WO2021017752A1 - Module de caméra, dispositif électronique, substrat composite, ensemble photosensible et procédé de production associé - Google Patents

Module de caméra, dispositif électronique, substrat composite, ensemble photosensible et procédé de production associé Download PDF

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Publication number
WO2021017752A1
WO2021017752A1 PCT/CN2020/100163 CN2020100163W WO2021017752A1 WO 2021017752 A1 WO2021017752 A1 WO 2021017752A1 CN 2020100163 W CN2020100163 W CN 2020100163W WO 2021017752 A1 WO2021017752 A1 WO 2021017752A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
circuit board
photosensitive
ribs
molding
Prior art date
Application number
PCT/CN2020/100163
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English (en)
Chinese (zh)
Inventor
王明珠
栾仲禹
黄桢
李婷花
干洪锋
刘丽
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201921213523.9U external-priority patent/CN210016540U/zh
Priority claimed from CN201921213522.4U external-priority patent/CN210016539U/zh
Priority claimed from CN201910695388.4A external-priority patent/CN112333350A/zh
Priority claimed from CN201910696414.5A external-priority patent/CN112399030A/zh
Priority claimed from CN201910695386.5A external-priority patent/CN112399029A/zh
Priority claimed from CN201921214519.4U external-priority patent/CN210016541U/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Publication of WO2021017752A1 publication Critical patent/WO2021017752A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

Definitions

  • the present invention relates to the technical field of camera modules. Specifically, the present invention relates to a camera module, a photosensitive component for the camera module, a composite substrate and a manufacturing method thereof, and corresponding electronic equipment.
  • a big problem in the field of camera modules especially based on the technological development trends of the mobile phone industry such as high pixels, large apertures, and large chips;
  • second the compact development of mobile phones and the increase in the proportion of mobile phones
  • the internal space that can be used for the front camera module is getting smaller and smaller; the number of rear camera modules is increasing, and the area occupied is also getting larger, resulting in the corresponding reduction of other mobile phone configurations such as battery size and motherboard size.
  • the market hopes that the size of the rear camera module can be reduced, that is, to achieve a small size package;
  • the chip when the chip is attached, because the suction nozzle sucks the chip from the upper part, the chip will also image the curved shape of the periphery lower than the center.
  • the coefficient of thermal expansion (CTE) index of the product is different between the chip, the glue, and the circuit board.
  • the CTE of the chip is 6ppm/C
  • the PCB is 14ppm/C.
  • the module assembly process generally has a baking process, based on various Different material CTE coefficients can cause chip bending problems.
  • the rigid-flex board conventionally used in the industry has serious warpage and aggravates the chip bending problem.
  • the above-mentioned chip bending problem will cause the chip field curvature problem in the final module imaging, and ultimately affect the imaging quality.
  • the inventor of this case discovered that as the heat generated when the photosensitive chip is working becomes larger and larger, this heat accumulation causes the photosensitive chip to deform, which is one of the important factors leading to the deterioration of image quality. Specifically, in the working state, as the internal temperature of the camera module increases, the circuit board and the photosensitive chip will bend, thereby reducing the image quality. In other words, for high-pixel, high-frame-rate photosensitive chips, even if they are not packaged by molding, they will be affected by temperature and bend. That is to say, neither molded or non-molded packaging can solve the bending problem of high pixels and large chips.
  • the camera module may include a photosensitive component and a lens component, and the lens group of the lens component and other optical components are arranged on the photosensitive path of the photosensitive component (usually a photosensitive chip) of the photosensitive component.
  • the color filter can be directly mounted on the photosensitive component to form part of the photosensitive component, but in other solutions, the photosensitive component may not contain the color filter, but the color filter is made into an independent The color filter assembly or other forms are installed on the light transmission path.
  • the lens assembly can also be understood as a combination of light-transmitting elements such as lens groups and color filters and their supporting structures. This combination can sometimes be referred to as a light-transmitting component, canceling or lowering the position of the color filter. , Can further reduce the height dimension of the module.
  • the photosensitive component may include a circuit board and a molded body integrally molded on the circuit board. Because the molded body eliminates the advantage of the avoidance space of the traditional lens mount attached module, the module can be further realized in terms of length, width, and height. Advantages in size. In addition, the molded body can reinforce the strength of the circuit board, can reduce the thickness of the circuit board, and ensure the flatness of the module, so the circuit board can be thinned. For example, in the MOC packaging process, the photosensitive element is pre-attached to the circuit board, and then a molded body is formed on the circuit board through a molding process. The molded body can wrap part of the non-sensitive area of the photosensitive element.
  • the combination of the circuit board and the molded body and the combination of the molded body and the photosensitive chip are all rigid combinations.
  • the combination is very strong and often requires destructive methods to be removed.
  • the circuit board and the photosensitive chip are combined by glue, which is a relatively flexible combination.
  • the coefficient of thermal expansion (CTE) of the circuit board, the molded body, and the photosensitive chip are different.
  • FIG. 24 shows a schematic diagram of the principle of deformation of the photosensitive chip due to bending of the circuit board and the molded body. It should be noted that, for ease of understanding, the figure shown in Figure 24 is exaggerated.
  • the amount of bending may only be more than ten to twenty microns, but this degree of bending is sufficient to negatively affect the image quality.
  • this kind of bending may cause the field curvature of the camera module to be too large.
  • the image obtained by the camera module appears to have a normal center effect but poor surrounding effects.
  • the corresponding optical performance improvement is also an inevitable trend.
  • the optical parameters of lenses such as large aperture and wide angle will gradually increase to maximize the resolution performance of the photosensitive chip.
  • large aperture and wide-angle modules place higher requirements on the flatness of the module.
  • the purpose of the present invention is to overcome the shortcomings of the prior art and provide a solution for the photosensitive component and the camera module.
  • the present invention provides a photosensitive assembly, which includes a circuit board and a photosensitive chip assembly, wherein the photosensitive surface of the photosensitive chip faces the front side of the assembly, and The side opposite to the front is the back of the assembly; and the heat dissipation ribs are arranged on the back of the assembly, and at least a part of the heat dissipation ribs are located on the back of the photosensitive chip or on the back of the circuit board.
  • the area overlapping with the photosensitive chip is
  • the circuit board has a first surface for attaching a photosensitive chip and a second surface opposite to the first surface, wherein the first surface has a chip attaching area; the back of the photosensitive chip is attached On the first surface; the heat dissipation ribs are directly fabricated on the second surface or attached to the second surface, wherein at least a part of the heat dissipation ribs is located on the second surface corresponding to the chip mount The area behind the attached area.
  • the photosensitive component further includes a back encapsulation part, the back encapsulation part covers the second surface and fills the gap between the heat dissipation ribs, wherein the gap between the heat dissipation ribs is a plurality of the heat dissipation ribs Or the gap between different parts of a single heat dissipation rib, and the back molding part is integrated with the heat dissipation rib.
  • the bottom surface of the heat dissipation rib is exposed outside the back encapsulation portion; the bottom surface of the back encapsulation portion is flush with the bottom surface of the heat dissipation rib.
  • the back encapsulation part is a back molding part made on the second surface by a molding process, the back molding part covers the second surface and the bottom surface of the heat dissipation rib, and the back molding
  • the distance between the bottom surface of the portion and the bottom surface of the heat dissipation rib is not more than 0.1 mm.
  • the heat dissipation rib is a plurality of linear strip heat dissipation ribs arranged in parallel; or a plurality of heat dissipation ribs arranged in a scattered point array; or a single strip heat dissipation rib, and the single strip heat dissipation rib is in a spiral shape Or "m" shape, or other strip shapes that can be connected together but still have gaps between different parts; or the heat dissipation ribs are any combination of two or more of the above.
  • the heat dissipation ribs are metal heat dissipation ribs or heat dissipation ribs formed by hardening a thermally conductive colloidal substance.
  • the photosensitive component further includes a secondary heat dissipation portion, the top surface of the secondary heat dissipation portion is connected to the bottom surface of the heat dissipation rib, the bottom surface of the back encapsulation portion is flush with the bottom surface of the secondary heat dissipation portion, so The bottom surface of the secondary heat dissipation portion is exposed outside the back encapsulation portion, and the area of the bottom surface of the secondary heat dissipation portion is larger than the area of the bottom surface of the heat dissipation rib.
  • the heat dissipation ribs are attached to the second surface by bonding or welding.
  • the photosensitive component further includes a metal wire that electrically connects the photosensitive chip and the circuit board through a wire bonding process, and the circuit board is a PCB circuit board.
  • the photosensitive component further includes electronic components mounted on the circuit board, wherein at least a part of the electronic components are mounted on the second surface and covered by the back encapsulation part.
  • the photosensitive component further includes a front molding part, the front molding part is made on the first surface through a molding process and surrounding the photosensitive chip, and the top surface of the front molding part Suitable for mounting a lens assembly; wherein there is a space between the front molding part and the photosensitive chip, or the front molding part extends toward the photosensitive chip and contacts the photosensitive chip.
  • the photosensitive component further includes a lens holder, the lens holder is mounted on the first surface and surrounding the photosensitive chip, and the top surface of the lens holder is suitable for mounting a lens component; wherein the lens After the bracket is formed, it is installed on the first surface.
  • the photosensitive component further includes a lens holder, the lens holder is installed on the front molding part, and the top surface of the lens holder is suitable for installing a lens component; wherein the lens holder is molded and then installed on the Front molding department.
  • the circuit board has a main through hole
  • the photosensitive chip is located in the main through hole
  • the back of the assembly includes the back of the circuit board and the photosensitive chip, and at least a part of the heat dissipation rib Located on the back of the photosensitive chip.
  • the thickness of the heat dissipation rib is 0.05mm-0.4mm.
  • a camera module which includes: any one of the aforementioned photosensitive components; and a lens assembly installed on the photosensitive component.
  • a method for manufacturing a photosensitive component which includes: 1) preparing a circuit board, the circuit board has a first surface for attaching a photosensitive chip and a surface opposite to the first surface.
  • the second surface of the second surface wherein the first surface has a chip attaching area; 2) the second surface is fabricated or attached to the heat dissipation rib; 3) the second surface is covered with a back surface package portion, wherein the back surface package The portion covers the second surface and fills the gaps between the heat dissipation ribs, wherein the gaps between the heat dissipation ribs are the gaps between multiple heat dissipation ribs or between different parts of a single heat dissipation rib Gap; the bottom surface of the heat dissipation rib is exposed outside the back encapsulation portion and the bottom surface of the back encapsulation portion is flush with the bottom surface of the heat dissipation rib; and 4) a photosensitive chip is
  • the heat dissipation ribs are attached by welding or bonding.
