WO2019075698A1 - Module structure, module processing method, and terminal device - Google Patents

Module structure, module processing method, and terminal device Download PDF

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Publication number
WO2019075698A1
WO2019075698A1 PCT/CN2017/106910 CN2017106910W WO2019075698A1 WO 2019075698 A1 WO2019075698 A1 WO 2019075698A1 CN 2017106910 W CN2017106910 W CN 2017106910W WO 2019075698 A1 WO2019075698 A1 WO 2019075698A1
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WO
WIPO (PCT)
Prior art keywords
surface
circuit board
module structure
chip
module
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Application number
PCT/CN2017/106910
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French (fr)
Chinese (zh)
Inventor
柳玉平
曾珊珊
Original Assignee
深圳市汇顶科技股份有限公司
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Priority to PCT/CN2017/106910 priority Critical patent/WO2019075698A1/en
Publication of WO2019075698A1 publication Critical patent/WO2019075698A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements

Abstract

A module structure, a module processing method, and a terminal device, which can reduce the thickness of a module structure. The module structure (200) comprises: a chip (210), a first surface (212) of the chip (210) being provided with multiple first pads (211); a circuit board (220), a second surface (224) of the circuit board (220) being provided with multiple second pads (221), and the first surface (212) of the chip (210) and the second surface (224) of the circuit board (220) being connected; an electrical connection assembly (230), which is used for electrically connecting the multiple first pads (211) and the multiple second pads (221); and a cover plate (240), the cover plate (240) and a first surface (225) of the circuit board (220) being connected.

Description

Module structure, module processing method and terminal device Technical field

Embodiments of the present application relate to the field of module processing, and more particularly, to a module structure, a module processing method, and a terminal device.

Background technique

At present, fingerprint recognition technology has been widely used in electronic devices such as smart phones, and other fields that require the use of biometrics. Users are increasingly demanding fingerprint recognition modules. The traditional fingerprint module structure is due to the production assembly process. Restrictions have been unable to meet the needs of users. Therefore, how to achieve a thinner and smaller module structure is an urgent problem to be solved.

Summary of the invention

The embodiment of the present application provides a module structure, a module processing method, and a terminal device, which can reduce the thickness of the module structure.

In a first aspect, a module structure is provided, comprising:

a chip, the first surface of the chip is provided with a plurality of first pads;

a circuit board having a plurality of second pads disposed on a second surface thereof, the first surface of the chip being coupled to the second surface of the circuit board;

An electrical connection assembly for electrically connecting the plurality of first pads and the plurality of second pads;

a cover plate, the cover plate being coupled to the first surface of the circuit board.

Therefore, compared with the existing module structure, the module structure of the embodiment of the present application eliminates the reinforcing structure, simplifies the module structure, helps reduce the thickness of the module structure, and sets the circuit board on the chip and Between the cover plates, the circuit board is absorbing external force, thereby improving the mechanical reliability of the module structure.

In conjunction with the first aspect, in some possible implementations of the first aspect, the circuit board is a hollowed out structure.

Optionally, the hollow structure may be a hollow structure.

In conjunction with the first aspect, in some possible implementations of the first aspect, the module structure further includes:

a physical connection assembly for connecting a first surface of the chip and a second table of the circuit board And a first surface and the cover plate connecting the circuit board.

In conjunction with the first aspect, in some possible implementations of the first aspect, the physical connection component is a non-conductive material.

Optionally, the physical connection component may adopt at least one of the following adhesive materials: Thermal Compression Non-Conductive Paste (TCNCP), Thermal Compression Non-Conductive Film (Thermal Compression Non-Conductive Film, TCNCF), Die Attach Film (DAF) or Silver (Epoxy).

In conjunction with the first aspect, in some possible implementations of the first aspect, the physical connection component has a dielectric constant greater than three.

In conjunction with the first aspect, in some possible implementations of the first aspect, the circuit board is a flexible circuit board FPC.

Generally, the thickness of the FPC is thin, and the FPC type circuit board is used to reduce the thickness of the module structure. In addition, due to the high flexibility of the FPC, the FPC type circuit board can improve the assembly flexibility.

In conjunction with the first aspect, in some possible implementations of the first aspect, the electrical connection component is a metal bump or a conductive particle.

