CN112188043A - Chip packaging structure, camera module and electronic equipment - Google Patents
Chip packaging structure, camera module and electronic equipment Download PDFInfo
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- CN112188043A CN112188043A CN201910601094.0A CN201910601094A CN112188043A CN 112188043 A CN112188043 A CN 112188043A CN 201910601094 A CN201910601094 A CN 201910601094A CN 112188043 A CN112188043 A CN 112188043A
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- chip
- circuit board
- photosensitive chip
- reinforcing plate
- lens
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Abstract
The embodiment of the invention provides a chip packaging structure, a camera module and electronic equipment, wherein the chip packaging structure comprises a reinforcing plate, a circuit board, a photosensitive chip and a packaging layer, the circuit board is arranged on the reinforcing plate, the circuit board is provided with an opening and forms a hollow space, the photosensitive chip is arranged on the reinforcing plate and is accommodated in the hollow space, the circuit board is electrically connected with the photosensitive chip through a lead, the packaging layer is stacked on the circuit board, the lead, the circuit board and the photosensitive chip so as to package the reinforcing plate, the circuit board, the photosensitive chip and the lead into a whole, the packaging layer is provided with a through hole so as to expose a photosensitive surface of the photosensitive chip, the top of the packaging layer, which is back to the reinforcing plate, is used for arranging a lens, and light rays are emitted through the lens and are transmitted to the photosensitive chip. Through regarding the stiffening plate as the support basis, the sensitization chip holding is in the fretwork space of circuit board, and the encapsulation layer encapsulates for chip package structure's whole thickness size reduces.
Description
Technical Field
The invention belongs to the technical field of cameras, and particularly relates to a chip packaging structure, a camera module and electronic equipment.
Background
One of the development trends of mobile terminals such as smart phones is thin thickness, and with the development of technology, the thickness of a camera module becomes a main factor that restricts the thickness of the mobile terminal from becoming thinner. The camera module generally includes a lens, a support, a circuit board, a photosensitive chip, and an optical filter, where the circuit board is used as a supporting base, the support and the photosensitive chip are disposed on the circuit board, and the lens and the optical filter are disposed on the support.
The thickness of the whole camera module is the sum of the thickness from the circuit board to the support and the thickness of the lens, and the thickness from the circuit board to the support is an improvement direction because the lens is difficult to be thinned further. The prior art has achieved the best structure by various means, which has reduced the thickness from the circuit board to the bracket to 0.71mm, and cannot further reduce the thickness.
Disclosure of Invention
The invention aims to provide a chip packaging structure, a camera module and electronic equipment, which can further reduce the thickness of the camera module.
In order to realize the purpose of the invention, the invention provides the following technical scheme:
in a first aspect, an embodiment of the present invention provides a chip package structure, including a stiffener, a circuit board, a photosensitive chip, and a package layer, where the circuit board is disposed on the stiffener, the circuit board is provided with an opening and forms a hollow space, the photosensitive chip is arranged on the reinforcing plate, and is accommodated in the hollow space, the circuit board is electrically connected with the photosensitive chip through a lead wire, the package layer is laminated on the reinforcing plate, the leads, the circuit board and the photosensitive chip, so as to package the reinforcing plate, the circuit board, the photosensitive chip and the lead into a whole, the packaging layer is provided with a through hole, the light-sensitive surface of the light-sensitive chip is exposed, the packaging layer faces back to the top of the reinforcing plate and is used for arranging a lens, and light rays are emitted into the lens and transmitted to the light-sensitive chip through the through hole of the packaging layer.
Through regarding the stiffening plate as supporting basis, circuit board and sensitization chip set up on the stiffening plate, and the fretwork space is established to the circuit board to with sensitization chip holding in the fretwork space, make chip packaging structure's whole thickness size reduce.
The circuit board is also provided with an electric device, and the electric device is embedded in the packaging layer; in the direction perpendicular to the surface of the reinforcing plate, the orthographic projection of the electric device on the reinforcing plate and the orthographic projection of the lens on the reinforcing plate are staggered.