  • step 1) the circuit board has a seed layer
  • step 2) a metal layer is planted on the seed layer so that the metal layer grows beyond the second surface, thereby forming the ⁇ heating ribs.
  • a thermally conductive colloidal substance is coated on the second surface, and then the thermally conductive colloidal substance is hardened to form the heat dissipation ribs.
  • the back encapsulation portion is formed on the second surface through a molding process.
  • step 2) is executed first, and then the step 3) is executed.
  • the step 3) is performed first, and then the step 2) is performed; wherein in the step 3), the back encapsulation portion is formed on the second surface by a molding process, and in the molding process, the pressure
  • the head leaves a through hole in the back encapsulation part, and the through hole makes a part of the second surface exposed outside the back encapsulation part; then, in the step 2), in the through hole of the encapsulation part
  • the heat dissipation ribs are made in the holes.
  • the photosensitive component manufacturing method further includes the steps performed after the step 3): 3a) A second-level package part is manufactured on the bottom surface of the back-side package part by a molding process, the second-level package part has a second-level package A through hole, the secondary through hole exposing the contiguous area between the bottom surface of the heat dissipating rib and the bottom surface of the back encapsulation part around the heat dissipating rib; and 3b) making a heat dissipation extension in the secondary through hole , The top surface of the heat dissipation extension portion is connected to the bottom surface of the heat dissipation rib, and the bottom surface of the heat dissipation extension portion is flush with the bottom surface of the secondary package portion; It is made by heat-conducting colloidal substances and hardening them, or by bonding or welding already formed components.
  • the step 4) further includes: mounting at least a part of the electronic components on the second surface; and first performing the step 4) and then performing the step 3); and in the step 3), the back The packaging layer covers the at least a part of the electronic components mounted on the second surface.
  • the step 4) further includes: fabricating a front molding part on the first surface, the front molding part is manufactured on the first surface through a molding process and surrounding the photosensitive chip, and The top surface of the front molding part is suitable for mounting a lens assembly.
  • the back encapsulation part is a back molding part, and the front molding part and the back molding part are simultaneously molded on the circuit board through the same molding process.
  • the circuit board is a circuit board jigsaw in which a plurality of single circuit boards are connected as a whole; in the step 2), the production on the circuit board jigsaw corresponds to the multiple Heat dissipation ribs of a single circuit board; in the step 3), the back encapsulation portion corresponding to the plurality of single circuit boards is manufactured by one-time molding; in the step 4), in the step corresponding to the The photosensitive chips are respectively mounted on the first surfaces of the multiple monolithic circuit boards to obtain a photosensitive assembly panel; and the photosensitive assembly manufacturing method further includes the step of: 5) cutting the photosensitive assembly panel to obtain a separated monolithic photosensitive assembly .
  • an electronic device which includes any one of the aforementioned camera modules.
  • a composite substrate for use in a camera module which includes: a circuit board having a first surface and a second surface opposite to the first surface, and a first surface A side surface and a second side surface opposite to the first side surface, wherein the first surface has a chip attaching area for attaching a photosensitive chip; a heat dissipation rib is provided on the second surface of the circuit board, so At least a part of the heat dissipation rib is located in an area overlapping with the chip attachment area, the heat dissipation rib is a strip heat dissipation rib, and at least one end surface of the strip heat dissipation rib extends to the first side surface or the first side surface.
  • At least one end surface of the strip-shaped heat dissipation rib is a cut surface.
  • the strip-shaped heat dissipation rib has two end surfaces, and the two end surfaces respectively extend to the first side surface and the second side surface.
  • the two end surfaces are both cutting surfaces.
  • the heat dissipation ribs include a plurality of strip heat dissipation ribs, and the direction of the plurality of strip heat dissipation ribs is suitable for being between the plurality of strip heat dissipation ribs, and that the strip heat dissipation ribs are used for the A flow channel for the molding flow is formed between the molds in the molding process.
  • strip-shaped heat dissipation ribs are linear strip-shaped heat dissipation ribs.
  • the injection direction of the molding flow in the molding process is a first direction from the first side surface to the second side surface, or a second direction opposite to the first direction.
  • linear strip-shaped heat dissipation ribs are parallel to the injection direction of the molding flow.
  • the circuit board further has a third side surface perpendicular to the first side surface, and a fourth side surface opposite to the third side surface; wherein the axis of the linear strip heat dissipation rib is parallel to the third side surface.
  • the side surface or the fourth side surface, or the axis of the linear strip-shaped radiating ribs and the third side surface or the fourth side surface form an angle of less than 45 degrees; and the second surface along the The edge regions of the third side and the fourth side have press-fit edges for the molding process.
  • the thermal conductivity of the material of the heat dissipation rib is 10-1000 W/(m ⁇ degree), and the material of the heat dissipation rib is metal, metal alloy or thermal conductive silicone grease.
  • the thickness of the back molding part is not more than 0.2 mm, and the thickness of the heat dissipation rib is not more than 0.1 mm.
  • a photosensitive component which includes: any of the foregoing composite substrates; a photosensitive chip, the bottom surface of which is attached to the chip attachment area; and a metal wire, which is bonded by a wire bonding process
  • the photosensitive chip is electrically connected to the circuit board.
  • the photosensitive assembly further includes a lens holder, which is attached to the first surface and surrounds the photosensitive chip to form a light window.
  • the photosensitive component further includes an electronic component, the electronic component is mounted on the first surface, and the front molding part wraps the electronic component.
  • the photosensitive component further includes a front molding part, the front molding part is made on the first surface and surrounding the photosensitive chip to form a light window, and the front molding part contacts the photosensitive chip And cover the edge area of the photosensitive chip.
  • the photosensitive component further includes a front molding part, the front molding part is made on the first surface and surrounding the photosensitive chip to form a light window, the front molding part and the photosensitive chip There is a gap between.
  • a camera module which includes: any one of the aforementioned photosensitive components; and a lens assembly, the lens assembly being mounted on the top of the photosensitive component.
  • a method for manufacturing a composite substrate which includes: 1) preparing a circuit board jigsaw, the circuit board jigsaw includes a plurality of circuit board units connected together, and the circuit The board jigsaw has a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of chip attachment areas for attaching photosensitive chips, and each of the circuit board units has There is one chip attachment area, and the circuit board units are distributed in an array; 2) at least one strip-shaped heat dissipation rib is arranged on the second surface, and each of the strip-shaped heat dissipation ribs extends to each of the same row At least one of the circuit board units, and at least a part of the strip-shaped heat dissipation ribs pass through the overlapping area on the back of the chip attaching area; 3) a back molding part is formed on the second surface through a molding process, and The bottom surface of the back molding part is flush
  • the direction of the strip-shaped heat dissipation ribs is suitable to be between the plurality of the strip-shaped heat dissipation ribs, and/or the strip-shaped heat dissipation ribs and the molding process Runners for molding flow are formed between the molds.
  • step 1) the circuit board jigsaw has a seed layer; in step 2), the strip-shaped heat dissipation ribs are arranged by growing a metal layer on the basis of the seed layer.
  • the strip-shaped heat dissipation ribs are arranged by attaching pre-formed heat dissipation ribs to the second surface.
  • the strip-shaped heat dissipation ribs are provided by coating and curing thermally conductive silicone grease on the second surface.
  • the step 3) includes the following sub-steps: 31) closing the upper mold and the lower mold, wherein the upper mold is pressed to the second surface, and the lower mold is pressed to the first surface, And the inner surface of the upper mold presses the strip-shaped heat dissipation ribs, thereby forming a molding cavity between the second surface, the strip-shaped heat dissipation ribs, and the upper mold; 32) liquid molding flow Injecting into the molding cavity, the injection direction of the molding flow is consistent with the arrangement direction of a row of the circuit board units; and 33) curing the injected liquid molding material to obtain the back molding part.
  • the upper mold is pressed onto the edge area of the second surface of the circuit board jigsaw.
  • step 1) between the circuit board units and between the circuit board units and the frame of the circuit board jigsaw are separated by insulating regions; in the step 4), The circuit board jigsaw, the back molding part and the strip-shaped heat dissipation ribs are cut together to separate the single composite substrate.
  • a photosensitive component manufacturing method which includes: any of the foregoing composite substrate manufacturing methods to manufacture a composite substrate; the photosensitive component manufacturing method further includes: 5) attaching a photosensitive chip to The corresponding chip attaching area is electrically connected to the photosensitive chip and the corresponding circuit board unit through a wire bonding process.
  • the method for manufacturing the photosensitive component further includes: 6) mounting a molded lens holder on the first surface of the circuit board unit, the lens holder surrounding the photosensitive chip.
  • the manufacturing method of the photosensitive component further includes: 6) forming a front molding part on the first surface of the circuit board unit through a molding process, and the front molding part forms a light window around the photosensitive chip .
  • the step 4) is performed after the step 6), and in the step 4), the circuit board jigsaw, the back molding part, the strip heat dissipation ribs and the front molding The parts are cut together to separate the single photosensitive components.
  • a composite substrate for use in a camera module comprising: a circuit board having a first surface and a second surface opposite to the first surface, Wherein the first surface has a chip attaching area for attaching the photosensitive chip; a heat dissipation rib is arranged on the second surface of the circuit board, and at least a part of the heat dissipation rib is located overlapping the chip attaching area And the back molding part, which is made on the second surface through a molding process, and the back molding part, the heat dissipation ribs and the circuit board are integrated into one body.
  • the thickness of the heat dissipation rib is not more than 0.1 mm.
  • the thickness of the back molding part is not more than 0.2 mm.
  • the heat dissipation ribs are directly fabricated on the second surface or attached to the second surface, and the back molding part covers the second surface and fills the gaps between the heat dissipation ribs, wherein the The gap between the heat dissipation ribs is a gap between a plurality of the heat dissipation ribs or a gap between different parts of a single heat dissipation rib.
  • the heat dissipation rib is a plurality of linear strip heat dissipation ribs arranged in parallel; or a plurality of heat dissipation ribs arranged in a scattered point array; or a single strip heat dissipation rib, and the single strip heat dissipation rib is in a spiral shape Or "m" shape, or other strip shapes that can be connected together but still have gaps between different parts; or the heat dissipation ribs are any combination of two or more of the above.
