CN110089100A - Camera module and its molded case circuit board group part and manufacturing method and the electronic equipment with camera module - Google Patents

Camera module and its molded case circuit board group part and manufacturing method and the electronic equipment with camera module Download PDF

Info

Publication number
CN110089100A
CN110089100A CN201780078561.5A CN201780078561A CN110089100A CN 110089100 A CN110089100 A CN 110089100A CN 201780078561 A CN201780078561 A CN 201780078561A CN 110089100 A CN110089100 A CN 110089100A
Authority
CN
China
Prior art keywords
substrate
camera module
sensitive chip
molded base
connecting plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780078561.5A
Other languages
Chinese (zh)
Inventor
陈振宇
王明珠
田中武彦
郭楠
赵波杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Publication of CN110089100A publication Critical patent/CN110089100A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

The present invention provides a camera module and its molded case circuit board group part and manufacturing method and the electronic equipment with camera module, wherein the camera module includes an at least optical lens, an at least sensitive chip and a molded case circuit board group part, the molded case circuit board group part includes at least the substrate of a hard and being connected at least connecting plate of the substrate, the sensitive chip is connected to the substrate switched only, the optical lens is maintained at the photosensitive path of the sensitive chip, wherein the molded case circuit board group part further includes the molded base for being integrally incorporated into the substrate, the molded base is looped around the surrounding of the photosensitive region of the sensitive chip, so that the photosensitive region of the sensitive chip corresponds to the optical window of the molded base, in this way, the volume of the camera module can be reduced, so that described Camera module is suitable for being applied to pursue lightening electronic equipment.

