WO2021017752A1

WO2021017752A1 - Camera module, electronic device, composite substrate, photosensitive assembly and production method therefor

Info

Publication number: WO2021017752A1
Application number: PCT/CN2020/100163
Authority: WO
Inventors: 王明珠; 栾仲禹; 黄桢; 李婷花; 干洪锋; 刘丽
Original assignee: 宁波舜宇光电信息有限公司
Priority date: 2019-07-30
Filing date: 2020-07-03
Publication date: 2021-02-04

Abstract

The present invention relates to a photosensitive assembly, comprising a combination consisting of a circuit board and a photosensitive chip, and radiating ribs provided on the back of the combination. At least a part of each radiating fin is located on the back of the photosensitive chip or located in the region on the back of the circuit board that overlaps the photosensitive chip. The present invention also provides a corresponding camera module, an electronic device, and a production method for the photosensitive assembly. The present invention can avoid or suppress the deformation of the photosensitive chip at the cost of a relatively small space size, and improves the imaging quality of the camera module.

Description

Camera module, electronic equipment, composite substrate, photosensitive component and manufacturing method thereof

Related application

This application requires the name "Camera module, electronic equipment, photosensitive component and its production method", the Chinese patent application number submitted on July 30, 2019 is 201910696414.5, the name is "camera module, electronic equipment and photosensitive component" , The Chinese patent application number submitted on July 30, 2019 is 201921213523.9, titled "Camera module, composite substrate, photosensitive component and its production method", the Chinese patent application number filed on July 30, 2019 is 201910695388.4 , The name is "camera module, composite substrate and photosensitive component", the Chinese patent application number submitted on July 30, 2019 is 201921213522.4, and the name is "camera module, composite substrate, photosensitive component and its production method", in The Chinese patent application number 201910695386.5 filed on July 30, 2019, and the six priority rights of the Chinese patent application number 201921214519.4 filed on July 30, 2019 under the name "Camera Module, Composite Substrate and Photosensitive Components" , And include all the contents of the above six applications by reference.

Technical field

The present invention relates to the technical field of camera modules. Specifically, the present invention relates to a camera module, a photosensitive component for the camera module, a composite substrate and a manufacturing method thereof, and corresponding electronic equipment.

Background technique

With the popularity of mobile electronic devices, the related technologies of camera modules used in mobile electronic devices to help users obtain images (such as videos or images) have been developed and advanced rapidly, and in recent years, camera modules have The group has been widely used in many fields such as medical treatment, security and industrial production.

In order to meet more and more extensive market demands, high pixels, large chips, small sizes, and large apertures are the irreversible development trends of existing camera modules. However, it is very difficult to achieve the four requirements of high pixels, large chip, small size, and large aperture in the same camera molding. For example, first, the market has put forward higher and higher requirements for the imaging quality of camera modules. How to obtain higher imaging quality with a smaller camera module volume has become a compact camera module (such as those used in mobile phones). A big problem in the field of camera modules, especially based on the technological development trends of the mobile phone industry such as high pixels, large apertures, and large chips; second, the compact development of mobile phones and the increase in the proportion of mobile phones The internal space that can be used for the front camera module is getting smaller and smaller; the number of rear camera modules is increasing, and the area occupied is also getting larger, resulting in the corresponding reduction of other mobile phone configurations such as battery size and motherboard size. In order to avoid the sacrifice of other configurations, the market hopes that the size of the rear camera module can be reduced, that is, to achieve a small size package; third, with the popularization of high-pixel chips and the gradual improvement of functions such as video shooting, chip energy consumption and heat dissipation have become important issues. Need to be resolved in the module design and manufacturing process.

The above-mentioned market demand is the bottleneck of the development of the camera module packaging industry. The main reasons for the unresolved problems of the above-mentioned demand are as follows:

(1) High pixel and large chip size: Due to the gradual increase in chip size, such as the relatively common chip with 48 million pixels or more at this stage, its size is 1/2 inch. In the future, 1/1.7 inch chips and even larger chips will become popular, leading to The chip size is increasing rapidly, but because the photosensitive chip is thinner than the general chip, only about 0.15mm thick, the large chip is more prone to field curvature problems. At the same time, since the chip and the circuit board are usually connected by glue, the glue coating generally presents a low-to-high shape around, such as a rice-shaped paint, which causes a slight bulge in the middle of the chip. Furthermore, when the chip is attached, because the suction nozzle sucks the chip from the upper part, the chip will also image the curved shape of the periphery lower than the center. In addition, the coefficient of thermal expansion (CTE) index of the product is different between the chip, the glue, and the circuit board. For example, the CTE of the chip is 6ppm/C, and the PCB is 14ppm/C. The module assembly process generally has a baking process, based on various Different material CTE coefficients can cause chip bending problems. However, due to the lamination process used in the industry, the rigid-flex board conventionally used in the industry has serious warpage and aggravates the chip bending problem. The above-mentioned chip bending problem will cause the chip field curvature problem in the final module imaging, and ultimately affect the imaging quality.

Further, under the current trend of device miniaturization, in the current mainstream compact camera modules (such as camera modules for mobile phones), most of the circuit boards tend not to add additional heat dissipation components to avoid increasing the camera module. The size of the group, but the heat dissipation performance of the circuit board itself is not enough to match the heat dissipation performance requirements of the module. However, on the other hand, the current high-end camera module has developed to 48 million pixels and above, and the demand for video shooting is gradually becoming prominent, such as 4K high-definition video shooting, slow motion capture, etc., and there will be more high-pixel, high frame rate in the future. The power of the corresponding photosensitive chip of the camera module is greatly improved. The inventor of this case discovered that as the heat generated when the photosensitive chip is working becomes larger and larger, this heat accumulation causes the photosensitive chip to deform, which is one of the important factors leading to the deterioration of image quality. Specifically, in the working state, as the internal temperature of the camera module increases, the circuit board and the photosensitive chip will bend, thereby reducing the image quality. In other words, for high-pixel, high-frame-rate photosensitive chips, even if they are not packaged by molding, they will be affected by temperature and bend. That is to say, neither molded or non-molded packaging can solve the bending problem of high pixels and large chips.

(2) Miniaturization/small size: In the field of compact camera modules, in order to reduce the size of the camera module and improve the manufacturing efficiency, a molding process is adopted to directly form the lens assembly or other component brackets (such as MOB Or MOC and other process programs). Specifically, the camera module may include a photosensitive component and a lens component, and the lens group of the lens component and other optical components are arranged on the photosensitive path of the photosensitive component (usually a photosensitive chip) of the photosensitive component. It should be noted that in some solutions, the color filter can be directly mounted on the photosensitive component to form part of the photosensitive component, but in other solutions, the photosensitive component may not contain the color filter, but the color filter is made into an independent The color filter assembly or other forms are installed on the light transmission path. Therefore, sometimes the lens assembly can also be understood as a combination of light-transmitting elements such as lens groups and color filters and their supporting structures. This combination can sometimes be referred to as a light-transmitting component, canceling or lowering the position of the color filter. , Can further reduce the height dimension of the module.

Further, the photosensitive component may include a circuit board and a molded body integrally molded on the circuit board. Because the molded body eliminates the advantage of the avoidance space of the traditional lens mount attached module, the module can be further realized in terms of length, width, and height. Advantages in size. In addition, the molded body can reinforce the strength of the circuit board, can reduce the thickness of the circuit board, and ensure the flatness of the module, so the circuit board can be thinned. For example, in the MOC packaging process, the photosensitive element is pre-attached to the circuit board, and then a molded body is formed on the circuit board through a molding process. The molded body can wrap part of the non-sensitive area of the photosensitive element. In the camera module, the combination of the circuit board and the molded body and the combination of the molded body and the photosensitive chip are all rigid combinations. The combination is very strong and often requires destructive methods to be removed. But at the same time, the circuit board and the photosensitive chip are combined by glue, which is a relatively flexible combination. In addition, the coefficient of thermal expansion (CTE) of the circuit board, the molded body, and the photosensitive chip are different. When the environmental temperature changes greatly during the manufacturing process (for example, the molding material in the molding process needs to increase the temperature to 150 degrees Celsius) In the module baking stage, the temperature needs to be raised to above 80 degrees Celsius. During the subsequent manufacturing process of the camera module, the ambient temperature may change many times.) The expansion degree of the circuit board, chip, and molded body is different. , The expansion speed is also different. Among them, the degree of shrinkage of the photosensitive chip is often the smallest, but because the combination of the circuit board and the molded body is a rigid combination, the circuit board and the molded body will generate stress, which will cause the circuit board and the molded body to bend, which will drive The deformation of the photosensitive chip, especially the upward bending deformation produced by the photosensitive chip, will cause the imaging quality of the module to be greatly reduced. Figure 24 shows a schematic diagram of the principle of deformation of the photosensitive chip due to bending of the circuit board and the molded body. It should be noted that, for ease of understanding, the figure shown in Figure 24 is exaggerated. In fact, the amount of bending may only be more than ten to twenty microns, but this degree of bending is sufficient to negatively affect the image quality. For example, this kind of bending may cause the field curvature of the camera module to be too large. At this time, the image obtained by the camera module appears to have a normal center effect but poor surrounding effects.

(3) Large aperture

Due to the popularization of large pixel chips, the corresponding optical performance improvement is also an inevitable trend. For example, the optical parameters of lenses such as large aperture and wide angle will gradually increase to maximize the resolution performance of the photosensitive chip. However, large aperture and wide-angle modules place higher requirements on the flatness of the module.

Therefore, there is an urgent need for a solution that can use a smaller space size to avoid or suppress the deformation of the photosensitive chip, and an urgent need for a smaller space size to ensure the imaging quality of the camera module ( Especially in the long-time working state image quality) solution.

Furthermore, in the field of consumer electronics, the market also has extremely high requirements for the production efficiency of camera modules. For example, the demand for a camera module for smart phones may reach the order of tens of millions or even hundreds of millions. In order to improve production efficiency, in actual mass production, photosensitive components are often produced by imposition. During the manufacturing process of the circuit board imposition, as the ambient temperature changes, it generally changes from room temperature to 180 degrees (during the baking and molding process). Because the circuit board imposition area is larger and the structural strength is weak, it is more It is susceptible to bending due to the influence of temperature, which affects the flatness, and adds difficulty to the chip attachment, and the flatness after the chip is attached cannot be guaranteed. Therefore, how to avoid or suppress the deformation of the photosensitive chip and avoid other problems caused by the new product design in the imposition production method is also a major problem currently faced.

Summary of the invention

The purpose of the present invention is to overcome the shortcomings of the prior art and provide a solution for the photosensitive component and the camera module.

In order to solve the above technical problems, the present invention provides a photosensitive assembly, which includes a circuit board and a photosensitive chip assembly, wherein the photosensitive surface of the photosensitive chip faces the front side of the assembly, and The side opposite to the front is the back of the assembly; and the heat dissipation ribs are arranged on the back of the assembly, and at least a part of the heat dissipation ribs are located on the back of the photosensitive chip or on the back of the circuit board. The area overlapping with the photosensitive chip.

Wherein, the circuit board has a first surface for attaching a photosensitive chip and a second surface opposite to the first surface, wherein the first surface has a chip attaching area; the back of the photosensitive chip is attached On the first surface; the heat dissipation ribs are directly fabricated on the second surface or attached to the second surface, wherein at least a part of the heat dissipation ribs is located on the second surface corresponding to the chip mount The area behind the attached area.

Wherein, the photosensitive component further includes a back encapsulation part, the back encapsulation part covers the second surface and fills the gap between the heat dissipation ribs, wherein the gap between the heat dissipation ribs is a plurality of the heat dissipation ribs Or the gap between different parts of a single heat dissipation rib, and the back molding part is integrated with the heat dissipation rib.

Wherein, the bottom surface of the heat dissipation rib is exposed outside the back encapsulation portion; the bottom surface of the back encapsulation portion is flush with the bottom surface of the heat dissipation rib.

Wherein, the back encapsulation part is a back molding part made on the second surface by a molding process, the back molding part covers the second surface and the bottom surface of the heat dissipation rib, and the back molding The distance between the bottom surface of the portion and the bottom surface of the heat dissipation rib is not more than 0.1 mm.

Wherein, the heat dissipation rib is a plurality of linear strip heat dissipation ribs arranged in parallel; or a plurality of heat dissipation ribs arranged in a scattered point array; or a single strip heat dissipation rib, and the single strip heat dissipation rib is in a spiral shape Or "m" shape, or other strip shapes that can be connected together but still have gaps between different parts; or the heat dissipation ribs are any combination of two or more of the above.

Wherein, the heat dissipation ribs are metal heat dissipation ribs or heat dissipation ribs formed by hardening a thermally conductive colloidal substance.

Wherein, the photosensitive component further includes a secondary heat dissipation portion, the top surface of the secondary heat dissipation portion is connected to the bottom surface of the heat dissipation rib, the bottom surface of the back encapsulation portion is flush with the bottom surface of the secondary heat dissipation portion, so The bottom surface of the secondary heat dissipation portion is exposed outside the back encapsulation portion, and the area of the bottom surface of the secondary heat dissipation portion is larger than the area of the bottom surface of the heat dissipation rib.

Wherein, the heat dissipation ribs are attached to the second surface by bonding or welding.

Wherein, the photosensitive component further includes a metal wire that electrically connects the photosensitive chip and the circuit board through a wire bonding process, and the circuit board is a PCB circuit board.

Wherein, the photosensitive component further includes electronic components mounted on the circuit board, wherein at least a part of the electronic components are mounted on the second surface and covered by the back encapsulation part.

