CN101959010B - Camera module and assembly method thereof - Google Patents
Camera module and assembly method thereof Download PDFInfo
- Publication number
- CN101959010B CN101959010B CN2009101591614A CN200910159161A CN101959010B CN 101959010 B CN101959010 B CN 101959010B CN 2009101591614 A CN2009101591614 A CN 2009101591614A CN 200910159161 A CN200910159161 A CN 200910159161A CN 101959010 B CN101959010 B CN 101959010B
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- Prior art keywords
- circuit board
- photographing module
- substrate
- image chip
- fixed
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Abstract
The invention relates to a camera module and an assembly method thereof. The camera module comprises a circuit board, a substrate, an image chip, a seat and a lens, wherein the circuit board comprises a first surface, a second surface and an opening penetrating through the first surface and the second surface; the substrate is fixed on the second surface and seals up the opening; the image chip is arranged on the substrate and located in the opening; the seat is fixed on the first surface; and the lens is fixed on the seat. The camera module of the invention has the advantage of reducing the overall height of the camera module.
Description
Technical field
The present invention relates to photographing module and assemble method thereof, relate in particular to a kind of photographing module and assemble method thereof that is applied on the electronic product.
Background technology
Photographing module is a kind of modularization camera head that combines camera lens, image chip and circuit board, can be applicable to mobile phone, notebook computer, pocket music playing device etc. and has on the electronic product of camera function.And above-mentioned electronic product on the exterior design in the trend of lightening design, also get over strict for the dimensional requirement of photographing module, particularly requirement can reduce the whole height of photographing module.
Fig. 1 is the side schematic view of existing photographing module.Photographing module 1 comprises a circuit board 11, a substrate 12, an image chip 13, a pedestal 14 and a camera lens 15.Wherein, substrate 12 is to be arranged on the circuit board 11, comprises a groove 121 in order to hold image chip 13, and substrate 12 also is responsible for the sensing signal of image chip 13 is passed on the circuit board 11 through the line layer (not shown) simultaneously.14 of pedestals are arranged on the substrate 12, make that in order to carry camera lens 15 external image is able to focus on the image chip 13 through camera lens 15.
Continuation is with reference to Fig. 1; Existing photographing module 1; Be used for the groove 121 of ccontaining image chip 13 owing to must be formed with on the substrate 12, therefore between bottom surface to the circuit board 11 of groove 121, must have a thickness inevitably, otherwise just can't load image chip 13.In addition, circuit board 11 and pedestal 14 itself also have certain fixed thickness, therefore, how keeping under the situation that has element now, realize reducing the design of photographing module 1 whole height, just become the problem that the design research staff desires most ardently solution at present.
Summary of the invention
The technical problem that the present invention will solve is that the above-mentioned deficiency to prior art exists provides a kind of method that reduces the photographing module of whole height and assemble this photographing module.
The technical solution adopted for the present invention to solve the technical problems provides a kind of photographing module, and this photographing module comprises:
Circuit board comprises first surface, second surface and the opening that runs through this first surface and this second surface;
Substrate is fixed on this second surface and seals this opening;
Image chip is arranged on this substrate and is positioned at this opening;
Pedestal is fixed on this first surface; And
Camera lens is fixed on this pedestal.
This image chip is to electrically connect through wire-bonded mode and this circuit board.
This circuit board is a soft printed circuit board.
This circuit board is rigid printed circuit board (PCB).
This circuit board is a rigid-flex.
This substrate is a glass substrate.
This substrate is a ceramic substrate.
This substrate is an acrylic plate.
This substrate is a metallic plate.
This metallic plate is an iron plate.
This metallic plate is an aluminium sheet.
This metallic plate is a copper coin.
This metallic plate is a steel plate.
This metallic plate is a corrosion resistant plate.
The present invention also provides a kind of assemble method of photographing module, and it comprises:
One image chip is fixed on the substrate;
One circuit board is provided, and this circuit board comprises first surface, second surface and the opening that runs through this first surface and this second surface;
This substrate is fixed on the second surface of this circuit board, and this image chip is placed in this opening;
Electrically connect this image chip and this circuit board; And
One pedestal is fixed on the first surface of this circuit board, this pedestal carries a camera lens.