Description

Camera module and its molded case circuit board group part and manufacturing method and the electronic equipment with camera module Technical field
The present invention relates to optical imaging field, in particular to a camera module and its molded case circuit board group part and manufacturing method and the electronic equipment with camera module.
Background technique
In recent years, one of the standard configuration that camera module has developed into for electronic equipment, wherein camera module can not only help camera module to obtain about scene or the image of object, but also the operation from user can be received so that electronic equipment provides various functions, this makes electronic equipment have increasingly been towards intelligent direction development.In addition, lightening electronic equipment easy to carry and use is increasingly pursued in the market, so that the lighter and thinner development trend for having become electronic equipment, and that it will also come the size of camera module and image quality requirement is harsher for the lightening and intelligentized development trend of electronic equipment.Therefore, how to solve the problems, such as in the volume that guarantees even to reduce camera module on the basis of improving the image quality of camera module and existing various in this process, be the present invention in the emphasis being next discussed.
Summary of the invention
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein the volume of the camera module can be reduced, so that the camera module pursues lightening electronic equipment particularly suitable for being applied to.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein the circuit board assemblies form a molded base by molding process on an at least substrate, so that the camera module is compact-sized.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein the circuit board assemblies provide a connecting plate, the mould group connecting side of the connecting plate is electrically connected to the substrate.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, it wherein moulds the molded base on the substrate first, the mould group connecting side of the connecting plate is then electrically connected to the substrate again.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein when carrying out molding process, a molding tool can directly apply pressure to the substrate the mould group connecting side that be used to connect the connecting plate position, effectively to reinforce the validity connected between the substrate and the connecting plate.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, it wherein can be by multiple substrate arrangement version units in a row, to be moulded simultaneously to multiple substrates, to for the substrate after soft or hard combination version or connection soft board, higher alignment efficiency can be obtained, and higher molding efficiencies, to improve the production efficiency of the camera module.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein the molded base can further embed the link position of the substrate and the connecting plate, in such manner, it is possible to guarantee the reliability of the link position.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein the molded base can further embed the link position of the substrate and the connecting plate, in this way, it can be substituted for reinforcing the reinforcement feature of the substrate and the connecting plate by the molded base, to save space and reduce process.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein the molded base can also further extend to the equipment connecting side of the connecting plate, to reach positioning, limit, fixation and the demand for blocking isostructuralism.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein the molded base can further wrap up the part of the spilling of the conducting medium for connecting the substrate and the connecting plate, to prevent the conducting medium overflowed from polluting the camera module, it can also be ensured that the aesthetics of the appearance of the camera module.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein the connecting plate can be electrically connected at least part at the back side of the substrate, in this way, when carrying out molding process to the substrate, the utilization rate of the horizontal size of layout unit can be further increased and improve the density of the substrate of the layout unit, to obtain better stock utilization and production efficiency.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein the connecting plate can be connected with the side of the substrate, in this way, the extending direction of the extending direction and the substrate that can make the connecting plate is inconsistent, in order to connect the connecting plate with electronic equipment subsequent.
It is an object of the present invention to provide a camera module and its molded case circuit board group part and manufacturing method and with the electronic equipment of camera module, wherein the connecting plate can be connected with the side of the substrate, in this way, the whole volume of the camera module can be reduced, to reduce the camera module occupied space in the electronic equipment.
One aspect under this invention, the present invention further provides a molded case circuit board group parts comprising:
One molded base, wherein the molded base has an at least optical window；With
An at least circuit board, wherein the circuit board includes at least connecting plate that at least substrate of a hard is connected to switched on the substrate, and the substrate connects an at least sensitive chip switched only, wherein the molded base is integrally incorporated into the substrate, and the molded base is looped around the surrounding of the photosensitive region of the sensitive chip, so that the photosensitive region of the sensitive chip corresponds to the optical window of the molded base.
According to one embodiment of present invention, the connecting plate have a mould group connecting side, wherein the connecting plate by the mould group connecting side of the connecting plate be mounted on the substrate it is positive in a manner of be connected to the substrate switched only.
According to one embodiment of present invention, the connecting plate has a mould group connecting side, wherein the connecting plate is connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the back side of the substrate switched only.
According to one embodiment of present invention, the connecting plate has a mould group connecting side, wherein the connecting plate is connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the side of the substrate switched only.
According to one embodiment of present invention, the substrate has on the outside of an edge and on the inside of an edge, set the dimensional parameters on the outside of the edge of the substrate wherein as L1, dimensional parameters on the inside of the edge of the substrate are L2, wherein the value range of the dimensional parameters L1 on the outside of the edge of the substrate is: 0.01mm≤L1≤5mm, wherein the value range of the dimensional parameters L2 on the inside of the edge of the substrate is: 0.01mm≤L2≤5mm.
According to one embodiment of present invention, if the width dimensions parameter of the overlapping region of the mould group connecting side and substrate of the connecting plate is L3, wherein the value range of parameter L3 is: 0.01mm≤L3≤5mm.
According to one embodiment of present invention, the substrate has an at least short slot, wherein the mould group connecting side of the connecting plate is maintained at the short slot of the substrate.
According to one embodiment of present invention, the side of the substrate forms an interconnecting piece, wherein the mould group connecting side of the connecting plate is mounted on the interconnecting piece of the substrate.
According to one embodiment of present invention, the molded base embeds the mould group connecting side of the connecting plate.
According to one embodiment of present invention, the molded case circuit board group part further comprises a reinforcement part, wherein the reinforcement part is integrally incorporated into the back side of the substrate.
According to one embodiment of present invention, the reinforcement part embeds the mould group connecting side of the connecting plate.
According to one embodiment of present invention, the substrate has an at least accommodation space, wherein the sensitive chip is maintained at the accommodation space of the substrate.
According to one embodiment of present invention, the molded case circuit board group part further comprises an at least electronic component, wherein the electronic component is connected to the substrate switched only.
According to one embodiment of present invention, at least one described electronic component is located at the back side of the substrate.
According to one embodiment of present invention, the molded case circuit board group part further comprises an at least electronic component, wherein the electronic component is connected to the substrate switched only, and at least one described electronic component is located at the back side of the substrate.
According to one embodiment of present invention, the reinforcement part embeds at least part of at least one electronic component.
Other side under this invention, the present invention further provides a camera modules comprising:
An at least optical lens；
An at least sensitive chip；And
One molded case circuit board group part, wherein the molded case circuit board group part further comprises:
One molded base, wherein the molded base has an at least optical window；With
An at least circuit board, wherein the circuit board includes at least connecting plate that at least substrate of a hard is connected to switched on the substrate, and the sensitive chip is connected to the substrate switched only, wherein the molded base is integrally incorporated into the substrate, and the molded base is looped around the surrounding of the photosensitive region of the sensitive chip, so that the photosensitive region of the sensitive chip corresponds to the optical window of the molded base, wherein the optical lens is maintained at the photosensitive path of the sensitive chip, so that the optical window of the molded base forms the light channel between the optical lens and the sensitive chip.
According to one embodiment of present invention, the connecting plate have a mould group connecting side, wherein the connecting plate by the mould group connecting side of the connecting plate be mounted on the substrate it is positive in a manner of be connected to the substrate switched only.
According to one embodiment of present invention, the connecting plate has a mould group connecting side, wherein the connecting plate is connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the back side of the substrate switched only.
According to one embodiment of present invention, the connecting plate has a mould group connecting side, wherein the connecting plate is connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the side of the substrate switched only.
According to one embodiment of present invention, the substrate has on the outside of an edge and on the inside of an edge, set the dimensional parameters on the outside of the edge of the substrate wherein as L1, dimensional parameters on the inside of the edge of the substrate are L2, wherein the value range of the dimensional parameters L1 on the outside of the edge of the substrate is: 0.01mm≤L1≤5mm, wherein the value range of the dimensional parameters L2 on the inside of the edge of the substrate is: 0.01mm≤L2≤5mm.
According to one embodiment of present invention, if the width dimensions parameter of the overlapping region of the mould group connecting side and substrate of the connecting plate is L3, wherein the value range of parameter L3 is: 0.01mm≤L3≤5mm.
According to one embodiment of present invention, the substrate has an at least short slot, wherein the mould group connecting side of the connecting plate is maintained at the short slot of the substrate.
According to one embodiment of present invention, the side of the substrate forms an interconnecting piece, wherein the mould group connecting side of the connecting plate is mounted on the interconnecting piece of the substrate.
According to one embodiment of present invention, the molded base embeds the mould group connecting side of the connecting plate.
According to one embodiment of present invention, the molded case circuit board group part further comprises a reinforcement part, wherein the reinforcement part is integrally incorporated into the back side of the substrate.
According to one embodiment of present invention, the reinforcement part embeds the mould group connecting side of the connecting plate.
According to one embodiment of present invention, the substrate has an at least accommodation space, wherein the sensitive chip is maintained at the accommodation space of the substrate.
According to one embodiment of present invention, the molded case circuit board group part further comprises an at least electronic component, wherein the electronic component is connected to the substrate switched only.
According to one embodiment of present invention, at least one described electronic component is located at the back side of the substrate.
According to one embodiment of present invention, the molded case circuit board group part further comprises an at least electronic component, wherein the electronic component is connected to the substrate switched only, and at least one described electronic component is located at the back side of the substrate.
According to one embodiment of present invention, the reinforcement part embeds at least part of at least one electronic component.
According to one embodiment of present invention, while the molded base is incorporated into the front of the substrate, the reinforcement part is incorporated into the back side of the circuit board.
According to one embodiment of present invention, after the front that the molded base is incorporated into the substrate, the reinforcement part is incorporated into the back side of the circuit board.
According to one embodiment of present invention, the molded base further embeds the non-photo-sensing region of at least one sensitive chip.
According to one embodiment of present invention, the camera module includes at least two optical lens, at least two sensitive chips and at least two substrates, wherein each sensitive chip is mounted on each substrate respectively, each optical lens is respectively held in the photosensitive path of each sensitive chip, so that the camera module forms an array camera module.
According to one embodiment of present invention, the camera module includes at least two optical lens, at least two sensitive chips and a substrate, wherein each sensitive chip is mounted on the substrate respectively, each optical lens is respectively held in the photosensitive path of each sensitive chip, so that the camera module forms an array camera module.
According to one embodiment of present invention, the camera module further comprises at least two filter elements, wherein each filter element is mounted on the molded base respectively, and each filter element is respectively held between each optical lens and each sensitive chip.
According to one embodiment of present invention, the camera module further comprises the bracket of at least two filter elements and at least two frame-type, wherein each filter element is mounted on each bracket respectively, each bracket is mounted on the molded base respectively, each filter element to be maintained between each optical lens and each sensitive chip respectively by each bracket and the molded base.
According to one embodiment of present invention, the camera module further comprises the bracket of at least two filter elements and an at least frame-type, wherein each filter element is mounted on the bracket respectively, the bracket is mounted on the molded base, each filter element to be maintained between each optical lens and each sensitive chip respectively by the bracket and the molded base.
According to one embodiment of present invention, the camera module further comprises an at least support, wherein the support has an at least light hole, wherein the support is mounted on the front of the substrate in the support mode adjacent with the molded base, and the support is looped around the surrounding of the photosensitive region of the sensitive chip, so that the photosensitive region of the sensitive chip corresponds to the light hole of the support, wherein the light hole of the support forms the light channel between the optical lens and the sensitive chip.
Other side under this invention, the present invention further provides an electronic equipments comprising an electronic equipment ontology and at least camera module for being arranged at the electronic equipment ontology, wherein the camera module includes:
An at least optical lens；
An at least sensitive chip；And
One molded case circuit board group part, wherein the molded case circuit board group part further comprises:
One molded base, wherein the molded base has an at least optical window；With
An at least circuit board, wherein the circuit board includes at least connecting plate that at least substrate of a hard is connected to switched on the substrate, and the sensitive chip is connected to the substrate switched only, wherein the molded base is integrally incorporated into the substrate, and the molded base is looped around the surrounding of the photosensitive region of the sensitive chip, so that the photosensitive region of the sensitive chip corresponds to the optical window of the molded base, wherein the optical lens is maintained at the photosensitive path of the sensitive chip, so that the optical window of the molded base forms the light channel between the optical lens and the sensitive chip.
According to one embodiment of present invention, the electronic equipment ontology is a smart phone, wherein the camera module is arranged at the front of the smart phone, to form the preposition camera module of the smart phone.
According to one embodiment of present invention, the electronic equipment ontology is a smart phone, wherein the camera module is arranged at the rear portion of the smart phone, to form the postposition camera module of the smart phone.
Other side under this invention, the present invention further provides the manufacturing methods of a camera module, wherein the manufacturing method includes the following steps:
(a) the layout unit that there is molding a molded base of an at least optical window to be formed in the substrate by an at least hard；
(b) an at least sensitive chip is conductively connected in the substrate, wherein the photosensitive region of the sensitive chip corresponds to the optical window of the molded base；And
(c) an at least optical lens is kept to the photosensitive path of each sensitive chip, the camera module is made.
According to one embodiment of present invention, the step (b) is before the step (a), to connect each sensitive chip with first turning in each of the formation layout unit substrate, then molding process is carried out on the layout unit, to form the molded base for the surrounding for being looped around each sensitive chip, so that the photosensitive region of each sensitive chip corresponds respectively to each of described molded base optical window.
According to one embodiment of present invention, non-photo-sensing region of the molded base in conjunction with the sensitive chip.
According to one embodiment of present invention, in the above-mentioned methods, further comprise step:
The layout unit is provided, wherein the layout unit includes substrate described in multiple row and multirow；
The molded base is moulded on the layout unit in such a way that the pasting area of each substrate is exposed on each of described molded base optical window respectively molding process；And
Each sensitive chip is mounted respectively in the pasting area of each substrate via each of the molded base optical window, and the sensitive chip and the substrate is connected.
According to one embodiment of present invention, in the above-mentioned methods, further comprise step:
The layout unit is provided, wherein the layout unit includes substrate described in multiple row and multirow；
The sensitive chip is mounted and is connected respectively in the pasting area of each substrate；And
The molded base is moulded on the layout unit in such a way that the molded base is looped around the surrounding of the photosensitive region of each sensitive chip molding process, so that the photosensitive region of each sensitive chip corresponds respectively to each of described molded base optical window.
According to one embodiment of present invention, in the above-mentioned methods, further comprise step:
The layout unit is provided, wherein the layout unit includes substrate described in multiple row and multirow；
The sensitive chip is mounted and is connected respectively in the pasting area of each substrate；And
The molded base is moulded on the layout unit in such a way that the molded base is looped around the surrounding of the photosensitive region of each sensitive chip molding process, so that the photosensitive region of each sensitive chip corresponds respectively to each of described molded base optical window.
According to one embodiment of present invention, in the step after molding process moulds the molded base in such a way that the pasting area of each substrate is exposed on each of described molded base optical window respectively on the layout unit, further comprise step: segmentation is performed the layout unit after molding process, to obtain a molded case circuit board group part.
According to one embodiment of present invention, each sensitive chip is mounted respectively in the pasting area of each substrate via each of the molded base optical window in the step, and after being connected the sensitive chip and the substrate, further comprise step: segmentation is performed the layout unit after molding process, to obtain the molded case circuit board group part.
According to one embodiment of present invention, the molded base is moulded on the layout unit in such a way that the molded base is looped around the surrounding of the photosensitive region of each sensitive chip molding process in the step, so that the photosensitive region of each sensitive chip corresponds respectively to after each of described molded base optical window, further comprise step: segmentation is performed the layout unit after molding process, to obtain the molded case circuit board group part.
According to one embodiment of present invention, the molded base is moulded on the layout unit in such a way that the molded base is looped around the surrounding of the photosensitive region of each sensitive chip molding process in the step, so that the photosensitive region of each sensitive chip corresponds respectively to after each of described molded base optical window, further comprise step: segmentation is performed the layout unit after molding process, to obtain the molded case circuit board group part.
According to one embodiment of present invention, the manufacturing method further comprises step: by an at least connecting plate by the mould group connecting side of the connecting plate be mounted on the substrate it is positive in a manner of be conductively connected to the substrate.
According to one embodiment of present invention, the manufacturing method further comprises step: an at least connecting plate is conductively connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the back side of the substrate.
According to one embodiment of present invention, the manufacturing method further comprises step: an at least connecting plate is conductively connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the side of the substrate.
According to one embodiment of present invention, the molded base embeds the mould group connecting side of the connecting plate.
According to one embodiment of present invention, the molded base embeds the mould group connecting side of the connecting plate.
According to one embodiment of present invention, the molded base embeds the mould group connecting side of the connecting plate.
According to one embodiment of present invention, at least one side of molded base described in is the separation side formed by division process.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of an electronic equipment of a preferred embodiment under this invention.
Fig. 2 is the stereoscopic schematic diagram of a camera module of a preferred embodiment under this invention.
Fig. 3 A is the schematic cross-sectional view of the camera module of above-mentioned preferred embodiment under this invention.