Wherein, the photosensitive component further includes a front molding part, the front molding part is made on the first surface through a molding process and surrounding the photosensitive chip, and the top surface of the front molding part Suitable for mounting a lens assembly; wherein there is a space between the front molding part and the photosensitive chip, or the front molding part extends toward the photosensitive chip and contacts the photosensitive chip.

Wherein, the photosensitive component further includes a lens holder, the lens holder is mounted on the first surface and surrounding the photosensitive chip, and the top surface of the lens holder is suitable for mounting a lens component; wherein the lens After the bracket is formed, it is installed on the first surface.

Wherein, the photosensitive component further includes a lens holder, the lens holder is installed on the front molding part, and the top surface of the lens holder is suitable for installing a lens component; wherein the lens holder is molded and then installed on the Front molding department.

Wherein, the circuit board has a main through hole, the photosensitive chip is located in the main through hole, and the back of the assembly includes the back of the circuit board and the photosensitive chip, and at least a part of the heat dissipation rib Located on the back of the photosensitive chip.

Wherein, the thickness of the heat dissipation rib is 0.05mm-0.4mm.

According to another aspect of the present application, there is also provided a camera module, which includes: any one of the aforementioned photosensitive components; and a lens assembly installed on the photosensitive component.

According to another aspect of the present application, there is also provided a method for manufacturing a photosensitive component, which includes: 1) preparing a circuit board, the circuit board has a first surface for attaching a photosensitive chip and a surface opposite to the first surface. The second surface of the second surface, wherein the first surface has a chip attaching area; 2) the second surface is fabricated or attached to the heat dissipation rib; 3) the second surface is covered with a back surface package portion, wherein the back surface package The portion covers the second surface and fills the gaps between the heat dissipation ribs, wherein the gaps between the heat dissipation ribs are the gaps between multiple heat dissipation ribs or between different parts of a single heat dissipation rib Gap; the bottom surface of the heat dissipation rib is exposed outside the back encapsulation portion and the bottom surface of the back encapsulation portion is flush with the bottom surface of the heat dissipation rib; and 4) a photosensitive chip is mounted on the first surface, and then a photosensitive chip is produced The photosensitive component.

Wherein, in the step 2), the heat dissipation ribs are attached by welding or bonding.

Wherein, in step 1), the circuit board has a seed layer, and in step 2), a metal layer is planted on the seed layer so that the metal layer grows beyond the second surface, thereby forming the述heating ribs.

Wherein, in the step 2), a thermally conductive colloidal substance is coated on the second surface, and then the thermally conductive colloidal substance is hardened to form the heat dissipation ribs.

Wherein, in the step 2), in the step 3), the back encapsulation portion is formed on the second surface through a molding process.

Wherein, the step 2) is executed first, and then the step 3) is executed.

Wherein, the step 3) is performed first, and then the step 2) is performed; wherein in the step 3), the back encapsulation portion is formed on the second surface by a molding process, and in the molding process, the pressure The head leaves a through hole in the back encapsulation part, and the through hole makes a part of the second surface exposed outside the back encapsulation part; then, in the step 2), in the through hole of the encapsulation part The heat dissipation ribs are made in the holes.

Wherein, the photosensitive component manufacturing method further includes the steps performed after the step 3): 3a) A second-level package part is manufactured on the bottom surface of the back-side package part by a molding process, the second-level package part has a second-level package A through hole, the secondary through hole exposing the contiguous area between the bottom surface of the heat dissipating rib and the bottom surface of the back encapsulation part around the heat dissipating rib; and 3b) making a heat dissipation extension in the secondary through hole , The top surface of the heat dissipation extension portion is connected to the bottom surface of the heat dissipation rib, and the bottom surface of the heat dissipation extension portion is flush with the bottom surface of the secondary package portion; It is made by heat-conducting colloidal substances and hardening them, or by bonding or welding already formed components.

Wherein, the step 4) further includes: mounting at least a part of the electronic components on the second surface; and first performing the step 4) and then performing the step 3); and in the step 3), the back The packaging layer covers the at least a part of the electronic components mounted on the second surface.

Wherein, the step 4) further includes: fabricating a front molding part on the first surface, the front molding part is manufactured on the first surface through a molding process and surrounding the photosensitive chip, and The top surface of the front molding part is suitable for mounting a lens assembly.

Wherein, in the step 3), the back encapsulation part is a back molding part, and the front molding part and the back molding part are simultaneously molded on the circuit board through the same molding process.

Wherein, in the step 1), the circuit board is a circuit board jigsaw in which a plurality of single circuit boards are connected as a whole; in the step 2), the production on the circuit board jigsaw corresponds to the multiple Heat dissipation ribs of a single circuit board; in the step 3), the back encapsulation portion corresponding to the plurality of single circuit boards is manufactured by one-time molding; in the step 4), in the step corresponding to the The photosensitive chips are respectively mounted on the first surfaces of the multiple monolithic circuit boards to obtain a photosensitive assembly panel; and the photosensitive assembly manufacturing method further includes the step of: 5) cutting the photosensitive assembly panel to obtain a separated monolithic photosensitive assembly .

According to another aspect of the present application, there is also provided an electronic device, which includes any one of the aforementioned camera modules.

According to another aspect of the present application, there is also provided a composite substrate for use in a camera module, which includes: a circuit board having a first surface and a second surface opposite to the first surface, and a first surface A side surface and a second side surface opposite to the first side surface, wherein the first surface has a chip attaching area for attaching a photosensitive chip; a heat dissipation rib is provided on the second surface of the circuit board, so At least a part of the heat dissipation rib is located in an area overlapping with the chip attachment area, the heat dissipation rib is a strip heat dissipation rib, and at least one end surface of the strip heat dissipation rib extends to the first side surface or the first side surface. Two sides; and a back molding part, which is made on the second surface by a molding process, and the back molding part is integrated with the heat dissipation ribs.

Wherein, at least one end surface of the strip-shaped heat dissipation rib is a cut surface.

Wherein, the strip-shaped heat dissipation rib has two end surfaces, and the two end surfaces respectively extend to the first side surface and the second side surface.

Wherein, the two end surfaces are both cutting surfaces.

Wherein, the heat dissipation ribs include a plurality of strip heat dissipation ribs, and the direction of the plurality of strip heat dissipation ribs is suitable for being between the plurality of strip heat dissipation ribs, and that the strip heat dissipation ribs are used for the A flow channel for the molding flow is formed between the molds in the molding process.

Wherein, the strip-shaped heat dissipation ribs are linear strip-shaped heat dissipation ribs.

Wherein, a plurality of the linear strip-shaped heat dissipation ribs are arranged in parallel.

Wherein, the injection direction of the molding flow in the molding process is a first direction from the first side surface to the second side surface, or a second direction opposite to the first direction.

Wherein, the linear strip-shaped heat dissipation ribs are parallel to the injection direction of the molding flow.

Wherein, the circuit board further has a third side surface perpendicular to the first side surface, and a fourth side surface opposite to the third side surface; wherein the axis of the linear strip heat dissipation rib is parallel to the third side surface. The side surface or the fourth side surface, or the axis of the linear strip-shaped radiating ribs and the third side surface or the fourth side surface form an angle of less than 45 degrees; and the second surface along the The edge regions of the third side and the fourth side have press-fit edges for the molding process.

Wherein, the thermal conductivity of the material of the heat dissipation rib is 10-1000 W/(m·degree), and the material of the heat dissipation rib is metal, metal alloy or thermal conductive silicone grease.

Wherein, the thickness of the back molding part is not more than 0.2 mm, and the thickness of the heat dissipation rib is not more than 0.1 mm.

According to another aspect of the present invention, there is also provided a photosensitive component, which includes: any of the foregoing composite substrates; a photosensitive chip, the bottom surface of which is attached to the chip attachment area; and a metal wire, which is bonded by a wire bonding process The photosensitive chip is electrically connected to the circuit board.

Wherein, the photosensitive assembly further includes a lens holder, which is attached to the first surface and surrounds the photosensitive chip to form a light window.

Wherein, the photosensitive component further includes an electronic component, the electronic component is mounted on the first surface, and the front molding part wraps the electronic component.

Wherein, the photosensitive component further includes a front molding part, the front molding part is made on the first surface and surrounding the photosensitive chip to form a light window, and the front molding part contacts the photosensitive chip And cover the edge area of the photosensitive chip.

Wherein, the photosensitive component further includes a front molding part, the front molding part is made on the first surface and surrounding the photosensitive chip to form a light window, the front molding part and the photosensitive chip There is a gap between.

According to another aspect of the present invention, there is also provided a camera module, which includes: any one of the aforementioned photosensitive components; and a lens assembly, the lens assembly being mounted on the top of the photosensitive component.

According to still another aspect of the present invention, there is also provided a method for manufacturing a composite substrate, which includes: 1) preparing a circuit board jigsaw, the circuit board jigsaw includes a plurality of circuit board units connected together, and the circuit The board jigsaw has a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of chip attachment areas for attaching photosensitive chips, and each of the circuit board units has There is one chip attachment area, and the circuit board units are distributed in an array; 2) at least one strip-shaped heat dissipation rib is arranged on the second surface, and each of the strip-shaped heat dissipation ribs extends to each of the same row At least one of the circuit board units, and at least a part of the strip-shaped heat dissipation ribs pass through the overlapping area on the back of the chip attaching area; 3) a back molding part is formed on the second surface through a molding process, and The bottom surface of the back molding part is flush with the bottom surface of the strip-shaped heat dissipation ribs to form a flat surface; and 4) cutting along the boundary line of the circuit board unit to obtain a single composite substrate.

Wherein, in the step 2), the direction of the strip-shaped heat dissipation ribs is suitable to be between the plurality of the strip-shaped heat dissipation ribs, and/or the strip-shaped heat dissipation ribs and the molding process Runners for molding flow are formed between the molds.

Wherein, in step 1), the circuit board jigsaw has a seed layer; in step 2), the strip-shaped heat dissipation ribs are arranged by growing a metal layer on the basis of the seed layer.

Wherein, in the step 2), the strip-shaped heat dissipation ribs are arranged by attaching pre-formed heat dissipation ribs to the second surface.

Wherein, in the step 2), the strip-shaped heat dissipation ribs are provided by coating and curing thermally conductive silicone grease on the second surface.

Wherein, the step 3) includes the following sub-steps: 31) closing the upper mold and the lower mold, wherein the upper mold is pressed to the second surface, and the lower mold is pressed to the first surface, And the inner surface of the upper mold presses the strip-shaped heat dissipation ribs, thereby forming a molding cavity between the second surface, the strip-shaped heat dissipation ribs, and the upper mold; 32) liquid molding flow Injecting into the molding cavity, the injection direction of the molding flow is consistent with the arrangement direction of a row of the circuit board units; and 33) curing the injected liquid molding material to obtain the back molding part.

Wherein, in the step 31), the upper mold is pressed onto the edge area of the second surface of the circuit board jigsaw.

Wherein, in the step 1), between the circuit board units and between the circuit board units and the frame of the circuit board jigsaw are separated by insulating regions; in the step 4), The circuit board jigsaw, the back molding part and the strip-shaped heat dissipation ribs are cut together to separate the single composite substrate.

According to another aspect of the present invention, there is also provided a photosensitive component manufacturing method, which includes: any of the foregoing composite substrate manufacturing methods to manufacture a composite substrate; the photosensitive component manufacturing method further includes: 5) attaching a photosensitive chip to The corresponding chip attaching area is electrically connected to the photosensitive chip and the corresponding circuit board unit through a wire bonding process.

Wherein, the method for manufacturing the photosensitive component further includes: 6) mounting a molded lens holder on the first surface of the circuit board unit, the lens holder surrounding the photosensitive chip.

Wherein, the manufacturing method of the photosensitive component further includes: 6) forming a front molding part on the first surface of the circuit board unit through a molding process, and the front molding part forms a light window around the photosensitive chip .

Wherein, the step 4) is performed after the step 6), and in the step 4), the circuit board jigsaw, the back molding part, the strip heat dissipation ribs and the front molding The parts are cut together to separate the single photosensitive components.

According to another aspect of the present invention, there is also provided a composite substrate for use in a camera module, the composite substrate comprising: a circuit board having a first surface and a second surface opposite to the first surface, Wherein the first surface has a chip attaching area for attaching the photosensitive chip; a heat dissipation rib is arranged on the second surface of the circuit board, and at least a part of the heat dissipation rib is located overlapping the chip attaching area And the back molding part, which is made on the second surface through a molding process, and the back molding part, the heat dissipation ribs and the circuit board are integrated into one body.

Wherein, the thickness of the heat dissipation rib is not more than 0.1 mm.

Wherein, the thickness of the back molding part is not more than 0.2 mm.

Wherein, the heat dissipation ribs are directly fabricated on the second surface or attached to the second surface, and the back molding part covers the second surface and fills the gaps between the heat dissipation ribs, wherein the The gap between the heat dissipation ribs is a gap between a plurality of the heat dissipation ribs or a gap between different parts of a single heat dissipation rib.

Wherein, the photosensitive component further includes a secondary heat dissipation portion, the top surface of the secondary heat dissipation portion is connected to the bottom surface of the heat dissipation rib, and the bottom surface of the back molding portion is flush with the bottom surface of the secondary heat dissipation portion, The bottom surface of the secondary heat dissipation portion is exposed outside the back molding portion, and the area of the bottom surface of the secondary heat dissipation portion is larger than the area of the bottom surface of the heat dissipation rib.

