WO2019242771A1

WO2019242771A1 - Molded photosensitive assembly, camera module, and manufacturing method therefor, and electronic device

Info

Publication number: WO2019242771A1
Application number: PCT/CN2019/092439
Authority: WO
Inventors: 邹新苗; 黄桢; 方银丽; 姜俊彬; 陈佳炜; 许晨祥
Original assignee: 宁波舜宇光电信息有限公司
Priority date: 2018-06-22
Filing date: 2019-06-22
Publication date: 2019-12-26

Abstract

Provided are a molded photosensitive assembly, a camera module, and a manufacturing method therefor, and an electronic device. The molded photosensitive assembly and an optical lens are assembled into the camera module, and the molded photosensitive assembly comprises a circuit board, a photosensitive element, and a molded base. The photosensitive element is conductively connected to the circuit board. The molded base is arranged on the circuit board and provides a flat chip-mounting surface and a flat camera-mounting surface, wherein the photosensitive element is correspondingly mounted on the chip-mounting surface of the molded base, and the camera-mounting surface of the molded base enables the optical lens to be correspondingly mounted, so as to position the optical lens in a photo-sensing path of the photosensitive element.

Description

Molded photosensitive component and camera module, manufacturing method thereof, and electronic equipment

Technical field

The present invention relates to the field of optical imaging, and in particular, to a molded photosensitive component, a camera module, a manufacturing method thereof, and an electronic device.

Background technique

In recent years, electronic products, smart devices, etc. have been increasingly developed in the direction of thinness, high performance, and this development trend of electronic products and smart devices is one of the standard configurations for electronic products and smart devices. Both the size and imaging capabilities of the group have put forward more demanding requirements.

In the assembly process of the current camera module, the most difficult and difficult problem is how to find a feasible and effective solution based on controlling the assembly cost of the camera module to solve the problems caused by circuit board deformation. The pixels of the camera module are blurred and the quality is not good.

Specifically, in the existing assembling process of the camera module, usually the photosensitive chip and the lens holder are directly attached to the circuit board, and then the lens is mounted on the lens holder, and the sensor and the lens need to be adjusted. The relative position between the photo sensor and the optical axis of the lens is perpendicular to each other, thereby ensuring that the camera module has good imaging quality.

However, during the assembly process of the camera module, multiple baking and heating steps will be performed. Since the circuit board has a large deformation after being heated, that is, the circuit board is prone to warp after being heated, which makes the circuit board The photosensitive surface of the photosensitive chip and the mounting surface of the lens holder are not parallel to each other. Therefore, it will be difficult to keep the photosensitive surface of the photosensitive chip and the optical axis of the lens perpendicular to each other, which will directly affect the camera module. Image quality.

In addition, as the imaging function of the camera module becomes stronger and stronger, that is, the performance of the lens and the performance of the photosensitive chip are continuously upgraded, this requires vertical accuracy between the optical axis of the lens and the photosensitive surface of the photosensitive chip. Higher and higher, therefore, once the photosensitive chip or the lens is tilted, it will seriously affect the imaging quality of the camera module and even cause the camera module to be scrapped as a whole.

Summary of the Invention

An object of the present invention is to provide a molded photosensitive component, a camera module, a method of manufacturing the same, and an electronic device, wherein a molded base of the molded photosensitive component can be stably maintained to be mounted on the mold. A light-sensitive surface of a light-sensitive element on a chip mounting surface of the base and an optical axis of an optical lens mounted on a lens-mounted surface of the molded base are perpendicular to each other, thereby ensuring that the camera module has a good Image quality.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a manufacturing method thereof, and an electronic device, wherein the molded base can prevent the chip mounting surface of the molded base from being mounted on the molded base. The photosensitive element is tilted or warped to ensure that the camera module has good imaging quality.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In some embodiments of the present invention, a circuit board of the molded photosensitive component is molded by a molding process. The molding base is integrally formed thereon to provide the chip mounting surface and the lens mounting surface which are more flat and stable through the molding base.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, the molded base can hold the chip mounting surface and the chip mounting surface. The lens mounting surfaces are parallel to ensure that the camera module has good imaging quality.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, the molded base can enhance the deformation resistance of the circuit board. Ability to prevent the circuit board from deforming due to heat.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, the molded base has an integrated structure, which is beneficial for maintaining the structure. The chip mounting surface and the lens mounting surface of the molded base are parallel to each other, so as to ensure that the photosensitive surface of the photosensitive element mounted on the chip mounting surface and the lens mounting surface are mounted on the lens mounting surface. The optical axes of the optical lens are perpendicular to each other.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, the molded base has an integrated structure, which is beneficial for maintaining the structure. The chip mounting surface and the lens mounting surface of the molding base are parallel to each other, so that the relative position between the optical lens and the photosensitive element is adjusted during assembly, so that the optical axis of the optical lens The photosensitive surface of the photosensitive element is vertical.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In some embodiments of the present invention, a thickness of a chip mounting portion of the molded base is described. The thickness of a lens mounting portion of the molded base is smaller than the distance between the photosensitive element and the circuit board, thereby reducing the height of the camera module.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, a connecting portion of the molded base can increase the chip. The strength of the connection between the mounting portion and the lens mounting portion further enhances the overall strength and deformation resistance of the molded base.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method of manufacturing the same, and an electronic device, wherein in some embodiments of the present invention, the chip mounting portion and the lens mounting portion are disposed at intervals. A set space of the molding base is formed between the chip mounting portion and the lens mounting portion on the circuit board, and a set of circuit board connecting members of the circuit board corresponds to the Reserve space to prevent the molded base from covering the circuit board connector, so as to facilitate electrical communication between the photosensitive element and the circuit board.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method of manufacturing the same, and an electronic device. In some embodiments of the present invention, the chip mounting portion, The lens mounting portion and the connection portion are simultaneously formed in one molding, that is, the molding base is integrally molded in the same mold to ensure the chip mounting portion and the lens mounting portion The top surface maintains good consistency and parallelism.

Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, the chip mounting portion of the molded base is provided with at least A separation gap is used to reduce the stress on the chip mounting portion of the molding base to prevent the chip mounting portion from being deformed due to thermal deformation of the circuit board.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, the separation gap separates the chip mounting portion into at least two daughter chips. The mounting portion is to disperse the stress received by the chip mounting portion to prevent the chip mounting portion from being deformed due to the concentrated stress.

Another object of the present invention is to provide a molded photosensitive component and a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, the chip mounting portion of the molded base is provided with at least An accommodating groove for accommodating a fluid-based adhesive material, so that the chip mounting surface of the module base can directly support the photosensitive element to ensure that the photosensitive surface of the photosensitive element has a high levelness degree.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In some embodiments of the present invention, the receiving groove is located at the center of the chip mounting portion to optimize The fixing effect of the adhesive material accommodated in the accommodating groove on the photosensitive element to prevent the photosensitive element from tilting due to uneven force.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, each of the accommodating grooves is provided in a “back” shape, and The center of the chip mounting portion is still the accommodating groove, so as to reduce the amount of the adhesive material while still maintaining a good fixing effect.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, each of the accommodating grooves is disposed in a circumferentially arranged manner. The chip mounting portion causes the photosensitive element to receive a uniform adhesive force to prevent the photosensitive element from being tilted due to uneven force.

Another object of the present invention is to provide a molded photosensitive component, a camera module, a method for manufacturing the same, and an electronic device. In some embodiments of the present invention, the receiving groove is penetratingly provided in the chip mounting portion. A through-hole groove is formed in the chip mounting portion, so that during the molding process, the receiving groove corresponds to an indenter of a molding die, so that the indenter of the molding die can be used in the molding process. The circuit board is medium-pressed to prevent the circuit board from being deformed, thereby improving the flatness of the circuit board and the chip mounting portion.

In order to achieve the above-mentioned at least one object of the invention or other objects and advantages, the present invention provides a molded photosensitive component for assembling an optical lens into a camera module, including:

A circuit board

A photosensitive element, wherein the photosensitive element is electrically connected to the circuit board; and

A molding base, wherein the molding base is formed on the circuit board in a molding manner, and provides a flat chip mounting surface and a flat lens mounting surface, wherein the photosensitive elements are correspondingly The chip mounting surface is mounted on the molding base, and the lens mounting surface of the molding base is used for correspondingly mounting the optical lens so that the optical lens is located on a light sensing path of the photosensitive element.

In some embodiments of the present invention, the chip mounting surface and the lens mounting surface provided by the molding base are parallel to each other.

In some embodiments of the present invention, the molding base includes a chip mounting portion having the chip mounting surface and a lens mounting portion having the lens mounting surface, and a reserved space is provided, wherein A lens mounting portion is located around the chip mounting portion, and the reserved space is located between the chip mounting portion and the lens mounting portion.

In some embodiments of the present invention, the circuit board is provided with a chip molding area, a lens molding area, a non-molding area, and at least one set of circuit board connectors, wherein the lens molding area is located on the circuit board. Around the die-molded area, the non-molded area is located between the die-molded area and the lens molded area, and each group of the circuit board connectors is disposed on the non-mold of the circuit board. A plastic area, after the circuit board is molded, the chip mounting portion of the mold base covers the chip mold area of the circuit board, and the mold base of the mold base The lens mounting portion covers the lens molding area of the circuit board, and the reserved space of the molding base corresponds to the non-molding area of the circuit board.

In some embodiments of the present invention, the molding base further includes at least one connection portion, wherein each of the connection portions integrally extends from the lens mounting portion to the chip mounting portion to form an integrated structure. Of the molded base.

In some embodiments of the present invention, the circuit board is further provided with a connection molding area, wherein the connection molding area is located between the lens molding area and the chip molding area and communicates with the lens A molding area and the chip molding area, after the circuit board is molded, the connection portion of the molding base is covered by the connection molding area of the circuit board to pass The connecting portion combines the lens mounting portion and the chip mounting portion into a single body.

In some embodiments of the present invention, the connection portion has a lens connection end and a chip connection end, wherein the lens connection end of the connection portion is integrally connected with the lens mounting portion, and the connection portion The chip connection end is integrally connected with the chip mounting portion, wherein the connection portion gradually extends from the lens connection end to the chip connection end.

In some embodiments of the present invention, a thickness of the chip mounting portion is smaller than a thickness of the lens mounting portion.

In some embodiments of the present invention, the chip mounting portion of the molding base includes at least two sub chip mounting portions spaced apart from each other, and a separation gap is formed between adjacent sub chip mounting portions, Each of the sub-chip mounting portions is integrally connected to the lens mounting portion through a corresponding one of the connection portions.

