CN102821239A - Camera module - Google Patents
Camera module Download PDFInfo
- Publication number
- CN102821239A CN102821239A CN2012103426191A CN201210342619A CN102821239A CN 102821239 A CN102821239 A CN 102821239A CN 2012103426191 A CN2012103426191 A CN 2012103426191A CN 201210342619 A CN201210342619 A CN 201210342619A CN 102821239 A CN102821239 A CN 102821239A
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- circuit board
- chip
- shooting module
- sheet metal
- camera module
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Abstract
The embodiment of the invention discloses a camera module which is applied to the field of electronic equipment. The camera module comprises a lens, a base, a chip, a circuit board and a metal sheet, wherein the base contains and fixes the lens; the chip is located at the bottom of the lens; the circuit board is electrically connected with the chip; and the chip and the circuit board are both mounted on the metal sheet. The camera module disclosed by the embodiment of the invention can quickly dissipate heat and is thinner.
Description
Technical field
The present invention relates to electronic device field, particularly a kind of shooting module.
Background technology
Along with the intellectuality of mobile device, the shooting module more has been installed on the mobile device, make mobile device to take pictures or to record a video.
The shooting module of prior art comprises camera lens, pedestal, and filter, sensitive chip and circuit board, sensitive chip is installed on the circuit board.
But along with the shooting module develop to high pixel, can produce more heat in the module, make the module cisco unity malfunction, and owing to chip is installed on the circuit board, the thickness of circuit board is difficult to reduce, the module that is unfavorable for making a video recording is to ultra-thin trend development.
Summary of the invention
The embodiment of the invention provides can quick heat radiating and thinner shooting module.
A kind of shooting module comprises: camera lens, accommodate the also pedestal of fixed lens, and be positioned at the chip of camera lens bottom, circuit board, and sheet metal, said circuit board and chip are electrically connected, and said chip and circuit board are installed on the said sheet metal.
In the technical scheme that the embodiment of the invention provides; Because chip is installed on the sheet metal; The radiating effect of sheet metal is strong more than circuit board; Therefore chip can quick heat radiating, and because sheet thicknesses realizes thinlyyer than circuit board easily, so the shooting module gross thickness that the embodiment of the invention provides is thinner.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art; To do to introduce simply to the accompanying drawing of required use in embodiment or the description of the Prior Art below; Obviously, the accompanying drawing in describing below only is some embodiments of the present invention, for those of ordinary skills; Under the prerequisite of not paying creative work property, can also obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is a shooting modular structure stereogram in the embodiment of the invention;
Fig. 2 is a shooting modular structure explosive view in the embodiment of the invention;
Fig. 3 is a shooting modular structure sectional view in the embodiment of the invention.
Embodiment
To combine the accompanying drawing in the embodiment of the invention below, the technical scheme in the embodiment of the invention is carried out clear, intactly description, obviously, described embodiment only is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment among the present invention, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the present invention's protection.
The embodiment of the invention provides a kind of shooting module.Be elaborated below.
See also Fig. 1 to Fig. 3, Fig. 1 is a shooting modular structure stereogram in the embodiment of the invention, and Fig. 2 is a shooting modular structure explosive view in the embodiment of the invention, and Fig. 3 is a shooting modular structure sectional view in the embodiment of the invention.The module of making a video recording in the embodiment of the invention comprises:
Further, in the present embodiment, said circuit board 13 hollow outs and openwork part are accommodated said chip 12; Said pedestal 11 is installed on the said circuit board 13; Because pedestal 11 is installed on the circuit board 13, circuit board 13 can directly be connected through modes such as gold threads with mainboard, in other embodiment; Said circuit board 13 is not accommodated said chip 12; But be installed in side by side on the sheet metal 14 with said chip 12, then said pedestal 11 is installed on the sheet metal 14, and said circuit board 13 parts are exposed to connect mainboard.
Because chip 12 is directly installed on the sheet metal 14; Sheet metal 14 can supporting chip 12 and circuit board 13; Make that the height of whole shooting module is that the thickness of sheet metal adds the length that chip thickness adds camera lens again; And the height of module need depend on the thickness of circuit board in the prior art, and the thickness of sheet metal can be realized thinlyyer than circuit board in the embodiment of the invention, meets the shooting module more to ultra-thin Development Trend.
Concrete, the electric connecting mode of said chip 12 and circuit board 13 is for to be connected through metal wire.
Concrete, said sheet metal 14 is a steel disc, in other embodiment, said sheet metal also can be other metals.
Concrete, said circuit board 13 is a printed circuit board (PCB).
Concrete, said circuit board 13 is a flexible printed circuit board.
More than a kind of shooting module that the embodiment of the invention provided has been carried out detailed introduction; Used concrete example among this paper principle of the present invention and execution mode are set forth, the explanation of above embodiment just is used for helping to understand method of the present invention and core concept thereof; Simultaneously, for one of ordinary skill in the art, according to thought of the present invention, the part that on embodiment and range of application, all can change, in sum, this description should not be construed as limitation of the present invention.