Wherein, the back molding part covers the bottom surface of the heat dissipation rib.

Wherein, the roots of the heat dissipation ribs extend to the inside of the circuit board.

Wherein, the circuit board is a multilayer board, and the multilayer board includes a plurality of conductive layers and a plurality of insulating layers arranged at intervals, and the conductive layer and the insulating layer are combined together by a lamination process.

According to another aspect of the present application, there is also provided a photosensitive component, which includes: any of the foregoing composite substrates; a photosensitive chip, the bottom surface of which is attached to the chip attachment area of the composite substrate; and a metal wire, which The photosensitive chip and the circuit board are electrically connected through a wire bonding process.

According to another aspect of the present application, there is also provided a camera module, which includes: any one of the aforementioned photosensitive components; and a lens component, the lens component being mounted on the photosensitive component.

According to another aspect of the present application, there is also provided a method for manufacturing a composite substrate, which includes: 1) preparing a circuit board, the circuit board having a first surface and a second surface opposite to the first surface, wherein The first surface has a chip attaching area for attaching photosensitive chips, and the thickness of the circuit board is not greater than 0.3 mm; 2) a heat dissipation rib is provided on the second surface, and at least a part of the heat dissipation rib is located at The area where the chip attaching area overlaps; and 3) forming a back molding part on the second surface by a molding process, the back molding part covering the second surface and filling the gap between the heat dissipation ribs , So that the back molding part, the heat dissipation ribs, and the circuit board are combined into one body, wherein the gap between the heat dissipation ribs is the gap between a plurality of the heat dissipation ribs or a single heat dissipation rib The gap between different parts.

Wherein, in the step 2), the heat dissipation ribs are attached by welding or bonding, and the thickness of the heat dissipation ribs is not greater than 0.1 mm.

Wherein, in step 1), the circuit board has a seed layer, and in step 2), a metal layer is planted on the seed layer so that the metal layer grows beyond the second surface, thereby forming the The heat dissipation ribs; the thickness of the metal layer beyond the second surface is not more than 0.1 mm.

Wherein, in the step 2), a thermally conductive colloidal substance is coated on the second surface, and then the thermally conductive colloidal substance is hardened to form the heat dissipation rib, and the thickness of the heat dissipation rib is not greater than 0.1 mm.

According to another aspect of the present application, there is also provided a method for manufacturing a photosensitive component, which includes: manufacturing a composite substrate by any of the foregoing composite substrate manufacturing methods; and the method for manufacturing a photosensitive component further includes: 4) mounting on the circuit board A photosensitive chip is attached to the first surface, electronic components are mounted, and the circuit board is electrically connected to the photosensitive chip through a wire bonding process.

Wherein, in the step 3) and the step 4), the front molding part and the back molding part are simultaneously formed on the circuit board through the same molding process.

Wherein, the step 4) further includes: installing a molded lens holder on the first surface, the lens holder surrounding the photosensitive chip.

Compared with the prior art, this application has at least one of the following technical effects:

1. The photosensitive component and camera module of the present application can avoid or suppress the deformation of the photosensitive chip with a small space size penalty.

2. The photosensitive component and camera module of the present application improve the structural strength of the circuit board.

3. The photosensitive component and camera module of the present application improve the heat dissipation efficiency of the photosensitive chip.

4. The photosensitive component and camera module of the present application can ensure the imaging quality of the camera module with a small space size penalty.

5. The photosensitive component and camera module of the present application are particularly suitable for camera modules with high pixels and high frame rate.

6. The photosensitive components and camera modules of this application are particularly suitable for combining with MOC and MOB technologies.

7. The photosensitive component and camera module of the present application can reduce the radial size of the camera module by arranging some electronic components on the back of the circuit board. The radial size refers to the size perpendicular to the optical axis.

8. The back surface of the photosensitive component of the present application may be a flat surface, which is convenient for the subsequent production process to be realized, and is convenient for adapting to other parts of the terminal device (such as a mobile phone).

9. The back surface of the photosensitive component of the present application can be a flat surface, which is more suitable for mass production.

10. The photosensitive components and camera modules of the present application have high production efficiency.

11. In the photosensitive component of the present application, the heat dissipation ribs on the back are combined with the encapsulation part, on the other hand, it improves the structural strength of the circuit board, on the other hand, it improves the heat dissipation efficiency of the photosensitive chip, avoids excessive heat accumulation, and reduces thermal expansion. The different coefficients cause the stress that causes the circuit board to bend, so the photosensitive component of the present application can suppress the bending of the photosensitive chip from two aspects.

12. The photosensitive component of the present application can inhibit the bending of the photosensitive chip by avoiding excessive heat accumulation and increasing the structural strength. Therefore, the thickness of the package part and the heat dissipation rib on the back of the circuit board can be relatively reduced. In other words, the The application can achieve the effect of suppressing the bending of the photosensitive chip at the cost of a smaller thickness.

13. This application can prevent the circuit board from warping during the molding process of the circuit board.

14. This application can prevent the overall warpage of the circuit board assembly during the manufacturing process of the circuit board assembly.

15. The heat dissipation ribs of the present application can form a mold flow channel during the molding process of the circuit board, thereby preventing the "under injection" phenomenon in the molding cavity, thereby avoiding the unevenness of the back molding part , Improve the production yield of composite substrates and photosensitive components.

Description of the drawings

FIG. 1 shows a schematic cross-sectional view of a composite substrate 1000 for a camera module in an embodiment of the present application;

FIG. 2 shows a three-dimensional schematic diagram of the composite substrate 1000 shown in FIG. 1;

FIG. 3 shows a schematic front view of a composite substrate 1000 mounted with a photosensitive chip 50 in an embodiment of the present application;

FIG. 4 shows a schematic cross-sectional view of a photosensitive component 2000 including a composite substrate 1000 in an embodiment of the present application;

Fig. 5 shows a schematic back view of a composite substrate in a modified embodiment of the present application;

Fig. 6 shows a schematic back view of a composite substrate in another modified embodiment of the present application;

FIG. 7 shows a photosensitive component 2000 based on a composite substrate according to another embodiment of the present application;

FIG. 8 shows a photosensitive component 2000 based on a composite substrate according to another embodiment of the present application;

FIG. 9 shows a schematic cross-sectional view of a photosensitive component according to another modified embodiment of the present application;

FIG. 10 shows a schematic cross-sectional view of a photosensitive component according to a modified embodiment of the present application;

FIG. 11 shows the circuit board 10 in step S10;

FIG. 12 shows a schematic diagram of fabricating heat dissipation ribs 20 on the second surface 15 of the circuit board 10 in step S20;

FIG. 13 shows a schematic diagram of placing the circuit board 10 in a mold to form a molding cavity in step S30 in an embodiment of the present application;

FIG. 14 shows a schematic diagram of injecting a liquid molding material into a molding cavity and forming the package portion 30 in an embodiment of the present application;

FIG. 15 shows a composite substrate obtained after the mold is opened, and the composite substrate includes a circuit board 10, a heat dissipation rib 20 and a packaging part 30;

Figure 16A shows a circuit board jigsaw containing a connector part;

Figure 16B shows a circuit board jigsaw without a connector part;

FIG. 17 shows a schematic diagram of forming a molding cavity after mold clamping in step S30 of an embodiment of the present application;

FIG. 18 shows a schematic diagram after molding in step S30 of an embodiment of the present application;

FIG. 19 shows a schematic diagram after mold opening in step S30 of an embodiment of the present application;

FIG. 20 shows a schematic diagram of forming a molding cavity after mold clamping in step S31 of an embodiment of the present application;

FIG. 21 shows a schematic diagram after molding in step S31 of an embodiment of the present application;

FIG. 22 shows a schematic diagram after mold opening in step S31 of an embodiment of the present application;

FIG. 23 shows a composite substrate with heat dissipation extensions in an embodiment of the present application;

Figure 24 shows a schematic diagram of the principle of deformation of the photosensitive chip due to bending of the circuit board and the molded body;

FIG. 25 shows a schematic cross-sectional view of a camera module in an embodiment of the present application;

FIG. 26 shows a schematic cross-sectional view of a camera module in another embodiment of the present application;

FIG. 27 shows a schematic cross-sectional view of a camera module in another embodiment of the present application;

FIG. 28 shows a schematic cross-sectional view of a camera module in another embodiment of the present application;

FIG. 29 shows a schematic cross-sectional view of a camera module in another embodiment of the present application;

FIG. 30 shows a schematic cross-sectional view of a camera module in another embodiment of the present application;

FIG. 31 shows a schematic cross-sectional view of a camera module in another embodiment of the present application;

FIG. 32 shows a schematic cross-sectional view of a composite substrate 1000 in another embodiment of the present application;

FIG. 33 shows a schematic diagram of placing the circuit board 10 in a mold to form a molding cavity in step S30 in another embodiment of the present application;

FIG. 34 shows a schematic diagram of injecting a liquid molding material into a molding cavity and forming the package portion 30 in another embodiment of the present application;

FIG. 35A shows a circuit board assembly in an embodiment of the present application;

FIG. 35B shows a circuit board assembly in another embodiment of the present application;

FIG. 35C shows a circuit board assembly in another embodiment of the present application;

FIG. 35D shows a circuit board assembly in another embodiment of the present application;

FIG. 36 shows a schematic bottom view of a circuit board jigsaw and a plurality of strip-shaped heat dissipation ribs in an embodiment of the present application;

FIG. 37A shows a schematic cross-sectional view of the circuit board after clamping in an embodiment of the present application;

FIG. 37B shows a schematic cross-sectional view of the circuit board after clamping in another embodiment of the present application;

Figure 38 shows the flow direction of the molding material in an embodiment of the present application;

FIG. 39 shows a schematic bottom view of the composite substrate panel obtained after the back molding is completed in an embodiment of the present application;

FIG. 40 shows a schematic diagram of cutting composite substrate panels in an embodiment of the present application;

FIG. 41A shows a three-dimensional schematic diagram of a single composite substrate made based on the foregoing splicing board according to an embodiment of the present application;

FIG. 41B shows an exploded schematic diagram of FIG. 38A;

FIG. 42 shows a schematic front view of a photosensitive component panel in an embodiment of the present application.

Detailed ways

In order to better understand the application, various aspects of the application will be described in more detail with reference to the drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application, and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and/or" includes any and all combinations of one or more of the associated listed items.

It should be noted that in this specification, expressions such as first, second, etc. are only used to distinguish one feature from another feature, and do not represent any restriction on the feature. Therefore, without departing from the teaching of the present application, the first subject discussed below may also be referred to as the second subject.

In the drawings, the thickness, size, and shape of objects have been slightly exaggerated for ease of description. The drawings are only examples and are not drawn strictly to scale.

It should also be understood that the terms "including", "including", "having", "including" and/or "including", when used in this specification, mean that the stated features, wholes, steps, operations exist , Elements and/or components, but does not exclude the presence or addition of one or more other features, wholes, steps, operations, elements, components and/or combinations thereof. In addition, when expressions such as "at least one of" appear after the list of listed features, the entire listed feature is modified instead of individual elements in the list. In addition, when describing the embodiments of the present application, the use of “may” means “one or more embodiments of the present application”. And, the term "exemplary" is intended to refer to an example or illustration.

As used herein, the terms "substantially", "approximately" and similar terms are used as terms representing approximation, not terms representing degree, and are intended to illustrate the measurement that will be recognized by those of ordinary skill in the art. The inherent deviation in the value or calculated value.

Unless otherwise defined, all terms (including technical terms and scientific terms) used herein have the same meanings as commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that terms (such as terms defined in commonly used dictionaries) should be interpreted as having meanings consistent with their meanings in the context of related technologies, and will not be interpreted in an idealized or excessively formal sense unless This is clearly defined in this article.

It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other if there is no conflict.

As mentioned earlier, with the development of mobile phone camera modules with high pixels and high frame rates, the heat generated by the photosensitive chip is increasing. The inventor of the present case found that the superposition of factors such as heat accumulation and increase in the size of the photosensitive chip (high pixels leads to an increase in the size of the photosensitive chip) makes the photosensitive chip prone to deformation, and the deformation is sufficient to cause the imaging quality of the camera module to decrease. Specifically, under the current development trend of the mobile phone market (mobile phone camera module market), the photosensitive chip itself is large in area, high in power, and generates more heat; second, the photosensitive chip is large in area and small in thickness. This ratio leads to the chip itself It is easily affected by foreign objects; thirdly, the photosensitive chip is affected by the force generated by foreign objects such as circuit boards and mold deformation, which makes the photosensitive chip more susceptible to deformation. Based on this, the applicant proposes a composite substrate that can suppress the aforementioned deformation, and a photosensitive component and camera module based on the composite substrate. Hereinafter, the present application will be described in detail with reference to the drawings and in conjunction with embodiments.

