The content of the invention
It is contemplated that at least solving one of technical problem present in correlation technique.Therefore, the present invention provide it is a kind of into
As device assembly and electronic installation.
The imaging device component of embodiment of the present invention is used for electronic installation, and imaging device component includes installing plate, described
Installing plate offers accepting hole;And imaging device, the imaging device is arranged on the installing plate, the bottom of the imaging device
Portion is arranged in the accepting hole.
In some embodiments, the imaging device includes:
Circuit board, the circuit board is housed in the accepting hole;With
The camera module on the circuit board is arranged on, the bottom of the camera module is arranged in the accepting hole.
In some embodiments, the camera module includes shell and the branch extended outwardly from the outside of the shell
Support member, the imaging device is by the supports support so that the bottom of the imaging device is arranged on the installing plate
In the accepting hole.
In some embodiments, the quantity of the support member is two, and two support members are separately positioned on described
The opposite both sides of installing plate.
In some embodiments, the side of the circuit board is connected with fin, and the fin is from the circuit board
Side away from the camera module direction extend.
In some embodiments, the fin is copper sheet or graphene film.
In some embodiments, the fin is structure as a whole with the circuit board.
In some embodiments, the fin is connected with ground terminal.
In some embodiments, the fin is located at the lower surface of the circuit board and the top surface of the camera module
Between.
In some embodiments, the camera module includes:
It is coupling in the imaging sensor on the circuit board;
It is arranged on the camera lens above described image sensor;With
Voice coil motor, the camera lens is arranged in the voice coil motor.
In some embodiments, the imaging device is included from the circuit board to away from camera module extension
Flexible PCB, the flexible PCB and the fin are located at the opposite both sides of the camera module respectively.
In some embodiments, the imaging device includes the connector being arranged on the flexible PCB, described
Connector is electrically connected with the flexible PCB.
The electronic installation of embodiment of the present invention includes the imaging device component of any of the above embodiment.
In some embodiments, the installing plate is the center of the electronic installation.
In the imaging device component and electronic installation of embodiment of the present invention, because the bottom of imaging device is arranged on collecting
Kong Zhong, can so reduce the integral thickness of imaging device and installing plate, so as to reduce the electricity being applied to as device assembly
The thickness of sub-device.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obtain substantially, or recognized by the practice of the present invention.
Embodiment
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the drawings, wherein from beginning
Same or similar element or element with same or like function are represented to same or similar label eventually.Below by ginseng
The embodiment for examining accompanying drawing description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the invention, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ", " up time
The orientation or position relationship of the instruction such as pin ", " counterclockwise " are, based on orientation shown in the drawings or position relationship, to be for only for ease of
The description present invention and simplified description, rather than indicate or imply that the device or element of meaning must have specific orientation, Yi Te
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, and it is not intended that indicating or implying relative importance or the implicit quantity for indicating indicated technical characteristic.
Thus, " first " is defined, one or more feature can be expressed or be implicitly included to the feature of " second ".
In description of the invention, " multiple " are meant that two or more, unless otherwise specifically defined.
In the description of the invention, it is necessary to illustrate, unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected;Can
To be mechanical connection or electrical connection or can mutually communicate;Can be joined directly together, can also be by between intermediary
Connect connected, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill of this area
For personnel, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it " under "
Can directly it be contacted including the first and second features, it is not direct contact but by it that can also include the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " to include first special
Levy directly over second feature and oblique upper, or be merely representative of fisrt feature level height higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " fisrt feature that includes are immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, hereinafter the part and setting of specific examples are described.Certainly, they are only merely illustrative, and
And purpose does not lie in the limitation present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, between discussed various embodiments itself are not indicated and/or are set
Relation.In addition, the invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the imaging device 100 of embodiment of the present invention includes (the Printed Circuit of circuit board 10
Board, PCB) and camera module 20.Camera module 20 is set on the circuit board 10.The side 11 of circuit board 10 is connected with radiating
Piece 30.Fin 30 is from the side 11 of circuit board 10 to the direction extension away from camera module 20.
In above-mentioned imaging device 100, the heat that fin 30 can produce imaging device 100 passes to imaging device 100
It is outside, it is ensured that the normal work of imaging device 100.
Specifically, circuit board 10 is sandwich construction, and such as circuit board 10 includes conductive layer, bus plane and stratum.Fin
30 can connect the stratum of circuit board 10 to avoid circuit board 10 from the phenomenon of short circuit occur.Fin 30 connects the side of circuit board 10
Face 11, and part heat sink 30 can be almost parallel or arranged side by side with circuit board 10, so as to avoid fin 30 and circuit board 10
It is laminated and increases the thickness of imaging device 100.
It is pointed out that size in above-below direction of the thickness of imaging device 100 for the imaging device 100 in Fig. 1.