In some embodiments of the present invention, the separation gap is provided in a "-" shape to separate the chip mounting portion into two sub-chip mounting portions.

In some embodiments of the present invention, the separation gap is provided in a “T” shape to separate the chip mounting portion into four sub-chip mounting portions.

In some embodiments of the present invention, the four sub-chip mounting portions are two by two, and each group of the sub-chip mounting portions is integrally connected to the lens mounting portion through the same connection portion.

In some embodiments of the present invention, the molded photosensitive component further includes an adhesive layer, wherein the chip mounting portion of the molded base includes at least one accommodating groove, and each of the accommodating grooves is free to The chip mounting surface is recessed downward to form a groove for receiving the adhesive layer, so that the photosensitive element is fixedly mounted on the chip mounting surface of the chip mounting portion through the adhesive layer.

In some embodiments of the present invention, each of the accommodating grooves is arranged on the chip mounting portion in an array arrangement.

In some embodiments of the present invention, each of the accommodating grooves is arranged on the chip mounting portion in a circumferential arrangement. .

In some embodiments of the present invention, each of the accommodating grooves extends downward from the chip mounting surface to the circuit board, so as to form the through-hole type grooves, so as to expose the photosensitive layer through the adhesive layer. The component, the chip mounting portion and the circuit board are bonded together.

In some embodiments of the present invention, each of the accommodating grooves is provided in a "back" shape to separate the chip mounting portion into two sub-chip mounting portions through the accommodating groove, wherein the two sub-chip mounting portions are integrally connected To form the chip mounting portion having an integrated structure.

In some embodiments of the present invention, the molded photosensitive component further includes a group of electronic components, wherein the electronic components are spacedly attached to the lens molding area of the circuit board to pass through the lens molding area. The lens mounting portion of the molded base covers the electronic component.

In some embodiments of the present invention, the molded photosensitive component further includes at least one set of leads, wherein the photosensitive element includes a photosensitive region, a non-photosensitive region, and at least one chip connector, wherein the non-photosensitive region Is located around the photosensitive area, and each group of the chip connectors is respectively disposed in the non-photosensitive area of the photosensitive element to connect the chip connector with the corresponding circuit board through the lead The parts are connected to the ground.

According to another aspect of the present invention, the present invention further provides a camera module, including:

An optical lens; and

In the above-mentioned molded photosensitive component, wherein the optical lens is correspondingly mounted on the lens mounting surface of the molded photosensitive component, wherein the optical axis of the optical lens is perpendicular to the photosensitive surface of the photosensitive element.

According to another aspect of the present invention, the present invention further provides an electronic device, including:

An electronic device body; and

At least one camera module, wherein the camera module is disposed on the electronic device body for acquiring an image, and the camera module is the camera module according to claim 20.

According to another aspect of the present invention, the present invention further provides a method for manufacturing a molded photosensitive component, including steps:

Forming a molding base on a circuit board by a molding process, wherein the molding base provides a flat chip mounting surface and a flat lens mounting surface;

Mounting a photosensitive element to the chip mounting surface of the molding base; and

The photosensitive element and the circuit board are connected in a conductive manner to form a molded photosensitive element.

In some embodiments of the present invention, the molding base is formed on a circuit board by a molding process, wherein the molding base provides a flat chip mounting surface and a flat lens mounting surface. Steps, including steps:

Placing the circuit board in a second mold of a forming mold;

Clamping a first mold and the second mold of the molding mold to form a molding space of the molding mold between the first mold and the second mold; and

A molding material is added to the molding space of the molding mold to form the molding base on the circuit board integrally after the molding material is cured.

In some embodiments of the present invention, a first mold and a second mold of the forming mold are clamped to form a mold of the forming mold between the first mold and the second mold. A step of forming a space, including the steps:

Pressing on a non-molding area of the circuit board by a pressing surface of the first mold;

Correspondingly forming a chip mounting portion molding space in a chip molding area of the circuit board;

Correspondingly forming a lens mounting portion molding space in a lens molding area of the circuit board, wherein the non-molding area is located between the chip molding area and the lens molding area; and

A connection portion molding space is correspondingly formed in a connection molding area of the circuit board, wherein the connection portion molding space communicates the chip mounting portion molding space and the lens mounting portion molding space to form an integrated type. The molding space of the structure.

In some embodiments of the present invention, the addition of a molding material to the molding space of the molding die to form the molding base on the circuit board integrally after the molding material is cured. Steps, including steps:

Forming a lens mounting portion covering the lens molding area of the circuit board in the lens mounting portion forming space, so that a top surface of the lens mounting portion forms the lens mounting surface;

Forming a chip mounting portion covering the chip molding area of the circuit board in the chip mounting portion molding space so that a top surface of the chip mounting portion forms the chip mounting surface; and

Forming a connection portion covering the connection molding area of the circuit board in the connection portion molding space, wherein the connection portion is integrally connected to the chip mounting portion and the lens mounting portion, To form the molded base having an integrated structure.

In some embodiments of the present invention, the method for manufacturing a molded photosensitive component further includes steps:

By a pressing head of the first mold, it is pressed against a central part of the chip molding area of the circuit board.

After the molding material is cured, a receiving groove is formed in the chip mounting portion.

After the molding material is cured, a separation gap is formed in the chip mounting portion, wherein the separation gap separates the chip mounting portion into at least two sub-chip mounting portions spaced apart from each other.

Pouring the molding material into the molding space of the lens mounting portion of the molding space; and

Through the connecting portion molding space, the molding material is guided from the lens mounting portion molding space into the chip mounting portion molding space so that the molding material fills the molding space.

In some embodiments of the present invention, the chip mounting surface and the lens mounting surface are parallel to each other.

In some embodiments of the present invention, in the method for manufacturing a molded photosensitive member, the chip mounting surface is lower than the lens mounting surface.

According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module, including steps:

Mounting a photosensitive element to the chip mounting surface of the molding base;

Conductively connecting the photosensitive element and the circuit board to make a molded photosensitive component; and

An optical lens is mounted on the lens mounting surface of the molding base, and an optical axis of the optical lens is perpendicular to the photosensitive surface of the photosensitive element to form a camera module.

Through the understanding of the following description and the accompanying drawings, further objects and advantages of the present invention will be fully realized.

These and other objects, features, and advantages of the present invention are fully embodied by the following detailed description, drawings, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view of a camera module according to a first preferred embodiment of the present invention.

FIG. 2 is a schematic perspective sectional view of the camera module according to the first preferred embodiment of the present invention.

3 is a schematic perspective view of a molded photosensitive component of the camera module according to the first preferred embodiment of the present invention.

4A to 4C are schematic diagrams of manufacturing steps of the molded photosensitive member according to the above-mentioned first preferred embodiment of the present invention.

FIG. 5 is a first modified embodiment of the molded photosensitive member according to the first preferred embodiment of the present invention.

6A and 6B are a second modified embodiment of the molded photosensitive member according to the above-mentioned first preferred embodiment of the present invention.

FIG. 7 is a schematic flowchart of a method for manufacturing the camera module according to the first preferred embodiment of the present invention.

FIG. 8 is a schematic perspective view of a molded photosensitive component according to a second preferred embodiment of the present invention.

FIG. 9 is a first modified embodiment of the molded photosensitive member according to the above-mentioned second preferred embodiment of the present invention.

FIG. 10 is a second modified embodiment of the molded photosensitive member according to the second preferred embodiment of the present invention.

FIG. 11A is a schematic perspective view of a molded photosensitive component according to a third preferred embodiment of the present invention.

11B is a schematic cross-sectional view of the molded photosensitive member according to the third preferred embodiment of the present invention.

12A and 12B are a first modified embodiment of the molded photosensitive member according to the third preferred embodiment of the present invention.

13A to 13C are a second modified embodiment of the molded photosensitive member according to the third preferred embodiment of the present invention.

14A and 14B are a third modified embodiment of the molded photosensitive member according to the above-mentioned third preferred embodiment of the present invention.

15A and 15B are schematic perspective views of an electronic device with the camera module according to the present invention.

detailed description

The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are merely examples, and those skilled in the art can think of other obvious variations. The basic principles of the present invention defined in the following description can be applied to other embodiments, modifications, improvements, equivalents, and other technical solutions without departing from the spirit and scope of the invention.

Those skilled in the art should understand that in the disclosure of the present invention, the terms "vertical", "horizontal", "up", "down", "front", "rear", "left", "right", " The orientations or positional relationships indicated by "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like are based on the orientations or positional relationships shown in the drawings, which are merely for the convenience of describing the present invention and The description is simplified, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, so the above terms should not be construed as limiting the invention.

In the present invention, the term "a" in the claims and the description should be understood as "one or more", that is, in one embodiment, the number of one element may be one, and in other embodiments, the number of the element Can be multiple. Unless the number of the element is explicitly indicated in the disclosure of the present invention, the term "a" is not to be understood as being unique or singular, and the term "a" is not to be understood as a limitation on the number.

In the description of the present invention, it should be understood that the terms “first” and “second” are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that unless otherwise specified and limited, "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. ; It can be mechanical or electrical connection; it can be direct connection or indirect connection through media. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the description of this specification, the description with reference to the terms “one embodiment”, “some embodiments”, “examples”, “specific examples”, or “some examples” and the like means specific features described in conjunction with the embodiments or examples , Structures, materials, or features are included in at least one embodiment or example of the invention. In this specification, the schematic expressions of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. In addition, without any contradiction, those skilled in the art may combine and combine different embodiments or examples and features of the different embodiments or examples described in this specification.

Referring to FIGS. 1 to 7 of the accompanying drawings of the present invention, a camera module 1 according to a first preferred embodiment of the present invention is illustrated. The camera module 1 includes at least an optical lens 10 and a mold.塑 sensitizing component 20. As shown in FIG. 1 to FIG. 4C, the molded photosensitive assembly 20 includes a circuit board 21, at least one photosensitive element 22, and a molded base 23, wherein each of the photosensitive elements 22 is separately connected to the circuit board 21. The connection is conductive, wherein the molding base 23 is integrally formed on the circuit board 21 in a molding manner, and provides at least one chip mounting surface 2301 and at least one lens mounting surface 2302 with high flatness. Each of the photosensitive elements 22 is mounted on a corresponding chip mounting surface 2301, each of the optical lenses 10 is mounted on a corresponding lens mounting surface 2302, and each of the optical lenses 10 is positioned on a corresponding The photosensitive path of the photosensitive element 22.