FIG. 1 shows a schematic cross-sectional view of a composite substrate 1000 for a camera module in an embodiment of the present application. Referring to FIG. 1, in this embodiment, the composite substrate 1000 includes a circuit board 10, a heat dissipation rib 20 and a backside packaging portion 30. The circuit board 10 has a first surface 14 for attaching a photosensitive chip and a second surface 15 opposite to the first surface 14. The heat dissipation ribs 20 are directly fabricated on the second surface 15. The material used for the heat dissipation ribs has good thermal conductivity. In this embodiment, the thermal conductivity of the material used for the heat dissipation ribs is 10-1000W/mK. The specific materials can be copper, aluminum, silver, metal alloys or thermal conductive silicone grease, etc. material. The back encapsulation portion 30 covers the second surface 15 and fills the gap between the heat dissipation ribs 20. Further, FIG. 2 shows a three-dimensional schematic diagram of the composite substrate 1000 shown in FIG. 1. Referring to FIG. 2, the circuit board 10 may include a circuit board main body 11, a connector 12 and a flexible connection band 13. Only the circuit board main body 11 is shown in FIG. 1. In this embodiment, the heat dissipation ribs 20 are actually attached to the back of the circuit board main body 11, so the connector 12 and the flexible connecting band 13 are omitted in some drawings. In this embodiment, the circuit board main body 11 may be a PCB board. The heat dissipation ribs 20 are a plurality of linear strip heat dissipation ribs 21 arranged in parallel. Correspondingly, the back encapsulation portion 30 is filled between a plurality of linear strip-shaped heat dissipation ribs 21 arranged in parallel, and covers the second surface 15. For clarity of illustration, FIG. 2 shows the backside packaging portion 30 and the circuit board 10 separately. The back encapsulation portion 30 may be fabricated on the second surface 15 through a molding process. Of course, in other embodiments, the back encapsulation portion 30 can also be implemented by other encapsulation processes such as injection molding and molding, as long as it can cover the second surface 15 and fill the gap between the heat dissipation ribs 20 to achieve encapsulation.

Here, based on different packaging methods, the setting of the back side packaging part is based on different packaging processes, and the setting of the heat dissipation ribs has different requirements. If it is processed by transfer molding, the mold is required to press the surface of the circuit board to form a runner Therefore, the direction of the heat dissipation ribs should preferably be parallel to the molded press-fit side (ie the exposed side of the circuit board), or at a certain angle, such as 45 degrees or less than 45 degrees with the press-fit side to facilitate molding Fluid is injected to prevent "under injection" from happening. The molding process is mainly encapsulated by molding powder. There is a certain gap between the surface flatness of molded packages and molded packages.

Further, FIG. 3 shows a schematic front view of a composite substrate 1000 on which the photosensitive chip 50 is mounted in an embodiment of the present application. For ease of understanding, in this article, the side facing the photosensitive surface is referred to as the front side, and the side facing away from the photosensitive surface is referred to as the back side. Referring to FIG. 3, in this embodiment, the photosensitive chip 50 is attached to the center of the circuit board 10. The area of the first surface 14 of the circuit board 10 for attaching the photosensitive chip 50 is called a chip attaching area. Further, FIG. 4 shows a schematic cross-sectional view of a photosensitive component 2000 including a composite substrate 1000 in an embodiment of the present application. 3 and 4 in combination, it can be seen that in this embodiment, a part of the heat dissipation rib 20 is located in an area of the second surface corresponding to the back of the chip attachment area. Among them, part of the linear strip-shaped heat dissipation ribs 21 are located in the area on the back of the chip attachment area, and both ends of these linear strip-shaped heat dissipation ribs 21 extend to parts outside the chip attachment area. Another part of the linear strip-shaped heat dissipation ribs 21 is located at the edge area of the circuit board 10, that is, this part of the linear strip-shaped heat dissipation ribs 21 are all located outside the chip attaching area. In this embodiment, since at least a part of the heat dissipation ribs 20 are arranged in the area overlapping with the photosensitive chip, the distance between the photosensitive chip and the heat dissipation ribs can be shortened, and the heat dissipation efficiency can be increased. In this embodiment, the bottom surface of the heat dissipation rib is exposed outside the back encapsulation portion, so as to improve the heat dissipation effect. In this embodiment, the back radiating ribs are combined with the encapsulation part, which on the one hand improves the structural strength of the circuit board, on the other hand, improves the heat dissipation efficiency of the photosensitive chip, avoids excessive heat accumulation, and reduces the thermal expansion coefficient caused by The stress that causes the circuit board to bend, so the photosensitive component of the present application can suppress the bending of the photosensitive chip from two aspects.

Further, still referring to FIG. 1, in an embodiment of the present application, the bottom surface of the back surface packaging portion is flush with the bottom surface of the heat dissipation rib. In this way, the back surface of the photosensitive component in this embodiment can be a flat surface, which facilitates the realization of subsequent manufacturing processes, facilitates the adaptation to other parts of the terminal device (such as a mobile phone), and is more suitable for mass production. Further, in this embodiment, the thickness of the heat dissipation ribs 20 can be 0.05mm-0.4mm, which ensures that the strength of the photosensitive component can be effectively strengthened without increasing the thickness of the camera module too much, and the strength of the structure and heat dissipation are enhanced. It is used to suppress the bending effect of the photosensitive chip, thereby effectively preventing the imaging quality (such as field curvature performance) of the camera module from decreasing. In addition, since the molded body can play the role of strengthening the circuit board, the circuit board selected in this technical solution can be thinner than the conventional design circuit board, generally reducing the thickness of the circuit board by 0.1mm. In some cases, the module height will not be increased. The thickness of the conventional circuit board is generally 0.35mm or more (for example, 0.35mm-0.45mm), while the thickness of the circuit board of the MOB module can be less than 0.3mm, and ideally it can be less than 0.25mm. It should be noted that in this embodiment, the thickness refers to the axial dimension, that is, the dimension in the optical axis direction of the camera module. The axial direction can also be understood as the normal direction of the photosensitive surface or the first surface.

It should be noted that although in the above-mentioned embodiment, the bottom surface of the back surface encapsulation portion is flush with the bottom surface of the heat dissipation rib, the present application is not limited to this. For example, FIG. 32 shows a schematic cross-sectional view of a composite substrate 1000 in another embodiment of the present application. In this embodiment, the back encapsulation part 30 is directly formed on the back molding part of the second surface 15 (namely the back) of the circuit board through a molding process, and the back molding part covers the bottom surface of the heat dissipation rib 20, Instead of being flush with the bottom surface of the heat dissipation rib 20. This solution can help improve product yield. Since the uniformity of the molding materials may be insufficient, if the back encapsulation part that is flush with the bottom surface and the heat dissipation ribs is directly made during molding, sometimes the problem of uneven molding bottom surface is encountered. Therefore, in this embodiment, the back molding part covers the bottom surface of the heat dissipation rib 20, so that a bottom surface 38 composed entirely of molding material can be obtained. This bottom surface 38 can have a high degree of flatness, and the process difficulty is reduced. , And can reduce the requirements for the quality of molding materials, which is beneficial to improve product yield and reduce production costs. Further, in an embodiment of the present application, on the basis that the back molding part covers the second surface and the bottom surface of the heat dissipation rib, the bottom surface 38 of the back molding part is connected to the bottom surface of the heat dissipation rib. The distance between the bottom surfaces may not be more than 0.1 mm, and the distance between the bottom surface 38 of the back molding part and the second surface 15 may not be more than 0.2 mm (that is, the thickness of the back molding part is not more than 0.2 mm). The composite substrate thus obtained still has a smaller thickness. Further, in an embodiment of the present application, when the back molding part covers the second surface 15 and the bottom surface of the heat dissipation rib 20, the thickness of the circuit board can be further reduced to 0.25 mm or 0.25 mm. mm below.

Further, still referring to FIG. 3, in an embodiment of the present application, the photosensitive chip 50 is a rectangle with a long side L and a short side W, and the heat dissipation ribs 20 are composed of a plurality of parallel linear strip heat dissipation ribs. The plurality of parallel linear strip heat dissipation ribs may be parallel to the long side L of the photosensitive chip 50. A typical photosensitive chip is a 16:9 rectangle, and the chip usually has different degrees of warping on the long side and the short side. The direction of the heat dissipation ribs used in this embodiment is more conducive to suppressing and preventing the photosensitive chip from bending, so it is preferred The heat dissipation ribs are arranged in a direction parallel to the long side of the photosensitive chip.

In another embodiment of the present application, the circuit board 10 (actually refers to the circuit board body 11) is rectangular, the rectangle has long sides and short sides, and a plurality of linear strip-shaped heat dissipation ribs are all parallel to The long side of the circuit board 10. The direction of the heat dissipation ribs used in this embodiment is more conducive to restraining and preventing the photosensitive bending from occurring. It should be noted that in FIG. 3, the long side direction of the photosensitive chip is consistent with the long side direction of the circuit board, but the application is not limited to this, because sometimes the long side of the photosensitive chip and the long side of the circuit board may be perpendicular.

Further, FIG. 5 shows a schematic diagram of the back side of the composite substrate in a modified embodiment of the present application. Referring to FIG. 5, in this embodiment, the heat dissipation rib 20 adopts another shape, that is, the heat dissipation rib 20 is composed of a single, integrated strip heat dissipation rib. When viewed from below, the radiating ribs 20 are substantially in the shape of a "meter". At this time, the gap between the heat dissipation ribs can be understood as the gap between different parts of a single heat dissipation rib. The back encapsulation part 30 fills the gap to realize encapsulation. This embodiment can strengthen the structural strength of the circuit board in the diagonal, horizontal, and vertical directions, support the circuit board in multiple directions, suppress the warpage of the photosensitive component at the four corners, strengthen the ability to hinder the bending of the photosensitive component, and alleviate the bending of the photosensitive component . In some cases, because the glue (ie glue) inside the chip is concentrated in the middle, or because the suction nozzle sucks the chip from the upper part to the circuit board, the chip is prone to bend up from the center, and in the subsequent process May exacerbate the degree of bending mentioned above. In a preferred embodiment of the present invention, the center position of the radiating ribs of the rice-shaped or X-shaped or cross-shaped radiating ribs corresponds to the central area of the chip, and the central part of the chip is reinforced and fixed, which is beneficial to suppress the upward warping of the chip center , Suppress the four corners of the photosensitive component warping, thereby suppressing the chip field curvature.

Further, FIG. 6 shows a schematic diagram of the back of the composite substrate in another modified embodiment of the present application. Referring to FIG. 6, in this embodiment, the heat dissipation rib 20 adopts another shape, that is, the heat dissipation rib 20 is composed of a single, integrated strip heat dissipation rib. When viewed from the bottom, the radiating rib 20 is substantially in the shape of a square spiral. Similar to the embodiment of FIG. 5, in this embodiment, the gap between the heat dissipation ribs can be understood as the gap between different parts of a single heat dissipation rib. The back encapsulation part 30 fills the gap to realize encapsulation. This embodiment can strengthen the structural strength of the circuit board, support the circuit board in multiple directions, strengthen the ability to hinder the bending of the photosensitive component, and alleviate the bending of the photosensitive component.

It should be noted that the present application can also use other shapes of heat dissipation ribs 20, such as "X"-shaped heat dissipation ribs, "back" shapes or ring shapes. The heat dissipation ribs 20 may also be a plurality of small heat dissipation ribs arranged in a scattered point array. The heat dissipation ribs 20 can also be a combination of two or more of the foregoing. For example, on the back of the same circuit board, a plurality of parallel linear strip-shaped heat dissipation ribs and a "meter"-shaped heat dissipation rib can be simultaneously provided. Various combinations can be set flexibly, so I won't repeat them in this article.

Further, in an embodiment of the present application, the heat dissipation ribs can be made of metal materials. For example, a multilayer PCB can be used as a circuit board. The multi-layer PCB board has multiple layers, and each layer can be arranged with circuits and designed functional circuits. Different levels can be connected by copper pillars (or other metal pillars) to connect the entire circuit board (electrically) into a whole. In this embodiment, a copper seed layer can be made in a certain layer of the circuit board, and then copper pillars are planted on the seed layer by electroplating and grown outside the second surface (ie the backside surface) of the circuit board , Thereby forming the required heat dissipation ribs. In this embodiment, the manufacturing process of the heat dissipation ribs can be compatible with the manufacturing process of the circuit board, which is easy for mass production, and the obtained composite substrate has a higher structural strength. The layer used to make the seed layer of the multilayer PCB board may not be used for circuit conduction, but is dedicated to strengthening the structural strength of the circuit board.

In another embodiment of the present application, the heat dissipation ribs may be formed of a thermally conductive colloidal substance. For example, the thermally conductive colloidal substance can be coated on the second surface (ie the back side surface) of the circuit board in a desired shape, and then the thermally conductive colloidal substance is hardened to form a heat dissipation rib. The thermally conductive colloidal substance may be thermally conductive silicone grease, for example.

In another embodiment of the present application, the heat dissipation ribs may be formed first, and then attached to the second surface (ie, the back side surface) of the circuit board by bonding or welding. The pre-formed heat dissipation ribs can be made of metal material or hardened thermally conductive colloidal material, such as thermally conductive silicone grease.

Further, still referring to FIG. 4, according to an embodiment of the present application, a photosensitive assembly 2000 based on a composite substrate is provided. The photosensitive component 2000 includes a composite substrate. The composite substrate may include a circuit board 10, a heat dissipation rib 20 and a back encapsulation part 30. The photosensitive chip 40 is attached to the first surface 14 of the circuit board 10. The heat dissipation ribs 20 are directly fabricated on the second surface 15 of the circuit board 10. The second surface 15 of the back encapsulation portion 30 fills the gap between the heat dissipation ribs 20 to achieve the encapsulation effect. The photosensitive component 2000 further includes an electronic component 50 that can be mounted on the first surface 14 and arranged around the photosensitive chip 40. The electronic component 50 may be, for example, a passive device such as a capacitive element or an inductance element, and may also be an active device such as a memory chip and an image processor chip. The photosensitive component may also include a metal wire 60, and the metal wire 60 may be bonded by wire (its English name is Wire Bonding, and may also be called "wire bonding", "binding", "binding" or "wire bonding". The wire bonding process electrically connects the photosensitive chip and the circuit board. The metal wire 60 may be a metal wire with better conductivity such as gold wire, aluminum wire or copper wire.