Fig. 3 B is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Fig. 4 is the schematic cross-sectional view of a circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Fig. 5 is the schematic diagram of one of manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Fig. 6 is two schematic diagram of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Fig. 7 is three schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Fig. 8 is four schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Fig. 9 is five schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 10 is six schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 11 is seven schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 12 is eight schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 13 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 14 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 15 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 16 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 17 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 18 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 19 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 20 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 21 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 22 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 23 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 24 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 25 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 26 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 27 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 28 A is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 28 B is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 29 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 30 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 31 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 32 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 33 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 34 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 35 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 36 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 37 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 38 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 39 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 40 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 41 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 42 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 43 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 44 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 45 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 46 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 47 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 48 A is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 48 B is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 49 A is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 49 B is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 50 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 51 is the schematic diagram of one of manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 52 is two schematic diagram of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 53 is three schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 54 is four schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 55 is five schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 56 is six schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 57 is seven schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 58 is eight schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 59 is nine schematic cross-sectional view of the manufacturing step of the circuit board assemblies of the camera module of above-mentioned preferred embodiment under this invention.
Figure 60 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 61 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 62 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 63 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 64 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 65 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 66 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 67 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 68 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 69 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 70 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 71 A is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 71 B is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 72 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention
Figure 73 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 74 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 75 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 76 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 77 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 78 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 79 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 80 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 81 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 82 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 83 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 84 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 85 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 86 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 87 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 88 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 89 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 90 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 91 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 92 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 93 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 94 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 95 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 96 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 97 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 98 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 99 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 100 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 101 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 102 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 103 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 104 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 105 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 106 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 107 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 108 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 109 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Figure 110 is the schematic cross-sectional view of a variant embodiment of the camera module of above-mentioned preferred embodiment under this invention.
Specific embodiment
It is described below for disclosing the present invention so that those skilled in the art can be realized the present invention.Preferred embodiment in being described below is only used as illustrating, it may occur to persons skilled in the art that other obvious modifications.The basic principle of the invention defined in the following description can be applied to other embodiments, deformation scheme, improvement project, equivalent program and the other technologies scheme without departing from the spirit and scope of the present invention.
It will be understood by those skilled in the art that, in exposure of the invention, term " longitudinal direction ", " transverse direction ", "upper", "lower", " preceding ", " rear ", " left side ", " right side ", "vertical", "horizontal", "top", "bottom" "inner", the orientation or positional relationship of the instructions such as "outside" is to be based on the orientation or positional relationship shown in the drawings, it is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must have a particular orientation, it is constructed and operated in a specific orientation, therefore above-mentioned term is not considered as limiting the invention.
It is understood that term " one " is interpreted as " at least one " or " one or more ", i.e., in one embodiment, the quantity of one element can be one, and in a further embodiment, the quantity of the element can be it is multiple, term " one " should not be understood as the limitation to quantity.
With reference to Fig. 1 of Figure of description of the invention, the one of a preferred embodiment under this invention is set forth with the electronic equipment of camera module, wherein the electronic equipment includes an at least camera module 100 and an electronic equipment ontology 200, wherein the camera module 100 is arranged at the electronic equipment ontology 200, for helping 200 filmed image of electronic equipment ontology.
It is worth mentioning that, although the shown in Figure 1 camera module 100 is arranged at the embodiment at the back side (side that facing away from the display screen of the electronic equipment ontology 200) of the electronic equipment ontology 200, it can be understood that, the camera module 100 can also be arranged at the front (side of the display screen of the electronic equipment ontology 200) of the electronic equipment ontology 200, or at least one described camera module 100 is arranged at the back side of the electronic equipment ontology 200, the front of the electronic equipment ontology 200 is arranged at camera module 100 described at least one.Certainly, it will be appreciated by those skilled in the art that, the side that the electronic equipment ontology 200 is arranged in the camera module 100 is also possible that.That is, the camera module 100 is arranged at the position of the electronic equipment ontology 200 and is not construed as the limitation of the content and range to the camera module 100 of the invention.
In addition, the type of the camera module 100 is unrestricted in the electronic equipment of the invention, although camera module 100 described in example as shown in Figure 1 is implemented as single-lens camera module, and in other examples, the camera module 100 also may be implemented as array camera module, such as, but not limited to twin-lens camera module.
In addition, although the electronic equipment ontology 200 of the electronic equipment shown in Figure 1 is carried out the example for smart phone, in other examples, the electronic equipment ontology 200 can also be implemented as any electronic products that can be configured the camera module 100 such as tablet computer, electric paper book, MP3/4/5, personal digital assistant, camera, television set, washing machine, refrigerator.
With reference to figs. 2 to Fig. 3 B, the camera module 100 includes an at least optical lens 10, at least a sensitive chip 20 and an at least circuit board assemblies 30, wherein the sensitive chip 20 is connected to the circuit board assemblies 30 switched only, and the optical lens 10 is maintained at the photosensitive path of the sensitive chip 20.In addition, the circuit board assemblies 30 can be connected with each other with the electronic equipment ontology 200, such as the circuit board assemblies 30 and the electronic equipment ontology 200 can be electrically connected, so that the camera module 100 is connected to the electronic equipment ontology 200.The light being reflected by the object enters the inside of the camera module 100 from the optical lens 10, then it is imaged by the sensitive chip 20 reception and progress photoelectric conversion, to obtain the image about object, wherein the electronic equipment ontology 200 can be sent to subsequent about the digital signal of the image of object, it such as, but not limited to can store in the memory of the electronic equipment ontology 200, it can also be stored by the electronic equipment ontology 200 and arrive cloud, also may be displayed on the display screen of the electronic equipment ontology 200.
The circuit board assemblies 30 include a circuit board 31 and a molded base 32.The circuit board 31 includes the substrate 311 and at least one soft connecting plate 312 of an at least hard, the substrate 311 has at least one smooth pasting area 3111 and is looped around a fringe region 3112 of the surrounding of the pasting area 3111, the connecting plate 312 has a mould group connecting side 3121 and the equipment connecting side 3122 corresponding to the mould group connecting side 3121, wherein the sensitive chip 20 is mounted on the pasting area 3111 of the substrate 311, the fringe region 3112 of the molded base 32 and the substrate 311 integrally combines, wherein the molded base 32 has an at least optical window 321, wherein the photosensitive region of the sensitive chip 20 corresponds to the optical window 321 of the molded base 32.The mould group connecting side 3121 of the connecting plate 312 and the fringe region 3112 of the substrate 311 are electrically connected together, so that the circuit of the connecting plate 312 and the circuit of the substrate 311 are switched on, wherein the equipment connecting side 3122 of the connecting plate 312 can be electrically connected to the electronic equipment ontology 200.
It can be switched on by an at least lead 33 between the sensitive chip 20 and the substrate 311, wherein the lead 33 can make two ends of the lead 33 be respectively communicated with the sensitive chip 20 and the substrate 311 by routing technique.The routing direction of the lead 33 is unrestricted in the present invention, such as the routing direction of the lead 33 can be from the sensitive chip 20 to the substrate 31, or from the substrate 31 to the sensitive chip 20.The type of the lead 33 is also unrestricted, such as the lead 33 can be gold thread, silver wire, copper wire etc..
Further, the substrate 311 of the circuit board 31 has a front 3113 and a back side 3114, wherein described positive 3113 and the reciprocal correspondence of the back side 3114.It is understood that under normal conditions, described positive the 3113 of the substrate 311 and the back side 3114 be used to define the thickness of the substrate 311.It can be understood that, the substrate 311 includes at least one layer of plate, such as the substrate 311 may be implemented as one layer of hardboard, at this time, the surface on the top of the substrate 311 is defined as described positive 3113, and the surface of the lower part of the substrate 311 is defined as the back side 3114.For example described substrate 311 can also be formed afterwards by multi-layered board is overlapped again, therefore, it can be understood that, the exposed side of the uppermost layer of plate of the substrate 311 is only defined as described positive 3113, and the exposed side of the nethermost layer of plate of the substrate 31 is defined as the back side 3114.It is understood that the pasting area 3111 and the fringe region 3112 of the substrate 311 are both formed in described positive the 3113 of the substrate 311.
In addition, the substrate 311 is by from the point of view of overlooking state, it is usually to be square, such as can be square, it is also possible to rectangle, however, it will be appreciated by those skilled in the art that be, the substrate 311 can also have other specific shapes, such as the overlooking state of the substrate 311 can be in rough rectangular, and the camera module 100 of the invention is unrestricted in this regard.
In addition, the mould group connecting side 3121 of the connecting plate 312 is generally connected to the side of the fringe region 3112 of the substrate 311, following, for ease of description, the side of the mould group connecting side 3121 that be used to connect the connecting plate 312 of the fringe region 3112 of the substrate 311 is defined as a connection edge side 31121, and the side of the mould group connecting side 3121 for being not applied to connect the connecting plate 312 of the fringe region 3112 of the substrate 311 is defined as a free edge side 31122.It is understood, therefore, that described positive the 3113 of the substrate 311 form the pasting area 3111, the connection edge side 31121 and the free edge side 31122.
It is worth mentioning that, the type of the substrate 311 is unrestricted in the camera module 100 of the invention, such as the substrate 311 can be but not limited to hardboard, Rigid Flex, ceramic wafer etc., in addition, the type of the connecting plate 312 is also unrestricted in the camera module 100 of the invention.
The circuit board assemblies 30 can also include an at least electronic component 34, electronic component 34 described in wherein at least one can be mounted on the fringe region 3112 of the substrate 311 of the circuit board 31, preferably, the electronic component 34 is mounted on the free edge side 31122 of the substrate 311.The molded base 32 can also embed at least part of at least one electronic component 34, or the electronic component 34 that embedding is whole without embedding the electronic component 34 after shaping.It is understood that the electronic component 34 and external environment can be prevented to contact by the molded base 32, to avoid the surface oxidation of the electronic component 34 when the molded base 32 embeds the electronic component 34 after shaping.When the molded base 32 embeds whole electronic components 34 after shaping, the adjacent electronic component 34 can be isolated in the molded base 32, to prevent the adjacent electronic component 34 from the bad phenomenon interfered with each other occur, in addition, the molded base 32 can also make the spacing of the adjacent electronic component 34 smaller, so that the free edge side 31122 of the substrate 311 can be by attachment greater number and the larger sized electronic component 34.
In addition, the electronic component 34 and the sensitive chip 20 can be also isolated in the molded base 32, and the photosensitive region of the sensitive chip 20 is polluted to avoid the cast of the link position of the cast or the electronic component 34 and the substrate 311 on the surface of the electronic component 34.Such as, the electronic component 34 and the sensitive chip 20 can be isolated by way of embedding the electronic component 34 in the molded base 32, and the electronic component 34 and the sensitive chip 20 is isolated in the mode that the electronic component 34 and the sensitive chip 20 can also be made to be located at the two sides of the molded base 32.
In other some examples, the electronic component 34 can also be mounted on the back side 3114 of the substrate 311, in this way, the length and width dimensions of the camera module 100 can be further reduced, the electronic component 34 and the sensitive chip 20 can also be isolated.
It is noted that the type of the electronic component 34 is unrestricted, such as the electronic component 34 may be implemented as but be not limited to driver, relay, processor, resistance, capacitor etc..
Further, with continued reference to attached drawing 3A, the camera module 100 includes an at least filter element 40, wherein the filter element 40 is maintained between the sensitive chip 20 and the optical lens 10, so as to enter the light of the inside of the camera module 100 being reflected by the object from the optical lens 10, it is received again by the sensitive chip 20 after passing through the filter element 40, the filter element 40 can filter the stray light in light, in this way, the image quality of the camera module 100 can be improved.The type of the filter element 40 is unrestricted, is selected as needed, such as in this illustration, and the filter element 40 may be implemented as cutoff filter.
The filter element 40 is mounted on the top surface of the molded base 32, the filter element 40 to be maintained between the optical lens 10 and the sensitive chip 20 by the molded base 42.Preferably, the extending direction of the filter element 40 and the optical axis direction of the camera module 100 are mutually perpendicular to.
Further, the top surface of the molded base 32 has an at least outer surface 322 and an at least inner surface 323, wherein in one example, the plane where plane and the inner surface 323 where the outer surface 322 of the molded base 32 is in approximately the same plane, and the filter element 40 is mounted on the inner surface 323 of the molded base 32.In another example, with reference to attached drawing 3A, the plane where plane and the inner surface 323 where the outer surface 322 of the molded base 32 has difference in height, such as the plane where the outer surface 322 of the molded base 32 is higher than the plane where the inner surface 323, to make the molded base 32 form at least one attachment slot 324, wherein the attachment slot 324 is connected to the optical window 321, the filter element 40 for being wherein mounted on the inner surface 323 of the molded base 32 is housed inside in the attachment slot 324, in this way, advantageously reduce the height dimension of the camera module 100.
In this variant embodiment of the camera module 100 shown in attached drawing 3B, the camera module 100 further comprises the bracket 50 of an at least frame shape, wherein the filter element 40 is mounted on the bracket 50, the bracket 50 is mounted on the inner surface 323 of the molded base 32, so that the filter element 40 is maintained between the optical lens 10 and the sensitive chip 20, in this way, the size of the filter element 40 can be reduced, to reduce the manufacturing cost of the camera module 100.With further reference to attached drawing 3B, the bracket 50 is to be maintained at the attachment slot 324, in this way, can reduce the height dimension of the camera module 100.
The camera module 100 can be an auto-focusing and zoom camera mould group, with reference to attached drawing 3A and Fig. 3 B, the camera module 100 may further include an at least driver 60, wherein the optical lens 10 is driveably set to the driver 60, the driver 60 is mounted on the outer surface 322 of the molded base 32, so that the optical lens 10 is maintained at the photosensitive path of the sensitive chip 20.The driver 60 can drive the optical lens 10 to move along the photosensitive path of the sensitive chip 20, in a manner of by adjusting the relative position of the optical lens 10 and the sensitive chip 20, realize focusing and the zoom of the camera module 100.It is noted that the driver 60 may be implemented as but be not limited to voice coil motor.
In addition, the camera module 100 also may be implemented as fixed-focus camera module, that is, the distance of the optical lens 10 and the sensitive chip 20 does not allow to be adjusted.Such as, in one embodiment, the optical lens 10 can be made to be maintained on the photosensitive path of the sensitive chip 20 by a lens barrel, wherein the lens barrel can be the outer surface 322 for being mounted on the molded base 32, the outer surface 322 of the molded base 32 can also integrally be extended from, in another embodiment, the optical lens 10 directly can also be mounted on the molded base 32, such as the optical lens 10 can be the outer surface 322 for being mounted on the molded base 32.
With reference to Fig. 5 to Figure 11 of Figure of description of the invention, the manufacturing process of the circuit board assemblies 30 of the camera module 100 is set forth.
With reference to attached drawing 5 and Fig. 6, two or more the substrate 311 can be arranged together to form a layout unit 300, in order in subsequent carry out molding process.Such as in this illustration, multiple substrates 311 can be arranged in two rows of formation layout units 300.Then each electronic component 34 can be mounted on to the fringe region 3112 of each substrate 311 respectively.Preferably, each electronic component 34 can be mounted on to the free edge side 31122 of each substrate 311 respectively.However, it will be appreciated by those skilled in the art that be, the electronic component 34 is mounted on to the connection edge side 31121 of the substrate 311, or the electronic component 34 attachment is possible to mounted in the back side 3114 of the substrate 311.In addition, the substrate 311 first also can also be mounted on the electronic component 34, then rearranges the substrate 311 and form the layout unit 30.
It is worth mentioning that, the substrate 311 can also be aligned to other patterns, or the substrate 311 can also be arranged, to individually execute molding process on the substrate 311 and form the molded base 32 joined integrally with the substrate 311 in subsequent molding process.
Preferably, the range of the distance between adjacent described substrate 311 of the layout unit 300 is 0.01mm~500mm (including 0.01mm and 500mm), preferably 0.05mm~200mm (including 0.05mm and 200mm).The minimum dimension range of the layout unit 300 is 1mm~100000mm (including 1mm and 100000mm), preferably 10mm~1000mm (including 10mm and 1000mm).
With reference to attached drawing 7, Fig. 8, Fig. 9 and Figure 10, the layout unit 300 is placed in a molding tool 400 and carries out molding process.
Specifically, the molding die 400 mold 402 including a upper mold 401 and once, wherein at least one mold in the upper mold 401 and the lower mold 402 can be operated, so that the molding die 400 can mold and draft, wherein when the upper mold 401 and the lower mold 402 are molded, an at least molding space 403 can be formed between the upper mold 401 and the lower mold 402.In addition, when forming two or more the molding space 403 between the upper mold 401 and the lower mold 402, an at least communicating passage can also be formed, between the upper mold 401 and the lower mold 402 for being connected to the adjacent molding space 403.
Further, the upper mold 401 may include a molding induction element 4011 and an at least optical window profile member 4012, wherein each optical window profile member 4012 is separately formed in the molding induction element 4011, to form a molding guiding groove 4013 between the molding induction element 4011 and the optical window profile member 4012.It is noted that each optical window profile member 4012 integrally formed in the molding induction element 4011 or each optical window profile member 4012 or seperated can take shape in the molding induction element 4012.
When the upper mold 401 and the lower mold 402 are molded, the molding die 400 forms each molding space 403 in the position of each molding guiding groove 4013.In addition, the molding die 400 can also include a cover film 405, wherein the cover film 405 is overlappingly set to the forming surface 4014 of the upper mold 401, such as the cover film 405 can make the cover film 405 overlappingly be set to the forming surface 4014 of the upper mold 401 in a manner of being attached at the forming surface 4014 of the upper mold 401.It is noted that the forming surface 4014 of the present invention includes at least the stitching surface of the optical window profile member 4012, it can also include the inner surface of the molding induction element 4011.