Conductive particles are used as a medium for signal transmission between the chip and the circuit board. Therefore, during the processing of the module, the required processing temperature is low, thereby reducing the influence of high temperature on the warpage of the chip, thereby enabling Improve the reliability of the module structure.

In conjunction with the first aspect, in some possible implementations of the first aspect, the metal bumps are gold bumps, copper bumps, tin bumps, and the like.

In combination with the first aspect, in some possible implementation manners of the first aspect, the conductive particles are a metal powder, a metal ball or a polymer plastic ball coated with a metal surface.

In combination with the first aspect, in some possible implementations of the first aspect, the cover material is plexiglass, glass, ceramic or sapphire or the like.

In conjunction with the first aspect, in some possible implementations of the first aspect, the chip is a fingerprint sensing chip.

In a second aspect, a module processing method is provided, including:

Mounting a cover on the carrier board;

Mounting a first surface of the circuit board on the cover plate;

Mounting a first surface of the chip on a second surface of the circuit board, wherein the chip a plurality of first pads are disposed on the first surface, and a plurality of second pads are disposed on the second surface of the circuit board;

An electrical connection assembly is fabricated between the first surface of the chip and the second surface of the circuit board, the plurality of first pads and the plurality of second pads being electrically connected by the electrical connection assembly.

With reference to the second aspect, in some possible implementation manners of the second aspect, the method further includes:

A physical connection assembly is prepared on the cover.

With reference to the second aspect, in some possible implementation manners of the second aspect, the method further includes:

A physical connection assembly is fabricated on the second surface of the circuit board.

In conjunction with the second aspect, in some possible implementations of the second aspect, before the first surface of the circuit board is mounted on the cover, the method further includes:

The partial area on the circuit board is hollowed out.

Therefore, in the module processing method of the embodiment of the present application, in the process of module processing, the cover plate is placed at the bottom of the module structure to function as an existing reinforcing structure, and in actual use, the cover is used. The plate is placed at the top of the module structure and functions as an existing cover plate. Therefore, the cover plate according to the embodiment of the present application has the functions of reinforcing structure and cover plate, and the module structure is simplified. Helps reduce the thickness of the module structure.

In a third aspect, a terminal device is provided, including:

A module structure as in the first aspect or any of the possible implementations of the first aspect.

A fourth aspect provides a terminal device, including:

A module structure prepared according to the module processing method of the second aspect or any of the possible implementations of the second aspect.

DRAWINGS

Figure 1 is a schematic diagram of a module structure.

2 is a schematic diagram of a longitudinal section of a module structure in accordance with an embodiment of the present application.

3 is a schematic diagram of a longitudinal section of a module structure in accordance with another embodiment of the present application.

4 is a schematic diagram of a cross-section of a module structure in accordance with another embodiment of the present application.

FIG. 5 is a schematic flowchart of a module processing method according to an embodiment of the present application.

FIG. 6 is a schematic structural diagram of a terminal device according to an embodiment of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be described below with reference to the accompanying drawings.

1 is a schematic diagram of a module structure. As shown in FIG. 1, the module structure 100 includes a cover 110, a physical connection component 120, a chip 130, and a circuit board 150 for implementing pads 131 and circuits of the chip 130. A connector (e.g., solder ball) 140 that electrically connects between the pads 151 of the board 150, and a reinforcing structure 160.

The above structure is indispensable due to the limitation of the assembly process. Therefore, the thickness of the module structure cannot be made thinner. In view of this, the embodiment of the present application provides a module structure, which can reduce the thickness of the module structure.

Hereinafter, the module structure of the embodiment of the present application will be described in detail with reference to FIG. 2 to FIG.

It should be noted that in the embodiments shown below, the same structures are denoted by the same reference numerals in the structures shown in the following embodiments, and the detailed description of the same structures is omitted for brevity. .

It should be understood that the height or thickness of various structural members in the module structure of the embodiment of the present application shown below, as well as the overall thickness of the module structure, and the like are merely illustrative, and should not be construed as limiting the application.

