-photosensitive region of the photosensitive chip 20 may be provided with the supporting member 70 or form the supporting member 70, and the mold base 32 may embed at least a portion of the supporting member 70, so that the substrate 311, the supporting member 70, the mold base 32, and each of the photosensitive chips 20 are integrally combined. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 106 shows another modified embodiment of the camera module 100, in which each of the photosensitive chips 20 can be attached to the substrate 311 by a flip-chip process, so that the photosensitive region of the photosensitive chip 20 passes through the accommodating space 3116 of the substrate 311 and corresponds to the light window 321 of the mold base 32. Of course, in other examples of the image pickup module 100, one of the photosensitive chips 20 may be mounted on the substrate 311 by a flip-chip process, and the other photosensitive chip 20 may be held in the accommodating space 3116 of the substrate 311. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 107 shows another modified embodiment of the camera module 100, in which the back surface 3114 of the substrate 311 may be at least partially integrally joined to the reinforcing portion 35, so that the strength of the substrate 311 is reinforced by the reinforcing portion 35. In addition, each of the photosensitive chips 20 can be directly attached to the reinforcing portion 35, so that the flatness of each of the photosensitive chips 20 can be ensured by the reinforcing portion 35, thereby improving the imaging quality of the camera module 100. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 108 shows another modified embodiment of the image pickup module 100, wherein the reinforcing portion 35 may be provided with the receiving groove 351 for receiving each of the photosensitive chips 20, so that the height of the image pickup module 100 can be further increased. For example, in this example, the number of the accommodation grooves 351 of the reinforcing portion 35 and the number of the photosensitive chips 20 are identical, so that each of the photosensitive chips 20 can be accommodated in the accommodation groove 351 of the reinforcing portion 35. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 109 shows another modified embodiment of the image pickup module 100, in which the number of the receiving grooves 351 of the reinforcing portion 35 may be smaller than the number of the photosensitive chips 20, so that one of the photosensitive chips 20 is received in the receiving groove of the reinforcing portion 35 and the other photosensitive chip 20 is attached to the reinforcing portion 35, so that the two photosensitive chips 20 may have a height difference. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

Fig. 110 shows another modified embodiment of the camera module 100, the base plate 311 may be provided with at least one holding space 3117, wherein at least one holding space 3117 may be implemented as a through hole, so that, after the molding material 500 can pass through the holding space 3117 implemented as a through hole in the molding process, the molding base 32 and the reinforcing part 35 integrally coupled to the base plate 311 are formed on the front surface 3113 and the back surface 3114 of the base plate 311, respectively. In addition, the molding base 32 may further embed a non-photosensitive region of at least one of the photosensitive chips 20.

It will be appreciated by persons skilled in the art that the embodiments of the invention described above and shown in the drawings are given by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the embodiments, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.

Claims

1. A molded circuit board assembly, comprising:

a molded base having at least one optical window;

a circuit board including a substrate and a connection plate, wherein the connection plate is electrically connected to the substrate, the substrate is used for conducting the photosensitive chip, and the molded base is integrally combined with the base; and

a reinforcing part integrally combined to a back surface of the substrate.

2. The molded circuit board assembly of claim 1, wherein a thickness dimension of the stiffener is equal to or less than a thickness dimension of the substrate.

3. The molded circuit board assembly of claim 1, wherein the base plate has an accommodating space penetrating to form an upper surface and a lower surface thereof, the accommodating space being for mounting the photosensitive chip therein, and the reinforcing part is integrally bonded to a back surface of the base plate and the lower surface of the photosensitive chip.

4. The molded circuit board assembly of claim 2, wherein the reinforcement part has a receiving groove corresponding to the receiving space, the receiving groove and the receiving space for mounting the photosensitive chip therein.

5. The molded circuit board assembly of claim 1, wherein the reinforcement portion is integrally bonded to the back side of the substrate by a molding process.

6. The molded circuit board assembly of claim 1, wherein the reinforcement is integrally bonded to a partial area of the back side of the substrate.

7. The molded circuit board assembly of claim 6, wherein the connecting plate is electrically connected to a region of the back surface of the base plate not occupied by the reinforcement.

8. The molded circuit board assembly of claim 1, wherein the base plate has a connection edge side concavely formed on a back surface thereof, the connection plate has a module connection side electrically connected to the connection edge side of the base plate, wherein the reinforcement portion covers a connection position of the connection plate and the base plate on the connection edge side of the base plate.

9. The molded circuit board assembly of claim 8, wherein a thickness dimension of the module connection side of the connection board is equal to a depth dimension of the connection edge side of the substrate.

10. The molded circuit board assembly of claim 8, wherein a lower surface of the connecting plate is flush with a back surface of the base plate.

11. The utility model provides a module of making a video recording which characterized in that includes:

an optical lens;

a photosensitive chip; and

the molded circuit board assembly of any one of claims 1 to 10, wherein the light sensing chip is electrically connected to the molded circuit board assembly, and the optical lens is held in a light sensing path of the light sensing chip.

12. A method of making a molded circuit board assembly, comprising:

(a) molding a mold base having at least one optical window on at least one substrate;

(b) connecting a connecting plate to the substrate; and

(c) a reinforcing part is formed on the back surface of the substrate, and the reinforcing part is integrally combined with the back surface of the substrate.

13. An electronic device, comprising:

an electronic device body; and

at least one module of making a video recording, wherein, the module of making a video recording includes:

an optical lens;

a photosensitive chip; and