  • the heat dissipation ribs are metal heat dissipation ribs or heat dissipation ribs formed by hardening a thermally conductive colloidal substance.
  • the photosensitive component further includes a secondary heat dissipation portion, the top surface of the secondary heat dissipation portion is connected to the bottom surface of the heat dissipation rib, and the bottom surface of the back molding portion is flush with the bottom surface of the secondary heat dissipation portion, The bottom surface of the secondary heat dissipation portion is exposed outside the back molding portion, and the area of the bottom surface of the secondary heat dissipation portion is larger than the area of the bottom surface of the heat dissipation rib.
  • the back molding part covers the bottom surface of the heat dissipation rib.
  • the heat dissipation ribs are attached to the second surface by bonding or welding.
  • the roots of the heat dissipation ribs extend to the inside of the circuit board.
  • the circuit board is a multilayer board, and the multilayer board includes a plurality of conductive layers and a plurality of insulating layers arranged at intervals, and the conductive layer and the insulating layer are combined together by a lamination process.
  • a photosensitive component which includes: any of the foregoing composite substrates; a photosensitive chip, the bottom surface of which is attached to the chip attachment area of the composite substrate; and a metal wire, which The photosensitive chip and the circuit board are electrically connected through a wire bonding process.
  • the photosensitive component further includes a front molding part, the front molding part is made on the first surface through a molding process and surrounding the photosensitive chip, and the top surface of the front molding part Suitable for mounting a lens assembly; wherein there is a space between the front molding part and the photosensitive chip, or the front molding part extends toward the photosensitive chip and contacts the photosensitive chip.
  • the photosensitive component further includes a lens holder, the lens holder is mounted on the first surface and surrounding the photosensitive chip, and the top surface of the lens holder is suitable for mounting a lens component; wherein the lens After the bracket is formed, it is installed on the first surface.
  • the photosensitive component further includes a lens holder, the lens holder is installed on the front molding part, and the top surface of the lens holder is suitable for installing a lens component; wherein the lens holder is molded and then installed on the Front molding department.
  • a camera module which includes: any one of the aforementioned photosensitive components; and a lens component, the lens component being mounted on the photosensitive component.
  • a method for manufacturing a composite substrate which includes: 1) preparing a circuit board, the circuit board having a first surface and a second surface opposite to the first surface, wherein The first surface has a chip attaching area for attaching photosensitive chips, and the thickness of the circuit board is not greater than 0.3 mm; 2) a heat dissipation rib is provided on the second surface, and at least a part of the heat dissipation rib is located at The area where the chip attaching area overlaps; and 3) forming a back molding part on the second surface by a molding process, the back molding part covering the second surface and filling the gap between the heat dissipation ribs , So that the back molding part, the heat dissipation ribs, and the circuit board are combined into one body, wherein the gap between the heat dissipation ribs is the gap between a plurality of the heat dissipation ribs or a single heat dissipation
  • the heat dissipation ribs are attached by welding or bonding, and the thickness of the heat dissipation ribs is not greater than 0.1 mm.
  • step 1) the circuit board has a seed layer
  • step 2) a metal layer is planted on the seed layer so that the metal layer grows beyond the second surface, thereby forming the The heat dissipation ribs; the thickness of the metal layer beyond the second surface is not more than 0.1 mm.
  • a thermally conductive colloidal substance is coated on the second surface, and then the thermally conductive colloidal substance is hardened to form the heat dissipation rib, and the thickness of the heat dissipation rib is not greater than 0.1 mm.
  • a method for manufacturing a photosensitive component which includes: manufacturing a composite substrate by any of the foregoing composite substrate manufacturing methods; and the method for manufacturing a photosensitive component further includes: 4) mounting on the circuit board A photosensitive chip is attached to the first surface, electronic components are mounted, and the circuit board is electrically connected to the photosensitive chip through a wire bonding process.
  • the step 4) further includes: fabricating a front molding part on the first surface, the front molding part is manufactured on the first surface through a molding process and surrounding the photosensitive chip, and The top surface of the front molding part is suitable for mounting a lens assembly.
  • the front molding part and the back molding part are simultaneously formed on the circuit board through the same molding process.
  • the step 4) further includes: installing a molded lens holder on the first surface, the lens holder surrounding the photosensitive chip.
  • the photosensitive component and camera module of the present application improve the structural strength of the circuit board.
  • the photosensitive component and camera module of the present application improve the heat dissipation efficiency of the photosensitive chip.
  • the photosensitive component and camera module of the present application can ensure the imaging quality of the camera module with a small space size penalty.
  • the photosensitive component and camera module of the present application are particularly suitable for camera modules with high pixels and high frame rate.
  • the photosensitive components and camera modules of this application are particularly suitable for combining with MOC and MOB technologies.
  • the photosensitive component and camera module of the present application can reduce the radial size of the camera module by arranging some electronic components on the back of the circuit board.
  • the radial size refers to the size perpendicular to the optical axis.
  • the back surface of the photosensitive component of the present application may be a flat surface, which is convenient for the subsequent production process to be realized, and is convenient for adapting to other parts of the terminal device (such as a mobile phone).
  • the back surface of the photosensitive component of the present application can be a flat surface, which is more suitable for mass production.
  • the photosensitive components and camera modules of the present application have high production efficiency.
  • the heat dissipation ribs on the back are combined with the encapsulation part, on the other hand, it improves the structural strength of the circuit board, on the other hand, it improves the heat dissipation efficiency of the photosensitive chip, avoids excessive heat accumulation, and reduces thermal expansion.
  • the different coefficients cause the stress that causes the circuit board to bend, so the photosensitive component of the present application can suppress the bending of the photosensitive chip from two aspects.
  • the photosensitive component of the present application can inhibit the bending of the photosensitive chip by avoiding excessive heat accumulation and increasing the structural strength. Therefore, the thickness of the package part and the heat dissipation rib on the back of the circuit board can be relatively reduced. In other words, the The application can achieve the effect of suppressing the bending of the photosensitive chip at the cost of a smaller thickness.
  • This application can prevent the circuit board from warping during the molding process of the circuit board.
  • This application can prevent the overall warpage of the circuit board assembly during the manufacturing process of the circuit board assembly.
  • the heat dissipation ribs of the present application can form a mold flow channel during the molding process of the circuit board, thereby preventing the "under injection” phenomenon in the molding cavity, thereby avoiding the unevenness of the back molding part , Improve the production yield of composite substrates and photosensitive components.
  • FIG. 1 shows a schematic cross-sectional view of a composite substrate 1000 for a camera module in an embodiment of the present application
  • FIG. 2 shows a three-dimensional schematic diagram of the composite substrate 1000 shown in FIG. 1;
  • FIG. 3 shows a schematic front view of a composite substrate 1000 mounted with a photosensitive chip 50 in an embodiment of the present application
  • FIG. 4 shows a schematic cross-sectional view of a photosensitive component 2000 including a composite substrate 1000 in an embodiment of the present application
  • Fig. 5 shows a schematic back view of a composite substrate in a modified embodiment of the present application
  • Fig. 6 shows a schematic back view of a composite substrate in another modified embodiment of the present application
  • FIG. 7 shows a photosensitive component 2000 based on a composite substrate according to another embodiment of the present application.
  • FIG. 8 shows a photosensitive component 2000 based on a composite substrate according to another embodiment of the present application.
  • FIG. 9 shows a schematic cross-sectional view of a photosensitive component according to another modified embodiment of the present application.
  • FIG. 10 shows a schematic cross-sectional view of a photosensitive component according to a modified embodiment of the present application
  • FIG. 11 shows the circuit board 10 in step S10
  • FIG. 12 shows a schematic diagram of fabricating heat dissipation ribs 20 on the second surface 15 of the circuit board 10 in step S20;
  • FIG. 13 shows a schematic diagram of placing the circuit board 10 in a mold to form a molding cavity in step S30 in an embodiment of the present application
  • FIG. 14 shows a schematic diagram of injecting a liquid molding material into a molding cavity and forming the package portion 30 in an embodiment of the present application
  • FIG. 15 shows a composite substrate obtained after the mold is opened, and the composite substrate includes a circuit board 10, a heat dissipation rib 20 and a packaging part 30;
  • Figure 16A shows a circuit board jigsaw containing a connector part
  • Figure 16B shows a circuit board jigsaw without a connector part
  • FIG. 17 shows a schematic diagram of forming a molding cavity after mold clamping in step S30 of an embodiment of the present application
  • FIG. 18 shows a schematic diagram after molding in step S30 of an embodiment of the present application.
  • FIG. 19 shows a schematic diagram after mold opening in step S30 of an embodiment of the present application.
  • FIG. 20 shows a schematic diagram of forming a molding cavity after mold clamping in step S31 of an embodiment of the present application
  • FIG. 21 shows a schematic diagram after molding in step S31 of an embodiment of the present application.
  • FIG. 22 shows a schematic diagram after mold opening in step S31 of an embodiment of the present application.
  • FIG. 23 shows a composite substrate with heat dissipation extensions in an embodiment of the present application
  • FIG. 25 shows a schematic cross-sectional view of a camera module in an embodiment of the present application.
  • FIG. 26 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • FIG. 27 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • FIG. 28 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • FIG. 29 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • FIG. 30 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • FIG. 31 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • FIG. 32 shows a schematic cross-sectional view of a composite substrate 1000 in another embodiment of the present application.
  • FIG. 33 shows a schematic diagram of placing the circuit board 10 in a mold to form a molding cavity in step S30 in another embodiment of the present application;
  • FIG. 34 shows a schematic diagram of injecting a liquid molding material into a molding cavity and forming the package portion 30 in another embodiment of the present application
  • FIG. 35A shows a circuit board assembly in an embodiment of the present application
  • FIG. 35B shows a circuit board assembly in another embodiment of the present application.
  • FIG. 35C shows a circuit board assembly in another embodiment of the present application.
  • FIG. 35D shows a circuit board assembly in another embodiment of the present application.
  • FIG. 36 shows a schematic bottom view of a circuit board jigsaw and a plurality of strip-shaped heat dissipation ribs in an embodiment of the present application
  • FIG. 37A shows a schematic cross-sectional view of the circuit board after clamping in an embodiment of the present application
  • FIG. 37B shows a schematic cross-sectional view of the circuit board after clamping in another embodiment of the present application.
