WO2021139510A1 - Ensemble puce photosensible, module de camera, et dispositif terminal - Google Patents

Ensemble puce photosensible, module de camera, et dispositif terminal Download PDF

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Publication number
WO2021139510A1
WO2021139510A1 PCT/CN2020/137753 CN2020137753W WO2021139510A1 WO 2021139510 A1 WO2021139510 A1 WO 2021139510A1 CN 2020137753 W CN2020137753 W CN 2020137753W WO 2021139510 A1 WO2021139510 A1 WO 2021139510A1
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WO
WIPO (PCT)
Prior art keywords
photosensitive chip
chip assembly
photosensitive
film
stress
Prior art date
Application number
PCT/CN2020/137753
Other languages
English (en)
Chinese (zh)
Inventor
蒋恒
孟楠
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202010028337.9A external-priority patent/CN113132586B/zh
Priority claimed from CN202010027889.8A external-priority patent/CN113114874B/zh
Priority claimed from CN202010027860.XA external-priority patent/CN113132585B/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to CN202080093815.2A priority Critical patent/CN115336245A/zh
Publication of WO2021139510A1 publication Critical patent/WO2021139510A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)

Abstract

La présente invention concerne un ensemble puce photosensible, un module de camera, et un dispositif terminal. L'ensemble puce comprend : une puce photosensible, comprenant un substrat, une région active située sur le substrat, et un réseau de microlentilles situé sur ladite région active ; une couche de contrainte, disposée sur le côté arrière de la puce photosensible, de telle sorte que la puce photosensible est déformée vers le substrat de la puce photosensible. Au moyen de l'agencement d'une couche de contrainte sur le dos d'une puce photosensible classique, la direction et le degré de courbure de la puce photosensible sont commandés, ce qui permet de commander la courbure de champ de la puce photosensible, amenant ainsi la direction de courbure de la puce photosensible à être cohérente avec la direction de courbure de champ de la lentille, ce qui permet d'améliorer la clarté de l'imagerie.
PCT/CN2020/137753 2020-01-10 2020-12-18 Ensemble puce photosensible, module de camera, et dispositif terminal WO2021139510A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202080093815.2A CN115336245A (zh) 2020-01-10 2020-12-18 感光芯片组件、摄像模组及终端设备

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN202010027889.8 2020-01-10
CN202010028337.9A CN113132586B (zh) 2020-01-10 2020-01-10 感光芯片组件、摄像模组及电子设备
CN202010027889.8A CN113114874B (zh) 2020-01-10 2020-01-10 感光芯片组件、摄像模组及终端设备
CN202010028337.9 2020-01-10
CN202010027860.X 2020-01-10
CN202010027860.XA CN113132585B (zh) 2020-01-10 2020-01-10 感光芯片组件、移动终端、摄像模组及其制备方法

Publications (1)

Publication Number Publication Date
WO2021139510A1 true WO2021139510A1 (fr) 2021-07-15

Family

ID=76787721

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/137753 WO2021139510A1 (fr) 2020-01-10 2020-12-18 Ensemble puce photosensible, module de camera, et dispositif terminal

Country Status (2)

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CN (1) CN115336245A (fr)
WO (1) WO2021139510A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030162368A1 (en) * 2002-02-25 2003-08-28 Connell Michael E. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as a die attach adhesive
CN101047195A (zh) * 2006-03-29 2007-10-03 松下电器产业株式会社 半导体摄像装置及其制造方法
CN105810557A (zh) * 2014-12-31 2016-07-27 格科微电子（上海）有限公司 半导体晶圆及其整平方法和封装方法
CN108649040A (zh) * 2018-03-12 2018-10-12 宁波舜宇光电信息有限公司 一种摄像模组的芯片贴装工艺以及摄像模组

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101285921A (zh) * 2007-04-13 2008-10-15 鸿富锦精密工业（深圳）有限公司 成像模组
CN109510924A (zh) * 2017-09-15 2019-03-22 南昌欧菲光电技术有限公司 摄像模组及其感光组件
CN208638447U (zh) * 2018-06-29 2019-03-22 宁波舜宇光电信息有限公司 线路板组件、感光组件及摄像模组
CN208940069U (zh) * 2018-10-15 2019-06-04 信利光电股份有限公司 一种新型超薄摄像模组
CN109451205A (zh) * 2018-10-15 2019-03-08 信利光电股份有限公司 一种新型摄像模组

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030162368A1 (en) * 2002-02-25 2003-08-28 Connell Michael E. Wafer back side coating to balance stress from passivation layer on front of wafer and be used as a die attach adhesive
CN101047195A (zh) * 2006-03-29 2007-10-03 松下电器产业株式会社 半导体摄像装置及其制造方法
CN105810557A (zh) * 2014-12-31 2016-07-27 格科微电子（上海）有限公司 半导体晶圆及其整平方法和封装方法
CN108649040A (zh) * 2018-03-12 2018-10-12 宁波舜宇光电信息有限公司 一种摄像模组的芯片贴装工艺以及摄像模组

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Publication number Publication date
CN115336245A (zh) 2022-11-11

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