CN112399029A - Camera module, composite substrate, photosensitive assembly and manufacturing method thereof - Google Patents
Camera module, composite substrate, photosensitive assembly and manufacturing method thereof Download PDFInfo
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- CN112399029A CN112399029A CN201910695386.5A CN201910695386A CN112399029A CN 112399029 A CN112399029 A CN 112399029A CN 201910695386 A CN201910695386 A CN 201910695386A CN 112399029 A CN112399029 A CN 112399029A
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- 239000002131 composite material Substances 0.000 title claims abstract description 71
- 239000000758 substrate Substances 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 47
- 230000017525 heat dissipation Effects 0.000 claims abstract description 207
- 238000000465 moulding Methods 0.000 claims abstract description 139
- 238000000034 method Methods 0.000 claims abstract description 68
- 230000008569 process Effects 0.000 claims abstract description 50
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 206010070834 Sensitisation Diseases 0.000 claims description 14
- 230000008313 sensitization Effects 0.000 claims description 14
- 239000000126 substance Substances 0.000 claims description 13
- 238000003466 welding Methods 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 description 20
- 239000012778 molding material Substances 0.000 description 17
- 238000005538 encapsulation Methods 0.000 description 16
- 230000002829 reductive effect Effects 0.000 description 16
- 230000001965 increasing effect Effects 0.000 description 15
- 238000005452 bending Methods 0.000 description 14
- 239000008393 encapsulating agent Substances 0.000 description 13
- 238000003384 imaging method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 10
- 230000001976 improved effect Effects 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 239000003292 glue Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000009825 accumulation Methods 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- 210000003205 muscle Anatomy 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000009517 secondary packaging Methods 0.000 description 4
- 239000004519 grease Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000003014 reinforcing effect Effects 0.000 description 3
- 230000000452 restraining effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B17/00—Details of cameras or camera bodies; Accessories therefor
- G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
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Abstract
The present invention relates to a composite substrate comprising: the circuit board is provided with a first surface for attaching the photosensitive chip and an opposite second surface; the heat dissipation rib is arranged on the second surface, and at least one part of the heat dissipation rib is positioned in an area overlapped with the chip attachment area; and a back molding part which is manufactured on the second surface through a molding process, and the back molding part, the heat dissipation rib and the circuit board are combined into a whole. The invention also provides a corresponding photosensitive assembly, a camera module and a corresponding manufacturing method. The invention can avoid or restrain the deformation of the photosensitive chip with a smaller space size cost.
Description
Technical Field
The invention relates to the technical field of camera modules, in particular to a camera module, a composite substrate for the camera module, a photosensitive assembly and a manufacturing method of the photosensitive assembly.
Background
With the popularization of mobile electronic devices, technologies related to camera modules applied to mobile electronic devices for helping users to obtain images (e.g., videos or images) have been rapidly developed and advanced, and in recent years, camera modules have been widely applied to various fields such as medical treatment, security, industrial production, and the like.
In order to meet the increasingly wide market demands, a high-pixel, large-chip, small-size and large-aperture camera module is an irreversible development trend of the existing camera module. However, the requirements for high pixel, large chip, small size, and large aperture are difficult to realize in the same image pickup mold. For example, firstly, the market puts forward higher and higher demands on the imaging quality of a camera module, and how to obtain higher imaging quality with a smaller camera module volume has become a big problem in the field of compact camera modules (for example, camera modules for mobile phones), especially on the premise of establishing the technical development trends of high pixels, large apertures, large chips and the like in the mobile phone industry; secondly, the compact development of the mobile phone and the increase of the occupation ratio of the mobile phone screen enable the space in the mobile phone, which can be used for the front camera module, to be smaller and smaller; the number of the rear camera modules is more and more, the occupied area is larger and larger, other configurations of the mobile phone such as the size of a battery and the size of a mainboard are correspondingly reduced, in order to avoid sacrifice of other configurations, the market hopes that the volume of the rear camera modules can be reduced, namely small-size packaging is realized; thirdly, with the increasing popularity of high pixel chips and the increasing functionality of video capture, chip energy consumption and heat dissipation become important issues that need to be addressed during the module design and manufacturing process.
The market demand is a development bottleneck of the camera module packaging industry, and causes the problem that the demand is not solved in time and delay, the reason analysis is mainly as follows:
(1) high pixel, large chip size: because the chip size is gradually increased, for example, the size of a current common chip with more than 4800 ten thousand pixels is 1/2 inches, and a chip with the size of 1/1.7 inch or even larger is popularized in the future, so that the chip size is rapidly increased, but because the photosensitive chip is thinner than a common chip and has the thickness of about 0.15mm, the field curvature problem is more easily generated by a large chip. Meanwhile, since the chip and the circuit board are generally connected by glue, the glue coating generally presents a shape with low periphery and high middle part, such as a Chinese character mi-shaped drawing glue, so that the middle part of the chip slightly bulges. Moreover, when the chip is attached, the chip is also in a bent shape with the periphery lower than the center due to the suction nozzle sucking the chip from the upper part. In addition, the Coefficient of Thermal Expansion (CTE) indexes of products among the chip, the glue and the circuit board are different, for example, the CTE of the chip is 6ppm/C, the CTE of the PCB is 14ppm/C, a baking process is generally adopted in a module assembly process, the chip bending problem is caused based on the difference of the CTE coefficients of various materials, and the chip bending problem is also aggravated due to the fact that the soft and hard combination board which is conventionally adopted in the industry at present adopts a laminating process and is seriously warped. The chip curvature problem can cause a chip field curvature problem in the final module imaging, and finally affect the imaging quality.
Further, under the current trend of miniaturization of devices, in the current mainstream compact camera module (for example, the camera module for a mobile phone), a heat dissipation member is not added on a circuit board, so as to avoid increasing the size of the camera module, but the heat dissipation performance of the circuit board is not sufficient to match the heat dissipation performance requirement of the module. On the other hand, the current high-end camera module has developed 4800 ten thousand pixels and more, and the video shooting demand is gradually highlighted, for example, 4K high definition video shooting, slow motion capture and the like, and then a camera module with higher pixels and higher frame rate is generated, and the power of the corresponding photosensitive chip is greatly increased. The inventor of the present application has found that, as the heat generated by the photosensitive chip during operation is larger and larger, the deformation of the photosensitive chip caused by the heat accumulation is one of the important factors causing the degradation of the imaging quality. Particularly, under the operating condition, along with the rising of the internal temperature of the camera module, the circuit board and the photosensitive chip can be bent, thereby reducing the imaging quality. In other words, even if the high-pixel high-frame-rate photosensitive chip is packaged without molding, the chip is subject to bending due to the influence of temperature. I.e., neither molded nor unmolded packaging, the problem of warpage of high pixel, large chips cannot be solved.
(2) Miniaturization/small size: in the field of compact camera modules, in order to reduce the size of the camera module and improve the manufacturing efficiency, a molding process is adopted to directly form a bracket (such as a MOB or MOC process scheme) of a lens assembly or other components on a circuit board. Specifically, the camera module may include a photosensitive component and a lens component, and the lens group and other optical elements of the lens component are disposed on a photosensitive path of a photosensitive element (typically, a photosensitive chip) of the photosensitive component. It should be noted that in some embodiments, the color filter may be mounted directly to the photosensitive member as part of the photosensitive member, but in other embodiments, the photosensitive member may not include the color filter, and the color filter may be formed as a separate color filter assembly or mounted in other ways on the light transmission path. Therefore, the lens assembly may be a combination of a lens set, a light-transmitting element such as a color filter and a supporting structural member thereof, and the combination may be referred to as a light-transmitting assembly, so that the position of the color filter can be eliminated or reduced, and the height dimension of the module can be further reduced.