  • Figure 38 shows the flow direction of the molding material in an embodiment of the present application
  • FIG. 39 shows a schematic bottom view of the composite substrate panel obtained after the back molding is completed in an embodiment of the present application.
  • FIG. 40 shows a schematic diagram of cutting composite substrate panels in an embodiment of the present application.
  • FIG. 41A shows a three-dimensional schematic diagram of a single composite substrate made based on the foregoing splicing board according to an embodiment of the present application
  • FIG. 41B shows an exploded schematic diagram of FIG. 38A
  • FIG. 42 shows a schematic front view of a photosensitive component panel in an embodiment of the present application.
  • the heat generated by the photosensitive chip is increasing.
  • the inventor of the present case found that the superposition of factors such as heat accumulation and increase in the size of the photosensitive chip (high pixels leads to an increase in the size of the photosensitive chip) makes the photosensitive chip prone to deformation, and the deformation is sufficient to cause the imaging quality of the camera module to decrease.
  • the photosensitive chip itself is large in area, high in power, and generates more heat; second, the photosensitive chip is large in area and small in thickness.
  • FIG. 1 shows a schematic cross-sectional view of a composite substrate 1000 for a camera module in an embodiment of the present application.
  • the composite substrate 1000 includes a circuit board 10, a heat dissipation rib 20 and a backside packaging portion 30.
  • the circuit board 10 has a first surface 14 for attaching a photosensitive chip and a second surface 15 opposite to the first surface 14.
  • the heat dissipation ribs 20 are directly fabricated on the second surface 15.
  • the material used for the heat dissipation ribs has good thermal conductivity. In this embodiment, the thermal conductivity of the material used for the heat dissipation ribs is 10-1000W/mK.
  • FIG. 2 shows a three-dimensional schematic diagram of the composite substrate 1000 shown in FIG. 1.
  • the circuit board 10 may include a circuit board main body 11, a connector 12 and a flexible connection band 13. Only the circuit board main body 11 is shown in FIG. 1. In this embodiment, the heat dissipation ribs 20 are actually attached to the back of the circuit board main body 11, so the connector 12 and the flexible connecting band 13 are omitted in some drawings.
  • the circuit board main body 11 may be a PCB board.
  • the heat dissipation ribs 20 are a plurality of linear strip heat dissipation ribs 21 arranged in parallel.
  • the back encapsulation portion 30 is filled between a plurality of linear strip-shaped heat dissipation ribs 21 arranged in parallel, and covers the second surface 15.
  • FIG. 2 shows the backside packaging portion 30 and the circuit board 10 separately.
  • the back encapsulation portion 30 may be fabricated on the second surface 15 through a molding process.
  • the back encapsulation portion 30 can also be implemented by other encapsulation processes such as injection molding and molding, as long as it can cover the second surface 15 and fill the gap between the heat dissipation ribs 20 to achieve encapsulation.
  • the setting of the back side packaging part is based on different packaging processes, and the setting of the heat dissipation ribs has different requirements.
  • the mold is required to press the surface of the circuit board to form a runner Therefore, the direction of the heat dissipation ribs should preferably be parallel to the molded press-fit side (ie the exposed side of the circuit board), or at a certain angle, such as 45 degrees or less than 45 degrees with the press-fit side to facilitate molding Fluid is injected to prevent "under injection” from happening.
  • the molding process is mainly encapsulated by molding powder. There is a certain gap between the surface flatness of molded packages and molded packages.
  • FIG. 3 shows a schematic front view of a composite substrate 1000 on which the photosensitive chip 50 is mounted in an embodiment of the present application.
  • the side facing the photosensitive surface is referred to as the front side
  • the side facing away from the photosensitive surface is referred to as the back side.
  • the photosensitive chip 50 is attached to the center of the circuit board 10.
  • the area of the first surface 14 of the circuit board 10 for attaching the photosensitive chip 50 is called a chip attaching area.
  • FIG. 4 shows a schematic cross-sectional view of a photosensitive component 2000 including a composite substrate 1000 in an embodiment of the present application.
  • a part of the heat dissipation rib 20 is located in an area of the second surface corresponding to the back of the chip attachment area.
  • part of the linear strip-shaped heat dissipation ribs 21 are located in the area on the back of the chip attachment area, and both ends of these linear strip-shaped heat dissipation ribs 21 extend to parts outside the chip attachment area.
  • Another part of the linear strip-shaped heat dissipation ribs 21 is located at the edge area of the circuit board 10, that is, this part of the linear strip-shaped heat dissipation ribs 21 are all located outside the chip attaching area.
  • the distance between the photosensitive chip and the heat dissipation ribs can be shortened, and the heat dissipation efficiency can be increased.
  • the bottom surface of the heat dissipation rib is exposed outside the back encapsulation portion, so as to improve the heat dissipation effect.
  • the back radiating ribs are combined with the encapsulation part, which on the one hand improves the structural strength of the circuit board, on the other hand, improves the heat dissipation efficiency of the photosensitive chip, avoids excessive heat accumulation, and reduces the thermal expansion coefficient caused by The stress that causes the circuit board to bend, so the photosensitive component of the present application can suppress the bending of the photosensitive chip from two aspects.
  • the bottom surface of the back surface packaging portion is flush with the bottom surface of the heat dissipation rib.
  • the back surface of the photosensitive component in this embodiment can be a flat surface, which facilitates the realization of subsequent manufacturing processes, facilitates the adaptation to other parts of the terminal device (such as a mobile phone), and is more suitable for mass production.
  • the thickness of the heat dissipation ribs 20 can be 0.05mm-0.4mm, which ensures that the strength of the photosensitive component can be effectively strengthened without increasing the thickness of the camera module too much, and the strength of the structure and heat dissipation are enhanced.
  • the circuit board selected in this technical solution can be thinner than the conventional design circuit board, generally reducing the thickness of the circuit board by 0.1mm. In some cases, the module height will not be increased.
  • the thickness of the conventional circuit board is generally 0.35mm or more (for example, 0.35mm-0.45mm), while the thickness of the circuit board of the MOB module can be less than 0.3mm, and ideally it can be less than 0.25mm. It should be noted that in this embodiment, the thickness refers to the axial dimension, that is, the dimension in the optical axis direction of the camera module. The axial direction can also be understood as the normal direction of the photosensitive surface or the first surface.
  • FIG. 32 shows a schematic cross-sectional view of a composite substrate 1000 in another embodiment of the present application.
  • the back encapsulation part 30 is directly formed on the back molding part of the second surface 15 (namely the back) of the circuit board through a molding process, and the back molding part covers the bottom surface of the heat dissipation rib 20, Instead of being flush with the bottom surface of the heat dissipation rib 20.
  • This solution can help improve product yield.
  • the back molding part covers the bottom surface of the heat dissipation rib 20, so that a bottom surface 38 composed entirely of molding material can be obtained.
  • This bottom surface 38 can have a high degree of flatness, and the process difficulty is reduced. , And can reduce the requirements for the quality of molding materials, which is beneficial to improve product yield and reduce production costs.
  • the bottom surface 38 of the back molding part is connected to the bottom surface of the heat dissipation rib.
  • the distance between the bottom surfaces may not be more than 0.1 mm, and the distance between the bottom surface 38 of the back molding part and the second surface 15 may not be more than 0.2 mm (that is, the thickness of the back molding part is not more than 0.2 mm).
  • the composite substrate thus obtained still has a smaller thickness.
  • the thickness of the circuit board can be further reduced to 0.25 mm or 0.25 mm. mm below.
  • the photosensitive chip 50 is a rectangle with a long side L and a short side W
  • the heat dissipation ribs 20 are composed of a plurality of parallel linear strip heat dissipation ribs.
  • the plurality of parallel linear strip heat dissipation ribs may be parallel to the long side L of the photosensitive chip 50.
  • a typical photosensitive chip is a 16:9 rectangle, and the chip usually has different degrees of warping on the long side and the short side.
  • the direction of the heat dissipation ribs used in this embodiment is more conducive to suppressing and preventing the photosensitive chip from bending, so it is preferred
  • the heat dissipation ribs are arranged in a direction parallel to the long side of the photosensitive chip.
  • the circuit board 10 (actually refers to the circuit board body 11) is rectangular, the rectangle has long sides and short sides, and a plurality of linear strip-shaped heat dissipation ribs are all parallel to The long side of the circuit board 10.
  • the direction of the heat dissipation ribs used in this embodiment is more conducive to restraining and preventing the photosensitive bending from occurring.
  • the long side direction of the photosensitive chip is consistent with the long side direction of the circuit board, but the application is not limited to this, because sometimes the long side of the photosensitive chip and the long side of the circuit board may be perpendicular.
  • FIG. 5 shows a schematic diagram of the back side of the composite substrate in a modified embodiment of the present application.
  • the heat dissipation rib 20 adopts another shape, that is, the heat dissipation rib 20 is composed of a single, integrated strip heat dissipation rib.
  • the radiating ribs 20 are substantially in the shape of a "meter”.
  • the gap between the heat dissipation ribs can be understood as the gap between different parts of a single heat dissipation rib.
  • the back encapsulation part 30 fills the gap to realize encapsulation.
  • This embodiment can strengthen the structural strength of the circuit board in the diagonal, horizontal, and vertical directions, support the circuit board in multiple directions, suppress the warpage of the photosensitive component at the four corners, strengthen the ability to hinder the bending of the photosensitive component, and alleviate the bending of the photosensitive component .
  • glue ie glue
  • the chip is prone to bend up from the center, and in the subsequent process May exacerbate the degree of bending mentioned above.
  • the center position of the radiating ribs of the rice-shaped or X-shaped or cross-shaped radiating ribs corresponds to the central area of the chip, and the central part of the chip is reinforced and fixed, which is beneficial to suppress the upward warping of the chip center , Suppress the four corners of the photosensitive component warping, thereby suppressing the chip field curvature.
  • FIG. 6 shows a schematic diagram of the back of the composite substrate in another modified embodiment of the present application.
  • the heat dissipation rib 20 adopts another shape, that is, the heat dissipation rib 20 is composed of a single, integrated strip heat dissipation rib.
  • the radiating rib 20 is substantially in the shape of a square spiral.
  • the gap between the heat dissipation ribs can be understood as the gap between different parts of a single heat dissipation rib.
  • the back encapsulation part 30 fills the gap to realize encapsulation.