By moving the electric device outwards, namely the orthographic projection of the electric device on the reinforcing plate and the orthographic projection of the lens on the reinforcing plate are staggered and do not coincide, components required to be arranged and overlapped with the orthographic projection of the lens in the Z direction are reduced, and therefore the thickness is reduced.
Wherein, the through-hole of packaging layer includes from keeping away from one side of sensitization chip is close to the direction of sensitization chip is first through-hole portion and the second through-hole portion that form in proper order, the cross section of second through-hole portion is less than the cross section of first through-hole portion is in order to form first ladder, the camera lens sets up on the first ladder, electric device is located the first through-hole portion outside.
Through setting up first ladder, set up the encapsulation layer on first ladder, can reduce the thickness of camera module.
The chip packaging structure further comprises an optical filter, the optical filter is arranged on one side, back to the reinforcing plate, of the photosensitive chip and is opposite to the photosensitive chip, the optical filter is located in the hollow space, and a gap is formed between the optical filter and the photosensitive chip.
A gap is arranged between the optical filter and the photosensitive chip, so that the optical filter has an interval with the photosensitive chip no matter the optical filter reflects or absorbs infrared light, and the infrared light is prevented from directly contacting with the photosensitive chip and entering the photosensitive chip.
The end part of the optical filter is glued on the photosensitive chip, the first ladder is laminated on the optical filter, and the optical filter is exposed out of the through hole of the packaging layer, so that the optical filter is closer to the reinforcing plate, namely the height of the first ladder is reduced, and the thickness of the camera module can be thinner.
The through hole further comprises a third through hole part, one end of the third through hole part is connected to the second through hole part, the cross section of the third through hole part is smaller than that of the second through hole part so as to form a second step, the other end of the third through hole part is adjacent to the photosensitive chip, and the optical filter is arranged on the second step.
Wherein, in the direction perpendicular to the reinforcing plate face, the size of clearance is 0.02mm-0.1 mm.
The circuit board is a flexible circuit board, and the reinforcing plate is a metal sheet.
The packaging layer is also stacked on the reinforcing plate at the interval between the photosensitive chip and the circuit board so as to embed the lead in the packaging layer to package the lead.
The photosensitive chip is fixed between the reinforcing plates and the lens and the packaging layer through gluing.
In a second aspect, an embodiment of the present invention further provides a camera module, including a lens and the chip package structure described in any of the various embodiments of the first aspect, where the lens is disposed on a package layer of the chip package structure. Because chip package structure thickness attenuate can make the holistic thickness attenuate of camera module.
In a third aspect, an embodiment of the present invention further provides an electronic device, which includes a housing and the camera module in the second aspect, where the camera module is disposed in the housing. Because the thickness of camera module is thin, can be so that electronic equipment's thickness is thin.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic cross-sectional structure diagram of a camera module according to an embodiment;
FIG. 2 is a schematic diagram of a planar structure of a circuit board according to an embodiment;
FIG. 3 is a partial cross-sectional structural schematic view of FIG. 1 except for a lens;
FIG. 4 is a schematic cross-sectional view of a camera module according to an embodiment;
fig. 5 is a partial sectional structure view of fig. 4 except for a lens.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The embodiment of the invention provides electronic equipment, taking a smart phone as an example, which comprises a shell, a display screen and a camera module, wherein the camera module is provided by the embodiment of the invention, and the display screen and the camera module are both arranged in the shell. Because the thickness of camera module is thin, can be so that electronic equipment's thickness is thin. The electronic device may be a smartphone, a Personal Digital Assistant (PDA), a laptop, a wearable device, or the like.
Referring to fig. 1, an embodiment of the invention provides a camera module, which includes a lens 60 and a chip package structure provided in an embodiment of the invention, wherein the lens 60 is disposed on a package layer 40 of the chip package structure. The lens 60 includes a plurality of lenses for receiving light and projecting the light into the photo sensor chip 20 to form an image. A voice coil motor may be further disposed at the periphery or below the lens 60 to realize an anti-shake or focusing function. Because chip package structure thickness attenuate can make the holistic thickness attenuate of camera module.