2 is a schematic illustration of a longitudinal section of a module structure 200 in accordance with an embodiment of the present application. As shown in FIG. 2, the module structure 200 includes:

a chip 210, the first surface 212 of the chip is provided with a plurality of first pads 211;

a circuit board 220, the second surface 224 of the circuit board is provided with a plurality of second pads 221, and the first surface 212 of the chip is connected to the second surface 224 of the circuit board;

The electrical connection component 230 is configured to electrically connect the plurality of first pads 211 and the plurality of second pads 221;

A cover plate 240 is coupled to the first surface 225 of the circuit board.

That is to say, the module structure of the embodiment of the present application is a chip, an electrical connection component, a circuit board and a cover plate in order from the bottom to the top, which can be understood by those skilled in the art, during the processing of the module, or in actual use. For the sake of understanding, the embodiment of the present application is described by taking the cover at the top of the module structure as an example, and should not be construed as limiting the embodiment of the present application.

It should be noted that the cover plate 240 of the embodiment of the present application has the function of the cover plate and the reinforcing structure in the existing module structure. Specifically, in actual use, the cover plate 240 of the embodiment of the present application may have a cover. The function of the board, in the processing of the module structure, the cover 240 of the embodiment of the present application can be placed at the bottom of the module structure, so as to play the role of reinforcing material, the specific implementation process is as follows An embodiment of the module processing method described herein.

Therefore, compared with the existing module structure, the module structure of the embodiment of the present application eliminates the reinforcing structure, simplifies the module structure, helps reduce the thickness of the module structure, and sets the circuit board on the chip and Between the cover plates, the circuit board is absorbing external force, thereby improving the mechanical reliability of the module structure.

It should be understood that during the processing of the module structure, there may be a case where the module is inverted. At this time, the upper surface of the structural member may become the lower surface of the structural member, and therefore, the upper surface or the lower surface of each structural member is not Absolutely, in relation to the placement state of the structural member, in the embodiment of the present application, the upper surface of each structural member is referred to as the first surface of each structural member when the cover is placed upward, The lower surface of each structural member when the cover is placed upward is referred to as the second surface of each structural member, for example, the first surface 225 of the circuit board is the upper surface of the circuit board when the cover is placed upward, the circuit board The second surface 224 is the lower surface of the circuit board when the cover is placed upward.

It should be noted that the chip in the embodiment of the present application may be a fingerprint sensing chip, such as an optical fingerprint chip, a capacitive fingerprint chip, or an ultrasonic fingerprint chip, or may be a chip for implementing other functions. For example, the fingerprint sensor chip is used as an example, but the present invention should not be limited. The module structure of the embodiment of the present application also falls within the protection scope of the embodiment of the present application.

The plurality of first pads 211 of the chip can be understood as pins that are electrically connected to the other structural components, that is, the chip 210 can be realized by the plurality of first pads 211 and other structural components, for example, a circuit board. 220 electrical connection. It should be understood that, in the embodiment of the present application, the plurality of first pads 210 may be uniformly or unevenly distributed on the first surface 212 of the chip, and the first solder in the module structure 200 shown in FIG. 2 The number and location of the disks 211 are merely examples and are not limiting.

Similarly, the plurality of second pads 221 of the circuit board can be understood as the pins that the circuit board 220 is electrically connected to other structural components, that is, the circuit board 220 can be realized with other structural components through the plurality of second pads 221. For example, the electrical connection of the chip 210. It should be understood that, in the embodiment of the present application, the plurality of second pads 221 may be uniformly or unevenly distributed on the second surface 224 of the circuit board, and the second soldering in the module structure 200 shown in FIG. The number and location of disks 221 are merely examples and are not limiting.

Optionally, in the embodiment of the present application, the circuit board 220 may be a Flexible Printed Circuit (FPC).

Generally, the thickness of the FPC is thin, and the FPC type circuit board is used to reduce the thickness of the module structure. In addition, since the FPC has high flexibility, the FPC type circuit board can be used. Increase the flexibility of assembly. Optionally, other types of circuit boards, such as a soft and hard bonding board, may also be used in the embodiment of the present application, which is not limited in this embodiment.

Optionally, in the embodiment of the present application, as shown in FIG. 2, the circuit board 220 may further include a substrate 222 and a solder resist layer 223.

The structure and function of the substrate 222 and the solder resist layer 223 are similar to those of the prior art and will not be described in detail herein.

