CN207766355U - Imaging modules and electronic device - Google Patents
Imaging modules and electronic device Download PDFInfo
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- CN207766355U CN207766355U CN201721824364.7U CN201721824364U CN207766355U CN 207766355 U CN207766355 U CN 207766355U CN 201721824364 U CN201721824364 U CN 201721824364U CN 207766355 U CN207766355 U CN 207766355U
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- imaging modules
- face
- passive device
- cooling fin
- imaging
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Abstract
The utility model discloses a kind of imaging modules and electronic devices.Imaging modules include circuit board, imaging sensor and passive device.Circuit board includes opposite the first face and the second face.Imaging sensor is arranged in the first face.Passive device is arranged in the second face.In the imaging modules of the utility model embodiment, imaging sensor and passive device are separately positioned on the opposite two sides of circuit board, can make the size of required circuit board XY axis smaller in this way, so as to reduce the volume of imaging modules.
Description
Technical field
The utility model is related to image technology more particularly to a kind of imaging modules and electronic devices.
Background technology
With the development of science and technology, the terminals such as mobile phone imaging modules are installed so that terminal have shooting function, so as to
Improve the experience of user's using terminal.But as requirement of the user to terminal is continuously improved, how to reduce the volume of terminal at
For problem to be solved.
Utility model content
The utility model aims to solve at least one of technical problem present in the relevant technologies.For this purpose, the utility model carries
For a kind of imaging modules and a kind of electronic device.
The imaging modules of the utility model embodiment include circuit board, imaging sensor and passive device.The circuit
Plate includes opposite the first face and the second face.Described image sensor is arranged in first face.The passive device setting exists
Second face.
In the imaging modules of the utility model embodiment, imaging sensor and passive device are separately positioned on circuit board phase
The two sides of the back of the body can make required circuit board XY shaft sizes smaller, so as to reduce the volume of imaging modules in this way.
In some embodiments, first face is provided with the first pad, and described image sensor is provided with the second weldering
Disk, the imaging modules include connecting the conducting wire of first pad and second pad.
In this way, can relatively easily realize that imaging sensor is electrically connected with main circuit board in this way.
In some embodiments, the quantity of the passive device is multiple, and the multiple passive device is divided into first yuan
Part group and second element group, the first element group and the second element group are located at the opposite both sides in second face.
In this way, passive device is easily mounted on the second face.
In some embodiments, the passive device is located at the center in second face.
In this way, passive device is easily mounted on the second face.
In some embodiments, the imaging modules include the cooling fin being arranged in second face, the cooling fin
It is arranged with the passive device interval, the cooling fin surrounds the passive device.
In this way, cooling fin can improve the radiating efficiency of imaging modules.
In some embodiments, the imaging modules include the cooling fin being arranged in second face, the cooling fin
It is arranged with the passive device interval.
In this way, cooling fin can improve the radiating efficiency of imaging modules.
In some embodiments, on the thickness direction of the circuit board, the size of the cooling fin is more than the quilt
The size of dynamic element.
In this way, cooling fin can protect passive device, reduces the probability that passive device is touched, avoid damage to element.
In some embodiments, the cooling fin is conductor, the cooling fin ground connection.In this way, cooling fin can prevent
Imaging modules generate electrostatic and influence imaging modules normal work.
In some embodiments, the imaging modules include the camera lens being located above described image sensor.
It is fallen on the image sensor in this way, camera lens is conducive to extraneous image, the imaging of imaging modules can be improved in this way
Quality.
The electronic device of the utility model embodiment includes the imaging modules of shell and any of the above embodiment, described
Imaging modules are arranged on the housing.
In this way, imaging sensor and passive device are separately positioned on the opposite two sides of circuit board, can make so required
Circuit board XY axis size it is smaller, so as to reduce the volume of imaging modules, and then the screen that can improve electronic device accounts for
Than.
The additional aspect and advantage of the utility model will be set forth in part in the description, partly will be from following description
In become apparent, or recognized by the practice of the utility model.
Description of the drawings
In description of the above-mentioned and/or additional aspect and advantage of the utility model from combination following accompanying drawings to embodiment
It will be apparent and be readily appreciated that, wherein：
Fig. 1 is the diagrammatic cross-section of the imaging modules of the utility model embodiment；
Fig. 2 is the floor map of the imaging modules of the utility model embodiment；
Fig. 3 is another diagrammatic cross-section of the imaging modules of the utility model embodiment；
Fig. 4 is another diagrammatic cross-section of the imaging modules of the utility model embodiment；
Fig. 5 is the floor map of the electronic device of the utility model embodiment.
Main element symbol description：
Imaging modules 100；
Circuit board 10, the first face 11, the second face 12, the first pad 13；
Imaging sensor 20, the second pad 21；
Passive device 30, first element group 31, second element group 32；
Conducting wire 40；
Cooling fin 50；
Camera lens 60；
Electronic device 200, shell 210.
Specific implementation mode
The embodiment of the utility model is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein
Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below
It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and should not be understood as to this practicality
Novel limitation.
In the description of the present invention, it should be understood that term "center", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside",
The orientation or positional relationship of the instructions such as " clockwise ", " counterclockwise " be based on the orientation or positional relationship shown in the drawings, be only for
Described convenient for description the utility model and simplifying, do not indicate or imply the indicated device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore should not be understood as limiting the present invention.In addition, term " first ",
" second " is used for description purposes only, and is not understood to indicate or imply relative importance or implicitly indicates indicated technology
The quantity of feature.Define " first " as a result, the feature of " second " can explicitly or implicitly include it is one or more
The feature.The meaning of " plurality " is two or more in the description of the present invention, unless otherwise clearly specific
It limits.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, can also be to be electrically connected or can mutually communicate；It can be directly connected, it can also be in
Between medium be indirectly connected, can be the interaction relationship of the connection or two elements inside two elements.For this field
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it
"lower" may include that the first and second features are in direct contact, and can also not be to be in direct contact but lead to including the first and second features
Cross the other characterisation contact between them.Moreover, fisrt feature second feature " on ", " top " and " above " include the
One feature is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.First is special
Sign second feature " under ", " lower section " and " below " include fisrt feature immediately below second feature and obliquely downward, or only
Indicate that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing the different structure of the utility model.
In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relationship between setting.In addition, the example for the various specific techniques and material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
In the related art, passive device is located at imaging sensor on the same surface of printed circuit board, makes in this way
The size of printed circuit board needed for obtaining is larger, so that the volume of corresponding imaging modules is larger.Passive device (Passive
Components) it is, for example, the components such as capacitance, resistance, inductance, crystal oscillator.
Referring to Fig. 1, the imaging modules 100 of the utility model embodiment include circuit board 10,20 and of imaging sensor
Passive device 30.Circuit board 10 includes the first face 11 and the second face 12 opposite to each other.Imaging sensor 20 is arranged in the first face 11.Quilt
Dynamic element 30 is arranged in the second face 12.
In the imaging modules 100 of the utility model embodiment, imaging sensor 20 and passive device 30 are separately positioned on
The opposite two sides of circuit board 10 can make the size in required circuit board 10XY axis directions smaller, so as to subtract in this way
The volume of small imaging modules 100.
Specifically, circuit board 10 is square, and circuit board 10 is the circuit board of rigidity, for example, printed circuit board (Printed
Circuit Board, PCB), such circuit board 10 can be that imaging sensor 20 provides support.
Imaging sensor 20 is, for example, complementary metal oxide semiconductor (Complementary Metal Oxide
Semiconductor, CMOS) Image Sensor or charge coupled cell (Charge-coupled Device, CCD) image
Sensor.Imaging sensor 20 is square, and imaging sensor 20 can sense extraneous light to obtain external image.Image passes
Sensor 20 can obtain the image of extraneous colour for color sensor, and imaging sensor 20 or black and white sensor are to obtain
Take the image of extraneous black and white.When imaging sensor 20 is color sensor, the inducing pixel of imaging sensor 20 is with Bayer battle array
Row are arranged.
Passive device 30 is connect with imaging sensor 20, and passive device 30 can form processing imaging sensor 20 and receive
Signal, and will treated signal transmission to outer member to be further processed.
Referring to Fig. 2, in some embodiments, the first face 11 of circuit board 10 is provided with the first pad 13, and image passes
Sensor 20 is provided with the second pad 21, and imaging modules 100 include the conducting wire 40 of the first pad 13 of connection and the second pad 21.
In this way, can relatively easily realize that imaging sensor 20 is electrically connected with main circuit board 10 in this way.Present embodiment
In, multiple second pads 21 are located at two opposite marginal positions of imaging sensor 20.As shown in the orientation of Fig. 2, wherein
A part of second pad 21 is located at 20 left side edge of imaging sensor, and the second pad of another part 21 is located at imaging sensor 20
Right side edge position.It is appreciated that the first pad 13 is connect with the second pad 21 for convenience, the first pad 13 and the second pad
21 are arranged close to.
Conducting wire 40 is preferable by extending effect and the higher metal wire of conductivity is made, such as gold thread.First pad 13 and
Two pads 21 are welded and fixed with conducting wire 40.
In some embodiments, the quantity of passive device 30 is multiple, and multiple passive devices 30 divide for first element group
31 and second element group 32, first element group 31 and second element group 32 be located at the opposite both sides in the second face 12.
In this way, passive device 30 is easily mounted on the second face 12.As shown in the orientation of Fig. 3, first element group 31 and second
Element group 32 is located at the left and right sides in the second face 12.It should be pointed out that first element group 31 and second element group 32 are equal
Including multiple passive devices 30.
Certainly, in some embodiments, passive device 30 is located at the center in the second face 12, as shown in Figure 4.
Referring to Fig. 1, Fig. 3 and Fig. 4, in some embodiments, imaging modules 100 include being arranged in the second face 12
Cooling fin 50, cooling fin 50 and passive device 30 interval are arranged.
In this way, cooling fin 50 can improve the radiating efficiency of imaging modules 100, the heat that imaging modules 100 are generated
It is dissipated to the outside of imaging modules 100.Imaging sensor 20 can generate a large amount of heat at work, and heat passes to circuit board 10
On, it then senses on cooling fin 50, heat can be passed to by cooling fin 50 in the air around cooling fin 50.Cooling fin 50 can
Think sheet metal, such as copper sheet；Cooling fin 50 or non-metal plate, for example, graphite flake.
In the example of fig. 3, when multiple passive devices 30 are located at the opposite both sides in the second face 12, cooling fin 50 is substantially
It is in the shape of an " I ".In the example of fig. 4, when passive device 30 is located at the center in the second face 12, cooling fin 50 is around passive
Element 30.At this point, cooling fin 50 is substantially in " returning " font.
In some embodiments, on the thickness direction of circuit board 10 (upper and lower directions of such as Fig. 1), the ruler of cooling fin 50
Very little D1 is more than the dimension D 2 of passive device 30, i.e. D1 ＞ D2.
In this way, cooling fin 50 can protect passive device 30, reduces the probability that passive device 30 is touched, avoid damage to
Element 30.
In some embodiments, the cooling fin 50 is conductor, and cooling fin 50 is grounded.In this way, cooling fin 50 can be to prevent
Only imaging modules 100 generate electrostatic and influence the normal work of imaging modules 100.
In some embodiments, imaging modules 100 include being located at the camera lens 60 of 20 top of imaging sensor, such as Fig. 1 institutes
Show.
It is imaged on imaging sensor 20 in this way, camera lens 60 is conducive to external object, can improve makes image sensing in this way
Device 20 obtains preferable image, to improve the image quality of imaging modules 100.It is set it is appreciated that camera lens 60 includes multi-disc stacking
The eyeglass (not shown) set, so that camera lens 60 has certain focal length.
Referring to Fig. 5, the electronic device 200 of the utility model embodiment includes shell 210 and any of the above embodiment party
The imaging modules 100 of formula, imaging modules 100 are arranged on shell 210.
In this way, imaging sensor 20 and passive device 30 are separately positioned on the opposite two sides of circuit board 10, can make in this way
The size for obtaining required circuit board 10XY axis directions is smaller, so as to reduce the volume of imaging modules 100, and then can improve
The screen accounting of electronic device.
Electronic device 200 can be able to be electronic device 200 with the electronic equipments such as mobile phone, tablet computer, imaging modules 100
Preposition imaging modules 100 or postposition imaging modules 100, in the example of hgure 5, imaging modules 100 are preposition imaging modules 100.
While there has been shown and described that the embodiment of the utility model, those skilled in the art can manage
Solution：A variety of to the progress of these embodiments can change in the case where not departing from the principles of the present invention and objective, change,
It replaces and modification, the scope of the utility model is limited by claim and its equivalent.
Claims (10)
1. a kind of imaging modules, which is characterized in that including：
Circuit board, the circuit board include opposite the first face and the second face；
Imaging sensor in first face is set；With
Passive device in second face is set.
2. imaging modules as described in claim 1, which is characterized in that first face is provided with the first pad, described image
Sensor is provided with the second pad, and the imaging modules include connecting the conducting wire of first pad and second pad.
3. imaging modules as described in claim 1, which is characterized in that the quantity of the passive device be it is multiple, it is the multiple
Passive device is divided into first element group and second element group, and the first element group and the second element group are located at described
The opposite both sides in second face.
4. imaging modules as described in claim 1, which is characterized in that the passive device is located at the centre bit in second face
It sets.
5. imaging modules as claimed in claim 4, which is characterized in that the imaging modules include being arranged in second face
Cooling fin, the cooling fin are arranged with the passive device interval, and the cooling fin surrounds the passive device.
6. the imaging modules as described in claim 1-4 any one, which is characterized in that the imaging modules include being arranged in institute
The cooling fin in the second face is stated, the cooling fin is arranged with the passive device interval.
7. imaging modules as claimed in claim 6, which is characterized in that on the thickness direction of the circuit board, the heat dissipation
The size of piece is more than the size of the passive device.
8. imaging modules as claimed in claim 6, which is characterized in that the cooling fin is conductor, the cooling fin ground connection.
9. imaging modules as described in claim 1, which is characterized in that the imaging modules include being located at described image sensor
The camera lens of top.
10. a kind of electronic device, which is characterized in that including：
Shell；With
Imaging modules described in any one of claim 1-9, the imaging modules setting is on the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721824364.7U CN207766355U (en) | 2017-12-22 | 2017-12-22 | Imaging modules and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721824364.7U CN207766355U (en) | 2017-12-22 | 2017-12-22 | Imaging modules and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207766355U true CN207766355U (en) | 2018-08-24 |
Family
ID=63188397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721824364.7U Active CN207766355U (en) | 2017-12-22 | 2017-12-22 | Imaging modules and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207766355U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109639947A (en) * | 2018-12-25 | 2019-04-16 | 维沃移动通信有限公司 | Camera module and terminal device |
| CN110602363A (en) * | 2019-09-23 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
-
2017
- 2017-12-22 CN CN201721824364.7U patent/CN207766355U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109639947A (en) * | 2018-12-25 | 2019-04-16 | 维沃移动通信有限公司 | Camera module and terminal device |
| CN110602363A (en) * | 2019-09-23 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera module and electronic equipment |
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