Specifically, the chip package structure includes a stiffener 10, a photosensitive chip 20, a circuit board 30, and a package layer 40. The reinforcing plate 10 is a metal sheet, specifically a steel sheet or a copper sheet, and is used as a structural foundation to support other structures. The light sensing chip 20 is a CMOS or CCD sensor for receiving light and converting it into an electrical signal to form an image. The circuit board 30 is preferably a flexible circuit board (FPC), which is thinner. In other embodiments, the circuit board 30 may also be a Printed Circuit Board (PCB). The circuit board 30 is used for providing and transmitting electrical signals, and an ISP (Image Signal Processor) may be further disposed on the circuit board 30 for processing the electrical signals input by the photosensitive chip 20 and forming an Image. The encapsulating layer 40 is used to encapsulate the reinforcing plate 10, the circuit board 30, the leads 31, and the photosensitive chip 20 as a whole. In addition, encapsulation layer 40 may also provide support, i.e., support for lens 60. The material of the encapsulation layer 40 is preferably EMC (epoxy Molding compound), that is, epoxy Molding compound and epoxy Molding compound, wherein EMC is a powdered Molding compound prepared by mixing epoxy resin as a matrix resin, high-performance phenolic resin as a curing agent, silica powder and the like as fillers, and a plurality of additives. The plastic package process is to extrude EMC into the mold cavity by a transfer molding method and embed the semiconductor chip therein, and simultaneously to crosslink, solidify and mold to form the semiconductor device with a certain structural shape. .
Referring to fig. 1 and 2, the circuit board 30 may be disposed on the reinforcing plate 10 by adhesive bonding. The circuit board 30 is opened to form a hollow space 35, and the shape of the hollow space 35 may correspond to the shape of the photosensitive chip 20, such as a rectangle or a circle. The photosensitive chip 20 can be disposed on the reinforcing plate 10 by gluing, and the photosensitive chip 20 is accommodated in the hollow space 35. The circuit board 30 and the photosensitive chip 20 are electrically connected by a lead 31, and the lead 31 may be a gold wire, a silver wire, a copper wire, or the like. The two ends of the lead 31 are respectively connected to the opposite ends of the circuit board 30 and the photosensitive chip 20, for example: may be attached to the upper surface or the opposite end surfaces of the opposite ends of the circuit board 30 and the photosensitive chip 20, and the number may be 1 or more, as shown in fig. 1 by 2.
The packaging layer 40 is stacked on the stiffener 10, the lead 31, the circuit board 30 and the photo sensor chip 20, and the packaging layer 40 is provided with a through hole to expose the photo sensing surface of the photo sensor chip 20. Specifically, the encapsulation layer 40 may be in the shape of a ring with a through hole opened in the middle, and is stacked near the opposite ends of the photosensitive chip 20 and the circuit board 30. The lens 60 can be disposed on the package layer 40 by adhesive bonding, and light is incident through the lens 60 and transmitted to the photosensitive chip 20 through the through hole of the package layer 40.
Specifically, the first adhesive layer 71 having a uniform thickness is disposed between the photosensitive chip 20 and the reinforcing plate 10, and the first adhesive layer 71 may be, for example, a conductive adhesive or a thermal conductive adhesive. The first adhesive layer 71 may be disposed only between the photosensitive chip 20 and the reinforcing plate 10, or may cover the entire surface of the reinforcing plate 10, so that the circuit board 30 is also connected and fixed to the reinforcing plate 10 through the first adhesive layer 71.
A third adhesive layer 73 may be disposed between the lens 60 and the package layer 40, the third adhesive layer 73 may be in a ring shape and may be made of aa (active alignment) adhesive for connecting and fixing with a lens barrel (not shown) of the lens 60. The lens barrel is provided with a plurality of lenses. When the lens 60 is provided with a voice coil motor at the periphery thereof, the third adhesive layer 73 is fixedly connected to the voice coil motor, so that the lens 60 can move under the driving of the voice coil motor.
The size of the hollow space 35 is slightly larger than that of the photosensitive chip 20, and when the photosensitive chip 20 is accommodated in the hollow space 35, the periphery of the photosensitive chip 20 is spaced from the inner wall of the circuit board 30 corresponding to the hollow space 35. The encapsulating layer 40 is also laminated on the reinforcing plate 10 at the space to embed the lead 31 in the encapsulating layer 40 to encapsulate the lead 31.