  • This embodiment can strengthen the structural strength of the circuit board, support the circuit board in multiple directions, strengthen the ability to hinder the bending of the photosensitive component, and alleviate the bending of the photosensitive component.
  • heat dissipation ribs 20 can also be a plurality of small heat dissipation ribs arranged in a scattered point array.
  • the heat dissipation ribs 20 can also be a combination of two or more of the foregoing. For example, on the back of the same circuit board, a plurality of parallel linear strip-shaped heat dissipation ribs and a "meter"-shaped heat dissipation rib can be simultaneously provided. Various combinations can be set flexibly, so I won't repeat them in this article.
  • the heat dissipation ribs can be made of metal materials.
  • a multilayer PCB can be used as a circuit board.
  • the multi-layer PCB board has multiple layers, and each layer can be arranged with circuits and designed functional circuits. Different levels can be connected by copper pillars (or other metal pillars) to connect the entire circuit board (electrically) into a whole.
  • a copper seed layer can be made in a certain layer of the circuit board, and then copper pillars are planted on the seed layer by electroplating and grown outside the second surface (ie the backside surface) of the circuit board , Thereby forming the required heat dissipation ribs.
  • the manufacturing process of the heat dissipation ribs can be compatible with the manufacturing process of the circuit board, which is easy for mass production, and the obtained composite substrate has a higher structural strength.
  • the layer used to make the seed layer of the multilayer PCB board may not be used for circuit conduction, but is dedicated to strengthening the structural strength of the circuit board.
  • the heat dissipation ribs may be formed of a thermally conductive colloidal substance.
  • the thermally conductive colloidal substance can be coated on the second surface (ie the back side surface) of the circuit board in a desired shape, and then the thermally conductive colloidal substance is hardened to form a heat dissipation rib.
  • the thermally conductive colloidal substance may be thermally conductive silicone grease, for example.
  • the heat dissipation ribs may be formed first, and then attached to the second surface (ie, the back side surface) of the circuit board by bonding or welding.
  • the pre-formed heat dissipation ribs can be made of metal material or hardened thermally conductive colloidal material, such as thermally conductive silicone grease.
  • a photosensitive assembly 2000 based on a composite substrate includes a composite substrate.
  • the composite substrate may include a circuit board 10, a heat dissipation rib 20 and a back encapsulation part 30.
  • the photosensitive chip 40 is attached to the first surface 14 of the circuit board 10.
  • the heat dissipation ribs 20 are directly fabricated on the second surface 15 of the circuit board 10.
  • the second surface 15 of the back encapsulation portion 30 fills the gap between the heat dissipation ribs 20 to achieve the encapsulation effect.
  • the photosensitive component 2000 further includes an electronic component 50 that can be mounted on the first surface 14 and arranged around the photosensitive chip 40.
  • the electronic component 50 may be, for example, a passive device such as a capacitive element or an inductance element, and may also be an active device such as a memory chip and an image processor chip.
  • the photosensitive component may also include a metal wire 60, and the metal wire 60 may be bonded by wire (its English name is Wire Bonding, and may also be called “wire bonding", “binding”, “binding” or “wire bonding”. The wire bonding process electrically connects the photosensitive chip and the circuit board.
  • the metal wire 60 may be a metal wire with better conductivity such as gold wire, aluminum wire or copper wire.
  • FIG. 7 shows a photosensitive assembly 2000 based on a composite substrate according to another embodiment of the present application.
  • the difference between this embodiment and the previous embodiment is that the electronic component 50 is arranged on the back side of the circuit board 10, that is, the electronic component 50 is mounted on the second surface 15.
  • the back encapsulation part 30 can wrap the electronic component 50 or fill the periphery of the electronic component 50, so as to realize the encapsulation of the back of the circuit board.
  • the space for arranging electronic components on the front side of the circuit board can be omitted, which helps to reduce the radial size of the photosensitive component.
  • the radial dimension refers to the dimension in a direction perpendicular to the optical axis of the camera module.
  • the thickness direction of the circuit board can be called the axial direction, which is parallel to the optical axis of the camera module.
  • the electronic components can be all arranged on the back of the circuit board, or partly on the back of the circuit board and partly on the front of the circuit board.
  • FIG. 8 shows a photosensitive assembly 2000 based on a composite substrate according to another embodiment of the present application.
  • the difference of this embodiment is that a secondary heat dissipation portion 22 is added.
  • the top surface of the secondary heat dissipation portion 22 is connected to the bottom surface of the heat dissipation rib 20.
  • the bottom surface of the back encapsulation portion 30 may be flush with the bottom surface of the secondary heat dissipation portion 22, and the bottom surface of the secondary heat dissipation portion 22 is exposed outside the back encapsulation portion 30.
  • the area of the bottom surface of the secondary heat dissipation portion 22 is larger than the area of the bottom surface of the heat dissipation rib 20.
  • FIG. 8 is not the only implementation form of the secondary heat sink 22.
  • the longitudinal section of the secondary heat sink 22 may be trapezoidal, so that the cross-sectional area of the secondary heat sink 22 The top surface to the bottom surface gradually increase. This implementation can also increase the surface area of the heat dissipation member and improve the heat dissipation efficiency.
  • FIG. 9 shows a schematic cross-sectional view of a photosensitive component according to another modified embodiment of the present application.
  • the photosensitive component eliminates the back encapsulation part, that is, the heat dissipation ribs 20 are fabricated on (or attached to) the second surface (rear surface) of the circuit board 10. The bottom and side surfaces of the heat dissipation rib 20 are exposed to the outside.
  • the heat dissipation ribs 20 may be a plurality of linear strip heat dissipation ribs arranged in parallel, or may be a plurality of heat dissipation ribs arranged in a scattered point array, or may be a single strip heat dissipation rib, and the single strip heat dissipation rib is Spiral or "meter" shape, or other strip shapes that can be connected together but still have gaps between different parts; it can also be any combination of two or more of the above.
  • the photosensitive component may further include a front molding part, and the front molding part may be fabricated on the first surface through a molding process and surrounding the photosensitive chip. around.
  • the front molding part may be fabricated on the first surface through a molding process and surrounding the photosensitive chip. around.
  • the top surface of the front molding part is suitable for mounting a lens assembly.
  • the lens assembly may be a lens assembly with a motor or a lens assembly without a motor.
  • the photosensitive component may further include a front molding part, and the front molding part may be made on the first surface by a molding process and surround the photosensitive chip And the front molding part extends to the photosensitive chip and contacts the photosensitive chip (for example, the front molding part may cover the edge area of the photosensitive chip), that is, the MOC process.
  • the top surface of the front molding part is suitable for mounting a lens assembly.
  • the lens assembly can be a lens assembly with a motor, or a lens assembly without a motor. The lens assembly and the photosensitive assembly are assembled together to obtain a camera module.
  • the photosensitive chip may be more prone to bending because the molded body is integrally formed on the photosensitive chip.
  • the photosensitive chip may be bent during the manufacturing process.
  • the photosensitive chip may be bent during the manufacturing process.
  • the photosensitive components packaged with the MOC or MOB process not only high-pixel and high-frame-rate camera modules may bend the photosensitive chip after long-term use. This bending phenomenon is relatively low in the number of pixels and frame rate. May also appear in the camera module.
  • the temperature change of the manufacturing environment is relatively large (for example, it rises from room temperature to above 150 degrees, and then decreases to room temperature), and the thermal expansion coefficient of the molding material and the circuit board are different. Therefore, stress is easily generated between the two, and the photosensitive components of the MOC/MOB module are more likely to bend. Therefore, for the photosensitive component packaged by the MOC/MOB process, the heat dissipation ribs in the foregoing embodiment are provided on the back of the circuit board to achieve a more obvious effect in suppressing the bending of the photosensitive chip. Furthermore, the combination of the molded body and the heat dissipation ribs can also reduce the thickness requirements of the circuit board, while having good flatness, and the heat dissipation performance is significantly improved compared with existing products.
  • the front molding part may be replaced with a lens holder (sometimes may also be called a lens holder).
  • the lens holder is formed and then mounted on the first surface.
  • the lens holder is installed on the first surface and surrounds the photosensitive chip, and the top surface of the lens holder is suitable for installing a lens assembly.
  • the photosensitive component may further include a color filter, and the color filter may be installed on the front molding part or the lens holder.
  • the color filter When the color filter is mounted on the front molding part, the top surface of the front molding part may form a step structure, and the color filter is mounted on the step structure.
  • the photosensitive element may not include a color filter.
  • a color filter assembly can be added to the camera module.
  • the color filter assembly includes a lens holder and a color filter mounted on the lens holder.
  • the photosensitive component may have a front molding part, and the bottom of the lens holder is mounted on the top surface of the front molding part.
  • a lens assembly is mounted on the top surface of the lens holder.
  • the photosensitive chips are all attached to the front surface of the circuit board, that is, the first surface, but the application is not limited to this.
  • the center of the circuit board may have a main through hole that can accommodate the photosensitive chip, and the photosensitive chip may be installed in the main through hole.
  • This manufacturing process helps reduce the axial size of the photosensitive component. That is to reduce the size of the optical axis (referring to the optical axis of the camera module or lens assembly).
  • FIG. 10 shows a schematic cross-sectional view of a photosensitive component according to a modified embodiment of the present application.
  • the circuit board and the photosensitive chip form a combined body, wherein the side facing the photosensitive surface of the photosensitive chip is the front side of the combined body, and the side opposite to the front side is The back of the combination.
  • the heat dissipation ribs are located on the back of the combined body, wherein the heat dissipation ribs are directly fabricated or attached to the back of the combined body.
  • the back surface of the assembly includes the circuit board and the back surface of the photosensitive chip, and at least a part of the heat dissipation rib is located on the back surface of the photosensitive chip.
  • a method for manufacturing a photosensitive element which includes the following steps S10-S40 executed in sequence.
  • Step S10 prepare a circuit board 10.
  • FIG. 11 shows the wiring board 10 in step S10.
  • the circuit board 10 has a first surface 14 for attaching photosensitive chips and a second surface 15 opposite to the first surface 14, wherein the first surface 14 has a chip attaching area.
  • the circuit board 10 in this step can be a PCB board.
  • the PCB board can be made by yourself or can be ordered on the market (note that there is no such product on the market at present, in other words, the circuit board 10 itself in this step The structure is not prior art).