When the layout unit 300 is placed into the molding die 400, at least part of the fringe region 3112 of each of the layout unit 300 substrate 311 corresponds to each molding space 403, wherein the stitching surface of each optical window profile member 4012 can be pressed together on the pasting area 3111 of each of described layout unit 300 substrate 311 respectively.It is understood that the stitching surface of the optical window profile member 4012 and the pasting area 3111 of the substrate 311 can be isolated in the cover film 405, to protect the pasting area 3111.Preferably, the cover film 405 has elasticity, to buffer the molding die 400 when being molded to impact caused by the substrate 311.
The moulding material 500 of one flow-like is added at least one described molding space 300, the moulding material 500 can fill whole molding spaces 403 of the full molding die 400 by the communicating passage, and solidify in the moulding material 500 and after carrying out draft operation to the molding die 400, formation and the substrate 311 molded base 32 joined integrally, wherein forming the optical window 321 of the molded base 32 in the corresponding position of the optical window profile member 4012.It can be understood that, when forming the molded base 32 after the moulding material 500 solidifies in the molding die 400, the cover film 405 is between the molded base 32 and the forming surface 4014 of the upper mold 401, to the cover film 405 can convenient for the molding die 400 by carry out draft operation, such as the cover film 405 convenient for the upper mold 401 by draft.
It is noted that the moulding material 500 can be but not limited to the mixture of solid particle, liquid, liquid and solid particle.
With reference to attached drawing 3A, Fig. 3 B, Figure 10 and Figure 11, for the ease of 400 draft of molding die, the inner surface 325 of the molded base 32 is preferably inclined-plane, specifically, if the angle parameter that the extending direction of the inner surface 325 of the molded base 32 and the optical axis of the sensitive chip 20 are formed is α, wherein the value range of parameter alpha is 0 °~60 ° (including 0 ° and 60 °), preferably 5 °~35 ° (including 5 ° and 35 °).
Then, with reference to shown in attached drawing 11, after carrying out molding process on the layout unit 300, it can be separated to each of the layout unit 300 substrate 311 is formed, to obtain the semi-finished product of the circuit board assemblies 30, such as the semi-finished product of the circuit board assemblies 30 can be obtained by the extra part in techniques removal molding and/or the substrate 311 such as cutting or etching.
It is worth mentioning that, in one example, for the ease of cutting by the layout unit 300 after carry out molding process, as well as abrasion, cutting blade will form a slight tapered cross-section, the separation side of the semi-finished product of the circuit board assemblies 30 obtained after cutting also has a slight gradient, with reference to attached drawing 11, if the angle parameter that the extending direction of the side 3115 of the substrate 311 of the semi-finished product of the circuit board assemblies 30 and the optical axis of the sensitive chip 20 are formed is β, wherein the range of parameter beta is 0 °~10 ° (including 0 ° and 10 °), preferably 0 °~5 ° (including 0 ° and 5 °).In another example, for the ease of etching, as well as the continuity of etching, it the separation side of the semi-finished product of the circuit board assemblies 30 obtained after etching also can a slight gradient, with reference to attached drawing 11, if the angle parameter that the extending direction of the side 3115 of the substrate 311 of the semi-finished product of the circuit board assemblies 30 and the optical axis of the sensitive chip 20 are formed is β, wherein the range of parameter beta is 0 °~10 ° (including 0 ° and 10 °), preferably 0 °~5 ° (including 0 ° and 5 °).Certainly, it can be understood that, the gradient of the side 3115 of the substrate 311 of the semi-finished product of the circuit board assemblies 30 can also be removed in subsequent technique, such as can obtain vertical, smooth, mellow and full side form by polishing grinding or the side 3115 for going the techniques such as flash removed to make the substrate 311.
With reference to attached drawing 12, the mould group connecting side 3121 of the connecting plate 312 is electrically connected to the connection edge side 31121 of the substrate 311, to obtain the circuit board assemblies 30.Such as the connection edge side 31121 of the mould group connecting side 3121 of the connecting plate 312 and the substrate 311 can be electrically connected by a conducting medium, wherein the connection type of the connection edge side 31121 of the molding connecting side 32121 and substrate 311 of the connecting plate 312 may be implemented as but be not limited to ACF, ACP, welding, connector etc..
Then, with reference to attached drawing 4 and Figure 12, the sensitive chip 20 is mounted on to the pasting area 3111 of the substrate 311 by the optical window 321 of the molded base 32, and at least one described lead 33 can be formed between the sensitive chip 20 and the substrate 311 by routing technique, the substrate 311 and the sensitive chip 20 is connected, and the sensitive chip 20 corresponds to the optical window 321 of the molded base 32.It is understood that the molded base 32 is looped around the surrounding of the photosensitive region of the sensitive chip 20.
Certainly, it can be understood that, the sensitive chip 20 first can also be mounted on the pasting area 3111 of the substrate 311 and the sensitive chip 20 and the substrate 311 is connected, then again be electrically connected the connection edge side 31121 of the mould group connecting side 3121 of the connecting plate 312 and the substrate 311.
With continued reference to attached drawing 12, for the mould group connecting side 3121 of the connecting plate 312 after being connected to the connection edge side 31121 of the substrate 311, the mould group connecting side 3121 of the connecting plate 312 can cover at least part of the connection edge side 31121 of the substrate 311.Such as, in this embodiment of the camera module 100 of the invention, with reference to attached drawing 3A and Fig. 3 B, the connection edge side 31121 of the substrate 311 has 311212 on the inside of edge outside 311211 and an edge, wherein the edge inside 311212 is located on the outside of the edge between 311211 and the outer surface 326 of the molded base 32, wherein the mould group connecting side 3121 of the connecting plate 312 is electrically connected to 311211 on the outside of the edge of the substrate 311, i.e., there is safe distance between the connecting plate 312 and the outer surface 326 of the molded base 32.
With reference to attached drawing 12, if 311211 width dimensions are L1 on the outside of the edge of the substrate 311, 311212 width dimensions are L2 on the inside of the edge of the substrate 311, the value range that wherein 311211 width dimensions are L1 on the outside of the edge of the substrate 311 is 0.01mm~5mm (including 0.01mm and 5mm), preferably 0.1mm~2mm (including 0.1mm and 2mm), the value range that wherein 311212 width dimensions are L2 on the inside of the edge of the substrate 311 is 0.01mm~5mm (including 0.01mm and 5mm), preferably 0.05mm~2mm (including 0.05mm and 2mm).
It can be understood that, can also first will the connection edge side 31121 of the mould group connecting side 3121 of the connecting plate 312 and the substrate 311 electrical connection after, molding process is carried out by the molding die 400 again, in this way, in attached drawing 7 into Fig. 9, the molding die 400 can apply pressure to the link position of the substrate 311 and the connecting plate 312, effectively to reinforce the validity connected between the substrate 311 and the connecting plate 312.
In addition, the present invention is by way of carrying out molding process to it after the substrate 311 arrangement is formed the typesetting unit 300, it is able to carry out mass molding, or arrangement forms after the typesetting unit 300 mode that molding process is carried out to it after the connecting plate 312 and the substrate 311 are electrically connected, and can be improved alignment efficiency and higher molding efficiencies.
It can be understood that, subsequent, the filter element 40 can be mounted on to the molded base 32 and the optical lens 10 is made to pass through the photosensitive path that the driver 60 or described lens barrel etc. are maintained at the sensitive chip 20, the camera module 100 is made.
Attached drawing 13 shows a variant embodiment of the camera module 100, wherein the molded base 32 embeds the link position of the substrate 311 and the connecting plate 312 after shaping, such as after first the connecting plate 312 and the substrate 311 can be electrically connected, molding process is carried out again, so that the molded base 32 embeds the link position of the substrate 311 and the connecting plate 312 after shaping, in this way, on the one hand, it can guarantee the reliability of the link position of the substrate 311 and the connecting plate 312, on the other hand, additional component can not needed to fix the link position of the substrate 311 and the connecting plate 312, to save space and reduce process, another further aspect, the molded base 32 can further embed described At least part of connecting plate 312, to reach positioning, limit, fixation, the needs for blocking isostructuralism.It is similar to above embodiment, the value range of the width dimensions L1 of the outer ledge 311211 of the substrate 311 is 0.01mm~5mm (including 0.01mm and 5mm), preferably 0.1mm~2mm (including 0.1mm and 2mm), width dimensions of the medial surface of the molded base 32 apart from the outer ledge 311211 are 0.01mm~8mm (including 0.01mm and 8mm), preferably 0.05mm~3mm (including 0.05mm and 3mm).
Attached drawing 14 shows a variant embodiment of the camera module 100, wherein the molded base 32 further embeds at least part in the non-photo-sensing region of the sensitive chip 20, so that the sensitive chip 20, the substrate 311 and the molded base 32 integrally combine, and the lead 33 can also be embedded in the inside of the molded base 32, to guarantee the good electrical property of the lead 33 by the molded base 32.Such as, the sensitive chip 20 can be first mounted on to the pasting area 3111 of the substrate 311, then molding process is carried out to it again, in such manner, it is possible to which molding is made to obtain at least part that the molded base 32 embeds the non-photo-sensing region of the sensitive chip 20.With reference to attached drawing 14, at least one size in length dimension and width dimensions that the camera module 100 can be further decreased in such a way that the molded base 32 embeds a part in the non-photo-sensing region of the sensitive chip 20, is applied to pursue lightening electronic equipment to be conducive to the camera module 100.
Attached drawing 15 shows another variant embodiment of the camera module 100, wherein the camera module 100 further comprises the supporting member 70 of an at least frame shape, wherein the supporting member 70 can be arranged at the fringe region 3112 of the substrate 311, or the supporting member 70 can be formed in the fringe region 3112 of the substrate 311, wherein the molded base 32 at least embeds the outer side edges 71 of the supporting member 70 after shaping, so that the sensitive chip 20, the substrate 311, the supporting member 70 and the molded base 32 integrally combine, wherein the molded base 32 can embed at least part of the lead 33, or the supporting member 70 embeds at least part of the lead 33, it is described Molded base 32 and the supporting member 70 embed at least part of the lead 33 respectively.In other examples, the molded base 32 can also further embed at least part of the top surface 72 of the supporting member 70.
The supporting member 70 can by but be not limited to glue and formed after hardening, either metal plating or change plating are formed, or solvent cures are lost after solution coating and are formed, so that the supporting member 70 protrudes from described positive the 3113 of the substrate 311, to in a molding process, the supporting member 70 can stop the moulding material 500 to enter the pasting area 3111 of the substrate 311, to guarantee the flatness of the pasting area 3111.In addition, the supporting member 70 also can have elasticity, to when the molding die 400 is molded, the impact force for resulting from the upper mold 401 and the lower mold 402 can be absorbed by the supporting member 70 and avoid acting on the substrate 311, in addition, the supporting member 70 can also prevent to generate gap between the top surface 72 of the supporting member 70 and the forming surface 4014 of the upper mold 401 by way of deformation.Also, the supporting member 70 can support the forming surface 4014 of the upper mold 401, to prevent the upper mold 401 from applying pressure to the lead 33, to guarantee the good electrical property of the lead 33.
Attached drawing 16 shows another variant embodiment of the camera module 100, wherein the supporting member 70 can also be arranged on the non-photo-sensing region of the sensitive chip 20, or the supporting member 70 can also be formed in the non-photo-sensing region of the sensitive chip 20, to which in molding process, the molded base 32, the substrate 311, the sensitive chip 20 and the supporting member 70 can be combined integrally.
It is worth mentioning that, the supporting member 70 is set to the non-photo-sensing region of the sensitive chip 20 simultaneously and described positive 3113 or the supporting member 70 of the substrate 311 are formed simultaneously and are equally possible in the non-photo-sensing region of the sensitive chip 20 and described positive the 3113 of the substrate 311.
It is attached that Figure 17 shows another variant embodiments of the camera module 100, wherein the filter element 40 can be after being overlapped in the sensitive chip 20, molding process is carried out again, so that the molded base 32 further embeds the edge of the filter element 40, that is, the molded base 32, the substrate 311, the sensitive chip 20 and the filter element 40 can be combined integrally.
Attached drawing 18 shows another variant embodiment of the camera module 100, wherein after the filter element 40 is overlapped in the sensitive chip 20, the supporting member 70 is set at the edge of the filter element 40 or forms the supporting member 70, to in molding process, the molded base 32 can embed at least part of the supporting member 70, so that the molded base 32, the substrate 311, the sensitive chip 20, the filter element 40 and the supporting member 70 can be combined integrally.
Attached drawing 19 shows another variant embodiment of the camera module 100, wherein the substrate 311 has an at least accommodation space 3116, the accommodation space 3116 may be implemented as groove, for accommodating the sensitive chip 20, in this way, it can reduce the height dimension of the camera module 100.In other words, for the camera module 100 shown in attached drawing 3A, the camera module 100 shown in Figure 19 is chip sunk type camera module.
Attached drawing 20 shows another variant embodiment of the camera module 100, wherein the molded base 32 can further embed the non-photo-sensing region of the sensitive chip 20.
Attached drawing 21 shows another variant embodiment of the camera module 100, wherein the accommodation space 3116 may be implemented as through-hole, wherein the sensitive chip 20 is maintained in the accommodation space 3116, and the sensitive chip 20 and the substrate 311 are switched on, in this way, the height dimension of the camera module 100 can be further decreased.
Attached drawing 22 shows another variant embodiment of the camera module 100, wherein the molded base 32 can further embed the non-photo-sensing region of the sensitive chip 20.
Attached drawing 23 shows another variant embodiment of the camera module 100, wherein the circuit board assemblies 30 further comprise an at least reinforcement part 35, wherein the reinforcement part 35 is integrally in conjunction with the back side 3114 with the substrate 311, by the intensity of substrate 311 described in 35 reinforcement of reinforcement part, in this way, the substrate 311 can select thinner plate, to reduce the height dimension of the camera module 100.The reinforcement part 35 and the molded base 32 can be separately formed the back side 3114 and described positive 3113 in the substrate 311 by the same process, it can also be first in positive 3113 molding molded base 32 of the substrate 311, then the reinforcement part 35 is moulded at the back side 3114 of the substrate 311 again, can also the reinforcement part 35, then positive 3113 molding molded base 32 in the substrate 311 first be moulded at the back side 3114 of the substrate 311.
Attached drawing 24 shows another variant embodiment of the camera module 100, wherein the substrate 311 has the accommodation space 3116 for being implemented as through-hole, the sensitive chip 20 is mounted on the reinforcement part 35, and it is located in the accommodation space 3116, wherein the sensitive chip 20 is switched on by the lead 33 and the substrate 311, in this way, the flatness of the sensitive chip 20 is not only restricted to the flatness of the substrate 311, so that the substrate 311 can select thinner plate, to further decrease the height dimension of the camera module.
Attached drawing 25 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 further has a holding tank 351, wherein the holding tank 351 of the reinforcement part 35 corresponds to the accommodation space 3116 of the substrate 311, wherein the sensitive chip 20 is housed inside the holding tank 315 of the reinforcement part 35, and the sensitive chip 20 corresponds to the accommodation space 3116 of the substrate 311, in this way, the flatness of the sensitive chip 20 can be made to be not limited by the flatness of the substrate 311, and further decrease the height dimension of the camera module 100.
Attached drawing 26 shows another variant embodiment of the camera module 100, wherein the substrate 311 has at least one to keep space 3117, wherein the holding space 3117 is implemented as groove, wherein a part of the molded base 32 takes shape in the holding space 3117 of the substrate 311.
Attached drawing 27 shows another variant embodiment of the camera module 100, wherein the holding space 3117 of the substrate 311 is implemented as through-hole, wherein a part of the molded base 32 takes shape in the holding space 3117 of the substrate 311.It is understood that at least one described holding space 3117 may be implemented as through-hole, and the holding space 3117 in addition may be implemented as groove in other examples.
Attached drawing 28A shows another variant embodiment of the camera module 100, wherein at least one described holding space 3117 of the substrate 311 is implemented as through-hole, wherein in a molding process, it is respectively formed after so that the moulding material 500 is passed through the holding space 3117 in described positive the 3113 of the substrate 311 and the back side 3114 and is integrally incorporated into the molded base 32 and the reinforcement part 35 of the substrate 311.
Attached drawing 28B shows another variant embodiment of the camera module 100, wherein the sensitive chip 20 can also be mounted on the substrate 311 by reverse installation process, and the photosensitive region of the sensitive chip 20 corresponds to the optical window 321 of the molded base 32 by the accommodation space 3116 for being implemented as through-hole of the substrate 311.
It is worth mentioning that, the camera module 100 is implemented as array camera module in following description, and by taking the array camera module is further embodied as twin-lens camera module as an example, to illustrate the feature and advantage of the camera module 100 of the invention, it can be understood that, the array camera module also can have more described optical lens 10, therefore, the camera module 100 of twin-lens camera module and it is not construed as the limitation of the content and range to the camera module 100 of the invention.
Attached drawing 29 shows another variant embodiment of the camera module 100, wherein the camera module 100 includes two optical lens 10, two sensitive chips 20 and the circuit board assemblies 30, wherein the circuit board assemblies 30 include a circuit board 31, at least one described molded base 32 and at least two groups lead 33, wherein the circuit board 31 includes at least one substrate 311 and at least one described connecting plate 312, the mould group connecting side 3121 of the connecting plate 312 is electrically connected to the connection edge side 31121 of the substrate 311, there are two the pasting areas 3111 for the tool of substrate 311, wherein it is described to be mounted on each of described substrate 311 respectively for each sensitive chip 20 Pasting area 3111, and each sensitive chip 20 and the substrate 311 are connected by the lead 33, wherein there are two the optical windows 321 for the tool of molded base 32, so that each sensitive chip 20 corresponds respectively to each optical window 321, wherein each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20.
In addition, the camera module 100 can also include two drivers 60, wherein each optical lens 10 is driveably set to each driver 60 respectively, each driver 60 is mounted on the molded base 32 respectively, so that each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20.
Further, the camera module 100 can further include an at least filter element 40, wherein each filter element 40 is respectively held between each optical lens 10 and each sensitive chip 20.For example, each filter element 40 can be mounted on the molded base 32 respectively, so that each filter element 40 is respectively held between each optical lens 10 and each sensitive chip 20.
It is worth mentioning that, the camera module 100 shown in attached drawing 29 is merely illustrative, when the camera module 100 is implemented as comprising more described optical lens 10, the quantity of the quantity of the sensitive chip 20, the quantity of the filter element 40 and the driver 60 can be consistent with the quantity of the optical lens 10.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.Preferably, the molded base 32 embeds the non-photo-sensing region of each sensitive chip 20.
