CN113079291A - Chip packaging structure, processing method, camera module and electronic equipment - Google Patents
Chip packaging structure, processing method, camera module and electronic equipment Download PDFInfo
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- CN113079291A CN113079291A CN202110334552.6A CN202110334552A CN113079291A CN 113079291 A CN113079291 A CN 113079291A CN 202110334552 A CN202110334552 A CN 202110334552A CN 113079291 A CN113079291 A CN 113079291A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The embodiment of the application discloses a chip packaging structure, a processing method, a camera module and electronic equipment, wherein the camera module comprises a circuit board; the photosensitive element is arranged on one side of the circuit board and is electrically connected with the circuit board; the optical packaging element and the photosensitive element are located on the same side of the circuit board, the optical packaging element covers the photosensitive element and is connected with the circuit board, and the optical packaging element has a refractive power. This application embodiment has the optics encapsulation component of refracting power through setting up, when realizing that photosensitive element normally works, can protect photosensitive element, prevents to damage, and then the influence realizes camera module and electronic equipment's function.
Description
Technical Field
The application relates to the technical field of cameras, in particular to a chip packaging structure, a processing method, a camera module and electronic equipment.
Background
With the development of science and technology, people have higher and higher requirements on the quality of products, for example, people have higher requirements on camera modules of electronic equipment. The camera module generally includes a photosensitive element for processing light and a circuit board, and the photosensitive element is generally mounted on the circuit board by matching glue with a pressing force, however, the pressing force easily causes damage to the photosensitive element, and the glue easily overflows to affect the normal operation of the photosensitive element.
Disclosure of Invention
The embodiment of the application provides a chip packaging structure, camera module and electronic equipment, can protect photosensitive element, realizes photosensitive element's normal work under the circumstances of guaranteeing that photosensitive element does not damage.
In a first aspect, an embodiment of the present application provides a chip package structure, including a circuit board; the photosensitive element is arranged on one side of the circuit board and is electrically connected with the circuit board; the optical packaging element and the photosensitive element are located on the same side of the circuit board, the optical packaging element covers the photosensitive element and is connected with the circuit board, and the optical packaging element has a refractive power.
Based on the embodiment of the application: through the optical packaging element with the refractive power, the photosensitive element is covered, the normal work of the photosensitive element is not influenced while the photosensitive element is protected, the structure is simple, the production and processing efficiency can be improved, and the damage rate of the photosensitive element is reduced.
In some of these embodiments, the optical package element comprises: the optical part is positioned on one side of the photosensitive element, which is far away from the circuit board, and can perform optical treatment on light reaching the photosensitive element; and the non-optical part is positioned on the periphery of the optical part and is connected with the circuit board.
Based on the above embodiment: the optical packaging element comprises an optical part and a non-optical part, wherein the optical part corresponds to the photosensitive element and can perform optical processing on light reaching the photosensitive element; the non-optical part is positioned at the periphery of the optical part and connected with the circuit board, so that the optical part at the inner side can be protected, and the normal work of the photosensitive element is further realized.
In some of these embodiments, the optic and the non-optic are of a unitary construction.
Based on the above embodiment: the optical part and the non-optical part are integrally formed, so that the stability of the optical packaging element can be improved, and the influence of play between the optical part and the non-optical part on the normal work of the photosensitive element is prevented.
In some embodiments, the chip package structure further comprises: the optical filter element is positioned on one side of the optical packaging element, which is far away from the circuit board, and can filter light rays with non-working band wavelengths, so that the light rays with the working band wavelengths reach the photosensitive element after optical processing of the optical packaging element.
Based on the above embodiment: set up the light filtering element in one side that the optics encapsulation component deviates from the circuit board, can filter the light that penetrates into photosensitive element, the light wave of filtering non-working band wavelength, and then optimize photosensitive element's work efficiency, alleviate photosensitive element's work.
In some of these embodiments, the non-optic portion comprises: a first portion located at the outer periphery of the optic; and a second portion located at an outer periphery of the first portion, a surface of the first portion facing away from the circuit board being located between a surface of the second portion facing away from the circuit board and the circuit board to form a first recess, the filter element being located within the first recess.
Based on the above embodiment: the non-optical part is divided into a first part and a second part, the first part is positioned at the periphery of the optical part, the second part is positioned at the periphery of the first part, and the surface of the first part is positioned between the circuit board and the surface of the second part in the direction departing from the surface of the circuit board to form a first groove for placing a filter element, so that the position of the filter element can be positioned, meanwhile, the structure can be simplified, and the production cost can be reduced.
In some embodiments, the chip package structure further includes a bracket, the bracket is supported on the non-optical portion, the bracket is provided with a light through hole, and the filter element covers the light through hole and is connected to the bracket.
Based on the above embodiment: a bracket is arranged on the non-optical part, the filter element is arranged on the bracket, and the bracket is used for positioning the filter element and enhancing the stability. The support is provided with a light through hole, and the position of the light through hole corresponds to the position of the photosensitive element, so that the filtered light emitted from the filter element reaches the photosensitive element, and the normal work of the photosensitive element is realized.
In some embodiments, a second groove is disposed on the circuit board, and the photosensitive element is disposed in the second groove.
Based on the above embodiment: set up the second recess on the circuit board, set up photosensitive element in the second recess, can reduce the thickness of structure, and the second recess can realize the location effect to photosensitive element installation, and the production installation is convenient.
In some embodiments, the photosensitive element and the circuit board are electrically connected through an electric connection wire, and the periphery of the electric connection wire, the connection part of the photosensitive element and the electric connection wire, and the connection part of the circuit board and the electric connection wire are coated with protective layers.
Based on the above embodiment: when the photosensitive element is electrically connected with the circuit board through the electric connection wire, the periphery of the electric connection wire is provided with a protective layer, and the protective layer covers the connection part of the photosensitive element and the electric connection wire and the connection part of the circuit board and the electric connection wire, so that the connection position can be protected while the electric connection wire is protected, and a certain fixing effect is also realized.
In a second aspect, an embodiment of the present application provides a camera module, which includes a lens and a chip package structure, where the chip package structure is located on an image side of the lens, and an optical axis of the lens is collinear with an optical axis of an optical package element in the chip package structure.
Based on this application embodiment's camera module, through setting up the optics encapsulation component that has optical processing ability, cover the photosensitive element, can not influence the normal work of photosensitive element when protecting the photosensitive element, and simple structure, can improve the efficiency of production and processing, reduce the spoilage of photosensitive element.
In a third aspect, an embodiment of the present application provides an electronic device, which includes a housing and a camera module, where the camera module is connected to the housing.
Based on this application embodiment's electronic equipment, through setting up the optics encapsulation component that has optical processing ability, cover photosensitive element, can not influence photosensitive element's normal work when protecting photosensitive element, and simple structure, can improve the efficiency of production and processing, reduce photosensitive element's spoilage.
In a fourth aspect, an embodiment of the present application provides a method for processing a chip package structure, including disposing a photosensitive element on one side of a circuit board, and electrically connecting the photosensitive element to the circuit board; arranging a module on one side of the photosensitive element, which is far away from the circuit board, and enabling a gap to be reserved between the module and the circuit board; injecting an optical material into the gap, thereby forming an optical package element; the optical packaging element covers the photosensitive element and is connected with the circuit board.
According to the chip packaging structure processing method, the photosensitive element is arranged on one side, away from the circuit board, of the circuit board, the module with the circuit board is arranged, optical materials are injected into the gap, the optical packaging element is formed, the photosensitive element is covered, normal work of the photosensitive element is not affected while the photosensitive element is protected, the structure is simple, production and processing efficiency can be improved, and the damage rate of the photosensitive element is reduced.
In some embodiments, the photosensitive element is electrically connected to the circuit board via an electrical connection, and an optical material is injected into the gap to form an optical package element; and forming protective layers on the periphery of the electric wiring, the connection part of the photosensitive element and the electric wiring and the connection part of the circuit board and the electric wiring.