  • a heat dissipation rib 20 is fabricated on the second surface 15 (ie, the back side) of the circuit board 10.
  • FIG. 12 shows a schematic diagram of fabricating heat dissipation ribs 20 on the second surface 15 of the circuit board 10 in step S20. At least a part of the heat dissipation rib 20 is located directly below the chip attachment area (note that the circuit board 10 is inverted in FIG. 12, so the heat dissipation rib 20 is located above the circuit board 10 in FIG. 12), that is, the second surface The area on 15 that overlaps with the chip attaching area.
  • the heat dissipation ribs 20 can be arranged in a preset shape.
  • the heat dissipation ribs may be composed of a plurality of parallel linear strip heat dissipation ribs.
  • the thickness of the heat dissipation rib 20 may reach 0.1 mm or less.
  • the thickness of the radiating ribs here refers to the size in the normal direction of the second surface, and the thickness of the radiating ribs is the size of the radiating ribs beyond the second surface. If the root of the radiating ribs is located inside the circuit board, the part located inside the circuit board is not Calculate within the thickness of the radiating rib.
  • Step S30 covering the back encapsulation portion on the second surface, wherein the back encapsulation portion covers the second surface and fills the gaps between the heat dissipation ribs, wherein the gaps between the heat dissipation ribs are multiple The gap between the heat dissipation ribs or the gap between different parts of a single heat dissipation rib; the bottom surface of the heat dissipation rib is exposed outside the back encapsulation portion and the bottom surface of the back encapsulation portion is connected to the bottom surface of the heat dissipation rib Flush.
  • the back encapsulation part may be formed on the second surface by a molding process. Specifically, FIG.
  • FIG. 13 shows a schematic diagram of placing the circuit board 10 in a mold to form a molding cavity in step S30 in an embodiment of the present application.
  • Fig. 14 shows a schematic diagram of injecting a liquid molding material into a molding cavity and forming the package portion 30 in an embodiment of the present application.
  • the circuit board 10 is placed in a mold, which includes an upper mold 91 and a lower mold 92.
  • the second surface 15 of the circuit board 10 faces upward, and the second surface 15 has heat dissipation ribs 20.
  • FIG. 14 shows a composite substrate obtained after the mold is opened, and the composite substrate includes a circuit board 10, a heat dissipation rib 20 and a packaging part 30.
  • the back molding part may simultaneously cover the second surface 15 and the bottom surface of the heat dissipation rib 20 (refer to FIG. 32).
  • a gap 39 may be left between the upper mold 91 and the bottom surface of the heat dissipation rib 20 (the bottom surface of the heat dissipation rib 20 is upward in FIGS. 13-14) (refer to FIG.
  • FIG. 34 shows a schematic diagram of injecting a liquid molding material into a molding cavity and forming the package portion 30 in another embodiment of the present application. Since the uniformity of the molding materials may be insufficient, if the back encapsulation part that is flush with the bottom surface and the heat dissipation ribs is directly made during molding, sometimes the problem of uneven molding bottom surface is encountered.
  • the back molding part By covering the bottom surface of the heat dissipation ribs with the back molding part, a bottom surface completely composed of molding materials can be obtained.
  • This bottom surface can have a high level of flatness, and the process difficulty is reduced, and the quality requirements of the molding materials can be reduced. , which is conducive to improving product yield and reducing production costs.
  • the thickness of the circuit board when the back molding part covers the second surface and the bottom surface of the heat dissipation rib, the thickness of the circuit board can be further reduced to 0.25 mm or less .
  • step S40 a photosensitive chip and other components (such as electronic components, metal wires, lens holders, color filters, etc.) are mounted on the first surface (ie, the front side) of the circuit board, and then the photosensitive component is manufactured.
  • the photosensitive chip may be pasted on the chip attaching area of the first surface.
  • the heat dissipation ribs may be directly fabricated on the second surface of the circuit board.
  • the circuit board may have a seed layer, and a metal layer is planted on the seed layer so that the metal layer grows beyond the second surface, thereby forming the heat dissipation ribs.
  • a thermally conductive colloidal substance may be coated on the second surface, and then the thermally conductive colloidal substance is hardened to form the heat dissipation ribs.
  • the heat dissipating ribs may be formed in advance and then attached to the second surface of the heat dissipating ribs by welding or bonding.
  • the heat dissipation ribs are first fabricated and then molded to form the back encapsulation portion.
  • this application is not limited to this.
  • another method for manufacturing a photosensitive component is also provided.
  • the backside package portion can be molded on the backside of the circuit board first, and then Then fabricate the heat dissipation ribs or attach the heat dissipation ribs to the second surface (ie, the back surface) of the circuit board.
  • the execution order of step S30 and step S20 is reversed, that is, step S30 is executed first, and then step S20 is executed.
  • the back surface encapsulation portion may be formed on the second surface by a molding process, and in the molding process, an indenter (or a convex structure of the upper mold) may be used on the back surface A through hole is left in the encapsulation part, and the through hole makes a part of the second surface exposed outside the back encapsulation part.
  • FIG. 17 shows a schematic diagram of forming a molding cavity after mold clamping in step S30 of an embodiment of the present application. It can be seen with reference to FIG. 17 that the upper mold 91 has a plurality of downwardly protruding structures 93 which bear against the second surface 15 of the circuit board 10, and an enclosure can be formed between the upper mold 91 and the circuit board 10.
  • FIG. 18 shows a schematic diagram after molding in step S30 of an embodiment of the present application.
  • the liquid molding material is injected into the molding cavity and cured to obtain the back encapsulation portion 30.
  • the back encapsulation portion 30 can surround the protrusion structure 93, or the back encapsulation portion 30 can fill the gap between the protrusion structure 93 and the gap between the protrusion structure 93 and the mold.
  • FIG. 19 shows a schematic diagram after mold opening (sometimes called demolding) in step S30 of an embodiment of the present application. Referring to FIG.
  • Step S20 is performed on the obtained wiring board having the back surface packaging portion 30.
  • the heat dissipation ribs are fabricated in the through holes of the back encapsulation portion, thereby obtaining a composite substrate as shown in FIG. 15.
  • steps S20 and S30 after the steps S20 and S30, the following steps S31 and S32 may be performed.
  • a second-level package part is fabricated on the bottom surface of the back-side package part through a molding process, the second-level package part has a second-level through hole, and the second-level through hole exposes the bottom surface of the heat dissipation rib and the The adjacent area of the bottom surface of the back surface encapsulation part around the heat dissipation rib.
  • FIG. 20 shows a schematic diagram of forming a molding cavity after mold clamping in step S31 of an embodiment of the present application. Referring to FIG.
  • the upper mold 91 may have a plurality of downward convex structures 93, and these convex structures 93 bear the composite substrate (referring to the composite substrate obtained after steps S20 and S30 are completed (the The composite substrate can be composed of the circuit board 10, the heat dissipation ribs 20, and the back encapsulation portion 30).
  • the composite substrate is actually a semi-finished product on the upper surface (note that the composite substrate is inverted in FIG. 20). Yes, the upper surface is actually the back surface), a molding cavity surrounding the raised structure 93 can be formed between the upper mold 91 and the composite substrate.
  • FIG. 21 shows a schematic diagram after molding in step S31 of an embodiment of the present application.
  • FIG. 22 shows a schematic diagram after mold opening (sometimes called demolding) in step S31 of an embodiment of the present application.
  • a composite substrate with a secondary encapsulation portion 32 can be obtained.
  • the secondary packaging portion 32 has a secondary through hole 33, and the secondary through hole 33 exposes the bottom surface of the heat dissipation rib 20 (the bottom surface is upward in FIG. 22) and the back packaging portion around the heat dissipation rib 20 The contiguous area 34 of the bottom surface.
  • a heat dissipation extension is made in the secondary through hole to obtain a composite substrate with a heat dissipation extension.
  • Fig. 23 shows a composite substrate with heat dissipation extensions in an embodiment of the present application.
  • the composite substrate can be used to manufacture the photosensitive component as shown in FIG. 8. 8 and 23, the top surface of the heat dissipation extension portion 22 is connected to the bottom surface of the heat dissipation rib 20, and the bottom surface of the heat dissipation extension portion 22 is flush with the bottom surface of the secondary package portion 32 (note that the figure 23 The bottom surface is placed upwards).
  • the heat dissipation extension 22 is made by planting a metal layer or pouring and hardening a thermally conductive colloidal substance, or by bonding or welding a formed member.
  • the step S40 may further include: mounting at least a part of electronic components on the second surface of the circuit board.
  • the step of mounting electronic components on the second surface may be performed before the step S30.
  • the back encapsulation layer can cover the electronic components mounted on the second surface (or fill the gaps around the electronic components) to achieve the encapsulation effect.
  • the step S40 may further include: forming a front molding part on the first surface of the circuit board, the front molding part being manufactured on the first surface and surrounding the first surface through a molding process
  • the periphery of the photosensitive chip and the top surface of the front molding part are suitable for mounting lens components.
  • the back encapsulation part is a back molding part, and the front molding part and the back molding part can be simultaneously molded on the circuit board. This will help improve production efficiency and save costs.
  • the prepared circuit board may be a circuit board assembled by connecting multiple single circuit boards together.
  • Figure 16A shows a circuit board jigsaw including a connector part.
  • the circuit board jigsaw can be a rigid-flex board.
  • Figure 16B shows a circuit board jigsaw without a connector part.
  • the circuit board jigsaw can be a PCB board, or called a hard board.
  • the heat dissipation ribs are made on the second surface (ie, the back surface) of the circuit board jigsaw. That is, the heat dissipation ribs corresponding to multiple single circuit boards are produced at one time.
  • the back encapsulation part corresponding to a plurality of single circuit boards may be manufactured by one-time molding, and the back encapsulation part may be connected and integrally cover the second surface of the circuit board jigsaw.
  • the photosensitive chips may be respectively pasted (or mounted in other ways) on the first surfaces corresponding to the plurality of single circuit boards, thereby obtaining a photosensitive assembly panel.
  • the method for manufacturing a photosensitive component of this embodiment further includes step S50: cutting the photosensitive component panel to obtain a separated single photosensitive component.
  • the obtained photosensitive component and the lens component can be further assembled to obtain a complete camera module.
  • the lens assembly here can be a lens assembly with a motor, or a lens assembly without a motor.
  • the assembled camera module can be an auto-focus camera module or a fixed-focus camera module.
