CN206743394U - Imaging device component and electronic installation - Google Patents
Imaging device component and electronic installation Download PDFInfo
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- CN206743394U CN206743394U CN201720553005.6U CN201720553005U CN206743394U CN 206743394 U CN206743394 U CN 206743394U CN 201720553005 U CN201720553005 U CN 201720553005U CN 206743394 U CN206743394 U CN 206743394U
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- imaging device
- circuit board
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- installing plate
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Abstract
The utility model discloses a kind of imaging device component and electronic installation.Imaging device component includes installing plate and imaging device, and the installing plate offers accepting hole.The imaging device is arranged on the installing plate, and the bottom of the imaging device is arranged in the accepting hole.In the imaging device component and electronic installation of the utility model embodiment, because the bottom of imaging device is arranged in accepting hole, the integral thickness of imaging device and installing plate can be so reduced, so as to reduce the thickness for being applied to the electronic installation as device assembly.
Description
Technical field
It the utility model is related to field of terminal, more particularly to a kind of imaging device component and electronic installation.
Background technology
As user improves to the thickness requirement of the electronic installations such as mobile phone, therefore, the electronic installations such as mobile phone how are reduced
Thickness turns into technical problem to be solved.
Utility model content
The utility model is intended at least solve one of technical problem present in correlation technique.Therefore, the utility model carries
For a kind of imaging device component and electronic installation.
The imaging device component of the utility model embodiment is used for electronic installation, and imaging device component includes installing plate,
The installing plate offers accepting hole；And imaging device, the imaging device are arranged on the installing plate, the imaging device
Bottom be arranged in the accepting hole.
In some embodiments, the imaging device includes：
Circuit board, the circuit board are housed in the accepting hole；With
The camera module being arranged on the circuit board, the bottom of the camera module are arranged in the accepting hole.
In some embodiments, the camera module includes shell and the branch extended outwardly from the outside of the shell
Support member, the imaging device is by the supports support so that the bottom of the imaging device is arranged on the installing plate
In the accepting hole.
In some embodiments, the quantity of the support member is two, and two support members are separately positioned on described
The opposite both sides of installing plate.
In some embodiments, the side of the circuit board is connected with fin, and the fin is from the circuit board
Side away from the camera module direction extend.
In some embodiments, the fin is copper sheet or graphene film.
In some embodiments, the fin is structure as a whole with the circuit board.
In some embodiments, the fin is connected with ground terminal.
In some embodiments, the fin is located at the lower surface of the circuit board and the top surface of the camera module
Between.
In some embodiments, the camera module includes：
The imaging sensor being coupling on the circuit board；
The camera lens being arranged on above described image sensor；With
Voice coil motor, the camera lens are arranged in the voice coil motor.
In some embodiments, the imaging device is included from the circuit board to away from camera module extension
Flexible PCB, the flexible PCB and the fin are respectively positioned at the opposite both sides of the camera module.
In some embodiments, the imaging device includes the connector being arranged on the flexible PCB, described
Connector is electrically connected with the flexible PCB.
The electronic installation of the utility model embodiment includes the imaging device component of any of the above embodiment.
In some embodiments, the installing plate is the center of the electronic installation.
In the imaging device component and electronic installation of the utility model embodiment, because the bottom of imaging device is arranged on
In accepting hole, the integral thickness of imaging device and installing plate can be so reduced, is applied to so as to reduce as device assembly
Electronic installation thickness.
Additional aspect and advantage of the present utility model will be set forth in part in the description, partly by from following description
In become obvious, or by it is of the present utility model practice recognize.
Brief description of the drawings
In description of the of the present utility model above-mentioned and/or additional aspect and advantage from combination accompanying drawings below to embodiment
It will be apparent and be readily appreciated that, wherein：
Fig. 1 is the decomposing schematic representation of the imaging device of the utility model embodiment；
Fig. 2 is the floor map of the imaging device component of the utility model embodiment；
Fig. 3 be Fig. 2 imaging device component III-III to schematic cross-section；
Fig. 4 be Fig. 2 imaging device component IV-IV to schematic cross-section；
Fig. 5 is the schematic perspective view of the electronic installation of the utility model embodiment.