Based on the above embodiment: in the process of processing the chip packaging structure, when the photosensitive element is electrically connected with the circuit board through the electric connection wire, a protective layer is formed on the periphery of the electric connection wire, the protective layer covers the connection part of the photosensitive element and the electric connection wire and the connection part of the circuit board and the electric connection wire, the electric connection wire can be protected, the connection position can be protected, and a certain fixing effect can be achieved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a first structural schematic diagram of a chip package structure according to an embodiment of the present application;
fig. 2 is a second structural diagram of a chip package structure according to an embodiment of the present application;
fig. 3 is a schematic diagram illustrating a third structure of a chip package structure according to an embodiment of the disclosure;
fig. 4 is a fourth structural diagram of a chip package structure according to an embodiment of the present application;
fig. 5 is a schematic structural diagram illustrating a method for processing a chip package structure according to an embodiment of the present disclosure;
fig. 6 is a schematic flow chart illustrating a method for processing a chip package structure according to an embodiment of the present disclosure;
fig. 7 is another schematic structural diagram illustrating a method for processing a chip package structure according to an embodiment of the present disclosure;
fig. 8 is another schematic flow chart of a processing method of a chip package structure according to an embodiment of the present application.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of components and methods consistent with certain aspects of the present application, as detailed in the appended claims.
The embodiment of the application provides an electronic equipment to the smart mobile phone is taken as the example, including casing, display screen and the camera module that this application embodiment provided, display screen and camera module all set up in the casing. The thickness of the camera module can influence the thickness of the electronic device. The electronic device may be a smartphone, a Personal Digital Assistant (PDA), a laptop computer, a wearable device, or the like.
As shown in fig. 1, an embodiment of the present disclosure provides a camera module 100, which includes a lens 110 and a chip package structure 120, wherein the lens 110 is disposed on an object side of the chip package structure 120. The lens 110 includes a plurality of lenses for receiving light and projecting the light into the light-sensing elements 122 of the chip package structure 120 to form an image. A voice coil motor may be further disposed at the periphery or below the lens 110 to implement an anti-shake or focusing function.
In order to reduce the size of the camera module 100, the embodiment of the application further provides a miniaturized chip packaging structure 120. Specifically, as shown in fig. 1, in some embodiments, the chip packaging structure 120 includes a circuit board 123, a light sensing element 122, and an optical packaging element 121. The circuit board 123 may be selected as a flexible circuit board (FPC), which is thinner in thickness, of course. In some embodiments, the circuit board 123 may also be a Printed Circuit Board (PCB). The circuit board 123 is used for providing and transmitting electrical signals, and an ISP (Image Signal Processor) may be further disposed on the circuit board 123 for processing the electrical signals input by the photosensitive element 122 and forming an Image. The light sensing element 122 may be a CMOS or CCD sensor for receiving light and converting it into electrical signals to form an image. The optical package element 121 is used for packaging the circuit board 123 and the photosensitive element 122 into a whole, and is connected to both the circuit board 123 and the photosensitive element 122, and the optical package element 121 has a refractive power and can optically process light so that the photosensitive chip 122 can receive the processed light. In addition, the optical package element 121 may also provide support for the lens 110. The chip package structure 120 may further include a reinforcing plate, which may be a metal sheet, specifically, the reinforcing plate may be a steel sheet or a copper sheet, and may be used as a structural foundation for the bottom of the circuit board 123, and the circuit board 123 may be disposed on the reinforcing plate in a gluing manner to enhance the stability.
In some embodiments, the optical package element 121 may include an optical portion 1211 and a non-optical portion 1212, the non-optical portion 1212 is located at the periphery of the optical portion 1211 and may be used to support the lens 110, and the optical portion 1211 has a refractive power so that the optical portion 1211 performs an optical process on the incident light. The optical portion 1211 and the non-optical portion 1212 may be integrally formed, which may improve the stability of the optical packaging element 121 and prevent the optical portion 1211 and the non-optical portion 1212 from moving to affect the normal operation of the photosensitive element 122. It can be understood that the structure of the optical portion 1211 is designed to optimize the fitting effect of the optical portion 1211 and the lens 110, so as to improve the optical performance.
In some embodiments, the optical package element 121 may further include a filter element 1213, the filter element 1213 being located on a side of the optical package element 121 facing away from the circuit board 123, i.e., the filter element 1213 is disposed between the lens 110 and the optical package element 121. The filter 1213 may be an infrared filter, which is a reflective or absorptive filter, and is used to filter out light in non-working wavelength bands such as infrared light, so that the light entering the photosensitive element 122 is visible light, and the influence of the non-working wavelength bands such as infrared light on the imaging quality is avoided.