As can be seen from the above description, compared with the scheme of disposing the bracket and the photosensitive chip on the circuit board in the prior art, the present invention uses the reinforcing plate 10 as the supporting base, the circuit board 30 and the photosensitive chip 20 are disposed on the reinforcing plate 10, the circuit board 30 is provided with the hollow space 35, and the photosensitive chip 20 is accommodated in the hollow space 35, and is packaged by using the packaging layer 40, so that the overall thickness and size of the chip packaging structure are reduced. And then the lens 60 is arranged on the packaging layer 40, so that the overall thickness of the camera module is reduced. With reference to fig. 1 and 3, the overall thickness of the camera module refers to the overall dimension of the camera module in the direction perpendicular to the plate surface of the reinforcing plate 10 (i.e., the Z direction), i.e., the sum of the total thickness H1 of the reinforcing plate 10 and the encapsulation layer 40 and the total thickness H2 of the lens 60 and the third adhesive layer 73.
Referring to fig. 1, the circuit board 30 is further provided with an electrical device, and the electrical device is embedded in the package layer 40. The number of electrical devices is not limited and may be 1 and more, as shown in fig. 1 for 2 electrical devices 32, 33. The electrical device can be a resistor, a capacitor, an inductor and other components and is used for realizing various functions of the circuit.
In a direction perpendicular to the plate surface of the reinforcing plate 10 (i.e., the Z direction), an orthogonal projection of the electrical component on the reinforcing plate 10 and an orthogonal projection of the lens 60 on the reinforcing plate 10 are offset from each other and do not overlap with each other. The misaligned state is that the electrical device is located outside the lens 60 in a direction away from the middle.
The prior art is that the sensitization chip sets up on the circuit board usually, and electric device sets up on the circuit board, and on the Z direction, the orthographic projection of electric device on the stiffening plate coincides with the orthographic projection of camera lens on the stiffening plate to camera module in the Z direction needs to set up circuit board, electric device and camera lens, and the size of camera module is hardly reduced. The invention reduces the components required to be arranged and overlapped with the orthographic projection of the lens 60 in the Z direction by moving the electric device outwards, namely, the orthographic projection of the electric device on the reinforcing plate 10 and the orthographic projection of the lens 60 on the reinforcing plate 10 are staggered and do not coincide, thereby reducing the thickness.
Referring to fig. 1 and 2, the thickness of the camera module is reduced by moving the electrical device outward to transfer the thickness dimension in the Z direction to the length X or width Y direction of the plane of the circuit board 30. Here, when the condition "in the direction perpendicular to the plate surface of the reinforcing plate 10 (i.e., the Z direction), the orthographic projection of the electrical component on the reinforcing plate 10 and the orthographic projection of the lens 60 on the reinforcing plate 10 are shifted from each other so as not to overlap" is satisfied, the electrical component may be arbitrarily set. For example, the embodiment shown in fig. 2 is that the electrical devices 32, 33 are respectively disposed on the circuit board 30 at two opposite ends of the hollow space 35. It can be understood that when the number of the electrical devices is 1, the electrical devices can be arranged at any position of the circuit board 30, when the number of the electrical devices is 2, the electrical devices can also be arranged on the circuit board 30 at two adjacent ends of the hollow space, and the number of the electrical devices is similar to that when the number of the electrical devices is more than 2, and is not described again.