Attached drawing 30 shows another variant embodiment of the camera module 100, wherein the circuit board 31 of the circuit board assemblies 30 may include two substrates 311 and two connecting plates 312, wherein each connecting plate 312 is electrically connected in each substrate 311, wherein each substrate 311 is respectively provided with the pasting area 3111, wherein the sensitive chip 20 is mounted on each of each described substrate 311 pasting area 3111 respectively, wherein the molded base 32 is integrally incorporated into each substrate 3111, so that two substrates 3111 and the molded base 32 are combined as a whole.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 31 shows another variant embodiment of the camera module 100, wherein the camera module 100 further comprises an at least lens barrel 80.Specifically, the camera module 100 may include two lens barrels 80 in this illustration, wherein each optical lens 10 is arranged at the lens barrel 80 respectively, each lens barrel 80 is mounted on the molded base 32 respectively, so that each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 32 shows another variant embodiment of the camera module 100, wherein each lens barrel 80 can also integrally extend the molded base 32 respectively, that is, the lens barrel 80 can be integrally formed with the molded base 32.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 33 shows another variant embodiment of the camera module 100, one of them described lens barrel 80 integrally extends the molded base 32, another described lens barrel 80 is mounted on the molded base 32.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 34 shows another variant embodiment of the camera module 100, one of them described optical lens 10 is driveably set to the driver 60, the driver 60 is mounted on the molded base 32, another described optical lens 10 is arranged at the lens barrel 80, wherein the lens barrel 80 is mounted on the molded base 32.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 35 shows another variant embodiment of the camera module 100, one of them described optical lens 10 is driveably set to the driver 60, the driver 60 is mounted on the molded base 32, another described optical lens 10 is arranged at the lens barrel 80, wherein the lens barrel 80 integrally extends the molded base 32.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 36 shows another variant embodiment of the camera module 100, wherein the camera module 100 further comprises an at least support 90, wherein the molded base 32 moulds a part of the substrate 311, so that at least one described sensitive chip 20 corresponds to the optical window 321 of the molded base 32, the support 90 is mounted on another part of the substrate 311, so that the sensitive chip 20 corresponds to the light hole 91 of the support 90, wherein each optical lens 10 is driveably set to each driver 60 respectively, at least one described driver 60 is mounted on the molded base 32, in addition the driver 60 is mounted on the support 90, so that each optical lens 10 is respectively held in each institute State the photosensitive path of sensitive chip 20.It is understood that each optical lens 10 is respectively arranged at each lens barrel 80, or at least one described optical lens 10 is set to the driver 60, it is also possible that the other optical lens 10, which is set to the support 90,.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 37 shows another variant embodiment of the camera module 100, wherein the molded base 32 of the camera module 100 can also further embed the link position of the connecting plate 312 and the substrate 311, to guarantee the circuit board 31 in the reliability of the connecting plate 312 and the link position of the substrate 311.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 38 shows another variant embodiment of the camera module 100, wherein in the fringe region 3112 that the supporting member 70 is set to the substrate 311, or after so that the supporting member 70 is formed in the fringe region 3112 of the substrate 311, molding process is carried out again, so that the molded base 32 embeds at least part of the supporting member 70, so that the substrate 311, the molded base 32 and the supporting member 70 integrally combine.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 39 shows another variant embodiment of the camera module 100, wherein the molded base 32 can further embed the non-photo-sensing region of the sensitive chip 20, so that the substrate 311, the sensitive chip 20, the molded base 32 integrally combine.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 40 shows another variant embodiment of the camera module 100, wherein in the non-photo-sensing region that the supporting member 70 is set to the sensitive chip 20, or after so that the supporting member 70 is formed in the non-photo-sensing region of the sensitive chip 20, molding process is carried out again, so that the molded base 32 embeds at least part of the supporting member 70, so that the substrate 311, the sensitive chip 20, the molded base 32 and the supporting member 70 integrally combine.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 41 shows another variant embodiment of the camera module 100, wherein the back side 3114 of the substrate 311 can also at least partly be molded the reinforcement part 35, with the intensity of substrate 311 described in reinforcement, in such manner, it is possible to be further ensured that the flatness of the sensitive chip 20.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 42 shows another variant embodiment of the camera module 100, wherein the substrate 311 has at least one described accommodation space 3116, wherein each sensitive chip 20 is housed inside each accommodation space 3116 respectively, to reduce the height of the camera module 100.It is understood that the accommodation space 3116 may be implemented as groove, through-hole also may be implemented as.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 43 shows another variant embodiment of the camera module 100, wherein the substrate 311 also can have at least one described accommodation space 3116, to which a sensitive chip 20 can be mounted on the pasting area 3111 of the substrate 311, another described sensitive chip 20 can be housed inside the accommodation space 3116, in such manner, it is possible to make two sensitive chips 20 that there is difference in height.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.It is noted that can make two optical systems formed by the optical lens 10 and the sensitive chip 20 that there is different focal lengths, to improve the imaging effect of the camera module 100 by way of making two sensitive chips 20 that there is difference in height.In other words, in some examples of the camera module 100 of the invention, the photosurface of the photosurface of at least one sensitive chip 20 and other sensitive chips 20 has difference in height.It is noted that the photosurface of the sensitive chip 20 involved in the camera module 100 of the invention is the side towards the optical lens 10 of the sensitive chip 20.
Attached drawing 44 shows another variant embodiment of the camera module 100, the back side 3114 of the substrate 311 is at least partly molded the reinforcement part 35, wherein each sensitive chip 20 is mounted on the reinforcement part 35 respectively, so that the flatness of each sensitive chip 20 is no longer limited by the flatness of the substrate 311, so that the substrate 311 can be selected thinner plate, to further decrease the height dimension of the camera module 100.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 45 shows another variant embodiment of the camera module 100, the back side 3114 of the substrate 311 can also at least partly be molded the reinforcement part 35, one of them described sensitive chip 20 is mounted on the reinforcement part 35, another sensitive chip 20 is mounted on the pasting area 3111 of the substrate 311, so that two sensitive chips 20 have difference in height.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 46 shows another variant embodiment of the camera module 100, wherein the quantity of the filter element 40 may be implemented as one, so that each optical lens 10 can correspond respectively to the different location of the filter element 40.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 47 shows another variant embodiment of the camera module 100, filter element 40 described in wherein at least one can be arranged at least one described bracket 50 respectively, wherein each bracket 50 is mounted on the molded base 32 respectively, so that the filter element 40 for being each arranged at the bracket 50 is respectively held between each optical lens 10 and each sensitive chip 20.Also, the size of the filter element 40 can be reduced, to reduce the manufacturing cost of the camera module 100.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 48A shows another variant embodiment of the camera module 100, wherein the quantity of the filter element 40 and the quantity of the optical lens 10 and the sensitive chip 20 correspond to each other, the bracket 50 may be implemented as one, wherein each filter element 40 is arranged at the different location of the bracket 50 respectively, the bracket 50 is mounted on the molded base 32, so that each filter element 40 is respectively held between each optical lens 10 and each sensitive chip 20.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 48B shows another variant embodiment of camera module 100, sensitive chip 20 described in wherein at least one can be mounted on the substrate 311 by reverse installation process, and the photosensitive region of the sensitive chip 20 can correspond to the optical window 321 of the molded base 32 by the accommodation space 3116 for being implemented as through-hole of the substrate 311.Although in this example of the camera module 100 shown in attached drawing 48B, the substrate 311 is mounted on by reverse installation process with two sensitive chips 20, and in an other example, at least one described sensitive chip 20 can also be mounted on the substrate 311 by reverse installation process, with the pasting area 3111 that at least another described sensitive chip 20 is directly mounted on to the substrate 311, or another described sensitive chip 20 is maintained to the accommodation space 3116 of the substrate 311.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 49A shows another variant embodiment of the camera module 100, wherein the mould group connecting side 3121 of the connecting plate 312 of the circuit board 31 of the circuit board assemblies 30 can also not be electrically connected to described positive the 3113 of the substrate 311, such as in this example of the camera module 100 shown in attached drawing 49A, the mould group connecting side 3121 of the connecting plate 312 can also be electrically connected to the back side 3114 of the substrate 311, in this way, in the mould group connecting side 3121 for being electrically connected the connecting plate 312 and the substrate 311, size and position without the concern for the sensitive chip 20, in order to make.
It is worth mentioning that, for the mould group connecting side 3121 of the connecting plate 312 behind the back side 3114 for being electrically connected to the substrate 311, the mould group connecting side 3121 of the connecting plate 312 can cover at least part at the back side 3114 of the substrate 311.Such as in this example of the camera module 100 shown in attached drawing 49A, the mould group connecting side 3121 of the connecting plate 312 can be electrically connected to the side at the back side 3114 of the substrate 311, and in other examples, the mould group connecting side 3121 of the connecting plate 312 can also cover the entire back side 3114 of the substrate 311, as shown in figure 50.Certainly, in other examples, the mould group two of the connecting plate 312 borrows the link position for surveying 3121 and the substrate 311 can also be in " mouth " font, " C " font, L shape or other any possible shapes, certainly, it is also possible to irregular shape, is selected as needed.
It is worth mentioning that, the back side 3114 of the substrate 311 is also possible to out-of-flatness, such as the back side 3114 can be equipped with a short slot 31141, so that receiving is electrically connected to the mould group connecting side 3121 of the connecting plate 312 at the back side 3114 of the substrate 311, to reduce the height of the camera module 100, with reference to attached drawing 49B.
With further reference to attached drawing 49A, when the electrical connection of the side at the mould group connecting side 3121 of the connecting plate 312 and the back side 3114 of the substrate 311, if the width parameter of the overlapping region at the back side 3114 of the mould group connecting side 3121 and substrate 311 of the connecting plate 312 is L3, wherein the value range of the width parameter L3 of the overlapping region at the back side 3114 of the mould group connecting side 3121 and substrate 311 of the connecting plate 312 is 0.01mm~5mm (including 0.01mm and 5mm), preferably 0.1mm~2mm (including 0.1mm and 2mm).
In addition, the preferably inclined-plane of the inner surface 325 of the molded base 32, in order to 400 draft of the molding die described after moulding the molded base 32 by molding process.Preferably, the range for the angle parameter alpha that the optical axis of the inner surface 325 of the molded base 32 and the sensitive chip 20 is formed is 0 °~60 ° (including 0 ° and 60 °), preferably 5 °~35 ° (including 5 ° and 35 °).
In addition, the driver 60 further has an at least driver pin 61, wherein the driver pin 61 extends to the substrate 311 after capable of passing through the molded base 32 from the driver 60, and the driver pin 61 can be connected to the substrate 311.It is worth mentioning that, the driver pin 61 according to the present invention passes through the molded base 32 and refers to, the top of the driver pin 61 from the molded base 32 extends to lower part, such as the driver pin 61 can be and pass through from the inside of the molded base 32, can also extend along the surface of the molded base 32.
Further, the molded base 32 is equipped with an at least driver pin slot 327, for accommodating the driver pin 61.Wherein the driver pin slot 327 is located at the outer surface 326 of the molded base 32, such as the outer surface 326 of the molded base 32 can form the driver pin slot 327 by way of recess.The outer surface 326 of the molded base 32 forms at least one first cell wall 3271 and at least two second cell walls 3272, second cell wall 3272 described in two of them is located at the two sides of first cell wall 3271, to define the driver pin slot 327 by first cell wall 3271 and each second cell wall 3272.Preferably, the inclined-plane of first cell wall 3271, if the angle parameter that the optical axis direction of the extending direction of first cell wall 3271 and the sensitive chip 20 is formed is θ, wherein parameter θ is acute angle.Preferably, the value range of parameter θ is 3 °~45 ° (including 3 ° and 45 °), preferably 3 °~15 ° (including 3 ° and 15 °).In addition, the outer surface 326 of the molded base 32 can also using Formation cross-section as the driver pin slot 327 of arc, wherein the extending direction of the driver pin slot 327 can be it is inclined.If the angle parameter that the extending direction of the driver pin slot 327 and the optical axis direction of the sensitive chip 20 are formed is θ, wherein parameter θ is acute angle.Preferably, the value range of parameter θ is 3 °~45 ° (including 3 ° and 45 °), preferably 3 °~15 ° (including 3 ° and 15 °).
With reference to Figure of description of the invention attached drawing 51 to Figure 58, the manufacturing process of the circuit board assemblies 30 of the camera module 100 is set forth.
With reference to attached drawing 51 and Figure 52, the substrate 311 that can be spaced two or more is arranged together to form the layout unit 300, in order in subsequent carry out molding process.It can be understood that, due in this embodiment of the camera module 100 of the invention, the position for the mould group connecting side 3121 for reserving the electrical connection connecting plate 312 described positive the 3113 of the substrate 311 can not be needed, each of the layout unit 300 substrate 311 can be close together more compactly, to improve the utilization rate of the layout unit 300.The distance range of the adjacent substrate 311 of the layout unit 300 is 0.01mm~500mm (including 0.01mm and 500mm), preferably 0.05mm~200mm (including 0.05mm and 200mm).Locally molding stability, the minimum dimension range of the layout unit 300 are 1mm~100000mm (including 1mm and 100000mm), preferably 10mm~1000mm (including 10mm and 1000mm) when in order to improve progress molding process.
It is noted that the connecting plate 312 can also be first electrically connected to the back side 3114 of the substrate 311 before molding process, at this point, the molding die 400 needs to be reserved mold pressing width and pattern draft.Then, each electronic component 34 is mounted on to the fringe region 3112 of the substrate 311 respectively.Certainly, it will be appreciated by those skilled in the art that, the back side 3114 that the electronic component 34 is mounted on the substrate 311 is also possible that.
It is understood that the substrate 311 first can also be mounted on each electronic component 34, each arrangement of substrate 311 is then formed into the typesetting unit 300 again.
With reference to attached drawing 53, Figure 54, Figure 55 and Figure 56, the layout unit 300 is placed in the molding die 400 and carries out molding process.
With reference to attached drawing 57, after carrying out molding process on the layout unit 300, it can be separated to each of the layout unit 300 substrate 311 is formed, to obtain the semi-finished product of the circuit board assemblies 30, such as can be separated through but not limited to the techniques such as cutting or etching to each of the layout unit 300 substrate 311 is formed.
It is worth mentioning that, in one example, for the ease of cutting by the layout unit 300 after carry out molding process, as well as abrasion, cutting blade will form a slight tapered cross-section, the separation side of the semi-finished product of the circuit board assemblies 30 obtained after cutting also has a slight gradient, with reference to attached drawing 57, if the angle parameter that the extending direction of the side 3115 of the substrate 311 of the semi-finished product of the circuit board assemblies 30 and the optical axis of the sensitive chip 20 are formed is β, wherein the range of parameter beta is 0 °~10 ° (including 0 ° and 10 °), preferably 0 °~5 ° (including 0 ° and 5 °).In another example, for the ease of etching, as well as the continuity of etching, it the separation side of the semi-finished product of the circuit board assemblies 30 obtained after etching also can a slight gradient, with reference to attached drawing 57, if the angle parameter that the extending direction of the side 3115 of the substrate 311 of the semi-finished product of the circuit board assemblies 30 and the optical axis of the sensitive chip 20 are formed is β, wherein the range of parameter beta is 0 °~10 ° (including 0 ° and 10 °), preferably 0 °~5 ° (including 0 ° and 5 °).Certainly, it can be understood that, the gradient of the side 3115 of the substrate 311 of the semi-finished product of the circuit board assemblies 30 can also be removed in subsequent technique, such as can obtain vertical, smooth, mellow and full side form by polishing grinding or the side 3115 for going the techniques such as flash removed to make the substrate 311.
With reference to attached drawing 58, the mould group connecting side 3121 of the connecting plate 312 is electrically connected to the side at the back side 3114 of the substrate 311, to obtain the circuit board assemblies 30.
With reference to attached drawing 59, the sensitive chip 20 is mounted on to the pasting area 3111 of the substrate 311 by the optical window 321 of the molded base 32, and at least one described lead 33 can be formed between the sensitive chip 20 and the substrate 311 by routing technique, the substrate 311 and the sensitive chip 20 is connected, and the sensitive chip 20 corresponds to the optical window 321 of the molded base 32.
Attached drawing 60 shows another variant embodiment of the camera module 100, wherein the molded base 32 further embeds at least part in the non-photo-sensing region of the sensitive chip 20, so that the sensitive chip 20, the substrate 311 and the molded base 32 integrally combine, and the lead 33 can also be embedded in the inside of the molded base 32, to guarantee the good electrical property of the lead 33 by the molded base 32.Such as, in this example of the camera module 100, the sensitive chip 20 can be first mounted on to the pasting area 3111 of the substrate 31, then molding process is carried out to it again, in such manner, it is possible to which molding is made to obtain at least part that the molded base 32 embeds the non-photo-sensing region of the sensitive chip 20.
Attached drawing 61 shows another variant embodiment of the camera module 100, wherein the camera module 100 further comprises the supporting member 70 of an at least frame shape, wherein the supporting member 70 can be arranged at the fringe region 3112 of the substrate 311, or the supporting member 70 can be formed in the fringe region 3112 of the substrate 311, wherein the molded base 32 at least embeds the outer side edges 71 of the supporting member 70 after shaping, so that the substrate 311, the supporting member 70 and the molded base 32 integrally combine, wherein the molded base 32 can embed at least part of the lead 33, or the supporting member 70 embeds at least part of the lead 33, the molded base 32 and described Supporting member 70 embeds at least part of the lead 33 respectively.In other examples, the molded base 32 can also further embed at least part of the top surface 72 of the supporting member 70.
The supporting member 70 can by but be not limited to glue and formed after hardening, either metal plating or change plating are formed, or solvent cures are lost after solution coating and are formed, so that the supporting member 70 protrudes from described positive the 3113 of the substrate 311, to in a molding process, the supporting member 70 can stop the moulding material 500 to enter the pasting area 3111 of the substrate 311, to guarantee the flatness of the pasting area 3111.In addition, the supporting member 70 also can have elasticity, to when the molding die 400 is molded, the impact force for resulting from the upper mold 401 and the lower mold 402 can be absorbed by the supporting member 70 and avoid acting on the substrate 311, in addition, the supporting member 70 can also prevent to generate gap between the top surface 72 of the supporting member 70 and the forming surface 4014 of the upper mold 401 by way of deformation.Also, the supporting member 70 can support the forming surface 4014 of the upper mold 401, to prevent the upper mold 401 from applying pressure to the lead 33, to guarantee the good electrical property of the lead 33.
Attached drawing 62 shows another variant embodiment of the camera module 100, wherein the supporting member 70 can also be arranged on the non-photo-sensing region of the sensitive chip 20, or the supporting member 70 can also be formed in the non-photo-sensing region of the sensitive chip 20, to which in molding process, the molded base 32, the substrate 311, the sensitive chip 20 and the supporting member 70 can be combined integrally.
Attached drawing 63 shows another variant embodiment of the camera module 100, wherein the substrate 311 has an at least accommodation space 3116, wherein the accommodation space 3116 is used to accommodate the sensitive chip 20, in this way, it can reduce the height dimension of the camera module 100, wherein the sensitive chip 20 is mounted on the connecting plate 312, to make the sensitive chip 20 be maintained in the accommodation space 3116 by the connecting plate 312.Preferably, the accommodation space 3116 may be implemented as through-hole.Nevertheless, it will be appreciated by those skilled in the art that, in other examples of the camera module 100, the accommodation space 3116 also may be implemented as groove.
Attached drawing 64 shows another variant embodiment of the camera module 100, wherein the molded base 32 can further embed at least part in the non-photo-sensing region of the sensitive chip 20.
Attached drawing 65 shows another variant embodiment of the camera module 100, wherein the link position at the back side 3114 of the mould group connecting side 3121 and substrate 311 of the connecting plate 312 can be in " mouth " font, i.e., the mould group connecting side 3121 of the connecting plate 312 has a through-hole 3123, the mould group connecting side 3121 of the connecting plate 312 is after the back side 3114 for being electrically connected to the substrate 311, the through-hole 3123 of the connecting plate 312 corresponds to the accommodation space 3116 of the substrate 311, wherein at least part of the sensitive chip 20 can be housed inside in the through-hole 3123 of the connecting plate 312, in this way, the sensitive chip 20 and the connecting plate 31 It can not be contacted between 2, in this way, the flatness of the sensitive chip 20 be made not will receive the influence of the connecting plate 312, to guarantee the image quality of the camera module 100.
Attached drawing 66 shows another variant embodiment of the camera module 100, wherein a part at the back side 3114 of the substrate 311 be used to connect the mould group connecting side 3121 of the connecting plate 312, another part of the substrate 311 can be integrally in conjunction with the reinforcement part 35, wherein the sensitive chip 20 can be directly mounted on the reinforcement part 35, in this way, the flatness of the sensitive chip 20 can be guaranteed by the reinforcement part 35, further to improve the image quality of the camera module 100.
Attached drawing 67 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 can also form a holding tank 351, wherein the sensitive chip 20 is housed inside the holding tank 351 of the reinforcement part 35, to further decrease the height of the camera module 100.
Attached drawing 68 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 can further embed the link position of the mould group connecting side 3121 of the connecting plate 312 and the back side 3114 of the substrate 311, to guarantee the reliability of the link position, to prevent the mould group connecting side 3121 of the connecting plate 312 from falling off from the back side 3114 of the substrate 311.The back side 3114 of the substrate 311 is equipped with the short slot 31141, for accommodating the mould group connecting side 3121 of the connecting plate 312.
Attached drawing 69 shows another variant embodiment of the camera module 100, wherein the substrate 311 has at least one to keep space 3117, wherein a part of of the molded base 32 can the integrally formed holding space 3117 in the substrate 311, to prevent the molded base 32 and the substrate 311 from falling off, to guarantee the reliability of the camera module 100.Preferably, the holding space 3117 of the substrate 311 may be implemented as through-hole, however, in other examples of the camera module 100, the holding space 3117 of the substrate 311 also may be implemented as blind hole, or a part of holding space 3117 is implemented as through-hole, holding space 3117 described in another part is implemented as blind hole.
Attached drawing 70 shows another variant embodiment of the camera module 100, wherein a part of of the reinforcement part 35 can the integrally formed holding space 3117 in the substrate 311, to prevent the reinforcement part 35 and the substrate 311 from falling off, to guarantee the reliability of the camera module 100.
Attached drawing 71A shows another variant embodiment of the camera module 100, wherein at least one described holding space 3117 of the substrate 311 is implemented as through-hole, wherein in a molding process, it is respectively formed after so that the moulding material 500 is passed through the holding space 3117 in described positive the 3113 of the substrate 311 and the back side 3114 and is integrally incorporated into the molded base 32 and the reinforcement part 35 of the substrate 311.
Attached drawing 71B shows another variant embodiment of the camera module 100, wherein the sensitive chip 20 can also be mounted on the substrate 311 by reverse installation process, and the photosensitive region of the sensitive chip 20 corresponds to the optical window 321 of the molded base 32 by the accommodation space 3116 for being implemented as through-hole of the substrate 311.
It is worth mentioning that, the camera module 100 is implemented as array camera module in following description, and by taking the array camera module is further embodied as twin-lens camera module as an example, to illustrate the feature and advantage of the camera module 100 of the invention, it can be understood that, the array camera module also can have more described optical lens 10, therefore, the camera module 100 of twin-lens camera module and it is not construed as the limitation of the content and range to the camera module 100 of the invention.