Specifically, the filter element 1213 may be disposed on the non-optical portion 1212 of the optical package element 121, and in some embodiments, as shown in fig. 2, the chip package structure 120 may include a bracket 124, the bracket 124 being disposed on the non-optical portion 1212, and the filter element 1213 being disposed on the bracket 124. The support 124 has a light-passing hole to ensure smooth transmission of light, and the filter element 1213 can cover the light-passing hole to prevent light from leaking from the edge of the light-passing hole to affect imaging. The bracket 124 may include a first connection portion and a second connection portion, the first connection portion is located at the periphery of the second connection portion, and the thickness of the first connection portion may be greater than that of the second connection portion in the direction along the optical axis of the optical portion 1211, so that a mounting groove departing from the circuit board 123 may be formed between the first connection portion and the second connection portion, and the filter element 1213 may be located in the mounting groove. The size of the first coupling portions may be made as large as possible in a direction perpendicular to the optical axis of the optical portion 1211 to increase a contact area of the bracket 124 with the first coupling portions, thereby improving mounting efficiency and stability of the bracket 124.
In still other embodiments, the filter element 1213 may be disposed directly on the non-optic portion 1212, specifically, referring to fig. 1 and 3, the non-optic portion 1212 includes a first portion 12121 and a second portion 12122, the first portion 12121 being located at the periphery of the optic 1211, and the second portion 12122 being located at the periphery of the first portion 12121. The surface of the first portion 12121 facing away from the circuit board 123 is located between the surface of the second portion 12122 facing away from the circuit board 123 and the circuit board 123, and a first groove 12123 may be formed to mount the filter element 1213 through the first groove 12123, thereby saving the assembly process and reducing the production cost. It should be noted that the distance between the plane of the bottom surface of the first groove 12123 and the circuit board 123 is greater than the maximum distance between the optical portion 1211 and the circuit board 123, so as to prevent the filter element 1213 from colliding with the optical portion 1211 to affect the light receiving of the light sensing element 122.
It is easy to understand that, by directly disposing the filter element 1213 on the optical package element 121, on one hand, the use of the bracket 124 is saved, the investment cost can be reduced, and on the other hand, the assembly process of the bracket 124 is also saved, and the assembly efficiency can be increased, compared with additionally disposing the bracket 124 and mounting the filter element 1213 on the bracket 124. Meanwhile, the first groove 12123 can be formed only by arranging the surface of the first portion 12121 facing away from the circuit board 123 to be located between the surface of the second portion 12122 facing away from the circuit board 123 and the circuit board 123, so that the optical package element 121 can achieve the purpose that the optical filter element 1213 is installed in the first groove 12123 on the basis of satisfying the structural miniaturization, the size of the chip package structure 120 can be effectively reduced, and the overall size of the camera module 100 can be further reduced.
In some embodiments, as shown in fig. 3, a second groove 1231 may be disposed on the circuit board 123, and the photosensitive element 122 may be disposed in the second groove 1231, so as to reduce the thickness of the chip package structure 120, and thus reduce the overall thickness of the camera module 100.
In some embodiments, as shown in fig. 1, the light sensing element 122 is electrically connected to the circuit board 123, specifically, the light sensing element 122 may be electrically connected to the circuit board 123 through an electrical connection 125, the electrical connection 125 may be disposed in the optical packaging element 121, and two ends of the electrical connection 125 may be respectively connected to opposite ends of the circuit board 123 and the light sensing element 122, and the number may be 1 or more, as shown in fig. 2. The electrical connection 125 may be a gold wire, a silver wire, a copper wire, or the like.
Further, as shown in fig. 4, the outer circumference of the electric wiring 125 may be provided with a protective layer 126, the protective layer 126 covering the electric wiring 125 and covering a connection portion of the electric wiring 125 and the photosensitive element 122 and a connection portion of the electric wiring 125 and the circuit board 123. The passivation layer 126 may be a sticky adhesive, such as a dispensing adhesive, including but not limited to gold wire pre-dispensing adhesive, which can fix the position of the electrical connection 125 and connect the light-sensing element 122 and the circuit board 123 while protecting the electrical connection 125, so as to enhance the stability of the chip package structure 120.