Further, referring to fig. 1 and 3, the through hole of the encapsulation layer 40 includes a first through hole portion and a second through hole portion sequentially formed from a side away from the photosensitive chip 20 to a direction close to the photosensitive chip 20, and a cross section of the second through hole portion is smaller than a cross section of the first through hole portion to form the first step 42. The lens 60 is disposed on the first step 42, and the electric device is located outside the first through hole portion. By providing the first step 42 and disposing the lens 60 on the first step 42, the thickness of the camera module can be reduced. The annular structure of the package layer 40 includes an inner side and an outer side, wherein the inner side is close to the photosensitive chip 20, and the outer side is far away from the photosensitive chip 20. The encapsulation layer 40 further includes a top portion 41 on the outer side, and the first step 42 is recessed in the direction (Z direction) of the reinforcing plate 10 with respect to the top portion 41 due to the provision of the first through hole portion. In an orthographic projection perpendicular to the plate surface direction of the reinforcing plate 10, the top portion 41 covers the electric device, and the first step 42 is located outside the first through hole portion and is offset from and does not overlap the electric device. Referring to fig. 3, a distance H1 from the bottom surface of the reinforcing plate 10 to the surface of the first step 42 is smaller than a distance H3 to the surface of the top portion 41. Referring to fig. 1, the total thickness of the camera module is the sum of the distance H1 from the bottom surface of the reinforcing plate 10 to the surface of the first step 42 and the total thickness H2 of the lens 60 and the third adhesive layer 73. The perpendicular distance H5 from the surface of the circuit board 30 facing away from the reinforcing plate 10 to the surface of the first step 42 is preferably smaller than the dimension of the electrical component in the direction Z perpendicular to the plate surface of the reinforcing plate 10, so as to reduce the distance H1 from the bottom surface of the reinforcing plate 10 to the surface of the first step 42 as much as possible, thereby reducing the camera module thickness.
In an embodiment, referring to fig. 1 to 3, the camera module further includes a filter 50. The filter 50 is disposed on a side of the photosensitive chip 20 opposite to the reinforcing plate 10 and opposite to the photosensitive chip 20. The optical filter 50 is located in the hollow space 35, and a gap H4 is formed between the optical filter 50 and the light sensing chip 20. The optical filter 50 may be an infrared light filter, which may be a reflective or absorptive optical filter, and is configured to filter infrared light, so that light entering the photosensitive chip 20 is visible light, and the infrared light is prevented from affecting imaging quality. In other embodiments, the filter 50 may also be a filter corresponding to light in other wavelength bands, which is not limited in this embodiment. The gap H4 is provided between the filter 50 and the photosensitive chip 20, so that the filter 50 has a gap with the photosensitive chip 20 no matter the filter reflects or absorbs infrared light, thereby preventing infrared light from entering the photosensitive chip 20 due to direct contact between the filter and the photosensitive chip. Wherein the size of the gap H4 is 0.02mm-0.1 mm.
Furthermore, two opposite ends or four peripheral ends of the optical filter 50 are bonded to the photosensitive chip 20 by a second adhesive layer 72, and the first step 42 is stacked on the optical filter 50. Since the filter 50 is directly bonded to the photo sensor chip 20, the gap H4 is preferably 0.02mm to 0.05mm, such as 0.02mm, 0.03mm, 0.04mm, 0.05mm, which is also called gmp (glass molding package), that is, the filter 50 and the photo sensor chip 20 are both encapsulated in the encapsulation layer 40. In this way, the filter 50 is closer to the reinforcing plate 10, that is, the height of the first step 42 is reduced, so that the thickness of the camera module can be thinner. In this embodiment, since the distance between the optical filter 50 and the photosensitive chip 20 is short, the optical filter 50 is required to have a better performance, specifically, the requirement for the coating on the optical filter 50 is high, so as to avoid the defect of the coating from affecting the imaging of the photosensitive chip 20.
In another embodiment, please refer to fig. 4 and 5, which are substantially the same as the previous embodiment, except that the through hole of the encapsulation layer 40 further includes a third through hole portion having one end connected to the second through hole portion, the cross section of the third through hole portion is smaller than that of the second through hole portion to form a second step 43, the other end of the third through hole portion is opposite to the photosensitive chip 20, and the optical filter 50 is bonded on the second step 43 through the second adhesive layer 43. Compared to the previous embodiment, in the present embodiment, the optical filter 50 is disposed on the second step 43, the gap H4 is preferably 0.05mm to 0.1mm, such as 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, and the like, which is also called cmp (chip molding package), that is, the photosensitive chip 20 is encapsulated in the encapsulation layer 40, and the optical filter 50 is disposed outside the encapsulation layer 40. In this manner, the distance between the filter 50 and the reinforcing plate 10 is slightly longer, and considering the degree of concavity of the second step 43 in the direction perpendicular to the plate surface of the reinforcing plate 10 (Z direction) and the thickness dimension of the filter 50 in the direction perpendicular to the plate surface of the reinforcing plate 10, the surface of the first step 42 can be set to be substantially flush with the surface of the filter 50 facing away from the reinforcing plate 10, so as to avoid interference between the filter 50 and the lens 60, and this manner can also make the thickness of the camera module thinner. In this embodiment, since the distance between the optical filter 50 and the photosensitive chip 20 is slightly long, the performance requirement on the optical filter 50 is low, the processing difficulty and the production cost can be reduced, and the photosensitive chip 20 can have a good heat dissipation space, thereby improving the heat dissipation performance.