Main element symbol description：
Imaging device 100, circuit board 10, upper surface 13, lower surface 12, camera module 20, imaging sensor 21, camera lens
22nd, voice coil motor 23, shell 24, lateral surface 241, support member 25, fin 30, flexible PCB 40, connector 50；
Imaging device component 200, installing plate 210, accepting hole 211；
The shell 310 of electronic installation 300, electronic installation 300.
Embodiment
Embodiment of the present utility model is described below in detail, the example of the embodiment is shown in the drawings, wherein
Same or similar label represents same or similar element or the element with same or like function from beginning to end.Lead to below
It is exemplary to cross the embodiment being described with reference to the drawings, and is only used for explaining the utility model, and it is not intended that to this practicality
New limitation.
In description of the present utility model, it is to be understood that term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width
Degree ", " thickness ", " on ", " under ", "front", "rear", "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outer ",
The orientation or position relationship of the instructions such as " clockwise ", " counterclockwise " be based on orientation shown in the drawings or position relationship, be only for
Be easy to describe the utility model and simplify to describe, rather than instruction or imply signified device or element must have it is specific
Orientation, with specific azimuth configuration and operation, therefore it is not intended that to limitation of the present utility model.In addition, term " first ",
" second " is only used for describing purpose, and it is not intended that indicating or implying relative importance or imply the technology indicated by indicating
The quantity of feature.Thus, " first " is defined, the feature of " second " can be expressed or implicitly include one or more
The feature.In description of the present utility model, " multiple " are meant that two or more, unless otherwise clearly specific
Limit.
, it is necessary to which explanation, unless otherwise clearly defined and limited, term " are pacified in description of the present utility model
Dress ", " connected ", " connection " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integratedly
Connection；It can be mechanical connection or electrical connection or can mutually communicate；Can be joined directly together, can also be in
Between medium be indirectly connected, can be connection or the interaction relationship of two elements of two element internals.For this area
For those of ordinary skill, concrete meaning of the above-mentioned term in the utility model can be understood as the case may be.
In the utility model, unless otherwise clearly defined and limited, fisrt feature second feature it " on " or it
" under " can directly be contacted including the first and second features, it is not directly to contact but lead to that can also include the first and second features
The other characterisation contact crossed between them.Moreover, fisrt feature second feature " on ", " top " and " above " include the
One feature is directly over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.First is special
Sign second feature " under ", " lower section " and " below " including fisrt feature immediately below second feature and obliquely downward, or only
Represent that fisrt feature level height is less than second feature.
Following disclosure provides many different embodiments or example is used for realizing different structure of the present utility model.
In order to simplify disclosure of the present utility model, hereinafter the part and setting of specific examples are described.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relation between setting.In addition, various specific techniques and the example of material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Referring to Fig. 1, the imaging device 100 of the utility model embodiment includes (the Printed Circuit of circuit board 10
Board, PCB) and camera module 20.Camera module 20 is set on the circuit board 10.The side 11 of circuit board 10 is connected with radiating
Piece 30.Fin 30 is from the side 11 of circuit board 10 to the direction extension away from camera module 20.
In above-mentioned imaging device 100, heat caused by imaging device 100 can be passed to imaging device 100 by fin 30
Outside, it ensure that the normal work of imaging device 100.
Specifically, circuit board 10 is sandwich construction, such as circuit board 10 includes conductive layer, bus plane and stratum.Fin
30 can connect the stratum of circuit board 10 to avoid circuit board 10 from the phenomenon of short circuit occur.Fin 30 connects the side of circuit board 10
Face 11, and part heat sink 30 can be almost parallel or arranged side by side with circuit board 10, so as to avoid fin 30 and circuit board 10
It is laminated and increases the thickness of imaging device 100.
It is pointed out that the thickness of imaging device 100 is the size in above-below direction of the imaging device 100 in Fig. 1.
In some embodiments, fin 30 be located at circuit board 10 lower surface 12 and camera module 20 top surface 26 it
Between.In this way, fin 30 can not only radiate, also so that avoiding the thickness of imaging device 100 after the increase fin of imaging device 100
Degree increase.
For example, fin 30 can be located in the space that the upper surface 13 of circuit board 10 and lower surface 12 surround so that radiating
The integral thickness of piece 30 and circuit board 10 is the thickness of circuit board 10, so as to avoid the increase of the thickness of imaging device 100.