Attached drawing 72 shows another variant embodiment of the camera module 100, wherein the camera module 100 includes two optical lens 10, two sensitive chips 20 and the circuit board assemblies 30, wherein the circuit board assemblies 30 include a circuit board 31, lead 33 described in one molded base 32 and at least two groups, wherein the circuit board 31 includes a substrate 311 and a connecting plate 312, the mould group connecting side 3121 of the connecting plate 312 is electrically connected to the back side 3114 of the substrate 311, there are two the pasting areas 3111 for the tool of substrate 311, wherein each sensitive chip 20 is mounted on each of described substrate 311 pasting area 3111 respectively, And each sensitive chip 20 and the substrate 311 are connected by the lead 33, wherein there are two the optical windows 321 for the tool of molded base 32, so that each sensitive chip 20 corresponds respectively to each optical window 321, wherein each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20.
In addition, the camera module 100 can also include two drivers 60, wherein each optical lens 10 is driveably set to each driver 60 respectively, each driver 60 is mounted on the molded base 32 respectively, so that each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20.
Further, the camera module 100 can further include at least two filter elements 40, wherein each filter element 40 is respectively held between each optical lens 10 and each sensitive chip 20.For example, each filter element 40 can be mounted on the molded base 32 respectively, so that each filter element 40 is respectively held between each optical lens 10 and each sensitive chip 20.
It is worth mentioning that, the camera module 100 shown in attached drawing 72 is merely illustrative, when the camera module 100 is implemented as comprising more described optical lens 10, the quantity of the quantity of the sensitive chip 20, the quantity of the filter element 40 and the driver 60 can be consistent with the quantity of the optical lens 10.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 73 shows another variant embodiment of the camera module 100, wherein the circuit board 31 of the circuit board assemblies 30 also may include two substrates 311 and two connecting plates 312, wherein each connecting plate 312 is connected to each substrate 311 by Electricity Federation respectively, wherein each substrate 311 is respectively provided with the pasting area 3111, wherein the sensitive chip 20 is mounted on each of each described substrate 311 pasting area 3111 respectively, wherein the molded base 32 is integrally incorporated into each substrate 3111, so that two substrates 3111 and the molded base 32 are combined as a whole.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 74 shows another variant embodiment of the camera module 100, wherein the camera module 100 further comprises an at least lens barrel 80.Specifically, the camera module 100 may include two lens barrels 80 in this illustration, wherein each optical lens 10 is arranged at the lens barrel 80 respectively, each lens barrel 80 is mounted on the molded base 32 respectively, so that each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 75 shows another variant embodiment of the camera module 100, wherein each lens barrel 80 can also integrally extend the molded base 32 respectively, that is, the lens barrel 80 can be integrally formed with the molded base 32.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 76 shows another variant embodiment of the camera module 100, one of them described lens barrel 80 integrally extends the molded base 32, another described lens barrel 80 is mounted on the molded base 32.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 77 shows another variant embodiment of the camera module 100, one of them described optical lens 10 is driveably set to the driver 60, the driver 60 is mounted on the molded base 32, another described optical lens 10 is arranged at the lens barrel 80, wherein the lens barrel 80 is mounted on the molded base 32.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 78 shows another variant embodiment of the camera module 100, one of them described optical lens 10 is driveably set to the driver 60, the driver 60 is mounted on the molded base 32, another described optical lens 10 is arranged at the lens barrel 80, wherein the lens barrel 80 integrally extends the molded base 32.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 79 shows another variant embodiment of the camera module 100, wherein the camera module 100 further comprises a support 90, wherein the molded base 32 moulds a part of the substrate 311, so that a sensitive chip 20 corresponds to the optical window 321 of the molded base 32, the support 90 is mounted on another part of the substrate 311, so that the sensitive chip 20 corresponds to the light hole 91 of the support 90, wherein each optical lens 10 is driveably set to each driver 60 respectively, one driver 60 is mounted on the molded base 32, another described driver 60 is mounted on the support 90, so that each optical lens 10 is respectively held in each sensitive chip 2 0 photosensitive path.It is understood that each optical lens 10 is respectively arranged at each lens barrel 80, or an optical lens 10 is set to the driver 60, it is also possible that another described optical lens 10, which is set to the support 90,.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 80 shows another variant embodiment of the camera module 100, wherein the molded base 32 can also further embed at least part in the non-photo-sensing region of the sensitive chip 20, so that the molded base 32, the sensitive chip 20 and the substrate 311 integrally combine.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 81 shows another variant embodiment of the camera module 100, wherein after the supporting member 70 is set to the substrate 311 or the supporting member 70 is made to take shape in the substrate 311, molding process is carried out again, so that the molded base 32 embeds at least part of the supporting member 70, so that the molded base 32, the substrate 311 and the supporting member 70 integrally combine.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 82 shows another variant embodiment of the camera module 100, wherein after the supporting member 70 to be set to the non-photo-sensing region of the sensitive chip 20 or the supporting member 70 is made to take shape in the non-photo-sensing region of the sensitive chip 20, molding process is carried out again, so that the molded base 32 embeds at least part of the supporting member 70, so that the molded base 32, the sensitive chip 20, the substrate 311 and the supporting member 70 integrally combine.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 83 shows another variant embodiment of the camera module 100, wherein the substrate 311 has at least one described accommodation space 3116, such as in this particular example, the camera module 100 may include two accommodation spaces 3116, for accommodating each sensitive chip 20, in such manner, it is possible to reduce the height dimension of the camera module 100.Preferably, the accommodation space 3116 may be implemented as through-hole, and certainly, in other examples, the accommodation space 3116 also may be implemented as blind hole.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 84 shows another variant embodiment of the camera module 100, wherein the quantity of the accommodation space 3116 of the substrate 311 is less than the quantity of the sensitive chip 20, such as the substrate 311 can have the accommodation space 3116, one of them sensitive chip 20 is mounted on the pasting area 3111 of the substrate 311, another described sensitive chip 20 is maintained at the accommodation space 3116, in such manner, it is possible to make two sensitive chips 20 that there is difference in height.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 85 shows another variant embodiment of the camera module 100, wherein the mould group connecting side 3121 of the connecting plate 312 is mounted on the side at the back side 3114 of the substrate 311, the other side at the back side 3114 of the substrate 311 can also be moulded at least one described reinforcement part 35 by molding process, wherein each sensitive chip 20 is mounted on the reinforcement part 35 respectively, so that each sensitive chip 20 can get along well, the substrate 311 is contacted, so that the substrate 311 can select thinner plate, to reduce the height dimension of the camera module 100, and guarantee the flatness of the sensitive chip 20.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 86 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 can further embed the link position of the mould group connecting side 3121 of the connecting plate 312 and the back side 3114 of the substrate 311, to guarantee the reliability of the link position.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 87 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 can also further provide for an at least holding tank 351, such as in this embodiment, the quantity of the holding tank 351 of the reinforcement part 35 is consistent with the quantity of each sensitive chip 20, so that each sensitive chip 20 is housed inside each of described reinforcement part 35 holding tank 351 respectively, however, in other examples, the quantity of the holding tank 351 can also be less than the quantity of the sensitive chip 20, so that each sensitive chip 20 has difference in height.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 88 shows another variant embodiment of the camera module 100, wherein the substrate 311 has at least one described holding space 3117, wherein a part of of the molded base 32 can be integrally formed in each of the substrate 311 holding space 3117.It is understood that the holding space 3117 may be implemented as through-hole, blind hole also may be implemented as.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 89 shows another variant embodiment of the camera module 100, wherein at least one described holding space 3117 of the substrate 311 may be implemented as through-hole, to in a molding process, the moulding material 500 can be respectively formed in described positive the 3113 of the substrate 311 and the back side 3114 after passing through the holding space 3117 and integrally be incorporated into the molded base 32 and the reinforcement part 35 of the substrate 311.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 90 shows another variant embodiment of the camera module 100, wherein the quantity of the filter element 40 may be implemented as one, so that each optical lens 10 is corresponded to the different location of the filter element 40 respectively.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 91 shows another variant embodiment of the camera module 100, wherein each filter element 40 can be arranged at each bracket 50 respectively, wherein each bracket 50 is mounted on the molded base 32 respectively, so that each filter element 40 is respectively held between each optical lens 10 and each sensitive chip 20.Also, the size of the filter element 40 can be reduced, to reduce the manufacturing cost of the camera module 100.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 92 shows another variant embodiment of the camera module 100, wherein the quantity of the filter element 40 and the quantity of the optical lens 10 and the sensitive chip 20 correspond to each other, the bracket 50 may be implemented as one, wherein each filter element 40 is arranged at the different location of the bracket 50 respectively, the bracket 50 is mounted on the molded base 32, so that each filter element 40 is respectively held between each optical lens 10 and each sensitive chip 20.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 93 shows another variant embodiment of camera module 100, sensitive chip 20 described in wherein at least one can be mounted on the substrate 311 by reverse installation process, and the photosensitive region of the sensitive chip 20 can correspond to the optical window 321 of the molded base 32 by the accommodation space 3116 for being implemented as through-hole of the substrate 311.Although in this example of the camera module 100 shown in attached drawing 93, the substrate 311 is mounted on by reverse installation process with two sensitive chips 20, and in an other example, one sensitive chip 20 can also be mounted on the substrate 311 by reverse installation process, with the pasting area 3111 that another described sensitive chip 20 is directly mounted on to the substrate 311, or another described sensitive chip 20 is maintained to the accommodation space 3116 of the substrate 311.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 94 shows another variant embodiment of the camera module 100, wherein the mould group connecting side 3121 of the connecting plate 312 can also be connected to the side 3115 of the substrate 311, that is, the extending direction of the connecting plate 312 and the extending direction of the substrate 311 can be inconsistent, such as the extending direction of the connecting plate 312 and the extending direction of the substrate 311 can be mutually perpendicular to, in this way, when the camera module 100 is installed on the electronic equipment ontology 200, can be avoided the connecting plate 312 by curved radian it is excessive and the phenomenon that be broken.
In other words, the camera module 100 of the invention keeps the connecting plate 312 different with the extending direction of the substrate 311, it needs so as to reserve the connecting plate 312 by curved angle, when the camera module 100 is installed on the electronic equipment ontology 200, the connecting plate 312 can be made to deform as small as possible, to guarantee the reliability of the camera module 100.Preferably, it can produce one 90 ° between the connecting plate 312 and the substrate 311 or close to 90 ° of angle, to further reduce the volume of the camera module 100, so as to reduce the camera module 100 occupied space in the electronic equipment ontology 200.
Further, the side 3115 that be used to connect the connecting plate 312 of the substrate 311 forms an interconnecting piece 31150, wherein set the interconnecting piece 31150 with a thickness of parameter H, wherein the value range of the thickness parameter H of the interconnecting piece 31150 is 0.01mm~10mm (including 0.01mm and 10mm), preferably 0.1mm~5mm (including 0.1mm and 5mm), in such manner, it is possible to guarantee the reliability of the link position of the connecting plate 312 and the substrate 311.It can be understood that, the thickness of the interconnecting piece 31150 of the substrate 311 can be different from the thickness of the other positions of the substrate 311, such as the thickness of the interconnecting piece 31150 of the substrate 311 can be greater than the substrate 311 other positions thickness, can also the substrate 311 the interconnecting piece 31150 thickness and the substrate 311 other positions consistency of thickness.In addition, at least one described side 3115 of the substrate 311 forms the interconnecting piece 31150.
It is noted that first can carry out molding process in one embodiment of the camera module 100 of the invention to the substrate 311, then the connecting plate 312 is connected to the interconnecting piece 31150 of the substrate 311 by the conducting medium again.In another embodiment of the camera module 100 of the invention, the connecting plate 312 can also be first connected to the interconnecting piece 31150 of the substrate 311 by the conducting medium, then molding process is carried out again, in this way, the molded base 32 for being integrally incorporated into the substrate 311 can be made to be embedded in the conducting medium overflowed when connecting the substrate 311 and the connecting plate 312 using the conducting medium, the other component of the camera module 100 is polluted to avoid the subsequent conducting medium, and can guarantee aesthetics.
It is worth mentioning that, the connecting plate 312 is formerly connected to the interconnecting piece 31150 of the substrate 311 by the conducting medium, when then carrying out molding process again, the connecting plate 312 can be placed in the groove of the molding die 400 held successfully in advance, to not influence flatness and stability that 311 part of substrate is put, to guarantee that the mass of molding process carries out.
In addition, the substrate 311 has the accommodation space 3116, for accommodating the sensitive chip 20, in such manner, it is possible to reduce the height of the camera module 100.It is noted that the accommodation space 3116 may be implemented as through-hole, groove also may be implemented as.
Attached drawing 95 shows another variant embodiment of the camera module 100, wherein the molded base 32 can further embed the non-photo-sensing region of the sensitive chip 20, so that the substrate 311, the molded base 32 and the sensitive chip 20 integrally combine.
Attached drawing 96 shows another variant embodiment of the camera module 100, wherein the substrate 311 can also be equipped with the supporting member 70 or form the supporting member 70, the molded base 32 can embed at least part of the supporting member 70, so that the substrate 311, the supporting member 70 and the molded base 32 integrally combine.
Attached drawing 97 shows another variant embodiment of the camera module 100, wherein the non-photo-sensing region of the sensitive chip 20 can also be equipped with the supporting member 70 or form the supporting member 70, the molded base 32 can embed at least part of the supporting member 70, so that the substrate 311, the supporting member 70, the molded base 32 and the sensitive chip 20 integrally combine.
Attached drawing 98 shows another variant embodiment of the camera module 100, wherein the sensitive chip 20 can be mounted on the substrate 311 by reverse installation process, so that the photosensitive region of the sensitive chip 20 corresponds to the optical window 321 of the molded base 32 by the accommodation space 3116 of the substrate 311.
Attached drawing 99 shows another variant embodiment of the camera module 100, wherein the back side 3114 of the substrate 311 can also be integrally in conjunction with the reinforcement part 35, by the intensity of substrate 311 described in 35 reinforcement of reinforcement part.In addition, the sensitive chip 20 can be directly mounted on the reinforcement part 35, in this way, the flatness of the sensitive chip 20 can be guaranteed by the reinforcement part 35, to improve the image quality of the camera module 100.
Attached drawing 100 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 can also be equipped with the holding tank 351, for accommodating the sensitive chip 20, in such manner, it is possible to further by the height of camera module 100 described in ground.
Attached drawing 101 shows another variant embodiment of the camera module 100, the substrate 311 can be equipped at least one described holding space 3117, holding space 3117 described in wherein at least one may be implemented as through-hole, in this way, in a molding process, the moulding material 500 can integrally be incorporated into the molded base 32 and the reinforcement part 35 of the substrate 311 after being implemented as the holding space 3117 of through-hole in described positive the 3113 of the substrate 311 and the formation of the back side 3114 respectively.
It is worth mentioning that, the camera module 100 is implemented as array camera module in following description, and by taking the array camera module is further embodied as twin-lens camera module as an example, to illustrate the feature and advantage of the camera module 100 of the invention, it can be understood that, the array camera module also can have more described optical lens 10, therefore, the camera module 100 of twin-lens camera module and it is not construed as the limitation of the content and range to the camera module 100 of the invention.
Attached drawing 102 shows another variant embodiment of the camera module 100, wherein the camera module 100 includes two optical lens 10, two sensitive chips 20 and the circuit board assemblies 30, wherein the circuit board assemblies 30 include a circuit board 31, lead 33 described in one molded base 32 and at least two groups, wherein the circuit board 31 includes a substrate 311 and a connecting plate 312, the mould group connecting side 3121 of the connecting plate 312 is electrically connected to the interconnecting piece 31150 of the substrate 311, there are two the accommodation spaces 3116 for the tool of substrate 311, for accommodating each sensitive chip 20 respectively, and each photosensitive core is connected by the lead 33 Piece 20 and the substrate 311, wherein there are two the optical windows 321 for the tool of molded base 32, so that each sensitive chip 20 corresponds respectively to each optical window 321, wherein each optical lens 10 is respectively held in the photosensitive path of each sensitive chip 20.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 103 shows another variant embodiment of the camera module 100, wherein the molded base 32 can further embed at least part in the non-photo-sensing region of the sensitive chip 20, so that the substrate 311, the molded base 32 and each sensitive chip 20 integrally combine.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 104 shows another variant embodiment of the camera module 100, wherein the substrate 311 can also be equipped with the supporting member 70 or form the supporting member 70, the molded base 32 can embed at least part of the supporting member 70, so that the substrate 311, the supporting member 70 and the molded base 32 integrally combine.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 105 shows another variant embodiment of the camera module 100, wherein the non-photo-sensing region of the sensitive chip 20 can also be equipped with the supporting member 70 or form the supporting member 70, the molded base 32 can embed at least part of the supporting member 70, so that the substrate 311, the supporting member 70, the molded base 32 and each sensitive chip 20 integrally combine.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 106 shows another variant embodiment of the camera module 100, wherein each sensitive chip 20 can be mounted on the substrate 311 by reverse installation process, so that the photosensitive region of the sensitive chip 20 corresponds to the optical window 321 of the molded base 32 by the accommodation space 3116 of the substrate 311.Certainly, in other examples of the camera module 100, a sensitive chip 20 can also be mounted on the substrate 311 by reverse installation process, and the accommodation space 3116 for making another described sensitive chip 20 be maintained at the substrate 311.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 107 shows another variant embodiment of the camera module 100, wherein the back side 3114 of the substrate 311 can also be at least partly integrally in conjunction with the reinforcement part 35, by the intensity of substrate 311 described in 35 reinforcement of reinforcement part.In addition, each sensitive chip 20 can be directly mounted on the reinforcement part 35 respectively, in this way, the flatness of each sensitive chip 20 can be guaranteed by the reinforcement part 35, to improve the image quality of the camera module 100.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 108 shows another variant embodiment of the camera module 100, wherein the reinforcement part 35 can also be equipped with the holding tank 351, for accommodating each sensitive chip 20, in such manner, it is possible to further by the height of camera module 100 described in ground.For example, in this illustration, the quantity of the holding tank 351 of the reinforcement part 35 is consistent with the quantity of the sensitive chip 20, so that each sensitive chip 20 can be housed inside the holding tank 351 of the reinforcement part 35.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 109 shows another variant embodiment of the camera module 100, wherein the quantity of the holding tank 351 of the reinforcement part 35 can be less than the quantity of the sensitive chip 20, to which a sensitive chip 20 is housed inside the holding tank of the reinforcement part 35, another described sensitive chip 20 is mounted on the reinforcement part 35, in this way, two sensitive chips 20 is made to can have difference in height.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
Attached drawing 110 shows another variant embodiment of the camera module 100, the substrate 311 can be equipped at least one described holding space 3117, holding space 3117 described in wherein at least one may be implemented as through-hole, in this way, in a molding process, the moulding material 500 can integrally be incorporated into the molded base 32 and the reinforcement part 35 of the substrate 311 after being implemented as the holding space 3117 of through-hole in described positive the 3113 of the substrate 311 and the formation of the back side 3114 respectively.In addition, the molded base 32 can also further embed the non-photo-sensing region of at least one sensitive chip 20.
It will be understood by those skilled in the art that foregoing description and the embodiment of the present invention shown in the drawings are only used as illustrating and being not intended to limit the present invention.
The purpose of the present invention has been fully and effectively achieved.Function and structural principle of the invention has been shown in embodiment and explanation, and under without departing from the principle, embodiments of the present invention can have any deformation or modification.