The distance H6 between the surface of the photosensitive chip 20 facing away from the stiffener 10 and the surface of the second step 43 is preferably as small as possible, but considering that the encapsulating layer 40 needs to completely encapsulate the lead 31, the size of H6 may be 0.19mm or more.
The thickness reduction of the camera module according to the present invention will be described below by taking the specific product size as an example, and the thickness in the following description refers to the size in the direction Z perpendicular to the plate surface of the reinforcing plate 10.
The thickness of the reinforcing plate 10 is 0.1mm to 0.15mm, the thickness of 0.1mm when a steel sheet is used, the thickness of 0.15mm when a copper sheet is used, the thickness of the first adhesive layer 71 is 0.04mm, the thickness of the photosensitive chip 20 is 0.15mm, the thickness of the gap H4 between the optical filter 50 and the photosensitive chip 20 is 0.02mm to 0.1mm, the thickness of the second adhesive layer 72 is 0.02mm, the thickness of the optical filter 50 is 0.1mm, the thickness of the circuit board 30 is 0.12mm, the thickness of the electrical device is 0.3mm, the thickness H1 from the bottom surface of the reinforcing plate 10 to the surface of the first step 42 is 0.45mm to 0.5mm, the thickness H3 from the bottom surface of the reinforcing plate 10 to the surface of the top portion 41 is 0.67mm to 0.72mm, the thickness H6 from the surface of the photosensitive chip 20 facing away from the reinforcing plate 10 to the surface of the second step 43 is 0.19mm, the thickness of the third adhesive layer 73 mm, the same as the thickness of the conventional lens, and the size of the second step is different from that of the conventional, the thickness of the invention is not changed in the scheme.
The total thickness of camera module is H1+ H2, because H2 is unchangeable, H1 is 0.45mm-0.5mm, and prior art H1 is 0.71mm, consequently, compares in prior art, can attenuate 0.21mm at least, the effectual thickness that thins the camera module.
With respect to the thickness of the stacked region of the photosensitive chips 20, the total thickness from the bottom surface of the reinforcing plate 10 to the surface of the optical filter 50 facing away from the reinforcing plate 10 is 0.47mm to 0.52mm, as can be obtained by adding the above parameters.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A chip packaging structure is characterized by comprising a reinforcing plate, a circuit board, a photosensitive chip and a packaging layer, wherein the circuit board is arranged on the reinforcing plate, the circuit board is provided with an opening and forms a hollow space, the photosensitive chip is arranged on the reinforcing plate, the photosensitive chip is accommodated in the hollow space, the circuit board is electrically connected with the photosensitive chip through a lead wire, the package layer is laminated on the reinforcing plate, the leads, the circuit board and the photosensitive chip, so as to package the reinforcing plate, the circuit board, the photosensitive chip and the lead into a whole, the packaging layer is provided with a through hole, the light-sensitive surface of the light-sensitive chip is exposed, the packaging layer faces back to the top of the reinforcing plate and is used for arranging a lens, and light rays are emitted into the lens and transmitted to the light-sensitive chip through the through hole of the packaging layer.
2. The chip package structure according to claim 1, wherein an electrical device is further disposed on the circuit board, and the electrical device is embedded in the package layer; in the direction perpendicular to the surface of the reinforcing plate, the orthographic projection of the electric device on the reinforcing plate and the orthographic projection of the lens on the reinforcing plate are staggered.