Further, the photosensitive assembly can comprise a circuit board and a molding body integrally molded on the circuit board, and the molding body can further realize the advantages of the module in the dimensions such as length, width, height and the like because the molding body eliminates the advantage of an avoiding space of the traditional lens seat attached module. In addition, the molding body can reinforce the strength of the circuit board, and can ensure the flatness of the module on the basis of reducing the thickness requirement of the circuit board, so that the circuit board can be thinned. For example, in the MOC packaging process, the photosensitive element is attached to the circuit board in advance, and then a molded body is formed on the circuit board through a molding process, and the molded body can wrap the non-photosensitive region of a part of the photosensitive element. In the camera module, the combination of the circuit board and the molded body and the combination of the molded body and the photosensitive chip are rigid combination, and the combination is very firm and can be detached through a destructive method. But meanwhile, the circuit board and the photosensitive chip are combined through glue, and the combination belongs to relatively flexible combination. In addition, the thermal expansion Coefficients (CTE) of the circuit board, the molded body, and the photosensitive chip are different, and when the ambient temperature changes greatly in the manufacturing process (for example, the molding material in the molding process needs to be heated to a temperature of more than 150 degrees celsius, the temperature needs to be heated to a temperature of more than 80 degrees celsius in the module baking stage, and the ambient temperature may change many times in the subsequent manufacturing process of producing the camera module), the expansion degrees of the circuit board, the chip, and the molded body are different, and the expansion speeds are also different. The shrinkage degree of the photosensitive chip is usually the minimum, however, because the combination of the circuit board and the molded body belongs to rigid combination, the circuit board and the molded body generate stress, so that the circuit board and the molded body are bent, the bending drives the photosensitive chip to deform, and especially the upward bending deformation of the photosensitive chip can cause the great reduction of the imaging quality of the module. Fig. 24 is a schematic diagram showing the principle that the wiring board and the molded body are bent to deform the photosensitive chip. Note that fig. 24 is exaggerated for ease of understanding, and in practice the amount of curvature may be only a dozen to twenty microns, but this degree of curvature is sufficient to adversely affect imaging quality. For example, such curvature may cause the curvature of the field of the camera module to be excessive, where the image imaged by the camera module appears to be normal in center effect but poor in periphery effect.
(3) Large aperture
Due to the popularization of large pixel chips, the corresponding improvement of optical performance is also an inevitable trend, for example, the optical parameters of lenses such as a large aperture, a large wide angle and the like are gradually improved, so that the resolution performance of the photosensitive chip is realized to the greatest extent. However, the large aperture and large wide angle module set have higher requirements for the flatness of the module set.
Therefore, there is an urgent need for a solution that can avoid or suppress deformation of the photosensitive chip with a small space size cost, and a solution that can ensure the imaging quality of the camera module (especially the imaging quality in a long-time working state) with a small space size cost.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a camera module and a solution for a composite substrate and a photosensitive assembly of the camera module.
In order to solve the above technical problem, the present invention provides a composite substrate for a camera module, the composite substrate comprising: the circuit board is provided with a first surface and a second surface opposite to the first surface, wherein the first surface is provided with a chip attaching area for attaching a photosensitive chip; the heat dissipation rib is arranged on the second surface of the circuit board, and at least one part of the heat dissipation rib is positioned in an area overlapped with the chip attaching area; and a back molding part which is manufactured on the second surface through a molding process, and the back molding part, the heat dissipation rib and the circuit board are combined into a whole.
Wherein, the thickness of heat dissipation muscle is no more than 0.1 millimeter.
Wherein the thickness of the back molding part is not more than 0.2 mm.
Wherein the heat dissipation ribs are directly fabricated on or attached to the second surface, the back molding portion covers the second surface and fills gaps between the heat dissipation ribs, wherein the gaps between the heat dissipation ribs are gaps between a plurality of the heat dissipation ribs or gaps between different portions of a single heat dissipation rib.
The radiating ribs are a plurality of linear strip-shaped radiating ribs arranged in parallel; or a plurality of radiating ribs arranged in a scattered point array; or a single strip-shaped heat dissipation rib which is in a spiral shape or a Chinese character 'mi' shape, or other strip-shaped shapes which can be connected into a whole and still have gaps among different parts; or the heat dissipation ribs are any combination of two or more of the above.
The heat dissipation ribs are formed by hardening metal heat dissipation ribs or heat conduction colloidal substances.
The photosensitive assembly further comprises a secondary heat dissipation part, the top surface of the secondary heat dissipation part is connected with the bottom surface of the heat dissipation rib, the bottom surface of the back molding part is flush with the bottom surface of the secondary heat dissipation part, the bottom surface of the secondary heat dissipation part is exposed outside the back molding part, and the area of the bottom surface of the secondary heat dissipation part is larger than that of the bottom surface of the heat dissipation rib.
Wherein the back molding part covers the bottom surface of the heat dissipation rib.
Wherein the heat dissipating ribs are attached to the second surface by means of bonding or welding.
Wherein, the root of heat dissipation muscle extends to the inside of circuit board.
The circuit board is a multilayer board, the multilayer board comprises a plurality of conducting layers and a plurality of insulating layers which are arranged at intervals, and the conducting layers and the insulating layers are combined together through a laminating process.
According to another aspect of the present application, there is also provided a photosensitive assembly, including: any of the foregoing composite substrates; the bottom surface of the photosensitive chip is attached to the chip attaching area of the composite substrate; and a metal wire electrically connecting the photosensitive chip and the circuit board by a wire bonding process.
The photosensitive assembly further comprises a front molding part, the front molding part is manufactured on the first surface and surrounds the photosensitive chip through a molding process, and the top surface of the front molding part is suitable for mounting a lens assembly; the front molding part and the photosensitive chip are spaced, or the front molding part extends towards the photosensitive chip and contacts the photosensitive chip.
The photosensitive assembly further comprises a lens bracket, the lens bracket is arranged on the first surface and surrounds the photosensitive chip, and the top surface of the lens bracket is suitable for mounting the lens assembly; the lens support is mounted on the first surface after being molded.
The photosensitive assembly further comprises a lens bracket, the lens bracket is mounted on the front molding part, and the top surface of the lens bracket is suitable for mounting a lens assembly; and the lens support is mounted on the front molding part after being molded.
According to another aspect of the present application, there is also provided a camera module, which includes: any one of the above photosensitive elements; and the lens component is arranged on the photosensitive component.
According to another aspect of the present application, there is also provided a method for manufacturing a composite substrate, including: 1) preparing a circuit board, wherein the circuit board is provided with a first surface and a second surface opposite to the first surface, the first surface is provided with a chip attaching area for attaching a photosensitive chip, and the thickness of the circuit board is not more than 0.3 mm; 2) arranging a heat dissipation rib on the second surface, wherein at least one part of the heat dissipation rib is positioned in an area overlapped with the chip attaching area; and 3) manufacturing a back molding part on the second surface through a molding process, wherein the back molding part covers the second surface and fills gaps among the heat dissipation ribs, so that the back molding part, the heat dissipation ribs and the circuit board are combined into a whole, and the gaps among the heat dissipation ribs are gaps among a plurality of heat dissipation ribs or gaps among different parts of a single heat dissipation rib.
In the step 2), the heat dissipation ribs are attached by welding or bonding, and the thickness of the heat dissipation ribs is not more than 0.1 mm.
In the step 1), a seed layer is arranged in the circuit board, and in the step 2), a metal layer is implanted on the seed layer to enable the metal layer to grow and exceed the second surface, so that the heat dissipation ribs are formed; the thickness of the metal layer beyond the second surface is no greater than 0.1 mm.
In the step 2), a heat-conducting colloidal substance is coated on the second surface, and then the heat-conducting colloidal substance is hardened to form the heat dissipation rib, wherein the thickness of the heat dissipation rib is not more than 0.1 mm.
According to another aspect of the present application, there is also provided a method for manufacturing a photosensitive assembly, including: manufacturing a composite substrate by any one of the above composite substrate manufacturing methods; the manufacturing method of the photosensitive assembly further comprises the following steps: 4) attaching a photosensitive chip on the first surface of the circuit board, mounting an electronic element, and electrically connecting the circuit board and the photosensitive chip through a lead bonding process.
Wherein, the step 4) further comprises: and manufacturing a front molding part on the first surface, wherein the front molding part is manufactured on the first surface and surrounds the photosensitive chip through a molding process, and the top surface of the front molding part is suitable for mounting a lens component.
In the step 3) and the step 4), the front surface molding part and the back surface molding part are simultaneously formed on the circuit board through the same molding process.
Wherein, the step 4) further comprises: and mounting a molded lens base on the first surface, wherein the lens base surrounds the photosensitive chip.
Compared with the prior art, the application has at least one of the following technical effects:
1. the utility model provides a sensitization subassembly and module of making a video recording can avoid or restrain sensitization chip deformation with a less space size cost.
2. The utility model provides a sensitization subassembly and the module of making a video recording have improved the structural strength of circuit board.
3. The photosensitive assembly and the camera module of the application improve the heat dissipation efficiency of the photosensitive chip.
4. The sensitization subassembly of this application can guarantee the formation of image quality of the module of making a video recording with a less space size cost with the module of making a video recording.
5. The utility model provides a sensitization subassembly and the module of making a video recording that makes a video recording is particularly suitable for high pixel, high frame rate make a video recording the module.
6. The photosensitive assembly and the camera module are particularly suitable for being combined with MOC and MOB technologies.