It should be understood that the molding base 23 is manufactured by a molding process, that is, by injecting a molding material that is melted into a liquid by heating into a mold, and after cooling, it is formed into a fixed shape corresponding to the mold. As shown in FIGS. 4A to 4C, since the mold used in the molding process has a high flatness, the surface of the molding base 23 formed in the mold also has a high flatness. Therefore, the The molding base 23 can provide the chip mounting surface 2301 which is more flat, so that the photosensitive element 22 can be smoothly mounted on the chip mounting surface 2301. At the same time, since the molding base 23 has higher structural strength and stronger heat resistance than the circuit board, the molding base 23 is formed by a molding process and combined with the molding of the circuit board 21 The base 23 can increase the structural strength of the molded photosensitive member 20 and can prevent it from being deformed by being heated. Therefore, the photosensitive member 23 mounted on the chip mounting surface 2301 can be effectively prevented from being inclined or warped. .

Preferably, as shown in FIGS. 2 and 4C, each of the chip mounting surfaces 2301 and the corresponding lens mounting surface 2302 are parallel to each other, so that when the photosensitive element 22 and the optical lens 10 are mounted on the mold After being mounted on the plastic base 23, it is more helpful to adjust the photosensitive elements 22 and the optical lens 10 so as to calibrate the photosensitive surface 220 of each of the photosensitive elements 22 and the optical axis 100 of the corresponding optical lens 10, The photosensitive surface 220 of each of the photosensitive elements 22 is kept perpendicular to the optical axis 100 of the corresponding optical lens 10 to further ensure that the camera module 1 has good imaging quality. It should be understood that the shape and size of each of the chip mounting surfaces 2301 can be designed and planned according to the shape and size of the photosensitive element 22, and accordingly, the shape and size of each of the lens mounting surfaces 2302 can be based on the The horizontal shape and size of the lens barrel of the optical lens 10 are designed and planned. For the different photosensitive elements 22 and the optical lens 10, the shape and size of the chip mounting surface 2301 and the lens mounting surface 2302 are also different. It is not the same and will not be described in detail in the present invention.

It is worth mentioning that although the camera module 1 includes only one of the optical lens 10 and one of the photosensitive elements 22 as examples in the accompanying drawings 1 to 7 and the following description, the invention The features and advantages of the camera module 1 will be described. Those skilled in the art can understand that the camera module 1 disclosed in FIGS. 1 to 7 and the following description is merely an example, and it does not constitute an embodiment of the present invention. Restrictions on content and scope. For example, in other examples of the camera module, the number of the optical lens 10 may be more than one, and accordingly, the number of the photosensitive elements 22 may be more than one to form an array camera. Module. In addition, the type of the optical lens 10 can be adjusted according to the needs of the camera module. For example, the optical lens 10 can be implemented as an integrated optical lens, a split optical lens, a naked lens, or an optical lens including a lens barrel. The lens and the like are not limited in the present invention.

Specifically, as shown in FIGS. 2 and 4A, the molding base 23 includes a chip mounting portion 231 having the chip mounting surface 2301 and a lens mounting portion 232 having the lens mounting surface 2302. The lens mounting portion 232 is positioned around the chip mounting portion 231 so that the lens mounting surface 2302 is positioned around the chip mounting surface 2301 so that the photosensitive element 22 is mounted on the lens mounting surface 2302. When the optical lens 10 is mounted on the lens mounting surface 2302, the optical lens 10 corresponds to a photosensitive path of the photosensitive element 22, that is, the optical axis 100 and the optical lens 10 of the optical lens 10 The photosensitive surfaces 220 of the photosensitive element 22 are perpendicular to each other, and the optical axis 100 of the optical lens 10 corresponds to the center of the photosensitive surface 220 of the photosensitive element 22.

More specifically, as shown in FIG. 3, the molding base 23 is further provided with a reserved space 233, wherein the reserved space 233 is provided between the chip mounting portion 231 and the lens mounting portion 232. . In other words, the chip mounting portion 231 and the lens mounting portion 232 of the molding base 23 are spaced apart to form the chip mounting portion 231 and the lens mounting portion 232. The reserved space 233 of the molding base 23.

It is worth noting that, as shown in FIG. 4A, the circuit board 21 includes a chip molding area 211, a lens molding area 212 and a non-molding area 213, wherein the non-molding area 213 is located on the chip Between the molding area 211 and the lens molding area 212, and the lens molding area 212 is located around the chip molding area 211, when molding on the circuit board 21 through a molding process The chip mounting portion 231 of the molding base 23 is formed in the chip molding area 211 of the circuit board 21 so that the chip mounting portion 231 of the molding base 23 is covered with The chip molding area 211 of the circuit board 21, and the lens mounting portion 232 of the molding base 23 is formed in the lens molding area 212 of the circuit board 21 so that the molding base The lens mounting portion 232 of 23 covers the lens molding area 212 of the circuit board 21 to form the mold base 23 in the non-molded area 213 of the circuit board 21. The reserved space 233 is such that the molded base 23 does not cover the non-molded area 213 of the circuit board 231 . In other words, the chip molding area 211 of the circuit board 21 corresponds to the chip mounting portion 231 of the molding base 23, and the lens molding area 211 of the circuit board 21 corresponds to The lens mounting portion 232 of the molded base 23 and the non-molded area 213 of the circuit board 21 correspond to the reserved space 233 of the molded base 23.

Further, as shown in FIG. 2 and FIG. 3, the circuit board 21 further includes at least one group of circuit board connectors 214, wherein each group of the circuit board connectors 214 is respectively disposed on the circuit board 211. Non-molded area 213 to prevent the molded base 23 from blocking the electrical connection between the photosensitive element 22 and the circuit board connector 214 due to the circuit board connector 214 covering the circuit board 21, which is convenient The light receiving element 22 and the circuit board 21 are connected in a conductive manner.

Accordingly, as shown in FIG. 3, the photosensitive element 22 includes a photosensitive region 221, a non-photosensitive region 222, and at least one set of chip connectors 223, wherein the non-photosensitive region 222 is located around the photosensitive region 221, And each group of the chip connecting members 223 is respectively disposed on the non-photosensitive region 222 of the photosensitive element 22. In other words, the photosensitive region 221 is located in the middle of the photosensitive element 22, the non-photosensitive region 222 is located on the outer periphery of the photosensitive element 22, and the non-photosensitive region 222 is arranged around the photosensitive region 221 such that The chip connecting members 223 of each group are located on the outer periphery of the photosensitive element 22.

It is worth noting that, as shown in FIG. 2, the molded photosensitive component 20 further includes an adhesive layer 26, wherein the adhesive layer 26 is located on the photosensitive element 22 and the molded base 23. Between the chip mounting surfaces 2301, the photosensitive element 22 is fixedly mounted on the chip mounting surface 2301 of the molding base 23 through the adhesive layer 26. It should be understood that in the process of mounting the photosensitive element 22 to the chip mounting surface 2301, an adhesive material such as glue, solid glue, etc. is first applied to the chip mounting surface 2301 of the molding base 23, and then The photosensitive element 22 is stacked on the chip mounting surface 2301 to form the adhesive layer 26 between the photosensitive element 22 and the chip mounting surface 2301 after the adhesive material is cured.

As shown in FIG. 3, the molded photosensitive assembly 20 further includes at least one set of leads 24, wherein each lead of each set of the leads 24 has a circuit board connection end 241 and a chip connection end 242, each of which Each lead of the lead 24 extends curvedly between the circuit board connection end 241 and the chip connection end 242, respectively, wherein the circuit board connection end 241 of each group of the leads 24 is respectively connected to the Each group of the circuit board connection members 214 of the circuit board 21, and the chip connection ends 242 of each group of the lead wires 24 are respectively connected to each group of the chip connection members 223 of the photosensitive element 22 to conduct electricity. The light receiving element 22 and the circuit board 21 are connected to the ground.

It is worth mentioning that the type of the lead 24 may not be limited, for example, the lead 24 may be a gold wire, that is, the chip where the photosensitive element 22 is mounted on the molding base 23 After the mounting surface 2301, the lead wire 24 can be connected to the photosensitive element 22 and the circuit board 21 through a gold wire process. Nevertheless, in other examples, the lead 24 may also be other types of lead, such as silver wire, copper wire, etc., where the lead 24 is capable of conducting the photosensitive element 22 and the circuit board 21, that is, can.

In an example of the camera module 1 of the present invention, each of the circuit board connecting pieces 214 of the circuit board 21 and each of the chip connecting pieces 223 of the photosensitive element 22 may be connection pads, respectively. That is, each of the circuit board connecting pieces 214 of the circuit board 21 and each of the chip connecting pieces 223 of the photosensitive elements 22 may have a disk shape, respectively, for making the leads of the leads 24 The circuit board connection end 241 and the chip connection end 242 are respectively connected to the circuit board connection member 214 of the circuit board 21 and the chip connection member 223 of the photosensitive element 22. In another example of the camera module of the present invention, the circuit board connecting member 214 of the circuit board 21 and the chip connecting member 223 of the photosensitive element 22 may be spherical, for example, solder paste Or other soldering materials are spotted on the non-molded region 213 of the circuit board 21 and the non-photosensitive region 222 of the photosensitive element 22 to form the circuit board connecting member 214 and the circuit board 21 respectively. The chip connector 223 of the photosensitive element 22. Nonetheless, those skilled in the art can understand that the types of the circuit board connecting member 214 of the circuit board 21 and the chip connecting member 223 of the photosensitive element 22 do not constitute the imaging of the present invention. Restrictions on the type and scope of the module, that is, in other examples of the camera module, the circuit board connector 214 of the circuit board 21 and the chip connector 223 of the photosensitive element 22 may also be used. It has other shapes not mentioned above.

It is worth mentioning that, as shown in FIG. 2, the molded photosensitive component 20 further includes a set of electronic components 25, wherein each of the electronic components 25 can be spaced apart from each other by a process such as SMT (Surface Mount Technology). Is mounted on the lens molding area 212 of the circuit board 21 so that after the molding base 23 is molded, the lens mounting portion 232 of the molding base 23 covers each The electronic components 25 are separated from each other by the lens mounting portion 232. It should be understood that, since the lens mounting portion 232 of the molding base 23 covers each of the electronic components 25 so that the adverse phenomenon of mutual interference does not occur between adjacent electronic components 25, Even when the distance between the adjacent electronic components 25 is short, the imaging quality of the camera module can be ensured, so that a larger area of the circuit board 21 can be mounted with a larger number of the The electronic component 25 makes the structure of the molded photosensitive component 20 more compact, which is beneficial to improving the imaging quality of the camera module 1 on the basis of controlling the size of the camera module 1.