In some embodiments, fin 30 is copper sheet.
In this way, fin 30 has preferable heat conduction and radiating effect, the temperature of imaging device 100 can be effectively reduced
Degree.In one example, the forming process of fin 30 can be as follows：One larger circuit board 10 is first provided, wherein, circuit board
10 include sandwich construction, wherein one layer is copper foil layer；Then other Rotating fields of partial circuit plate 10 in addition to copper foil layer are removed, from
And fin 30 and circuit board 10 can be obtained.In another example, the forming process of fin 30 can be as follows：First provide one
The larger copper sheet of piece, then on the copper sheet of part the layer of other in addition to copper foil layer of throttle circuit plate 10 to obtain printed circuit board (PCB)
10, the unstamped part copper sheet for having other layers forms fin 30.
Certainly, in other embodiments, fin 30 is graphene film.Graphene film also by compacting technique with electricity
Road plate 10 connects.
In some embodiments, fin 30 is connected with ground terminal.In other words, fin 30 is grounded.
In this way, fin 30 can avoid imaging device 100 from producing electrostatic and influence the imaging effect of imaging device 100.
For example, fin 30 can be connected (as shown in Figure 5) with the shell 310 of electronic installation 300, so that fin 30 not only may be used
To connect ground terminal, heat caused by circuit board 10 can also pass to the shell 310 of electronic installation 300, heat and then pass to sky
In gas, so as to reduce the temperature of imaging device 100.
In some embodiments, fin 30 is structure as a whole with circuit board 10.It so can not only avoid fin
30 depart from circuit board 10, so that the heat on circuit board 10 effectively can be passed to the outer of imaging device 100 by fin 30
Portion, it is also possible that the structure of fin 30 and circuit board 10 is simple, reduce the cost of manufacture of fin 30 and circuit board 10.Dissipate
Backing 30 for example can form integrative-structure with circuit board 10 using pressing process mentioned above.
In some embodiments, camera module 20 includes imaging sensor 21, camera lens 22 and voice coil motor 23.Image passes
Sensor 21 couples on the circuit board 10.Camera lens 22 is arranged on the top of imaging sensor 21.Camera lens 22 is arranged in voice coil motor 23.
In this way, imaging sensor 21 can sense the light outside camera module 20 to obtain external image.Camera lens 22 can be with
External object is imaged on imaging sensor 21 so that imaging sensor 21 obtains preferable image.Voice coil motor 23
Optical axis direction of the camera lens 22 along camera lens 22 can be driven to move to adjust the distance between camera lens 22 and imaging sensor 21, and then
The auto-focusing of imaging modules is realized, so that imaging modules obtain the preferable image of quality.
Specifically, imaging sensor 21 is, for example, complementary metal oxide semiconductor (Complementary Metal
Oxide Semiconductor, CMOS) CIS or charge coupled cell (Charge-coupled Device,
CCD) CIS.Imaging sensor 21 can produce substantial amounts of heat at work, and heat is passed on circuit board 10, then led to
The fin 30 being connected with circuit board 10 is crossed to pass to outside imaging device 100.
In some embodiments, imaging device 100 includes flexible PCB 40.Flexible PCB 40 from circuit board 10 to
Extend away from camera module 20.Flexible PCB 40 and fin 30 are respectively positioned at the opposite both sides of camera module 20.
In this way, flexible PCB 40 can cause imaging device 100 to realize data transfer with outer member.For example, image
The picture signal of acquisition can be transferred to outer member by sensor 21 by flexible PCB 40, and outer member is to picture signal
External image can be obtained after processing.And for example, external image can control imaging sensor 21 photosensitive by flexible PCB 40
To obtain external image.
Flexible PCB 40 can avoid flexible PCB positioned at the opposite both sides of camera module 20 respectively with fin 30
40 interfere with fin 30 so that flexible PCB 40 has larger installing space with fin 30.
In some embodiments, imaging device 100 includes connector 50.Connector 50 is arranged on flexible PCB 40
On.Connector 50 is electrically connected with flexible PCB 40.
In this way, connector 50 is by imaging device 100 rapidly in externally connected equipment, for example, being set on external equipment
Have and be inserted into connector interface with 50 corresponding connector interface of connector, connector 50 and can complete connector 50 and set with the external world
Standby connection.