The mode of this image chip of said electric connection and this circuit board is a wire-bonded.
The present invention can let this image chip and this circuit board on same level height, overlap, thereby can reduce the whole height of photographing module through on said circuit board, forming said opening and letting said image chip be positioned at the design of this opening.
Description of drawings
Fig. 1 is the side schematic view of existing photographing module;
The side schematic view of the photographing module that Fig. 2 is provided for photographing module preferred embodiment of the present invention;
Fig. 3 to Fig. 6 is for show the assembling sketch map of photographing module preferred embodiment of the present invention in regular turn.
Embodiment
Preferred embodiment of the present invention provides a kind of photographing module, can be applicable to mobile phone, notebook computer, pocket music playing device etc. and has on the electronic product of camera function.
With reference to side schematic view shown in Figure 2, photographing module 2 comprises a circuit board 21, a substrate 22, an image chip 23, a pedestal 24 and a camera lens 25.Wherein, circuit board 21 comprises first surface 211, second surface 212 and opening 213, and this opening 213 runs through first surface 211 and second surface 212.Substrate 22 is fixed on the second surface 212 of circuit board 21, and the opening 213 with circuit board 21 seals simultaneously.23 of image chips are arranged on the substrate 22 and are positioned at opening 213, and electrically connect through the contact (not shown) on wire-bonded mode (wirebonding) and circuit board 21 first surfaces 211.And this preferred embodiment is through forming opening 213 and letting image chip 23 be positioned at the design of this opening 213 on circuit board 21; Can let image chip 23 and circuit board 21 on same level height, overlap, thereby can reduce the whole height of photographing module 2.
Continuation is with reference to Fig. 2, and pedestal 24 is fixed on the first surface 211 of circuit board 21, and camera lens 25 is then sealed to be fixed in the pedestal 24, in order to external image is focused on the image chip 23.
This preferred embodiment provides the circuit board 21 that is arranged in the photographing module 2; The board type that can adopt industry generally to use; For example soft printed circuit board, rigid printed circuit board (PCB) or include the rigid-flex of soft printed circuit board and rigid printed circuit board (PCB) simultaneously, its all can sensing signal transmission to photographing module 2 applied electronic products with image chip 23 in.
This preferred embodiment provides the substrate 22 that is arranged in the photographing module 2; It can be the single or multiple lift structure; Its material is except that can adopting glass substrate, ceramic substrate and acryl (ACRYLIC) plate; Also can adopt metallic plate, for example iron plate, aluminium sheet, copper coin, steel plate or corrosion resistant plate etc. with whole photographing module 2 structural strengths of reinforcement.
And the assemble method of photographing module 2 provided by the present invention can be with reference to Fig. 3 to assembling sketch map shown in Figure 6.At first, as shown in Figure 3, image chip 23 is fixed on the substrate 22, and a circuit board 21 is provided, wherein, circuit board 21 comprises that a first surface 211, a second surface 212 and run through the opening 213 of first surface 211 and second surface 212.Then, as shown in Figure 4, substrate 22 is fixed on the second surface 212 of circuit board 21, and makes image chip 23 insert in (or insertion) opening 213; And substrate 22 is fixed in the method on the circuit board 21, can adopt modes such as gummed, pressing.Then, as shown in Figure 5, electrically connect image chip 23 and circuit board 21, for example adopt the wire-bonded mode to make the contact (not shown) on image chip 23 and the circuit board electrically connect.At last, as shown in Figure 6, with one carrying camera lens 25 pedestal 24 be fixed on the first surface 211 of circuit board 21, and pedestal 24 is fixed in the method on the circuit board 21, can adopt fixed forms such as gummed or pressing.So, just accomplished the assembling of whole photographing module 2.
The above is merely preferred embodiment of the present invention, is not in order to limiting claim of the present invention, and therefore all other do not break away from the equivalence of being accomplished under the disclosed spirit and change or modify, and all should be contained in the claim of the present invention.
Claims (16)
1. a photographing module is characterized in that, comprising:
Circuit board comprises first surface, second surface and the opening that runs through this first surface and this second surface;
Substrate is fixed on this second surface and seals this opening;
Image chip is arranged on this substrate and is positioned at this opening, and this image chip and this circuit board overlap on same level height;
Pedestal is fixed on this first surface; And
Camera lens is fixed on this pedestal.