It is worth noting that, in some other embodiments of the present invention, each of the electronic components 25 may be mounted on the non-molded area 213 of the circuit board 21 at intervals, so that After the plastic base 23 is formed, each of the electronic components 25 is located in the reserved space 233 of the molded base 23, so that the electronic components 25 are exposed outside the molded base 23. To facilitate subsequent repair and maintenance of the electronic component 25.

Preferably, as shown in FIG. 2, the chip mounting surface 2301 of the molding base 23 is lower than the lens mounting surface 2302, that is, the chip mounting portion 231 of the molding base 23 The thickness of the lens mounting portion 232 is smaller than the thickness of the lens mounting portion 232 of the molding base 23, so that the lens mounting portion 232 can completely cover the electronic component 25 to avoid the height of the electronic component 25. At the same time, it is also possible to provide a flat mounting surface 2302 for mounting the optical lens 10. At the same time, because the thickness of the chip mounting portion 231 is small, the distance between the chip mounting surface 2301 and the circuit board 21 is small, so that the space to be mounted on the chip mounting surface 2301 can be shortened. The distance between the photosensitive element 22 and the circuit board 21 is not only conducive to shortening the length of the lead 24 required to connect the photosensitive element 22 and the circuit board 21 in a conductive manner, but also reduces The overall height of the camera module 1 is described.

Further, in the first preferred embodiment of the present invention, as shown in FIG. 3 and FIG. 4A, the molding base 23 further includes at least one connection portion 234, wherein each of the connection portions 234 is respectively Integrally extends from the lens mounting portion 232 to the chip mounting portion 231 so as to combine the chip mounting portion 231 and the lens mounting portion 232 into one through the connection portion 234, thereby forming an integrated structure The molded base 23 enhances the overall strength and deformation resistance of the molded base 23, and is convenient to prevent the molded base 23 from being deformed due to the influence of heat or external force, thereby providing a more flat and stable Mounting surface. In other words, the circuit board 21 is further provided with a connection molding area 215, and the connection molding area 215 communicates with the chip molding area 211 and the lens molding area 212, respectively, to pass a molding process. When the molding base 23 is formed, the chip mounting portion 231, the lens mounting portion 232, and the connection portion 234 of the molding base 23 are integrally formed on the circuit board 21, where The connection portion 234 corresponds to the connection molding area 215 of the circuit board 21, and the connection portion 234 combines the chip mounting portion 231 and the lens mounting portion 232 into one body so that it is located in the chip mounting The chip mounting surface 2301 of the portion 231 and the lens mounting surface 2302 of the lens mounting portion 232 can be stably parallel to prevent the chip mounting portion 231 or the lens mounting portion 232 from being inclined or slightly tilted. Deformation reduces the parallelism between the chip mounting surface 2301 and the lens mounting surface 2302, which further affects the imaging quality of the camera module 1.

It is worth noting that although the connection portion 234 is located between the chip mounting portion 231 and the lens mounting portion 232, that is, the connection portion 234 corresponds to the reserved space 233 of the molding base 23. However, each of the connecting portions 234 avoids the circuit board connecting member 214 located in the non-molded area 213 of the circuit board 21 to prevent the connecting portion 234 from covering or blocking the circuit. The board connector 214 prevents the circuit board connector 214 from being connected to the chip connector 223 of the photosensitive element 22 in a conductive manner.

Exemplarily, as shown in FIGS. 2 and 3, the circuit board connector 214 of the circuit board 21 is disposed on both sides of the chip molding area 211, that is, the non-mold area 213 is distributed on both sides of the chip molding area 211. At this time, the number of the connection portions 234 of the molding base 23 is two, and they are disposed symmetrically before and after the chip mounting portion 231, respectively. Both sides to divide the reserved space 233 of the molded base 23 into left and right parts, so that the left and right parts of the reserved space 233 correspond to the non-molded parts of the circuit board 21 respectively The two corresponding portions of the region 213 are such that the circuit board connectors 214 provided on the left and right portions of the non-molded region 213 are respectively exposed to the left and right sides of the chip mounting portion 231 so as to communicate with the photosensitive The chip connecting members 223 of the element 22 are electrically connected correspondingly so as to conduct the photosensitive element 22 and the circuit board 21.

Preferably, as shown in FIG. 3, the width of each of the connection portions 234 is smaller than the width of the chip mounting portion 231 so as to reduce the space occupied by the connection portion 234 (ie, reduce the circuit board). (The area of the connection molding area 215 of 21), the area of the non-mold area 213 of the circuit board 21 can be increased accordingly to provide sufficient space for setting the circuit board connector 214 In order to prevent the circuit board connecting members 214 from being too crowded and touching each other to cause a short circuit accident. More preferably, the width of the connection portion 234 is not less than 1/10 of the width of the chip mounting portion 231 to prevent the connection strength of the connection portion 234 from being too weak due to the width of the connection portion 234 being too small. , Thereby reducing the overall strength of the molding base 23.

It should be understood that, in some other examples of the present invention, the width of each of the connection portions 234 may also be equal to or greater than the width of the chip mounting portion 231, so as to increase the connection portion 234 and the chip mounting portion, respectively. At the same time as the connection strength between 231 and the lens mounting portion 232, the anti-deformation performance of the connection portion 234 itself can be increased to ensure that there is a good connection between the chip mounting surface 2301 and the lens mounting surface 2302. Parallelism.

More preferably, in the first preferred embodiment of the present invention, as shown in FIGS. 3 and 4A, the thickness of the connection portion 234 is equal to the thickness of the chip mounting portion 231. Of course, in some other embodiments of the present invention, the thickness of the connection portion 234 may be greater than the thickness of the chip mounting portion 231, or may be smaller than the thickness of the chip mounting portion 231.

In the first preferred embodiment of the present invention, as shown in FIGS. 4A to 4C, the chip mounting portion 231 and the lens mounting portion 232 of the molding base 23 are simultaneously molded in one molding. Molding, that is, the circuit board 21 is correspondingly placed in a molding die 400 to perform a molding process through the molding die 400 to form the chip for covering the circuit board 21 The molding area 211 and the molding base 23 of the lens molding area 213 make the upper surfaces of the chip mounting portion 231 and the lens mounting portion 232 of the molding base 23 have good consistency. To ensure that the chip mounting surface 2301 and the lens mounting surface 2302 have a high degree of parallelism, which helps to make the photosensitive surface 220 of the photosensitive element 22 mounted on the chip mounting surface 2301 vertical. On the optical axis 100 of the optical lens 10 mounted on the lens mounting surface 2302.

Specifically, as shown in FIGS. 4B and 4C, the forming mold 400 includes a first mold 401 and a second mold 402, wherein at least one of the first mold 401 and the second mold 402 Can be moved so that the first mold 401 and the second mold 402 can be clamped and pulled out, and a molding space is formed between the first mold 401 and the second mold 402 403, wherein the molding base 23 is added to the molding space 403 from the molding material and is formed after curing.

For example, in one embodiment, the second mold 402 can be fixed, and the first mold 401 can move relative to the second mold 402 along the guide post to move the first mold 401 toward the The second mold 402 is clamped when the direction is moved, and the first mold 401 is moved away from the second mold 402, and the first mold 401 and the second mold 402 are clamped when the direction is moved. During operation, the molding space 403 is formed between the first mold 401 and the second mold 402. In another embodiment, the first mold 401 may be fixed, and the second mold 402 can be moved relative to the first mold 401 along the guide post to move the second mold 402 toward the The first mold 401 is clamped when the direction is moved, and the second mold 402 is moved away from the first mold 401 when the second mold 402 is moved.

Further, as shown in FIG. 4C, the forming mold 400 further includes a cover film 404, wherein the cover film 404 is overlapped and disposed on a pressing surface 4011 of the first mold 401 of the forming mold 400. And the cover film 404 corresponds to the non-molded area 213 of the circuit board 21, wherein after the circuit board 21 is placed in the first mold 401 and / or the second mold 402 The first mold 401 and the second mold 402 that operate the molding mold 400 perform a mold clamping operation so that the circuit board 21 is located in the molding space 403 of the molding mold 400. The pressing surface 4011 of the first mold 401 is pressed on the non-molded area 213 of the circuit board 21, and the cover film 404 is located on the pressing surface 4011 and the pressing surface of the first mold 401. Between the non-molded regions 213 of the circuit board 21, to prevent the pressing surface 4011 of the first mold 401 from scratching the circuit board connecting member 214 located in the non-molded regions 213. It should be understood that, in some other embodiments of the present invention, the forming mold 400 may not include the cover film 404, so that when the mold is closed, the pressing surface 4011 of the first mold 401 is directly pressed. The non-molded area 213 of the circuit board 21.

In addition, as shown in FIG. 4C, the cover film 404 is preferably made of a material having a certain elasticity such as plastic, rubber, polymer material, etc., so that the cover film 404 can also absorb the first mold 401 and When the second mold 402 is subjected to a mold clamping operation, an instantaneous impact force is generated when the pressing surface 4011 of the first mold 401 contacts the circuit board 21, thereby avoiding the first mold 401 and the The clamping of the second mold 402 causes damage to the circuit board 21.

It should be understood that, because the circuit board connector 214 located in the non-molded area 213 usually protrudes from the upper surface of the circuit board 21, the pressing surface 4011 of the first mold 401 cannot be pressed tightly. The non-molded area 213 of the circuit board 21 is closed, and the cover film 404 can be deformed to prevent the pressing surface 4011 of the first mold 401 and the circuit board 21 from being damaged. A gap is generated between the non-molded regions 213 to prevent the molding material from entering the pressing surface 4011 of the first mold 401 and the non-molded portion of the circuit board 21 during the molding process. The non-molded regions 213 of the circuit board 21 are covered between the molded regions 213.

It is worth noting that, in some other embodiments of the present invention, the molding die 400 further has a receiving groove provided on the pressing surface 4011 of the first mold 401, wherein the receiving groove and the receiving groove The circuit board connector 214 in the non-molded area 213 corresponds to the circuit board connector 214 is received in the receiving groove when the molding die 400 is in the mold clamping state, so that the first The pressing surface 4011 of the mold 401 can be tightly pressed to the non-molded region 213 of the circuit board 21 to prevent a molding material from entering between the pressing surface 4011 and the non-molded region 213. The non-molded area 213 of the circuit board 21 is covered.