In some embodiments, circuit board 10 is structure as a whole with flexible PCB 40.For example, circuit board 10 and flexibility
Circuit board 40 is respectively a part for Rigid Flex.Circuit board 10 be Rigid Flex hardboard part, flexible PCB 40
For the soft board part of Rigid Flex.
In this way, the structure between circuit board 10 and flexible PCB 40 is simple, and the zero of imaging device 100 can be reduced
The quantity of part, so as to reduce the assembling procedure of imaging device 100, to reduce the assembly cost of imaging device 100.
Referring to Fig. 2, the imaging device component 200 of the utility model embodiment includes installing plate 210 and any of the above
The imaging device 100 of embodiment, imaging device 100 are arranged on installing plate 210.
Support is provided with fixed imaging device 100 in this way, installing plate 210 can be imaging device 100, to ensure imaging dress
External image can be obtained by putting 100.For example, imaging device 100 can be fixed or by way of engaging by way of welding
Fixed with installing plate 210.
Specifically, in present embodiment.Installing plate 210 can be in flat board tabular.Certainly, in other embodiments, pacify
Loading board 210 is in frame shape.
In some embodiments, installing plate 210 offers accepting hole 211, and the bottom 102 of imaging device 100 is arranged on
In accepting hole 211, circuit board 10 is housed in accepting hole 211.
In this way, the integral thickness of imaging device 100 and installing plate 210 can be so reduced, to cause imaging device component
200 miniaturizations, and it is compacter.
Incorporated by reference to Fig. 3 and Fig. 4, in some embodiments, camera module 20 includes shell 24 and support member 25.Support member
25 stretch out from the lateral surface 241 of shell 24.Imaging device 100 be supported on by support member 25 on installing plate 210 so that into
As the bottom 102 of device 100 is arranged in accepting hole 211.
Moved in this way, support member 25 can limit camera module 20 relative to installing plate 210, define imaging device 100
Installation site.It should be noted that the bottom 102 of imaging device 100 includes the bottom of whole circuit board 10 and camera module 20
Portion, therefore, the bottom of camera module 20 are arranged in accepting hole 211.The bottom of shell 24 is also disposed in accepting hole 211.
Shell 24 can be the shell 24 of above-mentioned voice coil motor 23.It can also be the element around voice coil motor 23.
In some embodiments, the quantity of support member 25 is two, and two support members 25 are separately positioned on installing plate 210
Opposite both sides.In this way, two support members 25 cause the stress balance on installing plate 210 of imaging device 100 to be filled to improve imaging
Put the stability of 100 installations.
In present embodiment, support member 25 is in strip.It is appreciated that in other embodiments, support member 25 can also
In other shapes such as bulks.
In some embodiments, installing plate 210 is structure as a whole with support member 25.
In some embodiments, the shape of accepting hole 211 and size respectively with the bottom 102 with imaging device 100
Shape and matching size.For example, in Fig. 2 and Fig. 3 example, being shaped as accepting hole 211 is square, and imaging device 100
The shape of bottom 102 is also to be square, and the size of accepting hole 211 is slightly larger than the size of the bottom 102 of imaging device 100 so that imaging
The bottom 102 of device 100 can be arranged in accepting hole 211.
In some embodiments, fin 30 is respectively positioned on the same side of the thickness direction of installing plate 210 with support member 25, dissipates
Backing 30 is arranged at intervals with support member 25.
In this way, the side of installing plate 210 is provided with fin 30 and support member 25 so that the opposite side of installing plate 210 can
To set other elements, so as to which installing plate 210 improves the utilization rate of installing plate 210.
In some embodiments, installing plate 210 is the center 210 of electronic installation 300.
In this way, center 210, which can be imaging device 100, provides installing space.
Incorporated by reference to Fig. 5, the electronic installation 300 of the utility model embodiment includes the imaging device group that any of the above is implemented
Part 200.Electronic installation 300 has the electronic equipment of shoot function such as mobile phone, tablet personal computer or wearable smart machine.
In some embodiments, fin 30 connects the mainboard of electronic installation 300 or the shell 310 of electronic installation 300.