In some embodiments, as shown in fig. 4, an electrical device 1232 is further disposed on the circuit board 123, and the electrical device 1232 is embedded in the optical package element 121. The number of electrical devices 1232 is not limited and can be 1 and more, as illustrated by 2 electrical devices 1232. The electrical device 1232 may be a resistor, a capacitor, an inductor, or other devices, and is used to implement various functions of the circuit.
The embodiment of the present application provides a method for processing a chip package structure 120, as shown in fig. 5, the chip package structure 120 may be formed by extruding a material into a mold cavity 300 formed by a module 200, a circuit board 123, and a photosensitive element 122 by an injection molding method, and specifically, as shown in fig. 6, the method for forming the chip package structure 120 may include: in step S02, the photosensitive element 122 is disposed on one side of the circuit board 123, and the photosensitive element 122 is electrically connected to the circuit board 123. In step S04, the module 200 is disposed on a side of the photosensitive element 122 away from the circuit board 123, and a certain gap is formed between the module 200 and the circuit board 123. Step S06, injecting an optical material into the gap to form an optical package element 121, and the optical package element 121 covers the photosensitive element 122 and is connected to the circuit board 123.
It should be noted that, as shown in fig. 5 and 7, the side of the module 200 facing the photosensitive element 122 may have various surface types. Specifically, the surface type of the module 200 facing the light sensing element 122 determines the surface type of the light incident surface of the optical package element 121, and since the optical package element 121 and the lens in the lens 110 process light together when in use, in the actual production process, the module 200 with the appropriate surface type can be selected according to the shape of the lens in the lens 110, so that the optical package element 121 with a specific light incident surface produced by the module 200 and the lens in the lens 110 are combined to achieve the best light processing effect. In addition, the optical package element 121 with different thicknesses can be generated by controlling the distance between the module 200 and the circuit board 123, so that the optical package element 121 with a smaller thickness can be produced by reducing the distance between the module 200 and the circuit board 123, thereby reducing the thickness of the chip package structure 120, reducing the size of the camera module 100, and realizing the lightness and thinness of the electronic device.
To avoid wasting the optical material during the manufacturing process, the method for manufacturing the chip package structure 120 may further include, before injecting the optical material into the gap to form the optical package element 121: in step S05, a baffle 400 is disposed around the photosensitive element 122, and a sealed chamber is formed by the circuit board 123, the module 200 and the baffle 400. Through setting up baffle 400 in light sensing element 122's periphery, and make circuit board 123, enclose between module 200 and the baffle 400 and close and form a inclosed cavity, thereby can form optical packaging element 121 through injecting optical material into this cavity, can avoid optical material to expose and cause the waste, still can be through designing the shape of cavity into with the shape just right adaptation of the optical packaging element 121 that finally needs, thereby avoid after forming optical packaging element 121, still need handle such as cutting optical packaging element 121, promote machining efficiency. The above-described step S05 of providing the shutter 400 at the outer periphery of the photosensitive element 122 may be performed between the steps S02 and S04 and between the steps S04 and S06, wherein fig. 8 shows a case where the step S05 is performed between the steps S04 and S06.
Preferably, the baffle 400 and the photosensitive element 122 may have a certain distance therebetween, so that the optical material injected into the cavity may better cover the photosensitive element 122, and the packaging stability of the photosensitive element 122 is ensured. The optical material may be selected from optical glass, natural resin, synthetic resin, polycarbonate, etc. used for manufacturing the lens, the optical material embeds the photosensitive element 122 therein, and the optical material is cross-linked, cured and molded to form the optical package element 121 with the shape of the optical lens structure, and the optical package element 121 has refractive power and can optically process light rays incident to the optical package element 121. In the related art, the photosensitive element 122 needs to be fixed on the circuit board 123 by first applying pressure to press the photosensitive element 122 onto the circuit board 123 and then using glue, which may cause the inside of the photosensitive element 122 to be damaged and fractured, but in the embodiment of the present application, the optical package element 121 is formed by injection molding on the periphery of the photosensitive element 122, and the photosensitive element 122 is fixed on the circuit board 123 by the optical package element 121, so that the problem of pressing the photosensitive element 122 is avoided, the yield of products can be improved, and the production cost can be reduced.