It is worth mentioning that the fluid-like molding material according to the present invention may be a liquid material or a solid particulate material or a liquid and solid particle mixed material. It can be understood that whether the molding material is implemented as a liquid material or is When implemented as a solid particulate material or as a liquid and solid particulate mixed material, after being added to the molding space 403 of the molding mold 400, they can be cured to form the molding base 23. For example, in this specific example of the present invention, the molding material in a fluid state is implemented as a thermosetting material such as a liquid, wherein the molding material is cured after being added to the molding space 403 of the molding mold 400 to form a molding material. Mentioned molded base 23. It is worth mentioning that after the fluid-like molding material is added to the molding space 403 of the molding die 400, the curing manner of the fluid-like molding material does not limit the content and scope of the present invention.

In addition, the molding space 403 of the molding die 400 corresponds to the chip molding area 211, the lens molding area 212, and the connection molding area 215 of the circuit board 21 to add the After the molding material in the molding space 403 is cured, the chip mounting portion 231 covering the chip molding region 211 of the circuit board 21 is formed, and the lens molding region 212 covering the circuit board 21 is formed. The lens mounting portion 232 and the connection portion 234 forming the connection molding area 215 of the circuit board 21 so that the connection portion 234 integrally connects the chip mounting portion 231 and the chip mounting portion 231 A lens mounting portion 232, and a top surface of the chip mounting portion 231 is defined as the chip mounting surface 2301, and a top surface of the lens mounting portion 232 is defined as the lens mounting surface 2302.

More specifically, as shown in FIGS. 4B and 4C, during the molding process, the pressing surface 4011 of the first mold 401 of the forming mold 400 is pressed against the non-contact surface of the circuit board 21. A molded area 213, and the non-molded area 213 is located between the lens molded area 212 and the chip molded area 211 of the circuit board 21 so as to flatten the circuit board 21, thereby ensuring that The flatness of the circuit board 21 also ensures the flatness of the entire molding base surface during the molding process. It should be understood that, in order to further flatten the circuit board 21, in the embodiment described later, the first mold 401 further has a pressing head (not shown in the figure), wherein the first mold 401 The indenter corresponds to the center position of the circuit board 21 (that is, the center portion of the chip molding area 211 of the circuit board 21), so that when the mold is closed, the position of the first mold 401 The indenter is pressed on the central position of the circuit board 21 to ensure the overall flatness of the circuit board 21, thereby ensuring the flatness of the molding base surface.

In addition, as shown in FIGS. 4A and 4B, the molding space 403 of the molding mold 400 includes a chip mounting portion molding space 4031, a lens mounting portion molding space 4032, and two connection portion molding spaces 4033. In the state, the chip mounting portion molding space 4031 corresponds to the chip molding area 211 of the circuit board 21, and the lens mounting portion molding space 4032 corresponds to the lens molding area 212 of the circuit board 21. Each of the connection portion molding spaces 4033 corresponds to the connection molding area 215 of the circuit board 21, and each of the connection portion molding spaces 4033 communicates with the chip mounting portion molding space 4031 and the lens mounting Part molding space 4032, so that the connection part molding space 4033 forms a communication channel between the chip mounting part molding space 4031 and the lens mounting part molding space 4032. Therefore, when the molding material is injected into the molding space 403, the molding material can flow from the lens mounting portion molding space 4032 into the chip mounting portion molding space 4031 through the connection portion molding space 4033 to fill the molding space. Fills the molding space 403 and forms the molding base 23 with an integrated structure after the molding material is cured, that is, the molding base 23 can be made by only one molding The chip mounting portion 231 and the lens mounting portion 232 are provided to ensure that the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 are parallel to each other. It should be understood that if the chip mounting portion 231 and the lens mounting portion 232 of the molding base 23 are separately made by two moldings, due to the pressing degree, pressing position and molding of the circuit board each time, The material and other factors inevitably have differences, which will cause the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 to be unable to remain parallel to each other, which will bring great damage to the subsequent assembly process. Trouble and inconvenience.

Further, the first mold 401 of the molding mold 400 is further provided with at least one air escape hole (not shown in the figure), so as to exhaust the gas in the molding space 403 of the molding mold 400 in order to prevent The gas in the molding space 403 cannot be exhausted, so that the molding material cannot fill the molding space 403. Particularly, the escape hole is provided outside the chip mounting portion 231 of the first mold 401 to exhaust gas in the chip mounting portion molding space 4031 and the connection portion molding space 4033, thereby ensuring The molding material fills the chip mounting portion molding space 4031 and the connection portion molding space 4033. Preferably, the escape hole is located away from the circuit board connector 214 of the circuit board 21 to prevent the molding material from punching out of the escape hole to cover the circuit board connector 214.

It is worth noting that since the top surface of the chip mounting portion 231 and the lens mounting portion 232 of the molding base 23 correspond to the inner surface of the first mold 401, that is, Both the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 correspond to the inner surface of the first mold 401, and therefore pass through the flatness of the inner surface of the first mold 401 And the parallelism can ensure that the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 have high flatness and parallelism for subsequent assembly and calibration.

FIG. 5 shows a first modified embodiment of the molded photosensitive member 20 according to the first preferred embodiment of the present invention, wherein the molded base of the molded photosensitive member 20 23 includes only one of the connecting portions 234. For example, as shown in FIG. 5, the connection portion 234 integrally connects the chip mounting portion 231 and the lens mounting portion 232, and the connection portion 234 is located on one side of the chip mounting portion 231 (for example, : Front side), so that the reserved space 233 of the molding base 23 is located on the remaining three sides of the chip mounting portion 232 (for example, left side, right side, and rear side). In other words, the non-molded area 213 of the circuit board 21 is located on the left, right, and rear sides of the chip mounting portion 232.

6A and 6B illustrate a second modified embodiment of the molded photosensitive member 20 according to the first preferred embodiment of the present invention, wherein the mold of the molded photosensitive member 20 The connection portion 234 of the plastic base 23 has a chip connection end 2341 and a lens connection end 2342, wherein the chip connection end 2341 of the connection portion 234 is integrally connected to the chip mounting portion 231, and the connection The lens connection end 2342 of the portion 234 is integrally connected to the lens mounting portion 232, and the connection portion 234 is tapered from the lens connection end 2342 to the chip connection end 2341, so that the connection portion The thickness of the lens connection end 2342 of 234 is greater than the thickness of the chip connection end 2341 of the connection portion 234 to prevent the connection portion 234 from protruding from the chip mounting surface 2301 while enhancing the connection The connection strength and deformation resistance of the portion 234 are used to stably maintain that the chip mounting surface 2301 and the lens mounting surface 2302 have a good parallelism.

In addition, since the connection portion 234 gradually extends from the lens connection end 2342 to the chip connection end 2341, that is, the thickness of the lens connection end 2342 of the connection portion 234 is greater than that of the connection portion 234. The thickness of the chip connection end 2341 is such that a portion of the molding space 403 of the molding die 400 corresponding to the connection portion 234 is tapered, so that the molding material injected into the molding space 403 is self-aligning A portion corresponding to the lens mounting portion 232 flows into a portion corresponding to the chip mounting portion 231, so that the molding material easily fills the entire molding space 403 and is cured on the circuit board 21 to form the Mentioned molded base 23.

According to another aspect of the present invention, the present invention further provides a method for manufacturing a camera module. Specifically, as shown in FIG. 7, the method for manufacturing the camera module 1 includes steps:

S1: forming a molding base 23 on a circuit board 21 by a molding process, wherein the molding base 23 provides a flat chip mounting surface 2301 and a lens mounting surface 2302;

S2: mounting a photosensitive element 22 to the chip mounting surface 2301 of the molding base 23 and keeping the photosensitive surface 220 of the photosensitive element 22 parallel to the lens mounting surface 2302; and

S3: Connect the photosensitive element 22 and the circuit board 21 in an electrically conductive manner to form the molded photosensitive element 20.

Preferably, in the step S1, the chip mounting surface 2301 and the lens mounting surface 2302 of the molding base 23 are parallel to each other.

More specifically, the step S1 includes steps:

Placing the circuit board 21 in a second mold 402 of a molding mold 400;

Clamping a first mold 401 and a second mold 402 of the molding mold 400 to form a molding space 403 of the molding mold 400 between the first mold 401 and the second mold 402; as well as

A molding material is added to the molding space 403 of the molding mold 400 to form the molding base 23 on the circuit board 21 after the molding material is cured.

It is worth noting that, in step S1, the method further includes steps:

A pressing surface 4011 of the first mold 401 is pressed to a non-molded region 213 of the circuit board 21;

Correspondingly forming a chip mounting part molding space 4031 in a chip molding area 211 of the circuit board 21;

A lens mounting portion molding space 4032 is correspondingly formed in a lens molding area 212 of the circuit board 21, wherein the non-molding area 213 is located between the chip molding area 211 and the lens molding area 212. ;as well as

A connection portion molding space 4033 is formed correspondingly to a connection molding area 215 of the circuit board 21, wherein the connection portion molding space 4033 communicates the chip mounting portion molding space 4031 and the lens mounting portion molding space 4032. To form the molding space 403 with an integrated structure.

Preferably, in step S1, the method further includes the following steps:

In the lens mounting portion forming space 4032, a lens mounting portion 232 is formed to cover the lens molding area 212 of the circuit board 21, so that the top surface of the lens mounting portion 232 forms the lens. Mounting surface 2302;

In the chip mounting portion molding space 4031, a chip mounting portion 231 covering the chip molding area 211 of the circuit board 21 is formed, so that the top surface of the chip mounting portion 231 forms the chip. Mounting surface 2301; and

In the connection portion molding space 4033, a connection portion 234 is formed to cover the connection molding area 215 of the circuit board 21. The connection portion 234 is integrally connected to the chip mounting portion 231 and The lens mounting portion 232 is configured to form the molded base 23 having an integrated structure.

More preferably, in step S1, the method further includes the following steps:

Pouring the molding material into the lens mounting portion molding space 4032 of the molding space 403; and

Through the connecting portion molding space 4033, the molding material is guided from the lens mounting portion molding space 4032 into the chip mounting portion molding space 4031, so that the molding material fills the molding space 403. Further, as shown in FIG. 7, the method for manufacturing the camera module 1 further includes steps:

S4: An optical lens 10 is mounted to the lens mounting surface 2302 of the molding base 23, and the optical axis of the optical lens 10 is perpendicular to the photosensitive surface 220 of the photosensitive element 22 to make Mentioned camera module 1.