Claims (65)

  1. One molded case circuit board group part characterized by comprising
    One molded base, wherein the molded base has an at least optical window；With
    An at least circuit board, wherein the circuit board includes at least connecting plate that at least substrate of a hard is connected to switched on the substrate, and the substrate connects an at least sensitive chip switched only, wherein the molded base is integrally incorporated into the substrate, and the molded base is looped around the surrounding of the photosensitive region of the sensitive chip, so that the photosensitive region of the sensitive chip corresponds to the optical window of the molded base.
  2. Molded case circuit board group part according to claim 1, wherein the connecting plate have a mould group connecting side, wherein the connecting plate by the mould group connecting side of the connecting plate be mounted on the substrate it is positive in a manner of be connected to the substrate switched only.
  3. Molded case circuit board group part according to claim 1, wherein the connecting plate has a mould group connecting side, wherein the connecting plate is connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the back side of the substrate switched only.
  4. Molded case circuit board group part according to claim 1, wherein the connecting plate has a mould group connecting side, wherein the connecting plate is connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the side of the substrate switched only.
  5. Molded case circuit board group part according to claim 2, wherein the substrate has on the outside of an edge and on the inside of an edge, set the dimensional parameters on the outside of the edge of the substrate wherein as L1, dimensional parameters on the inside of the edge of the substrate are L2, wherein the value range of the dimensional parameters L1 on the outside of the edge of the substrate is: 0.01mm≤L1≤5mm, wherein the value range of the dimensional parameters L2 on the inside of the edge of the substrate is: 0.01mm≤L2≤5mm.
  6. Molded case circuit board group part according to claim 3, wherein setting the width dimensions parameter of the mould group connecting side of the connecting plate and the overlapping region of the substrate as L3, wherein the value range of parameter L3 is: 0.01mm≤L3≤5mm.
  7. Molded case circuit board group part according to claim 3, wherein the substrate has an at least short slot, wherein the mould group connecting side of the connecting plate is maintained at the short slot of the substrate.
  8. Mould-group circuit-board component according to claim 4, wherein the side of the substrate forms an interconnecting piece, wherein the mould group connecting side of the connecting plate is mounted on the interconnecting piece of the substrate.
  9. According to the molded case circuit board group part any in claim 2 to 8, wherein the molded base embeds the mould group connecting side of the connecting plate.
  10. It further comprise a reinforcement part, wherein the reinforcement part is integrally incorporated into the back side of the substrate according to claim 1 to any molded case circuit board group part in 8.
  11. Molded case circuit board group part according to claim 10, wherein the reinforcement part embeds the mould group connecting side of the connecting plate.
  12. According to claim 1 to any molded case circuit board group part in 8, wherein the substrate has an at least accommodation space, wherein the sensitive chip is maintained at the accommodation space of the substrate.
  13. Molded case circuit board group part according to claim 9, wherein the substrate has an at least accommodation space, wherein the sensitive chip is maintained at the accommodation space of the substrate.
  14. Molded case circuit board group part according to claim 10, wherein the substrate has an at least accommodation space, wherein the sensitive chip is maintained at the accommodation space of the substrate.
  15. It further comprise an at least electronic component, wherein the electronic component is connected to the substrate switched only according to claim 1 to any molded case circuit board group part in 8.
  16. Molded case circuit board group part according to claim 15, electronic component described in wherein at least one are located at the back side of the substrate.
  17. Molded case circuit board group part according to claim 10 further comprises an at least electronic component, wherein the electronic component is connected to the substrate switched only, and at least one described electronic component is located at the back side of the substrate.
  18. Molded case circuit board group part according to claim 17, wherein the reinforcement part embeds at least part of at least one electronic component.
  19. One camera module characterized by comprising
    An at least optical lens；
    An at least sensitive chip；And
    One molded case circuit board group part, wherein the molded case circuit board group part further comprises:
    One molded base, wherein the molded base has an at least optical window；With
    An at least circuit board, wherein the circuit board includes at least connecting plate that at least substrate of a hard is connected to switched on the substrate, and the sensitive chip is connected to the substrate switched only, wherein the molded base is integrally incorporated into the substrate, and the molded base is looped around the surrounding of the photosensitive region of the sensitive chip, so that the photosensitive region of the sensitive chip corresponds to the optical window of the molded base, wherein the optical lens is maintained at the photosensitive path of the sensitive chip, so that the optical window of the molded base forms the light channel between the optical lens and the sensitive chip.
  20. Camera module according to claim 19, wherein the connecting plate have a mould group connecting side, wherein the connecting plate by the mould group connecting side of the connecting plate be mounted on the substrate it is positive in a manner of be connected to the substrate switched only.
  21. Camera module according to claim 19, wherein the connecting plate has a mould group connecting side, wherein the connecting plate is connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the back side of the substrate switched only.
  22. Camera module according to claim 19, wherein the connecting plate has a mould group connecting side, wherein the connecting plate is connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the side of the substrate switched only.
  23. Camera module according to claim 20, wherein the substrate has on the outside of an edge and on the inside of an edge, set the dimensional parameters on the outside of the edge of the substrate wherein as L1, dimensional parameters on the inside of the edge of the substrate are L2, wherein the value range of the dimensional parameters L1 on the outside of the edge of the substrate is: 0.01mm≤L1≤5mm, wherein the value range of the dimensional parameters L2 on the inside of the edge of the substrate is: 0.01mm≤L2≤5mm.
  24. Camera module according to claim 21, wherein setting the width dimensions parameter of the mould group connecting side of the connecting plate and the overlapping region of the substrate as L3, wherein the value range of parameter L3 is: 0.01mm≤L3≤5mm.
  25. Camera module according to claim 21, wherein the substrate has an at least short slot, wherein the mould group connecting side of the connecting plate is maintained at the short slot of the substrate.
  26. Camera module according to claim 22, wherein the side of the substrate forms an interconnecting piece, wherein the mould group connecting side of the connecting plate is mounted on the interconnecting piece of the substrate.
  27. According to the camera module any in claim 20 to 26, wherein the molded base embeds the mould group connecting side of the connecting plate.
  28. According to claim 1, any camera module in 9 to 26, the molded case circuit board group part further comprises a reinforcement part, wherein the reinforcement part is integrally incorporated into the back side of the substrate.
  29. Camera module according to claim 28, wherein the reinforcement part embeds the mould group connecting side of the connecting plate.
  30. Any camera module in 9 to 26 according to claim 1, wherein the substrate has an at least accommodation space, wherein the sensitive chip is maintained at the accommodation space of the substrate.
  31. Camera module according to claim 27, wherein the substrate has an at least accommodation space, wherein the sensitive chip is maintained at the accommodation space of the substrate.
  32. Camera module according to claim 28, wherein the substrate has an at least accommodation space, wherein the sensitive chip is maintained at the accommodation space of the substrate.
  33. Any camera module in 9 to 26 according to claim 1, wherein the molded case circuit board group part further comprises an at least electronic component, wherein the electronic component is connected to the substrate switched only.
  34. Camera module according to claim 34, electronic component described in wherein at least one are located at the back side of the substrate.
  35. Camera module according to claim 28, the molded case circuit board group part further comprise an at least electronic component, wherein the electronic component is connected to the substrate switched only, and at least one described electronic component is located at the back side of the substrate.
  36. Camera module according to claim 35, wherein the reinforcement part embeds at least part of at least one electronic component.
  37. Camera module according to claim 28, wherein the reinforcement part is incorporated into the back side of the circuit board while molded base is incorporated into the front of the substrate.
  38. Camera module according to claim 28, wherein the reinforcement part is incorporated into the back side of the circuit board after the front that the molded base is incorporated into the substrate.
  39. Any camera module in 9 to 38 according to claim 1, wherein the molded base further embeds the non-photo-sensing region of at least one sensitive chip.
  40. Camera module according to claim 19, wherein the camera module includes at least two optical lens, at least two sensitive chips and at least two substrates, wherein each sensitive chip is mounted on each substrate respectively, each optical lens is respectively held in the photosensitive path of each sensitive chip, so that the camera module forms an array camera module.
  41. Camera module according to claim 19, wherein the camera module includes at least two optical lens, at least two sensitive chips and a substrate, wherein each sensitive chip is mounted on the substrate respectively, each optical lens is respectively held in the photosensitive path of each sensitive chip, so that the camera module forms an array camera module.
  42. Camera module according to claim 41, it further comprise at least two filter elements, wherein each filter element is mounted on the molded base respectively, and each filter element is respectively held between each optical lens and each sensitive chip.
  43. Camera module according to claim 41, it further comprise the bracket of at least two filter elements and at least two frame-type, wherein each filter element is mounted on each bracket respectively, each bracket is mounted on the molded base respectively, each filter element to be maintained between each optical lens and each sensitive chip respectively by each bracket and the molded base.
  44. Camera module according to claim 41, it further comprise the bracket of at least two filter elements and an at least frame-type, wherein each filter element is mounted on the bracket respectively, the bracket is mounted on the molded base, each filter element to be maintained between each optical lens and each sensitive chip respectively by the bracket and the molded base.
  45. Camera module according to claim 41, it further comprise an at least support, wherein the support has an at least light hole, wherein the support is mounted on the front of the substrate in the support mode adjacent with the molded base, and the support is looped around the surrounding of the photosensitive region of the sensitive chip, so that the photosensitive region of the sensitive chip corresponds to the light hole of the support, wherein the light hole of the support forms the light channel between the optical lens and the sensitive chip.
  46. One electronic equipment characterized by comprising
    One electronic equipment ontology；With
    Any at least one described described camera module in 9 to 46 according to claim 1, wherein the camera module is arranged at the electronic equipment ontology.
  47. Electronic equipment according to claim 46, wherein the electronic equipment ontology is a smart phone, wherein the camera module is arranged at the front of the smart phone, to form the preposition camera module of the smart phone.
  48. Electronic equipment according to claim 46, wherein the electronic equipment ontology is a smart phone, wherein the camera module is arranged at the rear portion of the smart phone, to form the postposition camera module of the smart phone.
  49. The manufacturing method of one camera module, which is characterized in that the manufacturing method includes the following steps:
    (a) the layout unit that there is molding a molded base of an at least optical window to be formed in the substrate by an at least hard；
    (b) an at least sensitive chip is conductively connected in the substrate, wherein the photosensitive region of the sensitive chip corresponds to the optical window of the molded base；And
    (c) an at least optical lens is kept to the photosensitive path of each sensitive chip, the camera module is made.
  50. Manufacturing method according to claim 49, wherein the step (b) is before the step (a), to connect each sensitive chip with first turning in each of the formation layout unit substrate, then molding process is carried out on the layout unit, to form the molded base for the surrounding for being looped around each sensitive chip, so that the photosensitive region of each sensitive chip corresponds respectively to each of described molded base optical window.
  51. Manufacturing method according to claim 50, wherein non-photo-sensing region of the molded base in conjunction with the sensitive chip.
  52. Manufacturing method according to claim 49, wherein further comprising step in the above-mentioned methods:
    The layout unit is provided, wherein the layout unit includes substrate described in multiple row and multirow；
    The molded base is moulded on the layout unit in such a way that the pasting area of each substrate is exposed on each of described molded base optical window respectively molding process；And
    Each sensitive chip is mounted respectively in the pasting area of each substrate via each of the molded base optical window, and the sensitive chip and the substrate is connected.
  53. Manufacturing method according to claim 50, wherein further comprising step in the above-mentioned methods:
    The layout unit is provided, wherein the layout unit includes substrate described in multiple row and multirow；
    The sensitive chip is mounted and is connected respectively in the pasting area of each substrate；And
    The molded base is moulded on the layout unit in such a way that the molded base is looped around the surrounding of the photosensitive region of each sensitive chip molding process, so that the photosensitive region of each sensitive chip corresponds respectively to each of described molded base optical window.
  54. Manufacturing method according to claim 51, wherein further comprising step in the above-mentioned methods:
    The layout unit is provided, wherein the layout unit includes substrate described in multiple row and multirow；
    The sensitive chip is mounted and is connected respectively in the pasting area of each substrate；And
    The molded base is moulded on the layout unit in such a way that the molded base is looped around the surrounding of the photosensitive region of each sensitive chip molding process, so that the photosensitive region of each sensitive chip corresponds respectively to each of described molded base optical window.
  55. Manufacturing method according to claim 52, wherein in the step after molding process moulds the molded base in such a way that the pasting area of each substrate is exposed on each of described molded base optical window respectively on the layout unit, further comprise step: segmentation is performed the layout unit after molding process, to obtain a molded case circuit board group part.
  56. Manufacturing method according to claim 52, wherein each sensitive chip is mounted respectively in the pasting area of each substrate via each of the molded base optical window in the step, and after being connected the sensitive chip and the substrate, further comprise step: segmentation is performed the layout unit after molding process, to obtain the molded case circuit board group part.
  57. Manufacturing method according to claim 53, the molded base is wherein moulded on the layout unit in such a way that the molded base is looped around the surrounding of the photosensitive region of each sensitive chip molding process in the step, so that the photosensitive region of each sensitive chip corresponds respectively to after each of described molded base optical window, further comprise step: segmentation is performed the layout unit after molding process, to obtain the molded case circuit board group part.
  58. Manufacturing method according to claim 54, the molded base is wherein moulded on the layout unit in such a way that the molded base is looped around the surrounding of the photosensitive region of each sensitive chip molding process in the step, so that the photosensitive region of each sensitive chip corresponds respectively to after each of described molded base optical window, further comprise step: segmentation is performed the layout unit after molding process, to obtain the molded case circuit board group part.
  59. According to the manufacturing method any in claim 49 to 58, further comprise step: by an at least connecting plate by the mould group connecting side of the connecting plate be mounted on the substrate it is positive in a manner of be conductively connected to the substrate.
  60. According to the manufacturing method any in claim 49 to 58, further comprises step: an at least connecting plate is conductively connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the back side of the substrate.
  61. According to the manufacturing method any in claim 49 to 58, further comprises step: an at least connecting plate is conductively connected to the substrate in such a way that the mould group connecting side of the connecting plate is mounted on the side of the substrate.
  62. Manufacturing method according to claim 59, wherein the molded base embeds the mould group connecting side of the connecting plate.
  63. Manufacturing method according to claim 60, wherein the molded base embeds the mould group connecting side of the connecting plate.
  64. Manufacturing method according to claim 61, wherein the molded base embeds the mould group connecting side of the connecting plate.
  65. According to the manufacturing method any in claim 49 to 58, wherein at least one side of the molded base is the separation side formed by division process.
CN201780078561.5A 2016-12-30 2017-12-29 Camera module and its molded case circuit board group part and manufacturing method and the electronic equipment with camera module Pending CN110089100A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN2016112618998 2016-12-30
CN201611261899.8A CN108270948A (en) 2016-12-30 2016-12-30 Camera module and its molded case circuit plate component and manufacturing method and the electronic equipment with camera module
PCT/CN2017/119940 WO2018121752A1 (en) 2016-12-30 2017-12-29 Camera module, moulded circuit board assembly thereof and manufacturing method for same, and electronic device comprising said camera module