2. photographing module as claimed in claim 1 is characterized in that: this image chip is to electrically connect through wire-bonded mode and this circuit board.
3. photographing module as claimed in claim 1 is characterized in that: this circuit board is a soft printed circuit board.
4. photographing module as claimed in claim 1 is characterized in that: this circuit board is rigid printed circuit board (PCB).
5. photographing module as claimed in claim 1 is characterized in that: this circuit board is a rigid-flex.
6. photographing module as claimed in claim 1 is characterized in that: this substrate is a glass substrate.
7. photographing module as claimed in claim 1 is characterized in that: this substrate is a ceramic substrate.
8. photographing module as claimed in claim 1 is characterized in that: this substrate is an acrylic plate.
9. photographing module as claimed in claim 1 is characterized in that: this substrate is a metallic plate.
10. photographing module as claimed in claim 9 is characterized in that: this metallic plate is an iron plate.
11. photographing module as claimed in claim 9 is characterized in that: this metallic plate is an aluminium sheet.
12. photographing module as claimed in claim 9 is characterized in that: this metallic plate is a copper coin.
13. photographing module as claimed in claim 9 is characterized in that: this metallic plate is a steel plate.
14. photographing module as claimed in claim 9 is characterized in that: this metallic plate is a corrosion resistant plate.
15. the assemble method of a photographing module is characterized in that, comprising:
One image chip is fixed on the substrate;
One circuit board is provided, and this circuit board comprises first surface, second surface and the opening that runs through this first surface and this second surface;
This substrate is fixed on the second surface of this circuit board, and this image chip is placed in this opening, and this image chip and this circuit board overlap on same level height;
Electrically connect this image chip and this circuit board; And
One pedestal is fixed on the first surface of this circuit board, this pedestal carries a camera lens.
16. the assemble method of photographing module as claimed in claim 15 is characterized in that: the mode that electrically connects this image chip and this circuit board is a wire-bonded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101591614A CN101959010B (en) | 2009-07-17 | 2009-07-17 | Camera module and assembly method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009101591614A CN101959010B (en) | 2009-07-17 | 2009-07-17 | Camera module and assembly method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101959010A CN101959010A (en) | 2011-01-26 |
| CN101959010B true CN101959010B (en) | 2012-07-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101591614A Expired - Fee Related CN101959010B (en) | 2009-07-17 | 2009-07-17 | Camera module and assembly method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101959010B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821239A (en) * | 2012-09-14 | 2012-12-12 | 信利光电(汕尾)有限公司 | Camera module |
| CN103354239B (en) * | 2013-07-16 | 2017-02-08 | 南昌欧菲光电技术有限公司 | image sensor assembly |
| CN104301592A (en) * | 2014-10-14 | 2015-01-21 | 江西盛泰光学有限公司 | Structure and packaging technology method of camera module |
| CN106254740A (en) * | 2016-08-30 | 2016-12-21 | 信利光电股份有限公司 | A kind of board unit installing photographic head |
| CN112600999A (en) * | 2016-12-30 | 2021-04-02 | 宁波舜宇光电信息有限公司 | Camera module, molded circuit board assembly thereof, preparation method and electronic equipment |
| WO2019075698A1 (en) * | 2017-10-19 | 2019-04-25 | 深圳市汇顶科技股份有限公司 | Module structure, module processing method, and terminal device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101137007A (en) * | 2006-09-01 | 2008-03-05 | 致伸科技股份有限公司 | Camera module and its assembly method |
| CN101448079A (en) * | 2007-11-26 | 2009-06-03 | 鸿富锦精密工业（深圳）有限公司 | Camera module |
-
2009
- 2009-07-17 CN CN2009101591614A patent/CN101959010B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101137007A (en) * | 2006-09-01 | 2008-03-05 | 致伸科技股份有限公司 | Camera module and its assembly method |
| CN101448079A (en) * | 2007-11-26 | 2009-06-03 | 鸿富锦精密工业（深圳）有限公司 | Camera module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101959010A (en) | 2011-01-26 |
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