3. The chip packaging structure according to claim 2, wherein the through hole of the packaging layer includes a first through hole portion and a second through hole portion formed in this order from a side away from the photosensitive chip toward a side close to the photosensitive chip, a cross section of the second through hole portion is smaller than a cross section of the first through hole portion to form a first step, the lens is disposed on the first step, and the electric device is located outside the first through hole portion.
4. The chip package structure of claim 3, further comprising an optical filter, wherein the optical filter is disposed on a side of the photosensitive chip opposite to the stiffener and opposite to the photosensitive chip, the optical filter is located in the hollow space, and a gap is formed between the optical filter and the photosensitive chip.
5. The chip package structure according to claim 4, wherein the optical filter is bonded to the photosensitive chip, the first step is stacked on the optical filter, and the optical filter is exposed through the through hole of the package layer.
6. The chip packaging structure according to claim 4, wherein the through hole further includes a third through hole portion having one end connected to the second through hole portion, the third through hole portion having a smaller cross section than the second through hole portion to form a second step, the other end of the third through hole portion being adjacent to the photosensitive chip, the optical filter being disposed on the second step.
7. The chip package structure according to claim 4, wherein the gap has a size of 0.02mm to 0.1mm in a direction perpendicular to the plane of the stiffener.
8. The chip package structure according to claim 1, wherein a space is provided between the photosensitive chip and the end portion of the circuit board opposite to the photosensitive chip in the hollow space, and the package layer is further stacked on the stiffener at the space between the photosensitive chip and the circuit board to embed the lead in the package layer.
9. A camera module, comprising a lens and the chip package structure according to any one of claims 1 to 8, wherein the lens is disposed on an encapsulation layer of the chip package structure.
10. An electronic device comprising a housing and the camera module of claim 9, the camera module disposed within the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201910601094.0A CN112188043A (en) | 2019-07-04 | 2019-07-04 | Chip packaging structure, camera module and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910601094.0A CN112188043A (en) | 2019-07-04 | 2019-07-04 | Chip packaging structure, camera module and electronic equipment |
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| CN112188043A true CN112188043A (en) | 2021-01-05 |
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| CN201910601094.0A Pending CN112188043A (en) | 2019-07-04 | 2019-07-04 | Chip packaging structure, camera module and electronic equipment |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113079291A (en) * | 2021-03-29 | 2021-07-06 | 南昌欧菲光电技术有限公司 | Chip packaging structure, processing method, camera module and electronic equipment |
| CN114339000A (en) * | 2021-12-31 | 2022-04-12 | 昆山丘钛微电子科技股份有限公司 | Camera module and preparation method thereof |
| CN115278020A (en) * | 2022-07-27 | 2022-11-01 | 维沃移动通信有限公司 | Camera module and electronic equipment |
| WO2023227048A1 (en) * | 2022-05-27 | 2023-11-30 | 华为技术有限公司 | Camera assembly, manufacturing method for camera assembly, and electronic device |
| CN114339000B (en) * | 2021-12-31 | 2024-04-23 | 昆山丘钛微电子科技股份有限公司 | Camera module and preparation method |
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2019
- 2019-07-04 CN CN201910601094.0A patent/CN112188043A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113079291A (en) * | 2021-03-29 | 2021-07-06 | 南昌欧菲光电技术有限公司 | Chip packaging structure, processing method, camera module and electronic equipment |
| CN114339000A (en) * | 2021-12-31 | 2022-04-12 | 昆山丘钛微电子科技股份有限公司 | Camera module and preparation method thereof |
| CN114339000B (en) * | 2021-12-31 | 2024-04-23 | 昆山丘钛微电子科技股份有限公司 | Camera module and preparation method |
| WO2023227048A1 (en) * | 2022-05-27 | 2023-11-30 | 华为技术有限公司 | Camera assembly, manufacturing method for camera assembly, and electronic device |
| CN115278020A (en) * | 2022-07-27 | 2022-11-01 | 维沃移动通信有限公司 | Camera module and electronic equipment |
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Address after: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Applicant before: OFilm Microelectronics Technology Co.,Ltd. |
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Application publication date: 20210105 |