Publications (1)

Publication Number Publication Date
CN110089100A true CN110089100A (en) 2019-08-02

Family

ID=62707013

Family Applications (3)

Application Number Title Priority Date Filing Date
CN202011416963.1A Pending CN112600999A (en) 2016-12-30 2016-12-30 Camera module, molded circuit board assembly thereof, preparation method and electronic equipment
CN201611261899.8A Pending CN108270948A (en) 2016-12-30 2016-12-30 Camera module and its molded case circuit plate component and manufacturing method and the electronic equipment with camera module
CN201780078561.5A Pending CN110089100A (en) 2016-12-30 2017-12-29 Camera module and its molded case circuit board group part and manufacturing method and the electronic equipment with camera module

Family Applications Before (2)

Application Number Title Priority Date Filing Date
CN202011416963.1A Pending CN112600999A (en) 2016-12-30 2016-12-30 Camera module, molded circuit board assembly thereof, preparation method and electronic equipment
CN201611261899.8A Pending CN108270948A (en) 2016-12-30 2016-12-30 Camera module and its molded case circuit plate component and manufacturing method and the electronic equipment with camera module

Country Status (2)

Country Link
CN (3) CN112600999A (en)
WO (1) WO2018121752A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113132586A (en) * 2020-01-10 2021-07-16 宁波舜宇光电信息有限公司 Photosensitive chip assembly, camera module and electronic equipment
CN113132585A (en) * 2020-01-10 2021-07-16 宁波舜宇光电信息有限公司 Photosensitive chip assembly, mobile terminal, camera module and preparation method thereof

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108401089A (en) * 2017-02-06 2018-08-14 宁波舜宇光电信息有限公司 The molded case circuit board group part and its manufacturing method of camera module and camera module and the electronic equipment with camera module
CN110855853B (en) * 2018-07-26 2022-08-23 宁波舜宇光电信息有限公司 Photosensitive component, photosensitive component jointed board, molding component jointed board and manufacturing method
US20210289112A1 (en) * 2018-07-26 2021-09-16 Ningbo Sunny Opotech Co., Ltd. Molding assembly, camera module, molding assembly jointed board and manufacturing method
CN110769130B (en) * 2018-07-26 2023-01-13 宁波舜宇光电信息有限公司 Molding assembly, camera module, molding assembly splicing plate and manufacturing method
CN109257531B (en) * 2018-11-09 2023-11-28 昆山丘钛微电子科技有限公司 Camera module, manufacturing method thereof and terminal
CN111726484A (en) * 2019-03-22 2020-09-29 宁波舜宇光电信息有限公司 Camera module, lens assembly thereof and electronic equipment with camera module
CN111314591A (en) * 2020-03-09 2020-06-19 昆山丘钛微电子科技有限公司 Camera module and manufacturing method thereof
CN114666466B (en) * 2020-12-23 2023-06-23 华为技术有限公司 Camera module and electronic equipment
CN114500792B (en) * 2021-12-16 2024-04-09 宁波舜宇光电信息有限公司 Camera module and photosensitive assembly thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030025825A1 (en) * 2000-03-02 2003-02-06 Olympus Optical Co., Ltd. Small image pickup module
CN1423477A (en) * 2001-11-30 2003-06-11 松下电器产业株式会社 Solid-state image-forming device and making method thereof
CN1929144A (en) * 2005-09-09 2007-03-14 金利精密工业股份有限公司 Image sensor and its packaging method
CN101448079A (en) * 2007-11-26 2009-06-03 鸿富锦精密工业（深圳）有限公司 Camera module
CN104580855A (en) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 Camera module
CN105681637A (en) * 2016-03-15 2016-06-15 宁波舜宇光电信息有限公司 Array camera module and photosensitive assembly thereof and manufacturing method
CN105681640A (en) * 2016-03-28 2016-06-15 宁波舜宇光电信息有限公司 Camera module and manufacturing method thereof
CN105744130A (en) * 2016-03-12 2016-07-06 宁波舜宇光电信息有限公司 Camera shooting module, photosensitive assembly of the camera shooting module and production method of the photosensitive assembly of the camera shooting module
CN105744131A (en) * 2016-03-15 2016-07-06 宁波舜宇光电信息有限公司 Array photographing module, circuit board assembly of the array photographing module and manufacturing method of the circuit board assembly of the array photographing module

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101035199A (en) * 2007-03-30 2007-09-12 昆山钜亮光电科技有限公司 Making method for the image module with the sensor directly connected and encapsulated together with the soft board
US8546739B2 (en) * 2007-03-30 2013-10-01 Min-Chih Hsuan Manufacturing method of wafer level chip scale package of image-sensing module
CN201270248Y (en) * 2008-03-12 2009-07-08 茂晖科技股份有限公司 Sensing chip for digital X-ray machine
JP5324935B2 (en) * 2009-01-20 2013-10-23 株式会社ザクティ Solid-state imaging device
CN101959010B (en) * 2009-07-17 2012-07-11 致伸科技股份有限公司 Camera module and assembly method thereof
CN103780803A (en) * 2012-10-23 2014-05-07 鸿富锦精密工业（深圳）有限公司 Image capturing module
CN103163617A (en) * 2013-03-05 2013-06-19 南昌欧菲光电技术有限公司 Lens module
TWI650016B (en) * 2013-08-22 2019-02-01 新力股份有限公司 Imaging device, manufacturing method and electronic device
JP2015177310A (en) * 2014-03-14 2015-10-05 株式会社東芝 camera module
CN104576674B (en) * 2014-12-25 2017-07-11 南昌欧菲光电技术有限公司 Camera module and its encapsulation structure of image sensing chip
CN105100571A (en) * 2015-07-28 2015-11-25 南昌欧菲光电技术有限公司 Camera module group and first and second circuit boards thereof
CN111010498B (en) * 2016-04-01 2022-08-23 宁波舜宇光电信息有限公司 Camera module based on integrated packaging process
CN112217969B (en) * 2016-04-07 2022-10-21 宁波舜宇光电信息有限公司 Photosensitive device with reinforced circuit board, array camera module and manufacturing method thereof

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030025825A1 (en) * 2000-03-02 2003-02-06 Olympus Optical Co., Ltd. Small image pickup module
CN1423477A (en) * 2001-11-30 2003-06-11 松下电器产业株式会社 Solid-state image-forming device and making method thereof
CN1929144A (en) * 2005-09-09 2007-03-14 金利精密工业股份有限公司 Image sensor and its packaging method
CN101448079A (en) * 2007-11-26 2009-06-03 鸿富锦精密工业（深圳）有限公司 Camera module
CN104580855A (en) * 2014-12-25 2015-04-29 南昌欧菲光电技术有限公司 Camera module
CN105744130A (en) * 2016-03-12 2016-07-06 宁波舜宇光电信息有限公司 Camera shooting module, photosensitive assembly of the camera shooting module and production method of the photosensitive assembly of the camera shooting module
CN105681637A (en) * 2016-03-15 2016-06-15 宁波舜宇光电信息有限公司 Array camera module and photosensitive assembly thereof and manufacturing method
CN105744131A (en) * 2016-03-15 2016-07-06 宁波舜宇光电信息有限公司 Array photographing module, circuit board assembly of the array photographing module and manufacturing method of the circuit board assembly of the array photographing module
CN105681640A (en) * 2016-03-28 2016-06-15 宁波舜宇光电信息有限公司 Camera module and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113132586A (en) * 2020-01-10 2021-07-16 宁波舜宇光电信息有限公司 Photosensitive chip assembly, camera module and electronic equipment
CN113132585A (en) * 2020-01-10 2021-07-16 宁波舜宇光电信息有限公司 Photosensitive chip assembly, mobile terminal, camera module and preparation method thereof
CN113132586B (en) * 2020-01-10 2022-09-09 宁波舜宇光电信息有限公司 Photosensitive chip assembly, camera module and electronic equipment
CN113132585B (en) * 2020-01-10 2022-09-09 宁波舜宇光电信息有限公司 Photosensitive chip assembly, mobile terminal, camera module and preparation method thereof

Also Published As

Publication number Publication date
WO2018121752A1 (en) 2018-07-05
CN112600999A (en) 2021-04-02
CN108270948A (en) 2018-07-10

Similar Documents

Publication Publication Date Title
CN110089100A (en) Camera module and its molded case circuit board group part and manufacturing method and the electronic equipment with camera module
CN108243300A (en) Array camera module and its application
JP7071926B2 (en) Camera module and its photosensitive parts and their manufacturing method
KR102132512B1 (en) Camera module with compression-molded circuit board and manufacturing method thereof
CN208143325U (en) Array camera module and circuit board module and its electronic equipment with difference in height
US8964003B2 (en) Three dimensional image pick-up device and manufacturing method thereof
CN112217969B (en) Photosensitive device with reinforced circuit board, array camera module and manufacturing method thereof
CN206272704U (en) Array camera module and double camera modules and its circuit board module and electronic equipment
CN107959770B (en) Camera module and array camera module based on integrated packaging technology
CN109688303A (en) Photosensory assembly jigsaw, photosensory assembly, camera module and production method
CN107566691A (en) Photosensory assembly and camera module and its manufacture method
CN207764526U (en) Camera module and its photosensory assembly and electronic equipment
TW201741752A (en) Array camera module, molded photosensitive component and circuit board component of same, manufacturing method therefor, and electronic device
CN109257531A (en) Camera module and preparation method thereof, terminal
CN206894759U (en) Array camera module and its molded circuit board component and electronic equipment
CN105681631A (en) Substrate for embedding imaging device and method for manufacturing same, and imaging apparatus
CN111726483A (en) Lens module and electronic device
CN110493502A (en) Camera module, mobile terminal and camera module manufacturing method
CN103246038A (en) Camera lens base and camera module
US20230328350A1 (en) Camera module and molded photosensitive assembly and manufacturing methods thereof, and electronic device
JP7335261B2 (en) Imaging modules, photosensitive modules and electronics with chamfers
CN112291449B (en) Camera module, photosensitive assembly and manufacturing method thereof
CN207251772U (en) A kind of camera encapsulating structure, camera module and mobile terminal
CN114710609A (en) Automatic focusing camera module and automatic focusing camera module assembling method
CN114167568A (en) Lens module, manufacturing method of lens module and electronic equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20190802

RJ01 Rejection of invention patent application after publication