  • FIG. 25 shows a schematic cross-sectional view of a camera module in an embodiment of the present application.
  • the camera module includes a lens assembly 3000 and a photosensitive assembly 2000.
  • the photosensitive assembly adds a lens holder 2001 and a color filter 2002 mounted on the lens holder 2001 to the photosensitive assembly of the embodiment in FIG. 1.
  • the lens assembly 3000 may have a motor 3001, and the bottom surface of the motor is mounted on the top surface of the lens holder.
  • FIG. 26 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • the difference between this embodiment and the embodiment of FIG. 25 is that the electronic component 50 is mounted on the back of the circuit board 10 and the electronic component 50 is covered and wrapped by the back molding part 30.
  • FIG. 27 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • the difference between this embodiment and the embodiment in FIG. 25 is that the composite substrate of the photosensitive assembly 2000 is provided with a heat dissipation extension 22.
  • FIG. 28 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • the difference between this embodiment and the embodiment of FIG. 25 is that the back molding part is eliminated from the composite substrate of the photosensitive component.
  • FIG. 29 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • the difference between this embodiment and the embodiment of FIG. 28 is that a front molding part 2003 is formed on the upper surface of the circuit board 10 of the photosensitive assembly 2000.
  • the bottom surface of the motor can be installed on the top surface of the front molding part 2003.
  • the lens holder 2001 (corresponding to the lens holder in the previous embodiments) is only used to install the color filter 2002, and the lens holder 2001 is located in the front molding part 2003.
  • the inside of the electronic component 50 is only used to install the color filter 2002, and the lens holder 2001 is located in the front molding part 2003.
  • FIG. 30 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • the difference between this embodiment and the embodiment in FIG. 28 is that a front molding part 2003 is formed on the upper surface of the circuit board 10 of the photosensitive component 2000.
  • the lens holder 2001 is installed on the top surface of the front molding part 2003
  • the color filter 2002 is installed on the lens holder 2001
  • the lens assembly 3000 (the bottom surface of the motor) is installed on the top surface of the lens holder 2001.
  • FIG. 31 shows a schematic cross-sectional view of a camera module in another embodiment of the present application.
  • the front molding part 2003 covers the electronic component 50 and the metal wire and contacts the photosensitive chip 40.
  • the front molding part 2003 may cover the edge area of the photosensitive chip, and the edge area may be a non-photosensitive area.
  • an electronic device having the camera module of any one of the foregoing embodiments.
  • the electronic device may be a smart phone, a tablet computer, etc., for example.
  • the heat dissipation ribs can be understood as: reinforcing ribs with heat dissipation effect.
  • a method for manufacturing a composite substrate based on a splicing board which includes steps S1000-S4000.
  • FIG. 35A shows a circuit board assembly in an embodiment of the present application.
  • the circuit board assembly 1 includes a plurality of circuit board units 2 connected together.
  • the circuit board jigsaw 1 has a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of chip attachment areas for attaching photosensitive chips, and each of the The circuit board units 2 each have one chip attaching area, and the circuit board units 2 are distributed in an array.
  • the circuit board units 2 and the circuit board units 2 and the frame 3 of the circuit board jigsaw can all be separated by insulating regions 4, as shown in FIG. 35A.
  • the circuit board jigsaw 1 is a rigid-flex board, in which the hard board part can form the circuit board main body 2a, and the soft board part corresponds to the flexible connecting strap 2b and its corresponding connector 2c (note the connector itself Usually not flexible).
  • the circuit board main body 2a, the flexible connection band 2b and the connector 2c together constitute a circuit board unit 2.
  • FIG. 35A is usually formed by etching away the conductive material (for example, copper material) of the conductive layer. Therefore, the insulating area of the circuit board jigsaw may be thinner. In order to prevent the high-temperature molding flow in the subsequent molding step from damaging the thinner insulating area, in this embodiment, a non-insulating area is also provided between adjacent circuit board units 2 District 5.
  • the non-insulating area 5 can also be understood as a non-etching area, and the non-etching area can reserve greater thickness and structural strength for the panel.
  • the circuit board assembly is not limited to the form of FIG. 35A.
  • FIG. 35B shows the circuit board assembly in another embodiment of the present application. Referring to FIG.
  • FIG. 35B in the circuit board jigsaw 1, the insulating area 4 between adjacent circuit board units 2 may have a smaller width, so that the non-insulating area 5 between the adjacent circuit board units 2 can be omitted.
  • FIG. 35C shows a circuit board assembly in another embodiment of the present application.
  • the circuit board is a rigid board, that is, it does not include a soft board.
  • the circuit board unit 2 only includes the main body of the circuit board (for the convenience of description, the main body of the circuit board is directly called the circuit board).
  • the flexible connecting band and the connector can be cut to obtain a single circuit board, and then pass The bonding process is connected to the circuit board.
  • FIG. 35D shows a circuit board assembly in another embodiment of the present application.
  • the insulating area 4 is not provided between the circuit board units 2 and the insulating area 4 is only provided between the circuit board unit 2 and the frame 3 of the circuit board jigsaw 1.
  • This embodiment can improve the space utilization rate of the circuit board jigsaw, and help save circuit board materials.
  • FIG. 36 shows a schematic bottom view of a circuit board jigsaw and a plurality of strip-shaped heat dissipation ribs in an embodiment of the present application.
  • each of the strip-shaped heat dissipation ribs 6 extends to each of the circuit board units 2 in the same row, and at least a part of the strip-shaped heat dissipation ribs 2 pass through the chip attaching area (in FIG. 36 The overlap area on the back side of the chip attachment area) is not shown.
  • a plurality of strip-shaped heat dissipation ribs 6 are arranged in parallel.
  • the strip-shaped heat dissipation ribs can be set by growing a metal layer on the basis of the seed layer, or by attaching pre-formed heat dissipation ribs to the second surface.
  • the strip-shaped heat dissipation ribs may also be provided by coating and curing thermally conductive silicone grease on the second surface.
  • the imposition circuit board is supported by the strip heat dissipation ribs to strengthen the overall strength of the circuit board imposition. When the temperature is increased in the subsequent manufacturing process (baking, molding process), the warpage of the circuit board imposition can be minimized to improve the circuit The flatness of board imposition ensures the flatness of chip installation.
  • step S3000 a back molding part is formed on the second surface through a molding process, and the bottom surface of the back molding part is flush with the bottom surface of the strip-shaped heat dissipation ribs to form a flat surface. Further, in an embodiment, this step can be decomposed into the following sub-steps S3100-S3300.
  • FIG. 37A shows a schematic cross-sectional view of the circuit board after clamping in an embodiment of the present application.
  • the upper mold 8a is pressed onto the pressing edge 7 of the second surface of the circuit board jigsaw 1 (that is, the upper die 8a can be pressed on the second surface of the circuit board jigsaw Edge area, thereby forming a pressing edge 7)
  • the lower mold 8b is pressed on the first surface of the circuit board jigsaw 1
  • the inner surface of the upper mold 8a presses the strip-shaped heat dissipation ribs 6,
  • a molding cavity is formed between the second surface, the strip-shaped heat dissipation ribs 6, and the upper mold 8a.
  • the direction of the strip-shaped heat dissipation ribs 6 can be such that a mold is formed between the plurality of strip-shaped heat dissipation ribs, and/or between the strip-shaped heat dissipation ribs and the mold used for the molding process. Plastic flow channel.
  • the design of the direction of the radiating ribs can facilitate the flow of high-temperature molding flow, and prevent certain circuit board units (for example, those circuit board units far away from the injection port of the molding flow) from appearing "under injection", thereby ensuring the product yield.
  • FIG. 37B shows a schematic cross-sectional view of the circuit board after clamping in another embodiment of the present application.
  • a strip-shaped heat dissipation rib 6 is provided in the edge area where the circuit board main body 2a and the flexible connecting band 2b are connected, so that the upper mold 8a presses the strip-shaped heat dissipation rib 6 located in the edge area to avoid liquid mold The plastic material leaks.
  • the upper mold 8a may not press against the circuit board main body 2a, so the pressing edge 7 in FIG. 37A can be omitted. This will help reduce the size of the composite substrate, thereby reducing the size of the photosensitive components and camera modules.
  • the panel molding of the present application is not limited to the situation of FIG. 37A and FIG. 37B.
  • the inner surface of the upper mold 8a can be connected to the bottom surface of the strip-shaped heat dissipation rib 6 (due to the figure
  • the circuit board in 37A is inverted, so the bottom surface of the strip-shaped heat dissipation rib 6 in FIG. 37A is located above) there may be a gap (the gap is similar to the gap 39 in FIG. 33).
  • the molded part can cover the second bottom surface (back surface) of the circuit board and the strip-shaped heat dissipation ribs 6 at the same time.
  • the gap between the bottom surface of the strip-shaped heat dissipation rib 6 and the inner surface of the upper mold 8a can be 0.1 mm (it can also be other values, such as 0.06 mm, generally not greater than 0.1 mm). Since the uniformity of the molding materials may be insufficient, if the back encapsulation part that is flush with the bottom surface and the heat dissipation ribs is directly made during molding, sometimes the problem of uneven molding bottom surface is encountered. By covering the bottom surface of the heat dissipation ribs with the back molding part, a bottom surface completely composed of molding materials can be obtained. This bottom surface can have a high level of flatness, and the process difficulty is reduced, and the quality requirements of the molding materials can be reduced.
  • the thickness of the circuit board can be further reduced to 0.25 mm or less .
  • a liquid molding flow is injected into the molding cavity, and the injection direction of the molding flow is consistent with the arrangement direction of a row of the circuit board units.
  • Fig. 38 shows the flow direction of the molding material in an embodiment of the present application.
  • the arrow direction represents the flow direction of the liquid molding flow. It can be seen that the flow direction is consistent with the arrangement direction of the circuit board units 2 in the same row, and is also consistent with the direction of the strip heat dissipation ribs 6.
  • the direction of the strip heat dissipation rib 6 can be understood as the direction of the axis of the strip heat dissipation rib 6.
  • FIG. 39 shows a schematic bottom view of the composite substrate panel obtained after the back molding is completed in an embodiment of the present application.
  • the back molding part 9 is attached to the second surface and fills the gaps between the plurality of parallel strip-shaped heat dissipation ribs 6.
  • Step S4000 cutting along the dividing line of the circuit board unit to obtain a single composite substrate.