In the embodiment of the present application, the electrical connection component 230 can be used to implement electrical connection between the plurality of first pads 211 and the plurality of second pads 221 . That is, the electrical connection assembly can be used to effect the transfer of electrical signals between the chip and the circuit board.

It should be understood that, in the embodiment of the present application, the plurality of first pads 211 may be part or all of all the pads included in the chip, and similarly, the plurality of second pads 221 may be circuits. Part or all of all the pads included in the board, that is, not necessarily all of the pads of the chip are to be electrically connected to all the pads of the board, which pads of the chip and the board Which pads need to be electrically connected can be determined according to the functions that the module structure needs to implement. The plurality of first pads 211 and the plurality of second pads 221 herein may be two sets of pads that require electrical connection to be established.

It should be understood that the number and location of the electrical connection assemblies 230 shown in FIG. 2 are merely examples and are not limiting, and the number of the electrical connection assemblies 230 may be one, for example, only one first pad needs to follow a second pad. The electrical connection may be established, or may be multiple. For example, a plurality of first pads may be electrically connected to the plurality of second pads, and the like.

Optionally, in the embodiment of the present application, the electrical connection component 230 may be a metal bump or a conductive particle.

The metal bumps and the conductive particles can be used to realize the transmission of electrical signals between the chip and the circuit board. It should be understood that those skilled in the art can select other types of electrical connection materials according to actual needs, as long as they can be realized. The electrical connection between the pad of the chip and the pad of the circuit board is sufficient. The embodiment of the present application does not specifically limit the specific form of the electrical connection component.

Optionally, in some specific embodiments, the metal bumps may be gold bumps, copper bumps, or tin bumps.

That is, when the electrical connection component is a metal bump, the metal bump may be a gold bump, a copper bump or a tin bump, and those skilled in the art may select other materials according to actual needs. The metal bumps are provided as long as the metal bumps can transmit electrical signals between the chip and the circuit board.

When the electrical connection component is a metal bump, on the other hand, the electrical connection component can not only transfer the electrical signal between the chip and the circuit board, but also can fix the chip and the circuit board. The role of the relative movement of the chip and the circuit board is prevented, that is to say, the electrical connection component can not only realize the electrical connection between the chip and the circuit board, but also realize the physical connection between the chip and the circuit board.

Optionally, in some specific embodiments, the conductive particles may be a metal powder, a metal ball or a polymer plastic ball coated with a metal surface.

That is, when the electrical connection component is a conductive particle, the conductive particle may be a metal powder, a metal ball or a polymer plastic ball coated with a metal surface, etc., and those skilled in the art may also select according to actual needs. Other types of conductive particles are provided as long as the conductive particles are capable of transmitting electrical signals between the chip and the board.

If conductive particles are used as the medium for signal transmission between the chip and the circuit board, the processing temperature required during the processing of the module is low, thereby reducing the influence of high temperature on the warpage of the chip, and further Can improve the reliability of the module structure.

It should be noted that, in the embodiment of the present application, the first surface 212 of the chip and the second surface 224 of the circuit board may be connected to the first surface 212 of the chip and the second surface of the circuit board. 224 is directly or indirectly connected, for example, the first surface 212 of the chip may be connected to the second surface 224 of the circuit board by the electrical connection assembly 230 described above, or the first surface 212 of the chip may pass In addition to the electrical connection assembly 230 being coupled to the second surface 224 of the circuit board, the first surface 212 of the chip may also be coupled to the circuit board by a first connector (eg, a gel or film) The second surface 224 is connected. That is, the first connector is used to implement physical connection between the first surface 212 of the chip and the second surface 224 of the circuit board, or the first connector may be used to fix the chip and the Said circuit board.

Similarly, the connection of the cover plate and the first surface 225 of the circuit board may mean that the cover plate and the first surface 225 of the circuit board are directly or indirectly connected, for example, the first surface of the circuit board. 225 may be coupled to the cover plate 240 by a second connector (eg, a glue or a film, etc.), ie, the second connector may be used to implement the physical properties of the first surface 225 of the circuit board and the cover plate 240 Alternatively, the second connector may be used to secure the circuit board and the cover plate 240.

It should be noted that, in general, the upper and lower surfaces of the cover plate are the same, that is, the upper surface can be used as the lower surface, and the lower surface can also be used as the upper surface. Therefore, the first surface 225 and the cover plate of the circuit board are not particularly limited herein. Which surface is connected.