7. The utility model provides a photosensitive assembly and module of making a video recording can reduce the radial dimension of the module of making a video recording through setting up some electronic component at the circuit board back, radial dimension means the ascending size of perpendicular to optical axis direction.
8. The back of the photosensitive assembly can be a flat surface, so that the subsequent manufacturing process is convenient to realize, and the photosensitive assembly is convenient to adapt to other parts of terminal equipment (such as a mobile phone).
9. The back of the photosensitive assembly can be a flat surface, and is more suitable for large-scale mass production.
10. The photosensitive assembly and the camera module have high production efficiency.
11. In the photosensitive assembly of this application, the back heat dissipation muscle combines together with encapsulation portion, and on the other hand has improved the structural strength of circuit board, and on the other hand has improved photosensitive chip's radiating efficiency, avoids heat accumulation too fast, has reduced because of the different crooked stress of circuit board that leads to that causes of thermal expansion coefficient, consequently the photosensitive assembly of this application can follow two aspects and restrain photosensitive chip crooked.
12. The photosensitive assembly of this application can restrain the sensitization chip crooked through avoiding the too fast effect with increasing two aspects of structural strength of heat accumulation, therefore the encapsulation portion at the circuit board back and the thickness of heat dissipation muscle can reduce relatively, in other words, this application can realize restraining the crooked effect of sensitization chip with littleer thickness cost.
Drawings
Fig. 1 shows a schematic cross-sectional view of a composite substrate 1000 for a camera module in an embodiment of the present application;
FIG. 2 illustrates a perspective view of the composite substrate 1000 shown in FIG. 1;
FIG. 3 illustrates a schematic front view of a composite substrate 1000 on which the photosensitive chip 50 is mounted in one embodiment of the present application;
FIG. 4 illustrates a schematic cross-sectional view of a photosensitive assembly 2000 including a composite substrate 1000 in one embodiment of the present application;
FIG. 5 shows a schematic backside view of a composite substrate in a variant embodiment of the present application;
FIG. 6 shows a schematic backside view of a composite substrate in another variant embodiment of the present application;
FIG. 7 illustrates a composite substrate based photosensitive assembly 2000 according to another embodiment of the present application;
FIG. 8 illustrates a composite substrate based photosensitive assembly 2000 according to yet another embodiment of the present application;
FIG. 9 shows a schematic cross-sectional view of a photosensitive assembly of yet another alternative embodiment of the present application;
FIG. 10 shows a schematic cross-sectional view of a photosensitive assembly of one variant embodiment of the present application;
fig. 11 shows the wiring board 10 in step S10;
fig. 12 is a schematic diagram illustrating the step S20 of manufacturing the heat dissipation ribs 20 on the second surface 15 of the circuit board 10;
fig. 13 is a schematic view illustrating the circuit board 10 placed in the mold to form the molding cavity in step S30 in an embodiment of the present application;
FIG. 14 shows a schematic view of an embodiment of the present application in which a liquid molding material is injected into a mold cavity and molded into an encapsulant 30;
fig. 15 shows the composite substrate obtained after the mold opening, which includes the wiring board 10, the heat dissipation ribs 20, and the encapsulation portion 30;
FIG. 16A shows a circuit board panel having connector portions;
FIG. 16B shows a circuit board panel without a connector portion;
FIG. 17 is a schematic view of the mold cavity formed after clamping in step S30 of an embodiment of the present application;
FIG. 18 illustrates a schematic view of the mold after step S30 of one embodiment of the present application;
FIG. 19 is a schematic diagram illustrating the method after the mold opening in step S30 according to an embodiment of the present application;
FIG. 20 is a schematic view of the mold cavity formed after clamping in step S31 of an embodiment of the present application;
FIG. 21 illustrates a schematic view of the mold after step S31 of one embodiment of the present application;
FIG. 22 is a schematic diagram illustrating the method after opening the mold in step S31 according to an embodiment of the present application;
FIG. 23 illustrates a composite substrate with heat dissipating extensions in one embodiment of the present application;
FIG. 24 is a schematic view showing the principle of deformation of the photosensitive chip caused by bending of the wiring board and the molded body;
FIG. 25 is a schematic cross-sectional view of a camera module in an embodiment of the present application;
fig. 26 shows a schematic cross-sectional view of a camera module in another embodiment of the present application;
fig. 27 shows a schematic cross-sectional view of a camera module in a further embodiment of the present application;
FIG. 28 is a schematic cross-sectional view of a camera module according to yet another embodiment of the present application;
fig. 29 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application;
fig. 30 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application;
fig. 31 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application;
FIG. 32 shows a schematic cross-sectional view of a composite substrate 1000 in another embodiment of the present application;
fig. 33 is a schematic view showing that the wiring board 10 is placed in a mold to form a molding cavity in step S30 in another embodiment of the present application;
fig. 34 shows a schematic view of another embodiment of the present application in which a liquid molding material is injected into a molding cavity and molded into the package 30.
Detailed Description
For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that the detailed description is merely illustrative of exemplary embodiments of the present application and does not limit the scope of the present application in any way. Like reference numerals refer to like elements throughout the specification. The expression "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that the expressions first, second, etc. in this specification are used only to distinguish one feature from another feature, and do not indicate any limitation on the features. Thus, a first body discussed below may also be referred to as a second body without departing from the teachings of the present application.
In the drawings, the thickness, size, and shape of an object have been slightly exaggerated for convenience of explanation. The figures are purely diagrammatic and not drawn to scale.
It will be further understood that the terms "comprises," "comprising," "includes," "including," "has," "including," and/or "including," when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. Moreover, when a statement such as "at least one of" appears after a list of listed features, the entirety of the listed features is modified rather than modifying individual elements in the list. Furthermore, when describing embodiments of the present application, the use of "may" mean "one or more embodiments of the present application. Also, the term "exemplary" is intended to refer to an example or illustration.
As used herein, the terms "substantially," "about," and the like are used as terms of table approximation and not as terms of table degree, and are intended to account for inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art.
Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
As mentioned above, as the mobile phone camera module is developed to have high pixel and high frame rate, the heat generated by the photosensitive chip during operation is increasingly large. The inventor of the present application finds that the superposition of factors such as heat accumulation and increase in the size of the photosensitive chip (the size of the photosensitive chip is increased due to high pixels) makes the photosensitive chip easily deformed, and the deformation is enough to cause the imaging quality of the camera module to be reduced. Specifically, under the development trend of the current mobile phone market (mobile phone camera module market), firstly, the area of the photosensitive chip is large, the power is high, and the generated heat is large; the area of the two photosensitive chips is large, the thickness of the two photosensitive chips is small, and the chips are easily influenced by foreign matters due to the proportion; thirdly, the photosensitive chip is influenced by the force generated by the deformation of foreign objects such as circuit boards and molding, so that the photosensitive chip is more prone to deformation. Based on this, the applicant has proposed a composite substrate capable of suppressing the above-mentioned distortion, and a photosensitive element and an image pickup module based on the composite substrate. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 shows a schematic cross-sectional view of a composite substrate 1000 for a camera module according to an embodiment of the present application. Referring to fig. 1, in the present embodiment, the composite substrate 1000 includes a circuit board 10, a heat dissipation rib 20, and a back surface sealing portion 30. The wiring board 10 has a first surface 14 for attaching a photosensitive chip and a second surface 15 opposite to the first surface 14. The heat dissipation ribs 20 are directly formed on the second surface 15. The material for manufacturing the heat dissipation ribs has good heat conductivity, in the embodiment, the heat conduction coefficient of the material adopted by the heat dissipation ribs is 10-1000W/mK, and the specific material can be copper, aluminum, silver, metal alloy or heat conduction silicone grease and the like. The back encapsulant 30 covers the second surface 15 and fills gaps between the heat sink ribs 20. Further, fig. 2 shows a perspective view of the composite substrate 1000 shown in fig. 1. Referring to fig. 2, the wiring board 10 may include a board body 11, a connector 12, and a flexible connection tape 13. Only the wiring board main body 11 is shown in fig. 1. In this embodiment, the heat dissipation ribs 20 are actually attached to the back surface of the wiring board main body 11, and therefore the connector 12 and the flexible connection tape 13 are omitted in some drawings. In this embodiment, the circuit board main body 11 may be a PCB. The heat dissipation ribs 20 are a plurality of linear strip-shaped heat dissipation ribs 21 arranged in parallel. Accordingly, the backside packaging part 30 is filled between the linear strip-shaped heat dissipation ribs 21 arranged in parallel, and covers the second surface 15. The back side encapsulant 30 is shown separated from the wiring board 10 in fig. 2 for clarity of illustration. The back side encapsulant 30 may be formed on the second surface 15 by a molding process. Of course, in other embodiments, the back side sealing portion 30 can be implemented by other sealing processes such as injection molding, mold pressing, etc., as long as the second surface 15 can be covered and the gap between the heat dissipation ribs 20 can be filled to realize sealing.