  • FIG. 40 shows a schematic diagram of cutting composite substrate panels in an embodiment of the present application. The dotted line in the figure represents the cutting line.
  • the cutting can be mechanical knife cutting, laser cutting, or any other suitable cutting method.
  • the circuit board jigsaw, the back molding part and the strip heat dissipation ribs can be cut together to separate the single composite substrate.
  • FIG. 41A shows a three-dimensional schematic diagram of a single composite substrate manufactured based on the foregoing splicing board according to an embodiment of the present application.
  • Fig. 41B shows an exploded schematic diagram of Fig. 41A.
  • the composite substrate includes a circuit board 2 (in this embodiment, the circuit board 2 corresponds to the circuit board unit in the original panel), heat dissipation ribs 6 and back molding part 9 .
  • the circuit board 2 has a first surface and a second surface 2h opposite to the first surface, and has a first side surface 2d and a second side surface 2e opposite to the first side surface 2d, wherein the first surface It has a chip attaching area for attaching photosensitive chips.
  • the heat dissipation ribs 6 are arranged on the second surface 2h of the circuit board, at least a part of the heat dissipation ribs 6 is located in the area overlapping the chip attachment area, the heat dissipation ribs 6 are strip-shaped heat dissipation ribs, and the strips At least one end surface of the radiating rib extends to the first side surface 2d or the second side surface 2e.
  • the back molding part 9 is made on the second surface 2h by a molding process, and the bottom surface of the back molding part 9 is flush with the bottom surface of the heat dissipation rib 6 and forms a flat surface together (note that Figure 41A And Figure 41B placed the bottom face up). Further, at least one end surface 6a of the strip-shaped heat dissipation rib is a cut surface, and the cut surface is exposed on the side surface of the back molding part.
  • each strip-shaped heat dissipation rib may have only one end surface as a cutting surface.
  • a composite substrate unit is located in the middle area of the composite substrate panel, that is, the composite substrate unit is a composite substrate unit in the middle of the same row, then in the corresponding composite substrate that is cut out, two of each strip-shaped heat dissipation rib Both end surfaces 6a and 6b are cut surfaces (refer to Fig. 38B).
  • the strip-shaped heat dissipation rib has two end surfaces, and the two end surfaces 6a, 6b extend to the first side surface 2d and the second side surface respectively. Side 2e. Both end surfaces 6a and 6b are cutting surfaces.
  • the heat dissipation ribs 6 include a plurality of strip heat dissipation ribs, and the direction of the plurality of strip heat dissipation ribs is suitable for being between the plurality of strip heat dissipation ribs, and the strip heat dissipation ribs are used for the mold A flow channel for the molding flow is formed between the molds in the molding process.
  • the strip radiating ribs are linear strip radiating ribs.
  • a plurality of the linear strip-shaped heat dissipation ribs are arranged in parallel.
  • the injection direction of the molding flow in the molding process is a first direction from the first side surface 6a to the second side surface 6b, or a second direction opposite to the first direction.
  • the linear strip-shaped heat dissipation ribs may be parallel to the injection direction of the molding flow.
  • the circuit board further has a third side surface 2f perpendicular to the first side surface 2d, and a third side surface 2f opposite to the third side surface 2f.
  • the fourth side 2g The axis of the linear strip-shaped heat dissipation rib may be parallel to the third side surface 2f or the fourth side surface 2g, or the axis of the linear strip-shaped heat dissipation rib may be parallel to the third side surface 2f or the third side surface 2g.
  • the fourth side surface 2g has an included angle of 45 degrees or less.
  • the edge area of the second surface 2h along the third side surface 2f and the fourth side surface 2g may have a press-fit side for molding process.
  • the pressing edge is not shown in FIGS. 41A and 41B.
  • the pressing edge is the exposed edge area of the second surface, and the edge area is not covered by the back molding part 7.
  • the pressing edge is usually an area not covered by the molding part formed by the mold directly pressing on the second surface of the circuit board (that is, the surface that needs to be attached by the molding part) during the molding process.
  • the thermal conductivity of the material of the heat dissipation rib is 10-1000 watts/(m ⁇ degree).
  • the material of the heat dissipation ribs can be metal, metal alloy or thermal conductive silicone grease.
  • a method for manufacturing a photosensitive component may include: manufacturing a composite substrate according to the foregoing steps S1000-S4000;
  • Step S5000 attach the photosensitive chip to the corresponding chip attachment area, and electrically connect the photosensitive chip and the corresponding circuit board unit through a wire bonding process.
  • step S6000 a molded lens holder is mounted on the first surface of the circuit board unit, and the lens holder surrounds the photosensitive chip.
  • step S6000 can be replaced with step S6001.
  • a front molding part is formed on the first surface of the circuit board unit through a molding process, and the front molding part forms a light window around the photosensitive chip.
  • FIG. 42 shows a schematic front view of a photosensitive component panel in an embodiment of the present application.
  • the first surface of the circuit board jigsaw has completed the molding of the front molding part 9a.
  • the front molding part 9a forms a light window 9b around the photosensitive chip.
  • the front molding part 9a may be based on the MOC process or the MOB process.
  • the MOC process and the MOB process can refer to the foregoing description, and will not be repeated here.
  • step S4000 can be performed before step S5000 and step S6000 (or step S6001), that is, a single composite substrate is first cut out, and then a photosensitive component is manufactured based on the single composite substrate.
  • the aforementioned step S4000 can also be executed after step S5000 and step S6000 (or step S6001), that is, a photosensitive component panel is made based on the composite substrate panel first, and then a single photosensitive component is obtained by cutting.
  • the circuit board jigsaw, the back molding part, the strip-shaped heat dissipation ribs and the front molding part can be cut together to separate the single photosensitive Components. This solution of manufacturing the photosensitive component panel based on the composite substrate panel and then cutting it can help improve the production efficiency of the photosensitive component.
  • a photosensitive component made based on a mosaic, the photosensitive component including a composite substrate, a photosensitive chip and a metal wire.
  • the composite substrate is any composite substrate fabricated based on splicing boards in the foregoing.
  • the bottom surface of the photosensitive chip is attached to the chip attachment area of the composite substrate.
  • the metal wire electrically connects the photosensitive chip and the circuit board through a wire bonding process.
  • the photosensitive component may further include a front molding part, the front molding part being made on the first surface and surrounding the photosensitive chip to form a light window.
  • the photosensitive component may further include an electronic component, the electronic component is mounted on the first surface, and the front molding part wraps the electronic component.
  • the front molding part may contact the photosensitive chip and cover the edge area of the photosensitive chip, that is, it may be manufactured based on the MOC process.
  • the front molding part may also have a gap with the photosensitive chip, that is, it may be manufactured based on the MOB process.

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  • Engineering & Computer Science (AREA)
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  • Signal Processing (AREA)
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Abstract

La présente invention concerne un ensemble photosensible, comprenant une combinaison constituée d'une carte de circuit imprimé et d'une puce photosensible, et des nervures rayonnantes disposées sur le dos de la combinaison. Au moins une partie de chaque ailette rayonnante est située sur l'arrière de la puce photosensible ou située dans la région sur le dos de la carte de circuit imprimé qui chevauche la puce photosensible. La présente invention concerne également un module de caméra correspondant, un dispositif électronique, et un procédé de production pour l'ensemble photosensible. La présente invention permet d'éviter ou de supprimer la déformation de la puce photosensible au coût d'une taille d'espace relativement petite, et améliore la qualité d'imagerie du module de caméra.
PCT/CN2020/100163 2019-07-30 2020-07-03 Module de caméra, dispositif électronique, substrat composite, ensemble photosensible et procédé de production associé WO2021017752A1 (fr)

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
CN201921213523.9U CN210016540U (zh) 2019-07-30 2019-07-30 摄像模组、电子设备和感光组件
CN201921214519.4 2019-07-30
CN201921213522.4U CN210016539U (zh) 2019-07-30 2019-07-30 摄像模组、复合基板和感光组件
CN201910695388.4 2019-07-30
CN201910695388.4A CN112333350A (zh) 2019-07-30 2019-07-30 摄像模组、复合基板、感光组件及其制作方法
CN201910696414.5A CN112399030A (zh) 2019-07-30 2019-07-30 摄像模组、电子设备、感光组件及其制作方法
CN201921213522.4 2019-07-30
CN201910695386.5 2019-07-30
CN201921213523.9 2019-07-30
CN201910695386.5A CN112399029A (zh) 2019-07-30 2019-07-30 摄像模组、复合基板、感光组件及其制作方法
CN201921214519.4U CN210016541U (zh) 2019-07-30 2019-07-30 摄像模组、复合基板和感光组件
CN201910696414.5 2019-07-30

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JP2018073957A (ja) * 2016-10-27 2018-05-10 京セラ株式会社 発熱体収容モジュール、撮像装置、及び移動体
CN209046749U (zh) * 2018-11-30 2019-06-28 南昌欧菲光电技术有限公司 电路板、感光组件、摄像模组及智能终端
CN210016539U (zh) * 2019-07-30 2020-02-04 宁波舜宇光电信息有限公司 摄像模组、复合基板和感光组件
CN210016541U (zh) * 2019-07-30 2020-02-04 宁波舜宇光电信息有限公司 摄像模组、复合基板和感光组件
CN210016540U (zh) * 2019-07-30 2020-02-04 宁波舜宇光电信息有限公司 摄像模组、电子设备和感光组件

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CN104967767A (zh) * 2015-07-03 2015-10-07 南昌欧菲光电技术有限公司 摄像模组及摄像装置
JP2018073957A (ja) * 2016-10-27 2018-05-10 京セラ株式会社 発熱体収容モジュール、撮像装置、及び移動体
CN207251755U (zh) * 2016-12-23 2018-04-17 宁波舜宇光电信息有限公司 电路板组件和摄像模组以及带有摄像模组的电子设备
CN209046749U (zh) * 2018-11-30 2019-06-28 南昌欧菲光电技术有限公司 电路板、感光组件、摄像模组及智能终端
CN210016539U (zh) * 2019-07-30 2020-02-04 宁波舜宇光电信息有限公司 摄像模组、复合基板和感光组件
CN210016541U (zh) * 2019-07-30 2020-02-04 宁波舜宇光电信息有限公司 摄像模组、复合基板和感光组件
CN210016540U (zh) * 2019-07-30 2020-02-04 宁波舜宇光电信息有限公司 摄像模组、电子设备和感光组件

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