Optionally, in the embodiment of the present application, the module structure 200 may further include:

The physical connection assembly 250 is configured to connect the first surface 212 of the chip and the second surface 224 of the circuit board, and to connect the first surface 225 of the circuit board and the cover plate 240.

The physical connection assembly 250 herein may correspond to the first connector and the second connector described above, in particular, the physical connection assembly 250 is for physically connecting the chip and the circuit board, and physically connecting the circuit board And the cover plate, that is, the physical connection component may be located between the chip and the circuit board, and between the circuit board and the cover plate, functioning as a fixing and insulating, that is, the physical connection component may be a chip, a circuit board, and The cover plates are fixed together to reduce the relative movement between the structures, and at the same time to isolate the electrical signal transmission between the two structural members. In contrast to the electrical connection assembly, the electrical connection assembly is for transmitting electrical signals, and no electrical signals are transmitted in the physical connection assembly.

It should be understood that, in the embodiment of the present application, the physical connection component 250 is generally a non-conductive medium, and the non-conductive medium is used to facilitate stable transmission of the sensing signal. Optionally, the physical connection component may adopt the following adhesive material. At least one of: Thermal Compression Non-Conductive Paste (TCNCP), Thermal Compression Non-Conductive Film (TCNCF), Die Attach Film (DAF) or Silver glue (Epoxy) and so on.

Optionally, in the embodiment of the present application, the physical connection component has a dielectric constant greater than 3.

The use of a non-conductive medium having a dielectric constant greater than 3 is advantageous for ensuring stable transmission of the sensing signal in the physical connection component, thereby improving the reliability of fingerprint recognition.

Optionally, if the number of the electrical connection components is multiple, the physical connection component between the chip and the circuit board may function to insulate and physically fix adjacent electrical connection components.

Optionally, in the embodiment of the present application, the material of the cover plate 240 may be organic glass, glass, ceramic or sapphire.

Optionally, the cover plate 240 may be made of other materials than the above materials. The material used in the cover plate 240 in the embodiment of the present application is not particularly limited.

3 is a schematic diagram of a longitudinal section of a module structure 200 according to another embodiment of the present application.

Different from the module structure shown in FIG. 2, the circuit board 220 in the module structure 200 shown in FIG. 3 is a hollow structure, and the hollow structure here may be a hollow structure, that is, the circuit of the embodiment of the present application. Part of the area of the board 220 can be hollowed out before the module is processed.

Optionally, in the embodiment of the present application, the hollow structure may be filled with a colloid (an example of a physical connection component), and the dielectric constant of the colloid is set to a large value, thereby ensuring that the sensing signal is in the colloid. The steady delivery.

Figure 4 is a schematic illustration of a cross-section of a cross-section of the module structure from a circuit board layer. As shown in FIG. 4, the hollow structure of the circuit board can be filled with a colloid (an example of the physical connection assembly 250).

It should be noted that the module structure according to the embodiment of the present application is described in detail above with reference to FIG. 2 to FIG. 4 . However, the structures shown in FIG. 2 to FIG. 4 are only a few possible implementations of the embodiments of the present application, and should not be construed as limiting the present application. The embodiments of the present application are not limited thereto.

Hereinafter, a module processing method for explaining an embodiment of the present application will be described with reference to FIG.

It should be understood that the module processing method shown in the following is only a possible implementation manner for implementing the module structure of the embodiment of the present application, and should not be limited to the present application. The processing method prepares the above module structure.

It should be understood that FIG. 5 shows detailed steps or operations of the module processing method of the embodiment of the present application, but the steps or operations are merely examples, and other operations of the present application or various operations of FIG. 5 may be performed. The deformation. Moreover, the various steps in FIG. 5 may be performed in a different order than that presented in FIG. 5, and it is possible that not all operations in FIG. 5 are to be performed.

As shown in FIG. 5, the method 300 includes the following:

S301: mounting a cover on a carrier;

The carrier plate may be glass, ceramic, metal or other material having similar functions.

Those skilled in the art can understand that the carrier board can be understood as a carrier that plays a supporting role in the processing of the module. It is not a module structure, only used for the processing process, and can be removed after completing the corresponding steps. board.