Further, FIG. 7 shows a photosensitive assembly 2000 based on a composite substrate according to another embodiment of the present application. The difference between this embodiment and the previous embodiment (refer to FIG. 4) is that the electronic component 50 is arranged on the back side of the circuit board 10, that is, the electronic component 50 is mounted on the second surface 15. The back encapsulation part 30 can wrap the electronic component 50 or fill the periphery of the electronic component 50, so as to realize the encapsulation of the back of the circuit board. In this embodiment, since the electronic components can be arranged on the back side of the circuit board, the space for arranging electronic components on the front side of the circuit board can be omitted, which helps to reduce the radial size of the photosensitive component. In this embodiment, the radial dimension refers to the dimension in a direction perpendicular to the optical axis of the camera module. The thickness direction of the circuit board can be called the axial direction, which is parallel to the optical axis of the camera module. It should be noted that the electronic components can be all arranged on the back of the circuit board, or partly on the back of the circuit board and partly on the front of the circuit board.

Further, FIG. 8 shows a photosensitive assembly 2000 based on a composite substrate according to another embodiment of the present application. Compared with the embodiment in FIG. 4, the difference of this embodiment is that a secondary heat dissipation portion 22 is added. Wherein, the top surface of the secondary heat dissipation portion 22 is connected to the bottom surface of the heat dissipation rib 20. The bottom surface of the back encapsulation portion 30 may be flush with the bottom surface of the secondary heat dissipation portion 22, and the bottom surface of the secondary heat dissipation portion 22 is exposed outside the back encapsulation portion 30. The area of the bottom surface of the secondary heat dissipation portion 22 is larger than the area of the bottom surface of the heat dissipation rib 20. In this way, the surface area of the heat dissipation member can be increased and the heat dissipation efficiency can be improved. It should be noted that FIG. 8 is not the only implementation form of the secondary heat sink 22. For example, in another embodiment, the longitudinal section of the secondary heat sink 22 may be trapezoidal, so that the cross-sectional area of the secondary heat sink 22 The top surface to the bottom surface gradually increase. This implementation can also increase the surface area of the heat dissipation member and improve the heat dissipation efficiency.

Further, FIG. 9 shows a schematic cross-sectional view of a photosensitive component according to another modified embodiment of the present application. Referring to FIG. 9, in this embodiment, the photosensitive component eliminates the back encapsulation part, that is, the heat dissipation ribs 20 are fabricated on (or attached to) the second surface (rear surface) of the circuit board 10. The bottom and side surfaces of the heat dissipation rib 20 are exposed to the outside. The heat dissipation ribs 20 may be a plurality of linear strip heat dissipation ribs arranged in parallel, or may be a plurality of heat dissipation ribs arranged in a scattered point array, or may be a single strip heat dissipation rib, and the single strip heat dissipation rib is Spiral or "meter" shape, or other strip shapes that can be connected together but still have gaps between different parts; it can also be any combination of two or more of the above.

Further, in an embodiment of the present application, the photosensitive component may further include a front molding part, and the front molding part may be fabricated on the first surface through a molding process and surrounding the photosensitive chip. around. In this embodiment, there is a gap between the front molding part and the photosensitive chip, that is, the MOB process. Moreover, in this embodiment, the top surface of the front molding part is suitable for mounting a lens assembly. Here, the lens assembly may be a lens assembly with a motor or a lens assembly without a motor.

Further, in another embodiment of the present application, the photosensitive component may further include a front molding part, and the front molding part may be made on the first surface by a molding process and surround the photosensitive chip And the front molding part extends to the photosensitive chip and contacts the photosensitive chip (for example, the front molding part may cover the edge area of the photosensitive chip), that is, the MOC process. Moreover, in this embodiment, the top surface of the front molding part is suitable for mounting a lens assembly. Here the lens assembly can be a lens assembly with a motor, or a lens assembly without a motor. The lens assembly and the photosensitive assembly are assembled together to obtain a camera module.

It should be noted that when the photosensitive component is packaged by the MOC process, the photosensitive chip may be more prone to bending because the molded body is integrally formed on the photosensitive chip. For example, for photosensitive components packaged by the MOC process, not only may the photosensitive chip bend after long-term use, but also the photosensitive chip may be bent during the manufacturing process. For another example, for photosensitive components packaged with the MOC or MOB process, not only high-pixel and high-frame-rate camera modules may bend the photosensitive chip after long-term use. This bending phenomenon is relatively low in the number of pixels and frame rate. May also appear in the camera module. This is because during the molding process, the temperature change of the manufacturing environment is relatively large (for example, it rises from room temperature to above 150 degrees, and then decreases to room temperature), and the thermal expansion coefficient of the molding material and the circuit board are different. Therefore, stress is easily generated between the two, and the photosensitive components of the MOC/MOB module are more likely to bend. Therefore, for the photosensitive component packaged by the MOC/MOB process, the heat dissipation ribs in the foregoing embodiment are provided on the back of the circuit board to achieve a more obvious effect in suppressing the bending of the photosensitive chip. Furthermore, the combination of the molded body and the heat dissipation ribs can also reduce the thickness requirements of the circuit board, while having good flatness, and the heat dissipation performance is significantly improved compared with existing products.

Further, in another embodiment of the present application, the front molding part may be replaced with a lens holder (sometimes may also be called a lens holder). The lens holder is formed and then mounted on the first surface. Specifically, the lens holder is installed on the first surface and surrounds the photosensitive chip, and the top surface of the lens holder is suitable for installing a lens assembly.

Further, in another embodiment of the present application, the photosensitive component may further include a color filter, and the color filter may be installed on the front molding part or the lens holder. When the color filter is mounted on the front molding part, the top surface of the front molding part may form a step structure, and the color filter is mounted on the step structure.

Further, in another embodiment of the present application, the photosensitive element may not include a color filter. A color filter assembly can be added to the camera module. The color filter assembly includes a lens holder and a color filter mounted on the lens holder. The photosensitive component may have a front molding part, and the bottom of the lens holder is mounted on the top surface of the front molding part. A lens assembly is mounted on the top surface of the lens holder.

It should be noted that in the above embodiments, the photosensitive chips are all attached to the front surface of the circuit board, that is, the first surface, but the application is not limited to this. In a modified embodiment, the center of the circuit board may have a main through hole that can accommodate the photosensitive chip, and the photosensitive chip may be installed in the main through hole. This manufacturing process helps reduce the axial size of the photosensitive component. That is to reduce the size of the optical axis (referring to the optical axis of the camera module or lens assembly). FIG. 10 shows a schematic cross-sectional view of a photosensitive component according to a modified embodiment of the present application. With reference to Figure 10, it can be seen that, in this embodiment, the circuit board and the photosensitive chip form a combined body, wherein the side facing the photosensitive surface of the photosensitive chip is the front side of the combined body, and the side opposite to the front side is The back of the combination. The heat dissipation ribs are located on the back of the combined body, wherein the heat dissipation ribs are directly fabricated or attached to the back of the combined body. Moreover, in this embodiment, the back surface of the assembly includes the circuit board and the back surface of the photosensitive chip, and at least a part of the heat dissipation rib is located on the back surface of the photosensitive chip.

Further, according to another embodiment of the present application, there is also provided a method for manufacturing a photosensitive element, which includes the following steps S10-S40 executed in sequence.

Step S10, prepare a circuit board 10. FIG. 11 shows the wiring board 10 in step S10. The circuit board 10 has a first surface 14 for attaching photosensitive chips and a second surface 15 opposite to the first surface 14, wherein the first surface 14 has a chip attaching area. The circuit board 10 in this step can be a PCB board. The PCB board can be made by yourself or can be ordered on the market (note that there is no such product on the market at present, in other words, the circuit board 10 itself in this step The structure is not prior art).

In step S20, a heat dissipation rib 20 is fabricated on the second surface 15 (ie, the back side) of the circuit board 10. FIG. 12 shows a schematic diagram of fabricating heat dissipation ribs 20 on the second surface 15 of the circuit board 10 in step S20. At least a part of the heat dissipation rib 20 is located directly below the chip attachment area (note that the circuit board 10 is inverted in FIG. 12, so the heat dissipation rib 20 is located above the circuit board 10 in FIG. 12), that is, the second surface The area on 15 that overlaps with the chip attaching area. In this embodiment, the heat dissipation ribs 20 can be arranged in a preset shape. For example, the heat dissipation ribs may be composed of a plurality of parallel linear strip heat dissipation ribs.

Further, in an embodiment, in the step S20, the thickness of the heat dissipation rib 20 may reach 0.1 mm or less. The thickness of the radiating ribs here refers to the size in the normal direction of the second surface, and the thickness of the radiating ribs is the size of the radiating ribs beyond the second surface. If the root of the radiating ribs is located inside the circuit board, the part located inside the circuit board is not Calculate within the thickness of the radiating rib.

Step S30, covering the back encapsulation portion on the second surface, wherein the back encapsulation portion covers the second surface and fills the gaps between the heat dissipation ribs, wherein the gaps between the heat dissipation ribs are multiple The gap between the heat dissipation ribs or the gap between different parts of a single heat dissipation rib; the bottom surface of the heat dissipation rib is exposed outside the back encapsulation portion and the bottom surface of the back encapsulation portion is connected to the bottom surface of the heat dissipation rib Flush. In this embodiment, the back encapsulation part may be formed on the second surface by a molding process. Specifically, FIG. 13 shows a schematic diagram of placing the circuit board 10 in a mold to form a molding cavity in step S30 in an embodiment of the present application. Fig. 14 shows a schematic diagram of injecting a liquid molding material into a molding cavity and forming the package portion 30 in an embodiment of the present application. Referring to FIG. 13, the circuit board 10 is placed in a mold, which includes an upper mold 91 and a lower mold 92. The second surface 15 of the circuit board 10 faces upward, and the second surface 15 has heat dissipation ribs 20. There is a gap between the heat dissipation ribs 20, the bottom surface of the upper mold 91 is pressed against the end surface of the heat dissipation rib 20, and the lower mold 92 bears against the first surface 14 of the circuit board 10. After the upper and lower molds are closed, a molding cavity is formed between the upper mold 91, the circuit board 10 and the heat dissipation rib 20. Then, referring to FIG. 14, a liquid molding material is injected into the molding cavity of FIG. 13, and the liquid molding material is solidified and formed into the packaging part 30. Further, FIG. 15 shows a composite substrate obtained after the mold is opened, and the composite substrate includes a circuit board 10, a heat dissipation rib 20 and a packaging part 30. It should be noted that although the above-mentioned embodiment adopts a solution in which the bottom surface of the back molding part is flush with the bottom surface of the heat dissipation ribs, the application is not limited to this. For example, in another embodiment of the present application, the back molding part may simultaneously cover the second surface 15 and the bottom surface of the heat dissipation rib 20 (refer to FIG. 32). In this embodiment, a gap 39 may be left between the upper mold 91 and the bottom surface of the heat dissipation rib 20 (the bottom surface of the heat dissipation rib 20 is upward in FIGS. 13-14) (refer to FIG. 33, which shows the In step S30 in another embodiment of the present application, the circuit board 10 is placed in a mold to form a molding cavity). The gap 39 can be 0.1 mm (it can also be other values, such as 0.06 mm, generally not greater than 0.1 mm). Further, FIG. 34 shows a schematic diagram of injecting a liquid molding material into a molding cavity and forming the package portion 30 in another embodiment of the present application. Since the uniformity of the molding materials may be insufficient, if the back encapsulation part that is flush with the bottom surface and the heat dissipation ribs is directly made during molding, sometimes the problem of uneven molding bottom surface is encountered. By covering the bottom surface of the heat dissipation ribs with the back molding part, a bottom surface completely composed of molding materials can be obtained. This bottom surface can have a high level of flatness, and the process difficulty is reduced, and the quality requirements of the molding materials can be reduced. , Which is conducive to improving product yield and reducing production costs. Further, in an embodiment of the present application, when the back molding part covers the second surface and the bottom surface of the heat dissipation rib, the thickness of the circuit board can be further reduced to 0.25 mm or less .

In step S40, a photosensitive chip and other components (such as electronic components, metal wires, lens holders, color filters, etc.) are mounted on the first surface (ie, the front side) of the circuit board, and then the photosensitive component is manufactured. Wherein, the photosensitive chip may be pasted on the chip attaching area of the first surface.

Further, in one embodiment, in the step S20, the heat dissipation ribs may be directly fabricated on the second surface of the circuit board. For example, the circuit board may have a seed layer, and a metal layer is planted on the seed layer so that the metal layer grows beyond the second surface, thereby forming the heat dissipation ribs. For another example, in a modified embodiment, a thermally conductive colloidal substance may be coated on the second surface, and then the thermally conductive colloidal substance is hardened to form the heat dissipation ribs.

Further, in another embodiment, the heat dissipating ribs may be formed in advance and then attached to the second surface of the heat dissipating ribs by welding or bonding.