Claims (7)
1. a shooting module is characterized in that, comprising: camera lens, accommodate the also pedestal of fixed lens, and be positioned at the chip of camera lens bottom, circuit board, and sheet metal, said circuit board and chip are electrically connected, and said chip and circuit board are installed on the said sheet metal.
2. shooting module according to claim 1 is characterized in that, said circuit board hollow out and openwork part are accommodated said chip.
3. shooting module according to claim 2 is characterized in that said pedestal is installed on the said circuit board.
4. according to each described shooting module in the claim 1 to 3, it is characterized in that the electric connecting mode of said chip and circuit board is for to be connected through metal wire.
5. according to each described shooting module in the claim 1 to 3, it is characterized in that said sheet metal is a steel disc.
6. according to each described shooting module in the claim 1 to 3, it is characterized in that said circuit board is a printed circuit board (PCB).
7. shooting module according to claim 6 is characterized in that, said circuit board is a flexible printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103426191A CN102821239A (en) | 2012-09-14 | 2012-09-14 | Camera module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103426191A CN102821239A (en) | 2012-09-14 | 2012-09-14 | Camera module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102821239A true CN102821239A (en) | 2012-12-12 |
Family
ID=47305082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012103426191A Pending CN102821239A (en) | 2012-09-14 | 2012-09-14 | Camera module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102821239A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104954634A (en) * | 2014-03-25 | 2015-09-30 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
| CN109040567A (en) * | 2018-10-17 | 2018-12-18 | 宁波为森智能传感技术有限公司 | Camera module and packaging technology |
| WO2019075698A1 (en) * | 2017-10-19 | 2019-04-25 | 深圳市汇顶科技股份有限公司 | Module structure, module processing method, and terminal device |
| CN109737868A (en) * | 2018-12-21 | 2019-05-10 | 华为技术有限公司 | Flight time mould group and electronic equipment |
| WO2019242771A1 (en) * | 2018-06-22 | 2019-12-26 | 宁波舜宇光电信息有限公司 | Molded photosensitive assembly, camera module, and manufacturing method therefor, and electronic device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201657130U (en) * | 2010-05-31 | 2010-11-24 | 昆山西钛微电子科技有限公司 | Mobile phone camera module |
| CN101959010A (en) * | 2009-07-17 | 2011-01-26 | 致伸科技股份有限公司 | Camera module and assembly method thereof |
| CN102098433A (en) * | 2011-04-02 | 2011-06-15 | 天津天地伟业数码科技有限公司 | Heat dissipation structure of high-definition vidicon |
| CN102263887A (en) * | 2010-05-31 | 2011-11-30 | 昆山西钛微电子科技有限公司 | Mobile phone camera module and manufacturing process thereof |
-
2012
- 2012-09-14 CN CN2012103426191A patent/CN102821239A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101959010A (en) * | 2009-07-17 | 2011-01-26 | 致伸科技股份有限公司 | Camera module and assembly method thereof |
| CN201657130U (en) * | 2010-05-31 | 2010-11-24 | 昆山西钛微电子科技有限公司 | Mobile phone camera module |
| CN102263887A (en) * | 2010-05-31 | 2011-11-30 | 昆山西钛微电子科技有限公司 | Mobile phone camera module and manufacturing process thereof |
| CN102098433A (en) * | 2011-04-02 | 2011-06-15 | 天津天地伟业数码科技有限公司 | Heat dissipation structure of high-definition vidicon |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104954634A (en) * | 2014-03-25 | 2015-09-30 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method thereof |
| WO2015143761A1 (en) * | 2014-03-25 | 2015-10-01 | 宁波舜宇光电信息有限公司 | Camera module and manufacturing method therefor |
| US20170134624A1 (en) * | 2014-03-25 | 2017-05-11 | Ningbo Sunny Opotach Co., Ltd. | Camera Module and Manufacturing Method Thereof |
| US10250788B2 (en) * | 2014-03-25 | 2019-04-02 | Ningbo Sunny Opotech Co., Ltd. | Camera module with heat dissipation arrangement and manufacturing method thereof |
| WO2019075698A1 (en) * | 2017-10-19 | 2019-04-25 | 深圳市汇顶科技股份有限公司 | Module structure, module processing method, and terminal device |
| WO2019242771A1 (en) * | 2018-06-22 | 2019-12-26 | 宁波舜宇光电信息有限公司 | Molded photosensitive assembly, camera module, and manufacturing method therefor, and electronic device |
| CN109040567A (en) * | 2018-10-17 | 2018-12-18 | 宁波为森智能传感技术有限公司 | Camera module and packaging technology |
| CN109737868A (en) * | 2018-12-21 | 2019-05-10 | 华为技术有限公司 | Flight time mould group and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 516600 Guangdong Industrial Zone, Shanwei City Road, Lee Lee Industrial City, a district of the building fifteenth Applicant after: Truly Opto-Electronics Ltd. Address before: 516600, Guangdong City, Shanwei Province Industrial Road, Xinli electronic industrial city Applicant before: Truly Semiconductors (Shanwei) Co., Ltd. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: TRULY OPTO-ELECTRONICS LIMITED TO: TRULY OPTO-ELECTRONICS LTD. |
|
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20121212 |