Optionally, the carrier film can be selectively coated with a structural film or a functional film, for example, an adhesive layer, a sacrificial layer, a buffer layer, and a dielectric film. (dielectric layer) and so on. More specifically, the adhesive layer film and the sacrificial layer film may both be an ultraviolet-curable (Ultra-Violet, UV) glue, a light-to-heat conversion (LTHC) film, or have similar functions and are wafer level. Process compatible materials. The dielectric layer film may be polyimide (PI), polybenzoxazole (PBO), Benzocyclobutene (BCB), an epoxy resin supplied by Ajinomoto Co., Ltd. AJinomoto Buildup Film (ABF), Solder Resist Film (SR), etc.

S302, attaching the first surface of the circuit board to the cover.

That is, the connection of the first surface of the circuit board to the cover plate is achieved.

Optionally, the method 300 further includes:

A physical connection assembly is prepared on the cover.

Optionally, the physical connection component may be an adhesive material. If a side of the cover plate and the carrier board is referred to as a first surface, a side of the cover plate connected to the first surface 225 of the circuit board is referred to as a first The two surfaces, then, preparing the physical connection component on the cover plate may specifically include coating an adhesive material on the second surface of the cover plate 240, and further, the circuit board may be A surface 225 is secured to the second surface of the cover.

Alternatively, the physical connection component may employ at least one of the following adhesive materials: TCNCP, TCNCF, DAF or Epoxy, and the like.

Further, in S303, a first surface of the chip is mounted on the second surface of the circuit board, wherein the first surface of the chip is provided with a plurality of first pads, the circuit board A plurality of second pads are disposed on the second surface.

That is, the connection of the first surface of the chip to the second surface of the circuit board is achieved.

Optionally, the method 300 further includes:

A physical connection assembly is fabricated on the second surface of the circuit board.

Similar to the execution of S312, an adhesive material can be applied to the second surface of the circuit board, and further, the first surface 212 of the chip can be secured to the second surface 224 of the circuit board by the adhesive material. Further, the method 300 may further include:

S304, preparing an electrical connection component between the first surface of the chip and the second surface of the circuit board, and electrically connecting the plurality of first pads and the plurality of second pads through the electrical connection component.

Alternatively, the electrical connection component may be the structure described in the foregoing embodiments, for example, metal bumps or conductive particles or the like.

Optionally, the process of preparing the physical connection component on the second surface of the circuit board may be performed after the S304, or may also be performed simultaneously with the S304, for example, if the electrical connection component is a conductive particle, The conductive particles may be prepared together with a physical connection component, and at the same time, electrical connection and physical connection between the chip and the circuit board are realized, or, if the electrical connection component is a metal bump, after the metal bump is prepared, The physical connection component is filled between the chip and the circuit board, and between the gaps of the metal bumps, which is not limited by the embodiment of the present application.

Therefore, in the module processing method of the embodiment of the present application, in the process of module processing, the cover is placed At the bottom of the module structure, it functions as an existing reinforcing structure. In actual use, the cover plate is placed at the top of the module structure to function as an existing cover plate. Therefore, the present application The cover plate in the module structure of the embodiment has the functions of reinforcing structure and cover plate, and the module structure is simplified, which is beneficial to reducing the thickness of the module structure.

It should be understood that the module processing method of the embodiment of the present application may also be other alternatives or equivalent modifications of the various operations in the above steps. The embodiment of the present application does not limit the operation process or operation mode adopted in each step.

It should also be understood that the various embodiments of the module processing method enumerated above may be performed by a robot or a numerically controlled machining method, and the device software or process for executing the module processing method may be executed by executing computer program code stored in the memory. Perform the above module processing method.

The embodiment of the present application provides a terminal device. FIG. 6 is a schematic structural diagram of a terminal device 400 according to an embodiment of the present application. As shown in FIG. 6, the terminal device may include a module structure 401. The structure 401 can be the module structure 200 shown in FIG. 2 to FIG. 4 or the module structure prepared according to the module processing method 300 described in FIG.

By way of example and not limitation, the terminal device 400 may be a mobile phone, a tablet computer, a notebook computer, a desktop computer, an in-vehicle electronic device, or a wearable smart device.