Here, based on different packaging methods, the back side packaging part is provided based on different packaging processes, and the heat dissipation rib is provided with different requirements, if the processing is performed by a transfer molding method, because a mold is required to press the surface of the circuit board to form a flow channel, the direction in which the heat dissipation rib is provided should preferably be parallel to a molded press-fit edge (i.e., an exposed edge of the circuit board), or at a certain angle, for example, at an angle of 45 degrees or less than 45 degrees with the press-fit edge, so as to facilitate the injection of the molding fluid and prevent the occurrence of an "short shot" condition. The molding process mainly uses molding powder for packaging, and the surface flatness of the molded package is different from that of the molded package.
Further, fig. 3 shows a schematic front view of the composite substrate 1000 on which the photosensitive chip 50 is mounted in one embodiment of the present application. For convenience of understanding, the side facing the photosensitive surface is referred to as the front surface, and the side facing away from the photosensitive surface is referred to as the back surface. Referring to fig. 3, in the present embodiment, the photosensitive chip 50 is attached to the center of the circuit board 10. The area of the first surface 14 of the wiring board 10 for attaching the photosensitive chip 50 is referred to as a chip attaching area. Further, fig. 4 shows a schematic cross-sectional view of a photosensitive assembly 2000 including a composite substrate 1000 according to an embodiment of the present application. Referring to fig. 3 and 4 together, it can be seen that in the present embodiment, a portion of the heat dissipation rib 20 is located in a region of the second surface corresponding to the back of the chip attach region. Wherein, the linear heat dissipation ribs 21 are partially located in the back region of the chip attachment region, and two ends of the linear heat dissipation ribs 21 extend to the outside of the chip attachment region. The other part of the linear strip-shaped heat dissipation rib 21 is located at the edge area of the circuit board 10, that is, the part of the linear strip-shaped heat dissipation rib 21 is located outside the chip attachment area. In this embodiment, since at least a part of the heat dissipation ribs 20 are arranged in the region overlapping with the photosensitive chip, the distance between the photosensitive chip and the heat dissipation ribs can be shortened, and the heat dissipation efficiency can be increased. In this embodiment, the bottom surface of the heat dissipation rib is exposed outside the back surface packaging part, so as to improve the heat dissipation effect. In this embodiment, back portion heat dissipation muscle combines together with the encapsulation portion, has improved the structural strength of circuit board on the one hand, and on the other hand has improved the radiating efficiency of sensitization chip, avoids the heat accumulation too fast, has reduced the crooked stress of circuit board that leads to because of thermal expansion coefficient difference causes, consequently the sensitization subassembly of this application can follow two aspects and restrain the sensitization chip crooked.
Further, still referring to fig. 1, in one embodiment of the present application, a bottom surface of the backside encapsulation is flush with a bottom surface of the heat dissipation rib. In this embodiment, the back surface of the photosensitive component may be a flat surface, which is convenient for the implementation of the subsequent manufacturing process, is convenient for being adapted to other components of the terminal device (such as a mobile phone), and is more suitable for large-scale mass production. Further, in this embodiment, the thickness of the heat dissipation rib 20 may be 0.05mm-0.4mm, which ensures that the strength of the photosensitive assembly can be effectively enhanced without increasing the thickness of the camera module, and the bending effect of the photosensitive chip is suppressed by the dual functions of enhancing the structural strength and enhancing the heat dissipation, thereby effectively preventing the image quality (e.g., field curvature) of the camera module from decreasing. In addition, because the molded body can play a role in reinforcing the circuit board, the circuit board selected in the technical scheme can be thinner than the circuit board of the conventional design scheme, and the thickness of the circuit board is generally reduced by 0.1mm, so that the height of the module cannot be increased under certain conditions. The thickness of the conventional circuit board is generally 0.35mm or more (e.g., 0.35mm-0.45mm), while the thickness of the circuit board of the MOB module can be less than 0.3mm, and ideally less than 0.25 mm. Note that, in the present embodiment, the thickness refers to an axial dimension, i.e., a dimension in the optical axis direction of the camera module. Axial direction may also be understood as the normal direction of the light-sensing surface or first surface. It should be noted that although in the above embodiments, the bottom surface of the back surface encapsulation portion is flush with the bottom surface of the heat dissipation rib, the application is not limited thereto. For example, fig. 32 shows a schematic cross-sectional view of a composite substrate 1000 in another embodiment of the present application. In this embodiment, the back side encapsulant 30 is a back side molding directly formed on the second surface 15 (i.e., the back side) of the circuit board by a molding process, and the back side molding covers the bottom surface of the heat dissipation rib 20 instead of being flush with the bottom surface of the heat dissipation rib 20. This scheme can help to improve product yield. Because of the possible lack of consistency of the incoming molding material, the problem of uneven bottom surface of the molding is sometimes encountered if the back encapsulant is to be directly made flush with the bottom surface and the heat sink ribs during molding. Therefore, in the embodiment, the back molding portion covers the bottom surface of the heat dissipation rib 20, so that the bottom surface 38 completely made of the molding material can be obtained, the bottom surface 38 can have high flatness, the process difficulty is reduced, the requirement on the quality of the molding material can be reduced, and the improvement of the product yield and the reduction of the production cost are facilitated. Further, in an embodiment of the present application, on the basis that the back surface molding portion covers the second surface and the bottom surface of the heat dissipation rib, a distance between the bottom surface 38 of the back surface molding portion and the bottom surface of the heat dissipation rib may be not greater than 0.1mm, and a distance between the bottom surface 38 of the back surface molding portion and the second surface 15 may be not greater than 0.2mm (i.e., a thickness of the back surface molding portion is not greater than 0.2 mm). The resulting composite substrate still has a small thickness. Further, in an embodiment of the present application, when the back molding part covers the second surface 15 and the bottom surface of the heat dissipation rib 20, the thickness of the circuit board may be further reduced to 0.25mm or less than 0.25 mm.
Further, still referring to fig. 3, in an embodiment of the present application, the photosensitive chip 50 is rectangular, the rectangle has a long side L and a short side W, and the heat dissipation rib 20 is formed by a plurality of parallel linear strip-shaped heat dissipation ribs. The plurality of parallel linear strip-shaped heat dissipation ribs may be parallel to the long side L of the photosensitive chip 50. The typical photosensitive chip is in a 16:9 rectangular shape, the warpage degree of the chip usually appears on the long side and the short side of the chip is different, the orientation of the heat dissipation rib adopted in the embodiment is more favorable for restraining and preventing the photosensitive chip from bending, so the heat dissipation rib is preferably arranged along the direction parallel to the long side of the photosensitive chip.
In another embodiment of the present application, the circuit board 10 (actually, the circuit board main body 11) has a rectangular shape having a long side and a short side, and the linear strip-shaped heat dissipation ribs are parallel to the long side of the circuit board 10. The trend of the heat dissipation rib that this embodiment adopted is favorable to restraining more and prevents that the sensitization from taking place the bending. Note that, in fig. 3, the long side direction of the photosensitive chip coincides with the long side direction of the wiring board, but the present application is not limited thereto, because the long side of the photosensitive chip and the long side of the wiring board may be in a perpendicular state in some cases.
Further, fig. 5 shows a schematic backside view of a composite substrate in a variant embodiment of the present application. Referring to fig. 5, in the present embodiment, another shape of the heat dissipation rib 20 is adopted, that is, the heat dissipation rib 20 is formed by a single strip-shaped heat dissipation rib integrally connected together. The heat dissipating ribs 20 are substantially "m" shaped at a bottom view. The gaps between the heat dissipation ribs can be understood as gaps between different portions of a single heat dissipation rib. The back surface package portion 30 fills the gap to realize packaging. This embodiment can strengthen the structural strength of circuit board diagonal direction, horizontal line direction, perpendicular line direction, supports the circuit board in a plurality of directions, suppresses photosensitive assembly's four corners warpage, strengthens the ability that hinders photosensitive assembly crooked, alleviates photosensitive assembly crooked. In some cases, the chip is prone to be bent upward at the center due to the concentration of glue (i.e., glue) applied inside the chip in the middle, or due to the suction nozzle sucking the chip from the upper part to be attached to the circuit board, and the degree of bending may be increased in the subsequent processes. In a preferred embodiment of the present invention, the center of the heat dissipation rib structure of the heat dissipation rib is located at a position corresponding to the center area of the chip, and the center of the chip is reinforced and fixed, so as to suppress upward warpage of the center of the chip and suppress four corners of the photosensitive assembly, thereby suppressing field curvature of the chip.
Further, fig. 6 shows a schematic backside view of a composite substrate in another variant embodiment of the present application. Referring to fig. 6, in the present embodiment, another shape is adopted for the heat dissipation rib 20, that is, the heat dissipation rib 20 is formed by a single strip-shaped heat dissipation rib integrally connected together. The heat dissipating ribs 20 are substantially square spiral in a bottom view. Similar to the embodiment of fig. 5, in the present embodiment, the gap between the heat dissipation ribs may be understood as a gap between different portions of a single heat dissipation rib. The back surface package portion 30 fills the gap to realize packaging. This embodiment can strengthen the structural strength of circuit board, at a plurality of direction support circuit boards, strengthens the ability that hinders the sensitization subassembly crooked, alleviates the sensitization subassembly crooked.
It should be noted that other shapes of the heat sink ribs 20 may be used, such as "X" shaped heat sink ribs, "loop" shaped or annular shaped. The heat dissipating ribs 20 may also be a plurality of small heat dissipating ribs arranged in a scattered array. The heat dissipation ribs 20 may also be a combination of two or more of the foregoing, for example, a plurality of parallel linear strip-shaped heat dissipation ribs and a "meter" shaped heat dissipation rib may be disposed on the back of the same circuit board. Various combination modes can be flexibly set, and are not described in detail herein.
Further, in an embodiment of the present application, the heat dissipation rib may be made of a metal material. For example, a multilayer PCB board may be employed as the wiring board. The multi-layer PCB board has multiple layers, and each layer can be provided with circuits and designed functional circuits. The different layers can be conducted through copper columns (or other metal columns) so as to connect the whole circuit board into a whole (electrically). In this embodiment, a copper seed layer may be formed in a certain layer of the circuit board, and then copper pillars are implanted on the seed layer by electroplating and grown to a position outside the second surface (i.e., the back surface) of the circuit board, so as to form the required heat dissipation ribs. In this embodiment, the manufacturing process of the heat dissipation rib can be compatible with the process in the manufacturing of the circuit board, the mass production is easy, and the obtained composite substrate has high structural strength. The layer of the multi-layer PCB used to make the seed layer may not be used for circuit conduction, but may be dedicated to reinforcing the structural strength of the circuit board.
In another embodiment of the present application, the heat dissipating ribs may be formed using a thermally conductive colloidal substance. For example, the thermally conductive colloidal substance may be applied to the second surface (i.e., the back-side surface) of the circuit board in a desired shape, and then hardened to form the heat dissipating ribs. The thermally conductive colloidal substance may be, for example, thermally conductive silicone grease.
In yet another embodiment of the present application, the heat dissipating ribs may be molded and then attached to the second surface (i.e., the backside surface) of the circuit board by bonding, welding, or the like. The preformed heat sink ribs may be made of metal or hardened heat conductive colloidal substance, such as heat conductive silicone grease.
Further, still referring to fig. 4, according to an embodiment of the present application, a composite substrate based photosensitive assembly 2000 is provided. The photosensitive assembly 2000 includes a composite substrate. The composite substrate may include a wiring board 10, heat dissipation ribs 20, and a back side encapsulation portion 30. The photosensitive chip 40 is attached to the first surface 14 of the wiring board 10. The heat dissipation ribs 20 are directly formed on the second surface 15 of the circuit board 10. The back side encapsulant 30 fills the gaps between the heat sink ribs 20 and the second surface 15 to achieve an encapsulation effect. The photosensitive assembly 2000 further includes an electronic component 50, and the electronic component 50 may be mounted on the first surface 14 and disposed around the photosensitive chip 40. The electronic component 50 may be a passive device such as a capacitive element or an inductive element, or may be an active device such as a memory chip or an image processor chip. The photosensitive assembly can also include a metal Wire 60, and the metal Wire 60 can electrically connect the photosensitive chip and the circuit board through a Wire Bonding (also referred to as "Wire Bonding", "binding", or "routing") process. The metal line 60 may be a metal line with better conductivity, such as a gold line, an aluminum line, or a copper line.
Further, fig. 7 shows a composite substrate based photosensitive assembly 2000 according to another embodiment of the present application. The present embodiment differs from the previous embodiment (refer to fig. 4) in that the electronic component 50 is arranged on the back side of the wiring board 10, i.e., the electronic component 50 is mounted on the second surface 15. The back side packaging part 30 can wrap the electronic element 50 or fill around the electronic element 50, thereby realizing the packaging of the back side of the circuit board. In this embodiment, since the electronic component can be arranged on the back surface of the wiring board, a space for arranging the electronic component on the front surface of the wiring board can be omitted, thereby contributing to reduction in the radial dimension of the photosensitive assembly. In this embodiment, the radial dimension refers to a dimension in a direction perpendicular to an optical axis of the camera module. And the thickness direction of the circuit board may be referred to as an axial direction, which is parallel to the optical axis of the camera module. Note that the electronic components may be entirely disposed on the back surface of the wiring board, or may be partially disposed on the back surface of the wiring board, and partially disposed on the front surface of the wiring board.
Further, fig. 8 illustrates a composite substrate based photosensitive assembly 2000 according to yet another embodiment of the present application. The present embodiment differs from the embodiment of fig. 4 in that a secondary heat sink 22 is added. Wherein, the top surface of the secondary heat dissipation part 22 is connected with the bottom surface of the heat dissipation rib 20. The bottom surface of the back side encapsulation 30 may be flush with the bottom surface of the secondary heat sink member 22, and the bottom surface of the secondary heat sink member 22 is exposed outside the back side encapsulation 30. The area of the bottom surface of the secondary heat dissipation portion 22 is larger than the area of the bottom surface of the heat dissipation rib 20. Thus, the surface area of the heat dissipation member can be increased, and the heat dissipation efficiency can be improved. It is noted that fig. 8 is not the only implementation of the secondary heat sink 22, for example, in another embodiment, the longitudinal section of the secondary heat sink 22 may be trapezoidal such that the cross-sectional area of the secondary heat sink gradually increases from the top surface to the bottom surface thereof. The surface area of the heat dissipation component can be increased by the implementation mode, and the heat dissipation efficiency is improved.
Further, fig. 9 shows a schematic cross-sectional view of a photosensitive assembly of an embodiment of still another variation of the present application. Referring to fig. 9, in the present embodiment, the photosensitive assembly eliminates the backside packaging part, i.e., the heat dissipation ribs 20 are formed on (or attached to) the second surface (backside) of the circuit board 10. The bottom surface and the side surface of the heat dissipation rib 20 are exposed to the outside. The heat dissipation ribs 20 may be a plurality of linear strip-shaped heat dissipation ribs arranged in parallel, a plurality of heat dissipation ribs arranged in a scattered array, or a single strip-shaped heat dissipation rib, and the single strip-shaped heat dissipation rib is spiral or in a shape like a Chinese character 'mi', or in other strip-shaped shapes which can be connected into a whole but still have gaps between different parts; the ribs may be any combination of two or more of the above.
Further, in an embodiment of the present application, the photosensitive assembly may further include a front molding portion, and the front molding portion may be formed on the first surface and around the photosensitive chip through a molding process. In this embodiment, a space is provided between the front molding portion and the photosensitive chip, that is, the MOB process. Also, in the present embodiment, the top surface of the front molding portion is adapted to mount a lens assembly. Here, the lens assembly may be a lens assembly having a motor, or may be a lens assembly without a motor.
Further, in another embodiment of the present application, the photosensitive assembly may further include a front molding portion, the front molding portion may be formed on the first surface and around the photosensitive chip by a molding process, and the front molding portion extends toward the photosensitive chip and contacts the photosensitive chip (for example, the front molding portion may cover an edge region of the photosensitive chip), that is, an MOC process. Also, in the present embodiment, the top surface of the front molding portion is adapted to mount a lens assembly. Here, the lens assembly may be a lens assembly having a motor, or may be a lens assembly without a motor. The lens component and the photosensitive component are assembled together to obtain the camera module.
It should be noted that when the photosensitive assembly is packaged by the MOC process, the photosensitive chip may be more easily bent due to the molding body integrally formed on the photosensitive chip. For example, in a photosensitive assembly packaged by an MOC process, not only the bending of the photosensitive chip may occur after a long time use, but also the bending of the photosensitive chip may occur during the manufacturing process. For another example, in a photosensitive assembly packaged by an MOC or MOB process, not only the high-pixel and high-frame-rate camera module may be bent after a long time use, but also the bending phenomenon may occur in the camera module with a relatively low pixel count and frame rate. This is because the temperature change of the manufacturing environment is relatively large (for example, the temperature is increased to 150 degrees from room temperature and then decreased to room temperature) during the molding process, and the thermal expansion coefficients of the molding material and the circuit board are different, so that stress is easily generated between the molding material and the circuit board, and the photosensitive element of the MOC/MOB module is more easily bent. Therefore, for the photosensitive assembly packaged by the MOC/MOB process, the heat dissipation ribs in the foregoing embodiments are disposed on the back surface of the circuit board, so that a more significant effect can be achieved in terms of suppressing the bending of the photosensitive chip. Furthermore, the thickness requirement of the circuit board can be reduced by combining the molded body and the heat dissipation ribs, and meanwhile, the circuit board has good flatness, and the heat dissipation performance is remarkably improved compared with the existing product.
Further, in another embodiment of the present application, the front molding may be replaced with a lens holder (sometimes also referred to as a lens mount). The lens holder is mounted on the first surface after being molded. Specifically, the lens holder is mounted on the first surface and surrounds the photosensitive chip, and the top surface of the lens holder is suitable for mounting a lens component.
Further, in another embodiment of the present application, the photosensitive member may further include a color filter, and the color filter may be mounted to the front molding part or the lens holder. When the color filter is mounted to the front molding part, a top surface of the front molding part may form a stepped structure to which the color filter is mounted.
Further, in another embodiment of the present application, the photosensitive element may not include a color filter. A color filter assembly can be added in the camera module, and the color filter assembly comprises a lens base and a color filter arranged on the lens base. The photosensitive assembly may have a front molding portion, and a bottom portion of the mirror base is mounted on a top surface of the front molding portion. The top surface of the lens base is provided with a lens component.
It should be noted that, in the above embodiments, the photosensitive chips are all attached to the front surface, i.e. the first surface, of the circuit board, but the present application is not limited thereto. In a modified embodiment, the center of the wiring board may have a main through hole that can accommodate the photosensitive chip, and the photosensitive chip may be mounted in the main through hole. This fabrication process helps to reduce the axial dimension of the photosensitive assembly. I.e. reducing the size in the direction of the optical axis (referring to the optical axis of the camera module or lens assembly). FIG. 10 shows a schematic cross-sectional view of a photosensitive assembly of one variant embodiment of the present application. Referring to fig. 10, in the present embodiment, the circuit board and the photosensitive chip form a combined body, where a surface of the photosensitive chip facing the photosensitive surface is a front surface of the combined body, and a surface opposite to the front surface is a back surface of the combined body. Heat dissipating ribs are located on the back of the assembly, wherein the heat dissipating ribs are fabricated directly on or attached to the back of the assembly. In addition, in this embodiment, the back surface of the assembly includes the back surfaces of the circuit board and the photosensitive chip, and at least a part of the heat dissipation rib is located on the back surface of the photosensitive chip.
Further, according to another embodiment of the present application, a method for fabricating a photosensitive element is also provided, which includes the following steps S10-S40 performed in sequence.
In step S10, a wiring board 10 is prepared. Fig. 11 shows the wiring board 10 in step S10. The circuit board 10 has a first surface 14 for attaching a photosensitive chip and a second surface 15 opposite to the first surface 14, wherein the first surface 14 has a chip attaching area. The circuit board 10 of this step may be a PCB, which may be manufactured by itself or ordered in the market (note that there is no such product in the market at present, in other words, the structure of the circuit board 10 itself in this step is not prior art). In this embodiment, the thickness of the circuit board is not greater than 0.3 mm.
In step S20, a heat dissipation rib 20 is formed on the second surface 15 (i.e., the back surface) of the circuit board 10. Fig. 12 shows a schematic diagram of the step S20 of manufacturing the heat dissipation ribs 20 on the second surface 15 of the circuit board 10. At least a part of the heat dissipation rib 20 is located directly below the chip attachment region (note that the wiring board 10 is turned upside down in fig. 12, and thus the heat dissipation rib 20 is located above the wiring board 10 in fig. 12), that is, an area on the second surface 15 overlapping the chip attachment region. In this embodiment, the heat dissipating ribs 20 may be provided in a predetermined shape. For example, the heat dissipation rib may be formed by a plurality of parallel linear strip-shaped heat dissipation ribs. In this embodiment, the thickness of the heat dissipation rib 20 may reach 0.1mm or less than 0.1 mm. The thickness of the heat dissipation rib refers to the size of the heat dissipation rib in the normal direction of the second surface, the thickness of the heat dissipation rib is the size of the heat dissipation rib exceeding the second surface, and if the root of the heat dissipation rib is located inside the circuit board, the part located inside the circuit board is not calculated within the thickness of the heat dissipation rib.
Step S30, covering a back-side encapsulation portion on the second surface, wherein the back-side encapsulation portion covers the second surface and fills gaps between the heat dissipation ribs, wherein the gaps between the heat dissipation ribs are gaps between a plurality of heat dissipation ribs or gaps between different portions of a single heat dissipation rib; the bottom surface of the heat dissipation rib is exposed outside the back surface packaging part, and the bottom surface of the back surface packaging part is flush with the bottom surface of the heat dissipation rib. In this embodiment, the back side encapsulation portion may be formed on the second surface by a molding process. Specifically, fig. 13 shows a schematic diagram of the circuit board 10 placed in the mold to form the molding cavity in step S30 in an embodiment of the present application. Fig. 14 shows a schematic view of an embodiment of the present application in which liquid molding material is injected into the molding cavity and molded into the encapsulant 30. Referring to fig. 13, the wiring board 10 is placed in a mold including an upper mold 91 and a lower mold 92. The second surface 15 of the circuit board 10 faces upward, and the second surface 15 has heat dissipation ribs 20. The heat dissipating ribs 20 have gaps therebetween, the bottom surface of the upper mold 91 presses the end surfaces of the heat dissipating ribs 20, and the lower mold 92 bears against the first surface 14 of the circuit board 10. After the upper and lower molds are closed, a molding cavity is formed among the upper mold 91, the circuit board 10 and the heat dissipation ribs 20. Then, referring to fig. 14, a liquid molding material is injected into the molding cavity of fig. 13, and the liquid molding material is cured to form the encapsulant 30. Further, fig. 15 shows a composite substrate obtained after mold opening, which includes the wiring board 10, the heat dissipation ribs 20, and the sealing portion 30. In this step, the thickness of the back molding part manufactured by the molding process may be 0.1mm or less than 0.1 mm. It should be noted that although the above-described embodiment adopts a solution in which the bottom surface of the back surface molding portion is flush with the bottom surface of the heat dissipation rib, the present application is not limited thereto. For example, in another embodiment of the present application, the back molding portion may cover both the second surface 15 and the bottom surface of the heat dissipation rib 20 (refer to fig. 32). In this embodiment, a gap 39 may be left between the upper mold 91 and the bottom surface of the heat dissipation rib 20 (the bottom surface of the heat dissipation rib 20 faces upward in fig. 13 to 14) (refer to fig. 33, and fig. 33 shows a schematic diagram of the circuit board 10 placed in the mold to form the molding cavity in step S30 in another embodiment of the present application). The gap 39 may be 0.1mm (other values are possible, for example 0.06mm, typically no more than 0.1 mm). Further, fig. 34 shows a schematic view of another embodiment of the present application in which a liquid molding material is injected into a molding cavity and molded into the package 30. Because of the possible lack of consistency of the incoming molding material, the problem of uneven bottom surface of the molding is sometimes encountered if the back encapsulant is to be directly made flush with the bottom surface and the heat sink ribs during molding. The back molding part covers the bottom surface of the heat dissipation rib, so that a bottom surface completely made of molding materials can be obtained, the bottom surface has high flatness, the process difficulty is reduced, the requirement on the quality of the molding materials can be reduced, the product yield is improved, and the production cost is reduced. Further, in an embodiment of the present application, when the back mold covers the second surface and the bottom surface of the heat dissipation rib, the thickness of the circuit board may be further reduced to 0.25mm or less than 0.25 mm.
In step S40, a photosensitive chip and other components (such as electronic components, metal wires, a mirror base, and a color filter) are mounted on the first surface (i.e., the front surface) of the circuit board, thereby manufacturing the photosensitive assembly. Wherein, the photosensitive chip can be pasted on the chip attaching area of the first surface.
Further, in an embodiment, in the step S20, the heat dissipation rib may be directly formed on the second surface of the circuit board. For example, the circuit board may have a seed layer, and the metal layer is implanted on the seed layer so that the metal layer grows and exceeds the second surface, thereby forming the heat dissipation rib. For another example, in a modified embodiment, the second surface may be coated with a thermally conductive colloidal substance, and then the thermally conductive colloidal substance is hardened to form the heat dissipation rib.
Further, in another embodiment, the heat dissipation rib may be pre-formed and then attached to the second surface of the heat dissipation rib by welding or bonding.
In the above embodiments, the heat dissipation ribs are first fabricated and then molded to form the back side package portion. The present application is not so limited. For example, in another embodiment of the present application, another manufacturing method of a photosensitive assembly is also provided, and different from the manufacturing method of the foregoing embodiment, in this embodiment, a back side packaging portion may be formed by molding on the back side of a circuit board, and then the heat dissipation rib is manufactured or attached to the second surface (i.e., the back side) of the circuit board. Specifically, in the present embodiment, the execution order of the step S30 and the step S20 is reversed, that is, the step S30 is executed first and then the step S20 is executed. In step S30, the back side package portion may be formed on the second surface by a molding process, and during the molding process, a through hole may be left in the back side package portion by using a ram (or a protruding structure of an upper mold), and the through hole exposes a portion of the second surface outside the back side package portion. Fig. 17 shows a schematic view of the mold cavity formed after mold clamping in step S30 according to an embodiment of the present application. Referring to fig. 17, the upper mold 91 has a plurality of downward protruding structures 93, the protruding structures 93 are against the second surface 15 of the circuit board 10, and a molding cavity surrounding the protruding structures 93 can be formed between the upper mold 91 and the circuit board 10. FIG. 18 shows a schematic view of the molded product in step S30 according to an embodiment of the present application. Referring to fig. 18, it can be seen that a liquid molding material is injected into the molding cavity and cured, resulting in a back side encapsulant 30. As can be seen in fig. 18, the back encapsulant 30 may surround the raised structures 93, or the back encapsulant 30 fills the gaps between the raised structures 93 and the mold. Further, fig. 19 shows a schematic diagram of the mold opening (also referred to as mold release) in step S30 according to an embodiment of the present application. Referring to fig. 19, after the mold is opened, the back side packaging part 30 is reserved with a through hole 31, and the through hole 31 may be in a long strip shape. Step S20 is performed on the obtained wiring board having the back surface package part 30. In step S20, the heat dissipation ribs are formed in the through holes of the back surface sealing part, so that the composite substrate shown in fig. 15 is obtained.
Still further, in one embodiment, after the steps S20 and S30, the following steps S31 and S32 may also be performed.
Step S31, a secondary packaging part is manufactured on the bottom surface of the back packaging part by a molding process, the secondary packaging part having a secondary through hole exposing the bottom surface of the heat dissipation rib and a bordering area of the bottom surface of the back packaging part around the heat dissipation rib. Fig. 20 is a schematic diagram illustrating the mold cavity formed after mold clamping in step S31 according to an embodiment of the present application. Referring to fig. 20, in the present embodiment, the upper mold 91 may have a plurality of downward protruding structures 93, and these protruding structures 93 are against the upper surface (note that, since the composite substrate is inverted in fig. 20, the upper surface is actually the back surface) of the composite substrate (which may be composed of the circuit board 10, the heat dissipation ribs 20, and the back surface sealing portion 30) obtained after steps S20 and S30 are completed, in the present embodiment, the composite substrate is still actually a semi-finished product), and a molding cavity surrounding the protruding structures 93 may be formed between the upper mold 91 and the composite substrate. FIG. 21 is a schematic view of the molded product in step S31 according to an embodiment of the present application. Referring to fig. 21, it can be seen that the injection of the liquid molding material into the molding cavity and the curing thereof can result in the secondary molded portion, i.e., the secondary encapsulation portion 32, which reserves the secondary through hole (shown in fig. 22). Further, fig. 22 shows a schematic diagram of the mold opening (also referred to as mold release) in step S31 according to an embodiment of the present application. Referring to fig. 22, after the mold is opened, a composite substrate having a secondary packaging part 32 can be obtained. The secondary package 32 has a secondary through hole 33, and the secondary through hole 33 exposes the bottom surface of the heat-dissipating rib 20 (facing upward in fig. 22) and an adjoining area 34 of the bottom surface of the back package at the periphery of the heat-dissipating rib 20.
Step S32, fabricating a heat dissipation extension in the secondary through hole, and obtaining a composite substrate with the heat dissipation extension. FIG. 23 illustrates a composite substrate with heat dissipating extensions in one embodiment of the present application. The composite substrate can be used to fabricate a photosensitive assembly as shown in fig. 8. Referring to fig. 8 and 23, the top surface of the heat dissipation extension 22 is connected to the bottom surface of the heat dissipation rib 20, and the bottom surface of the heat dissipation extension 22 is flush with the bottom surface of the secondary packaging part 32 (note that the bottom surface is placed upward in fig. 23). The heat dissipation extension 22 is made by implanting a metal layer or pouring a thermally conductive colloidal substance and hardening it, or by bonding or welding a molded member.
Further, in an embodiment of the present application, the step S40 may further include: at least a portion of the electronic component is mounted on the second surface of the wiring board. The step of mounting the electronic component on the second surface may be performed prior to the step S30. Thus, in step S30, the backside encapsulation layer may cover the electronic component mounted on the second surface (or fill the gap around the electronic component) to achieve the encapsulation effect.
Further, in an embodiment, the step S40 may further include: and manufacturing a front molding part on the first surface of the circuit board, wherein the front molding part is manufactured on the first surface and surrounds the photosensitive chip through a molding process, and the top surface of the front molding part is suitable for mounting a lens component.
Further, in one embodiment, in step S30, the back packaging part is a back molding part, and the front molding part and the back molding part may be simultaneously molded on the circuit board by the same molding process. This will help to promote production efficiency and save costs.
Further, in one embodiment, in step S10, the prepared circuit board may be a circuit board panel formed by connecting a plurality of single circuit boards together. Fig. 16A shows a circuit board panel having connector portions. The circuit board splicing plate can be a soft and hard combined plate. Fig. 16B shows a circuit board panel without a connector portion. The circuit board panel can be a PCB or a hard board. Further, in this embodiment, in the step S20, the heat dissipation ribs are formed on the second surface (i.e., the back surface) of the circuit board jointed board. Namely, the heat dissipation ribs corresponding to the plurality of single circuit boards are manufactured at one time. In step S30, a back-sealing portion corresponding to the plurality of single circuit boards may be formed by one-time molding, and the back-sealing portion may be integrally connected to cover the second surface of the circuit board panels. In step S40, photosensitive chips may be respectively adhered (or otherwise mounted) on the first surfaces corresponding to the plurality of single circuit boards, so as to obtain a joined plate of photosensitive assemblies. Further, the method for manufacturing a photosensitive assembly of this embodiment further includes step S50: and cutting the spliced plate of the photosensitive assembly to obtain the separated single photosensitive assembly.
On the basis of the method for manufacturing the photosensitive assembly in the embodiment, the obtained photosensitive assembly can be further assembled with the lens assembly to obtain a complete camera module. The lens assembly may be a lens assembly with a motor or a lens assembly without a motor. The camera module obtained by assembly can be an automatic focusing camera module and also can be a fixed-focus camera module.
Further, fig. 25 shows a schematic cross-sectional view of a camera module in an embodiment of the present application. Referring to fig. 25, the camera module includes a lens assembly 3000 and a photosensitive assembly 2000. In this embodiment, the photosensitive assembly is added with a lens holder 2001 and a color filter 2002 mounted on the lens holder 2001 on the basis of the photosensitive assembly of the embodiment of fig. 1. The lens assembly 3000 may have a motor 3001, the bottom surface of which is mounted on the top surface of the lens holder.
Further, fig. 26 is a schematic cross-sectional view of a camera module according to another embodiment of the present application. The present embodiment is different from the embodiment of fig. 25 in that the electronic component 50 is mounted on the back surface of the wiring board 10, and the electronic component 50 is covered and wrapped by the back surface molding part 30.
Further, fig. 27 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application. The present embodiment is different from the embodiment of fig. 25 in that the heat dissipation extension 22 is added to the composite substrate of the photosensitive assembly 2000.
Further, fig. 28 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application. This embodiment differs from the embodiment of fig. 25 in that the back molding portion is eliminated in the composite substrate of the photosensitive member.
Further, fig. 29 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application. The present embodiment is different from the embodiment of fig. 28 in that a front surface molding portion 2003 is formed on the upper surface of the wiring board 10 of the photosensitive member 2000. The motor bottom surface may be mounted on the top surface of the front molding 2003, the mirror mount 2001 (corresponding to the lens holder in the first several embodiments) is used only for mounting the color filter 2002, and the mirror mount 2001 is located on the inner side of the front molding 2003, the outer side of the electronic component 50.
Further, fig. 30 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application. The present embodiment is different from the embodiment of fig. 28 in that a front molding portion 2003 is formed on the upper surface of the wiring board 10 of the photosensitive member 2000. The lens holder 2001 is mounted on the top surface of the front molding portion 2003, the color filter 2002 is mounted on the lens holder 2001, and the lens assembly 3000 (the bottom surface of the motor) is mounted on the top surface of the lens holder 2001.
Further, fig. 31 is a schematic cross-sectional view of a camera module according to still another embodiment of the present application. This embodiment is different from the embodiment of fig. 30 in that the front surface molding portion 2003 covers the electronic component 50 and the metal wires and contacts the photosensitive chip 40. In this embodiment, the front surface molding portion 2003 may cover an edge area of the photosensitive chip, and the edge area may be a non-photosensitive area.
Further, according to an embodiment of the present application, there is also provided an electronic apparatus having the camera module according to any one of the foregoing embodiments. The electronic device may be, for example, a smartphone, a tablet computer, or the like.
Herein, the heat dissipation ribs may be understood as: the reinforcing rib has the function of heat dissipation.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and are not limited. Although the present invention has been described in detail with reference to the embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (24)
1. The utility model provides a composite substrate, its module that makes a video recording that is used for, its characterized in that, composite substrate includes:
the circuit board is provided with a first surface and a second surface opposite to the first surface, wherein the first surface is provided with a chip attaching area for attaching a photosensitive chip;
the heat dissipation rib is arranged on the second surface of the circuit board, and at least one part of the heat dissipation rib is positioned in an area overlapped with the chip attaching area; and
and the back molding part is manufactured on the second surface through a molding process, and the back molding part, the heat dissipation rib and the circuit board are combined into a whole.
2. The composite substrate of claim 1, wherein the thickness of the heat sink ribs is no greater than 0.1 mm.
3. The composite substrate of claim 2, wherein the back-molding has a thickness of no greater than 0.2 millimeters.
4. The composite substrate of claim 1, wherein the heat dissipation ribs are fabricated directly on or attached to the second surface, and the back mold covers the second surface and fills gaps between the heat dissipation ribs, wherein the gaps between the heat dissipation ribs are gaps between a plurality of the heat dissipation ribs or gaps between different portions of a single heat dissipation rib.
5. The composite substrate as claimed in claim 4, wherein the heat dissipating ribs are a plurality of linear strip-shaped heat dissipating ribs arranged in parallel; or a plurality of radiating ribs arranged in a scattered point array; or a single strip-shaped heat dissipation rib which is in a spiral shape or a Chinese character 'mi' shape, or other strip-shaped shapes which can be connected into a whole and still have gaps among different parts; or the heat dissipation ribs are any combination of two or more of the above.
6. The composite substrate according to claim 1, wherein the heat dissipation ribs are metal heat dissipation ribs or heat dissipation ribs formed by hardening of a thermally conductive colloidal substance.
7. The composite substrate of claim 2, wherein the photosensitive assembly further comprises a secondary heat dissipation part, wherein the top surface of the secondary heat dissipation part is connected with the bottom surface of the heat dissipation rib, the bottom surface of the back molding part is flush with the bottom surface of the secondary heat dissipation part, the bottom surface of the secondary heat dissipation part is exposed out of the back molding part, and the area of the bottom surface of the secondary heat dissipation part is larger than that of the bottom surface of the heat dissipation rib.
8. The composite substrate of claim 1, wherein the back mold covers a bottom surface of the heat sink rib.
9. The composite substrate of claim 1, wherein the heat sink ribs are attached to the second surface by bonding or welding.
10. The composite substrate according to claim 1, wherein a root portion of the heat dissipation rib extends to an inside of the circuit board.
11. The composite substrate of claim 1, wherein the wiring board is a multilayer board comprising a plurality of conductive layers and a plurality of insulating layers arranged at intervals, the conductive layers and the insulating layers being bonded together by a lamination process.
12. A photosensitive assembly, comprising:
the composite substrate of any one of claims 1-11;
the bottom surface of the photosensitive chip is attached to the chip attaching area of the composite substrate; and
and the metal wire electrically connects the photosensitive chip and the circuit board through a wire bonding process.
13. A photosensitive assembly according to claim 12, further comprising a front molding portion formed on the first surface and surrounding the photosensitive chip by a molding process, and having a top surface adapted to mount a lens assembly; the front molding part and the photosensitive chip are spaced, or the front molding part extends towards the photosensitive chip and contacts the photosensitive chip.
14. A photo-sensing assembly according to claim 12, further comprising a lens holder mounted to the first surface and surrounding the photo-sensing chip, and a top surface of the lens holder adapted to mount a lens assembly; the lens support is mounted on the first surface after being molded.
15. A light sensing assembly as claimed in claim 12, further comprising a lens holder mounted to the front molding and having a top surface adapted to mount a lens assembly; and the lens support is mounted on the front molding part after being molded.
16. The utility model provides a module of making a video recording which characterized in that includes:
the photosensitive assembly of any one of claims 1-15; and
the lens subassembly, the lens subassembly install in sensitization subassembly.
17. A method for manufacturing a composite substrate is characterized by comprising the following steps:
1) preparing a circuit board, wherein the circuit board is provided with a first surface and a second surface opposite to the first surface, the first surface is provided with a chip attaching area for attaching a photosensitive chip, and the thickness of the circuit board is not more than 0.3 mm;
2) arranging a heat dissipation rib on the second surface, wherein at least one part of the heat dissipation rib is positioned in an area overlapped with the chip attaching area; and
3) and manufacturing a back molding part on the second surface by a molding process, wherein the back molding part covers the second surface and fills gaps among the heat dissipation ribs, so that the back molding part, the heat dissipation ribs and the circuit board are combined into a whole, and the gaps among the heat dissipation ribs are gaps among a plurality of heat dissipation ribs or gaps among different parts of a single heat dissipation rib.
18. The method for manufacturing a composite substrate according to claim 17, wherein in the step 2), the heat dissipation rib is attached by welding or bonding, and the thickness of the heat dissipation rib is not more than 0.1 mm.
19. The method for manufacturing a composite substrate according to claim 17, wherein in step 1), the circuit board has a seed layer, and in step 2), the seed layer is implanted with a metal layer so that the metal layer grows and exceeds the second surface to form the heat dissipation rib; the thickness of the metal layer beyond the second surface is no greater than 0.1 mm.
20. The method of claim 17, wherein in the step 2), the second surface is coated with a thermally conductive colloidal substance, and then the thermally conductive colloidal substance is hardened to form the heat dissipation rib, wherein the thickness of the heat dissipation rib is not greater than 0.1 mm.
21. A method for manufacturing a photosensitive assembly is characterized by comprising the following steps: fabricating a composite substrate according to the method of fabricating a composite substrate of any one of claims 17 to 20;
the manufacturing method of the photosensitive assembly further comprises the following steps:
4) attaching a photosensitive chip on the first surface of the circuit board, mounting an electronic element, and electrically connecting the circuit board and the photosensitive chip through a lead bonding process.
22. A method for fabricating a photosensitive assembly according to claim 21, wherein said step 4) further comprises: and manufacturing a front molding part on the first surface, wherein the front molding part is manufactured on the first surface and surrounds the photosensitive chip through a molding process, and the top surface of the front molding part is suitable for mounting a lens component.
23. A method for manufacturing a photosensitive assembly according to claim 22, wherein in the steps 3) and 4), the front surface molding part and the back surface molding part are simultaneously formed on the circuit board by the same molding process.
24. A method for fabricating a photosensitive assembly according to claim 21, wherein said step 4) further comprises: and mounting a molded lens base on the first surface, wherein the lens base surrounds the photosensitive chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910695386.5A CN112399029A (en) | 2019-07-30 | 2019-07-30 | Camera module, composite substrate, photosensitive assembly and manufacturing method thereof |
| PCT/CN2020/100163 WO2021017752A1 (en) | 2019-07-30 | 2020-07-03 | Camera module, electronic device, composite substrate, photosensitive assembly and production method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910695386.5A CN112399029A (en) | 2019-07-30 | 2019-07-30 | Camera module, composite substrate, photosensitive assembly and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112399029A true CN112399029A (en) | 2021-02-23 |
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ID=74601175
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910695386.5A Pending CN112399029A (en) | 2019-07-30 | 2019-07-30 | Camera module, composite substrate, photosensitive assembly and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112399029A (en) |
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2019
- 2019-07-30 CN CN201910695386.5A patent/CN112399029A/en active Pending
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