Specifically, referring to FIG. 8 of the accompanying drawings, a molded photosensitive member 20A according to a second preferred embodiment of the present invention is shown. Compared with the first preferred embodiment of the present invention, the molded photosensitive member 20A according to the second preferred embodiment of the present invention is different in that: The chip mounting portion 231A of the molding base 23A includes at least two sub chip mounting portions 2311A spaced apart from each other, and a separation gap 2312A is formed between the adjacent sub chip mounting portions 2311A to pass the separation The gap 2312A reduces the stress applied by the circuit board 21 to the chip mounting portion 231A, and distributes the stress received by the chip mounting portion 231A to the at least two sub chip mounting portions 2311A to reduce each of the sub chips. The stress on the chip mounting portion 2311A, so as to prevent deformation of each of the sub chip mounting portions 2311A, so that the chip mounting portion 231A of the molding base 23A does not change with the deformation of the circuit board 21 Deformation occurs to ensure that the chip mounting surface 2301 and the lens mounting surface 2302 remain parallel. In addition, each of the sub-chip mounting portions 2311A is integrally connected to the lens mounting portion 232 through the corresponding connection portion 234, so that the molding base 23A has an integrated structure, which is convenient to pass through a one-time mold. The molding base 23A is formed.

Exemplarily, as shown in FIG. 8, the separation gap 2312A of the chip mounting portion 231A is provided in a “one” shape to separate the chip mounting portion 231A into two sub chip mounting portions 2311A before and after, The circuit board 21 can be concentratedly deformed at the separation gap 2312A to reduce the concentrated stress exerted by the circuit board 21 on the sub-chip mounting portion 2311A, so that the sub-chip mounting portion 2311A is subject to relatively The small concentrated stress will not be deformed, thereby effectively preventing the chip mounting portion 231A from being deformed due to the large stress.

Further, FIG. 9 shows a first modified embodiment of the molded photosensitive member 20A according to the second preferred embodiment of the present invention, wherein the molding of the molded photosensitive member 20A The separation gap 2312A of the chip mounting portion 231A of the base 23A is arranged in a “T” shape to divide the chip mounting portion 232A into four of the sub chip mounting portions 2311A, wherein the molded base 23A has two of the connection portions 234, of which four of the sub-chip mounting portions 2311A are two by two, and each group of the sub-chip mounting portions 231A is integrally connected to the lens through one of the connection portions 234, respectively. The mounting portion 232, so as to increase the volume of the separation gap 2312A of the module base 231A to further slow down the stress imposed on the chip mounting portion 231A by the circuit board 21, and also ensure the molding The base 23A still has an integrated structure to keep the chip mounting surface 2301 and the lens mounting surface 2302 parallel.

In addition, FIG. 10 shows a second modified embodiment of the molded photosensitive member 20A according to the second preferred embodiment of the present invention, wherein the molded base of the molded photosensitive member 20A The base 23A has four of the connection portions 234, and each of the connection portions 234 integrally connects the corresponding sub-chip mounting portion 2311A and the lens mounting portion 232 to ensure the module base 23A. Has an integrated structure.

It is worth noting that, since the separation gap 2312A of the chip mounting portion 231A of the molding base 23A is a gap or a blank space, that is, during the molding process, the separation gap 2312A is not The molding material is filled, and the separation gap 2312A corresponds to the chip molding area 211 of the circuit board 21. Therefore, during the molding process, the first mold 401 of the molding mold 400 passes through the mold The gap 2312A is separated and directly pressed on the chip molding area 211 of the circuit board 21, so that the circuit board 21 is stably and flatly held in the molding die 400, thereby effectively preventing the circuit board 21 is tilted or deformed due to uneven force to obtain the molded base 23A of high quality.

Of course, in some other embodiments of the present invention, the separation gap 2312A may also be provided in an “X” shape or a “meter” shape to separate the chip mounting portion 231A into a plurality of the sub chip mounting portions. 2311A, and reduces the stress applied to the chip mounting portion 231A by the circuit board 21 in other directions through the separation gap 2312A. It should be understood that the shape of the first mold 401 is designed and manufactured according to the shape of the molding base 23A, and what kind of the molding base 23A is desired, the corresponding first mold is manufactured and used. 401. In the present invention, the shape of the first mold 401 is not limited.

It is worth noting that, in the second preferred embodiment of the present invention, in addition to the above-mentioned structures, other structures of the molded photosensitive member 20A are the same as those of the first preferred embodiment according to the present invention. The molded photosensitive member 20 has the same structure, and the molded photosensitive member 20A also has similar or the same modified implementation as the various modified embodiments of the molded photosensitive member 20 of the first preferred embodiment. The method is not repeated here.

Because the adhesive material has a certain fluidity before being cured to form the adhesive layer 26, the adhesive material 26 may cause the thickness of the adhesive layer 26 to be uneven due to the flow, and thus the photosensitive element 22 may be easily caused. The photosensitive surface 220 is tilted to reduce the parallelism between the photosensitive surface 220 of the photosensitive element 22 and the chip mounting surface 2301. Therefore, in order to ensure the photosensitive surface 220 of the photosensitive element 22 Maintaining a good parallel relationship with the chip mounting surface 2301, the present invention prevents the photosensitive surface 220 of the photosensitive element 22 by providing a receiving groove for receiving an adhesive material to suppress the flow of the adhesive material. Tilt occurs.

Specifically, FIGS. 11A and 11B illustrate a molded photosensitive member 20B according to a third preferred embodiment of the present invention. Compared with the first preferred embodiment of the present invention, the molded photosensitive member 20B according to the second preferred embodiment of the present invention is different in that: The chip mounting portion 231B of the molding base 23B has at least one accommodating groove 2313B, wherein each of the accommodating grooves 2313B is recessed downward from the chip mounting surface 2301 to form an accommodating adhesive The groove of the layer 26 is used to fix the photosensitive element 22 to the chip mounting portion 231B through the adhesive layer 26 so that the photosensitive element 22 is closely attached to the chip mounting portion 231B. The chip mounting surface 2301 is convenient for stably maintaining the photosensitive surface 220 of the photosensitive element 22 in parallel with the chip mounting surface 2301 to prevent being mounted due to the flow of the viscous material forming the adhesive layer 26. The photosensitive surface 220 of the photosensitive element 22 on the chip mounting surface 2301 is inclined. In other words, when the photosensitive element 22 is mounted on the chip mounting portion 231B, the adhesive layer 26 bonds the photosensitive element 22 and the chip mounting portion 231B together, and the chip mounting The chip mounting surface 2301 of the portion 231B supports the photosensitive element 22, and since the chip mounting portion 231B has strong rigidity and flatness, the photosensitive surface 220 of the photosensitive element 22 and the chip can be guaranteed The mounting surface 2301 remains parallel.

It is worth noting that although the shape of the cross section of the receiving groove 2313B is circular as an example in FIGS. 11A and 11B and the following description, the features and advantages of the receiving groove 2313B of the present invention are described. Those skilled in the art can understand that the shape of the accommodating groove 2313B disclosed in FIGS. 11A and 11B and the following description is merely an example, and it does not constitute a limitation on the content and scope of the present invention. In other examples of the molded photosensitive member 20B of the third preferred embodiment of the invention, the shape of the cross section of each of the receiving grooves 2313B may be implemented as a square, a rectangle, a trapezoid, a triangle, or an oval. , Ring or polygon, etc.

Exemplarily, as shown in FIGS. 11A and 11B, the chip mounting portion 231B is provided with one of the receiving grooves 2313B. When the photosensitive element 22 is mounted on the chip mounting surface 2301, the adhesive layer 26 is accommodated in the accommodation groove 2313B of the chip mounting portion 231B, and the photosensitive element 22 is supported on the chip mounting portion 231B with high rigidity, so that the adhesive layer 26 does not affect the photosensitivity The flatness of the photosensitive surface 220 of the element 22 ensures that the photosensitive surface 220 of the photosensitive element 22 and the chip mounting surface 2301 remain parallel.

Preferably, as shown in FIG. 11B, the accommodating groove 2313B is located at the center of the chip mounting portion 231B, so that the adhesive layer 26 accommodated in the accommodating groove 2313B applies uniformity to the photosensitive element 22. Adhesive force to prevent the photosensitive element 22 from warping due to uneven force.

It is worth noting that, since the receiving groove 2313B of the chip mounting portion 231A of the molding base 23A is a through-hole groove, and the receiving groove 2313B corresponds to the circuit board 21 The center position of the chip molding area 211, that is, the receiving groove 2313B is not filled with the molding material during the molding process, and therefore, during the molding process, the first mold of the molding mold 400 401 is directly pressed at the center of the chip molding area 211 of the circuit board 21 through the receiving groove 2313B, so as to stably and flatly hold the circuit board 21 in the molding die 400, thereby Effectively preventing the circuit board 21 from being tilted or deformed due to uneven force, so as to obtain the molded base 23A of high quality.

It should be understood that, in some other embodiments of the present invention, the chip mounting portion 231B is provided with two or more of the accommodating grooves 2313B, and all the accommodating grooves 2313B are evenly arrayed to ensure that The adhesive layer 26 accommodated in the receiving groove 2313B applies a uniform adhesive force to the photosensitive element 22.

12A and 12B illustrate a first modified embodiment of the molded photosensitive member 20B according to the third preferred embodiment of the present invention, wherein the molding of the molded photosensitive member 20B The chip mounting portion 231B of the base 23B includes two of the accommodating grooves 2313B, and each of the accommodating grooves 2313B is arranged in a concentric ring, that is, the two accommodating grooves 2313B are arranged in a circumferential arrangement (one The accommodating groove 2313B surrounds another accommodating groove 2313B (that is, a ring-shaped structure) is provided in the chip mounting portion 231B so as to adhere to the accommodating inside the accommodating groove 2313B. While the layer 26 applies a uniform adhesive force to the photosensitive element 22, the chip mounting surface 2301 of the chip mounting portion 231B applies a uniform supporting force to the photosensitive element 22 to prevent the photosensitive element 22 from being damaged. Warping occurs due to uneven force.

It should be understood that although FIG. 12A and FIG. 12B and the description of the modified embodiment take the chip mounting portion 231B including two receiving grooves 2313B as an example, the features and advantages of the chip mounting portion 231B of the present invention are explained. Those skilled in the art can understand that the chip mounting portion 231B disclosed in FIGS. 12A and 12B and the description of the modified embodiment is merely an example, and does not constitute a limitation on the content and scope of the present invention. For example, In other examples of the molded photosensitive member 20B of the first modified embodiment of the third preferred embodiment of the present invention, the number of the receiving grooves 2313B may also exceed two to form a ring. Ring-shaped grooves.