It should be understood that, in the various embodiments of the present application, the size of the sequence numbers of the foregoing processes does not mean the order of execution sequence, and the order of execution of each process should be determined by its function and internal logic, and should not be applied to the embodiment of the present application. The implementation process constitutes any limitation.

The foregoing is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present application. It should be covered by the scope of protection of this application. Therefore, the scope of protection of the present application should be determined by the scope of the claims.

Claims (17)

  1. A module structure, comprising:
    a chip, the first surface of the chip is provided with a plurality of first pads;
    a circuit board having a plurality of second pads disposed on a second surface thereof, the first surface of the chip being coupled to the second surface of the circuit board;
    An electrical connection assembly for electrically connecting the plurality of first pads and the plurality of second pads;
    a cover plate, the cover plate being coupled to the first surface of the circuit board.
  2. The module structure according to claim 1, wherein the circuit board is a hollow structure.
  3. The module structure according to claim 1 or 2, wherein the module structure further comprises:
    a physical connection assembly for connecting a first surface of the chip and a second surface of the circuit board, and a first surface and the cover plate connecting the circuit board.
  4. The module structure according to claim 3, wherein the physical connection component is a non-conductive material.
  5. The module structure according to claim 4, wherein the physical connection component has a dielectric constant greater than three.
  6. The module structure according to any one of claims 1 to 5, wherein the circuit board is a flexible circuit board FPC.
  7. The module structure according to any one of claims 1 to 6, wherein the electrical connection component is a metal bump or a conductive particle.
  8. The module structure according to claim 7, wherein the metal bumps are gold bumps, copper bumps or tin bumps.
  9. The module structure according to claim 7, wherein the conductive particles are metal powder, metal balls or polymer plastic balls coated with metal on the surface.
  10. The module structure according to any one of claims 1 to 9, wherein the cover material is made of plexiglass, glass, ceramic or sapphire.
  11. The module structure according to any one of claims 1 to 10, wherein the chip is a fingerprint sensing chip.
  12. A module processing method, comprising:
    Mounting a cover on the carrier board;
    Mounting a first surface of the circuit board on the cover plate;
    Mounting a first surface of the chip on the second surface of the circuit board, wherein the first surface of the chip is provided with a plurality of first pads, and the second surface of the circuit board is disposed Second pad;
    An electrical connection assembly is fabricated between the first surface of the chip and the second surface of the circuit board, the plurality of first pads and the plurality of second pads being electrically connected by the electrical connection assembly.
  13. The method of processing a module according to claim 12, wherein the method further comprises:
    A physical connection assembly is prepared on the cover.
  14. The module processing method according to claim 12 or 13, wherein the method further comprises:
    A physical connection assembly is fabricated on the second surface of the circuit board.
  15. The method of processing a module according to any one of claims 12 to 14, wherein before the first surface of the circuit board is mounted on the cover, the method further comprises:
    The partial area on the circuit board is hollowed out.
  16. A terminal device, comprising:
    A module structure according to any one of claims 1 to 11.
  17. A terminal device, comprising:
    A module structure prepared by the module processing method according to any one of claims 12 to 15.
PCT/CN2017/106910 2017-10-19 2017-10-19 Module structure, module processing method, and terminal device WO2019075698A1 (en)

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PCT/CN2017/106910 WO2019075698A1 (en) 2017-10-19 2017-10-19 Module structure, module processing method, and terminal device

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CN104582263A (en) * 2015-01-23 2015-04-29 京东方科技集团股份有限公司 Flexible printed circuit board, assembling method thereof and display device
CN105046190A (en) * 2015-05-08 2015-11-11 苏州迈瑞微电子有限公司 Fingerprint identification module
CN106295589A (en) * 2016-08-16 2017-01-04 广东欧珀移动通信有限公司 Fingerprint module and terminal unit and the processing method of this fingerprint module with it

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CN101959010A (en) * 2009-07-17 2011-01-26 致伸科技股份有限公司 Camera module and assembly method thereof
CN102821239A (en) * 2012-09-14 2012-12-12 信利光电(汕尾)有限公司 Camera module
CN104582263A (en) * 2015-01-23 2015-04-29 京东方科技集团股份有限公司 Flexible printed circuit board, assembling method thereof and display device
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