In the above-mentioned embodiments, the heat dissipation ribs are first fabricated and then molded to form the back encapsulation portion. But this application is not limited to this. For example, in another embodiment of the present application, another method for manufacturing a photosensitive component is also provided. Unlike the manufacturing method of the previous embodiment, in this embodiment, the backside package portion can be molded on the backside of the circuit board first, and then Then fabricate the heat dissipation ribs or attach the heat dissipation ribs to the second surface (ie, the back surface) of the circuit board. Specifically, in this embodiment, the execution order of step S30 and step S20 is reversed, that is, step S30 is executed first, and then step S20 is executed. Wherein, in the step S30, the back surface encapsulation portion may be formed on the second surface by a molding process, and in the molding process, an indenter (or a convex structure of the upper mold) may be used on the back surface A through hole is left in the encapsulation part, and the through hole makes a part of the second surface exposed outside the back encapsulation part. FIG. 17 shows a schematic diagram of forming a molding cavity after mold clamping in step S30 of an embodiment of the present application. It can be seen with reference to FIG. 17 that the upper mold 91 has a plurality of downwardly protruding structures 93 which bear against the second surface 15 of the circuit board 10, and an enclosure can be formed between the upper mold 91 and the circuit board 10. The molding cavity of the convex structure 93. FIG. 18 shows a schematic diagram after molding in step S30 of an embodiment of the present application. Referring to FIG. 18, it can be seen that the liquid molding material is injected into the molding cavity and cured to obtain the back encapsulation portion 30. It can be seen in FIG. 18 that the back encapsulation portion 30 can surround the protrusion structure 93, or the back encapsulation portion 30 can fill the gap between the protrusion structure 93 and the gap between the protrusion structure 93 and the mold. Further, FIG. 19 shows a schematic diagram after mold opening (sometimes called demolding) in step S30 of an embodiment of the present application. Referring to FIG. 19, after the mold is opened, a through hole 31 is reserved in the back encapsulation portion 30, and the through hole 31 may be elongated. Step S20 is performed on the obtained wiring board having the back surface packaging portion 30. In the step S20, the heat dissipation ribs are fabricated in the through holes of the back encapsulation portion, thereby obtaining a composite substrate as shown in FIG. 15.

Furthermore, in an embodiment, after the steps S20 and S30, the following steps S31 and S32 may be performed.

In step S31, a second-level package part is fabricated on the bottom surface of the back-side package part through a molding process, the second-level package part has a second-level through hole, and the second-level through hole exposes the bottom surface of the heat dissipation rib and the The adjacent area of the bottom surface of the back surface encapsulation part around the heat dissipation rib. FIG. 20 shows a schematic diagram of forming a molding cavity after mold clamping in step S31 of an embodiment of the present application. Referring to FIG. 20, it can be seen that in this embodiment, the upper mold 91 may have a plurality of downward convex structures 93, and these convex structures 93 bear the composite substrate (referring to the composite substrate obtained after steps S20 and S30 are completed (the The composite substrate can be composed of the circuit board 10, the heat dissipation ribs 20, and the back encapsulation portion 30). In this embodiment, the composite substrate is actually a semi-finished product on the upper surface (note that the composite substrate is inverted in FIG. 20). Yes, the upper surface is actually the back surface), a molding cavity surrounding the raised structure 93 can be formed between the upper mold 91 and the composite substrate. FIG. 21 shows a schematic diagram after molding in step S31 of an embodiment of the present application. With reference to Figure 21, it can be seen that by injecting the liquid molding material into the molding cavity and curing it, the secondary molding part with the secondary through holes (shown in Figure 22) can be obtained, that is, the secondary packaging part. 32. Further, FIG. 22 shows a schematic diagram after mold opening (sometimes called demolding) in step S31 of an embodiment of the present application. Referring to FIG. 22, after the mold is opened, a composite substrate with a secondary encapsulation portion 32 can be obtained. The secondary packaging portion 32 has a secondary through hole 33, and the secondary through hole 33 exposes the bottom surface of the heat dissipation rib 20 (the bottom surface is upward in FIG. 22) and the back packaging portion around the heat dissipation rib 20 The contiguous area 34 of the bottom surface.

In step S32, a heat dissipation extension is made in the secondary through hole to obtain a composite substrate with a heat dissipation extension. Fig. 23 shows a composite substrate with heat dissipation extensions in an embodiment of the present application. The composite substrate can be used to manufacture the photosensitive component as shown in FIG. 8. 8 and 23, the top surface of the heat dissipation extension portion 22 is connected to the bottom surface of the heat dissipation rib 20, and the bottom surface of the heat dissipation extension portion 22 is flush with the bottom surface of the secondary package portion 32 (note that the figure 23 The bottom surface is placed upwards). Wherein, the heat dissipation extension 22 is made by planting a metal layer or pouring and hardening a thermally conductive colloidal substance, or by bonding or welding a formed member.

Further, in an embodiment of the present application, the step S40 may further include: mounting at least a part of electronic components on the second surface of the circuit board. The step of mounting electronic components on the second surface may be performed before the step S30. In this way, in the step S30, the back encapsulation layer can cover the electronic components mounted on the second surface (or fill the gaps around the electronic components) to achieve the encapsulation effect.

Further, in an embodiment, the step S40 may further include: forming a front molding part on the first surface of the circuit board, the front molding part being manufactured on the first surface and surrounding the first surface through a molding process The periphery of the photosensitive chip and the top surface of the front molding part are suitable for mounting lens components.

Further, in one embodiment, in the step S30, the back encapsulation part is a back molding part, and the front molding part and the back molding part can be simultaneously molded on the circuit board. This will help improve production efficiency and save costs.

Further, in one embodiment, in the step S10, the prepared circuit board may be a circuit board assembled by connecting multiple single circuit boards together. Figure 16A shows a circuit board jigsaw including a connector part. The circuit board jigsaw can be a rigid-flex board. Figure 16B shows a circuit board jigsaw without a connector part. The circuit board jigsaw can be a PCB board, or called a hard board. Further, in this embodiment, in the step S20, the heat dissipation ribs are made on the second surface (ie, the back surface) of the circuit board jigsaw. That is, the heat dissipation ribs corresponding to multiple single circuit boards are produced at one time. In the step S30, the back encapsulation part corresponding to a plurality of single circuit boards may be manufactured by one-time molding, and the back encapsulation part may be connected and integrally cover the second surface of the circuit board jigsaw. In the step S40, the photosensitive chips may be respectively pasted (or mounted in other ways) on the first surfaces corresponding to the plurality of single circuit boards, thereby obtaining a photosensitive assembly panel. Further, the method for manufacturing a photosensitive component of this embodiment further includes step S50: cutting the photosensitive component panel to obtain a separated single photosensitive component.

Based on the method for manufacturing the photosensitive component of the above embodiment, the obtained photosensitive component and the lens component can be further assembled to obtain a complete camera module. The lens assembly here can be a lens assembly with a motor, or a lens assembly without a motor. The assembled camera module can be an auto-focus camera module or a fixed-focus camera module.

Further, FIG. 25 shows a schematic cross-sectional view of a camera module in an embodiment of the present application. Referring to FIG. 25, the camera module includes a lens assembly 3000 and a photosensitive assembly 2000. In this embodiment, the photosensitive assembly adds a lens holder 2001 and a color filter 2002 mounted on the lens holder 2001 to the photosensitive assembly of the embodiment in FIG. 1. The lens assembly 3000 may have a motor 3001, and the bottom surface of the motor is mounted on the top surface of the lens holder.

Further, FIG. 26 shows a schematic cross-sectional view of a camera module in another embodiment of the present application. The difference between this embodiment and the embodiment of FIG. 25 is that the electronic component 50 is mounted on the back of the circuit board 10 and the electronic component 50 is covered and wrapped by the back molding part 30.

Further, FIG. 27 shows a schematic cross-sectional view of a camera module in another embodiment of the present application. The difference between this embodiment and the embodiment in FIG. 25 is that the composite substrate of the photosensitive assembly 2000 is provided with a heat dissipation extension 22.

Further, FIG. 28 shows a schematic cross-sectional view of a camera module in another embodiment of the present application. The difference between this embodiment and the embodiment of FIG. 25 is that the back molding part is eliminated from the composite substrate of the photosensitive component.

Further, FIG. 29 shows a schematic cross-sectional view of a camera module in another embodiment of the present application. The difference between this embodiment and the embodiment of FIG. 28 is that a front molding part 2003 is formed on the upper surface of the circuit board 10 of the photosensitive assembly 2000. The bottom surface of the motor can be installed on the top surface of the front molding part 2003. The lens holder 2001 (corresponding to the lens holder in the previous embodiments) is only used to install the color filter 2002, and the lens holder 2001 is located in the front molding part 2003. The inside of the electronic component 50.

Further, FIG. 30 shows a schematic cross-sectional view of a camera module in another embodiment of the present application. The difference between this embodiment and the embodiment in FIG. 28 is that a front molding part 2003 is formed on the upper surface of the circuit board 10 of the photosensitive component 2000. The lens holder 2001 is installed on the top surface of the front molding part 2003, the color filter 2002 is installed on the lens holder 2001, and the lens assembly 3000 (the bottom surface of the motor) is installed on the top surface of the lens holder 2001.

Further, FIG. 31 shows a schematic cross-sectional view of a camera module in another embodiment of the present application. The difference between this embodiment and the embodiment of FIG. 30 is that the front molding part 2003 covers the electronic component 50 and the metal wire and contacts the photosensitive chip 40. In this embodiment, the front molding part 2003 may cover the edge area of the photosensitive chip, and the edge area may be a non-photosensitive area.

Further, according to an embodiment of the present application, there is also provided an electronic device having the camera module of any one of the foregoing embodiments. The electronic device may be a smart phone, a tablet computer, etc., for example.

In this article, the heat dissipation ribs can be understood as: reinforcing ribs with heat dissipation effect.

Further, according to an embodiment of the present application, there is also provided a method for manufacturing a composite substrate based on a splicing board, which includes steps S1000-S4000.

Step S1000, prepare a circuit board jigsaw. FIG. 35A shows a circuit board assembly in an embodiment of the present application. Referring to FIG. 35A, in this embodiment, the circuit board assembly 1 includes a plurality of circuit board units 2 connected together. The circuit board jigsaw 1 has a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of chip attachment areas for attaching photosensitive chips, and each of the The circuit board units 2 each have one chip attaching area, and the circuit board units 2 are distributed in an array. The circuit board units 2 and the circuit board units 2 and the frame 3 of the circuit board jigsaw can all be separated by insulating regions 4, as shown in FIG. 35A. With reference to Figure 35A, the circuit board jigsaw 1 is a rigid-flex board, in which the hard board part can form the circuit board main body 2a, and the soft board part corresponds to the flexible connecting strap 2b and its corresponding connector 2c (note the connector itself Usually not flexible). The circuit board main body 2a, the flexible connection band 2b and the connector 2c together constitute a circuit board unit 2. In this embodiment, there may be a non-insulating area 5 between adjacent circuit board units 2, which aims to prevent the continuous width of the insulating area 4 between adjacent circuit board units from being too large. Since the circuit board is usually a printed circuit board, it is formed by laminating multiple conductive layers and insulating layers. The insulating region 4 in FIG. 35A is usually formed by etching away the conductive material (for example, copper material) of the conductive layer. Therefore, the insulating area of the circuit board jigsaw may be thinner. In order to prevent the high-temperature molding flow in the subsequent molding step from damaging the thinner insulating area, in this embodiment, a non-insulating area is also provided between adjacent circuit board units 2 District 5. The non-insulating area 5 can also be understood as a non-etching area, and the non-etching area can reserve greater thickness and structural strength for the panel. Of course, the circuit board assembly is not limited to the form of FIG. 35A. For example, FIG. 35B shows the circuit board assembly in another embodiment of the present application. Referring to FIG. 35B, in the circuit board jigsaw 1, the insulating area 4 between adjacent circuit board units 2 may have a smaller width, so that the non-insulating area 5 between the adjacent circuit board units 2 can be omitted. Further, FIG. 35C shows a circuit board assembly in another embodiment of the present application. In this embodiment, the circuit board is a rigid board, that is, it does not include a soft board. In this embodiment, the circuit board unit 2 only includes the main body of the circuit board (for the convenience of description, the main body of the circuit board is directly called the circuit board). The flexible connecting band and the connector can be cut to obtain a single circuit board, and then pass The bonding process is connected to the circuit board. Further, FIG. 35D shows a circuit board assembly in another embodiment of the present application. In this embodiment, the insulating area 4 is not provided between the circuit board units 2 and the insulating area 4 is only provided between the circuit board unit 2 and the frame 3 of the circuit board jigsaw 1. This embodiment can improve the space utilization rate of the circuit board jigsaw, and help save circuit board materials.

In step S2000, at least one strip-shaped heat dissipation rib is arranged on the second surface. FIG. 36 shows a schematic bottom view of a circuit board jigsaw and a plurality of strip-shaped heat dissipation ribs in an embodiment of the present application. Referring to FIG. 36, each of the strip-shaped heat dissipation ribs 6 extends to each of the circuit board units 2 in the same row, and at least a part of the strip-shaped heat dissipation ribs 2 pass through the chip attaching area (in FIG. 36 The overlap area on the back side of the chip attachment area) is not shown. In this embodiment, a plurality of strip-shaped heat dissipation ribs 6 are arranged in parallel. In this step, the strip-shaped heat dissipation ribs can be set by growing a metal layer on the basis of the seed layer, or by attaching pre-formed heat dissipation ribs to the second surface. The strip-shaped heat dissipation ribs may also be provided by coating and curing thermally conductive silicone grease on the second surface. The imposition circuit board is supported by the strip heat dissipation ribs to strengthen the overall strength of the circuit board imposition. When the temperature is increased in the subsequent manufacturing process (baking, molding process), the warpage of the circuit board imposition can be minimized to improve the circuit The flatness of board imposition ensures the flatness of chip installation.

In step S3000, a back molding part is formed on the second surface through a molding process, and the bottom surface of the back molding part is flush with the bottom surface of the strip-shaped heat dissipation ribs to form a flat surface. Further, in an embodiment, this step can be decomposed into the following sub-steps S3100-S3300.