In this way, fin 30 can pass to heat on the shell 310 of the mainboard of electronic installation 300 or electronic installation 300, with
Heat is passed to outside electronic installation 300 by the mainboard of electronic installation 300 or the shell 310 of electronic installation 300.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means with reference to the embodiment or example description
Specific features, structure, material or feature are contained at least one embodiment or example of the present utility model.In this explanation
In book, identical embodiment or example are not necessarily referring to the schematic representation of above-mentioned term.Moreover, the specific spy of description
Sign, structure, material or feature can combine in an appropriate manner in any one or more embodiments or example.
While there has been shown and described that embodiment of the present utility model, one of ordinary skill in the art can manage
Solution：A variety of to the progress of these embodiments can change in the case where not departing from principle and objective of the present utility model, change,
Replace and modification, the scope of the utility model are limited by claim and its equivalent.
Claims (14)
1. a kind of imaging device component, for electronic installation, it is characterised in that the imaging device component includes：
Installing plate, the installing plate offer accepting hole；With
Imaging device, the imaging device are arranged on the installing plate, and the bottom of the imaging device is arranged on the collecting
Kong Zhong.
2. imaging device component as claimed in claim 1, it is characterised in that the imaging device includes：
Circuit board, the circuit board are housed in the accepting hole；With
The camera module being arranged on the circuit board, the bottom of the camera module are arranged in the accepting hole.
3. imaging device component as claimed in claim 2, it is characterised in that the camera module includes shell and from described outer
The support member extended outwardly on the outside of shell, the imaging device is by the supports support so that institute on the installing plate
The bottom for stating imaging device is arranged in the accepting hole.
4. imaging device component as claimed in claim 3, it is characterised in that the quantity of the support member is two, two institutes
State support member and be separately positioned on the opposite both sides of the installing plate.
5. imaging device component as claimed in claim 2, it is characterised in that the side of the circuit board is connected with fin,
Direction of the fin from the side of the circuit board away from the camera module extends.
6. imaging device component as claimed in claim 5, it is characterised in that the fin is copper sheet or graphene film.
7. imaging device component as claimed in claim 5, it is characterised in that the fin is integrated knot with the circuit board
Structure.
8. imaging device component as claimed in claim 5, it is characterised in that the fin is connected with ground terminal.
9. imaging device component as claimed in claim 5, it is characterised in that the fin is located at the following table of the circuit board
Between the top surface of face and the camera module.
10. imaging device component as claimed in claim 2, it is characterised in that the camera module includes：
The imaging sensor being coupling on the circuit board；
The camera lens being arranged on above described image sensor；With
Voice coil motor, the camera lens are arranged in the voice coil motor.
11. imaging device component as claimed in claim 5, it is characterised in that the imaging device is included from the circuit board
To the flexible PCB away from camera module extension, the flexible PCB is located at the camera respectively with the fin
The opposite both sides of module.
12. imaging device component as claimed in claim 11, it is characterised in that the imaging device is described soft including being arranged on
Property circuit board on connector, the connector and the flexible PCB are electrically connected with.
13. a kind of electronic installation, it is characterised in that including the imaging device component described in claim 1-12 any one.
14. electronic installation as claimed in claim 13, it is characterised in that the installing plate is the center of the electronic installation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720553005.6U CN206743394U (en) | 2017-05-17 | 2017-05-17 | Imaging device component and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720553005.6U CN206743394U (en) | 2017-05-17 | 2017-05-17 | Imaging device component and electronic installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206743394U true CN206743394U (en) | 2017-12-12 |
Family
ID=60566370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720553005.6U Active CN206743394U (en) | 2017-05-17 | 2017-05-17 | Imaging device component and electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206743394U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107147826A (en) * | 2017-05-17 | 2017-09-08 | 广东欧珀移动通信有限公司 | Imaging device component and electronic installation |
-
2017
- 2017-05-17 CN CN201720553005.6U patent/CN206743394U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107147826A (en) * | 2017-05-17 | 2017-09-08 | 广东欧珀移动通信有限公司 | Imaging device component and electronic installation |
| CN107147826B (en) * | 2017-05-17 | 2023-01-20 | 深圳市欢太科技有限公司 | Imaging device assembly and electronic device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Patentee before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |