CN109714507A - A kind of imaging device and equipment - Google Patents
A kind of imaging device and equipment Download PDFInfo
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- CN109714507A CN109714507A CN201811613846.7A CN201811613846A CN109714507A CN 109714507 A CN109714507 A CN 109714507A CN 201811613846 A CN201811613846 A CN 201811613846A CN 109714507 A CN109714507 A CN 109714507A
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- imaging device
- functional module
- mould group
- circuit board
- module group
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- 230000004308 accommodation Effects 0.000 claims abstract description 33
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Abstract
The application is suitable for optics and electronic technology field, a kind of imaging device is provided, for object to be imaged comprising pedestal, functional module group, connector and main circuit board.Corresponding function mould group offers accommodation groove on the pedestal.The bottom surface of the accommodation groove offers through-hole.The functional module group is fixedly mounted in corresponding accommodation groove and is emitted by the through-hole or receive light beam to realize corresponding function.The functional module group is connected with exchanging by main circuit board and external progress data and signal with main circuit board.The main circuit board is arranged in functional module group backwards to the side of through-hole and fixes on the base.The pedestal is attached by the connector with external structure.
Description
Technical field
The application belongs to optical technical field more particularly to a kind of imaging device and equipment.
Background technique
Existing electronic equipment is in order to realize that it is a variety of that three-dimensional (Three Dimensional, 3D) sensing function needs to integrate
Functional module group.However, electronic equipment often gives the integrated belt of the functional module group to come greatly the ultimate attainment pursuit of design
Challenge, do not require nothing more than the miniaturization of each mould group, low-power consumption and radiating efficiency with higher, and also to meet one on the whole
Fixed intensity requirement is to ensure to be hardly damaged in use.
Summary of the invention
The application provides a kind of imaging device and equipment to solve the above technical problems.
The application embodiment provides a kind of imaging device, for object to be imaged comprising pedestal, function mould
Group, connector and main circuit board.Corresponding function mould group offers accommodation groove on the pedestal.The bottom surface of the accommodation groove offers
Through-hole.The functional module group is fixedly mounted in corresponding accommodation groove and is emitted by the through-hole or receive light beam to realize pair
Answer function.The functional module group is connected with exchanging by main circuit board and external progress data and signal with main circuit board.
The main circuit board is arranged in functional module group backwards to the side of through-hole and fixes on the base.The pedestal passes through the connector
It is attached with external structure.
In some embodiments, the functional module group be selected from pattern light projection mould group and pattern light three-dimensional sensing mould group,
Flight time emitting mould train and flight time receiving module and binocular vision 3 D sensing Mo Zu respectively with flood projection mould group
It is combined with made of any one or more collocation in camera mould group.
In some embodiments, the functional module group includes pattern light projection mould group, pattern light three-dimensional sensing mould group, general
Light projection mould group and camera mould group.
In some embodiments, the pedestal includes ontology and is each extended over by the opposite end of ontology along its length
Lug out by connector with external structure to be connected, and the wherein side of the connector is connected with corresponding lug, phase
Pair the other side be connected with external structure.
In some embodiments, it is provided with the first positioning column on the lug, is offered on the connector corresponding
First positioning hole, the connector are through on first positioning column by first positioning hole and are positioned, and solid by bolt
It is scheduled on lug.
In some embodiments, the connector is with flexible thin gauge sheet.
In some embodiments, in the accommodation groove according to the structure for the functional module group to be packed into be formed with one layer or
The step structure of multilayer, the functional module group of the loading are supported on the step surface of the step structure.
In some embodiments, the functional module group is fixed in the accommodation groove by dispensing, the accommodation groove
Surrounding edge offers the glue groove for accommodating excessive colloid along from accommodating groove center outwardly direction.
It in some embodiments, further include one or more cooling fins, the cooling fin is used to carry out functional module group
Heat dissipation, a portion of the cooling fin are in contact with the step surface of step structure, and another part and setting are being packed into accommodating
Corresponding function mould group in slot is in contact.
The application embodiment provides a kind of equipment, including shell, power supply, control mainboard and such as above-mentioned any one embodiment party
Imaging device in formula.Functional module group on the imaging device is connect by main circuit board with the control mainboard mutually to pass
Transmission of data and signal.
Imaging device provided by the application embodiment and equipment utilization connector are attached with external structure, with
The connector can carry out buffering by deformation to avoid damaging when pedestal misplaces with external structure.
The additional aspect and advantage of the application embodiment will be set forth in part in the description, partially will be from following
Become obvious in description, or is recognized by the practice of the application embodiment.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the imaging device along first direction of the application first embodiment offer.
Fig. 2 is the components broken down structural schematic diagram of imaging device described in Fig. 1 in a second direction.
Fig. 3 is the structural schematic diagram of the imaging device of the application second embodiment offer in a second direction.
Fig. 4 is the components broken down structural schematic diagram of the imaging device of the application third embodiment offer in a second direction.
Fig. 5 is the structural schematic diagram for the equipment that the 4th embodiment of the application provides.
Specific embodiment
Presently filed embodiment is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.?
In the description of the present application, it is to be understood that term " first ", " second " are only used for describing, and should not be understood as instruction or dark
Show relative importance or implicitly indicates the quantity of indicated technical characteristic or put in order.Define as a result, " first ",
The technical characteristic of " second " can explicitly or implicitly include one or more technical characteristic.In retouching for the application
In stating, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present application, it should be noted that unless otherwise specific regulation or limit, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integration connection；It can
To be mechanical connection, it is also possible to be electrically connected or is in communication with each other；It can be directly connected, the indirect phase of intermediary can also be passed through
Even, the connection inside two elements or the interaction relationship between two elements be can be.For the ordinary skill of this field
For personnel, the concrete meaning of above-mentioned term in this application can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the application.In order to
Simplify disclosure herein, hereafter only to the component of specific examples and being set for describing.Certainly, they are merely examples, and
And purpose does not lie in limitation the application.In addition, the application can reuse reference number and/or reference word in different examples
Mother, this reuse are itself not indicate the various embodiments discussed to simplify and clearly state the application
And/or the particular kind of relationship between setting.In addition, the application in the following description provided by various specific techniques and material only
For the example for realizing technical scheme, but those of ordinary skill in the art should be aware that the technical solution of the application
It can be realized by other techniques for not describing hereafter and/or other materials.
Further, described feature, structure can be incorporated in one or more embodiment party in any suitable manner
In formula.In the following description, many details are provided so as to fully understand presently filed embodiment.However, this
Field technical staff will be appreciated that even if without one or more in the specific detail, or using other structures, group
Member etc. can also practice the technical solution of the application.In other cases, it is not shown in detail or describes known features or operation
To avoid the emphasis of fuzzy the application.
Also referring to shown in Fig. 1 and Fig. 2, the application first embodiment provides a kind of imaging device 1, is used for pair
Object is imaged.Institute includes two-dimensional color information and three-dimensional information at image.The three-dimensional information includes but is not limited to mesh
Mark other and the object phase such as dimension information of the three-dimensional information on object surface, object location information in space, object
The three-dimensional information of pass.The spatial information of the object sensed can be used for identifying object or combine two-dimensional color information structure
Build the colorful three-dimensional model of object.
The imaging device 1 includes pedestal 10, functional module group 12, connector 14 and main circuit board 16.The functional module group
12 and main circuit board 16 be assembled on pedestal 10.The functional module group 12 is connected through main circuit board 16 with main circuit board 16
Exchanging for data and signal is carried out with external.The pedestal 10 is attached by connector 14 with external structure.In this implementation
In mode, the opposite end of the pedestal 10 each extends over out lug 100 to be connected by connector 14 with external structure.Institute
The wherein side for stating connector 14 is connected with corresponding lug 100, and the opposite other side is connected with external structure.The lug
It is provided with the first positioning column 101 on 100, corresponding first positioning hole 140, the connector 14 are offered on the connector 14
It is through on first positioning column 101 and is positioned by first positioning hole 140, and be bolted on lug 100.Institute
Stating connector 14 can also be attached by bolt and external structure.It is understood that the connector 14 and pedestal 10
It can also be attached by other means with external structure, such as: riveting etc. is not particularly limited herein.
Because of the requirement of 10 integral rigidity of pedestal, the lug 100 is more thick and heavy and flexible poor.The connector
14 be thin gauge sheet, has relatively good pliability.So the company when the pedestal 10 misplaces with external structure
Fitting 14 can carry out buffering by deformation to avoid damaging.
The pedestal 10 includes ontology 102 and described in being each extended over out as the opposite end of ontology 102 along its length
Lug 100.Corresponding function mould group 12 offers accommodation groove 104 on the ontology 102.The bottom surface of the accommodation groove 104 offers
Through-hole 105.The functional module group 12 is fixedly mounted in corresponding accommodation groove 104 and emits or receive by the through-hole 105
Light beam realizes corresponding function.The ontology 102 includes being formed with the first surface 1020 of the through-hole 105 and with described first
The opposite second surface 1022 in surface 1020.The main circuit board 16 is connected on the second surface 1022 of ontology 102.In this reality
It applies in mode, the main circuit board 16 is bolted to connection on second surface 1022, and the lug 100 is along ontology
102 length direction extends from ontology 102 close to the wherein one side of second surface 1022.
The material of the pedestal 10 selected from steel, aluminium alloy, kirsite, stainless steel alloy, ceramics in any one or it is several
The combination of kind, takes into account higher hardness and good heat dissipation performance.
12 quantity of functional module group that the quantity and imaging device 1 of the accommodation groove 104 opened up on the ontology 102 integrate
It is related.The accommodation groove 104 is set gradually along 102 length direction of ontology.According to the function to be packed into the accommodation groove 104
The structure of mould group 12 could be formed with one or more layers step structure 1040, and the functional module group 12 of the loading can be supported
On the step surface 1042 of the step structure 1040.Such as: if the functional module group 12 is camera mould group, the camera mould group
The camera lens that may include a board structure of circuit and be arranged on the board structure of circuit.Therefore, the camera mould is assembled into accommodating
The board structure of circuit can be stuck on step surface 1042 and be positioned when slot 104.
The functional module group 12 can be fixed in the accommodation groove 104 by mode for dispensing glue.104 He of accommodation groove
The surrounding edge of every layer of step structure 1040 is offered along from 104 center outwardly direction of accommodation groove for accommodating outer excessive glue
The glue groove 108 of body.The functional module group 12 in the edge dispensing of corresponding accommodation groove 104 or step structure 1040 by fixing
Afterwards, not solidified colloid can flow around in flow-like, will lead to colloid if going to accommodate these colloids without corresponding space
Accommodation groove 104 is overflowed to cause to assem-bly face out-of-flatness.In the present embodiment, the accommodation groove 104 is generally rectangular shaped.The appearance glue
108 semicircular in shape of slot is provided with four edges of accommodation groove 104 and every layer of step structure 1040 respectively.
Referring to Figure 2 together and Fig. 3, the imaging device 1 further include one or more cooling fins 18.The cooling fin 18
For to the biggish functional module group of calorific value 12, such as: the emitting mould train etc. of light is sensed, is radiated.The step structure
1040 can be also used for that the cooling fin 18 is arranged.A portion of the cooling fin 18 and the step surface of step structure 1040
1042 are in contact, and another part is in contact with the corresponding function mould group 12 being packed into accommodation groove 104, and functional module group 12 is produced
Raw heat is transmitted to the diverging for accelerating heat on ontology 10.
Each accommodation groove 104 is corresponded on the second surface 1022 of the ontology 10 is formed with location structure 1023.It is described
Location structure 1023 is for positioning functional module group 12 and the link position of main circuit board 16.In the present embodiment, institute
Functional module group 12 is stated to connect by flexible circuit board 17 with the corresponding interface on main circuit board 16.The location structure 1023 is corresponding
It is formed in the position that the flexible circuit board 17 is connected with corresponding interface on main circuit board 16.The location structure 1023 can be with
For convex block or groove.The flexible circuit board 17 is provided with stiffening plate 170, the reinforcement in the position connecting with main circuit board 16
Plate 170 is accordingly housed in the groove of location structure 1023 or offsets with the convex block of location structure 1023.The function as a result,
The available preferable fixation in position that energy mould group 12 is connected with main circuit board 16, is not easy loose or dislocation.In present embodiment
In, the location structure 1023 is convex block, each corresponding accommodation groove 104 is arranged on the second surface 1022 of main body 102.
The main circuit board 16 includes but is not limited to processor 160, passive device 162, the first output interface 164 and second
Output interface 166.The processor 160 and passive device 162 collectively form locates 12 output signals of functional module group in advance
A series of signal processing circuit of reason.First output interface 164 setting is in main circuit board 16 towards 12 side of functional module group
Surface and close to main circuit board 16 edge, the main circuit board 16 be fixed on pedestal 10 after first output interface
164 from pedestal 10 wherein one side wall 106 expose it is external to facilitate.Second output interface 166 setting main circuit board 16 with
On the surface of the opposite side of functional module group 12.First output interface 164 electricity respectively different from the second output interface 166
Road interface type, externally to provide different interface type selections.In the present embodiment, first output interface 164 is
Universal Serial Bus Interface (Universal Serial Bus, USB).Second output interface 166 connects for flexible circuit board
Mouthful, it is electrically connected by grafting flexible circuit board 17 with external world's realization.
It is also provided with avoiding hollow groove 107 on the second surface 1022 of the ontology 102, for carrying out the installation of functional module group 12
When to dispenser reserve running space.The avoiding hollow groove 107 opens up position depending on actual job demand, in this embodiment party
In formula, the correspondence of avoiding hollow groove 107 is provided on second surface 1022 along the accommodation groove of 102 length direction opposite end of ontology
104 near outside edge.
Also extend at least two second positioning columns 103 on the second surface 1022 of the ontology 102 along the vertical direction.Institute
The second positioning column 103 is stated for positioning the main circuit board 16.Second location hole 168 is offered on the main circuit board 16.Institute
It states the second location hole 168 when main circuit board 16 is assembled with pedestal 10 and is inserted into corresponding second positioning on main circuit board 16
Hole 168 is positioned, then is fixed by bolt.
In the present embodiment, the functional module group 12 includes but is not limited to pattern light projection mould group 120, flood projection mould
Group 122, camera mould group 124 and pattern light three-dimensional sense mould group 126.The pattern light projection mould group 120 and pattern light three-dimensional sense
It surveys mould group 126 and is separately positioned on the opposite end of 10 ontology of pedestal along its length, the flood projection mould group 122 and camera mould
Group 124, which is arranged on 10 ontology of pedestal, to be located between pattern light projection mould group 126 and pattern light three-dimensional sensing mould group 126, described
Flood projection mould group 122 is arranged close to pattern light projection mould group 120, and the camera mould group 124 senses mould close to pattern light three-dimensional
126 setting of group.
It is understood that in other embodiments, the functional module group 12 can be above-mentioned pattern light projection mould group
126 and pattern light three-dimensional sensing mould group 126 and flood projection mould group 122 and/or camera mould group 124 any combination.The function
Energy mould group 12 can also include the relevant TOF emitting mould train of time-of-flight (Time of fly, TOF) with three-dimensional sensing
Mould group is sensed with TOF receiving module or binocular vision 3 D relevant to the Binocular Vision Principle of three-dimensional sensing.
It is understood that the position of the accommodation groove 104 can need realization pair according to the functional module group 12 being packed into
The requirement of function is answered to be adjusted.Such as: the pattern light projection mould group for three-dimensional sensing is respectively provided on the imaging device 1
120 and pattern light three-dimensional for the sensing light pattern projected on object to be imaged sense mould group 126.The pattern
It is needed between having centainly between the optical centre of optical centre and pattern light three-dimensional the sensing mould group 126 of light projection mould group 120
Away from referred to herein as baseline.The three-dimensional sense constituted for the pattern light projection mould group 120 and pattern light three-dimensional sensing mould group 126
For examining system, the length of baseline will affect the measurement range and precision of three-dimensional sensing system.In general, baseline is longer, survey
It is bigger to measure range.But baseline is longer, and to also result in 1 size of imaging device bigger and influence practicability.Both tradeoffs, the pattern
Baseline length range between light projection mould group 120 and pattern light three-dimensional sensing mould group 126 is 10 millimeters to 200 millimeters
(Millimeter,mm).In the present embodiment, the pattern light projection mould group 120 is divided with pattern light three-dimensional sensing mould group 126
Imaging device 1 is not set along the opposite end in length direction, the pattern light projection mould group 120 and pattern light three-dimensional sense
Surveying between mould group 126 can be set other function mould group 12 to maximally utilise space.
As shown in figure 3, the application second embodiment offer a kind of imaging device 2, structure and first embodiment
Imaging device 1 is essentially identical, and the main distinction is that the imaging device 2 does not include main circuit board 16.Each described function mould
Group 22 is electrically connected by the flexible circuit board 27 being correspondingly arranged with external world's realization.
As shown in figure 4, the application third embodiment offer a kind of imaging device 3, structure and first embodiment
Imaging device 1 is essentially identical, and the main distinction is that the imaging device 3 further includes a cover sheet 38.The cover sheet 38
The side opposite with the functional module group 32 of main circuit board 36 is set and is fixed on the second surface 3022 of the pedestal 30.
The size and shape of the cover sheet 38 and the second surface 3022 of pedestal 30 are almost the same, so that cover sheet 38 is fixed
The main circuit board 36 can be sealed in inside the pedestal 30 after on pedestal 30.The pedestal 30 does not include along length
Opposite end on direction distinguishes outwardly extending lug 100.The pedestal 30 is at the position for being formed with lug 100 originally pair
Jagged 300 should be opened up.Opposite two ends of the cover sheet 38 along length direction offer link slot 380 respectively.
First positioning column 301 corresponding with the connector 34 is provided in the link slot 380.The connector 34 passes through pedestal 30
Upper corresponding notch 300 is housed in be correspondingly connected in slot 380 after positioned by the first positioning column 301, recycle bolt into
Row is fixed in link slot 380.Because the cover sheet 38 seals the bottom surface of main circuit board 36, the main circuit board 36 only leads to
First output interface 364 and external electrical connections are crossed, or second output interface 366 is also disposed at main circuit board 36
Towards 32 side of functional module group surface and pass through the aperture external connection on the side wall 306 of pedestal 30.In the present embodiment,
The cover sheet 38 is bolted to connection on the second surface 3022 of pedestal 30.
Also referring to Fig. 1, Fig. 2 and Fig. 5, the 4th embodiment of the application provides a kind of equipment 4, such as mobile phone, notes
This computer, tablet computer, touch-control interaction screen, door, the vehicles, robot, automatic numerical control lathe etc..The equipment 4 includes outer
Shell 40, screen 42, power supply 44, control mainboard 46 and at least one above-mentioned first to imaging device provided by third embodiment
1.The imaging device 1 can be set to for sense 4 front of the equipment pair object three-dimensional information, can also be with
Be arranged to be used for sensing 4 back side of equipment pair object three-dimensional information.
For imaging device 1 provided by first embodiment, the first master with imaging device 1 of the difference of functional module group 12
Circuit board 16 connect, the main circuit board 16 can respectively by from 10 side wall 106 of pedestal aperture expose described first
Output interface 164 and/or the second output interface 166 arranged at the bottom are connect again with the control circuit board 46 of equipment 4 with mutual
Transmit data and signal.
For imaging device 2 provided by second embodiment, the functional module group 22 control directly with equipment 4 respectively
46 plate of circuit is connected with mutual data transmission and signal.
For imaging device 3 provided by third embodiment, the first master with imaging device 3 of the difference of functional module group 32
Circuit board 36 connect, the main circuit board 36 can respectively by from 30 side wall 306 of pedestal aperture expose described first
Output interface 364 and/or the second output interface 366 are connect again with the control circuit board 46 of equipment 4 with mutual data transmission and letter
Number.
In the present embodiment, the imaging device 1 is installed in equipment 4 as independent component, the imaging device 1
On each element be provided separately with the control mainboard 46 in equipment 4.In other embodiments, the equipment 4 is for fixing
The structure of other components can mutually be shared with the pedestal 10 of the imaging device 1, the subelement on the imaging device 1
Also it can be arranged directly in the control mainboard 46 of equipment 4, or by the other elements generation in the control mainboard 46 of the equipment 4
To execute corresponding function, so as to reduce the quantity of component, so that the equipment 4 is more integrated on the whole, power consumption
Also it can reduce.
The equipment 4 executes corresponding function for corresponding to according to the sensing result of the imaging device 1.The corresponding function
It can include but is not limited to unlock, pay after identifying user's identity, starting preset application program, avoidance, identification user's face
Any one or more in the mood and health condition of user is judged using depth learning technology after portion's expression.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the application.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
The foregoing is merely the better embodiments of the application, all the application's not to limit the application
Made any modifications, equivalent replacements, and improvements etc., should be included within the scope of protection of this application within spirit and principle.
Claims (10)
1. a kind of imaging device, for object to be imaged comprising pedestal, functional module group, connector and main circuit board,
Corresponding function mould group offers accommodation groove on the pedestal, and the bottom surface of the accommodation groove offers through-hole, and the functional module group is solid
Dingan County is in corresponding accommodation groove and is emitted by the through-hole or receives light beam to realize corresponding function, the functional module group
It is connected with main circuit board to carry out exchanging for data and signal with external by main circuit board, the main circuit board setting is in function
Can mould group backwards to through-hole side and it is fixed on the base, the pedestal is attached by the connector with external structure.
2. imaging device as described in claim 1, which is characterized in that the functional module group is selected from pattern light projection mould group and figure
Case light three-dimensional senses mould group, flight time emitting mould train and flight time receiving module and binocular vision 3 D senses mould splits
It is not combined with made of any one or more collocation in flood projection mould group and camera mould group.
3. imaging device as described in claim 1, which is characterized in that the functional module group includes pattern light projection mould group, figure
Case light three-dimensional senses mould group, flood projection mould group and camera mould group.
4. imaging device as described in claim 1, which is characterized in that the pedestal include ontology and by ontology along its length
The lug that each extends over out of opposite end to be connected by connector with external structure, the wherein side of the connector with
Corresponding lug connection, the opposite other side is connected with external structure.
5. imaging device as claimed in claim 4, which is characterized in that be provided with the first positioning column, the company on the lug
Corresponding first positioning hole is offered on fitting, the connector is through on first positioning column by first positioning hole and is carried out
Positioning, and be bolted on lug.
6. imaging device as described in claim 1, which is characterized in that the connector is with flexible thin gauge sheet.
7. imaging device as described in claim 1, it is characterised in that: according to the functional module group to be packed into the accommodation groove
Structure be formed with one or more layers step structure, the functional module group of the loading is supported on the step of the step structure
On face.
8. imaging device as described in claim 1, it is characterised in that: the functional module group is fixed on the accommodating by dispensing
In slot, the surrounding edge of the accommodation groove is offered along from accommodating groove center outwardly direction for accommodating excessive colloid
Glue groove.
9. imaging device as claimed in claim 7, it is characterised in that: further include one or more cooling fins, the cooling fin
For radiating to functional module group, a portion of the cooling fin is in contact with the step surface of step structure, another portion
Divide and is in contact with the corresponding function mould group being arranged in loading accommodation groove.
10. a kind of equipment, including shell, power supply, control mainboard and imaging device as claimed in any one of claims 1 to 9,
Functional module group on the imaging device is connect by main circuit board with the control mainboard with mutual data transmission and signal.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613846.7A CN109714507A (en) | 2018-12-27 | 2018-12-27 | A kind of imaging device and equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613846.7A CN109714507A (en) | 2018-12-27 | 2018-12-27 | A kind of imaging device and equipment |
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| CN109714507A true CN109714507A (en) | 2019-05-03 |
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| CN201811613846.7A Pending CN109714507A (en) | 2018-12-27 | 2018-12-27 | A kind of imaging device and equipment |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110174078A (en) * | 2019-05-10 | 2019-08-27 | 深圳阜时科技有限公司 | A kind of sensing mould group and sensing device |
| CN110174131A (en) * | 2019-05-17 | 2019-08-27 | 深圳阜时科技有限公司 | A kind of sensing mould group |
| CN110186499A (en) * | 2019-05-27 | 2019-08-30 | 深圳阜时科技有限公司 | A kind of sensing mould group, sensing device and electronic equipment |
| CN110186498A (en) * | 2019-05-27 | 2019-08-30 | 深圳阜时科技有限公司 | A kind of sensing mould group, sensing device and electronic equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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