13A to 13C illustrate a second modified embodiment of the molded photosensitive member 20B according to the third preferred embodiment of the present invention, wherein the receiving groove 2313B is from the chip mounting surface 2301 Recessed down to the circuit board 21 to form a through-hole recess for receiving the adhesive layer 26, wherein when the photosensitive element 22 is mounted on the chip mounting portion 231B, the adhesive The bonding layer 26 bonds the photosensitive element 22, the chip mounting portion 231B, and the circuit board 21 together, so that the photosensitive element 22 is fixedly mounted on the chip mounting surface 2301. In other words, as shown in FIG. 13B, the receiving groove 2313B is penetratingly provided in the chip mounting portion 231B, and an upper opening of the receiving groove 2313B is located on the chip mounting surface 2301. The lower opening corresponds to the circuit board 21, so that the adhesive layer 26 accommodated in the accommodation groove 2313B can simultaneously contact the photosensitive element 22, the chip mounting portion 231B, and the circuit board 21, so that The photosensitive element 22, the chip mounting portion 231B, and the circuit board 21 are bonded together.

It is worth noting that, since the receiving groove 2313B is implemented as a through-hole groove, as shown in FIG. 13C, during the molding process, a pressing of the first mold 401 of the molding mold 400 The head 4012 will press a part of the chip molding area 211 of the circuit board 21 so that the indenter 4012 and the pressing surface 4011 of the first mold 401 cooperate with each other to ensure the circuit board 21 In order to provide a flat molding base surface for the molding process of the molding base 23, it is ensured that the chip mounting surface 2301 of the molding base 23 has a good flatness.

Preferably, the receiving groove 2313B is located in a central region of the chip mounting portion 231B, that is, the receiving groove 2313B corresponds to a central portion of the chip molding region 211 of the circuit board 21 so that During the molding process, the indenter 4012 of the first mold 401 is pressed against the center portion of the chip molding area 211 of the circuit board 21 and passes through the first mold 401. The pressing surface 4011 is pressed on the outside of the chip molding area 211 of the circuit board 21 to further ensure the flatness of the circuit board 21. It should be understood that, since the indenter 4012 of the first mold 401 is pressed against the central portion of the chip molding area 211 during the molding process, and the indenter 4012 is formed at the chip mounting portion In the space 4031, while the molding material is cured to form the chip mounting portion 231B, a space corresponding to the indenter 4012 in the chip mounting portion molding space 4031 forms the chip because there is no molding material. The accommodating groove 2313B of the mounting portion 231B, that is, a chip unmolded area is formed at the center portion of the chip molding area 211 of the circuit board 21 because it is not molded.

It is worth mentioning that, compared with the first preferred embodiment according to the present invention, in this embodiment of the present invention, the method for manufacturing the molded photosensitive member 20B further includes steps:

A pressing head 4012 of the first mold 401 is pressed against a central portion of the chip molding area 211 of the circuit board 21 to form a chip located on the chip after the molding material is cured. The receiving groove 2313B of the mounting portion 231B. First Mold FIGS. 14A and 14B illustrate a third modified embodiment of the molded photosensitive member 20B according to the third preferred embodiment of the present invention, wherein the chip mounting portion 231B includes two Each through-hole type receiving groove 2313B, and each of the receiving grooves 2313B is provided in a "back" shape, so that the chip mounting portion 231B is separated into two ring-shaped two sub-chip installations through the two receiving grooves 2313B A portion 2311B, in which the two sub-chip mounting portions 2311B are integrally connected to form the chip mounting portion 231B having an integrated structure. In other words, one of the two accommodating grooves 2313B is located at the center of the chip mounting portion 231B, and the other of the two accommodating grooves 2313B is located around one of the two accommodating grooves 2313B, and is located in the two accommodating areas. One of the sub chip mounting portions 2311B is formed between the grooves 2313B, and another of the sub chip mounting portions 2311B is formed on the outer periphery of the other receiving groove 2313B. The other of the two receiving grooves 2313B has a “C” shape. Structure so that the sub chip mounting portion 2311B located between the two receiving slots 2313B and the other sub chip mounting portion 2311B are integrally connected to ensure that the chip mounting portion 231B has an integrated structure so as to pass the primary mold The chip mounting portion 231B is molded to ensure that the chip mounting portion 231B provides a flat chip mounting surface 2301.

It is worth noting that, in the third preferred embodiment of the present invention, in addition to the above-mentioned structures, other structures of the molded photosensitive member 20B are the same as those of the first preferred embodiment of the present invention. The molded photosensitive member 20 has the same structure, and the molded photosensitive member 20B also has similar or the same modified implementation as the various modified embodiments of the molded photosensitive member 20 of the first preferred embodiment. The method is not repeated here.

15A and 15B, according to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device includes an electronic device body 500 and at least one camera module 1, wherein each of the cameras Modules are respectively disposed on the electronic device body 500 for acquiring images. It is worth mentioning that the type of the electronic device body 500 is not limited. For example, the electronic device body 500 may be a smart phone, a tablet computer, a notebook computer, an e-book, a personal digital assistant, a camera, or any other device that can be configured. The electronic equipment of the camera module 1 is described. Those skilled in the art can understand that although the electronic device body 500 is implemented as a smart phone as an example in FIGS. 15A and 15B, it does not constitute a limitation on the content and scope of the present invention.

Exemplarily, as shown in FIG. 15A, the camera module 1 is disposed on the electronic device body 500 and faces the front side of the electronic device body 500 so that the camera module 1 serves as the electronic device. A front-facing camera for shooting a space object on the front side of the electronic device body 500.

In addition, as shown in FIG. 15B, the camera module 1 is disposed on the electronic device body 500 and faces the rear side of the electronic device body 500, so that the camera module 1 serves as a part of the electronic device. The rear camera is used for shooting a space object on the rear side of the electronic device body 500.

Those skilled in the art should understand that the embodiments of the present invention shown in the above description and the accompanying drawings are merely examples and do not limit the present invention. The object of the invention has been completely and effectively achieved. The function and structural principle of the present invention have been shown and explained in the embodiments, and the embodiments of the present invention may have any deformation or modification without departing from the principle.

Claims

A molded photosensitive component for assembling a camera module with an optical lens, which is characterized by:

A circuit board

A photosensitive element, wherein the photosensitive element is electrically connected to the circuit board; and

A molding base, wherein the molding base is formed on the circuit board in a molding manner, and provides a flat chip mounting surface and a flat lens mounting surface, wherein the photosensitive elements are correspondingly The chip mounting surface is mounted on the molding base, and the lens mounting surface of the molding base is used for correspondingly mounting the optical lens so that the optical lens is located on a light sensing path of the photosensitive element.
The molded photosensitive assembly according to claim 1, wherein the chip mounting surface and the lens mounting surface provided by the molding base are parallel to each other.
The molded photosensitive assembly according to claim 2, wherein the molded base includes a chip mounting portion having the chip mounting surface and a lens mounting portion having the lens mounting surface, and is provided with a reserve A space in which the lens mounting portion is located around the chip mounting portion, and the reserved space is located between the chip mounting portion and the lens mounting portion.
The molded photosensitive assembly according to claim 3, wherein the circuit board is provided with a chip molding area, a lens molding area, a non-molding area, and at least one set of circuit board connectors, wherein the lens mold A plastic area is located around the chip molding area, the non-molded area is located between the chip molding area and the lens molding area, and each group of the circuit board connectors is disposed on the circuit board For the non-molded area of the circuit board, after the molding is performed on the circuit board, the chip mounting portion of the molding base covers the chip molding area of the circuit board, the molding The lens mounting portion of the base covers the lens molded area of the circuit board, and the reserved space of the molded base corresponds to the non-molded area of the circuit board.
The molded photosensitive assembly according to claim 4, wherein the molded base further comprises at least one connection portion, wherein each of the connection portions integrally extends from the lens mounting portion to the chip mounting portion, so that The molded base having an integrated structure is formed.
The molded photosensitive assembly according to claim 5, wherein the circuit board is further provided with a connection molding area, wherein the connection molding area is located between the lens molding area and the chip molding area, The lens molding area and the chip molding area are connected to each other. After molding on the circuit board, the connection portion of the molding base is covered by the connection mold of the circuit board. And a plastic region to combine the lens mounting portion and the chip mounting portion into one body through the connection portion.
The molded photosensitive assembly according to claim 6, wherein the connection portion has a lens connection end and a chip connection end, and wherein the lens connection end of the connection portion is integrally connected with the lens mounting portion, The chip connection end of the connection portion is integrally connected with the chip mounting portion, and the connection portion gradually extends from the lens connection end to the chip connection end.
The molded photosensitive member according to any one of claims 3 to 7, wherein a thickness of the chip mounting portion is smaller than a thickness of the lens mounting portion.
The molded photosensitive assembly according to any one of claims 5 to 7, wherein the chip mounting portion of the molding base includes at least two sub-chip mounting portions spaced apart from each other, and A separation gap is formed between the chip mounting portions, wherein each of the sub chip mounting portions is integrally connected to the lens mounting portion through a corresponding one of the connection portions.
The molded photosensitive assembly according to claim 9, wherein the separation gap is provided in a "one" shape to separate the chip mounting portion into two of the sub chip mounting portions.
The molded photosensitive assembly according to claim 9, wherein the separation gap is provided in a "T" shape to separate the chip mounting portion into four of the sub chip mounting portions.
The molded photosensitive assembly according to claim 11, wherein four of said sub-chip mounting portions are provided in groups of two, and each of said sub-chip mounting portions is integrally connected to said lens mounting through the same said connection portion unit.
The molded photosensitive component according to any one of claims 3 to 7, further comprising an adhesive layer, wherein the chip mounting portion of the molding base includes at least one receiving groove, and each of the receiving grooves is The chip mounting surface is recessed downward to form a groove for accommodating the adhesive layer, so that the photosensitive element is fixedly mounted on the chip mounting surface of the chip mounting portion through the adhesive layer.
The molded photosensitive assembly according to claim 13, wherein each of the accommodating grooves is provided in the chip mounting portion in an array arrangement.
The molded photosensitive member according to claim 13, wherein each of the accommodating grooves is provided in the chip mounting portion in a circumferential arrangement.
The molded photosensitive assembly according to claim 13, wherein each of the accommodating grooves extends downward from the chip mounting surface to the circuit board to form the grooves having a through-hole structure to pass through the grooves. An adhesive layer adheres the photosensitive element, the chip mounting portion, and the wiring board together.
The molded photosensitive assembly according to claim 16, wherein each of the accommodating grooves is provided in a "back" shape to separate the chip mounting portion into two sub-chip mounting portions through the accommodating grooves, wherein the two The sub chip mounting portions are integrally connected to form the chip mounting portion having an integrated structure.
The molded photosensitive assembly according to any one of claims 4 to 7, further comprising a set of electronic components, wherein the electronic components are mounted at intervals on the lens molding area of the circuit board to The electronic component is covered by the lens mounting portion of the molded base.
The molded photosensitive component according to any one of claims 4 to 7, further comprising at least one set of leads, wherein the photosensitive element includes a photosensitive area, a non-photosensitive area, and at least one set of chip connectors, wherein the non- The light-sensitive area is located around the light-sensitive area, and each group of the chip connectors is respectively disposed in the non-light-sensitive area of the photosensitive element, so that the chip connector and the corresponding circuit are connected through the leads. The board connector is connected in a conducting manner.
The molded photosensitive assembly according to any one of claims 1 to 7, wherein the chip mounting surface of the molding base is lower than the lens mounting surface of the molding base.
A camera module, characterized in that:

An optical lens; and

A molded photosensitive component, wherein the molded photosensitive component includes:

A circuit board

A photosensitive element, wherein the photosensitive element is electrically connected to the circuit board; and

A molding base, wherein the molding base is formed on the circuit board in a molding manner, and provides a flat chip mounting surface and a flat lens mounting surface, wherein the photosensitive elements are correspondingly The chip mounting surface mounted on the molding base, wherein the optical lens is correspondingly mounted on the lens mounting surface of the molding base, and an optical axis of the optical lens is perpendicular to the lens mounting surface The photosensitive surface of the photosensitive element, so that the optical lens is located on the photosensitive path of the photosensitive element.
The camera module according to claim 21, wherein the chip mounting surface and the lens mounting surface provided by the molding base are parallel to each other.
The camera module according to claim 22, wherein the molding base includes a chip mounting portion having the chip mounting surface and a lens mounting portion having the lens mounting surface, and is provided with a reserved space , Wherein the lens mounting portion is located around the chip mounting portion, and the reserved space is located between the chip mounting portion and the lens mounting portion.
The camera module according to claim 23, wherein the circuit board is provided with a chip molding area, a lens molding area, a non-molding area, and at least one set of circuit board connectors, wherein the lens is molded A region is located around the chip molding region, the non-molded region is located between the chip molding region and the lens molding region, and each group of the circuit board connectors is disposed on the circuit board. In the non-molded region, after the molding is performed on the circuit board, the chip mounting portion of the molding base is covered by the chip molding region of the circuit board, and the molding base The lens mounting portion of the mount covers the lens molding area of the circuit board, and the reserved space of the molding base corresponds to the non-molding area of the circuit board.
The camera module according to claim 24, wherein the molding base further comprises at least one connection portion, wherein each of the connection portions integrally extends from the lens mounting portion to the chip mounting portion to form The molded base has an integrated structure.
The camera module according to claim 25, wherein the circuit board is further provided with a connection molding area, wherein the connection molding area is located between the lens molding area and the chip molding area, and The lens molding area and the chip molding area communicate with each other, and after the circuit board is molded, the connection portion of the molding base is covered by the connection molding of the circuit board. A region in which the lens mounting portion and the chip mounting portion are integrated into one by the connection portion.
The camera module according to claim 26, wherein the connection portion has a lens connection end and a chip connection end, wherein the lens connection end of the connection portion is integrally connected with the lens mounting portion, and The chip connection end of the connection portion is integrally connected with the chip mounting portion, wherein the connection portion gradually extends from the lens connection end to the chip connection end.
The camera module according to any one of claims 23 to 27, wherein a thickness of the chip mounting portion is smaller than a thickness of the lens mounting portion.
The camera module according to any one of claims 25 to 27, wherein the chip mounting portion of the molding base includes at least two sub-chip mounting portions spaced apart from each other, and the sub-chips are adjacent to each other. A separation gap is formed between the mounting portions, wherein each of the sub-chip mounting portions is integrally connected to the lens mounting portion through a corresponding one of the connection portions.
The camera module according to claim 29, wherein the separation gap is provided in a "-" shape to separate the chip mounting portion into two sub-chip mounting portions.
The camera module according to claim 29, wherein the separation gap is arranged in a "T" shape to separate the chip mounting portion into four sub-chip mounting portions.
The camera module according to claim 31, wherein four of said sub-chip mounting portions are provided in groups of two, and each of said sub-chip mounting portions is integrally connected to said lens mounting portion through the same connection portion .
The camera module according to any one of claims 23 to 27, further comprising an adhesive layer, wherein the chip mounting portion of the molding base includes at least one accommodating groove, and each of the accommodating grooves is freely located. The chip mounting surface is recessed downward to form a groove for receiving the adhesive layer, so that the photosensitive element is fixedly mounted on the chip mounting surface of the chip mounting portion through the adhesive layer.
The camera module according to claim 33, wherein each of the accommodating grooves is provided in the chip mounting portion in an array arrangement.
The camera module according to claim 33, wherein each of the accommodating grooves is arranged on the chip mounting portion in a circumferential arrangement.
The camera module according to claim 35, wherein each of the receiving grooves is disposed in a concentric ring.
The camera module according to claim 33, wherein each of the accommodating grooves extends downward from the chip mounting surface to the circuit board to form the groove with a through-hole structure to pass the adhesive The bonding layer bonds the photosensitive element, the chip mounting portion, and the circuit board together.
The camera module according to claim 37, wherein each of the accommodating grooves is provided in a "back" shape to divide the chip mounting portion into two sub-chip mounting portions through the accommodating grooves, wherein the two sub-chips The chip mounting portions are integrally connected to form the chip mounting portion having an integrated structure.
The camera module according to any one of claims 24 to 27, further comprising a group of electronic components, wherein the electronic components are mounted on the lens molding area of the circuit board at intervals to pass through The lens mounting portion of the molded base covers the electronic component.
The camera module according to any one of claims 24 to 27, further comprising at least one set of leads, wherein the photosensitive element includes a photosensitive region, a non-photosensitive region, and at least one chip connector, wherein the non-photosensitive element A region is located around the photosensitive region, and each group of the chip connectors is respectively disposed in the non-photosensitive region of the photosensitive element, so as to connect the chip connector with the corresponding circuit board through the leads. The connecting piece is connected in a conducting manner.
The camera module according to any one of claims 21 to 27, wherein the chip mounting surface of the molding base is lower than the lens mounting surface of the molding base.
An electronic device, comprising:

An electronic device body; and

At least one camera module, wherein the camera module is disposed on the electronic device body for acquiring an image, and the camera module is the camera module according to any one of claims 21 to 41.
The electronic device according to claim 42, wherein the camera module faces a front side of the electronic device body.
The electronic device according to claim 42, wherein the camera module faces a rear side of the electronic device body.
A method for manufacturing a molded photosensitive component, comprising the steps of:

Forming a molding base on a circuit board by a molding process, wherein the molding base provides a flat chip mounting surface and a flat lens mounting surface;

Mounting a photosensitive element to the chip mounting surface of the molding base; and

The photosensitive element and the circuit board are connected in a conductive manner to form a molded photosensitive element.
The method of claim 45, wherein the molding base is formed on a circuit board by a molding process, and wherein the molding base provides a flat chip mounting. With a flat surface and a flat lens mounting surface, including the steps:

Placing the circuit board in a second mold of a forming mold;

Clamping a first mold and the second mold of the molding mold to form a molding space of the molding mold between the first mold and the second mold; and

A molding material is added to the molding space of the molding mold to form the molding base on the circuit board integrally after the molding material is cured.
The method for manufacturing a molded photosensitive member according to claim 46, wherein said first mold and said second mold of said forming mold are clamped together, so that said first mold and said second mold are clamped together. The step of forming a forming space between the forming molds includes the steps:

Pressing on a non-molding area of the circuit board by a pressing surface of the first mold;

Correspondingly forming a chip mounting portion molding space in a chip molding area of the circuit board;

Correspondingly forming a lens mounting portion molding space in a lens molding area of the circuit board, wherein the non-molding area is located between the chip molding area and the lens molding area; and

A connection portion molding space is correspondingly formed in a connection molding area of the circuit board, wherein the connection portion molding space communicates the chip mounting portion molding space and the lens mounting portion molding space to form an integrated type. The molding space of the structure.
The method for manufacturing a molded photosensitive member according to claim 47, wherein said adding a molding material to said molding space of said molding die to integrate the molding material on said circuit board after curing The step of forming the molded base includes the steps of:

Forming a lens mounting portion covering the lens molding area of the circuit board in the lens mounting portion forming space, so that a top surface of the lens mounting portion forms the lens mounting surface;

Forming a chip mounting portion covering the chip molding area of the circuit board in the chip mounting portion molding space so that a top surface of the chip mounting portion forms the chip mounting surface; and

Forming a connection portion covering the connection molding area of the circuit board in the connection portion molding space, wherein the connection portion is integrally connected to the chip mounting portion and the lens mounting portion, To form the molded base having an integrated structure.
The method for manufacturing a molded photosensitive member according to claim 47 or 48, further comprising the step of:

By a pressing head of the first mold, it is pressed against a central part of the chip molding area of the circuit board.
The method for manufacturing a molded photosensitive member according to claim 49, further comprising the step of:

After the molding material is cured, a receiving groove is formed in the chip mounting portion.
The method for manufacturing a molded photosensitive member according to claim 49, further comprising the step of:

After the molding material is cured, a separation gap is formed in the chip mounting portion, wherein the separation gap separates the chip mounting portion into at least two sub-chip mounting portions spaced apart from each other.
The method for manufacturing a molded photosensitive member according to claim 47 or 48, wherein said adding a molding material to said molding space of said molding die, so that after said molding material is cured, said circuit board The step of integrally forming the molded base includes the steps of:

Pouring the molding material into the molding space of the lens mounting portion of the molding space; and

Through the connecting portion molding space, the molding material is guided from the lens mounting portion molding space into the chip mounting portion molding space so that the molding material fills the molding space.
The method for manufacturing a molded photosensitive member according to any one of claims 45 to 48, wherein the chip mounting surface and the lens mounting surface are parallel to each other.
The method for manufacturing a molded photosensitive member according to any one of claims 45 to 48, wherein the chip mounting surface is lower than the lens mounting surface.
A method for manufacturing a camera module, comprising the steps of:

Forming a molding base on a circuit board by a molding process, wherein the molding base provides a flat chip mounting surface and a flat lens mounting surface;

Mounting a photosensitive element to the chip mounting surface of the molding base;

Conductively connecting the photosensitive element and the circuit board to make a molded photosensitive component; and

An optical lens is mounted on the lens mounting surface of the molding base, and an optical axis of the optical lens is perpendicular to the photosensitive surface of the photosensitive element to form a camera module.