In some embodiments, fin 30 be located at circuit board 10 lower surface 12 and camera module 20 top surface 26 it
Between.In this way, fin 30 can not only radiate, also cause the thickness that imaging device 100 is avoided after the increase fin of imaging device 100
Degree increase.
For example, fin 30 can be located in the space that the upper surface 13 of circuit board 10 is surrounded with lower surface 12 so that radiating
The integral thickness of piece 30 and circuit board 10 is the thickness of circuit board 10, so as to avoid the thickness of imaging device 100 from increasing.
In some embodiments, fin 30 is copper sheet.
In this way, fin 30 has preferably heat conduction and radiating effect, the temperature of imaging device 100 can be effectively reduced
Degree.In one example, the forming process of fin 30 can be as follows:One larger circuit board 10 is first provided, wherein, circuit board
10 include sandwich construction, wherein one layer is copper foil layer;Then other Rotating fields of partial circuit plate 10 in addition to copper foil layer are removed, from
And fin 30 and circuit board 10 can be obtained.In another example, the forming process of fin 30 can be as follows:First provide one
The larger copper sheet of piece, then on the copper sheet of part the layer of other in addition to copper foil layer of throttle circuit plate 10 to obtain printed circuit board (PCB)
10, the unstamped part copper sheet for having other layers forms fin 30.
Certainly, in other embodiments, fin 30 is graphene film.Graphene film also by compacting technique with electricity
Road plate 10 is connected.
In some embodiments, fin 30 is connected with ground terminal.In other words, fin 30 is grounded.
In this way, fin 30 can avoid imaging device 100 from producing electrostatic and influence the imaging effect of imaging device 100.
For example, fin 30 can be connected (as shown in Figure 5) with the shell 310 of electronic installation 300, so that fin 30 not only may be used
To connect ground terminal, the heat that can also produce circuit board 10 passes to the shell 310 of electronic installation 300, heat and then passes to sky
In gas, so as to reduce the temperature of imaging device 100.
In some embodiments, fin 30 is structure as a whole with circuit board 10.It so can not only avoid fin
30 depart from circuit board 10, so that the heat on circuit board 10 effectively can be passed to the outer of imaging device 100 by fin 30
Portion, it is also possible that simple in construction, the cost of manufacture of reduction fin 30 and circuit board 10 of fin 30 and circuit board 10.Dissipate
Backing 30 can for example use pressing process mentioned above to form integrative-structure with circuit board 10.
In some embodiments, camera module 20 includes imaging sensor 21, camera lens 22 and voice coil motor 23.Image is passed
Sensor 21 is coupled on the circuit board 10.Camera lens 22 is arranged on the top of imaging sensor 21.Camera lens 22 is arranged in voice coil motor 23.
In this way, imaging sensor 21 can sense the light outside camera module 20 to obtain external image.Camera lens 22 can be with
External object is imaged on imaging sensor 21 so that imaging sensor 21 obtains preferably image.Voice coil motor 23
Optical axis direction of the camera lens 22 along camera lens 22 can be driven to move to adjust the distance between camera lens 22 and imaging sensor 21, and then
The auto-focusing of imaging modules is realized, so that imaging modules obtain quality preferably image.
Specifically, imaging sensor 21 is, for example, complementary metal oxide semiconductor (Complementary Metal
Oxide Semiconductor, CMOS) CIS or charge coupled cell (Charge-coupled Device,
CCD) CIS.Imaging sensor 21 can operationally produce substantial amounts of heat, and heat is passed on circuit board 10, then led to
The fin 30 being connected with circuit board 10 is crossed to pass to outside imaging device 100.
In some embodiments, imaging device 100 includes flexible PCB 40.Flexible PCB 40 from circuit board 10 to
Extend away from camera module 20.Flexible PCB 40 and fin 30 are located at the opposite both sides of camera module 20 respectively.
In this way, flexible PCB 40 can cause imaging device 100 to realize data transfer with outer member.For example, image
The picture signal of acquisition by flexible PCB 40 can be transferred to outer member by sensor 21, and outer member is to picture signal
External image can be obtained after processing.And for example, external image can control imaging sensor 21 photosensitive by flexible PCB 40
To obtain external image.
Flexible PCB 40 is located at the opposite both sides of camera module 20 with fin 30 respectively can avoid flexible PCB
40 interfere with fin 30 so that flexible PCB 40 has larger installing space with fin 30.
In some embodiments, imaging device 100 includes connector 50.Connector 50 is arranged on flexible PCB 40
On.Connector 50 is electrically connected with flexible PCB 40.
In this way, connector 50 is by imaging device 100 rapidly externally connected equipment, for example, being set on external equipment
Have and be inserted into connector interface with the corresponding connector interface of connector 50, connector 50 and can complete connector 50 and set with the external world
Standby connection.