In the installation and implementation process of the optical packaging element 121, the optical packaging element 121 can be directly formed on the circuit board 123 equipped with the photosensitive element 122, so that the steps and the time of assembly are reduced, the production and processing cost is reduced, the assembly and assembly precision is improved, and the production and processing yield is improved.
In some embodiments, during the processing of the chip package structure 120, a stiffener may be further disposed on a side of the circuit board 123 facing away from the photosensitive element 122. The stiffening plate can be used to make structural foundation in circuit board 123 bottom, and circuit board 123 can adopt the mode of gluing to set up on the stiffening plate to the reinforcing steadiness. The reinforcing plate may be a metal sheet, and specifically, the reinforcing plate may be a steel sheet or a copper sheet.
In some embodiments, during the processing of the chip package structure 120, as shown in fig. 4, the light sensing element 122 and the circuit board 123 may be electrically connected through the electrical connection 125. The electrical connection 125 may be a gold wire, a silver wire, a copper wire, or the like. Prior to the step of injecting the optical material into the gap to form the optical package element 121, the processing method may further include: in step S03, the protective layer 126 is formed at the position of the electrical wiring 125, and specifically, the protective layer 126 may be formed at the outer circumference of the electrical wiring 125, the connection portion of the photosensitive element 122 and the electrical wiring 125, and the connection portion of the circuit board 123 and the electrical wiring 125. The above step S03 of forming the protective layer 126 at the position of the electrical connection 125 may be performed between the steps S02 and S04 and between the steps S04 and S06, wherein fig. 8 shows a case where the step S03 is performed between the steps S02 and S04.
It is understood that the passivation layer 126 may be an adhesive, such as a dispensing adhesive, including but not limited to gold wire pre-dispensing adhesive, which can fix the position of the electrical connection 125 and connect the light-sensing element 122 and the circuit board 123 while protecting the electrical connection 125, so as to enhance the stability of the chip package structure 120. On the other hand, the protective layer 126 may be formed in various ways, for example, the protective layer 126 may be formed by injecting or coating an unformed colloid, and the colloid is formed to form the protective layer 126; the protective layer 126 may also be a sheet material, so as to cover the electrical connection wires 125, the connection portions of the electrical connection wires 125 and the photosensitive elements 122, and the connection portions of the electrical connection wires 125 and the circuit board 123, and enhance the mounting stability of the photosensitive elements 122.
In some embodiments, as shown in fig. 3, during the processing of the chip package structure 120, the circuit board 123 may be provided with a second groove 1231, and the photosensitive element 122 may be disposed in the second groove 1231, so as to reduce the thickness of the chip package structure 120, and thus reduce the overall thickness of the camera module 100. It should be noted that, in the process of mounting implementation, the step of opening the second groove 1231 needs to be performed before the step S02 of mounting the photosensitive element 122, and of course, the circuit board 123 may originally have the second groove 1231 without opening it separately. The size of the second groove 1231 may be slightly larger than that of the photosensitive element 122, so that the material generated by slotting can be saved. On the other hand, only by forming the groove, the height of the photosensitive element 122 in the chip package structure 120 can be reduced, and further, the thickness of the chip package structure 120 and the camera module 100 can be reduced, which results in lower cost.
In some embodiments, the injected optical material forms the optical package element 121, as shown in fig. 1, the optical package element 121 may include an optical portion 1211 and a non-optical portion 1212, the non-optical portion 1212 is located at the outer periphery of the optical portion 1211 and may be used to support the lens 110, and the optical portion 1211 has a refractive power so that the optical portion 1211 performs an optical process on the incident light. By adopting the processing method of the embodiment of the application, the influence of the play between the optical part 1211 and the non-optical part 1212 on the normal work of the photosensitive element 122 can be prevented. It can be understood that the structure of the optical portion 1211 is designed to optimize the fitting effect of the optical portion 1211 and the lens 110, so as to improve the optical performance.