In substep S3100, the upper mold and the lower mold are closed. FIG. 37A shows a schematic cross-sectional view of the circuit board after clamping in an embodiment of the present application. Referring to FIG. 37A, the upper mold 8a is pressed onto the pressing edge 7 of the second surface of the circuit board jigsaw 1 (that is, the upper die 8a can be pressed on the second surface of the circuit board jigsaw Edge area, thereby forming a pressing edge 7), the lower mold 8b is pressed on the first surface of the circuit board jigsaw 1, and the inner surface of the upper mold 8a presses the strip-shaped heat dissipation ribs 6, Thus, a molding cavity is formed between the second surface, the strip-shaped heat dissipation ribs 6, and the upper mold 8a. Moreover, the direction of the strip-shaped heat dissipation ribs 6 can be such that a mold is formed between the plurality of strip-shaped heat dissipation ribs, and/or between the strip-shaped heat dissipation ribs and the mold used for the molding process. Plastic flow channel. The design of the direction of the radiating ribs can facilitate the flow of high-temperature molding flow, and prevent certain circuit board units (for example, those circuit board units far away from the injection port of the molding flow) from appearing "under injection", thereby ensuring the product yield. FIG. 37B shows a schematic cross-sectional view of the circuit board after clamping in another embodiment of the present application. In this embodiment, a strip-shaped heat dissipation rib 6 is provided in the edge area where the circuit board main body 2a and the flexible connecting band 2b are connected, so that the upper mold 8a presses the strip-shaped heat dissipation rib 6 located in the edge area to avoid liquid mold The plastic material leaks. At this time, the upper mold 8a may not press against the circuit board main body 2a, so the pressing edge 7 in FIG. 37A can be omitted. This will help reduce the size of the composite substrate, thereby reducing the size of the photosensitive components and camera modules. It should be noted that the panel molding of the present application is not limited to the situation of FIG. 37A and FIG. 37B. For example, in another embodiment, the inner surface of the upper mold 8a can be connected to the bottom surface of the strip-shaped heat dissipation rib 6 (due to the figure The circuit board in 37A is inverted, so the bottom surface of the strip-shaped heat dissipation rib 6 in FIG. 37A is located above) there may be a gap (the gap is similar to the gap 39 in FIG. 33). In this way, the molded part can cover the second bottom surface (back surface) of the circuit board and the strip-shaped heat dissipation ribs 6 at the same time. Further, the gap between the bottom surface of the strip-shaped heat dissipation rib 6 and the inner surface of the upper mold 8a can be 0.1 mm (it can also be other values, such as 0.06 mm, generally not greater than 0.1 mm). Since the uniformity of the molding materials may be insufficient, if the back encapsulation part that is flush with the bottom surface and the heat dissipation ribs is directly made during molding, sometimes the problem of uneven molding bottom surface is encountered. By covering the bottom surface of the heat dissipation ribs with the back molding part, a bottom surface completely composed of molding materials can be obtained. This bottom surface can have a high level of flatness, and the process difficulty is reduced, and the quality requirements of the molding materials can be reduced. , Which is conducive to improving product yield and reducing production costs. Further, in an embodiment of the present application, when the back molding part covers the second surface and the bottom surface of the heat dissipation rib, the thickness of the circuit board can be further reduced to 0.25 mm or less .

In sub-step S3200, a liquid molding flow is injected into the molding cavity, and the injection direction of the molding flow is consistent with the arrangement direction of a row of the circuit board units. Fig. 38 shows the flow direction of the molding material in an embodiment of the present application. The arrow direction represents the flow direction of the liquid molding flow. It can be seen that the flow direction is consistent with the arrangement direction of the circuit board units 2 in the same row, and is also consistent with the direction of the strip heat dissipation ribs 6. The direction of the strip heat dissipation rib 6 can be understood as the direction of the axis of the strip heat dissipation rib 6.

In sub-step S3300, the injected liquid molding material is cured to obtain the back molding part. FIG. 39 shows a schematic bottom view of the composite substrate panel obtained after the back molding is completed in an embodiment of the present application. Referring to FIG. 39, after the molding is completed, the back molding part 9 is attached to the second surface and fills the gaps between the plurality of parallel strip-shaped heat dissipation ribs 6. After the sub-step S3300 is completed, the subsequent step S4000 can be executed.

Step S4000, cutting along the dividing line of the circuit board unit to obtain a single composite substrate. FIG. 40 shows a schematic diagram of cutting composite substrate panels in an embodiment of the present application. The dotted line in the figure represents the cutting line. The cutting can be mechanical knife cutting, laser cutting, or any other suitable cutting method. In this step, the circuit board jigsaw, the back molding part and the strip heat dissipation ribs can be cut together to separate the single composite substrate.

Further, FIG. 41A shows a three-dimensional schematic diagram of a single composite substrate manufactured based on the foregoing splicing board according to an embodiment of the present application. Fig. 41B shows an exploded schematic diagram of Fig. 41A. For clarity of illustration, Fig. 41A and Fig. 41B both face up, that is, the bottom surface of the composite substrate is placed up. 41A and 41B, in this embodiment, the composite substrate includes a circuit board 2 (in this embodiment, the circuit board 2 corresponds to the circuit board unit in the original panel), heat dissipation ribs 6 and back molding part 9 . The circuit board 2 has a first surface and a second surface 2h opposite to the first surface, and has a first side surface 2d and a second side surface 2e opposite to the first side surface 2d, wherein the first surface It has a chip attaching area for attaching photosensitive chips. The heat dissipation ribs 6 are arranged on the second surface 2h of the circuit board, at least a part of the heat dissipation ribs 6 is located in the area overlapping the chip attachment area, the heat dissipation ribs 6 are strip-shaped heat dissipation ribs, and the strips At least one end surface of the radiating rib extends to the first side surface 2d or the second side surface 2e. The back molding part 9 is made on the second surface 2h by a molding process, and the bottom surface of the back molding part 9 is flush with the bottom surface of the heat dissipation rib 6 and forms a flat surface together (note that Figure 41A And Figure 41B placed the bottom face up). Further, at least one end surface 6a of the strip-shaped heat dissipation rib is a cut surface, and the cut surface is exposed on the side surface of the back molding part. With reference to Figure 40, it can be understood that when a composite substrate unit is located at the edge area of the composite substrate panel, for example, the composite substrate unit is the first composite substrate unit or the last composite substrate unit in the same row, and the cut corresponding In the composite substrate, each strip-shaped heat dissipation rib may have only one end surface as a cutting surface. When a composite substrate unit is located in the middle area of the composite substrate panel, that is, the composite substrate unit is a composite substrate unit in the middle of the same row, then in the corresponding composite substrate that is cut out, two of each strip-shaped heat dissipation rib Both end surfaces 6a and 6b are cut surfaces (refer to Fig. 38B).

Still referring to FIGS. 41A and 41B, in an embodiment of the present application, the strip-shaped heat dissipation rib has two end surfaces, and the two end surfaces 6a, 6b extend to the first side surface 2d and the second side surface respectively. Side 2e. Both end surfaces 6a and 6b are cutting surfaces. The heat dissipation ribs 6 include a plurality of strip heat dissipation ribs, and the direction of the plurality of strip heat dissipation ribs is suitable for being between the plurality of strip heat dissipation ribs, and the strip heat dissipation ribs are used for the mold A flow channel for the molding flow is formed between the molds in the molding process. The strip radiating ribs are linear strip radiating ribs. A plurality of the linear strip-shaped heat dissipation ribs are arranged in parallel. The injection direction of the molding flow in the molding process is a first direction from the first side surface 6a to the second side surface 6b, or a second direction opposite to the first direction. The linear strip-shaped heat dissipation ribs may be parallel to the injection direction of the molding flow.

Further, still referring to FIGS. 41A and 41B, in an embodiment of the present application, the circuit board further has a third side surface 2f perpendicular to the first side surface 2d, and a third side surface 2f opposite to the third side surface 2f. The fourth side 2g. The axis of the linear strip-shaped heat dissipation rib may be parallel to the third side surface 2f or the fourth side surface 2g, or the axis of the linear strip-shaped heat dissipation rib may be parallel to the third side surface 2f or the third side surface 2g. The fourth side surface 2g has an included angle of 45 degrees or less. And, the edge area of the second surface 2h along the third side surface 2f and the fourth side surface 2g may have a press-fit side for molding process. It should be noted that the pressing edge is not shown in FIGS. 41A and 41B. The pressing edge is the exposed edge area of the second surface, and the edge area is not covered by the back molding part 7. The pressing edge is usually an area not covered by the molding part formed by the mold directly pressing on the second surface of the circuit board (that is, the surface that needs to be attached by the molding part) during the molding process.

Further, in an embodiment of the present application, the thermal conductivity of the material of the heat dissipation rib is 10-1000 watts/(m·degree). The material of the heat dissipation ribs can be metal, metal alloy or thermal conductive silicone grease.

Further, in an embodiment of the present application, there is also provided a method for manufacturing a photosensitive component, the method may include: manufacturing a composite substrate according to the foregoing steps S1000-S4000; and

Step S5000, attach the photosensitive chip to the corresponding chip attachment area, and electrically connect the photosensitive chip and the corresponding circuit board unit through a wire bonding process.

In step S6000, a molded lens holder is mounted on the first surface of the circuit board unit, and the lens holder surrounds the photosensitive chip.

In another embodiment of the present application, step S6000 can be replaced with step S6001.

In step S6001, a front molding part is formed on the first surface of the circuit board unit through a molding process, and the front molding part forms a light window around the photosensitive chip. FIG. 42 shows a schematic front view of a photosensitive component panel in an embodiment of the present application. In FIG. 42, the first surface of the circuit board jigsaw has completed the molding of the front molding part 9a. The front molding part 9a forms a light window 9b around the photosensitive chip. The front molding part 9a may be based on the MOC process or the MOB process. The MOC process and the MOB process can refer to the foregoing description, and will not be repeated here.

It should be noted that the aforementioned step S4000 can be performed before step S5000 and step S6000 (or step S6001), that is, a single composite substrate is first cut out, and then a photosensitive component is manufactured based on the single composite substrate. The aforementioned step S4000 can also be executed after step S5000 and step S6000 (or step S6001), that is, a photosensitive component panel is made based on the composite substrate panel first, and then a single photosensitive component is obtained by cutting. For the latter solution, in the step S4000, the circuit board jigsaw, the back molding part, the strip-shaped heat dissipation ribs and the front molding part can be cut together to separate the single photosensitive Components. This solution of manufacturing the photosensitive component panel based on the composite substrate panel and then cutting it can help improve the production efficiency of the photosensitive component.

Further, in an embodiment of the present application, there is also provided a photosensitive component made based on a mosaic, the photosensitive component including a composite substrate, a photosensitive chip and a metal wire. The composite substrate is any composite substrate fabricated based on splicing boards in the foregoing. The bottom surface of the photosensitive chip is attached to the chip attachment area of the composite substrate. The metal wire electrically connects the photosensitive chip and the circuit board through a wire bonding process. The photosensitive component may further include a front molding part, the front molding part being made on the first surface and surrounding the photosensitive chip to form a light window. The photosensitive component may further include an electronic component, the electronic component is mounted on the first surface, and the front molding part wraps the electronic component. The front molding part may contact the photosensitive chip and cover the edge area of the photosensitive chip, that is, it may be manufactured based on the MOC process. The front molding part may also have a gap with the photosensitive chip, that is, it may be manufactured based on the MOB process.

The above description is only a preferred embodiment of the application and an explanation of the applied technical principles. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover the technical solutions described above without departing from the inventive concept. Other technical solutions formed by any combination of its equivalent features. For example, the above-mentioned features and the technical features disclosed in this application (but not limited to) with similar functions are mutually replaced to form a technical solution.