In some embodiments, circuit board 10 is structure as a whole with flexible PCB 40.For example, circuit board 10 and flexibility
Circuit board 40 is respectively a part for Rigid Flex.Circuit board 10 is the hardboard part of Rigid Flex, flexible PCB 40
For the soft board part of Rigid Flex.
In this way, it is simple in construction between circuit board 10 and flexible PCB 40, and the zero of imaging device 100 can be reduced
The quantity of part, so as to reduce the assembling procedure of imaging device 100, to reduce the assembly cost of imaging device 100.
Referring to Fig. 2, the imaging device component 200 of embodiment of the present invention includes installing plate 210 and any of the above is implemented
The imaging device 100 of mode, imaging device 100 is arranged on installing plate 210.
In this way, installing plate 210 can provide support with fixed imaging device 100 for imaging device 100, to ensure imaging dress
External image can be obtained by putting 100.For example, imaging device 100 can be fixed or by way of engaging by way of welding
Fixed with installing plate 210.
Specifically, in present embodiment.Installing plate 210 can be in flat board tabular.Certainly, in other embodiments, pacify
It is in frame shape to fill plate 210.
In some embodiments, installing plate 210 offers accepting hole 211, and the bottom 102 of imaging device 100 is arranged on
In accepting hole 211, circuit board 10 is housed in accepting hole 211.
In this way, the integral thickness of imaging device 100 and installing plate 210 can be so reduced, to cause imaging device component
200 miniaturizations, and it is compacter.
Incorporated by reference to Fig. 3 and Fig. 4, in some embodiments, camera module 20 includes shell 24 and support member 25.Support member
25 stretch out from the lateral surface 241 of shell 24.Imaging device 100 be supported on by support member 25 on installing plate 210 so that into
As the bottom 102 of device 100 is arranged in accepting hole 211.
Moved in this way, support member 25 can limit camera module 20 relative to installing plate 210, define imaging device 100
Installation site.It should be noted that the bottom 102 of imaging device 100 includes the bottom of whole circuit board 10 and camera module 20
Portion, therefore, the bottom of camera module 20 are arranged in accepting hole 211.The bottom of shell 24 is also disposed in accepting hole 211.
Shell 24 can be the shell 24 of above-mentioned voice coil motor 23.It can also be the element around voice coil motor 23.
In some embodiments, the quantity of support member 25 is two, and two support members 25 are separately positioned on installing plate 210
Opposite both sides.In this way, two support members 25 cause the stress balance on installing plate 210 of imaging device 100 to be filled to improve imaging
Put the stability of 100 installations.
In present embodiment, support member 25 is in strip.It is appreciated that in other embodiments, support member 25 can also
In other shapes such as bulks.
In some embodiments, installing plate 210 is structure as a whole with support member 25.
In some embodiments, the shape and size of accepting hole 211 respectively with the bottom 102 of imaging device 100
Shape and matching size.For example, in Fig. 2 and Fig. 3 example, being shaped as accepting hole 211 is square, and imaging device 100
The shape of bottom 102 is also square, and size of the size slightly larger than the bottom 102 of imaging device 100 of accepting hole 211 is so that imaging
The bottom 102 of device 100 can be arranged in accepting hole 211.
In some embodiments, fin 30 is respectively positioned on the same side of the thickness direction of installing plate 210 with support member 25, dissipates
Backing 30 is arranged at intervals with support member 25.
In this way, the side of installing plate 210 is provided with fin 30 and support member 25 so that the opposite side of installing plate 210 can
To set other elements, so that installing plate 210 improves the utilization rate of installing plate 210.
In some embodiments, installing plate 210 is the center 210 of electronic installation 300.
In this way, center 210 can provide installing space for imaging device 100.
Incorporated by reference to Fig. 5, the electronic installation 300 of embodiment of the present invention includes the imaging device component that any of the above is implemented
200.Electronic installation 300 has the electronic equipment of shoot function such as mobile phone, tablet personal computer or wearable smart machine.
In some embodiments, the shell 310 of the mainboard of the connection of fin 30 electronic installation 300 or electronic installation 300.
In this way, fin 30 can pass to heat on the shell 310 of the mainboard of electronic installation 300 or electronic installation 300, with
Heat is passed to outside electronic installation 300 by the mainboard of electronic installation 300 or the shell 310 of electronic installation 300.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment of the present invention or example.In this specification
In, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Levy, structure, material or feature can in an appropriate manner be combined in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that:
These embodiments can be carried out with a variety of changes, modification in the case of not departing from the principle and objective of the present invention, replace and become
Type, the scope of the present invention is limited by claim and its equivalent.