In combination with the above analysis, referring to fig. 8, a method for processing a chip package structure 120 may further include:
step S02: the photosensitive element 122 is disposed on one side of the circuit board 123, and the photosensitive element 122 and the circuit board 123 are electrically connected by an electrical connection 125.
Step S03: a protective layer is formed at the location of the electrical connection 125. Specifically, the protective layer 126 may be formed at the outer circumference of the electrical wiring 125, the connection portion of the photosensitive element 122 and the electrical wiring 125, and the connection portion of the circuit board 123 and the electrical wiring 125.
Step S04: the module 200 is disposed on a side of the photosensitive element 122 away from the circuit board 123, and a certain gap is formed between the module 200 and the circuit board 123.
Step S05: a baffle 400 is disposed around the periphery of the photosensitive element 122, and a closed chamber is formed by the circuit board 123, the module 200 and the baffle 400.
Step S06: injecting optical materials into the cavity to form an optical packaging element 121, and the optical packaging element 121 covers the photosensitive element 122 and is connected with the circuit board 123.
Because the circuit board is provided with electronic devices such as resistors, capacitors and the like, when the optical material is injected into the cavity, the optical material can also cover part of the electronic devices on the circuit board.
In some embodiments, after the optical package element 121 is formed in step S06, the optical filter element 1213 may be mounted on a side of the optical package element 121 facing away from the circuit board 123, thereby completing the assembly of the chip package structure 120. Specifically, the filter element 1213 may be disposed on the non-optical portion 1212 of the optical package element 121 through the bracket 124, or may be directly disposed on the non-optical portion 1212, and different structures may be selected according to the size of the reserved installation space in the electronic device.
When the filter element 1213 is disposed on the non-optical portion 1212 through the bracket 124, the bracket 124 may include a first connecting portion and a second connecting portion, the first connecting portion is located at an outer periphery of the second connecting portion, and a thickness of the first connecting portion may be greater than a thickness of the second connecting portion along an optical axis direction of the optical portion 1211, so that a mounting groove away from the circuit board 123 may be formed between the first connecting portion and the second connecting portion, and the filter element 1213 may be located in the mounting groove. The scaffold 124 may be mounted directly to the non-optic portion 1212 or may be bonded to the non-optic portion 1212 to improve the stability of the scaffold 124.
When the filter element 1213 is directly mounted on the optical package element 121, the mounting steps can be reduced, the chip package structure 120 can be simplified, the assembly accuracy can be improved, and the product quality can be improved. It should be appreciated that the first recess 12123 for placing the optical filter element 1213 may be formed directly on the optical package element 121 during the formation of the optical package element 121 before the optical filter element 1213 is mounted directly on the optical package element 121. Specifically, referring to fig. 1 and 3, the non-optical portion 1212 of the optical package element 121 may include a first portion 12121 and a second portion 12122, the first portion 12121 being located at an outer periphery of the optical portion 1211, the second portion 12122 being located at an outer periphery of the first portion 12121, and a surface of the first portion 12121 facing away from the circuit board 123 being located between a surface of the second portion 12122 facing away from the circuit board 123 and the circuit board 123 to form the first groove 12123. With reference to fig. 7, by providing notches on the outer periphery of the surface of the module 200 facing the circuit board 123, the non-optical portion 1212 includes the first portion 12121, the second portion 12122, and the first groove 12123, since the first groove 12123 for mounting the optical filter element 1213 is directly formed during the process of forming the optical package element 121, the assembly steps of the chip package structure 120 can be reduced compared to separately processing a groove or a mounting bracket on the optical package element 121, which is beneficial to improving the mounting accuracy of the optical filter element 1213.
Further, after the assembly of the chip package structure 120 is completed, the chip package structure 120 and the lens 110 may be assembled together to achieve the assembly of the camera module 100, specifically, the lens 110 may be first mounted on a side of the chip package structure 120 where the optical package element 121 is located, and an optical axis of the optical portion 1211 of the optical package element 121 and an optical axis of a lens in the lens 110 are collinear, and then the chip package structure 120 and the lens 110 may be fixed by dispensing or the like. It should be noted that, when the chip package structure 120 and the lens group in the lens 110 are adjusted to the optimal distance and the optical axes of the lens group in the lens 110 and the chip package structure 120 are collinear, the chip package structure 120 and the lens can be fixed by dispensing in the gap between the chip package structure 120 and the lens 110. When the gap between the chip package structure 120 and the lens 110 changes, the chip package structure 120 and the lens 110 can be fixed by adjusting the thickness of the glue. In some embodiments, the lens 110 may be directly mounted on the bracket 124 or the non-optical portion 1212 of the optical package element 121, so that the light emitted from the lens 110 can be transmitted to the photosensitive element 122 through the filter element 1213 and the optical portion 1211, and the photosensitive element 122 can receive the light and further convert the light signal into an electrical signal, thereby forming an image.
In the description of the present application, it is to be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art. Further, in the description of the present application, "a plurality" means two or more unless otherwise specified. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present application and is not to be construed as limiting the scope of the present application, so that the present application is not limited thereto, and all equivalent variations and modifications can be made to the present application.
Claims (12)
1. A chip package structure, comprising:
a circuit board;
the photosensitive element is arranged on one side of the circuit board and is electrically connected with the circuit board;
the optical packaging element and the photosensitive element are located on the same side of the circuit board, the optical packaging element covers the photosensitive element and is connected with the circuit board, and the optical packaging element has a refractive power.
2. The chip package structure according to claim 1, wherein the optical package element comprises:
the optical part is positioned on one side of the photosensitive element, which is far away from the circuit board, and can perform optical treatment on light reaching the photosensitive element; and
and the non-optical part is positioned on the periphery of the optical part and is connected with the circuit board.
3. The chip package structure according to claim 2, wherein the optical portion and the non-optical portion are an integral structure.
4. The chip package structure according to claim 2, further comprising:
the optical filter element is positioned on one side of the optical packaging element, which is far away from the circuit board, and can filter light rays with non-working band wavelengths, so that the light rays with the working band wavelengths reach the photosensitive element after optical processing of the optical packaging element.
5. The chip package structure according to claim 4, wherein the non-optical portion comprises:
a first portion located at the outer periphery of the optic; and
the second part is positioned on the periphery of the first part, the surface of the first part, which faces away from the circuit board, is positioned between the surface of the second part, which faces away from the circuit board, and the circuit board to form a first groove, and the filter element is positioned in the first groove.
6. The chip package structure according to claim 4, further comprising a bracket, wherein the bracket is carried by the non-optical portion, the bracket is provided with a light hole, and the filter element covers the light hole and is connected to the bracket.
7. The chip package structure according to claim 1, wherein a second recess is disposed on the circuit board, and the photosensitive element is disposed in the second recess.
8. The chip package structure according to claim 1, wherein the light sensing element is electrically connected to the circuit board via an electrical connection, and the outer periphery of the electrical connection, the connection portion of the light sensing element and the electrical connection, and the connection portion of the circuit board and the electrical connection are coated with a protective layer.
9. The utility model provides a camera module which characterized in that includes:
a lens; and
the chip package structure of any one of claims 1 to 8, the chip package structure being located on an image side of the lens, and an optical axis of the lens being collinear with an optical axis of the optical package element in the chip package structure.
10. An electronic device, comprising:
a housing; and
the camera module of claim 9, said camera module coupled to said housing.
11. A processing method of a chip packaging structure is characterized by comprising the following steps:
arranging a photosensitive element on one side of a circuit board, and electrically connecting the photosensitive element with the circuit board;
arranging a module on one side of the photosensitive element, which is far away from the circuit board, and enabling a gap to be reserved between the module and the circuit board;
injecting an optical material into the gap, thereby forming an optical package element; the optical packaging element covers the photosensitive element and is connected with the circuit board.
12. The process of claim 11 wherein said photosensitive element is electrically connected to said circuit board by electrical connections, prior to the step of injecting optical material into said gap to form an optical package element; also comprises
And forming protective layers on the periphery of the electric wiring, the connection part of the photosensitive element and the electric wiring and the connection part of the circuit board and the electric wiring.
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| CN202110334552.6A CN113079291B (en) | 2021-03-29 | 2021-03-29 | Chip packaging structure, processing method, camera module and electronic equipment |
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| CN113079291B (en) | 2023-04-07 |
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