Claims

A photosensitive component, characterized in that it comprises:

A composite body composed of a circuit board and a photosensitive chip, wherein the side facing the photosensitive surface of the photosensitive chip is the front surface of the composite body, and the side opposite to the front surface is the back surface of the composite body; and

The heat dissipation ribs are arranged on the back of the composite body, and at least a part of the heat dissipation ribs are located on the back of the photosensitive chip or located on the back of the circuit board in an area overlapping the photosensitive chip.
The photosensitive component according to claim 1, wherein the circuit board has a first surface for attaching a photosensitive chip and a second surface opposite to the first surface, wherein the first surface has a chip Attached area; the back of the photosensitive chip is attached to the first surface; the heat dissipation ribs are directly made on the second surface or attached to the second surface, wherein at least a part of the heat dissipation ribs is located The area of the second surface corresponding to the back of the chip attaching area.
The photosensitive component according to claim 2, wherein the photosensitive component further comprises a back encapsulation part, the back encapsulation part covers the second surface and fills the gap between the heat dissipation ribs, wherein the heat dissipation part The gap between the ribs is a gap between a plurality of the heat dissipation ribs or a gap between different parts of a single heat dissipation rib, and the back molding part is integrated with the heat dissipation rib.
3. The photosensitive component of claim 2, wherein the bottom surface of the heat dissipation rib is exposed outside the back encapsulation part; the bottom surface of the back encapsulation part is flush with the bottom surface of the heat dissipation rib.
The photosensitive component according to claim 3, wherein the back encapsulation part is a back molding part made on the second surface by a molding process, and the back molding part covers the second surface and The distance between the bottom surface of the heat dissipation rib and the bottom surface of the back molding part and the bottom surface of the heat dissipation rib is not more than 0.1 mm.
The photosensitive component according to claim 2, wherein the heat dissipation ribs are a plurality of linear strip heat dissipation ribs arranged in parallel; or a plurality of heat dissipation ribs arranged in a scattered point array; or a single strip heat dissipation Ribs, and the single strip-shaped heat-dissipating ribs are spiral or "m"-shaped, or other strip-shaped shapes that can be connected as a whole but still have gaps between different parts; or the heat-dissipating ribs are two or two of the above Any combination of the above items.
The photosensitive component of claim 1, wherein the heat dissipation ribs are metal heat dissipation ribs or heat dissipation ribs formed by hardening a thermally conductive colloidal substance.
The photosensitive component of claim 2, wherein the photosensitive component further comprises a secondary heat dissipation portion, the top surface of the secondary heat dissipation portion is connected to the bottom surface of the heat dissipation rib, and the bottom surface of the back encapsulation portion is connected to The bottom surface of the secondary heat dissipation portion is flush, the bottom surface of the secondary heat dissipation portion is exposed outside the back encapsulation portion, and the area of the bottom surface of the secondary heat dissipation portion is larger than the area of the bottom surface of the heat dissipation rib.
4. The photosensitive component of claim 2, wherein the heat dissipation rib is attached to the second surface by bonding or welding.
The photosensitive component of claim 1, wherein the photosensitive component further comprises a metal wire, the metal wire electrically connects the photosensitive chip and the circuit board through a wire bonding process, and the circuit board is a PCB circuit board.
The photosensitive component of claim 2, wherein the photosensitive component further comprises electronic components mounted on the circuit board, wherein at least a part of the electronic components are mounted on the second surface and encapsulated by the back surface Department covered.
The photosensitive component of claim 2, wherein the photosensitive component further comprises a front molding part, the front molding part is made on the first surface by a molding process and surrounds the photosensitive chip And the top surface of the front molding part is suitable for mounting lens components; wherein there is a gap between the front molding part and the photosensitive chip, or the front molding part extends toward and contacts the photosensitive chip The photosensitive chip.
The photosensitive assembly of claim 2, wherein the photosensitive assembly further comprises a lens holder, the lens holder is mounted on the first surface and surrounds the photosensitive chip, and the lens holder is The top surface is suitable for mounting lens components; wherein the lens holder is formed and then mounted on the first surface.
11. The photosensitive component of claim 12, wherein the photosensitive component further comprises a lens holder, the lens holder is mounted on the front molding part, and the top surface of the lens holder is suitable for mounting a lens component; Wherein, the lens holder is formed and then mounted on the front molding part.
The photosensitive assembly according to claim 1, wherein the circuit board has a main through hole, the photosensitive chip is located in the main through hole, and the back of the assembly includes the circuit board and the On the back of the photosensitive chip, at least a part of the heat dissipation ribs is located on the back of the photosensitive chip.
The photosensitive component of claim 1, wherein the thickness of the heat dissipation ribs is 0.05 mm-0.4 mm.
A camera module, characterized by comprising:

The photosensitive component of any one of claims 1-16; and

The lens assembly is mounted on the photosensitive assembly.
A method for manufacturing a photosensitive component, characterized in that it comprises:

1) Prepare a circuit board, the circuit board has a first surface for attaching a photosensitive chip and a second surface opposite to the first surface, wherein the first surface has a chip attaching area;

2) Fabricating or attaching heat dissipation ribs on the second surface;

3) Cover the back encapsulation part on the second surface, wherein the back encapsulation part covers the second surface and fills the gap between the heat dissipation ribs, wherein the gap between the heat dissipation ribs is a plurality of The gap between the heat dissipation ribs or the gap between different parts of a single heat dissipation rib; the bottom surface of the heat dissipation rib is exposed outside the back encapsulation portion and the bottom surface of the back encapsulation portion is flat with the bottom surface of the heat dissipation rib Qi; and

4) Mounting a photosensitive chip on the first surface to fabricate the photosensitive component.
18. The method for manufacturing a photosensitive component according to claim 18, wherein in the step 2), the heat dissipation ribs are attached by welding or bonding.
The method for manufacturing a photosensitive component according to claim 18, wherein in step 1), the circuit board has a seed layer, and in step 2), a metal layer is planted on the seed layer to make the The metal layer grows and extends beyond the second surface to form the heat dissipation ribs.
The method for manufacturing a photosensitive component according to claim 18, wherein in the step 2), a thermally conductive colloidal substance is coated on the second surface, and then the thermally conductive colloidal substance is hardened to form the Cooling ribs.
18. The method for manufacturing a photosensitive component of claim 18, wherein in the step 2), in the step 3), the back encapsulation portion is formed on the second surface by a molding process.
22. The method of manufacturing a photosensitive element according to claim 22, wherein said step 2) is performed first and then said step 3) is performed.
18. The method of manufacturing a photosensitive component according to claim 18, wherein said step 3) is executed first and then said step 2) is executed;

Wherein in step 3), the back encapsulation portion is formed on the second surface by a molding process, and in the molding process, a through hole is reserved in the back encapsulation portion by an indenter, and the through hole makes the A part of the second surface is exposed outside the back encapsulation part; then, in the step 2), the heat dissipation rib is formed in the through hole of the encapsulation part.
The method of manufacturing a photosensitive component according to claim 18, wherein the method of manufacturing the photosensitive component further comprises a step performed after the step 3):

3a) A second-level package part is fabricated on the bottom surface of the back-side package part by a molding process, the second-level package part has a second-level through hole, and the second-level through hole exposes the bottom surface of the heat dissipation rib and the heat sink The adjacent area of the bottom surface of the back surface encapsulation part around the rib; and

3b) Making a heat dissipation extension in the secondary through hole, the top surface of the heat dissipation extension is connected to the bottom surface of the heat dissipation rib, and the bottom surface of the heat dissipation extension is flush with the bottom surface of the secondary encapsulation portion; Wherein, the heat-dissipating extension part is manufactured by planting a metal layer or pouring and hardening a thermally conductive colloidal substance, or by bonding or welding a formed member.
The method of manufacturing a photosensitive component according to claim 18, wherein said step 4) further comprises: mounting at least a part of electronic components on said second surface; and performing said step 4) before performing said step 3. ); And in the step 3), the back encapsulation layer covers the at least a part of the electronic components mounted on the second surface.
The method for manufacturing a photosensitive component according to claim 18, wherein the step 4) further comprises: forming a front molding part on the first surface, and the front molding part is manufactured on the first surface by a molding process. The first surface surrounds the photosensitive chip, and the top surface of the front molding part is suitable for mounting a lens assembly.
The method for manufacturing a photosensitive component according to claim 27, wherein in the step 3), the back encapsulation part is a back molding part, and the front molding part and the back molding part pass through the same mold The plastic process is simultaneously formed on the circuit board.
The method for manufacturing a photosensitive component according to claim 18, wherein in the step 1), the circuit board is a circuit board jigsaw in which multiple single circuit boards are connected as a whole; in the step 2), The heat dissipation ribs corresponding to the plurality of single circuit boards are fabricated on the circuit board; in the step 3), the backside package corresponding to the plurality of single circuit boards is fabricated by one molding Section; in step 4), a photosensitive chip is respectively mounted on the first surface corresponding to the plurality of single circuit boards to obtain a photosensitive assembly panel; and

The method for manufacturing the photosensitive component further includes the steps:

5) Cutting the photosensitive component panel to obtain a separated single photosensitive component.
An electronic device, characterized by comprising the camera module of claim 17.
A composite substrate used in a camera module, characterized in that the composite substrate includes:

A circuit board having a first surface and a second surface opposite to the first surface, wherein the first surface has a chip attaching area for attaching a photosensitive chip;

A heat dissipation rib is arranged on the second surface of the circuit board, and at least a part of the heat dissipation rib is located in an area overlapping with the chip attachment area; and

The back molding part is made on the second surface through a molding process, and the back molding part, the heat dissipation ribs and the circuit board are integrated into one body.
The composite substrate according to claim 31, wherein the thickness of the heat dissipation rib is not more than 0.1 mm.
The composite substrate according to claim 32, wherein the thickness of the back molding part is not more than 0.2 mm.
A composite substrate used in a camera module is characterized in that it comprises:

A circuit board having a first surface and a second surface opposite to the first surface, and a first side surface and a second side surface opposite to the first side surface, wherein the first surface has a surface for attaching The chip attaching area of the photosensitive chip;

A heat dissipation rib is arranged on the second surface of the circuit board, at least a part of the heat dissipation rib is located in an area overlapping with the chip attachment area, the heat dissipation rib is a strip heat dissipation rib, and the strip heat dissipation At least one end surface of the rib extends to the first side surface or the second side surface; and

The back molding part is made on the second surface through a molding process, and the back molding part is integrated with the heat dissipation ribs.
The composite substrate according to claim 34, wherein at least one end surface of the strip-shaped heat dissipation rib is a cut surface.
The composite substrate according to claim 34, wherein the strip-shaped heat dissipation rib has two end surfaces, and the two end surfaces respectively extend to the first side surface and the second side surface.
The composite substrate according to claim 36, wherein the two end surfaces are both cut surfaces.
The composite substrate according to claim 34, wherein the heat dissipation ribs comprise a plurality of strip heat dissipation ribs, and the direction of the plurality of strip heat dissipation ribs is suitable to be between the plurality of strip heat dissipation ribs, And a flow channel for molding flow is formed between the strip-shaped heat dissipation ribs and the mold used for the molding process.
The composite substrate of claim 38, wherein the strip-shaped heat dissipation ribs are linear strip-shaped heat dissipation ribs.
The composite substrate according to claim 39, wherein a plurality of the linear strip-shaped heat dissipation ribs are arranged in parallel.
The composite substrate of claim 38, wherein the injection direction of the molding flow in the molding process is a first direction from the first side surface to the second side surface, or is the same as the first direction One direction is opposite to the second direction.
The composite substrate according to claim 41, wherein the strip-shaped heat dissipation ribs are parallel to the injection direction of the molding flow.
The composite substrate according to claim 39, wherein the circuit board further has a third side surface perpendicular to the first side surface, and a fourth side surface opposite to the third side surface; wherein the linear type The axis of the strip-shaped radiating rib is parallel to the third side surface or the fourth side surface, or the axis of the linear strip-shaped radiating rib and the third side surface or the fourth side surface form an angle of less than 45 degrees ; And the edge area of the second surface along the third side and the fourth side has a press-fit side for a molding process.
The composite substrate according to claim 34, wherein the thermal conductivity of the material of the heat dissipation rib is 10-1000 watts/(m·degree), and the material of the heat dissipation rib is metal, metal alloy or thermal conductivity Silicone grease.
A method for manufacturing a composite substrate, which is characterized by comprising:

1) Prepare a circuit board jigsaw. The circuit board jigsaw includes a plurality of circuit board units connected together. The circuit board jigsaw has a first surface and a second surface opposite to the first surface, wherein The first surface has a plurality of chip attachment areas for attaching photosensitive chips, and each circuit board unit has one chip attachment area, and the circuit board units are distributed in an array;

2) At least one strip-shaped radiating rib is provided on the second surface, each of the strip-shaped radiating ribs extends to each of the circuit board units in the same row, and at least a part of the strip-shaped radiating ribs pass through all The overlapping area on the back of the chip attaching area;

3) A back molding part is formed on the second surface through a molding process, and the bottom surface of the back molding part is flush with the bottom surface of the strip-shaped heat dissipation ribs and together constitute a flat surface; and

4) Cutting along the dividing line of the circuit board unit to obtain a single composite substrate.
The method for manufacturing a composite substrate according to claim 45, wherein, in the step 2), the direction of the strip-shaped heat dissipation ribs is suitable for being between a plurality of the strip-shaped heat dissipation ribs, and/or A molding flow channel is formed between the strip-shaped heat dissipation ribs and the mold used in the molding process.
The method for manufacturing a composite substrate according to claim 46, wherein in step 1), the circuit board jigsaw has a seed layer; in step 2), by adding a seed layer on the basis of the seed layer The strip-shaped heat dissipation ribs are arranged by growing a metal layer.
The method for manufacturing a composite substrate according to claim 46, wherein in the step 2), the strip-shaped heat dissipation ribs are arranged by attaching a pre-formed heat dissipation rib to the second surface.
The method for manufacturing a composite substrate according to claim 46, wherein in the step 2), the strip-shaped heat dissipation ribs are arranged by coating and curing the second surface with thermally conductive silicone grease.
The method for manufacturing a composite substrate according to claim 46, wherein said step 3) comprises the following sub-steps:

31) The upper mold and the lower mold are closed, wherein the upper mold is pressed against the second surface, the lower mold is pressed against the first surface, and the inner surface of the upper mold presses the Strip-shaped heat dissipation ribs, thereby forming a molding cavity between the second surface, the strip-shaped heat dissipation ribs, and the upper mold;

32) Injecting a liquid molding flow into the molding cavity, the injection direction of the molding flow is consistent with the arrangement direction of a row of the circuit board units; and

33) Curing the injected liquid molding material to obtain the back molding part.
The method of manufacturing a composite substrate according to claim 50, wherein in the step 31), the upper mold is pressed onto the edge area of the second surface of the circuit board jigsaw.
The method of manufacturing a composite substrate according to claim 50, wherein in the step 1), between the circuit board units and between the circuit board units and the frame of the circuit board jigsaw Insulation zone separation;

In the step 4), the circuit board jigsaw, the back molding part and the strip-shaped heat dissipation ribs are cut together to separate the single composite substrate.